JP7053939B1 - How to manufacture soldering equipment and soldered products - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering apparatus capable of miniaturizing an apparatus and a method for manufacturing a soldered product. SOLUTION: The soldering device of the present disclosure is a processing chamber provided with a cooler on the bottom surface thereof, and the cooler protrudes upward from the bottom surface and the upper surface thereof is directly or indirectly to a work to be soldered. A processing chamber provided with a contactable cooling block, a heater installed below the top surface of the cooling block to heat the work, and a work support unit that supports the work conveyed into the processing chamber. The work support unit is located at a heating position for heating the work using the heater and for cooling the work heated at the heating position using the cooler located below the heating position. It includes the work support unit, which is movable between the cooling position and the work support unit. [Selection diagram] Fig. 1

Description

The present disclosure relates to a soldering apparatus and a method for manufacturing a soldered product.

In a soldering device, for example, a reflow soldering device, a processing chamber capable of creating a negative pressure (vacuum) state inside may be used. Then, in the processing chamber of such a soldering device, components such as a heater for heating the work and a cooler for cooling the heated work are arranged, and by operating these components, they are operated. Those that perform melting and solidification of solder on a work are known (see, for example, Patent Document 1 below).

Japanese Patent No. 5864732

In the case where a plurality of components for soldering are arranged in the processing chamber like the soldering device described above, it is necessary to secure a space for arranging each component in the processing chamber. be. In particular, when the components include movable ones, the processing chamber tends to be larger in order to secure the range of motion of the components.

It is an object of the present disclosure to provide a soldering apparatus and a method for manufacturing a soldered product capable of downsizing the apparatus.

In order to achieve the above object, the soldering apparatus according to the first aspect of the present disclosure is a processing chamber provided with a cooler on the bottom surface of the soldering apparatus, and the cooler protrudes upward from the bottom surface and the upper surface thereof is soldered. The processing chamber, which includes a cooling block that can directly or indirectly contact the work to be attached, and a heater installed below the upper surface of the cooling block to heat the work, are conveyed into the processing chamber. A work support unit that supports the work, and the work support unit is located at a heating position for heating the work using the heater and is located below the heating position and uses the cooler to heat the work. It includes the work support unit, which is movable between a cooling position for cooling the work heated at the position.

In such soldering equipment, the cooling block of the cooler is formed on the bottom of the processing chamber and the heater is placed below the top of the cooling block, which makes them look like a single unit. Compared with the case where the processing chamber, the cooler and the heater are independent units, the structure is simplified and the number of parts can be reduced. Further, since the cooler and the heater are fixed to the processing chamber, it is not necessary to secure the range of motion required for operating them in the processing chamber, and the entire device can be miniaturized.

The soldering device according to the second aspect of the present disclosure is the soldering device according to the first aspect of the present disclosure. In the soldering device, the cooler is arranged inside the cooling block and the refrigerant can pass through the inside thereof. Further includes said refrigerant passage, the end of which communicates with the outside of the processing chamber.

In such a soldering device, since the refrigerant passage is provided in the cooling block and the end thereof communicates with the outside of the processing chamber, it is not necessary to arrange the refrigerant passage in the processing space of the processing chamber. Therefore, the sealing process required when the refrigerant passage is arranged in the processing space can be omitted.

The soldering device according to the third aspect of the present disclosure is the soldering device according to the first or second aspect of the present disclosure, wherein the heater is arranged so as to traverse the inside of the processing chamber. It includes an outer tube and an infrared heater inserted into the outer tube from the outside of the processing chamber.

In such a soldering device, since the infrared heater can be inserted from the outside of the processing chamber, the maintainability of the infrared heater is improved.

The soldering device according to the fourth aspect of the present disclosure is the soldering device according to any one of the first to third aspects of the present disclosure, wherein the work support unit is a plate on which the work can be placed. The cooling block is indirectly accessible to the work via the plate, including an elevating pin which is disposed so as to penetrate the bottom surface of the processing chamber and is capable of raising and lowering the plate.

In such a soldering device, the work can be moved with a simple configuration. Further, by using a plate, it is possible to realize soldering of workpieces having various shapes and sizes.

The soldering device according to the fifth aspect of the present disclosure further includes a work fixing jig attached to the work in the soldering device according to any one of the first to fourth aspects of the present disclosure, and the cooling. The block can indirectly contact the work via the work fixing jig.

In such a soldering device, it is possible to realize soldering of workpieces of various shapes and sizes by using a workpiece fixing jig.

The soldering device according to the sixth aspect of the present disclosure is the soldering device according to any one of the first to fifth aspects of the present disclosure, wherein the processing chamber is provided with the cooler on the bottom surface and the upper portion thereof. It includes an open processing chamber body, a lid capable of airtightly closing the opening, and a discharge mechanism for discharging fluid inside the processing chamber to the outside of the processing chamber.

In such a soldering device, the inside of the processing chamber can be made airtight with a simple configuration. In addition, the inside of the processing chamber can be evacuated by operating the discharge mechanism.

The soldering device according to the seventh aspect of the present disclosure is the soldering device according to any one of the first to sixth aspects of the present disclosure, wherein the cooling block is combed so as to cross the processing chamber. The heater is arranged in a shape between the adjacent cooling blocks.

In such a soldering device, the cooling block and the heater can be evenly arranged on the bottom surface of the processing chamber, and the work can be reliably heated and cooled regardless of its shape.

The soldering device according to the eighth aspect of the present disclosure is a processing chamber provided with a cooler on the bottom surface thereof, and the cooler protrudes upward from the bottom surface and the upper surface thereof is directly or indirectly to the work to be soldered. A cooling block that can be brought into contact with each other, and a refrigerant passage that is arranged inside the cooling block and allows a refrigerant to pass through the inside thereof, the end of which communicates with the outside of the processing chamber. It includes the processing chamber, a heater for heating the work, and a work support unit for supporting the work to be conveyed into the processing chamber.

