JP7009963B2 - Cooling device and power conversion device - Google Patents

Cooling device and power conversion device Download PDF

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JP7009963B2
JP7009963B2 JP2017233887A JP2017233887A JP7009963B2 JP 7009963 B2 JP7009963 B2 JP 7009963B2 JP 2017233887 A JP2017233887 A JP 2017233887A JP 2017233887 A JP2017233887 A JP 2017233887A JP 7009963 B2 JP7009963 B2 JP 7009963B2
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electrolytic corrosion
joint
heat sink
cooling device
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幸司 村田
広行 日吉
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Meidensha Corp
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Description

本発明は、冷却液を循環させる冷却装置に関する。特に、電力変換装置に備えられる冷却装置の漏れ電流腐食対策構造に関する。 The present invention relates to a cooling device that circulates a coolant. In particular, the present invention relates to a leakage current corrosion countermeasure structure of a cooling device provided in a power conversion device.

図４に示すように、電力変換装置１２には半導体素子１３が設けられ、半導体素子１３のスイッチングに伴い半導体素子１３が発熱する。特に、発熱量が多い半導体素子１３では、水冷式のヒートシンク１４を備える冷却装置１５が採用される。 As shown in FIG. 4, the power conversion device 12 is provided with the semiconductor element 13, and the semiconductor element 13 generates heat as the semiconductor element 13 switches. In particular, in the semiconductor element 13 having a large amount of heat generation, a cooling device 15 provided with a water-cooled heat sink 14 is adopted.

ヒートシンク１４の内部には、冷却液が流通する流路が設けられる。そして、冷却液が主配水管１６とヒートシンク１４の内部の間で循環され、半導体素子１３等が冷却される（例えば、特許文献１、２）。冷却液は、例えば、電気抵抗率の高い純水や不凍液水が用いられる。 Inside the heat sink 14, a flow path through which the coolant flows is provided. Then, the coolant is circulated between the main water pipe 16 and the inside of the heat sink 14, and the semiconductor element 13 and the like are cooled (for example, Patent Documents 1 and 2). As the coolant, for example, pure water or antifreeze water having a high electrical resistivity is used.

ヒートシンク１４は、冷却性能を考慮して銅等により形成される。ヒートシンク１４には、ステンレス製の竹の子ニップル１７がろう付け等で取り付けられ、竹の子ニップル１７に絶縁性の配管１８が接続される。つまり、ヒートシンク１４の流路と主配水管１６は、絶縁性の配管１８と竹の子ニップル１７、１９を介して接続される。 The heat sink 14 is made of copper or the like in consideration of cooling performance. A bamboo shoot nipple 17 made of stainless steel is attached to the heat sink 14 by brazing or the like, and an insulating pipe 18 is connected to the bamboo shoot nipple 17. That is, the flow path of the heat sink 14 and the main water pipe 16 are connected to the insulating pipe 18 via the bamboo shoot nipples 17 and 19.

ヒートシンク１４には半導体素子１３が取り付けられるため、竹の子ニップル１７の先端部分に電気回路電圧（通常は、５００Ｖ以上の電圧）が印加される。主配水管１６は、接地されており、電位差により水路に漏れ電流が発生する。そのため、印加電圧がかかる竹の子ニップル１７の先端部がイオン化して腐食する電食が発生する。腐食が進むと冷却水漏れなどの故障が発生するおそれがある。 Since the semiconductor element 13 is attached to the heat sink 14, an electric circuit voltage (usually a voltage of 500 V or more) is applied to the tip portion of the bamboo shoot nipple 17. The main water pipe 16 is grounded, and a leakage current is generated in the water channel due to the potential difference. Therefore, electrolytic corrosion occurs in which the tip of the bamboo shoot nipple 17 to which the applied voltage is applied is ionized and corroded. If corrosion progresses, failures such as cooling water leakage may occur.

