JP6938249B2 - Manufacturing method of semiconductor devices and molds - Google Patents

Description

The present technology relates to a method for manufacturing a semiconductor device and a mold, and more particularly to a method for manufacturing a semiconductor device capable of controlling a lens shape with high accuracy and a mold.

In the step of arranging and forming a plurality of lenses in the plane direction of the wafer substrate, an imprint technique of pressing a mold against a resin material dropped on the substrate to transfer the shape can be used (see, for example, Patent Document 1). ).

Japanese Unexamined Patent Publication No. 2012-93765

In order to form the lens with high accuracy, it is necessary to control the distance, inclination, etc. in the Z-axis (height) direction of the mounting part where the mold is mounted with high accuracy, and the operation accuracy of the device is improved. As the equipment goes on, the equipment becomes large and the cost increases.

Further, in lens molding using the imprint technique, it is necessary to pay attention to the occurrence of gaps and wrinkles between the mold and the resin material due to the shrinkage of the resin material when the resin material is cured.

The present technology has been made in view of such a situation, and makes it possible to control the lens shape with high accuracy.

The mold on the first side surface of the present technology is arranged outside the lens portion in a plan view and a lens portion having a predetermined concave-convex shape surface, and has a height different from the predetermined concave-convex shape surface of the lens portion. and abutting portions having, has a side surface of the tapered, and a guide portion for controlling the position of the plane direction in contact with the inclined surface of the substrate, said abutting portion includes a resin material on the substrate the the abuts the substrate when forming a predetermined concavo-convex shape, said in a state where the abutting portion is abutted on the substrate, the resin material on the outer side of the space inflow and outflow between the substrate and the lens unit The structure is such that a gap is formed to allow the lens to be formed.

In the first aspect of the present technology, a lens portion having a predetermined concave-convex shape surface and a protrusion which is arranged outside the lens portion in a plan view and has a height different from the predetermined concave-convex shape surface of the lens portion. and abutting portion has a side surface of the tapered, and a guide portion for controlling the position of the plane direction in contact with the inclined surface of the substrate, said abutting portion includes a resin material on the substrate of the predetermined the abuts the substrate when forming the uneven shape in a state where the abutting portion is abutted on the substrate, a gap in which the causes of the resin material flow and out outside the space between the substrate and the lens unit Is formed.

The method for manufacturing a semiconductor device on the second side of the present technology is to press a mold against a resin material on a substrate and transfer the uneven shape of the mold to the resin material to form a lens resin portion. The mold is provided with a step, and the lens portion having a predetermined concave-convex shape surface and an abutting portion which is arranged outside the lens portion in a plan view and has a height different from the predetermined concave-convex shape surface of the lens portion. has a section, the sides of the tapered, and a guide portion for controlling the position of the plane direction in contact with the inclined surface of the substrate, the abutment portion, the predetermined said resin material on said substrate abuts on the substrate when forming the uneven shape of, in a state where the abutting portion is abutted on the substrate, the so resin material is the flow and from the outside of the space between the substrate and the lens unit It is a structure in which a gap is formed.

In the second aspect of the present technology, the mold is pressed against the resin material on the substrate and the shape of the mold is transferred to the resin material to form the lens resin portion. The mold has a lens portion having a predetermined concave-convex shape surface, an abutting portion arranged outside the lens portion in a plan view and having a height different from the predetermined concave-convex shape surface of the lens portion, and a taper. has a side surface shape, in contact with the inclined surface of the substrate and a guide portion for controlling the position of the plane direction, the abutting section, the resin material on the substrate to the predetermined irregularities When the resin material is abutted against the substrate during molding , and the abutting portion is abutted against the substrate, a gap is formed outside the space between the lens portion and the substrate to allow the resin material to flow in and out. It is a configuration.

The mold may be an independent component or a component incorporated as part of another device.

According to the first and second aspects of the present technology, the lens shape can be controlled with high accuracy.

The effects described here are not necessarily limited, and may be any of the effects described in the present disclosure.

It is a schematic structural drawing of the solid-state image sensor as a semiconductor device to which this technology is applied. It is a block diagram which shows the system configuration example of the solid-state image sensor of FIG. It is a figure explaining the lens forming method which forms a lens resin part. It is a cross-sectional view and a plan view of a mold. It is a top view of the lens resin part. It is a figure explaining the action effect when the mold of FIG. 4 is used. It is a figure explaining the action effect when the mold of FIG. 4 is used. It is a figure explaining the modification of the mold of FIG. It is a figure explaining the 2nd Embodiment of a mold. It is sectional drawing and plan view of the mold of 2nd Embodiment. It is a figure explaining the formation timing of the lens resin part. It is a figure which shows the other shape example of the lens resin part. It is a figure which shows the detailed cross-sectional structure of a laminated structure. It is a figure explaining the manufacturing method of the solid-state image sensor. It is a figure explaining the manufacturing method of the solid-state image sensor. It is a figure explaining the manufacturing method of the solid-state image sensor. It is a figure explaining the manufacturing method of the solid-state image sensor. It is a figure explaining the manufacturing method of the solid-state image sensor. It is a figure explaining the manufacturing method of the solid-state image sensor. It is a figure explaining the manufacturing method of the solid-state image sensor. It is a figure explaining the manufacturing method of the solid-state image sensor. It is a figure explaining the manufacturing method of the solid-state image sensor. It is a figure explaining the manufacturing method of the solid-state image sensor. It is a figure explaining the manufacturing method of the solid-state image sensor. It is a figure explaining the manufacturing method of the solid-state image sensor. It is a figure explaining the manufacturing method of the solid-state image sensor. It is a figure explaining the manufacturing method of the solid-state image sensor. It is a figure explaining the manufacturing method of the solid-state image sensor. It is sectional drawing of the 1st configuration example of a camera module. It is sectional drawing of the 2nd configuration example of a camera module. It is sectional drawing of the 3rd configuration example of a camera module. It is a figure explaining the manufacturing method of the laminated lens structure. It is a figure explaining the joining of the substrate with a lens in the state of two substrates. It is a figure explaining the manufacturing method of the substrate with a lens in the substrate state. It is a block diagram which shows the configuration example of the image pickup apparatus as an electronic device to which this technology is applied. It is a figure explaining the use example of an image sensor. It is a block diagram which shows an example of the schematic structure of the body information acquisition system. It is a figure which shows an example of the schematic structure of the endoscopic surgery system. It is a block diagram which shows an example of the functional structure of a camera head and a CCU. It is a block diagram which shows an example of the schematic structure of a vehicle control system. It is explanatory drawing which shows an example of the installation position of the vehicle exterior information detection unit and the image pickup unit.

Hereinafter, embodiments for carrying out the present technology (hereinafter referred to as embodiments) will be described. The explanation will be given in the following order.
1. 1. Schematic structure of the solid-state image sensor 2. System configuration of solid-state image sensor 3. Lens forming method 4. Action and effect of mold 5. Mold modification 6. Second embodiment of the mold 7. Timing of formation of lens resin part 8. Examples of other shapes of the lens resin part 9. Detailed structure of the laminated structure 10. Method for manufacturing laminated structure 11. Detailed configuration of camera module 12. Direct bonding between substrates with lenses 13. Manufacturing method of substrate with lens 14. Application example to electronic devices 15. Application example to internal information acquisition system 16. Application example to endoscopic surgery system 17. Application example to mobile

<1. Outline structure of solid-state image sensor>
FIG. 1 shows a schematic structure of a solid-state image sensor as a semiconductor device to which the present technology is applied.

The solid-state image sensor 1 shown in FIG. 1 converts light or electromagnetic waves incident on the device in the direction of the arrow in the figure into an electric signal. Hereinafter, in the present disclosure, for convenience, a device for converting light into an electric signal will be described as an example as an object for converting into an electric signal.

The solid-state image sensor 1 protects the laminated structure 13 in which the first structure 11 and the second structure 12 are laminated, the external terminal 14, and the protective substrate 18 formed on the upper side of the first structure 11. A lens resin portion 19 formed on the substrate 18 is provided. In the following, for convenience, the first structure 11 is the upper structure, with the side of the incident surface on which light is incident on the device as the upper side and the side of the other surface of the device facing the incident surface as the lower side. The body 11 and the second structure 12 will be referred to as a lower structure 12.

The solid-state image sensor 1 has a semiconductor substrate (wafer) forming a part of the upper structure 11, a semiconductor substrate (wafer) forming a part of the lower structure 12, and a protective substrate 18 at a wafer level. After being pasted together in, it is formed as an individual piece into each solid-state image sensor 1.

The upper structure 11 before being fragmented is a semiconductor substrate (wafer) in which pixels for converting incident light into electric signals are formed. The pixel includes, for example, a photodiode (PD) for photoelectric conversion and a plurality of pixel transistors that control a photoelectric conversion operation and an operation of reading a photoelectrically converted electric signal. The pixel transistor is preferably a MOS transistor, for example. The upper structure 11 included in the solid-state image sensor 1 after being fragmented may be referred to as an upper chip, an image sensor substrate, or an image sensor chip.

