JP6976884B2 - Exposure equipment and manufacturing method of goods - Google Patents

Description

The present invention relates to an exposure apparatus and a method for manufacturing an article.

In the manufacture of color filters, semiconductor devices, etc., a pattern (a pattern on a resist on a substrate) is used to project a pattern of an original plate such as a reticle or mask onto a substrate (glass plate, wafer, etc.) via a projection optical system. A process of forming a latent image) is performed. It is known that the resist used in such a treatment slows down the chemical reaction due to the irradiation of the exposure light due to the oxygen present in the exposure environment. Therefore, it is preferable to control the oxygen concentration in the exposure environment according to the demand for pattern formation on the resist. For example, when forming a fine pattern on a resist with high accuracy, it is preferable to increase the oxygen concentration in the exposure environment to slow down the chemical reaction of the resist, and when improving the throughput, the oxygen concentration in the exposure environment may be increased. It is advisable to lower the temperature to accelerate the chemical reaction of the resist.

Patent Document 1 includes an oxygen gas supply system that supplies oxygen gas into the exposure apparatus and a nitrogen gas supply system that supplies nitrogen gas into the exposure apparatus, and has a predetermined oxygen concentration according to a measurement value of an oxygen densitometer. It is disclosed that the supply amounts of oxygen gas and nitrogen gas are adjusted and mixed in order to obtain the above.

Japanese Unexamined Patent Publication No. 2007-94066

In Patent Document 1, an oxygen concentration meter is arranged in the chamber of the exposure apparatus, and the oxygen gas supply system and the nitrogen gas supply system are feedback-controlled to adjust to a desired concentration by measuring the oxygen concentration in the chamber. Is disclosed. In an exposure device that measures the oxygen concentration in the chamber and controls it to the target oxygen concentration, if the oxygen concentration in the oxygen gas supply system before mixing changes from the desired value, the oxygen concentration in the chamber becomes the target oxygen concentration. On the other hand, there is a risk of a large deviation.

Therefore, an object of the present invention is to provide an exposure apparatus which is advantageous in reducing a change in oxygen concentration of a gas supplied into the exposure apparatus.

The exposure device of the present invention is an exposure device that exposes a substrate via an optical system, and is a first flow path to which a first gas containing oxygen is supplied and a second gas having an oxygen concentration different from that of the first gas. A mixed gas using the first gas and the second gas based on the measurement results of the second flow path to which the gas is supplied, the measurement unit that measures the oxygen concentration of the first flow path, and the measurement unit. It is characterized by including a mixing unit for generating the mixed gas, and a supply unit having a supply flow path for supplying the mixed gas to the space between the optical system and the substrate from the mixing unit.

According to the present invention, it is possible to provide an exposure apparatus which is advantageous in reducing a change in oxygen concentration of a gas supplied into the exposure apparatus.

It is a figure which shows the structure of the exposure apparatus of 1st Embodiment. It is a figure which shows the structure of the supply part. It is a figure which shows the structure of the exposure apparatus of 2nd Embodiment.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, in each figure, the same reference number is given to the same member, and duplicate description is omitted.

(First Embodiment)
The exposure apparatus 100 of the first embodiment according to the present invention will be described with reference to FIG. FIG. 1 is a schematic view showing the configuration of the exposure apparatus 100 of the first embodiment. The exposure apparatus 100 is a lithography apparatus that exposes the substrate 6 by a step-and-scan method and transfers the pattern of the mask 1 (reticle) to the substrate 6 (resist 5 on the substrate) (exposure processing). However, the exposure apparatus 100 can also apply a step-and-repeat method or another exposure method.

The exposure apparatus 100 includes, for example, an illumination optical system 2, a mask stage 3 (reticle stage) that holds and moves the mask 1, a projection optical system 4, and a substrate stage 7 that holds and moves the substrate 6. , The supply unit 8, the oxygen concentration meter 9 (measurement unit), and the control unit 10 may be included. The control unit 10 is configured by, for example, a computer having a CPU, a memory, or the like, and controls each unit of the exposure apparatus 100 (controls the exposure process). The control unit 10 may be provided in the exposure apparatus 100, or may be installed in a place different from the exposure apparatus 100 and controlled remotely. Further, each part of the exposure apparatus 100 is arranged inside the chamber 11 that defines the exposure chamber. The atmosphere inside the chamber 11 is maintained in an air atmosphere in which the temperature and humidity are controlled by the atmosphere maintaining unit 12.

