JP6973649B2 - A method for manufacturing an adhesive composition, an adhesive film, and a connecting body. - Google Patents

Description

The present disclosure relates to an adhesive composition used for adhering a semiconductor chip and a flexible printed circuit board, an adhesive film having a plurality of adhesive pieces composed of the adhesive composition, and a method for manufacturing a connector.

Conventionally, a semiconductor device is manufactured through the following steps. First, the semiconductor wafer is attached to the adhesive sheet for dicing, and the semiconductor wafer is separated into semiconductor chips in that state. After that, a pickup process, a mounting process, a reflow process, a die bonding process, and the like are carried out. Patent Document 1 discloses an adhesive sheet (die bond dicing sheet) having both a function of fixing a semiconductor wafer in a dicing process and a function of adhering a semiconductor chip to a substrate in a die bonding process.

Japanese Unexamined Patent Publication No. 2007-288170

By the way, in recent years, with the evolution of semiconductor devices for small devices represented by smartphones, the manufacturing process of conventional semiconductor devices has changed remarkably from the conventional ones. For example, a process using a dicing sheet (die bond dicing sheet) described in Patent Document 1 and a process in which the dicing step and the dicing process are not carried out, or a process in which the reflow step is not carried out is being put into practical use. Along with this, there is a demand for a new type of adhesive film used in the manufacturing process of semiconductor devices. In addition to this situation, the present inventors have applied a semiconductor chip having a shape corresponding to a limited specific area of the substrate in order to cope with higher functionality and thinner size of a small device on which a semiconductor device is mounted. We proceeded with the development of an adhesive film that is easy to use for adhering.

One aspect of the present disclosure is to provide an adhesive composition which is excellent in adhesiveness between a semiconductor chip and a flexible printed circuit board and can suitably perform wire bonding carried out after bonding the semiconductor chip and the flexible printed circuit board. .. One aspect of the present disclosure provides an adhesive film comprising a plurality of adhesive pieces made of this adhesive composition, and a method for producing a connector.

The adhesive composition according to one aspect of the present disclosure is used for adhering a semiconductor chip and a flexible printed circuit board, and has a melt viscosity at 130 ° C. of 3500 to 20000 Pa · s.

According to the above-mentioned adhesive composition, the melt viscosity at 130 ° C. is 3500 to 20000 Pa · s, so that the semiconductor chip and the flexible printed circuit board (hereinafter referred to as “FPC substrate”) are excellently bonded in the bonding process. Both the property and the excellent wire bonding property in the subsequent wire bonding process between the semiconductor chip and the FPC substrate can be achieved to a sufficiently high level. When the melt viscosity of the adhesive composition at 130 ° C. is 20000 Pa · s or less (the adhesive composition is moderately soft at 130 ° C.), excellent adhesion is achieved in the bonding process between the semiconductor chip and the FPC substrate. can. On the other hand, when the melt viscosity of the adhesive composition at 130 ° C. is 3500 Pa · s or more (the adhesive composition is moderately hard at 130 ° C.), the adhesive layer (adhesive layer) is used in the wire bonding step performed after the bonding step. It is possible to sufficiently suppress the change in the thickness of the adhesive composition (adhesive composition interposed between the semiconductor chip and the FPC substrate), thereby achieving excellent wire bonding properties. In the wire bonding step, the positions (for example, height positions) to be connected to the semiconductor chip and the FPC substrate are set in advance, so that the thickness of the adhesive layer becomes uneven or excessively thick. If this happens (see FIG. 8B), wire bonding cannot be suitably performed.

The adhesive composition contains at least a thermoplastic resin and a thermosetting resin, and when the content of the thermoplastic resin is 100 parts by mass, the content of the thermosetting resin is 70 to 240 parts by mass. Is preferable. When the content of the thermosetting resin is in the above range, it is easy to achieve both excellent adhesiveness and wire bonding property. From the viewpoint of adjusting the melt viscosity (hardness) of the adhesive composition at 130 ° C., the adhesive composition may further contain a filler, and if the content of the thermoplastic resin is 100 parts by mass, the filler is contained. The amount is preferably 10 to 450 parts by mass.

The adhesive film according to one aspect of the present disclosure includes a strip-shaped carrier film having a width of 100 mm or less, and a plurality of adhesive pieces arranged so as to be arranged in the longitudinal direction of the carrier film on the carrier film, and these are adhered to each other. The agent piece comprises the above adhesive composition.

According to this adhesive film, a plurality of adhesive pieces arranged side by side on the carrier film are sequentially picked up, and then each adhesive piece is placed in a predetermined region of an adherend (semiconductor chip or FPC substrate). This makes it possible to efficiently carry out the bonding process between the semiconductor chip and the FPC substrate. For example, if a strip-shaped adhesive film is wound on a reel, the adhesive process can be carried out more efficiently by the roll-to-roll method. The shape of the adhesive piece may be appropriately set according to the shape of the region of the FPC substrate to which the semiconductor chip is to be bonded or the shape of the semiconductor chip.

The size, number, and the like of the adhesive pieces arranged on the carrier film may be appropriately set according to the design of the connecting body to be manufactured. For example, the area of one adhesive piece can be in the range of 10 to ^{200 mm 2.} In addition, one or a plurality of rows composed of the plurality of adhesive pieces may be formed on the carrier film. The plurality of adhesive pieces can be formed, for example, by punching out an adhesive layer formed so as to cover the surface of the carrier film.

The adhesive film according to the present disclosure covers the first surface of the adhesive piece on the carrier film side and the second surface on the opposite side, and may further include a protective member having the same shape as the adhesive piece. By covering the adhesive piece with a protective member, it is possible to prevent dust and the like from adhering to the adhesive piece until it is used. The adhesive piece and the protective member can be formed by punching out an adhesive layer formed so as to cover the surface of the carrier film and a protective film arranged so as to cover the adhesive layer.

According to one aspect of the present disclosure, there is provided an adhesive composition which is excellent in adhesiveness between a semiconductor chip and an FPC substrate and can suitably perform wire bonding performed after bonding the semiconductor chip and the FPC substrate. According to one aspect of the present disclosure, there is provided an adhesive film comprising a plurality of adhesive pieces made of this adhesive composition, and a method for producing a connector.

