JP6960293B2 - Board holding member - Google Patents

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JP6960293B2
JP6960293B2 JP2017186980A JP2017186980A JP6960293B2 JP 6960293 B2 JP6960293 B2 JP 6960293B2 JP 2017186980 A JP2017186980 A JP 2017186980A JP 2017186980 A JP2017186980 A JP 2017186980A JP 6960293 B2 JP6960293 B2 JP 6960293B2
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substrate
main surface
opening
support member
holding member
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JP2019062129A (en
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教夫 小野寺
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NGK Spark Plug Co Ltd
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NGK Spark Plug Co Ltd
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本発明は、半導体ウエハなど基板を真空吸着保持するために用いられる基板保持部材に関する。 The present invention relates to a substrate holding member used for vacuum suction holding a substrate such as a semiconductor wafer.

ウエハを支持するための鋼球が保持された鋼球保持枠がチャック本体の凹所に装着されたボール接触型ウエハチャック(基板保持部材)において、鋼球を交換可能とする技術が提案されている(特許文献1参照)。チャック本体に設けられた真空通路を介して減圧することによって、鋼球およびチャック本体に設けられたシールリングにおいてウエハを吸着支持している。 A technique has been proposed in which a steel ball holding frame for supporting a wafer is mounted in a recess of the chuck body in a ball contact type wafer chuck (board holding member) in which the steel balls can be replaced. (See Patent Document 1). By reducing the pressure through the vacuum passage provided in the chuck body, the wafer is attracted and supported by the steel ball and the seal ring provided in the chuck body.

特公平06−097674号公報Tokushu Kohei 06-097674

しかし、基板保持部材で基板を繰り返し吸着すると基板を支持する支持部材と基板が吸着時に摺動し、支持部材が摩耗する。その結果、吸着される基板の平坦度が悪化し、所定のプロセスが行えなくなる。その場合、真空チャックの表面形状の修正加工が必要になり、真空チャックが取り付けられた基板プロセス用の装置のダウンタイムが長くなり生産性が低下する問題が生じていた。 However, when the substrate is repeatedly adsorbed by the substrate holding member, the support member that supports the substrate and the substrate slide during adsorption, and the support member wears. As a result, the flatness of the substrate to be adsorbed deteriorates, and a predetermined process cannot be performed. In that case, it is necessary to modify the surface shape of the vacuum chuck, which causes a problem that the downtime of the apparatus for the substrate process to which the vacuum chuck is attached becomes long and the productivity is lowered.

そこで、本発明は、基板を支持する部材のみが容易に交換または補修されることによって、基板の平坦度を確保しうるような吸着保持性能が回復され、かつ、上記のような基板プロセス用の装置におけるダウンタイムの短縮化を図ることができる基板保持部材を提供することを目的とする。 Therefore, according to the present invention, by easily replacing or repairing only the member supporting the substrate, the adsorption holding performance that can secure the flatness of the substrate is restored, and the substrate process is used as described above. An object of the present invention is to provide a substrate holding member capable of reducing downtime in an apparatus.

本発明の基板保持部材は、主面を有する基体と、前記基体に設けられ、前記主面において開口する複数の第1開口部を有する1つ以上の第1通気路と、前記基体に設けられ、前記主面において開口する第2開口部を有する第2通気路と、前記複数の第1開口部のそれぞれを少なくとも部分的に塞ぎ、かつ、少なくとも一部が前記主面から突出するように前記基体に対して取り外し可能に配置される複数の支持部材と、を備えていることを特徴とする。 The substrate holding member of the present invention is provided on a substrate having a main surface, one or more first air passages provided on the substrate and having a plurality of first openings opened on the main surface, and the substrate. The second air passage having a second opening that opens on the main surface and the plurality of first openings are each closed at least partially, and at least a part thereof protrudes from the main surface. It is characterized by including a plurality of support members that are detachably arranged with respect to the substrate.

当該構成の基板保持部材によれば、基体の主面において複数の第1開口部のそれぞれを少なくとも部分的に塞ぎ、かつ、少なくとも一部が前記主面から突出するように複数の支持部材が配置される。この状態で、第1通気路が減圧されることにより、複数の支持部材のそれぞれに対して第1開口部を通じて真空吸引力が作用して基体に対して当該複数の支持部材のそれぞれが吸着される。また、基体の主面側に基板が載置されることにより、複数の支持部材のうち少なくとも一部に基板が当接する。この状態で、第2通気路が減圧されることにより、第2開口部を通じて基体の主面および基板の裏面により挟まれた空間が減圧され、基板に対して基体の主面に向かう真空吸引力が作用し、基板が複数の支持部材に支持された状態で基板保持部材に吸着保持される。 According to the substrate holding member having this configuration, a plurality of support members are arranged so that each of the plurality of first openings is at least partially closed on the main surface of the substrate and at least a part thereof protrudes from the main surface. Will be done. In this state, when the pressure in the first air passage is reduced, a vacuum suction force acts on each of the plurality of support members through the first opening, and each of the plurality of support members is attracted to the substrate. NS. Further, by placing the substrate on the main surface side of the substrate, the substrate comes into contact with at least a part of the plurality of support members. In this state, the pressure of the second air passage is reduced, so that the space sandwiched between the main surface of the substrate and the back surface of the substrate is decompressed through the second opening, and the vacuum suction force toward the main surface of the substrate with respect to the substrate is reduced. Acts, and the substrate is attracted and held by the substrate holding member in a state of being supported by a plurality of supporting members.

第2通気路が減圧状態から解放される(例えば大気圧に戻される)ことにより、基体の主面および基板の裏面により挟まれた空間も減圧状態から解放され、基板が基板保持部材から取り外される。第1通気路が減圧状態から解放される(例えば大気圧に戻される)ことにより、複数の支持部材のそれぞれが真空吸引力から解放されて基体から取り外し可能となる。このため、複数の支持部材のうち少なくとも一部の支持部材が摩耗または損傷した場合、基板保持部材全体ではなく当該少なくとも一部の支持部材のみが容易に交換または補修等されることによって基板の平坦度が確保されるような吸着保持性能が回復され、かつ、基板に対してプロセスを施すための装置のダウンタイムの短縮化が図られる。 When the second air passage is released from the decompressed state (for example, returned to atmospheric pressure), the space sandwiched between the main surface of the substrate and the back surface of the substrate is also released from the decompressed state, and the substrate is removed from the substrate holding member. .. When the first air passage is released from the reduced pressure state (for example, returned to atmospheric pressure), each of the plurality of support members is released from the vacuum suction force and can be removed from the substrate. Therefore, when at least a part of the support members among the plurality of support members is worn or damaged, the substrate is flattened by easily replacing or repairing only at least a part of the support members, not the entire substrate holding member. The suction holding performance is restored so that the degree is ensured, and the downtime of the device for performing the process on the substrate can be shortened.

前記複数の支持部材のそれぞれが、前記第1開口部に部分的に収容され、かつ、前記第1開口部を画定する前記基体の内側面と前記基体の主面との角部に全周にわたって当接した状態で前記第1開口部を塞いでいることが好ましい。 Each of the plurality of support members is partially housed in the first opening, and covers the entire circumference at a corner between an inner surface of the base and a main surface of the base that defines the first opening. It is preferable that the first opening is closed in a state of contact.

