JP7018342B2 - Heat exchanger - Google Patents

Description

The present invention relates to a heat exchanger.

Patent Document 1 describes a heat exchanger.
As shown in FIG. 16A, the heat exchanger 50 is divided into a rectangular tubular peripheral wall 51 and a plurality of first cells and second cells 53 extending the inside of the peripheral wall 51 in the axial direction of the peripheral wall 51. It is configured in a honeycomb shape with a wall. In the cross section orthogonal to the axial direction of the peripheral wall 51, the first cell and the second cell 53 are arranged so as to form a row in the vertical direction, respectively. Specifically, the first cell is arranged in the first row, the third row, the fifth row, and the seventh row from the left side of the paper in FIG. 16A, and the second row, the fourth row, the sixth row, and the eighth row are arranged. The second cell 53 is arranged in the column.

As shown in FIG. 16B, both ends of the first cell 52 are sealed, and the peripheral wall 51 is continuous from the peripheral wall 51 to the partition wall 54 on one end side and the other end side on the same surface of the peripheral wall 51. The openings 55 and 56 are formed. The fluid flowing in from the opening 55 on one end side of the peripheral wall 51 can flow out from the opening 56 on the other end side of the peripheral wall 51 while flowing in the plurality of first cells 52 along the arrow M. There is.

As shown in FIG. 16 (c), both ends of the second cell 53 are open so that the fluid can flow from one end side to the other end side of the second cell 53 along the arrow G. ing.
It is configured so that heat exchange is performed between the first fluid flowing through the first cell 52 and the second fluid flowing through the second cell 53.

Japanese Unexamined Patent Publication No. 2015-14273

By the way, when the heat exchanger with the liquid heat medium accumulated inside is exposed to the condition that the heat medium freezes, the partition wall that partitions the cells through which the heat medium flows due to the pressure of the volume expansion of the heat medium due to the freezing. Was at risk of being damaged. The present invention has been made in view of these circumstances, and an object of the present invention is to provide a heat exchanger capable of suppressing damage to a partition wall due to freezing of a liquid heat medium.

The heat exchanger of the present invention for solving the above-mentioned problems includes a tubular peripheral wall and a partition wall for partitioning the inside of the peripheral wall into a plurality of gas flow passages and a plurality of heat medium flow passages. A heat exchanger in which heat exchange is performed between a gas flowing through a flow passage and a liquid heat medium flowing through the heat medium flow passage, and the heat medium flow passage is the heat that opens in the peripheral wall. The inflow path of the medium, the outflow path of the heat medium opening to the peripheral wall, and the storage section for storing the heat medium are provided, and the inflow path and the outflow path communicate with each other through the storage section. The gist is that.

When the heat medium existing in the inflow path and the outflow path freezes, the expansion pressure can be released to the outside of the heat exchanger through the inflow port and the outflow b of the heat medium flow path. On the other hand, when the inflow path and the outflow path are communicated through a plurality of cells as in the heat exchanger of the prior art, the expansion pressure when the heat medium existing in the plurality of cells freezes is the heat exchanger. It is difficult to escape to the outside of. Therefore, the expansion pressure when the heat medium freezes tends to strongly act on the partition wall that partitions the cell.

According to the above configuration, since the inflow path and the outflow path in the heat medium flow path communicate with each other through the storage portion, the expansion pressure is compared with the embodiment in which the inflow path and the outflow path communicate with each other through a plurality of cells. Is easy to escape to the outside of the heat exchanger. The result is a heat exchanger in which damage to the partition wall due to freezing of the heat medium is suppressed.

The heat exchanger of the present invention is provided with the plurality of inflow paths and the plurality of outflow paths, and the plurality of the inflow paths and the plurality of the outflow paths communicate with one common storage unit. It is preferable to have. According to this configuration, it becomes easy to increase the cross-sectional area of the flow path of the storage portion. Further, as compared with the case where separate storage portions are provided, it is possible to reduce the number of partition walls that partition between the storage portions, so that the number of partition walls on which the expansion pressure acts can be reduced.

