JP6964315B1 - Board processing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus for treating a surface of a substrate with droplets with a simple configuration. SOLUTION: Instead of a conventional substrate processing apparatus, a surface of a substrate is formed through an opening formed between an inner peripheral portion forming an end face at a position facing the surface of the substrate and an outer peripheral portion surrounding the inner peripheral portion. A jig capable of ejecting gas toward the surface and a jig that holds the jig so that the end face is brought into contact with the droplets adhering to the surface of the substrate and the droplets are surrounded by the openings, and the gas ejected from the openings is released. It is equipped with a scanning device that moves the jig relative to the surface of the substrate while spraying it on the surface of the substrate, and the annular contour of the opening as the opening moves away from the inner peripheral portion along the orthogonal direction of the surface of the substrate. The inner peripheral wall, which is a wall inclined away from the center of the circuit board, and the outer peripheral wall, which is a wall inclined away from the center of the annular contour of the opening as the distance from the outer peripheral portion is along the orthogonal direction of the surface of the substrate. It was supposed to be formed. [Selection diagram] Fig. 1

Description

The present invention relates to a substrate processing apparatus for processing a substrate for processing a substrate. In particular, the present invention relates to a substrate processing apparatus characterized in a configuration in which the surface of a substrate is treated with droplets.

A substrate treatment method is performed to treat the surface of the substrate with droplets.
A substrate processing device is used to process the surface of the substrate with droplets.
A jig is used to hold the droplets adhering to the surface of the substrate when processing the substrate.
When the surface of the substrate is hydrophobic with respect to the droplets, the droplets adhering to the surface of the substrate are held by an existing jig.
When the surface of the substrate is hydrophilic, the droplets tend to spread along the surface of the substrate, and it is difficult to hold the droplets adhering to the surface of the substrate as a single unit.
When the surface of the substrate is roughened by etching or the like, the droplets are caught in the fine irregularities on the surface of the substrate, so it is difficult to hold the droplets adhering to the surface of the substrate as a single unit. It is difficult to move the droplets along the surface of the substrate.
For example, substrate processing equipment is used in semiconductor and liquid crystal manufacturing equipment and inspection equipment.
The substrate processing apparatus is an apparatus for processing a substrate. For example, the substrate is a substrate such as a semiconductor wafer, a sapphire wafer, a liquid crystal substrate, or a mask substrate. The semiconductor wafer is a wafer made of silicon, gallium, silicon carbide or the like.
A substrate processing apparatus is used to accurately measure the amount of impurities such as sodium, potassium, and iron contained on the surface of a substrate.
Further, the substrate processing apparatus is used when the surface of the substrate is etched or the like.

For example, the purpose and method of accurately measuring impurities on the surface of a semiconductor wafer will be briefly described.
If impurities are contained in a thin film such as an oxide film or a nitride film formed on the surface of a semiconductor wafer, even a small amount of the impurities has a great influence on the electrical characteristics of the semiconductor element.
Therefore, in semiconductor device manufacturing equipment, it is required to suppress the mixing of impurities from the wafer surface as much as possible.
Therefore, the amount of impurities present on the surface of the semiconductor wafer is accurately measured.

Instead of secondary ion mass spectrometry, Auger spectroscopy, and neutron activation analysis, which have recently been used to measure the amount of impurities present on the wafer surface, it has a fluoride solution and the amount of impurities. To measure. For example, the fluoride solution is an HF (hydrogen fluoride) aqueous solution.
After dissolving the oxide film on the surface of the silicon wafer with an HF (hydrogen fluorinated) aqueous solution, the HF (hydrogen fluorinated) aqueous solution can be collected and the impurities in the HF (hydrogen fluorinated) aqueous solution can be analyzed. Will be done. When the amount of the collected HF (hydrogen fluoride) aqueous solution is small, the concentration of impurities is high and the measurement accuracy is improved.
For example, the substrate is exposed to the vapor of an HF (hydrogen fluoride) aqueous solution to dissolve the oxide layer of the substrate, and then droplets of the HF (hydrogen fluoride) aqueous solution are dropped on the surface of the substrate, and the droplets are dropped on the substrate. Move while adhering to the surface. Impurities in the oxide film are collected in the droplets. The amount of impurities on the surface of the substrate is inspected by measuring the amount of impurities in the droplet.
For example, the amount of impurities in the droplet of the fluoride solution is measured by an ICP mass analyzer.

In the above case, a substrate processing apparatus is used to drop droplets on the surface of the substrate, and a jig or the like is used to scan the droplets on the surface of the substrate to dissolve the oxide layer on the surface of the scanned region.
Since the silicon wafer and the HF (hydrogen fluoride) aqueous solution have a hydrophobic relationship, the droplets of the HF (hydrogen fluoride) aqueous solution become spherical on the surface of the silicon wafer. When the spherical droplet is held by a jig and moved, the droplet can be moved along a predetermined trajectory on the surface of the substrate very easily.

However, if the surface of the silicon wafer is after the etching process, the surface has fine irregularities, which makes it difficult to hold and move the droplets on the surface of the substrate.
Further, when the substrate and the droplet are in a hydrophilic relationship, it becomes more difficult to hold and move the droplet on the surface of the substrate.
For example, the surface of a sapphire wafer is hydrophilic.
In consideration of the above circumstances, the inventor considers the droplets adhering to the substrate to the droplets adhering to the surface of the substrate without being affected by the difference in hydrophobicity and hydrophilicity and the difference in the roughness of the surface of the substrate. We sought to come up with a method and structure that could hold it, and a method and structure that could allow the droplets to move relative to the surface of the substrate.

The present invention has been devised in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus for treating the surface of a substrate with droplets with a simple configuration.

In order to achieve the above object, in order to achieve the above object, the substrate processing apparatus for processing the substrate according to the present invention with droplets is provided with an inner peripheral portion forming an end face at a position facing the surface of the substrate and the inner peripheral portion when viewed from the side of the surface of the substrate. It has an outer peripheral portion that surrounds the portion, and is formed by being sandwiched between the inner peripheral portion and the outer peripheral portion, and can eject gas toward the surface of the substrate from an opening having an annular contour when viewed from the surface side of the substrate. The jig and the jig are held so that the end face is brought into contact with the droplets adhering to the surface of the substrate and the droplets adhering to the surface of the substrate are surrounded by the openings, and the gas ejected from the openings is discharged from the substrate. It comprises a scanning device that moves the jig relative to the surface of the substrate while spraying onto the surface of the opening, as the opening moves away from the outer edge of the inner circumference along the orthogonal direction of the surface of the substrate. The inner peripheral wall, which is a wall inclined away from the center of the annular contour, and the inner edge of the outer peripheral portion are inclined toward the center of the annular contour of the opening as the distance from the inner edge of the outer peripheral portion is along the orthogonal direction of the surface of the substrate. It is assumed that it is formed by the outer peripheral wall which is a wall.

According to the configuration of the present invention, the jig has an inner peripheral portion that forms an end face at a position facing the surface of the substrate and an outer peripheral portion that surrounds the inner peripheral portion when viewed from the surface side of the substrate. It is possible to eject gas toward the surface of the substrate from an opening having an annular contour when viewed from the side of the surface of the substrate, which is formed by being sandwiched between the portion and the outer peripheral portion. The scanning device holds the jig so that the end face is brought into contact with the droplets adhering to the surface of the substrate and the droplets adhering to the surface of the substrate are surrounded by the openings, and the gas ejected from the openings is discharged from the substrate. The jig is relatively moved along the surface of the substrate while spraying on the surface. An inner peripheral wall and an inner edge of the outer peripheral portion, which is a wall that inclines so that the opening moves away from the center of the annular contour of the opening as the opening moves away from the outer edge of the inner peripheral portion along the orthogonal direction of the surface of the substrate. It is formed of an outer peripheral wall which is a wall which is inclined so as to move away from the center of the annular contour of the opening as the distance from the surface of the substrate increases along the orthogonal direction.
As a result, when the gas is blown out along the inclination from the gap sandwiched between the inner peripheral wall and the outer peripheral wall of the opening and blown around the droplets adhering to the surface of the substrate, the jig is relatively moved along the surface of the substrate. The droplets can be stably held.

The substrate processing apparatus according to the embodiment of the present invention will be described below. The present invention includes any of the embodiments described below, or a combination of two or more of them.

