JP7036051B2 - Curable silicone resin composition - Google Patents

Description

The present invention relates to a curable silicone resin composition and a cured product thereof, which provide a cured product useful as a material for an optical device / optical component, an insulating material for an electronic device / electronic component, a coating material, and the like.

The addition curable silicone resin composition contains an organopolysiloxane containing an aliphatic unsaturated group such as an alkenyl group, and is cured by a hydrosilylation reaction to give a cured product. The cured product thus obtained is excellent in heat resistance, cold resistance, electrical insulation and the like, and is transparent, so that it is used in various optical applications.
Silicone resins used for optical applications are required to have high transparency, high refractive index and high strength, and in order to achieve these, a method of using a dimethylsiloxane / diphenylsiloxane copolymer or polymethylphenylsiloxane in the main skeleton. Is commonly done.
However, in order to increase the strength of the cured product, it is necessary to make a composition in which a branched organopolysiloxane and a linear organopolysiloxane are combined. No product has been obtained that gives a cured product that sufficiently satisfies the elasticity and the like.
Further, in order to improve the sulfur gas blocking property of the cured product, a method of introducing a phenyl group into the side chain is used, but the sulfur gas blocking property is still not sufficient (Patent Documents 1 to 9).

Japanese Unexamined Patent Publication No. 2005-307015 Japanese Unexamined Patent Publication No. 2004-143361 Japanese Unexamined Patent Publication No. 2004-186168 Japanese Unexamined Patent Publication No. 2004-292807 Japanese Unexamined Patent Publication No. 2004-359756 Japanese Unexamined Patent Publication No. 2005-076003 Japanese Unexamined Patent Publication No. 2005-105217 Japanese Unexamined Patent Publication No. 2010-132795 Japanese Unexamined Patent Publication No. 2014-205823

The present invention has been made in view of the above circumstances, and is an addition-curing type which is useful as an optical element encapsulant because it provides a cured product having high transparency and high refractive index, particularly high strength and excellent sulfur gas blocking property. It is an object of the present invention to provide a silicone resin composition and a cured product thereof.

As a result of diligent efforts to achieve the above object, the present inventors have made a curable silicone containing a compound containing a diphenylvinylsilyl group at the terminal and a diphenylsylethylene and a methylphenylsiloxane skeleton in the main chain. It has been found that the resin composition gives a cured product having the above-mentioned characteristics, and the present invention has been completed.

（式中、ｎは０以上の整数である。）
（Ｂ）ケイ素原子に結合した水素原子を少なくとも３個有する有機ケイ素化合物：５～２００質量部、および
（Ｃ）ヒドロシリル化反応触媒：有効量
を含む硬化性シリコーン樹脂組成物、
２． （Ａ）成分の屈折率が１．５６以上である１記載の組成物、
３． （Ｂ）成分の屈折率が１．４５以上である１または２記載の組成物、
４． （Ｂ）成分が、下記式（２）で表される基を有するオルガノハイドロジェンポリシロキサン化合物である１～３のいずれかに記載の組成物、

（式中、破線は結合手を示す。）
５． （Ｂ）成分が、下記式で表される化合物から選ばれる１～３のいずれかに記載の組成物、

（式中、ｋは１～１０の整数であり、ｍは１～１０の整数である。）
６． 光学デバイス・光学部品用材料として用いられる１～５のいずれかに記載の組成物、
７． １～６のいずれかに記載の組成物を硬化させてなる硬化物、
８． 透明である７記載の硬化物
を提供する。 That is, the present invention
1. 1. (A) A compound represented by the following general formula (1) and having an alkenyl group bonded to a silicon atom at the end of the molecular chain: 100 parts by mass,

(In the formula, n is an integer greater than or equal to 0.)
(B) an organosilicon compound having at least three hydrogen atoms bonded to a silicon atom: 5 to 200 parts by mass, and (C) a hydrosilylation reaction catalyst: a curable silicone resin composition containing an effective amount.
2. 2. (A) The composition according to 1 in which the refractive index of the component is 1.56 or more.
3. 3. (B) The composition according to 1 or 2, wherein the refractive index of the component is 1.45 or more.
4. The composition according to any one of 1 to 3, wherein the component (B) is an organohydrogenpolysiloxane compound having a group represented by the following formula (2).

(In the formula, the broken line indicates the bond.)
5. The composition according to any one of 1 to 3, wherein the component (B) is selected from the compounds represented by the following formulas.