当該構成の基板保持部材によれば、第1通気路が減圧されることにより、複数の支持部材のそれぞれに対して第1開口部を通じて真空吸引力が作用して基体に対して吸着された際、各支持部材が第1開口部に部分的に収容された状態で第1開口部を画定する前記基体の内側面と前記基体の主面との角部に全周にわたって当接しているため、横方向への各支持部材の変位が防止され、基体に対する各支持部材の相対的な位置および姿勢がより確実に維持される。 According to the substrate holding member having this configuration, when the pressure in the first air passage is reduced, a vacuum suction force acts on each of the plurality of support members through the first opening and is attracted to the substrate. Since each support member is partially housed in the first opening and is in contact with the corner portion between the inner surface of the substrate defining the first opening and the main surface of the substrate over the entire circumference. Displacement of each support member in the lateral direction is prevented, and the relative position and orientation of each support member with respect to the substrate is more reliably maintained.

前記角部により画定される前記第1開口部の上端縁部が円形であり、前記支持部材が、前記第1開口部の上端縁部よりも大径の球体であることが好ましい。 It is preferable that the upper end edge portion of the first opening defined by the corner portion is circular, and the support member is a sphere having a diameter larger than that of the upper end edge portion of the first opening portion.

当該構成の基板保持部材によれば、第1通気路が減圧状態から解放された際、部分的に摩耗した支持部材が交換されることのほか、球体である支持部材が摩耗したときに支持部材を交換することなく、例えば支持部材の摩耗した部分が横向きになるように回転させることによっても、基体の主面からの支持部材の突出高さを元に戻すことができる。球体の支持部材がその中心回りに回転しても、第1開口部に対する支持部材の相対的な姿勢は変化しないため、支持部材の一部が第1開口部に収容されるように基体に配置する作業の容易化が図られる。 According to the substrate holding member having this configuration, when the first air passage is released from the decompression state, the partially worn support member is replaced, and when the spherical support member is worn, the support member is replaced. The height of the support member protruding from the main surface of the substrate can be restored by rotating the support member so that the worn portion is laterally oriented, for example, without replacing the support member. Even if the support member of the sphere rotates around its center, the relative posture of the support member with respect to the first opening does not change, so that a part of the support member is arranged on the substrate so as to be accommodated in the first opening. The work to be done is facilitated.

前記複数の第1開口部のそれぞれが、前記主面より窪んでいる底面により画定される凹部と、前記底面に開口する孔部と、により構成され、前記支持部材は、前記底面に当接して前記孔部を少なくとも部分的に塞いだ状態で前記凹部に一部が収容されることが好ましい。 Each of the plurality of first openings is composed of a recess defined by a bottom surface recessed from the main surface and a hole portion opened in the bottom surface, and the support member abuts on the bottom surface. It is preferable that a part of the hole is housed in the recess with the hole at least partially closed.

当該構成の基板保持部材によれば、第1通気路が減圧されることにより、複数の支持部材のそれぞれに対して第1開口部を構成する孔部を通じて真空吸引力が作用して、複数の支持部材のそれぞれが基体に対して吸着された際、各支持部材が凹部に部分的に収容されているため、横方向への変位が凹部を形成する内側面または側部によって抑制され、基体に対する各支持部材の相対的な位置および姿勢が確実に維持されうる。 According to the substrate holding member having the above configuration, by reducing the pressure in the first air passage, a vacuum suction force acts on each of the plurality of support members through the holes forming the first opening, so that a plurality of support members are subjected to vacuum suction force. When each of the support members is attracted to the substrate, each support member is partially accommodated in the recess, so that lateral displacement is suppressed by the inner side surface or side portion forming the recess, and the support member is suppressed with respect to the substrate. The relative position and orientation of each support member can be reliably maintained.

前記支持部材は、前記凹部を画定する底面に下端面を当接させた状態で前記凹部に少なくとも一部が収容されている下部要素と、前記下部要素の上端面から上方に突出し、前記下部要素の下端面よりも小面積の上端面を有する上部要素と、により構成されていることが好ましい。 The support member has a lower element in which at least a part thereof is housed in a state where the lower end surface is in contact with the bottom surface defining the concave portion, and the lower element projects upward from the upper end surface of the lower element. It is preferably composed of an upper element having an upper end surface having a smaller area than the lower end surface of the above.

当該構成の基板保持部材によれば、第1通気路が減圧された際に、第1開口部の孔部を通じて、支持部材を構成する下部要素の下端面に対して作用する真空吸引力の増大が図られるので、支持部材の基体に対する位置および姿勢が確実に維持される。これに加えて、支持部材を構成する上部要素の上端面と基板の裏面との接触面積の低減が図られる。 According to the substrate holding member having this configuration, when the pressure in the first air passage is reduced, the vacuum suction force acting on the lower end surface of the lower element constituting the support member is increased through the hole of the first opening. Therefore, the position and orientation of the support member with respect to the substrate are reliably maintained. In addition to this, the contact area between the upper end surface of the upper element constituting the support member and the back surface of the substrate can be reduced.

前記複数の凹部のそれぞれが、前記主面より円柱状に窪んだ形状であり、前記支持部材は、円柱状の前記下部要素と、前記下部要素よりも小径の円柱状の前記上部要素と、により構成されていることが好ましい。 Each of the plurality of recesses has a shape of being recessed in a columnar shape from the main surface, and the support member is formed by the columnar lower element and the columnar upper element having a diameter smaller than that of the lower element. It is preferably configured.

当該構成の基板保持部材によれば、支持部材を構成する円柱状の下部要素がその中心軸線回りに回転しても、第1開口部に対する下部要素の相対的な姿勢は変化しないため、支持部材の下部要素の少なくとも一部が第1開口部に収容されるように基体に配置する作業の容易化が図られる。 According to the substrate holding member having this configuration, even if the columnar lower element constituting the support member rotates around its central axis, the relative posture of the lower element with respect to the first opening does not change, so that the support member The work of arranging the lower element of the substrate on the substrate so that at least a part of the lower element is accommodated in the first opening is facilitated.

本発明の基板保持部材が、前記基体に設けられ、前記主面において前記複数の第1開口部および前記第2開口部を囲むように環状に延在し、かつ、前記主面から前記複数の支持部材のそれぞれと同じ高さまたは前記主面から前記複数の支持部材のそれぞれよりも低い高さで突出する環状凸部をさらに備えていることが好ましい。 The substrate holding member of the present invention is provided on the substrate, extends in an annular shape so as to surround the plurality of first openings and the second openings on the main surface, and the plurality of members extend from the main surface. It is preferable that the annular convex portion is further provided so as to project from the main surface at the same height as each of the support members or at a lower height than each of the plurality of support members.

当該構成の基板保持部材によれば、第2通気路の第2開口部を通じて、基体の主面と基板の裏面とにより上下が画定され、かつ、環状凸部により周縁が画定される空間が減圧された際、基板に対して基体の主面に向かって作用する真空吸引力の向上および維持が容易になる。 According to the substrate holding member having this configuration, the space where the upper and lower sides are defined by the main surface of the substrate and the back surface of the substrate and the peripheral edge is defined by the annular convex portion is decompressed through the second opening of the second air passage. When this is done, it becomes easy to improve and maintain the vacuum suction force acting on the substrate toward the main surface of the substrate.

本発明の第1実施形態としての基板保持部材の上面図。Top view of the substrate holding member as the first embodiment of the present invention. 図1のIIA−IIA線に沿った基板保持部材の縦断面図。The vertical sectional view of the substrate holding member along the line IIA-IIA of FIG. 図1のIIB−IIB線に沿った基板保持部材の縦断面図。The vertical sectional view of the substrate holding member along the line IIB-IIB of FIG. 本発明の第2実施形態としての基板保持部材の図2Aに対応する縦断面図。The vertical sectional view corresponding to FIG. 2A of the substrate holding member as the 2nd Embodiment of this invention. 本発明の第2実施形態としての基板保持部材の図2Bに対応する縦断面図。The vertical sectional view corresponding to FIG. 2B of the substrate holding member as the 2nd Embodiment of this invention.

