JP7036573B2 - Laser processing jig - Google Patents

Laser processing jig Download PDF

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JP7036573B2
JP7036573B2 JP2017214285A JP2017214285A JP7036573B2 JP 7036573 B2 JP7036573 B2 JP 7036573B2 JP 2017214285 A JP2017214285 A JP 2017214285A JP 2017214285 A JP2017214285 A JP 2017214285A JP 7036573 B2 JP7036573 B2 JP 7036573B2
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base
pillar
pillar member
laser processing
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JP2019084558A (en
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陽平 小室
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Sumitomo Heavy Industries Ltd
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本発明は、レーザー加工用治具に関し、特に汎用性を高めることができるレーザー加工用治具に関するものである。 The present invention relates to a jig for laser processing, and more particularly to a jig for laser processing that can enhance versatility.

板状の被加工物をレーザー光により切断して個片化する技術が知られている。特許文献1には、被加工物が載置される面に、レーザー光による切断予定線に沿って溝が形成された治具が開示される。この治具によれば、溝(切断予定線)に沿ってレーザー光が掃引されることで、被加工物が切断され、個片化される。この場合、被加工物を通過したレーザー光を溝により受けることができるので、溝の底面や側面にレーザー光が到達したとしても、ビーム径が広がったエネルギー密度が低い状態として、治具が損傷することを抑制できる。 A technique is known in which a plate-shaped workpiece is cut by a laser beam to be individualized. Patent Document 1 discloses a jig in which a groove is formed on the surface on which the workpiece is placed along a planned cutting line by a laser beam. According to this jig, the work piece is cut and individualized by sweeping the laser beam along the groove (planned cutting line). In this case, since the laser beam that has passed through the workpiece can be received by the groove, even if the laser beam reaches the bottom surface or the side surface of the groove, the jig is damaged because the beam diameter is widened and the energy density is low. Can be suppressed.

WO2013/100149(段落0043,0047)WO2013 / 100149 (paragraphs 0043, 0047)

しかしながら、上述した従来の技術では、レーザー光による切断予定線(即ち、個片化する形状)に沿って溝が形成されているため、個片化する形状が異なる場合には、新たに治具を製造する必要があり、汎用性が低いという問題点があった。 However, in the above-mentioned conventional technique, since the groove is formed along the planned cutting line by the laser beam (that is, the shape to be individualized), if the shape to be individualized is different, a new jig is used. There was a problem that the versatility was low because it was necessary to manufacture the laser.

本発明は、上述した問題点を解決するためになされたものであり、汎用性を高めることができるレーザー加工用治具を提供することを目的としている。 The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a laser machining jig capable of increasing versatility.

この目的を達成するために本発明のレーザー加工用治具は、レーザー光により切断される被加工物を保持するものであり、ベース台と、そのベース台から立設され上面に前記被加工物の下面が載置される複数の柱部材と、前記被加工物を前記ベース台または前記柱部材に保持する保持手段と、を備え、前記柱部材が前記ベース台に対して着脱可能に構成され、前記柱部材の上面には、凹部が凹設され、前記柱部材は、前記凹部に配設され弾性材料から構成される保護部材を備え、前記柱部材の上面に載置された前記被加工物の下面が前記保護部材に当接される。 In order to achieve this object, the laser processing jig of the present invention holds a work piece to be cut by laser light , and is erected from a base base and the base base and has the work piece on the upper surface. A plurality of pillar members on which the lower surface of the pillar member is placed, and a holding means for holding the workpiece on the base base or the pillar member, and the pillar member is configured to be detachable from the base base. A recess is recessed in the upper surface of the pillar member, and the pillar member is provided with a protective member disposed in the recess and made of an elastic material, and is placed on the upper surface of the pillar member. The lower surface of the object is in contact with the protective member .

請求項1記載のレーザー加工用治具によれば、ベース台と、そのベース台から立設され上面に被加工物の下面が載置される複数の柱部材と、被加工物をベース台または柱部材に保持する保持手段と、を備えるので、隣接する柱部材の間の空間を、被加工物を通過したレーザー光を受ける溝として機能させることができる。 According to the laser processing jig according to claim 1, the base base, a plurality of pillar members erected from the base base and the lower surface of the work piece is placed on the upper surface, and the work piece are the base base or the work piece. Since the holding means for holding the column member is provided, the space between the adjacent column members can function as a groove for receiving the laser beam that has passed through the workpiece.

この場合、柱部材がベース台に対して着脱可能に構成されるので、例えば、柱部材の配置を変更する、或いは、柱部材の大きさや形状を変更することで、隣接する柱部材の間の空間(溝)を、レーザー光による切断予定線(即ち、個片化する形状)に対応させることができる。よって、個片化する形状が異なる場合であっても、新たにレーザー加工用治具を製造することなく対応できる。即ち、汎用性を高めることができる。 In this case, since the pillar members are configured to be removable from the base, for example, by changing the arrangement of the pillar members or changing the size and shape of the pillar members, the space between the adjacent pillar members can be changed. The space (groove) can correspond to the planned cutting line (that is, the shape to be individualized) by the laser beam. Therefore, even if the shape to be individualized is different, it can be dealt with without manufacturing a new laser processing jig. That is, the versatility can be enhanced.

また、被加工物を通過したレーザー光により柱部材またはベース台が損傷したとしても、レーザー加工用治具全体を交換する必要がなく、損傷した部品(柱部材またはベース台)のみを交換することができる。
更に、柱部材の上面には、凹部が凹設され、柱部材は、凹部に配設され弾性材料から構成される保護部材を備え、柱部材の上面に載置された被加工物の下面が保護部材に当接されるので、被加工物の下面における所定領域(保護部材が当接された領域)に、被加工物の切断によって発生するスパッタやドロス等が付着することを抑制できる。また、保護部材の厚み寸法を確保して、被加工物の下面に密着させやすくしつつ、かかる保護部材の側面を凹部の側壁により遮蔽して、被加工物の切断によって発生するスパッタやドロス等が保護部材の側面に付着することを抑制できる。
Even if the pillar member or base base is damaged by the laser light that has passed through the workpiece, it is not necessary to replace the entire laser machining jig, and only the damaged parts (pillar member or base base) should be replaced. Can be done.
Further, a recess is recessed in the upper surface of the column member, the column member is provided with a protective member disposed in the recess and made of an elastic material, and the lower surface of the workpiece placed on the upper surface of the column member is. Since it is in contact with the protective member, it is possible to prevent spatter, dross, and the like generated by cutting the workpiece from adhering to a predetermined region (the region with which the protective member is abutted) on the lower surface of the workpiece. Further, while ensuring the thickness dimension of the protective member and making it easy to adhere to the lower surface of the workpiece, the side surface of the protective member is shielded by the side wall of the concave portion, and spatter, dross, etc. generated by cutting the workpiece, etc. Can be prevented from adhering to the side surface of the protective member.