For the heat exchanger of the present invention, the flow path cross-sectional area of the storage portion is preferably 100 to 400 times the flow path cross-sectional area of the gas flow cell. According to this configuration, since the cross-sectional area of the flow path of the storage portion is relatively large, it becomes easy to release the expansion pressure to the outside of the heat exchanger.

For the heat exchanger of the present invention, it is preferable that the partition wall contains silicon carbide as a main component. According to this configuration, since silicon carbide is a material having a high thermoelectric conductivity among ceramic materials, it is possible to improve the heat exchange efficiency of the heat exchanger.

According to the present invention, damage to the partition wall of the heat exchanger can be suppressed.

Perspective view of the heat exchanger. (A) is a sectional view taken along line 2a-2a of FIG. 1, and (b) is a sectional view taken along line 2b-2b of FIG. FIG. 1 is a sectional view taken along line 3-3. FIG. 1 is a sectional view taken along line 4-4 of FIG. (A) is a perspective view of the first molded body, and (b) is a perspective view of the second molded body. Explanatory drawing of the processing process (explanatory drawing of the state where the processing jig of the first processing is inserted). Explanatory drawing of the processing process (explanatory drawing after inserting the processing jig of the first processing). Explanatory drawing of processing process (explanatory drawing of 2nd processing). Explanatory drawing of assembly process (perspective view of assembly). Explanatory drawing of degreasing process (perspective view of degreasing body). Explanatory drawing of impregnation process. Explanatory drawing which shows the state which arranged the assembly in a container. A graph showing the temperature change in the container. Perspective view of the heat exchanger of the modified example. Sectional drawing of the heat exchanger of the modified example. (A) is a perspective view of a heat exchanger of the prior art, (b) is a sectional view taken along line bb of (a), and (c) is a sectional view taken along line cc of (a).

Hereinafter, an embodiment of the heat exchanger will be described.
As shown in FIGS. 1, 3 and 4, in the heat exchanger 10 of the present embodiment, the rectangular tubular peripheral wall 11 and the inside of the peripheral wall 11 are divided into a plurality of gas flow passages R1 and a plurality of heat medium flow passages R2. It is provided with a partition wall 12 to be used.

As shown in FIG. 2, the rectangular tubular peripheral wall 11 has a pair of lateral side walls 11a facing vertically and a pair of vertical side walls 11b facing left and right, and has a cross-sectional shape orthogonal to the axial direction of the peripheral wall 11. Is configured to form a horizontally long rectangle. In the following, the "axial direction of the peripheral wall 11" is simply referred to as "axial direction".

As shown in FIGS. 2 to 4, the partition wall 12 connects the first partition wall 12a parallel to the lateral side wall 11a and the first partition wall 12a to each other, and also has a second partition wall 12b parallel to the vertical side wall 11b. To prepare for. Further, a part of the partition wall 12 is provided with a sealing portion 22 formed by filling the inside with a sealing material as described later. As shown in FIG. 4, the sealing portions 22 are provided at three locations, both ends and a central portion in the axial direction.

As shown in FIGS. 2 to 4, a storage portion 13 which is a space partitioned by the peripheral wall 11 and the first partition wall 12a is formed in the lower part of the heat exchanger 10. End walls 13a that close the storage portion 13 are formed at both ends of the storage portion 13 in the axial direction.

As shown in FIGS. 2 and 3, a plurality of gas flow cells C extending in the axial direction are formed inside the peripheral wall 11 by the first partition wall 12a and the second partition wall 12b. The gas distribution cell C constitutes the gas flow passage R1.

As shown in FIGS. 14b is formed. The inflow path 14a and the outflow path 14b are formed so as to be aligned in the axial direction in a pair state. The inflow path 14a and the outflow path 14b are configured so that one end side opens to the peripheral wall 11 and the other end side communicates with the storage unit 13, and communicates with each other via the storage unit 13.