FIG. 1 is a perspective view schematically showing an embodiment of the adhesive film according to the present disclosure. FIG. 2 is a cross-sectional view taken along the line II-II shown in FIG. FIG. 3 is a cross-sectional view schematically showing a laminate in which a carrier film, an adhesive layer, and a protective film are laminated in this order. FIG. 4 is a perspective view showing how a plurality of adhesive pieces are formed on the carrier film by die cutting. FIG. 5 is a cross-sectional view schematically showing how the adhesive piece and the protective member covering the adhesive piece are picked up from the carrier film. 6 (a) and 6 (b) are cross-sectional views schematically showing the state of the adhesive piece before the step of adhering the tip of the FPC substrate to the semiconductor chip is performed. FIG. 7 schematically shows a state in which the adhesive piece between the tip of the FPC substrate and the semiconductor chip is cured while holding the FPC substrate by applying an upward force to the FPC substrate. It is sectional drawing which shows. FIG. 8A is a cross-sectional view schematically showing a module in which the tip end portion of the FPC substrate can be suitably bonded to the semiconductor chip, and FIG. 8B is a cross-sectional view of the FPC substrate to the semiconductor chip. It is sectional drawing which shows typically the module which could not bond the tip part appropriately.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings as appropriate. The present invention is not limited to the following embodiments. As used herein, the term (meth) acrylic means acrylic or methacryl.

<Adhesive film>
FIG. 1 is a perspective view schematically showing an adhesive film according to this embodiment. FIG. 2 is a cross-sectional view taken along the line II-II shown in FIG. The adhesive film 10 shown in these figures is a strip-shaped carrier film 1 having a width of 100 mm or less, and a plurality of the adhesive films 10 arranged so as to be arranged in the longitudinal direction (direction of arrow X in FIG. 1) on the carrier film 1. It includes an adhesive piece 3p and a protective member 5p that covers the surface F2 of the adhesive piece 3p and has the same shape as the adhesive piece 3p. As shown in FIG. 2, the surface F2 (second surface) of the adhesive piece 3p is a surface opposite to the surface F1 (first surface) on the carrier film 1 side of the adhesive piece 3p.

The adhesive film 10 is applied to bond a semiconductor chip and an FPC substrate. According to the adhesive film 10, a plurality of adhesive pieces 3p arranged side by side on the carrier film 1 can be sequentially picked up, and then each adhesive piece 3p can be arranged in a predetermined region of the substrate, and the semiconductor can be used. The bonding process between the chip and the FPC substrate can be efficiently performed.

The adhesive piece 3p is made of an adhesive composition having a melt viscosity at 130 ° C. of 3500 to 20000 Pa · s. The melt viscosity of this adhesive composition at 130 ° C. is preferably 4000 to 19000 Pa · s, more preferably 4000 to 15000 Pa · s, and even more preferably 4000 to 13000 Pa · s. Since the melt viscosity of the adhesive composition at 130 ° C. is 3500 to 20000 Pa · s, excellent adhesiveness in the bonding process between the semiconductor chip and the FPC substrate and subsequent wire bonding process between the semiconductor chip and the FPC substrate are performed. Both excellent wire bonding properties can be achieved at a sufficiently high level.

Specifically, when the melt viscosity of the adhesive composition at 130 ° C. is 20000 Pa · s or less, excellent adhesion can be achieved in the bonding process between the semiconductor chip and the FPC substrate. On the other hand, when the melt viscosity of the adhesive composition at 130 ° C. is 3500 Pa · s or more, the adhesive composition interposed between the adhesive layer (the semiconductor chip and the FPC substrate) in the wire bonding step carried out after the bonding step. It is possible to sufficiently suppress the change in the thickness of the object), whereby excellent wire bonding property can be achieved. In the wire bonding step, the positions (for example, height positions) to be connected to each of the semiconductor chip and the FPC substrate are set in advance. Therefore, in the bonding step performed prior to this, the thickness of the adhesive layer is set. If the wire bonding becomes non-uniform or excessively thick (see FIG. 8B), wire bonding cannot be preferably performed.

In the present specification, the melt viscosity of the adhesive composition at 130 ° C. is a value measured by the following method. First, an adhesive piece (adhesive layer) having a thickness of 25 μm is attached to a Teflon (registered trademark) sheet and pressed with a roll (temperature 60 ° C., linear pressure 0.2 MPa, feeding speed 0.5 m / min). Then, the PET film is peeled off, another adhesive layer having a thickness of 25 μm is laminated on the adhesive piece, and the adhesive layer is laminated while being pressed. This is repeated to obtain an adhesive sample having a thickness of about 200 μm. The melt viscosity of the obtained adhesive sample was measured using a viscoelasticity measuring device (manufactured by Leometrics Scientific FE Co., Ltd., trade name: ARES) using a parallel plate with a diameter of 25 mm as a measuring plate, and the temperature rise rate: Measure in the temperature range of 20 to 200 ° C. under the conditions of 10 ° C./min and frequency: 1 Hz. From this measurement result, the melt viscosity at 130 ° C. is obtained.

In the present embodiment, as shown in FIG. 1, an adhesive piece 3p having a thick T-shaped shape is exemplified, but the shape of the adhesive piece is the shape of the region of the FPC substrate to which the semiconductor chip is to be adhered. Alternatively, it may be appropriately set according to the shape of the semiconductor chip. Further, FIGS. 1 and 2 show a case where one row 3A composed of a plurality of adhesive pieces 3p is provided on the carrier film 1, but two or more rows 3A are provided on the carrier film 1. It may have been.

The adhesive piece 3p in the present embodiment is assumed to be sufficiently small in size, and the area of one adhesive piece 3p is, for example, 10 to ²⁰⁰ mm 2. The ratio of the region on the surface of the carrier film 1 covered by the plurality of adhesive pieces 3p (area ratio of the adhesive pieces) is, for example, 10 to 60% with respect to the area of the carrier film 1. It may be 10 to 35%. In this area ratio, the area A of one adhesive piece 3p is the pitch of the adhesive piece 3p provided on the carrier film 1 (pitch P in FIG. 1) and the width of the carrier film 1 (width W in FIG. 1). ) May be calculated by dividing by the product. That is, this area ratio R may be a value calculated by the following formula.
Area ratio R (%) = A / (P × W) × 100

Hereinafter, the configuration of the adhesive film 10 will be described.
[Carrier film]
As described above, the carrier film 1 is strip-shaped and has a width of 100 mm or less. The width of the carrier film 1 may be appropriately set according to the size of the adhesive piece 3p arranged on the carrier film 1 and the number of rows 3A. For example, as shown in FIG. 1, when the number of rows 3A is one, the width of the carrier film 1 is preferably 10 to 50 mm, and may be 10 to 30 mm or 10 to 20 mm. Since the width of the carrier film 1 is 10 mm or more, when the roll-to-roll method is adopted, it is easy to prevent a decrease in workability due to twisting of the carrier film 1.

The material of the carrier film 1 is not particularly limited as long as it can sufficiently withstand the tension applied in the manufacturing process of the adhesive film 10 and the manufacturing process of the semiconductor device. The carrier film 1 is preferably transparent from the viewpoint of visibility of the adhesive piece 3p and / or the protective member 5p arranged on the carrier film 1. The carrier film 1 includes polyester films such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyvinylacetate film, poly-4-methylpentene-1, and ethylene-vinyl acetate. A polymer, a homopolymer such as an ethylene-ethyl acrylate copolymer, a polyolefin film such as a copolymer or a mixture thereof, a plastic film such as a polyvinyl chloride film and a polyimide film, and the like can be used. The carrier film 1 may have a single-layer structure or a multi-layer structure.