In such a soldering device, since the refrigerant passage is provided in the cooling block and the end thereof communicates with the outside of the processing chamber, it is not necessary to arrange the refrigerant passage in the processing space of the processing chamber. Therefore, the sealing process required when the refrigerant passage is arranged in the processing space can be omitted. Further, since the cooler is fixed to the processing chamber, it is not necessary to secure the range of motion required for operating the cooler in the processing chamber, and the entire device can be miniaturized.

The method for manufacturing a soldered product according to a ninth aspect of the present disclosure is a step of supporting a work to be soldered on a work support unit in a processing chamber of a soldering apparatus according to any one of the first to eighth aspects. This includes a step of heating the work using a heater and a step of cooling the heated work using a cooler.

In such a method for manufacturing a soldered product, the work can be soldered without using a large soldering device.

The method for manufacturing a soldered product according to a tenth aspect of the present disclosure is a step of supporting a work to be soldered on a work support unit in a processing chamber, and the processing chamber is provided with a cooler on the bottom surface thereof. The cooler comprises a cooling block that projects upward from the bottom surface and has a direct or indirect contact with the work to which the upper surface is soldered, and the work is supported in a heating position by the work support unit. In this state, a step of heating the work using a heater installed below the upper surface of the cooling block and a step of moving the work heated by the work support unit to a cooling position lower than the heating position. And the step of cooling the heated work supported in the cooling position by using the cooler.

In such a method for manufacturing a soldered product, the work can be soldered without using a large soldering device.

According to the method for manufacturing a soldering device and a soldered product of the present disclosure, it is possible to miniaturize the device and to manufacture a soldered product using a small soldering device.

It is a schematic explanatory drawing which shows an example of the soldering apparatus which concerns on 1st Embodiment of this disclosure. It is a schematic plan view which shows the internal structure of the soldering apparatus shown in FIG. It is an enlarged arrow view of the part A of FIG. It is a schematic explanatory drawing which shows the state which various workpieces were placed on the soldering apparatus of FIG. It is a flowchart which shows an example of the manufacturing method of the soldering product which concerns on 1st Embodiment of this disclosure. It is an operation explanatory view which shows the state of the soldering apparatus when the manufacturing method of the soldering product shown in FIG. 5 is executed. It is a schematic explanatory drawing which shows an example of the soldering apparatus which concerns on the 2nd Embodiment of this disclosure.

Hereinafter, embodiments for carrying out the present disclosure will be described with reference to the drawings. In the following, the scope necessary for the explanation to achieve the object of the present disclosure will be schematically shown, and the scope necessary for the explanation of the relevant part of the present disclosure will be mainly explained. It shall be based on known technology. Further, in the drawings, members that are the same as or correspond to each other are designated by the same or similar reference numerals, and duplicate description will be omitted.

<First Embodiment>
FIG. 1 is a schematic explanatory view showing an example of a soldering apparatus according to the first embodiment of the present disclosure. As the soldering device 1 according to the first embodiment, as shown in FIG. 1, a soldering device 1 that functions as a reflow furnace can be adopted. In this soldering device 1, it is possible to solder a work W, for example, a substantially disk-shaped semiconductor substrate on which electronic components are mounted. In the soldering here, at least the solder bumps are formed on the semiconductor substrate as the work W, which melts the raw material solder arranged in advance to form the hemispherical solder bumps on the semiconductor substrate as the work W. It may include mounting electronic components that are produced or disposed via cream solder or preform solder. In the following description, in order to facilitate the understanding, the width direction in FIG. 1 is tentatively defined as the X direction, the depth direction is tentatively defined as the Y direction, and the height (vertical) direction is tentatively defined as the Z direction, and they are used as appropriate. do.

FIG. 2 is a schematic plan view showing the internal structure of the soldering apparatus shown in FIG. As shown in FIGS. 1 and 2, the soldering apparatus 1 according to the present embodiment has a processing chamber 10 in which a processing space PS is formed therein, and a work W housed in the processing space PS of the processing chamber 10. It includes at least a heater 30 for heating the work W and a work support unit 40 for supporting the work W in the processing space PS of the processing chamber 10. Further, the operation of each of the above-mentioned components may be controlled by the control device 2. In FIG. 2, in order to make it easier to understand the configuration in the processing space PS, the lid 14 and the plate 41 are omitted from each component of the soldering apparatus 1 described later, and the soldering apparatus 1 is placed on the plate 41. The work W is shown by a broken line.

The processing chamber 10 can be configured with a box-shaped housing that defines the processing space PS. The processing chamber 10 includes a rectangular bottom wall 12 and a side wall 13 that stands upward from the edge of the bottom wall 12, and has a processing chamber main body 11 having an open upper portion thereof and an opening of the processing chamber main body 11. It may include at least a lid 14 that can be airtightly closed. The loading / unloading of the work W into / from the processing space PS in the processing chamber 10 may be performed via the opening of the processing chamber main body 11.

The bottom wall 12 constituting the bottom surface of the processing chamber main body 11 includes a cooler 20 for cooling the work W. The cooler 20 is provided so as to project upward from the upper surface of the bottom wall 12, and includes at least a cooling block 21 in which the upper surface 21A can function as a cooling surface for cooling the work W. The bottom wall 12 of the processing chamber 10 including the cooler 20 may be formed in a machined structure together with the side wall 13. By adopting such a configuration, the soldering device 1 according to the present embodiment can be made smaller than the case where the bottom wall 12 and the cooler 20 are configured as separate units. become.

As shown in FIG. 2, the cooling block 21 may be arranged so that a plurality of block bodies extending in the Y direction are lined up along the X direction. In other words, the cooling block 21 may be arranged in a comb-teeth shape along the X direction. Further, inside the cooling block 21, a refrigerant passage 22 for passing the refrigerant can be arranged. The upper surface 21A of the cooling block 21 is formed substantially flat, and the upper surface 21A directly or indirectly contacts the work W to enable cooling of the work W. The cooling block 21 may be integrally formed with the bottom wall 12. Thus, it can be said that the bottom wall 12 of the processing chamber 10 functions as a cooler 20, or that the cooler 20 forms the bottom wall 12 of the processing chamber 10. The cooling block 21 can be made of a material having high thermal conductivity, for example, copper (Cu) or a copper alloy. In the present embodiment, the cooling block 21 is arranged in a comb-teeth shape as an example, but the layout of the cooling block and the like are not limited to this.

