JP5568201B2 - Substrate processing method and substrate processing apparatus - Google Patents

Description

  The present invention relates to a substrate processing method and a substrate processing apparatus for processing a substrate for processing the substrate. In particular, the present invention relates to a substrate processing method and a substrate processing apparatus characterized by a method and configuration for processing a surface of a substrate with droplets.

A substrate processing method is implemented to process the surface of a substrate with droplets.
A substrate processing apparatus is used to process the surface of the substrate with droplets.
A jig is used to hold droplets attached to the surface of the substrate when the substrate is processed.
When the surface of the substrate is hydrophobic to the droplet, the droplet attached to the surface of the substrate is held by an existing jig.
When the surface of the substrate is hydrophilic, the droplets try to spread along the surface of the substrate, so that it is difficult to hold the droplets adhering to the surface of the substrate as one unit.
When the surface of the substrate is rough due to an etching process or the like, the droplets are caught by fine irregularities on the surface of the substrate, so it is difficult to hold the droplets adhering to the surface of the substrate as one unit, It is difficult to move the droplet along the surface of the substrate.
For example, a substrate processing apparatus is used in a semiconductor or liquid crystal manufacturing facility or inspection facility.
The substrate processing apparatus is an apparatus that processes a substrate. For example, the substrate is a substrate such as a semiconductor wafer, a sapphire wafer, a liquid crystal substrate, or a mask substrate. The semiconductor wafer is a wafer of silicon, gallium, silicon carbide or the like.
The substrate processing apparatus is used when accurately measuring the amount of impurities such as sodium, potassium and iron contained in the surface of the substrate.
The substrate processing apparatus is used when the surface of the substrate is etched.

For example, the purpose and method for accurately measuring impurities on the surface of a semiconductor wafer will be briefly described.
If an impurity is contained in a thin film such as an oxide film or a nitride film formed on the surface of a semiconductor wafer, even if the amount of the impurity is very small, the electrical characteristics of the semiconductor element are greatly affected.
Accordingly, there is a demand for suppressing the contamination of impurities from the wafer surface as much as possible in a semiconductor device manufacturing facility.
For this purpose, the amount of impurities present on the surface of the semiconductor wafer is accurately measured.

Instead of secondary ion mass spectrometry, Auger spectroscopy, or neutron activation analysis, which has recently been used to measure the amount of impurities present on the wafer surface, it has a fluoride solution, and the amount of impurities Measure. For example, the fluoride solution is an aqueous HF (hydrogen fluoride) solution.
After the oxide film on the surface of the silicon wafer is dissolved in an HF (hydrogen fluoride) aqueous solution, the HF (hydrogen fluoride) aqueous solution is collected and the impurities in the HF (hydrogen fluoride) aqueous solution are analyzed. Done. When the amount of the collected HF (hydrogen fluoride) aqueous solution is small, the impurity concentration increases, and the measurement accuracy is improved.
For example, after exposing the substrate to the vapor of HF (hydrogen fluoride) aqueous solution and dissolving the oxide layer of the substrate, a droplet of HF (hydrogen fluoride) aqueous solution is dropped on the surface of the substrate, and the droplet is applied to the substrate. Move while attached to the surface. Impurities in the oxide film are collected in the droplets. The amount of impurities on the substrate surface is inspected by measuring the amount of impurities in the droplet.
For example, the amount of impurities in a fluoride solution droplet is measured by an ICP mass analyzer.

In the above case, the substrate processing apparatus is used to drop droplets on the surface of the substrate, and a jig or the like is used to scan the droplets on the surface of the substrate, thereby dissolving the oxide layer on the surface of the scanned region.
Since the silicon wafer and the HF (hydrogen fluoride) aqueous solution have a hydrophobic relationship, droplets of the HF (hydrogen fluoride) aqueous solution become spherical on the surface of the silicon wafer. When the spherical droplet is held and moved by a jig, the droplet can be moved along a predetermined locus on the surface of the substrate very easily.

However, if the surface of the silicon wafer is after the etching process, there are fine irregularities on the surface, making it difficult to hold and move the droplets on the surface of the substrate.
In addition, when the substrate and the droplet are in a hydrophilic relationship, it becomes more difficult to move the droplet while holding the droplet on the surface of the substrate.
For example, the surface of a sapphire wafer is hydrophilic.
In consideration of the above circumstances, the inventor applied droplets adhering to the surface of the substrate without being affected by differences in hydrophobicity and hydrophilicity and differences in surface roughness of the substrate. An attempt was made to devise a method and structure capable of holding, and an attempt to devise a method and structure capable of relatively moving droplets along the surface of the substrate.

  The present invention has been devised in view of the problems described above, and intends to provide a substrate processing method and a substrate processing apparatus for processing a surface of a substrate with droplets with a simple configuration.

  In order to achieve the above object, a substrate processing method for processing a substrate according to the present invention with liquid droplets is formed by forming a single or a plurality of openings provided along a circular imaginary line so that gas can be ejected from the openings. And a preparatory process for preparing a pressure sensor for detecting the internal pressure of the gas jetted from the opening and the liquid adhering to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate While holding the jig so as to surround the droplet with the opening and blowing the gas ejected from the opening onto the surface of the substrate, the differential pressure between the internal pressure and the specific pressure value, which is a specific pressure value, is reduced. A position adjusting step for adjusting the position of the jig along the direction orthogonal to the surface of the substrate, and the treatment is performed so that the droplets attached to the surface of the substrate viewed from the direction orthogonal to the surface of the substrate are surrounded by the opening. Hold the tool and spray from the opening A scanning step for relatively moving along the jig while blowing out gas on the surface of the substrate on the surface of the substrate, and intended to comprise a.

With the above-described configuration of the present invention, the jig is formed with one or a plurality of openings provided along a circular imaginary line, and gas can be ejected from the openings. A pressure sensor detects the internal pressure inside the jig of the gas ejected from the opening. The position adjustment process holds the jig so as to surround the droplets adhering to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate, and blows the gas ejected from the opening onto the surface of the substrate. However, the position along the orthogonal direction of the surface of the substrate of the jig is adjusted so as to reduce the differential pressure between the internal pressure and the specific pressure value which is a specific pressure value. While the scanning process sees the substrate from the direction orthogonal to the surface of the substrate, while holding the jig so as to surround the droplets adhering to the surface of the substrate surrounded by the opening, while blowing the gas ejected from the opening to the surface of the substrate The jig is relatively moved along the surface of the substrate.
As a result, while keeping the separation distance between the jig and the surface of the substrate to a certain extent, the gas blown from the opening is blown to the surface of the substrate so as to surround the droplets attached to the surface of the substrate, and relatively moved, The droplets can be relatively moved along the surface of the substrate.

  Hereinafter, a plurality of substrate processing methods according to embodiments of the present invention will be described. The present invention includes any of the embodiments described below, or a combination of two or more of them.

In order to achieve the above object, a substrate processing method according to the present invention for processing a substrate with droplets is such that the jig is formed with an annular opening and gas can be ejected from the opening.
By the structure of the said embodiment, a jig | tool forms an annular opening and it becomes possible to eject gas from the said opening.
As a result, while keeping the separation distance between the jig and the surface of the substrate to a certain extent, the gas blown from the opening is blown to the surface of the substrate so as to surround the droplets attached to the surface of the substrate, and relatively moved, The droplets can be relatively moved along the surface of the substrate.

Furthermore, in the substrate processing method according to the embodiment of the present invention, the jig has an end surface part that forms an end surface surrounded by the opening, and the scanning step attaches the end surface to the surface of the substrate. The jig is held so as to surround the droplet attached to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate in contact with the droplet, and the gas blown from the opening is blown onto the surface of the substrate. The jig is relatively moved along the surface of the substrate.
According to the configuration of the above embodiment, the jig has an end surface portion that forms an end surface surrounded by the opening. The scanning step holds the jig so that the end surface is brought into contact with a droplet attached to the surface of the substrate and the droplet attached to the surface of the substrate is surrounded by the opening when viewed from the direction orthogonal to the surface of the substrate. Then, the jig is relatively moved along the surface of the substrate while the gas blown from the opening is blown onto the surface of the substrate.
As a result, while maintaining a certain distance between the jig and the surface of the substrate, the gas blown from the opening is blown onto the surface of the substrate so as to surround the droplet attached to the surface of the substrate, and the end surface is dropped. The liquid droplets can be moved relative to each other along the surface of the substrate.

Furthermore, in the substrate processing method according to the embodiment of the present invention, the internal pressure is set in advance by causing the jig to gradually approach the surface of the substrate along a direction orthogonal to the surface of the substrate while ejecting gas from the opening. And a stop step of stopping the jig when the pressure value matches the set pressure value.
According to the configuration of the above embodiment, in the stopping process, the internal pressure is set at a preset pressure value by causing the jig to gradually approach the surface of the substrate along the direction orthogonal to the surface of the substrate while ejecting gas from the opening. The jig is stopped when it matches a certain set pressure value.
As a result, the jig can be stopped by setting the distance between the jig and the surface of the substrate to a predetermined distance corresponding to the set pressure.

Further, in the substrate processing method according to the embodiment of the present invention, the set pressure value is a pressure value obtained by multiplying the internal pressure when the opening is temporarily closed by a predetermined ratio.
With the configuration of the above embodiment, the set pressure value is a pressure value obtained by multiplying the internal pressure when the opening is temporarily closed by a predetermined ratio.
As a result, the jig can be stopped by setting the distance between the jig and the surface of the substrate to a predetermined distance corresponding to the set pressure.

Furthermore, in the substrate processing method according to the embodiment of the present invention, the opening is directed toward the surface of the substrate, the jig is stopped and held, and the liquid ejected from the opening is sprayed onto the surface of the substrate. Is attached to a position surrounded by the opening on the surface of the substrate, and the specific pressure value is a pressure value of the internal pressure immediately after the attachment step is performed.
According to the configuration of the above-described embodiment, in the attaching process, the opening is directed toward the surface of the substrate, the jig is stopped and held, and the gas blown out from the opening is sprayed on the surface of the substrate. It is made to adhere to the position enclosed by the said opening of the surface. The specific pressure value is a pressure value of the internal pressure immediately after the attachment process is performed.
As a result, if the position along the orthogonal direction of the jig is adjusted so as to reduce the differential pressure between the internal pressure and the specific pressure value, the distance between the jig and the substrate can be maintained at the distance in the attaching step.