(第1実施形態)
(構成)
図1、図2Aおよび図2Bに示されている本発明の第1実施形態としての基板保持部材は、基体1と、複数の支持部材12と、環状凸部14と、第1通気路21と、第2通気路22と、を備えている。
(First Embodiment)
(composition)
The substrate holding member as the first embodiment of the present invention shown in FIGS. 1, 2A and 2B includes a substrate 1, a plurality of support members 12, an annular convex portion 14, and a first air passage 21. , A second vent passage 22 and the like.

基体1は、SiC、AlN、Al23等のセラミックス焼結体により形成され、平坦な主面10を有している。主面10は、基板Wの支持面を構成しない。主面10は平坦ではなく、凹曲面または凸曲面であってもよい。第1通気路21は、基体1の側面から主面10に対して平行に延在する部分と、当該平行に延在する部分から主面10に向かって延在するように基体1の内部に形成され、主面10において開口する複数の第1開口部210と、を有している。第2通気路22は、基体1の側面から主面10に対して平行に延在する部分と、当該平行に延在する部分から主面10に向かって延在するように基体1の内部に形成され、主面10において開口する複数の第2開口部220を有している。 The substrate 1 is formed of a ceramic sintered body such as SiC, AlN, and Al 2 O 3, and has a flat main surface 10. The main surface 10 does not form a support surface for the substrate W. The main surface 10 is not flat and may be a concave curved surface or a convex curved surface. The first air passage 21 extends from the side surface of the substrate 1 in parallel with the main surface 10 and inside the substrate 1 so as to extend from the parallel extending portion toward the main surface 10. It has a plurality of first openings 210 that are formed and open on the main surface 10. The second ventilation passage 22 extends inside the substrate 1 so as to extend from the side surface of the substrate 1 in parallel with the main surface 10 and from the portion extending in parallel toward the main surface 10. It has a plurality of second openings 220 that are formed and open on the main surface 10.

本実施形態では、第1開口部210は、基体1の主面10より円柱状に窪んでいる凹部211(円柱状のザグリ部)と、凹部211を画定する基体1の主面10より窪んだ底面に開口する孔部212と、により構成されている。第1開口部210(またはこれを構成する凹部211)を画定する基体1の内側面と基体1の主面10との間に形成される角部は、面取り加工されている。第1開口部210は、基体1の主面10において、中心と、当該中心を基準とする一の方位群を構成する複数の方位(例えば8方位)のそれぞれについて離間した複数(例えば4つ)の位置のそれぞれと、当該一の方位群とは異なる他の方位群を構成する複数の方位(例えば8方位)のそれぞれについて離間した複数(例えば2つ)の位置のそれぞれと、に配置されている。複数の第1開口部210は、当該中心を基準とした回転対称性(例えば8回対称性)を有するように配置されている。第1通気路21のうち主面10に平行に延在している部分は、複数の第1開口部210の位置に合わせて、同心の複数の円環状部分と、当該複数の円環状部分を連通させる基体1の径方向に延在する部分と、を有している。 In the present embodiment, the first opening 210 is recessed from the recess 211 (cylindrical counterbore portion) recessed from the main surface 10 of the substrate 1 in a columnar shape and from the main surface 10 of the substrate 1 defining the recess 211. It is composed of a hole 212 that opens to the bottom surface. The corners formed between the inner surface of the substrate 1 defining the first opening 210 (or the recess 211 constituting the opening 210) and the main surface 10 of the substrate 1 are chamfered. The first opening 210 is a plurality (for example, four) separated from each other on the main surface 10 of the substrate 1 for each of a center and a plurality of directions (for example, eight directions) constituting one direction group with respect to the center. Is arranged at each of the positions of, and at each of a plurality of (for example, two) positions separated from each of a plurality of directions (for example, eight directions) constituting another direction group different from the one direction group. There is. The plurality of first openings 210 are arranged so as to have rotational symmetry (for example, eight-fold symmetry) with respect to the center. The portion of the first air passage 21 extending parallel to the main surface 10 has a plurality of concentric annular portions and the plurality of annular portions in accordance with the positions of the plurality of first openings 210. It has a portion extending in the radial direction of the substrate 1 to be communicated with.

第2開口部220は、基体1の主面10において、中心を基準とする第1開口部210が配列されている複数の方位とは異なる方位について離間した複数(例えば4つ)の位置のそれぞれに配置されている。第2通気路22のうち主面10に平行に延在している部分は、複数の第2開口部220の位置に合わせて、基体1の中心から複数の第2開口部220が配置された方位に延在する部分と、を有している。 The second opening 220 is located at a plurality of (for example, four) positions on the main surface 10 of the substrate 1 that are separated from each other in a direction different from the plurality of directions in which the first opening 210 is arranged with respect to the center. Is located in. In the portion of the second air passage 22 extending parallel to the main surface 10, the plurality of second openings 220 are arranged from the center of the substrate 1 in accordance with the positions of the plurality of second openings 220. It has a part that extends in the direction.

第1通気路21および第2通気路22のそれぞれは、別個または共通の真空吸引装置に接続されている。複数の第1開口部210のすべてが1つの第1通気路21を構成している必要はなく、一または複数の第1開口部210からなる複数の第1開口部群のそれぞれが、別個独立の複数の第1通気路のそれぞれを構成していてもよい。同様に、複数の第2開口部220のすべてが1つの第2通気路22を構成している必要はなく、一または複数の第2開口部220からなる複数の第2開口部群のそれぞれが、別個独立の複数の第2通気路のそれぞれを構成していてもよい。 Each of the first vent 21 and the second vent 22 is connected to a separate or common vacuum suction device. It is not necessary for all of the plurality of first openings 210 to form one first air passage 21, and each of the plurality of first openings groups consisting of one or more first openings 210 are independent of each other. Each of the plurality of first ventilation passages may be configured. Similarly, it is not necessary for all of the plurality of second openings 220 to form one second air passage 22, and each of the plurality of second openings groups consisting of one or more second openings 220 , Each of a plurality of separate and independent second air passages may be configured.

支持部材12は、SiC、AlN、Al23等のセラミックス焼結体により形成されている。支持部材12を構成するセラミックス焼結体と、基体1を構成するセラミックス焼結体とは、主成分が同一であってもよいし異なっていてもよい。複数の支持部材12のそれぞれは、複数の第1開口部210のそれぞれを少なくとも部分的に塞ぎ、かつ、少なくとも一部が主面10から同じ高さで突出するように基体1に対して配置される。支持部材12は、基体1とは別個の取り外し可能な部材である。 The support member 12 is formed of a ceramic sintered body such as SiC, AlN, or Al 2 O 3. The ceramics sintered body constituting the support member 12 and the ceramics sintered body constituting the substrate 1 may have the same or different main components. Each of the plurality of support members 12 is arranged with respect to the substrate 1 so as to at least partially close each of the plurality of first openings 210 and at least a part of the support members 12 project from the main surface 10 at the same height. NS. The support member 12 is a removable member separate from the substrate 1.