In the substrate processing apparatus according to the embodiment of the present invention, the surface of the substrate moves away from the center of the annular contour of the opening as the opening moves away from the outer edge of the inner peripheral portion along the orthogonal direction of the surface of the substrate. As the distance from the inner peripheral wall, which is a wall inclined at the first inclination angle, which is a predetermined inclination angle with respect to the orthogonal direction orthogonal to, and the inner edge of the outer peripheral portion, along the orthogonal direction of the surface of the substrate, the annular shape of the opening is formed. It is formed by an outer peripheral wall which is a wall inclined at a second inclination angle which is a predetermined inclination angle with respect to an orthogonal direction orthogonal to the surface of the substrate so as to move away from the center of the contour of.
According to the configuration of the above embodiment, as the opening moves away from the outer edge of the inner peripheral portion along the orthogonal direction of the surface of the substrate, the opening is orthogonal to the surface of the substrate so as to move away from the center of the annular contour of the opening. The center of the annular contour of the opening as it moves away from the inner peripheral wall, which is a wall inclined at the first inclination angle, which is a predetermined inclination angle with respect to the direction, and the inner edge of the outer peripheral portion along the orthogonal direction of the surface of the substrate. It is formed by an outer peripheral wall which is a wall inclined at a second inclination angle which is a predetermined inclination angle with respect to an orthogonal direction orthogonal to the surface of the substrate so as to move away from.
As a result, the gas is blown out along the inclination from the gap between the inner peripheral wall inclined at the first inclination angle of the opening and the outer peripheral wall inclined at the second inclination angle, and is sprayed around the droplets adhering to the surface of the substrate. , The droplet can be stably held when the jig is relatively moved along the surface of the substrate.

In the substrate processing apparatus according to the embodiment of the present invention, the second inclination angle is larger than the first inclination angle.
According to the configuration of the above embodiment, the second tilt angle is larger than the first tilt angle.
As a result, the gas is squeezed along the inclination from the gap between the inner peripheral wall inclined at the first inclination angle of the opening and the outer peripheral wall inclined at the second inclination angle, and blown out around the droplets adhering to the surface of the substrate. Can be sprayed on to stably hold droplets as the jig moves relative to the surface of the substrate.

In the substrate processing apparatus according to the embodiment of the present invention, the gap distance between the inner peripheral portion and the surface of the substrate is shorter than the gap distance between the outer peripheral portion and the surface of the substrate by a predetermined distance.
According to the configuration of the above embodiment, the gap distance between the inner peripheral portion and the surface of the substrate is shorter than the gap distance between the outer peripheral portion and the surface of the substrate by a predetermined distance.
As a result, there is no possibility that the outer peripheral portion comes into contact with the surface of the substrate when the inner peripheral portion is brought close to the surface of the substrate.

In the substrate processing apparatus according to the embodiment of the present invention, the jig has a jig main body, a jig outer peripheral member, and a jig inner peripheral member, and the jig inner peripheral member forms the inner peripheral portion. It is a member, the jig outer peripheral member is a member forming the outer peripheral portion, and a jig inner peripheral fitting hole into which the jig inner peripheral member is fitted is formed, and the jig main body is attached to the scanning device. It is a member to be supported, a first gas passage is formed, and a holder for attaching / detaching the jig outer peripheral member is provided, and the jig main body holds the jig outer peripheral member by the holder, and the jig outer peripheral member is held. When the jig inner peripheral member is fitted into the jig inner peripheral fitting hole, a second gas passage is formed in the gap between the jig inner peripheral jig and the jig outer peripheral member, and the first gas passage and the jig inner peripheral member are formed. The second gas passage and the opening communicate with each other.
According to the configuration of the above embodiment, the jig has a jig main body, a jig outer peripheral member, and a jig inner peripheral member. The jig inner peripheral member is a member that forms the inner peripheral portion. The jig outer peripheral member is a member that forms the outer peripheral portion, and a jig inner peripheral fitting hole that fits into the jig inner peripheral member is formed. The jig main body is a member supported by the scanning device, a first gas passage is formed, and a holder on which the jig outer peripheral member can be attached and detached is provided. The jig body holds the jig outer peripheral member by the holder. When the jig inner peripheral member is fitted into the jig inner peripheral fitting hole, a second gas passage is formed in a gap between the jig inner peripheral jig and the jig outer peripheral member, and the first gas passage is formed. And the second gas passage and the opening communicate with each other.
As a result, the gas is sprayed from the first gas passage formed in the jig body to the surface of the gas through the opening through the second gas passage formed in the gap between the jig outer peripheral member and the jig inner peripheral jig. Be done.

The substrate processing apparatus according to the embodiment of the present invention is a cylindrical void in which the second gas passage extends vertically and communicates with the opening at the lower end, and the gas is the first gas passage and the second gas passage. It passes through the openings in this order and is sprayed on the surface of the substrate.
According to the configuration of the above embodiment, the gas is the first gas passage, the second gas passage, and the opening, which is a cylindrical void in which the second gas passage extends vertically and communicates with the opening at the lower end. It passes through in order and is sprayed on the surface of the substrate.
As a result, the gas is sprayed onto the surface of the gas from the opening through the second gas passage having a cylindrical void extending vertically from the first gas passage formed in the jig body.

In the substrate processing apparatus according to the embodiment of the present invention, the second gas passage is a cylindrical void having a constant outer diameter and a constant inner diameter, extending vertically and communicating with the opening at the lower end, and the gas is the first gas. It passes through the gas passage, the second gas passage, and the opening in this order, and is sprayed onto the surface of the substrate.
According to the configuration of the above embodiment, the second gas passage has a constant outer diameter and a constant inner diameter, extends vertically and vertically, and is a cylindrical void communicating with the opening at the lower end. The gas passes through the first gas passage, the second gas passage, and the opening in this order, and is blown onto the surface of the substrate.
As a result, the gas is sprayed onto the surface of the gas from the opening through the second gas passage having a cylindrical void having a cross section of the same size extending vertically from the first gas passage formed in the jig body.

In the substrate processing apparatus according to the embodiment of the present invention, the jig outer peripheral member has a flange-shaped mounting portion, the jig main body has a flange-shaped mounting portion, and the jig main body is formed by the holding tool. When holding the jig outer peripheral member, the flange-shaped mounting portion of the jig outer peripheral member and the flange-shaped lower portion of the jig body are in close contact with each other.
According to the configuration of the above embodiment, the jig outer peripheral member has a flange-shaped mounting portion. The jig body has a flange-shaped mounting portion. When the jig main body holds the jig outer peripheral member by the holder, the flange-shaped mounting portion of the jig outer peripheral member and the flange-shaped mounting portion of the jig main body are in close contact with each other.
As a result, when the scanning device moves the jig body relative to the surface of the substrate, the jig outer peripheral member and the jig inner peripheral member fitted in the jig inner peripheral fitting hole of the jig outer peripheral member are formed. It can move relative to the surface of the substrate.

The substrate processing apparatus according to the embodiment of the present invention has a flange-shaped mounting portion on the upper surface of which the outer peripheral member of the jig is formed with one of a groove or a protrusion having an annular contour when viewed from above. When the main body has a flange-shaped mounting portion on the lower surface forming the other side of a groove or a protrusion having an annular contour when viewed from below, and the jig main body holds the jig outer peripheral member by the holder. One of the groove or the protrusion of the jig outer peripheral member and the other of the groove or the protrusion of the jig main body are fitted, and the flange-shaped mounting portion of the jig outer peripheral member and the jig main body It comes into close contact with the flange-shaped lower part.
According to the configuration of the above embodiment, the jig outer peripheral member has a flange-shaped mounting portion on the upper surface on which one of a groove or a protrusion having an annular contour when viewed from above is formed. The jig body has a flange-shaped mounting portion on the lower surface on which the other side of a groove or protrusion having an annular contour when viewed from below is formed. When the jig main body holds the jig outer peripheral member by the holder, one of the groove or the protrusion of the jig outer peripheral member and the other of the groove or the protrusion of the jig main body are fitted. Therefore, the flange-shaped mounting portion of the jig outer peripheral member and the flange-shaped mounting portion of the jig body are in close contact with each other.
As a result, when the scanning device moves the jig body relative to the surface of the substrate, the jig body and the jig outer peripheral member are in close contact with each other in the jig outer peripheral member and the jig outer peripheral member. The inner peripheral member of the jig fitted in the peripheral fitting hole can move relative to the surface of the substrate.