Furthermore, in the substrate processing method according to the embodiment of the present invention, the flow rate of the gas ejected from the opening when the stop process is performed is a first flow rate, and the opening is performed when the attaching process is performed. The second flow rate has a substantially constant flow rate of gas ejected from the first flow rate, and the first flow rate and the second flow rate are different.
With the configuration of the above embodiment, the flow rate of the gas ejected from the opening when the stop step is performed is a first flow rate that is substantially constant. The second flow rate is such that the flow rate of the gas ejected from the opening when performing the attaching step is substantially constant. The first flow rate and the second flow rate are different.
As a result, it is possible to select a first flow rate suitable for setting the distance between the jig to be stopped in the stopping step and the surface of the substrate to a desired accuracy, and for attaching droplets to the surface of the substrate in the attaching step. A suitable second flow rate can be selected.

Furthermore, in the substrate processing method according to the embodiment of the present invention, the flow rate of the gas ejected from the opening when the attaching step is performed is a second flow rate that is substantially constant, and the opening is performed when the scanning step is performed. The third flow rate is a substantially constant third flow rate, and the second flow rate and the third flow rate are different.
With the configuration of the above embodiment, the flow rate of the gas ejected from the opening when the attaching step is performed is a second flow rate that is substantially constant. The flow rate of the gas ejected from the opening when the scanning step is performed is a substantially constant third flow rate. The second flow rate and the third flow rate are different.
As a result, a second flow rate suitable for adhering to the surface of the substrate in the attaching step can be selected, and a third flow rate suitable for maintaining the distance between the jig and the surface of the substrate can be selected in the scanning step.

  In order to achieve the above object, a substrate inspection apparatus for processing a substrate according to the present invention with droplets is formed with one or a plurality of openings provided along a circular imaginary line, and gas can be ejected from the openings. A jig, a pressure sensor for detecting an internal pressure of the gas ejected from the opening, and a droplet attached to the surface of the substrate when viewed from a direction orthogonal to the surface of the front substrate. While holding the jig so as to be surrounded by a gas, the pressure of the jig is reduced so as to reduce the differential pressure between the internal pressure and a specific pressure value which is a specific pressure value while blowing the gas blown out from the opening onto the surface of the substrate. The position along the direction orthogonal to the surface of the substrate can be adjusted, and the jig is held so as to surround the droplet attached to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate with the opening. The gas ejected from the opening A scanning device capable of allowing relative movement along the jig surface of the substrate while spraying the was intended to comprise a.

With the above-described configuration of the present invention, the jig is formed with one or a plurality of openings provided along a circular imaginary line, and gas can be ejected from the openings.
The scanning device holds the jig so as to surround droplets adhering to the surface of the substrate when viewed from the direction orthogonal to the surface of the front substrate with the opening, and the gas ejected from the opening onto the surface of the substrate. The position along the orthogonal direction of the surface of the board | substrate of the said jig | tool can be adjusted so that the differential pressure | voltage of the said internal pressure and the specific pressure value which is a specific pressure value may be made small while spraying. The scanning device sprays the gas ejected from the opening while holding the jig so as to surround the opening with droplets adhering to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate. However, the jig can be relatively moved along the surface of the substrate.
As a result, while keeping the separation distance between the jig and the surface of the substrate to a certain extent, the gas blown from the opening is blown to the surface of the substrate so as to surround the droplets attached to the surface of the substrate, and relatively moved, The droplets can be relatively moved along the surface of the substrate.

  A plurality of substrate processing apparatuses according to embodiments of the present invention will be described below. The present invention includes any of the embodiments described below, or a combination of two or more of them.

In order to achieve the above object, in the substrate inspection apparatus for processing a substrate according to the present invention with droplets, the jig is formed with an annular opening, and gas can be ejected from the opening.
By the structure of the said embodiment, a jig | tool forms an annular opening and it becomes possible to eject gas from the said opening.
As a result, while keeping the separation distance between the jig and the surface of the substrate to a certain extent, the gas blown from the opening is blown to the surface of the substrate so as to surround the droplets attached to the surface of the substrate, and relatively moved, The droplets can be relatively moved along the surface of the substrate.

Furthermore, in the substrate processing apparatus according to the embodiment of the present invention, the jig has an end surface portion that forms an end surface surrounded by the opening, and the scanning device attaches the end surface to the surface of the substrate. The jig is held so as to surround the droplet attached to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate in contact with the droplet, and the gas blown from the opening is blown onto the surface of the substrate. However, the jig can be relatively moved along the surface of the substrate.
According to the configuration of the above embodiment, the jig has an end surface portion that forms an end surface surrounded by the opening. The scanning device holds the jig so that the end surface is brought into contact with a droplet attached to the surface of the substrate and the droplet attached to the surface of the substrate is surrounded by the opening when viewed from the direction orthogonal to the surface of the substrate. Then, the jig can be relatively moved along the surface of the substrate while the gas blown from the opening is blown onto the surface of the substrate.
As a result, while maintaining a certain distance between the jig and the surface of the substrate, the gas blown from the opening is blown onto the surface of the substrate so as to surround the droplet attached to the surface of the substrate, and the end surface is dropped. The liquid droplets can be moved relative to each other along the surface of the substrate.

Furthermore, in the substrate processing apparatus according to the embodiment of the present invention, the scanning device causes the jig to gradually approach the surface of the substrate along the direction orthogonal to the surface of the substrate while ejecting gas from the opening. The jig is stopped when it matches the set pressure value which is a preset pressure value.
With the configuration of the above embodiment, the scanning device gradually approaches the surface of the substrate along the direction orthogonal to the surface of the substrate while blowing the gas from the opening, and the internal pressure is set at a preset pressure value. The jig is stopped when it matches a certain set pressure value.
As a result, the jig can be stopped by setting the distance between the jig and the surface of the substrate to a predetermined distance corresponding to the set pressure.

Furthermore, in the substrate processing apparatus according to the embodiment of the present invention, the set pressure value is a pressure value obtained by multiplying the internal pressure when the opening is closed by a predetermined ratio.
With the configuration of the above embodiment, the set pressure value is a pressure value obtained by multiplying the internal pressure when the opening is temporarily closed by a predetermined ratio.
As a result, the jig can be stopped by setting the distance between the jig and the surface of the substrate to a predetermined distance corresponding to the set pressure.

Further, in the substrate processing apparatus according to the embodiment of the present invention, the specific pressure value is determined so that the scanning device holds the opening with the opening facing the surface of the substrate, stops the jig, and discharges the gas ejected from the opening to the substrate. It is the pressure value of the internal pressure immediately after the droplet is attached to the position surrounded by the opening on the surface of the substrate when spraying on the surface.
According to the configuration of the above embodiment, the specific pressure value is set when the scanning device holds the opening with the opening facing the surface of the substrate, stops the jig, and blows the gas ejected from the opening onto the surface of the substrate. It is the pressure value of the internal pressure immediately after a droplet is attached to a position surrounded by the opening on the surface of the substrate.
As a result, if the position along the orthogonal direction of the jig is adjusted so as to reduce the differential pressure between the internal pressure and the specific pressure value, the distance between the jig and the substrate can be maintained at the distance in the attaching step.

Further, in the substrate processing apparatus according to the embodiment of the present invention, the internal pressure is set in advance by causing the scanning apparatus to gradually approach the surface of the substrate along the direction orthogonal to the surface of the substrate. When the set pressure value is reached, the flow rate of the gas ejected from the opening until the jig is stopped is a first flow rate, and the scanning device directs the opening toward the surface of the substrate and the jig. The flow rate of the gas ejected from the opening until the droplet is attached to the position surrounded by the opening on the surface of the substrate when the gas ejected from the opening is sprayed on the surface of the substrate Is a second flow rate that is substantially constant, and the first flow rate and the second flow rate are different.
With the configuration of the above embodiment, when the scanning device gradually brings the jig closer to the surface of the substrate along the direction orthogonal to the surface of the substrate, the internal pressure becomes a preset pressure value that is a preset pressure value. The first flow rate is such that the flow rate of the gas ejected from the opening until the jig is stopped is substantially constant. When the scanning device holds the jig with the opening facing the surface of the substrate and stops and holds the gas blown from the opening onto the surface of the substrate, a droplet is surrounded by the opening on the surface of the substrate. The second flow rate is such that the flow rate of the gas ejected from the opening is substantially constant until it adheres to the position. The first flow rate and the second flow rate are different.
As a result, it is possible to select a first flow rate suitable for setting the distance between the jig to be stopped in the stopping step and the surface of the substrate to a desired accuracy, and for attaching droplets to the surface of the substrate in the attaching step. A suitable second flow rate can be selected.

Furthermore, in the substrate processing apparatus according to the embodiment of the present invention, the scanning device holds the jig with the opening directed toward the surface of the substrate, stops the jig, and blows the gas ejected from the opening onto the surface of the substrate. The second flow rate is such that the flow rate of the gas ejected from the opening is substantially constant before the droplet is attached to the position surrounded by the opening on the surface of the substrate, and the scanning device is orthogonal to the surface of the substrate. The jig is held along the surface of the substrate while holding the jig so as to surround the liquid droplets adhering to the surface of the substrate when viewed from the direction with the opening and blowing the gas blown from the opening onto the surface of the substrate. Until the relative movement, the flow rate of the gas ejected from the opening is a substantially constant third flow rate, and the second flow rate and the third flow rate are different.
With the configuration of the above embodiment, when the scanning device holds the jig with the opening facing the surface of the substrate and holds the jig, and sprays the gas ejected from the opening on the surface of the substrate, the liquid droplets are ejected from the substrate. This is a second flow rate in which the flow rate of the gas ejected from the opening is substantially constant until it adheres to the position surrounded by the opening on the surface. While the scanning device sees the substrate from a direction orthogonal to the surface of the substrate and holds the jig so as to surround the droplet attached to the surface of the substrate with the opening, the gas blown out from the opening is blown onto the surface of the substrate The flow rate of the gas ejected from the opening until the jig is relatively moved along the surface of the substrate is a third flow rate that is substantially constant. The second flow rate and the third flow rate are different.
As a result, a second flow rate suitable for adhering to the surface of the substrate in the attaching step can be selected, and a third flow rate suitable for maintaining the distance between the jig and the surface of the substrate can be selected in the scanning step.

