JP6954238B2 - Vacuum pump power supply and vacuum pump - Google Patents

Description

The present invention relates to a power supply device for a vacuum pump and a vacuum pump device.

High-vacuum vacuum pumps such as turbo molecular pumps are used in, for example, semiconductor manufacturing equipment. In such a vacuum pump, there is known a vacuum pump in which a pump body for performing vacuum exhaust and a power supply device for driving and controlling the pump body are integrally provided (see, for example, Patent Document 1).

The power supply unit is equipped with a power supply unit, motor drive unit, control unit, etc. necessary for drive control of the pump body, but an external device can be connected to the power supply device to communicate with the external device or to connect the external device. In the case of control, the power supply device may be further provided with an external connection circuit for connecting to the external device. For example, in the case of a configuration in which communication is performed with the main controller of the semiconductor manufacturing apparatus, the power supply apparatus is provided with a communication circuit necessary for communication with the main controller.

Japanese Unexamined Patent Publication No. 2014-0438227

However, if the housing of the power supply device is designed to have a sufficient size so that various external connection circuits can be accommodated, the power supply device becomes larger than necessary. In addition, if the power supply housing is designed according to the size of the external connection circuit that should be supported in order to reduce the size of the power supply, it is necessary to prepare a housing that corresponds to the external connection circuit, which increases costs. Invite.

The power supply device for a vacuum pump according to a preferred embodiment of the present invention includes a first housing in which a control unit and a power supply unit of the vacuum pump main body are housed, and the first housing so as to project from the first housing. A second housing having a circuit accommodation space communicating with the internal space of the first housing, and being accommodated in the circuit accommodation space and connected to at least one of the power supply unit and the control unit. It also includes an external connection circuit that is also connected to an external device, and a connector that is provided on the outer peripheral surface of the second housing and is provided on the outer peripheral surface of the second housing to connect the external connection circuit and the external device.
In a more preferred embodiment, the external connector circuit has a first communication circuit for inputting / outputting a first signal according to the first communication standard and a second communication circuit for inputting / outputting a second signal according to the second communication standard. The connector has a communication circuit, and the connector includes a first signal connector for inputting / outputting the first signal to the external device and a second signal for inputting / outputting the second signal to the external device. Includes signal connector.
In a more preferred embodiment, the external connection circuit has a heat generating component, and the heat generating component is in thermal contact with the inner peripheral surface of the second housing, and the heat of the heat generating component is transferred to the second heat generating component. Heat is dissipated through the housing.
In a more preferred embodiment, the external device is a heater that heats the vacuum pump body, the external connection circuit includes a heater control circuit that controls the heater, and the heater control circuit is a power source from the power supply unit. Is supplied to the heater via the connector.
In a more preferred embodiment, the first housing is a cast product using an aluminum alloy, and the second housing is a sheet metal product.
In a more preferred embodiment, an opening is formed on one side surface of the first housing so as to communicate the circuit accommodation space of the second housing and the internal space of the first housing. The second housing is attached to the one side surface of the first housing so as to close the opening of the first housing, and is attached to the opening of the first housing. A cable connecting the control unit or the power supply unit in the first housing and the external connection circuit in the second housing is inserted.
The vacuum pump device according to a preferred embodiment of the present invention includes a vacuum pump main body, the vacuum pump power supply device according to the above aspect, and a cooling member that integrally cools the vacuum pump main body and the vacuum pump power supply device. Of the first and second housings, at least the first housing is in thermal contact with the cooling member.

According to the present invention, the housing of the power supply device provided with the power supply unit and the control unit of the pump body is composed of the first housing and the second housing, and the specifications are changed to increase the size of the parts and the parts. When a specification change such as an addition occurs, only the second housing can be redesigned to handle it, so it is possible to suppress the increase in size of the housing, which was indispensable for one conventional housing, and the power supply device. It is possible to reduce the cost of.