請求項2記載のレーザー加工用治具によれば、請求項1記載のレーザー加工用治具の奏する効果に加え、ベース台には、複数の凹部が形成され、柱部材は、その凹部に対して着脱可能に構成される。よって、凹部の位置により、ベース台上に柱部材を配置する位置を容易に認識することができる。これにより、レーザー加工用治具の構築をより容易とできる。 According to the second aspect of the laser processing jig, in addition to the effect of the laser processing jig according to the first aspect, a plurality of recesses are formed in the base base, and the pillar member is formed on the recesses. It is configured to be removable. Therefore, the position where the pillar member is arranged on the base base can be easily recognized by the position of the recess. This makes it easier to construct a laser machining jig.

請求項3記載のレーザー加工用治具によれば、請求項2記載のレーザー加工用治具の奏する効果に加え、凹部には、貫通孔が貫通形成され、柱部材の下面には、ねじが締結可能とされる締結孔が形成され、凹部の貫通孔に挿通されたねじが柱部材の締結孔に締結されることで、柱部材がベース台に対して着脱可能に構成されるので、着脱可能とするための構造を簡素化して、製品コストを低減できる。また、柱部材の交換を容易とできる。 According to the laser processing jig according to the third aspect, in addition to the effect of the laser processing jig according to the second aspect, a through hole is formed through the recess and a screw is formed on the lower surface of the pillar member. A fastening hole that can be fastened is formed, and the screw inserted through the through hole of the recess is fastened to the fastening hole of the pillar member, so that the pillar member can be attached to and detached from the base base. The structure to enable it can be simplified and the product cost can be reduced. In addition, the pillar members can be easily replaced.

請求項4記載のレーザー加工用治具によれば、請求項2又は3に記載のレーザー加工用治具の奏する効果に加え、保持手段は、上面に被加工物が保持される保持部材を備え、保持部材の下面には、ねじが締結可能とされる締結孔が形成され、凹部には、貫通孔が貫通形成され、その凹部の貫通孔に挿通されたねじが保持部材の締結孔に締結されることで、保持部材がベース台に対して着脱可能に構成されるので、被加工物の大きさに応じて保持部材の配置(被加工物の保持位置)を変更することができる。よって、被加工物を適正な状態で保持できる。 According to the laser processing jig according to claim 4, in addition to the effect of the laser processing jig according to claim 2 or 3, the holding means includes a holding member on the upper surface for holding the workpiece. , A fastening hole to which a screw can be fastened is formed on the lower surface of the holding member, a through hole is formed through the recess, and a screw inserted through the through hole of the recess is fastened to the fastening hole of the holding member. By doing so, the holding member is configured to be detachable from the base base, so that the arrangement of the holding member (holding position of the workpiece) can be changed according to the size of the workpiece. Therefore, the work piece can be held in an appropriate state.

また、凹部の貫通孔を、柱部材と保持部材とで共用できるので、保持部材をベース台に対して着脱可能とするための構成を別途設けることを不要とできる。よって、その分、製品コストを低減できる。 Further, since the through hole of the recess can be shared by the pillar member and the holding member, it is not necessary to separately provide a configuration for attaching and detaching the holding member to the base base. Therefore, the product cost can be reduced accordingly.

(a)は、レーザー加工用治具の上面図であり、(b)は、Ib-Ib断面線におけるレーザー加工用治具の断面図である。(A) is a top view of the laser processing jig, and (b) is a cross-sectional view of the laser processing jig in the Ib-Ib cross-sectional line. レーザー加工時におけるレーザー加工用治具の断面図である。It is sectional drawing of the jig for laser processing at the time of laser processing. ワークの切断経路を模式的に示した図である。It is a figure which showed the cutting path of a work schematically. 様々な柱部材を持つレーザー加工用治具を表す図である。It is a figure which shows the jig for laser processing which has various pillar members. レーザー光の照射位置をくり抜いたレーザー加工用治具を表す図である。It is a figure which shows the jig for laser processing which hollowed out the irradiation position of a laser beam.

以下、本発明の好ましい実施形態について、添付図面を参照して説明する。まず、図1を参照して、本実施形態のレーザー加工用治具1の概要を説明する。図1(a)は、レーザー加工用治具1の上面図であり、図1(b)は、Ib-Ib断面線におけるレーザー加工用治具1の断面図である。 Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. First, the outline of the laser processing jig 1 of the present embodiment will be described with reference to FIG. 1 (a) is a top view of the laser processing jig 1, and FIG. 1 (b) is a cross-sectional view of the laser processing jig 1 in the cross-sectional line of Ib-Ib.

本実施形態におけるレーザー加工用治具1は、被加工物であるステンレス製のワーク5(図2参照)を載置し、その上方からレーザー光Lを照射することでワーク5を切断し、所望の個片化形状8(図3参照)を得るための治具である。レーザー加工用治具1は、ベース台2と、複数の柱部材3と、ワーク固定具4とを有する。 In the laser processing jig 1 in the present embodiment, a stainless steel work 5 (see FIG. 2), which is a workpiece, is placed, and the work 5 is cut by irradiating the laser light L from above the work 5 as desired. It is a jig for obtaining the individualized shape 8 (see FIG. 3). The laser processing jig 1 has a base base 2, a plurality of pillar members 3, and a work fixing tool 4.

ベース台2は、後述の柱部材3及びワーク固定具4を立設するためのアルミニウム製の板状の部材である。ベース台2には、柱部材3及びワーク固定具4をねじ止めするための複数の貫通孔2a(凹部)が、縦横に対し等間隔に貫通形成される。この貫通孔2aの位置により、ベース台2上に柱部材3及びワーク固定具4を配置する位置を容易に認識することができる。 The base base 2 is an aluminum plate-shaped member for erection of the pillar member 3 and the work fixture 4, which will be described later. A plurality of through holes 2a (recesses) for screwing the pillar member 3 and the work fixture 4 are formed through the base base 2 at equal intervals in the vertical and horizontal directions. From the position of the through hole 2a, the position where the pillar member 3 and the work fixing tool 4 are arranged on the base base 2 can be easily recognized.

ベース台2上に配置された柱部材3及びワーク固定具4は、貫通孔2aからねじ6でねじ止めすることによってベース台2に固定される。貫通孔2aには、ねじ6のねじ頭の高さ分の座繰加工が施されているので、ねじ頭をベース台2に埋設させるとともに、ねじ6による固定を確実に行うことができる。 The pillar member 3 and the work fixture 4 arranged on the base base 2 are fixed to the base base 2 by screwing from the through hole 2a with a screw 6. Since the through hole 2a is countersunk for the height of the screw head of the screw 6, the screw head can be embedded in the base base 2 and can be reliably fixed by the screw 6.

