JP7055672B2 - Electronic devices, imaging devices, and mobiles - Google Patents

Description

The present invention relates to electronic devices, image pickup devices, and mobile objects.

In electronic devices with various electronic components such as image pickup devices, we know the structure in which electronic components are compressed and interposed between rigid members such as metal substrate covers and electronic components. (See Patent Document 1).

International Publication No. 2012/008398

In order to manufacture the structure described in Patent Document 1, the substrate cover is attached to the substrate on which the electronic components are mounted with the heat dissipation sheet stacked on the electronic components, using the legs or the attachment members of the substrate cover. It was necessary and the work was complicated.

Therefore, an object of the present disclosure made in view of the above-mentioned problems of the prior art is to compress an elastic member between an electronic component which can be manufactured more easily and a housing which can have a large rigidity. To provide intervening electronic devices, image pickup devices, and moving objects.

In order to solve the above-mentioned problems, the electronic device from the first viewpoint is
With electronic components
It has a set of facing wall portions each having a flat surface portion, and a fixed wall portion having the flat surface portions of the pair of facing wall portions facing each other in parallel at a first interval, and the one set of facing wall portions and the said. The fixed wall portion has an opening formed in one direction perpendicular to the facing direction of the flat surface portion, and a housing for accommodating the electronic component between the flat surface portions facing each other.
An elastic member that is compressed in the facing direction and is located between the electronic component and the flat surface portion in the facing direction.
An indirect member interposed between the electronic component or the housing and the elastic member,
A substrate on which the electronic component is mounted and one end of the indirect member is fixed at the back side from the opening of the electronic component is provided .
In a state where the indirect member and the substrate are located outside the housing, the distance between the substrate and the indirect member in the facing direction is wider on the non-fixed side than on the fixed one end side .
The electronic device from the second viewpoint is
With electronic components
It has a set of facing wall portions each having a flat surface portion, and a fixed wall portion having the flat surface portions of the pair of facing wall portions facing each other in parallel at a first interval, and the one set of facing wall portions and the said. The fixed wall portion has an opening formed in one direction perpendicular to the facing direction of the flat surface portion, and a housing for accommodating the electronic component between the flat surface portions facing each other.
An elastic member that is compressed in the facing direction and is located between the electronic component and the flat surface portion in the facing direction.
An indirect member that is interposed between the electronic component and the elastic member and one end of the housing from the opening side to the back side is fixed to the housing.
In a state where the electronic component is not housed in the housing, the distance between the indirect member and the flat surface portion via the elastic member in the facing direction is from the fixed one end side to the non-fixed side. Is wider.

In addition, the image pickup device from the second viewpoint is
It has an electronic component, a set of facing wall portions each having a flat surface portion, and a fixed wall portion in which the flat surface portions of the pair of facing wall portions are opposed to each other in parallel at a first interval, and the pair of facing walls are opposed to each other. The wall portion and the fixed wall portion have an opening formed in one direction perpendicular to the facing direction of the flat surface portion, and the housing for accommodating the electronic component between the flat surface portions facing each other and the facing direction. An elastic member that is compressed and is located between the electronic component and the flat portion in the opposite direction, an indirect member interposed between the housing and the elastic member, and the electronic component are mounted. The substrate and the indirect member include a substrate that fixes one end of the indirect member behind the opening from the electronic component, and the indirect member and the substrate are located outside the housing. The spacing in the facing direction is wider on the non-fixed side than on the fixed one end side, the electronic device or electronic component, a set of facing wall portions each having a flat portion, and the pair of facing walls. It has a fixed wall portion in which the flat portions of the wall portions face each other in parallel at a first interval, and the pair of facing wall portions and the fixed wall portion are opened in one direction perpendicular to the facing direction of the flat portion. A housing in which the electronic component is housed between the flat portions facing each other, and an elastic member compressed in the facing direction and located between the electronic component and the flat portion in the facing direction. An indirect member that is interposed between the electronic component and the elastic member and one end of the housing from the opening side to the back side is fixed to the housing, and the electronic component is mounted on the housing. The electronic device is provided with an electronic device in which the distance between the indirect member and the flat surface portion via the elastic member in the facing direction is wider on the non-fixed side than on the fixed one end side. ,
The electronic device includes an image sensor.