そこで、従来の冷却装置１５では、冷却水が流通する流路内に電食棒２０を備え、電食棒２０を疑似電極棒として腐食させて、他の部材の腐食進行を抑え、保護している。 Therefore, in the conventional cooling device 15, an electrolytic corrosion rod 20 is provided in the flow path through which the cooling water flows, and the electrolytic corrosion rod 20 is corroded as a pseudo electrode rod to suppress and protect the corrosion progress of other members. There is.

図５に示すように、ヒートシンク１４には、ステンレス製の電食棒２０が設けられる。図５（ｃ）に示すように、電食棒２０は、ヒートシンク１４内にＯリング２１を取り付けて、ねじ止めにてヒートシンク１４に固定される。電食棒２０は、ヒートシンク１４の流路内から、絶縁性の配管１８まで延在している。 As shown in FIG. 5, the heat sink 14 is provided with a stainless steel electrolytic corrosion rod 20. As shown in FIG. 5 (c), the electrolytic corrosion rod 20 has an O-ring 21 mounted in the heat sink 14 and is fixed to the heat sink 14 by screwing. The electrolytic corrosion rod 20 extends from the flow path of the heat sink 14 to the insulating pipe 18.

絶縁性の配管１８の長さＬ（ｃｍ）は、回路電圧Ｖ（Ｖ）と冷却液の電気抵抗率（水比抵抗）Ｂ（Ω・ｃｍ）から式（１）により求められる。式（１）において、Ａは、絶縁性の配管１８の流路断面積（ｃｍ2）、Ｉｗは、漏れ電流（Ａ）である。
Ｌ＝（Ｖ・Ａ）／（Ｂ・Ｉｗ） …（１）
また、電食棒２０の電食量Ｇ（ｇ）は、漏れ電流Ｉｗ（Ａ）から式（２）により求められる。式（２）において、Ｍは、電食棒２０の電気化学当量（ｇ／Ａ・ｈ）、Ｈは、通電時間（ｈ）、ｋは、周波数係数である。電食棒２０の電食量Ｇに基づいて、電食棒２０の長さが決められる。
Ｇ＝Ｍ・Ｉｗ・Ｈ・ｋ …（２）
電食棒２０は、通常定期交換部材であり、絶縁性の配管１８を透明とすることで、定期点検にて、電食棒２０の腐食状況が確認される。 The length L (cm) of the insulating pipe 18 is obtained by the equation (1) from the circuit voltage V (V) and the electrical resistivity (water resistivity) B (Ω · cm) of the coolant. In the formula (1), A is the flow path cross-sectional area (cm 2 ) of the insulating pipe 18, and Iw is the leakage current (A).
L = (VA) / (B ・ Iw)… (1)
Further, the electrolytic corrosion amount G (g) of the electrolytic corrosion rod 20 is obtained from the leakage current Iw (A) by the formula (2). In the formula (2), M is the electrochemical equivalent (g / A · h) of the electrolytic corrosion rod 20, H is the energization time (h), and k is the frequency coefficient. The length of the electrolytic corrosion rod 20 is determined based on the electrolytic corrosion amount G of the electrolytic corrosion rod 20.
G = M ・ Iw ・ H ・ k… (2)
The electrolytic corrosion rod 20 is usually a regular replacement member, and by making the insulating pipe 18 transparent, the corrosion status of the electrolytic corrosion rod 20 can be confirmed by periodic inspection.

また、特許文献２では、電食棒を取り付けることなく電食を防止する構造が提案されている。具体的に説明すると、半導体素子のアノード側およびカソード側に電極を設け、カソード側の電極に冷却水を流通させるとともに、アノード側電極には冷却水を流通させないようにして、電食が発生しないようにしている。しかし、この構造は、平形の半導体素子には、適用可能であるが、モジュール型の半導体素子では底面にヒートシンクを取り付ける必要があるため、適用することが困難となるおそれがある。 Further, Patent Document 2 proposes a structure for preventing electrolytic corrosion without attaching an electrolytic corrosion rod. Specifically, electrodes are provided on the anode side and the cathode side of the semiconductor element, and cooling water is circulated through the electrodes on the cathode side, and cooling water is not circulated through the electrodes on the anode side, so that electrolytic corrosion does not occur. I am doing it. However, although this structure can be applied to a flat semiconductor element, it may be difficult to apply it to a modular semiconductor element because a heat sink needs to be attached to the bottom surface.