As described above, the substrate processing apparatus according to the present invention has the following effects depending on its configuration.
Scan a jig that ejects gas onto the surface of the substrate from an opening with an annular contour formed by being sandwiched between the inner peripheral portion that forms the end face and the outer peripheral portion that surrounds the inner peripheral portion when viewed from the surface side of the substrate. In a substrate processing device in which a device holds droplets adhering to the surface of a substrate so as to be surrounded by an opening and moves the droplets relative to the surface of the substrate, the opening is formed from the outer edge of the inner peripheral portion of the surface of the substrate. The annular shape of the opening as it moves away from the inner peripheral wall, which is a wall that inclines away from the center of the annular contour of the opening as it moves away along the orthogonal direction, and the inner edge of the outer peripheral portion along the orthogonal direction of the surface of the substrate. Since it is formed by the outer peripheral wall, which is a wall that inclines away from the center of the contour of the, gas is blown out along the incline from the gap sandwiched between the inner peripheral wall and the outer peripheral wall of the opening and adheres to the surface of the substrate. By spraying around the droplets to be formed, the droplets can be stably held as the jig moves relative to the surface of the substrate.
A predetermined tilt angle with respect to the orthogonal direction orthogonal to the surface of the substrate so that the opening moves away from the outer edge of the inner peripheral portion along the orthogonal direction of the surface of the substrate and away from the center of the annular contour of the opening. As the distance from the inner peripheral wall, which is a wall inclined at the first inclination angle, and the inner edge of the outer peripheral portion along the orthogonal direction of the surface of the substrate, the surface of the substrate is moved away from the center of the annular contour of the opening. Since it is formed by the outer peripheral wall which is a wall inclined at the second inclination angle which is a predetermined inclination angle with respect to the orthogonal orthogonal direction, the inner peripheral wall where the gas is inclined at the first inclination angle of the opening and the first Blows out along the slope from the gap between the outer wall that slopes at two tilt angles, and sprays around the droplets that adhere to the surface of the substrate, causing the droplets to move relative to each other along the surface of the substrate. Can be held stably.
Since the second inclination angle is made larger than the first inclination angle, the gas is along the inclination from the gap sandwiched between the inner peripheral wall inclined at the first inclination angle of the opening and the outer peripheral wall inclined at the second inclination angle. It can be squeezed and blown out and sprayed around the droplets adhering to the surface of the substrate to stably hold the droplets as the jig moves relative to the surface of the substrate.
Since the gap distance between the inner peripheral portion and the surface of the substrate is set to be shorter than the gap distance between the outer peripheral portion and the surface of the substrate by a predetermined distance, the outer peripheral portion becomes closer to the surface of the substrate when the inner peripheral portion is brought closer to the surface of the substrate. There is no risk of contact with the surface of the substrate.
The jig inner peripheral member forming the inner peripheral portion is fitted into the jig inner peripheral fitting hole of the jig outer peripheral member forming the peripheral portion, and the jig outer peripheral member is supported by the scanning device. When the jig is fitted into the jig outer peripheral fitting hole of the tool body and the holder provided on the jig body holds the jig outer peripheral member, the first gas passage formed in the jig body and the jig outer peripheral member Since the second gas passage formed in the gap between the jig inner peripheral jig and the opening are made to communicate with each other, the gas is formed from the first gas passage formed in the jig main body to the jig outer peripheral member and the said. It is sprayed onto the surface of the gas from the opening through the second gas passage formed in the gap between the jig inner circumference jig and the jig.
Since the second gas passage extends vertically and extends vertically to communicate with the opening at the lower end, the cylindrical gap extending vertically from the first gas passage formed in the jig body. It is sprayed onto the surface of the gas through the opening through the second gas passage with.
Since the second gas passage has a constant outer diameter and a constant inner diameter and extends vertically long and is a cylindrical void communicating with the opening at the lower end, the first gas passage in which gas is formed in the jig body. It is sprayed onto the surface of the gas through an opening through a second gas passage having a cylindrical void having a cross section of the same size extending vertically from the gas.
When the jig main body holds the jig outer peripheral member by the holder, the flange-shaped upper portion of the jig outer peripheral member and the flange-shaped lower portion of the jig main body are brought into close contact with each other. When the scanning device moves the jig body relative to the surface of the substrate, the jig outer peripheral member and the jig inner peripheral member that fits into the jig inner peripheral fitting hole of the jig outer peripheral member are on the surface of the substrate. Can be moved relative to each other.
When the jig main body holds the jig outer peripheral member by the holder, one of the groove or the protrusion of the jig outer peripheral member and the other of the groove or the protrusion of the jig main body are fitted. Since the flange-shaped upper portion of the jig outer peripheral member and the flange-shaped lower portion of the jig body are brought into close contact with each other, the scanning device moves the jig body relative to the surface of the substrate. And the jig inner peripheral member that fits into the jig inner peripheral fitting hole of the jig outer peripheral member and the jig outer peripheral member in a state where the jig main body and the jig outer peripheral member are in close contact with each other along the surface of the substrate. Can move relative to each other.

It is a front view of the substrate processing apparatus which concerns on embodiment of this invention. It is a top view of the substrate processing apparatus which concerns on embodiment of this invention. It is a front view of the jig which concerns on embodiment of this invention. FIG. 1 is a cross-sectional view of a jig according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of a jig according to an embodiment of the present invention. It is an enlarged sectional view of the jig which concerns on embodiment of this invention. It is an enlarged bottom view of the jig which concerns on embodiment of this invention. It is a partial plan view of the jig which concerns on embodiment of this invention. It is a partial cross-sectional view of the jig which concerns on embodiment of this invention. It is a procedure diagram of the substrate processing method which concerns on embodiment of this invention.

Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings.

First, the substrate processing apparatus according to the embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a front view of the substrate processing apparatus according to the embodiment of the present invention. FIG. 2 is a plan view of the substrate processing apparatus according to the embodiment of the present invention. FIG. 3 is a front view of the jig according to the embodiment of the present invention. FIG. 4 is a cross-sectional view 1 of the jig according to the embodiment of the present invention. FIG. 5 is a cross-sectional view 2 of the jig according to the embodiment of the present invention. FIG. 6 is an enlarged cross-sectional view of the jig according to the embodiment of the present invention. FIG. 7 is an enlarged bottom view of the jig according to the embodiment of the present invention. FIG. 8 is a partial plan view of the jig according to the embodiment of the present invention. FIG. 9 is a partial cross-sectional view of the jig according to the embodiment of the present invention.

The substrate processing device is a device that processes the substrate 5 with droplets P, and is composed of a jig 100, a pressure sensor (not shown), a liquid supply device 200, a scanning device 300, and a liquid recovery device (not shown). It is composed.

The jig 100 is a jig for holding the droplet P adhering to the substrate 5.
The jig 100 has an inner peripheral portion 131 that forms an end surface S at a position facing the surface of the substrate 5 and an outer peripheral portion 121 that surrounds the inner peripheral portion 131 when viewed from the surface side of the substrate 5. Gas can be ejected from the opening O, which is formed between 131 and the outer peripheral portion 121 and has an annular contour when viewed from the surface side of the substrate 5, toward the surface of the substrate 5.
The jig 100 includes an inner peripheral portion 131 that forms an end surface S at a position facing the surface of the substrate 5 and an outer peripheral portion 121 that forms an annular end surface N that surrounds the inner peripheral portion 131 when viewed from the surface side of the substrate 5. The gas can be ejected from the opening O having an annular contour when viewed from the surface side of the substrate 5, which is sandwiched between the inner peripheral portion 131 and the outer peripheral portion 121, toward the surface of the substrate 5. be.

The end face S may be a flat surface.
The end face S may be a plane parallel to the surface of the substrate 5.
The end face S may have a circular outer diameter when viewed from the side of the substrate 5.
The end face S may have a circular outer diameter with a hole in the center when viewed from the side of the substrate 5.

The end face N may be flat.
The end face N may be a plane parallel to the surface of the substrate 5.
The end face N may have an annular contour when viewed from the side of the substrate 5.

The opening O is formed by the inner peripheral wall Wi and the outer peripheral wall Wo.
The inner peripheral wall Wi is a wall that inclines so as to move away from the center of the annular contour of the opening O as the distance from the outer edge of the inner peripheral portion 131 is along the orthogonal direction of the surface of the substrate 5. It is a wall that inclines so as to move away from the center of the annular contour of the opening O as it moves away from the inner edge of 121 along the orthogonal direction of the surface of the substrate 5.