The inflow passage 14a, the outflow passage 14b, and the storage portion 13 constitute a heat medium flow passage R2. Therefore, the end opening to the peripheral wall 11 of the inflow path 14a becomes the inflow port 15a of the heat medium flow path R2, and the end opening to the peripheral wall 11 of the outflow path 14b is the outflow port 15b of the heat medium flow path R2. It becomes. In the present embodiment, the three sets of inflow passages 14a and outflow passages 14b are formed so as to be arranged in a direction orthogonal to the axial direction. Each inflow passage 14a and each outflow passage 14b are communicated with one common storage unit 13.

The material constituting the heat exchanger 10 is preferably a material containing silicon carbide as a main component. A material containing silicon carbide as a main component is preferable because it has a higher thermal conductivity than other ceramic materials and can increase the heat exchange efficiency. Here, the "main component" means 50% by mass or more. Examples of the material containing silicon carbide as a main component include materials containing silicon carbide particles and metallic silicon.

Next, the gas distribution cell C (gas flow passage R1) will be described.
As shown in FIG. 3, the gas flow cell C is configured such that both ends are opened so that the gas to be processed can be circulated along the axial direction. The gas distribution cell C includes a cell row Ca in which eight gas distribution cells C are arranged in parallel with the vertical side wall 11b of the peripheral wall 11. In FIG. 2A, four rows of cells are provided along the lateral side wall 11a of the peripheral wall 11, and an arrangement pattern in which this arrangement is repeated is formed.

Examples of the gas to be processed in which the gas distribution cell C is distributed include the exhaust gas of an internal combustion engine. The cell structure of the gas flow cell C is not particularly limited, but for example, the wall thickness of the first partition wall 12a and the second partition wall 12b is 0.1 to 0.5 mm, and the cell density is the peripheral wall 11. It is possible to have a cell structure having 15 to 93 cells per 1 cm ² in cross section orthogonal to the axial direction of.

Next, the heat medium flow passage R2 will be described.
As shown in FIG. 4, the heat medium flow passage R2 has an inflow path 14a having an inflow port 15a opening in the peripheral wall 11, an outflow path 14b having an outflow port 15b opening in the peripheral wall 11, and an inflow path 14a and an outflow path. The inlet 15a and the reservoir 13 communicating with the end opposite to the outlet 15b in 14b are provided. The inflow path 14a and the outflow path 14b are arranged side by side on one end side and the other end side in the axial direction. Further, the inflow path 14a and the outflow path 14b are formed so as to extend in parallel with each other in a direction orthogonal to the axial direction.

It is preferable that the flow path cross-sectional area of the inflow path 14a and the outflow path 14b is configured to be larger than the flow path cross-sectional area of the gas flow cell C. The flow path cross-sectional area of the inflow path 14a and the outflow path 14b is preferably 5 to 30 times the flow path cross-sectional area of the gas flow cell C. Further, it is preferable that the cross-sectional area of the flow path of the storage unit 13 is larger than the cross-sectional area of the flow path of the gas flow cell C, the inflow path 14a and the outflow path 14b. The cross-sectional area of the flow path of the storage unit 13 is preferably 100 to 400 times the cross-sectional area of the flow path of the gas flow cell C. Here, the cross-sectional area of the flow path means a cross-sectional area orthogonal to the extending direction of the flow path. The flow path cross-sectional area of the reservoir 13 is assumed to mean a cross-sectional area orthogonal to the axial direction.

As shown in FIGS. 2B and 4, the heat medium supplied to the heat exchanger 10 flows into the heat exchanger 10 from the inflow port 15a opened in the peripheral wall 11 and passes through the inflow path 14a to the storage unit. It is distributed to 13. A certain amount of the heat medium distributed to the storage unit 13 is stored in the storage unit 13. Further, the heat medium in the storage unit 13 flows from the inflow path 14a side to the outflow port 15b side along the axial direction. Then, it flows out of the heat exchanger 10 from the outflow port 15b that opens to the peripheral wall 11 through the outflow path 14b. In the inflow path 14a and the outflow path 14b, the heat medium circulates in opposite directions.

As the heat medium flowing through the heat medium flow passage R2, for example, a known liquid heat medium can be used. Examples of known heat media include cooling water (Long Life Coolant: LLC) and organic solvents such as ethylene glycol.