特開２００３－１３４８２３号公報Japanese Patent Application Laid-Open No. 2003-134823 特開平１０－３３５７２７号公報Japanese Unexamined Patent Publication No. 10-335727

電食棒をヒートシンクに設けた場合、電食棒の接続部分（例えば、ねじ止め構造）において、水密性の信頼性が低下するおそれがある。 When the electrolytic corrosion rod is provided on the heat sink, the reliability of watertightness may decrease at the connection portion (for example, a screwed structure) of the electrolytic corrosion rod.

また、万が一電食棒が配管の内面に当たると、配管を傷つけるおそれや、配管の傷から水漏れするおそれがある。また、配管内に電食棒を備えることで、水路圧力損失が大きくなる。 In addition, if the electrolytic corrosion rod hits the inner surface of the pipe, the pipe may be damaged or water may leak from the scratch on the pipe. Further, by providing the electrolytic corrosion rod in the pipe, the water channel pressure loss becomes large.

また、電食棒をヒートシンク内の流路と水密性を確保して取り付ける必要があるので、電食棒の取付けや交換に時間を要するおそれがある。 Further, since it is necessary to secure the watertightness with the flow path in the heat sink and attach the electrolytic corrosion rod, it may take time to attach or replace the electrolytic corrosion rod.

本発明は、上記事情に鑑みてなされたものであり、電力変換装置の冷却装置の配管または継手の腐食を抑制する技術を提供することを目的としている。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a technique for suppressing corrosion of a pipe or a joint of a cooling device of a power conversion device.

上記目的を達成する本発明の冷却装置の一態様は、
電力変換装置を冷却する液冷式のヒートシンクと、
前記ヒートシンクに接続される第１配管と、
前記第１配管に備えられる継手と、
前記継手に差し込んで取り付けられる第２配管と、
前記継手の前記第２配管が差し込まれる接続孔内であって、当該接続孔に差し込まれた前記第２配管の端面と対向して備えられる電食リングと、を備えたことを特徴としている。 One aspect of the cooling device of the present invention that achieves the above object is
A liquid-cooled heat sink that cools the power converter,
The first pipe connected to the heat sink and
The joint provided in the first pipe and
The second pipe that is inserted into the joint and attached,
It is characterized in that it is provided with an electrolytic corrosion ring provided in the connection hole into which the second pipe of the joint is inserted and facing the end surface of the second pipe inserted into the connection hole.

また、上記目的を達成する本発明の冷却装置の他の態様は、上記冷却装置において、
前記第１配管と前記第２配管により形成される管路に一対の止水バルブを備え、
前記継手が、前記一対の止水バルブ間に備えられた、ことを特徴としている。 In addition, another aspect of the cooling device of the present invention that achieves the above object is the above cooling device.
A pair of water stop valves are provided in the pipeline formed by the first pipe and the second pipe.
The joint is provided between the pair of water stop valves.

また、上記目的を達成する本発明の電力変換装置は、上記いずれかの冷却装置を備えている。 Further, the power conversion device of the present invention that achieves the above object includes any of the above cooling devices.

以上の発明によれば、電力変換装置の冷却装置の配管または継手の腐食を抑制することができる。 According to the above invention, it is possible to suppress corrosion of the piping or the joint of the cooling device of the power conversion device.

（ａ）本発明の実施形態に係る電力変換装置の要部断面図、（ｂ）冷却装置に備えられるヒートシンクに接続される配管を示す図である。(A) A cross-sectional view of a main part of the power conversion device according to the embodiment of the present invention, and (b) a diagram showing a pipe connected to a heat sink provided in the cooling device. （ａ）電食リングの正面図、（ｂ）電食リングの側面図である。(A) A front view of the electrolytic corrosion ring and (b) a side view of the electrolytic corrosion ring. 本発明の実施形態に係る電力変換装置の他例の要部断面図である。It is sectional drawing of the main part of another example of the power conversion apparatus which concerns on embodiment of this invention. 従来技術に係る電力変換装置の要部側面図である。It is a side view of the main part of the power conversion apparatus which concerns on the prior art. （ａ）ヒートシンクに備えられた電食棒を示す上面図、（ｂ）ヒートシンクに備えられる電食棒を示す図、（ｃ）ヒートシンクに備えられた電食棒を示す横断面図である。(A) A top view showing an electrolytic corrosion rod provided on a heat sink, (b) a view showing an electrolytic corrosion rod provided on a heat sink, and (c) a cross-sectional view showing an electrolytic corrosion rod provided on the heat sink.

