JP7065700B2 - Power converter - Google Patents

Description

The present invention is an invention relating to a power conversion device.

Conventionally, in a generator used for a portable generator or the like, an AC voltage is generated in an alternator by driving an engine, and the generated AC voltage is converted into a DC voltage by rectification by a rectifying circuit and smoothing by an electrolytic capacitor, and converted. There is a device that converts the generated DC voltage into an AC voltage by an inverter (see, for example, Japanese Patent Application Laid-Open No. 2003-102200).

Further, in the above-mentioned conventional generator, a noise filter for reducing noise is connected to the output side of the inverter according to the noise level of the AC voltage converted by the inverter.

In such a generator, a power conversion device is configured by sealing an electronic component with a resin while being housed in a storage case.

Some such power conversion devices are provided with heat dissipation fins on the outer surface of the storage case in order to dissipate heat generated from electronic components (see, for example, Japanese Patent Application Laid-Open No. 2016-146714).

However, in the above-mentioned conventional power conversion device, a configuration for improving the efficiency of heat dissipation of heat generated from electronic components while reducing the size of the power conversion device has not been studied.

As described above, the conventional power conversion device has a problem that the heat dissipation property of the heat generated from the electronic component which is the heat generation source cannot be improved while reducing the size.

Therefore, an object of the present invention is to provide a power conversion device capable of improving the heat dissipation of heat generated from an electronic component which is a heat generation source while reducing the size.

The power conversion device according to the embodiment according to one aspect of the present invention is
A power conversion device that outputs an output voltage obtained by converting the first input voltage into power.
A storage case having a first surface and a second surface opposite to the first surface,
A first electronic component, which is a first heat source, arranged in a first component region on the first surface of the storage case.
A second electronic component, which is a second heat source, arranged adjacent to the first electronic component in the second component region on the first surface of the storage case.
A third electronic component, which is a third heat source, arranged adjacent to the second electronic component in the third component region on the first surface of the storage case.
A wiring board arranged in the storage case and having a third surface facing the first surface of the storage case and a fourth surface opposite to the third surface.
A control unit arranged on the fourth surface of the wiring board and controlling the operation of the first and second electronic components.
A first surface that seals the first to third electronic components on the first surface of the storage case, and also seals the wiring board and the control unit on the fourth surface of the wiring board. Sealing member and
A radiating fin arranged on the second surface of the storage case is provided.
The first electronic component is
A rectifying circuit having a plurality of rectifying elements controlled by the control unit and rectifying and outputting the first input voltage by the plurality of rectifying elements.
The heat radiation fin is
On the second surface, with respect to a region extending from the first component region in which the first electronic component is arranged on the first surface to the second component region in which the second electronic component is arranged. It is provided so as to face each other via the storage case.
The plurality of rectifying elements are
It is characterized in that the heat radiation fins are arranged along the extending direction.

In the power conversion device
The calorific value per unit time during the operation of the second electronic component is larger than the calorific value per unit time during the operation of the first electronic component.
The calorific value per unit time during operation of the third electronic component is smaller than the calorific value per unit time during operation of the first electronic component and the second electronic component. ..

In the power conversion device
The heat radiation fin is
The feature is that the first component region and the second component region are provided on the second surface so as to extend in a direction parallel to the adjacent first direction on the first surface. do.

In the power conversion device
The heat radiation fin is
It is characterized in that a plurality of them are provided so as to extend in a direction parallel to the first direction.

In the power conversion device
The heat radiation fin is characterized by having a flat plate shape protruding from the second surface of the storage case.

In the power conversion device
The heat radiating fin is not provided on the second surface in a region of the first surface facing the third component region in which the third electronic component is arranged.

In the power conversion device
The first component region of the first surface on which the first electronic component is arranged is a first recess formed so as to be recessed in the first surface of the storage case, and the first recess of the first recess. The two-sided side protrudes from the second side of the storage case.
The second component region of the first surface on which the second electronic component is arranged is a second recess formed so as to be recessed in the first surface of the storage case, and the second recess of the second recess. The two-sided side is characterized in that it protrudes from the second side of the storage case.

In the power conversion device
The radiating fin is characterized in that it is in contact with the first recess and the second surface side of the second recess.

In the power conversion device
The third component region of the first surface on which the third electronic component is arranged is a third recess formed so as to be recessed in the first surface of the storage case, and the third recess of the third recess. The two-sided side is characterized in that it protrudes from the second side of the storage case.

