JP7043350B2 - Insulation - Google Patents

Description

The present invention relates to a heat insulating material.

In recent years, the heat generation density from heat-generating parts has rapidly increased with the improvement of the performance of electronic devices such as smartphones, tablets, and notebook computers and precision devices, and heat diffusion technology in these electronic devices has become indispensable.

In particular, small mobile devices have many opportunities to come into direct contact with the human body, and the temperature rise on the outer surface of the housing has become a serious problem. One of the problems caused by the temperature rise on the outer surface of the housing of mobile devices is low temperature burns. Low temperature burns are a type of burn that occurs when the human body is exposed to a temperature higher than body temperature for a long time. For example, it has been reported that burns occur in 6 hours at 44 ° C, and the time to burn is halved for every 1 ° C rise. Cold burns often delay the person's awareness of the progression of symptoms compared to normal burns, often with severe skin damage.

In addition, there are the following problems in the cooling and heating equipment. For example, in a refrigerator, urethane foam or vacuum heat insulating material is used to prevent heat from entering the refrigerator from the wall surface of the refrigerator, and a sealing structure using a gasket or the like is used between the door and the refrigerator box. Has been done. On the other hand, the surface of the refrigerator is kept at a low temperature inside the refrigerator, so that the temperature is lower than the temperature outside the refrigerator and dew condensation may occur. Therefore, it is necessary to arrange a pipe for flowing a high-temperature refrigerant and a heater near the surface of the refrigerator, and the heat has conversely entered the refrigerator through the parts constituting the refrigerator.

In this way, in both cases of electronic devices and cooling / heating devices, by arranging the heat insulating material, it is possible to prevent low-temperature burns in the former and suppress cooling power due to heat intrusion in the latter. In this case, the space that can be installed is very small, so a thin heat insulating material with low thermal conductivity is required.

Under such circumstances, a silica airgel sheet exists as a heat insulating material that exhibits a sufficient heat insulating effect even in a narrow space. This silica airgel sheet is made by supporting silica airgel having a nano-sized porous structure on a non-woven fabric.

As shown in FIG. 5, the silica airgel is an aggregate of a network structure including silica secondary particles 502 and voids 503. The silica secondary particles 502 are formed by gathering silica primary particles 501 having a diameter of about 1 nm, and have a diameter of about 10 nm. The void 503 has a distance between particles of about 10 to 60 nm.

This interparticle distance is less than or equal to the mean free path of air (nitrogen molecules). Therefore, the thermal conductivity of silica airgel is 0.015 to 0.024 W / mK, which is very low. This thermal conductivity is less than or equal to the thermal conductivity of static air at room temperature (0.026 W / mK). Therefore, heat transfer can be suppressed by laminating an airgel sheet having a low thermal conductivity.

However, the silica airgel sheet (nonwoven fabric carrying silica airgel having a nano-sized porous structure) has a small binding force between the silica secondary particles 502 and is extremely fragile. Therefore, when stress is applied to the silica airgel sheet from the outside, the silica airgel pieces (for example, the size is 100 μm to 200 μm) existing in the opening on the surface of the silica airgel sheet are detached into the electronic device.

Further, the silica airgel pieces desorbed in the electronic device are not carried by the non-woven fabric that relieves stress from the outside. Therefore, it is crushed into fine particles of a large amount of silica particles, which are scattered in the electronic device and cause problems such as poor contact.

Therefore, it is necessary to suppress the detachment of the silica airgel when an external stress is applied to one or both sides of the airgel sheet.

On the other hand, for example, in Patent Document 1, as shown in FIG. 6, a portion where the silica airgel 602 does not exist is formed in the nonwoven fabric 603, and the portion and the support layers 604a and 604b are heat-bonded to form a heat insulating material. A method of forming 601 is disclosed.

