JP6954120B2 - Polyamide resin composition and molded products made from it - Google Patents

Description

The present invention relates to a polyamide resin composition and a molded product comprising the polyamide resin composition.

Polyamide resins are widely used in automobile parts, mechanical parts, and electrical and electronic parts because they exhibit excellent properties as engineering plastics. Polyamide resins are particularly excellent in mechanical properties and abrasion resistance, and are therefore widely used as molding materials for sliding parts such as gears, cams, and bearings.

Among them, polyamide 66 reinforced with glass fiber has excellent mechanical properties and abrasion resistance, as disclosed in Patent Document 1, and therefore, molding of sliding parts such as gears, cams, and bearings. Used in materials. Polyamide 66 reinforced with glass fiber generally contains 25-35% by weight of glass fiber.

International Publication No. 2006/054774

For sliding parts made of polyamide resin, there is a demand for improving slidability while suppressing a decrease in rigidity.

A main object of the present invention is to provide a polyamide resin composition having improved slidability while suppressing a decrease in rigidity, and a molded product thereof.

The polyamide resin composition according to the present invention
A polyamide resin composition containing a polyamide resin and fibers.
The fibers include aramid fibers and carbon fibers.
The content of the aramid fiber is 2.0% by mass or more and 15.0% by mass or less.
The content of the carbon fiber is 0.1% by mass or more and 15.0% by mass or less.

In the polyamide resin composition according to the present invention, the polyamide resin is a polyamide 6, polyamide 11, polyamide 12, polyamide 66, polyamide 610, polyamide 611, polyamide 612, polyamide 6/66 copolymer, polyamide 6/69 copolymer. , Polyamide 6/610 copolymer, Polyamide 6/611 copolymer, Polyamide 6/612 copolymer, Polyamide 6/12 copolymer, Polyamide 6/66/12 copolymer and Polyamide MXD6. It is preferable to contain at least one of these.

In the polyamide resin composition according to the present invention, the number average molecular weight of the polyamide resin is preferably 10,000 or more and 35,000 or less.
The polyamide resin composition according to the present invention preferably further contains a nucleating agent of 0.005% by mass or more and less than 3.0% by mass.
The polyamide resin composition according to the present invention preferably further contains a copper compound of 0.001% by mass or more and less than 3.0% by mass.

The molded product according to the present invention comprises the polyamide resin composition according to the present invention.
The molded product according to the present invention is preferably a sliding part.

According to the present invention, it is possible to improve the slidability while suppressing a decrease in the rigidity of the resin member containing the polyamide resin composition.

The polyamide resin composition according to the present invention contains a polyamide resin, aramid fibers, and carbon fibers.