FIG. 1 is a diagram showing a first embodiment of a vacuum pump device. FIG. 2 is a perspective view of the power supply device in a state where the second housing is removed from the first housing. FIG. 3 is a diagram illustrating the relationship between the control circuit board and the communication circuit. FIG. 4 is a diagram showing a second embodiment of the vacuum pump device according to the present invention. FIG. 5 is a diagram showing an example of the arrangement of the heater control circuit in the second housing.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
− First Embodiment −
FIG. 1 is a diagram showing a first embodiment of the vacuum pump device according to the present invention. The vacuum pump device 1 includes a pump main body 10 and a power supply device 20. The pump body 10 and the power supply device 20 are bolted together, and the vacuum pump device 1 is integrally configured. Although not shown in FIG. 1, the pump body 10 is provided with a rotor and a stator that are rotationally driven by a motor, and the gas exhausted from the intake port 101 is discharged from the exhaust port 102.

In the vacuum pump device 1 shown in FIG. 1, the pump body 10 and the power supply device 20 are integrated, but the present invention also applies to a vacuum pump device in which the pump body 10 and the power supply device 20 are separate bodies. be able to.

The power supply device 20 includes a first housing 201 fixed to the pump main body 10, and a second housing 202 fixed so as to project to the side surface of the first housing 201. The first housing 201 is, for example, a cast product using an aluminum alloy, and its shape and size are difficult to change. The second housing 202 is, for example, a sheet metal product using thin sheet steel, and its shape. It has the feature that it is easy to change the size and size. The present invention has been made to improve the degree of freedom in design when the specifications of the pump device are changed and the number of additional parts and parts is increased.

The power supply unit 210, the control unit 211, and the motor drive unit 212 are provided in the internal space 201S of the first housing 201. A communication circuit 220 is provided in the circuit accommodation space 202S, which is an internal space of the second housing 202, and connectors 221, 222 are provided on the outer peripheral surface of the second housing 202.

Power from a commercial power supply (for example, AC200V) is supplied to the power supply device 20, and the power supply unit 210 converts the power of the commercial power supply into DC power of a predetermined voltage (a plurality of voltages corresponding to a strong electric system and a weak electric system). Supply to the circuit as power. The motor drive unit 212 drives the rotor rotation motor provided in the pump main body 10 by the electric power from the power supply unit 210. The control unit 211 controls the entire vacuum pump device 1 including the control of the motor drive unit 212.

The connectors 221, 222 provided in the second housing 202 of the power supply device 20 are connectors for signals connected to the external device. As the external device, for example, there is a main control device 1000 such as a semiconductor manufacturing device on which the vacuum pump device 1 is mounted. In the example shown in FIG. 1, the main control device 1000 is connected to the connector 222. For example, a start / stop signal, a rotation speed signal, and current value information of the pump main body 10 are exchanged between the communication circuit 220 and the main control device 1000.

In the present embodiment, the power supply device 20 can input / output signals according to two types of communication standards. The signal of the first communication standard (serial communication such as RS-232C as an example) is input / output from the connector 221 and the signal of the second communication standard (EtherCAT as an example) is input / output from the connector 222. .. Since the second communication standard is adopted for the main control device 1000, the main control device 1000 is connected to the connector 222. In addition to the above-mentioned communication standards, there are various communication standards used for the communication circuit 220, such as EtherNet / IP, Profinet, and C-C link IE.

FIG. 2 is a perspective view showing a part of the power supply device 20 in a state where the second housing 202 is removed from the first housing 201. The alternate long and short dash line indicates the second housing 202 attached to the first housing 201. An opening 201b is formed on the side surface 201a of the first housing 201 to communicate the circuit accommodation space 202S of the second housing 202 and the internal space 201S of the first housing 201. The second housing 202 is attached so as to close the opening 201b of the first housing 201, and the flange portions 202a formed on both sides of the second housing 202 are screwed to the first housing 201 to form the first housing 202. It is fixed to the housing 201.

Boards 223 and 224 are provided in the circuit accommodation space 202S of the second housing 202. The communication circuit 220 shown in FIG. 1 includes a first communication circuit 220a that communicates according to the first communication standard and a second communication circuit 220b that communicates according to the second communication standard. The first communication circuit 220a is mounted on the board 223, and the second communication circuit 220b is mounted on the board 224. The board 223 is provided with a connector 221 and the board 224 is provided with a connector 222. The external connection terminals of the connectors 221 and 222 are projected on the side surface of the second housing 202. The board 223 is connected to the control circuit board (not shown) provided in the control unit 211 by the cable 225 and the board 224 by the cable 226.