The inner peripheral wall Wi may be a wall that inclines so as to move away from the center of the annular contour of the opening O as the inner peripheral wall Wi moves away from the outer edge of the inner peripheral portion 131 along the orthogonal direction of the surface of the substrate 5 over the entire circumference.
The outer peripheral wall Wo may be a wall that inclines so as to move away from the center of the annular contour of the opening O as the outer peripheral wall Wo moves away from the inner edge of the outer peripheral portion 121 along the orthogonal direction of the surface of the substrate over the entire circumference.

As the inner peripheral wall Wi moves away from the outer edge of the inner peripheral portion 131 along the orthogonal direction of the surface of the substrate, it is determined with respect to the orthogonal direction orthogonal to the surface of the substrate 5 so as to move away from the center of the annular contour of the opening O. The wall may be inclined at the first inclination angle θ1 which is the inclination angle of.
As the outer peripheral wall Wo moves away from the inner edge of the outer peripheral portion 121 along the orthogonal direction of the surface of the substrate 5, it is determined with respect to the orthogonal direction orthogonal to the surface of the substrate 5 so as to move away from the center of the annular contour of the opening O. The wall may be inclined at the second inclination angle θ2, which is the inclination angle of.

An orthogonal direction orthogonal to the surface of the substrate 5 so that the inner peripheral wall Wi moves away from the center of the annular contour of the opening O as the inner peripheral wall Wi moves away from the outer edge of the inner peripheral portion 131 along the orthogonal direction of the surface of the substrate 5 over the entire circumference. The wall may be inclined at a first inclination angle θ1 which is a predetermined inclination angle.
The outer peripheral wall Wo is orthogonal to the surface of the substrate 5 so as to move away from the center of the annular contour of the opening O as the outer peripheral wall Wo moves away from the inner edge of the outer peripheral portion 121 along the orthogonal direction of the surface of the substrate 5 over the entire circumference. On the other hand, the wall may be inclined at a second inclination angle θ2 which is a predetermined inclination angle.

The second inclination angle θ2 and the first inclination angle θ1 may be different.
The second inclination angle θ2 and the first inclination angle θ1 may be different over the entire circumference.
The second tilt angle θ2 may be larger than the first tilt angle θ1.
The second tilt angle θ2 may be larger than the first tilt angle θ1 over the entire circumference.

The gap distance D1 between the inner peripheral portion 131 and the surface of the substrate 5 and the gap distance D2 between the outer peripheral portion 121 and the surface of the substrate 5 may be different.
The gap distance D1 between the end surface S of the inner peripheral portion 131 and the surface of the substrate 5 and the gap distance D2 between the end surface N of the outer peripheral portion 121 and the surface of the substrate 5 may be different.
The gap distance D1 between the inner peripheral portion 131 and the surface of the substrate 5 may be shorter than the gap distance D2 between the outer peripheral portion 121 and the surface of the substrate 5 by a predetermined distance.
The gap distance D1 between the end surface S of the inner peripheral portion 131 and the surface of the substrate 5 may be shorter than the gap distance D2 between the end surface N of the outer peripheral portion 121 and the surface of the substrate 5 by a predetermined distance.

The jig 100 may have an inner peripheral portion 131 forming an end face S, an annular opening O surrounding the end face S may be formed, and gas may be ejected from the opening O. The jig 100 brings the end face into contact with the droplet P adhering to the surface of the substrate 5, looks at the substrate from the direction orthogonal to the surface of the substrate 5, and surrounds the droplet P adhering to the surface of the substrate 5 with an opening O. The gas ejected from the opening O in the held state can be sprayed onto the surface of the substrate.
For example, the outer peripheral wall Wo of the outer peripheral portion 121 forms the outside of the opening О, and the inner peripheral wall Wi of the inner peripheral portion 131 forms the inside of the opening O.
For example, the outer peripheral wall Wo of the outer peripheral portion 121 forms the outside of the opening О, the inner peripheral wall Wi of the inner peripheral portion 131 forms the inside of the opening O, and the end surface S is located below the inner peripheral portion 131.

The jig 100 looks at the substrate 5 from the direction orthogonal to the surface of the substrate 5, and in a state where the droplet P adhering to the surface of the substrate is held so as to be surrounded by the opening O, the gas ejected from the opening O of the substrate 5 is held. It may be possible to spray on the surface.
The jig 100 may have an inner peripheral portion 131 forming the end face S, and may be capable of ejecting gas from the opening O surrounding the end face S.

The jig 100 has a through hole H formed inside an end surface S surrounded by the opening O when viewed from the side of the substrate 5, and the gas ejected from the opening O while the opening O is held toward the surface of the substrate. May be able to pass through the through hole H and allow droplets to adhere to the surface of the substrate 5 when the gas is sprayed onto the surface of the substrate.
For example, in the jig 100, a through hole H is formed inside an end surface S surrounded by the opening O when viewed from the side of the substrate 5, the opening O is directed toward the surface of the substrate, the jig is held, and the jig 100 is ejected from the opening O. When the gas is sprayed onto the surface of the substrate, the droplet may be dropped and adhered to the surface of the substrate 5 through the through hole H.
For example, the through hole H penetrates the center surrounded by the end face S, and the tip of the nozzle-shaped member of the liquid supply device 200 passes through the through hole H and approaches the surface of the substrate 5, so that the liquid supply device 200 A liquid is dropped on the surface of the substrate from the tip of the nozzle-shaped member of the above, and the droplet P is attached to the surface of the substrate 5.
For example, the inner peripheral surface 132 of the jig inner peripheral member 130 surrounds the through hole H.

In the jig 100, a through hole H is formed inside an end surface S surrounded by the opening O, and the gas ejected from the opening O is blown out from the opening O while the jig 100 is held with the opening O facing the surface 5 of the substrate. The droplets adhering to the surface of the substrate when sprayed on the surface of the substrate may be collected through the through holes H.
For example, the jig 100 has a through hole formed inside the end surface S surrounded by the opening O, and the gas ejected from the opening O while the jig 100 is held with the opening O facing the surface of the substrate 5 is discharged. The droplet P adhering to the surface of the substrate 5 when sprayed on the surface of the substrate 5 may pass through the through hole H and be sucked out by the nozzle-shaped member of the liquid supply device 200 so that it can be collected.
For example, the through hole H penetrates the center of the end face S, and the tip of the nozzle-shaped member of the liquid supply device 200 passes through the through hole H and approaches the surface of the substrate 5, so that the nozzle of the liquid supply device 200 The tip of the shaped member is brought into contact with the droplet P adhering to the surface of the substrate 5, and the droplet P adhering to the surface of the substrate 5 is sucked.

The pressure sensor (not shown) is a sensor that detects the internal pressure inside the jig 100 of the gas ejected from the opening O.
The pressure sensor (not shown) may detect the pressure inside the first gas passage E of the jig 100.
The pressure sensor (not shown) may detect the pressure inside the second gas passage F of the jig 100.
The pressure sensor (not shown) may detect the pressure of the gas supplied from the gas supply device 140 to the jig 100.
If the opening O is closed, the pressure sensor 15 indicates the value of the original pressure of the gas supply device 140.

The liquid supply device 200 is a device that attaches droplets P to the surface of the substrate 5.
The liquid supply device 200 may include a nozzle-shaped member that drops and adheres the droplet P to the surface of the substrate 5.
When the jig 100 forms a through hole H, the liquid supply device 200 holds the jig with the opening O facing the surface of the substrate and sprays the gas ejected from the opening O onto the surface of the substrate 5. The nozzle-shaped member of the liquid supply device 200 may be passed through the through hole H to allow the droplets to adhere to the surface of the substrate.
In this way, the droplet P is stably placed in the ring-shaped curtain of gas that is ejected from the opening O and sprayed on the surface of the substrate 5.
Further, the jig 100 may be retracted from above the substrate 5, and the liquid supply device 200 may attach the droplet P to the surface of the substrate 5.

