JP7033246B2 - Stress measuring device for transported objects - Google Patents

Description

The present invention relates to a stress measuring device for a transported object.

Conventionally, in the field where materials are continuously produced such as steel material continuous casting process, hot rolling process, cold rolling process, forging process, drawing process, etc., in order to control the quality of the produced material, it is transported. A material for measurement is taken out at a predetermined ratio from the materials, and the plane residual stress of each part of the material is measured by a stress measuring device using X-ray diffraction. This is because when the tensile residual stress exceeds the yield strength of the material, plastic deformation and cracks occur, and even if the residual stress value is low, dimensional change and shape change after machining occur due to creep deformation and the like. As shown in Patent Document 1, such a stress measuring device includes a stress measuring device by the sin ² ψ method. This device measures the plane residual stress by changing the incident angle of X-rays with respect to the material and detecting the diffraction angle 2θ at each incident angle.

Since the stress measuring device by the sin ² ψ method needs to change the angle of incidence of X-rays on the material for measurement, there is a problem that the device becomes large and it takes time to measure. On the other hand, as a stress measuring device using X-ray diffraction for measuring by fixing the incident angle of X-rays to a material, there is a stress measuring device by the cosα method as shown in Patent Document 2. This device forms a diffractive ring on the image pickup surface by diffracted X-rays from the material, and measures the plane residual stress from the shape of the diffractive ring. This device has an advantage that the device can be miniaturized and the measurement time can be shortened. As the imaging surface forming the diffraction ring, in addition to the imaging plate as shown in Patent Document 2, there is one in which solid-state imaging elements are arranged two-dimensionally as shown in Patent Document 3.

Further, as shown in Patent Document 4, an apparatus for performing X-ray diffraction measurement on a moving object has been developed by the present inventor. This device continuously irradiates an object with X-rays, rotates the imaging plate in synchronization with the movement of the object, and forms an image of diffracted X-rays on the imaging plate through a slit. Then, the half width of the image formed in parallel with the formation of the image of the diffracted X-ray is measured, and the abnormal portion of the object is detected by the half width.

Japanese Unexamined Patent Publication No. 2013-36861 Japanese Patent No. 5505361 JP-A-2015-78934 Japanese Patent No. 5920593

The stress measuring device using X-ray diffraction shown in Patent Document 2 and Patent Document 3 is a device premised on the case of irradiating X-rays with the material fixed and performing measurement, and the material being conveyed. The stress of is not measured as it is. Further, the X-ray diffraction measuring device shown in Patent Document 4 is a device for measuring the half-value width of the image of the diffracted X-ray of a moving object, and is not a device for measuring residual stress. As described above, the conventional stress measuring device using X-ray diffraction does not have a device for accurately measuring the residual stress of the conveyed material.

Therefore, in order to measure the residual stress of the material being conveyed, it is necessary to take out the material for measurement at a predetermined ratio from the material being conveyed, and after taking out the material for measurement, the residual stress It takes time to obtain the measurement result, and there is a problem that it is difficult to feed back the obtained measurement result to the material to be conveyed. Further, since it is not possible to inspect all the materials, there is a problem that it is not possible to reliably detect the abnormal material.

The present invention has been made by paying attention to such a problem, and it is possible to accurately measure the residual stress of all the conveyed objects in real time, and the inspection results are immediately applied to the production process of the conveyed objects. It is an object of the present invention to provide a stress measuring device that can be reflected.

In order to achieve the above object, the conveyed object stress measuring device according to the present invention is a conveyed object stress measuring device for measuring the residual stress of one or a plurality of conveyed objects conveyed at a constant speed. , The X-ray irradiation means that intermittently irradiates the conveyed object with X-rays of a predetermined intensity, and the diffracted X-rays generated by the conveyed object when X-rays are irradiated from the X-ray irradiation means are received on the imaging surface. Then, a light receiving means for forming a diffracted X-ray image on the imaging surface and detecting the shape of the diffracted X-ray image, and a residue of the conveyed object based on the shape of the diffracted X-ray image detected by the light receiving means. It has a residual stress acquisition means for calculating stress , the light receiving means detects the shape of the diffractive ring as the shape of the image of the diffracted X-ray, and the residual stress acquiring means is the diffractive ring detected by the light receiving means. The residual stress is calculated by the cosα method based on the shape of, and the light receiving means scans the imaging plate and the laser beam on the imaging plate, and the intensity of the diffraction generated from the scanning position and the irradiation point of the laser beam. A diffractive ring detecting means for detecting the shape of the diffractive ring by detecting the same timing, and a diffractive ring erasing means for irradiating the erasing light for erasing the diffractive ring formed on the imaging plate and scanning the erasing light. There are two sets of imaging plates, each set of imaging plates is alternately moved to a position where diffracted X-rays are incident, and while one set of imaging plates is formed with a diffractive ring. It is characterized by having a diffractive ring detecting means and a diffractive ring erasing means, and having a measuring control means for detecting and erasing the shape of the diffractive ring formed on another set of imaging plates.

According to this device, the X-ray irradiation means irradiates the image pickup surface with X-rays having an intensity that forms a diffracted X-ray image in a short time, and receives light before the X-ray irradiation by the next X-ray irradiation means. If the shape of the diffracted X-ray image formed on the image pickup surface is detected by the means and the residual stress acquisition means calculates the residual stress each time the shape of the diffracted X-ray image is obtained, the residual stress of the conveyed object is shortened. It can be measured in real time at time intervals. That is, the residual stress of the transported object can be measured in real time at intervals of a predetermined length. The measured residual stress is highly accurate because it is calculated based on the shape of the entire image of the diffracted X-ray. Further, when a plurality of conveyed objects are sequentially conveyed, the residual stress can be measured in real time for each conveyed object.

According to this, it is not necessary to sample the transported object at a predetermined ratio for inspection or to cut out the sample for stress measurement from the transported object, which is economical. Further, if the residual stress acquisition means immediately calculates the residual stress after the light receiving means detects the shape of the image of the diffracted X-ray, the residual stress of each conveyed object is compared after the X-ray irradiation to each conveyed object. It can be obtained at an early stage. As a result, the inspection result of each transported object can be immediately reflected in the production process of the transported object, and quality deterioration such as insufficient stress of the transported object can be quickly corrected. In addition, the stress-deficient portion and the stress-deficient transported object itself can be removed at a stage before going to the next process, and it is possible to prevent unnecessary processes from occurring. Therefore, this stress measuring device for the transported object is suitable for sites where materials are continuously produced and transported, such as a steel material continuous casting process, a hot rolling process, a cold rolling process, a forging process, and a wire drawing process. Can be used. In addition to the processing process for non-iron materials such as aluminum alloys and copper alloys, it has a wide range of applications such as inspection of ceramics, composite materials, and devices on mass production lines.

