JP6973333B2 - An active energy ray-curable composition containing an organopolysiloxane compound having a polymerizable functional group. - Google Patents
An active energy ray-curable composition containing an organopolysiloxane compound having a polymerizable functional group. Download PDFInfo
- Publication number
- JP6973333B2 JP6973333B2 JP2018159165A JP2018159165A JP6973333B2 JP 6973333 B2 JP6973333 B2 JP 6973333B2 JP 2018159165 A JP2018159165 A JP 2018159165A JP 2018159165 A JP2018159165 A JP 2018159165A JP 6973333 B2 JP6973333 B2 JP 6973333B2
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- Prior art keywords
- meth
- group
- acrylate
- active energy
- energy ray
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- 150000001875 compounds Chemical class 0.000 title claims description 74
- 229920001296 polysiloxane Polymers 0.000 title claims description 65
- 239000000203 mixture Substances 0.000 title claims description 49
- 125000000524 functional group Chemical group 0.000 title description 10
- -1 acryloyloxypropyl group Chemical group 0.000 claims description 26
- 239000011248 coating agent Substances 0.000 claims description 26
- 125000004432 carbon atom Chemical group C* 0.000 claims description 22
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 20
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 9
- 150000002430 hydrocarbons Chemical group 0.000 claims description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 125000005843 halogen group Chemical group 0.000 claims description 5
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 4
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 3
- XVHPFVIYVYIHHN-UHFFFAOYSA-N 1,2,3-trihydroxypropyl prop-2-enoate Chemical compound OCC(O)C(O)OC(=O)C=C XVHPFVIYVYIHHN-UHFFFAOYSA-N 0.000 claims description 2
- 239000005977 Ethylene Substances 0.000 claims description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 claims description 2
- 239000003505 polymerization initiator Substances 0.000 claims description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims 1
- 239000010410 layer Substances 0.000 description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
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- 238000005452 bending Methods 0.000 description 21
- 239000000047 product Substances 0.000 description 21
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 18
- 238000000576 coating method Methods 0.000 description 16
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 13
- 229910000077 silane Inorganic materials 0.000 description 13
- 238000003786 synthesis reaction Methods 0.000 description 13
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 12
- 239000003054 catalyst Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000003999 initiator Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
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- 125000002947 alkylene group Chemical group 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 238000005481 NMR spectroscopy Methods 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 125000004122 cyclic group Chemical group 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 229940098779 methanesulfonic acid Drugs 0.000 description 6
- 229920001281 polyalkylene Polymers 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000009835 boiling Methods 0.000 description 5
- 239000007795 chemical reaction product Substances 0.000 description 5
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000011085 pressure filtration Methods 0.000 description 5
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 5
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
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- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 238000006482 condensation reaction Methods 0.000 description 4
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 150000004756 silanes Chemical class 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
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- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 3
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- 230000004888 barrier function Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
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- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 230000003449 preventive effect Effects 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 229910052938 sodium sulfate Inorganic materials 0.000 description 3
- 235000011152 sodium sulphate Nutrition 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical group CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
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- 125000003545 alkoxy group Chemical group 0.000 description 2
- 230000003373 anti-fouling effect Effects 0.000 description 2
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- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 125000004956 cyclohexylene group Chemical group 0.000 description 2
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
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- 230000007062 hydrolysis Effects 0.000 description 2
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- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 2
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- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
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- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
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- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
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- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
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- FIOCEWASVZHBTK-UHFFFAOYSA-N 2-[2-(2-oxo-2-phenylacetyl)oxyethoxy]ethyl 2-oxo-2-phenylacetate Chemical compound C=1C=CC=CC=1C(=O)C(=O)OCCOCCOC(=O)C(=O)C1=CC=CC=C1 FIOCEWASVZHBTK-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
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- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
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- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
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- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- ZMAPKOCENOWQRE-UHFFFAOYSA-N diethoxy(diethyl)silane Chemical compound CCO[Si](CC)(CC)OCC ZMAPKOCENOWQRE-UHFFFAOYSA-N 0.000 description 1
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 description 1
- VSYLGGHSEIWGJV-UHFFFAOYSA-N diethyl(dimethoxy)silane Chemical compound CC[Si](CC)(OC)OC VSYLGGHSEIWGJV-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000012567 medical material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/08—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/46—Block-or graft-polymers containing polysiloxane sequences containing polyether sequences
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- Chemical & Material Sciences (AREA)
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- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Paints Or Removers (AREA)
- Silicon Polymers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Description
本発明は、重合性官能基を有するオルガノポリシロキサン化合物を含む活性エネルギー線硬化性組成物に関する。 The present invention relates to an active energy ray-curable composition containing an organopolysiloxane compound having a polymerizable functional group.
有機官能基を含有するオルガノポリシロキサン化合物は、高硬度、可撓性、耐熱性、耐候性、耐衝撃性、耐クラック性、耐摩耗性、防食性、耐水性、撥水性、離型性、電気絶縁性、加工性等の特性を有する硬化物を与えることから、ハードコート、建材用塗料、成形材料、医療用材料、自動車用材料、各種コーティング材料等の分野で樹脂やコーティング剤として広く利用されている。 Organopolysiloxane compounds containing organic functional groups have high hardness, flexibility, heat resistance, weather resistance, impact resistance, crack resistance, abrasion resistance, corrosion resistance, water resistance, water repellency, and mold release resistance. Since it provides a cured product with properties such as electrical insulation and processability, it is widely used as a resin and coating agent in the fields of hard coats, paints for building materials, molding materials, medical materials, automobile materials, various coating materials, etc. Has been done.
近年ではスマートフォンなどのディスプレイの最表面にタッチパネルが設置されることが多い。このタッチパネルでは、最表面を指で触れた際に、接地している指をスムーズに動かせる滑り性が重要となるため、一般的に、その表面に滑り性向上のためのコーティングが施される。
また、最近、有機ELに代表されるフレキシブルデバイスの台頭が目覚ましく、それに伴ってコーティング用材料としても、表面硬度を保ちつつ屈曲性に優れる材料が求められるようになってきている。
In recent years, a touch panel is often installed on the outermost surface of a display such as a smartphone. In this touch panel, when the outermost surface is touched by a finger, the slipperiness that allows the finger in contact with the ground to move smoothly is important, and therefore, the surface thereof is generally coated to improve the slipperiness.
Recently, the rise of flexible devices typified by organic EL has been remarkable, and along with this, a material having excellent flexibility while maintaining surface hardness has been required as a coating material.
従来の有機官能基を含有するオルガノポリシロキサン化合物に、機能性付与のために種々の樹脂を配合した場合、相溶性が不十分であること等に起因して、硬化後の樹脂やコーティング膜等に収縮が起きたり、クラックが生じたりする等の問題が生じる場合がある。とりわけ、滑り性を付与する改質剤との混合組成物においては相溶性が悪く、硬化後の樹脂やコーティング表面においてブリード現象や白化現象が見られることが多い。
また、ラジカル重合性を有する不飽和化合物として、多官能(メタ)アクリレートおよび不飽和ポリエステル等が広く利用されている。しかし、従来のラジカル重合性を有する不飽和化合物にオルガノポリシロキサン化合物を混合した場合、両者の相溶性が悪いため、オルガノポリシロキサン成分が遊離する等の問題点を有している。
When various resins are blended with a conventional organopolysiloxane compound containing an organic functional group to impart functionality, the compatibility is insufficient, and the cured resin, coating film, etc. May cause problems such as shrinkage and cracking. In particular, in a mixed composition with a modifier that imparts slipperiness, compatibility is poor, and a bleeding phenomenon or a whitening phenomenon is often observed on the cured resin or coating surface.
Further, as an unsaturated compound having radical polymerization properties, polyfunctional (meth) acrylate, unsaturated polyester and the like are widely used. However, when an organopolysiloxane compound is mixed with a conventional unsaturated compound having radical polymerization property, there is a problem that the organopolysiloxane component is liberated because the compatibility between the two is poor.
この点、化合物の構成要素にウレタン結合を含有させることで、分子同士をウレタン結合由来の水素結合により凝集させ、相溶性の向上を図るとともに、硬化物の靱性を向上させる検討が行われている。
また、化合物の構成要素にポリアルキレンエーテル結合を含有させることで、種々の樹脂との相溶性の向上を図るとともに、硬化物の滑り性や平滑性、弾力性を向上させる検討が行われている。
In this regard, studies have been conducted to improve compatibility and toughness of cured products by aggregating molecules by hydrogen bonds derived from urethane bonds by incorporating urethane bonds in the constituent elements of the compound. ..
Further, studies have been conducted to improve the compatibility with various resins by containing a polyalkylene ether bond in the constituent elements of the compound, and to improve the slipperiness, smoothness, and elasticity of the cured product. ..
例えば、特許文献1では、ウレタンアクリレート構造を有する3官能のアルコキシシランを加水分解してシルセスキオキサンを合成した例が開示されているが、得られたシルセスキオキサンの末端には縮合性官能基が存在しているため、経時変化が起こり得るという課題を有している。
また、特許文献2では、表面滑り性を有する表面処理層の形成に活性エネルギー線硬化性の含フッ素ケイ素ポリマーが用いられているが、フッ素を含んでいるため他の構成成分との相溶性が低く、高硬度と耐屈曲性の両立が困難であるとの課題を有している。
For example, Patent Document 1 discloses an example in which a trifunctional alkoxysilane having a urethane acrylate structure is hydrolyzed to synthesize silsesquioxane, but the terminal of the obtained silsesquioxane is condensable. Since the functional group is present, there is a problem that the change with time may occur.