本実施形態では、支持部材12は、上記した基体1の角部により画定される上端縁部よりも大径の球体である。すなわち、支持部材12は、第1開口部210の凹部211に部分的に収容され、かつ、上記のように面取り加工された角部に全周にわたって当接することにより第1開口部210を塞いでいる。なお、支持部材12が第1開口部210の凹部211を画定する底面から離間しているが、支持部材12が第1開口部210の凹部211を画定する底面に当接することにより、基体1の主面10を基準とした支持部材12の上端面または上端部の高さが決定されてもよい。 In the present embodiment, the support member 12 is a sphere having a diameter larger than that of the upper end edge portion defined by the corner portions of the substrate 1 described above. That is, the support member 12 is partially housed in the recess 211 of the first opening 210, and closes the first opening 210 by abutting the corner portion chamfered as described above over the entire circumference. There is. Although the support member 12 is separated from the bottom surface defining the recess 211 of the first opening 210, the support member 12 comes into contact with the bottom surface defining the recess 211 of the first opening 210, so that the base 1 is formed. The height of the upper end surface or the upper end portion of the support member 12 with respect to the main surface 10 may be determined.

環状凸部14は、基体1に設けられ、主面10において複数の第1開口部210および第2開口部220を囲むように環状に延在し(図1参照)、かつ、主面10から複数の支持部材12のそれぞれと同じ高さで突出している。環状凸部14の縦断面形状は、矩形状、台形状、三角形状、半円形状など、様々な形状であってもよい。環状凸部14は、切削加工、ブラスト加工もしくはレーザー加工またはこれらの組み合わせにより形成される。なお、環状凸部14の高さ(上端面位置)は、主面10から複数の支持部材12のそれぞれよりも低くてもよい。 The annular convex portion 14 is provided on the substrate 1, extends in an annular shape so as to surround the plurality of first openings 210 and second openings 220 on the main surface 10 (see FIG. 1), and extends from the main surface 10 in an annular shape. It protrudes at the same height as each of the plurality of support members 12. The vertical cross-sectional shape of the annular convex portion 14 may have various shapes such as a rectangular shape, a trapezoidal shape, a triangular shape, and a semicircular shape. The annular convex portion 14 is formed by cutting, blasting, laser machining, or a combination thereof. The height (upper end surface position) of the annular convex portion 14 may be lower than each of the plurality of support members 12 from the main surface 10.

(機能)
本発明の第1実施形態としての基板保持部材によれば、基体1の主面10において複数の第1開口部210のそれぞれを少なくとも部分的に塞ぎ、かつ、少なくとも一部が主面10から同じ高さで突出するように複数の支持部材12が配置される(図2Aおよび図2B参照)。支持部材12が球体であり、その中心回りに回転しても、第1開口部210に対する支持部材12の相対的な姿勢は変化しないため、支持部材12の一部が第1開口部210に収容されるように基体1に配置する作業の容易化が図られる。
(function)
According to the substrate holding member as the first embodiment of the present invention, each of the plurality of first openings 210 is at least partially closed on the main surface 10 of the substrate 1, and at least a part thereof is the same from the main surface 10. A plurality of support members 12 are arranged so as to project at a height (see FIGS. 2A and 2B). Since the support member 12 is a sphere and the relative posture of the support member 12 with respect to the first opening 210 does not change even if the support member 12 is rotated around the center thereof, a part of the support member 12 is housed in the first opening 210. The work of arranging the substrate 1 is facilitated.

この状態で、第1通気路21が減圧されることにより、複数の支持部材12のそれぞれに対して第1開口部210を通じて真空吸引力が作用して基体1に対して吸着される。球形状の複数の支持部材12のそれぞれが、これよりも小径の第1開口部210に部分的に収容され、かつ、上記した基体1の角部に全周にわたって当接した状態で複数の第1開口部210のそれぞれを塞ぐ。このため、支持部材12が第1開口部210に対して横方向に変位することが防止され、基体1に対する各支持部材12の相対的な位置および姿勢がより確実に維持される。 In this state, the pressure of the first air passage 21 is reduced, so that a vacuum suction force acts on each of the plurality of support members 12 through the first opening 210 and is attracted to the substrate 1. Each of the plurality of spherical support members 12 is partially housed in the first opening 210 having a diameter smaller than this, and is in contact with the corner portion of the substrate 1 over the entire circumference. 1 Each of the openings 210 is closed. Therefore, the support member 12 is prevented from being displaced laterally with respect to the first opening 210, and the relative position and orientation of each support member 12 with respect to the substrate 1 is more reliably maintained.

また、基体1の主面10側に基板Wが載置されることにより、複数の支持部材12のうち少なくとも一部の上端面または上端部に基板Wの裏面が当接する。この状態で、第2通気路22が減圧されることにより、第2開口部220を通じて基体1の主面10および基板Wの裏面により挟まれ、かつ、環状凸部14により囲まれた空間が減圧され、基板Wに対して基体1の主面に向かう真空吸引力が作用し、基板Wが複数の支持部材12の全部に対して当接して平坦な状態で基板保持部材に吸着保持される。 Further, by placing the substrate W on the main surface 10 side of the substrate 1, the back surface of the substrate W comes into contact with at least a part of the upper end surface or the upper end portion of the plurality of support members 12. In this state, the pressure of the second ventilation passage 22 is reduced, so that the space sandwiched between the main surface 10 of the substrate 1 and the back surface of the substrate W through the second opening 220 and surrounded by the annular convex portion 14 is decompressed. Then, a vacuum suction force toward the main surface of the substrate 1 acts on the substrate W, and the substrate W comes into contact with all of the plurality of support members 12 and is attracted and held by the substrate holding member in a flat state.

第2通気路22が減圧状態から解放される(例えば大気圧に戻される)ことにより、基体1の主面10および基板Wの裏面により挟まれた空間も減圧状態から解放され、基板Wが基板保持部材から取り外される。第1通気路21が減圧状態から解放される(例えば大気圧に戻される)ことにより、基体1とは別個の部材である複数の支持部材12のそれぞれが真空吸引力から解放されて基体1から取り外し可能となる。 When the second ventilation passage 22 is released from the decompressed state (for example, returned to atmospheric pressure), the space sandwiched between the main surface 10 of the substrate 1 and the back surface of the substrate W is also released from the decompressed state, and the substrate W is released from the decompressed state. It is removed from the holding member. When the first air passage 21 is released from the reduced pressure state (for example, returned to atmospheric pressure), each of the plurality of support members 12 which are members separate from the base 1 is released from the vacuum suction force and is released from the base 1. It becomes removable.

このため、複数の支持部材12のうち少なくとも一部の支持部材12が摩耗した等の場合、基板保持部材全体ではなく当該少なくとも一部の支持部材12のみが容易に交換または補修等されることによって基板Wの平坦度が確保されるような吸着保持性能が回復され、かつ、基板Wに対してプロセスを施すための装置のダウンタイムの短縮化が図られる。さらに、球体である支持部材12を摩耗部分が例えば横向きになるように回転させることによっても、基体1の主面10からの複数の支持部材12の突出高さを元に戻すことができる。 Therefore, when at least a part of the support members 12 among the plurality of support members 12 is worn, only at least a part of the support members 12 is easily replaced or repaired, not the entire substrate holding member. The suction holding performance is restored so that the flatness of the substrate W is ensured, and the downtime of the apparatus for performing the process on the substrate W can be shortened. Further, by rotating the support member 12 which is a sphere so that the worn portion is oriented sideways, for example, the protruding heights of the plurality of support members 12 from the main surface 10 of the substrate 1 can be restored.