本実施形態において、ベース台2の大きさは縦120mm,横120mmが例示され、貫通孔2aの穿孔間隔は縦方向・横方向共に5mmが例示される。なお、ベース台2はアルミニウム製に限られるものではなく、鋼等、貫通孔2aの穿孔が可能で、レーザー光Lの照射によるベース台2の損傷や融解、熱変形が生じにくい材料を適宜適用しても良い。 In the present embodiment, the size of the base base 2 is exemplified by 120 mm in length and 120 mm in width, and the drilling interval of the through hole 2a is exemplified by 5 mm in both the vertical direction and the horizontal direction. The base base 2 is not limited to aluminum, and a material such as steel that can drill through holes 2a and is less likely to be damaged, melted, or thermally deformed by irradiation with laser light L is appropriately applied. You may.

柱部材3は、ベース台2上に立設され、ワーク5が載置される柱状の部材である。柱部材3は、支持部材3aと、支持部材3aの上面に凹設された凹部3bと、その凹部3bに配設される保護部材3cと、支持部材3aの下面に配設され柱部材3をベース台2に締結するための締結孔3dとで構成される。 The pillar member 3 is a pillar member that is erected on the base base 2 and on which the work 5 is placed. The pillar member 3 includes a support member 3a, a recess 3b recessed in the upper surface of the support member 3a, a protective member 3c disposed in the recess 3b, and a pillar member 3 disposed in the lower surface of the support member 3a. It is composed of a fastening hole 3d for fastening to the base base 2.

支持部材3aは、その上面視の形状がワーク5の個片化形状8(図3参照)に準じた形状を持つ、鋼製の柱状の部材である。本実施形態におけるワーク5の個片化形状8は、矩形における4つの頂点を円弧によって切り落とした形状であり、支持部材3aの上面視の形状は、かかる個片化形状8に内接する矩形で形成される。柱部材3上に載置されたワーク5を、隣接する支持部材3aの間に対してレーザー光Lを照射して切断することで、ワーク5から個片化形状8を得る。 The support member 3a is a steel columnar member having a shape similar to the individualized shape 8 (see FIG. 3) of the work 5 when viewed from above. The individualized shape 8 of the work 5 in the present embodiment is a shape in which four vertices of the rectangular shape are cut off by an arc, and the shape of the support member 3a viewed from above is formed by a rectangular shape inscribed in the individualized shape 8. Will be done. The work 5 placed on the pillar member 3 is cut by irradiating the space between the adjacent support members 3a with the laser beam L to obtain an individualized shape 8 from the work 5.

また、支持部材3aの下面は平坦とされる。これにより、柱部材3をベース台2上に対して、垂直に立設させることができる。なお、支持部材3aは鋼製に限られるものではなく、セラミックやアルミニウム等、レーザー光Lによる損傷や融解、熱変形が生じにくい材料を適宜適用する構成としても良い。 Further, the lower surface of the support member 3a is made flat. As a result, the pillar member 3 can be erected vertically with respect to the base base 2. The support member 3a is not limited to steel, and may be configured to appropriately apply a material such as ceramic or aluminum that is less likely to be damaged, melted, or thermally deformed by the laser beam L.

保護部材3cは、凹部3bに配設され、レーザー加工用治具1に固定されたワーク5を保護するための合成ゴム製の部材である。凹部3b及び保護部材3cの上面視における形状は、支持部材3aの上面視における形状と同一とされる。また凹部3b及び保護部材3cの上面視における大きさは、支持部材3aの上面視における大きさより小さく、なおかつワーク5の微細な加工部(具体的には、図2で後述の孔5a,5b)を塞ぐ程度とされる。これにより、詳細は後述するが、保護部材3cとワーク5の微細な加工部とが密着されるので、レーザー光Lをワーク5に照射した場合に生じる、スパッタSやドロスD等(図2参照)、ワーク5の溶解物質による汚染から、ワーク5の微細な加工部を保護することができる。 The protective member 3c is a member made of synthetic rubber, which is arranged in the recess 3b and for protecting the work 5 fixed to the laser processing jig 1. The shape of the recess 3b and the protective member 3c in the top view is the same as the shape of the support member 3a in the top view. Further, the size of the recess 3b and the protective member 3c in the top view is smaller than the size of the support member 3a in the top view, and the finely processed portion of the work 5 (specifically, the holes 5a and 5b described later in FIG. 2). It is said to close the. As a result, although details will be described later, since the protective member 3c and the finely processed portion of the work 5 are brought into close contact with each other, spatter S, dross D, etc. (see FIG. 2) that occur when the work 5 is irradiated with the laser beam L (see FIG. 2). ), It is possible to protect the finely processed portion of the work 5 from contamination by the dissolved substance of the work 5.

さらに、保護部材3cの高さは、凹部3bの側面視における高さ(深さ)より大きく、なおかつワーク5をレーザー加工用治具1に取り付けた際に、保護部材3cが弾性変形しても、ワーク5が支持部材3aに当接しない程度の高さとされる。従って、保護部材3cの側面の一部は、凹部3bの側壁に遮蔽される。なお、保護部材3cは、合成ゴム製に限られるものではなく、天然ゴムやシリコン・ゲル、再利用可能な両面テープ等、弾性を持ち、ワーク5と密着するものであれば適宜適用される。 Further, the height of the protective member 3c is larger than the height (depth) in the side view of the recess 3b, and even if the protective member 3c is elastically deformed when the work 5 is attached to the laser machining jig 1. The height is set so that the work 5 does not come into contact with the support member 3a. Therefore, a part of the side surface of the protective member 3c is shielded by the side wall of the recess 3b. The protective member 3c is not limited to that made of synthetic rubber, and is appropriately applied as long as it has elasticity and is in close contact with the work 5, such as natural rubber, silicon gel, and reusable double-sided tape.

締結孔3dは、柱部材3とベース台2とを、着脱可能にねじ止めするためのねじ穴である。柱部材3をベース台2上に配設し、貫通孔2aから挿入したねじ6を、締結孔3dにねじ止めすることで、ベース台2と柱部材3とが締結される。これにより、着脱可能とするための構造を簡素化することができるので、製品コストを低減でき、また柱部材3の交換を容易とできる。 The fastening hole 3d is a screw hole for detachably screwing the pillar member 3 and the base base 2. The pillar member 3 is arranged on the base base 2, and the screw 6 inserted from the through hole 2a is screwed into the fastening hole 3d to fasten the base base 2 and the pillar member 3. As a result, the structure for making the pillar member removable can be simplified, so that the product cost can be reduced and the pillar member 3 can be easily replaced.