As described above, the substrate processing method and the substrate processing apparatus according to the present invention have the following effects due to their configurations.
A jig capable of ejecting gas from one or a plurality of openings provided along a circular imaginary line and a pressure sensor for detecting the internal pressure of the gas inside the jig are prepared, and the internal pressure is the specified Adjust the position along the orthogonal direction of the substrate surface of the jig so as to approach the pressure value, and hold the jig so as to surround the droplet attached to the surface of the substrate with the opening, and the gas spouted from the opening Since the jig is relatively moved along the surface of the substrate while spraying the surface of the substrate, the gas blown out from the opening is kept constant while maintaining a certain distance between the jig and the surface of the substrate. The droplets attached to the surface of the substrate are sprayed on the surface of the substrate so as to surround the droplets, and the droplets can be relatively moved along the surface of the substrate.
Also, a jig capable of ejecting gas from the annular opening and a pressure sensor for detecting the internal pressure of the gas inside the jig are prepared, and the jig substrate is arranged so that the internal pressure approaches the specific pressure value. Adjust the position along the orthogonal direction of the surface, hold the jig so that the droplets adhering to the surface of the substrate are surrounded by the opening, and blow the gas ejected from the opening to the surface of the substrate Since the relative movement is performed along the surface of the substrate, the gas blown out from the opening is surrounded by the droplet attached to the surface of the substrate while keeping the distance between the jig and the surface of the substrate constant. The liquid droplets can be relatively moved along the surface of the substrate.
In addition, the end surface portion of the jig forms an end surface surrounded by the opening, and the position along the orthogonal direction of the substrate surface of the jig is adjusted so that the internal pressure approaches the specific pressure value. Holding the jig whose end face is in contact with the droplet so that the droplet adhering to the opening is surrounded by the opening and blowing the gas blown from the opening onto the surface of the substrate, the jig is moved along the surface of the substrate. Since the relative movement is performed, the gas blown out from the opening is blown onto the surface of the substrate so as to surround the droplets adhering to the surface of the substrate while maintaining a certain distance between the jig and the surface of the substrate. Thus, the end face is brought into contact with the droplet and moved relatively, and the droplet can be moved relatively along the surface of the substrate.
In addition, the jig is brought close to the surface of the substrate along the orthogonal method, and the jig is stopped when the internal pressure matches the set pressure value. Therefore, the distance between the jig and the surface of the substrate is set to the set pressure. The jig can be stopped at a corresponding predetermined distance.
Further, since the set pressure value is a pressure value obtained by multiplying the internal pressure when the opening is closed by a predetermined ratio, the distance between the jig and the surface of the substrate is a predetermined distance corresponding to the set pressure. The jig can be stopped.
Further, when the jig is stopped and held with the opening directed toward the surface of the substrate and the gas blown out from the opening is sprayed on the surface of the substrate, a droplet is surrounded by the opening on the surface of the substrate. Since the value of the internal pressure immediately after adhering to the liquid droplet is set as the specific pressure value, it is aligned along the orthogonal direction of the jig so as to reduce the differential pressure between the internal pressure and the specific pressure value. When the position is adjusted, the distance between the jig and the substrate can be maintained at the distance in the attaching process.
When the jig is gradually approached to the surface of the substrate along the orthogonal direction while jetting gas from the opening at the first flow rate, and the internal pressure matches a preset pressure value that is a preset pressure value The position of the droplet surrounded by the opening on the surface of the substrate when the jig is stopped and held and the gas ejected from the opening at the second flow rate is sprayed on the surface of the substrate. Because the first flow rate and the second flow rate are different from each other,
A first flow rate suitable for setting the distance between the jig to be stopped in the stopping step and the surface of the substrate to a desired accuracy can be selected, and a first flow rate suitable for attaching droplets to the surface of the substrate in the attaching step. Two flow rates can be selected.
Further, the jig is stopped and held with the opening directed toward the surface of the substrate, and when the gas blown out from the opening at the second flow rate is blown onto the surface of the substrate, a droplet is dropped on the surface of the substrate. The jig is held at the third flow rate from the opening by holding the jig so that droplets attached to the surface of the substrate are surrounded by the opening when viewed from the direction orthogonal to the surface of the substrate. Since the jig is relatively moved along the surface of the substrate while blowing the jetted gas onto the surface of the substrate, a second flow rate suitable for attaching to the surface of the substrate in the attaching step can be selected, A third flow rate suitable for maintaining the distance between the jig and the surface of the substrate in the scanning process can be selected.
Therefore, it is possible to provide a substrate processing method and a substrate processing apparatus that process the surface of the substrate with droplets with a simple configuration.

It is a top view of the substrate processing apparatus concerning the embodiment of the present invention. 1 is a front view of a substrate processing apparatus according to an embodiment of the present invention. 1 is a side view of a substrate processing apparatus according to an embodiment of the present invention. It is a side view of the jig concerning a first embodiment of the present invention. It is a bottom view of the jig concerning a first embodiment of the present invention. It is a side view of the jig | tool which concerns on 2nd embodiment of this invention. It is a side view of the jig | tool which concerns on 3rd embodiment of this invention. It is a side view of the jig | tool which concerns on 4th embodiment of this invention. It is a procedure figure of the substrate processing method concerning a first embodiment of the present invention. It is a procedure figure of the substrate processing method concerning a second embodiment of the present invention.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

First, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a front view of the substrate processing apparatus according to the embodiment of the present invention. FIG. 3 is a side view of the substrate processing apparatus according to the embodiment of the present invention. FIG. 4 is a side cross-sectional view of the jig according to the first embodiment of the present invention. FIG. 5 is a bottom view of the jig according to the first embodiment of the present invention.

  The substrate processing apparatus is an apparatus that processes a substrate with droplets, and includes a jig 10, a pressure sensor 15, a liquid supply device 20, a scanning device 30, and a liquid recovery device (not shown).

The jig 10 is a jig for holding droplets attached to the substrate.
The jig 10 is formed by forming a single or a plurality of openings provided along a circular imaginary line, and ejecting the gas from the opening and the jig that can eject the gas from the opening.
For example, the jig 10 is formed by forming a single opening provided along a circular imaginary line and ejecting gas from the opening and the jig that can eject gas from the opening.
For example, the jig 10 is formed by forming a plurality of openings arranged along a circular imaginary line, and ejecting the gas from the openings and the jig that can eject the gas from the openings.
The jig 10 blows the gas blown from the opening O onto the surface of the substrate while holding the droplet P attached to the surface of the substrate 5 as viewed from the direction orthogonal to the surface of the substrate 5 so as to be surrounded by the opening. It can be done.
The jig 10 spouts from the opening O in a state where the droplet P adhering to the surface of the substrate 5 as viewed from the direction orthogonal to the surface of the substrate 5 is held so as to be surrounded by the opening provided along the virtual line. Gas can be sprayed onto the surface of the substrate.

The jig 10 may be one in which an annular opening O is formed and gas can be ejected from the opening O. The jig 10 sees the substrate 5 from the direction orthogonal to the surface of the substrate 5, and keeps the droplet P adhering to the surface of the substrate surrounded by the opening O so that the gas blown from the opening O is applied to the surface of the substrate. You may be able to spray.
For example, the outer peripheral portion forms the outer periphery of the opening O, and the inner peripheral portion forms the inner periphery of the opening.

The jig 10 may have an end surface portion that forms the end surface S, an annular opening O that surrounds the periphery of the end surface, and a gas that can be ejected from the opening O. The jig 10 contacts the droplet P attached to the surface of the substrate 5 with the end face so that the droplet P attached to the surface of the substrate 5 is surrounded by the opening O when viewed from the direction orthogonal to the surface of the substrate 5. The gas ejected from the opening O while being held can be blown onto the surface of the substrate.
For example, the outer peripheral portion forms the outer periphery of the opening O, and the end surface portion forms the inner periphery of the opening.
For example, the outer peripheral portion forms the outer periphery of the opening O, the inner peripheral portion forms the inner periphery of the opening, and the end surface is located inside the inner peripheral portion.

The jig 10 may be one in which a C-shaped opening O is formed and gas can be ejected from the opening O. The jig 10 can spray the gas ejected from the opening on the surface of the substrate while holding the droplets attached to the surface of the substrate as viewed from the direction orthogonal to the surface of the plate. ing. When the jig 10 is relatively moved along the surface of the substrate, the C-shaped opening O may be positioned behind the locus of relative movement of the jig.
The jig 10 may have an end surface portion that forms an end surface, a C-shaped opening O that surrounds the periphery of the end surface, and a gas that can be ejected from the opening O.

The jig 10 may be formed with a plurality of openings arranged along a circular imaginary line and capable of ejecting gas from the plurality of openings. The jig 10 sees the substrate from the direction orthogonal to the surface of the substrate, and keeps the droplets adhering to the surface of the substrate surrounded by the plurality of openings so that the gas ejected from the plurality of openings is applied to the surface of the substrate. It may be possible to spray.
The jig 10 may have an end surface portion that forms an end surface, and a plurality of openings arranged along a circular imaginary line surrounding the end surface may be formed, and gas may be ejected from the plurality of openings. .

The jig 10 has a through hole H formed on the inner side surrounded by the opening O, and when the gas blown from the opening O is blown to the surface of the substrate while the opening O is held toward the surface of the substrate. A droplet may be attached to the surface of the substrate through the through hole.
For example, the jig 10 has a through hole H formed on the inner side surrounded by the opening O, holds the jig with the opening O facing the surface of the substrate, and blows the gas ejected from the opening O onto the surface of the substrate. At this time, it may be configured such that droplets can be dropped and adhered to the surface of the substrate through the through hole.
For example, the through hole H passes through the middle of the end surface, and the tip of the nozzle-like member passes through the through-hole H to approach the surface of the substrate, so that liquid is applied from the tip of the nozzle-like member to the surface of the substrate. The droplet is dropped and attached to the surface of the substrate.

The jig 10 has a through-hole H formed inside the opening O, and blows a gas blown from the opening O onto the surface of the substrate while holding the jig with the opening O facing the surface of the substrate. In addition, the liquid droplets adhering to the surface of the substrate may be collected through the through hole.
For example, the jig 10 has a through hole formed on the inner side surrounded by the opening, and when the gas blown from the opening is blown to the surface of the substrate while the opening is held toward the surface of the substrate, The droplets adhering to the surface may pass through the through hole and be sucked out by the nozzle and collected.
For example, the through hole H passes through the middle of the end surface, the tip of the nozzle-like member passes through the through-hole H and approaches the surface of the substrate, and the tip of the nozzle-like member adheres to the surface of the substrate. The liquid droplets are brought into contact with the liquid droplets, and the liquid droplets attached to the surface of the substrate are sucked.