The thickness of the carrier film 1 may be appropriately selected within a range that does not impair workability, and may be, for example, 10 to 200 μm, 20 to 100 μm, or 25 to 80 μm. These thickness ranges are practically acceptable and economically effective.

In order to enhance the adhesion of the adhesive piece 3p to the carrier film 1, the surface of the carrier film 1 is chemically or physically treated with corona treatment, chromic acid treatment, ozone exposure, flame exposure, high piezoelectric shock exposure, ionizing radiation treatment, etc. Surface treatment may be applied. As the carrier film 1, a film made of a fluororesin and having a low surface energy can also be used. Examples of such films include A-63 (release treatment agent: modified silicone type) manufactured by Teijin DuPont Film Co., Ltd. and A-31 (release treatment agent: Pt type) manufactured by Teijin DuPont Film Co., Ltd. Silicone type) etc.

In order to prevent the adhesive force of the adhesive piece 3p from becoming excessively high on the carrier film 1, a silicone-based release agent, a fluorine-based release agent, a long-chain alkyl acrylate-based release agent, etc. are released on the surface of the carrier film 1. A mold release layer composed of a mold may be formed.

The adhesion between the carrier film 1 and the adhesive piece 3p is preferably 0.5 to 18 N / m, more preferably 2 to 10 N / m, and 2 to 6 N / m or 2 to 4 N / m. It may be m. When this adhesive force is 0.5 N / m or more, it is easy to prevent the adhesive piece 3p from being inadvertently peeled from the carrier film 1 in the process of manufacturing the adhesive film 10, and on the other hand, at 18 N / m or less. This makes it easy to stably pick up the adhesive piece 3p and the protective member 5p covering the adhesive piece 3p from the carrier film 1 when the adhesive film 10 is used. The adhesive force of the adhesive piece 3p to the carrier film 1 means a 90 ° peel strength, and specifically, an adhesive layer having a width of 20 mm having the same composition as the adhesive piece 3p is formed on the carrier film 1. It means the peel strength measured when the prepared sample is prepared and the adhesive layer is peeled off from the carrier film at an angle of 90 ° and a peeling speed of 50 mm / min.

[Adhesive piece]
The adhesive piece 3p is a protective member 5p by simultaneously die-cutting an adhesive layer 3 formed so as to cover the surface of the carrier film 1 and a protective film 5 arranged so as to cover the adhesive layer 3. It is formed together with (see FIG. 4). The thickness of the adhesive piece 3p may be appropriately selected within a range that does not impair workability, and may be, for example, 1 to 200 μm, or 3 to 150 μm or 5 to 150 μm. When the thickness of the adhesive piece 3p is 1 μm or more or 5 μm or more, it is easy to secure sufficient adhesiveness, while when it is 200 μm or less or 150 μm or less, the adhesive composition constituting the adhesive piece 3p is protected. It is easy to prevent the member from protruding from the member 5p.

The adhesive composition constituting the adhesive piece 3p preferably has an appropriate softness (adhesiveness) at 130 ° C. and a property of not excessively stretching. The adhesive piece 3p preferably contains a thermoplastic resin, a thermosetting resin, a curing accelerator, and a filler, and may contain a photoreactive monomer, a photopolymerization initiator, and the like, if necessary.

(Thermoplastic resin)
As the thermoplastic resin, a resin having thermoplasticity, or a resin having at least thermoplasticity in an uncured state and forming a crosslinked structure after heating can be used. As the thermoplastic resin, as a tape for semiconductor processing, a (meth) acrylic copolymer having a reactive group (hereinafter, “reactive group-containing (meth) acrylic” from the viewpoint of excellent shrinkage, heat resistance and peelability. It may also be called "polymer").
When the thermoplastic resin contains a reactive group-containing (meth) acrylic copolymer, the adhesive piece 3p may not contain a thermosetting resin. That is, an embodiment containing a reactive group-containing (meth) acrylic copolymer, a curing accelerator, and a filler may be used.
The thermoplastic resin may be used alone or in combination of two or more.

Examples of the (meth) acrylic copolymer include (meth) acrylic acid ester copolymers such as acrylic glass and acrylic rubber, and acrylic rubber is preferable. The acrylic rubber is preferably formed by copolymerizing an acrylic acid ester as a main component and a monomer selected from (meth) acrylic acid ester and acrylonitrile.

Examples of the (meth) acrylic acid ester include methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate, isobutyl acrylate, hexyl acrylate, cyclohexyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate, methyl methacrylate, ethyl methacrylate, and propyl methacrylate. Examples thereof include isopropyl acrylate, butyl methacrylate, isobutyl methacrylate, hexyl methacrylate, cyclohexyl methacrylate, 2-ethylhexyl methacrylate and lauryl methacrylate.
As the (meth) acrylic acid ester copolymer, a copolymer containing butyl acrylate and acrylonitrile as a copolymerization component and a copolymer containing ethyl acrylate and acrylonitrile as a copolymerization component are preferable.

The reactive group-containing (meth) acrylic copolymer is preferably a reactive group-containing (meth) acrylic copolymer containing a (meth) acrylic monomer having a reactive group as a copolymerization component. Such a reactive group-containing (meth) acrylic copolymer can be obtained by copolymerizing a (meth) acrylic monomer having a reactive group and a monomer composition containing the above-mentioned monomer. ..

As the reactive group, an epoxy group, a carboxyl group, an acryloyl group, a methacryloyl group, a hydroxyl group and an episulfide group are preferable from the viewpoint of improving heat resistance, and an epoxy group and a carboxyl group are more preferable from the viewpoint of crosslinkability.

In the present embodiment, the reactive group-containing (meth) acrylic copolymer is preferably an epoxy group-containing (meth) acrylic copolymer containing a (meth) acrylic monomer having an epoxy group as a copolymerization component. In this case, examples of the (meth) acrylic monomer having an epoxy group include glycidyl acrylate, 4-hydroxybutyl acrylate glycidyl ether, 3,4-epoxycyclohexylmethyl acrylate, glycidyl methacrylate, 4-hydroxybutyl methacrylate glycidyl ether, and 3,4-. Epoxycyclohexylmethylmethacrylate and the like can be mentioned. As the (meth) acrylic monomer having a reactive group, glycidyl acrylate and glycidyl methacrylate are preferable from the viewpoint of heat resistance.

The Tg of the thermoplastic resin is preferably −50 ° C. to 50 ° C. When the Tg of the thermoplastic resin is 50 ° C. or lower, it is easy to secure the flexibility of the adhesive piece 3p. Further, if there are irregularities when the material is attached to the adherend, it becomes easy to follow the surface and has an appropriate adhesiveness. On the other hand, when the Tg of the thermoplastic resin is −50 ° C. or higher, it is easy to prevent the adhesive piece 3p from becoming too flexible, and excellent handleability, adhesiveness, and peelability can be achieved.

