JP6977628B2 - Signal transmission cable manufacturing equipment and manufacturing method - Google Patents

Description

The present disclosure relates to a manufacturing apparatus and a manufacturing method of a signal transmission cable.

The signal transmission cable includes, for example, a signal line, an insulator layer that covers the periphery of the signal line, and a shield layer that covers the insulator layer. Conventionally, a technique for marking an insulator layer is known. In the technique described in Patent Document 1, an inkjet printer is used to mark the outer peripheral surface of the insulator layer.

Japanese Patent No. 3212528

In the technique described in Patent Document 1, the scattered matter of ink may contaminate the portion other than the portion to be marked. In that case, the adhesion between the insulator layer and the shield layer is lowered.
One aspect of the present disclosure is to provide an apparatus for manufacturing a signal transmission cable and a method for manufacturing a signal transmission cable, which can suppress a decrease in adhesion between an insulator layer and a shield layer even if marking is performed. do.

One aspect of the present disclosure is an apparatus for manufacturing a signal transmission cable including a signal line, an insulator layer covering the periphery of the signal line, and a plating layer covering the outer peripheral surface of the insulator layer. A pretreatment for alternately forming a first region and a second region having a larger surface roughness and / or water repellency than the first region on the outer peripheral surface along the longitudinal direction of the signal transmission cable. For signal transmission, comprising a unit and a plating unit for selectively forming the plating layer in the first region by performing a plating treatment on the outer peripheral surface on which the first region and the second region are formed. It is a cable manufacturing device.

In the signal transmission cable manufactured by the signal transmission cable manufacturing apparatus which is one aspect of the present disclosure, the portion where the plating layer is formed and the portion where the plating layer is not formed are the length of the signal transmission cable. It exists alternately along the direction. The portion where the plating layer is formed is the portion corresponding to the first region. The portion where the plating layer is not formed is a portion corresponding to the second region. The portion where the plating layer is not formed functions as a marking. Therefore, the signal transmission cable manufacturing apparatus, which is one aspect of the present disclosure, can form markings on the manufactured signal transmission cable.

The signal transmission cable manufacturing apparatus, which is one aspect of the present disclosure, can form markings without necessarily performing a treatment that may contaminate the outer peripheral surface of the insulator layer. Therefore, in the signal transmission cable manufactured by the signal transmission cable manufacturing apparatus, which is one aspect of the present disclosure, the adhesion between the insulator layer and the shield layer is high.

Another aspect of the present disclosure is a method of manufacturing a signal transmission cable including a signal line, an insulator layer covering the periphery of the signal line, and a plating layer covering the outer peripheral surface of the insulator layer. A first region and a second region having a larger surface roughness and / or water repellency than the first region are alternately formed on the outer peripheral surface along the longitudinal direction of the signal transmission cable. This is a method for manufacturing a signal transmission cable that selectively forms the plating layer in the first region by performing a plating treatment on the outer peripheral surface on which the first region and the second region are formed.

In the signal transmission cable manufactured by the method for manufacturing a signal transmission cable, which is another aspect of the present disclosure, the portion where the plating layer is formed and the portion where the plating layer is not formed are the parts of the signal transmission cable. It exists alternately along the longitudinal direction. The portion where the plating layer is formed is the portion corresponding to the first region. The portion where the plating layer is not formed is a portion corresponding to the second region. The portion where the plating layer is not formed functions as a marking. Therefore, according to the method for manufacturing a signal transmission cable, which is another aspect of the present disclosure, marking can be formed on the manufactured signal transmission cable.

According to the method for manufacturing a signal transmission cable, which is another aspect of the present disclosure, marking can be formed without necessarily performing a treatment that may contaminate the outer peripheral surface of the insulator layer. Therefore, in the signal transmission cable manufactured by the method for manufacturing the signal transmission cable, which is another aspect of the present disclosure, the adhesion between the insulator layer and the shield layer is high.