本発明の実施形態に係る冷却装置および電力変換装置について、図面に基づいて詳細に説明する。 The cooling device and the power conversion device according to the embodiment of the present invention will be described in detail with reference to the drawings.

図１（ａ）に示すように、本発明の実施形態に係る電力変換装置１は、半導体素子２等により構成される電力変換回路３と、半導体素子２等の発熱部品を冷却する冷却装置４を備える。 As shown in FIG. 1A, the power conversion device 1 according to the embodiment of the present invention includes a power conversion circuit 3 composed of a semiconductor element 2 and the like, and a cooling device 4 for cooling heat-generating components such as the semiconductor element 2. To prepare for.

冷却装置４は、内部に冷却液が循環される流路を有するヒートシンク５を備える。冷却液としては、例えば、電気抵抗率の高い純水や不凍液水が用いられる。 The cooling device 4 includes a heat sink 5 having a flow path inside which the cooling liquid is circulated. As the coolant, for example, pure water or antifreeze water having a high electrical resistivity is used.

ヒートシンク５には、銅管６がろう付け接合され、銅管６の先端には、継手７がろう付け接合される。継手７には、絶縁性の配管８が接続される。ヒートシンク５は、銅管６、継手７、配管８を介して主配水管（図示せず）に接続される。図１（ｂ）に示すように、ヒートシンク５には、冷却液が流入する側の流路と、冷却液が流出する側の流路にそれぞれ銅管６や継手７等が備えられる。図中の矢印は、冷却液の流れる方向を示している。 A copper tube 6 is brazed to the heat sink 5, and a joint 7 is brazed to the tip of the copper tube 6. An insulating pipe 8 is connected to the joint 7. The heat sink 5 is connected to a main water pipe (not shown) via a copper pipe 6, a joint 7, and a pipe 8. As shown in FIG. 1 (b), the heat sink 5 is provided with a copper pipe 6, a joint 7, and the like in the flow path on the side where the coolant flows in and the flow path on the side where the coolant flows out, respectively. The arrows in the figure indicate the direction in which the coolant flows.

図１（ａ）に示すように、継手７は、銅管６に接合される本体７ａと、本体７ａに備えられた配管８を締め付けるナット７ｂを備える。継手７は、耐食性を考慮して、例えば、ステンレス等により形成される。 As shown in FIG. 1A, the joint 7 includes a main body 7a joined to the copper pipe 6 and a nut 7b for tightening the pipe 8 provided in the main body 7a. The joint 7 is made of, for example, stainless steel in consideration of corrosion resistance.

継手７の本体７ａには、配管８が差し込まれる接続孔７ｃが形成される。接続孔７ｃの奥は、配管８の端面と対向する端部７ｄが形成されている。つまり、継手７は、銅管６と連通する銅管６側の流路と、銅管６側の流路と連通し、配管８が備えられる流路を備える。さらに、本体７ａの接続孔７ｃが形成された部分の外周部には、ねじが形成されており、このねじにナット７ｂが取り付けられる。また、接続孔７ｃの内周面と配管８の外周面との間には、フェルール等のシール材９が備えられる。 A connection hole 7c into which the pipe 8 is inserted is formed in the main body 7a of the joint 7. At the back of the connection hole 7c, an end portion 7d facing the end surface of the pipe 8 is formed. That is, the joint 7 includes a flow path on the copper tube 6 side that communicates with the copper tube 6 and a flow path that communicates with the flow path on the copper tube 6 side and is provided with the pipe 8. Further, a screw is formed on the outer peripheral portion of the portion of the main body 7a where the connection hole 7c is formed, and the nut 7b is attached to the screw. Further, a sealing material 9 such as a ferrule is provided between the inner peripheral surface of the connection hole 7c and the outer peripheral surface of the pipe 8.