The refrigerant passage 22 may be a passage for cooling the cooling block 21 by passing a refrigerant, for example, cooling water, through the inside thereof. The wiring structure in the cooling block 21 of the refrigerant passage 22 can be formed so as to pass through all the positions close to the upper surface 21A of the comb-shaped cooling block 21, for example. The refrigerant passage 22 may have one or a plurality of refrigerant supply ports 22A and a plurality of refrigerant discharge ports 22B formed at least at the ends thereof. The refrigerant supply port 22A may be fluidly connected to a refrigerant supply source (not shown), and the refrigerant discharge port 22B may be fluidly connected to a refrigerant recovery means (also not shown). Further, by forming the above-mentioned refrigerant supply source and the refrigerant recovery means with a common member, the refrigerant passage 22 can be configured as a flow path through which the refrigerant circulates. The supply of the refrigerant into the refrigerant passage 22 can be controlled by opening and closing the refrigerant supply valve 23 and the refrigerant discharge valve 24 connected to the refrigerant supply port 22A and the refrigerant discharge port 22B, respectively. The refrigerant passing through the cooling passage 22 is not limited to the above-mentioned cooling water, and other fluids (for example, ethylene glycol) may be used alone or in combination. Further, if hot water of, for example, about 80 ° C. is passed through the cooling passage 22, it can function as an auxiliary heating (or heat retaining) means in the processing chamber 10 in the heating step of the work W described later.

Here, as shown in FIG. 1, it is preferable that both ends of the refrigerant passage 22 according to the present embodiment communicate with the outside of the processing chamber 10. With such a configuration, various members for supplying the refrigerant into the refrigerant passage 22 can be arranged outside the processing chamber 10, so that maintenance and the like of the members can be easily performed. Further, in general, in a soldering apparatus that performs reflow soldering, the inside of the processing space may be in a negative pressure state during the processing process. Also in the soldering device 1 according to the present embodiment, since the fluid discharge mechanism 18 described later operates to put the inside of the processing space PS in a negative pressure state, various members arranged in the processing space PS are used. Sealing processing (sealing processing) is performed so that the airtight state of the processing space PS can be maintained. Since the (vacuum) sealing process is generally a process with a relatively high technical difficulty, it is better to have as few places as possible for this sealing process, which saves time and labor required for equipment manufacturing and maintenance work. It can be suppressed. In this respect, if the refrigerant passage 22 is not arranged in the processing space PS as described above, the above-mentioned sealing process is not required over the entire length of the refrigerant passage 22.

The side wall 13 of the processing chamber body 11 may be formed so as to surround the periphery of the processing space PS, and the upper end thereof may be formed by a substantially flat surface on which the lower surface of the lid 14 can be contacted. .. Further, a seal ring 13S may be disposed on the upper end surface of the side wall 13 so as to airtightly seal between the side wall 13 and the lid 14 by coming into contact with the lid 14.

The lid 14 may be a member for opening and closing the opening of the processing chamber main body 11 that functions as a carry-in / out port of the work W. The lid 14 may be openable and closable by a support mechanism (not shown), such as a hinge mechanism, and the lid 14 has a well-known lock for maintaining the closed state of the opening of the processing chamber body 11. A mechanism (not shown) may be provided. Further, a window 14W for visually recognizing the inside of the processing space PS may be provided at an arbitrary position, for example, a substantially central position of the lid 14, and the window 14W may be provided with a translucent material such as quartz. Glass may be fitted. In the present embodiment, the soldering device 1 that enables loading and unloading of the work W by opening the lid 14 is illustrated, but a specific configuration for loading and unloading the work W and the like are illustrated. Is not limited to this.

In the case of reflow soldering using the soldering apparatus 1 according to the present embodiment, an operation of supplying a predetermined fluid to the inside of the processing space PS and discharging the fluid in the processing space PS will be exemplified. Therefore, the soldering device 1 of the present disclosure includes a fluid supply port 15 provided in a part of the lid 14 and capable of supplying fluid into the processing space PS, and a processing space PS provided in a part of the processing chamber main body 11. It may include a fluid discharge port 17 capable of discharging the fluid inside to the outside of the processing chamber 10. In this regard, the processing chamber 10 may be a vacuum chamber. The arrangement of the fluid supply port 15 and the fluid discharge port 17 described above can be appropriately changed.

A fluid supply mechanism 16 may be connected to the fluid supply port 15. The fluid supply mechanism 16 includes a fluid supply pipe 16A connected to the fluid supply port 15 and a fluid supply valve 16B provided in the fluid supply pipe 16A to control the supply of an arbitrary fluid into the processing space PS. You can go out. The fluid supplied by the fluid supply mechanism 16 can be appropriately selected according to the content of the soldering process, such as a processing gas or an inert gas. In the soldering apparatus 1 according to the present embodiment, a device that supplies a reducing gas for removing an oxide film formed on the surface of the solder as a processing gas during the soldering process is exemplified. As this reducing gas, hydrogen gas, carboxylic acid gas, or the like can be used, but in the present embodiment, formic acid gas is used as an example. In relation to this, flux-free solder can be used for the work W soldered by the soldering apparatus 1 according to the present embodiment. The fluid supply mechanism 16 according to the present embodiment employs a fluid supply mechanism 16 capable of supplying the formic acid gas described above and nitrogen gas as an inert gas.

A fluid discharge mechanism 18 may be connected to the fluid discharge port 17. The fluid discharge mechanism 18 includes a fluid discharge pipe 18A connected to the fluid discharge port 17, a fluid discharge valve 18B provided in the fluid discharge pipe 18A for discharging the fluid in the processing space PS to the outside of the processing chamber 10. It may include a fluid discharge pump 18C. The fluid discharge valve 18B can be composed of a vacuum valve capable of sealing or vacuum breaking the inside of the processing chamber 10. Further, the fluid discharge pump 18C can be configured by a vacuum pump capable of evacuating the inside of the processing chamber 10 so that the pressure is below atmospheric pressure (for example, about 50 to 1000 mTorr).