柱部材3の高さ、即ち支持部材3aの下面から保護部材3cの上面までの高さは、柱部材3上に載置されたワーク5上から照射されたレーザー光Lによって、ベース台2が破損しない程度の高さとされ、50mmが例示される。 The height of the pillar member 3, that is, the height from the lower surface of the support member 3a to the upper surface of the protective member 3c is determined by the laser light L emitted from the work 5 placed on the pillar member 3 to cause the base base 2 to be set. The height is set so as not to be damaged, and 50 mm is exemplified.

ワーク固定具4は、ベース台2上に立設され、レーザー加工用治具1にワーク5を固定するための柱状の部材であり、ワーク5に穿設された固定用孔(図示せず)と一致する位置に、それぞれ立設される。ワーク固定具4は、支持部材4aと、支持部材4aの上面に配設されるワーク固定孔4bと、支持部材4aの下面に配設される締結孔4cとで構成される。 The work fixture 4 is a columnar member that is erected on the base base 2 and for fixing the work 5 to the laser processing jig 1, and is a fixing hole (not shown) formed in the work 5. It is erected at the position corresponding to. The work fixture 4 is composed of a support member 4a, a work fixing hole 4b arranged on the upper surface of the support member 4a, and a fastening hole 4c arranged on the lower surface of the support member 4a.

支持部材4aは、ベース台2にワーク5を支持するための柱状の部材である。支持部材4aの上面および下面は平坦とされる。これにより、ワーク固定具4をベース台2に対して、垂直に立設させることができ、また支持部材4a上に固定されたワーク5を、ベース台2に対して平行に支持することができる。 The support member 4a is a columnar member for supporting the work 5 on the base base 2. The upper and lower surfaces of the support member 4a are flat. As a result, the work fixture 4 can be erected vertically with respect to the base base 2, and the work 5 fixed on the support member 4a can be supported in parallel with the base base 2. ..

ワーク固定孔4bは、レーザー加工用治具1上に載置したワーク5を、取付ねじ7(図2参照)で固定するためのねじ穴である。ワーク5の固定用孔から挿入した取付ねじ7を、ワーク固定孔4bにねじ止めすることで、ワーク5とワーク固定具4とが固定される。 The work fixing hole 4b is a screw hole for fixing the work 5 placed on the laser processing jig 1 with the mounting screw 7 (see FIG. 2). The work 5 and the work fixing tool 4 are fixed by screwing the mounting screw 7 inserted from the fixing hole of the work 5 into the work fixing hole 4b.

締結孔4cは、ワーク固定具4とベース台2とを、着脱可能にねじ止めするためのねじ穴である。ワーク固定具4をベース台2上に配設し、ねじ6を貫通孔2aから挿入して締結孔4cにねじ止めすることで、ベース台2とワーク固定具4とが締結される。これにより、ワーク5の大きさに応じて、ワーク固定具4の配置やワーク5の保持位置を変更することができるので、ワーク5を適正な状態で保持することができる。 The fastening hole 4c is a screw hole for detachably screwing the work fixing tool 4 and the base base 2. The work fixture 4 is arranged on the base base 2, and the screw 6 is inserted through the through hole 2a and screwed into the fastening hole 4c to fasten the base base 2 and the work fixture 4. As a result, the arrangement of the work fixture 4 and the holding position of the work 5 can be changed according to the size of the work 5, so that the work 5 can be held in an appropriate state.

また柱部材3及びワーク固定具4の立設に際し、ベース台2の貫通孔2aを、柱部材3の締結孔3dとワーク固定具4の締結孔4cとで共用できるので、ワーク固定具4用に貫通孔を穿設したり、ねじ6を用意する必要がなく、その分製品コストを低減できる。 Further, when the pillar member 3 and the work fixing tool 4 are erected, the through hole 2a of the base base 2 can be shared by the fastening hole 3d of the pillar member 3 and the fastening hole 4c of the work fixing tool 4, so that the work fixing tool 4 can be used. It is not necessary to make a through hole in the hole or prepare a screw 6, and the product cost can be reduced accordingly.

ワーク固定具4の高さは、ワーク5をワーク固定具4によって固定した場合に、柱部材3の保護部材3cとワーク5の下面とが当接し、保護部材3cが弾性変形しつつも、ワーク5の下面が、柱部材3の支持部材3aの上面と当接しない程度の高さとされ、48mmが例示される。これにより、ワーク固定具4によってレーザー加工用治具1に固定されたワーク5は、支持部材3aによって損傷されることなく、ワーク5の下面をスパッタSやドロスD等から、適切に保護することができる。 The height of the work fixing tool 4 is such that when the work 5 is fixed by the work fixing tool 4, the protective member 3c of the pillar member 3 and the lower surface of the work 5 come into contact with each other, and the protective member 3c is elastically deformed while the work is deformed. The lower surface of the pillar member 3 is set to a height such that the lower surface does not come into contact with the upper surface of the support member 3a of the pillar member 3, and 48 mm is exemplified. As a result, the work 5 fixed to the laser machining jig 1 by the work fixture 4 is not damaged by the support member 3a, and the lower surface of the work 5 is appropriately protected from spatter S, dross D, and the like. Can be done.

以上より、本実施形態におけるレーザー加工用治具1は、個片化形状8の位置や数またはワーク5の形状に応じて、ベース台2に柱部材3及びワーク固定具4を着脱可能にねじ止めすることで、ワーク5を切断するための「型」として構成される。よって、個片化形状8の位置や数またはワーク5の形状の個々に応じた型を作成する必要がないので、製品コストを低減できる。また、柱部材3及びワーク固定具4を、貫通孔2aにねじ止めするだけで良いので、短時間で所望の型を構成することができる。 From the above, in the laser processing jig 1 of the present embodiment, the pillar member 3 and the work fixing tool 4 are detachably screwed to the base base 2 according to the position and number of the individualized shapes 8 or the shape of the work 5. By stopping, it is configured as a "mold" for cutting the work 5. Therefore, it is not necessary to create a mold corresponding to the position and number of the individualized shapes 8 or the shape of the work 5, so that the product cost can be reduced. Further, since it is only necessary to screw the column member 3 and the work fixing tool 4 into the through hole 2a, a desired mold can be formed in a short time.