In the power conversion device
The radiating fin is not in contact with the second surface side of the third recess.

In the power conversion device
In the second direction in which the second electronic component and the third electronic component are adjacent to each other on the first surface of the storage case, the first electronic component and the second electronic component are adjacent to each other. It is characterized in that it is different from the above-mentioned first direction.

In the power conversion device
The radiating fins are configured to release at least the heat generated by the first and second electronic components to the outside by being cooled by an air flow supplied from the outside.
It is characterized in that at least a part of the air flow guided by the heat radiation fins is arranged so as to avoid the second surface side of the third recess in which the third electronic component is arranged.

In the power conversion device
The storage case and the heat radiating fin are integrally molded.

In the power conversion device
The second electronic component is a module controlled by the control unit and converting and outputting the voltage rectified by the rectifier circuit.
The third electronic component is characterized in that it is a reactor that adjusts and outputs the voltage output by the module.

In the power conversion device
It is arranged on the fourth surface of the wiring board, connected to the input of the rectifying circuit via the wiring of the wiring board, and the connection portion with the wiring board is sealed by the first sealing member. The first input terminal to which the first input voltage is supplied and
It is arranged on the fourth surface of the wiring board, connected to the output of the rectifying circuit via the wiring of the wiring board, and the connection portion with the wiring board is sealed by the first sealing member. A smoothing capacitor that smoothes the voltage output by the rectifying circuit,
A noise filter arranged on the fourth surface of the wiring board 10 and filtering and outputting a voltage output by an LC filter including the reactor.
The voltage supplied from the noise filter is used as the voltage supplied from the noise filter, which is arranged on the fourth surface of the wiring board, connected to the wiring board, and the connection portion with the wiring board is sealed by the first sealing member. It is characterized by further including an output terminal that outputs as an output voltage.

In the power conversion device according to one aspect of the present invention, the first electronic component has a plurality of rectifying elements (thyristor, diode) controlled by a control unit, and the input voltage is rectified by the plurality of rectifying elements. It is a rectifier circuit that outputs, and the heat radiation fin is the second electron from the first component region in which the first electronic component on the first surface (inner surface) is arranged on the second surface (outer surface) of the storage case. It is provided so as to face the area extending over the second component area where the components are arranged via the storage case, and the plurality of rectifying elements are arranged along the direction in which the heat dissipation fins extend. ing.

In this way, the second electronic component (module) having a high heat generation amount and the first electronic component (rectifier circuit) are arranged adjacent to each other to reduce the area where the heat radiation fins are arranged, and the first electron. Rectifier elements (cyclistas, diodes) of components (rectifier circuits) are arranged along the direction in which the heat dissipation fins extend.

As a result, the rectifier circuit and the heat dissipation fins that dissipate the heat of the module are provided along the direction from the module side to the rectifier circuit side so as to be away from the reactor, and the airflow (cooling air) is a second electronic component. The heat generated in the second electronic component (module) while being guided along the radiating fins away from the (module) and the third electronic component (reactor) and avoiding the heat generated by the third electronic component (reactor). And the heat generated by the rectifying element (thyristor, diode) of the first electronic component (rectifier circuit) is dissipated in order.

As described above, according to the power conversion device of the present invention, it is possible to improve the heat dissipation of the heat generated from the electronic component which is the heat generation source while reducing the size.

FIG. 1 is a diagram showing an example of the configuration of a power generation system 1000 to which the power conversion device 100 according to the first embodiment is applied. FIG. 2 is a block diagram showing an example of a main configuration of the power conversion device 100 shown in FIG. FIG. 3 is a top view showing an example of the external configuration of the power conversion device 100 shown in FIG. FIG. 4 is a cross-sectional view taken along the line IV-IV showing an example of the configuration of the power conversion device 100 shown in FIG. FIG. 5 is a perspective view of a wiring board 10 in which each component of the power conversion device 100 shown in FIG. 3 is arranged. FIG. 6 is a bottom view of the storage case H of the power conversion device 100 shown in FIG. FIG. 7 is a perspective view of the storage case H shown in FIG. FIG. 8 is a perspective view showing an example of a state before sealing in which the first to third electronic components Y, M, and R are mounted on the storage case H shown in FIG. 7. FIG. 9 is a side view of the storage case H of the power conversion device 100 shown in FIG.

Hereinafter, embodiments according to the present invention will be described with reference to the drawings.