(In the formula, k is an integer of 1 to 10 and m is an integer of 1 to 10.)
6. The composition according to any one of 1 to 5, which is used as a material for an optical device / optical component.
7. A cured product obtained by curing the composition according to any one of 1 to 6.
8. The cured product according to 7 which is transparent is provided.

The curable silicone resin composition of the present invention is resistant to stress such as thermal shock, has excellent light extraction property from a light source due to its high refractive index, and is also excellent in heat resistance, transparency, and sulfur gas blocking property. A cured product can be given. Therefore, it can be suitably used for protection, encapsulation, adhesion, wavelength change or wavelength adjustment of light emitting diode elements, lens materials such as lenses, encapsulants for optical devices / optical parts, optical materials such as display materials, and the like. .. It can also be used as an insulating material for electronic devices and electronic parts, and also as a coating material.

It is a vertical sectional view which shows the LED lamp used in an Example and a comparative example.

Hereinafter, the present invention will be described in more detail. In the present specification, the refractive index is a value at 25 ° C. using a sodium D line (wavelength 589.3 nm) measured by a digital refractive index meter RX-9000α manufactured by Atago Co., Ltd., and the viscosity is rotational. It is a value measured by a viscometer, and ppm is a mass standard.

（式中、ｎは０以上の整数である。）
（Ａ）成分は１種単独でも、構造や重合度の異なる２種以上を組み合わせても使用することができる。 [(A) component]
The component (A) is a compound represented by the following general formula (1), which contains a diphenylvinylsilyl group at the terminal and has a diphenylsylethylene and a methylphenylsiloxane skeleton in the main chain.

(In the formula, n is an integer greater than or equal to 0.)
The component (A) can be used alone or in combination of two or more having different structures and degrees of polymerization.

Although n in the above general formula (1) is an integer of 0 or more, it is preferably an integer of 0 to 30, more preferably an integer of 1 to 10, and particularly an integer of 1 to 5. Is preferable.

The refractive index of the component (A) is preferably 1.56 or more, more preferably 1.56 to 1.59, and particularly preferably 1.57 to 1.59. If the refractive index of the component (A) is too low, the efficiency of extracting light from the light source may decrease when the optical device or the like is protected or sealed.

Suitable specific examples of the component (A) are shown below, but the component (A) is not limited thereto.

（式中、例えばｎ＝０のときはａ＝２，ｂ＝１である。また、ｎ＝１のときはａ＝３，ｂ＝２である。） The component (A) can be obtained, for example, by hydrosilylating the compounds corresponding to the units in the component (A) according to a conventional method.
Specific examples of the hydrosilylation reaction include those represented by the following reaction formula.

(In the equation, for example, when n = 0, a = 2, b = 1. Also, when n = 1, a = 3, b = 2.)

[(B) component]
The organosilicon compound (B) is a cross-linking agent of the composition of the present invention, and has at least three hydrogen atoms (that is, SiH groups) bonded to silicon atoms in one molecule. Examples of the component (B) include organohydrogenpolysiloxane having at least 3 SiH groups, organohydrogensilane having at least 3 SiH groups, and the like. The component (B) can be used alone or in combination of two or more.

As the organic group bonded to the silicon atom of the component (B), for example, the number of identical or heterogeneous unsubstituted or substituted carbon atoms having no aliphatic unsaturated bond is preferably 1 to 12, and more preferably 1 to 10. , More preferably 1-8 monovalent hydrocarbon groups. Specific examples thereof include an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group and a heptyl group; a cycloalkyl group such as a cyclohexyl group; a phenyl group, a trill group, a xsilyl group and a naphthyl group. Aryl groups such as benzyl group, aralkyl group such as phenethyl group; alkyl halide groups such as chloromethyl group, 3-chloropropyl group, 3,3,3-trifluoropropyl group and the like, particularly methyl group, A phenyl group is preferred.

Examples of the molecular structure of the organohydrogenpolysiloxane included in the component (B) include linear, cyclic, branched chain, and three-dimensional network. In this organohydrogenpolysiloxane, the SiH group may be located only at the end of the molecular chain (ie, only in the M unit) or only in the side chain of the molecular chain (ie,). It may be located in both the terminal chain and the side chain of the molecular chain (even if it is present in the D unit, the T unit, or only both of them). The organohydrogenpolysiloxane has at least 3 SiH groups, preferably 3 to 300, more preferably 3 to 100, and preferably 3 to 300 silicon atoms, more preferably. It is desirable to have about 3 to 150 pieces.