Further, in Patent Document 2, an active energy ray-curable fluorine-containing silicon polymer is used for forming a surface-treated layer having surface slipperiness, but since it contains fluorine, it is compatible with other constituents. It is low and has a problem that it is difficult to achieve both high hardness and bending resistance.
本発明は、上記事情に鑑みてなされたものであり、種々の重合性不飽和化合物との相溶性に優れるオルガノポリシロキサン化合物を含有し、硬度、耐クラック性、耐屈曲性、滑り性等に優れる硬化物およびコーティング膜を与え得る活性エネルギー線硬化性組成物を提供することを目的とする。 The present invention has been made in view of the above circumstances, and contains an organopolysiloxane compound having excellent compatibility with various polymerizable unsaturated compounds, and has properties such as hardness, crack resistance, bending resistance, and slipperiness. It is an object of the present invention to provide an active energy ray-curable composition which can give an excellent cured product and a coating film.
本発明者は、上記目的を達成するために鋭意検討を重ねた結果、ウレタン結合および(メタ)アクリロイルオキシ基を有する所定のオルガノポリシロキサン化合物とポリアルキレンエーテル結合および(メタ)アクリロイルオキシ基を有する所定のオルガノポリシロキサン化合物とを含む活性エネルギー線硬化性組成物において、上記課題を解決することができることを見出し、本発明を完成させた。
なお、本発明において(メタ)アクリロイルオキシ基とは、アクリロイルオキシ基またはメタクリロイルオキシ基を意味する。
As a result of diligent studies to achieve the above object, the present inventor has a predetermined organopolysiloxane compound having a urethane bond and a (meth) acryloyloxy group, a polyalkylene ether bond, and a (meth) acryloyloxy group. The present invention has been completed by finding that the above-mentioned problems can be solved in an active energy ray-curable composition containing a predetermined organopolysiloxane compound.
In the present invention, the (meth) acryloyloxy group means an acryloyloxy group or a methacryloyloxy group.
すなわち、本発明は、
1. (A)下記平均式(I)で表されるオルガノポリシロキサン化合物と、(B)下記平均式(II)で表されるオルガノポリシロキサン化合物とを含むことを特徴とする活性エネルギー線硬化性組成物、
2. 活性エネルギー線によりラジカルを発生する重合開始剤を含有する1の活性エネルギー線硬化性組成物、
3. 前記平均式(I)および(II)で表されるオルガノポリシロキサン化合物以外の重合性不飽和化合物を含有する2の活性エネルギー線硬化性組成物、
4. 溶剤を含有する2または3の活性エネルギー線硬化性組成物、
5. 2〜4のいずれかの活性エネルギー線硬化性組成物からなるコーティング剤、
6. 基材と、この基材の少なくとも一方の面に直接または少なくとも1種のその他の層を介して積層された硬化膜とを有し、
前記硬化膜が、5のコーティング剤から作製された硬化膜である被覆物品
を提供する。
That is, the present invention
1. 1. An active energy ray-curable composition comprising (A) an organopolysiloxane compound represented by the following average formula (I) and (B) an organopolysiloxane compound represented by the following average formula (II). Stuff,
2. 2. 1. An active energy ray-curable composition containing a polymerization initiator that generates radicals by active energy rays.
3. 3. 2. The active energy ray-curable composition of 2, which contains a polymerizable unsaturated compound other than the organopolysiloxane compound represented by the average formulas (I) and (II).
4. 2 or 3 active energy ray-curable compositions containing a solvent,
5. A coating agent comprising any of 2 to 4 active energy ray-curable compositions,
6. It has a substrate and a cured film laminated directly on at least one surface of the substrate or via at least one other layer.
Provided is a coated article in which the cured film is a cured film made from the coating agent of 5.
本発明の活性エネルギー線硬化性組成物は、ウレタン結合および(メタ)アクリロイルオキシ基を有するオルガノポリシロキサン化合物と、ポリアルキレンエーテル結合および(メタ)アクリロイルオキシ基を有するオルガノポリシロキサン化合物とを含んでいるため、滑り性、硬度、耐クラック性、耐屈曲性に優れた樹脂やコーティングの作製に好適に用いることができる。
また、本発明の活性エネルギー線硬化性組成物は、縮合性官能基の含有量が所定の範囲内であるため、当該組成物から得られた樹脂やコーティングは、耐水性および耐クラック性に優れるとともに、経時変化による劣化も抑えられる。
The active energy ray-curable composition of the present invention comprises an organopolysiloxane compound having a urethane bond and a (meth) acryloyloxy group and an organopolysiloxane compound having a polyalkylene ether bond and a (meth) acryloyloxy group. Therefore, it can be suitably used for producing a resin or coating having excellent slipperiness, hardness, crack resistance, and bending resistance.
Further, since the active energy ray-curable composition of the present invention contains a condensable functional group within a predetermined range, the resin or coating obtained from the composition is excellent in water resistance and crack resistance. At the same time, deterioration due to aging can be suppressed.
以下、本発明について具体的に説明する。
本発明に係る活性エネルギー線硬化性組成物は、(A)下記平均式(I)で表されるオルガノポリシロキサン化合物と、(B)下記平均式(II)で表されるオルガノポリシロキサン化合物とを含むことを特徴とする。
Hereinafter, the present invention will be specifically described.
The active energy ray-curable composition according to the present invention comprises (A) an organopolysiloxane compound represented by the following average formula (I) and (B) an organopolysiloxane compound represented by the following average formula (II). It is characterized by including.
式(I)において、R1およびR2は、それぞれ独立して炭素原子数1〜10の2価の炭化水素基を表し、R3は、水素原子またはメチル基を表し、R4は、それぞれ独立して、水素原子、ハロゲン原子で置換されていてもよい炭素原子数1〜8のアルキル基、フェニル基、(メタ)アクリロイルオキシプロピル基、またはグリシドキシプロピル基を表し、R5は、水素原子、メチル基、エチル基、n−プロピル基、またはi−プロピル基を表し、a、b、c、dおよびeは、0.1≦a≦0.5、0≦b≦0.2、0≦c≦0.4、0≦d≦0.4、0.2≦e≦0.7、a+b+c+d+e=1を満たす数を表し、fは、0≦f≦0.3を満たす数を表す。 In formula (I), R 1 and R 2 each independently represent a divalent hydrocarbon group having 1 to 10 carbon atoms, R 3 represents a hydrogen atom or a methyl group, and R 4 represents a hydrogen atom or a methyl group, respectively. Independently, an alkyl group having 1 to 8 carbon atoms, which may be substituted with a hydrogen atom or a halogen atom, a phenyl group, a (meth) acryloyloxypropyl group, or a glycidoxypropyl group is represented, and R 5 is Represents a hydrogen atom, a methyl group, an ethyl group, an n-propyl group, or an i-propyl group, where a, b, c, d and e are 0.1 ≦ a ≦ 0.5, 0 ≦ b ≦ 0.2. , 0 ≦ c ≦ 0.4, 0 ≦ d ≦ 0.4, 0.2 ≦ e ≦ 0.7, a + b + c + d + e = 1, and f represents a number satisfying 0 ≦ f ≦ 0.3. show.
R1およびR2の炭素原子数1〜10の2価炭化水素基としては、直鎖、分岐、環状のいずれでもよく、その具体例としては、メチレン、エチレン、トリメチレン、プロピレン、ブチレン、ヘキシレン、デシレン、シクロヘキシレン基等の直鎖、分岐または環状のアルキレン基;フェニレン、キシリレン基等のアリーレン基などが挙げられる。
これらの中でも、炭素原子数1〜5のアルキレン基が好ましく、炭素原子数1〜3の直鎖のアルキレン基がより好ましく、エチレン基、トリメチレン基がより一層好ましい。
The divalent hydrocarbon group having 1 to 10 carbon atoms of R 1 and R 2 may be linear, branched or cyclic, and specific examples thereof include methylene, ethylene, trimethylene, propylene, butylene and hexylene. Linear, branched or cyclic alkylene groups such as decylene and cyclohexylene groups; arylene groups such as phenylene and xylylene groups may be mentioned.
Among these, an alkylene group having 1 to 5 carbon atoms is preferable, a linear alkylene group having 1 to 3 carbon atoms is more preferable, and an ethylene group and a trimethylene group are even more preferable.
R4の炭素原子数1〜8のアルキル基としては、直鎖、分岐、環状のいずれでもよく、その具体例としては、メチル、エチル、n−プロピル、i−プロピル、n−ブチル、i−ブチル、t−ブチル、n−ペンチル、n−ヘキシル、シクロヘキシル、n−ヘプチル、n−オクチル基等が挙げられ、これらのアルキル基は、その水素原子の一部または全部が、ハロゲン原子で置換されていてもよい。
ハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子が挙げられる。
中でも、R4としては、炭素原子数1〜4のアルキル基またはフェニル基が好ましく、メチル基またはフェニル基がより好ましい。
The alkyl group having 1 to 8 carbon atoms of R 4 may be linear, branched or cyclic, and specific examples thereof include methyl, ethyl, n-propyl, i-propyl, n-butyl and i-. Butyl, t-butyl, n-pentyl, n-hexyl, cyclohexyl, n-heptyl, n-octyl group and the like can be mentioned, and some or all of these alkyl groups are replaced with halogen atoms. May be.
Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.
Among them, as R 4 , an alkyl group or a phenyl group having 1 to 4 carbon atoms is preferable, and a methyl group or a phenyl group is more preferable.
上記aは0.1≦a≦0.5を満たす数であるが、0.2≦a≦0.5が好ましい。aが0.1未満の場合は、オルガノポリシロキサン化合物の相溶性が不十分なものとなり、また、当該オルガノポリシロキサン化合物を含む組成物の硬化性、並びに硬化物の硬度、耐擦傷性、耐クラック性、および耐屈曲性に劣るものとなる場合がある。
上記bは0≦b≦0.2を満たす数であるが、0≦b≦0.1が好ましい。bが0.2を超えると、得られる硬化物が耐クラック性、耐屈曲性に劣るものとなる場合がある。
上記cは0≦c≦0.4を満たす数であるが、0≦c≦0.2が好ましい。cが0.4を超えると、得られる硬化物が耐クラック性、耐屈曲性に劣るものとなる場合がある。
上記dは0≦d≦0.4を満たす数であるが、0≦d≦0.3が好ましい。dが0.4を超えると、得られる硬化物が硬度に劣るものとなる場合がある。
上記eは0.2≦e≦0.7を満たす数であるが、0.3≦e≦0.6が好ましい。eが0.2未満の場合は、オルガノポリシロキサン化合物が高粘度となる場合があり、作業性および加工性の観点から好ましくない。eが0.7を超えると、得られる硬化物が硬度に劣るものとなる場合がある。
上記fは0≦f≦0.3を満たす数であるが、縮合性官能基による縮合反応の抑制に効果的であることや、得られる硬化物の耐クラック性、耐水性、および耐候性の観点を考慮すると、fは0≦f≦0.1を満たす数が好ましい。
The above a is a number satisfying 0.1 ≦ a ≦ 0.5, but 0.2 ≦ a ≦ 0.5 is preferable. When a is less than 0.1, the compatibility of the organopolysiloxane compound is insufficient, and the curability of the composition containing the organopolysiloxane compound, as well as the hardness, scratch resistance, and scratch resistance of the cured product are sufficient. It may be inferior in crack resistance and bending resistance.
The above b is a number satisfying 0 ≦ b ≦ 0.2, but 0 ≦ b ≦ 0.1 is preferable. If b exceeds 0.2, the obtained cured product may be inferior in crack resistance and bending resistance.
The above c is a number satisfying 0 ≦ c ≦ 0.4, but 0 ≦ c ≦ 0.2 is preferable. If c exceeds 0.4, the obtained cured product may be inferior in crack resistance and bending resistance.
The above d is a number satisfying 0 ≦ d ≦ 0.4, but 0 ≦ d ≦ 0.3 is preferable. If d exceeds 0.4, the obtained cured product may be inferior in hardness.
The above e is a number satisfying 0.2 ≦ e ≦ 0.7, but 0.3 ≦ e ≦ 0.6 is preferable. When e is less than 0.2, the organopolysiloxane compound may have a high viscosity, which is not preferable from the viewpoint of workability and processability. If e exceeds 0.7, the obtained cured product may be inferior in hardness.
Although the above f is a number satisfying 0 ≦ f ≦ 0.3, it is effective in suppressing the condensation reaction by the condensing functional group, and the obtained cured product has crack resistance, water resistance, and weather resistance. Considering the viewpoint, f is preferably a number satisfying 0 ≦ f ≦ 0.1.
特に、重合性不飽和化合物との相溶性や、当該オルガノポリシロキサン化合物を含む硬化性組成物の硬化性、並びに当該組成物から得られる硬化物の硬度、耐クラック性、耐屈曲性、および耐水性の観点から、一般式(I)において、R1がトリメチレン基であり、R2がエチレン基であり、R3が水素原子であり、R4がメチル基であることが好適である。 In particular, the compatibility with the polymerizable unsaturated compound, the curability of the curable composition containing the organopolysiloxane compound, and the hardness, crack resistance, bending resistance, and water resistance of the cured product obtained from the composition. From the viewpoint of sex, it is preferable that R 1 is a trimethylene group, R 2 is an ethylene group, R 3 is a hydrogen atom, and R 4 is a methyl group in the general formula (I).
一方、式(II)において、R6は、炭素原子数1〜10の2価の炭化水素基を表し、R1およびR3〜R5は、式(I)と同じ意味を表し、a′、b′、c′およびd′は、0.05≦a′≦0.5、0≦b′≦0.2、0≦c′≦0.95、0≦d′≦0.5、a′+b′+c′+d′=1を満たす数を表し、e′は、0≦e′≦0.3を満たす数を表し、nは、1≦n≦50を満たす整数を表す。 On the other hand, in the formula (II), R 6 represents a divalent hydrocarbon group having 1 to 10 carbon atoms, and R 1 and R 3 to R 5 have the same meaning as in the formula (I), and a ′. , B', c'and d'are 0.05≤a'≤0.5, 0≤b'≤0.2, 0≤c'≤0.95, 0≤d'≤0.5, a ′ + B ′ + c ′ + d ′ = 1 represents a number, e ′ represents a number satisfying 0 ≦ e ′ ≦ 0.3, and n represents an integer satisfying 1 ≦ n ≦ 50.
R1の炭素原子数1〜10の2価の炭化水素基の具体例としては、上記式(I)で例示した基と同様のものが挙げられるが、中でも、式(II)では、炭素原子数1〜5のアルキレン基が好ましく、エチレン基、トリメチレン基がより好ましい。
R4の炭素原子数1〜8のアルキル基の具体例としては、上記式(I)で例示した基と同様のものが挙げられる。中でも、式(II)では、R4としては、炭素原子数1〜4のアルキル基またはフェニル基が好ましく、メチル基またはフェニル基がより好ましい。
Specific examples of the divalent hydrocarbon group having 1 to 10 carbon atoms of R 1 include the same groups as those exemplified by the above formula (I), but among them, the carbon atom in the formula (II). An alkylene group having a number of 1 to 5 is preferable, and an ethylene group and a trimethylene group are more preferable.
Specific examples of the alkyl group having 1 to 8 carbon atoms of R 4 include the same groups as those exemplified by the above formula (I). Among them, in the formula (II), as R 4 , an alkyl group or a phenyl group having 1 to 4 carbon atoms is preferable, and a methyl group or a phenyl group is more preferable.
R6の炭素原子数1〜10の2価の炭化水素基としては、直鎖、分岐、環状のいずれでもよく、その具体例としては、メチレン、エチレン、トリメチレン、プロピレン、ブチレン、ヘキシレン、デシレン、シクロヘキシレン基等の直鎖、分岐または環状のアルキレン基;フェニレン、キシリレン基等のアリーレン基などが挙げられる。
これらの中でも、炭素原子数1〜5のアルキレン基が好ましく、炭素原子数1〜3の直鎖のアルキレン基がより好ましく、エチレン基、トリメチレン基がより一層好ましい。
The divalent hydrocarbon group having 1 to 10 carbon atoms of R 6 may be linear, branched or cyclic, and specific examples thereof include methylene, ethylene, trimethylene, propylene, butylene, hexylene and decylene. Linear, branched or cyclic alkylene groups such as cyclohexylene groups; arylene groups such as phenylene and xylylene groups may be mentioned.
Among these, an alkylene group having 1 to 5 carbon atoms is preferable, a linear alkylene group having 1 to 3 carbon atoms is more preferable, and an ethylene group and a trimethylene group are even more preferable.
上記a′は0.05≦a′≦0.5を満たす数であるが、0.07≦a′≦0.2が好ましい。a′が0.05未満の場合は、オルガノポリシロキサン化合物の相溶性が不十分なものとなり、また、当該オルガノポリシロキサン化合物を含む組成物の滑り性、耐クラック性に劣るものとなる場合がある。
上記b′は0≦b′≦0.2を満たす数であるが、0≦b′≦0.1が好ましい。b′が0.2を超えると、得られる硬化物が耐クラック性、耐屈曲性に劣るものとなる場合がある。
上記c′は0≦c′≦0.95を満たす数であるが、滑り性、耐クラック性、耐屈曲性の点から0.3≦c′≦0.95が好ましい。
上記d′は0≦d′≦0.5を満たす数であるが、0≦d′≦0.3が好ましい。d′が0.5を超えると、オルガノポリシロキサン化合物の相溶性が不十分なものとなり、得られる硬化物が硬度に劣るものとなる場合がある。
上記e′は0≦e′≦0.3を満たす数であるが、縮合性官能基による縮合反応の抑制に効果的であることや、得られる硬化物の耐クラック性、耐水性、および耐候性の観点を考慮すると、e′は0≦e′≦0.1を満たす数が好ましい。
The above a'is a number satisfying 0.05 ≦ a ′ ≦ 0.5, but 0.07 ≦ a ′ ≦ 0.2 is preferable. If a'is less than 0.05, the compatibility of the organopolysiloxane compound may be insufficient, and the slipperiness and crack resistance of the composition containing the organopolysiloxane compound may be inferior. be.
The above b ′ is a number satisfying 0 ≦ b ′ ≦ 0.2, but 0 ≦ b ′ ≦ 0.1 is preferable. If b'exceeds 0.2, the obtained cured product may be inferior in crack resistance and bending resistance.
The above c ′ is a number satisfying 0 ≦ c ′ ≦ 0.95, but 0.3 ≦ c ′ ≦ 0.95 is preferable from the viewpoint of slipperiness, crack resistance and bending resistance.