FIG. 1A is a side view showing the configuration of the pretreatment unit 1 in which the shutter unit 19 is in the shielded state, and FIG. 1B is a side view showing the configuration of the pretreatment unit 1 in which the shutter unit 19 is in the open state. FIG. 2A is a top view showing the configuration of the pretreatment unit 1 in which the shutter unit 19 is in the shielded state, and FIG. 2B is a top view showing the configuration of the pretreatment unit 1 in which the shutter unit 19 is in the open state. It is explanatory drawing which shows the structure of a plating unit 3. It is a perspective view which shows the structure of the unplated cable 23. It is a block diagram which shows the electric structure of a pretreatment unit 1. It is explanatory drawing which shows the structure of the preprocessed cable 56. It is a perspective view which shows the structure of the signal transmission cable 61. FIG. 8A is a photograph showing the state of the first region 57 in the unplated cable 23, and FIG. 8B is a photograph showing the state of the second region 59 in the unplated cable 23. It is a photograph showing the state near the boundary between the first region 57 and the second region 59 in the unplated cable 23. FIG. 10A is a photograph showing the dripping water on the first region 57, and FIG. 10B is a photograph showing the dripping water on the second region 59. It is a photograph showing the vicinity of the boundary between the first region 57 and the second region 59 of the signal transmission cable 61.

An exemplary embodiment of the present disclosure will be described with reference to the drawings.
<First Embodiment>
1. 1. Configuration of Signal Transmission Cable Manufacturing Equipment A configuration of a signal transmission cable manufacturing equipment (hereinafter referred to as a cable manufacturing equipment) will be described. The cable manufacturing apparatus includes a pretreatment unit 1 shown in FIGS. 1A, 1B, 2A, and 2B, and a plating unit 3 shown in FIG.

(1-1) Configuration of Pretreatment Unit 1 The pretreatment unit 1 includes an introduction reel 5, a delivery reel 7, a take-up reel 9, a take-up coil 11, a delivery guide jig 13, and a take-up guide jig 15. A dry ice blast device 17, a shutter unit 19, and a support portion 21 are provided. The dry ice blasting device 17 corresponds to a surface modification unit. The introduction reel 5, the delivery reel 7, the take-up reel 9, and the take-up coil 11 correspond to the moving unit. The shutter unit 19, the control unit 45 and the shutter drive unit 49 described later correspond to the control unit.

The introduction reel 5, the delivery reel 7, the take-up reel 9, and the take-up coil 11 are arranged along the transport direction T. The introduction reel 5, the delivery reel 7, and the take-up reel 9 rotate in the R direction, respectively, and convey the unplated cable 23, which will be described later, in the transfer direction T. The transport direction T is parallel to the longitudinal direction of the unplated cable 23. The unplated cable 23 to be conveyed moves relative to the dry ice blasting device 17.

The conveyed unplated cable 23 is wound around the take-up coil 11. The delivery guide jig 13 and the take-up guide jig 15 guide the unplated cable 23 to be conveyed. The support portion 21 supports the delivery reel 7 and the take-back reel 9.

The unplated cable 23 is a signal transmission cable having an unplated layer. As shown in FIG. 4, the unplated cable 23 is composed of a signal line 25 and an insulator layer 27. The insulator layer 27 covers the periphery of the signal line 25. The signal line 25 is composed of, for example, a strand. The signal line 25 may be, for example, a stranded wire formed by twisting a plurality of strands. In the case of stranded wire, the flexibility of the signal wire 25 is improved.

Examples of the material of the insulator layer 27 include polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), perfluoroethylene propene copolymer (FEP), ethylene / tetrafluoroethylene copolymer (ETFE), and tetrafluoroethylene-perfluoro. Dioxol copolymer (TFE / PDD), polyvinylidene fluoride (PVDF), polychlorotrifluoroethylene (PCTFE), ethylene-chlorotrifluoroethylene copolymer (ECTFE), polyvinylidene fluoride (PVF), silicone, polyethylene (PE) ) Etc. can be mentioned.

The material of the insulator layer 27 may be a foamable resin. When the material of the insulator layer 27 is a foamable resin, the dielectric constant and the dielectric loss tangent of the insulator layer 27 become smaller. As a method for producing the insulator layer 27 made of a foamable resin, for example, there is a method in which a resin and a foaming agent are kneaded and foamed by controlling the temperature and pressure when molding the insulator layer 27. Further, as another method for producing the insulator layer 27 made of a foamable resin, for example, there is a method in which nitrogen gas or the like is injected when the insulator layer 27 is high-pressure molded, and then the insulator layer 27 is decompressed and foamed.