For example, an R (red), G (green), or B (blue) color filter 15 and an on-chip lens 16 are formed on the upper surface of the upper structure 11. On the upper side of the on-chip lens 16, a protective substrate 18 for protecting the structure of the solid-state imaging device 1, particularly the on-chip lens 16 and the color filter 15, is arranged. The protective substrate 18 is, for example, a transparent glass substrate. When the hardness of the protective substrate 18 is higher than the hardness of the on-chip lens 16, the action of protecting the on-chip lens 16 is strengthened.

On the upper surface of the protective substrate 18, a lens resin portion 19 formed by molding a resin material as a lens material into a predetermined shape by imprinting is arranged. The lens resin portion 19 refracts the incident light in a predetermined direction and causes the incident light to enter a predetermined pixel of the upper structure 11.

The lower structure 12 before being fragmented is a semiconductor substrate (wafer) in which a semiconductor circuit including a transistor and wiring is formed. The lower structure 12 included in the solid-state image sensor 1 after being fragmented may be referred to as a lower chip, a signal processing substrate, or a signal processing chip. The lower structure 12 is formed with a plurality of external terminals 14 for electrically connecting to wiring (not shown) outside the device. The external terminal 14 is, for example, a solder ball.

The solid-state image sensor 1 has a cavityless structure in which the protective substrate 18 is fixed to the upper side of the upper structure 11 or the upper side of the on-chip lens 16 via the seal resin 17 arranged on the on-chip lens 16. There is. Since the hardness of the seal resin 17 is lower than the hardness of the protective substrate 18, the stress applied to the protective substrate 18 from the outside of the solid-state imaging device 1 is transmitted to the inside of the device as compared with the case where the seal resin does not exist. It can act as a palliative.

The solid-state image sensor 1 has a structure different from the cavityless structure, in which a columnar or wall-like structure is formed on the upper surface of the upper structure 11, and the protective substrate 18 is supported with a gap above the on-chip lens 16. As described above, a cavity structure fixed to the columnar or wall-like structure may be formed.

<2. System configuration of solid-state image sensor>
FIG. 2 is a block diagram showing a system configuration example of the solid-state image sensor 1.

The solid-state image sensor 1 of FIG. 2 includes a pixel array unit 24 in which a plurality of pixels 31 having a photoelectric conversion unit (PD) are arranged in the row direction and the column direction.

The pixel array unit 24 is a vertical signal line for reading a signal generated as a result of photoelectric conversion from a row drive signal line 32 for driving the pixel 31 row by row and a plurality of pixels 31 driven row by row. (Column read line) 33 is provided. As shown in FIG. 2, a plurality of pixels 31 arranged in the row direction are connected to one row drive signal line 32. A plurality of pixels 31 arranged in a column direction are connected to one vertical signal line 33.

The solid-state image sensor 1 further includes a row drive unit 22 and a column signal processing unit 25.

The row drive unit 22 includes, for example, a row address control unit that determines the position of a row for driving a pixel, in other words, a row decoder unit, and a row drive circuit unit that generates a signal for driving the pixel 31.

The column signal processing unit 25 includes, for example, a load circuit unit connected to the vertical signal line 33 to form a source follower circuit with the pixels 31. Further, the column signal processing unit 25 may include an amplifier circuit unit that amplifies the signal read from the pixel 31 via the vertical signal line 33. Further, the column signal processing unit 25 may further include a noise processing unit for removing the noise level of the system from the signal read from the pixel 31 as a result of photoelectric conversion.

The column signal processing unit 25 includes an analog-to-digital converter (ADC) for converting the signal read from the pixel 31 or the noise-processed analog signal into a digital signal. The ADC includes a comparator section for comparing the analog signal to be converted with the reference sweep signal to be compared, and a counter section for measuring the time until the comparison result in the comparator section is inverted. .. The column signal processing unit 25 may further include a horizontal scanning circuit unit that controls scanning the read sequence.

The solid-state image sensor 1 further includes a timing control unit 23. The timing control unit 23 supplies a signal for controlling the timing to the row drive unit 22 and the column signal processing unit 25 based on the reference clock signal and the timing control signal input to the apparatus. Hereinafter, in the present disclosure, all or a part of the row drive unit 22, the column signal processing unit 25, and the timing control unit 23 may be simply referred to as a pixel peripheral circuit unit, a peripheral circuit unit, or a control circuit unit. ..

The solid-state image sensor 1 further includes an image signal processing unit 26. The image signal processing unit 26 is a circuit that performs various signal processing on the data obtained as a result of photoelectric conversion, in other words, the data obtained as a result of the image pickup operation in the solid-state image sensor 1. The image signal processing unit 26 includes, for example, an image signal processing circuit unit and a data holding unit. The image signal processing unit 26 may further include a processor unit.

An example of signal processing executed by the image signal processing unit 26 is that when the AD-converted imaging data is data obtained by photographing a dark subject, it has many gradations and is data obtained by photographing a bright subject. Is a tone curve correction process that reduces gradation. In this case, it is desirable to store the characteristic data of the tone curve in the data holding unit of the image signal processing unit 26 in advance as to what kind of tone curve the gradation of the imaging data is corrected based on.

The solid-state image sensor 1 further includes an input unit 21A. The input unit 21A is a solid-state imaging device that stores, for example, the reference clock signal, timing control signals such as vertical synchronization signals and horizontal synchronization signals, and characteristic data stored in the data holding unit of the image signal processing unit 26 from outside the device. Enter in 1. The input unit 21A includes an input terminal 41 which is an external terminal 14 for inputting data to the solid-state image sensor 1, and an input circuit unit 42 which takes in the signal input to the input terminal 41 into the solid-state image sensor 1. Be prepared.

The input unit 21A further includes an input amplitude changing unit 43 that changes the amplitude of the signal captured by the input circuit unit 42 to an amplitude that can be easily used inside the solid-state image sensor 1.

The input unit 21A further includes an input data conversion circuit unit 44 that changes the arrangement of the data strings of the input data. The input data conversion circuit unit 44 is, for example, a serial-parallel conversion circuit that receives a serial signal as input data and converts it into a parallel signal.

The input amplitude changing unit 43 and the input data conversion circuit unit 44 may be omitted.

When the solid-state imaging device 1 is connected to an external memory device such as a flash memory, SRAM, or DRAM, the input unit 21A can further include a memory interface circuit that receives data from these external memory devices. ..

The solid-state image sensor 1 further includes an output unit 21B. The output unit 21B outputs the image data captured by the solid-state image sensor 1 and the image data signal-processed by the image signal processing unit 26 from the solid-state image sensor 1 to the outside of the device. The output unit 21B is an output terminal 48 which is an external terminal 14 for outputting data from the solid-state image sensor 1 to the outside of the device, and a circuit for outputting data from the inside of the solid-state image sensor 1 to the outside of the device. It includes an output circuit unit 47, which is a circuit for driving an external wiring outside the solid-state image sensor 1 connected to the 48.

The output unit 21B further includes an output amplitude changing unit 46 that changes the amplitude of the signal used inside the solid-state image sensor 1 to an amplitude that can be easily used by an external device connected to the outside of the solid-state image sensor 1.

The output unit 21B further includes an output data conversion circuit unit 45 that changes the arrangement of the data strings of the output data. The output data conversion circuit unit 45 is, for example, a parallel serial conversion circuit that converts a parallel signal used inside the solid-state imaging device 1 into a serial signal.

The output data conversion circuit unit 45 and the output amplitude changing unit 46 may be omitted.

When the solid-state imaging device 1 is connected to an external memory device such as a flash memory, SRAM, or DRAM, the output unit 21B may further include a memory interface circuit that outputs data to these external memory devices. can.

In the present disclosure, for convenience, a circuit block including both or at least one of the input unit 21A and the output unit 21B may be referred to as an input / output unit 21. Further, a circuit unit including both or at least one of the input circuit unit 42 and the output circuit unit 47 may be referred to as an input / output circuit unit 49.

<3. Lens formation method>
Next, a lens forming method for forming the lens resin portion 19 on the protective substrate 18 will be described with reference to FIG.

Although the lens forming method for forming one lens resin portion 19 will be described with reference to FIG. 3, the same applies to the wafer level lens process in which a plurality of lens resin portions 19 are simultaneously formed in the plane direction of the protective substrate 18. be.

First, as shown in A of FIG. 3, UV ozone cleaning using _{ultraviolet rays (UV) and ozone (O 3} ) in a state where the protective substrate 18 is placed on the chuck 501 and is adsorbed and fixed. The contamination on the surface of the protective substrate 18 is removed by cleaning with a chemical solution or the like. As the cleaning using the chemical solution, for example, IPA (isopropyl alcohol), ethanol, acetone or the like can be used as the chemical solution, and the cleaning can be performed by a cleaning method such as two-fluid cleaning or brush cleaning. After the surface of the protective substrate 18 is cleaned, an adhesion accelerator (not shown) for improving the adhesion between the lens material 502 and the protective substrate 18 dropped in the next step is formed.