The illumination optical system 2 shapes the light emitted from a light source (not shown) such as a mercury lamp, an ArF excimer laser, or a KrF excimer laser into, for example, a band-shaped or arc-shaped slit light, and the slit light is used as one of the mask 1. Illuminate the part. The mask 1 and the substrate 6 are held by the mask stage 3 and the substrate stage 7, respectively, and are optically coupled to each other via the projection optical system 4 (optical system) (object plane and image plane of the projection optical system 4). ) Are placed respectively. The projection optical system 4 has a predetermined projection magnification, and projects the pattern of the mask 1 onto the substrate 6 (specifically, the resist 5 supplied (coated) on the substrate) by the slit light. The mask stage 3 and the substrate stage 7 are relatively scanned at a speed ratio corresponding to the projection magnification of the projection optical system 4 while synchronizing with each other. As a result, the pattern of the mask 1 can be transferred to the resist 5 on the substrate.

In such an exposure apparatus 100, it is known that the chemical reaction of the resist 5 due to the exposure light is delayed due to the oxygen existing in the exposure environment. Therefore, it is preferable to control the oxygen concentration in the exposure environment according to the demand for pattern formation on the resist 5 on the substrate. For example, when forming a fine pattern on the resist 5 with high accuracy, it is preferable to increase the oxygen concentration in the exposure environment to slow down the chemical reaction of the resist 5, and when improving the throughput, it is preferable to increase the oxygen concentration in the exposure environment. It is preferable to lower the oxygen concentration to accelerate the chemical reaction of the resist 5.

This will be described by way of exemplifying a method for manufacturing a color filter. As a method for manufacturing a color filter, there are various methods such as a dyeing method, a printing method, an electrodeposition / electric field method, and a pigment dispersion method. Of these methods, the pigment dispersion method is currently the mainstream because of its manufacturing stability and simplicity. In the photosensitive acrylic method, which is a typical pigment dispersion method, a pattern is formed by photolithography on a color resist containing an acryloid-based photosensitive resin and having both a coloring function and a photosensitive function.

Since the color resist is a negative resist, when it is irradiated with exposure light, radicals that contribute to the reaction are generated, the polymer is photopolymerized, and it becomes insoluble in the developing solution. However, the pigment component contained in the color resist easily absorbs the exposure light, and the generated radicals are trapped by oxygen existing in the exposure environment (in the air), so that the photopolymerization reaction tends to be hindered. be. That is, the chemical reaction of the color resist due to the exposure light is slowed down due to the oxygen present in the air, and the throughput is lowered. Therefore, in order to improve the throughput, it is preferable to lower the oxygen concentration in the exposure environment. On the other hand, the fact that the chemical reaction of the color resist due to the exposure light is delayed means that the formation of fine patterns on the resist can be controlled with high accuracy. Therefore, when forming a fine pattern on the resist with high accuracy, it is preferable to increase the oxygen concentration in the exposure environment.

Therefore, the exposure device 100 of the present embodiment provides a supply unit 8 that supplies a gas adjusted to a target oxygen concentration to the space between the projection optical system 4 and the substrate 6 (hereinafter, referred to as “exposure space”). Including, it controls the oxygen concentration in the exposure environment.

The supply unit 8 includes a first flow path 101 to which a first gas (reference gas) containing air (oxygen) is supplied, and a second flow path 102 to which a second gas having a higher oxygen concentration than the first gas is supplied. , A third flow path 103 to which a third gas having a lower oxygen concentration than the first gas is supplied. Then, the supply unit 8 generates a gas (mixed gas) having a target oxygen concentration inside the mixing unit 104 to which the first flow path 101, the second flow path 102, and the third flow path 103 are connected, and the generated gas is generated. Is supplied to the exposure space via the supply flow path 105 (supply nozzle). As shown in FIG. 2, the generation of the gas having the target oxygen concentration in the supply unit 8 is performed by controlling valves 111 to 113 (for example, a mass flow meter) provided in the first flow path 101, the second flow path 102, and the third flow path 103, respectively. ) Can be controlled by the control unit 10.