The jig 10 has an outer peripheral portion that forms the outer periphery of the opening O and an inner peripheral portion that forms the inner periphery of the opening O. When the opening is directed toward the surface of the substrate, the surface of the substrate and the end portions of the inner peripheral portion May be shorter than the distance between the surface of the substrate and the end of the outer peripheral portion.
The jig 10 has an outer peripheral portion that forms the outer periphery of the opening O, and when the opening is directed to the surface of the substrate, the distance between the surface of the substrate and the end surface is larger than the distance between the surface of the substrate and the end portion of the outer peripheral portion. It may be short.
The jig 10 has an outer peripheral portion that forms the outer periphery of the opening O, the end surface portion forms the inner periphery of the opening O, and the distance between the surface of the substrate and the end surface when the opening faces the surface of the substrate is It may be shorter than the distance between the surface and the end of the outer periphery.

The end surface S has a concave shape that is slightly concave as it approaches the center from the outer periphery, and the contour of the concave shape is a convex shape that is the degree of swelling of the free surface of the droplet when the droplet adheres to the surface of the substrate You may substantially coincide with the contour.
A plurality of uneven shapes that are sufficiently smaller than the size of the end surface may be provided on the end surface S.
For example, fine irregularities are provided on the end surface S.
For example, a plurality of grooves are provided on the end surface S.
For example, a plurality of concentric grooves are provided on the end surface S.
For example, fine irregularities are provided on the end surface S.

The pressure sensor 15 is a sensor that detects an internal pressure inside a jig of gas ejected from the opening.
The pressure sensor 15 may detect the pressure inside the first gas passage E of the jig 10.
The pressure sensor 15 may detect the pressure inside the second gas passage F of the jig 10.
The pressure sensor 15 may detect the pressure of the gas supplied from the gas supply device 14 to the jig 10.
If the opening is closed, the pressure sensor 15 indicates the value of the original pressure of the gas supply device 14.

The liquid supply device 20 is a device that attaches droplets to the surface of the substrate.
The liquid supply device 20 may include a nozzle-like member that drops and attaches droplets to the surface of the substrate.
When the jig 10 is formed with the through-hole H, the liquid supply device 20 holds the jig with the opening directed toward the surface of the substrate and sprays the gas ejected from the opening onto the surface of the substrate. The member may be passed through the through hole H, and the droplet may be attached to the surface of the substrate.
If it does in this way, a droplet will be stably put in the ring-shaped curtain of gas which ejects from an opening and is sprayed on the surface of a board | substrate.
Alternatively, the jig 10 may be retracted from the top of the substrate, and the liquid supply device may cause the droplets to adhere to the surface of the substrate.

The scanning device 30 is a device that holds and moves the jig 10.
The scanning device 30 exhibits a stop function, an adhesion function, a scanning function, a position adjustment function, and a recovery function.
For example, the scanning device 30 exhibits the scanning function and the position adjustment function simultaneously after exhibiting the stop function and the adhesion function in order, and then exhibits the recovery function.
Each function will be described below.

First, the stop function exhibited by the scanning device 30 will be described.
When the scanning device 30 gradually approaches the surface of the substrate along the direction orthogonal to the surface of the substrate while ejecting gas from the opening, the internal pressure matches a preset pressure value that is a preset pressure value. It may be possible to stop the jig.
The scanning device 30 may exhibit a position adjusting function described later after exhibiting the stop function.
While the scanning device 30 exhibits the stop function, the flow rate of the gas ejected from the opening O may be substantially constant.
For example, the scanning device 30 gradually brings the jig 10 close to the surface of the substrate along the direction orthogonal to the surface of the substrate, and stops the jig 10 when the internal pressure reaches a set pressure value that is a preset pressure value. Is the first flow rate A1 in which the flow rate of the gas ejected from the opening O is substantially constant.

Next, the adhesion function exhibited by the scanning device will be described.
The scanning device 30 stops the jig with the opening directed toward the surface of the substrate, holds the gas, and blows the gas blown out from the opening onto the surface of the substrate, so that the droplet is positioned at a position surrounded by the opening on the surface of the substrate. It may be attached.
While the scanning device 30 performs the adhesion function, the flow rate of the gas ejected from the opening O may be substantially constant.
For example, when the scanning device 30 faces the opening O toward the surface of the substrate and stops the jig and holds the gas blown out from the opening, the droplet is surrounded by the opening on the surface of the substrate. This is the second flow rate A2 in which the flow rate of the gas ejected from the opening before being attached to the position is substantially constant.

Next, the position adjustment function of the scanning device 30 will be described.
The scanning device 30 holds the jig so as to surround the droplets adhering to the surface of the substrate viewed from the direction orthogonal to the surface of the substrate with a single or a plurality of openings arranged along a virtual line from the opening O. The position along the orthogonal direction of the surface of the substrate of the jig can be adjusted so as to reduce the differential pressure between the internal pressure and the specific pressure value, which is a specific pressure value, while blowing the jetted gas onto the surface of the substrate.
The scanning device 30 holds the jig so as to surround the droplet attached to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate with the annular opening O, and the gas ejected from the opening O on the surface of the substrate. The position along the orthogonal direction of the surface of the substrate of the jig can be adjusted so as to reduce the differential pressure between the internal pressure and the specific pressure value that is a specific pressure value while spraying.
The specific pressure value may be the pressure value of the internal pressure immediately after performing the attaching step.
While the scanning device 30 performs the position adjustment function, the flow rate of the gas ejected from the opening O may be substantially constant.
For example, the scanning device 30 holds the jig 10 so as to surround the droplet attached to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate with the opening O, and the gas ejected from the opening O is the surface of the substrate. While adjusting the position along the direction orthogonal to the surface of the substrate of the jig so as to reduce the differential pressure between the internal pressure and the specific pressure value, the flow rate of the gas blown from the opening O is The third flow rate A3 is substantially constant.

Next, the scanning function of the scanning device 30 will be described.
The scanning device 30 holds the jig so as to surround the liquid droplets adhering to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate, and blows the gas ejected from the opening onto the surface of the substrate. Can be relatively moved along the surface of the substrate.
The scanning device 30 holds the jig so that the end face is brought into contact with the droplet attached to the surface of the substrate and the droplet attached to the surface of the substrate is surrounded by the opening O when viewed from the direction orthogonal to the surface of the substrate. The jig may be relatively moved along the surface of the substrate while the gas blown from the opening O is sprayed on the surface of the substrate.
While the scanning device 30 exhibits the scanning function, the flow rate of the gas ejected from the opening O may be substantially constant.
For example, the scanning device 30 blows the gas ejected from the opening O onto the surface of the substrate while holding the jig so as to surround the droplet attached to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate. However, the flow rate of the gas ejected from the opening O before the jig is relatively moved along the surface of the substrate is the third flow rate A3.
The scanning device 30 may exhibit the position adjustment function and the scanning function at the same time.

The first flow rate A1 and the second flow rate A2 may be different.
For example, the first flow rate A1 is larger than the second flow rate A2.

The second flow rate A2 and the third flow rate A3 may be different.
For example, the third flow rate A3 is larger than the second flow rate A2.

The first flow rate A1 and the third flow rate A3 may be different.
For example, the first flow rate A1 is larger than the third flow rate A3.

When the droplet collection jig 10 has the opening O having a C-shape, the scanning device 30 looks at the substrate from the direction orthogonal to the surface of the substrate and surrounds the droplet attached to the surface of the substrate with the opening O. And holding the jig on the surface of the substrate and blowing the gas from the opening O to the surface of the substrate while moving the jig along the surface of the substrate and positioning the opening O behind the relative movement of the jig. Also good.
When the scanning device 30 has a plurality of openings O arranged along a circular imaginary line, the scanning device 30 looks at the substrate from a direction orthogonal to the surface of the substrate and surrounds the droplets adhering to the surface of the substrate with the plurality of openings O. Alternatively, the jig 10 may be held on the surface of the substrate while the gas blown from the plurality of openings O is sprayed on the surface of the substrate, and the jig may be relatively moved along the surface of the substrate.

The scanning device 30 includes a base 31, a rotating device 32, a centering device 33, a swing device 34, and a lifting device 35.
The base 31 is a device on which a rotating device 32, a centering device 33, a swinging device 34, and a lifting device 35 are mounted, and a control device (not shown) or the like is built therein.
The rotating device 32 is a device that rotates the substrate around a virtual rotation axis orthogonal to the surface of the substrate.
For example, when the substrate is a wafer such as a silicon wafer or a sapphire wafer, the rotating device 32 rotates around a rotation axis that coincides with the arc center of the edge of the wafer.

  The centering device 33 is a device that makes a virtual rotation axis for rotating the substrate coincide with the rotation axis of the rotation device 32.

The swing device 34 is a device that moves the jig 10 along the radial direction of the substrate.
For example, the swing device 34 holds the jig 10 at the tip of the swing arm and swings the base of the swing arm around the vertical axis.
When the swinging device 34 swings the swinging arm that holds the jig 10, the jig 10 moves on the surface of the substrate along the radial direction of the substrate with a trace of an arc.
Therefore, when the rotating device 32 rotates the substrate around the rotation center and the swing device 34 moves the jig 10 in the radial direction of the substrate, the jig 10 is relatively moved along the surface of the substrate 5. it can.

  For example, the scanning device 30 activates the swing device 24 and the rotating device 32 in synchronization with each other, and exhibits a scanning function.

The lifting device 35 is a device that moves the swing arm of the swing device 34 up and down.
When the lifting / lowering device 35 moves the swing arm holding the jig 10 up and down, the separation distance between the jig 10 and the surface of the substrate changes.

For example, the scanning device 30 operates the elevating device 35 to exhibit a stop function.
For example, the scanning device 30 operates the elevating device 35 and exhibits a position adjustment function.
For example, the scanning device 30 activates the lifting device 35 and the liquid supply device in synchronism to perform the adhesion process.