Further, the insulator layer 27 made of a foamable resin may be manufactured as follows. An extruder having a desired shape is installed in the extruder. Using the extruder, the signal line 25 and the foamable resin are extruded at the same time. The foamable resin forms the insulator layer 27.

As shown in FIGS. 1A and 1B, the dry ice blasting device 17 includes a dry ice injection nozzle 29. The tip of the dry ice injection nozzle 29 faces the portion of the unplated cable 23 to be conveyed between the delivery reel 7 and the take-up reel 9. The dry ice blasting device 17 can eject dry ice particles from the dry ice ejection nozzle 29. If the shutter unit 19 does not block the flow of dry ice particles, the dry ice particles will collide with the unplated cable 23. As a result, the outer peripheral surface 27A of the insulator layer 27 is subjected to dry ice blasting treatment. Of the outer peripheral surface 27A, the portion subjected to the dry ice blast treatment is roughened and made water repellent as compared with the other portions.

Examples of the dry ice blasting apparatus 17 include Super Blast DSC-V Reborn and DSC-I, which are dry ice blasting apparatus manufactured by Kyodo International Co., Ltd. The following conditions are preferable as the treatment conditions for dry ice blasting.

Air pressure: 0.1 to 1.0 MPa
Particle size of dry ice particles φ: 0.3 to 3 mm
Distance from the outer peripheral surface 27A to the tip of the dry ice injection nozzle 29: 0 to 10 cm
Temperature of unplated cable 23 during dry ice blasting treatment: -80 ° C to room temperature As shown in FIGS. 1A and 1B, the shutter unit 19 is provided between the dry ice blasting device 17 and the unplated cable 23. To position. The shutter unit 19 includes a pair of fixing plates 31, 33, and a shutter 35. The fixing plates 31 and 33 are arranged in the vertical direction, and a space 37 is provided between them. The fixing plates 31 and 33 are provided with through holes 39 and 41, respectively. The dry ice injection nozzle 29 and the through holes 39 and 41 are arranged in the vertical direction.

The shutter 35 is housed in the space 37. The shutter 35 is held by a plurality of rollers 43 so as to be movable in the transport direction T and the opposite direction. As shown in FIG. 1A, the shutter 35 can move to both a position where the through holes 39 and 41 are closed and a position where the through holes 39 and 41 are opened as shown in FIG. 1B. In the following, the state in which the shutter 35 is in the position of closing the through holes 39 and 41 is referred to as a shielding state. Further, the state in which the shutter 35 is in the position where the through holes 39 and 41 are opened is defined as the open state.

When the shutter unit 19 is in the shielded state, the dry ice particles ejected from the dry ice ejection nozzle 29 are blocked by the shutter 35 and cannot reach the unplated cable 23. When the shutter unit 19 is in the open state, the dry ice particles ejected from the dry ice ejection nozzle 29 are not blocked by the shutter 35, pass through the through holes 39 and 41, and reach the unplated cable 23.

The electrical configuration of the pretreatment unit 1 is shown in FIG. The pretreatment unit 1 includes a control unit 45, a reel drive unit 47, a shutter drive unit 49, and a dry ice blast device 17. The control unit 45 is mainly composed of a well-known microcomputer having a CPU 53 and a semiconductor memory (hereinafter referred to as a memory 55) such as a RAM, a ROM, and a flash memory.

Various functions of the control unit 45 are realized by the CPU 53 executing a program stored in a non-transitional substantive recording medium. In this example, the memory 55 corresponds to a non-transitional substantive recording medium in which a program is stored. In addition, when this program is executed, the method corresponding to the program is executed. The number of microcomputers constituting the control unit 45 may be one or a plurality.

The control unit 45 controls each unit of the preprocessing unit 1. A part or all of the functions of the control unit 45 may be realized in terms of hardware by using one or a plurality of ICs and the like. Further, the control unit 45 may have hardware such as an electronic circuit in place of the computer or in addition to the computer. The electronic circuit may include at least one of a digital circuit and an analog circuit.

The reel drive unit 47 drives the introduction reel 5, the delivery reel 7, the take-up reel 9, and the take-up coil 11. The shutter drive unit 49 drives the shutter 35. The dry ice blasting device 17 is as described above.