In addition, the moving body from the third viewpoint is
It has an electronic component, a set of facing wall portions each having a flat surface portion, and a fixed wall portion in which the flat surface portions of the pair of facing wall portions are opposed to each other in parallel at a first interval, and the pair of facing walls are opposed to each other. The wall portion and the fixed wall portion have an opening formed in one direction perpendicular to the facing direction of the flat surface portion, and the housing for accommodating the electronic component between the flat surface portions facing each other and the facing direction. An elastic member that is compressed and is located between the electronic component and the flat portion in the opposite direction, an indirect member interposed between the housing and the elastic member, and the electronic component are mounted. The substrate and the indirect member are provided with a substrate for fixing one end of the indirect member behind the opening of the electronic component, and the indirect member and the substrate are located outside the housing. The distance between the two and the electronic device in the opposite direction is wider on the non-fixed side than on the fixed one end side. It has a fixed wall portion in which the flat portions of the wall portions face each other in parallel at a first interval, and the pair of facing wall portions and the fixed wall portion are opened in one direction perpendicular to the facing direction of the flat portion. A housing in which the electronic component is housed between the flat portions facing each other, and an elastic member compressed in the facing direction and located between the electronic component and the flat portion in the facing direction. An indirect member that is interposed between the electronic component and the elastic member and one end of the housing from the opening side to the back side is fixed to the housing, and the electronic component is mounted on the housing. The distance between the indirect member and the flat surface portion via the elastic member in the facing direction is wider on the non-fixed side than on the fixed one end side, or an electronic device or the like. The electronic component has the electronic device, and the electronic component is equipped with an image pickup device including an image pickup element.

According to the present disclosure configured as described above, it is possible to more easily manufacture an electronic device in which an elastic member is compressed and interposed between an electronic component and a housing that may have rigidity.

It is a layout drawing which shows the mounting position in the moving body of the image pickup apparatus which includes the electronic device which concerns on 1st Embodiment. It is sectional drawing which shows the schematic structure of the image pickup apparatus of FIG. 1, cut parallel to the optical axis. It is an external perspective view of only the indirect member of FIG. It is a figure explaining the process of mounting an electronic component on a substrate in the manufacturing method of the electronic device of FIG. It is a figure explaining the process of sandwiching a spacer between two substrates in the manufacturing method of the electronic device of FIG. It is a figure explaining the process of connecting two boards in a part of a spacer in the manufacturing method of the electronic device of FIG. It is a figure explaining the process of fixing an indirect member to a substrate in the manufacturing method of the electronic device of FIG. It is a figure explaining the process of pressing an indirect member and compressing an elastic member in the manufacturing method of the electronic device of FIG. It is a figure explaining the process of inserting a substrate structure into a device housing while pressing an indirect member in the manufacturing method of the electronic device of FIG. It is a figure explaining the process of releasing the pressure on an indirect member in the manufacturing method of the electronic device of FIG. It is a figure for demonstrating the phenomenon which occurs when the substrate structure is inserted into a housing without using an indirect member. It is sectional drawing of the electronic device which concerns on 2nd Embodiment. It is sectional drawing of the device housing and an indirect member of FIG. It is a figure explaining the process of pressing an indirect member and compressing an elastic member in the manufacturing method of the electronic device of FIG. It is a figure explaining the process of inserting a substrate structure into a device housing while pressing an indirect member in the manufacturing method of the electronic device of FIG. It is a figure of the substrate structure seen from the opposite direction in the electronic device which shows the 1st modification of an indirect member. It is a figure of the substrate structure seen from the opposite direction in the electronic device which shows the 2nd modification of an indirect member. It is a side view of the substrate structure which shows the 3rd modification of an indirect member. It is a side view which shows the 1st modification of the substrate structure of FIG. It is a side view which shows the 2nd modification of the substrate structure of FIG. It is sectional drawing which shows the modification of the device housing and the indirect member of FIG. It is sectional drawing which shows the modification of the electronic device of FIG. It is a figure explaining the process of sandwiching a substrate structure by an indirect member in the manufacturing method of the electronic device of FIG. FIG. 22 is a diagram illustrating a step of restraining an indirect member sandwiching a substrate structure with a band in the method of manufacturing an electronic device of FIG. 22. FIG. 22 is a diagram illustrating a step of inserting a substrate structure into a device housing while pressing an indirect member in the method of manufacturing an electronic device of FIG. 22. It is a side view which shows the 3rd modification of the substrate structure of FIG. It is a side view which shows the 4th modification of the substrate structure of FIG.