The heater 30 is for heating the work W in the processing space PS. The heater 30 according to the present embodiment can include an infrared heater 31 as a heat source and a substantially cylindrical outer tube 32 surrounding the infrared heater 31. Of these, the infrared heater 31 can be, for example, a plurality of infrared (InfraRed, IR) lamps (12 in FIGS. 1 and 2) formed in a rod shape. The specific shape of the infrared heater 31 is not limited to this.

The outer tube 32 can be a plurality of cylindrical tubes in which at least a part thereof is made of a translucent material, for example, quartz glass, and an infrared heater 31 can be arranged inside. As shown in FIGS. 1 and 2, the outer pipe 32 may be arranged so as to cross between the facing side walls 13 of the processing chamber 10. Then, at least one end thereof may communicate with the outside of the processing chamber 10. In this regard, the infrared heater 31 can be disposed by inserting it into the outer tube 32 from the end communicating with the outside of the processing chamber 10 of the outer tube 32. As described above, the infrared heater 31 can be easily replaced by making the structure so that the infrared heater 31 can be inserted from the outside of the processing chamber 10. In the present embodiment, the heater 30 including the outer tube 32 is adopted, but the heater according to the present disclosure is not limited to such a structure and is appropriately changed according to the shape of the cooling block and the like. can do.

FIG. 3 is an enlarged arrow view of part A of FIG. The outer pipe 32 can be arranged along the extending direction of the cooling blocks 21 in the gaps between the adjacent cooling blocks 21 arranged in a comb-teeth shape. At this time, the height position of the outer pipe 32 is installed below the cooling block 21 as shown in FIG. Specifically, the height position of the upper end of the outer pipe 32 is set to be slightly lower than the height position of the upper surface 21A of the cooling block 21. The height difference ΔH between the upper end of the outer pipe 32 and the upper surface 21A of the cooling block 21 may be, for example, about several millimeters. As a result, when the cooling block 21 and the work W are brought into direct or indirect contact with each other, the heater 30 does not interfere with the contact.

In addition, in the outer pipe 32 arranged in the gap between the adjacent cooling blocks 21, only the upper surface thereof is exposed in the processing space PS, and the surrounding surfaces other than the upper surface of the outer pipe 32 are the cooling blocks. It abuts on 21 or the bottom wall 12 or faces it with a slight gap. Therefore, the upper surface of the outer tube 32 can function as an irradiation window 33 that transmits the infrared light IL emitted from the infrared heater 31 inserted in the outer tube 32. In this regard, the infrared heater 31 inserted into the outer tube 32 may be attached so that its irradiation surface faces the irradiation window 33. The infrared light IL emitted from the infrared heater 31 may include those in the near infrared wavelength region (0.75 to 4 μm) and those in the far infrared wavelength region (4 to 1000 μm). A structure (insulation structure) for blocking heat from the infrared heater 31 is provided on the peripheral surface of the outer tube 32 excluding the irradiation window 33, or the surface of the cooling block 21 or the bottom wall 12 facing the peripheral surface. It is preferable to adopt it. Specifically, the irradiation window 33 of the outer tube 32 is mirror-finished on the inside of the surrounding surface of the outer tube 32 excluding the irradiation window 33, or on the surface of the cooling block 21 or the bottom wall 12 facing the surrounding surface. A heat insulating material can be arranged between the peripheral surface excluding the above surface and the surface of the cooling block 21 or the bottom wall 12 facing the peripheral surface, or both can be implemented. The mirror surface processing can be realized by subjecting the corresponding surface to a plating process using a metal such as chromium (Cr) or zirconium (Zr). By adopting the above-mentioned mirror surface processing, the heat radiant energy from the infrared heater 31 can be efficiently transmitted to the work W during heating, and the heating of the cooling block 21 can be suppressed, so that the work W can be cooled. It is also possible to reduce the time required for.

As shown in FIG. 3, the infrared light IL emitted from the infrared heater 31 can be radially emitted upward from the irradiation window 33 at a predetermined irradiation angle θ, and can be directly or indirectly irradiated to the work W. The irradiation angle θ at this time can be appropriately adjusted, but may be, for example, an angle range of 80 to 100 ° about a line extending in the Z direction from the infrared heater 31. In this regard, it is preferable that both ends of the upper surface 21A of the cooling block 21 in the X direction are chamfered 21C so as not to overlap with the irradiation path of the infrared light IL. Preventing the infrared light IL from irradiating the cooling block 21 in this way can suppress the heating of the cooling block 21 and shorten the time required for cooling the work W, as in the heat insulating structure described above.

The work support unit 40 may support the work W carried into the processing space PS and may be able to adjust the position of the supported work W. The work support unit 40 includes a plate 41 on which the work W carried into the processing space PS can be placed, one or more (four in FIG. 2) elevating pins 42 for supporting the plate 41, and an elevating pin 42. It can include an elevator 43 which is connected to the pin 42 and raises and lowers the elevating pin 42 in the vertical direction.

The plate 41 can be made of a plate-like body having high thermal conductivity, for example, a metal plate containing copper or a copper alloy, and can function as a table on which the work W can be placed. The lower surface of the plate 41 is an irradiation surface to which the infrared light IL from the infrared heater 31 is irradiated, and a contact surface to which the upper surface 21A of the cooling block 21 contacts. Therefore, the work W placed on the plate 41 is indirectly heated and cooled with the plate 41 interposed between the heater 30 and the cooler 20.

The elevating pin 42 may be a rod-shaped member arranged so as to penetrate the bottom wall 12 of the processing chamber main body 11 through the elevating pin insertion hole 12H provided in the bottom wall 12. The elevating pin 42 may be capable of moving the plate 41 in the vertical direction by having one end of the elevating pin 42 abutting against or attached to the lower surface of the plate 41 and the other end of the elevating pin 42 being connected to the elevator 43. .. In the present embodiment, four elevating pin insertion holes 12H are provided near each corner of the bottom wall 12 of the processing chamber main body 11, and one elevating pin 42 is provided in each of the four elevating pin insertion holes 12H. Is illustrated. The number of the elevating pins 42 may be one or a plurality, and the arrangement thereof can be appropriately adjusted according to the number of the elevating pins 42, the presence or absence of the plate 41, and the like. Further, the elevating pin insertion hole 12H may include a vacuum sealing structure (not shown).