(1-2) Plating unit 3
The plating unit 3 has the configuration shown in FIG. The plating unit 3 includes a degreasing unit 103, a surface modification unit 105, a first activation unit 107, a second activation unit 109, an electroless plating unit 111, an electrolytic plating unit 113, and a transfer unit 115. , Equipped with.

The degreasing unit 103 includes a degreasing tank 117 and a degreasing liquid 119. The degreasing liquid 119 is housed in the degreasing tank 117. The degreasing liquid 119 contains, for example, one or more of sodium borate, sodium phosphate, a surfactant and the like. The temperature of the degreasing liquid 119 is, for example, 40 to 60 ° C.

The surface modification unit 105 for performing the surface modification treatment for plating comprises a treatment tank 121 and a treatment liquid 123. The treatment liquid 123 is housed in the treatment tank 121. The treatment liquid 123 contains, for example, a permanganate solution or the like. The temperature of the treatment liquid 123 is, for example, 65 to 90 ° C.

The first activation unit 107 includes a first activation tank 125 and a first activation liquid 127. The first activation liquid 127 is housed in the first activation tank 125. The first activation liquid 127 contains, for example, one or more of palladium chloride, stannous chloride, concentrated hydrochloric acid and the like. The temperature of the first activating liquid 127 is, for example, 30 to 40 ° C.

The second activation unit 109 includes a second activation tank 129 and a second activation liquid 131. The second activation liquid 131 is housed in the second activation tank 129. The second activation liquid 131 contains, for example, sulfuric acid or the like. The temperature of the second activating liquid 131 is, for example, 0 to 50 ° C.

The electroless plating unit 111 includes an electroless plating tank 133 and an electroless plating solution 135. The electroless plating solution 135 is housed in the electroless plating tank 133. The electroless plating solution 135 contains, for example, copper sulfate, Rossiel salt, formaldehyde, sodium hydroxide and the like. The temperature of the electroless plating solution 135 is, for example, 20 to 30 ° C.

The electroplating unit 113 includes an electroplating tank 137, an electrolytic plating solution 139, a pair of anodes 141, and a power supply unit 143. The electrolytic plating solution 139 is housed in the electrolytic plating tank 137. The electrolytic plating solution 139 has, for example, the composition shown in Table 1 or Table 2. The temperature of the electrolytic plating solution 139 is, for example, 20 to 25 ° C.

アノード１４１は電解めっき液１３９の中に浸漬されている。アノード１４１は、例えば、銅湯から作製した溶融銅を圧延鋳造したものである。あるいは、アノード１４１は、以下のように製造されたものであってもよい。粗銅をアノードとし、ステンレス又はチタンをカソードとして種板電解を行う。カソード表面に析出した純銅板を剥ぎ取って、アノード１４１とする。電源ユニット１４３は、アノード１４１と、後述するボビン１６５、１６９との間に直流電圧を印加する。

The anode 141 is immersed in the electrolytic plating solution 139. The anode 141 is, for example, a rolled and cast molten copper produced from hot water. Alternatively, the anode 141 may be manufactured as follows. Seed plate electrolysis is performed using blister copper as the anode and stainless steel or titanium as the cathode. The pure copper plate deposited on the cathode surface is peeled off to obtain an anode 141. The power supply unit 143 applies a DC voltage between the anode 141 and the bobbin 165 and 169 described later.

The transport unit 115 includes a plurality of bobbins 145, 147, 149, 151, 153, 155, 157, 159, 161 and 163, 165, 167, 169. In the following, these may be collectively referred to as a bobbin group. The bobbins 165 and 169 are conductive. The bobbin 167 has an insulating property.

The bobbin groups are basically arranged in series along the transport direction D shown in FIG. The transport direction D is a direction from the degreasing unit 103 to the electroplating unit 113 through the surface modification unit 105, the first activation unit 107, the second activation unit 109, and the electroless plating unit 111 in this order.

A part of the bobbin 147 is immersed in the degreasing liquid 119. A part of the bobbin 151 is immersed in the treatment liquid 123. A part of the bobbin 155 is immersed in the first activation liquid 127. A part of the bobbin 159 is immersed in the second activation liquid 131. A part of the bobbin 163 is immersed in the electroless plating solution 135. The entire bobbin 167 is immersed in the electrolytic plating solution 139.

