JP7049877B2

JP7049877B2 - Electronic circuit module

Info

Publication number: JP7049877B2
Application number: JP2018056517A
Authority: JP
Inventors: 芳清渡辺
Original assignee: Alps Electric Co Ltd; Alps Alpine Co Ltd
Current assignee: Alps Alpine Co Ltd
Priority date: 2018-03-23
Filing date: 2018-03-23
Publication date: 2022-04-07
Anticipated expiration: 2038-03-23
Also published as: JP2019169617A

Description

本発明は、電子回路モジュールに関する。 The present invention relates to an electronic circuit module.

従来、回路基板と、回路基板の表面に半田付けされた枠体と、枠体と嵌合したカバーと、を備えた電子回路モジュールが実用化されている。このような構成により、回路基板の表面に実装された電子部品が枠体及びカバーで覆われるため、電子回路モジュールの外部への電磁波の漏えいを抑制し、電子回路モジュールのシールド性を高めることができる。 Conventionally, an electronic circuit module including a circuit board, a frame body soldered to the surface of the circuit board, and a cover fitted with the frame body has been put into practical use. With such a configuration, the electronic components mounted on the surface of the circuit board are covered with the frame and the cover, so that the leakage of electromagnetic waves to the outside of the electronic circuit module can be suppressed and the shielding property of the electronic circuit module can be improved. can.

特開平３－１０４１９７号公報Japanese Unexamined Patent Publication No. 3-104197 特開２００６－０９３４７１号公報Japanese Unexamined Patent Publication No. 2006-093471

上記従来の電子回路モジュールは、リフロー処理により他の回路基板に半田付けされる。このリフロー処理の際に、枠体を回路基板に固定する半田が溶融し、カバーからの荷重により枠体が変形するおそれがある。枠体が変形すると、カバーが枠体から外れやすくなるという問題がある。 The conventional electronic circuit module is soldered to another circuit board by reflow processing. During this reflow process, the solder that fixes the frame to the circuit board may melt, and the frame may be deformed by the load from the cover. When the frame is deformed, there is a problem that the cover is easily removed from the frame.

本発明は、上記の課題に鑑みてなされたものであり、枠体からカバーが外れにくい電子回路モジュールを提供することを目的とする。 The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic circuit module whose cover does not easily come off from the frame.

一実施形態に係る電子回路モジュールは、表面に電子部品を実装された回路基板と、前記電子部品を囲むように配置され下端を前記回路基板の表面に半田付けされた側壁部と、前記側壁部の上端から内側に延びる平板部と、を有する枠体と、前記枠体の上部を覆う天板部と、前記天板部の外周から下方に延び前記側壁部と嵌合する複数の舌片部と、を有するカバーと、を備え、前記天板部には、隣接した２つの前記舌片部の間から内側に延びる、複数のスリットが形成される。 The electronic circuit module according to one embodiment has a circuit board on which electronic components are mounted on the surface, a side wall portion arranged so as to surround the electronic components and whose lower end is soldered to the surface of the circuit board, and the side wall portion. A frame having a flat plate portion extending inward from the upper end of the frame, a top plate portion covering the upper portion of the frame body, and a plurality of tongue pieces extending downward from the outer periphery of the top plate portion and fitting with the side wall portion. The top plate portion is formed with a plurality of slits extending inward from between two adjacent tongue pieces.

本発明の各実施形態によれば、枠体からカバーが外れにくい電子回路モジュールを提供することができる。 According to each embodiment of the present invention, it is possible to provide an electronic circuit module whose cover does not easily come off from the frame.

電子回路モジュールの一例を示す外観斜視図。External perspective view showing an example of an electronic circuit module. 図１の電子回路モジュールの分解斜視図。An exploded perspective view of the electronic circuit module of FIG. 1. 図１のカバーの部分拡大斜視図。A partially enlarged perspective view of the cover of FIG. 1. 比較例に係る電子回路モジュールを示す外観斜視図。The external perspective view which shows the electronic circuit module which concerns on a comparative example.

以下、本発明の各実施形態について、添付の図面を参照しながら説明する。なお、各実施形態に係る明細書及び図面の記載に関して、実質的に同一の機能構成を有する構成要素については、同一の符号を付することにより重畳した説明を省略する。 Hereinafter, each embodiment of the present invention will be described with reference to the accompanying drawings. Regarding the description of the specification and the drawings according to each embodiment, the components having substantially the same functional configuration are designated by the same reference numerals, and the superimposed description will be omitted.