The heat exchanger 10 having the above configuration can exchange heat between the gas flowing through the gas flow cell C and the heat medium flowing through the heat medium flow passage R2 via the partition wall 12.
A method for manufacturing the heat exchanger 10 will be described with reference to FIGS. 5 to 13.

The heat exchanger 10 is manufactured by going through the molding step, the processing step, the assembly step, the degreasing step, and the impregnation step described below in this order.
(Molding process)
A clay-like mixture containing silicon carbide particles, an organic binder, and a dispersion medium is prepared as a raw material used for molding the heat exchanger.

Examples of the organic binder include polyvinyl alcohol, methyl cellulose, ethyl cellulose, and carboxymethyl cellulose. Among these organic binders, methyl cellulose and carboxymethyl cellulose are particularly preferable. Further, only one of the above organic binders may be used, or two or more of them may be used in combination.

Examples of the dispersion medium include water and organic solvents. Examples of the organic solvent include ethanol. Further, only one of the above dispersion media may be used, or two or more of them may be used in combination.

Further, other components may be further contained in the mixture. Examples of other components include ceramic particles made of a material other than silicon carbide, a plasticizer, and a lubricant. Examples of the ceramic particles made of a material other than silicon carbide include carbides made of tantalum carbide, tungsten carbide and the like, and ceramic particles made of nitrides such as aluminum nitride, silicon nitride and boron nitride. Examples of the plasticizer include polyoxyalkylene compounds such as polyoxyethylene alkyl ether and polyoxypropylene alkyl ether. Examples of the lubricant include glycerin.

As shown in FIG. 5A, the clay-like mixture is used to partition a rectangular tubular peripheral wall 11 and a partition wall that divides the inside of the peripheral wall 11 into a plurality of gas flow cells C extending in the axial direction of the peripheral wall 11. A molded body (first molded body 20) including the 12 is molded. Both ends of the first molded body 20 are open for all gas distribution cells C. The first molded body 20 can be molded by, for example, extrusion molding.

As shown in FIG. 5B, a bottomed box-shaped molded body (second molded body 21) is molded using the same clay-like mixture as the first molded body 20. The second molded body 21 is configured to have a length approximately twice the axial length of the first molded body 20. The second molded body 21 can be molded by, for example, press molding. As will be described later, the second molded body 21 is assembled together with the first molded body 20 to form a storage portion.

If necessary, the obtained first molded body 20 and the second molded body 21 are subjected to a drying treatment. Specific methods of the drying treatment include, for example, a drying treatment using a microwave dryer, a hot air dryer, a dielectric dryer, a vacuum dryer, a vacuum dryer, a freeze dryer and the like.

(Processing process)
In the processing step, a first process of forming a through hole in the first molded body 20 and a second process of sealing both ends of some cells in the first molded body 20 are performed.

As shown in FIG. 6, in the first processing, for example, a method of bringing a heated processing tool into contact with the first molded body 20 is used to remove a part of the peripheral wall 11 and the partition wall 12 in the first molded body 20. To form a through hole.

Specifically, as shown in FIG. 6, a blade 25 having an outer shape corresponding to the through hole is prepared as a processing tool. The blade 25 is made of a heat-resistant metal (for example, stainless steel), and its thickness is set so as not to exceed the width of the gas flow cell C. Next, the blade 25 is heated so that the organic content contained in the first molded body 20 is burnt down. For example, when the organic component is methyl cellulose, the blade 25 is heated to 400 ° C. or higher. The heated blade 25 is inserted from the opposite side (upper side in FIG. 6) of the peripheral wall 11 of the first molded body 20, and the tip of the blade 25 is inserted from the opposite side (lower side in FIG. 6) of the peripheral wall 11. Make it stick out.