Next, as shown in FIG. 3B, the lens material 502 is dropped onto the protective substrate 18 forming the lens resin portion 19 at a predetermined position. The dropping position of the lens material 502 can be controlled with high accuracy with reference to the alignment mark formed at a predetermined position on the protective substrate 18. The lens material 502 is composed of, for example, a resin material that is cured by ultraviolet rays.

Next, as shown in C of FIG. 3, a mold 503 having an uneven shape of the lens resin portion 19 attached to the attachment portion 504 of the imprint device is pressed against the protective substrate 18 at a predetermined speed and load. Be done. As a result, the uneven shape of the mold 503 is transferred to the lens material 502 dropped on the protective substrate 18. At this time, the abutting portion 511, which is the convex portion closest to the protective substrate 18 of the mold 503, abuts against the protective substrate 18, so that the distance (height) between the mounting portion 504 and the protective substrate 18 is controlled with high accuracy. NS. The position of the mold 503 in the plane direction is controlled with high accuracy with reference to the alignment mark formed at a predetermined position on the protective substrate 18, similarly to the dropping position of the lens material 502. The surface of the mold 503 that comes into contact with the lens material 502 may be previously subjected to a mold release treatment so that it can be easily peeled off from the cured lens material 502.

Finally, as shown in D of FIG. 3, the lens material 502 is cured by irradiating ultraviolet rays from the upper side of the mounting portion 504 with the mold 503 pressed against the lens material 502, and the lens is formed. The resin portion 19 is formed. A light-shielding film (mask) 512 that does not transmit ultraviolet rays is formed on the outer peripheral portion of the mold 503 in the plane direction, and the lens material 502 protruding from the abutting portion 511 is not irradiated with ultraviolet rays. Therefore, the lens material 502 outside the abutting portion 511 can be removed without being cured.

As the lens material 502, a thermosetting resin material, which is not ultraviolet curable, can be used.

FIG. 4 is a cross-sectional view of a surface of the mold 503 passing through the abutting portion 511 and a plan view (bottom view) of the lower surface of the surface pressed against the lens material 502.

The mold 503 has four abutting portions 511, and each of the four abutting portions 511 is arranged at a position inside the outer peripheral portion in a plan view. Each abutting portion 511 is a columnar body having a cylindrical shape. In the present specification, the columnar body is a columnar body or a cone whose side surface is in the abutting direction, and the side surface does not have to be perpendicular to the protective substrate 18 which is the abutting surface, and is inclined at a predetermined angle. You may. The abutting portion 511 may be a prism-shaped columnar body such as a triangular prism or a square prism. Further, the abutting portion 511 may be a polygonal pyramid-shaped or conical columnar body such as a triangular pyramid or a quadrangular pyramid.

Further, the shape of the tip of the columnar body that abuts against the protective substrate 18 is arbitrary. In the example of FIG. 4, when the mold 503 is pressed against the protective substrate 18, the contact surface where the protective substrate 18 and the abutting portion 511 come into contact with each other is a circle shown in gray in the bottom view. As will be described later with reference to A and B, the shape of the tip portion of the abutting portion 511 may be configured to be in contact with the protective substrate 18 at a point.

Further, in the present embodiment, the four abutting portions 511 are arranged so as to be symmetrical with respect to the center of the plane region of the mold 503, but they do not necessarily have to be arranged symmetrically. .. However, considering the flow of the lens material 502 described later, it is preferable to arrange them symmetrically.

The number of abutting portions 511 formed on the mold 503 is not limited to four, but may be three or more, as long as the flat surface can be controlled in order to control the height of the lens resin portion 19 after curing.

As shown by diagonal lines in the bottom view, the light-shielding film 512 is formed on the outer peripheral portion outside the four abutting portions 511.

FIG. 5 is a plan view of the lens resin portion 19 after removing the excess lens material 502 after the curing treatment.

Since the lens material 502 is removed from the region of the light-shielding film 512 shown in FIG. 4 without being cured, the planar shape of the lens resin portion 19 becomes a rectangular shape as shown in FIG. The lens material 502 does not exist in the four regions 521 corresponding to each of the four abutting portions 511 of the mold 503.

When the light-shielding film 512 formed on the mold 503 is formed up to the inside of the four abutting portions 511, the planar shape of the lens resin portion 19 becomes the rectangular shape indicated by the broken line 19'. No trace of the four regions 521 corresponding to each of the abutting portions 511 remains.

In the plan view of FIGS. 4 and 5, the lens portion 19L in the central portion is a region of the cured lens resin portion 19 that exhibits a lens function of refracting incident light and incident light on the pixels of the upper structure 11. Is shown.

<4. Effect of mold ＞
The mold 503 used in the lens forming method of the present disclosure is formed with a space for allowing the lens material 502 to flow out to the outside in a state where the abutting portion 511 is abutted against the protective substrate 18.

Further, the space generated between the mold 503 and the protective substrate 18 with the abutting portion 511 abutted against the protective substrate 18 allows the lens material 502 to be formed from the outside when the lens material 502 is cured and shrunk. It is also a space for inflow.

An energy-curable resin material that cures with energy such as ultraviolet rays or heat shrinks when it cures. According to the structure of the mold 503 described above, when the lens material 502 contracts, as shown in A and B of FIG. 6, the outside from the gap between the mold 503 other than the abutting portion 511 and the protective substrate 18. Since the protruding lens material 502 is supplied, wrinkles and voids do not occur in the lens portion 19L that exerts the lens function.

In comparison with this, for example, as shown in A and B of FIG. 7, a case where the lens shape is imprinted using a mold 540 having a rectangular abutting portion 541 surrounding the entire circumference is considered. The abutting portion 541 of the mold 540 is in contact with the protective substrate 18 on the entire circumference as shown in gray in B of FIG. When the lens material 502 is cured by using such a mold 540 and the lens material 502 shrinks, the lens material 502 is not supplied from the outside of the abutting portion 541 and the inside sealed by the abutting portion 541. Since the lens material 502 of the lens shrinks, voids and wrinkles due to peeling occur.

Therefore, by imprinting using the mold 503 of the present disclosure, a space for allowing the resin material to flow in and out is formed, so that the occurrence of wrinkles and voids can be prevented.

Further, since the distance of the abutting portion 511 of the mold 503 in the height direction from the protective substrate 18 is controlled by a surface with high accuracy, the lens resin portion 19 can be obtained by simply pressing the mold 503 against the protective substrate 18. The lens thickness and shape of the lens can be controlled with high accuracy.

Therefore, by performing imprinting using the mold 503 provided with the abutting portion 511, it is possible to form the lens resin portion 19 in which the lens shape is controlled with high accuracy at low cost with a simple device configuration. ..

<5. Mold modification example>
FIG. 8 shows a modified example of the mold 503 of the first embodiment described above. In addition, in A to C of FIG. 8, illustration of the light-shielding film 512 is omitted.

The shape of the tip of the abutting portion 511 of the mold 503 of the first embodiment described above is a cylindrical shape, and when the mold 503 is pressed against the protective substrate 18, the abutting portion 511 is a protective substrate. It was configured to come into contact with 18 in a circle (plane).

On the other hand, in the first modification of the mold 503 shown in FIG. 8A, the shape of the tip portion of the abutting portion 511 is a substantially spherical (hemispherical) shape. When the mold 503 of this first modification is pressed against the protective substrate 18, the region where the protective substrate 18 and the abutting portion 511 come into contact becomes a point.

Further, in the second modification of the mold 503 shown in FIG. 8B, the shape of the tip portion of the abutting portion 511 is a polygonal pyramid shape such as a triangular pyramid. When the mold 503 of this second modification is pressed against the protective substrate 18, the region where the protective substrate 18 and the abutting portion 511 come into contact becomes a point. In addition to the polygonal pyramid shape, a conical shape may be used.

As described above, the shape of the tip portion of the abutting portion 511 may be a shape that makes point contact with the protective substrate 18.

Further, as shown in FIG. 8C, the three or more abutting portions 511 of the mold 503 may be arranged not in one lens unit but in two or more lens units.

<6. Second embodiment of the mold>
Next, another embodiment (second embodiment) of the mold 503 will be described.

The mold 503 of the second embodiment shown in FIG. 9 includes an abutting portion 611 instead of the abutting portion 511 of the first embodiment, and replaces the light-shielding film 512 of the first embodiment. A light-shielding film 612 is provided.

The abutting portion 611 is configured to abut against a surface different from the surface on which the lens resin portion 19 of the substrate 601 is formed.

In FIG. 9, the substrate 601 on which the lens resin portion 19 is formed has a cavity shape and has a surface having a height different from the surface on which the lens resin portion 19 is formed. The abutting portion 611 of the mold 503 is arranged on the outer peripheral portion of the mold 503, and is configured to abut against a surface above the surface on which the lens resin portion 19 is formed. The abutting portion 611 controls the height of the lens resin portion 19 by abutting the surface on which the lens resin portion 19 is formed and an upper surface different from the surface on which the lens resin portion 19 is formed.

When the abutting portion 611 is abutted against the upper surface on the higher side of the substrate 601, an extra lens material 502 is provided between the lower surface on the lower side of the cavity-shaped substrate 601 and the mold 503. A flowable space is formed so as to allow the lens material 502 to escape to the outside or to be pulled back to the inside when the lens material 502 is cured and shrunk.