[Polyamide resin]
The polyamide resin used in the present invention can be obtained by polymerization or copolymerization by a known method such as melt polymerization, solution polymerization or solid phase polymerization. Specifically, polyamide 6 (polycaprolactam), polyamide 11 (polyundecantham), polyamide 12 (polydodecantham), polyamide 26 (polyethylene adipamide), polyamide 46 (polytetramethylene adipamide), polyamide 66. (Polyhexamethylene adipamide), Polyamide 69 (Polyhexamethylene azelamide), Polyamide 610 (Polyhexamethylene sebacamide), Polyamide 611 (Polyhexamethylene undecamide), Polyamide 612 (Polyhexamethylene dodecamide) , Polyamide 6T (Polyhexamethylene terephthalamide), Polyamide 6I (Polyhexamethylene isophthalamide), Polyamide 6T (H) (Polyhexamethylene hexahydroterephthalamide), Polyamide 96 (Polynonamethylene adipamide), Polyamide 99 (Polynonamethylene azelamide), Polyamide 910 (Polynonamethylene sebacamide), Polyamide 912 (Polynonamethylene dodecamide), Polyamide 9T (Polynomethylene terephthalamide), Polyamide TMHT (Polytrimethyl hexamethylene terephthalamide) ), Polyamide 9T (H) (Polynonamethylenehexahydroterephthalamide), Polyamide 9N (Polynonamethylenenaphthalamide), Polyamide 106 (Polydecamethylene adipamide), Polyamide 109 (Polydecamethylene azelamide), Polyamide 1010 (polydecamethylene decamide), polyamide 1012 (polydecamethylene dodecamide), polyamide 10T (polydecamethylene terephthalamide), polyamide 10T (H) (polydecamethylene hexahydroterephthalamide), polyamide 10N (poly) Decamethylene naphthalamide), Polyamide 126 (Polydodecamethylene adipamide), Polyamide 129 (Polydodecamethylene azelamide), Polyamide 1210 (Polydodecamethylene sebacamide), Polyamide 1212 (Polydodecamethylene dodecamide), Polyamide 12T (Polydodecamethylene terephthalamide), Polyamide 12T (H) (Polyamide decamethylene hexahydroterephthalamide), Polyamide 12N (Polydodecamethylene naphthalamide), Polyamide MXD6 (Polymethaxylylene adipamide), Polyamide MXD8 (Poly) Metaxylylene veramide), Polyamide MXD9 (Polymethoxylylene azelamide), Polyamide MXD10 (Polymeta) Xylylene sebacamide), polyamide MXD12 (polymethoxylylend decamide), polyamide MXDT (polymethoxylylen terephthalamide), polyamide MXDI (polymethoxylylen isophthalamide), polyamide MXDN (polymethoxylylen naphthalamide), polyamide PACM12 (Polybis (4-aminocyclohexyl) methanedodecamide), Polyamide PACMT (Polybis (4-aminocyclohexyl) methaneterephthalamide), Polyamide PACMI (Polybis (4-aminocyclohexyl) methaneisophthalamide), PolyamidedimethylPACM12 ( Examples thereof include polybis (3-methyl-4-aminocyclohexyl) methadodecamide), polyamide IPD6 (polyisophorone adipamide), polyamide IPDT (polyisophorone terephthalamide), and polyamide copolymers using these raw material monomers. .. These can be used alone or in combination of two or more. Among these, polyamide 6, polyamide 11, polyamide 12, polyamide 66, polyamide 610, polyamide 611, polyamide 612, and polyamide 6/66 copolymer (polyamide 6 and polyamide 66 copolymer, hereinafter, the copolymer is the same. ), Polyamide 6/69 copolymer, Polyamide 6/610 copolymer, Polyamide 6/611 copolymer, Polyamide 6/612 copolymer, Polyamide 6/12 copolymer, Polyamide 6/66/12 It is preferably at least one selected from the group consisting of the copolymer and the polyamide MXD6, and the polyamide 6, the polyamide 11, the polyamide 12, the polyamide 66, the polyamide 610, the polyamide 612, the polyamide 6/66 copolymer, and the polyamide 6 More preferably, it is at least one selected from the group consisting of the / 12 copolymer and the polyamide 6/66/12 copolymer, and at least one selected from the group consisting of the polyamide 6, the polyamide 66 and the polyamide 12. Is more preferable, and polyamide 6 is particularly preferable from the viewpoint of moldability.

The number average molecular weight of the polyamide resin is preferably 10,000 or more and 35,000 or less. From the viewpoint of mechanical properties and slidability, the number average molecular weight of the polyamide resin is more preferably 12,000 or more, further preferably 14,000 or more, and 20,000 or more. Is even more preferable, 24,000 or more is further preferable, and 28,000 or more is further preferable. From the viewpoint of moldability, the number average molecular weight of the polyamide resin is preferably 35,000 or less, and more preferably 33,000 or less.

As a method for measuring the number average molecular weight of the polyamide resin, a method of obtaining from at least one of the terminal carboxyl group concentration and the terminal amino group concentration of the polyamide resin, a method of obtaining from the relative viscosity of the above-mentioned polyamide resin, and gel permeation chromatography (GPC) are used. The method and the like can be mentioned. When the number average molecular weight of the polyamide resin is determined from at least one of the terminal carboxyl group concentration and the terminal amino group concentration of the polyamide resin, the number average molecular weight of the polyamide resin is generally the terminal carboxyl group concentration without using an end modifier. Alternatively, it can be obtained by reversing the terminal amino group concentration.

The terminal carboxyl group concentration and the terminal amino group concentration of the polyamide resin ^{can be measured by using 1} H-NMR, a titration method, or the like, respectively.
When measuring the terminal amino group concentration of the polyamide resin by the titration method, first, the polyamide resin is dissolved in a phenol / methanol mixed solvent (phenol: methanol = 7: 3 [v / v]). The resulting solution is titrated with 0.05 N (specified) hydrochloric acid. Thereby, the terminal amino group concentration (μeq / g) of the polyamide resin can be measured.
When measuring the terminal carboxyl group concentration of the polyamide resin by the titration method, first, the polyamide resin is dissolved in benzyl alcohol. The resulting solution is titrated with a 0.05 N (specified) sodium hydroxide solution. Thereby, the terminal carboxyl group concentration (μeq / g) of the polyamide resin can be measured.