Hereinafter, embodiments of the fixed structure to which the present invention is applied will be described with reference to the drawings.

The electronic device according to the first embodiment of the present disclosure may be included in, for example, an image pickup apparatus. As shown in FIG. 1, the image pickup apparatus 10 including the electronic device of the first embodiment is mounted on a mobile body 11, for example.

The moving body 11 may include, for example, a vehicle, a ship, an aircraft, and the like. Vehicles may include, for example, automobiles, industrial vehicles, railroad vehicles, living vehicles, fixed-wing aircraft traveling on runways, and the like. Automobiles may include, for example, passenger cars, trucks, buses, motorcycles, trolley buses and the like. Industrial vehicles may include, for example, industrial vehicles for agriculture and construction. Industrial vehicles may include, for example, forklifts and golf carts. Industrial vehicles for agriculture may include, for example, tractors, tillers, porting machines, binders, combines, lawnmowers and the like. Industrial vehicles for construction may include, for example, bulldozers, scrapers, excavators, mobile cranes, dump trucks, road rollers and the like. The vehicle may include a vehicle that travels manually. The classification of vehicles is not limited to the above examples. For example, an automobile may include an industrial vehicle capable of traveling on a road. The same vehicle may be included in multiple categories. Vessels may include, for example, marine jets, boats, tankers and the like. Aircraft may include, for example, fixed-wing aircraft, rotary-wing aircraft, and the like.

As shown in FIG. 2, the image pickup apparatus 10 includes an electronic device 12. Further, the image pickup device 10 may further include an optical system 13, an image pickup device 14, and a device housing 15.

The optical system 13 is composed of an optical element such as a lens. The optical system 13 is designed and formed so that optical characteristics such as an angle of view and a depth of field have desired values. The optical system 13 forms a subject image.

The image pickup device 14 is, for example, a CCD (Charge Coupled Device) image sensor and a CMOS (Complementary Metal Oxide Semiconductor) image sensor. The image pickup device 14 is arranged at the imaging position of the optical system 13. The image pickup device 14 captures a subject image formed by the optical system 13.

The device housing 15 holds the optical system 13 in the opening of the device housing 15, and houses the image pickup device 14 and the electronic device 12 inside. The device housing 15 internally fixes the image pickup device 14 at a position defined with respect to the optical system 13.

The electronic device 12 includes an electronic component 16, a device housing (housing) 17, an elastic member 18, and an indirect member 19. The electronic device 12 may further have a substrate 20 on which the electronic component 16 is mounted.

The electronic component 16 is, for example, a controller of the image pickup apparatus 10, a power supply circuit, or the like. The controller includes, for example, one or more processors and memory. The processor may include at least one of a general purpose processor that loads a specific program and performs a specific function, and a dedicated processor specialized for a specific process. The controller may analyze the image captured by the image pickup device 10.

The electronic component 16 may be exposed in the device housing 17. Alternatively, the electronic component 16 may be covered with a shield case or the like in the device housing 17.

The device housing 17 has a set of facing wall portions 21 and a fixed wall portion 22. The facing wall portion 21 has a flat surface portion fp, and the fixed wall portion 22 makes the flat surface portions fp of each of the pair of facing wall portions 21 face each other substantially in parallel at a first interval. A set of facing wall portions 21 and a fixed wall portion 22 are integrally formed. In the device housing 17, an opening is formed in one direction perpendicular to the facing direction of the flat surface portion fp of the pair of facing wall portions 21.

For example, the device housing 17 has a rectangular parallelepiped shape with one open surface. In the equipment housing 17 formed in a rectangular parallelepiped shape, a set of facing wall portions 21 is a set of facing wall portions having an open portion as a side. In the device housing 17, the fixed wall portion 22 is three wall portions connecting a set of facing wall portions 21.

The device housing 17 accommodates the electronic component 16 between the opposite flat surface portions fp. In a configuration in which the electronic device 12 includes the substrate 20, the device housing 17 may accommodate the substrate 20. A plurality of substrates 20 may be connected to each other in the equipment housing 17 at intervals determined by the spacer 23. In the configuration in which a plurality of substrates 20 are connected, at least the electronic component 16 is mounted on the back surface of the facing surface. In the device housing 17, the flat surface portion fp of the facing wall portion 21 and the substrate 20 may be parallel to each other.