The X-ray irradiation means may be any type as long as it can irradiate the imaging surface with X-rays having an intensity that forms an image of diffracted X-rays in a short time, for example, intermittently by chopper control or the like. It may be one that irradiates pulsed X-rays, or one that allows continuously irradiated X-rays to pass for a short time by controlling the opening and closing of the shutter. Further, any light receiving means can be used as long as an image of diffracted X-rays is formed on the imaging surface and the shape of the formed diffracted X-ray image can be detected. For example, an X-ray CCD or An image sensor in which imaging elements such as X-ray CMOS are arranged in two dimensions, a two-dimensional microgap method, a means for scanning a sensor with a small opening for detecting X-ray intensity (such as a scintillation counter) in two dimensions, or an imaging plate. The imaging plate has means for scanning a laser beam to detect a scanning position and fluorescence intensity.

Further, as the residual stress acquisition means for calculating the residual stress from the shape of the image of the diffracted X-ray, there are the sin ² ψ method and the cos α method as described in the background technique, and either method can be used, but the sin ² method can be used. The ψ method has a problem that the device becomes large and it takes time to measure because it is necessary to change the incident angle of the X-ray to the conveyed object and obtain an image of the diffracted X-ray for each incident angle. Is preferable. The image of the diffracted X-ray in the cosα method is a diffractive ring.

If the residual stress acquisition means is based on the cosα method and the light receiving means is an imaging plate and a diffractive ring detecting means for detecting the scanning position and fluorescence intensity by scanning laser light on the imaging plate, the device can be miniaturized and residual stress can be obtained. The stress measurement has the advantage that it is not significantly affected by the ambient temperature. There are two sets of imaging plates, a moving means for alternately moving each set of imaging plates to a position where diffracted X-rays are incident, and diffraction while a diffraction ring is formed on one set of imaging plates. By controlling the ring detection means and the diffractive ring erasing means to have a measurement control means for detecting and erasing the shape of the diffractive ring formed on another set of imaging plates, the diffractive ring can be formed and the diffractive ring can be erased. Since it is possible to perform both detection and erasing in parallel, the time between X-ray irradiation and the next X-ray irradiation can be shortened by one pair of X-ray irradiation means and light receiving means, and the conveyed object can be detected and erased. The interval between the positions where the residual stress is measured can be shortened.

In addition, there are three sets of imaging plates, a moving means for moving each set of imaging plates to a position where diffracted X-rays are incident in order, and a diffractive ring while a diffractive ring is formed on one set of imaging plates. The detection means is controlled to detect the shape of the diffractive ring formed on another set of imaging plates, and the diffractive ring erasing means is controlled to detect the diffraction formed on another set of imaging plates. It may have a measurement control means for erasing the ring.

According to this, since the formation of the diffractive ring, the detection of the diffractive ring, and the elimination of the diffractive ring can be performed in parallel, the X-ray irradiation and the next pair of the X-ray irradiation means and the light receiving means can be performed. The time between X-ray irradiation can be further shortened, and the distance between the positions where the residual stress of the conveyed material is measured can be further shortened.

When the light receiving means is a means for detecting the scanning position and the fluorescence intensity by scanning the imaging plate and the laser beam on the imaging plate, the light receiving means is diffracted X as compared with the case where the image sensor is arranged in two dimensions. The time required to obtain the shape of the line image becomes longer, and the time between the X-ray irradiation and the next X-ray irradiation becomes longer. That is, the interval between the positions where the residual stress of the conveyed object is measured becomes long.

In order to shorten the interval between the positions for measuring the residual stress of the transported object to the limit value or more, a plurality of sets of X-ray irradiation means and light receiving means are provided, and each X-ray irradiation means is located at a position different in the transport direction of the transported object. Has an irradiation control means that is irradiated with X-rays and controls each X-ray irradiation means so that the X-rays emitted from each X-ray irradiation means are irradiated to different positions of the conveyed object. The residual stress acquisition means may be configured to obtain the residual stress at the position where each X-ray is irradiated based on the shape of the image of the diffracted X-rays detected by each light receiving means. ..

In this case, the interval between each set of the X-ray irradiating means and the light receiving means may be lengthened so that the timing at which the X-rays are irradiated to the conveyed object from each set may be different, or the interval may be narrowed. , The timing at which the X-rays from each set are irradiated to the conveyed object may be the same. In either case, the irradiation control means may control the X-rays emitted from the respective X-ray irradiation means so as to be irradiated to different positions of the conveyed object.

Further, when it is desired to inspect the conveyed object with triaxial residual stress, the light receiving means detects the shape of the diffractive ring as the shape of the image of the diffracted X-rays, and a plurality of sets of X-ray irradiation means and light receiving means are provided. At the same time, each set of the X-ray irradiation means and the light receiving means is arranged along the transport direction of the transported object, and the X-rays emitted from the respective X-ray irradiation means are from different directions with respect to the transported object. There is an irradiation control means that controls each X-ray irradiation means to be irradiated so that the X-rays emitted from each X-ray irradiation means are irradiated to the same position of the conveyed object at different timings. However, the residual stress acquisition means may be configured to obtain the triaxial residual stress at the position irradiated with X-rays based on the shape of the diffractive ring detected by each light receiving means.

According to this, the X-rays emitted from the respective X-ray irradiation means are irradiated to the same position, and the irradiation control means is controlled to irradiate the respective X-ray irradiation means at the same time. There is no longer the restriction that the set of X-ray irradiation means and light receiving means must be compact.

As described above, according to the stress measuring device for the transported object according to the present invention, the planar residual stress of all the transported objects can be accurately measured in real time at short intervals. Further, even when it is desired to inspect the transported object with the triaxial residual stress, the triaxial residual stress can be measured accurately in real time. As a result, the inspection result can be immediately reflected in the production process of the transported object.