A liquid recovery device (not shown) is a device that recovers droplets attached to the surface of the substrate.
The main structure of the liquid recovery device is the same as the main structure of the liquid supply device 20.
The liquid recovery device may recover the droplets through the through hole H provided in the jig 10 when the scanning device 30 holds the droplets attached to the surface of the substrate.
For example, when the jig 10 has the through-hole H formed therein, the liquid recovery apparatus sucks and recovers the droplets that have adhered to the surface of the substrate through the through-hole H through the tip of the nozzle-like member.
Further, for example, after the scanning device 30 is retracted, the liquid recovery device may draw the droplets by sucking and recovering the droplets adhering to the surface of the substrate by bringing the tip of the nozzle-like member closer to the droplets.

  For example, the scanning device 30 operates the liquid recovery device and exhibits a recovery function.

Below, the jig | tool 10 concerning embodiment of this invention is explained in full detail.
The surface of the substrate has an upper surface, a lower surface, and side surfaces.
For convenience of explanation, it is assumed that the upper surface of the substrate is fixed so as to face upward, the jig is disposed above the upper surface, and gas is ejected from the opening O directed downward.
The jig 10 according to the embodiment of the present invention includes a jig that is in contact with droplets attached to the substrate and a jig that is not in contact with droplets attached to the substrate.

The jig 10 according to the first embodiment of the present invention will be described in detail with reference to the drawings.
FIG. 4 is a side view of the jig according to the first embodiment of the present invention. FIG. 5 is a bottom view of the jig according to the first embodiment of the present invention.
The jig 10 according to the first embodiment is a jig of a type that comes into contact with droplets attached to a substrate.

The jig 10 according to the first embodiment is provided with an end surface portion 13a that is a portion that forms the end surface S, an annular opening O that surrounds the outer periphery of the end surface S is formed, and gas can be ejected from the opening O. In this state, the end face S is brought into contact with the droplet P attached to the surface of the substrate, and the droplet P attached to the surface of the substrate is held so as to be surrounded by the opening O when viewed from the direction orthogonal to the surface of the substrate. This is a jig that can spray the gas ejected from the opening O onto the surface of the substrate.
The jig 10 is formed with a through hole H on the inner side surrounded by the opening O of the end surface portion 13a.
For example, the through hole H is formed through the center portion of the end surface S.
For example, the end surface S is circular, the cross-sectional shape of the through hole H is circular, and the end surface S and the through hole H are formed concentrically.
The jig 10 has an outer peripheral portion 12 a that forms the outer periphery of the opening O, and the end surface portion 13 a forms the inner periphery of the opening O. The direction of the virtual surface including the end M of the outer peripheral portion 12a and the direction of the end surface S substantially coincide. For example, the virtual surface including the end portion M of the outer peripheral portion 12a and the end surface S are parallel.
When the opening is directed to the surface of the substrate, the distance D1 between the surface of the substrate 5 and the end surface S is shorter than the distance D2 between the surface of the substrate 5 and the end M of the outer peripheral portion 12a.

A jig 10 according to the first embodiment includes a jig body 11, a jig outer peripheral member 12, a jig inner peripheral member 13, and a gas supply device 14.
The jig body 11 is a block-like member supported by the swing device 34.
The jig body 11 is formed with a jig outer periphery fitting hole 11a and a first gas passage E.
The jig outer periphery fitting hole 11 a is a hole into which the jig outer peripheral member 12 is fitted.
The first gas passage E is a gas passage provided around the jig outer periphery fitting hole 11a.

The jig outer peripheral member 12 is a member that fits into the jig outer peripheral fitting hole 11a. The lower part of the jig outer peripheral member 12 is exposed from the lower part of the jig outer peripheral fitting hole 11a.
The exposed portion of the jig outer peripheral member 12 corresponds to the outer peripheral portion 12a.
The jig outer peripheral member 12 is formed with a jig inner peripheral fitting hole 12b and a second gas passage F.
The jig inner peripheral fitting hole 12 b is a hole into which the jig inner peripheral member 13 is fitted.
The second gas passage F is a gas passage communicating the first gas passage E and the jig inner circumferential fitting hole 12b.

The jig inner peripheral member 13 is a member that fits into the jig inner peripheral fitting hole 12b. The lower part of the jig inner peripheral member 13 is exposed from the lower part of the jig inner peripheral fitting hole 12b.
The exposed portion of the jig inner peripheral member 13 corresponds to the end surface portion 13a.
The surface facing below the end surface portion 13a corresponds to the end surface S.
The jig inner peripheral member 13 is formed with a third gas passage G and a through hole H.
The third gas passage G is a gas passage communicating the second gas passage F and the opening O.
The through hole H is a hole that penetrates the upper part of the jig inner peripheral member 13 and the central part of the end surface S.

The opening O has an annular shape surrounded by a circular inner periphery and a circular outer periphery.
The inner periphery of the opening O is formed by the end surface portion 13a.
The outer periphery of the opening O is formed by the end M of the outer peripheral portion 12a.
For example, the opening O is surrounded by the outer periphery of the end surface portion 13a and the end portion M of the outer peripheral portion 12a.

When the end surface S is opposed to the surface of the substrate, the distance D1 between the surface of the substrate 5 and the end surface S is slightly shorter than the distance D2 between the surface of the substrate 55 and the end M of the outer peripheral portion 12a.
If it does in this way, gas will eject from the opening O, gas will be sprayed on the surface of a board | substrate, and gas will flow to circumference | surroundings along the surface of a board | substrate. The droplet surrounded by the opening O is pushed and positioned by the gas.

The gas supply device 14 is a device for supplying gas to the jig 10 and ejecting gas from the opening O.
The piping of the gas supply device 14 communicates with the first gas passage E of the jig body 11.
When the gas supply device 14 supplies gas to the plate processing jig, the gas is ejected from the opening O through the first gas passage E, the second gas passage F, and the third gas passage G in order.

Below, the effect | action of the jig | tool concerning 1st embodiment is demonstrated based on a figure.
The opening O is directed toward the surface of the substrate 5, a jig is held so that the distance D1 between the surface of the substrate 5 and the end surface S is a predetermined distance, gas is ejected from the opening O, and the ejected gas is ejected from the surface of the substrate. Spray on.
When the gas is blown from the opening to the surface of the substrate using the liquid supply device 20, the droplet passes through the through hole H and drops onto the surface of the substrate.
The end surface S comes into contact with a droplet that adheres to the surface of the substrate 5.
When the jig 10 is relatively moved along the surface of the substrate 5 while holding the jig so that the distance D1 between the surface of the substrate 5 and the end surface S is a predetermined distance, the droplets move the jig. Accordingly, the surface of the substrate 5 is moved.
If the droplet is a liquid that treats the surface of the substrate 5, the surface of the substrate 5 can be treated.

Next, the jig | tool 10 concerning 2nd embodiment is demonstrated based on a figure.
FIG. 6 is a side view of the jig according to the second embodiment of the present invention.
The jig 10 according to the second embodiment is a jig of a type that comes into contact with droplets attached to a substrate.

The jig 10 according to the second embodiment is provided with an end surface portion 13a that is a portion that forms the end surface S, an annular opening O that surrounds the outer periphery of the end surface S is formed, and gas can be ejected from the opening O. When the end surface S is in contact with the droplet P adhered to the surface of the substrate, the droplet P adhered to the surface of the substrate viewed from the direction orthogonal to the surface of the substrate is held so as to be surrounded by the opening O. This is a jig that can blow the gas ejected from the opening O onto the surface of the substrate.
The jig 10 does not have to be formed with the through hole H on the inner side surrounded by the opening O of the end surface portion 13a.
The jig 10 has an outer peripheral portion 12 a that forms the outer periphery of the opening O, and the end surface portion 13 a forms the inner periphery of the opening O. The direction of the end surface S substantially coincides with the direction of the virtual surface including the end M of the outer peripheral portion 12a. For example, the end surface S and the virtual surface including the end M of the outer peripheral portion 12a are parallel.
When the opening is directed to the surface of the substrate, the distance D1 between the surface of the substrate 5 and the end surface S is shorter than the distance D2 between the surface of the substrate 5 and the end M of the outer peripheral portion 12a.
If it does in this way, gas will eject from the opening O, gas will be sprayed on the surface of a board | substrate, and gas will flow to circumference | surroundings along the surface of a board | substrate. The droplet surrounded by the opening O is pushed and positioned by the gas.

A jig 10 according to the second embodiment includes a jig body 11, a jig outer peripheral member 12, a jig inner peripheral member 13, and a gas supply device 14.
The jig body 11 is a block-like member that is fixed to the swing device 34.
The jig body 11 is formed with a jig outer periphery fitting hole 11a and a first gas passage E.
The jig outer periphery fitting hole 11 a is a fitting hole into which the jig outer peripheral member 12 is fitted.
The first gas passage E is a gas passage provided around the jig outer periphery fitting hole 11a.

The jig outer peripheral member 12 is a member that fits into the jig outer peripheral fitting hole 11a. The lower part of the jig outer peripheral member 12 is exposed from the lower part of the jig outer peripheral fitting hole 11a.
The exposed portion of the jig outer peripheral member 12 corresponds to the outer peripheral portion 12a.
The jig outer peripheral member 12 is formed with a jig inner peripheral fitting hole 12b and a second gas passage F.
The jig inner peripheral fitting hole 12 b is a hole into which the jig inner peripheral member 13 is fitted.
The second gas passage F is a gas passage communicating the first gas passage E and the jig inner circumferential fitting hole 12b.

The jig inner peripheral member 13 is a member that fits into the jig inner peripheral fitting hole 12b. The lower part of the jig inner peripheral member 13 is exposed from the lower part of the jig inner peripheral fitting hole 12b.
The exposed portion of the jig inner peripheral member 13 corresponds to the end surface portion 13a.
The surface facing below the end surface portion 13a corresponds to the end surface S.
The jig inner peripheral member 13 is formed with a third gas passage G.
The third gas passage G is a passage for the gas communicating with the second gas passage F and the opening O.

The opening O has an annular shape surrounded by a circular inner periphery and a circular outer periphery.
The inner periphery of the opening O is formed by the end surface portion 13a.
The outer periphery of the opening O is formed by the end M of the outer peripheral portion 12a.
For example, the opening O is a space surrounded by the outer periphery of the end surface portion 13a and the inner periphery of the end portion M of the outer peripheral portion.

  When the opening O is opposed to the surface of the substrate, the distance D1 between the surface of the substrate 5 and the end surface S is slightly shorter than the distance D2 between the surface of the substrate 55 and the end M of the outer peripheral portion 12a.