The device housing 17 may be formed of a conductive material such as metal.

The elastic member 18 is compressed in the facing direction and is located between the electronic component 16 and the flat portion fp in the facing direction of the flat portion fp of the equipment housing 17. Therefore, the thickness of the elastic member 18 released from compression is longer than the sum of the thickness of the overlapping substrates 20, the spacing between the substrates 20 at both ends in the facing direction, and the height of the electronic components 16 subtracted from the first spacing. .. The thickness of the elastic member 18 is the total thickness of each elastic member 18 in a configuration in which separate elastic members 18 are provided so as to face each of the flat surface portions fp of both facing wall portions 21.

The elastic member 18 may be formed of a material having elasticity and heat transfer properties, such as silicone rubber and acrylic rubber.

The indirect member 19 is interposed between the device housing 17 and the elastic member 18 over both ends of the elastic member 18 in the opening direction toward the opening from the inside of the device housing 17 and in the opposite direction.

As shown in FIG. 3, the indirect member 19 is composed of, for example, a fixing portion 24, a pressing portion 25, and a connecting portion 26. The fixing portion 24, the pressing portion 25, and the connecting portion 26 are flat plates having the same width. The fixing portion 24 is fixed to the substrate 20 in a state where the plane is in contact with the plane of the substrate 20. A hole h1 is perforated in the fixing portion 24. The pressing portion 25 is formed in a size that covers the entire elastic member 18. The connecting portion 26 is connected to the fixing portion 24 and the pressing portion 25 in a state where the pressing portion 25 is tilted with respect to the fixing portion 24.

The indirect member 19 may be fixed on the surface of the substrate 20 facing the facing wall portion 21. For example, screwing may be applied to fix the indirect member 19 to the substrate 20. Alternatively, conventionally known fixing methods such as adhesion, spot welding, fitting, caulking, and welding may be applied to the fixing of the indirect member 19 to the substrate 20.

The indirect member 19 may be made of a material having elasticity and heat transfer property, for example, metal.

As described above, the substrate 20 may mount the electronic component 16. The electronic component 16 may be mounted on the substrate 20 on only one side or on both sides. Wiring may be formed on the substrate 20.

Next, a method of manufacturing the electronic device 12 having the illustrated configuration will be described below.

As shown in FIG. 4, for example, electronic components 16 are mounted on both sides of a substrate 20 having holes h2 formed in four corners of a rectangle. Next, as shown in FIG. 5, a cylindrical spacer 23 is sandwiched at the position of the hole h2 of the substrate 20 in a state where the two substrates 20 on which the electronic components 16 are mounted on both sides face each other.

Next, as shown in FIG. 6, two boards 20 are connected by inserting bolts 27 into holes h2 and spacers 23 on the side of the board 20 on which the indirect member 19 is not fixed and fastening nuts 28. To. Further, the elastic member 18 is attached to the electronic component 16 on the back surface side of the surfaces where the substrates 20 face each other. Next, as shown in FIG. 7, the nut 28 is fastened by inserting the bolt 27 into the hole h1 of the indirect member 19, the hole h2 of the substrate 20 on the side where the indirect member 19 is fixed, and the spacer 23. By fastening the nuts 28, the two substrates 20 are connected, and the substrate structure 29 in which the two indirect members 19 are fixed to the separate substrates 20 is formed.

As shown in FIG. 8, the elastic member 18 is compressed by pressing the pressing portion 25 of the indirect member 19 against the substrate 20. As shown in FIG. 9, the substrate structure 29 is inserted from the opening of the device housing 17 from the end side where the indirect member 19 is fixed while the pressing portion 25 is pressed toward the substrate 20 side. The first interval between the pair of facing wall portions 21 is an indirect member 19 facing each other with the pressing portion 25 pressed against the substrate 20 with a pressure that does not damage the substrate 20 and the electronic component 16. It is longer than the distance between the pressing portions 25.

As shown in FIG. 10, for example, like the bottom surface at the back of an opening, the substrate structure 29 is inserted to a predetermined position in the device housing 17, and then the pressure on the pressing portion 25 is released to cause elasticity. The member 18 extends in the opposite direction. Due to the extension of the elastic member 18, the indirect member 19 comes into contact with the elastic member 18 and the device housing 17, and the electronic device 12 is manufactured.