As shown in FIG. 7, the heated blade 25 is inserted into the first molded body 20 from the outside in the circumferential direction and then pulled out to form a section 12 located between the facing peripheral wall 11 and the facing peripheral wall 11. A through hole 17 penetrating the wall is formed. At this time, when the heated blade 25 and the first molded body 20 come into contact with each other, the organic components contained in the first molded body 20 are burned and burned at the contact portion. Therefore, the insertion resistance of the blade 25 with respect to the first molded body 20 is very small, and when the blade 25 is inserted, the peripheral portion of the inserted portion is unlikely to be deformed or broken. In addition, the amount of processing waste generated is reduced by burning off the organic matter. The through hole 17 formed in the first processing functions as a heat medium flow passage R2 as described later.

As shown in FIG. 8, in the second processing, among the plurality of gas flow cells C formed in the first molded body 20, both ends of the cell C in which the through holes 17 are formed are used in the molding step. The clay-like mixture that has been used is filled as a sealing material to form a sealing portion 22 that seals both ends of the cell C. After that, the first molded body 20 is subjected to a drying treatment for drying the sealing portion 22.

The processed molded product 23 is obtained by going through the processing steps including the first processing and the second processing described above. The order of the first processing and the second processing is not particularly limited, and the first processing may be performed after the second processing.

(Assembly process)
The assembling step is a step of assembling the second molded body 21 obtained in the molding step and the processed molded body 23 obtained in the processing step.

As shown in FIG. 9, the two processed molded bodies 23 are arranged with their axial end faces aligned with each other. Further, the second molded body 21 is arranged below the two processed molded bodies 23 to produce the assembly 24. When the assembly 24 is manufactured, an adhesive may be applied between the second molded body 21 and the processed molded body 23.

(Degreasing process and impregnation process)
The degreasing step is a step of burning off the organic matter contained in the assembly 24 by heating the assembly 24. As shown in FIG. 10, by going through the degreasing step, a porous degreasing body 30 having a skeleton portion arranged in a state where the silicon carbide particles are in contact with each other can be obtained.

The impregnation step is a step of impregnating the inside of each wall of the degreasing body 30 with metallic silicon. As shown in FIG. 11, by going through the impregnation step, metallic silicon is filled in the gaps of the silicon carbide particles constituting each wall of the degreased body 30. Then, a heat exchanger 10 including a cylindrical peripheral wall 11, a plurality of gas flow passages R1 (gas flow cell C) inside the peripheral wall 11, and a partition wall 12 for partitioning the inside of the peripheral wall 11 into a plurality of heat medium flow passages R2 is obtained. Be done. A storage unit 13 connecting the inflow path 14a and the outflow path 14b to the end of the inflow path 14a on the side opposite to the inflow port 15a side and the end of the outflow path 14b on the side opposite to the outflow port 15b side. It will be configured to include.

Here, in the production method of the present embodiment, the degreasing step and the impregnation step are continuously performed by a multi-step heat treatment in different temperature ranges.
As shown in FIG. 12, the assembly 24 is arranged in a bottomed box-shaped heat-resistant container 40 made of graphite or the like. In FIG. 12, the cross-sectional shape of the assembly 24 is omitted. The assembly 24 is placed in the container 40 via the support 41 by being placed on the support 41 arranged on the bottom surface of the container 40. The support 41 is formed in a size and shape that contacts only a part of the lower surface of the assembly 24, and supports the assembly 24 at one or several points on the lower surface of the assembly 24. The number of supports 41 may be singular or plural.

Examples of the shape of the support 41 include a prismatic shape, a cylindrical shape, a pyramidal cone shape, and a truncated cone shape. Among these, a pyramidal cone shape or a truncated cone shape is particularly preferable from the viewpoint that the number of contacts with the lower surface of the assembly 24 can be reduced.

The support 41 is made of a porous material having continuous pores having a size sufficient to cause a capillary phenomenon. Examples of the porous material constituting the support 41 include a porous material made of silicon carbide and a porous material made of carbon such as graphite. The porosity of the porous material constituting the support 41 is, for example, 20 to 60%.

Further, solid metallic silicon 42 such as powder, granules, and lumps is arranged in the gap S between the bottom surface of the container 40 and the assembly 24 placed on the support 41. As the metallic silicon 42, it is preferable to use metallic silicon having a purity of less than 98%. Solid metallic silicon tends to have a lower melting point as its purity decreases. Therefore, by using low-purity metallic silicon, the heating temperature required for the impregnation step can be kept low. As a result, the manufacturing cost can be suppressed. The purity of metallic silicon is, for example, 95% or more.