The viscosity of the component (B) at 25 ° C. is 0.1 to 1,000 mPa · s because the obtained composition has good handling workability and the obtained cured product has good physical properties. It is preferably in the range of 5 to 500 mPa · s, and particularly preferably in the range of 5 to 500 mPa · s.

The refractive index of the component (B) is preferably 1.45 or more, more preferably 1.45 to 1.65. When the refractive index of the component (B) is 1.45 or more, it is advantageous in terms of light extraction from the light source. In order for the refractive index of the component (B) to be 1.45 or more, the organic group bonded to the silicon atom preferably contains a carbon atom having 3 or more carbon atoms, and particularly preferably contains a phenyl group. In this case, it is preferable that 10 mol% or more, particularly 10 to 100 mol% of the substituent other than the hydrogen atom bonded to the silicon atom is a phenyl group.

（式中、破線は結合手を示す。） Specific examples of the organohydrogenpolysiloxane having at least three SiH groups contained in the component (B) include tris (dimethylhydrogensiloxy) phenylsilane and trimethylsiloxy group-blocked dimethylsiloxane / methylhydrogen at both ends of the molecular chain. Siloxane / methylphenylsiloxane copolymer, molecular chain double-ended dimethylhydrogensiloxy group-blocked dimethylsiloxane / methylphenylsiloxane copolymer, molecular chain double-ended dimethylhydrogensiloxy group-blocked methylphenylpolysiloxane; methyl group of these compounds Part or all of the above is substituted with another alkyl group such as an ethyl group or a propyl group or an aryl group such as a phenyl group; the siloxane unit represented by the formula: R ₃ SiO _0.5 and the formula: represented by the formula: R ₂ HSiO _0.5 . A copolymer consisting of a siloxane unit and a siloxane unit represented by the formula: SiO ₂ , a copolymer consisting of a siloxane unit represented by the formula: R ₂ HSiO _0.5 and a siloxane unit represented by the formula: SiO ₂ , formula: A copolymer consisting of one or both of the siloxane unit represented by RHSiO and the siloxane unit represented by the formula: RSiO _1.5 and the siloxane unit represented by the formula: HSiO _1.5 ; a mixture consisting of two or more of the above compounds, etc. Can be mentioned. R in the above formula is an unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms having no aliphatic unsaturated bond, and R is, for example, an organic bond to the silicon atom of the component (B). Examples of the group include an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group and the like, which have been specifically mentioned above. In addition, the effect of the present invention can be further enhanced by using an organohydrogensiloxane having a group represented by the following formula (2).

(In the formula, the broken line indicates the bond.)

（式中、ｋは１～１０の整数であり、ｍは１～１０の整数である。） The specific structure of the component (B) is illustrated below as a general formula.

(In the formula, k is an integer of 1 to 10 and m is an integer of 1 to 10.)

Specific examples of the organohydrogensilane having at least three SiH groups included in the component (B) include the silanes shown below.

The blending amount of the component (B) is 5 to 200 parts by mass, preferably 10 to 100 parts by mass with respect to 100 parts by mass of the component (A). Further, the amount of SiH groups in the component (B) is preferably 0.3 to 4.0 mol, more preferably 0.6 to 3.0 mol, based on 1 mol of the alkenyl group bonded to the silicon atom in the entire composition. It is an amount that falls within the range of. When the amount is within this range, the obtained composition tends to be sufficiently cured, and the obtained cured product tends to have excellent heat resistance.

[(C) component]
The hydrosilylation reaction catalyst of the component (C) is particularly effective as long as it has an action of promoting an addition reaction (hydrosilylation reaction) between the alkenyl group-containing compound of the component (A) and the SiH group-containing organosilicon compound of the component (B). Not limited. As the component (C), for example, a conventionally known hydrosilylation reaction catalyst can be used. Specific examples of the component (C) include platinum chloride, alcohol-modified platinum chloride, a coordinate compound (complex) between platinum chloride and olefins, a vinylsiloxane or an acetylene compound, and platinum such as a platinum-vinylsiloxane complex. System compounds; Palladium-based compounds such as tetrakis (triphenylphosphine) palladium; rhodium-based compounds such as chlorotris (triphenylphosphine) rhodium and the like can be mentioned, but platinum-based compounds are particularly preferable.