The gas supply device 14 is a device for supplying gas to the jig 10 and ejecting gas from the opening O.
The piping of the gas supply device 14 communicates with the first gas passage E of the jig body 11.
When the gas supply device 14 supplies gas to the plate processing jig, the gas is ejected from the opening O through the first gas passage E, the second gas passage F, and the third gas passage G in order.

Below, the effect | action of the jig | tool concerning 2nd embodiment is demonstrated based on a figure.
The opening O is directed toward the surface of the substrate 5, a jig is held so that the distance D1 between the surface of the substrate 5 and the end surface S is a predetermined distance, gas is ejected from the opening O, and the ejected gas is ejected from the surface of the substrate. Spray on.
Using the liquid supply device 20, droplets are dropped on the surface of the substrate.
The jig 10 is held so that the opening O faces the surface of the substrate 5 and the end surface S is positioned on the droplet attached to the surface of the substrate 5.
The jig is brought close to the surface of the substrate, and the end surface S is brought into contact with the droplet adhering to the surface of the substrate 5.
The jig is held so that the distance D1 between the surface of the substrate 5 and the end surface S is a predetermined distance.
Gas is ejected from the opening O. Gas is blown onto the surface of the substrate.
While holding the jig so that the distance D1 between the surface of the substrate 5 and the end surface S is a predetermined distance, the jig 10 is relatively moved along the surface of the substrate 5 while blowing gas from the opening to the surface of the substrate. Then, the droplet moves on the surface of the substrate 5 as the jig moves.
If the droplet is a liquid that treats the surface of the substrate 5, the surface of the substrate 5 can be treated.

Next, the jig 10 according to the third embodiment will be described with reference to the drawings.
FIG. 7 is a side view of a jig according to the third embodiment of the present invention.
The jig 10 according to the third embodiment is a jig of a type that comes into contact with droplets attached to a substrate.

The jig 10 according to the third embodiment is provided with an end surface portion 13a that is a portion that forms the end surface S, an annular opening O that surrounds the outer periphery of the end surface S is formed, and gas can be ejected from the opening O. When the end surface S is in contact with the droplet P adhered to the surface of the substrate, the droplet P adhered to the surface of the substrate viewed from the direction orthogonal to the surface of the substrate is held so as to be surrounded by the opening O. This is a jig that can blow the gas ejected from the opening O onto the surface of the substrate.
The jig 10 may have a through hole H formed inside the end surface portion 13a surrounded by the opening O.
The jig 10 has an outer peripheral portion 12 a that forms the outer periphery of the opening O, and the end surface portion 13 a forms the inner periphery of the opening O.
The direction of the end surface S substantially coincides with the direction of the virtual surface including the end M of the outer peripheral portion 12a. For example, the end surface S and the virtual surface including the end M of the outer peripheral portion 12a are parallel.
When the opening is directed to the surface of the substrate, the distance D1 between the surface of the substrate 5 and the end surface S is shorter than the distance D2 between the surface of the substrate 5 and the end M of the outer peripheral portion 12a.
The end surface S has a concave shape that is slightly concave as it approaches the center from the outer periphery, and the concave contour is a convexity that is the degree of swelling of the free surface of the droplet P when the droplet adheres to the surface of the substrate 5. It almost matches the outline of the shape.

Since the main structure of the jig 10 according to the third embodiment is the same as the jig according to the first embodiment, only differences will be described.
A jig 10 according to the third embodiment includes a jig main body 11, a jig outer peripheral member 12, a jig inner peripheral member 13, and a gas supply device 14.
The end surface S of the jig inner peripheral member 13 has a concave shape that is slightly recessed as it approaches the center from the outer periphery.
The concave contour substantially matches the convex contour, which is the degree of swelling of the free surface of the droplet P when the droplet is attached to the surface of the substrate 5.

  Hereinafter, the operation of the jig according to the third embodiment is one of the operations of the jig according to the first embodiment or the jig 10 according to the second embodiment, and thus the description thereof is omitted. .

Below, the jig | tool 10 concerning 4th embodiment is demonstrated based on a figure.
FIG. 8 is a side view of the jig 10 according to the fourth embodiment.
The jig 10 according to the fourth embodiment is a jig that does not come into contact with the droplets attached to the substrate.

The jig 10 according to the fourth embodiment is formed with an annular opening O, can eject gas from the opening, and drops droplets P attached to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate. It is a jig that can blow the gas blown from the opening O onto the surface of the substrate while being held so as to be surrounded by the opening O.
The jig 10 is formed with a through hole H on the inner side surrounded by the opening O of the end surface portion 13a.
The jig 10 has an outer peripheral portion 12 a that forms the outer periphery of the opening O and an inner peripheral portion 13 b that forms the inner periphery of the opening O. The direction of the virtual surface including the end M of the outer peripheral portion 12a and the direction of the virtual surface including the end N of the inner peripheral portion 13b substantially coincide. For example, the orientation of the virtual surface including the end portion M of the outer peripheral portion 12a and the orientation of the virtual surface including the end portion N of the inner peripheral portion 13b are parallel.
When the opening is directed to the surface of the substrate, the distance D1 between the surface of the substrate 5 and the end N of the inner peripheral portion 13b is shorter than the distance D2 between the surface of the substrate 5 and the end M of the outer peripheral portion 12a.

A jig 10 according to the fourth embodiment includes a jig body 11, a jig outer peripheral member 12, a jig inner peripheral member 13, and a gas supply device 14.
The jig 10 according to the fourth embodiment is a jig that does not come into contact with the droplets attached to the substrate.
The jig body 11 is a block-like member that is fixed to the swing device 34.
The jig body 11 is formed with a jig outer periphery fitting hole 11a and a first gas passage E.
The first gas passage E is a gas passage provided around the jig outer periphery fitting hole 11a.
The jig outer periphery fitting hole 11 a is a fitting hole into which the jig outer peripheral member 12 is fitted.

The jig outer peripheral member 12 is a member that fits into the jig outer peripheral fitting hole 11a. The lower part of the jig outer peripheral member 12 is exposed from the lower part of the jig outer peripheral fitting hole 11a.
The exposed portion of the jig outer peripheral member 12 corresponds to the outer peripheral portion 12a.
The jig outer peripheral member 12 is formed with a jig inner peripheral fitting hole 12b and a second gas passage F.
The jig inner circumferential fitting hole 12b is a fitting hole into which the jig inner circumferential member 13 is fitted.
The second gas passage F is a gas passage communicating the first gas passage E and the third gas passage G.

The jig inner peripheral member 13 is a member that fits into the jig inner peripheral fitting hole 12b. The lower part of the jig inner peripheral member 13 is exposed from the lower part of the jig inner peripheral fitting hole 12b.
The exposed portion of the jig inner peripheral member 13 corresponds to the inner peripheral portion 13b.
The jig inner peripheral member 13 is formed with a third gas passage G and a through hole H.
The third gas passage G is a passage for the gas communicating with the second gas passage F and the opening O.
The jig inner peripheral member 13 may be formed with a through hole H.
The through hole H penetrates the upper part of the jig inner peripheral member 13 and the central part of the end surface S.

The opening O has an annular shape surrounded by a circular inner periphery and a circular outer periphery.
The inner periphery of the opening O is formed by the end N of the inner periphery 13b.
The outer periphery of the opening O is formed by the end M of the outer peripheral portion 12a.

  When the opening O is opposed to the surface of the substrate, the distance D1 between the surface of the substrate 5 and the end N of the inner peripheral portion 13b is slightly smaller than the distance D2 between the surface of the substrate 55 and the end M of the outer peripheral portion 12a. Short.

The gas supply device 14 is a device for supplying gas to the jig 10 and ejecting gas from the opening O.
The piping of the gas supply device 14 communicates with the first gas passage E of the jig body 11.
When the gas supply device 14 supplies gas to the plate processing jig, the gas is ejected from the opening O through the first gas passage E, the second gas passage F, and the third gas passage G in order.

Below, the effect | action of the jig | tool concerning 4th embodiment is demonstrated based on a figure.
The opening O is directed toward the surface of the substrate 5, the jig is held so that the distance D1 between the surface of the substrate 5 and the end N of the inner peripheral portion 13b is a predetermined distance, and gas is ejected from the opening O. The jetted gas is blown onto the surface of the substrate.
When the gas is blown from the opening to the surface of the substrate using the liquid supply device 20, the droplet passes through the through hole and drops onto the surface of the substrate.
The end surface S does not come into contact with the droplets adhering to the surface of the substrate 5.
When the jig 10 is relatively moved along the surface of the substrate 5 while holding the jig so that the distance D1 between the surface of the substrate 5 and the end surface S is a predetermined distance, the droplets move the jig. Accordingly, the surface of the substrate 5 is moved.
If the droplet is a liquid that treats the surface of the substrate 5, the surface of the substrate 5 can be treated.

Next, the substrate processing method concerning 1st embodiment of this invention is demonstrated based on figures.
FIG. 9 is a flowchart of the substrate processing method according to the first embodiment of the present invention.

The substrate processing method according to the first embodiment includes a preparation step S10, a stop step S15, an adhesion step S20, a scanning step S40, a position adjustment step S45, a recovery step S50, and a measurement step S60.
For example, the stop process S15 and the adhesion process S20 are performed in order, the scanning process S40 and the position adjustment process S45 are performed simultaneously, and then the recovery process S50 and the measurement process S60 are performed in order.

The preparation step S <b> 10 is a step for preparing the jig 10 and the pressure sensor 15.
For example, in the preparation step S10, the jig 10, the pressure sensor 15, the liquid supply device 20, and the scanning device 30 are prepared.

The stopping step S15 is when the jig is gradually approached to the surface of the substrate along the direction orthogonal to the surface of the substrate while jetting gas from the opening, and the internal pressure matches a preset pressure value that is a preset pressure value. This is a step of stopping the jig.
The set pressure value may be a pressure value obtained by multiplying the internal pressure when the opening is closed by a predetermined ratio.
The first flow rate may be a constant flow rate of the gas ejected from the opening when the stop step S15 is performed.