一実施形態に係る電子回路モジュール１００について、図１～図４を参照して説明する。本実施形態に係る電子回路モジュール１００は、センサモジュールや通信モジュールなどの、電子部品を備えた任意のモジュールとして利用できる。 The electronic circuit module 100 according to the embodiment will be described with reference to FIGS. 1 to 4. The electronic circuit module 100 according to this embodiment can be used as an arbitrary module provided with electronic components such as a sensor module and a communication module.

図１は、一実施形態に係る電子回路モジュール１００の一例を示す外観斜視図である。図２は、図１の電子回路モジュール１００の分解斜視図である。図１及び図２に示すように、電子回路モジュールは、回路基板１と、枠体２と、カバー３と、を備える。なお、以下では、回路基板１の表面側を電子回路モジュール１００の上側として説明するが、電子回路モジュール１００の使用時の方向はこれに限られない。 FIG. 1 is an external perspective view showing an example of an electronic circuit module 100 according to an embodiment. FIG. 2 is an exploded perspective view of the electronic circuit module 100 of FIG. As shown in FIGS. 1 and 2, the electronic circuit module includes a circuit board 1, a frame 2, and a cover 3. In the following, the surface side of the circuit board 1 will be described as the upper side of the electronic circuit module 100, but the direction in which the electronic circuit module 100 is used is not limited to this.

回路基板１は、表面（上面）及び裏面（下面）を有する樹脂製のプリント基板である。回路基板１の表面は実装面となっており、１つ又は複数の電子部品１１が実装される。電子部品１１は、電子回路モジュール１００の用途に応じた任意の種類の電子部品で有り得る。また、図示省略されているが、回路基板１の表面、裏面、及び内部の少なくとも一部には、配線パターンが形成される。なお、図１及び図２の例では、回路基板１は平面視矩形であるが、回路基板１の平面視形状はこれに限られない。 The circuit board 1 is a resin-made printed circuit board having a front surface (upper surface) and a back surface (lower surface). The surface of the circuit board 1 is a mounting surface, and one or a plurality of electronic components 11 are mounted. The electronic component 11 can be any kind of electronic component according to the application of the electronic circuit module 100. Further, although not shown, wiring patterns are formed on the front surface, the back surface, and at least a part of the inside of the circuit board 1. In the examples of FIGS. 1 and 2, the circuit board 1 has a rectangular shape in a plan view, but the shape of the circuit board 1 in a plan view is not limited to this.

枠体２は、電子部品１１からの電磁波が、電子回路モジュール１００の側面から外部へ漏えいすることを抑制する金属部材である。枠体２は、平面視矩形であり、回路基板１の表面に固定される。枠体２は、側壁部２１と、平板部２２と、を有する。 The frame body 2 is a metal member that suppresses electromagnetic waves from the electronic component 11 from leaking to the outside from the side surface of the electronic circuit module 100. The frame body 2 has a rectangular shape in a plan view and is fixed to the surface of the circuit board 1. The frame body 2 has a side wall portion 21 and a flat plate portion 22.

側壁部２１は、電子回路モジュール１００の側面に相当し、電子回路モジュール１００の前面、後面、右側面、及び左側面とそれぞれ対応する、回路基板１と垂直な４つの板状部分を有する。側壁部２１は、電子部品１１を囲むように配置され、下端を回路基板１の表面に半田付けされる。側壁部２１は、複数の嵌合部２３と、複数の押圧部２４と、を有する。 The side wall portion 21 corresponds to the side surface of the electronic circuit module 100, and has four plate-shaped portions perpendicular to the circuit board 1 corresponding to the front surface, the rear surface, the right side surface, and the left side surface of the electronic circuit module 100, respectively. The side wall portion 21 is arranged so as to surround the electronic component 11, and the lower end thereof is soldered to the surface of the circuit board 1. The side wall portion 21 has a plurality of fitting portions 23 and a plurality of pressing portions 24.