Further, for example, in Patent Document 2, the silica airgel is not supported on the surface layer of the nonwoven fabric, the surface layer of the nonwoven fabric is heat-fused, and the opening diameter of the surface layer of the nonwoven fabric is made smaller than the diameter of the silica airgel to suppress the detachment of the silica airgel. The method of doing so is disclosed.

Japanese Unexamined Patent Publication No. 2016-11275 Japanese Unexamined Patent Publication No. 2017-15205

However, in the methods of Patent Document 1 and Patent Document 2, when the silica airgel is supported on the non-woven fabric, masking or adjustment of immersion in chemicals is required, and it is difficult to cope with large format (large area) and complicated shapes. Will be.

In applications such as cooling and heating equipment, the area to be insulated is often a place isolated from electronic equipment. Therefore, there is almost no effect due to the desorption of a part of the silica airgel, and there is no problem even if the silica airgel is exposed and desorbed on the cut end surface of the non-woven fabric.

The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a heat insulating material capable of dealing with a large size and a complicated shape.

In order to achieve the above object, the heat insulating material of the present invention comprises a non-woven fabric made of fibers, a fiber layer having a silica airgel supported on the entire surface and the entire thickness of the non-woven fabric, and at least one of the fiber layers. It has a support layer arranged on a surface, and has a bonding layer in which the support layer and the fiber layer are bonded by entering the support layer into the fiber layer.

According to the heat insulating material of the present invention, it is possible to provide a heat insulating material capable of dealing with a large size and a complicated shape.

Cross-sectional view of the side surface of the heat insulating material according to the first embodiment of the present invention. Enlarged view of the welded portion of the heat insulating material according to the first embodiment of the present invention. Perspective view of the heat insulating material after heat welding between the nonwoven fabric and the support layer in the first embodiment of the present invention. Schematic diagram of the cut shape of the nonwoven fabric and the support layer after heat welding according to the first embodiment of the present invention. Schematic diagram of the cut shape of the nonwoven fabric and the support layer after heat welding according to the first embodiment of the present invention. Perspective view of the heat insulating material according to the second embodiment of the present invention. A view of the heat insulating material from the direction of arrow A in FIG. 3A. BB sectional view of FIG. 3B Sectional drawing after cutting of heat insulating material in Embodiment 2 of this invention Perspective view of the heat insulating material according to the third embodiment of the present invention. A view of the heat insulating material from the direction of arrow C in FIG. 4A. DD cross-sectional view of FIG. 4B Sectional drawing after cutting of heat insulating material in Embodiment 2 of this invention Enlarged schematic diagram of a part of silica airgel Cross section of the side of conventional insulation

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to the following embodiments.

(Embodiment 1)
Embodiment 1 of the present invention will be described with reference to FIGS. 1A, 1B, 2A, 2B, and 2C.

FIG. 1A is a cross-sectional view of a side surface of the heat insulating material 101 according to the first embodiment. As shown in FIG. 1A, in the heat insulating material 101, one surface of the silica airgel-supporting fiber 102 is coated on the support layer 103a, and the back surface of the silica airgel-supporting fiber 102 is coated on the support layer 103b.

The silica airgel-supporting fiber 102 (an example of the fiber layer) is a non-woven fabric supporting silica airgel. The silica airgel is supported on the entire surface of the silica airgel-supporting fiber 102 in the total thickness direction.

FIG. 1B is an enlarged view of a welded portion of the heat insulating material in the first embodiment. As shown in FIG. 1B, between the support layer 103a and the silica airgel-supporting fiber 102, a part of the support layer 103a is dissolved in the silica airgel-supporting fiber 102. As a result, the bonding layer 104 of the support layer 103a and the silica airgel-supporting fiber 102 is formed. A similar bonding layer is also formed between the support layer 103b and the silica airgel-supporting fiber 102.

In the first embodiment, for example, the thickness of the silica airgel-supported fiber 102 is 1 mm, the thickness of the support layers 103a and 103b is 60 μm, and the thickness of the bonding layer 104 is 20 μm. Further, the bonding layer (not shown) between the support layer 103b and the silica airgel-supporting fiber 102 is also 20 μm.