The attaching step S20 is a step of attaching droplets to the surface of the substrate.
In the attaching step S20, when the opening is directed to the surface of the substrate, the jig is stopped and held, and the gas blown from the opening is sprayed on the surface of the substrate, the droplet is placed at a position surrounded by the opening on the surface of the substrate. Adhere.
For example, in the state where the opening O is directed toward the surface of the substrate 5 and the substrate recovery jig is held, when the gas is ejected from the opening O toward the surface of the substrate 5, the surface of the substrate passes through the through hole H. Drop droplets on
The second flow rate A2 in which the flow rate of the gas ejected from the opening when performing the attaching step may be substantially constant.
The droplet P adheres to the surface of the substrate 5.
The amount of the liquid that forms the droplet P is an amount that does not protrude from the space surrounded by the opening O.
An appropriate amount of the liquid that forms the droplet P is affected by the state of the surface of the substrate, the viscosity of the liquid, or the wettability between the surface of the substrate and the liquid.
For example, when the jig according to the first embodiment is used, droplets adhere to the end surface S of the end surface portion.
For example, if the substrate inspection jig according to the fourth embodiment is used, the jig does not contact the droplet.

The scanning step S40 is performed by holding the jig so as to surround the droplets attached to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate with the opening and blowing the gas ejected from the opening onto the surface of the substrate. Is a process of relatively moving along the surface of the substrate.
In the scanning step S40, the jig is held such that the end surface is brought into contact with the droplet attached to the surface of the substrate and the droplet attached to the surface of the substrate is surrounded by the opening when viewed from the direction orthogonal to the surface of the substrate. It may be a step of relatively moving the jig along the surface of the substrate while blowing the gas ejected from the opening onto the surface of the substrate.
The droplet P moves along the surface of the substrate 5.
If the droplet is a liquid that treats the substrate, the surface of the substrate 5 is treated.
The third flow rate may be a substantially constant flow rate of gas ejected from the opening when performing the scanning step S20.

The position adjustment step S45 is performed while holding the jig so as to surround the droplets attached to the substrate surface when viewed from the direction orthogonal to the substrate surface and blowing the gas ejected from the opening to the substrate surface. This is a step of adjusting the position along the orthogonal direction of the surface of the substrate of the jig so as to reduce the differential pressure between the pressure and the specific pressure value which is a specific pressure value.
The specific pressure value may be the pressure value of the internal pressure immediately after performing the attaching step S20.
It is performed simultaneously with the scanning step S40 and the position adjustment step S45.

In the collecting step S50, the droplets adhering to the surface of the substrate 5 are collected.
For example, droplets adhering to the surface of the substrate 5 are sucked up using a dropper-like device.
For example, in the state where the opening O is directed toward the surface of the substrate 5 and the substrate recovery jig is held, when the gas is ejected from the opening O toward the surface of the substrate 5, the surface of the substrate passes through the through hole H. Collect droplets adhering to.
Further, for example, the jig 10 is retracted from the surface of the substrate, and a droplet attached to the surface of the substrate 5 is sucked up using a dropper-like device.

The measurement step S60 is a step of measuring a droplet.
For example, measure the amount of metal atoms contained in a droplet

Next, the substrate processing method concerning 2nd embodiment of this invention is demonstrated based on figures.
FIG. 10 is a flowchart of the substrate processing method according to the second embodiment of the present invention.

The substrate processing method according to the second embodiment includes a preparation step S10, a stop step S15, an adhesion step S30, a scanning step S40, a position adjustment step S45, a recovery step S50, and a measurement step S60.
For example, after performing stop process S15 and adhesion process S30 in order, and performing scanning process S40 and position adjustment process S45 simultaneously, it implements in order with collection process S50 and measurement process S60.

  The preparation step S10 is a step of preparing the jig 10, the pressure sensor 15, the liquid supply device 20, and the scanning device 30.

The stopping step S15 is when the jig is gradually approached to the surface of the substrate along the direction orthogonal to the surface of the substrate while jetting gas from the opening, and the internal pressure matches a preset pressure value that is a preset pressure value. This is a step of stopping the jig.
After performing stop process S15, position adjustment process S45 is implemented.
The set pressure value may be a pressure value obtained by multiplying the internal pressure when the opening is closed by a predetermined ratio.
The first flow rate may be a constant flow rate of the gas ejected from the opening when the stop step S15 is performed.

The attaching step S30 is a step for attaching droplets to the surface of the substrate.
In the attaching step S30, the liquid droplets are placed at a position surrounded by the opening on the surface of the substrate when the opening is directed toward the surface of the substrate and the jig is stopped and held and the gas ejected from the opening is sprayed on the surface of the substrate. Adhere.
For example, the substrate is moved from the opening O to the substrate O in a state where the substrate recovery jig is held with the opening O directed toward the surface of the substrate 5 by moving from the position stopped in the stopping step S15 in a direction away from the surface of the substrate. When the gas is blown out toward the surface of 5, the droplet passes through the through hole H and drops onto the surface of the substrate.
The second flow rate A2 in which the flow rate of the gas ejected from the opening when performing the attaching step may be substantially constant.
Further, for example, the jig 10 is retracted from the surface of the substrate, and a droplet is dropped at a desired position on the surface of the substrate.
The droplet P adheres to the surface of the substrate 5.
Thereafter, with the opening O facing the surface of the substrate 5, the end surface S is brought close to the surface of the substrate 5, and the end surface S is brought into contact with the droplet attached to the surface of the substrate.
For example, the jig 10 is moved closer to the surface of the substrate by a predetermined distance L and moved so as to be positioned at the position stopped in the stop step S15 so that the end surface S comes into contact with the droplets attached to the surface of the substrate. .

The scanning step S40 is performed by holding the jig so as to surround the droplets attached to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate with the opening and blowing the gas ejected from the opening onto the surface of the substrate. Is a process of relatively moving along the surface of the substrate.
In the scanning step S40, the jig is held such that the end surface is brought into contact with the droplet attached to the surface of the substrate and the droplet attached to the surface of the substrate is surrounded by the opening when viewed from the direction orthogonal to the surface of the substrate. It may be a step of relatively moving the jig along the surface of the substrate while blowing the gas ejected from the opening onto the surface of the substrate.
The droplet P moves along the surface of the substrate 5.
If the droplet is a liquid that treats the substrate, the surface of the substrate 5 is treated.

The position adjustment step S45 is a step of adjusting the position along the orthogonal direction of the surface of the substrate of the jig so as to reduce the differential pressure between the internal pressure and the specific pressure value which is a specific pressure value.
The specific pressure value may be the pressure value of the internal pressure immediately after performing the attaching step S20.
It is performed simultaneously with the scanning step S40 and the position adjustment step S45.

In the collecting step S50, the droplets adhering to the surface of the substrate 5 are collected.
For example, droplets adhering to the surface of the substrate 5 are sucked up using a dropper-like device.
For example, when the jig 10 is held with the opening directed toward the surface of the substrate and the gas blown from the opening is sprayed onto the surface of the substrate, the droplets adhering to the surface of the substrate pass through the through hole H. To collect,
Further, for example, the jig 10 is retracted from the surface of the substrate, and the droplets on the surface of the substrate are collected.

The measurement step S60 is a step of measuring a droplet.
For example, measure the amount of metal atoms contained in a droplet

If the substrate processing apparatus, the substrate processing method, and the jig 10 according to the above-described embodiment are used, the following effects are exhibited.
A jig 10 capable of ejecting gas from a single or a plurality of openings O arranged along a circular imaginary line and a pressure sensor 15 for detecting the internal pressure of the gas inside the jig 10 are prepared, and the internal pressure is The position along the orthogonal direction of the substrate surface of the jig was adjusted so as to approach the specific pressure value, and the jig 10 was held and ejected from the opening O so as to surround the droplet attached to the surface of the substrate with the opening O. Since the jig is relatively moved along the surface of the substrate while the gas is blown onto the surface of the substrate, the gas blown out from the opening is maintained while keeping the distance between the jig 10 and the surface of the substrate constant. The droplets attached to the surface of the substrate are sprayed on the surface of the substrate so as to surround the droplets, and the droplets can be relatively moved along the surface of the substrate.
Also, a jig 10 capable of ejecting gas from the annular opening O and a pressure sensor 15 for detecting the internal pressure of the gas inside the jig 10 are prepared, and the jig is set so that the internal pressure approaches a specific pressure value. 10, the position along the orthogonal direction of the substrate surface is adjusted, the jig is held so as to surround the droplets adhering to the substrate surface with the opening O, and the gas blown out from the opening O is blown onto the surface of the substrate. Since the tool 10 is relatively moved along the surface of the substrate, a droplet in which the gas ejected from the opening O is adhered to the surface of the substrate while keeping the distance between the jig 10 and the surface of the substrate constant to some extent. The liquid droplets can be relatively moved along the surface of the substrate by spraying on the surface of the substrate so as to surround the substrate.
In addition, the end surface portion of the jig 10 is formed with an end surface S surrounded by the opening O, and the position along the orthogonal direction of the substrate surface of the jig 10 is adjusted so that the internal pressure approaches a specific pressure value. The jig 10 is held on the surface of the substrate while holding the jig 10 in which the droplet adhering to the surface is surrounded by the opening O so that the end surface S is in contact with the droplet and blowing the gas ejected from the opening O onto the surface of the substrate. Accordingly, the gas blown out from the opening O is surrounded by the liquid droplets adhering to the surface of the substrate while keeping the distance between the jig 10 and the surface of the substrate constant to some extent. By spraying on the surface and bringing the end face into contact with the droplet, the droplet can be moved relatively, and the droplet can be moved relatively along the surface of the substrate.
Further, when the jig 10 is brought close to the surface of the substrate along the orthogonal method and the internal pressure matches the set pressure value, the jig is stopped, and then the substrate of the jig 10 is moved so that the internal pressure approaches the specific pressure value. Since the position along the orthogonal direction of the surface is adjusted, it is possible to relatively move the droplet along the surface of the substrate while maintaining the distance between the jig and the surface of the substrate at a value corresponding to the internal pressure. it can.
Further, since the set pressure value is a pressure value obtained by multiplying the internal pressure when the opening O is closed by a predetermined ratio, the distance between the jig and the surface of the substrate is a predetermined distance corresponding to the set pressure. The jig can be stopped.
Also, when the opening O is directed toward the surface of the substrate and the jig is stopped and held, and the gas blown from the opening is sprayed on the surface of the substrate, the droplets adhere to the surface surrounded by the opening on the surface of the substrate. Since the value of the internal pressure immediately after attaching the droplet is the specific pressure value, adjusting the position along the orthogonal direction of the jig so as to reduce the differential pressure between the internal pressure and the specific pressure value, The distance between the jig and the substrate can be maintained at the distance in the attaching process.
Further, when the jig 10 is gradually approached to the surface of the substrate along the orthogonal direction while jetting gas from the opening O at the first flow rate A1, the internal pressure matches a preset pressure value which is a preset pressure value. When the jig is stopped, the jig is stopped and held, and the gas ejected from the opening at the second flow rate A2 is sprayed onto the surface of the substrate, the droplet is attached to the position surrounded by the opening on the surface of the substrate. Since the first flow rate A1 and the second flow rate A2 are made different, the first flow rate A1 suitable for making the distance between the jig 10 to be stopped in the stopping step and the surface of the substrate have a desired accuracy can be selected. The second flow rate A2 suitable for attaching droplets to the surface of the substrate in the attaching step can be selected.
Further, when the opening O is directed toward the surface of the substrate and the jig is stopped and held, and the gas blown out from the opening O at the second flow rate A2 is sprayed onto the surface of the substrate, the droplets are applied to the opening O on the surface of the substrate. A gas which is attached to the enclosed position, held by a jig so as to surround the droplet attached to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate with the opening O, and ejected from the opening at the third flow rate A3 Since the jig is relatively moved along the surface of the substrate while spraying on the surface of the substrate, the second flow rate A2 suitable for adhering to the surface of the substrate can be selected in the adhering step, and the jig can be selected in the scanning step. And a third flow rate A3 suitable for maintaining the distance between the surfaces of the substrates.