The electronic device 12 of the first embodiment having the above configuration is compressed in the facing direction, and the elastic member 18 located between the electronic component 16 and the flat portion fp in the facing direction of the flat portion fp of the facing wall portion 21. And an indirect member 19 interposed between the device housing 17 and the elastic member 18. In the manufacturing method of inserting an electronic component in which an elastic member is stacked in a housing having an opening, an elastic member such as a heat dissipation sheet is placed on the electronic component and the substrate cover is fixed to the substrate so as to be pressed against the elastic member. Compared with the manufacturing method described in Patent Document 1, the manufacturing work can be simplified. However, for example, as shown in FIG. 11, when the substrate structure 29'without the indirect member is inserted into the opening of the device housing 17', the elastic member 18'is caught on the device housing 17'. It is difficult to insert the substrate structure 29'. On the other hand, the electronic device 12 having the above-described configuration is damaged by inserting the substrate structure 29 into the opening of the device housing 17 in a state where the elastic member 18 is compressed by using the indirect member 19. It can be manufactured while reducing the possibility of failure.

Further, in the electronic device 12 of the first embodiment, the elastic member 18 has a heat transfer property. With such a configuration, the electronic device 12 can quickly transfer the heat generated in the electronic component 16 to the device housing 17 via the elastic member 18, and can improve the heat dissipation of the electronic component 16.

Further, in the electronic device 12 of the first embodiment, the device housing 17 has electrical conductivity. Therefore, the electronic device 12 can improve the electromagnetic compatibility (EMC) of the electronic component 16.

Next, the electronic device according to the second embodiment of the present disclosure will be described. In the second embodiment, the object to which the indirect member is fixed is different from that in the first embodiment. Hereinafter, the second embodiment will be described with a focus on the differences from the first embodiment. The same reference numerals are given to the parts having the same configuration as that of the first embodiment.

As shown in FIG. 12, the electronic device 120 according to the second embodiment includes an electronic component 16, a device housing 170, an elastic member 18, and an indirect member 190, as in the first embodiment. In the second embodiment, the configurations and functions of the electronic component 16 and the elastic member 18 are the same as those in the first embodiment.

The device housing 170 has a set of facing wall portions 21 and a fixed wall portion 22 as in the first embodiment. The configuration and function of the facing wall portion 21 and the fixed wall portion 22 are the same as those in the first embodiment. The device housing 170 houses the electronic component 16 as in the first embodiment.

As shown in FIG. 13, unlike the first embodiment, the device housing 170 fixes one end of the indirect member 190 from the opening to the back side. The device housing 170, for example, fixes one end of the indirect member 19 at the facing wall portion 21. For fixing the indirect member 19 to the device housing 17, conventionally known fixing methods such as screwing, adhesion, spot welding, fitting, caulking, and welding may be applied.

As shown in FIG. 12, the elastic member 18 is compressed in the facing direction as in the first embodiment, and is between the electronic component 16 and the flat portion fp in the facing direction of the flat portion fp of the device housing 170. To position. Unlike the first embodiment, the elastic member 18 is located between the device housing 170 and the indirect member 19.

Similar to the first embodiment, the indirect member 190 extends to both ends of the elastic member 18 in the opening direction toward the opening from the inside of the device housing 170 and in the opposite direction. Unlike the first embodiment, the indirect member 190 is interposed between the electronic component 16 and the elastic member 18. As described above, the indirect member 190 is fixed to the device housing 170, unlike the first embodiment.

Next, a method of manufacturing the electronic device 120 having the illustrated configuration will be described below. As in the first embodiment, as shown in FIGS. , The cylindrical spacer 23 is sandwiched at the position of the hole h2 of the substrate 20. Unlike the first embodiment, the substrate structure according to the second embodiment is formed by inserting the bolts 27 into the holes h2 and the spacers 23 of all the substrates 20 and fastening the nuts 28.

As shown in FIG. 14, in the device housing 170 to which the indirect member 190 is fixed, the elastic member 18 is arranged between the indirect member 190 and the facing wall portion 21, and the indirect member 190 is pressed toward the facing wall portion 21. As a result, the elastic member 18 is compressed. As shown in FIG. 15, the substrate structure 290 according to the second embodiment is inserted between a set of indirect members 190 facing each other while the indirect member 190 is pressed toward the facing wall portion 21. .. Similar to the first embodiment, after inserting the substrate structure 290 to a predetermined position in the device housing 170, the elastic member 18 extends in the opposite direction by releasing the pressure on the indirect member 190. .. Due to the extension of the elastic member 18, the indirect member 190 comes into contact with the elastic member 18 and the electronic component 16, and the electronic device 12 is manufactured.