次に、図2を参照して、レーザー加工用治具1を用いて、レーザー光によりワーク5を個片化形状8に切断する場合について説明する。図2は、レーザー加工時におけるレーザー加工用治具1の断面図である。図2に示す通り、柱部材3をベース台2上における個片化形状8に該当する位置に配置し、ワーク固定具4をベース台2上におけるワーク5の固定用孔に該当する位置に配置し、柱部材3及びワーク固定具4をねじ6でねじ止めされて構成されたレーザー加工用治具1に対して、ワーク5を載置し、ワーク5の固定用孔と、ワーク固定具4とを取付ねじ7でねじ止めすることで、レーザー加工用治具1とワーク5とが固定される。そして、レーザー加工用治具1とワーク5とを、レーザー加工機内における、加工対象物を載置するためのステージST上に配置する。 Next, with reference to FIG. 2, a case where the work 5 is cut into the individualized shape 8 by the laser beam using the laser processing jig 1 will be described. FIG. 2 is a cross-sectional view of the laser processing jig 1 during laser processing. As shown in FIG. 2, the pillar member 3 is arranged on the base base 2 at a position corresponding to the individualized shape 8, and the work fixture 4 is arranged at a position corresponding to the fixing hole of the work 5 on the base base 2. Then, the work 5 is placed on the laser processing jig 1 configured by screwing the pillar member 3 and the work fixing tool 4 with screws 6, and the fixing hole of the work 5 and the work fixing tool 4 are placed. The laser processing jig 1 and the work 5 are fixed by screwing and with the mounting screw 7. Then, the laser processing jig 1 and the work 5 are arranged on the stage ST on which the object to be processed is placed in the laser processing machine.

そして、レーザー加工用治具1及びワーク5上の加工ヘッドHから、隣接する柱部材3の間に対してレーザー光Lを照射することで、ワーク5の切断を行う。よって、隣接する柱部材3の間の空間を、ワーク5を通過したレーザー光Lを受ける「溝」として機能させることができる。 Then, the work 5 is cut by irradiating the space between the adjacent pillar members 3 with the laser light L from the processing head H on the laser processing jig 1 and the work 5. Therefore, the space between the adjacent pillar members 3 can function as a "groove" that receives the laser beam L that has passed through the work 5.

さて、本実施形態におけるワーク5の個片化形状8のそれぞれには、微細な孔5a,5bが開孔されている。ワーク5の切断加工中には、ワーク5をレーザー光Lで照射することによって生じるスパッタSやドロスD、粉塵等がワーク5に付着してしまう。これらスパッタSやドロスD、粉塵が孔5a,5bの内部に付着してしまうと、これらを除去することは困難である。 By the way, fine holes 5a and 5b are opened in each of the individualized shapes 8 of the work 5 in the present embodiment. During the cutting process of the work 5, spatter S, dross D, dust and the like generated by irradiating the work 5 with the laser beam L adhere to the work 5. If the spatter S, dross D, and dust adhere to the inside of the holes 5a and 5b, it is difficult to remove them.

そこで、本実施形態におけるレーザー加工用治具1の柱部材3には、保護部材3cが設けられ、その保護部材3cは、孔5a,5bを塞ぐ位置に配設される。さらに、ワーク5をワーク固定具4によってレーザー加工用治具1に固定した場合には、ワーク5の下面と保護部材3cとが密着し、孔5a,5bが保護部材3cによって塞がれる。これにより、レーザー光Lをワーク5に照射することで生じるスパッタSやドロスD、粉塵等が孔5a,5bの内部に付着するのを抑制できる。 Therefore, the pillar member 3 of the laser processing jig 1 in the present embodiment is provided with a protective member 3c, and the protective member 3c is arranged at a position that closes the holes 5a and 5b. Further, when the work 5 is fixed to the laser machining jig 1 by the work fixing tool 4, the lower surface of the work 5 and the protective member 3c are in close contact with each other, and the holes 5a and 5b are closed by the protective member 3c. As a result, it is possible to prevent spatter S, dross D, dust and the like generated by irradiating the work 5 with the laser beam L from adhering to the inside of the holes 5a and 5b.

また、保護部材3cは凹部3bに配設されるので、支持部材3aの高さが同一であれば、凹部3bが凹設されない場合と比較して、保護部材3cの高さ(厚さ)を大きく確保することができる。ワーク5をレーザー加工用治具1に固定した場合に、ワーク5の寸法公差や歪み、支持部材3a,4aの個体差により、ワーク5と支持部材3aとが接近することで、保護部材3cに過度の押圧がかかることがある。このような状態において、凹部3bが凹設されない場合では、保護部材3cの高さ(厚さ)が小さいので、保護部材3cの圧縮率が高くなる。従って、逆に保護部材3cからのワーク5に対する反発力が大きくなり、ワーク5が上面側に反ってしまう。これにより、かかるワーク5に対して、レーザー光により個片化形状8に切断しても、その切断後の形状が所望の形状からかけ離れたものとなったり、レーザー光による加工中に、反発力によって個片化形状8が誤って切断される等、ワーク5が破損してしまう虞がある。 Further, since the protective member 3c is arranged in the recess 3b, if the heights of the support members 3a are the same, the height (thickness) of the protective member 3c can be increased as compared with the case where the recess 3b is not recessed. It can be secured to a large extent. When the work 5 is fixed to the laser machining jig 1, the work 5 and the support member 3a come close to each other due to the dimensional tolerance and distortion of the work 5 and the individual differences of the support members 3a and 4a, so that the work 5 is attached to the protective member 3c. Excessive pressure may be applied. In such a state, when the recess 3b is not recessed, the height (thickness) of the protective member 3c is small, so that the compressibility of the protective member 3c is high. Therefore, on the contrary, the repulsive force from the protective member 3c to the work 5 becomes large, and the work 5 warps toward the upper surface side. As a result, even if the work 5 is cut into individualized shapes 8 by laser light, the shape after cutting may be far from the desired shape, or repulsive force may occur during processing by laser light. There is a risk that the work 5 will be damaged, such as the individualized shape 8 being accidentally cut.

これに対して、本実施形態においては、保護部材3cが凹部3bに配設されるので、保護部材3cの高さ(厚さ)を大きく確保することができる。これにより、ワーク5と支持部材3aとが接近した場合においても、保護部材3cの圧縮率が小さくなるので、ワーク5が上面側に反ることを抑制できる。即ち、ワーク5の寸法公差や歪み、支持部材3a,4aの個体差を、保護部材3cによって吸収することができる。 On the other hand, in the present embodiment, since the protective member 3c is arranged in the recess 3b, it is possible to secure a large height (thickness) of the protective member 3c. As a result, even when the work 5 and the support member 3a come close to each other, the compressibility of the protective member 3c becomes small, so that the work 5 can be prevented from warping toward the upper surface side. That is, the dimensional tolerances and distortions of the work 5 and individual differences of the support members 3a and 4a can be absorbed by the protective member 3c.