[Aramid fiber]
The polyamide resin composition according to the present invention contains aramid fibers. Therefore, the slidability of the resin member can be improved as compared with the case of using glass fiber.

The content of the aramid fiber in the polyamide resin composition according to the present invention is 2.0% by mass or more, preferably 3.0% by mass or more, and more preferably 6.0% by mass or more. It is more preferably 9.0% by mass or more, and further preferably 10.0% by mass or more. If the content of the aramid fiber is less than 2.0% by mass, the slidability of the resin member may be lowered.

The content of the aramid fiber in the polyamide resin composition according to the present invention is 15.0% by mass or less, preferably 13.0% by mass or less, and more preferably 9.0% by mass or less. If the content of the aramid fiber exceeds 15.0% by mass, the rigidity and kneadability of the resin member may be lowered.

The number average fiber length of the aramid fibers contained in the polyamide resin composition according to the present invention is preferably 2.0 mm or more, more preferably 2.5 mm or more, and further preferably 2.8 mm or more. preferable. By setting the number average fiber length of the aramid fibers to 2.0 mm or more, it is possible to maintain the physical properties and improve the slidability of the resin member.

The number average fiber length of the aramid fibers contained in the polyamide resin composition according to the present invention is preferably 4.0 mm or less, more preferably 3.5 mm or less, and further preferably 3.2 m or less. preferable. By setting the number average fiber length of the aramid fibers to 4.0 mm or less, it is possible to maintain the physical properties and improve the slidability of the resin member.

The number average fiber diameter of the aramid fibers contained in the polyamide resin composition according to the present invention is preferably 5 μm or more, more preferably 7 μm or more, and further preferably 9 μm or more. By setting the number average fiber diameter of the aramid fibers to 5 μm or more, it is possible to maintain the physical properties and improve the slidability of the resin member.

The number average fiber diameter of the aramid fibers contained in the polyamide resin composition according to the present invention is preferably 15 μm or less, more preferably 13 μm or less, and further preferably 11 μm or less. By setting the number average fiber diameter of the aramid fibers to 15 μm or less, it is possible to maintain the physical properties and improve the slidability of the resin member.

In the present invention, the aramid fiber may be made into an aramid fiber bundle by a sizing agent. Examples of the bundling agent preferably used include urethane resin, polyester resin, epoxy resin, polyamide resin and the like. Only one of the above-mentioned focusing agents may be used, or a plurality of types of focusing agents may be mixed and used.

In the present invention, the aramid fiber may be surface-treated. That is, in the present invention, the aramid fiber may be a surface-treated aramid fiber. Specific examples of the surface treatment agent preferably used for the surface treatment of the aramid fiber include a silane coupling agent, a titanate-based coupling agent, an aluminate-based coupling agent, and the like. Only one of the above surface treatment agents may be used, or a plurality of types of surface treatment agents may be mixed and used.

〔Carbon fiber〕
The polyamide resin composition according to the present invention contains carbon fibers. Therefore, good slidability can be maintained and high rigidity can be exhibited. It is also effective in reducing weight.

The content of carbon fibers in the polyamide resin composition according to the present invention is 0.1% by mass or more, preferably 1.0% by mass or more, and more preferably 4.0% by mass or more. It is more preferably 7.0% by mass or more. If the content of the carbon fiber is less than 0.1% by mass, the rigidity and kneadability of the resin member may be lowered.

The content of carbon fibers in the polyamide resin composition according to the present invention is 15.0% by mass or less, preferably 13.0% by mass or less, and more preferably 10.0% by mass or less. It is more preferably 8.0% by mass or less. If the carbon fiber content exceeds 15.0% by mass, the slidability of the resin member may be reduced.

The weight average fiber length of the carbon fibers contained in the polyamide resin composition after melt-kneading or molding according to the present invention is preferably 100.0 μm or more, more preferably 200.0 μm or more, and 300. It is more preferably 0 μm or more. By setting the weight average fiber length of the carbon fibers to 100.0 μm or more, good slidability can be maintained and high rigidity can be exhibited.

The weight average fiber length of the carbon fibers contained in the polyamide resin composition after melt-kneading or molding according to the present invention is preferably 1000 μm or less, more preferably 700 μm or less, and more preferably 500 μm or less. More preferred. By setting the weight average fiber length of the carbon fibers to 1000 μm or less, good slidability and rigidity can be maintained, and good moldability can be exhibited.