FIG. 10 is a cross-sectional view of the mold 503 of the second embodiment shown in FIG. 9 and a plan view (bottom view) of a lower surface which is a surface pressed against the lens material 502.

When the substrate 601 has a step on a surface having a height different from the surface on which the lens resin portion 19 is formed, the inclined surface connecting the step is used in the plane direction of the mold 503 and the substrate 601. Alignment can be performed.

As shown in the cross-sectional view and the plan view of FIG. 10, the mold 503 of the second embodiment includes a guide portion 631 having a tapered shape formed so as to come into contact with the inclined surfaces at the four corners of the substrate 601. The position of the mold 503 in the plane direction is controlled by guiding the guide portion 631 on the inclined surface of the cavity shape of the substrate 601. Except for the four corners of the guide portion 631 of the mold 503, the lens material 502 is recessed inward (in the lens portion 19L direction) from the inclined surface of the cavity shape so as to form a gap as a flow path of the lens material 502. ..

<7. Timing of formation of lens resin part>
FIG. 11 is a diagram illustrating the formation timing of the lens resin portion 19 in the step of forming the solid-state image sensor 1 of FIG.

FIG. 11A shows a method of forming the lens resin portion 19 on the upper surface of the protective substrate 18 by the method described above after arranging the protective substrate 18 on the upper side of the laminated structure 13.

On the other hand, in FIG. 11B, the lens resin portion 19 is first formed on the upper surface of the protective substrate 18 by the method described above, and the protective substrate 18 on which the lens resin portion 19 is formed is laminated at an arbitrary timing. The method of arranging the structure 13 above the on-chip lens 16 and the color filter 15 is shown.

In this way, the lens resin portion 19 may be formed on the protective substrate 18 that has been combined with the laminated structure 13, or the lens resin portion 19 may be formed in the state of the protective substrate 18 alone, and then the laminated structure 13 is formed. May be combined with.

<8. Other shape examples of the lens resin part>
FIG. 12 is a diagram showing another shape example of the lens resin portion 19.

As the shape of the lens resin portion 19, any shape can be adopted as long as it exhibits the performance as a lens, and may be, for example, the shape shown in FIG. The shape of the mold 503 may change depending on the shape of the lens resin portion 19.

<9. Detailed structure of laminated structure>
Next, the detailed structure and manufacturing method of the laminated structure 13, which is a portion of the solid-state image sensor 1 excluding the lens resin portion 19, will be described.

FIG. 13 is a diagram showing a detailed cross-sectional structure of the laminated structure 13. In FIG. 13, the lens resin portion 19 of the solid-state image sensor 1 is not shown.

A plurality of pixels 31 (FIG. 2) having an on-chip lens 16, a color filter 15, a pixel transistor, and a photodiode 51 are provided in a portion including the upper structure 11 provided in the solid-state image sensor 1 and above the upper structure 11. Pixel array units 24 arranged in an array are arranged. A pixel transistor region 301 is also arranged in the region (pixel array region) of the pixel array unit 24. The pixel transistor region 301 is a region in which at least one pixel transistor among a transfer transistor, an amplification transistor, and a reset transistor is formed.

A plurality of external terminals 14 are arranged on the lower surface of the semiconductor substrate 81 provided in the lower structure 12 and in a region located below the pixel array portion 24 provided in the upper structure 11.

In the description of FIG. 13, "a region located on the lower surface of the semiconductor substrate 81 provided in the lower structure 12 and below the pixel array portion 24 provided in the upper structure 11" is the first. A specific region, "a region located on the upper surface of the semiconductor substrate 81 provided in the lower structure 12 and below the pixel array portion 24 provided in the upper structure 11" is referred to as a second specific region.

At least a part of the plurality of external terminals 14 arranged in the first specific region is for outputting a signal from the signal input terminal 14A for inputting a signal from the outside to the solid-state image sensor 1 or the solid-state image sensor 1 to the outside. The signal output terminal 14B of. In other words, the signal input terminal 14A and the signal output terminal 14B are external terminals 14 excluding the power supply terminal and the ground terminal from the external terminals 14. In the present disclosure, these signal input terminals 14A or signal output terminals 14B are referred to as signal input / output terminals 14C.

A through via 88 penetrating the semiconductor substrate 81 is arranged in the first specific region and in the vicinity of these signal input / output terminals 14C. In the present disclosure, the penetrating via hole penetrating the semiconductor substrate 81 and the via wiring formed inside the through via hole may be collectively referred to as a penetrating via 88.

This through via hole is a part of the multilayer wiring layer 82 arranged above the upper surface of the semiconductor substrate 81 from the lower surface of the semiconductor substrate 81, and is a conductive pad 322 (hereinafter, a bottom portion) which is a terminal (bottom) of the via hole. It is desirable that the structure is formed by digging up to (sometimes referred to as a via pad 322).

The signal input / output terminal 14C arranged in the first specific area is electrically connected to the through via 88 (more specifically, the via wiring formed in the through via hole) also arranged in the first specific area. NS.

An input / output circuit unit 49 having an input circuit unit 42 or an output circuit unit 47 is arranged in a second specific region and in a region near the signal input / output terminal 14C and the through via.

The signal input / output terminal 14C arranged in the first specific region is electrically connected to the input / output circuit unit 49 via the through via 88 and the via pad 322, or also a part of the multilayer wiring layer 82. NS.

The area in which the input / output circuit unit 49 is arranged is referred to as an input / output circuit area 311. A signal processing circuit region 312 is formed adjacent to the input / output circuit region 311 on the upper surface of the semiconductor substrate 81 provided in the lower structure 12. The signal processing circuit area 312 is an area in which the image signal processing unit 26 described with reference to FIG. 2 is formed.

The region in which the pixel peripheral circuit unit including all or part of the row drive unit 22 and the column signal processing unit 25 described with reference to FIG. 2 is arranged is referred to as a pixel peripheral circuit area 313. Of the lower surface of the semiconductor substrate 101 provided in the upper structure 11 and the upper surface of the semiconductor substrate 81 provided in the lower structure 12, a pixel peripheral circuit region 313 is provided in a region outside the pixel array portion 24. Have been placed.

The signal input / output terminal 14C may be arranged in the area below the input / output circuit area 311 arranged in the lower structure 12, or may be arranged in the area below the signal processing circuit area 312. You may. Alternatively, the signal input / output terminal 14C may be arranged below the pixel peripheral circuit unit such as the row drive unit 22 or the column signal processing unit 25, which is arranged in the lower structure 12.

In the present disclosure, the wiring connection structure for connecting the wiring included in the multilayer wiring layer 102 of the upper structure 11 and the wiring included in the multilayer wiring layer 82 of the lower structure 12 may be referred to as an upper and lower wiring connection structure. There is, and the area where this structure is arranged may be called the upper and lower wiring connection area 314.

The upper and lower wiring connection structure consists of a first through electrode (through silicon via) 109 that penetrates the semiconductor substrate 101 from the upper surface of the upper structure 11 and reaches the multilayer wiring layer 102, and a semiconductor substrate from the upper surface of the upper structure 11. A second through electrode (chip through electrode) 105 that penetrates 101 and the multilayer wiring layer 102 and reaches the multilayer wiring layer 82 of the lower structure 12 and these two through electrodes (Through Silicon Via, TSV) for connecting. It is formed by a through electrode connecting wiring 106. In the present disclosure, such a vertical wiring connection structure may be referred to as a twin contact structure.

The upper and lower wiring connection areas 314 are arranged outside the pixel peripheral circuit area 313.

In the present embodiment, the pixel peripheral circuit region 313 is formed in both the upper structure 11 and the lower structure 12, but it can also be formed in only one of them.

Further, in the present embodiment, the upper and lower wiring connection areas 314 are located outside the pixel array section 24 and outside the pixel peripheral circuit area 313, but are outside the pixel array section 24. Moreover, it may be arranged inside the pixel peripheral circuit area 313.

Further, in the present embodiment, the through silicon via 109 and the through silicon via 105 have two structures for electrically connecting the multilayer wiring layer 102 of the upper structure 11 and the multilayer wiring layer 82 of the lower structure 12. We adopted a twin contact structure that connects using through electrodes.

As a structure for electrically connecting the multilayer wiring layer 102 of the upper structure 11 and the multilayer wiring layer 82 of the lower structure 12, for example, the wiring of the wiring layer 103 of the upper structure 11 and the wiring of the lower structure 12 Each of the layers 83 may have a share contact structure that is commonly connected to one through electrode.

<10. Manufacturing method of laminated structure>
Next, a method of manufacturing the solid-state image sensor 1 will be described with reference to FIGS. 14 to 28.

First, the lower structure 12 and the upper structure 11 in a wafer state are manufactured separately.

As the lower structure 12, a multi-layer wiring layer 82 that is a part of the input / output circuit unit 49, the row drive unit 22, or the column signal processing unit 25 is formed in each chip portion of the semiconductor substrate 81. .. The semiconductor substrate 81 at this point is in a state before being thinned, and has a thickness of, for example, about 600 μm.