The Tg of the thermoplastic resin is an intermediate point glass transition temperature value obtained by differential scanning calorimetry (DSC). Specifically, the Tg of the thermoplastic resin is an intermediate calculated by a method based on JIS K 7121: 1987 by measuring the change in calorific value under the conditions of a heating rate of 10 ° C./min and a measurement temperature of -80 to 80 ° C. The point glass transition temperature.

The weight average molecular weight of the thermoplastic resin is preferably 100,000 or more and 2 million or less. When the weight average molecular weight is 100,000 or more, it becomes easy to secure heat resistance when used for temporary fixing. On the other hand, when the weight average molecular weight is 2 million or less, it is easy to suppress a decrease in flow and a decrease in stickability when used for temporary fixing. From the above viewpoint, the weight average molecular weight of the thermoplastic resin is more preferably 500,000 or more and 2 million or less, and further preferably 1 million or more and 2 million or less. The weight average molecular weight is a polystyrene-equivalent value using a calibration curve made of standard polystyrene by gel permeation chromatography (GPC).

When the (meth) acrylic copolymer having a reactive group contains glycidyl acrylate or glycidyl methacrylate as a copolymerization component, the total content thereof is 0.1 to 20% by mass based on the total amount of the copolymerization component. It is preferably 0.5 to 15% by mass, more preferably 1.0 to 10% by mass, and even more preferably 1.0 to 10% by mass. When the content is within the above range, it is easy to achieve all of the flexibility, adhesiveness and peelability of the adhesive piece 3p to a higher level.

As the (meth) acrylic copolymer having a reactive group as described above, one obtained by a polymerization method such as pearl polymerization or solution polymerization may be used. Alternatively, a commercially available product such as HTR-860P-3CSP (trade name, manufactured by Nagase ChemteX Corporation) may be used.

(Thermosetting resin)
As the thermosetting resin, any resin that can be cured by heat can be used without particular limitation. Examples of the thermosetting resin include epoxy resin, acrylic resin, silicone resin, phenol resin, thermosetting polyimide resin, polyurethane resin, melamine resin, and urea resin. These can be used alone or in combination of two or more.

The epoxy resin is not particularly limited as long as it is cured and has a heat resistant effect. As the epoxy resin, a bifunctional epoxy resin such as bisphenol A type epoxy, a novolak type epoxy resin such as a phenol novolac type epoxy resin, and a novolak type epoxy resin such as cresol novolac type epoxy resin can be used. As the epoxy resin, conventionally known ones such as a polyfunctional epoxy resin, a glycidylamine type epoxy resin, a heterocyclic-containing epoxy resin, and an alicyclic epoxy resin can be used.

Bisphenol A type epoxy resins include Epicoat 807, Epicoat 815, Epicoat 825, Epicoat 827, Epicoat 828, Epicoat 834, Epicoat 1001, Epicoat 1004, Epicoat 1007, Epicoat 1009 (all manufactured by Mitsubishi Chemical Co., Ltd.), DER- 330, DER-301, DER-361 (all manufactured by Dow Chemical Co., Ltd.), YD8125, YDF8170 (all manufactured by Toto Kasei Co., Ltd.) and the like can be mentioned.
Examples of the phenol novolac type epoxy resin include Epicoat 152, Epicoat 154 (all manufactured by Mitsubishi Chemical Co., Ltd.), EPPN-201 (manufactured by Nippon Kayaku Co., Ltd.), DEN-438 (manufactured by Dow Chemical Co., Ltd.) and the like. ..
Examples of the o-cresol novolac type epoxy resin include YDCN-700-10 (manufactured by Nippon Steel & Sumitomo Metal Corporation), EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, and EOCN-1027 (any of them). (Made by Nippon Kayaku Co., Ltd.), YDCN701, YDCN702, YDCN703, YDCN704 (all manufactured by Toto Kasei Co., Ltd.) and the like.
Examples of the polyfunctional epoxy resin include Epon 1031S (manufactured by Mitsubishi Chemical Corporation), Araldite 0163 (manufactured by BASF Japan), Denacol EX-611, EX-614, EX-614B, EX-622, EX-512, and EX-. 521, EX-421, EX-411, EX-321 (all manufactured by Nagase ChemteX Corporation) and the like can be mentioned.
As the amine type epoxy resin, Epicoat 604 (manufactured by Mitsubishi Chemical Corporation), YH-434 (manufactured by Toto Kasei Co., Ltd.), TETRAD-X, TETRAD-C (all manufactured by Mitsubishi Gas Chemical Co., Ltd.), ELM -120 (manufactured by Sumitomo Chemical Corporation) and the like can be mentioned.
Examples of the heterocyclic-containing epoxy resin include Araldite PT810 (manufactured by BASF Japan Ltd.), ERL4234, ERL4299, ERL4221 and ERL4206 (all manufactured by Union Carbide). These epoxy resins can be used alone or in combination of two or more.

As the epoxy resin curing agent which is a part of the thermosetting resin component, a commonly used known resin can be used. Specifically, bisphenols and phenol novolak resins having two or more phenolic hydroxyl groups in one molecule, such as amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, bisphenol A, bisphenol F, and bisphenol S. , Bisphenol A novolak resin, phenolic resin such as cresol novolak resin and the like. As the epoxy resin curing agent, phenolic resins such as phenol novolac resin, bisphenol A novolak resin, and cresol novolak resin are particularly preferable from the viewpoint of excellent electrolytic corrosion resistance during moisture absorption.
The epoxy curing agent may be used at the same time as the epoxy resin, or may be used alone.

Among the above phenol resin curing agents, Phenolite LF2882, Phenolite LF2282, Phenolite TD-2090, Phenolite TD-2149, Phenolite VH-4150, Phenolite VH4170 (all manufactured by DIC Co., Ltd., trade names). H-1 (manufactured by Meiwa Kasei Co., Ltd., trade name), Epicure MP402FPY, Epicure YL6065, Epicure YLH129B65, Millex XL, Millex XLC, Millex XLC-LL, Millex RN, Millex RS, Millex VR (all from Mitsubishi Chemical Co., Ltd.) ), It is preferable to use the trade name).

The content of the thermosetting resin in the adhesive piece 3p is preferably 70 to 240 parts by mass, more preferably 70 to 180 parts by mass, still more preferably 70 to 120 parts by mass with respect to 100 parts by mass of the thermoplastic resin. When the content of the thermosetting resin is within the above range, shrinkage of the adhesive piece 3p due to heat curing can be suppressed, and excellent adhesion after heat curing can be easily achieved.

(Hardening accelerator)
Examples of the curing accelerator include imidazoles, dicyandiamide derivatives, dicarboxylic acid dihydrazide, triphenylphosphine, tetraphenylphosphonium tetraphenylborate, 2-ethyl-4-methylimidazole-tetraphenylborate, 1,8-diazabicyclo [5,4. 0] Undecene-7-tetraphenylborate and the like can be mentioned. These can be used alone or in combination of two or more.