Here, in the present embodiment, air (dry air serving as a reference gas) can be used as the first gas, oxygen gas can be used as the second gas, and nitrogen gas can be used as the third gas, but the present invention is not limited thereto. The first gas is not limited to air, and may be a gas whose oxygen concentration is changed with respect to air by mixing nitrogen or oxygen with air. That is, the first gas means a gas whose main component is air. As the first gas, for example, a gas such as clean dry air generated in factory equipment (a gas in which at least one of oxygen concentration, temperature and humidity is adjusted) can be used. Further, the second gas is not limited to the oxygen gas, and as described above, the oxygen concentration may be high with respect to the first gas. Similarly, the third gas is not limited to nitrogen gas, and it is sufficient that the oxygen concentration is low with respect to the first gas.

Further, the supply unit 8 may have either a second gas or a third gas. In that case, a gas having an oxygen concentration different from the oxygen concentration of the first gas is provided as the second gas, and a gas having a target oxygen concentration may be generated by mixing the first gas and the second gas.

In such a supply unit 8, when the oxygen concentration of the first gas supplied to the mixing unit 104 changes from a predetermined value, the oxygen concentration of the gas mixed in the mixing unit temporarily changes, and the gas in the exposure space There is a risk of error with respect to the target oxygen concentration of. This is because the equipment for producing dry air as the first gas usually employs a two-tower switching type adsorption device using an adsorbent such as silica gel. This method has the characteristic of selectively adsorbing the nitrogen component among the air components. For this reason, in the process of boosting the pressure of the adsorption tower after the regeneration step is completed, the nitrogen component of the boosted gas is absorbed by the adsorbent, and as a result, the adsorption tower immediately before the oxygen-concentrated gas switches to the purification step. It will remain in the system containing it. Therefore, immediately after switching to the purification step, the oxygen concentration in the dry air may temporarily rise sharply, and the oxygen concentration of the first gas supplied to the mixing unit 104 changes significantly from a predetermined value. There is a fear.

Therefore, the supply unit 8 of the present embodiment is provided with an oxygen concentration meter 9 as a measurement unit for measuring the oxygen concentration in the first flow path 101 to which at least the first gas containing air is supplied. Based on the measurement result of the oxygen concentration of the first gas by the oxygen concentration meter 9, the supply unit 8 mixes at least one of the second gas and the third gas with the first gas to obtain a gas having a target oxygen concentration. Generate. When a gas having a desired oxygen concentration of the second gas or the third gas is used, the oxygen concentration meter 9 for measuring the oxygen concentration is not provided in the second flow path 102 or the third flow path 103. good.

For example, when the target oxygen concentration is higher than the measurement result of the oxygen concentration of the first gas, the supply unit 8 generates a gas having the target oxygen concentration by mixing the second gas with the first gas in the mixing unit 104. , The generated gas is supplied to the exposure space via the supply flow path 105. On the other hand, when the target oxygen concentration is lower than the measurement result of the oxygen concentration of the first gas, the supply unit 8 generates a gas having a target oxygen concentration by mixing the first gas with the third gas in the mixing unit 104. , The generated gas is supplied to the exposure space via the supply flow path 105.

Here, in the supply unit 8, the first gas may not be supplied from the first flow path 101 due to the influence of, for example, a failure of the factory equipment. In this case, the control unit 10 does not use the first gas, but mixes the second gas and the third gas to generate a gas having a target oxygen concentration so that the supply unit 8 (control valve 111 of each flow path) is generated. ~ 113) may be controlled. Further, the temperature and humidity of the gas having the target oxygen concentration may be adjusted inside the mixing unit 104 based on the result of measuring the temperature and humidity (at least one of the temperature and humidity) of the exposure space. In this case, the exposure apparatus 100 may be provided with a thermometer for measuring the temperature of the exposure space, a hygrometer for measuring the humidity, and an adjusting unit (heater or the like) for adjusting the temperature and humidity of the gas in the mixing unit 104. Further, an oxygen concentration meter for measuring the oxygen concentration of the gas in the mixing unit 104 may be provided.