配管８は、例えば、ポリテトラフルオロエチレン製のチューブである。配管８の一端は、継手７の接続孔７ｃに差し込まれて備えられる。接続孔７ｃの内部であって、接続孔７ｃに差し込まれた配管８の端部には、電食リング１０が備えられる。すなわち、電食リング１０は、継手７の接続孔７ｃ内であって、接続孔７ｃの奥の端部７ｄと配管８の端面の間に、配管８の端面と対向して備えられる。 The pipe 8 is, for example, a tube made of polytetrafluoroethylene. One end of the pipe 8 is provided by being inserted into the connection hole 7c of the joint 7. An electrolytic corrosion ring 10 is provided at the end of the pipe 8 inserted into the connection hole 7c inside the connection hole 7c. That is, the electrolytic corrosion ring 10 is provided in the connection hole 7c of the joint 7, between the end portion 7d at the back of the connection hole 7c and the end surface of the pipe 8, facing the end surface of the pipe 8.

図２に示すように、電食リング１０は、ステンレス等により形成された環状の部材である。電食リング１０の大きさは、電食リング１０の電食量Ｇに応じて定められる。つまり、配管８の長さＬを決めることで、式（１）から漏れ電流Ｉｗが算出される。そして、算出された漏れ電流Ｉｗや電食リング１０の電気化学当量Ｍ等を式（２）に代入して、電食リング１０の電食量Ｇが算出される。この電食量Ｇに応じて、電食リング１０の大きさが定められる。このように、冷却装置４の使用期間において想定される電食リング１０の電食量Ｇを算出して、電食リング１０の大きさを定めることで、電食リング１０の定期交換が不要となる。もし、電食リング１０の電食が想定を超えた場合は、電食リング１０の定期交換が行われる。 As shown in FIG. 2, the electrolytic corrosion ring 10 is an annular member made of stainless steel or the like. The size of the electrolytic corrosion ring 10 is determined according to the electrolytic corrosion amount G of the electrolytic corrosion ring 10. That is, by determining the length L of the pipe 8, the leakage current Iw is calculated from the equation (1). Then, the calculated leakage current Iw, the electrochemical equivalent M of the electrolytic corrosion ring 10, and the like are substituted into the equation (2) to calculate the electrolytic corrosion amount G of the electrolytic corrosion ring 10. The size of the electrolytic corrosion ring 10 is determined according to the electrolytic corrosion amount G. In this way, by calculating the electrolytic corrosion amount G of the electrolytic corrosion ring 10 assumed during the usage period of the cooling device 4 and determining the size of the electrolytic corrosion ring 10, periodic replacement of the electrolytic corrosion ring 10 becomes unnecessary. .. If the electrolytic corrosion of the electrolytic corrosion ring 10 exceeds the expectation, the electrolytic corrosion ring 10 is regularly replaced.

継手７に配管８を接続する際、継手７の接続孔７ｃに電食リング１０を入れて、接続孔７ｃに配管８を差し込む。そして、ナット７ｂにより継手７の本体７ａと配管８をかしめて、継手７に配管８が固定される。電力変換回路３に電圧（例えば、通常は、５００Ｖ以上）が印加されて漏れ電流が流れると、電食リング１０が疑似電極として腐食し、継手７の先端部等の管内の腐食進行が抑えられ、保護される。なお、電食リング１０と継手７を構成する材料が同じであったとしても、電位の先端部（接地されている主配水管に近い冷却液と接触している端部）に備えられた電食リング１０の方が先に腐食し、継手７の先端部等の腐食進行が抑制される。 When connecting the pipe 8 to the joint 7, the electrolytic corrosion ring 10 is inserted into the connection hole 7c of the joint 7, and the pipe 8 is inserted into the connection hole 7c. Then, the main body 7a of the joint 7 and the pipe 8 are crimped by the nut 7b, and the pipe 8 is fixed to the joint 7. When a voltage (for example, usually 500 V or more) is applied to the power conversion circuit 3 and a leakage current flows, the electrolytic corrosion ring 10 corrodes as a pseudo electrode, and the progress of corrosion in the pipe such as the tip of the joint 7 is suppressed. , Protected. Even if the materials constituting the electrolytic corrosion ring 10 and the joint 7 are the same, the electric potential provided at the tip of the potential (the end in contact with the cooling liquid near the grounded main water pipe). The corrosion ring 10 corrodes first, and the progress of corrosion of the tip of the joint 7 and the like is suppressed.