On the other hand, as the upper structure 11, the photodiode 51 of each pixel 31 and the source / drain region of the pixel transistor are formed in the region of each chip of the semiconductor substrate 101. Further, a multilayer wiring layer 102 constituting a row drive signal line 32, a vertical signal line 33, and the like is formed on one surface of the semiconductor substrate 101. The semiconductor substrate 101 at this point is also in a state before being thinned, and has a thickness of, for example, about 600 μm.

Then, as shown in FIG. 14, after the manufactured wafer state is bonded so that the multilayer wiring layer 82 side of the lower structure 12 and the multilayer wiring layer 102 side of the upper structure 11 face each other, FIG. As shown in FIG. 15, the semiconductor substrate 101 of the upper structure 11 is thinned. The bonding includes, for example, plasma bonding and bonding with an adhesive, but in the present embodiment, plasma bonding is used. In the case of plasma bonding, a film such as a plasma TEOS film, a plasma SiN film, a SiON film (block film), or a SiC film is formed on the bonding surface of the upper structure 11 and the lower structure 12, respectively, to form a bonding surface. The two are joined by plasma treatment, superposition, and then annealing treatment.

After the semiconductor substrate 101 of the upper structure 11 is thinned, as shown in FIG. 16, the through silicon via 109 and the through silicon via 105 are used in the upper and lower wiring connection regions 314 by using the damascene method or the like. A connection wiring 106 that connects them is formed.

Next, as shown in FIG. 17, a color filter 15 and an on-chip lens 16 are formed above the photodiode 51 of each pixel 31 via the flattening film 108.

Then, as shown in FIG. 18, the flattening film 110 is interposed over the entire surface of the laminated structure 13 in which the upper structure 11 and the lower structure 12 are bonded to each other on which the on-chip lens 16 is formed. The sealing resin 17 is applied, and as shown in FIG. 19, the protective substrate 18 is bonded in a cavityless structure.

At this time, as described with reference to FIG. 11B, when the method of forming the lens resin portion 19 in the state of the protective substrate 18 alone and then bonding the lens resin portion 19 to the laminated structure 13 is adopted, the protective substrate 18 is used. The lens resin portion 19 is formed on the lens resin portion 19.

On the other hand, as described with reference to FIG. 11A, when the method of forming the lens resin portion 19 on the protective substrate 18 after arranging the protective substrate 18 on the upper side of the laminated structure 13 is adopted, FIG. In a predetermined step after the state shown in the above, the lens resin portion 19 is formed on the protective substrate 18.

Next, as shown in FIG. 20, after the entire laminated structure 13 is inverted, the semiconductor substrate 81 of the lower structure 12 has a thickness that does not affect the device characteristics, for example, about 30 to 100 μm. It will be thinned.

Next, as shown in FIG. 21, the photoresist 221 is patterned and then dry-etched so that the position where the through via 88 (not shown) is arranged on the thinned semiconductor substrate 81 is opened. As a result, a part of the semiconductor substrate 81 and the interlayer insulating film 84 under the semiconductor substrate 81 is removed, and an opening 222 is formed.

Next, as shown in FIG. 22, an insulating film (isolation film) 86 is formed on the entire upper surface of the semiconductor substrate 81 including the opening 222 by, for example, a plasma CVD method. The insulating film 86 can be, for example, a SiO2 film or a SiN film.

Next, as shown in FIG. 23, the insulating film 86 on the bottom surface of the opening 222 is removed by the etchback method, and the wiring layer 83c closest to the semiconductor substrate 81 is exposed.

Next, as shown in FIG. 24, a barrier metal film (not shown) and a Cu seed layer 231 are formed by using a sputtering method. The barrier metal film is a film for preventing the diffusion of the connecting conductor 87 (Cu) shown in FIG. 25, and the Cu seed layer 231 serves as an electrode when the connecting conductor 87 is embedded by the electrolytic plating method. As the material of the barrier metal film, tantalum (Ta), titanium (Ti), tungsten (W), zirconium (Zr), a nitrided film thereof, a carbonized film and the like can be used. In this embodiment, titanium is used as the barrier metal film.

Next, as shown in FIG. 25, after forming a resist pattern 241 in a required region on the Cu seed layer 231, copper (Cu) as a connecting conductor 87 is plated by an electrolytic plating method. As a result, the through via 88 is formed, and the rewiring 90 is also formed on the upper side of the semiconductor substrate 81.

Next, as shown in FIG. 26, after the resist pattern 241 is removed, the barrier metal film (not shown) and the Cu seed layer 231 under the resist pattern 241 are removed by wet etching.

Next, as shown in FIG. 27, the solder mask 91 is formed to protect the rewiring 90, and then the solder mask 91 is removed only in the area where the external terminal 14 is mounted, whereby the solder mask opening 242 is formed. ..

Then, as shown in FIG. 28, an external terminal 14 is formed in the solder mask opening 242 by a solder ball mounting method or the like.

As described above, according to the method for manufacturing the laminated structure 13, first, from the upper structure 11 (first semiconductor substrate) on which the photodiode 51 for photoelectric conversion, the pixel transistor circuit, and the like are formed, and the pixels 31 The lower structure 12 (second semiconductor substrate) formed so that the input / output circuit unit 49 for outputting the output pixel signal to the outside of the solid-state imaging device 1 is below the pixel array unit 24 is , The wiring layers are pasted together so that they face each other. Then, a penetrating via 88 penetrating the lower structure 12 is formed, and an external terminal 14 electrically connected to the outside of the solid-state image sensor 1 is formed via the input / output circuit unit 49 and the penetrating via 88. As a result, the solid-state image sensor 1 shown in FIG. 1 can be manufactured.

<11. Detailed configuration of camera module>
The mold to which this technology is applied can also be used for forming a mold in a wafer level lens process in which a plurality of lenses are simultaneously formed in the plane direction of a wafer substrate by imprinting.

In the following, first, the configuration of the camera module formed by using the wafer level lens process of simultaneously forming a plurality of lenses in the plane direction of the wafer substrate will be described, and then in which step of the process of forming the camera module. , Explain whether the mold of this technology can be used.

FIG. 29 is a cross-sectional view of the camera module 700.

The camera module 700 includes a laminated lens structure (lens module) 702 in which a plurality of lens-attached substrates 701a to 701e are laminated. The laminated lens structure 702 constitutes one optical unit 703. The alternate long and short dash line 704 represents the optical axis of the optical unit 703.

The solid-state image sensor 1 of FIG. 1 is arranged below the laminated lens structure 702. The solid-state image sensor 1 is fixed to the laminated lens structure 702 via a structural material 740 formed of, for example, an epoxy resin.

In the camera module 700, the light incident on the camera module 700 from above passes through the laminated lens structure 702 and is formed on the on-chip lens 16 of the solid-state image sensor 1, the color filter 15, and the upper structure 11. It is incident on a photoelectric conversion element such as a photodiode (not shown).

The laminated lens structure 702 includes five laminated substrates with lenses 701a to 701e. When the five lens-attached substrates 701a to 701e are not particularly distinguished, the description will be simply described as the lens-attached substrate 701.

In the example of FIG. 29, the laminated lens structure 702 includes a configuration in which five lens-attached substrates 701a to 701e are laminated, but the number of laminated lens-attached substrates 701 is not particularly limited as long as it is two or more. ..

Each lens-attached substrate 701 constituting the laminated lens structure 702 has a configuration in which a lens resin portion 722 is added to the carrier substrate 721. The carrier substrate 721 has a through hole 723, and a lens resin portion 722 is formed inside the through hole 723. The lens resin portion 722 represents a portion integrated with the material constituting the lens portion, including a portion extending to the carrier substrate 721 and supporting the lens portion.

When distinguishing the carrier substrates 721, the lens resin portion 722, or the through hole 723 of the lens-attached substrates 701a to 701e, as shown in FIG. 29, the lens-attached substrates 701a to 41e correspond to the lens-attached substrates 701a to 41e. The description will be described as described as the carrier substrates 721a to 81e, the lens resin portions 722a to 82e, or the through holes 723a to 83e.

The cross-sectional shape of the through hole 723 of each lens-equipped substrate 701 constituting the laminated lens structure 702 has a so-called downward recess shape in which the opening width decreases toward the lower side (the side on which the light receiving element 705 is arranged). Is

A diaphragm plate 731 is arranged on the laminated lens structure 702. The drawing plate 731 includes, for example, a layer made of a material having a light absorbing property or a light absorbing property. The drawing plate 731 is provided with an opening 732.

The laminated lens structure 702, the solid-state image sensor 1, the aperture plate 731, and the like are housed in the lens barrel 751.

As described above, the solid-state image sensor 1 of FIG. 1 can form the camera module 700 in combination with the laminated lens structure 702 in which a plurality of lens-attached substrates 701 are laminated.

Further, as shown in FIG. 30, the camera module 700 can be configured by combining the solid-state image sensor 1 shown in FIG. 12 and the laminated lens structure 702.