(第2実施形態)
(構成)
図3Aおよび図3Bに示されている本発明の第2実施形態としての基板保持部材においては、支持部材120が、第1開口部210を構成する凹部211を画定する基体1の底面に当接して孔部212を少なくとも部分的に塞いだ状態で凹部211に一部が収容されるように構成されている。
(Second Embodiment)
(composition)
In the substrate holding member as the second embodiment of the present invention shown in FIGS. 3A and 3B, the support member 120 abuts on the bottom surface of the substrate 1 defining the recess 211 constituting the first opening 210. The hole 212 is configured to be partially housed in the recess 211 with the hole 212 at least partially closed.

より具体的には、支持部材120が、凹部211を画定する基体1の底面に下端面を当接させた状態で凹部211に少なくとも一部が収容されている円柱状の下部要素121と、下部要素121の上端面から上方に突出し、下部要素121の下端面よりも小面積の上端面を有する円柱状の上部要素122と、により構成されている。 More specifically, the support member 120 has a columnar lower element 121 in which at least a part of the support member 120 is housed in the recess 211 in a state where the lower end surface is in contact with the bottom surface of the substrate 1 defining the recess 211, and a lower portion. It is composed of a columnar upper element 122 that protrudes upward from the upper end surface of the element 121 and has an upper end surface having a smaller area than the lower end surface of the lower element 121.

本実施形態では、円柱状の下部要素121は、凹部211を画定する基体1の内側面の内径よりも小径であり、その分だけ下部要素121の側面および凹部211を画定する内側面の間には間隙が存在する。円柱状の下部要素121が孔部212よりも大径である。このため、第1開口部210または第1開口部210を構成する孔部212の全部が支持部材120またはこれを構成する下部要素121の下端面により塞がれる。 In the present embodiment, the columnar lower element 121 has a diameter smaller than the inner diameter of the inner surface of the base 1 that defines the recess 211, and is between the side surface of the lower element 121 and the inner surface that defines the recess 211 by that amount. There is a gap. The columnar lower element 121 has a larger diameter than the hole 212. Therefore, the first opening 210 or all the holes 212 forming the first opening 210 are closed by the support member 120 or the lower end surface of the lower element 121 constituting the support member 120.

上記した以外の基板保持装置の構成は、第1実施形態と同様であるため、同一符号を用いるとともに説明を省略する。 Since the configuration of the substrate holding device other than the above is the same as that of the first embodiment, the same reference numerals are used and the description thereof will be omitted.

(機能)
本発明の第2実施形態としての基板保持部材によれば、基体1の主面10において複数の第1開口部210のそれぞれを少なくとも部分的に塞ぎ、かつ、少なくとも一部が主面10から同じ高さで突出するように複数の支持部材120が配置される(図3Aおよび図3B参照)。支持部材120を構成する円柱状の下部要素121がその中心軸線回りに回転しても、第1開口部210に対する下部要素121の相対的な姿勢は変化しないため、支持部材120の下部要素121の少なくとも一部が第1開口部210の凹部211に収容されるように基体1に配置する作業の容易化が図られる。
(function)
According to the substrate holding member as the second embodiment of the present invention, each of the plurality of first openings 210 is at least partially closed on the main surface 10 of the substrate 1, and at least a part thereof is the same from the main surface 10. A plurality of support members 120 are arranged so as to project at a height (see FIGS. 3A and 3B). Even if the columnar lower element 121 constituting the support member 120 rotates around its central axis, the relative posture of the lower element 121 with respect to the first opening 210 does not change, so that the lower element 121 of the support member 120 The work of arranging the substrate 1 so that at least a part thereof is accommodated in the recess 211 of the first opening 210 can be facilitated.

この状態で、第1通気路21が減圧されることにより、複数の支持部材120のそれぞれに対して第1開口部210を通じて真空吸引力が作用して、複数の支持部材120のそれぞれが基体1に対して吸着される。支持部材120を構成する円柱状の下部要素121の下端面が、これよりも小径の複数の第1開口部210のそれぞれを塞ぐ。この際、支持部材120が第1開口部210に対して横方向に変位することが凹部211を画定する内側面によって抑制され、基体1に対する各支持部材120の相対的な位置および姿勢が確実に維持される。 In this state, the pressure of the first air passage 21 is reduced, so that a vacuum suction force acts on each of the plurality of support members 120 through the first opening 210, and each of the plurality of support members 120 is a substrate 1. Is adsorbed against. The lower end surface of the columnar lower element 121 constituting the support member 120 closes each of the plurality of first openings 210 having a smaller diameter. At this time, the lateral displacement of the support member 120 with respect to the first opening 210 is suppressed by the inner surface defining the recess 211, and the relative position and posture of each support member 120 with respect to the substrate 1 is ensured. Be maintained.

また、基体1の主面10側に基板Wが載置されることにより、複数の支持部材120またはこれを構成する上部要素122のうち少なくとも一部の上端面または上端部に基板Wの裏面が当接する。この状態で、第2通気路22が減圧されることにより、第2開口部220を通じて基体1の主面10および基板Wの裏面により挟まれ、かつ、環状凸部14により囲まれた空間が減圧され、基板Wに対して基体1の主面に向かう真空吸引力が作用し、基板Wが複数の支持部材120の全部に対して当接して平坦な状態で基板保持部材に吸着保持される。 Further, by placing the substrate W on the main surface 10 side of the substrate 1, the back surface of the substrate W is placed on the upper end surface or the upper end portion of at least a part of the plurality of support members 120 or the upper elements 122 constituting the support member 120. Contact. In this state, the pressure of the second ventilation passage 22 is reduced, so that the space sandwiched between the main surface 10 of the substrate 1 and the back surface of the substrate W through the second opening 220 and surrounded by the annular convex portion 14 is decompressed. Then, a vacuum suction force toward the main surface of the substrate 1 acts on the substrate W, and the substrate W comes into contact with all of the plurality of support members 120 and is attracted and held by the substrate holding member in a flat state.

支持部材120を構成する下部要素121の下端面の面積よりも、上部要素122の上端面の面積が小さいため、第1通気路21が減圧された際に、第1開口部210の孔部212を通じて、支持部材120を構成する下部要素121の下端面に対して作用する真空吸引力の増大が図られるので、支持部材120の基体1に対する位置および姿勢が確実に維持される。これに加えて、支持部材120を構成する上部要素122の上端面と基板Wの裏面との接触面積の低減が図られる。 Since the area of the upper end surface of the upper element 122 is smaller than the area of the lower end surface of the lower element 121 constituting the support member 120, the hole 212 of the first opening 210 when the first air passage 21 is depressurized. Through this, the vacuum suction force acting on the lower end surface of the lower element 121 constituting the support member 120 is increased, so that the position and orientation of the support member 120 with respect to the substrate 1 are surely maintained. In addition to this, the contact area between the upper end surface of the upper element 122 constituting the support member 120 and the back surface of the substrate W can be reduced.

第2通気路22が減圧状態から解放される(例えば大気圧に戻される)ことにより、基体1の主面10および基板Wの裏面により挟まれた空間も減圧状態から解放され、基板Wが基板保持部材から取り外される。第1通気路21が減圧状態から解放される(例えば大気圧に戻される)ことにより、基体1とは別個の部材である複数の支持部材120のそれぞれが真空吸引力から解放されて基体1から取り外し可能となる。 When the second ventilation passage 22 is released from the decompressed state (for example, returned to atmospheric pressure), the space sandwiched between the main surface 10 of the substrate 1 and the back surface of the substrate W is also released from the decompressed state, and the substrate W is released from the decompressed state. It is removed from the holding member. When the first air passage 21 is released from the reduced pressure state (for example, returned to atmospheric pressure), each of the plurality of support members 120, which are members separate from the base 1, is released from the vacuum suction force and is released from the base 1. It becomes removable.