When the adhesive piece 3p contains a (meth) acrylic copolymer having an epoxy group, it is preferable to contain a curing accelerator that promotes curing of the epoxy group contained in the acrylic copolymer. Examples of the curing accelerator that promotes the curing of the epoxy group include a phenol-based curing agent, an acid anhydride-based curing agent, an amine-based curing agent, an imidazole-based curing agent, an imidazoline-based curing agent, a triazine-based curing agent, and a phosphine-based curing agent. Can be mentioned. Among these, an imidazole-based curing agent, which can be expected to shorten the process time and improve workability, is preferable from the viewpoint of quick curing property, heat resistance and peelability. These compounds may be used alone or in combination of two or more.

The content of the curing accelerator in the adhesive piece 3p is preferably 0.01 to 2.0 parts by mass, more preferably 0.02 to 1.5 parts by mass, and 0. 03 to 1.0 parts by mass is more preferable. When the content of the curing accelerator is within the above range, there is a tendency that the deterioration of the storage stability can be sufficiently suppressed while improving the curing property of the adhesive piece 3p.

(Inorganic filler)
The adhesive piece 3p preferably contains an inorganic filler. Examples of the inorganic filler include metal fillers such as silver powder, gold powder and copper powder, and non-metal inorganic fillers such as silica, alumina, boron nitride, titania, glass, iron oxide and ceramics. The inorganic filler can be selected according to the desired function.

The inorganic filler preferably has an organic group on its surface. Since the surface of the inorganic filler is modified with an organic group, the dispersibility in an organic solvent when preparing a varnish for forming the adhesive piece 3p and the shrinkage of the adhesive piece 3p due to thermosetting are suppressed. At the same time, it is easy to achieve both high elastic modulus and excellent peelability of the adhesive piece 3p.

The inorganic filler having an organic group on the surface can be obtained, for example, by mixing a silane coupling agent represented by the following formula (B-1) and the inorganic filler and stirring at a temperature of 30 ° C. or higher. It is possible to confirm that the surface of the inorganic filler is modified by an organic group by UV measurement, IR measurement, XPS measurement or the like.

In the formula (B-1), X represents an organic group selected from the group consisting of a phenyl group, a glycidoxy group, an acryloyl group, a methacryloyl group, a mercapto group, an amino group, a vinyl group, an isocyanate group and a methacryloxy group, and s Indicates an integer of 0 or 1 to 10, and R ¹¹ , R ¹² and R ¹³ each independently indicate an alkyl group having 1 to 10 carbon atoms.
Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, an isopropyl group and an isobutyl group. ..
The alkyl group having 1 to 10 carbon atoms is preferably a methyl group, an ethyl group and a pentyl group from the viewpoint of easy availability. From the viewpoint of heat resistance, X is preferably an amino group, a glycidoxy group, a mercapto group and an isocyanate group, and more preferably a glycidoxy group and a mercapto group. The s in the formula (B-1) is preferably 0 to 5, and more preferably 0 to 4 from the viewpoint of suppressing the film fluidity at the time of high heat and improving the heat resistance.

Examples of the silane coupling agent include trimethoxyphenylsilane, dimethyldimethoxyphenylsilane, triethoxyphenylsilane, dimethoxymethylphenylsilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, and N- (2). -Aminoethyl) -3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-glycid Xipropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-isoxapropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3- Mercaptopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, N- (1,3-dimethylbutylidene) -3- (triethoxysilyl) -1-propaneamine, N, N'-bis (3- (tri) Examples thereof include methoxysilyl) propyl) ethylenediamine, polyoxyethylenepropyltrialkoxysilane, and polyethoxydimethylsiloxane.
Among these, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isoxapropyltriethoxysilane, and 3-mercaptopropyltrimethoxysilane are preferable, and trimethoxyphenylsilane and 3-glycidoxy are preferable. Propyltrimethoxysilane and 3-mercaptopropyltrimethoxysilane are more preferred. The silane coupling agent may be used alone or in combination of two or more.

The content of the coupling agent is preferably 0 to 10 parts by mass, more preferably 0 to 5 parts by mass, based on 100 parts by mass of the thermoplastic resin, from the viewpoint of balancing heat resistance and storage stability. From the viewpoint of storage stability, 0 to 3 parts by mass is more preferable.

The content of the inorganic filler in the adhesive piece 3p is preferably 450 parts by mass or less, more preferably 400 parts by mass or less, and more preferably 350 parts by mass or less with respect to 100 parts by mass of the thermoplastic resin. More preferred. The lower limit of the content of the inorganic filler is not particularly limited, but is preferably 10 parts by mass or more, and more preferably 50 parts by mass or more with respect to 100 parts by mass of the thermoplastic resin. By setting the content of the inorganic filler in the above range, shrinkage due to thermosetting can be suppressed, and it is easy to achieve both high melt viscosity and excellent peelability of the adhesive piece 3p.

(Organic filler)
The adhesive piece 3p may contain an organic filler. Examples of the organic filler include carbon, rubber-based filler, silicone-based fine particles, polyamide fine particles, polyimide fine particles, and the like. The content of the organic filler is preferably 450 parts by mass or less, more preferably 400 parts by mass or less, and even more preferably 350 parts by mass or less with respect to 100 parts by mass of the thermoplastic resin. The lower limit of the content of the organic filler is not particularly limited, but is preferably 10 parts by mass or more with respect to 100 parts by mass of the thermoplastic resin.

(Organic solvent)
The adhesive piece 3p may be diluted with an organic solvent, if necessary. The organic solvent is not particularly limited, but can be determined in consideration of the volatility at the time of film formation and the like from the boiling point. Specifically, a solvent having a relatively low boiling point such as methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methylethylketone, acetone, methylisobutylketone, toluene, and xylene is applied to the film during film formation. It is preferable from the viewpoint that curing does not proceed easily. Further, for the purpose of improving the film-forming property, it is preferable to use a solvent having a relatively high boiling point such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone and cyclohexanone. These solvents may be used alone or in combination of two or more.

[Protective member]
The protective member 5p is formed by simultaneously die-cutting an adhesive layer 3 formed to cover the surface of the carrier film 1 and a protective film 5 arranged to cover the adhesive layer 3 to form an adhesive piece 3p. It is formed together with (see FIG. 4). Since the protective member 5p according to the present embodiment is formed at the same time as the adhesive piece 3p by die cutting, it has substantially the same shape as the adhesive piece 3p. The protective film 5 may be any as long as it can be punched in the manufacturing process of the adhesive film 10 and the protective member 5p can be easily peeled off from the adhesive piece 3p in the manufacturing process of the semiconductor device.