Further, an oxygen concentration meter 9 for measuring the oxygen concentration in the exposure space may be provided in the chamber 11 of the exposure apparatus 100. The oxygen concentration meter 9 is arranged in the vicinity of a local space (exposure space) between the projection optical system 4 and the substrate 6, and measures the oxygen concentration in the local space. The oxygen concentration meter 9 in the chamber 11 can also be arranged at a position where the oxygen concentration between the projection optical system 4 and the substrate 6 can be measured in an alternative manner. For example, alternative measurement can be performed by arranging an oxygen concentration meter 9 between the end of the supply flow path 105 of the supply unit 8 and the projection optical system 4 (near the final surface of the projection optical system 4). By providing the oxygen concentration meter 9 in this way, the control unit 10 is provided in the first flow path 101, the second flow path 102, and the third flow path 103, respectively, based on the measurement results of the oxygen concentration meter 9. The control valves 111 to 113 can be controlled to generate a gas having a target oxygen concentration.

An embodiment in which a gas having a target oxygen concentration is generated by the supply unit 8 in the exposure apparatus 100 of the first embodiment and supplied to the exposure space will be described with reference to FIG.

The control unit 10 acquires an exposure recipe used for the exposure process from the storage unit 13, and reads the target oxygen concentration in the exposure space set in the acquired exposure recipe. Then, the control unit 10 controls the supply unit 8 so as to generate a gas having a target oxygen concentration and supply it to the exposure space. At this time, the control unit 10 supplies the target oxygen concentration required for the exposure process based on the oxygen concentration of the first flow path 101 of the first gas (dry air) measured by the oxygen concentration meter 9. The unit 8 is controlled. Here, in the exposure apparatus 100 of the first embodiment, the storage unit 13 and the control unit 10 are separately configured, but the storage unit 13 may be configured as a part of the control unit 10. The storage unit 13 stores the target oxygen concentration according to the type of exposure processing.

Next, the control unit 10 determines the value measured by the oxygen concentration meter 9 of the first flow path 101 and the oxygen concentrations of the oxygen (second gas) and the inert gas (third gas) stored in the storage unit 13. Based on this, the flow ratio of each gas is calculated so as to have the read oxygen concentration, and the supply unit 8 is controlled based on the numerical value. Specifically, the control unit 10 controls the control valve 111 of the first flow path 101 connected to the mixing unit 104, the control valve 112 of the second flow path 102, and the control valve 113 of the third flow path 103. By doing so, the flow rate of the gas supplied from each flow path is adjusted.

Here, the oxygen concentration of the first flow path 101 (dry air supply system) is 21%, the oxygen concentration of the second flow path 102 (oxygen supply system) is 99%, and the oxygen concentration of the third flow path 103 (inert gas supply system). The oxygen concentration of is 1%. When the target oxygen concentration of the recipe stored in the storage unit 13 is higher than the oxygen concentration of the first flow path 101, the first gas and the second gas are supplied from the first flow path 101 and the second flow path 102. When the oxygen concentration of the recipe stored in the storage unit 13 is lower than the oxygen concentration of the first flow path 101, the first gas and the second gas are supplied from the first flow path 101 and the third flow path 103.

Specifically, in FIG. 2A, the control unit 10 controls the control valves 111, 112, 113 of each flow path to control the flow rate of the gas supplied from each flow path to the mixing unit 104. .. When the target oxygen concentration is higher than the oxygen concentration of the first flow path 101, the control valves 111 and 112 are opened in order to supply the first gas and the second gas from the first flow path 101 and the second flow path 102. By closing the control valve 113, a mixed gas having a desired oxygen concentration is generated in the mixing unit 104. When the target oxygen concentration is lower than the oxygen concentration of the first flow path 101, the control valves 111 and 113 are opened in order to supply the first gas and the third gas from the first flow path 101 and the third flow path 103. By closing the control valve 112, a mixed gas having a desired oxygen concentration is generated in the mixing unit 104.

At this time, when the oxygen concentration of the first gas supplied from the first flow path 101 changes, the control valves 112 and 113 are controlled based on the measurement result of the oxygen concentration meter 9 and supplied to the mixing unit 104. Adjust the flow rate of the gas. This makes it possible to reduce the fluctuation of the mixed gas in the mixing unit 104 with respect to the target oxygen concentration, reduce the fluctuation of the oxygen concentration of the mixed gas supplied from the supply flow path 105 to the exposure space, and reduce the fluctuation of the mixed gas. The oxygen concentration can be set to a desired value (target oxygen concentration).