2. 2. Cable Manufacturing Method Performed by Cable Manufacturing Equipment The cable manufacturing method includes a pretreatment step and a plating treatment step.
(2-1) Pretreatment Step The pretreatment step is performed using the pretreatment unit 1. The introduction reel 5, the delivery reel 7, and the take-up reel 9 are each rotated in the R direction, and the unplated cable 23 is conveyed in the transfer direction T. The transport speed is preferably 0.2 to 5 m / min, more preferably 1 to 5 m / min.

While the unplated cable 23 is being conveyed, the dry ice blasting device 17 is in a state of continuously ejecting dry ice particles. Further, when the unplated cable 23 is being conveyed, the shutter unit 19 periodically repeats a shielded state and an open state.

As shown in FIG. 6, the outer peripheral surface 27A of the unplated cable 23 (hereinafter referred to as the pretreated cable 56) wound around the take-up coil 11 after the pretreatment step is formed with the first region 57. , Second regions 59 are alternately formed along the longitudinal direction of the pretreated cable 56. The first region 57 is a region that has passed under the through holes 39 and 41 when the shutter unit 19 is in a shielded state. The first region 57 has not been subjected to the dry ice blast treatment. The first region 57 has a smaller surface roughness and a smaller water repellency than the second region 59.

The second region 59 is a region that has passed under the through holes 39 and 41 when the shutter unit 19 is in the open state. The second region 59 has undergone a dry ice blast treatment. The second region 59 has a larger surface roughness and a larger water repellency than the first region 57. The width of the second region 59 can be, for example, about 20 mm.

A photograph showing the state of the first region 57 is shown in FIG. 8A. A photograph showing the state of the second region 59 is shown in FIG. 8B. FIG. 9 shows a photograph showing the state near the boundary between the first region 57 and the second region 59. The second region 59 has a larger surface roughness than the first region 57.

The dropping water on the first region 57 is shown in FIG. 10A. The dripping water on the second region 59 is shown in FIG. 10B. The second region 59 is more water repellent than the first region 57.
(2-2) Plating process The plating process is performed using the plating unit 3. The transport unit 115 continuously transports the pretreated cable 56 along the transport direction D by the bobbin group.

The pretreated cable 56 to be transported is first immersed in the degreasing liquid 119 in the degreasing unit 103 for 3 to 5 minutes. At this time, the oil and fat adhering to the outer peripheral surface 27A surface is removed.

Next, the pretreated cable 56 is immersed in the treatment liquid 123 for 8 to 15 minutes in the surface modification unit 105.
Next, the pretreated cable 56 is immersed in the first activation liquid 127 for 1 to 3 minutes in the first activation unit 107. At this time, a catalyst layer is formed on the outer peripheral surface 27A.

Next, the pretreated cable 56 is immersed in the second activation liquid 131 in the second activation unit 109 for 3 to 6 minutes. At this time, the surface of the catalyst layer is washed.
Next, the pretreated cable 56 is immersed in the electroless plating solution 135 in the electroless plating unit 111. The soaking time is, for example, 10 minutes or less. At this time, an electroless plating layer is formed on the outer peripheral surface 27A. The longer the immersion time in the electroless plating solution 135, the larger the thickness of the electroless plating layer.

Next, the pretreated cable 56 is immersed in the electrolytic plating solution 139 in the electrolytic plating unit 113. The soaking time is, for example, 3 minutes or less. At this time, the electrolytic plating layer is formed on the outer peripheral surface of the electroless plating layer. The electroless plating layer and the electrolytic plating layer correspond to the shield layer. The longer the immersion time in the electrolytic plating solution 139, the larger the thickness of the electrolytic plating layer. The specific conditions for electroplating in the electroplating unit 113 are as shown in Table 3.

なお、図３では記載を省略しているが、各ユニットの間では、前処理済みケーブル５６を純水で洗浄する。洗浄の方法として、超音波洗浄、揺動洗浄、流水洗浄等がある。純水で洗浄することにより、前のユニットで付着した残留薬剤が後のユニットに持ち込まれることを抑制できる。

Although the description is omitted in FIG. 3, the pretreated cable 56 is washed with pure water between the units. Cleaning methods include ultrasonic cleaning, rocking cleaning, running water cleaning, and the like. By cleaning with pure water, it is possible to prevent the residual chemicals adhering from the previous unit from being carried into the later unit.