嵌合部２３は、後述する凸部３４と嵌合する部分である。嵌合部２３は、側壁部２１に形成された貫通孔であってもよいし、側壁部２１の外周面に形成された凹部であってもよい。凸部３４と嵌合部２３とが嵌合することにより、カバー３が枠体２に取り付けられる。 The fitting portion 23 is a portion that fits with the convex portion 34 described later. The fitting portion 23 may be a through hole formed in the side wall portion 21, or may be a recess formed in the outer peripheral surface of the side wall portion 21. The cover 3 is attached to the frame body 2 by fitting the convex portion 34 and the fitting portion 23.

押圧部２４は、側壁部２１から外側（電子部品１１と反対側）に突出した部分である。押圧部２４は、カバー３が枠体２に取り付けられている間、後述する舌片部３２を外側に押圧するように設けられる。押圧部２４が舌片部３２を押圧することにより、カバー３のガタつきが抑制される。 The pressing portion 24 is a portion protruding outward (opposite to the electronic component 11) from the side wall portion 21. The pressing portion 24 is provided so as to press the tongue piece portion 32 described later to the outside while the cover 3 is attached to the frame body 2. By pressing the tongue piece portion 32 by the pressing portion 24, the rattling of the cover 3 is suppressed.

平板部２２は、側壁部２１の上端から所定の幅Ｗだけ内側（電子部品１１側）に延びる、回路基板１と平行な板状部分である。平板部２２により枠体２が補強される。平板部２２の幅Ｗは、例えば、２ｍｍであるが、任意に設計可能である。 The flat plate portion 22 is a plate-shaped portion parallel to the circuit board 1 extending inward (on the electronic component 11 side) by a predetermined width W from the upper end of the side wall portion 21. The frame body 2 is reinforced by the flat plate portion 22. The width W of the flat plate portion 22 is, for example, 2 mm, but can be arbitrarily designed.

カバー３は、電子部品１１からの電磁波が、電子回路モジュール１００の上面から外部へ漏えいすることを抑制する金属部材である。カバー３は、平面視略矩形であり、枠体２に取り付けられる。ここでいう略矩形は、矩形、及び矩形の一部を切り欠いた形状を含む。カバー３は、天板部３１と、複数の舌片部３２と、を有する。 The cover 3 is a metal member that suppresses electromagnetic waves from the electronic component 11 from leaking to the outside from the upper surface of the electronic circuit module 100. The cover 3 has a substantially rectangular shape in a plan view and is attached to the frame body 2. The substantially rectangle referred to here includes a rectangle and a shape obtained by cutting out a part of the rectangle. The cover 3 has a top plate portion 31 and a plurality of tongue piece portions 32.

天板部３１は、枠体２の上部を覆う略矩形の板状部分である。天板部３１は、矩形の角及び辺の一部（後述するスリット３３に相当する部分）を切り欠いた形状を有するが、天板部３１の形状はこれに限られない。天板部３１は、カバー３を枠体２に取り付けた際に、舌片部３２から枠体２に内側方向の荷重が加わるように、枠体２と略同じ大きさに形成される。これにより、カバー３が枠体２から外れにくくすることができる。 The top plate portion 31 is a substantially rectangular plate-shaped portion that covers the upper portion of the frame body 2. The top plate portion 31 has a shape in which a corner of a rectangle and a part of a side (a portion corresponding to a slit 33 described later) are cut out, but the shape of the top plate portion 31 is not limited to this. The top plate portion 31 is formed to have substantially the same size as the frame body 2 so that a load in the inward direction is applied from the tongue piece portion 32 to the frame body 2 when the cover 3 is attached to the frame body 2. As a result, the cover 3 can be prevented from coming off from the frame body 2.

ここで、図３は、図１のカバー３の部分拡大斜視図である。図３に示すように、天板部３１の各辺には、それぞれ複数のスリット３３が形成される。スリット３３は、隣接した２つの舌片部３２の間から、所定の長さＬだけ内側に延びる切欠き部分である。長さＬは、例えば、１ｍｍであるが、任意に設計可能である。ただし、長さＬは、図２の例のように、幅Ｗより短いのが好ましい。長さＬを幅Ｗより短くすることにより、カバー３を枠体２に取り付けた際に、スリット３３の全体が平板部２２により覆われるため、スリット３３からの電磁波の漏えいを抑制することができる。スリット３３を設けることにより、舌片部３２が天板部３１を支点として、上下方向に移動可能となる。 Here, FIG. 3 is a partially enlarged perspective view of the cover 3 of FIG. As shown in FIG. 3, a plurality of slits 33 are formed on each side of the top plate portion 31. The slit 33 is a notch portion extending inward by a predetermined length L from between two adjacent tongue pieces 32. The length L is, for example, 1 mm, but can be arbitrarily designed. However, the length L is preferably shorter than the width W as in the example of FIG. By making the length L shorter than the width W, when the cover 3 is attached to the frame body 2, the entire slit 33 is covered by the flat plate portion 22, so that the leakage of electromagnetic waves from the slit 33 can be suppressed. .. By providing the slit 33, the tongue piece portion 32 can move in the vertical direction with the top plate portion 31 as a fulcrum.