The amount of the component (C) added may be an effective amount as a hydrosilylation reaction catalyst, but can be appropriately increased or decreased depending on the desired curing rate. The amount of the component (C) added is usually 0.1 to 1,000 ppm in terms of the catalytic metal element such as platinum, palladium, or rhodium with respect to the total of the component (A) and the component (B). It is preferably in the range of 1 to 500 ppm. When the blending amount is in the range of 0.1 to 1,000 ppm, the curing rate can be increased according to the blending amount, which is economically preferable.

[Other ingredients]
In addition to the above-mentioned components (A) to (C), the composition of the present invention may contain other components as long as the effects of the present invention are not impaired.
For example, in order to adjust the viscosity of the obtained composition, the hardness of the obtained cured product, and the like, a non-reactive linear or cyclic diorganopolysiloxane or the like may be blended as other components.
Further, in order to secure the required pot life, a reaction control agent such as 1-ethynylcyclohexanol and 3,5-dimethyl-1-hexin-3-ol can be blended as other components.
Further, as other components, an inorganic filler such as fumed silica may be blended in order to improve the strength of the cured product as long as the transparency is not affected, and if necessary, silane coupling may be added. Adhesive improvers such as agents, dyes, pigments, flame retardants, hindered phenols, hindered amine-based antioxidants and the like may be added.

The curing conditions of the composition of the present invention vary depending on the amount thereof and the like, and are not particularly limited, but are usually preferably 60 to 180 ° C. for 5 to 180 minutes. The composition of the present invention can be cured by applying it to a predetermined substrate according to the intended use and then heating it under the above conditions.

The cured product of the present invention preferably has a hardness (Shore D) of 60 or more, more preferably 65 to 90, as measured according to ASTM D 2240.
The transparency is preferably 80% or more, more preferably 85% or more at a wavelength of 400 nm measured by a Hitachi spectrophotometer U-3310 for a cured molded product having a thickness (optical path length) of 2 mm. Is.
For the sulfur gas barrier property, after measuring the initial total luminous flux of the package sealed with the composition of the present invention, this is placed in a 100 mL glass bottle together with 0.2 g of sulfur powder and sealed. When the temperature is deteriorated at 90 ° C. for 1 day in that state and the total luminous flux is measured again, the luminous flux change rate is preferably 80% or more, more preferably 85% or more.
The oxygen permeability of the cured molded product having a thickness of 1 mm is preferably 250 cc / m 3.24 h or less ^{, more preferably 200 cc / m 3 .} It is 24 hours or less, more preferably 100 cc / m ^3.24 hours or less.
The water vapor permeability of the cured molded product having a thickness of 1 mm is preferably 8 g / m 3.24 h or less, more preferably ^{6 g / m 3 as} measured by LYSSY L80-5000 (manufactured by SYSTECH illinois).・ It is 24 hours or less.

[Use]
The curable silicone composition of the present invention is useful as a material for optical devices / optical components, an insulating material for electronic devices / electronic components, a coating material, and the like. Examples of the optical device include optical elements such as LEDs, semiconductor lasers, photodiodes, phototransistors, solar cells, and CCDs. Examples of the optical component include a lens and the like. With the curable silicone composition of the present invention, for example, the optical element can be protected, sealed, adhered, and the like, and the optical component can be manufactured. Examples of the electronic device / electronic component include semiconductor elements such as diodes, transistors, ICs, CPUs, and memories other than the above optical elements. As a coating application, it can be suitably used for applications that require transparency.

Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples.

（Ｂ）下記式（４）で表されるオルガノハイドロジェンポリシロキサン（屈折率１．５３）：４５質量部、

および
１－エチニルシクロヘキサノール：０．０３質量部
を均一に混合して混合物を得た後、この混合物に
（Ｃ）白金－ビニルシロキサン錯体：（Ａ）成分と（Ｂ）成分との合計に対して白金換算で１０ｐｐｍ
を添加し、更に均一に混合して組成物を得た。 [Example 1]
(A) Methylphenylsiloxane-based compound represented by the following formula (3) (refractive index 1.59): 100 parts by mass,

(B) Organohydrogenpolysiloxane (refractive index 1.53) represented by the following formula (4): 45 parts by mass,

And 1-ethynylcyclohexanol: 0.03 parts by mass were uniformly mixed to obtain a mixture, and then (C) platinum-vinylsiloxane complex: (A) and (B) were added to the mixture. 10ppm in terms of platinum
Was added, and the mixture was further uniformly mixed to obtain a composition.

This composition was poured into a mold assembled from a glass plate so as to have a thickness of 4 cm × 4 cm × 2 mm, and heated at 150 ° C. for 2 hours to obtain a cured molded product.