The above d ′ is a number satisfying 0 ≦ d ′ ≦ 0.5, but 0 ≦ d ′ ≦ 0.3 is preferable. If d'exceeds 0.5, the compatibility of the organopolysiloxane compound becomes insufficient, and the obtained cured product may be inferior in hardness.
The above e'is a number satisfying 0≤e'≤0.3, but it is effective in suppressing the condensation reaction by the condensing functional group, and the obtained cured product has crack resistance, water resistance, and weather resistance. From the viewpoint of sex, e'preferably a number satisfying 0≤e'≤0.1.
上記nは1≦n≦50を満たす整数であるが、5≦n≦30が好ましい。nが1未満の場合は、得られる硬化物(コーティング膜)の滑り性が劣る可能性があり、nが50を超えると、当該オルガノポリシロキサン化合物の重合性不飽和化合物との相溶性が不十分となる可能性がある。 The above n is an integer satisfying 1 ≦ n ≦ 50, but 5 ≦ n ≦ 30 is preferable. When n is less than 1, the slipperiness of the obtained cured product (coating film) may be inferior, and when n is more than 50, the compatibility of the organopolysiloxane compound with the polymerizable unsaturated compound is incompatible. It may be enough.
特に、重合性不飽和化合物との相溶性や、当該オルガノポリシロキサン化合物を含む硬化性組成物の硬化性、並びに当該組成物から得られる硬化物の硬度、耐クラック性、耐屈曲性、および耐水性の観点から、一般式(II)において、R1がトリメチレン基であり、R6がエチレン基であり、R3が水素原子であり、R4がメチル基であることが好適である。 In particular, the compatibility with the polymerizable unsaturated compound, the curability of the curable composition containing the organopolysiloxane compound, and the hardness, crack resistance, bending resistance, and water resistance of the cured product obtained from the composition. From the viewpoint of sex, it is preferable that R 1 is a trimethylene group, R 6 is an ethylene group, R 3 is a hydrogen atom, and R 4 is a methyl group in the general formula (II).
本発明で用いるオルガノポリシロキサン化合物の平均分子量は特に限定されるものではないが、式(I)および式(II)のオルガノポリシロキサン化合物のいずれも、ゲルパーミエーションクロマトグラフィ(GPC)によるポリスチレン換算重量平均分子量で500〜100,000が好ましく、700〜10,000がより好ましい。500未満では縮合が十分に進んでおらず、オルガノポリシロキサン化合物の保存性が低くなる可能性があり、また経時で縮合反応が生じ、耐熱耐湿試験で良好な結果が得られない可能性がある。一方、100,000超の高分子量体では、当該オルガノポリシロキサン化合物を含有する活性エネルギー線硬化性組成物を硬化させたフィルムや被覆物品において良好な硬度や耐屈曲性が得られない可能性がある。 The average molecular weight of the organopolysiloxane compound used in the present invention is not particularly limited, but both the organopolysiloxane compounds of the formulas (I) and (II) are polystyrene-equivalent weights obtained by gel permeation chromatography (GPC). The average molecular weight is preferably 500 to 100,000, more preferably 700 to 10,000. If it is less than 500, the condensation does not proceed sufficiently, the storage stability of the organopolysiloxane compound may be lowered, and the condensation reaction may occur over time, and good results may not be obtained in the heat and moisture resistance test. .. On the other hand, in the case of a high molecular weight substance exceeding 100,000, good hardness and bending resistance may not be obtained in a film or a coated article obtained by curing an active energy ray-curable composition containing the organopolysiloxane compound. be.
また、本発明で用いるオルガノポリシロキサン化合物の粘度は特に限定されるものではないが、式(I)および式(II)のオルガノポリシロキサン化合物のいずれも、作業性および加工性の観点から、回転粘度計により測定される25℃における粘度が200〜50,000mPa・sが好ましく、300〜5,000mPa・sがより好ましい。
また、本発明で用いるオルガノポリシロキサン化合物は、有機溶剤等を除く不揮発分が96質量%以上であることが好ましい。揮発分が多くなると、組成物を硬化した際のボイド発生による外観の悪化や機械的性質の低下の原因となる場合がある。
The viscosity of the organopolysiloxane compound used in the present invention is not particularly limited, but all of the organopolysiloxane compounds of the formulas (I) and (II) rotate from the viewpoint of workability and workability. The viscosity at 25 ° C. measured by a viscometer is preferably 200 to 50,000 mPa · s, more preferably 300 to 5,000 mPa · s.
Further, the organopolysiloxane compound used in the present invention preferably has a non-volatile content of 96% by mass or more excluding organic solvents and the like. If the amount of volatile matter is large, it may cause deterioration of appearance and deterioration of mechanical properties due to the generation of voids when the composition is cured.
本発明の活性エネルギー線硬化性組成物において、式(I)のオルガノポリシロキサン化合物と、式(II)のオルガノポリシロキサン化合物との配合割合は、特に限定されるものではないが、得られる樹脂やコーティングの滑り性、硬度、耐クラック性、耐屈曲性をより高めることを考慮すると、式(I)のオルガノポリシロキサン化合物100質量部に対し、式(II)のオルガノポリシロキサン化合物0.1〜100質量部が好ましく、1〜50質量部がより好ましく、2〜25質量部がより一層好ましく、3〜10質量部がさらに好ましい。 In the active energy ray-curable composition of the present invention, the blending ratio of the organopolysiloxane compound of the formula (I) and the organopolysiloxane compound of the formula (II) is not particularly limited, but the obtained resin. In consideration of further enhancing the slipperiness, hardness, crack resistance, and bending resistance of the coating, the organopolysiloxane compound of the formula (II) is 0.1 with respect to 100 parts by mass of the organopolysiloxane compound of the formula (I). ~ 100 parts by mass is preferable, 1 to 50 parts by mass is more preferable, 2 to 25 parts by mass is further preferable, and 3 to 10 parts by mass is further preferable.
なお、本発明の活性エネルギー線硬化性組成物は、組成の異なる複数のオルガノポリシロキサン化合物の混合物であってもよい。 The active energy ray-curable composition of the present invention may be a mixture of a plurality of organopolysiloxane compounds having different compositions.
本発明で用いるオルガノポリシロキサン化合物は、一般的なオルガノポリシロキサンの製造方法に従って製造することができる。
式(I)のオルガノポリシロキサン化合物は、例えば、ウレタン結合および(メタ)アクリロイルオキシ基を有する有機基を含む加水分解性シランを縮合して得ることができる。
具体的には、下記式(III)で表される加水分解性シラン、および必要に応じてその他の加水分解性シランを用いて、触媒の存在下で加水分解縮合を行ってオルガノポリシロキサン化合物を製造する方法が挙げられる。
The organopolysiloxane compound used in the present invention can be produced according to a general method for producing an organopolysiloxane.
The organopolysiloxane compound of the formula (I) can be obtained, for example, by condensing a hydrolyzable silane containing an organic group having a urethane bond and a (meth) acryloyloxy group.
Specifically, a hydrolyzable silane represented by the following formula (III) and, if necessary, other hydrolyzable silanes are used to hydrolyze and condense in the presence of a catalyst to obtain an organopolysiloxane compound. The manufacturing method can be mentioned.
Xの炭素原子数1〜6のアルコキシ基としては、その中のアルキル基が直鎖、分岐、環状のいずれでもよく、その具体例としては、メトキシ、エトキシ、n−プロポキシ、イソプロポキシ、n−ブトキシ、t−ブトキシ、n−ペンチルオキシ基等が挙げられる。 As the alkoxy group having 1 to 6 carbon atoms of X, the alkyl group thereof may be linear, branched or cyclic, and specific examples thereof include methoxy, ethoxy, n-propoxy, isopropoxy and n-. Examples thereof include butoxy, t-butoxy, n-pentyloxy group and the like.
また、必要に応じて用いられるその他の加水分解性シランとしては、上記一般式(III)で表される加水分解性シランとともに加水分解縮合することでオルガノポリシロキサン化合物を製造できるものであれば特に限定されるものではない。
その具体例としては、ジメチルジメトキシシラン、ジエチルジメトキシシラン、ジフェニルジメトキシシラン、ジメチルジエトキシシラン、ジエチルジエトキシシラン、ジフェニルジエトキシシラン、メチルトリメトキシシラン、エチルトリメトキシシラン、フェニルトリメトキシシラン、メチルトリエトキシシラン、エチルトリエトキシシラン、フェニルトリエトキシシラン、2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、3−グリシドキシプロピルメチルジメトキシシラン、3−グリシドキシプロピルトリメトキシシラン、3−グリシドキシプロピルメチルジエトキシシラン、p−スチリルトリメトキシシラン、3−メタクリロキシプロピルメチルジメトキシシラン、3−メタクリロキシプロピルトリメトキシシラン、3−メタクリロキシプロピルメチルジエトキシシラン、3−メタクリロキシプロピルトリエトキシシラン、3−アクリロキシプロピルメチルジメトキシシラン、3−アクリロキシプロピルメチルジエトキシシラン、3−アクリロキシプロピルトリメトキシシラン、3−アクリロキシプロピルトリエトキシシラン等のアルコキシシランなどが挙げられる。
Further, as the other hydrolyzable silane used as needed, in particular, any hydrolyzable silane that can be hydrolyzed and condensed with the hydrolyzable silane represented by the above general formula (III) to produce an organopolysiloxane compound. Not limited.