The control unit 10 may generate a gas having a desired oxygen concentration in the mixing unit 104 by mixing the second gas in the second flow path 102 and the third gas in the third flow path 103. However, as described above, by generating a gas having a target oxygen concentration with reference to the first gas, it is better than mixing a second gas and a third gas having a large difference in oxygen concentration to generate a gas having a target oxygen concentration. , The time required for the oxygen concentration of the mixed gas to stabilize can be shortened. In addition, air is generally cheaper than oxygen gas and nitrogen gas (inert gas). Therefore, it may be more cost effective to generate a gas having a target oxygen concentration based on air than to generate a gas having a target oxygen concentration by mixing oxygen gas and nitrogen gas.

In the conventional exposure apparatus, the oxygen densitometer is arranged between the final surface of the projection optical system 4 and the substrate 6, and the mixed gas supplied to the local space between the final surface of the projection optical system 4 and the substrate 6 is provided. The supply unit 8 is feedback-controlled based on the result of measuring the oxygen concentration of the above. Therefore, there is a possibility that a mixed gas having a large error with respect to the target value oxygen concentration will be supplied without being able to detect the oxygen concentration fluctuation of the dry air before supplying and controlling the supply unit 8.

On the other hand, in the exposure apparatus 100 of the present embodiment, the oxygen concentration meter 9 is arranged in the first flow path 101 before supplying to the local space between the final surface of the projection optical system 4 and the substrate 6. .. The supply unit 8 is controlled by using the measured value of the oxygen concentration meter 9 and the oxygen concentration values of the second flow path (second gas) and the third flow path (third gas) stored in the storage unit 13 in advance. .. This makes it possible to control the supply unit 8 by following the oxygen concentration fluctuation of the first gas (dry air) before supplying the mixed gas to the exposure space, and the mixed gas can be supplied at the target oxygen concentration. It will be possible.

(Second Embodiment)
The exposure apparatus 200 according to the second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a schematic view showing the configuration of the exposure apparatus 200 of the second embodiment. In the exposure apparatus of the second embodiment, the same reference numbers are assigned to the same members as the exposure apparatus of the first embodiment, and duplicate description will be omitted.

The exposure apparatus 100 of the first embodiment is an embodiment in which the oxygen concentration meter 9 is arranged in the first flow path 101. The control unit 10 has the oxygen concentration value of the first gas (dry air) measured by the oxygen concentration meter 9, and the oxygen of the second gas (oxygen) and the third gas (inert gas) stored in the storage unit 13 in advance. The flow rate ratio of each gas is obtained using the concentration value, and the supply unit 8 is controlled based on the flow rate ratio.

On the other hand, in the exposure apparatus 200 of the second embodiment shown in FIG. 3, oxygen concentration meters 31 and 32 are arranged in the second flow path 102 and the third flow path 103, respectively. The control unit 10 of the exposure apparatus 200 of the second embodiment is the measurement result from the oxygen concentration meters 9, 31, 32 (measurement unit) arranged in each of the first flow path, the second flow path, and the third flow path. The flow rate ratios of the first gas, the second gas, and the third gas are obtained using the above, and the supply unit 8 is controlled based on the obtained flow rate ratios. As a result, even when low-purity oxygen is used as the second gas or low-purity inert gas is used as the third gas, the mixed gas generated in the mixing unit 104 can be adjusted to the oxygen concentration according to the target value. .. Therefore, the supply unit 8 of the exposure apparatus 200 of the second embodiment can supply a mixed gas having a desired oxygen concentration to the exposure space between the final surface of the projection optical system 4 and the substrate 6.

Further, the distance from the oxygen concentration meters 9, 31, 32 arranged in the first flow path 101, the second flow path 102, and the third flow path 103 to the mixing unit 104 of the supply unit 8 is installed in the factory. It depends on the layout of the exposure equipment. Further, the time for the oxygen concentration fluctuation measured by the oxygen concentration meters 9, 31, and 32 to reach the mixing unit 104 of the supply unit 8 differs depending on the pipe length, the consumption flow rate, and the supply pressure in each flow path. Therefore, the control unit 10 has a degree of freedom in arranging the oxygen concentration meter by giving a time difference to control the control valves 111, 112, 113 that control the flow rate of each gas mixed by the mixing unit 104. It is possible to make it.