For example, as shown in FIG. 1, the power generation system 1000 includes an engine E, a fan X driven by an alternator (not shown) connected to the engine E, and an AC voltage (first input voltage VIN1) output by the alternator. ) Is converted into an AC voltage (output voltage VOUT), and the power conversion device 100 is provided.

In the power generation system 1000, when the fan X is driven, the airflow A, which is cooling air, flows into the power generation system 1000 from the outside and is guided to the surroundings of the power conversion device 100 and the engine E. As a result, the power conversion device 100 and the engine E are cooled by the air flow A which is the cooling air, and the heat generated by the power conversion device 100 and the engine E is discharged to the outside together with the air flow B.

Such a power conversion device 100 includes, for example, a storage case H, a heat radiation fin Z, a first sealing member 11, a wiring board 10, and a first input terminal (as shown in FIGS. 2 to 9). Main power supply connector) TIN1, second input terminal (auxiliary power supply connector) TIN2, output terminal TOUT, first electronic component (rectifier circuit) Y, second electronic component (module) M, and LC filter ( It includes a third electronic component (reactor) R, a capacitor Cf1) LC, a smoothing capacitor C, a noise filter F, a control unit CON, and an auxiliary power supply P.

Note that FIG. 2 shows a configuration required for the power conversion device 100 to convert the first and second input voltages VIN1 and VIN2 to the output terminal TOUT for the sake of simplicity, and the other configurations are omitted. There is. Further, FIG. 3 shows a state in which each electronic component of the power conversion device 100 and the wiring board 10 are sealed by the first sealing member 11. The noise filter F includes, for example, a capacitor Cf2 and a fourth electronic component W, as shown in FIG.

Here, for example, as shown in FIGS. 3, 4, 6 to 9, the storage case H has a first surface (upper surface, inner surface) A1 which is an inner surface (electronic component mounting surface) of the storage case H. It has a second surface A2 (lower surface, outer surface) opposite to the first surface A1.

The storage case H and the heat radiating fin Z are made of, for example, aluminum and are integrally molded.

Further, as shown in FIGS. 4 and 8, for example, the first electronic component Y is arranged in the first component region S1 on the first surface A1 of the storage case H, and is electrically connected to the wiring board 10. ing. The first electronic component Y is a first heat generating source that generates heat by operating.

The first electronic component Y is, for example, as shown in FIG. 2, a rectifier circuit controlled by a control unit CON to rectify and output a first input voltage (AC voltage) VIN1.

In particular, the first electronic component Y has a plurality of rectifying elements (thyristors, diodes) YA controlled by the control unit CON, and the first input voltage VIN1 is rectified and output by the plurality of rectifying elements YA. (Fig. 8).

The plurality of rectifying elements YA are arranged along the first direction DZ in which the heat radiation fins Z extend, as shown in FIG. 8, for example.

The plurality of rectifying elements YA of the first electronic component Y are sealed by the first sealing member 11.

The first electronic component Y includes, for example, as shown in FIGS. 3 and 8, a plurality of terminals YT for inputting / outputting an input voltage VIN, a rectified voltage, or a control signal. These terminals YT are electrically connected to the electrode 10Y of the wiring board 10 by a solder material or the like (FIG. 3).

In this way, the first electronic component (rectifier circuit) Y is electrically connected to the wiring board 10. In particular, the input of the rectifying circuit Y (input terminal YT, electrode 10Y) is connected to the input terminal TIN via the wiring 10Y of the wiring board 10, and the output of the rectifying circuit Y (output terminal YT, electrode 10Y). 10Y) is connected to the smoothing capacitor C via the wiring 10Ca of the wiring board 10 (FIG. 3).

Here, for example, as shown in FIGS. 7 to 9, the first component region S1 of the first surface A1 in which the first electronic component (rectifier circuit) Y is arranged is located on the first surface A1 of the storage case H. It is a first concave portion S1b formed so as to be recessed.

The second surface A2 side of the first recess S1b is a convex portion S1a protruding from the second surface A2 of the storage case H (FIG. 6).

Further, as shown in FIGS. 7 to 9, for example, the second electronic component M is located in the second component region S2 on the first surface A1 of the storage case H and in the first electronic component (rectifier circuit) Y. They are arranged adjacent to each other and are electrically connected to the wiring board 10. The second electronic component M is a second heat source that generates heat when operated.

The second electronic component M is, for example, as shown in FIG. 2, a module (H bridge circuit) controlled by a control unit CON to convert and output a voltage rectified by a rectifier circuit (first electronic component) Y. ).