The scanning device 300 is a device that holds and moves the jig 100.
The scanning device 300 brought the end face S into contact with the droplet P adhering to the surface of the substrate 5, held the jig 100 so as to surround the droplet adhering to the surface of the substrate 5 with the opening O, and ejected the gas from the opening O. This is a device that relatively moves the jig 100 along the surface of the substrate 5 while blowing gas onto the surface of the substrate 5.
The scanning device 300 sets the distance between the surface of the substrate 5 and the end surface S to a predetermined distance, brings the end surface S into contact with the droplet P adhering to the surface of the substrate 5, and directs the line of sight along the direction orthogonal to the surface of the substrate 5. The jig 100 is held so as to surround the droplet P adhering to the surface of the substrate 5 with the opening O, and the jig 100 is moved along the surface of the substrate while spraying the gas ejected from the opening O onto the surface of the substrate 5. May be moved relative to each other.
The scanning device 300 exhibits a stop function, an adhesion function, a scanning function, a position adjusting function, and a collecting function.
For example, the scanning device 300 simultaneously exerts the scanning function and the position adjusting function after exerting the stopping function and the attaching function in order, and then exerts the collecting function.
Each function will be described below.

First, the stop function exhibited by the scanning device 300 will be described.
The scanning device 300 gradually approaches the surface of the substrate along the orthogonal direction of the surface of the substrate 5 while ejecting gas from the opening O of the jig 100, and the internal pressure matches the set pressure value which is a preset pressure value. It may be possible to stop the jig at the time of doing so.
After the scanning device 300 exerts the stop function, the position adjusting function described later may be exerted.
The flow rate of the gas ejected from the opening O may be substantially constant while the scanning device 300 exerts the stop function.
For example, the scanning device 300 gradually brings the jig 100 closer to the surface of the substrate along the orthogonal direction of the surface of the substrate, and stops the jig 100 when the internal pressure reaches a set pressure value which is a preset pressure value. The first flow rate A1 is such that the flow rate of the gas ejected from the opening O is substantially constant.

Next, the adhesion function exhibited by the scanning device 300 will be described.
The scanning device 300 keeps the jig stopped and holds the opening toward the surface of the substrate, and when the gas ejected from the opening is sprayed onto the surface of the substrate, the droplet is placed at a position surrounded by the opening on the surface of the substrate. It may be attached.
The flow rate of the gas ejected from the opening O may be substantially constant while the scanning device 300 exerts the adhesion function.
For example, when the scanning device 300 points the opening O toward the surface of the substrate, stops and holds the jig, and sprays the gas ejected from the opening onto the surface of the substrate, the droplets are surrounded by the opening on the surface of the substrate. The second flow rate A2 is such that the flow rate of the gas ejected from the opening until it is attached to the position is substantially constant.

Next, the position adjusting function of the scanning device 300 will be described.
The scanning device 300 holds the jig 100 so as to surround the droplets adhering to the surface of the substrate with the annular opening O when the substrate is viewed from the direction orthogonal to the surface of the substrate, and the gas ejected from the opening O is discharged from the substrate 5. The position of the surface of the jig substrate along the orthogonal direction can be adjusted so as to reduce the differential pressure between the internal pressure and the specific pressure value, which is a specific pressure value, while spraying on the surface.
The specific pressure value may be the pressure value of the internal pressure immediately after the adhesion step is performed.
The flow rate of the gas ejected from the opening O may be substantially constant while the scanning device 300 exerts the position adjusting function.
For example, the scanning device 300 holds the jig 10 so as to surround the droplets adhering to the surface of the substrate by the opening O when the substrate is viewed from the direction orthogonal to the surface of the substrate, and the gas ejected from the opening O is discharged from the surface of the substrate. The flow rate of gas ejected from the opening O while adjusting the position of the surface of the jig substrate along the orthogonal direction so as to reduce the differential pressure between the internal pressure and the specific pressure value, which is a specific pressure value, while spraying on the jig. It is a substantially constant third flow rate A3.

Next, the scanning function of the scanning device 300 will be described.
The scanning device 300 holds the jig 100 so as to surround the droplet P adhering to the surface of the substrate 5 with the opening O when the substrate 5 is viewed from the direction orthogonal to the surface of the substrate 5, and the gas ejected from the opening O is discharged from the substrate. The jig 100 can be relatively moved along the surface of the substrate 5 while spraying on the surface of the substrate 5.
The scanning device 300 brings the end surface S into contact with the droplet P attached to the surface of the substrate, looks at the substrate 5 from the direction orthogonal to the surface of the substrate 5, and surrounds the droplet attached to the surface of the substrate 5 with the opening O. It may be possible to move the jig 100 relative to the surface of the substrate 5 while holding the jig 100 and spraying the gas ejected from the opening O onto the surface of the substrate 5.
The flow rate of the gas ejected from the opening O may be substantially constant while the scanning device 300 exerts the scanning function.
For example, the scanning device 300 holds a jig so as to surround the droplets adhering to the surface of the substrate with an opening when the substrate is viewed from the direction orthogonal to the surface of the substrate 5, and the gas ejected from the opening O is applied to the surface of the substrate. The third flow rate A3 is such that the flow rate of the gas ejected from the opening O is substantially constant until the jig is relatively moved along the surface of the substrate while being sprayed.
The scanning device 30 may simultaneously exert the position adjusting function and the scanning function.

The first flow rate A1 and the second flow rate A2 may be different.
For example, the first flow rate A1 is larger than the second flow rate A2.

The second flow rate A2 and the third flow rate A3 may be different.
For example, the third flow rate A3 is larger than the second flow rate A2.

The first flow rate A1 and the third flow rate A3 may be different.
For example, the first flow rate A1 is larger than the third flow rate A3.

The scanning device 300 includes a base 310, a rotating device 320, a centering device 330, a swinging device 340, and an elevating device 350.
The base 310 is a device on which a rotating device 320, a centering device 330, a swinging device 340, and an elevating device 350 are mounted, and a control device (not shown) or the like is built in the base 310.
The rotating device 320 is a device that rotates the substrate around a virtual rotation axis orthogonal to the surface of the substrate.
For example, when the substrate is a wafer such as a silicon wafer or a sapphire wafer, the rotating device 320 rotates around a rotation axis that coincides with the arc center of the edge of the wafer.

The centering device 330 is a device that aligns a virtual rotation axis that rotates the substrate 5 with the rotation axis of the rotation device 320.

The rocking device 340 is a device that moves the jig 100 along the radial direction of the substrate.
For example, the swing device 340 holds the jig 100 at the tip of the swing arm and swings the base of the swing arm around the vertical axis.
When the swinging device 340 swings the swinging arm holding the jig 100, the jig 100 moves on the surface of the substrate along the radial direction of the substrate by drawing an arc locus.
Therefore, when the rotating device 32 rotates the substrate around the center of rotation and the rocking device 34 moves the jig 100 in the radial direction of the substrate, the jig 100 moves relative to the surface of the substrate 5. can.

For example, the scanning device 300 operates the swinging device 340 and the rotating device 320 in synchronization to exhibit the scanning function.

The lifting device 350 is a device that raises and lowers the swing arm of the swing device 340 in the vertical direction.
When the swing arm holding the jig 100 is moved up and down in the lifting device 350, the gap distance between the jig 100 and the surface of the substrate changes.

For example, the scanning device 300 operates the elevating device 350 to exert a stop function.
For example, the scanning device 300 operates the elevating device 350 to exert a position adjusting function.
For example, the scanning device 300 operates the elevating device 350 and the liquid supply device 200 in synchronization to exhibit the adhesion process.

A liquid recovery device (not shown) is a device that collects droplets adhering to the surface of a substrate.
The main structure of the liquid recovery device is the same as the main structure of the liquid supply device 20.
The liquid recovery device may collect the droplets by passing through the through hole H provided in the jig 100 when the scanning device 300 holds the droplets adhering to the surface of the substrate.
For example, in a liquid recovery device, when the jig 100 has a through hole H formed, the liquid recovery device sucks and collects droplets adhering to the surface of the substrate through the through hole H at the tip of the nozzle-shaped member.
Further, for example, in the liquid recovery device, after the scanning device 300 is retracted, the tip of the nozzle-shaped member may be brought close to the droplets adhering to the surface of the substrate, and the droplets may be sucked and collected.

For example, the scanning device 300 operates a liquid recovery device to exert a recovery function.

An example of the structure of the jig 100 according to the embodiment of the present invention will be described below.
The surface of the substrate 5 has an upper surface, a lower surface, and a side surface.
For convenience of explanation, it is assumed that the upper surface of the substrate is fixed so as to face upward, the jig is arranged above the upper surface, and gas is ejected from the opening O facing downward.