Specific examples thereof include dimethyldimethoxysilane, diethyldimethoxysilane, diphenyldimethoxysilane, dimethyldiethoxysilane, diethyldiethoxysilane, diphenyldiethoxysilane, methyltrimethoxysilane, ethyltrimethoxysilane, phenyltrimethoxysilane, and methyltri. Ethoxysilane, ethyltriethoxysilane, phenyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3- Glycydoxypropylmethyldiethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltri Examples thereof include alkoxysilanes such as ethoxysilane, 3-acryloxypropylmethyldimethoxysilane, 3-acryloxypropylmethyldiethoxysilane, 3-acryloxypropyltrimethoxysilane, and 3-acryloxypropyltriethoxysilane.
縮合に用いられる触媒としては、特に限定されるものではないが、酸性触媒が好ましく、その具体例としては、塩酸、ギ酸、酢酸、硫酸、燐酸、p−トルエンスルホン酸、安息香酸、酢酸、乳酸、炭酸、メタンスルホン酸、トリフルオロメタンスルホン酸等が挙げられる。
触媒の使用量は特に限定されるものではないが、反応を速やかに進行させるとともに、反応後の触媒の除去の容易性を考慮すると、加水分解性シラン1モルに対して0.0002〜0.5モルの範囲が好ましい。
The catalyst used for condensation is not particularly limited, but an acidic catalyst is preferable, and specific examples thereof include hydrochloric acid, formic acid, acetic acid, sulfuric acid, phosphoric acid, p-toluenesulfonic acid, benzoic acid, acetic acid, and lactic acid. , Carbonate, methanesulfonic acid, trifluoromethanesulfonic acid and the like.
The amount of the catalyst used is not particularly limited, but in consideration of the rapid progress of the reaction and the ease of removal of the catalyst after the reaction, 0.0002 to 0. For 1 mol of hydrolyzable silane. A range of 5 mol is preferred.
加水分解性シランと、加水分解縮合反応に要する水との量比は、特に限定されるものではないが、触媒の失活を防いで反応を十分に進行させるとともに、反応後の水の除去の容易性を考慮すると、加水分解性シラン1モルに対し、水0.1〜10モルの割合が好ましい。
加水分解縮合時の反応温度は、特に限定されるものではないが、反応率を向上させるとともに、加水分解性シランが有する有機官能基の分解を防止することを考慮すると、−10〜150℃が好ましい。
The amount ratio of the hydrolyzable silane to the water required for the hydrolyzed condensation reaction is not particularly limited, but it is possible to prevent the catalyst from being deactivated to allow the reaction to proceed sufficiently and to remove water after the reaction. Considering the ease, the ratio of 0.1 to 10 mol of water is preferable with respect to 1 mol of hydrolyzable silane.
The reaction temperature at the time of hydrolysis condensation is not particularly limited, but is -10 to 150 ° C. in consideration of improving the reaction rate and preventing the decomposition of the organic functional group of the hydrolyzable silane. preferable.
なお、加水分解縮合の際には、有機溶媒を使用してもよい。有機溶媒の具体例としては、メタノール、エタノール、プロパノール、アセトン、メチルイソブチルケトン、テトラヒドロフラン、トルエン、キシレン等が挙げられる。 An organic solvent may be used for hydrolysis condensation. Specific examples of the organic solvent include methanol, ethanol, propanol, acetone, methyl isobutyl ketone, tetrahydrofuran, toluene, xylene and the like.
一方、式(II)のオルガノポリシロキサン化合物は、例えば、オキシアルキレン結合および(メタ)アクリロイルオキシ基を有する有機基を含む加水分解性シランを縮合して得ることができる。
具体的には、下記式(IV)で表される加水分解性シラン、および必要に応じてその他の加水分解性シランを用いて、触媒の存在下で加水分解縮合を行ってオルガノポリシロキサン化合物を製造する方法が挙げられる。
この場合、その他の加水分解性シラン、触媒、水の使用量、有機溶媒種、反応条件等は、上記式(III)の加水分解性シランを用いる場合と同様である。
On the other hand, the organopolysiloxane compound of the formula (II) can be obtained, for example, by condensing a hydrolyzable silane containing an organic group having an oxyalkylene bond and a (meth) acryloyloxy group.
Specifically, a hydrolyzable silane represented by the following formula (IV) and, if necessary, other hydrolyzable silanes are used to hydrolyze and condense in the presence of a catalyst to obtain an organopolysiloxane compound. The manufacturing method can be mentioned.
In this case, other hydrolyzable silanes, catalysts, amounts of water used, organic solvent species, reaction conditions and the like are the same as in the case of using the hydrolyzable silanes of the above formula (III).
本発明の活性エネルギー線硬化性組成物は、上述した式(I)および(II)のオルガノポリシロキサン化合物に加え、光重合開始剤を含有していてもよい。
光重合開始剤としては、活性エネルギー線によりラジカル種を発生する開始剤であれば特に限定されるものではなく、アセトフェノン系、ベンゾイン系、アシルフォスフィンオキサイド系、ベンゾフェノン系、チオキサントン系等の公知の光重合開始剤から適宜選択して用いることができる。
光重合開始剤の具体例としては、ベンゾフェノン、ベンジル、ミヒラーズケトン、チオキサントン誘導体、ベンゾインエチルエーテル、ジエトキシアセトフェノン、ベンジルジメチルケタール、2−ヒドロキシ−2−メチルプロピオフェノン、1−ヒドロキシシクロヘキシルフェニルケトン、アシルフォスフィンオキサイド誘導体、2−メチル−1−{4−(メチルチオ)フェニル}−2−モルフォリノプロパン−1−オン、4−ベンゾイル−4’−メチルジフェニルスルファイド、2,4,6−トリメチルベンゾイルジフェニルフォスフィン等が挙げられ、これらは単独で用いても、2種以上を組み合わせて用いてもよい。
The active energy ray-curable composition of the present invention may contain a photopolymerization initiator in addition to the organopolysiloxane compounds of the above formulas (I) and (II).
The photopolymerization initiator is not particularly limited as long as it is an initiator that generates radical species by active energy rays, and known examples such as acetophenone type, benzoin type, acylphosphine oxide type, benzophenone type, and thioxanthone type. It can be appropriately selected from the photopolymerization initiators and used.
Specific examples of the photopolymerization initiator include benzophenone, benzyl, Michler's ketone, thioxanthone derivative, benzoin ethyl ether, diethoxyacetophenone, benzyldimethylketal, 2-hydroxy-2-methylpropiophenone, 1-hydroxycyclohexylphenylketone, and acyl. Phosphine oxide derivative, 2-methyl-1- {4- (methylthio) phenyl} -2-morpholinopropane-1-one, 4-benzoyl-4'-methyldiphenylsulfide, 2,4,6-trimethylbenzoyl Examples thereof include diphenylphosphine, which may be used alone or in combination of two or more.
光重合開始剤は市販品として入手することができ、その具体例としては、ダロキュア1173、ダロキュアMBF、イルガキュア127、イルガキュア184、イルガキュア369、イルガキュア379、イルガキュア379EG、イルガキュア651、イルガキュア754、イルガキュア784、イルガキュア819、イルガキュア819DW、イルガキュア907、イルガキュア1800、イルガキュア2959、ルシリンTPO(いずれもBASFジャパン社製)等が挙げられる。 The photopolymerization initiator can be obtained as a commercial product, and specific examples thereof include DaroCure 1173, DaroCure MBF, Irgacure 127, Irgacure 184, Irgacure 369, Irgacure 379, Irgacure 379EG, Irgacure 651, Irgacure 754, Irgacure 784, Examples thereof include Irgacure 819, Irgacure 819DW, Irgacure 907, Irgacure 1800, Irgacure 2959, Lucillin TPO (all manufactured by BASF Japan Ltd.) and the like.
光重合開始剤の使用量は、硬化性を良好にするとともに、硬化後の表面硬度の低下を防止することを考慮すると、オルガノポリシロキサン化合物および必要に応じて用いられる重合性不飽和化合物の総量100質量部に対して、0.1〜20質量部が好ましい。 The amount of the photopolymerization initiator used is the total amount of the organopolysiloxane compound and the polymerizable unsaturated compound used as necessary, considering that the curability is improved and the surface hardness is prevented from being lowered after curing. 0.1 to 20 parts by mass is preferable with respect to 100 parts by mass.
また、本発明の活性エネルギー線硬化性組成物は、式(I)および(II)のオルガノポリシロキサン化合物以外の重合性不飽和化合物を含有していてもよい。
重合性不飽和化合物の具体例としては、1,6−ヘキサンジオールジ(メタ)アクリレート、トリエチレングリコールジ(メタ)アクリレート、エチレンオキサイド変性ビスフェノールA ジ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ジトリメチロールプロパンテトラ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、3−(メタ)アクリロイルオキシグリセリンモノ(メタ)アクリレート、ウレタンアクリレート、エポキシアクリレート、エステルアクリレート等が挙げられる。
重合性不飽和化合物を用いる場合、その含有量は、式(I)および(II)のオルガノポリシロキサン化合物100質量部に対して、1〜1,000質量部が好ましい。
Further, the active energy ray-curable composition of the present invention may contain a polymerizable unsaturated compound other than the organopolysiloxane compounds of the formulas (I) and (II).