The second electronic component M is molded by a second sealing member (sealing resin) different from the first sealing member 11. That is, the second electronic component M has a second sealing member different from the first sealing member 11, and the circuit portion of the second electronic component M is sealed by the second sealing member. Has been done.

The second electronic component M includes, for example, as shown in FIGS. 3 and 8, a plurality of terminal MTs for inputting / outputting a rectified voltage, an AC voltage, or a control signal. These terminal MTs are electrically connected to the electrode 10M of the wiring board 10 by a solder material or the like (FIG. 3).

In this way, the second electronic component (module) M is electrically connected to the wiring board 10. In particular, the input of this module M (input terminal MT, electrode 10M) is connected to the output of the rectifying circuit Y (output terminal MT, electrode 10Y) via the wiring 10Ca and 10Cb of the wiring board 10. The output of the H-bridge module M (terminal MT for output, electrode 10M) is connected to the input of the reactor R (terminal MT for input, electrode 10R) via the wiring 10Ra of the wiring board 10 (FIG. 3). ).

The amount of heat generated per unit time during the operation of the second electronic component M is larger than the amount of heat generated per unit time during the operation of the first electronic component Y.

That is, the amount of heat generated per unit time when the module M is operating is larger than the amount of heat generated per unit time when the rectifier circuit Y is operating.

Here, for example, as shown in FIGS. 7 to 9, the second component region S2 of the first surface A1 in which the second electronic component (module) M is arranged is recessed in the first surface A1 of the storage case H. It is a second concave portion S2b formed as described above. The second surface A2 side of the second recess S2b is a convex portion S2a protruding from the second surface A2 of the storage case H (FIG. 6).

Further, the third electronic component (reactor) R is, for example, as shown in FIGS. 7 to 9, in the third component region S3 on the first surface A1 of the storage case H, and in the second direction D. It is arranged adjacent to the electronic component M of the above and is electrically connected to the wiring board 10. The third electronic component R is a third heat source that generates heat when operated.

The third electronic component R is, for example, as shown in FIG. 2, a reactor that adjusts the voltage output by the module M (removes high frequency components) and outputs the voltage.

As shown in FIGS. 3 and 8, for example, the third electronic component R includes a plurality of terminals RT for inputting the voltage output by the module M and outputting the adjusted voltage. These terminal RTs are electrically connected to the electrode 10Y of the wiring board 10 by a solder material or the like (FIG. 3).

In this way, the third electronic component (reactor) R is electrically connected to the wiring board 10. In particular, the input of the reactor R (input terminal RT, electrode 10R) is connected to the output of the module M via the wiring 10R of the wiring board 10, and the output of the reactor R (output terminal RT, electrode 10R). ) Is connected to the input of the noise filter F via the wiring 10Rb of the wiring board 10 and the capacitor Cf1 arranged on the fourth surface A4 of the wiring board 10 (FIG. 3).

The calorific value per unit time during the operation of the third electronic component R is smaller than the calorific value per unit time during the operation of the first electronic component Y and the second electronic component M. There is.

That is, the calorific value per unit time when the reactor R is operating is smaller than the calorific value per unit time when the rectifier circuit Y and the module M are operating.

In particular, the calorific value per unit time of the rectifier circuit Y, the module M, and the reactor R arranged on the first surface of the storage case H is arranged on the fourth surface of the wiring board 10. It is set to be larger than the calorific value per unit time when the smoothing capacitor and the noise filter are operated.

Here, for example, as shown in FIGS. 7 to 9, the third component region S3 of the first surface A1 on which the third electronic component R is arranged is formed so as to be recessed in the first surface A1 of the storage case H. It is the third concave portion S3b made. The second surface A2 side of the third recess S3b is a convex portion S3a protruding from the second surface A2 of the storage case H (FIG. 6).

That is, the third component region S3 of the first surface A1 on which the reactor R is arranged is the third concave portion S3b formed so as to be recessed in the first surface A1 of the storage case H, and is the second surface of the third concave portion S3b. The A2 side is a convex portion S3a protruding from the second surface A2 of the storage case H.

Further, the fourth electronic component W is arranged on the fourth surface A4 of the wiring board 10, for example, as shown in FIGS. 3 and 5. The fourth electronic component W is a winding constituting the noise filter F.

As described above, the first to third electronic components Y, M, and R are along the outer circumference of the first surface (inner surface) A1 of the substantially rectangular shape of the storage case H (that is, along the current path through which the current flows). Have been placed.