The jig 100 according to the embodiment of the present invention is composed of a jig main body 110, a jig outer peripheral member 120, and a jig inner peripheral member 130.
The jig body 110 is a member supported by the scanning device 300.
The jig inner peripheral member 130 is a member that forms the inner peripheral portion 131.
The jig outer peripheral member 120 is a member that forms the outer peripheral portion 121, and a jig inner peripheral fitting hole 122 that fits into the jig inner peripheral member 130 is formed.
The jig main body 110 forms a jig outer peripheral fitting hole 112 and a first gas passage E to be fitted to the jig outer peripheral member 120.
For example, the jig outer peripheral member 120 fits into the jig outer peripheral fitting hole 112 from below, and the jig outer peripheral fitting hole 112 fits into the jig outer peripheral member 120.
The jig body 110 is provided with a holder 113 to which the jig outer peripheral member 120 can be attached and detached.
The holder 113 may be a vacuum chuck.

When the jig main body 110 holds the jig outer peripheral member 120 by the holder 113, the second gas passage F is formed in the gap between the jig inner peripheral jig 130 and the jig outer peripheral member 120, and the first gas passage E and the first gas passage E are formed. The second gas passage F and the opening O may communicate with each other.
When the jig body 110 holds the jig outer peripheral member 120 by the holder 113, the jig inner peripheral member 130 fits into the jig inner peripheral fitting hole 122, and the jig inner peripheral jig 130 and the jig outer peripheral member A second gas passage F may be formed in the gap between the 120 and the first gas passage E, the second gas passage F, and the opening O may communicate with each other.
When the jig body 110 holds the jig outer peripheral member 120 by the holder 113, the jig outer peripheral member 120 fits into the jig outer peripheral fitting hole 112, and the jig inner peripheral member 130 fits into the jig inner peripheral fitting hole 112. The second gas passage F is formed in the gap between the jig inner peripheral jig 130 and the jig outer peripheral member 120 by fitting into the hole 122, and the first gas passage E, the second gas passage F, and the opening O communicate with each other. You may.

When the jig main body 110 holds the jig outer peripheral member 120 by the holder 113, the jig outer peripheral member 120 is fitted into the jig outer peripheral fitting hole 112, and the jig inner peripheral member 130 is fitted into the jig inner peripheral fitting hole. Fitted to 122, a second gas passage F is formed in a gap between the jig inner peripheral jig 130, the jig outer peripheral member 120, and the jig main body 110, and the first gas passage E, the second gas passage F, and the opening O are formed. May communicate with.

The second gas passage F is a cylindrical void that extends vertically and communicates with the opening at the lower end, and the gas passes through the first gas passage E, the second gas passage F, and the opening O in this order and is sprayed onto the surface of the substrate. Be done.

The second gas passage F is a cylindrical void having a constant outer diameter Ro and a constant inner diameter Ri, extending vertically and communicating with the opening O at the lower end, and the gas is the first gas passage E and the second gas passage F. It may pass through the openings O in this order and be sprayed on the surface of the substrate 5.

The jig outer peripheral member 120 may have a flange-shaped mounting portion 120U.
The jig body 110 may have a flange-shaped mounting portion 115.
When the jig main body 110 holds the jig outer peripheral member 120 by the holder 113, the jig outer peripheral member 120 is fitted into the jig outer peripheral fitting hole 112, and the flange-shaped mounting portion 120U of the jig outer peripheral member 120 is formed. The flange-shaped mounting portion 115 of the jig body 110 may be in close contact with the jig body 110.

The jig outer peripheral member 120 may have a flange-shaped mounting portion 120U on which one of a groove U or a protrusion T having an annular contour when viewed from above is formed on the upper surface.
For example, the jig outer peripheral member 120 has a flange-shaped mounting portion 120U on the upper surface on which a protrusion T having an annular contour when viewed from above is formed.
For example, the jig outer peripheral member 120 has a flange-shaped mounting portion 120U having a groove U having an annular contour when viewed from above on the upper surface.
The jig body 110 may be viewed from below on the lower surface.
For example, the jig body 110 has a flange-shaped mounting portion 115 on the lower surface on which a protrusion T having an annular contour when viewed from below is formed.
For example, the jig body 110 has a flange-shaped mounting portion 115 having a groove U having an annular contour when viewed from below on the lower surface.
When the jig main body 110 holds the jig outer peripheral member 120 by the holder 113, the jig outer peripheral member 120 is fitted into the jig outer peripheral fitting hole 112, and one of the groove U or the protrusion T of the jig outer peripheral member 120 is fitted. And the other of the groove U or the protrusion T of the jig body 110 are fitted, and the flange-shaped mounting portion 120U of the jig outer peripheral member 120 and the flange-shaped mounting portion 115 of the jig body 110 are in close contact with each other. good.

The gas supply device 140 is a device for supplying gas to the jig 100 and ejecting the gas from the opening O.
The piping of the gas supply device 140 communicates with the first gas passage E of the jig main body 110.
When the gas supply device 140 supplies the gas to the substrate processing jig, the gas is ejected from the opening O via the first gas passage E and the second gas passage F in order.
FIG. 5 shows how the gas supply device 140 supplies gas to the jig 100.

Hereinafter, the operation of the jig 100 according to the embodiment of the present invention will be described with reference to the drawings.
The jig 100 is held so that the opening O is directed toward the surface of the substrate 5 and the distance D1 between the surface of the substrate 5 and the end surface S is a predetermined distance, gas is ejected from the opening O, and the ejected gas is discharged from the substrate. Spray on the surface.
When the gas is blown from the opening O to the surface of the substrate by using the liquid supply device 200, the droplets pass through the through holes H and are dropped onto the surface of the substrate.
The end face S comes into contact with the droplets adhering to the surface of the substrate 5.
When the jig 100 is relatively moved along the surface of the substrate 5 while the jig is held so that the distance D1 between the surface of the substrate 5 and the end surface S is a predetermined distance, the droplets move the jig. The surface of the substrate 5 is moved accordingly.
If the droplet is a liquid that treats the surface of the substrate 5, the surface of the substrate 5 can be treated.

Next, the substrate processing method according to the embodiment of the present invention will be described with reference to the drawings.
FIG. 10 is a procedural diagram of the substrate processing method according to the embodiment of the present invention.

The substrate processing method according to the first embodiment includes a preparation step S10, a stop step S15, an adhesion step S20, a scanning step S40, a position adjustment step S45, a recovery step S50, and a measurement step S60.
For example, the stop step S15 and the adhesion step S20 are carried out in order, the scanning step S40 and the position adjustment step S45 are carried out at the same time, and then the recovery step S50 and the measurement step S60 are carried out in order.

The preparation step S10 is a step of preparing the jig 100 and the pressure sensor 15.
For example, in the preparation step S10, the jig 100, the pressure sensor 15, the liquid supply device 200, and the scanning device 300 are prepared.

The stop step S15 is when the jig is gradually approached to the surface of the substrate along the orthogonal direction of the surface of the substrate while ejecting gas from the opening, and the internal pressure matches the set pressure value which is the preset pressure value. This is the process of stopping the jig.
The set pressure value may be a pressure value obtained by multiplying the internal pressure when the opening is closed by a predetermined ratio.
The first flow rate may be such that the flow rate of the gas ejected from the opening when the stop step S15 is carried out is substantially constant.

The adhesion step S20 is a step of adhering the droplets to the surface of the substrate.
In the adhesion step S20, the jig is stopped and held so that the opening is directed toward the surface of the substrate, and when the gas ejected from the opening is sprayed onto the surface of the substrate, the droplets are placed at a position surrounded by the opening on the surface of the substrate. Attach.
For example, with the opening O facing the surface of the substrate 5 and holding the substrate recovery jig, the surface of the substrate passes through the through hole H when gas is ejected from the opening O toward the surface of the substrate 5. Droplets are dropped on the.
The second flow rate A2 may be such that the flow rate of the gas ejected from the opening when the adhesion step S20 is carried out is substantially constant.
The droplet P adheres to the surface of the substrate 5.
The amount of the liquid that forms the droplet P is defined as the amount that does not protrude from the space surrounded by the opening O.
The appropriate amount of the liquid that forms the droplet P is affected by the condition of the surface of the substrate, the viscosity of the liquid, the wettability of the surface of the substrate and the liquid, and the like.
For example, if the jig according to the embodiment of the present invention is used, the droplet P adheres to the end surface S of the inner peripheral portion 131.