The adhesion between the adhesive piece 3p and the protective member 5p is preferably 16 N / m or less, more preferably 10 N / m or less, and 5 N / m or less or 4.5 N / m or less. May be good. In particular, when the adhesive piece 3p is made of a thermosetting resin composition, it is preferable that the adhesive force of the protective member 5p to the adhesive piece 3p is within the above range after heat treatment at 90 ° C. for 1 second. When this adhesive force is 16 N / m or less, the adhesive piece 3p covered with the protective member 5p is temporarily pressure-bonded to an adherend (for example, a substrate) at 90 ° C. for 1 second. The protective member 5p can be easily peeled off from the semi-cured adhesive piece 3p with an adhesive tape or the like. The adhesive force of the protective member 5p to the adhesive piece 3p means a 90 ° peel strength, and specifically, a protective film having the same width on an adhesive layer having the same composition as the adhesive piece 3p and having a width of 20 mm. It means the peel strength measured when a sample is prepared and the protective film is peeled off from the adhesive layer at an angle of 90 ° and a peeling speed of 300 mm / min.

The protective film 5 includes polyester films such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyvinylacetate film, poly-4-methylpentene-1, and ethylene-vinyl acetate. A polymer, a homopolymer such as an ethylene-ethyl acrylate copolymer, a polyolefin film such as a copolymer or a mixture thereof, a plastic film such as a polyvinyl chloride film and a polyimide film, and the like can be used. The protective film 5 may have a single-layer structure or a multi-layer structure.

The thickness of the protective film 5 may be appropriately selected within a range that does not impair workability, and may be, for example, 10 to 200 μm, 20 to 100 μm, or 25 to 80 μm. These thickness ranges are practically acceptable and economically effective.

The light transmittance of the protective member 5p is preferably lower than the light transmittance of the carrier film 1. By adopting such a configuration, the position and orientation of the adhesive piece 3p can be recognized by a device such as a camera, and the bonding process in the manufacturing process of the semiconductor device can be easily automated. For example, it is preferable to use a protective member 5p colored so that the transmittance of light having a wavelength of 500 nm is less than 10% (more preferably less than 7%).

<Manufacturing method of adhesive film>
Next, a method for manufacturing the adhesive film 10 will be described. The manufacturing method of this embodiment includes the following steps.
(A) A laminate having a strip-shaped carrier film 1 having a width of 100 mm or less, an adhesive layer 3 formed so as to cover the surface of the carrier film 1, and a protective film 5 arranged so as to cover the adhesive layer 3. The process of preparing 20.
(B) A step of punching out the adhesive layer 3 and the protective film 5 in the laminated body 20 to obtain a plurality of adhesive pieces 3p arranged so as to be lined up in the longitudinal direction of the carrier film 1 on the carrier film 1.

FIG. 3 is a cross-sectional view schematically showing the laminated body 20 prepared in the step (A). The laminated body 20 can be produced as follows. First, the raw material resin composition of the adhesive layer 3 is dissolved in a solvent such as an organic solvent to prepare a varnished coating liquid. After applying this coating liquid on the carrier film 1, the adhesive layer 3 is formed by removing the solvent. Examples of the coating method include a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, a curtain coating method and the like. Next, the protective film 5 is attached to the surface of the adhesive layer 3 under the conditions of room temperature to 60 ° C. Thereby, the laminated body 20 can be obtained. After forming the adhesive layer 3 on the wide carrier film, a laminated film is produced by laminating the protective film 5 so as to cover the adhesive layer 3, and the laminated film is cut (slit) to a width of 100 mm or less. The laminated body 20 may be obtained.

FIG. 4 is a perspective view showing how a plurality of adhesive pieces 3p and a protective member 5p covering the adhesive pieces 3p are formed on the carrier film 1 by die cutting in the step (B). As shown in FIG. 4, the laminated body 20 passes between the rotating body 51 having a plurality of blades 51c for performing die cutting on the outer peripheral surface and the roll 52 paired with the rotating body 51. An adhesive piece 3p and a protective member 5p corresponding to the shape of the blade 51c are continuously formed on the carrier film 1. At this time, in the laminated body 20, the surface on the protective film 5 side faces the rotating body 51, and the surface on the carrier film 1 side faces the roll 52. By adjusting the distance between the rotating shaft 51a of the rotating body 51 and the rotating shaft 52a of the roll 52, the depth of the cut formed in the laminated body 20 by the blade 51c can be adjusted.

As shown in FIG. 4, the laminated body 20 that has passed between the rotating body 51 and the roll 52 is separated into an adhesive film 10 and an unnecessary portion 30, and is wound on each reel (not shown). The unnecessary portion 30 is composed of an adhesive layer 3 in which an adhesive piece 3p and a protective member 5p are hollowed out, and a protective film 5.

<How to use the adhesive film>
Next, how to use the adhesive film 10, a method for manufacturing a connector comprising a semiconductor chip and the FPC board will be described as an example. FIG. 5 is a cross-sectional view schematically showing how the adhesive piece 3p and the protective member 5p covering the adhesive piece 3p are picked up from the carrier film 1. With a constant tension applied to the adhesive film 10, the adhesive film 10 is moved in the direction of the arrow shown in FIG. 5 while the surface of the adhesive film 10 on the carrier film 1 side is brought into contact with the wedge-shaped member 60. As a result, as shown in the figure, the front of the adhesive piece 3p and the protective member 5p is in a state of floating from the carrier film 1. In this state, for example, the adhesive piece 3p and the protective member 5p are picked up by the pickup device 65 having a suction force. For example, by using a pickup device 65 equipped with a camera or the like for visually recognizing the protective member 5p, it is possible to grasp information such as the presence / absence of the adhesive piece 3p and the protective member 5p, and the orientation. .. Based on this information, the subsequent bonding step can be appropriately carried out.

Next, the adhesive piece 3p covered with the protective member 5p is arranged at a predetermined position and orientation on the surface C1 of the semiconductor chip C (see FIG. 6A). In this state, the adhesive piece 3p is temporarily crimped to the semiconductor chip C. Temporary crimping may be performed, for example, under the conditions of a temperature of 60 to 100 ° C. and a pressing force of 0.1 to 0.8 MPa for 0.1 to 10 seconds. By the temporary crimping, the adhesive piece 3p is semi-cured, so that the adhesive force to the surface C1 is improved. Then, the protective member 5p is peeled off from the adhesive piece 3p using an adhesive tape or the like (see FIG. 6B).

The step of adhering the tip portion S1 of the FPC substrate S to the semiconductor chip C is a step of crimping the semiconductor chip C and the tip portion S1 of the FPC substrate S via the adhesive piece 3p, and then to the adhesive piece 3p. Includes a step of applying a curing treatment. That is, first, the tip portion S1 of the FPC substrate S is placed on the surface of the adhesive piece 3p exposed by the peeling of the protective member 5p, and then the tip portion S1 of the FPC substrate S is crimped against the semiconductor chip C. The crimping may be performed for 0.1 to 10 seconds under the conditions of, for example, a temperature of 90 to 150 ° C. and a pressing force of 0.1 to 1 MPa. Next, as shown in FIG. 7, an adhesive piece between the tip portion S1 of the FPC substrate S and the semiconductor chip C while holding the FPC substrate S by applying a force F upward to the FPC substrate S. Carry out a 3p curing process. The curing treatment may be performed, for example, at a temperature of 100 to 175 ° C. for 0.5 to 6 hours.