Here, the support layers 103a and 103b are formed of a material (substance) having a melting point lower than that of the fibers constituting the silica airgel-supporting fiber 102. As the material constituting the support layers 103a and 103b, for example, polyethylene (melting point 115 to 135 ° C.) can be used. Further, as the fiber constituting the silica airgel-supporting fiber 102, for example, polyester (melting point 255 to 260 ° C.) can be used. The selection of the materials constituting the support layers 103a and 103b and the silica airgel-supporting fiber 102 is not limited to the above, and various materials can be selected.

Further, in the first embodiment, the case where the support layers 103a and 103b are made of a polyethylene sheet and the thickness of the polyethylene sheet is 60 μm will be described as an example, but the thickness is not limited thereto. If the polyethylene sheet has a thickness of 40 μm or more, it is possible to form the bonding layer 104 shown in FIG. 1B. If the polyethylene sheet is thinner than 40 μm, the support layers 103a and 103b permeate the silica airgel-supported fibers 102 as described above, so that the thickness of the support layers 103a and 103b themselves becomes thin and holes are opened on the surface of the heat insulating material 101. Sometimes.

On the other hand, if the thicknesses of the support layers 103a and 103b are too large, the flexibility of the heat insulating material 101 decreases, and the ratio of the thicknesses of the support layers 103a and 103b to the total thickness of the heat insulating material 101 increases. The thermal conductivity of 101 may be high. Therefore, the thickness of the support layers 103a and 103b is preferably 100 μm or less.

Examples of the shape of the entire heat insulating material 101 include the shape shown in FIG. 2A. FIG. 2A is a heat insulating material 101 in which the support layers 103a and 103b and the silica airgel-supporting fibers 102 are bonded, and the shapes of the upper and lower surfaces thereof are rectangular (in other words, the overall shape is a rectangular parallelepiped shape). Things) are shown.

In the heat insulating material 101 shown in FIG. 2A, the support layers 103a and 103b and the silica airgel-supported fibers 102 are bonded by a bonding layer (not shown), and the bonding is homogeneous. Therefore, no matter which direction is cut on the plane of the heat insulating material 101, the support layers 103a and 103b and the silica airgel-supported fibers 102 are maintained in a bonded state at the cut end face. Further, the flat surface portion of the silica airgel-supported fiber 102 has a structure covered with the support layers 103a and 103b. Further, since the cut end face is not welded between the support layers 103a and 103b, the silica airgel-supporting fiber 102 (and the silica airgel) is exposed.

2B and 2C are schematic views of the cut shape when the heat insulating material 101 is cut after heat welding of the support layers 103a and 103b and the silica airgel-supporting fiber 102, respectively.

FIG. 2B shows a state in which one rectangular parallelepiped heat insulating material 101 (see, for example, FIG. 1A) is cut and divided into two rectangular parallelepiped heat insulating materials 201a and 201b. The heat insulating materials 201a and 201b can be used as they are as the heat insulating material in the same manner as the heat insulating material 101 before cutting.

FIG. 2C shows a state in which one rectangular parallelepiped heat insulating material 101 (see, for example, FIG. 1A) is cut and divided into two heat insulating materials 201c and 201d having the same triangular columnar shape. The heat insulating materials 201c and 201d can be used as they are as the heat insulating material in the same manner as the heat insulating material 101 before cutting.

As the cutting means, for example, a blade such as a cutter or a press configuration such as a Thomson type can be used. That is, since a cutting means that does not require heating can be used, the heat insulating material 101 can be easily cut into an arbitrary shape.

<Method of forming the bond layer 104>
Here, a method of forming the bond layer 104 shown in FIG. 1B will be described.

The bonding layer 104 is formed by applying pressure while heating at a temperature higher than the melting point of the support layer 103a and lower than the melting point of the fibers constituting the silica airgel-supported fiber 102.