舌片部３２は、天板部３１の外周から下方に延びる板状部分である。舌片部３２は、天板部３１の各辺に、間隔をあけてそれぞれ複数設けられる。図３に示すように、舌片部３２は、下部が外側に湾曲しているのが好ましい。これにより、枠体２をカバー３の下方から、カバー３の内側に容易に挿入可能となるため、電子回路モジュール１００の組み立て性を向上させることができる。舌片部３２は、凸部３４と、開口部３５と、を有する。 The tongue piece portion 32 is a plate-shaped portion extending downward from the outer periphery of the top plate portion 31. A plurality of tongue pieces 32 are provided on each side of the top plate 31 at intervals. As shown in FIG. 3, it is preferable that the lower portion of the tongue piece portion 32 is curved outward. As a result, the frame body 2 can be easily inserted into the inside of the cover 3 from below the cover 3, so that the assembleability of the electronic circuit module 100 can be improved. The tongue piece portion 32 has a convex portion 34 and an opening portion 35.

凸部３４は、舌片部３２から内側に突出した部分であり、嵌合部２３と対向するように設けられ、対向する嵌合部２３と嵌合する。凸部３４が嵌合部２３と嵌合することにより、カバー３が枠体２に取り付けられる。本実施形態において、嵌合部２３を舌片部３２に設け、凸部３４を側壁部２１に設けることも可能であるが、凸部３４は、舌片部３２に設けられるのが好ましい。凸部３４を舌片部３２に設けることにより、凸部３４が嵌合部２３と適切に嵌合しない場合であっても、嵌合部２３に嵌合していない凸部３４が舌片部３２により隠されるため、電子回路モジュール１００の美観の低下を抑制することができる。また、凸部３４の正面視形状は、円形、矩形、楕円形など、任意に設計可能であるが、図３の例のように、円形であるのが好ましい。凸部３４の正面視形状を円形とすることにより、枠体２に対するカバー３の位置決め精度を向上させることができる。 The convex portion 34 is a portion protruding inward from the tongue piece portion 32, is provided so as to face the fitting portion 23, and fits with the facing fitting portion 23. The cover 3 is attached to the frame body 2 by fitting the convex portion 34 with the fitting portion 23. In the present embodiment, it is possible to provide the fitting portion 23 on the tongue piece portion 32 and the convex portion 34 on the side wall portion 21, but it is preferable that the convex portion 34 is provided on the tongue piece portion 32. By providing the convex portion 34 on the tongue piece portion 32, even if the convex portion 34 does not properly fit with the fitting portion 23, the convex portion 34 that is not fitted to the fitting portion 23 is the tongue piece portion. Since it is hidden by 32, it is possible to suppress deterioration of the aesthetic appearance of the electronic circuit module 100. The front view shape of the convex portion 34 can be arbitrarily designed to be circular, rectangular, elliptical, or the like, but it is preferably circular as in the example of FIG. By making the front view shape of the convex portion 34 circular, it is possible to improve the positioning accuracy of the cover 3 with respect to the frame body 2.

開口部３５は、天板部３１の外周部に形成された貫通孔であって、舌片部３２の上端と接する位置から天板部３１の中央部に向かって広がるように形成されている。このような開口部３５を設けることにより、天板部３１の舌片部３２の上端と接する部分の機械強度を低下させて弾性変形しやすくでき、舌片部３２の上下方向への移動が容易になる。 The opening 35 is a through hole formed in the outer peripheral portion of the top plate portion 31, and is formed so as to extend from a position in contact with the upper end of the tongue piece portion 32 toward the central portion of the top plate portion 31. By providing such an opening 35, the mechanical strength of the portion of the top plate portion 31 in contact with the upper end of the tongue piece portion 32 can be reduced to facilitate elastic deformation, and the tongue piece portion 32 can be easily moved in the vertical direction. become.