It is an overall schematic diagram which shows the stress measuring apparatus of a conveyed object in 1st Embodiment of this invention. It is an overall schematic diagram which shows the stress measuring apparatus of a conveyed object in 2nd Embodiment of this invention. It is an overall schematic diagram which shows the stress measuring apparatus of a conveyed object in 3rd Embodiment of this invention. It is an overall schematic diagram which shows the stress measuring apparatus of the conveyed object in the modification of the 3rd Embodiment of this invention. It is an overall schematic diagram which shows the stress measuring apparatus of a conveyed object in 4th Embodiment of this invention. It is an overall schematic diagram which shows the X-ray diffractometer of the stress measuring apparatus of a conveyed object in 5th Embodiment of this invention. It is an overall schematic diagram which shows the stress measuring apparatus of a conveyed object in 6th Embodiment of this invention. It is an overall schematic diagram which shows the stress measuring apparatus of the conveyed object in the modification of the 6th Embodiment of this invention. It is an overall schematic diagram which shows the stress measuring apparatus of a conveyed object in another modification of 6th Embodiment of this invention.

(First Embodiment)
FIG. 1 is an overall schematic view showing a stress measuring device for a transported object according to the first embodiment of the present invention. This stress measuring device is composed of an X-ray diffractometer 10 and a computer device 30, and the X-ray diffractometer 10 transports the transported object 1 above the moving stage of the transport device 2 that transports the transported object 1 in a constant direction at a constant speed. It is fixed by the fixture 16 so as to be in an appropriate position with respect to the object. The transport speed of the transport object 1 is, in a specific example, 0.5 cm / sec to 10 m / sec. Further, the computer device 30 is connected to the X-ray diffractometer 10 by a power line, a signal line, or the like, and is installed in the vicinity of the X-ray diffractometer 10. Although omitted in FIG. 1, a high-voltage power supply that supplies high-voltage power to the X-ray diffractometer 10 is installed in the vicinity of the computer device 30 and is connected to the X-ray diffractometer 10 by a power line. Has been done.

The X-ray diffractometer 10 includes an X-ray emitter 11 having a long columnar shape in the housing, and the X-ray emitter 11 is controlled by an X-ray control circuit 20 and is high from a high voltage power source. When the voltage is supplied, X-rays are emitted from the exit port. When a command is input from the computer device 30, the X-ray control circuit 20 controls the electric power supplied from the high-voltage power source so that the X-ray emitter 11 emits X-rays having a set intensity. With this set intensity, a diffraction ring is formed in the two-dimensional image pickup element 12, which will be described later, in an extremely short time (for example, within 1 second) by the diffracted X-rays generated in the conveyed object 1 when the conveyed object 1 is irradiated. It is strength. To express it accurately, the time from when the diffracted X-rays are incident on the two-dimensional image sensor 12 until the two-dimensional image sensor 12 outputs a signal capable of calculating the shape of the diffraction ring with high accuracy is the pole. It is a strength that can be shortened.

A shutter 15 is fixed in the vicinity of the emission port of the X-ray emitter 11, and when the shutter 15 is in the open state when the X-ray is irradiated from the X-ray emitter 11, the X-ray is emitted from the cylindrical pipe 14 described later. Is irradiated to the conveyed object 1 through the above. The shutter 15 is controlled by the open / close control circuit 21, and the open / close control circuit 21 supplies electric power to the drive unit of the shutter 15 to open / close the shutter 15 each time a command of “open” and “close” is input from the computer device 30. I do. The time from when the computer device 30 outputs the "open" command to when the "closed" command is output is an extremely short time (for example, within 1 second), and X-rays are applied to the conveyed object 1 for an extremely short time. To. Further, the time from the output of the "closed" command to the output of the next "open" command by the computer device 30 is appropriately set from the transfer speed of the conveyed object 1 and the interval between the measurement positions of the conveyed object 1. Will be done.

When X-rays are emitted from the X-ray emitter 11 and the shutter 15 is in the open state, the X-rays enter the cylindrical pipe 14 fixed to the central portion of the disk-shaped table 13 and inside the cylindrical pipe 14. Is emitted from the tip of the cylindrical pipe 14. A passage member whose inner diameter is smaller than the inner diameter of other parts is fixed inside each end of the cylindrical pipe 14, and the X-rays emitted from the X-ray emitter 11 are X-rays spreading in the traveling direction. However, by passing through the inside of the cylindrical pipe 14, X-rays become substantially parallel.

A two-dimensional image sensor 12 is fixed to the surface of the table 13. The two-dimensional image sensor 12 is an image sensor in which an image sensor such as an X-ray CCD or an X-ray CMOS is arranged in two dimensions, and each image sensor is set with a signal having an intensity corresponding to the incident X-ray intensity. It is output to the data extraction circuit 22 at time intervals. The data extraction circuit 22 processes the input signal of each image sensor to create data of an image formed from X-rays incident on the two-dimensional image sensor 12. When the carrier 1 is irradiated with X-rays, diffracted X-rays are generated at the irradiated portion, but the intensity of the diffracted X-rays increases at the locations where the Bragg condition is satisfied, and when the diffracted X-rays are incident on the two-dimensional image pickup element 12. , A diffractive ring is formed as an X-ray image. Therefore, when the conveyed object 1 is irradiated with X-rays, the data extraction circuit 22 creates data on the shape of the diffractive ring. When the operation start command is input from the computer device 22, the data extraction circuit 22 starts to output the data of the shape of the diffraction ring at the set time interval, and the computer device 30 is "closed" after the command of "open". Immediately after the command of "" is output to the open / close control circuit 21, the data input from the data extraction circuit 22 is stored in the memory to acquire the data of the shape of the diffractive ring.

Although the X-ray control circuit 20, the open / close control circuit 21, and the data extraction circuit 22 described above are drawn so as to be outside the housing of the X-ray diffractometer 10 in FIG. 1, they are actually the casing of the X-ray diffractometer 10. It is stored in the body.

An end detection sensor 3 for detecting the front end and the rear end of the moving object 1 is fixed in the vicinity of the side surface of the moving stage of the transfer device 2. As the end detection sensor 3, a sensor that detects the front end and the rear end of the object to be measured OB can be used from the presence or absence of light reception of the laser beam near the side surface on the opposite side of the moving stage. Each time the end detection sensor 3 detects the front end and the rear end of the conveyed object 1, it outputs a signal meaning "tip detection" and "rear end detection" to the computer device 30.