As a result, the storage case H accommodates the first to third electronic components Y, M, and R, so that the space can be reduced and the size of the power conversion device 100 can be reduced.

Further, the wiring board 10 is arranged in the storage case H, for example, as shown in FIGS. 3 and 4. The wiring board 10 has a third surface A3 (lower surface) facing the first surface A1 of the storage case H and a fourth surface A4 (upper surface) opposite the third surface A3.

The wiring board 10 includes a plurality of wirings 10Ya, 10Ca, 10Cb, 10Ra, 10Rb, 10Fa, 10a, 10b, and a plurality of electrodes 10Y, 10M, 10R, 10F.

Further, the first input terminal TIN1 is arranged on the fourth surface A4 of the wiring board 10, for example, as shown in FIGS. 3 and 5. The first input terminal TIN1 is connected to the input of the rectifier circuit (first electronic component Y) via the wiring of the wiring board 10.

The connection portion of the first input terminal TIN1 with the wiring board 10 is sealed by the sealing member 11. The first input voltage VIN1 is supplied to the first input terminal TIN1.

As shown in FIG. 3, for example, the first input terminal TIN1 is electrically connected to the electrode 10Y via the wiring 10Ya of the wiring board 10.

Further, the second input terminal TIN2 is arranged on the fourth surface A4 of the wiring board 10, and a second input voltage (VIN2) lower than the first input voltage is supplied.

Further, the smoothing capacitor C is arranged on the fourth surface A4 of the wiring board 10, for example, as shown in FIGS. 3 and 5. The smoothing capacitor C is connected to the output (output terminal YT, electrode 10Y) of the rectifier circuit (first electronic component) Y via the wiring 10Ca of the wiring board 10.

As shown in FIG. 3, for example, in this smoothing capacitor C, a connection portion with the wiring board 10 is sealed by a sealing member 11. The smoothing capacitor C is adapted to smooth the voltage output by the rectifier circuit (first electronic component) Y.

As shown in FIG. 3, for example, the smoothing capacitor C is electrically connected to the electrode 10Y via the wiring 10Ca of the wiring board 10. Further, the smoothing capacitor C is electrically connected to the electrode 10M via the wiring 10Cb of the wiring board 10, for example, as shown in FIG. That is, the smoothing capacitor C is connected to the input (input terminal MT, electrode 10M) of the H bridge module M via the wiring 10Cb of the wiring board 10.

Further, the noise filter F is arranged on the fourth surface A4 of the wiring board 10 and is connected to the output of the LC filter FX including the reactor R via the wiring of the wiring board 10.

In particular, the capacitor CF2 of the noise filter F is arranged on the fourth surface A4 of the wiring board 10, for example, as shown in FIG.

The noise filter F filters the voltage output by the LC filter FX composed of the third electronic component (reactor) R and the capacitor CF1 and outputs the voltage to the output terminal TOUT.

As shown in FIG. 3, the input of the noise filter F is connected to the output of the reactor R (terminal RT for output, electrode 10R) via the wiring 10Rb of the wiring board 10 and the capacitor Cf1. The output of the noise filter F is electrically connected to the output terminal TOUT via the wiring 10F of the wiring board 10.

Further, the output terminal TOUT is arranged in the first wiring region WA1 on the fourth surface (upper surface) A4 of the wiring board 10, for example, as shown in FIGS. 3 and 5. The output terminal TOUT is connected to the wiring board 10, and the connection portion with the wiring board 10 is sealed by the first sealing member 11.

The output terminal TOUT outputs the voltage supplied from the noise filter F as the output voltage VOUT.

Further, the control unit CON is arranged on the fourth surface A4 of the wiring board 10, for example, as shown in FIGS. 3 and 5. As shown in FIG. 2, for example, the control unit CON controls the operation of the first electronic component (rectifier circuit) Y and the second electronic component (module) M.

The control unit CON inputs and outputs a control signal via the wiring 10a and the electrode 10Y of the wiring board 10 shown in FIG. 3 to control the operation of the first electronic component (rectifier circuit) Y. ..

Further, the control unit CON inputs and outputs a control signal via the wiring 10b and the electrode 10M of the wiring board 10 shown in FIG. 3 to control the operation of the second electronic component (module) M. There is.

Further, for example, as shown in FIG. 2, the auxiliary power supply P is arranged on the fourth surface A4 of the wiring board 10 so as to supply the auxiliary power supply voltage obtained by converting the second input voltage VIN2 to the control unit CON. It has become.