ここで、本実施形態に係る電子回路モジュール１００の効果について、比較例と比較しながら説明する。図４は、比較例に係る電子回路モジュール２００を示す図である。電子回路モジュール２００は、カバー３の構成を除き、電子回路モジュール１００と同様である。すなわち、電子回路モジュール２００は、回路基板１と、枠体２と、カバー４と、を備える。 Here, the effect of the electronic circuit module 100 according to the present embodiment will be described while comparing with a comparative example. FIG. 4 is a diagram showing an electronic circuit module 200 according to a comparative example. The electronic circuit module 200 is the same as the electronic circuit module 100 except for the configuration of the cover 3. That is, the electronic circuit module 200 includes a circuit board 1, a frame body 2, and a cover 4.

電子回路モジュール２００のカバー４は、スリットを有しない略矩形の天板部４１と、側板部４２と、を有する。側板部４２は、天板部４１の各辺から下方に延びる矩形の板状部分であり、嵌合部２３と嵌合する複数の凸部４４を有する。 The cover 4 of the electronic circuit module 200 has a substantially rectangular top plate portion 41 having no slit and a side plate portion 42. The side plate portion 42 is a rectangular plate-shaped portion extending downward from each side of the top plate portion 41, and has a plurality of convex portions 44 to be fitted with the fitting portion 23.

この比較例によれば、カバー４を枠体２に取り付けると、枠体２は、カバー４の側板部４２により内側方向に荷重を加えられる。この荷重が大きい場合、電子回路モジュール２００をリフロー処理により他の基板に半田付けする際、荷重により枠体２が変形し、カバー４が枠体２から外れやすくなる。 According to this comparative example, when the cover 4 is attached to the frame body 2, the frame body 2 is loaded inward by the side plate portion 42 of the cover 4. When this load is large, when the electronic circuit module 200 is soldered to another substrate by reflow processing, the frame 2 is deformed by the load, and the cover 4 is easily detached from the frame 2.

これに対して、本実施形態によれば、カバー３を枠体２に取り付けると、枠体２は、カバー３の舌片部３２により内側方向に荷重を加えられる。舌片部３２は、隙間をあけて複数に分割した側板部４２に相当する。したがって、舌片部３２により荷重を加えることにより、側板部４２により荷重を加える比較例に比べて、枠体２に加わる荷重を小さくすることができる。 On the other hand, according to the present embodiment, when the cover 3 is attached to the frame body 2, the frame body 2 is loaded inward by the tongue piece portion 32 of the cover 3. The tongue piece portion 32 corresponds to a side plate portion 42 divided into a plurality of parts with a gap. Therefore, by applying the load by the tongue piece portion 32, the load applied to the frame body 2 can be reduced as compared with the comparative example in which the load is applied by the side plate portion 42.

また、本実施形態によれば、スリット３３を設けたことにより、舌片部３２が天板部３１を支点として、上下方向に移動可能となっている。このような構成により、側板部４２が上下方向に移動不能な比較例に比べて、枠体２に加わる荷重を更に小さくすることができる。 Further, according to the present embodiment, by providing the slit 33, the tongue piece portion 32 can move in the vertical direction with the top plate portion 31 as a fulcrum. With such a configuration, the load applied to the frame body 2 can be further reduced as compared with the comparative example in which the side plate portion 42 cannot move in the vertical direction.

また、本実施形態によれば、天板部３１には、舌片部３２の上端と接する位置に開口部３５が形成されている。このような開口部３５を設けることにより、天板部３１の舌片部３２の上端と接する部分の機械強度を低下させて弾性変形しやすくでき、舌片部３２の上下方向への移動が容易になる。そして、舌片部３２の上下方向への移動を利用して、舌片部３２から枠体２に加わる荷重を上下方向に分散しやすくなる。その結果、側板部４２が変形しにくい比較例に比べて、枠体２に加わる荷重を更に小さくすることができる。 Further, according to the present embodiment, the top plate portion 31 is formed with an opening 35 at a position in contact with the upper end of the tongue piece portion 32. By providing such an opening 35, the mechanical strength of the portion of the top plate portion 31 in contact with the upper end of the tongue piece portion 32 can be reduced to facilitate elastic deformation, and the tongue piece portion 32 can be easily moved in the vertical direction. become. Then, by utilizing the vertical movement of the tongue piece portion 32, the load applied to the frame body 2 from the tongue piece portion 32 can be easily dispersed in the vertical direction. As a result, the load applied to the frame body 2 can be further reduced as compared with the comparative example in which the side plate portion 42 is less likely to be deformed.