The computer device 30 is an electronic control device mainly composed of a microcomputer equipped with a CPU, ROM, RAM, a large-capacity storage device, etc., and receives a signal from the end detection sensor 3 and the above-mentioned X-ray control circuit. 20. The control unit 32 that controls the X-ray diffraction device 10 by outputting commands to the open / close control circuit 21 and the data extraction circuit 22, and the data of the shape of the diffraction ring input from the data extraction circuit 22 remain. There is a calculation unit 31 that calculates the stress. These are the programs installed in the computer device 30.

When the measurement control unit 32 inputs the "tip detection" signal from the end detection sensor 3, it outputs an operation start command to the X-ray control circuit 20 and the data extraction circuit 22, and is set after the set time has elapsed. It repeats outputting "open" and "closed" commands to the open / close control circuit 21 at regular time intervals. Then, every time immediately after the "close" command is output, the data input from the data extraction circuit 22 is stored in the memory. Then, when the signal of "rear end detection" is input from the end detection sensor 3, the operation stop command is output to the X-ray control circuit 20 and the data extraction circuit 22.

The calculation unit 31 performs arithmetic processing for calculating the residual stress when the data of the image of the diffraction ring is stored in the memory. This calculation method is based on the cosα method, which is a known technique, and is shown in, for example, Japanese Patent Application Laid-Open No. 2005-241308. The obtained residual stress is the residual normal stress σx in the X direction and the residual normal stress σy in the Y direction, where the lateral direction (transport direction of the transported object 1) in FIG. 1 is the X direction and the paper vertical direction in FIG. 1 is the Y direction. , And the residual shear stress τxy, which is the plane residual stress. When the residual stress is obtained, the calculation unit 31 makes a pass / fail judgment by comparing it with a preset threshold value.

The computer device 30 includes an input device such as a keyboard and a touch panel and a display device such as a display, and the computer device 30 displays the obtained residual stress value and the pass / fail judgment result on the display device together with the identification information of the conveyed object 1. .. Further, when starting and ending the measurement of the residual stress in the stress measuring device, the measurement start and measurement stop commands are input from the input device. Further, for calculation of measurement conditions such as the time interval of a command output to the closed control circuit 21 set in the computer device 30, the incident angle of X-rays, and the residual stress such as the distance from the X-ray irradiation point to the two-dimensional image pickup element 12. Judgment conditions such as necessary parameter values and thresholds for performing pass / fail judgment are set by the operator inputting from the input device.

According to the stress measuring device for the transported object configured in this way, the planar residual stress of the transported object 1 is accurately measured at short time intervals, that is, at short intervals in the transport direction of the transported object 1. Can be done. In addition, the measurement result of the plane residual stress and the pass / fail judgment can be displayed in real time.

(Second Embodiment)
Although the stress measuring device for the conveyed object of the first embodiment described above can obtain the above-mentioned effect, the two-dimensional image pickup element 12 is strongly affected by the temperature, so that the plane residual stress is generated in an environment where the temperature fluctuation is large. It is difficult to measure accurately. On the other hand, the stress measuring device for the transported object according to the second embodiment of the present invention is not strongly affected by the temperature.

FIG. 2 is an overall schematic view showing a stress measuring device for a transported object according to the second embodiment of the present invention. The X-ray diffractometer 40 of this stress measuring device is different from the X-ray diffractometer shown in Patent Document 2 of the prior art document in that the device is fixed by the fixture 16 and the shutter 15 is provided. The other points are the same. The fixture 16 and the shutter 15 are the same as those in the first embodiment.

In the stress measuring device for the conveyed object in the second embodiment, diffracted X-rays are incident on the imaging plate 46 instead of the two-dimensional imaging element 12, and a diffractive ring is formed on the imaging plate 46. Then, the diffractive ring formed on the imaging plate 46 is moved to the position of the optical head 47 by the movement of the moving mechanism 41, and the shape of the diffractive ring is detected. In this detection, laser light is irradiated from the optical head 47 with the movement of the moving mechanism 41 and the rotation of the motor 42 connected to the table 44 to which the imaging plate 46 is attached, and the intensity data of the fluorescence generated in the imaging plate 46 is obtained. , The computer device 30 acquires the rotation angle data of the motor 42 and the moving position data of the moving mechanism 41. Further, after the shape of the diffractive ring is detected, the LED light for erasing is irradiated from the optical head 47 to erase the diffractive ring, and the imaging plate 46 moves to the original position where the diffracted X-rays are incident.

The stress measuring device for the conveyed object in the second embodiment includes a movement control circuit 43 and an optical head control circuit 48 instead of the data extraction circuit 22, and the rotation and movement mechanism 41 of the motor 42 is instructed by the computer device 30. In addition to controlling the laser light irradiation from the moving and optical head 47 and the LED light irradiation for erasing, the rotation angle data of the motor 42, the moving position data of the moving mechanism 41, and the intensity data of the fluorescence generated by the imaging plate 46 are obtained. It is transmitted to the computer device 30.

The control unit 32 of the computer device 30 in the second embodiment outputs a “closed” command to the open / close control circuit 21, and then outputs various commands to the movement control circuit 43 and the optical head control circuit 48 to perform the above-described operation. And input the above-mentioned data which is the shape data of the diffractive ring. Other than that, it is the same as the computer device 30 of the first embodiment.

According to the stress measuring device for the conveyed object of the second embodiment configured in this way, the same effect as that of the first embodiment can be obtained, and the plane residual stress is accurately measured even in an environment where the temperature fluctuation is large. It has the effect of being able to. Compared to the device of the first embodiment, the stress measuring device of the conveyed object of the second embodiment takes longer time to detect the shape of the image of the diffracted X-ray after the irradiation of the X-ray, and the conveyed object 1 It is difficult to shorten the interval between the measurement positions of. This problem can be improved to some extent by limiting the irradiation of the imaging plate 46 with the laser beam and the irradiation of the LED light for erasing only to the position where the diffraction ring is formed.