以上のような、本発明の実施形態に係る冷却装置４および電力変換装置１によれば、継手７内部に電食リング１０を備えることで、冷却装置４の流路内（銅管６や継手７等）の腐食（電食）を抑制することができる。 According to the cooling device 4 and the power conversion device 1 according to the embodiment of the present invention as described above, by providing the electrolytic corrosion ring 10 inside the joint 7, the inside of the flow path of the cooling device 4 (copper pipe 6 and the joint). 7 etc.) corrosion (electrolytic corrosion) can be suppressed.

また、電食リング１０が腐食しても、継手７部分の水密性は確保されているので、継手７部分の水密性を損なうことなく、電食対策を施すことができる。すなわち、電食リング１０を継手７の水密性に影響を与えない部分に備えることで、電食リング１０が腐食しても継手７部分の水密性を確保することができる。 Further, even if the electrolytic corrosion ring 10 is corroded, the watertightness of the joint 7 portion is ensured, so that the electrolytic corrosion countermeasure can be taken without impairing the watertightness of the joint 7 portion. That is, by providing the electrolytic corrosion ring 10 in a portion that does not affect the watertightness of the joint 7, even if the electrolytic corrosion ring 10 is corroded, the watertightness of the joint 7 portion can be ensured.

また、継手７の接続孔７ｃに電食リング１０を入れるだけで、簡単に電食リング１０を備えることができるので、電食リング１０の取付時間や継手７の組立時間を短縮することができる。また、電食リング１０の交換作業も容易となる。さらに、電食リング１０が環状であることで、従来のように電食棒を冷却液の流路に備えた場合と比較して、冷却液の流路の圧力損失を著しく低減することができる。 Further, since the electrolytic corrosion ring 10 can be easily provided by simply inserting the electrolytic corrosion ring 10 into the connection hole 7c of the joint 7, the mounting time of the electrolytic corrosion ring 10 and the assembly time of the joint 7 can be shortened. .. In addition, the replacement work of the electrolytic corrosion ring 10 becomes easy. Further, since the electrolytic corrosion ring 10 is annular, the pressure loss in the flow path of the coolant can be significantly reduced as compared with the case where the electrolytic corrosion rod is provided in the flow path of the coolant as in the conventional case. ..

また、図３に示すように、継手７の前後の配管（銅管６や配管８）に止水バルブ１１ａ、１１ｂを備えると、継手７部分の冷却液の流れを止めることが可能となる。つまり、止水バルブ１１ａ、１１ｂを閉じることで、継手７が容易に着脱でき、電食リング１０の交換がさらに容易となる。 Further, as shown in FIG. 3, if the water stop valves 11a and 11b are provided in the pipes (copper pipe 6 and pipe 8) before and after the joint 7, it is possible to stop the flow of the coolant in the joint 7. That is, by closing the water stop valves 11a and 11b, the joint 7 can be easily attached and detached, and the electrolytic corrosion ring 10 can be replaced more easily.

以上、具体的な実施形態を示して本発明の冷却装置および電力変換装置について説明したが、本発明の冷却装置および電力変換装置は、実施形態に限定されるものではなく、その特徴を損なわない範囲で適宜設計変更が可能であり、設計変更されたものも、本発明の技術的範囲に属する。 Although the cooling device and the power conversion device of the present invention have been described above with reference to specific embodiments, the cooling device and the power conversion device of the present invention are not limited to the embodiments and do not impair their characteristics. The design can be changed as appropriate within the range, and the changed design also belongs to the technical scope of the present invention.