The present invention is not limited to the embodiments described above, and various modifications can be made without departing from the scope of the invention.
Although the jig has been described as being used in a substrate processing method for processing a substrate, the jig is not limited to this and can be used to hold droplets attached to the substrate for other purposes.

E 1st gas passage F 2nd gas passage G 3rd gas passage S End surface O Opening M End part of outer peripheral part N End part of inner peripheral part H Through hole 10 Jig 11 Jig body 11a Jig outer peripheral fitting hole 12 Jig outer peripheral member 12a Outer peripheral portion 12b Jig inner peripheral fitting hole 13 Jig inner peripheral member 13a End surface portion 13b Inner peripheral portion 14 Gas supply device 15 Pressure sensor 20 Liquid supply device 30 Scanning device 31 Base 32 Rotating device 33 Centering Equipment 34 Oscillating equipment 35 Lifting equipment

JP 02-272359 A JP 02-028533 JP 08-233709 A Japanese Patent Laid-Open No. 02-229428 JP2007-245209 JP 2010-040548 A

Claims (16)

A substrate processing method for processing a substrate with droplets,
A jig formed with one or a plurality of openings provided along a circular imaginary line and capable of ejecting a gas from the opening, and a pressure for detecting an internal pressure of the gas ejected from the opening inside the jig A preparation process for preparing the sensor;
While holding the jig so as to surround droplets adhering to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate with the opening, and blowing the gas ejected from the opening onto the surface of the substrate, the internal pressure and A position adjustment step of adjusting the position along the orthogonal direction of the surface of the substrate of the jig so as to reduce the differential pressure with the specific pressure value that is a specific pressure value;
The jig is held while blowing the gas blown from the opening onto the surface of the substrate while holding the jig so as to surround the opening with droplets attached to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate. A scanning process for relative movement along the surface of the substrate;
With
The specific pressure value is a value that can keep the separation distance between the jig and the surface of the substrate constant when the internal pressure is maintained at the specific pressure value in the position adjusting step.
And a substrate processing method. The jig is formed with an annular opening so that gas can be ejected from the opening.
The substrate processing method according to claim 1. The jig has an end surface portion forming an end surface surrounded by the opening;
The scanning step holds the jig so that the end surface is brought into contact with a droplet attached to the surface of the substrate and the droplet attached to the surface of the substrate is surrounded by the opening when viewed from the direction orthogonal to the surface of the substrate. The jig is relatively moved along the surface of the substrate while blowing the gas blown from the opening to the surface of the substrate.
The substrate processing method according to claim 2. When the jig is gradually approached to the surface of the substrate along the direction orthogonal to the surface of the substrate while gas is ejected from the opening, the jig is matched with the preset pressure value which is a preset pressure value. A stop process for stopping
With
The set pressure value is a value capable of stopping the jig by setting the distance between the jig and the substrate to a predetermined distance corresponding to the set pressure value when the internal pressure coincides with the set pressure value in the stopping step.
Carrying out the position adjusting step after carrying out the stopping step;
The substrate processing method according to claim 1. The set pressure value is a pressure value obtained by multiplying the internal pressure when the opening is temporarily closed by a predetermined ratio.
The substrate processing method according to claim 4. When the opening is directed toward the surface of the substrate and the jig is stopped and held, and the gas blown out from the opening is sprayed onto the surface of the substrate, the droplets adhere to the surface of the substrate surrounded by the opening. An adhering process,
The specific pressure value is a pressure value of the internal pressure immediately after performing the attaching step,
The substrate processing method according to claim 1. A step of stopping the movement of the jig when the jig gradually approaches the surface of the substrate along the direction orthogonal to the surface of the substrate and the internal pressure reaches a set pressure value which is a preset pressure value;
When the opening is directed toward the surface of the substrate and the jig is stopped and held, and the gas blown out from the opening is sprayed onto the surface of the substrate, the droplets adhere to the surface of the substrate surrounded by the opening. An adhering process,
With
A flow rate of gas ejected from the opening when performing the stopping step is a first flow rate that is substantially constant;
A second flow rate in which the flow rate of the gas ejected from the opening when performing the attaching step is substantially constant;
The first flow rate and the second flow rate are different,
The substrate processing method according to claim 1. When the opening is directed toward the surface of the substrate and the jig is stopped and held, and the gas blown out from the opening is sprayed onto the surface of the substrate, the droplets adhere to the surface of the substrate surrounded by the opening. An adhering process,
With
A second flow rate in which the flow rate of the gas ejected from the opening when performing the attaching step is substantially constant;
The flow rate of the gas ejected from the opening when performing the scanning step is a substantially constant third flow rate,
The second flow rate and the third flow rate are different.
The substrate processing method according to claim 1. A substrate processing apparatus for processing a substrate with droplets,
A jig formed with one or a plurality of openings provided along a circular imaginary line and capable of ejecting gas from the openings; and
A pressure sensor for detecting an internal pressure inside the jig of the gas ejected from the opening;
While holding the jig so as to surround droplets adhering to the surface of the substrate when viewed from the direction orthogonal to the surface of the substrate with the opening, and blowing the gas ejected from the opening onto the surface of the substrate, the internal pressure and The position along the orthogonal direction of the substrate surface of the jig can be adjusted so as to reduce the differential pressure from the specific pressure value, which is a specific pressure value, and the substrate is viewed from the orthogonal direction of the substrate surface. The jig can be relatively moved along the surface of the substrate while holding the jig so as to surround the droplet attached to the surface of the substrate with the opening and blowing the gas blown from the opening onto the surface of the substrate. Scanning equipment;
With
The specific pressure value is a value that can keep the separation distance between the jig and the surface of the substrate constant when the internal pressure is maintained at the specific pressure value.
A substrate processing apparatus. The jig is formed with an annular opening so that gas can be ejected from the opening.
The substrate processing apparatus according to claim 9. The jig has an end surface portion forming an end surface surrounded by the opening;
The scanning device holds the jig so that the end surface is brought into contact with a droplet attached to the surface of the substrate and the droplet attached to the surface of the substrate is surrounded by the opening when viewed from the direction orthogonal to the surface of the substrate. The jig can be relatively moved along the surface of the substrate while blowing the gas blown from the opening to the surface of the substrate.
The substrate processing apparatus according to claim 10. The scanning device gradually approaches the surface of the substrate along the direction orthogonal to the surface of the substrate while blowing the gas from the opening, and the internal pressure matches a preset pressure value that is a preset pressure value. When the jig is stopped and the substrate is viewed from a direction orthogonal to the surface of the substrate and the droplets adhering to the surface of the substrate are surrounded by the opening, the jig is held so that the gas ejected from the opening The position along the orthogonal direction of the surface of the substrate of the jig can be adjusted so as to reduce the differential pressure between the internal pressure and the specific pressure value that is a specific pressure value while spraying on the surface of
The set pressure value is a value capable of stopping the jig by setting the distance between the jig and the substrate to a predetermined distance corresponding to the set pressure value when the internal pressure matches the set pressure value.
The substrate processing apparatus according to claim 9. The set pressure value is a pressure value obtained by multiplying the internal pressure when the opening is temporarily closed by a predetermined ratio.
The substrate processing apparatus according to claim 12. When the scanning device is holding the jig with the opening directed toward the surface of the substrate and holding the gas blown out from the opening onto the surface of the substrate, the specific pressure value is applied to the surface of the substrate. It is the pressure value of the internal pressure immediately after being attached to the position surrounded by the opening,
The substrate processing apparatus according to claim 9. Until the scanning device stops the jig when the jig gradually approaches the surface of the substrate along the direction orthogonal to the surface of the substrate and the internal pressure reaches a preset pressure value which is a preset pressure value. Is a first flow rate at which the flow rate of the gas ejected from the opening is substantially constant,
When the scanning device holds the jig with the opening facing the surface of the substrate and stops and holds the gas blown from the opening onto the surface of the substrate, a droplet is surrounded by the opening on the surface of the substrate. A second flow rate in which the flow rate of the gas ejected from the opening is substantially constant until it adheres to the position,
The first flow rate and the second flow rate are different,
The substrate processing apparatus according to claim 9. When the scanning device holds the jig with the opening facing the surface of the substrate and stops and holds the gas blown from the opening onto the surface of the substrate, a droplet is surrounded by the opening on the surface of the substrate. A second flow rate in which the flow rate of the gas ejected from the opening is substantially constant until it adheres to the position,
While the scanning device sees the substrate from a direction orthogonal to the surface of the substrate and holds the jig so as to surround the droplet attached to the surface of the substrate with the opening, the gas blown out from the opening is blown onto the surface of the substrate The flow rate of the gas spouted from the opening until the jig is relatively moved along the surface of the substrate is a substantially constant third flow rate,
The second flow rate and the third flow rate are different.
The substrate processing apparatus according to claim 9.

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