(Third Embodiment)
The stress measuring device for the transported object according to the first embodiment and the second embodiment described above has the characteristics of the function of detecting the shape of the image of the diffracted X-ray, the function of calculating the residual stress, and the transport speed of the transported object 1. There is a limit value when the interval between the measurement positions of the object 1 is reduced, and this limit value is particularly large in the stress measuring device for the conveyed object of the second embodiment. In the third embodiment of the present invention, the interval between the measurement positions of the conveyed object 1 can be made smaller than this limit value.

FIG. 3 is an overall schematic view showing a stress measuring device for a transported object according to the third embodiment of the present invention. In this stress measuring device, a plurality of X-ray diffractometers 40 of FIG. 2 are arranged in the transport direction of the transported object 1 in the same manner as in FIG. The X-ray diffractometer 40 may be the X-ray diffractometer 10 shown in FIG. 1, and another X-ray diffractometer 40 may be arranged depending on the interval between the measurement positions of the conveyed object 1.

The computer device 30 has individual control units 32-1, 32-2, 32-3 and individual control units 32-1, 32-2, 32-3 that independently control each X-ray diffractometer 40. There is a general control unit 33 that controls 3. The individual control units 32-1, 32-2, and 32-3 perform the same control as the control unit 32 of the second embodiment independently of the X-ray diffractometers 40-1, 40-2, and 40-3, respectively. And do it. The integrated control unit 33 has individual control units 32-1, 32-2, and 32-3 so that the measurement positions of the conveyed objects 1 by the X-ray diffractometers 40-1, 40-2, and 40-3 are at equal intervals. Command the operation.

The edge detection sensors 3 of the first embodiment and the second embodiment are provided for the X-ray diffractometers 40-1, 40-2, and 40-3 in the third embodiment, respectively, and are provided in the computer device 30. The integrated control unit 33 identifies the signals from the respective end detection sensors 3 and commands the individual control units 32-1, 32-2, and 32-3 to operate. By appropriately setting the time for each of the individual control units 32-1, 32-2, and 32-3 to operate after the signal is input from the end detection sensor 3, the measurement positions of the conveyed objects 1 become equal intervals. ..

FIG. 3 shows a case where the X-ray diffractometers 40-1, 40-2, and 40-3 are arranged so that different carriers 1 are irradiated with X-rays. As shown in FIG. 4, X-ray diffraction is performed. The devices 40-1 and 40-2 may be arranged so that the X-rays irradiate the same conveyed object 1 at a position slightly separated from each other, and at the same time, the X-rays may be irradiated to measure the residual stress. In this case, in order to irradiate X-rays at positions separated from each other by a small distance and set the incident angle of the X-rays with respect to the conveyed object 1 to a predetermined angle, as shown in FIG. 4, the X-ray diffractometer 40 of FIG. The long direction may be set to the direction perpendicular to the paper surface, and the X-ray diffractometer 40 may be tilted around the long direction to irradiate X-rays.

The shape of the housing of the X-ray diffractometers 40-1 and 40-2 in this case is such that the X-ray diffractometers 40-1 and 40-2 can be brought close to each other without contacting the conveyed object 1. It should be shaped like this. The shape of this housing is shown in detail in Japanese Patent No. 5967394. Since the direction in which the X-ray irradiation direction is projected onto the surface of the conveyed object 1 needs to be the direction in which the residual normal stress is to be measured accurately, the same is true unless the X-ray diffractometer 40 is made very compact. As shown in FIG. 4, the number of irradiation points when the X-rays irradiate the conveyed objects 1 at positions separated from each other by a small distance is limited to two points.

According to the stress measuring device of the conveyed object of the third embodiment configured in this way, the same effect as that of the first embodiment can be obtained, and the X-ray diffractometer sets the interval between the measurement positions of the conveyed object 1 by 1. There is an effect that it can be made smaller than the limit value at the time of the stand.

(Fourth Embodiment)
In the third embodiment described above, since the number of X-ray diffractometers is increased, the cost of the stress measuring device for the conveyed object is increased. In the fourth embodiment of the present invention, the time interval between the X-ray irradiation and the next X-ray irradiation in one X-ray diffractometer according to the second embodiment is reduced, and the cost of the stress measuring device for the conveyed object is increased. Can be suppressed.

FIG. 5 is an overall schematic view showing a stress measuring device for a transported object according to the fourth embodiment of the present invention. The X-ray diffractometer 50 of this stress measuring device is provided with two sets of imaging plates 46-1 and 46-2, and the imaging plates 46-1 and 46-2 are alternately at positions where diffracted X-rays are incident (a diffraction ring is formed). It is provided with a moving mechanism 41 that moves to a position). It also has two sets of a function to detect the shape of the diffractive ring formed on the imaging plates 46-1 and 46-2 and a function to erase the diffractive ring, and when the diffracted X-ray is incident on one of the imaging plates ( (When forming a diffractive ring), the shape of the diffractive ring formed on the other imaging plate is detected, and then the diffractive ring is erased.

The shape detection function and the erasing function of the diffractive ring are the motors 42-1 and 42-2 and the optical head 47-1 connected to the tables 44-1 and 44-2 to which the imaging plates 46-1 and 46-2 are attached. , 47-2 and the optical head movement mechanisms 51-1 and 51-2, the movement control circuit 43, the optical head control circuits 48-1, 48-2, and the optical head control circuits 48-1, 48-2, which control the operation of these and obtain the shape data of the diffractive ring. Optical head movement control circuits 52-1 and 52-2. The difference from the second embodiment is that there are two sets other than the movement control circuit 43, and when detecting the shape of the diffractive ring, the optical head movement mechanism 51-1, 51 is replaced with the movement by the movement mechanism 41. This is a point where the optical heads 47-1 and 47-2 are moved by -2.

That is, when detecting the shape of the diffraction ring, in the second embodiment, the laser light irradiation point is moved in the radial direction of the imaging plate 46 by the movement of the imaging plate 46 by the moving mechanism 41, but in the fourth embodiment, The laser light irradiation point is moved in the radial direction of the imaging plates 46-1 and 46-2 by the movement of the optical heads 47-1 and 47-2 by the optical head moving mechanisms 51-1 and 51-2.

In FIG. 5, the long direction of the X-ray diffractometer 50 and the transport direction of the conveyed object 1 are drawn to be the same, but in reality, the long direction of the X-ray diffractometer 50 is the direction perpendicular to the paper surface. The X-ray diffractometer 50 is tilted around the long direction, so that the X-rays are incident on the conveyed object 1 at a predetermined incident angle.