Through the above steps, the signal transmission cable 61 shown in FIG. 7 is completed. In the signal transmission cable 61, the plating layer 63 is selectively formed in the first region 57 of the outer peripheral surface 27A. The plating layer 63 is not formed on the second region 59 of the outer peripheral surface 27A.

FIG. 11 is a photograph showing the vicinity of the boundary between the first region 57 and the second region 59 of the signal transmission cable 61. A plating layer 63 is formed in the first region 57. The plating layer 63 is not formed in the second region 59.

The signal transmission cable 61 can be used, for example, for signal transmission between electronic devices, signal transmission between substrates in electronic devices, and the like. Examples of electronic devices include servers, routers, storage products and the like that handle high-speed signals of several Gbps or more. Further, the signal transmission cable 61 can be used as, for example, an acoustic cable. The signal transmission cable 61 is, for example, a cable that transmits a high-speed signal of 25 GHz or higher.

3. 3. Effects of the cable manufacturing apparatus and cable manufacturing method (1A) The signal transmission cable 61 manufactured by the cable manufacturing apparatus and the cable manufacturing method of the present disclosure includes a portion where the plating layer 63 is formed and a plating layer 63. The unformed portions are alternately present along the longitudinal direction of the signal transmission cable 61. The portion where the plating layer is not formed functions as a marking. Therefore, the cable manufacturing apparatus and the cable manufacturing method of the present disclosure can form markings on the manufactured signal transmission cable 61.

(1B) The cable manufacturing apparatus and the cable manufacturing method of the present disclosure can form markings without necessarily performing a treatment that may contaminate the outer peripheral surface 27A. Therefore, in the signal transmission cable 61, the adhesion between the insulator layer 27 and the plating layer 63 is high.

(1C) According to the cable manufacturing apparatus and the cable manufacturing method of the present disclosure, the transmission characteristics of the signal transmission cable 61 are unlikely to deteriorate.
On the other hand, for example, when marking is performed by irradiating the insulator layer with a laser, the insulator layer is thermally altered and the dielectric constant of the insulator layer is changed. As a result, the transmission characteristics of the signal transmission cable deteriorate.

(1D) According to the cable manufacturing apparatus and the cable manufacturing method of the present disclosure, the insulator layer 27 is not easily deformed. As a result, in the manufacturing process of the signal transmission cable 61, it becomes easy to appropriately convey the signal transmission cable 61.

On the other hand, when marking is performed by stamping on the insulator layer 27, the insulator layer is deformed by stamping. As a result, it becomes difficult to properly convey the signal transmission cable in the process of manufacturing the signal transmission cable.
<Other embodiments>
Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments, and can be variously modified and implemented.

(1) Instead of the dry ice blasting apparatus 17, another surface modification unit may be used to selectively roughen and make the second region 59 water repellent. The other surface modification unit may perform only one of roughening and water repellency.

(2) The pretreatment unit 1 may control the dry ice blast treatment by means other than the shutter unit 19. For example, the dry ice blasting process may be selectively performed on the second region 59 by opening and closing the dry ice injection nozzle 29.

Further, the dry ice blasting treatment may be selectively performed on the second region 59 by interrupting the supply of the dry ice to the dry ice blasting device 17.
(3) The pretreatment unit 1 may include a surface modification unit for hydrophilizing the outer peripheral surface 27A instead of the dry ice blasting device 17. In this case, it is possible to selectively perform the surface modification treatment on the first region 57 and not perform the surface modification treatment on the second region 59. As a result, the first region 57 is selectively hydrophilized.

The first region 57 is a region that has passed under the through holes 39 and 41 when the shutter unit 19 is in the open state. The second region 59 is a region that has passed under the through holes 39 and 41 when the shutter unit 19 is in the shielded state.

Examples of the surface modification unit for hydrophilizing the outer peripheral surface 27A include those that perform corona discharge exposure, plasma exposure, ultraviolet irradiation, electron beam irradiation, and the like.
Even when the first region 57 is selectively hydrophilized, it is possible to selectively form a plating layer in the first region 57 and prevent the plating layer from being formed in the second region 59.

(4) The function of one component in each of the above embodiments may be shared by a plurality of components, or the function of the plurality of components may be exerted by one component. Further, a part of the configuration of each of the above embodiments may be omitted. Further, at least a part of the configuration of each of the above embodiments may be added or substituted with respect to the configuration of the other embodiments. It should be noted that all aspects included in the technical idea specified from the wording described in the claims are embodiments of the present disclosure.