ここで、凹部3bが凹設されない場合においても、支持部材3aの高さを低くし、保護部材3cの高さを高くすることで、保護部材3cの高さ(厚さ)を確保することができる。しかし、かかる場合においては、保護部材3cが完全に外部に露出されているので、レーザー光Lをワーク5に照射した場合に生じる、スパッタSやドロスD等が保護部材3cに付着し、保護部材3cが損傷してしまう虞がある。 Here, even when the recess 3b is not recessed, the height (thickness) of the protective member 3c can be secured by lowering the height of the support member 3a and increasing the height of the protective member 3c. can. However, in such a case, since the protective member 3c is completely exposed to the outside, spatter S, dross D, etc. generated when the laser beam L is irradiated to the work 5 adhere to the protective member 3c, and the protective member There is a risk that 3c will be damaged.

これに対して、本実施形態においては、保護部材3cは凹部3bに配設されるので、保護部材3cの側面の一部が、凹部3bの側壁に遮蔽される。これにより、保護部材3cに対して、スパッタSやドロスD等が付着することが抑制できるので、保護部材3cの劣化を抑制できる。 On the other hand, in the present embodiment, since the protective member 3c is arranged in the recess 3b, a part of the side surface of the protective member 3c is shielded by the side wall of the recess 3b. As a result, it is possible to suppress the adhesion of spatter S, dross D, etc. to the protective member 3c, so that deterioration of the protective member 3c can be suppressed.

次に、図3を参照して、レーザー光Lによるワーク5の切断方法について説明する。図3は、ワーク5の切断経路(切断予定線)を模式的に示した図である。本実施形態においては、ワーク5上から隣接する柱部材3の間の空間に沿ってレーザー光Lを照射することで、ワーク5の切断を行う。その際に、ワーク5を個片化形状8毎に完全に切り離してしまうことも可能だが、個片化形状8毎に完全に切り離してしまうと、後の工程(例えば、洗浄や塗装等)では、切り離された個片化形状8をそれぞれ回収し、個別に処理を行わなければならないので、作業効率が著しく低下する。そこで本実施形態においては、1つの個片化形状8に対して、2箇所以上の接続点を設けることで、ワーク5を全て切り離さないようにする。 Next, a method of cutting the work 5 by the laser beam L will be described with reference to FIG. FIG. 3 is a diagram schematically showing a cutting route (planned cutting line) of the work 5. In the present embodiment, the work 5 is cut by irradiating the laser beam L from above the work 5 along the space between the adjacent pillar members 3. At that time, it is possible to completely separate the work 5 for each individualized shape 8, but if the work 5 is completely separated for each individualized shape 8, in a later process (for example, cleaning or painting). Since the separated individualized shapes 8 must be collected and individually processed, the work efficiency is significantly reduced. Therefore, in the present embodiment, the work 5 is not completely separated by providing two or more connection points for one pieced shape 8.

具体的には、1つの個片化形状8に対して、少なくとも2つの切断経路を設けてレーザー光Lを照射する。本実施形態においては2つの切断経路が設けられ、1つ目は、個片化形状8の角部であって、ワーク5における個片化形状8の外側の始点S1から、柱部材3に向かい、そのまま始点S1の対角側の終点E1まで柱部材3の側面を沿う切断経路L1である。もう一つは、終点E1に隣接し、ワーク5における個片化形状8の外側の始点S2から、柱部材3に向かい、そのまま始点S2の対角側の終点E2まで柱部材3の側面を沿う切断経路L2である。なお、それぞれ隣接する始点S1と終点E2,また始点S2と終点E2とはそれぞれ異なる位置とされる。 Specifically, at least two cutting paths are provided for one pieced shape 8 to irradiate the laser beam L. In the present embodiment, two cutting paths are provided, the first is a corner portion of the individualized shape 8, and the starting point S1 on the outside of the individualized shape 8 in the work 5 is directed toward the pillar member 3. It is a cutting path L1 along the side surface of the pillar member 3 to the end point E1 on the diagonal side of the start point S1 as it is. The other is adjacent to the end point E1 and runs along the side surface of the pillar member 3 from the outer start point S2 of the individualized shape 8 in the work 5 toward the pillar member 3 and directly to the diagonal end point E2 of the start point S2. It is a cutting path L2. It should be noted that the start point S1 and the end point E2, which are adjacent to each other, and the start point S2 and the end point E2 are set to different positions.

切断経路L1と切断経路L2とによって形成された領域が、個片化形状8となるが、始点S1と終点E2との間、および始点S2と終点E1との間の、2箇所の接続点によって、個片化形状8はワーク5に残ったままとなる。これにより、各個片化形状8は、ワーク5から完全に切り離されないので、切断加工の後の工程における作業効率が向上する。なお、本実施形態において、1つの個片化形状8に対して、接続点は2箇所に設けられる構成としたが、2箇所に限られるものではなく、1箇所でも良いし、3箇所以上でも良い。 The region formed by the cutting path L1 and the cutting path L2 becomes an individualized shape 8, but it is formed by two connection points between the start point S1 and the end point E2 and between the start point S2 and the end point E1. , The individualized shape 8 remains on the work 5. As a result, each pieced shape 8 is not completely separated from the work 5, so that the work efficiency in the process after the cutting process is improved. In addition, in this embodiment, the connection points are provided at two places for one pieced shape 8, but the connection points are not limited to two places, and may be one place or three or more places. good.

また、始点S1,S2はともに、ワーク5における個片化形状8の外側に設けられる。始点S1,S2をワーク5における個片化形状8の外側に設定するのは、レーザー光Lの出力開始時、特にレーザー光Lがワーク5を貫通するまでの間は、多くのスパッタSが発生し、そのスパッタSがワーク5に付着してしまうからである。そこで、始点S1,S2の位置を、ワーク5における個片化形状8の外側、即ち最終的には各個片化形状8とは切り離される位置に設定することで、各個片化形状8に対して、スパッタSの付着を抑制することができる。 Further, both the starting points S1 and S2 are provided on the outside of the individualized shape 8 in the work 5. The starting points S1 and S2 are set outside the individualized shape 8 in the work 5, because a large amount of spatter S is generated at the start of the output of the laser beam L, especially until the laser beam L penetrates the work 5. However, the spatter S adheres to the work 5. Therefore, by setting the positions of the starting points S1 and S2 to the outside of the individualized shape 8 in the work 5, that is, the position finally separated from each individualized shape 8, the individual individualized shape 8 is finally separated from the individual individualized shape 8. , Adhesion of spatter S can be suppressed.