Further, as shown in FIG. 31, in the camera module 700, the laminated lens structure 702 includes a plurality of optical units 703, and the solid-state image sensor 1 also has a plurality of light receiving regions corresponding to the plurality of optical units 703. It can also be configured as a compound eye camera module.

In the solid-state imaging device 1 of the camera module 700 of FIG. 31, the seal resin 17 embedded between the on-chip lens 16 and the protective substrate 18 and the lens resin portion 19 formed on the upper surface of the protective substrate 18 are provided. , The omitted configuration is adopted.

In the example of FIG. 31, the plurality of optical units 703 formed in the laminated lens structure 702 have the same configuration, but may have different configurations. That is, the plurality of optical units 703 may have different optical parameters because the shape and the number of lens resin portions 722 are different. For example, the plurality of optical units 703 can be an optical unit 703 having a short focal length for photographing a near view and an optical unit 703 having a long focal length for photographing a distant view.

FIG. 32 is a diagram illustrating a manufacturing method for manufacturing the laminated lens structure 702 described with reference to FIGS. 29 to 31 in a substrate state.

First, as shown in A of FIG. 32, a lens-attached substrate 701W-e in a substrate state located at the lowest layer in the laminated lens structure 702 is prepared. The lens-equipped substrate 701W-e represents a substrate state (wafer state) before the lens-equipped substrate 701e is fragmented. Similarly, the lens-attached substrates 701W-a to 701W-d, which will be described later, indicate that the lens-attached substrates 701a to 701e are in the substrate state (wafer state) before being fragmented.

Next, as shown in B of FIG. 32, the lens-attached substrate 701W-d in the substrate state located in the second layer from the bottom in the laminated lens structure 702 is placed on the lens-attached substrate 701W-e in the substrate state. Be joined.

Next, as shown in C of FIG. 32, the lens-attached substrate 701W-c in the substrate state located in the third layer from the bottom in the laminated lens structure 702 is placed on the lens-attached substrate 701W-d in the substrate state. Be joined.

Next, as shown in D of FIG. 32, the lens-attached substrate 701W-b in the substrate state located in the fourth layer from the bottom in the laminated lens structure 702 is placed on the lens-attached substrate 701W-c in the substrate state. Join.

Next, as shown in E of FIG. 32, the lens-attached substrate 701W-a in the substrate state located in the fifth layer from the bottom in the laminated lens structure 702 is placed on the lens-attached substrate 701W-b in the substrate state. Be joined.

Finally, as shown in F of FIG. 32, the diaphragm plate 731W located on the upper layer of the lens-equipped substrate 701a in the laminated lens structure 702 is joined onto the lens-equipped substrate 701W-a in the substrate state. The drawing plate 731W represents a substrate state (wafer state) before the drawing plate 731 is fragmented.

As described above, the five lens-attached substrates 701W-a to 701W-e in the substrate state are sequentially arranged one by one from the lower lens-attached substrate 701W in the laminated lens structure 702 to the upper lens-attached substrate 701W. A laminated lens structure 702W in a substrate state can be obtained by laminating the lenses.

By reversing the order of lamination and laminating one by one from the upper layer lens-equipped substrate 701W to the lower layer lens-equipped substrate 701W, the laminated lens structure 702W in the substrate state is formed. It is also possible.

<12. Direct bonding between substrates with lenses>
FIG. 33 is a diagram illustrating joining of the lens-attached substrate 701W-a in the substrate state and the lens-attached substrate 701W-b in the substrate state as an example of joining the lens-attached substrate 701W in the substrate state.

In FIG. 33, the parts of the lens-equipped substrate 701W-b corresponding to the respective parts of the lens-equipped substrate 701W-a are designated by the same reference numerals as those of the lens-equipped substrate 701W-a.

An upper surface layer 801 is formed on the upper surfaces of the lens-equipped substrate 701W-a and the lens-equipped substrate 701W-b. A lower surface layer 802 is formed on the lower surfaces of the lens-equipped substrate 701W-a and the lens-equipped substrate 701W-b. Then, as shown in A of FIG. 33, the entire lower surface including the back flat portion 812 of the lens-equipped substrate 701W-a, which is the surface to which the lens-attached substrate 701W-a and 701W-a are joined, and the entire lower surface including the back flat portion 812 of the lens-attached substrate 701W-a, and The entire upper surface of the lens-equipped substrate 701W-b including the front flat portion 811 is subjected to plasma activation treatment. The gas used for the plasma activation treatment may be any gas that can be plasma treated, such as O2, N2, He, Ar, and H2. However, when the same gas as the constituent elements of the upper surface layer 802 and the lower surface layer 803 is used as the gas used for the plasma activation treatment, the deterioration of the film itself of the upper surface layer 802 and the lower surface layer 803 is suppressed. It is preferable because it can be used.

Then, as shown in B of FIG. 33, the flat portion 812 on the back side of the activated surface state of the substrate 701W-a with a lens and the flat portion 811 on the front side of the substrate 701W-b with a lens are bonded together.

By the bonding process between the lenses-attached substrates, the hydrogen of the OH groups on the surface of the lower surface layer 802 of the lens-attached substrate 701W-a and the hydrogen of the OH groups on the surface of the upper surface layer 801 of the lens-attached substrate 701W-b are combined with each other. A hydrogen bond is formed between the two. As a result, the lens-equipped substrate 701W-a and the lens-equipped substrate 701W-b are fixed. The bonding process between the lenses-equipped substrates can be performed under atmospheric pressure conditions.

An annealing treatment is performed on the lens-attached substrate 701W-a and the lens-attached substrate 701W-b that have undergone the bonding process. As a result, dehydration condensation occurs from the state where the OH groups are hydrogen-bonded to each other, and oxygen is interposed between the lower surface layer 802 of the lens-attached substrate 701W-a and the upper surface layer 801 of the lens-attached substrate 701W-b. Covalent bond is formed. Alternatively, the element contained in the lower surface layer 802 of the lens-attached substrate 701W-a and the element contained in the upper surface layer 801 of the lens-attached substrate 701W-b are covalently bonded. By these couplings, the two lens-attached substrates are firmly fixed. In this way, a covalent bond is formed between the lower surface layer 802 of the lens-equipped substrate 701W arranged on the upper side and the upper surface layer 801 of the lens-equipped substrate 701W arranged on the lower side, thereby forming two lenses. Fixing the attached substrate 701W is referred to as direct bonding in this specification. Since the direct bonding of the present technology does not use resin when fixing a plurality of lenses-equipped substrates 701W, it is possible to fix a plurality of lens-attached substrates 701W without causing curing shrinkage or thermal expansion due to this. , Which has the effect or effect.

The annealing treatment can also be performed under atmospheric pressure conditions. Since this annealing treatment is dehydration condensation, it can be performed at 100 ° C. or higher, 150 ° C. or higher, or 200 ° C. or higher. On the other hand, this annealing treatment is 400 ° C. or lower, 350 ° C. or lower, or 300 ° C. from the viewpoint of protecting the energetic cured resin for forming the lens resin portion 722 from heat and suppressing degassing from the energetic cured resin. It can be done as follows.

If the bonding process between the lens-attached substrates 701W or the direct bonding process between the lens-attached substrates 701W is performed under conditions other than atmospheric pressure, the bonded substrate with lens 701W-a and the substrate with lens are joined. When the 701W-b is returned to the atmospheric pressure environment, a pressure difference between the space between the bonded lens resin portion 722 and the lens resin portion 722 and the outside of the lens resin portion 722 occurs. Due to this pressure difference, pressure is applied to the lens resin portion 722, and there is a concern that the lens resin portion 722 is deformed.

Performing both the bonding process between the lenses-equipped substrates 701W and the direct bonding process between the lens-equipped substrates 701W under atmospheric pressure is a concern when the bonding is performed under conditions other than atmospheric pressure. It has the effect or effect that the deformation of the lens resin portion 722 can be avoided.

By directly joining the plasma-activated substrates, in other words, plasma bonding, it is possible to suppress fluidity and thermal expansion as in the case of using a resin as an adhesive, so the lens-attached substrate 701W It is possible to improve the positional accuracy when joining −a and the lens-equipped substrate 701W−b.

As described above, the upper surface layer 801 or the lower surface layer 802 is formed on the back side flat portion 812 of the lens-equipped substrate 701W-a and the front side flat portion 811 of the lens-equipped substrate 701W-b. Dangling bonds are easily formed in the upper surface layer 801 and the lower surface layer 802 by the plasma activation treatment performed earlier. That is, the lower surface layer 802 formed on the back flat portion 812 of the lens-equipped substrate 701W-a and the upper surface layer 801 formed on the front flat portion 811 of the lens-attached substrate 701W-b increase the bonding strength. It also has a role.

Further, when the upper surface layer 801 or the lower surface layer 802 is composed of an oxide film, it is not affected by the change in film quality due to plasma (O2), so that the lens resin portion 722 is corroded by plasma. It also has the effect of suppressing.