FIG. 8A is a cross-sectional view schematically showing a module 50 (connector) in which the tip end portion S1 of the FPC substrate S can be suitably adhered to the semiconductor chip C. FIG. 8B is a cross-sectional view schematically showing a module in which the tip portion S1 of the FPC substrate S could not be suitably bonded to the semiconductor chip C. As shown in FIG. 8B, when a part of the adhesive piece 3p is stretched due to the force F when the adhesive piece 3p is cured, a part of the adhesive piece 3p becomes thick. The position where wire bonding should be performed is displaced from the surface C1 of the semiconductor chip C to the upper surface S2 of the FPC substrate S, and wire bonding cannot be suitably performed.

In the suitable module 50 shown in FIG. 8A, the semiconductor chip C and the FPC substrate S are electrically connected by wire bonding from the surface C1 of the semiconductor chip C to the upper surface S2 of the FPC substrate S. Module (not shown) is obtained.

Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above embodiments. For example, in the above embodiment, a case where a colored protective film 5 is used so that the presence / absence and orientation of the protective member 5p can be grasped by a camera or the like is illustrated, but instead of this, a predetermined protective member 5p is specified. A mark may be added to the position of. Further, if the adhesive piece 3p is colored, the protective member 5p may not be provided. When the orientation of the adhesive piece 3p does not matter (for example, when the shape of the adhesive piece 3p is circular), it is not necessary to identify the orientation.

Further, in the above embodiment, the case where the adhesive piece 3p composed of the adhesive composition is prepared in advance by die cutting is exemplified, but a coating liquid containing the adhesive composition is prepared and used as a semiconductor chip C or FPC. An adhesive layer may be formed in a predetermined region of the substrate S by coating the region.

Hereinafter, the present disclosure will be described based on examples. The present disclosure is not limited to the following examples.

<Example 1>
(Preparation of adhesive varnish)
The following materials were mixed and vacuum degassed to obtain an adhesive varnish (see Example 1 in Table 1).
-Thermoplastic resin: HTR-860P-3 (trade name, manufactured by Nagase ChemteX Corporation, glycidyl group-containing acrylic rubber, molecular weight 1 million, Tg-7 ° C) 100 parts by mass-Thermosetting resin: YDCN-700- 10 (trade name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., o-cresol novolac type epoxy resin, epoxy equivalent 210) 30 parts by mass, thermosetting resin: PSM-4326 (trade name, manufactured by Gunei Chemical Industry Co., Ltd., Phenol resin, functional group equivalent 105) 95 parts by mass, thermosetting resin: YDF-8170C (trade name, manufactured by Nippon Steel & Sumitomo Metal Corporation, bisphenol F type epoxy resin, epoxy equivalent 157) 100 parts by mass, curing accelerator: 2PZ-CN (trade name, manufactured by Shikoku Kasei Kogyo Co., Ltd., imidazole compound) 0.3 parts by mass ・ Surface treatment filler: SC-2050-HLG (trade name, manufactured by Admatex Co., Ltd.) 330 parts by mass ・ Silane cup Ring agent: A-189 (trade name, manufactured by NUC Co., Ltd., γ-mercaptopropyltrimethoxysilane) 0.9 parts by mass ・ Silane coupling agent: A-1160 (trade name, manufactured by NUC Co., Ltd., γ- Ureidopropyltriethoxysilane) 2 parts by mass

(Making an adhesive film)
The adhesive varnish was applied onto a surface release-treated polyethylene terephthalate film (manufactured by Teijin DuPont Film Co., Ltd., trade name: Teijin Tetron Film A-63) having a thickness of 50 μm. Through the drying step, a film having an adhesive layer having a thickness of 25 μm formed on one surface of the polyethylene terephthalate film (carrier film) was obtained. A laminated film was obtained by laminating this film and a colored polyethylene film having a thickness of 50 μm (TDM-1 manufactured by Tamapoli Co., Ltd.). By slitting this laminated film to a width of 15 mm, a strip-shaped laminated body was obtained.

The laminated body obtained as described above was die-cut using the apparatus having the configuration shown in FIG. 4 to obtain an adhesive film according to this embodiment. ^{The shape of the adhesive piece was a shape (area: 29 mm 2} ) in which a part of a rectangle having a length of about 7 mm and a width of about 6 mm was missing. The pitch P was about 9 mm. The area ratio R of the adhesive piece was 23%. The melt viscosity of the adhesive composition constituting the adhesive piece at 130 ° C. was 3500 Pa · s.

(Making a module)
On the upper surface of the semiconductor chip (length: about 15 mm × width: about 15 mm × thickness: 0.4 mm), a 3.2 mm × 3.2 mm adhesive piece and a protective member covering the adhesive piece were arranged (see FIG. 6A). In this state, under a temperature condition of 90 ° C., a pressing force of 10 N was applied to the adhesive piece for 0.5 seconds to temporarily press the adhesive piece against the semiconductor chip. Then, the protective member was peeled off to expose the adhesive piece (see FIG. 6 (b)). The tip of the FPC substrate was crimped against the exposed adhesive piece. The crimping was performed by applying a pressing force of 15 N to the adhesive piece at a temperature of 130 ° C. for 1 second. After crimping, as shown in FIG. 7, the adhesive piece was cured at a temperature of 130 ° C. for 1 hour while holding the FPC substrate by applying a force of 250 g upward to the FPC substrate, and the module (connection) was formed. Body) was made. These steps were repeated to produce a total of 10 modules.

<Example 2>
Except for the use of the adhesive varnish having the composition shown in Example 2 of Table 1, an adhesive piece according to this example was prepared in the same manner as in Example 1, and a total of 10 pieces were used. The module was made. The melt viscosity of the adhesive composition constituting the adhesive piece at 130 ° C. was 6500 Pa · s.

<Example 3>
Except for the use of the adhesive varnish having the composition shown in Example 3 of Table 1, an adhesive piece according to this example was prepared in the same manner as in Example 1, and a total of 10 pieces were used. The module was made. The melt viscosity of the adhesive composition constituting the adhesive piece at 130 ° C. was 13000 Pa · s.

<Example 4>
Except for the use of the adhesive varnish having the composition shown in Example 4 of Table 1, an adhesive piece according to this example was prepared in the same manner as in Example 1, and a total of 10 pieces were used. The module was made. The melt viscosity of the adhesive composition constituting the adhesive piece at 130 ° C. was 20000 Pa · s.