Further, the above composition was encapsulated in a mold assembled of a glass plate so as to have a thickness of 4 cm × 4 cm × 1 mm, and cured at 150 ° C. for 2 hours to obtain a cured molded product.

Further, an LED lamp in which an LED chip was sealed with a cured product of the above composition was obtained. A vertical cross-sectional view of this LED lamp is shown in FIG. The LED lamp 1 shown in FIG. 1 has a polyphthalamide package 2 having a concave cross section and an LED chip 3 (trade name: SMD5050 (trade name: I-CHIUN PRECISION INDUSTRY CO., Co., Ltd., resin portion PPA) sealed therein. (Polyphthalamide))). The recess 4 of the package is composed of a bottom surface portion 5 and a side surface portion 6, and an LED chip 3 is arranged at the center portion of the bottom surface portion 5. Further, the bottom surface portion 5 is provided with the LED chip 3. A silver electrode 7 is formed so as to be in contact with both the bottom surface portion 5 and the side surface portion 6 apart from the LED chip 3, and a gold wire 8 is connected between the LED chip 3 and each silver electrode 7. The recess 4 is filled with the above composition, and the composition is heated at 150 ° C. for 2 hours to be cured to form the transparent cured product 9, whereby the recess 4 is sealed with the transparent cured product 9. LED lamp 1 was obtained.

を用い、（Ｂ）成分の配合量を４５質量部から３１質量部に変更した以外は、実施例１と同様にして組成物を調製し、１ｍｍおよび２ｍｍ厚みの硬化成形物とＬＥＤチップが硬化物で封止されたＬＥＤランプとを得た。 [Example 2]
In Example 1, as the component (A), the methylphenylsiloxane compound represented by the above formula (3): instead of 100 parts by mass, the methylphenylsiloxane compound represented by the following formula (5) (refractive index). 1.59): 100 parts by mass

The composition was prepared in the same manner as in Example 1 except that the blending amount of the component (B) was changed from 45 parts by mass to 31 parts by mass, and the cured molded product having a thickness of 1 mm and 2 mm and the LED chip were cured. An LED lamp sealed with an object was obtained.

を均一に混合した以外は、実施例１と同様にして組成物を調製し、硬化成形物とＬＥＤチップが硬化物で封止されたＬＥＤランプとを得た。 [Example 3]
Using 100 parts by mass of the component (A) used in Example 2, an organohydrogenpolysiloxane represented by the following formula (6) instead of the compound of the formula (4) as the component (B) (refractive index 1. 58): 34 parts by mass

The composition was prepared in the same manner as in Example 1 except that the LED chips were uniformly mixed to obtain a cured molded product and an LED lamp in which the LED chips were sealed with the cured product.

を用い、（Ｂ）成分の配合量を４５質量部から３５質量部に変更した以外は、実施例１と同様にして組成物を調製し、硬化成形物とＬＥＤチップが硬化物で封止されたＬＥＤランプとを得た。 [Comparative Example 1]
In Example 1, the methylphenylsiloxane compound represented by the above formula (3) as the component (A): a diphenylsiloxane compound represented by the following formula (7) instead of 100 parts by mass (refractive index 1.57). ): 100 parts by mass

The composition was prepared in the same manner as in Example 1 except that the blending amount of the component (B) was changed from 45 parts by mass to 35 parts by mass, and the cured molded product and the LED chip were sealed with the cured product. I got an LED lamp.

のレジン：４０質量部を用い、（Ｂ）成分の配合量を４５質量部から２０質量部に変更し、１－エチニルシクロヘキサノール：０．０３質量部を用いた以外は、実施例１と同様にして組成物を調製し、硬化成形物とＬＥＤチップが硬化物で封止されたＬＥＤランプとを得た。 [Comparative Example 2]
In Example 1, as the component (A), a methylphenylsiloxane-based compound represented by the above formula (3): instead of 100 parts by mass, an organic group bonded to a silicon atom is composed of a methyl group, a phenyl group and a vinyl group. Of all the organic groups bonded to the silicon atom, the amount of phenyl group is 30 mol%, the amount of vinyl group is 0.02 mol%, the viscosity is 4,000 mPa · s, and the refractive index is 1.51. Vinyl methyl polysiloxane: 30 parts by mass, the organic group bonded to the silicon atom consists of a methyl group, a phenyl group and a vinyl group, and the amount of the phenyl group is 30 mol% among all the organic groups bonded to the silicon atom, and the vinyl group. Phenylvinylmethylpolysiloxane with an amount of 0.06 mol%, a viscosity of 700 mPa · s, and a refractive index of 1.51: 30 parts by mass, and

Resin: 40 parts by mass was used, the blending amount of the component (B) was changed from 45 parts by mass to 20 parts by mass, and 1-ethynylcyclohexanol: 0.03 parts by mass was used, as in Example 1. The composition was prepared, and a cured molded product and an LED lamp in which the LED chip was sealed with the cured product were obtained.