FIG. 3 is a diagram showing a control circuit board 240 and boards 223 and 224 of the control unit 211. The CPU 241 is mounted on the control circuit board 240. The CPU 241 has a UART (Universal Asynchronous Receiver Transmitter) function for transmitting and receiving data by serial communication. In the control circuit board 240, a fieldbus having a specification called PROFIBUS is adopted. The CPU 241 and the Profibus 242 are connected by a UART line 243. A debugging connector (JTAG (Joint Test Action Group) standard test access port) 245 is provided on the control circuit board 240. A UART line is also connected to this connector 245.

The first communication circuit 220a mounted on the board 223 is connected to the Profibus 242 by connecting the connector 227 provided on the cable 225 to the connector 244 on the control circuit board 240. On the other hand, the second communication circuit 220b mounted on the board 224 is connected to the UART line 243 of the connector 245 by connecting the connector 228 provided on the cable 226 to the connector 245 on the control circuit board 240. The second communication circuit 220b includes a processor 229 that converts a UART signal and a second communication standard (EtherCAT) signal. The UART signal from the CPU 241 is converted into a signal of the second communication standard (EtherCAT) by the processor 229, and is output from the connector 222.

In the present embodiment, the connector 245 for debugging is also used as a connector for connecting the second communication circuit 220b to the UART line, but for connecting to the UART line 243 on the control circuit board 240. A dedicated connector may be provided, and the connector 228 of the board 224 may be connected to the connector.

-Second embodiment-
FIG. 4 is a diagram showing a second embodiment of the vacuum pump device according to the present invention. In the first embodiment described above, the communication circuit 220 is provided in the second housing 202, but in the second embodiment, the heater control circuit 230 is housed in the second housing 202. bottom. Further, in the second embodiment, the cooling jacket 30 is provided between the pump main body 10 and the power supply device 20. The configuration of the pump main body 10 is the same as that of the first embodiment.

The cooling jacket 30 is bolted to the pump body 10, and the power supply 20 is bolted to the cooling jacket 30. As a result, the pump main body 10 and the power supply device 20 are integrated via the cooling jacket 30. A flow path 301 through which a refrigerant (for example, cooling water) flows is formed in the cooling jacket 30, the refrigerant is supplied to the flow path 301 from the supply unit 302, and the refrigerant circulating in the flow path 301 is discharged from the discharge unit 303. Will be done. The cooling jacket 30 is provided between the pump main body 10 and the power supply device 20 and is in thermal contact with the pump main body 10 and the power supply device 20, and functions as a cooling device for cooling the pump main body 10 and the power supply device 20. ..

The first housing 201 of the power supply device 20 is fixed to the cooling jacket 30. A power supply unit 210, a control unit 211, a motor drive unit 212, and a communication circuit 213 are provided in the first housing 201. The communication circuit 213 is an interface for communicating with an external device according to a predetermined interface standard (RS232C, Ethercat, etc. described above), and is on a control circuit board (not shown) on which the circuit components of the control unit 211 are mounted. It is installed as a standard communication circuit in. The power supply unit 210, the control unit 211, and the motor drive unit 212 have the same functions as the corresponding configurations of the first embodiment.
In FIG. 4, the communication circuit 213 is housed in the first housing 201, but the communication circuit 213 may be provided in the second housing 202.

A heater control circuit 230 is provided in the second housing 202 as described above. Further, a connector 221 for communication and a connector 231 for the heater control circuit are provided on the outer peripheral surface of the second housing 202. The communication circuit 213 is connected to a main control device 1000 such as a semiconductor manufacturing device on which the vacuum pump device 1 is mounted via a connector 221. The heater control circuit 230 is connected to the heater 103 via the connector 231. The heater 103 is attached to the base portion of the pump body 10 and constitutes a part of a temperature adjusting device that controls the temperature of the base portion to a temperature within a predetermined range in cooperation with the cooling jacket 30. The heater control circuit 230 controls on / off of the electric power supplied to the heater 103.