According to the stress measuring device for the conveyed object of the fourth embodiment configured in this way, the same effect as that of the second embodiment can be obtained, and the interval between the measurement positions of the conveyed object 1 is smaller than that of the second embodiment. It has the effect of being able to. When a plurality of X-ray diffractometers are provided as in the third embodiment, the number of X-ray diffractometers can be reduced to suppress the cost increase of the stress measuring device for the conveyed object.

(Fifth Embodiment)
In the above-mentioned fourth embodiment, the imaging plate 46 and the diffraction ring shape detection function and the erasing function are set to two sets, but the imaging plate 46 is set to three sets and the diffraction ring shape detection function and the erasing function are separated. In the fifth embodiment of the present invention, the time interval between the X-ray irradiation and the next X-ray irradiation in one X-ray diffractometer of the second embodiment is further reduced.

FIG. 6 is a schematic view showing the configuration of the X-ray diffractometer 60 of the stress measuring device for the conveyed object according to the fifth embodiment of the present invention, and is a view of the X-ray diffractometer 60 viewed from above. The X-ray diffractometer 60 includes three sets of imaging plates, and has a moving mechanism for moving each imaging plate to a position where diffracted X-rays are incident (a position where a diffraction ring is formed) in order. In FIG. 6, the imaging plate is attached to the back side of the tables 44-1, 44-2, 44-3. The moving mechanism consists of a motor 61 and a plate 62 to which the motors 42-1, 42-2, 42-3 connected to the tables 44-1, 44-2, 44-3 are attached, and the motor 61 is rotated by a predetermined angle. By doing so, each imaging plate is sequentially positioned at the position where the diffracted X-rays are incident.

When one imaging plate is in a position where diffracted X-rays are incident, the diffraction ring formed on the remaining one imaging plate is the operation of the optical head 47-1 and the operation of the optical head moving mechanism 51-1. It is detected by the operation and the rotation of any one of the motors 42-1, 42-2, and 42-3. Further, the diffractive ring formed on the remaining another imaging plate is either the operation of the optical head 47-2, the operation of the optical head moving mechanism 51-2, or the motors 42-1, 42-2, 42-3. It is erased by one rotation.

That is, while the fourth embodiment performs the formation of the diffractive ring and the detection and elimination of the shape of the diffractive ring in parallel, in the fifth embodiment, the formation of the diffractive ring, the shape detection of the diffractive ring, and the diffractive ring are performed. Erase 3 in parallel. Since the time for detecting the shape of the diffractive ring and the time for erasing the diffractive ring are longer than the time for forming the diffractive ring (irradiation of X-rays), in the fifth embodiment, X-ray irradiation in one X-ray diffractometer is performed. The time interval between and the next X-ray irradiation can be further reduced.

In FIG. 6, the X-ray diffractometer 60 is inclined with respect to the surface of the moving stage on which the conveyed object 1 is placed in the longitudinal direction of the X-ray emitter 11, and the X-rays are conveyed. It is irradiated at a predetermined incident angle with respect to 1. The axis of rotation of the inclination is near the central axis of the X-ray emitter 11, and the X-ray diffractometer 60 is inclined so that the motors 42-2 and 42-3 are above the motor 42-1.

Further, the motor 61 rotates by 120 degrees, and when it rotates by a set angle, it rotates by 240 degrees in the opposite direction, and after the plus or minus rotation angle becomes 0 degrees, it rotates by 120 degrees in the original direction. It has become. This is to prevent the power lines and signal lines connected to the motors 42-1, 42-2, and 42-3 from being twisted.

According to the stress measuring device for the conveyed object of the fifth embodiment configured in this way, the same effect as that of the second embodiment can be obtained, and the interval between the measurement positions of the conveyed object 1 is smaller than that of the fourth embodiment. It has the effect of being able to. When a plurality of X-ray diffractometers are provided as in the third embodiment, the number of X-ray diffractometers can be reduced as compared with the fourth embodiment to suppress the cost increase of the stress measuring device for the conveyed object.

(Sixth Embodiment)
The first to fifth embodiments described above measure the planar residual stress of the transported object 1, while the sixth embodiment of the present invention measures the triaxial residual stress.

FIG. 7 is an overall schematic view showing a stress measuring device for a transported object according to the sixth embodiment of the present invention. This stress measuring device is a device in which a plurality of X-ray diffractometers 10 of FIG. 1 are fixed in the transport direction of the transported object 1 in the same manner as in FIG. The X-ray diffractometer 10 may be the X-ray diffractometer 40 of FIG. 2, the X-ray diffractometer 50 of FIG. 5, or the X-ray diffractometer 60 of FIG.

The X-ray diffractometer 10-1 projects the X-ray optical axis onto the surface of the conveyed object 1 so that it is parallel to the conveyed direction, and irradiates the conveyed object 1 with X-rays at a predetermined incident angle. Further, the X-ray diffractometer 10-2 projects the X-ray optical axis onto the surface of the conveyed object 1 so that it is perpendicular to the conveyed direction, and irradiates the conveyed object 1 with X-rays at a predetermined incident angle. Then, the X-ray diffractometer 10-3 irradiates X-rays so that the X-ray optical axis is perpendicular to the surface of the conveyed object 1.

Similar to the third embodiment, the computer device 30 has individual control units 32-1, 32-2, 32-3 that independently control the X-ray diffractometers 10-1, 10-2, and 10-3, respectively. And the integrated control unit 33 that controls the individual control units 32-1, 32-2, and 32-3, respectively. In the sixth embodiment, the integrated control unit 33 has individual control units 32-1 and 32 so that the X-ray irradiation positions of the conveyed objects 1 by the X-ray diffractometers 10-1, 10-2, and 10-3 are equal. Instruct each of -2 and 32-3 to operate.

The method of calculating the triaxial residual stress from the shape of the diffractive ring obtained by each X-ray diffractometer 10-1, 10-2, 10-3 is an existing technique and is described in detail in Japanese Patent No. 5339253. There is.