Here, for example, as shown in FIG. 3, the first input terminal TIN1, the second input terminal TIN2, the auxiliary power supply P, and the control unit CON are the first of the wiring board 10 of the fourth surface A4 of the wiring board 10. The noise filter F and the smoothing capacitor C are arranged on the first wiring region WA1 on the side end 101 side, and the noise filter F and the smoothing capacitor C are on the second side of the fourth surface A4 of the wiring board 10 opposite to the first side end 101. It is arranged on the second wiring area WA2 on the end 102 side.

Further, the first sealing member 11 seals the first to third electronic components Y, M, and R on the first surface A1 of the storage case H, for example, as shown in FIGS. 3 and 4. It is designed to do.

Further, the second sealing member 11b includes a wiring board 10, a control unit CON on the fourth surface A4 of the wiring board 10, an auxiliary power supply P, a part of the first input terminal TIN1, and a part of the second input terminal TIN2. , A part of the smoothing capacitor C, a part of the capacitor Cf1, a part of the capacitor Cf2 of the noise filter F, and a part of the output terminal TOUT are sealed.

That is, the first sealing member 11 seals the rectifier circuit Y, the module M, and the reactor R on the first surface A1 of the storage case H, and also seals the wiring board 10 and the wiring board 10. The control unit CON, the smoothing capacitor C, the noise filter F, and the auxiliary power supply P on the four surfaces A4 are sealed.

The sealing member 11 is, for example, a sealing resin such as an epoxy resin.

Further, the heat radiation fins Z are arranged on the second surface (outer surface) A2 of the storage case H, for example, as shown in FIGS. 4, 6 to 9.

The heat radiation fin Z is cooled by an air flow supplied from the outside of the power generation system 1000 so as to release heat generated by at least the first and second electronic components (rectifier circuit and module) Y and M to the outside. It is configured in.

In the heat radiation fin Z, on the second surface A2 (outer surface), the second electronic component M is arranged from the first component region S1 in which the first electronic component Y of the first surface A1 (inner surface) is arranged. It is provided so as to face the region extending over the two component regions S2 via the storage case H.

As shown in FIGS. 6 and 7, for example, the heat radiation fin Z is from the first component region S1 in which the first electronic component (rectifier circuit) Y of the first surface A1 is arranged on the second surface A2. It extends so as to continuously face the region extending over the second component region S2 in which the second electronic component M is arranged via the storage case H.

That is, the heat radiation fin Z is in contact with the convex portions S2a and S3a on the second surface A2 side of the first concave portion S1b and the second concave portion S2b.

Further, as shown in FIGS. 7 and 8, the heat radiation fin Z extends in a direction parallel to the first direction DZ in which the first component region S1 and the second component region 2 are adjacent to each other on the first surface A1. As it exists, it is provided on the second surface A2.

Further, as shown in FIGS. 6 to 8, for example, a plurality of the heat radiation fins Z are provided so as to extend in a direction parallel to the first direction DZ.

The radiating fin Z has a flat plate shape protruding from the second surface A2 of the storage case H, for example, as shown in FIGS. 6 to 8.

As for the heat radiation fin Z, for example, as shown in FIGS. 6 to 8, the heat radiation fin Z is a third component region in which the third electronic component R of the first surface A1 is arranged on the second surface A2. It is not provided in the area facing S3.

Then, for example, as shown in FIGS. 6 to 8, the heat radiation fin Z is not in contact with the second surface A2 side of the third recess S3b. In other words, the radiating fin Z is not provided for the third electronic component R, which is the reactor.

Here, as described above, the calorific value per unit time during the operation of the second electronic component M is larger than the calorific value per unit time during the operation of the first electronic component Y.

Further, as described above, the calorific value per unit time of the third electronic component R during operation is higher than the calorific value per unit time of the first electronic component Y and the second electronic component M during operation. Is getting smaller.

Therefore, as described above, the second electronic component (module) M having a high calorific value and the first electronic component (rectifier circuit) Y are arranged adjacent to the first direction D. Then, the heat radiating fins Z that dissipate the heat of the first and second electronic components Y and M are directed from the module M side to the rectifier circuit Y side so that the airflow guiding direction is away from the reactor R. It is provided along with.