As described above, the surface activity of the lens-attached substrate 701W-a in which the plurality of lens-attached substrates 701a are formed and the lens-attached substrate 701W- in the substrate state in which the plurality of lens-attached substrates 701b are formed are due to plasma. It is directly bonded after being subjected to a chemical treatment, in other words, it is bonded using plasma bonding.

The same applies to the case where the lens-attached substrate 701W of the other two substrates is joined.

<13. Manufacturing method of substrate with lens ＞
Next, a method of manufacturing the lens-attached substrate 701W in the substrate state will be described with reference to FIG. 34.

First, as shown in A of FIG. 34, a carrier substrate 721W in which a plurality of through holes 723 are formed is prepared. A light-shielding film 911 for preventing light reflection is formed on the side wall of the through hole 723. In FIG. 34, only two through holes 723 are shown due to space limitations, but in reality, a large number of through holes 723 are formed in the plane direction of the carrier substrate 721W. Further, an alignment mark (not shown) for alignment is formed in a region near the outer circumference of the carrier substrate 721W.

The front flat portion 811 on the upper side of the carrier substrate 721W and the back flat portion 812 on the lower side are flat surfaces formed flat enough to enable the plasma bonding described above. The thickness of the carrier substrate 721W is finally individualized as a substrate with a lens 701, and when it is stacked with another substrate with a lens 701, it also plays a role as a spacer for determining the distance between lenses.

For the carrier substrate 721W, it is preferable to use a substrate having a low coefficient of thermal expansion of 10 ppm / ° C. or less.

Next, as shown in B of FIG. 34, the carrier substrate 721W is arranged on the mold substrate 921 in which a plurality of concave molds 922 are arranged at regular intervals. More specifically, the back flat portion 812 of the carrier substrate 721W and the flat surface 923 of the mold substrate 921 are overlapped so that the concave mold 922 is located inside the through hole 723 of the carrier substrate 721W. The mold 922 of the mold substrate 921 is formed so as to correspond one-to-one with the through hole 723 of the carrier substrate 721W so that the centers of the corresponding mold 922 and the through hole 723 coincide with each other in the optical axis direction. In addition, the positions of the carrier substrate 721W and the mold substrate 921 in the plane direction are adjusted. The mold substrate 921 is made of a hard mold member, and is made of, for example, metal, silicon, quartz, or glass.

Next, as shown in C of FIG. 34, the energy curable resin 931 is filled (dropped) inside the through holes 723 of the overlapped mold substrate 921 and the carrier substrate 721W. The lens resin portion 722 is formed by using this energy curable resin 931. Therefore, it is preferable that the energy curable resin 931 is pre-defoamed so as not to contain air bubbles. The defoaming treatment is preferably a vacuum defoaming treatment or a defoaming treatment by centrifugal force. Further, it is preferable that the vacuum defoaming treatment is performed after filling. By performing the defoaming treatment, the lens resin portion 722 can be molded without embracing air bubbles.

Next, as shown in D of FIG. 34, the mold substrate 941 is arranged on the stacked mold substrate 921 and the carrier substrate 721W. A plurality of concave molds 942 are arranged on the mold substrate 941 at regular intervals, and the center of the through hole 723 and the center of the mold 942 are the optical axes as in the case where the mold substrate 921 is arranged. The mold substrate 941 is arranged after being accurately positioned so that the directions match. The mold substrate 941 is made of a hard mold member, and is made of, for example, metal, silicon, quartz, or glass.

Regarding the height direction, which is the vertical direction on the paper surface, the distance between the mold substrate 941 and the mold substrate 921 is set to a predetermined distance by the control device that controls the distance between the mold substrate 941 and the mold substrate 921. The position of the mold substrate 941 is fixed so as to be. At this time, the space sandwiched between the mold 942 of the mold substrate 941 and the mold 922 of the mold substrate 921 is equal to the thickness of the lens resin portion 722 calculated by the optical design.

Alternatively, as shown in E of FIG. 34, the flat surface 943 of the mold substrate 941 and the front flat portion 811 of the carrier substrate 721W may be overlapped in the same manner as when the mold substrate 921 is arranged. good. In this case, the distance between the mold substrate 941 and the mold substrate 921 is the same as the thickness of the carrier substrate 721W, and highly accurate alignment in the plane direction and the height direction becomes possible.

When the distance between the mold substrate 941 and the mold substrate 921 is controlled to be a preset distance, the energy curing dropped inside the through hole 723 of the carrier substrate 721W in the step C of FIG. 34 described above. The filling amount of the sex resin 931 is a controlled amount so as not to overflow from the space surrounded by the through hole 723 of the carrier substrate 721W and the mold substrate 941 and the mold substrate 921 above and below the through hole 723. As a result, the manufacturing cost can be reduced without wasting the material of the energy curable resin 931.

Subsequently, the energy curable resin 931 is cured in the state shown in E of FIG. 34. The energy-curable resin 931 is cured by, for example, applying heat or UV light as energy and leaving it to stand for a predetermined time. By pushing the mold substrate 941 downward or aligning the mold substrate 941 during curing, deformation due to shrinkage of the energy curable resin 931 can be suppressed to a minimum.

A thermoplastic resin may be used instead of the energy curable resin 931. In that case, in the state shown in E of FIG. 34, the energy curable resin 931 is formed into a lens shape by raising the temperature of the mold substrate 941 and the mold substrate 921, and is cured by cooling.

Next, as shown in F of FIG. 34, the control device that controls the positions of the mold substrate 941 and the mold substrate 921 moves the mold substrate 941 upward and the mold substrate 921 downward. , The mold substrate 941 and the mold substrate 921 are separated from the carrier substrate 721W. When the mold substrate 941 and the mold substrate 921 are separated from the carrier substrate 721W, a lens resin portion 722 is formed inside the through hole 723 of the carrier substrate 721W.

The surfaces of the mold substrate 941 and the mold substrate 921 that come into contact with the carrier substrate 721W may be coated with a mold release agent such as fluorine or silicon. By doing so, the carrier substrate 721W can be easily separated from the mold substrate 941 and the mold substrate 921. Further, as a method of easily separating the mold from the contact surface with the carrier substrate 721W, various coatings such as fluorine-containing DLC (Diamond Like Carbon) may be applied.

Next, as shown in G of FIG. 34, the upper surface layer 801 is formed on the surface of the carrier substrate 721W and the lens resin portion 722, and the lower surface layer 802 is formed on the back surface of the carrier substrate 721W and the lens resin portion 722. It is formed. Even if the front flat portion 811 and the back flat portion 812 of the carrier substrate 721W are flattened by performing CMP (Chemical Mechanical Polishing) or the like as necessary before and after the film formation of the upper surface layer 801 and the lower surface layer 802. good.

As described above, the energy curable resin 931 is imprinted (pressure molded) in the through hole 723 formed in the carrier substrate 721W using the mold substrate 941 and the mold substrate 921 to form the lens resin portion 722. The substrate 701W with a lens in the substrate state can be manufactured.

The shapes of the mold 922 and the mold 942 are not limited to the concave shape described above, and are appropriately determined according to the shape of the lens resin portion 722. As shown in FIGS. 29 to 31, the lens shapes of the lens-attached substrates 701a to 701e can take various shapes derived by the optical system design, for example, biconvex shape, biconcave shape, and plano-convex shape. The shape, a plano-concave shape, a convex meniscus shape, a concave meniscus shape, a higher-order aspherical shape, or the like may be used.

Further, the shapes of the mold 922 and the mold 942 may be such that the lens shape after formation has a moth-eye structure.

According to the manufacturing method described above, the fluctuation of the distance between the lens resin portions 722 in the plane direction due to the curing shrinkage of the energy curable resin 931 can be cut off by the intervention of the carrier substrate 721W, so that the accuracy between the lens distances is highly accurate. Can be controlled to. Further, the energy curable resin 931 having a weak strength is reinforced by the carrier substrate 721W having a strong strength. This makes it possible to provide a lens array substrate in which a plurality of lenses having good handleability are arranged, and also has an effect of suppressing warpage of the lens array substrate.

The lens forming method described with reference to FIG. 3 can be adopted for forming the mold 922 and the mold 942 used in the method for manufacturing the lens-attached substrate 701W in the above-mentioned substrate state.

That is, the molds 922 and 942 of FIG. 34 can be formed in the same manner as the lens resin portion 19 is formed by using the lens forming method of FIG. 3, and the protective substrate 18 in the lens forming method of FIG. 3 is shown in FIG. 34. Corresponds to the mold substrate 921 or 941 of. The shape transferred by the mold 503 provided with the abutting portion 511 is the shape of the mold 922 or 942.

<14. Application example to electronic devices>
The solid-state image sensor 1 and the camera module 700 described above include an image capture unit such as an image pickup device such as a digital still camera or a video camera, a portable terminal device having an image pickup function, or a copier that uses a solid-state image sensor as an image reader. It can be used in a form incorporated in an electronic device that uses a solid-state image sensor in (photoelectric conversion unit).

FIG. 35 is a block diagram showing a configuration example of an imaging device as an electronic device to which the present technology is applied.