The elevator 43 may be a device capable of adjusting the position of the work W by operating the elevator pin 42 in the vertical direction. Although the detailed configuration of the elevator 43 is not shown, typically an electric actuator such as a piston / cylinder mechanism, a ball screw mechanism, a linear motor, or a solenoid actuator using a fluid (water, oil, air, etc.) is used. The linear motion mechanism used can be adopted. In the elevator 43 according to the present embodiment, the operating portion thereof and a plurality of elevator pins 42 may be connected by a connecting arm 44. By operating the elevator 43, the work support unit 40 has at least a heating position HP (see FIG. 6) for heating the work W placed on the plate 41 by the heater 30 and a cooler 20. It can be moved from the cooling position CP (see FIG. 6) for cooling. The cooling position CP is located below the heating position HP.

FIG. 4 is a schematic explanatory view showing a state in which various workpieces are placed on the soldering apparatus of FIG. 1. In FIG. 4, the same reference numerals are given to the configurations similar to those shown in FIG. 1. The work support unit 40 according to the present embodiment illustrates that the work W is placed on the plate 41, but the present disclosure is not limited to this. Specifically, for example, as one modification, as shown in FIG. 4A, the work W1 to which the first work fixing jig 50 is attached to the edge thereof is placed on the elevating pin 42. It can also be a soldering device 1A. In this case, the lower surface of the work W1 is the irradiation surface on which the infrared light IL of the infrared heater 31 is directly irradiated and the contact surface on which the upper surface 21A of the cooling block 21 is in direct contact.

Further, as another modification, as shown in FIG. 4B, a second work fixing jig 60 including a work fixing lower jig 61 and a work fixing upper jig 62 is attached around the work fixing lower jig 61. The work W2 may be a soldering device 1B such that the extending portion 63 extending in the substantially horizontal direction provided in the work fixing lower jig 61 is supported by the elevating pin 42. In this case, the lower surface of the work fixing jig 61 is the irradiation surface on which the infrared light IL of the infrared heater 31 is directly irradiated, and the contact surface on which the upper surface 21A of the cooling block 21 is in direct contact. The above-mentioned second work fixing jig 60 includes a jig 60 that functions as a carrier for transporting the work W2. As described above, by using jigs such as the first and second work fixing jigs 50 and 60, the size and shape of the work that can be soldered by the soldering apparatus of the present disclosure can be freely adjusted. The degree can be higher.

In addition, in order to enable soldering of a work having a relatively large height, such as the work W2 to which the second work fixing jig 60 is attached, soldering according to the other modification is performed. The device 1B may be provided with an expansion member 14A between the opening of the processing chamber main body 11 and the lid 14. The expansion member 14A is a frame-shaped member along the upper end surface of the side wall 13, and may be made of the same material as the processing chamber 10. By adopting such an expansion member 14A, the size of the processing space PS can be easily changed, so that the work that can be soldered by the soldering apparatus according to the present embodiment can be soldered. The degree of freedom in the size and shape of the soldering can be further increased.

The operation of the various components of the soldering device 1 described above is controlled by the control device 2 electrically connected to them via wireless or wired communication (schematically shown by a dotted line in FIG. 1 and the like). It may be something. The control device 2 can be configured by, for example, a computer including a sequencer (Programmable Logical Controller, PLC). The computer may include at least a volatile or non-volatile memory (for example, RAM (Random Access Memory) or HDD (Hard Disk Drive)) and a processor typified by a CPU (Central Processing Unit).

According to the soldering apparatus 1 having the above-described configuration, the cooling block 21 of the cooler 20 is formed on the bottom wall 12 of the processing chamber 10, and the heater 30 is installed below the upper surface 21A of the cooling block 21. The structure is simpler than when the chamber 10, the cooler 20 and the heater 30 are formed as independent units. As a result, the number of parts of the soldering apparatus 1 can be reduced. Further, since the structure inside the processing chamber 10 is simple, dirt (for example, volatile substances and flux from the work) adhering to the inner surface of the processing chamber 10 can be cleaned in a short time.

Further, according to the soldering apparatus 1 according to the present embodiment, since the cooler 20 and the heater 30 are not movable but are fixed to the processing chamber 10, the range of motion required for operating them is processed. It is not necessary to secure it in the chamber, and the entire device can be miniaturized. In relation to this, when the soldering process is executed using the soldering device 1, the work W is heated by slightly changing the position of the work W by the work support unit 40 (for example, about 1 to 10 mm). And cooling can be performed, and each process for soldering can proceed smoothly. In addition, since the cooler 20 and the heater 30 are not movable, it is not necessary to arrange wirings, pipelines, etc. of these members in the processing space PS, and the cooler 20 or the heater 30 is movable. Compared to the case, there are fewer places that require sealing. As a result, the difficulty of assembling and maintaining the processing chamber can be reduced, and the man-hours required for these operations can be significantly reduced.

Next, an example of a method for manufacturing a soldered product according to the present embodiment will be briefly described. In the following description, a soldering product is referred to as a work W, and a device that performs reflow soldering using the above-mentioned soldering apparatus 1 will be exemplified. Further, a series of manufacturing methods described later can be controlled by the control device 2 of the soldering device 1.

FIG. 5 is a flowchart showing an example of a method for manufacturing a soldered product according to the first embodiment of the present disclosure. Further, FIG. 6 is an operation explanatory diagram showing a state of the soldering apparatus when the method for manufacturing the soldered product shown in FIG. 5 is executed. Note that FIG. 6 is shown as an enlarged cross-sectional view of only a part of the soldering apparatus 1 for the sake of simplicity. The method for manufacturing a soldered product according to the present embodiment can include each step shown in FIG. Specifically, first, as shown in FIG. 6A, the lid 14 of the processing chamber 10 is opened, and the work W to be soldered into the processing space PS is carried in from the opening of the processing chamber main body 11 and the work. The work W is supported on the work support unit 40 by placing it on the plate 41 of the support unit 40 (step S11). At this time, the height of the plate 41 of the work support unit 40 may be set to, for example, the delivery position DP set near the opening of the chamber main body 11 (see FIG. 6A). However, the delivery position DP is not limited to this, and may be, for example, a height position similar to the heating position HP described later.