In the scanning step S40, the substrate 5 is viewed from the direction orthogonal to the surface of the substrate 5, and the jig 100 is held so as to surround the droplet P adhering to the surface of the substrate 5 with the opening O, and the gas ejected from the opening O is discharged from the substrate. This is a step of moving the jig relative to the surface of the substrate while spraying it on the surface of the substrate 5.
In the scanning step S40, the end surface S is brought into contact with the droplet P attached to the surface of the substrate 5, the substrate is viewed from the direction orthogonal to the surface of the substrate 5, and the droplet P attached to the surface of the substrate 5 is surrounded by the opening O. The step may be a step of holding the jig 100 and blowing the gas ejected from the opening O onto the surface of the substrate 5 while relatively moving the jig 100 along the surface of the substrate 5.
The droplet P moves along the surface of the substrate 5.
If the droplet P is a liquid that processes the substrate 5, the surface of the substrate 5 is processed.
When the scanning step S20 is performed, the flow rate of the gas ejected from the opening may be a substantially constant third flow rate.

In the position adjusting step S45, the substrate 5 is viewed from the direction orthogonal to the surface of the substrate 5, and the jig 100 is held so as to surround the droplet P adhering to the surface of the substrate 5 with the opening O, and the gas ejected from the opening O is released. This is a step of adjusting the position of the surface of the jig substrate along the orthogonal direction so as to reduce the differential pressure between the internal pressure and the specific pressure value, which is a specific pressure value, while spraying the surface of the substrate 5.
The specific pressure value may be the pressure value of the internal pressure immediately after the adhesion step S20 is performed.
It is carried out at the same time as the scanning step S40 and the position adjusting step S45.

The recovery step S50 recovers the droplets adhering to the surface of the substrate 5.
For example, a dropper-shaped device is used to suck up the droplets adhering to the surface of the substrate 5.
For example, with the opening O facing the surface of the substrate 5 and holding the substrate recovery jig, the surface of the substrate passes through the through hole H when gas is ejected from the opening O toward the surface of the substrate 5. Collect the droplets adhering to the.
Further, for example, the jig 100 is retracted from the surface of the substrate, and a dropper-like device is used to suck up the droplets adhering to the surface of the substrate 5.

The measurement step S60 is a step of measuring the droplet P.
For example, the amount of metal atoms contained in the droplet P is measured.

When the substrate processing apparatus, the substrate processing method, and the jig 100 according to the above-described embodiment are used, the following effects are exhibited.
A gas is formed on the surface of the substrate 5 from an opening O having an annular contour formed by being sandwiched between the inner peripheral portion 131 forming the end surface S and the outer peripheral portion 121 surrounding the inner peripheral portion 131 when viewed from the surface side of the substrate 5. In the substrate processing apparatus in which the jig 100 for ejecting the gas is held by the scanning device 300 so as to surround the droplet P adhering to the surface of the substrate 5 with the opening O and relatively moved along the surface of the substrate 5, the opening O is formed. From the inner peripheral wall Wi, which is a wall that inclines so as to move away from the center of the annular contour of the opening O as the distance from the outer edge of the inner peripheral portion 131 is along the orthogonal direction of the surface of the substrate 5, and the inner edge of the outer peripheral portion 121. Since it is formed by the outer peripheral wall Wo, which is a wall that inclines so as to move away from the center of the annular contour of the opening O as it moves away along the orthogonal direction of the surface of the substrate 5, the gas is formed on the inner peripheral wall Wi of the opening O. The droplet P is blown out along the inclination from the gap sandwiched between the gas and the outer peripheral wall Wo and sprayed around the droplet P adhering to the surface of the substrate 5, and the droplet P is moved relative to the surface of the substrate 5 when the jig is moved relative to the surface of the substrate 5. Can be held stably.
With respect to the orthogonal direction orthogonal to the surface of the substrate 5 so that the opening O moves away from the center of the annular contour of the opening O as the opening O moves away from the outer edge of the inner peripheral portion 131 along the orthogonal direction of the surface of the substrate 5 over the entire circumference. As the distance from the inner peripheral wall Wi, which is a wall inclined at the first inclination angle θ1 which is a predetermined inclination angle, and the inner edge of the outer peripheral portion 121, along the orthogonal direction of the surface of the substrate 5, the ring shape of the opening O becomes annular. Since it is formed by the outer peripheral wall Wo, which is a wall inclined at a second inclination angle θ "2, which is a predetermined inclination angle with respect to the orthogonal direction orthogonal to the surface of the substrate 5 so as to move away from the center of the contour. , The gas is blown out along the inclination from the gap between the inner peripheral wall Wi inclined at the first inclination angle θ1 of the opening O and the outer peripheral wall Wo inclined at the second inclination angle θ2, and the droplet P adhering to the surface of the substrate 5. The droplet P can be stably held when the jig is relatively moved along the surface of the substrate 5 by spraying on the periphery of the substrate 5.
Since the second inclination angle θ2 is larger than the first inclination angle θ1, the gas is sandwiched between the inner peripheral wall Wi inclined at the first inclination angle θ1 of the opening O and the outer peripheral wall Wo inclined at the second inclination angle θ2. The droplet P can be stably held when the jig is relatively moved along the surface of the substrate 5 by being squeezed from the gap along the inclination and sprayed around the droplet P adhering to the surface of the substrate 5. ..
Since the gap distance D1 between the inner peripheral portion 131 and the surface of the substrate 5 is shorter than the gap distance D2 between the outer peripheral portion 121 and the surface of the substrate 5, the inner peripheral portion 131 is placed on the surface of the substrate 5. There is no possibility that the outer peripheral portion 121 will come into contact with the surface of the substrate 5 when approaching.
The jig inner peripheral member 131 forming the inner peripheral portion 131 is fitted into the jig inner peripheral fitting hole of the jig outer peripheral member 120 forming the peripheral portion, and the jig outer peripheral member 120 is supported by the scanning device 300. When the jig 113 is fitted into the jig outer peripheral fitting hole of the jig main body 110 from below and is fitted, and the holder 113 provided on the jig main body 110 holds the jig outer peripheral member 120, the jig main body 110 is formed. Since the second gas passage F formed in the gap between the first gas passage E, the outer peripheral member of the jig, and the inner peripheral jig of the jig communicates with the opening O, the gas is formed in the jig main body 110. It is sprayed from the gas passage E to the surface of the gas through the opening O through the second gas passage F formed in the gap between the jig outer peripheral member and the jig inner peripheral jig.
Since the second gas passage F is formed as a cylindrical gap that extends vertically and communicates with the opening O at the lower end, the gas has a cylindrical shape that extends vertically from the first gas passage E formed in the jig body 110. It is sprayed onto the surface of the gas from the opening O through the second gas passage F having the voids of.
Since the second gas passage F has a constant outer diameter Ro and a constant inner diameter Ri and is formed as a cylindrical void extending vertically and vertically and communicating with the opening O at the lower end, gas is formed in the jig body 110. It is sprayed onto the surface of the gas from the opening O through the second gas passage F having a cylindrical void having the same cross section extending vertically from the one gas passage E.
When the jig body 110 holds the jig outer peripheral member 120 by the holder and the jig outer peripheral member 120 is fitted into the jig outer peripheral fitting hole 112, the flange-shaped upper portion of the jig outer peripheral member 120 and the jig Since the flange-shaped lower portion of the main body 110 is brought into close contact with the jig main body 110, when the scanning device 300 relatively moves the jig main body 110 along the surface of the substrate 5, the jig outer peripheral member and the jig outer peripheral member 120 The jig inner peripheral member 130 fitted in the jig inner peripheral fitting hole 122 can move relative to the surface of the substrate 5.
When the jig main body 110 holds the jig outer peripheral member 120 by the holder and the jig outer peripheral member 120 is fitted into the jig outer peripheral fitting hole 112, it is formed with one of the groove U or the protrusion T of the jig outer peripheral member 120. The groove U of the jig body 110 or the other of the protrusions T is fitted so that the flange-shaped upper portion of the jig outer peripheral member 120 and the flange-shaped lower portion of the jig body 110 are in close contact with each other.
When the scanning device 300 relatively moves the jig main body 110 along the surface of the substrate 5, the jig main body 110 and the jig outer peripheral member 120 are in close contact with each other, and the jig outer peripheral member 120 and the jig outer peripheral member 120 are cured. The jig inner peripheral member 130 fitted in the tool inner peripheral fitting hole 122 can move relative to the surface of the substrate 5.