(5) In addition to the cable manufacturing device and cable manufacturing method described above, a system having the cable manufacturing device as a component, a program for operating a computer as a control unit of the cable manufacturing device, and this program are recorded. The present disclosure can also be realized in various forms such as a non-transitional actual recording medium such as a semiconductor memory, a method for modifying the surface of a cable, and the like.

1 ... Pretreatment unit, 3 ... Plating unit, 5 ... Introduction reel, 7 ... Sending reel, 9 ... Take-up reel, 11 ... Take-up coil, 13 ... Send-out guide jig, 15 ... Take-up guide jig, 17 ... Dry ice Blast device, 19 ... Shutter unit, 21 ... Support, 23 ... Unplated cable, 25 ... Signal line, 27 ... Insulation layer, 27A ... Outer surface, 29 ... Dry ice injection nozzle, 31, 33 ... Fixed plate, 35 ... Shutter, 37 ... Space, 39, 41 ... Through hole, 43 ... Roller, 45 ... Control unit, 47 ... Reel drive unit, 49 ... Shutter drive unit, 53 ... CPU, 55 ... Memory, 56 ... Pre-plated cable, 57 ... 1st region, 59 ... 2nd region, 61 ... Signal transmission cable, 63 ... Plating layer, 103 ... Degreasing unit, 105 ... Surface modification unit, 107 ... 1st activation unit, 109 ... 2nd activation Unit, 111 ... Electrolytic plating unit, 113 ... Electrolytic plating unit, 115 ... Conveying unit, 117 ... Solventing tank, 119 ... Solventing liquid, 121 ... Processing tank, 123 ... Processing liquid, 125 ... First activation tank, 127 ... 1st activation liquid, 129 ... 2nd activation tank, 131 ... 2nd activation liquid, 133 ... Electrolytic plating tank, 135 ... Electrolytic plating liquid, 137 ... Electrolytic plating tank, 139 ... Electrolytic plating liquid, 141 ... Anodic, 143 ... Power supply unit, 145, 147, 149, 151, 153, 155, 157, 159, 161, 163, 165, 167, 169 ... Bobbin

Claims (4)

A signal transmission cable manufacturing apparatus comprising a signal line, an insulator layer covering the periphery of the signal line, and a plating layer covering the outer peripheral surface of the insulator layer.
A pretreatment unit that alternately forms a first region and a second region having a larger surface roughness and / or water repellency than the first region on the outer peripheral surface along the longitudinal direction of the signal transmission cable. When,
A plating unit that selectively forms the plating layer in the first region by performing a plating treatment on the outer peripheral surface on which the first region and the second region are formed.
Equipped with
The pretreatment unit is
A surface modification unit that roughens and / or makes a part of the outer peripheral surface water repellent.
A moving unit that moves the signal transmission cable in which the plating layer is not formed in the longitudinal direction relative to the surface modification unit.
A control unit that controls roughening and / or water repellency by the surface modification unit so that the second region is selectively roughened and / or water repellent.
A device for manufacturing cables for signal transmission. The device for manufacturing a signal transmission cable according to claim 1.
The surface modification unit is a signal transmission cable manufacturing apparatus including a dry ice blasting apparatus. The device for manufacturing a signal transmission cable according to claim 2.
The control unit may (a) open / close the dry ice ejection nozzle provided in the dry ice blasting apparatus, (b) interrupt the supply of dry ice to the dry ice blasting apparatus, or (c) with the dry ice ejection nozzle. A device for manufacturing a signal transmission cable configured to open and close a shutter provided between the outer peripheral surface and the outer peripheral surface. A method for manufacturing a signal transmission cable, comprising: a signal line, an insulator layer that covers the periphery of the signal line, and a plating layer that covers the outer peripheral surface of the insulator layer.
A first region and a second region having a larger surface roughness and / or water repellency than the first region are alternately formed on the outer peripheral surface along the longitudinal direction of the signal transmission cable.
By performing a plating treatment on the outer peripheral surface on which the first region and the second region are formed, the plating layer is selectively formed in the first region.
A method for manufacturing a signal transmission cable that selectively roughens and / or makes the second region water repellent by dry ice blasting.

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