Specific examples of the polymerizable unsaturated compound include 1,6-hexanediol di (meth) acrylate, triethylene glycol di (meth) acrylate, ethylene oxide-modified bisphenol A di (meth) acrylate, and trimethyl propantri (meth). Acrylate, pentaerythritol tetra (meth) acrylate, ditrimethylolpropanetetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, pentaerythritol tri (meth) acrylate, 3- (meth) acryloyloxyglycerin mono (meth) acrylate, Examples thereof include urethane acrylate, epoxy acrylate, and ester acrylate.
When a polymerizable unsaturated compound is used, the content thereof is preferably 1 to 1,000 parts by mass with respect to 100 parts by mass of the organopolysiloxane compound of the formulas (I) and (II).
なお、本発明の活性エネルギー線硬化性組成物は、金属酸化物微粒子、シリコーンレジン、シランカップリング剤、希釈溶剤、可塑剤、充填剤、増感剤、光吸収剤、光安定剤、重合禁止剤、熱線反射剤、帯電防止剤、酸化防止剤、防汚性付与剤、撥水性付与剤、消泡剤、着色剤、増粘剤、レベリング剤等の各種添加剤を本発明の目的を損なわない範囲で含んでいてもよい。 The active energy ray-curable composition of the present invention contains metal oxide fine particles, silicone resin, silane coupling agent, diluting solvent, plasticizer, filler, sensitizer, light absorber, light stabilizer, and polymerization inhibitor. Various additives such as agents, heat ray reflective agents, antistatic agents, antioxidants, antifouling agents, water repellent agents, defoaming agents, colorants, thickeners, leveling agents, etc. impair the object of the present invention. It may be included in the range not included.
本発明の活性エネルギー線硬化性組成物は、上記各成分を常法に準じて均一に混合することにより得られる。
本発明の活性エネルギー線硬化性組成物の粘度は特に限定されるものではないが、成形または塗布作業性を良好にし、スジムラ等の発生を抑制することを考慮すると、回転粘度計により測定される25℃での粘度が、500mPa・s以下が好ましく、300mPa・s以下がより好ましい。なお、25℃における粘度の下限は10mPa・s以上が好ましい。
The active energy ray-curable composition of the present invention can be obtained by uniformly mixing each of the above components according to a conventional method.
The viscosity of the active energy ray-curable composition of the present invention is not particularly limited, but is measured by a rotational viscometer in consideration of improving molding or coating workability and suppressing the generation of streaks and the like. The viscosity at 25 ° C. is preferably 500 mPa · s or less, more preferably 300 mPa · s or less. The lower limit of the viscosity at 25 ° C. is preferably 10 mPa · s or more.
上述した本発明の活性エネルギー線硬化性組成物は、コーティング剤として好適に使用可能であり、基材の少なくとも一方の面に、直接または少なくとも1種のその他の層を介して塗布し、それを硬化させることにより被膜を形成した被覆物品を得ることができる。
また、本発明の活性エネルギー線硬化性組成物の硬化物は、フィルムとしても好適に使用可能である。
The active energy ray-curable composition of the present invention described above can be suitably used as a coating agent, and is applied directly to at least one surface of a substrate or through at least one other layer, and applied thereto. By curing, a coated article having a film formed can be obtained.
Further, the cured product of the active energy ray-curable composition of the present invention can be suitably used as a film.
上記基材としては、特に限定されるものではないが、プラスチック成形体、木材系製品、セラミックス、ガラス、金属、およびそれらの複合物等が挙げられる。
また、これらの基材の表面が、化成処理、コロナ放電処理、プラズマ処理、酸やアルカリ液で処理されている基材や、基材本体と表層が異なる種類の塗料で被覆された化粧合板等も用いることもできる。
The base material is not particularly limited, and examples thereof include plastic molded bodies, wood-based products, ceramics, glass, metals, and composites thereof.
In addition, the surface of these base materials is treated with chemical conversion treatment, corona discharge treatment, plasma treatment, acid or alkaline solution, or decorative plywood whose surface layer is coated with a different type of paint from the base material body. Can also be used.
さらに、予めその他の機能層が形成された基材表面に、本発明のコーティング剤による被覆を施してもよく、その他の機能層としては、プライマー層、防錆層、ガスバリア層、防水層、熱線遮蔽層等が挙げられ、これらのいずれか一層または複数層が基材上に予め形成されていてもよい。 Further, the surface of the base material on which other functional layers are formed may be coated with the coating agent of the present invention, and the other functional layers include a primer layer, a rust preventive layer, a gas barrier layer, a waterproof layer, and a heat ray. Shielding layers and the like may be mentioned, and any one or a plurality of these layers may be pre-formed on the substrate.
被覆物品は、本発明のコーティング剤からなる塗膜が形成された面に、さらに、CVD(化学気相成長)法による蒸着層、ハードコート層、防錆層、ガスバリア層、防水層、熱線遮蔽層、防汚層、光触媒層、帯電防止層等の1層または複数層によって被覆されていてもよい。
さらに、被覆物品は、本発明のコーティング剤からなる塗膜が形成された面とは反対側の面が、ハードコート層、防錆層、ガスバリア層、防水層、熱線遮蔽層、防汚層、光触媒層、帯電防止層等の1層または複数層によって被覆されていてもよい。
In the coated article, a vapor deposition layer, a hard coat layer, a rust preventive layer, a gas barrier layer, a waterproof layer, and a heat ray shield by a CVD (chemical vapor deposition) method are further formed on a surface on which a coating film made of the coating agent of the present invention is formed. It may be covered with one or more layers such as a layer, an antifouling layer, a photocatalyst layer, and an antistatic layer.
Further, in the coated article, the surface opposite to the surface on which the coating film made of the coating agent of the present invention is formed is a hard coat layer, a rust preventive layer, a gas barrier layer, a waterproof layer, a heat ray shielding layer, an antifouling layer, and the like. It may be covered with one or more layers such as a photocatalyst layer and an antistatic layer.
本発明のコーティング剤は、表面に耐擦傷性および耐磨耗性の付与が必要とされる物品、特に液晶ディスプレイ、CRTディスプレイ、プラズマディスプレイ、ELディスプレイ等の各種表示素子等の表面に塗布し、硬化被膜とすることにより、これらの表面に耐擦傷性、耐磨耗性、耐屈曲性、および耐クラック性を付与することが可能である。 The coating agent of the present invention is applied to the surface of various display elements such as liquid crystal displays, CRT displays, plasma displays, EL displays, etc., in which scratch resistance and abrasion resistance are required to be imparted to the surface. By forming a cured film, it is possible to impart scratch resistance, abrasion resistance, bending resistance, and crack resistance to these surfaces.
コーティング剤の塗布方法としては、公知の手法から適宜選択すればよく、例えば、バーコーター、刷毛塗り、スプレー、浸漬、フローコート、ロールコート、カーテンコート、スピンコート、ナイフコート等の各種塗布方法を用いることができる。 The coating agent may be appropriately selected from known methods. For example, various coating methods such as bar coater, brush coating, spraying, dipping, flow coating, roll coating, curtain coating, spin coating, and knife coating may be used. Can be used.
活性エネルギー線硬化性組成物を硬化させるための光源としては、通常、200〜450nmの範囲の波長の光を含む光源、例えば高圧水銀灯、超高圧水銀灯、メタルハライドランプ、キセノン灯、カーボンアーク灯等が挙げられる。
照射量は特に制限されないが、10〜5,000mJ/cm2が好ましく、20〜1,000mJ/cm2がより好ましい。
硬化時間は、通常0.5秒〜2分であり、好ましくは1秒〜1分である。
As a light source for curing the active energy ray-curable composition, a light source containing light having a wavelength in the range of 200 to 450 nm, for example, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, a xenon lamp, a carbon arc lamp, or the like is used. Can be mentioned.
Although the irradiation amount is not particularly limited but is preferably 10~5,000mJ / cm 2, 20~1,000mJ / cm 2 is more preferable.
The curing time is usually 0.5 seconds to 2 minutes, preferably 1 second to 1 minute.
以下、実施例および比較例を挙げて本発明をより具体的に説明するが、本発明はこれらの実施例に限定されるものではない。
なお、下記において、揮発分はJIS C2133に準じて測定した値であり、重量平均分子量はGPC(ゲルパーミエーションクロマトグラフィー、HLC−8220 東ソー(株)製)を用いてテトラヒドロフラン(THF)を展開溶媒として測定した値である。
また、平均式(I)におけるa〜fおよび平均式(II)におけるa′〜e′の値は、1H−NMRおよび29Si−NMR測定の結果から算出した。
Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples.
In the following, the volatile content is a value measured according to JIS C2133, and the weight average molecular weight is a developing solvent of tetrahydrofuran (THF) using GPC (gel permeation chromatography, manufactured by HLC-8220 Tosoh Corporation). It is a value measured as.
The values of a to f in the average formula (I) and a'to e'in the average formula (II) were calculated from the results of 1 H-NMR and 29 Si-NMR measurements.