(Third Embodiment)
Further, in the exposure apparatus, in general, the optical performance of the projection optical system 4 is greatly affected by the refractive index of the local space (exposure space) between the projection optical system 4 (final surface) and the substrate 6. Since the refractive index of the gas changes depending on the temperature and humidity of the gas, the exposure process can be performed with the optical performance of the projection optical system 4 in a desired state by reducing the change in the temperature and humidity of the gas.

For example, in the exposure apparatus 100, the exposure process is performed in a state where the surface position (Z direction) of the substrate 6 is aligned with the image formation position of the projection optical system 4. On the other hand, although the oxygen concentration of the gas supplied to the exposure space by the supply unit 8 is the same, if the temperature and humidity of the gas are different, the image formation position of the projection optical system 4 may change. When the temperature and humidity of the mixed gas supplied to the exposure space change with the change in the mixing ratio of the gas supplied to the mixing unit 104, the refractive index of the exposure space changes and the imaging position of the projection optical system 4 changes. As a result, the surface position of the substrate 6 may deviate from the image formation position of the projection optical system 4.

Therefore, in the exposure apparatus of the third embodiment, the first gas, the second gas, and the third gas are preliminarily adjusted to different temperatures, and these gases are adjusted so that the mixed gas approaches the target oxygen concentration and the target temperature. To mix. That is, the temperature of the mixed gas is adjusted by mixing at least two of the first gas, the second gas, and the third gas. The target temperature may include, for example, the temperature of the atmosphere in which the projection optical system 4 is arranged (the temperature of the internal atmosphere of the chamber 11). In this embodiment, an example in which the first gas, the second gas, and the third gas are preliminarily adjusted to different temperatures will be described, but the present invention is not limited to this, and even if these gases are preliminarily adjusted to different humidity. good. In this case, the gases are mixed so that the mixed gases have the target humidity.

(Fourth Embodiment)
The case where the exposure apparatus of any of the above-described embodiments is adjusted to the target oxygen concentration by mixing the second gas and the third gas with the first gas has been described. However, the supply unit 8 of the exposure apparatus of the present invention may supply the mixed gas adjusted to the target oxygen concentration by using two kinds of gases having different oxygen concentrations from each other without using three kinds of gases to the exposure space.

For example, the supply unit 8 of the fourth embodiment supplies a first gas having a low oxygen concentration with respect to the target oxygen concentration from the first flow path 101 to the mixing unit 104, and has a high oxygen concentration with respect to the target oxygen concentration. 2 Gas is supplied to the mixing unit 104 from the second flow path 102. The control unit 10 of the exposure apparatus together with the control valve 111 is based on the measurement results of the oxygen concentration meter 9 provided in the first flow path 101 and the measurement results of the oxygen concentration meter 31 provided in the second flow path 102. The control valve 112 is controlled to control the flow rates of the first gas and the second gas supplied to the mixing unit 104. When the oxygen concentration of one of the first gas and the second gas is a desired value (does not change significantly), either the oxygen concentration meter 9 or the oxygen concentration meter 31 may be provided. Further, the gas supplied to the mixing unit 8 may be three or more types of gas.

Although the exposure apparatus that exposes the substrate via the optical system has been described in any of the above embodiments, it is an imprint apparatus that forms a pattern of an imprint material on the substrate by using a mold instead of the exposure apparatus. May be good. The imprint device brings the imprint material supplied on the substrate into contact with the mold (mold) and applies energy for curing to the imprint material to form a pattern of the cured product to which the uneven pattern of the mold is transferred. It is a device to do. Imprint devices are used in the manufacture of devices such as semiconductor devices as articles. In the imprint device, the mixed gas whose oxygen concentration is adjusted by the supply unit 8 can be supplied to the space between the mold and the substrate.