The amount of metallic silicon 42 contained in the container 40 is, for example, an amount corresponding to the sum of the pore volumes of the degreased body 30 obtained from the assembly 24 and the pore volumes of the support 41 (for example, 1.00 of the above sum). (Amount corresponding to ~ 1.05 times the volume). In this case, the porosity of the heat exchanger 10 can be brought close to 0%. In addition, the amount of metallic silicon 42 used can be suppressed, and the manufacturing cost can be suppressed.

As described above, with the assembly 24 and the metallic silicon 42 arranged in the container 40, the container 40 is placed in an inert atmosphere such as argon or nitrogen or under vacuum using a known heating means such as a firing furnace. To heat. At this time, the container 40 is heated in multiple stages in different temperature ranges.

Specifically, as shown in FIG. 13, the temperature inside the container 40 is raised to the first temperature and held at the first temperature for a certain period of time to perform primary heating. After that, the temperature inside the container 40 is raised to a second temperature higher than the first temperature and held for a certain period of time to perform secondary heating. After that, the temperature inside the container 40 is lowered.

The primary heating is a heat treatment corresponding to the degreasing step. The first temperature of the primary heating is a temperature at which the organic matter is burnt out and is lower than the melting point of the metallic silicon, and is set according to the type of the organic matter contained in the assembly 24. By the primary heating, the organic component contained in the assembly 24 is burnt down, and the assembly 24 becomes a degreased body 30. At this time, since the temperature inside the container 40 (first temperature) is lower than the melting point of the metallic silicon, the metallic silicon 42 housed in the container 40 is maintained in a solid state.

The first temperature is, for example, preferably 400 ° C. or higher and 1400 ° C. or lower, and more preferably 450 ° C. or higher and 1000 ° C. or lower. By setting the temperature in the above temperature range, it is possible to more reliably burn off the organic component while suppressing the melting of the metallic silicon 42.

The primary heating is preferably performed until the organic content contained in the assembly 24 is completely removed. For example, by a preliminary test in advance, the heating time for the degreased body 30 in the state where the organic component contained in the assembly 24 is removed is measured, and the temperature inside the container 40 is set to the first temperature after the lapse of the heating time. The temperature is raised from the temperature to the second temperature.

The secondary heating is a heat treatment corresponding to the impregnation step. The second temperature of the secondary heating is set to be equal to or higher than the melting point of metallic silicon. The secondary heating melts the metallic silicon 42 contained in the container 40. Then, the molten metallic silicon enters the gaps of the silicon carbide particles constituting each wall of the degreased body 30 through the support 41 made of a porous material by the capillary phenomenon, and the metallic silicon 42 is impregnated in the gaps. At this time, the metal silicon 42 is also impregnated in the boundary portion between the second molded bodies 21 in the degreased body 30 and the boundary portion between the second molded body 21 and the processed molded body 23, whereby the second molded bodies 21 are impregnated with each other. And the contact between the second molded body 21 and the processed molded body 23 can be achieved. As a result, the heat exchanger 10 is obtained in which the gaps between the silicon carbide particles constituting each wall are impregnated with the metallic silicon 42, and the portions of the second molded body 21 and the processed molded body 23 are integrated.

The second temperature is preferably, for example, a temperature of 1420 ° C. or higher. By setting the temperature in the above temperature range, metallic silicon can be impregnated more reliably.
The second temperature is, for example, preferably 2000 ° C. or lower, and more preferably 1900 ° C. or lower. By setting the temperature within the above temperature range, the manufacturing cost can be suppressed from the viewpoint of equipment, energy and the like. Further, the thermal expansion of the degreased body is suppressed, and damage due to the thermal expansion is less likely to occur.