For example, pressure is applied between the two heated rollers, and the laminate in which the silica airgel-supporting fibers 102 are sandwiched by the support layers 103a and 103b is passed between the rollers. As described above, in the first embodiment, polyethylene (melting point 115 to 135 ° C.) is used as the material of the support layers 103a and 103b, and polyester (melting point 255 to 260 ° C.) is used as the fiber of the silica airgel-supported fiber 102. ing. Therefore, the heating temperature is 150 ° C., the pressurizing pressure is 40 MPa, and the laminate is passed between the rollers five times at a speed of 50 mm / s to heat and pressurize the bonded layer 104. ..

The thickness of the bonding layer 104 can be adjusted by the heating temperature and the pressurizing pressure. The thickness of the bonding layer 104 becomes thicker as the heating temperature and the pressurizing pressure increase, and becomes thinner as the heating temperature and the pressurizing pressure decrease.

The thicker the bond layer 104, the stronger the bond strength between the support layers 103a and 103b and the silica airgel-supported fiber 102. However, since the amount of permeation of the support layers 103a and 103b into the silica airgel-supported fibers 102 (thickness of the bonding layer 104) increases, the thermal conductivity of the heat insulating material 101 increases.

On the other hand, the thinner the bond layer 104, the weaker the bond strength between the support layers 103a and 103b and the silica airgel-supported fiber 102. However, since the amount of permeation of the support layers 103a and 103b into the silica airgel-supported fibers 102 (thickness of the bonding layer 104) is reduced, the thickness of the material of the support layers 103a and 103b can be reduced. Therefore, the thickness of the heat insulating material 101 as a whole can be reduced.

In the first embodiment, the bond layer 104 is formed by the above-mentioned conditions and methods. As a result, the bond strength between the support layer 103a and the silica airgel-supported fiber 102 in the heat insulating material 101 was 3 N or more when the heat insulating material 101 had a width of 15 mm and was peeled off at a right angle of 300 mm / min. Moreover, the increase in thermal conductivity could be suppressed to less than 10%.

The heating condition and the pressurizing condition described above are examples, and the bond layer 104 can be formed in the same manner as described above even if other conditions are selected. However, it may need to be changed depending on the material used. Further, in the first embodiment, the case where two heated rollers are used as a means for heating and pressurizing has been described as an example, but the present invention is not limited to this, and for example, heating is performed using an impulse sealer. And another means such as pressurization may be used.

<Effect of Embodiment 1>
As described above, according to the heat insulating material 101 of the first embodiment, it can be produced in a large format in a usage environment where the degree of the silica airgel falling off from the side surface of the fiber is not affected, and after the production in the large format. Can be cut into the required shape. Therefore, for example, in electronic equipment, precision equipment, cooling and heating equipment, etc., it is possible to use it in a large format or in a complicated shape.

Further, as described above, it is necessary to take measures to prevent the surrounding area from being contaminated due to the falling off of silica airgel, but according to the heat insulating material 101 of the first embodiment, the process of the measures should be simplified. Can be done.

(Embodiment 2)
Embodiment 2 of the present invention will be described with reference to FIGS. 3A, 3B, 3C, and 3D. In the following description of the second embodiment, a configuration different from that of the first embodiment will be mainly described. Further, in FIG. 3, the same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 3A is a perspective view of the heat insulating material 101 according to the second embodiment. As shown in FIG. 3A, the support layer 301 encloses the silica airgel-supported fibers 102. The surface of the heat insulating material 101 seen from the direction of the arrow A shown in FIG. 3A is an example of an exposed surface on which the silica airgel-supporting fiber 102 and the silica airgel are exposed.

FIG. 3B is a view of the heat insulating material 101 of FIG. 3A viewed from the direction of arrow A. As shown in FIG. 3B, the support layer 301 is heat-welded at the support layer welding portion 301a corresponding to one side surface of the silica airgel-supported fiber 102, and the side surface of the silica airgel-supported fiber 102 is sealed. The support layer welded portion 301a is a portion where two support layers are welded (in other words, a portion where the ends of the support layers are welded to each other).