FIG. 5 is a diagram showing an example of the arrangement of the heater control circuit 230 in the second housing 202. The heater control circuit 230 includes substrates 232 and 233 on which circuit components are mounted. The board 232 is connected to the board 233 by a support column 234. A heat generating component (for example, a circuit component such as a solid state relay (SSR)) 235 and a connector 231 are mounted on the board 233, the connector 231 is fixed to the wall surface of the second housing 202, and the heat generating component 235 is the second. It is in thermal contact with the inner peripheral surface 202c of the housing 202. When the heat-generating component 235 is in thermal contact with the inner peripheral surface 202c, the heat generated by the heat-generating component 235 is dissipated to the outside air via the second housing 202. As a result, the temperature rise of the heat generating component 235 is suppressed.

The first and second embodiments described above have the following effects.
(1) In the first and second embodiments, the power supply device 20 for the vacuum pump includes a first housing 201 in which the control unit 211 and the power supply unit 210 of the pump main body 10 are housed, and the first housing 201. The second housing 202, which is attached to the first housing 201 so as to protrude from the first housing 201 and has a circuit accommodation space 202S communicating with the internal space of the first housing 201, and the power supply unit 210 accommodated in the circuit accommodation space 202S. An external connection circuit (communication circuit 220 in FIG. 1 or heater control circuit 230 in FIG. 4) connected to at least one of the control unit 211 and also connected to the main control device 1000 which is an external device and a heater, and the first 2 A connector provided on the outer peripheral surface of the housing 202 and connecting an external connection circuit (communication circuit 220 in FIG. 1 or heater control circuit 230 in FIG. 4) and the main control device 1000 (connectors 221, 222 in FIG. 1 or The connector 231) of FIG. 4 is provided.

As the power supply unit 210, the control unit 211, and the motor drive unit 212 provided in the first housing 201 of FIG. 1, those corresponding to the specifications of the pump main body 10 are used. It may also be used in common for multiple specifications. Therefore, as long as the specifications of the pump body 10 are the same, the configuration inside the first housing 201 is substantially the same. On the other hand, the communication circuit 220 and the heater control circuit 230 provided in the second housing 202 are circuits connected to an external device. As described above, in the first and second embodiments, the second housing 202 different from the first housing 201 is provided, so that the external connection circuit corresponding to the external device to be connected can be provided. It can be housed in the second housing without affecting the configuration of the first housing 201.

When the external connection circuit is also housed in the first housing 201, when the specifications of the peripheral system in which the vacuum pump is installed are changed, such as when the external device is changed, the changed external connection circuit becomes larger. It may not be possible to accommodate in one housing 201. In this case, it is necessary to change the design of the first housing 201. For example, when the first housing 201 is a cast product of an aluminum alloy, there is a problem of cost increase such as rebuilding the casting mold. Further, if the first housing 201 is provided with a space allowance so that all system changes can be made, there is a problem that the first housing 201 becomes large.
On the other hand, in the first and second embodiments described above, only the second housing 202 needs to be changed to a size corresponding to the enlarged external connection circuit, so that the cost increase can be suppressed. At the same time, the size of the power supply device 20 can be suppressed to the minimum necessary size.

(2) In the first embodiment, the first communication circuit 220a according to the first communication standard and the second communication circuit 220b according to the second communication standard are provided in the second housing 202. Therefore, by selecting and using one of them according to the communication standard of the user-side device (external device), it is possible to easily correspond to users having different communication standards.

(3) In the second embodiment, since the heat generating component 235 included in the heater control circuit 230, which is an external connection circuit, is brought into contact with the inner peripheral surface of the second housing 202, the heat generated by the heat generating component 235 is generated. The second housing 202 dissipates heat to the outside air, and the temperature rise of the heat generating component 235 can be suppressed. Also in the first embodiment, when the communication circuit 220 includes a heat-generating component, the temperature rise of the heat-generating component is suppressed by bringing the heat-generating component into contact with the inner peripheral surface of the second housing 202. Can be done. For example, since the processor 229 mounted on the board 224 generates a relatively large amount of heat, the temperature rise of the processor 229 can be suppressed by bringing the processor 229 into contact with the inner peripheral surface of the second housing 202 to dissipate heat. It is possible to suppress a decrease in the life of the processor 229 due to a temperature rise.