The second temperature is preferably a temperature lower than the sintering temperature of silicon carbide contained in the mixture used in the molding step (for example, 2000 ° C. or lower). By setting the temperature in the above temperature range, the obtained heat exchanger 10 becomes an unsintered honeycomb structure in which most of the silicon carbide particles, which are the constituents thereof, are not sintered and exist independently of each other. This unsintered honeycomb structure has a high Young's modulus and is not easily deformed, and is useful as a heat exchanger.

The secondary heating is preferably performed until the gaps between the silicon carbide particles constituting each wall of the degreased body 30 are sufficiently impregnated with metallic silicon. For example, when the amount of metallic silicon 42 contained in the container 40 is an amount corresponding to the sum of the pore volume of the degreased body 30 and the pore volume of the support 41, all the metallic silicon 42 is impregnated. Therefore, it can be determined that the metallic silicon is sufficiently impregnated.

Then, after the secondary heating, the temperature inside the container 40 is lowered, the heat exchanger 10 is taken out from the container 40, and the support 41 integrated on the lower surface of the heat exchanger 10 is separated. As a result, the heat exchanger 10 is obtained.

Through the above impregnation step, the heat exchanger 10 including a cylindrical peripheral wall 11, a plurality of gas flow cells C inside the peripheral wall 11, and a partition wall 12 for partitioning the inside of the peripheral wall 11 into a plurality of heat medium flow passages R2 is provided. can get. The heat medium flow passage includes an inflow path for the heat medium that opens in the peripheral wall, an outflow path for the heat medium that opens in the peripheral wall, and a storage section for storing the heat medium. A heat exchanger is obtained that communicates with the medium.

Next, the operation and effect of this embodiment will be described.
(1) The heat medium flow passage includes an inflow path for the heat medium that opens in the peripheral wall, an outflow path for the heat medium that opens in the peripheral wall, and a storage portion for storing the heat medium. It communicates through the department.

Since the heat medium flow path includes a storage section that communicates the inflow path and the outflow path, the heat medium flowing in from the inflow port flows out from the outflow port through the inflow path, the storage section, and the outflow path in order. With such a flow path configuration, as compared with the conventional heat exchanger shown in FIG. 16, a large number of passages (first cell 52) are arranged side by side between the inflow path and the outflow path. Therefore, it is easy to release the expansion pressure to the outside of the heat exchanger. The result is a heat exchanger in which damage to the partition wall due to freezing of the heat medium is suppressed.

(2) A plurality of inflow paths and a plurality of outflow channels are provided, and the plurality of inflow paths and the plurality of outflow channels communicate with one common storage unit. Therefore, it becomes easy to increase the cross-sectional area of the flow path of the storage portion. Further, as compared with the case where separate storage portions are provided, it is possible to reduce the number of partition walls that partition between the storage portions, so that the number of partition walls on which the expansion pressure acts can be reduced. As a result, damage to the partition wall due to freezing of the heat medium can be suppressed.

(3) The cross-sectional area of the flow path of the storage portion shall be 100 to 400 times the cross-sectional area of the flow path of the gas flow cell. Therefore, since the cross-sectional area of the flow path of the storage portion becomes relatively large, it becomes easy to release the expansion pressure to the outside of the heat exchanger.

(4) The partition wall contains silicon carbide as a main component. Since silicon carbide is a material having a high thermoelectric conductivity among ceramic materials, it is possible to improve the heat exchange efficiency of the heat exchanger.

(5) The heat medium flow passage can store a certain amount of heat medium in the storage unit. Therefore, the storage unit can be used as a buffer against a sudden change in the flow rate of the heat medium when the heat exchanger is used.

This embodiment can be modified and implemented as follows. Further, it is also possible to appropriately combine the configurations of the above-described embodiment and the configurations shown in the following modified examples.
-In the present embodiment, the heat exchanger is configured such that the dimension in the width direction (horizontal direction in FIG. 2) is larger than the dimension in the vertical direction, but the present invention is not limited to this embodiment. The vertical dimension may be larger than the width dimension, or the vertical dimension and the width direction may be the same dimension.