In the present invention, the carbon fibers may be made into a carbon fiber bundle by a sizing agent. Examples of the sizing agent preferably used include urethane-based and polyester-based ones. Only one of the above-mentioned focusing agents may be used, or a plurality of types of focusing agents may be mixed and used.

In the present invention, the carbon fiber may be surface-treated. That is, in the present invention, the carbon fiber may be a surface-treated carbon fiber. Specific examples of the surface treatment agent preferably used for the surface treatment of carbon fibers include silane coupling agents, titanate-based coupling agents, and aluminate-based coupling agents. Only one of the above surface treatment agents may be used, or a plurality of types of surface treatment agents may be mixed and used.

[Nuclear agent]
The polyamide resin composition according to the present invention may further contain a nucleating agent. Preferred nucleating agents include, for example, inorganic crystallization agents such as talc, graphite and mica, and organic crystallization agents such as fatty acid metal salts composed of metals such as magnesium, calcium and aluminum. The nucleating agent may be talc alone, other nucleating agents alone, or in combination with talc.

The content of the nucleating agent in the polyamide resin composition according to the present invention is preferably 0.005% by mass or more, more preferably 0.01% by mass or more, and 0.05% by mass or more. Is even more preferable. By setting the content of the nucleating agent to 0.005% by mass or more, the moldability can be improved mainly including the effect of shortening the molding cycle.

The content of the nucleating agent in the polyamide resin composition according to the present invention is preferably less than 3.0% by mass, more preferably 2.0% by mass or less, and more preferably 1.0% by mass or less. Is more preferable, and 0.6% by mass or less is particularly preferable. By setting the content of the nucleating agent to less than 3.0% by mass, the moldability can be improved mainly including the effect of shortening the molding cycle.

[Copper-based antioxidant]
The polyamide resin composition according to the present invention may further contain a copper-based antioxidant as a heat resistant agent. The copper-based antioxidant is not particularly limited, but preferably used copper compounds include, for example, cuprous chloride, cupric chloride, cuprous bromide, cupric bromide, cuprous iodide, and the like. Copper iodide, cupric sulfate, cupric nitrate, copper phosphate, cuprous acetate, cupric acetate, copper propionate, copper benzoate, copper adipate, copper terephthalate, copper isophthalate, Examples thereof include cupric salicylate, cupric stearate and complex compounds such as the inorganic copper halide and xylylene diamine, 2-mercaptobenzoimidazole and benzoimidazole. Among them, a monovalent copper compound, particularly a monovalent copper halide compound is preferable, and cuprous acetate, cuprous iodide and the like can be exemplified as particularly suitable copper compounds. Only one of the above copper compounds may be used, or a plurality of types of copper compounds may be mixed and used.
Further, in the present invention, an alkali halide or an organic antioxidant can be added together with the copper compound. Potassium iodide, sodium iodide, potassium bromide, sodium bromide, potassium chloride, and sodium chloride are preferable as the alkali halide compound, and melamine and melamine cyanurate are preferable as the organic antioxidant aid.

The content of the heat resistant agent mainly composed of a copper compound in the polyamide resin composition according to the present invention is preferably 0.001% by mass or more, more preferably 0.01% by mass or more, and 0.02. It is more preferably mass% or more. By setting the content of the copper compound to 0.001% by mass or more, the antioxidant property can be improved.

The content of the heat-resistant agent mainly composed of a copper compound in the polyamide resin composition according to the present invention is preferably less than 3.0% by mass, more preferably 2.0% by mass or less, and 1.0. It is more preferably mass% or less, and particularly preferably 0.5 mass% or less. By setting the content of the copper compound to less than 3.0% by mass, the antioxidant property can be improved.

[Other ingredients]
The composition of the present invention includes a thermoplastic resin other than the polyamide resin, an adhesive, a modifier, a reinforcing material, for example, a heat stabilizer, an antioxidant, etc., as long as the characteristics of the composition of the present invention are not impaired. UV absorbers, weathering agents, fillers, plastics, foaming agents, blocking inhibitors, tackifiers, sealing improvers, cloudproofing agents, mold release agents, cross-linking agents, foaming agents, flame retardants, colorants (pigments) , Dyes, etc.), coupling agents, inorganic reinforcing materials such as glass fibers, etc. can be contained.