[1]平均式(I)で表されるオルガノポリシロキサン化合物の合成
[合成例1−1]オルガノポリシロキサン1−1の合成
下記式(V)で表される化合物964.2g(3.0mol)、ジメチルジメトキシシラン360.7g(3.0mol)、ヘキサメチルジシロキサン487.1g(3.0mol)、メタンスルホン酸7.3gを反応器中で配合し、均一になったところでイオン交換水162.0gを添加し、25℃で4時間撹拌した。キョーワード500SH(協和化学工業(株)製)36.7gを投入し、2時間撹拌して中和した。減圧下にてメタノール等の揮発成分を留去し、トルエンと芒硝水を加えて水洗し、ストリップによりトルエンを留去後、加圧濾過を行った。
得られた反応物は、粘度1,210mPa・s、揮発分1.6質量%、重量平均分子量1,210の25℃で粘稠な液体であった。NMRの結果から算出した平均式(II)におけるa〜fの値は、それぞれa=0.27、b=0、c=0、d=0.25、e=0.48、f=0.15であった。
[1] Synthesis of organopolysiloxane compound represented by the average formula (I) [Synthesis Example 1-1] Synthesis of organopolysiloxane 1-1 964.2 g (3.0 mol) of the compound represented by the following formula (V). ), dimethyldimethoxysilane 360.7 g (3.0 mol), hexamethyldisiloxane 487.1 g (3.0 mol), and methanesulfonic acid 7.3 g in a reactor, and when they become uniform, ion-exchanged water 162. .0 g was added and stirred at 25 ° C. for 4 hours. 36.7 g of Kyoward 500SH (manufactured by Kyowa Chemical Industry Co., Ltd.) was added and stirred for 2 hours to neutralize. Volatile components such as methanol were distilled off under reduced pressure, toluene and sodium sulfate water were added and washed with water, toluene was distilled off with a strip, and then pressure filtration was performed.
The obtained reaction product was a viscous liquid having a viscosity of 1,210 mPa · s, a volatile content of 1.6% by mass, and a weight average molecular weight of 1,210 at 25 ° C. The values of a to f in the average formula (II) calculated from the results of NMR are a = 0.27, b = 0, c = 0, d = 0.25, e = 0.48, and f = 0, respectively. It was 15.
[合成例1−2]オルガノポリシロキサン1−2の合成
上記式(V)で表される化合物1,285.6g(4.0mol)、トリメチルメトキシシラン136.22g(1.0mol)、ジメチルジメトキシシラン360.7g(3.0mol)、ヘキサメチルジシロキサン487.1g(3.0mol)、メタンスルホン酸8.9gを反応器中で配合し、均一になったところでイオン交換水226.8gを添加し、25℃で4時間撹拌した。キョーワード500SH(協和化学工業(株)製)44.7gを投入し、2時間撹拌して中和した。減圧下にてメタノール等の揮発成分を留去し、トルエンと芒硝水を加えて水洗し、ストリップによりトルエンを留去後、加圧濾過を行った。
得られた反応物は、粘度2,200mPa・s、揮発分1.6質量%、重量平均分子量1,870の25℃で粘稠な液体であった。NMRの結果から算出した平均式(I)におけるa〜fの値は、それぞれa=0.30、b=0、c=0.08、d=0.22、e=0.40、f=0.05であった。
[Synthesis Example 1-2] Synthesis of Organopolysiloxane 1-2 Compounds 1,285.6 g (4.0 mol) represented by the above formula (V), trimethylmethoxysilane 136.22 g (1.0 mol), dimethyldimethoxy Mix 360.7 g (3.0 mol) of silane, 487.1 g (3.0 mol) of hexamethyldisiloxane, and 8.9 g of methanesulfonic acid in a reactor, and add 226.8 g of ion-exchanged water when the mixture becomes uniform. Then, the mixture was stirred at 25 ° C. for 4 hours. 44.7 g of Kyoward 500SH (manufactured by Kyowa Chemical Industry Co., Ltd.) was added and stirred for 2 hours to neutralize. Volatile components such as methanol were distilled off under reduced pressure, toluene and sodium sulfate water were added and washed with water, toluene was distilled off with a strip, and then pressure filtration was performed.
The obtained reaction product was a viscous liquid at 25 ° C. with a viscosity of 2,200 mPa · s, a volatile content of 1.6% by mass, and a weight average molecular weight of 1,870. The values of a to f in the average formula (I) calculated from the results of NMR are a = 0.30, b = 0, c = 0.08, d = 0.22, e = 0.40, f =, respectively. It was 0.05.
[合成例1−3]オルガノポリシロキサン1−3の合成
上記式(V)で表される化合物1,285.6g(4.0mol)、テトラメトキシシラン30.5g(0.1mol)、ジメチルジメトキシシラン721.3g(6.0mol)、ヘキサメチルジシロキサン487.1g(3.0mol)、メタンスルホン酸9.8gを反応器中で配合し、均一になったところでイオン交換水265.7gを添加し、25℃で4時間撹拌した。キョーワード500SH(協和化学工業(株)製)49.0gを投入し、2時間撹拌して中和した。減圧下にてメタノール等の揮発成分を留去し、トルエンと芒硝水を加えて水洗し、ストリップによりトルエンを留去後、加圧濾過を行った。
得られた反応物は、粘度4,400mPa・s、揮発分0.9質量%、重量平均分子量3,250の25℃で粘稠な液体であった。NMRの結果から算出した平均式(I)におけるa〜fの値は、それぞれa=0.30、b=0、c=0.15、d=0、e=0.55、f=0.06であった。
[Synthesis Example 1-3] Synthesis of Organopolysiloxane 1-3 Compounds 1,285.6 g (4.0 mol) represented by the above formula (V), tetramethoxysilane 30.5 g (0.1 mol), dimethyldimethoxy 721.3 g (6.0 mol) of silane, 487.1 g (3.0 mol) of hexamethyldisiloxane, and 9.8 g of methanesulfonic acid were mixed in a reactor, and 265.7 g of ion-exchanged water was added when the mixture became uniform. Then, the mixture was stirred at 25 ° C. for 4 hours. 49.0 g of Kyoward 500SH (manufactured by Kyowa Chemical Industry Co., Ltd.) was added and stirred for 2 hours to neutralize. Volatile components such as methanol were distilled off under reduced pressure, toluene and sodium sulfate water were added and washed with water, toluene was distilled off with a strip, and then pressure filtration was performed.
The obtained reaction product was a viscous liquid at 25 ° C. with a viscosity of 4,400 mPa · s, a volatile content of 0.9% by mass, and a weight average molecular weight of 3,250. The values of a to f in the average formula (I) calculated from the results of NMR are a = 0.30, b = 0, c = 0.15, d = 0, e = 0.55, f = 0, respectively. It was 06.
[2]平均式(II)で表されるオルガノポリシロキサン化合物の合成
[合成例2−1]オルガノポリシロキサン2−1の合成
下記式(VI)で表される化合物1,462.0g(2.0mol)、ジメチルジメトキシシラン2,164.0g(18.0mol)、メタンスルホン酸13.8gを反応器中で配合し、均一になったところでイオン交換水410.4gを添加し、25℃で4時間撹拌した。キョーワード500SH(協和化学工業(株)製)68.8gを投入し、2時間撹拌して中和した。減圧下にてメタノール等の揮発成分を留去し、加圧濾過を行った。
得られた反応物は、粘度320mPa・s、揮発分0.8質量%、重量平均分子量2,700の25℃で粘稠な液体であった。NMRの結果から算出した平均式(II)におけるa′〜e′の値は、それぞれa′=0.11、b′=0、c′=0.89、d′=0、e′=0.02であった。
[2] Synthesis of organopolysiloxane compound represented by the average formula (II) [Synthesis Example 2-1] Synthesis of organopolysiloxane 2-1 1,462.0 g (2) of the compound represented by the following formula (VI) .0 mol), 2,164.0 g (18.0 mol) of dimethyldimethoxysilane, and 13.8 g of methanesulfonic acid were blended in a reactor, and when they became uniform, 410.4 g of ion-exchanged water was added, and the temperature was 25 ° C. The mixture was stirred for 4 hours. 68.8 g of Kyoward 500SH (manufactured by Kyowa Chemical Industry Co., Ltd.) was added and stirred for 2 hours to neutralize. Volatile components such as methanol were distilled off under reduced pressure, and pressure filtration was performed.
The obtained reaction product was a viscous liquid at 25 ° C. with a viscosity of 320 mPa · s, a volatile content of 0.8% by mass, and a weight average molecular weight of 2,700. The values of a'to e'in the average formula (II) calculated from the NMR results are a'= 0.11, b'= 0, c'= 0.89, d'= 0, e'= 0, respectively. It was 0.02.
[合成例2−2]オルガノポリシロキサン2−2の合成
上記式(VI)で表される化合物1,462.0g(2.0mol)、トリメチルメトキシシラン136.2g(1.0mol)、ジメチルジメトキシシラン1,683.1g(14.0mol)、ヘキサメチルジシロキサン324.8g(2.0mol)、メタンスルホン酸14.2gを反応器中に配合し、均一になったところでイオン交換水356.4gを添加し、25℃で4時間撹拌した。キョーワード500SH(協和化学工業(株)製)71.2gを投入し、2時間撹拌して中和した。減圧下にてメタノール等の揮発成分を留去し、加圧濾過を行った。
得られた反応物は、粘度160mPa・s、揮発分0.9質量%、重量平均分子量2,900の25℃で粘稠な液体であった。NMRの結果から算出した平均式(II)におけるa′〜e′の値は、それぞれa′=0.10、b′=0.06、c′=0.67、d′=0.17、e′=0.06であった。
[Synthesis Example 2-2] Synthesis of Organopolysiloxane 2-2 1,462.0 g (2.0 mol) of the compound represented by the above formula (VI), 136.2 g (1.0 mol) of trimethylmethoxysilane, dimethyldimethoxy Silane 1,683.1 g (14.0 mol), hexamethyldisiloxane 324.8 g (2.0 mol), and methanesulfonic acid 14.2 g were blended in a reactor, and when uniform, ion-exchanged water 356.4 g. Was added, and the mixture was stirred at 25 ° C. for 4 hours. 71.2 g of Kyoward 500SH (manufactured by Kyowa Chemical Industry Co., Ltd.) was added and stirred for 2 hours to neutralize. Volatile components such as methanol were distilled off under reduced pressure, and pressure filtration was performed.