[Comparative Example 3]
Instead of the composition of Example 1, a phenylsilicone resin-based curable composition (trade name: KER-2667, phenyl group content: about 50 mol%, manufactured by Shin-Etsu Chemical Co., Ltd.) was used, and the heating time was 2 A cured molded product and an LED lamp in which the LED chip was sealed with the cured product were obtained in the same manner as in Example 1 except that the time was changed from 8 hours.

[Performance evaluation method]
The performance of the cured products and LED lamps obtained in the above Examples and Comparative Examples was evaluated according to the following method.
<Hardness>
The hardness (Shore D) of the cured product was measured according to ASTM D 2240 for the cured molded product having a thickness of 2 mm produced in Examples and Comparative Examples. The measurement results are shown in Table 1.
<Transparency>
The light transmittance of the cured product (optical path length 2.0 mm) having a wavelength of 400 nm at 25 ° C. was measured for the cured molded product having a thickness of 2 mm produced in Examples and Comparative Examples (device name: Hitachi spectrophotometer U). -3310). The measurement results are shown in Table 1.
<Sulfur gas barrier>
The initial total luminous flux of the LED lamps produced in Examples and Comparative Examples was measured. Next, 0.2 g of sulfur powder and the LED lamps prepared in each Example and Comparative Example were placed in a 100 mL glass bottle and sealed. After sealing, it was placed in a dryer at 90 ° C. and left for 24 hours. After leaving it to stand, the LED lamp was energized to emit light, and the total luminous flux was measured again. The rate of change of the LED lamp taken out after being left for 24 hours when the initial total luminous flux was 100 was confirmed (device name: total luminous flux measurement system HM-9100 (manufactured by Otsuka Electronics Co., Ltd.)). The measurement results are shown in Table 1.
<Oxygen gas permeability>
The oxygen permeability of the cured molded product having a thickness of 1 mm produced in Examples and Comparative Examples was measured (device name: PARMEATION ANALYZER 8001, manufactured by illinois instruments). The measurement results are shown in Table 1.
<Water vapor permeability>
The water vapor permeability of the cured molded product having a thickness of 1 mm produced in Examples and Comparative Examples was measured (device name: LYSSY L80-5000, manufactured by SYSTECH illinois). The measurement results are shown in Table 1.

[evaluation]
A curable silicone resin composition that provides a cured product with excellent transparency and sulfur gas blocking properties by using a compound containing a diphenylvinylsilyl group at the end and a diphenylsylethylene and methylphenylsiloxane skeleton in the main chain. I was able to develop things.

1 LED lamp 2 Package 3 LED chip 4 Recess 5 Inner bottom surface 6 Inner side surface 7 Silver electrode 8 Gold wire 9 Transparent cured product

Claims (8)

(A) A compound represented by the following general formula (1) and having an alkenyl group bonded to a silicon atom at the end of the molecular chain: 100 parts by mass,

(In the formula, n is an integer greater than or equal to 0.)
A curable silicone resin composition comprising (B) an organosilicon compound having at least three hydrogen atoms bonded to a silicon atom: 5 to 200 parts by mass, and (C) a hydrosilylation reaction catalyst: an effective amount. (A) The composition according to claim 1, wherein the refractive index of the component is 1.56 or more. (B) The composition according to claim 1 or 2, wherein the refractive index of the component is 1.45 or more. The composition according to any one of claims 1 to 3, wherein the component (B) is an organohydrogenpolysiloxane compound having a group represented by the following formula (2).

(In the formula, the broken line indicates the bond.) The composition according to any one of claims 1 to 3, wherein the component (B) is selected from a compound represented by the following formula.

(In the formula, k is an integer of 1 to 10 and m is an integer of 1 to 10.) The composition according to any one of claims 1 to 5, which is used as a material for an optical device / optical component. A cured product obtained by curing the composition according to any one of claims 1 to 6. The cured product according to claim 7, which is transparent.

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