-In the present embodiment, in the gas flow cell, eight gas flow cells are arranged parallel to the vertical side wall of the peripheral wall, and the arrangement pattern in which four rows of the cell rows are provided along the lateral side wall of the peripheral wall is sealed. It was repeated through the section and the heat medium flow path, but is not limited to this embodiment. The arrangement pattern of the gas distribution cell can be appropriately selected. Similarly, the heat medium flow path can be appropriately selected and formed.

-In the present embodiment, the opening on one end side in the axial direction of the peripheral wall is used as the inlet of the heat medium, and the opening on the other end side of the peripheral wall in the axial direction is used as the outlet of the heat medium, but the present invention is not limited to this embodiment. The positions of the inflow port and the outflow port may be reversed. Further, the inlet and outlet of the heat medium may be appropriately selected in the plurality of openings provided in the peripheral wall.

-The cross-sectional area of the flow path of the storage portion is not limited to the mode in which the cross-sectional area of the flow path of the gas flow cell is larger than the cross-sectional area of the flow path of the gas flow cell. As long as the flow rate of the heat medium flowing through the storage section can be secured, the flow path cross-sectional area of the storage section may be configured to be substantially equal to the flow path cross-sectional area of the gas flow cell, or the gas flow cell. It may be configured to be smaller than the flow path cross-sectional area.

-The plurality of inflow channels and the plurality of outflow channels are not limited to the mode in which the plurality of inflow channels and the plurality of outflow channels communicate with one common reservoir. For example, a plurality of storage units may be substantially formed by providing a plurality of partitions inside the storage units, and each storage unit may have an inflow path and an outflow path in communication with each other.

-The peripheral wall is not limited to a rectangular cylinder. It may be formed in a cylindrical shape or a cylindrical shape having an elliptical cross section. As shown in FIG. 14, for example, the peripheral wall 11c is made cylindrical by forming the first molded body, the second molded body, and the interlayer material into a cylindrical shape when assembled in the assembly step. It becomes possible. Further, the cross-sectional shape of the gas flow cell and the heat medium flow path is not limited to the rectangular cross-sectional shape. It may be a polygonal shape other than a rectangular shape, or may be a circular shape or an elliptical shape. The corners of the polygonal shape may be chamfered. The shape may be different between the inflow path and the outflow path of the heat medium flow path.

-The heat medium flow path is not limited to the mode in which the inflow path and the outflow path are formed so as to extend in parallel with each other in the direction orthogonal to the axial direction of the peripheral wall. The shapes of the inflow path and the outflow path can be appropriately selected by changing the shape of the communication portion formed in the first processing. For example, as shown in FIG. 15, the inflow path 16a and the outflow path 16b may be formed so as to extend in a V shape.

-In the present embodiment, the second molded body constituting the storage portion is integrated with the first molded body, but may be formed as a separate body. For example, the storage unit may be prepared as a separate member, and after the assembly step, the degreasing step, and the impregnation step are performed on the first molded body, the storage unit may be arranged via the packing. In this case, the storage material is not limited to the ceramic material, and may be made of a metal material such as stainless steel.

10 ... heat exchanger, 11 ... peripheral wall, 12 ... partition wall, 13 ... reservoir, 14a ... inflow path, 14b ... outflow channel, 15a ... inlet, 15b ... outlet, R1 ... gas flow path, R2 ... heat medium Flow passage.

Claims (2)

A tubular peripheral wall and a partition wall for partitioning the inside of the peripheral wall into a plurality of gas flow passages and a plurality of heat medium flow passages are provided, and the gas flowing through the gas flow passages and the heat medium flow passages are circulated. A heat exchanger that exchanges heat with a liquid heat medium.
The heat medium flow path is
The inflow path of the heat medium that opens in the peripheral wall and
The outflow path of the heat medium that opens in the peripheral wall,
A storage unit for storing the heat medium is provided.
A heat exchanger in which the inflow path and the outflow path communicate with each other through the storage portion. A plurality of the inflow channels and a plurality of the outflow paths are provided.
The heat exchanger according to claim 1, wherein the plurality of inflow passages and the plurality of outflow passages communicate with one common storage unit.

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