When the work W is placed on the plate 41, the work support unit 40 is then operated to move the work W to the heating position HP set below the delivery position DP (step S12). After this movement or in parallel with this movement, the lid 14 is closed to make the inside of the processing chamber 10 airtight. Further, after the inside of the processing chamber 10 is made airtight, the fluid supply mechanism 16 is operated to supply nitrogen gas into the processing space PS, and the fluid discharge mechanism 18 is operated to suck oxygen in the processing space PS. It is good to discharge it.

When the work W is supported by the heating position HP by the operation of the work support unit 40 (see FIG. 6B), the plurality of infrared heaters 31 of the heater 30 are operated to start irradiation with infrared light IL. , The work W placed on the plate 41 is heated to a solder melting temperature (for example, 220 to 400 ° C., depending on the type of solder) (step S13). Before heating the work W to the above-mentioned solder melting temperature, the work W is heated to a reduction temperature lower than the solder melting temperature (for example, 180 to 260 ° C.), and the fluid supply mechanism 16 is operated to operate the processing space. It is advisable to carry out a step of reducing and removing the oxide film on the solder surface by supplying formic acid gas into the PS.

The work W heated to the solder melting temperature in the heating step S13 is then moved to the cooling position CP set below the heating position HP by operating the work support unit 40 (step S14). In the cooling position CP, as shown in FIG. 6C, the lower surface of the plate 41 contacts the upper surface 21A of the cooling block 21. When the movement to the cooling position CP is completed, the control device 2 operates the cooler 20, specifically, the work W placed on the plate 41 by continuously passing the refrigerant into the refrigerant passage 22. Is cooled to the solder solidification temperature (for example, 300 ° C. or lower) (step S15). When supplying the refrigerant into the refrigerant passage 22, the refrigerant supply valve 23 and the refrigerant discharge valve 24 may be opened to circulate the refrigerant along the flow F of the refrigerant shown in FIG. 5 (C). In the cooling step S15 described above, the cooling by the cooler 20 is performed to the solder solidification temperature or lower, but the cooling may be performed to a lower temperature, for example, to the vicinity of the ambient temperature outside the processing chamber 10.

The work W in which the solder melted by being cooled to the solder solidification temperature is solidified is then carried out of the processing chamber 10 (step S16) and transported to another processing apparatus such as a secondary cooling apparatus. Will be done. When the work W is carried out of the processing chamber 10, the work support unit 40 is operated after the lid 14 is opened or in parallel with the opening of the lid 14, and the work W is delivered to the delivery position DP. It is good to let it.

As described above, according to the method for manufacturing a soldered product according to the present embodiment, when reflow soldering a work W such as a semiconductor substrate, the work support unit 40 that supports the work W is slightly downward. The position can be changed from the heating position to the cooling position just by operating it. This makes it possible to smoothly change from the process of heating the work to the process of cooling the heated work in a short time. Further, since a series of steps can be carried out without moving the cooler and the heater, it is not necessary to prepare a large-sized soldering device for soldering the work.

<Second embodiment>
In the soldering apparatus 1 according to the first embodiment described above, the heater 30 is mainly installed below the upper surface 21A of the cooling block 21, and the work W is heated by using the heater 30. An example is shown in which the soldering device 1 is downsized by arranging a cooling position CP for cooling the work W using a cooler 20 below the position HP. However, the soldering apparatus of the present disclosure is not limited to the one that realizes miniaturization of the soldering apparatus by the above-mentioned configuration. Therefore, as the second embodiment of the present disclosure, an example in which the soldering apparatus is downsized based on a configuration different from the above-described configuration will be exemplified below. The soldering device 100 according to the present embodiment is an example of a device for reflow soldering a work W made of a semiconductor substrate or the like, similarly to the soldering device 1 according to the first embodiment described above. Shown. Therefore, among the soldering devices 100 according to the present embodiment, the same components as those of the soldering device 1 according to the first embodiment described above are designated by the same reference numerals and the description thereof will be omitted, and soldering will be omitted. The description will be focused on the components different from those of the device 1.

FIG. 7 is a schematic explanatory view showing an example of the soldering apparatus according to the second embodiment of the present disclosure. It can be said that FIG. 7 is drawn so as to correspond to FIG. As shown in FIG. 7, the soldering apparatus 100 according to the present embodiment heats the processing chamber 110 in which the processing space PS is formed and the work W housed in the processing space PS of the processing chamber 110. It includes at least a heater 130 and a work support unit 140 that supports the work W in the processing space PS of the processing chamber 10.

The processing chamber 110 can be configured with a box-shaped housing that defines the processing space PS. The processing chamber 110 may include at least a rectangular bottom wall 112 and an upper wall 114, and a side wall 113 extending in the Z direction so as to connect the edges of the bottom wall 112 and the upper wall 114. Further, a part of the side wall 113 may be provided with one or more (two in FIG. 7) gates 119 for carrying in / out the work W to / from the processing space PS in the processing chamber 110. In this regard, the soldering apparatus 100 according to the present embodiment is manufactured by connecting a plurality of chambers that perform different processes on a line (this may be referred to as an "in-line type"). It may be possible to form a part of a system, for example, a manufacturing system for mounting various electronic components on a semiconductor substrate. The processing chamber 110 of the soldering apparatus 100 according to the present embodiment is not limited to the above configuration, and is, for example, the same as the processing chamber 10 of the soldering apparatus 1 according to the first embodiment described above. The configuration of the work W, specifically, the configuration in which the work W is carried in and out by opening and closing the lid 14 can be adopted. Similarly, the soldering apparatus 1 according to the first embodiment can adopt the same structure as the processing chamber 110 described above.