The present invention is not limited to the embodiments described above, and various modifications can be made without departing from the gist of the invention.
Although the jig has been described as being used for a substrate processing apparatus for processing a substrate, the jig is not limited to this, and can be used to hold droplets P adhering to the substrate for other purposes.

D1 Gap distance between the inner peripheral part and the surface of the substrate D2 Gap distance between the outer peripheral part and the surface of the substrate θ1 First inclination angle θ2 Second inclination angle E First gas passage F Second gas passage S End surface N End surface O Opening P Droplet Wi Inner peripheral wall W Outer peripheral wall H Through hole U Circular groove T Circular protrusion 5 Substrate 100 Jig 110 Jig body 112 Jig outer peripheral fitting hole 113 Holder 115 Jig body mounting part 120 Jig outer member 120u Jig outer peripheral member mounting part 121 Outer peripheral part 122 Jig inner peripheral fitting hole 130 Jig inner peripheral member 131 Inner peripheral part 132 Inner peripheral surface 140 Gas supply equipment 200 Liquid supply equipment 300 Scanning equipment 310 Base 320 Rotating equipment 330 Centering device 340 Shaking device 341 Terminal part 350 Lifting device S10 Preparation process S15 Stop process S20 Adhesion process S40 Scanning process S45 Position adjustment process S50 Recovery process S60 Measurement process

Japanese Patent Application Laid-Open No. 02-272359 Japanese Patent Application Laid-Open No. 02-028533 Japanese Patent Application Laid-Open No. 08-233709 Japanese Patent Application Laid-Open No. 02-229428 JP-A-2007-24509 JP-A-2010-040548 JP 2012-09475

Claims (14)

A substrate processing device that processes a substrate with droplets.
It has an inner peripheral portion that forms an end face at a position facing the surface of the substrate and an outer peripheral portion that surrounds the inner peripheral portion when viewed from the surface side of the substrate, and is sandwiched between the inner peripheral portion and the outer peripheral portion. A jig that can eject gas toward the surface of the substrate from an opening that has an annular contour when viewed from the surface side of the substrate.
While holding the jig so that the end surface is brought into contact with the droplets adhering to the surface of the substrate and the droplets adhering to the surface of the substrate are surrounded by the openings, the gas ejected from the openings is sprayed onto the surface of the substrate. A scanning device that moves the jig relative to the surface of the substrate, and
With
An inner peripheral wall and an inner edge of the outer peripheral portion, which is a wall that inclines so that the opening moves away from the center of the annular contour of the opening as the opening moves away from the outer edge of the inner peripheral portion along the orthogonal direction of the surface of the substrate. It is formed by an outer peripheral wall, which is a wall that inclines so as to move away from the center of the annular contour of the opening as it moves away from the surface of the substrate along the orthogonal direction.
A substrate processing apparatus comprising. A predetermined tilt angle with respect to the orthogonal direction orthogonal to the surface of the substrate so that the opening moves away from the outer edge of the inner peripheral portion along the orthogonal direction of the surface of the substrate and away from the center of the annular contour of the opening. As the distance from the inner peripheral wall, which is a wall inclined at the first inclination angle, and the inner edge of the outer peripheral portion along the orthogonal direction of the surface of the substrate, the surface of the substrate is moved away from the center of the annular contour of the opening. It is formed by an outer peripheral wall which is a wall inclined at a second inclination angle which is a predetermined inclination angle with respect to an orthogonal orthogonal direction.
The substrate processing apparatus according to claim 1. The second tilt angle is larger than the first tilt angle,
The substrate processing apparatus according to claim 2. The gap distance between the inner peripheral portion and the surface of the substrate is shorter than the gap distance between the outer peripheral portion and the surface of the substrate by a predetermined distance.
The substrate processing apparatus according to claim 3. The jig has a jig main body, a jig outer peripheral member, and a jig inner peripheral member.
The jig inner peripheral member is a member that forms the inner peripheral portion.
The jig outer peripheral member is a member forming the outer peripheral portion, and a jig inner peripheral fitting hole for fitting to the jig inner peripheral member is formed.
The jig main body is a member supported by the scanning device, a first gas passage is formed, and a holder for attaching / detaching the jig outer peripheral member is provided.
When the jig main body holds the jig outer peripheral member by the holder, the jig inner peripheral member is fitted into the jig inner peripheral fitting hole, and the jig inner peripheral member and the jig outer peripheral member are fitted. A second gas passage is formed in the gap between the members, and the first gas passage, the second gas passage, and the opening communicate with each other.
The substrate processing apparatus according to claim 4. The second gas passage is a cylindrical void that extends vertically and communicates with the opening at the lower end, and gas passes through the first gas passage, the second gas passage, and the opening in this order to reach the surface of the substrate. Be blown,
The substrate processing apparatus according to claim 5. The second gas passage is a cylindrical void having a constant outer diameter and a constant inner diameter, extending vertically and communicating with the opening at the lower end, and the gas is the first gas passage, the second gas passage, and the opening. It passes through in order and is sprayed on the surface of the substrate.
The substrate processing apparatus according to claim 6. The jig outer peripheral member has a flange-shaped mounting portion and has a flange-like mounting portion.
The jig body has a flange-shaped mounting portion and has a flange-like mounting portion.
When the jig body holds the jig outer peripheral member by the holder, the flange-shaped mounting portion of the jig outer peripheral member and the flange-shaped mounting portion of the jig body are in close contact with each other.
The substrate processing apparatus according to claim 7. The jig outer peripheral member has a flange-shaped mounting portion on the upper surface on which one of a groove or a protrusion having an annular contour when viewed from above is formed.
The jig body has a flange-like mounting portion on the lower surface on which the other side of a groove or protrusion having an annular contour when viewed from below is formed.
When the jig main body holds the jig outer peripheral member by the holder, one of the groove or the protrusion of the jig outer peripheral member and the other of the groove or the protrusion of the jig main body are fitted. Therefore, the flange-shaped mounting portion of the jig outer peripheral member and the flange-shaped lower portion of the jig body are in close contact with each other.
The substrate processing apparatus according to claim 8. The jig has a jig main body, a jig outer peripheral member, and a jig inner peripheral member.
The jig inner peripheral member is a member that forms the inner peripheral portion.
The jig outer peripheral member is a member forming the outer peripheral portion, and a jig inner peripheral fitting hole for fitting to the jig inner peripheral member is formed.
The jig main body is a member supported by the scanning device, a first gas passage is formed, and a holder for attaching / detaching the jig outer peripheral member is provided.
When the jig main body holds the jig outer peripheral member by the holder, the jig inner peripheral member is fitted into the jig inner peripheral fitting hole, and the jig inner peripheral member and the jig outer peripheral member are fitted. A second gas passage is formed in the gap between the members, and the first gas passage, the second gas passage, and the opening communicate with each other.
The substrate processing apparatus according to claim 1. The second gas passage is a cylindrical void that extends vertically and communicates with the opening at the lower end, and gas passes through the first gas passage, the second gas passage, and the opening in this order to reach the surface of the substrate. Be blown,
The substrate processing apparatus according to claim 10. The second gas passage is a cylindrical void having a constant outer diameter and a constant inner diameter, extending vertically and communicating with the opening at the lower end, and the gas is the first gas passage, the second gas passage, and the opening. It passes through in order and is sprayed on the surface of the substrate.
The substrate processing apparatus according to claim 11. The jig outer peripheral member has a flange-shaped mounting portion and has a flange-like mounting portion.
The jig body has a flange-shaped mounting portion and has a flange-like mounting portion.
When the jig body holds the jig outer peripheral member by the holder, the flange-shaped mounting portion of the jig outer peripheral member and the flange-shaped mounting portion of the jig body are in close contact with each other.
The substrate processing apparatus according to claim 1. The jig outer peripheral member has a flange-shaped mounting portion on the upper surface on which one of a groove or a protrusion having an annular contour when viewed from above is formed.
The jig body has a flange-like mounting portion on the lower surface on which the other side of a groove or protrusion having an annular contour when viewed from below is formed.
When the jig main body holds the jig outer peripheral member by the holder, one of the groove or the protrusion of the jig outer peripheral member and the other of the groove or the protrusion of the jig main body are fitted. Therefore, the flange-shaped mounting portion of the jig outer peripheral member and the flange-shaped lower portion of the jig body are in close contact with each other.
The substrate processing apparatus according to claim 13.

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