FIG. 3C is a sectional view taken along the line BB of FIG. 3B. As shown in FIG. 3C, the heat insulating material 101 has a bonding layer 302 of a support layer 301 and a silica airgel-supported fiber 102. Here, the bonding layer 302 is not arranged on the entire surface of the heat insulating material 101 (silica airgel-supported fiber 102), but is arranged in the depth direction in FIG. 3C. In other words, the binding layer 302 is arranged over the entire width direction of the silica airgel-supporting fiber 102 (the range indicated by the double-headed arrow a shown in FIG. 3B). As a result, the heat insulating material 101 is structurally strong because its surroundings are protected by the support layer welding portion 301a and the bonding layer 302. The width of the connecting layer 302 shown in FIG. 3C (the length in the left-right direction in the figure) is, for example, 10 mm.

Further, as shown in FIG. 3C, the bonding layer 302 exists at a part of the interface between the silica airgel-supported fiber 102 and the support layer 301.

The heat insulating material 101 is cut into an arbitrary shape after the formation of the bonding layer 302. FIG. 3D is a cross-sectional view of the heat insulating material 101 shown in FIGS. 3A to 3C after being cut (after being cut along the width direction of the heat insulating material 101). As shown in FIG. 3D, the heat insulating material 101 is cut at a position where the bonding layer 302 of the support layer 301 and the silica airgel-supported fiber 102 is present. Here, as an example, the heat insulating material 101 is cut at the center of the width of the bonding layer 302. As a result, the width of the bonding layer 302 after cutting is 5 mm. By cutting at the location where the bond layer 302 is present in this way, the bond between the support layer 301 and the silica airgel-supported fiber 102 is maintained. Therefore, the heat insulating material 101 after cutting can be used as a heat insulating material coated on the support layer 301, similarly to the heat insulating material 101 before cutting.

Further, as shown in FIG. 3D, the bonding layer 302 exists on the exposed surface. Further, as shown in FIG. 3D, the bonding layer 302 exists for a certain length from the exposed surface toward the inside of the heat insulating material 101 (in other words, along the longitudinal direction of the heat insulating material 101 from the exposed surface). .. The constant length is a length equal to or less than the thickness of the heat insulating material 101. Also, as shown in FIG. 3D, all or part of the coupling layer 302 faces the exposed surface.

Here, the support layer 301 uses a material having a melting point lower than that of the fibers constituting the silica airgel-supporting fiber 102. In the second embodiment, for example, polyethylene (melting point 115 to 135 ° C.) can be used as the material constituting the support layers 103a and 103b. Further, polyester (melting point 255 to 260 ° C.) can be used as the fiber constituting the silica airgel-supporting fiber 102. The selection of the materials constituting the support layers 103a and 103b and the silica airgel-supporting fiber 102 is not limited to the above, and various materials can be selected.

<Method of forming the bond layer 302>
Here, a method of forming the bond layer 302 shown in FIG. 3C will be described.

The bonding layer 302 is formed by applying pressure while heating at a temperature higher than the melting point of the support layer 103a and lower than the melting point of the fibers constituting the silica airgel-supported fiber 102.

For example, using an impulse sealer, the support layer 301 and the silica airgel-supported fibers 102 are heat-treated under pressure. As described above, in the second embodiment, polyethylene (melting point 115 to 135 ° C.) is used as the material constituting the support layer 301, and polyester (melting point 255 to 260 ° C.) is used as the fiber constituting the silica airgel-supported fiber 102. I'm using it. Therefore, the heating temperature is set to 180 ° C., the pressurizing pressure is set to 20 MPa, and heating and pressurizing are performed to form the bonding layer 302.

The above-mentioned heating conditions and pressurizing conditions are examples, and it is possible to form the bonding layer 302 in the same manner as described above even if other conditions are selected. However, it may need to be changed depending on the material used. Further, in the second embodiment, the case where an impulse sealer is used as a means for heating and pressurizing has been described as an example, but the present invention is not limited to this, and another means may be used.