Similar to the first embodiment, the electronic device 120 of the second embodiment having the above configuration is also compressed in the facing direction, and the electronic component 16 and the electronic component 16 and the electronic component 120 in the facing direction of the flat surface portion fp of the facing wall portion 21. It has an elastic member 18 located between the flat surface portions fp, and an indirect member 190 interposed between the electronic component 16 and the elastic member 18. Therefore, the electronic device 120 can also be manufactured by inserting the substrate structure 290 into the opening of the device housing 170 in a state where the elastic member 18 is compressed by using the indirect member 190, as in the first embodiment. .. Further, also in the electronic device 120 of the second embodiment, the elastic member 18 has a heat transfer property. Therefore, as in the first embodiment, the electronic device 120 can quickly transfer the heat generated in the electronic component 16 to the device housing 170 via the elastic member 18, and can improve the heat dissipation of the electronic component 16. Further, also in the electronic device 120 of the second embodiment, the device housing 170 has electrical conductivity. Therefore, the electronic device 120 can also improve the electromagnetic compatibility of the electronic component 16 as in the first embodiment.

Although the present invention has been described with reference to the drawings and examples, it should be noted that those skilled in the art can easily make various modifications and modifications based on the present disclosure. Therefore, it should be noted that these modifications and modifications are within the scope of the present invention.

For example, in the first embodiment and the second embodiment, the indirect members 19 and 190 have a flat plate shape, but may have a rod shape extending over both ends of the elastic member 18 in the opening direction and the opposite direction. The number of rod-shaped indirect members 19 and 190 may be plural. Further, the rod-shaped indirect member 19 has a U-shape extending over both ends of the elastic member 18 in the opening direction and the reverse direction as shown in FIG. 16, and the indirect member 19 has an indirect member 19 as shown in FIG. It may be a shape in which a part of the U-shape is bent.

Alternatively, as shown in FIG. 18, the indirect member 19 may have a shape in which the thickness in the facing direction increases toward the opening direction. Generally, the rectangular parallelepiped-shaped device housing 17 having one open surface is formed by casting, cutting, or the like. In such a forming method, in order to make it easy to remove the nest for forming the internal space of the device housing 17, it is general to form a tapered shape in which the distance from the back side to the opening side is slightly increased. .. By using the indirect member 19 whose thickness changes as described above for such a device housing 17, the distance between the indirect members 19 in the electronic device 12 becomes constant regardless of the position in the opening direction. Therefore, the application of the indirect member 19 whose thickness changes as described above can compress the elastic member 18 with a uniform force.

Further, in each of the first embodiment and the second embodiment, the indirect members 19 and 190 have a specific surface of the substrate 20 (a surface facing the facing wall portion 21) and a specific portion of the device housing 170 (facing each other). Although it is fixed to the wall portion 21), the fixing location is not limited. For example, as shown in FIG. 19, in the first embodiment, the indirect member 19 may be fixed to the substrate 20 on the surface on the back side of the surface facing the facing wall portion 21. Further, in the second embodiment, the indirect member 190 may be fixed to the fixed wall portion 22.

Further, in each of the first embodiment and the second embodiment, the indirect members 19 and 190 are configured to be fixed to the substrate 20 and the device housing 170, but may not be fixed. For example, as shown in FIG. 20, in the first embodiment, the indirect member 19 may be configured to engage the substrate 20 from the back surface of the surface facing the facing wall portion 21 from the opening to the back side. Even with the indirect member 19 having such a configuration, the pressing portion 25 can be pressed against the substrate 20 by pressing the end portion on the opening side against the substrate 20 side. Further, for example, as shown in FIG. 21, in the second embodiment, the indirect member 190 may be configured to engage with the fixed wall portion 22 on the back side of the device housing 170 from the opening to the back side. ..

Further, the indirect members 19 and 190 may not be fixed or engaged with the substrate 20 or the device housing 170. For example, as shown in FIG. 22, in the first embodiment, the indirect member 19 may be interposed between the device housing 17 and the elastic member 18. The electronic device 12 having such a configuration can be manufactured by the method described below.