例えば、実施形態の説明では、ヒートシンク５の冷却液が流出する側の銅管６に電食リング１０を備えた態様について説明したが、電食リング１０は、ヒートシンク５の冷却液が流入する側の銅管６に備える態様とすることもできる。 For example, in the description of the embodiment, the embodiment in which the electrolytic corrosion ring 10 is provided on the copper tube 6 on the side where the coolant of the heat sink 5 flows out is described, but the electrolytic corrosion ring 10 is on the side where the coolant of the heat sink 5 flows in. It is also possible to prepare for the copper tube 6 of the above.

また、実施形態の説明では、半導体素子２を冷却するヒートシンク５を備える冷却装置４を例示しているが、本発明の冷却装置を、水冷式変圧器やリアクトルの冷却装置に適用することもできる。 Further, in the description of the embodiment, the cooling device 4 provided with the heat sink 5 for cooling the semiconductor element 2 is exemplified, but the cooling device of the present invention can also be applied to a water-cooled transformer or a reactor cooling device. ..

１…電力変換装置
２…半導体素子
３…電力変換回路
４…冷却装置
５…ヒートシンク
６…銅管（第１配管）
７…継手
７ａ…本体、７ｂ…ナット、７ｃ…接続孔、７ｄ…端部
８…配管（第２配管）
９…シール材
１０…電食リング
１１ａ、１１ｂ…止水バルブ 1 ... Power conversion device 2 ... Semiconductor element 3 ... Power conversion circuit 4 ... Cooling device 5 ... Heat sink 6 ... Copper pipe (first pipe)
7 ... Joint 7a ... Main body, 7b ... Nut, 7c ... Connection hole, 7d ... End 8 ... Piping (second piping)
9 ... Sealing material 10 ... Electrolytic corrosion ring 11a, 11b ... Water stop valve

Claims (2)

電力変換装置を冷却する液冷式のヒートシンクと、
前記ヒートシンクに接続される第１配管と、
前記第１配管に備えられる継手と、
前記継手に差し込んで取り付けられる第２配管と、
前記継手の前記第２配管が差し込まれる接続孔内であって、当該接続孔に差し込まれた前記第２配管の端面と対向して備えられる電食リングと、を備え、
前記第１配管と前記第２配管により形成される管路に一対の止水バルブを備え、
前記継手が、前記一対の止水バルブ間に備えられた、ことを特徴とする冷却装置。 A liquid-cooled heat sink that cools the power converter,
The first pipe connected to the heat sink and
The joint provided in the first pipe and
The second pipe that is inserted into the joint and attached,
It is provided with an electrolytic corrosion ring provided in the connection hole into which the second pipe of the joint is inserted and facing the end surface of the second pipe inserted into the connection hole .
A pair of water stop valves are provided in the pipeline formed by the first pipe and the second pipe.
A cooling device characterized in that the joint is provided between the pair of water stop valves. 請求項１に記載の冷却装置を備えた、電力変換装置。 A power conversion device including the cooling device according to claim 1 .
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Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2007135279A (en) 2005-11-09 2007-05-31 Yaskawa Electric Corp Motor control device
JP2012047226A (en) 2010-08-25 2012-03-08 Daikin Industries Ltd Pipe joint, hot water supply device, air conditioning device, and floor heating device using the same
JP2015223014A (en) 2014-05-22 2015-12-10 田淵電機株式会社 High frequency power supply device

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Publication number Priority date Publication date Assignee Title
JP3207064B2 (en) * 1994-12-22 2001-09-10 関西電力株式会社 Cooling water piping for electrical equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007135279A (en) 2005-11-09 2007-05-31 Yaskawa Electric Corp Motor control device
JP2012047226A (en) 2010-08-25 2012-03-08 Daikin Industries Ltd Pipe joint, hot water supply device, air conditioning device, and floor heating device using the same
JP2015223014A (en) 2014-05-22 2015-12-10 田淵電機株式会社 High frequency power supply device

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