Further, when the cooling jacket 30 is provided as in the second embodiment and the first housing 201 is in thermal contact with the cooling jacket 30, the first housing 201 flows through the cooling jacket 30. It is cooled by a refrigerant that is used, for example, a coolant. Therefore, the heat generated in the circuit components housed in the first housing 201 is dissipated to the cooling jacket 30 via the first housing 201. Further, since the second housing 202 attached to the first housing 201 is also indirectly cooled by the cooling jacket 30, the heat of the heat generating component 235 is dissipated to the outside air by the second housing 202. At the same time, heat is dissipated to the cooling jacket 30 via the second housing 202 and the first housing 201, so that the heat generating component 235 is cooled more effectively.

A part of the second housing 202 may be directly contacted with the cooling jacket 30. Of course, even when the cooling jacket 30 is not provided in the second embodiment, the heat dissipation effect from the second housing 202 to the outside air is exhibited.

Also in the first embodiment, the processor 229, which is a heat generating component, is brought into contact with the inner peripheral surface of the second housing 202 as described above, and the cooling jacket 30 is further provided to provide a cooling effect on the processor 229. Can be enhanced.

Although various embodiments and modifications have been described above, the present invention is not limited to these contents. Other aspects conceivable within the scope of the technical idea of the present invention are also included within the scope of the present invention. For example, it can be applied not only to a turbo molecular pump but also to other types of vacuum pump devices. Moreover, each of the above-described embodiments may be used individually or in combination.

1 ... Vacuum pump device, 10 ... Pump body, 20 ... Power supply device, 201 ... First housing, 202 ... Second housing, 202S ... Circuit accommodation space, 210 ... Power supply unit, 211 ... Control unit, 212 ... Motor drive Unit, 220 ... communication circuit, 221,222, 244, 245, 227, 228, 231 ... connector, 230 ... heater control circuit, 235 ... heat generating component, 240 ... control circuit board, 1000 ... main control device

Claims (7)

A first housing in which the control unit and power supply unit of the vacuum pump body are housed,
A second housing that is attached to the first housing so as to project from the first housing and has a circuit accommodation space that communicates with the internal space of the first housing.
An external connection circuit housed in the circuit accommodation space, connected to at least one of the power supply unit and the control unit, and also connected to an external device.
A vacuum pump power supply device provided on the outer peripheral surface of the second housing and provided with a connector for connecting the external connection circuit and the external device. In the vacuum pump power supply device according to claim 1.
The external connection circuit includes a first communication circuit that inputs and outputs a first signal according to the first communication standard, and a second communication circuit that inputs and outputs a second signal according to the second communication standard. death,
The connector includes a first signal connector for inputting / outputting the first signal to the external device and a second signal connector for inputting / outputting the second signal to the external device. Power supply for vacuum pump. In the vacuum pump power supply device according to claim 1 or 2.
The external connection circuit has a heat generating component and has a heat generating component.
A power supply device for a vacuum pump in which the heat-generating component is in thermal contact with the inner peripheral surface of the second housing, and the heat of the heat-generating component is dissipated through the second housing. In the vacuum pump power supply device according to any one of claims 1 to 3.
The external device is a heater that heats the vacuum pump body.
The external connection circuit includes a heater control circuit that controls the heater.
The heater control circuit is a vacuum pump power supply device that supplies electric power from the power supply unit to the heater via the connector. In the vacuum pump power supply device according to any one of claims 1 to 4.
The first housing is a cast product using an aluminum alloy, and the second housing is a sheet metal product, which is a power supply device for a vacuum pump. In the vacuum pump power supply device according to any one of claims 1 to 5.
An opening is formed on one side surface of the first housing so as to communicate the circuit accommodation space of the second housing and the internal space of the first housing.
The second housing is attached to the one side surface of the first housing so as to close the opening of the first housing.
A cable connecting the control unit or the power supply unit in the first housing and the external connection circuit in the second housing is inserted into the opening of the first housing. , Power supply for vacuum pump. Vacuum pump body and
The power supply device for a vacuum pump according to any one of claims 1 to 6.
A cooling member for integrally cooling the vacuum pump main body and the vacuum pump power supply device is provided.
A vacuum pump device in which at least the first housing of the first and second housings is in thermal contact with the cooling member.

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