Then, for example, as shown in FIGS. 6 to 9, the second direction DY in which the second electronic component M and the third electronic component R are adjacent to each other is on the first surface A1 of the storage case H. The electronic component (rectifier circuit) Y of 1 and the second electronic component (module) M are different from the adjacent first direction DZ. Then, the smoothing capacitor C is located on the fourth surface A4 of the wiring board 10 so as to be located above the region adjacent to the rectifier circuit Y and adjacent to the module M and the second direction DY on the opposite side of the reactor R. It is placed on top.

That is, the heat radiation fins Z are arranged so that at least a part of the air flow guided by the heat radiation fins Z avoids the second surface A2 side of the third recess S3b where the third electronic component R is arranged.

Thereby, for example, the airflow (cooling air) is guided along the heat radiation fin Z so as to be away from the third electronic component (reactor) R adjacent to the second electronic component (module) M, and the third electron. While avoiding the heat generated by the component (reactor) R, the heat generated by the second electronic component (module) M having a large calorific value and the heat generated by the first electronic component (rectifying circuit) Y are dissipated in order.

As a result, it is possible to improve the heat dissipation of the heat generated from the electronic component that is the heat generation source of the power conversion device 100.

In the first embodiment described above, an example of the configuration of the power generation system 1000 to which the power conversion device 100 is applied has been described.

The power generation system 1000 may be applied to, for example, a portable generator.

Also in this case, by driving the fan X, the airflow A, which is cooling air, flows into the power generation system 1000 from the outside and is guided to the surroundings of the power conversion device 100 and the engine E. As a result, the power conversion device 100 and the engine E are cooled by the air flow A which is the cooling air, and the heat generated by the power conversion device 100 and the engine E is discharged to the outside together with the air flow B. (Fig. 1).

The configuration of the other power conversion device 100 in the second embodiment is the same as that of the first embodiment.

That is, according to the power conversion device 100 according to the second embodiment, it is possible to improve the heat dissipation of the heat generated from the electronic component which is the heat generation source while reducing the size.

As described above, in the power conversion device according to one aspect of the present invention, the first electronic component Y has a plurality of rectifying elements (thyristors, diodes) YA controlled by the control unit CON, and the plurality of rectifying elements are rectified. It is a rectifier circuit that rectifies and outputs an input voltage by the element YA, and the heat radiation fin Z has a first electronic component on the first surface (inner surface) arranged on the second surface (outer surface) of the storage case H. The plurality of rectifying elements YA are provided so as to face the region extending from the first component region to the second component region in which the second electronic component is arranged via the storage case, and the plurality of rectifying elements YA are radiating fins. Z is arranged along the extending direction DZ.

In this way, the second electronic component (module) having a high heat generation amount and the first electronic component (rectifier circuit) are arranged adjacent to each other to reduce the area where the heat radiation fin Z is arranged, and the first electronic component (rectifier circuit) is arranged. A rectifying element (thyristor, diode) YA of an electronic component (rectifying circuit) is arranged along the direction in which the heat radiation fins extend.

As a result, the rectifier circuit and the heat dissipation fins that dissipate the heat of the module are provided along the direction from the module side to the rectifier circuit side so as to be away from the reactor, and the airflow (cooling air) is a second electronic component. The heat generated in the second electronic component (module) while being guided along the radiating fins away from the (module) and the third electronic component (reactor) and avoiding the heat generated by the third electronic component (reactor). And the heat generated by the rectifying element (thyristor, diode) of the first electronic component (rectifier circuit) is dissipated in order.

As described above, according to the power conversion device of the present invention, it is possible to improve the heat dissipation of the heat generated from the electronic component which is the heat generation source while reducing the size.

Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and variations thereof are included in the scope of the invention described in the claims and the equivalent scope thereof, as are included in the scope and gist of the invention.

100 Power converter 1000 Power generation system E Engine X Fan A, B Airflow H Storage case Z Heat dissipation fin 11 First sealing member 10 Wiring board TIN1 First input terminal TIN2 Second input terminal TOUT Output terminal Y First electronic component (Rectifier circuit)
M Second electronic component (module)
R Third electronic component (reactor)
W Fourth electronic component C Smoothing capacitor FX LC filter F Noise filter CON control unit Cf1, Cf2 Capacitor 10Ya, 10Ca, 10Cb, 10Ra, 10Rb, 10Fa, 10a, 10b Wiring 10Y, 10M, 10R, 10F Electrode

Claims (15)