このように、本実施形態によれば、枠体２に加わる内側方向の荷重を、比較例に比べて大幅に小さくすることができるため、リフロー処理の際に、枠体２がカバー３により加えられた荷重によって変形することを抑制することができる。結果として、枠体２の変形によりカバー３が外れやすくなることを抑制することができる。すなわち、カバー３を枠体２から外れにくくすることができる。 As described above, according to the present embodiment, the load applied to the frame body 2 in the inward direction can be significantly reduced as compared with the comparative example, so that the frame body 2 is applied by the cover 3 during the reflow process. Deformation due to the applied load can be suppressed. As a result, it is possible to prevent the cover 3 from being easily removed due to the deformation of the frame body 2. That is, the cover 3 can be made difficult to come off from the frame body 2.

なお、枠体２は、側壁部２１の辺の中央部が、側壁部２１の辺の端部に比べて変形しやすい。このため、カバー３は、側壁部２１の辺の中央部に加わる荷重が、側壁部２１の辺の端部に加わる荷重より小さくなるように形成されるのが好ましい。具体的には、天板部３１の辺の中央部に設けられた舌片部３２を、天板部３１の辺の端部に設けられた舌片部３２より小さくすればよい。また、天板部３１の辺の中央部に設けられたスリット３３を、天板部３１の辺の端部に設けられたスリット３３より長くしてもよい。また、天板部３１の辺の中央部に設けられた開口部３５を、天板部３１の辺の端部に設けられた開口部３５より大きくしてもよい。いずれの場合も、側壁部２１の辺の中央部に加わる荷重が、側壁部２１の辺の端部に加わる荷重より小さくなるため、枠体２の変形を効果的に抑制できる。 In the frame body 2, the central portion of the side surface of the side wall portion 21 is more easily deformed than the end portion of the side surface of the side wall portion 21. Therefore, it is preferable that the cover 3 is formed so that the load applied to the central portion of the side surface portion 21 is smaller than the load applied to the end portion of the side wall portion 21. Specifically, the tongue piece portion 32 provided at the center of the side of the top plate portion 31 may be smaller than the tongue piece portion 32 provided at the end of the side of the top plate portion 31. Further, the slit 33 provided in the central portion of the side of the top plate portion 31 may be longer than the slit 33 provided in the end portion of the side of the top plate portion 31. Further, the opening 35 provided at the center of the side of the top plate 31 may be larger than the opening 35 provided at the end of the side of the top plate 31. In either case, the load applied to the central portion of the side surface portion 21 is smaller than the load applied to the end portion of the side wall portion 21, so that the deformation of the frame body 2 can be effectively suppressed.

また、本実施形態によれば、複数の凸部３４はそれぞれ異なる舌片部３２に設けられているため、１つの凸部３４が嵌合部２３から外れても、当該凸部３４が設けられた舌片部３２が位置ずれするだけであり、他の舌片部３２及び他の凸部３４には影響しない。これに対して、比較例によれば、１つの凸部４４が嵌合部２３から外れると、側板部４２の全体が位置ずれし、他の凸部４４まで外れやすくなる。このように、本実施形態によれば、複数の凸部３４をそれぞれ異なる舌片部３２に設けることにより、比較例に比べて、凸部３４を嵌合部２３から外れにくくすることができる。結果として、カバー３を枠体２から外れにくくすることができる。 Further, according to the present embodiment, since the plurality of convex portions 34 are provided on different tongue piece portions 32, even if one convex portion 34 is disengaged from the fitting portion 23, the convex portion 34 is provided. The tongue piece portion 32 is only displaced, and does not affect the other tongue piece portion 32 and the other convex portion 34. On the other hand, according to the comparative example, when one convex portion 44 is disengaged from the fitting portion 23, the entire side plate portion 42 is displaced in position, and the other convex portion 44 is likely to be disengaged. As described above, according to the present embodiment, by providing the plurality of convex portions 34 on different tongue piece portions 32, it is possible to make the convex portions 34 less likely to come off from the fitting portion 23 as compared with the comparative example. As a result, the cover 3 can be made difficult to come off from the frame body 2.