以上説明した通り、本実施形態のレーザー加工用治具1は、ベース台2と、そのベース台2から立設される複数の柱部材3と、ワーク5をベース台2又は柱部材3に保持するワーク固定具4とが設けられる。よって、隣接する柱部材3の間の空間を、ワーク5を通過したレーザー光Lを受ける溝として機能させることができる。この場合、柱部材3がベース台2に対して着脱可能に構成されるので、例えば、柱部材3の配置を変更する、或いは、柱部材3の大きさや形状を変更することで、隣接する柱部材3の間の空間(溝)を、レーザー光による個片化形状8に対応させることができる。よって、個片化形状8が異なる場合であっても、新たにレーザー加工用治具1を製造することなく対応できる。即ち、汎用性を高めることができる。 As described above, the laser processing jig 1 of the present embodiment holds the base base 2, a plurality of pillar members 3 erected from the base base 2, and the work 5 on the base base 2 or the pillar member 3. A work fixing tool 4 is provided. Therefore, the space between the adjacent pillar members 3 can function as a groove for receiving the laser beam L that has passed through the work 5. In this case, since the pillar member 3 is configured to be detachable from the base base 2, for example, by changing the arrangement of the pillar member 3 or changing the size and shape of the pillar member 3, adjacent pillars are formed. The space (groove) between the members 3 can be made to correspond to the individualized shape 8 by the laser beam. Therefore, even if the individualized shapes 8 are different, it can be dealt with without newly manufacturing the laser processing jig 1. That is, the versatility can be enhanced.

また、ワーク5を通過したレーザー光Lにより柱部材3又はベース台2が損傷したとしても、レーザー加工用治具1を交換する必要がなく、柱部材3又はベース台2のみを交換することができる。 Further, even if the pillar member 3 or the base base 2 is damaged by the laser beam L passing through the work 5, it is not necessary to replace the laser processing jig 1, and only the pillar member 3 or the base base 2 can be replaced. can.

以上、実施形態に基づき本発明を説明したが、本発明は上述した実施形態に何ら限定されるものではなく、本発明の趣旨を逸脱しない範囲内で種々の改良変更が可能であることは容易に推察できるものである。 Although the present invention has been described above based on the embodiments, the present invention is not limited to the above-described embodiments, and it is easy that various improvements and changes can be made without departing from the spirit of the present invention. It can be inferred from.

上記実施形態に挙げた数値は一例であり、他の数値を採用することは当然可能である。 The numerical values given in the above embodiment are examples, and it is naturally possible to adopt other numerical values.

上記実施形態においては、レーザー加工用治具1をレーザー加工に用いるものとしたが、必ずしもこれに限られるものではない。NC工作機等、切断や穿孔を行う他の工作機械に対して適用しても良い。 In the above embodiment, the laser processing jig 1 is used for laser processing, but the present invention is not limited to this. It may be applied to other machine tools such as NC machine tools that perform cutting and drilling.

上記実施形態においては、柱部材3及びワーク固定具4を、ベース台2にねじ止めする構成としたが、必ずしもこれに限られるものではない。柱部材3及びワーク固定具4の底面に突起を設け、その突起をベース台2の貫通孔2aに差し込むことで、柱部材3及びワーク固定具4をベース台2上に配設する構成としても良い。また、ベース台2の貫通孔2aの代わりに、貫通形成されていない凹部を設け、柱部材3及びワーク固定具4の突起をその凹部に差し込むことで、柱部材3及びワーク固定具4をベース台2上に配設する構成としても良い。なお、この場合、突起、貫通孔2a及び凹部の断面形状は、矩形や十字型等、ベース台2上に配設された柱部材3及びワーク固定具4が回転する等、不安定な状態とならない形状とされるのが好ましい。 In the above embodiment, the column member 3 and the work fixture 4 are screwed to the base base 2, but the present invention is not limited to this. A protrusion is provided on the bottom surface of the pillar member 3 and the work fixing tool 4, and the protrusion is inserted into the through hole 2a of the base base 2, so that the pillar member 3 and the work fixing tool 4 are arranged on the base base 2. good. Further, instead of the through hole 2a of the base base 2, a recess that is not formed through is provided, and the protrusion of the pillar member 3 and the work fixing tool 4 is inserted into the recess to base the pillar member 3 and the work fixing tool 4. It may be configured to be arranged on the table 2. In this case, the cross-sectional shapes of the protrusions, through holes 2a, and recesses are in an unstable state, such as a rectangle or a cross shape, and the pillar member 3 and the work fixing tool 4 arranged on the base base 2 rotate. It is preferable that the shape is not formed.

上記実施形態においては、柱部材3が、凹部3bと保護部材3cとを有する構成としたが、必ずしもこれに限られるものではない。柱部材3から凹部3bと保護部材3cとを除いた構成としても良い。かかる場合においても、レーザー加工用治具1上に載置されたワーク5の孔5a,5bと、柱部材3の支持部材3aとが当接されるので、孔5a,5bへスパッタSやドロスD等が侵入するのを抑制できる。 In the above embodiment, the pillar member 3 has a recess 3b and a protective member 3c, but the present invention is not limited to this. The pillar member 3 may be configured by removing the recess 3b and the protective member 3c. Even in such a case, since the holes 5a and 5b of the work 5 placed on the laser processing jig 1 and the support member 3a of the pillar member 3 are in contact with each other, spatter S and dross are formed in the holes 5a and 5b. It is possible to suppress the invasion of D and the like.

上記実施形態においては、ワーク5の個片化形状8を矩形における4つの頂点を円弧で切り落とした形状とし、支持部材3aの上面視の形状を個片化形状8に内接する矩形としたが、必ずしもこれに限られるものではない。ワーク5の個片化形状8は、三角形等、様々な形状として構成されても良い。図4は、様々な柱部材3を持つレーザー加工用治具1を表す図である。図4に示す通り、柱部材3の形状は、矩形以外でも、三角形や星形、丸形等、様々な形状が適用可能である。また、レーザー加工用治具1に立設される柱部材3の形状は全て同一である必要はなく、様々な形状の柱部材3を混在して構成しても良い。 In the above embodiment, the individualized shape 8 of the work 5 is formed by cutting off four vertices of the rectangular shape by an arc, and the shape of the support member 3a viewed from above is formed into a rectangular shape inscribed in the individualized shape 8. It is not always limited to this. The individualized shape 8 of the work 5 may be configured as various shapes such as a triangle. FIG. 4 is a diagram showing a laser processing jig 1 having various pillar members 3. As shown in FIG. 4, as the shape of the pillar member 3, various shapes such as a triangle, a star, a circle, and the like can be applied other than the rectangle. Further, the shapes of the pillar members 3 erected on the laser processing jig 1 do not necessarily have to be the same, and the pillar members 3 having various shapes may be mixed and configured.