A power conversion device that outputs an output voltage obtained by converting the first input voltage into power.
A storage case having a first surface and a second surface opposite to the first surface,
A first electronic component, which is a first heat source, arranged in a first component region on the first surface of the storage case.
A second electronic component, which is a second heat source, arranged adjacent to the first electronic component in the second component region on the first surface of the storage case.
A third electronic component, which is a third heat source, arranged adjacent to the second electronic component in the third component region on the first surface of the storage case.
A wiring board arranged in the storage case and having a third surface facing the first surface of the storage case and a fourth surface opposite to the third surface.
A control unit arranged on the fourth surface of the wiring board and controlling the operation of the first and second electronic components.
A first surface that seals the first to third electronic components on the first surface of the storage case, and also seals the wiring board and the control unit on the fourth surface of the wiring board. Sealing member and
A radiating fin arranged on the second surface of the storage case is provided.
The first electronic component is
A rectifying circuit having a plurality of rectifying elements controlled by the control unit and rectifying and outputting the first input voltage by the plurality of rectifying elements.
The heat radiation fin is
On the second surface, with respect to a region extending from the first component region in which the first electronic component is arranged on the first surface to the second component region in which the second electronic component is arranged. It is provided so as to face each other via the storage case.
The plurality of rectifying elements are
A power conversion device characterized in that the heat radiation fins are arranged along an extending direction. The calorific value per unit time during the operation of the second electronic component is larger than the calorific value per unit time during the operation of the first electronic component.
The calorific value per unit time during operation of the third electronic component is smaller than the calorific value per unit time during operation of the first electronic component and the second electronic component. The power conversion device according to claim 1. The heat radiation fin is
The feature is that the first component region and the second component region are provided on the second surface so as to extend in a direction parallel to the adjacent first direction on the first surface. The power conversion device according to claim 2. The heat radiation fin is
The power conversion device according to claim 3, wherein a plurality of power conversion devices are provided so as to extend in a direction parallel to the first direction. The power conversion device according to claim 4, wherein the heat radiation fin has a flat plate shape protruding from the second surface of the storage case. The claim is characterized in that the heat radiation fin is not provided on the second surface in a region of the first surface facing the third component region in which the third electronic component is arranged. 5. The power conversion device according to 5. The first component region of the first surface on which the first electronic component is arranged is a first recess formed so as to be recessed in the first surface of the storage case, and the first recess of the first recess. The two-sided side protrudes from the second side of the storage case.
The second component region of the first surface on which the second electronic component is arranged is a second recess formed so as to be recessed in the first surface of the storage case, and the second recess of the second recess. The power conversion device according to claim 6, wherein the two-sided side protrudes from the second side of the storage case. The power conversion device according to claim 7, wherein the heat radiating fin is in contact with the first recess and the second surface side of the second recess. The third component region of the first surface on which the third electronic component is arranged is a third recess formed so as to be recessed in the first surface of the storage case, and the third recess of the third recess. The power conversion device according to claim 8, wherein the two-sided side protrudes from the second side of the storage case. The power conversion device according to claim 9, wherein the heat radiation fin is not in contact with the second surface side of the third recess. In the second direction in which the second electronic component and the third electronic component are adjacent to each other on the first surface of the storage case, the first electronic component and the second electronic component are adjacent to each other. The power conversion device according to claim 10, wherein the power conversion device is different from the first direction. The radiating fins are configured to release at least the heat generated by the first and second electronic components to the outside by being cooled by an air flow supplied from the outside.
15. The power converter described. The power conversion device according to claim 6, wherein the storage case and the heat radiation fin are integrally molded. The second electronic component is a module controlled by the control unit and converting and outputting the voltage rectified by the rectifier circuit.
The power conversion device according to claim 6, wherein the third electronic component is a reactor that adjusts and outputs a voltage output by the module. It is arranged on the fourth surface of the wiring board, connected to the input of the rectifying circuit via the wiring of the wiring board, and the connection portion with the wiring board is sealed by the first sealing member. The first input terminal to which the first input voltage is supplied and
It is arranged on the fourth surface of the wiring board, connected to the output of the rectifying circuit via the wiring of the wiring board, and the connection portion with the wiring board is sealed by the first sealing member. A smoothing capacitor that smoothes the voltage output by the rectifying circuit,
A noise filter arranged on the fourth surface of the wiring board 10 and filtering and outputting a voltage output by an LC filter including the reactor.
The voltage supplied from the noise filter is used as the voltage supplied from the noise filter, which is arranged on the fourth surface of the wiring board, connected to the wiring board, and the connection portion with the wiring board is sealed by the first sealing member. The power conversion device according to claim 14, further comprising an output terminal for outputting as an output voltage.

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