For example, as shown in FIG. 23, the substrate structure 290 without the indirect member in the manufacturing method of the electronic device 120 of the second embodiment is sandwiched between the indirect members 19 from both directions perpendicular to the plate surface of the substrate 20. Next, as shown in FIG. 24, the indirect member 19 is restrained by using a band 30 or the like so that the distance between the two indirect members 19 sandwiching the substrate structure 290 is shorter than the first distance.

Next, as shown in FIG. 25, the substrate structure 290 sandwiched between the indirect members 19 is inserted through the opening of the device housing 17. Further, the band 30 restraining the indirect member 19 is removed. The electronic device 12 shown in FIG. 22 is manufactured by inserting the substrate structure 290 to a predetermined position in the device housing 17 and removing the band 30.

Further, in the first embodiment and the second embodiment, the spacer 23 has a cylindrical shape that can also serve as a guide for the bolt 27, but is not limited to such a shape. For example, as illustrated in FIG. 26, the spacer 23 may have a frame shape surrounding the space sandwiched by the two substrates 20 facing each other. The spacer 23 having such a configuration can improve the thermal conductivity between the substrates 20. Further, the spacer 23 having such a configuration can improve heat dissipation by directly contacting the spacer 23 with the device housing 17. In the configuration in which the frame-shaped spacer 23 as shown in FIG. 26 is applied, the indirect member 19 may be fixed to or integrated with the spacer 23 as shown in FIG. 27.

10 Electronic equipment 11 Mobile 12, 120 Electronic equipment 13 Optical system 14 Image sensor 15 Equipment housing 16 Electronic components 17, 170 Equipment housing (housing)
18 Elastic member 19, 190 Indirect member 20 Board 21 Opposing wall part 22 Fixed wall part 23 Spacer 24 Fixed part 25 Pressing part 26 Connecting part 27 Bolt 28 Nut 29, 290 Board structure 30 Band fp Flat part h1 Engaging part hole h2 Board hole

Claims (8)

With electronic components
It has a set of facing wall portions each having a flat surface portion, and a fixed wall portion having the flat surface portions of the pair of facing wall portions facing each other in parallel at a first interval, and the one set of facing wall portions and the said. The fixed wall portion has an opening formed in one direction perpendicular to the facing direction of the flat surface portion, and a housing for accommodating the electronic component between the flat surface portions facing each other.
An elastic member that is compressed in the facing direction and is located between the electronic component and the flat surface portion in the facing direction.
An indirect member interposed between the housing and the elastic member,
A substrate on which the electronic component is mounted and one end of the indirect member is fixed at the back side from the opening of the electronic component is provided .
In a state where the indirect member and the substrate are located outside the housing, the distance between the substrate and the indirect member in the facing direction is wider on the non-fixed side than on the fixed one end side.
Electronics. With electronic components
It has a set of facing wall portions each having a flat surface portion, and a fixed wall portion having the flat surface portions of the pair of facing wall portions facing each other in parallel at a first interval, and the one set of facing wall portions and the said. The fixed wall portion has an opening formed in one direction perpendicular to the facing direction of the flat surface portion, and a housing for accommodating the electronic component between the flat surface portions facing each other.
An elastic member that is compressed in the facing direction and is located between the electronic component and the flat surface portion in the facing direction.
An indirect member that is interposed between the electronic component and the elastic member and one end of the housing from the opening side to the back side is fixed to the housing.
In a state where the electronic component is not housed in the housing, the distance between the indirect member and the flat surface portion via the elastic member in the facing direction is from the fixed one end side to the non-fixed side. Wider
Electronics. In the electronic device according to claim 1 or 2 .
The elastic member is an electronic device having heat transfer properties. In the electronic device according to any one of claims 1 to 3 .
An electronic device in which the thickness of the indirect member in the facing direction increases from the inside of the housing toward the opening to the opening. In the electronic device according to any one of claims 1 to 4.
The housing is an electronic device having electrical conductivity. In the electronic device according to any one of claims 1 to 5.
The indirect member has a flat plate-shaped pressing portion that covers the elastic member when viewed from the facing direction, and the indirect member makes surface contact with the housing on the back side of the surface that comes into surface contact with the elastic member at the pressing portion.
Electronics. The electronic device according to any one of claims 1 to 6.
An image pickup device including an image pickup device. A mobile body on which at least one of the electronic device according to any one of claims 1 to 6 and the image pickup apparatus according to claim 7 is mounted.

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