The bottom wall 112 of the processing chamber 110 includes a cooler 120 for cooling the work W. The cooler 120 is provided so as to project upward from the upper surface of the bottom wall 112, and includes at least a cooling block 121 whose upper surface 121A serves as a cooling surface for cooling the work W. The cooling block 121 may be provided integrally with the bottom wall 112 so as to cover the entire upper surface of the bottom wall 112 except for the portion where the fluid discharge port 17 is provided, for example. The upper surface 121A of the cooling block 121 may be formed substantially flat, and the upper surface 121A may be in direct or indirect contact with the work W to cool the work W. Further, inside the cooling block 121, a refrigerant passage 122 for passing the refrigerant is arranged. In addition, as the material, forming method, and the like of the cooling block 121, the same materials as those of the cooling block 21 of the second embodiment described above can be adopted. Further, the specific shape of the cooling block 121 can be appropriately changed according to the arrangement and shape of the heater 130 described later, the shape of the work W, and the like. Then, the routing structure of the refrigerant passage 122, which will be described later, can be appropriately changed according to the shape of the cooling block 121.

The refrigerant passage 122 may be a passage for cooling the cooling block 121 by passing a refrigerant, for example, cooling water, through the inside thereof. The refrigerant passage 122 is arranged so as to pass through a position close to the upper surface 121A in the cooling block 121, and the refrigerant passes through the refrigerant passage 122 to cool the surrounding cooling block 121. Can work. The wiring structure in the cooling block 121 of the refrigerant passage 122 can be appropriately adjusted as long as the entire upper surface 121A of the cooling block 121 can be cooled, but for example, the position close to the upper surface 121A meanders at a predetermined interval. It can be formed as such or in a grid pattern along the upper surface 121A.

Further, the end portion of the refrigerant passage 122 communicates with the outside of the processing chamber 110. Specifically, the refrigerant passage 122 is formed with one or a plurality of refrigerant supply ports 122A and refrigerant discharge ports 122B at least at its ends, and the refrigerant supply ports 122A and the refrigerant discharge ports 122B are arranged outside the processing chamber 110. By doing so, the refrigerant passage 122 can be communicated to the outside of the processing chamber 110. The refrigerant supply port 122A may be fluidly connected to a refrigerant supply source (not shown), and the refrigerant discharge port 122B may be fluidly connected to a refrigerant recovery means (also not shown). Further, by forming the above-mentioned refrigerant supply source and the refrigerant recovery means with a common member, the refrigerant passage 122 can be configured as a flow path through which the refrigerant circulates. The supply of the refrigerant into the refrigerant passage 122 can be controlled by opening and closing the refrigerant supply valve 123 and the refrigerant discharge valve 124 connected to the refrigerant supply port 122A and the refrigerant discharge port 122B, respectively.

With the above configuration, the refrigerant passage 122 is wired inside the cooling block 121, inside the bottom wall 112, or outside the processing chamber 110. In other words, the refrigerant passage 122 has no portion disposed in the processing space PS over its entire length. Therefore, in the soldering apparatus 100 according to the present embodiment, the sealing work associated with the arrangement of the refrigerant passage 122 in the processing space PS becomes unnecessary, and the time required for the apparatus manufacturing and maintenance work becomes unnecessary. And labor can be reduced. Further, since various members for supplying the refrigerant in the refrigerant passage 122, such as the refrigerant supply valve 123 and the refrigerant discharge valve 124, can be arranged outside the processing chamber 110, maintenance of the members can be easily performed. You will be able to do it.

The heater 130 is for heating the work W in the processing space PS. The heater 130 included in the soldering apparatus 100 according to the present embodiment is not particularly limited in terms of its arrangement and structure, and can be appropriately selected. FIG. 7 illustrates a heater 130 that is arranged above the work W and supplies hot air mainly to the upper surface of the work W. Specifically, the heater 130 may include a blower 131, a heater 132, and a straightening vane 133.

The blower 131 may be a member for circulating the air in the processing space PS and sending it to the work W. The blower 131 can be composed of an electric motor attached to the upper wall 114 of the processing chamber 110 and fins attached to the drive shaft of the electric motor. As the blower 131, for example, a sirocco fan or a propeller fan can be adopted. Further, the heating heater 132 may be one that is arranged in the processing space and heats the gas in the processing space PS sent by the blower 131. As the heater 132, for example, a sheathed heater or the like can be adopted. Further, the straightening vane 133 may be arranged in the information of the work W and control the flow so that the hot air sent by the blower 131 and heated by the heating heater 132 is blown to the work W. The heater 130 of the soldering apparatus 100 according to the present embodiment is not limited to the above configuration, and the number of heaters is not limited to one. Therefore, in addition to the above-described configuration, the heater 130 may further include, for example, a heater 30 including an infrared heater 31 included in the soldering device 1 according to the first embodiment, or another configuration. A heating means comprising the above may be provided below or to the side of the work W alone or in combination with the above-mentioned one. Further, the heater 130 can be formed so as to be movable in the processing space PS.

The work support unit 140 supports the work W carried into the processing space PS. Further, the work support unit 140 can adjust the position of the supported work W. FIG. 7 illustrates the same configuration as the work support unit 40 of the soldering device 1 according to the first embodiment described above as the work support unit 140. However, the soldering apparatus 100 according to the present embodiment does not necessarily have to have a movable structure as the work support unit 140, and it is sufficient if the work W can be supported in the processing space PS. Therefore, for example, the work support unit 140 may be configured by the upper surface 121A of the cooling block 121. In this case, the heating and cooling of the work W will be carried out in a state of being supported by the upper surface 121A of the cooling block 121.

Also in the soldering device 100 according to the present embodiment, the deformation shown in the soldering device 1 according to the first embodiment described above, for example, the shape of the work W supported by the work support unit 140 and the work support accompanying the deformation. Those skilled in the art can clearly understand that the modification of the components of the unit 140, the adoption of the size adjustment structure of the processing chamber 110 such as the expansion member 14A described above, and the like are similarly applicable. Let's do it.

According to the soldering apparatus 100 having the above-described configuration, since the cooler 120 is fixed, it is not necessary to secure the range of motion required for operating the cooler 120 in the processing chamber 110, and the entire apparatus is downsized. can do. Further, since the refrigerant passage 122 is not wired in the processing space PS, it is possible to reduce the number of parts that require sealing processing, and it is possible to have a simple structure that is easy to manufacture and maintain.