このため、複数の支持部材120のうち少なくとも一部の支持部材120が摩耗または損傷した場合、基板保持部材全体ではなく当該少なくとも一部の支持部材120のみが交換または補修されることによって基板Wの平坦度が確保されるような吸着保持性能が回復され、かつ、基板Wに対してプロセスを施すための装置のダウンタイムの短縮化が図られる。 Therefore, when at least a part of the support members 120 out of the plurality of support members 120 is worn or damaged, only at least a part of the support members 120 is replaced or repaired instead of the entire substrate holding member, so that the substrate W is replaced or repaired. The suction holding performance that ensures flatness is restored, and the downtime of the device for performing the process on the substrate W can be shortened.

(本発明の他の実施形態)
第1実施形態では、基体1の内側面と主面10との角部によって画定される第1開口部210の上端縁部が円形状であり、支持部材12が球形状であったが、支持部材12が基体1の角部に対して全周にわたって当接するように、支持部材12および第1開口部210の上端縁部のそれぞれの形状およびサイズがさまざまな形態で設計されてもよい。例えば、第1開口部210の上端縁部が円形状に形成され、支持部材12の下部が球面状、楕円球面状、下向きの円錐状または下向きの円錐台状などに形成されていてもよい。また、第1開口部210の上端縁部が矩形状に形成され、支持部材12の下部が下向きの四角錐状または下向きの四角錐台状などに形成されていてもよい。基体1の角部には面取り加工(C面取り加工・R面取り加工)が施されていることが好ましい。
(Other Embodiments of the present invention)
In the first embodiment, the upper end edge of the first opening 210 defined by the corners between the inner surface of the substrate 1 and the main surface 10 is circular, and the support member 12 is spherical, but the support The shapes and sizes of the support member 12 and the upper end edge of the first opening 210 may be designed in various forms so that the member 12 abuts on the corners of the substrate 1 over the entire circumference. For example, the upper end edge of the first opening 210 may be formed in a circular shape, and the lower portion of the support member 12 may be formed in a spherical shape, an elliptical spherical shape, a downward conical shape, a downward conical cone shape, or the like. Further, the upper end edge of the first opening 210 may be formed in a rectangular shape, and the lower portion of the support member 12 may be formed in a downward quadrangular pyramid shape, a downward quadrangular pyramid shape, or the like. It is preferable that the corners of the substrate 1 are chamfered (C chamfering / R chamfering).

第1実施形態において、支持部材12が基体1の角部に対して周方向の一部において当接するように、支持部材12および第1開口部210の上端縁部のそれぞれの形状が変更されてもよい。例えば、第1開口部210の上端縁部が前方後円形状に形成され、支持部材12の下部が当該後円より大径の球面状、半楕円球面状、底面が当該後円より大径の下向きの円錐状または下向きの円錐台状などに形成されていてもよい。 In the first embodiment, the shapes of the support member 12 and the upper end edge of the first opening 210 are changed so that the support member 12 abuts on the corner portion of the substrate 1 in a part in the circumferential direction. May be good. For example, the upper end edge of the first opening 210 is formed in a front-rear circular shape, the lower portion of the support member 12 has a spherical shape or a semi-elliptical spherical shape having a diameter larger than the rear circle, and the bottom surface has a diameter larger than the rear circle. It may be formed in a downward conical shape or a downward conical trapezoidal shape.

第2実施形態において、支持部材120を構成する下部要素121および上部要素122がともに円柱状に形成されていたが、これ以外のさまざまな形状に形成されていてもよい。例えば、下部要素121が柱状に形成され、上部要素122が下部要素121の上端面と底面を共通にする円錐台状または各錐台状に形成されていてもよい。 In the second embodiment, both the lower element 121 and the upper element 122 constituting the support member 120 are formed in a columnar shape, but they may be formed in various other shapes. For example, the lower element 121 may be formed in a columnar shape, and the upper element 122 may be formed in a truncated cone shape or a truncated cone shape in which the upper end surface and the bottom surface of the lower element 121 are shared.

第2実施形態において、支持部材120を構成する下部要素121の下端面の面積より上部要素122の上端面の面積が小さく設計されていたが、下部要素121の下端面の面積より上部要素122の上端面の面積が大きく設計されていてもよく、または、下部要素121の下端面の面積と上部要素122の上端面の面積とが同じになるように設計されていてもよい。例えば、支持部材120が下部要素121および上部要素122の区別なく、柱状または筒状に形成されていてもよい。 In the second embodiment, the area of the upper end surface of the upper element 122 is designed to be smaller than the area of the lower end surface of the lower element 121 constituting the support member 120, but the area of the upper element 122 is smaller than the area of the lower end surface of the lower element 121. The area of the upper end surface may be designed to be large, or the area of the lower end surface of the lower element 121 and the area of the upper end surface of the upper element 122 may be designed to be the same. For example, the support member 120 may be formed in a columnar or cylindrical shape without distinguishing between the lower element 121 and the upper element 122.

第2実施形態において、支持部材120が第1開口部210を構成する孔部212の全部を塞ぐように、支持部材120のそれぞれの形状およびサイズがさまざまな形態で設計されてもよい。例えば、支持部材120が上向きの円錐状、角錐状、円錐台状、角錐台状、段差付きの錐状または錐台状などの形状に形成され、その底面または下底面が孔部212の全部を塞ぐようにサイズが設計されてもよい。第2実施形態において、支持部材120が第1開口部210を構成する孔部212の一部を塞ぐように、支持部材12のそれぞれの形状およびサイズがさまざまな形態で設計されてもよい。例えば、支持部材12が上向きの円錐状、角錐状、円錐台状または角錐台状などに形成され、底面または下底面の面積が小さくされることで孔部212の一部のみを塞ぐようにサイズが設計されてもよい。 In the second embodiment, each shape and size of the support member 120 may be designed in various forms so that the support member 120 closes all of the holes 212 constituting the first opening 210. For example, the support member 120 is formed in a shape such as an upward cone, a pyramid, a cone, a cone, a stepped cone, or a cone, and the bottom surface or the bottom surface thereof covers the entire hole 212. The size may be designed to block. In the second embodiment, each shape and size of the support member 12 may be designed in various forms so that the support member 120 closes a part of the hole 212 forming the first opening 210. For example, the support member 12 is formed in an upward conical shape, a pyramidal shape, a truncated cone shape, a truncated cone shape, or the like, and is sized so as to close only a part of the hole 212 by reducing the area of the bottom surface or the lower bottom surface. May be designed.

前記実施形態の基板保持部材において、基体1における環状凸部14が省略されてもよい。前記実施形態の基板保持部材において、複数の支持部材12、120の基体1の主面10からの突出高さ(上端点または上端面の高さ位置)はすべて同じであったが、一部の突出部材12、120の基体1の主面10からの突出高さが、他の突出部材12、120の基体1の主面10からの突出高さと異なっていてもよい。 In the substrate holding member of the embodiment, the annular convex portion 14 in the substrate 1 may be omitted. In the substrate holding member of the above embodiment, the protrusion heights (upper end points or upper end surface height positions) of the plurality of support members 12 and 120 from the main surface 10 of the substrate 1 are all the same, but some of them are the same. The protruding height of the protruding members 12 and 120 from the main surface 10 of the base 1 may be different from the protruding height of the other protruding members 12 and 120 from the main surface 10 of the base 1.