Preferred thermoplastic resins include, for example, high density polyethylene (HDPE), medium density polyethylene (MDPE), low density polyethylene (LDPE), linear low density polyethylene (LLDPE), ultra high molecular weight polyethylene (UHMWPE), and the like. Polypropylene-based resins such as polypropylene (PP), ethylene / propylene copolymer (EPR), ethylene / butene copolymer (EBR), acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, crotonic acid, Carboxy groups such as mesaconic acid, citraconic acid, glutaconic acid, cis-4-cyclohexene-1,2-dicarboxylic acid, endobicyclo- [2.2.1] -5-heptene-2,3-dicarboxylic acid and their metals. Salts (Na, Zn, K, Ca, Mg), maleic anhydride, itaconic anhydride, citraconic anhydride, endobicyclo- [2.2.1] -5-heptene-2,3-dicarboxylic acid anhydride, etc. The polyolefin resin, polybutylene terephthalate modified with a compound containing a functional group such as an acid anhydride group, glycidyl acrylate, glycidyl methacrylate, glycidyl etacrilate, glycidyl itaconate, glycidyl citracone and the like. (PBT), Polyether-based resins such as polyethylene terephthalate (PET), polyphenylene oxide (PPO), polyphenylene sulfide (PPS), polymethacrylonitrile, acrylonitrile / styrene copolymer (AS), methacrylnitrile / styrene common weight Combined, acrylonitrile / butadiene / styrene copolymer (ABS) and the like can be mentioned.

[Manufacturing method of polyamide resin composition]
The polyamide resin composition according to the present invention may be a dry blend of the above-mentioned polyamide resin, a predetermined amount of aramid fiber and carbon fiber, and the above-mentioned nucleating agent, copper-based antioxidant, and other components, but may have moldability and the like. From this point of view, it is preferable to melt-knead with a uniaxial or twin-screw extruder, a Banbury mixer or the like.

〔Molding〕
Since the polyamide resin composition according to the present invention has high rigidity and excellent slidability, it can be used for various molded products. The polyamide resin composition according to the present invention is particularly suitable for sliding parts such as gears, pulleys, cams, bearings, and cable housing chain extensions because it has excellent slidability.

Examples of the molding method of the resin member using the polyamide resin composition according to the present invention include injection molding, extrusion molding, hollow molding, press molding, roll molding, foam molding, vacuum / pressure molding, stretch molding and the like. ..

Hereinafter, the present invention will be described in more detail based on specific examples, but the present invention is not limited to the following examples, and the present invention is appropriately modified without changing the gist thereof. It is possible to do.

In the following examples and comparative examples, the following materials were used.
Polyamide resin Polyamide 6 (PA6): Polyamide 6 having a number average molecular weight of 30,000
Polyamide 66 (PA66): Polyamide 66 having a number average molecular weight of 26,000
The number average molecular weight of the polyamide was calculated by GPC measurement using HLC-802A manufactured by Tosoh Corporation under the following conditions and converted to PMMA.

Column: Shodex HFIP-LG + HFIP-806M
Eluent: HFIP-10 mM CF3COONa
Temperature: 40 ° C
Flow velocity: 0.8 ml / min
Sample concentration: Approximately 0.1 wt / vol%
Injection volume: 500 μl

-Aramid fiber, manufactured by Teijin Limited, T322UR (number average fiber diameter: 10 μm, number average fiber length: 3 mm)
-Carbon fiber manufactured by Mitsubishi Rayon Co., Ltd., TR06NE B4J (average fiber length: 6 mm)
・ Glass fiber manufactured by Nitto Boseki Co., Ltd., CS 3DE-456S
・ Talc Made by Japan Talc Co., Ltd., Micro Ace L-1

(Examples 1 to 5, Comparative Examples 1 to 5)
Using a twin-screw kneader, melt-kneading was performed at a kneading temperature of 270 ° C. to produce pellets of the polyamide resin composition having the composition shown in Table 1. In Table 1, blanks indicate no compounding.
Before melt-kneading, 0.03% by mass of an adhering agent (polyoxyethylene sorbitan fatty acid ester) and 0.04% by mass of a copper-based antioxidant containing copper iodide were added.

〔evaluation〕
(Flexural modulus)
The flexural modulus of the polyamide resin compositions of Examples 1 to 5 and Comparative Examples 1 to 5 was measured according to ISO178.
The flexural modulus is
Less than 5000 x,
5000 or more and 7000 or less ○,
◎ is over 7,000
The results are shown in Table 2.

(Rockwell hardness)
The hardness of the polyamide resin compositions of Examples 1 to 5 and Comparative Examples 1 to 5 was measured on an R scale according to ISO2039-2. The results are shown in Table 2.