Next, a method for manufacturing the soldered product according to the present embodiment will be briefly described. Although the apparatus used for manufacturing the soldered product according to the present embodiment is different, the series of steps is similar to the method for manufacturing the soldered product according to the first embodiment described above. Therefore, when explaining the method for manufacturing the soldered product according to the present embodiment, the explanation will be given with reference to FIG. 5, and the detailed processing contents in the series of steps will be related to the first embodiment. The description thereof will be omitted as it is the same as the manufacturing method of the soldered product.

The method for manufacturing a soldered product according to this embodiment is carried out using the soldering apparatus 100 described above. Specifically, first, one gate 119 of the processing chamber 110 is opened, the work W to be soldered is carried into the processing space PS, and the work W is placed on the plate 41 of the work support unit 140 to work the work W. It is supported on the support unit 140 (step S11). When the work W is placed on the plate 41, the work support unit 140 is then operated to move the work W to the heating position (step S12). After this movement or in parallel with this movement, the gate 119 is closed to make the inside of the processing chamber 110 airtight.

Next, the blower 131 and the heater 132 of the heater 130 are operated to supply hot air toward the work W placed on the plate 41, and the work W is heated to the solder melting temperature (step S13). The work W heated to the solder melting temperature in the heating step S13 is then moved to a cooling position where the plate 41 comes into contact with the cooling block 121 by operating the work support unit 140 (step S14). Then, the work W placed on the plate 41 is cooled to the solder solidification temperature by continuously passing the refrigerant through the refrigerant passage 122 (step S15). The work W in which the solder melted by being cooled to the solder solidification temperature is solidified is carried out of the processing chamber 110 from the other released gate 119 (step S16), and is carried out to another processing apparatus, for example, a secondary. It is transported to a cooling device, etc.

As described above, according to the method for manufacturing a soldered product according to the present embodiment, a series of steps can be carried out without moving the cooler, so that a large-sized solder is used for soldering the work. There is no need to prepare a soldering device. Further, since the refrigerant passage is not routed in the processing space PS, the portion requiring sealing processing can be reduced, and the maintainability of the device can be improved.

The present disclosure is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present disclosure. And all of them are included in the technical idea of the present disclosure.

1, 1A, 1B, 100 Soldering device 2 Control device 10, 110 Processing chamber 11 Processing chamber body 12, 112 Bottom wall (example of bottom surface)
13, 113 Side wall 14 Lid 15 Fluid supply port 16 Fluid supply mechanism 17 Fluid discharge port 18 Fluid discharge mechanism (example of discharge mechanism)
20, 120 Cooler 21, 121 Cooling block 22, 122 Refrigerant passage 22A, 122A Refrigerant supply port 22B, 122B Refrigerant discharge port 30, 130 Heater 31 Infrared heater 32 Outer tube 33 Irradiation window 40, 140 Work support unit 41 Plate 42 Lifting pin 50 1st work fixing jig 60 2nd work fixing jig PS Processing space IL Infrared light DP Delivery position HP Heating position CP Cooling position W, W1, W2 Work

Claims (10)

A processing chamber having a cooler on its bottom surface, wherein the cooler comprises a cooling block that projects upward from the bottom surface and has a cooling block that can directly or indirectly contact the work to which the upper surface is soldered. ,
A heater installed below the upper surface of the cooling block to heat the work, and
A work support unit that supports the work to be conveyed into the processing chamber, wherein the work support unit is located at a heating position for heating the work using the heater and below the heating position. A work support unit, which is movable between a cooling position for cooling the work heated at the heating position using a cooler, is provided.
Soldering equipment. The cooler further comprises the refrigerant passage, which is disposed inside the cooling block and allows the refrigerant to pass through the interior, the end of which communicates with the outside of the processing chamber.
The soldering apparatus according to claim 1. The heater includes an outer tube arranged so as to traverse the inside of the processing chamber, and an infrared heater inserted into the outer tube from the outside of the processing chamber.
The soldering apparatus according to claim 1 or 2. The work support unit includes a plate on which the work can be placed and an elevating pin which is arranged so as to penetrate the bottom surface of the processing chamber and can raise and lower the plate, and the cooling block is provided on the work. Indirect contact via the plate,
The soldering apparatus according to any one of claims 1 to 3. A work fixing jig attached to the work is further provided, and the cooling block can indirectly contact the work via the work fixing jig.
The soldering apparatus according to any one of claims 1 to 4. The processing chamber includes a processing chamber main body having the cooler on the bottom surface and an opening at the top, a lid that can close the opening airtightly, and a discharge that discharges the fluid inside the processing chamber to the outside of the processing chamber. With a mechanism,
The soldering apparatus according to any one of claims 1 to 5. The cooling blocks are formed in a comb shape so as to cross the processing chamber, and the heater is arranged between the adjacent cooling blocks.
The soldering apparatus according to any one of claims 1 to 6. A processing chamber having a cooler on the bottom thereof, wherein the cooler is
A cooling block that projects upward from the bottom surface and allows direct or indirect contact with the work to which the top surface is soldered.
The processing chamber comprising the refrigerant passage, which is disposed inside the cooling block and allows the refrigerant to pass through the inside, the end of which communicates with the outside of the processing chamber. ,
A heater that heats the work and
A work support unit for supporting the work to be conveyed into the processing chamber.
Soldering equipment. The step of supporting the work to be soldered on the work support unit in the processing chamber of the soldering apparatus according to any one of claims 1 to 8.
The process of heating the work using a heater and
A step of cooling the work heated by using a cooler.
How to manufacture soldered products. In a step of supporting a work to be soldered onto a work support unit in a processing chamber, the processing chamber is provided with a cooler on the bottom surface thereof, and the cooler protrudes upward from the bottom surface and the upper surface thereof is soldered. With a cooling block that can be directly or indirectly contacted with the workpiece to be soldered,
A step of heating the work by using a heater installed below the upper surface of the cooling block while the work is supported at the heating position by the work support unit.
A step of moving the work heated by the work support unit to a cooling position lower than the heating position, and
A step of cooling the heated work supported at the cooling position by using the cooler.
How to manufacture soldered products.

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