前記実施形態の基板保持部材において、環状凸部14の基体1の主面10からの突出高さは、複数の支持部材12、120の基体1の主面10からの突出高さと同じであったが、環状凸部14の基体1の主面10からの突出高さが、複数の支持部材12、120の基体1の主面10からの突出高さより低くてもよい。このとき、環状凸部14は、基体1の主面10および基板Wの裏面により挟まれ、かつ、環状凸部14により囲まれた空間と大気との差圧が50kPa以上確保できる程度の高さに調節されることが好ましい。環状凸部14の突出高さを支持部材12、120の突出高さより低くすると、環状凸部14と基板Wとの接触が回避される分だけ基板Wと基体1との接触面積が小さくなるため、基体1が基板Wに接触することに由来するパーティクルの発生を抑制することができる。 In the substrate holding member of the above embodiment, the protruding height of the annular convex portion 14 from the main surface 10 of the substrate 1 was the same as the protruding height of the plurality of support members 12 and 120 from the main surface 10 of the substrate 1. However, the protruding height of the annular convex portion 14 from the main surface 10 of the base 1 may be lower than the protruding height of the plurality of support members 12 and 120 from the main surface 10 of the base 1. At this time, the annular convex portion 14 is sandwiched between the main surface 10 of the substrate 1 and the back surface of the substrate W, and is high enough to secure a pressure difference of 50 kPa or more between the space surrounded by the annular convex portion 14 and the atmosphere. It is preferable to adjust to. When the protruding height of the annular convex portion 14 is made lower than the protruding height of the support members 12 and 120, the contact area between the substrate W and the substrate 1 is reduced by the amount that the contact between the annular convex portion 14 and the substrate W is avoided. , It is possible to suppress the generation of particles resulting from the contact of the substrate 1 with the substrate W.

前記実施形態の基板保持部材において、支持部材12、120は、SiC、AlN、A2lO3等のセラミックス焼結体であったが、支持部材12、120を構成する素材は、ポリイミド、PTFE(ポリテトラフルオロエチレン)、PEEK(ポリエーテルエーテルケトン)などの合成樹脂、金属、あるいは石英ガラスであってもよい。支持部材12、120が合成樹脂からなる場合には、支持部材12、120がセラミックス焼結体である場合と比較してケミカルコンタミネーションを抑制することができる。 In the substrate holding member of the above embodiment, the support members 12 and 120 were ceramic sintered bodies such as SiC, AlN, and A 2 lO 3 , but the materials constituting the support members 12 and 120 were polyimide and PTFE ( It may be a synthetic resin such as polytetrafluoroethylene) or PEEK (polyetheretherketone), a metal, or quartz glass. When the support members 12 and 120 are made of synthetic resin, chemical contamination can be suppressed as compared with the case where the support members 12 and 120 are ceramic sintered bodies.

(実施例)
(実施例1)
図1、図2Aおよび図2Bに示されている本発明の第1実施形態にしたがって実施例1の基板保持装置が作製された。外径φ300mm、厚さ7mmの略円盤状のSiCセラミックス焼結体からなる基体1が作製された。直径1.5mm、基体1の主面10からの深さ2.0mmの略円柱状の凹部211と、直径1.0mm、基体1の主面10からの深さ3.0mmの略円柱状の孔部212と、を有する第1開口部210と、直径2.0mm、基体1の主面10からの深さ5.0mmの略円柱状の第2開口部220と、が形成された。直径4mmの略球形状のアルミナ焼結体からなる複数の支持部材12が作製された。外径φ299mm、幅0.5mm、高さ500μmの略矩形状の縦断面形状を有する円環状の環状凸部14が基体1の主面10の周縁部に形成された。基体1の主面10と第1開口部210を画定する基体1の内側面との角部が面取り加工されることにより、角部に対して、球形状の支持部材12を当接させた際、支持部材12の高さが環状凸部14の高さと同じになるように調節された。
(Example)
(Example 1)
The substrate holding device of Example 1 was manufactured according to the first embodiment of the present invention shown in FIGS. 1, 2A and 2B. A substrate 1 made of a substantially disk-shaped SiC ceramic sintered body having an outer diameter of φ300 mm and a thickness of 7 mm was produced. A substantially cylindrical recess 211 having a diameter of 1.5 mm and a depth of 2.0 mm from the main surface 10 of the substrate 1 and a substantially cylindrical recess 211 having a diameter of 1.0 mm and a depth of 3.0 mm from the main surface 10 of the substrate 1. A first opening 210 having a hole 212 and a substantially columnar second opening 220 having a diameter of 2.0 mm and a depth of 5.0 mm from the main surface 10 of the substrate 1 were formed. A plurality of support members 12 made of a substantially spherical alumina sintered body having a diameter of 4 mm were produced. An annular convex portion 14 having a substantially rectangular vertical cross-sectional shape having an outer diameter of φ299 mm, a width of 0.5 mm, and a height of 500 μm was formed on the peripheral edge of the main surface 10 of the substrate 1. When the corner portion between the main surface 10 of the base 1 and the inner surface of the base 1 defining the first opening 210 is chamfered so that the spherical support member 12 is brought into contact with the corner portion. , The height of the support member 12 was adjusted to be the same as the height of the annular convex portion 14.

基体1の主面10側に基板Wとしてシリコンウエハを載置した後、第1通気路21および第2通気路22が真空吸引装置により、基体1の主面10および基板Wの裏面により挟まれ、かつ、環状凸部14により囲まれた空間と大気との差圧が85kPaとなるまで減圧された。その結果、基板Wは環状凸部14および支持部材12のそれぞれの上端面に形成される平面で吸着保持された。この状態で、基板Wの平坦度をレーザー干渉計(ZYGO社製 GPI Hs)で測定した。基板W全体での測定結果は、PV値で3.1μmであり、十分な平坦度が確保された状態で基板Wを基板保持部材で吸着保持できることが確認された。 After placing the silicon wafer as the substrate W on the main surface 10 side of the substrate 1, the first ventilation passage 21 and the second ventilation passage 22 are sandwiched between the main surface 10 of the substrate 1 and the back surface of the substrate W by the vacuum suction device. Moreover, the pressure was reduced until the differential pressure between the space surrounded by the annular convex portion 14 and the atmosphere became 85 kPa. As a result, the substrate W was attracted and held by the flat surfaces formed on the upper end surfaces of the annular convex portion 14 and the support member 12. In this state, the flatness of the substrate W was measured with a laser interferometer (GPI Hs manufactured by ZYGO). The measurement result of the entire substrate W was 3.1 μm in PV value, and it was confirmed that the substrate W could be adsorbed and held by the substrate holding member while sufficient flatness was secured.