As the imprint method, a photocuring method and a thermal cycle method are known. In the photocuring method, a pattern is formed by using an ultraviolet curable resin, irradiating the resin with ultraviolet rays while pressing the mold against the substrate through the resin to cure the resin, and then pulling the mold away from the cured resin. .. In the thermal cycle method, the thermoplastic resin is heated to a temperature equal to or higher than the glass transition temperature, the mold is pressed against the substrate through the resin in a state where the fluidity of the resin is increased, and the mold is separated from the resin after cooling. A pattern is formed. The above-mentioned supply unit 8 can be applied to the imprint device of any method.

Further, the gas adjusted by the supply unit 8 (mixing unit 104) is not limited to the oxygen concentration. For example, the gas supplied to the space between the mold and the substrate in the imprint device may be a gas containing helium or nitrogen gas, and the supply unit 8 of the present invention adjusts the concentration of these helium or nitrogen gas. You may be able to do it. In this case, instead of the oxygen densitometer 9, a densitometer capable of measuring the concentration of a specific gas may be arranged as a measuring unit according to the type of gas to be adjusted.

(Embodiment of manufacturing method of goods)
The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article of the present embodiment includes a step of forming a pattern (latent image) on a substrate (a photosensitive agent applied to) using the above-mentioned exposure apparatus (a step of exposing the substrate) and an exposure (exposure) in such a step. It includes a step of developing a substrate (with a pattern formed). Further, such manufacturing methods may include other well-known steps such as oxidation, film formation, vapor deposition, doping, flattening, etching, resist stripping, dicing, bonding, packaging and the like. The method for manufacturing an article of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and modifications can be made within the scope of the gist thereof.

100 Exposure device 8 Supply unit 9 Measurement unit 10 Control unit 101 1st flow path 102 2nd flow path 103 3rd flow path 104 Mixing section 105 Supply flow path

Claims (9)

An exposure device that exposes a substrate via an optical system.
The first flow path to which the first gas containing oxygen is supplied, and
A second flow path to which a second gas having an oxygen concentration different from that of the first gas is supplied,
A measuring unit that measures the oxygen concentration in the first flow path,
Based on the measurement results of the measuring unit, the mixing unit that generates a mixed gas using the first gas and the second gas, and the mixing unit in the space between the optical system and the substrate. A supply unit having a supply flow path for supplying gas,
An exposure apparatus characterized by comprising. The exposure apparatus according to claim 1, wherein each of the first flow path and the second flow path is provided with the measuring unit for measuring the oxygen concentration. The exposure apparatus according to claim 1 or 2, wherein the first gas is air supplied from outside the exposure apparatus, and the second gas is oxygen or nitrogen. The exposure apparatus according to any one of claims 1 to 3, further comprising a third flow path to which a third gas having a different oxygen concentration from the first gas and the second gas is supplied. The measuring unit measures the oxygen concentration in the first flow path and measures the oxygen concentration.
The claim is characterized in that the supply unit produces the mixed gas by mixing one of the second gas and the third gas with the first gas based on the measurement result of the measurement unit. Item 4. The exposure apparatus according to item 4. The supply unit mixes the second gas with the first gas when the target oxygen concentration is higher than the oxygen concentration of the first gas, and when the target oxygen concentration is lower than the oxygen concentration of the first gas, the supply unit mixes the second gas with the first gas. The exposure apparatus according to claim 4 or 5, wherein the mixed gas is produced by mixing the third gas with the first gas. A measuring unit for measuring the oxygen concentration of the mixed gas supplied to the space between the optical system and the substrate is provided, and the first gas and the second gas are provided based on the measurement results of the measuring unit. The exposure apparatus according to any one of claims 1 to 6, wherein the mixed gas is generated. An imprint device that forms a pattern of imprint material on a substrate using a mold.
The first flow path to which the first gas containing oxygen is supplied, and
A second flow path to which a second gas having an oxygen concentration different from that of the first gas is supplied,
A measuring unit that measures the oxygen concentration in the first flow path,
Based on the measurement result of the measuring unit, the mixing gas that generates a mixed gas using the first gas and the second gas, and the mixed gas in the space between the mixing unit and the mold and the substrate. With a supply unit having a supply flow path for supplying
An imprint device characterized by being equipped with. A step of exposing a substrate using the exposure apparatus according to any one of claims 1 to 7.
The step of developing the substrate exposed in the step and
A method of manufacturing an article comprising.

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