There are other ways of arranging the X-ray diffractometer for measuring the triaxial residual stress other than FIG. 7. FIG. 8 shows another way of arranging the X-ray diffractometer for calculating the triaxial residual stress. In this case, when the X-ray optical axis is projected onto the surface of the transported object 1, it is parallel to the transport direction and the direction perpendicular to the transport direction, and each has opposite directions, and the incident angle of each X-ray is predetermined. The X-ray diffractometers 10-1, 10-2, 10-3, and 10-4 are arranged so as to have an incident angle. The method of calculating the triaxial residual stress from the shape of the diffractive ring obtained by each X-ray diffractometer 10-1, 10-2, 10-3, 10-4 in this case is also described in detail in Japanese Patent No. 5339253. It is explained.

Further, as another method of arranging the X-ray diffractometer for calculating the triaxial residual stress, if the accuracy of the residual normal stress in the direction perpendicular to the transport direction may be reduced, the X-ray diffractometer in FIG. 7 There is also a way of arranging only 10-1 and 10-3. A method for calculating the triaxial residual stress from the shape of the diffractive ring obtained by the respective X-ray diffractometers 10-1 and 10-3 in this case is described in detail in Japanese Patent No. 6011846.

Further, as another method of arranging the X-ray diffractometer for calculating the triaxial residual stress, if the accuracy of the residual stress in the direction perpendicular to the transport direction may be reduced, the X-ray diffractometer 10 is shown in FIG. Only -1 and 10-3 are used, and when the X-ray optical axis of the X-ray diffractometer 10-3 is projected onto the surface of the conveyed object 1, it is parallel to the conveyed direction, and the X-ray diffractometer is applied to the conveyed object 1. There is also a method of irradiating at an incident angle different from 10-1. A method for calculating the triaxial residual stress from the shape of the diffractive ring obtained by the respective X-ray diffractometers 10-1 and 10-3 in this case is described in detail in Japanese Patent No. 6060474.

Further, the X-ray diffractometers in the modified examples of FIGS. 7, 8 and 7 described above are arranged so that the X-rays irradiate the different conveyed objects 1, and the timing of irradiating the X-rays is adjusted. The X-ray irradiation positions were made equal. However, each X-ray diffractometer may be arranged so that the X-rays are irradiated to the same place, and the X-rays may be irradiated at the same time. In this case, unless the X-ray diffractometer 10 is made very compact, the possible arrangement of the X-ray diffractometer 10 is as shown in FIG. 4, in which the X-ray diffractometer 10 is tilted in the longitudinal direction and X-rays are emitted. Is irradiated, and the X-ray diffractometer is arranged as shown in FIG. 9 when viewed from above.

According to the stress measuring device of the conveyed object of the sixth embodiment configured in this way, the same effect as that of the first embodiment can be obtained, and the triaxial residual stress of the conveyed object 1 is accurately measured in real time. be able to.

The implementation of the present invention is not limited to the above-described embodiment, and various changes can be made as long as the object of the present invention is not deviated.

In the above-described embodiment, the method for measuring the residual stress is the cosα method. However, even the sin ² Ψ method may be used as a method for measuring residual stress if the measurement time can be shortened.

Further, in the above-described embodiment, the X-ray emitter 11 continuously emits X-rays, and the X-rays are irradiated to the conveyed object 1 for a short time by opening and closing the shutter 15. However, any X-ray irradiation means may be used as long as it is possible to emit X-rays having an intensity at which an image of diffracted X-rays is formed in a short time. For example, pulse X-rays may be irradiated intermittently by chopper control or the like.

Further, in the above-described embodiment, as a means for forming a diffractive ring and detecting the shape of the diffractive ring, the two-dimensional image pickup element 12, the imaging plate 46 and the imaging plate 46 are scanned with a laser beam to obtain a scanning position. A means for detecting the fluorescence intensity was used. However, any means may be used as long as the shape of the diffractive ring can be detected accurately and in a short time. For example, a two-dimensional microgap type device may be used, or a plurality of sensors (scintillation counters, etc.) having a small opening may be provided in the radial direction of the table 44, and the table 44 may be rotated once while being irradiated with X-rays. The X-ray intensity may be detected for each radial position and rotation angle.

Further, in the above-described embodiment, in order to determine the timing at which the computer device 30 emits X-rays to the X-ray diffractometer, the end detection sensor 3 detects the end of the conveyed object 1. However, any method may be used as long as it is possible to irradiate the set portion of the conveyed object 1 with X-rays. For example, even if the X-ray diffractometer irradiates visible parallel light on the same optical axis as the X-ray axis and the received intensity of the reflected light exceeds the threshold value, the end of the conveyed object 1 is detected. good.

The plane residual stress of the conveyed object 1 was measured by the stress measuring device of the conveyed object according to the third embodiment of the present invention. As the X-ray diffractometer, a portable X-ray residual stress measuring device "μ-X360" manufactured by Pulstec Industrial Co., Ltd. was used. This is an apparatus corresponding to the X-ray diffractometer 40 shown in the second embodiment of the present invention. As the conveyed object 1 to be measured, SS400 H-shaped steel conveyed by the cold rolling process and a cross-sectional dimension of 100 mm × 200 mm were used. The rolling speed (conveyance speed) of the H-shaped steel was 1 cm / sec, and a plurality of X-ray diffractometers 40 were arranged in the rolling direction of the H-shaped steel, and the rolling direction was measured at intervals of 20 cm. The X-ray source in the X-ray emitter 11 of the X-ray diffractometer 40 was an air-cooled Cr—Kα radiation source, the tube voltage was 30 kV, and the tube current was 1.5 mA, and X-rays were irradiated. The measurement point (X-ray irradiation point) in the H-section steel is near the center line in the rolling direction, the diameter of the X-ray irradiation point is 1 mm, the X-ray incident angle is 35 °, and a diffraction ring is formed on the imaging plate 46. did. Further, the diffraction angle of the X-ray in the diffraction ring is set to 2θ ₀ = 156.4 ° of α-Fe (211), and based on the shape of the formed diffraction ring, the calculation unit 31 of the computer device 30 uses the cosα method. The plane residual stress of the H-section steel was determined.

Since the X-ray emitter 11 has not yet emitted X-rays having an intensity that forms a diffractive ring in a short time, the irradiation time of X-rays at one time is set to 15 seconds, during which the H-shaped steel moves. The average plane residual stress at a distance (distance in which the X-ray irradiation point moves) of 15 cm was determined. Further, the obtained planar residual stress is an average value up to a depth of about 10 μm. When the rolling direction of the H-shaped steel is x and the direction perpendicular to it is y, the ranges of the planar residual stress σx and σy obtained at each point of the H-shaped steel are σx = -35 to -69 MPa and σy =, respectively. It was 28 to -6 MPa.