(実施例2)
図3Aおよび図3Bに示されている本発明の第2実施形態にしたがって実施例2の基板保持装置が作製された。外径φ300mm、厚さ7mmの略円盤状のSiCセラミックス焼結体からなる基体1が作製された。直径4.0mm、基体1の主面10からの深さ3.0mmの略円柱状の凹部211と、直径1.0mm、基体1の主面10からの深さ3.0mmの略円柱状の孔部212と、直径2.0mm、基体1の主面10からの深さ5.0mmの略円柱状の第2開口部220と、が形成された。外径φ3.9mm、高さ2.6mmの略円柱状の下部要素121および外径φ0.5mm、高さ0.5mmの略円柱状の上部要素122により構成されるアルミナ焼結体からなる複数の支持部材120が作製された。外径φ299mm、幅0.5mm、高さ100μmの略矩形状の縦断面形状を有する円環状の環状凸部14が基体1の主面10の周縁部に形成された。
(Example 2)
The substrate holding device of Example 2 was manufactured according to the second embodiment of the present invention shown in FIGS. 3A and 3B. A substrate 1 made of a substantially disk-shaped SiC ceramic sintered body having an outer diameter of φ300 mm and a thickness of 7 mm was produced. A substantially cylindrical recess 211 having a diameter of 4.0 mm and a depth of 3.0 mm from the main surface 10 of the substrate 1 and a substantially cylindrical recess 211 having a diameter of 1.0 mm and a depth of 3.0 mm from the main surface 10 of the substrate 1. A hole 212 and a substantially columnar second opening 220 having a diameter of 2.0 mm and a depth of 5.0 mm from the main surface 10 of the substrate 1 were formed. A plurality of alumina sintered bodies composed of a substantially cylindrical lower element 121 having an outer diameter of φ3.9 mm and a height of 2.6 mm and a substantially cylindrical upper element 122 having an outer diameter of φ0.5 mm and a height of 0.5 mm. The support member 120 of the above was manufactured. An annular convex portion 14 having a substantially rectangular vertical cross-sectional shape having an outer diameter of φ299 mm, a width of 0.5 mm, and a height of 100 μm was formed on the peripheral edge of the main surface 10 of the substrate 1.

基体1の主面10側に基板Wとしてシリコンウエハを載置した後、第1通気路21および第2通気路22が真空吸引装置により、基体1の主面10および基板Wの裏面により挟まれ、かつ、環状凸部14により囲まれた空間と大気との差圧が80kPaとなるまで減圧された。その結果、基板Wは環状凸部14および支持部材12のそれぞれの上端面に形成される平面で吸着保持された。この状態で、基板Wの平坦度をレーザー干渉計(ZYGO社製 GPI Hs)で測定した。基板W全体での測定結果は、PV値で4.8μmであり、十分な平坦度が確保された状態で基板Wを基板保持部材で吸着保持できることが確認された。 After placing a silicon wafer as the substrate W on the main surface 10 side of the substrate 1, the first ventilation passage 21 and the second ventilation passage 22 are sandwiched between the main surface 10 of the substrate 1 and the back surface of the substrate W by a vacuum suction device. Moreover, the pressure was reduced until the differential pressure between the space surrounded by the annular convex portion 14 and the atmosphere became 80 kPa. As a result, the substrate W was attracted and held by the flat surfaces formed on the upper end surfaces of the annular convex portion 14 and the support member 12. In this state, the flatness of the substrate W was measured with a laser interferometer (GPI Hs manufactured by ZYGO). The measurement result of the entire substrate W was 4.8 μm in PV value, and it was confirmed that the substrate W could be adsorbed and held by the substrate holding member while sufficient flatness was secured.

1‥基体、10‥主面、12、120‥支持部材、14‥環状凸部、21‥第1通気路、22‥第2通気路、121‥下部要素、122‥上部要素、210‥第1開口部、211‥凹部、212‥孔部、220‥第2開口部、W‥基板(ウエハ)。 1-base, 10-main surface, 12, 120-support member, 14-annular convex portion, 21-first ventilation path, 22-second ventilation path, 121-lower element, 122-upper element, 210-first Opening, 211, concave, 212, hole, 220, second opening, W. Substrate (wafer).

Claims (7)

主面を有する基体と、
前記基体に設けられ、前記主面において開口する複数の第1開口部を有する1つ以上の第1通気路と、
前記基体に設けられ、前記主面において開口する第2開口部を有する第2通気路と、
前記複数の第1開口部のそれぞれを少なくとも部分的に塞ぎ、かつ、少なくとも一部が前記主面から突出するように前記基体に対して取り外し可能に配置される複数の支持部材と、を備えていることを特徴とする基板保持部材。
A substrate with a main surface and
One or more first vents provided on the substrate and having a plurality of first openings that open on the main surface.
A second vent that is provided on the substrate and has a second opening that opens on the main surface.
Provided with a plurality of support members that are at least partially closed to each of the plurality of first openings and that are detachably arranged with respect to the substrate so that at least a part thereof protrudes from the main surface. A substrate holding member characterized by being present.
前記複数の支持部材のそれぞれが、前記第1開口部に部分的に収容され、かつ、前記第1開口部を画定する前記基体の内側面と前記基体の主面との角部に全周にわたって当接した状態で前記第1開口部を塞いでいることを特徴とする請求項1記載の基板保持部材。 Each of the plurality of support members is partially housed in the first opening, and covers the entire circumference at a corner between an inner surface of the base and a main surface of the base that defines the first opening. The substrate holding member according to claim 1, wherein the first opening is closed in a state of being in contact with the first opening. 前記角部により画定される前記第1開口部の上端縁部が円形であり、
前記支持部材が、前記第1開口部の上端縁部よりも大径の球体であることを特徴とする請求項2記載の基板保持部材。
The upper end edge of the first opening defined by the corner is circular.
The substrate holding member according to claim 2, wherein the support member is a sphere having a diameter larger than that of the upper end edge portion of the first opening.
前記複数の第1開口部のそれぞれが、前記主面より窪んでいる底面により画定される凹部と、前記底面に開口する孔部と、により構成され、
前記支持部材は、前記底面に当接して前記孔部を少なくとも部分的に塞いだ状態で前記凹部に一部が収容されることを特徴とする請求項1記載の基板保持部材。
Each of the plurality of first openings is composed of a recess defined by a bottom surface recessed from the main surface and a hole portion opened in the bottom surface.
The substrate holding member according to claim 1, wherein the support member is partially housed in the recess in a state of being in contact with the bottom surface and at least partially closing the hole.
前記支持部材は、前記凹部を画定する底面に下端面を当接させた状態で前記凹部に少なくとも一部が収容されている下部要素と、前記下部要素の上端面から上方に突出し、前記下部要素の下端面よりも小面積の上端面を有する上部要素と、により構成されていることを特徴とする請求項4記載の基板保持部材。 The support member has a lower element in which at least a part of the lower element is housed in a state where the lower end surface is in contact with the bottom surface defining the concave portion, and the lower element projects upward from the upper end surface of the lower element. The substrate holding member according to claim 4, further comprising an upper element having an upper end surface having an area smaller than that of the lower end surface of the above. 前記複数の凹部のそれぞれが、前記主面より円柱状に窪んだ形状であり、
前記支持部材は、円柱状の前記下部要素と、前記下部要素よりも小径の円柱状の前記上部要素と、により構成されていることを特徴とする請求項5記載の基板保持部材。
Each of the plurality of recesses has a shape of being recessed in a columnar shape from the main surface.
The substrate holding member according to claim 5, wherein the support member is composed of the columnar lower element and the columnar upper element having a diameter smaller than that of the lower element.
前記基体に設けられ、前記主面において前記複数の第1開口部および前記第2開口部を囲むように環状に延在し、かつ、前記主面から前記複数の支持部材のそれぞれと同じ高さまたは前記主面から前記複数の支持部材のそれぞれよりも低い高さで突出する環状凸部をさらに備えていることを特徴とする請求項1〜6のうちいずれか1つに記載の基板保持部材。 It is provided on the substrate, extends in an annular shape on the main surface so as to surround the plurality of first openings and the second opening, and has the same height as each of the plurality of support members from the main surface. The substrate holding member according to any one of claims 1 to 6, further comprising an annular convex portion protruding from the main surface at a height lower than that of each of the plurality of support members. ..
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