上記実施形態においては、柱部材3及びワーク固定具4の高さは、柱部材3及びワーク固定具4上から照射されたレーザー光Lによって、ベース台2が破損しない程度の高さに構成されるとした。これに加え、又はこれに代えて、柱部材3の支持部材3aと、支持部材4aとの高さを低くした上で、ベース台2における、レーザー光Lの照射位置をくり抜く構造としても良い。図5は、レーザー光Lの照射位置をくり抜いたレーザー加工用治具1を表す図である。図5に示す通り、ベース台2の柱部材3の立設位置の周囲における、貫通孔2a間に、矩形の溝2bがくり抜かれて設けられる。 In the above embodiment, the heights of the pillar member 3 and the work fixture 4 are configured to be such that the base base 2 is not damaged by the laser beam L emitted from the pillar member 3 and the work fixture 4. I said. In addition to this, or instead of this, the height of the support member 3a of the pillar member 3 and the support member 4a may be lowered, and then the irradiation position of the laser beam L on the base base 2 may be hollowed out. FIG. 5 is a diagram showing a laser processing jig 1 in which the irradiation position of the laser beam L is hollowed out. As shown in FIG. 5, a rectangular groove 2b is provided by hollowing out between the through holes 2a around the vertical position of the pillar member 3 of the base base 2.

レーザー加工用治具1に載置されたワーク5上から照射されたレーザー光Lは、この溝2bを通過する。これにより、レーザー光Lに照射されるベース台2の面積が小さくなり、レーザー光Lによって損傷を受けるベース台2の面積も小さくなるので、ベース台2の劣化を抑制することができる。また、柱部材3の支持部材3aと、支持部材4aとの高さを低くした場合は、支持部材3a,4aの製造コストが低減するので、レーザー加工用治具1の製造コストも低減できる。なお溝2bは、必ずしも矩形でくり抜かれると限られるものではなく、支持部材3aの上面視の形状に応じて、様々な形状が適宜適用される。また、図3で示した切断経路L1,L2の形状に沿って、溝2bがくり抜かれる構成としても良い。 The laser beam L irradiated from above the work 5 placed on the laser processing jig 1 passes through the groove 2b. As a result, the area of the base base 2 irradiated with the laser beam L becomes small, and the area of the base base 2 damaged by the laser light L also becomes small, so that deterioration of the base base 2 can be suppressed. Further, when the heights of the support member 3a of the pillar member 3 and the support member 4a are lowered, the manufacturing cost of the support members 3a and 4a is reduced, so that the manufacturing cost of the laser processing jig 1 can also be reduced. The groove 2b is not necessarily limited to being hollowed out in a rectangular shape, and various shapes are appropriately applied depending on the shape of the support member 3a when viewed from above. Further, the groove 2b may be hollowed out along the shapes of the cutting paths L1 and L2 shown in FIG.

1 レーザー加工用治具
2 ベース台
2a 貫通孔(凹部)
3 柱部材
3b 凹部
3c 保護部材
3d 締結孔
4 ワーク固定具(保持手段、保持部材)
4c 締結孔
5 ワーク(被加工物)
5a,5b 孔(所定領域)
6 ねじ
L レーザー光
1 Laser machining jig 2 Base base 2a Through hole (recess)
3 Pillar member 3b Recess 3c Protective member 3d Fastening hole 4 Work fixture (holding means, holding member)
4c Fastening hole 5 Work (workpiece)
5a, 5b holes (predetermined area)
6 screw L laser light

Claims (4)

レーザー光により切断される被加工物を保持するレーザー加工用治具において、
ベース台と、
そのベース台から立設され上面に前記被加工物の下面が載置される複数の柱部材と、
前記被加工物を前記ベース台または前記柱部材に保持する保持手段と、を備え、
前記柱部材が前記ベース台に対して着脱可能に構成され
前記柱部材の上面には、凹部が凹設され、
前記柱部材は、前記凹部に配設され弾性材料から構成される保護部材を備え、
前記柱部材の上面に載置された前記被加工物の下面が前記保護部材に当接されることを特徴とするレーザー加工用治具。
In a laser machining jig that holds a workpiece to be cut by laser light,
With the base stand
A plurality of pillar members erected from the base base and the lower surface of the work piece is placed on the upper surface, and
A holding means for holding the work piece on the base base or the pillar member is provided.
The pillar member is configured to be removable from the base ,
A recess is provided on the upper surface of the pillar member.
The pillar member includes a protective member disposed in the recess and made of an elastic material.
A laser machining jig characterized in that the lower surface of the workpiece placed on the upper surface of the pillar member is in contact with the protective member .
前記ベース台には、複数の凹部が形成され、
前記柱部材は、前記ベース台の凹部に対して着脱可能に構成されることを特徴とする請求項1記載のレーザー加工用治具。
A plurality of recesses are formed in the base base.
The laser processing jig according to claim 1, wherein the pillar member is configured to be detachable from a recess of the base base.
前記凹部には、貫通孔が貫通形成され、
前記柱部材の下面には、ねじが締結可能とされる締結孔が形成され、
前記凹部の貫通孔に挿通されたねじが前記柱部材の締結孔に締結されることで、前記柱部材が前記ベース台に対して着脱可能に構成されることを特徴とする請求項2記載のレーザー加工用治具。
A through hole is formed through the recess.
Fastening holes to which screws can be fastened are formed on the lower surface of the pillar member.
The second aspect of claim 2, wherein the pillar member is detachably attached to the base base by fastening the screw inserted into the through hole of the recess to the fastening hole of the pillar member. Laser processing jig.
前記保持手段は、上面に前記被加工物が保持される保持部材を備え、
前記保持部材の下面には、ねじが締結可能とされる締結孔が形成され、
前記凹部には、貫通孔が貫通形成され、
前記凹部の貫通孔に挿通されたねじが前記保持部材の締結孔に締結されることで、前記保持部材が前記ベース台に対して着脱可能に構成されることを特徴とする請求項2又は3に記載のレーザー加工用治具。
The holding means includes a holding member on the upper surface for holding the work piece.
Fastening holes to which screws can be fastened are formed on the lower surface of the holding member.
A through hole is formed through the recess.
2. Laser processing jig described in.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001259878A (en) 2000-03-15 2001-09-25 Hitachi Ltd Laser beam machining device
JP3170896U (en) 2011-07-25 2011-10-06 トピー工業株式会社 Laser processing jig

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3388129B2 (en) * 1997-04-02 2003-03-17 シャープ株式会社 Substrate beam processing equipment

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001259878A (en) 2000-03-15 2001-09-25 Hitachi Ltd Laser beam machining device
JP3170896U (en) 2011-07-25 2011-10-06 トピー工業株式会社 Laser processing jig

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