(Molding shrinkage rate)
Using an injection molding machine of SE100D manufactured by Sumitomo Heavy Industries, Ltd., a test piece having a length of 200 mm, a width of 40 mm, and a thickness of 3 mm was prepared from the polyamide resin compositions of Examples 1 to 5 and Comparative Examples 1 to 5, and the test piece was prepared. Was left at 23 ° C. for 48 hours or more, and then the distance between the injured lines in the test piece was measured with an OLYMPUS microscope, and the molding shrinkage ratio was calculated by the following formula. In Table 2, MD refers to the molding shrinkage rate in the flow direction (longitudinal direction) of the test piece, and TD refers to the molding shrinkage rate in the direction (horizontal direction) forming an angle of 90 degrees with the MD direction. The results are shown in Table 2.
Molding shrinkage rate = (distance between mold marking lines-distance between marking lines in the test piece) / distance between mold marking lines x 100

(Coefficient of friction)
Using the SE100D injection molding machine manufactured by Sumitomo Heavy Industries, Ltd., a test piece of 100 mm × 30 mm × 3 mm was prepared from the polyamide resin compositions of Examples 1 to 5 and Comparative Examples 1 to 5, and the temperature was 23 ° C. for 48 hours or more. After the conditions of Using the ring-on-plate method, the limit PV value of the prepared test piece was applied at a test speed of 500 mm / sec and a test load of 25 kgf (245 N) at the start of the test, and a load of 25 kgf (245 N) was applied every 10 minutes. The dynamic friction coefficient was calculated from the following formula using the frictional resistance and load immediately before the test piece melted under the condition of raising.
The coefficient of friction is
Less than 0.1 ◎,
0.1 or more and 1 or less ○,
Let x be 1 excess
The results are shown in Table 2.
Dynamic friction coefficient = (friction resistance force immediately before melting) / (load immediately before the test piece melts)

(Limited PV value)
Using the SE100D injection molding machine manufactured by Sumitomo Heavy Industries, Ltd., a test piece of 100 mm × 30 mm × 3 mm was prepared from the polyamide resin compositions of Examples 1 to 5 and Comparative Examples 1 to 5, and the temperature was 23 ° C. for 48 hours or more. After the conditions of Using the ring-on-plate method, the limit PV value of the prepared test piece was applied at a test speed of 500 mm / sec and a test load of 25 kgf (245 N) at the start of the test, and a load of 25 kgf (245 N) was applied every 10 minutes. It was measured under the condition of increasing. The load immediately before the load in which the test piece was melted was set as the limit PV value.
The limit PV value is
Less than 1000 ×,
1000 or more and 4000 or less ○,
◎ is over 4000
The results are shown in Table 2.

(Easy to knead)
Using a twin-screw kneader, melt-kneading was performed at a kneading temperature of 270 ° C., and the polyamide resin composition having the composition shown in Table 1 was extruded into a strand shape. The stability of the strands and the surface properties of the strands at that time were evaluated according to the following criteria.
⊚: The strand was not broken during manufacturing, and no fluffing of fibers was observed on the surface of the strand.
◯: The strands were not broken during manufacturing, but fluffing of fibers was observed on the surface of the strands.
X: The strand was cut in the middle of manufacturing, and fluffing of fibers was observed on the surface of the strand.

Claims (4)

A polyamide composition composed of a polyamide resin, fibers, and a copper compound , wherein the polyamide resin is a polyamide 6, polyamide 11, polyamide 12, polyamide 66, polyamide 610, polyamide 611, polyamide 612, or polyamide 6/66 copolymer. , Polyamide 6/69 copolymer, Polyamide 6/610 copolymer, Polyamide 6/611 copolymer, Polyamide 6/612 copolymer, Polyamide 6/12 copolymer, and Polyamide 6/66/12 copolymer weight Includes at least one selected from the coalesced group
The number average molecular weight of the polyamide resin is 28,000 or more and 35,000 or less.
The fibers include aramid fibers and carbon fibers.
The content of the aramid fiber is 2.0% by mass or more and 9.0 % by mass or less.
Wherein Ri Der content less 8.0 wt% 0.1 wt% carbon fibers,
A polyamide composition for sliding parts , wherein the copper compound is a copper halide compound and the content thereof is 0.001% by mass or more and 3.0% by mass or less. The polyamide composition for sliding parts according to claim 1, further comprising a nucleating agent of 0.005% by mass or more and less than 3.0% by mass. The polyamide composition for sliding parts according to claim 1 or 2, wherein the copper halide compound is copper iodide. A molded product comprising the polyamide composition for sliding parts according to any one of claims 1 to 3.