1 Conveyor 2 Conveyor 3 End detection sensor 10 X-ray diffractometer 11 X-ray emitter 12 Two-dimensional image pickup element 13 Table 14 Cylindrical pipe 15 Shutter 16 Fixture 20 X-ray control circuit 21 Open / close control circuit 22 Data extraction circuit 30 Computer equipment 31 Calculation unit 32 Control unit 32-1, 32-2, 32-3 Individual control unit 33 Central control unit 40 X-ray diffractometer 41 Movement mechanism 42 Motor 43 Movement control circuit 44 Table 46 Imaging plate 47 Optical head 48 Optical Head control circuit 50 X-ray diffractometer 51-1, 51-2 Optical head movement mechanism 52-1, 52-2 Optical head movement control circuit 60 X-ray diffractometer 61 Motor 62 Plate

Claims (4)

A stress measuring device for a transported object for measuring the residual stress of one or more transported objects transported at a constant speed.
An X-ray irradiation means that intermittently irradiates the transported object with X-rays of a predetermined intensity,
When X-rays are irradiated from the X-ray irradiating means, the diffracted X-rays generated by the conveyed object are received by the image pickup surface to form an image of the diffracted X-rays on the image pickup surface and the image of the diffracted X-rays. Light receiving means for detecting the shape and
It has a residual stress acquisition means for calculating the residual stress of the conveyed object based on the shape of the image of the diffracted X-ray detected by the light receiving means.
The light receiving means detects the shape of the diffractive ring as the shape of the image of the diffracted X-ray.
The residual stress acquisition means calculates the residual stress by the cosα method based on the shape of the diffractive ring detected by the light receiving means.
The light receiving means is
Imaging plate and
A diffractive ring detecting means for detecting the shape of a diffractive ring by scanning a laser beam on the imaging plate and detecting the position of the scanning and the intensity of fluorescence generated from the irradiation point of the laser beam at the same timing.
It is composed of a diffractive ring erasing means for irradiating the erasing light for erasing the diffractive ring formed on the imaging plate and scanning the erasing light.
There are two sets of the imaging plates.
A moving means for alternately moving each set of the imaging plates to a position where diffracted X-rays are incident, and
While the diffractive ring is formed on one set of the imaging plates, the diffractive ring detecting means and the diffractive ring erasing means are controlled to detect the shape of the diffractive ring formed on the other set of the imaging plates and detect the shape of the diffractive ring. A stress measuring device for a conveyed object, which comprises a measuring control means for erasing. A stress measuring device for a transported object for measuring the residual stress of one or more transported objects transported at a constant speed.
An X-ray irradiation means that intermittently irradiates the transported object with X-rays of a predetermined intensity,
When X-rays are irradiated from the X-ray irradiating means, the diffracted X-rays generated by the conveyed object are received by the image pickup surface to form an image of the diffracted X-rays on the image pickup surface and the image of the diffracted X-rays. Light receiving means for detecting the shape and
It has a residual stress acquisition means for calculating the residual stress of the conveyed object based on the shape of the image of the diffracted X-ray detected by the light receiving means.
The light receiving means detects the shape of the diffractive ring as the shape of the image of the diffracted X-ray.
The residual stress acquisition means calculates the residual stress by the cosα method based on the shape of the diffractive ring detected by the light receiving means.
The light receiving means is
Imaging plate and
A diffractive ring detecting means for detecting the shape of a diffractive ring by scanning a laser beam on the imaging plate and detecting the position of the scanning and the intensity of fluorescence generated from the irradiation point of the laser beam at the same timing.
It is composed of a diffractive ring erasing means for irradiating the erasing light for erasing the diffractive ring formed on the imaging plate and scanning the erasing light.
There are three sets of the imaging plates.
A moving means for moving each set of the imaging plates to a position where diffracted X-rays are incident in order, and
While the diffraction ring is formed on one set of the imaging plates, the diffraction ring detection means is controlled to detect the shape of the diffraction ring formed on another set of the imaging plates, and the diffraction is performed. A device for measuring stress of a conveyed object, which comprises a measurement control means for controlling a ring erasing means to erase a diffractive ring formed on another set of the imaging plates. A plurality of sets of the X-ray irradiation means and the light receiving means are provided, and each of the X-ray irradiation means is irradiated with X-rays at different positions.
It has an irradiation control means for controlling each of the X-ray irradiation means so that the X-rays emitted from the respective X-ray irradiation means are emitted to different positions in the transport direction of the conveyed object.
The residual stress acquiring means is characterized in that the residual stress at the position where each X-ray is irradiated is obtained based on the shape of the image of the diffracted X-rays detected by each of the light receiving means. The stress measuring device for a transported object according to claim 1 or 2 . A stress measuring device for a transported object for measuring the residual stress of one or more transported objects transported at a constant speed.
An X-ray irradiation means that intermittently irradiates the transported object with X-rays of a predetermined intensity,
When X-rays are irradiated from the X-ray irradiating means, the diffracted X-rays generated by the conveyed object are received by the image pickup surface to form an image of the diffracted X-rays on the image pickup surface and the image of the diffracted X-rays. Light receiving means for detecting the shape and
It has a residual stress acquisition means for calculating the residual stress of the conveyed object based on the shape of the image of the diffracted X-ray detected by the light receiving means.
The light receiving means detects the shape of the diffractive ring as the shape of the image of the diffracted X-ray.
A plurality of sets of the X-ray irradiation means and the light receiving means are provided, and each set of the X-ray irradiation means and the light receiving means is arranged along the transport direction of the conveyed object, and the X-ray irradiation means is provided. The X-rays to be irradiated are applied to the conveyed object from different directions.
There is an irradiation control means that controls each of the X-ray irradiation means so that the X-rays emitted from the respective X-ray irradiation means are irradiated to the same position of the conveyed object at different timings. death,
The transport is characterized in that the residual stress acquisition means is configured to obtain triaxial residual stress at a position irradiated with X-rays based on the shape of the diffractive ring detected by each of the light receiving means. An object stress measuring device.

Images