<Comparative Example 1>
Except for the use of the adhesive varnish having the composition shown in Comparative Example 1 in Table 1, an adhesive piece according to this Comparative Example was prepared in the same manner as in Example 1, and a total of 10 pieces were used. The module was made. The melt viscosity of the adhesive composition constituting the adhesive piece at 130 ° C. was 24000 Pa · s.

<Comparative Example 2>
Except for the use of the adhesive varnish having the composition shown in Comparative Example 2 in Table 1, an adhesive piece according to this Comparative Example was prepared in the same manner as in Example 1, and a total of 10 pieces were used. The module was made. The melt viscosity of the adhesive composition constituting the adhesive piece at 130 ° C. was 1700 Pa · s.

The following items were evaluated for the adhesive pieces according to the above Examples and Comparative Examples. The results are shown in Table 1.

(1) Elongation of Adhesive Pieces The adhesiveness of a total of 10 modules obtained as described above was evaluated as follows. That is, the thickness of the side where tension was applied to the adhesive piece in the curing treatment (left side in FIG. 7) was measured by an optical microscope image. For each of the four modules, the thickness of each of the above points was measured, and the average value was calculated. The thickness of the adhesive piece before use was 25 μm.
It was evaluated according to the following criteria.
A: The average value of the above thickness is less than 30 μm.
B: The average value of the thickness is 30 to 250 μm.
C: The average value of the above thickness is more than 250 μm.
D: Of the total of four modules, the number of modules from which the FPC substrate has peeled off during the curing process of the adhesive piece is three or more.

(2) Adhesiveness of Adhesive Pieces The adhesiveness of a total of 10 modules obtained as described above was evaluated as follows. That is, the semiconductor chip was fixed by sticking it to the surface of the table, and in this state, a force was gradually applied upward to the FPC substrate. It was confirmed whether or not the FPC substrate was peeled off from the semiconductor chip when a force of 0.5 N was applied to the FPC substrate.
It was evaluated according to the following criteria.
A: Of the total of 10 modules, the number of modules from which the FPC substrate has peeled off is 2 or less.
B: Of the total of 10 modules, the number of modules from which the FPC substrate has been peeled off is 3 to 8.
C: Of the total of 10 modules, the number of modules from which the FPC substrate has been peeled off is 9 or more.
D: Of the total of 10 modules, the number of modules from which the FPC substrate has peeled off during the curing process of the adhesive piece is 5 or more.

(3) Voids of adhesive pieces The voids of a total of two modules obtained as described above were evaluated as follows. That is, the obtained module was inspected with an ultrasonic imaging device SAT (manufactured by Hitachi Construction Machinery, FS200II) to confirm the presence or absence of voids. The evaluation criteria for the presence or absence of voids are as follows.
A: The percentage of voids is less than 10%.
D: Void ratio is 10% or more.

According to one aspect of the present disclosure, there is provided an adhesive composition which is excellent in adhesiveness between a semiconductor chip and an FPC substrate and can suitably perform wire bonding performed after bonding the semiconductor chip and the FPC substrate. According to one aspect of the present disclosure, there is provided an adhesive film comprising a plurality of adhesive pieces made of this adhesive composition, and a method for producing a connector.

1 ... Carrier film, 3 ... Adhesive layer, 3p ... Adhesive piece (adhesive composition), 5 ... Protective film, 5p ... Protective member, 10 ... Adhesive film, 50 ... Module (connector) C ... Semiconductor chip, F1 ... Adhesive piece surface (first surface), F2 ... Adhesive piece surface (second surface), S ... Flexible printed circuit board

Claims (14)

A method for manufacturing a connector including a semiconductor chip and a flexible printed circuit board.
An adhesive layer made of an adhesive composition having a melt viscosity at 130 ° C. of 3500 to 20000 Pa · s is interposed between the semiconductor chip and the tip of the flexible printed circuit board, and the semiconductor chip and the flexible printed circuit board are provided. The process of adhering the tip of the circuit board and
The step of heating the adhesive layer at 100 to 175 ° C. for 30 to 360 minutes, and
The process of wire bonding the semiconductor chip and the flexible printed circuit board,
A method of manufacturing a connector, including in this order. A method for manufacturing a connector including a semiconductor chip and a flexible printed circuit board.
An adhesive piece made of an adhesive composition having a melt viscosity at 130 ° C. of 3500 to 20000 Pa · s is interposed between the semiconductor chip and the tip of the flexible printed circuit board, and the semiconductor chip and the flexible printed circuit board are interleaved. The process of adhering the tip of the circuit board and
The step of heating the adhesive piece at 100 to 175 ° C. for 30 to 360 minutes, and
The process of wire bonding the semiconductor chip and the flexible printed circuit board,
A method of manufacturing a connector, including in this order. The method for manufacturing a connector according to claim ² , wherein the area of the adhesive piece is 10 to 200 mm 2. The adhesive composition comprises at least a thermoplastic resin and a thermosetting resin.
The method for producing a connector according to any one of claims 1 to 3, wherein the content of the thermoplastic resin is 100 parts by mass, and the content of the thermosetting resin is 70 to 240 parts by mass. The adhesive composition further comprises a filler and contains
The method for producing a connector according to claim 4 , wherein the content of the filler is 10 to 450 parts by mass, where the content of the thermoplastic resin is 100 parts by mass. An adhesive composition used for adhering a semiconductor chip and a flexible printed circuit board.
An adhesive composition having a melt viscosity at 130 ° C. of 13000 to 20000 Pa · s. Contains at least a thermoplastic resin and a thermosetting resin,
The adhesive composition according to claim 6 , wherein the content of the thermoplastic resin is 100 parts by mass, and the content of the thermosetting resin is 70 to 240 parts by mass. Contains more filler,
The adhesive composition according to claim 7 , wherein the content of the filler is 10 to 450 parts by mass, where the content of the thermoplastic resin is 100 parts by mass. The adhesive composition according to any one of claims 6 to 8, which is used for adhering a semiconductor chip and a tip end portion of a flexible printed circuit board. A strip-shaped carrier film with a width of 100 mm or less and
A plurality of adhesive pieces arranged so as to be arranged in the longitudinal direction of the carrier film on the carrier film,
Equipped with
The adhesive piece is an adhesive film comprising the adhesive composition according to any one of claims 6 to 9. The adhesive film according to claim 10 , wherein the adhesive piece has an area ^{of 10 to 200 mm 2.} The adhesive film according to claim 10 or 11 , wherein the adhesive piece is formed by punching out an adhesive layer formed so as to cover the surface of the carrier film. Any one of claims 10 to 12 , further comprising a protective member having the same shape as the adhesive piece, covering the first side of the adhesive piece on the carrier film side and the second side opposite to the carrier film side. Adhesive film described in. The adhesive piece and the protective member were formed by punching out an adhesive layer formed so as to cover the surface of the carrier film and a protective film arranged so as to cover the adhesive layer. The adhesive film according to claim 13.

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