なお、上記実施形態に挙げた構成等に、その他の要素との組み合わせなど、ここで示した構成に本発明が限定されるものではない。これらの点に関しては、本発明の趣旨を逸脱しない範囲で変更可能であり、その応用形態に応じて適切に定めることができる。 The present invention is not limited to the configurations shown here, such as combinations with other elements in the configurations and the like described in the above embodiments. These points can be changed without departing from the spirit of the present invention, and can be appropriately determined according to the application form thereof.

１：回路基板
２：枠体
３：カバー
４：カバー
１１：電子部品
２１：側壁部
２２：平板部
２３：嵌合部
２４：押圧部
３１：天板部
３２：舌片部
３３：スリット
３４：凸部
３５：開口部
４１：天板部
４２：側板部
４４：凸部
１００：電子回路モジュール
２００：電子回路モジュール（比較例） 1: Circuit board 2: Frame 3: Cover 4: Cover 11: Electronic component 21: Side wall 22: Flat plate 23: Fitting 24: Pressing 31: Top plate 32: Tongue piece 33: Slit 34: Convex portion 35: Opening portion 41: Top plate portion 42: Side plate portion 44: Convex portion 100: Electronic circuit module 200: Electronic circuit module (comparative example)

Claims

A circuit board with electronic components mounted on the surface,
A frame body having a side wall portion arranged so as to surround the electronic component and having a lower end soldered to the surface of the circuit board, and a flat plate portion extending inward from the upper end of the side wall portion.
A cover having a top plate portion that covers the upper portion of the frame body, and a plurality of tongue pieces that extend downward from the outer periphery of the top plate portion and fit into the side wall portion.
Equipped with
A plurality of slits extending inward from between the two adjacent tongue pieces are formed in the top plate portion.
The top plate portion is substantially rectangular and has a substantially rectangular shape.
The tongue piece portion provided at the center of the side of the top plate portion is smaller than the tongue piece portion provided at the end of the side of the top plate portion.
Electronic circuit module.

A circuit board with electronic components mounted on the surface,
A frame body having a side wall portion arranged so as to surround the electronic component and having a lower end soldered to the surface of the circuit board, and a flat plate portion extending inward from the upper end of the side wall portion.
A cover having a top plate portion that covers the upper portion of the frame body, and a plurality of tongue pieces that extend downward from the outer periphery of the top plate portion and fit into the side wall portion.
Equipped with
A plurality of slits extending inward from between the two adjacent tongue pieces are formed in the top plate portion.
The top plate portion is substantially rectangular and has a substantially rectangular shape.
The slit provided at the center of the side of the top plate is longer than the slit provided at the end of the side of the top plate.
Electronic circuit module.

A circuit board with electronic components mounted on the surface,
A frame body having a side wall portion arranged so as to surround the electronic component and having a lower end soldered to the surface of the circuit board, and a flat plate portion extending inward from the upper end of the side wall portion.
A cover having a top plate portion that covers the upper portion of the frame body, and a plurality of tongue pieces that extend downward from the outer periphery of the top plate portion and fit into the side wall portion.
Equipped with
A plurality of slits extending inward from between the two adjacent tongue pieces are formed in the top plate portion.
The top plate portion is substantially rectangular and has a substantially rectangular shape.
An opening is formed in the top plate portion at a position in contact with the upper end of the tongue piece portion.
The opening at the upper end of the tongue piece provided at the center of the side of the top plate is larger than the opening at the upper end of the tongue piece provided at the end of the side of the top plate.
Electronic circuit module.

The electronic circuit module according to any one of claims 1 to 3 , wherein the length of the slit is shorter than the width of the flat plate portion.

The electronic circuit module according to any one of claims 1 to 4 , wherein an opening is formed in the top plate portion at a position in contact with the upper end of the tongue piece portion.

The tongue piece portion has a convex portion protruding inward and has a convex portion.
The electronic circuit module according to any one of claims 1 to 5 , wherein the side wall portion has a fitting portion that fits with the convex portion.

The electronic circuit module according to any one of claims 1 to 6 , wherein the tongue piece portion is curved outward.