<Effect of Embodiment 2>
As described above, according to the heat insulating material 101 of the second embodiment, the effect of the first embodiment described above can be obtained. Further, according to the heat insulating material 101 of the second embodiment, it is not necessary to form the bonding layer 302 on the entire surface of the heat insulating material 101, and the pressurizing equipment configuration can be simplified.

(Embodiment 3)
Embodiment 2 of the present invention will be described with reference to FIGS. 4A, 4B, 4C, and 4D. In the following description of the third embodiment, a configuration different from that of the second embodiment will be mainly described. Further, in FIG. 4, the same components as those in the second embodiment are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 4A is a perspective view of the heat insulating material 101 according to the third embodiment. As shown in FIG. 4A, the support layer 401 encloses the silica airgel-supported fibers 102. The surface of the heat insulating material 101 seen from the direction of the arrow C shown in FIG. 4A is an example of an exposed surface on which the silica airgel-supporting fiber 102 and the silica airgel are exposed.

4B is a view of the heat insulating material 101 of FIG. 4A as viewed from the direction of arrow C. As shown in FIG. 4B, the support layer 401a and the support layer 401b in the support layer 401 are laminated on the upper surface of the silica airgel-supported fiber 102. The support layer 401a and the support layer 401b are welded together and seal the two side surfaces of the silica airgel-supported fiber 102. As described above, in the third embodiment, the welded portion in the support layer 401 is planar and is located on the upper surface side or the lower surface side of the heat insulating material 101. The support layer 401a and the support layer 401b may be referred to as a "welded portion".

4C is a cross-sectional view taken along the line DD of FIG. 4B. As shown in FIG. 4C, the heat insulating material 101 has a bonding layer 302 of a support layer 401 and a silica airgel-supported fiber 102. Here, the bonding layer 302 is not arranged on the entire surface of the heat insulating material 101 (silica airgel-supported fiber 102), but is arranged in the depth direction in FIG. 4C. In other words, the binding layer 302 is arranged over the entire width direction of the silica airgel-supported fiber 102 (the range indicated by the double-headed arrow b shown in FIG. 4B). The width of the connecting layer 302 shown in FIG. 4C (the length in the left-right direction in the figure) is, for example, 10 mm.

Further, as shown in FIG. 4C, the bonding layer 302 exists at a part of the interface between the silica airgel-supported fiber 102 and the support layer 401 (support layer 401b).

4D is a cross-sectional view of the heat insulating material 101 shown in FIGS. 4A to 4C after being cut (after being cut along the width direction of the heat insulating material 101). As shown in FIG. 4D, the heat insulating material 101 is cut at a position where the bonding layer 302 of the support layer 401 and the silica airgel-supported fiber 102 is present. Here, as an example, the heat insulating material 101 is cut at the center of the width of the bonding layer 302. As a result, the width of the bonding layer 302 after cutting is 5 mm. By being cut at the position where the bond layer 302 is present in this way, the bond between the support layer 401 and the silica airgel-supported fiber 102 is maintained. Therefore, the heat insulating material 101 after cutting can be used as a heat insulating material coated on the support layer 401, similarly to the heat insulating material 101 before cutting.

Further, as shown in FIG. 4D, the bonding layer 302 exists on the exposed surface. Further, as shown in FIG. 4D, the bonding layer 302 exists for a certain length from the exposed surface toward the inside of the heat insulating material 101 (in other words, along the longitudinal direction of the heat insulating material 101 from the exposed surface). .. The constant length is a length equal to or less than the thickness of the heat insulating material 101. Also, as shown in FIG. 4D, all or part of the coupling layer 302 faces the exposed surface.

<Effect of Embodiment 3>
As described above, according to the heat insulating material 101 of the third embodiment, the effect of the first embodiment described above can be obtained. In particular, it can be used in a long shape in, for example, electronic equipment, precision equipment, cooling equipment, and the like.