The obtained reaction product was a viscous liquid at 25 ° C. with a viscosity of 160 mPa · s, a volatile content of 0.9% by mass, and a weight average molecular weight of 2,900. The values of a'to e'in the average formula (II) calculated from the NMR results are a'= 0.10, b'= 0.06, c'= 0.67, d'= 0.17, respectively. e'= 0.06.
[3]活性エネルギー線硬化性組成物の調製およびその硬化物の製造
[実施例1−1〜1−6,比較例1−1〜1−6]
上記合成例1−1〜1−3、2−1および2−2で得られた各オルガノポリシロキサン化合物、ジペンタエリスリトールヘキサアクリレート(DPHA、MIWON社製)、ダロキュア1173(ラジカル系光重合開始剤、BASF社製)を表1および表2に示す配合比率(質量部)で混合し、厚さ0.2mmとなるように離形フィルムを貼り付けた型に流し込み、高圧水銀灯で積算照射量600mJ/cm2となるように光を照射し、硬化させて硬化物を製造した。
[3] Preparation of active energy ray-curable composition and production of cured product thereof [Examples 1-1 to 1-6, Comparative Examples 1-1 to 1-6]
Each organopolysiloxane compound obtained in the above synthesis examples 1-1 to 1-3, 2-1 and 2-2, dipentaerythritol hexaacrylate (DPHA, manufactured by MIWON), DaroCure 1173 (radical photopolymerization initiator). , BASF) was mixed at the blending ratios (parts by mass) shown in Tables 1 and 2, poured into a mold with a release film attached so that the thickness was 0.2 mm, and the integrated irradiation amount was 600 mJ with a high-pressure mercury lamp. A cured product was produced by irradiating light to a ratio of / cm 2 and curing the mixture.
[4]活性エネルギー線硬化性組成物のフィルムの特性評価
実施例1−1〜1−6および比較例1−1〜1−5で得られたフィルムについて、鉛筆硬度、耐屈曲性および滑り性を下記の手法により測定した。結果を表3,4に示す。
(1)鉛筆硬度
JIS K5600−5−4に準じて750g荷重にて測定した。
(2)耐屈曲性
JIS K5600−5−1に準じて円筒形マンドレル(タイプ1)を用いて測定し、耐屈曲性に関して、8mmφ試験でクラックが生じたフィルムに対しては、>8mmφとした。
(3)滑り性
指で表面をなぞり、滑り性が発現しているものをOK、滑り性が発現していないものをNGとした。
[4] Evaluation of film characteristics of active energy ray-curable composition The films obtained in Examples 1-1 to 1-6 and Comparative Examples 1-1 to 1-5 have pencil hardness, bending resistance and slipperiness. Was measured by the following method. The results are shown in Tables 3 and 4.
(1) Pencil hardness Measured under a load of 750 g according to JIS K5600-5-4.
(2) Bending resistance Measured using a cylindrical mandrel (type 1) according to JIS K5600-5-1, the bending resistance was set to> 8 mmφ for films with cracks in the 8 mmφ test. ..
(3) Slippery The surface was traced with a finger, and the one with slipperiness was regarded as OK, and the one without slipperiness was regarded as NG.
表3,4に示されるように、ウレタン結合を有するオルガノポリシロキサンおよびポリアルキレンエーテル結合を有するオルガノポリシロキサンを含有する活性エネルギー線硬化物では、高い耐屈曲性および滑り性の両立がみられるが、ポリアルキレンエーテル結合を含有しない比較例1−1〜1−3では、滑り性が見られず、ウレタン結合を有しない比較例1−4、1−5では、耐屈曲性を示さないことがわかる。 As shown in Tables 3 and 4, the active energy ray-cured product containing an organopolysiloxane having a urethane bond and an organopolysiloxane having a polyalkylene ether bond has both high bending resistance and slipperiness. In Comparative Examples 1-1 to 1-3 which do not contain a polyalkylene ether bond, no slipperiness is observed, and in Comparative Examples 1-4 and 1-5 which do not have a urethane bond, bending resistance is not exhibited. Recognize.
[5]コーティング組成物および被覆物品の製造
[実施例2−1〜2−6,比較例2−1〜2−5]
上記合成例1−1〜1−3、2−1および2−2で得られた各オルガノポリシロキサン化合物、ポリエステル骨格ウレタンアクリレートUA−122P(新中村化学工業(株)製)、ジペンタエリスリトールヘキサアクリレート(MIWON社製)、酢酸エチル、ダロキュア1173(BASF社製)を表5および表6に示す配合比率(質量部)で混合してコーティング組成物を調製した。
得られた各コーティング組成物をバーコ−タ−No.3を用いてPET基板(A4100)上に塗布し、100℃で5分間乾燥させ、高圧水銀灯で積算照射量600mJ/cm2となるように光を照射し、硬化させて被膜物品を製造した。
[5] Production of coating composition and coated article [Examples 2-1 to 2-6, Comparative Examples 2-1 to 2-5]
Organopolysiloxane compounds obtained in Synthetic Examples 1-1 to 1-3, 2-1 and 2-2, polyester skeleton urethane acrylate UA-122P (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), dipentaerythritol hexa. Acrylate (manufactured by MIWON), ethyl acetate, and DaroCure 1173 (manufactured by BASF) were mixed at the compounding ratios (parts by mass) shown in Tables 5 and 6 to prepare a coating composition.
Each of the obtained coating compositions was referred to as Barcoter No. 3 was applied onto a PET substrate (A4100), dried at 100 ° C. for 5 minutes, irradiated with light with a high-pressure mercury lamp so as to have an integrated irradiation amount of 600 mJ / cm 2, and cured to produce a coated article.
[6]被覆物品の特性評価
得られた被覆物品の硬化膜について鉛筆硬度、耐屈曲性、滑り性および煮沸密着性を評価した。結果を表7,8に示す。なお、鉛筆硬度、耐屈曲性、滑り性は、上記と同様の手順で測定・評価し、煮沸密着性は下記の手法により評価した。
(4)煮沸密着試験
100℃の沸騰水に2時間試験片を浸した後、JIS K5600−5−6に準じて25マスによるクロスカット試験を行い、(剥離せず残ったマスの数)/25として表した。
[6] Evaluation of characteristics of the coated article The pencil hardness, bending resistance, slipperiness and boiling adhesion of the obtained cured film of the coated article were evaluated. The results are shown in Tables 7 and 8. The pencil hardness, bending resistance, and slipperiness were measured and evaluated by the same procedure as described above, and the boiling adhesion was evaluated by the following method.
(4) Boiling adhesion test After immersing the test piece in boiling water at 100 ° C for 2 hours, perform a cross-cut test with 25 cells according to JIS K5600-5-6 (number of cells remaining without peeling) / Expressed as 25.
表7,8に示されるように、コーティング組成物を塗布した被膜物品において、ポリアルキレンエーテル結合を有するオルガノポリシロキサンおよびウレタン結合を有するオルガノポリシロキサンを含有する物品のみ、耐屈曲性、滑り性、煮沸密着試験の全てにおいて良好な結果が得られており、本発明の重合性官能基を有するオルガノポリシロキサン化合物の優位性を示している。 As shown in Tables 7 and 8, in the coated articles coated with the coating composition, only the articles containing the organopolysiloxane having a polyalkylene ether bond and the organopolysiloxane having a urethane bond have bending resistance and slipperiness. Good results were obtained in all of the boiling adhesion tests, demonstrating the superiority of the organopolysiloxane compound having a polymerizable functional group of the present invention.
Claims (6)
前記重合性不飽和化合物が、1,6−ヘキサンジオールジ(メタ)アクリレート、トリエチレングリコールジ(メタ)アクリレート、エチレンオキサイド変性ビスフェノールA ジ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ジトリメチロールプロパンテトラ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、3−(メタ)アクリロイルオキシグリセリンモノ(メタ)アクリレート、ウレタンアクリレート、エポキシアクリレート、およびエステルアクリレートから選ばれる少なくとも1種である請求項2記載の活性エネルギー線硬化性組成物。 It contains a polymerizable unsaturated compound other than the organopolysiloxane compound represented by the average formulas (I) and (II) .
The polymerizable unsaturated compound is 1,6-hexanediol di (meth) acrylate, triethylene glycol di (meth) acrylate, ethylene oxide-modified bisphenol A di (meth) acrylate, trimethyl propanthry (meth) acrylate, and penta. Elythritol tetra (meth) acrylate, ditrimethylol propanetetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, pentaerythritol tri (meth) acrylate, 3- (meth) acryloyloxyglycerin mono (meth) acrylate, urethane acrylate, The active energy ray-curable composition according to claim 2, which is at least one selected from epoxy acrylates and ester acrylates.
前記硬化膜が、請求項5記載のコーティング剤から作製された硬化膜である被覆物品。 It has a substrate and a cured film laminated directly on at least one surface of the substrate or via at least one other layer.
A coated article in which the cured film is a cured film produced from the coating agent according to claim 5.
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