<Summary of this disclosure>
The heat insulating material of the present disclosure has a fiber layer on which silica airgel is supported and a support layer arranged on at least one surface of the fiber layer, and the support layer penetrates into the fiber layer to obtain the above-mentioned. It has a binding layer in which the support layer and the fiber layer are bonded.

In the heat insulating material of the present disclosure, the melting point of the support layer may be lower than the melting point of the fiber layer.

Further, in the heat insulating material of the present disclosure, there may be an exposed surface on which the fiber layer and the silica airgel are exposed on at least one surface at the end portion of the heat insulating material in the plane direction.

Further, in the heat insulating material of the present disclosure, the bonding layer may be present at a part of the interface between the fiber layer and the support layer.

Further, in the heat insulating material of the present disclosure, the bonding layer may be present on the exposed surface.

Further, in the heat insulating material of the present disclosure, the bonding layer may exist for a certain length from the exposed surface toward the inside of the heat insulating material.

Further, in the heat insulating material of the present disclosure, the constant length may be a length equal to or less than the thickness of the heat insulating material.

Further, in the heat insulating material of the present disclosure, all or a part of the bonding layer may face the exposed surface.

Further, in the heat insulating material of the present disclosure, one of the support layers may enclose the fiber layer and may have a welded portion in which the ends of the one support layer are welded to each other.

Further, in the heat insulating material of the present disclosure, one support layer encloses the fiber layer, the one support layer is laminated on one surface of the fiber layer, and the laminated support layers are welded to each other. It may have a welded portion.

Further, in the heat insulating material of the present disclosure, the welded portion and the bonding layer may be present around the heat insulating material.

The heat insulating material of the present invention simplifies the process for preventing contamination of the surrounding area due to the falling off of silica airgel, and can be used in large sizes and complicated shapes. It can also be applied to heat insulation of large equipment.

101, 601 Insulation material 102 Silica airgel-supporting fiber 103a, 103b, 301, 401, 401a, 401b, 604a, 604b Support layer 104, 302 Bonding layer 201a, 201b, 201c, 201d Insulation material after cutting 301a Support layer Welding part 501 Silica primary particles 502 Silica secondary particles 503 Voids 602 Silica airgel 603 Non-woven fabric 605 Graphite sheet

Claims (11)

A non-woven fabric made of fibers and a fiber layer having silica airgel supported on the entire surface and the entire thickness of the non-woven fabric .
It has a support layer arranged on at least one surface of the fiber layer, and has.
The support layer has a bonding layer in which the support layer and the fiber layer are bonded by entering the fiber layer.
Insulation material. The melting point of the support layer is lower than the melting point of the fiber .
The heat insulating material according to claim 1. At the planar end of the insulation, there is an exposed surface on at least one surface where the fibers and the silica airgel are exposed.
The heat insulating material according to claim 1 or 2. The binding layer exists at a part of the interface between the fiber layer and the support layer.
The heat insulating material according to any one of claims 1 to 3. The bonding layer is present on the exposed surface.
The heat insulating material according to claim 3. The bonding layer exists for a certain length from the exposed surface toward the inside of the heat insulating material.
The heat insulating material according to claim 5. The constant length is a length equal to or less than the thickness of the heat insulating material.
The heat insulating material according to claim 6. All or part of the bonding layer faces the exposed surface.
The heat insulating material according to any one of claims 5 to 7. One of the support layers encloses the fiber layer and
It has a welded portion in which the ends of the one support layer are welded to each other.
The heat insulating material according to any one of claims 1 to 8. One support layer encloses the fiber layer and is laminated on one surface of the fiber layer.
It has a welded portion in which the laminated support layers are welded to each other.
The heat insulating material according to any one of claims 1 to 8. The welded portion and the bonding layer exist around the heat insulating material.
The heat insulating material according to claim 9 or 10.

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