The image pickup apparatus 2000 of FIG. 35 includes a camera module 2002 and a DSP (Digital Signal Processor) circuit 2003 which is a camera signal processing circuit. The image pickup apparatus 2000 also includes a frame memory 2004, a display unit 2005, a recording unit 2006, an operation unit 2007, and a power supply unit 2008. The DSP circuit 2003, the frame memory 2004, the display unit 2005, the recording unit 2006, the operation unit 2007, and the power supply unit 2008 are connected to each other via the bus line 2009.

The image sensor 2001 in the camera module 2002 takes in the incident light (image light) from the subject, converts the amount of the incident light imaged on the imaging surface into an electric signal in pixel units, and outputs it as a pixel signal. As the camera module 2002, the above-mentioned camera module 700 is adopted, and the image sensor 2001 corresponds to the above-mentioned light receiving element 705. When the configuration of the solid-state image sensor 1 is adopted as the image pickup unit of the image pickup device 2000, the camera module 2002 is replaced with the solid-state image sensor 1.

The display unit 2005 comprises a panel-type display device such as a liquid crystal panel or an organic EL (Electro Luminescence) panel, and displays a moving image or a still image captured by the image sensor 2001. The recording unit 2006 records a moving image or a still image captured by the image sensor 2001 on a recording medium such as a hard disk or a semiconductor memory.

The operation unit 2007 issues operation commands for various functions of the image pickup apparatus 2000 under the operation of the user. The power supply unit 2008 appropriately supplies various power sources serving as operating power sources for the DSP circuit 2003, the frame memory 2004, the display unit 2005, the recording unit 2006, and the operation unit 2007 to these supply targets.

As described above, by using the camera module 700 equipped with the laminated lens structure 702 that is positioned and joined (laminated) with high accuracy as the camera module 2002, it is possible to realize high image quality and miniaturization. .. Therefore, in the imaging device 2000 such as a video camera, a digital still camera, and a camera module for mobile devices such as mobile phones, it is possible to achieve both miniaturization of the semiconductor package and high image quality of the captured image.

<Example of using image sensor>
FIG. 36 is a diagram showing an example of using an image sensor using the solid-state image sensor 1 or the camera module 700 described above.

The image sensor using the solid-state image sensor 1 or the camera module 700 can be used in various cases for sensing light such as visible light, infrared light, ultraviolet light, and X-ray, as shown below. ..

・ Devices that take images for viewing, such as digital cameras and portable devices with camera functions. ・ For safe driving such as automatic stop and recognition of the driver's condition, in front of the car Devices used for traffic, such as in-vehicle sensors that photograph the rear, surroundings, and interior of vehicles, surveillance cameras that monitor traveling vehicles and roads, and distance measurement sensors that measure distance between vehicles, etc. Equipment used in home appliances such as TVs, refrigerators, and air conditioners to take pictures and operate the equipment according to the gestures ・ Endoscopes, devices that perform angiography by receiving infrared light, etc. Equipment used for medical and healthcare ・ Equipment used for security such as surveillance cameras for crime prevention and cameras for person authentication ・ Skin measuring instruments for taking pictures of the skin and taking pictures of the scalp Equipment used for beauty such as microscopes ・ Equipment used for sports such as action cameras and wearable cameras for sports applications ・ Camera etc. for monitoring the condition of fields and crops , Equipment used for agriculture

<15. Application example to internal information acquisition system>
The technology according to the present disclosure (the present technology) can be applied to various products as described above. For example, the technique according to the present disclosure may be applied to a patient's internal information acquisition system using a capsule endoscope.

FIG. 37 is a block diagram showing an example of a schematic configuration of a patient's internal information acquisition system using a capsule endoscope to which the technique according to the present disclosure (the present technique) can be applied.

The in-vivo information acquisition system 10001 includes a capsule-type endoscope 10100 and an external control device 10200.

The capsule endoscope 10100 is swallowed by the patient at the time of examination. The capsule endoscope 10100 has an imaging function and a wireless communication function, and moves inside an organ such as the stomach or intestine by peristaltic movement or the like until it is naturally excreted from the patient, and inside the organ. Images (hereinafter, also referred to as internal organ images) are sequentially imaged at predetermined intervals, and information about the internal organ images is sequentially wirelessly transmitted to an external control device 10200 outside the body.

The external control device 10200 comprehensively controls the operation of the internal information acquisition system 10001. Further, the external control device 10200 receives information about the internal image transmitted from the capsule endoscope 10100, and based on the information about the received internal image, the internal image is displayed on a display device (not shown). Generate image data to display.

In this way, the in-vivo information acquisition system 10001 can obtain an in-vivo image of the inside of the patient at any time from the time when the capsule-type endoscope 10100 is swallowed until it is excreted.

The configuration and function of the capsule endoscope 10100 and the external control device 10200 will be described in more detail.

The capsule endoscope 10100 has a capsule-shaped housing 10101, and the light source unit 10111, the imaging unit 10112, the image processing unit 10113, the wireless communication unit 10114, the power feeding unit 10115, and the power supply unit are contained in the housing 10101. The 10116 and the control unit 10117 are housed.

The light source unit 10111 is composed of, for example, a light source such as an LED (Light Emitting Diode), and irradiates the imaging field of view of the imaging unit 10112 with light.

The image pickup unit 10112 is composed of an image pickup element and an optical system including a plurality of lenses provided in front of the image pickup element. The reflected light (hereinafter referred to as observation light) of the light applied to the body tissue to be observed is collected by the optical system and incident on the image pickup element. In the image pickup unit 10112, the observation light incident on the image pickup device is photoelectrically converted, and an image signal corresponding to the observation light is generated. The image signal generated by the image capturing unit 10112 is provided to the image processing unit 10113.

The image processing unit 10113 is configured by a processor such as a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit), and performs various signal processing on the image signal generated by the imaging unit 10112. The image processing unit 10113 provides the signal-processed image signal to the wireless communication unit 10114 as RAW data.

The wireless communication unit 10114 performs predetermined processing such as modulation processing on the image signal that has been signal-processed by the image processing unit 10113, and transmits the image signal to the external control device 10200 via the antenna 10114A. Further, the wireless communication unit 10114 receives a control signal related to drive control of the capsule endoscope 10100 from the external control device 10200 via the antenna 10114A. The wireless communication unit 10114 provides the control unit 10117 with a control signal received from the external control device 10200.

The power feeding unit 10115 is composed of an antenna coil for receiving power, a power regeneration circuit that regenerates power from the current generated in the antenna coil, a booster circuit, and the like. In the power feeding unit 10115, electric power is generated using the principle of so-called non-contact charging.

The power supply unit 10116 is composed of a secondary battery and stores the electric power generated by the power supply unit 10115. In FIG. 37, in order to avoid complication of the drawing, the illustration of the arrow or the like indicating the power supply destination from the power supply unit 10116 is omitted, but the power stored in the power supply unit 10116 is the light source unit 10111. , Is supplied to the imaging unit 10112, the image processing unit 10113, the wireless communication unit 10114, and the control unit 10117, and can be used to drive these.

The control unit 10117 is composed of a processor such as a CPU, and is a control signal transmitted from the external control device 10200 to drive the light source unit 10111, the image pickup unit 10112, the image processing unit 10113, the wireless communication unit 10114, and the power supply unit 10115. Control as appropriate according to.

The external control device 10200 is composed of a processor such as a CPU and a GPU, or a microcomputer or a control board on which a processor and a storage element such as a memory are mixedly mounted. The external control device 10200 controls the operation of the capsule endoscope 10100 by transmitting a control signal to the control unit 10117 of the capsule endoscope 10100 via the antenna 10200A. In the capsule endoscope 10100, for example, a control signal from the external control device 10200 can change the light irradiation conditions for the observation target in the light source unit 10111. Further, the imaging conditions (for example, the frame rate in the imaging unit 10112, the exposure value, etc.) can be changed by the control signal from the external control device 10200. Further, the content of processing in the image processing unit 10113 and the conditions for transmitting the image signal by the wireless communication unit 10114 (for example, transmission interval, number of transmitted images, etc.) may be changed by the control signal from the external control device 10200. ..

Further, the external control device 10200 performs various image processing on the image signal transmitted from the capsule endoscope 10100, and generates image data for displaying the captured internal image on the display device. The image processing includes, for example, development processing (demosaic processing), high image quality processing (band enhancement processing, super-resolution processing, NR (Noise reduction) processing and / or camera shake correction processing, etc.), and / or enlargement processing ( Various signal processing such as electronic zoom processing) can be performed. The external control device 10200 controls the drive of the display device to display the captured internal image based on the generated image data. Alternatively, the external control device 10200 may have the generated image data recorded in a recording device (not shown) or printed out in a printing device (not shown).

The example of the in-vivo information acquisition system to which the technology according to the present disclosure can be applied has been described above. The technique according to the present disclosure can be applied to the imaging unit 10112 among the configurations described above. Specifically, the solid-state image sensor 1 or the camera module 700 can be applied as the image pickup unit 10112. By applying the technique according to the present disclosure to the imaging unit 10112, the capsule endoscope 10100 can be further miniaturized, so that the burden on the patient can be further reduced. In addition, since the capsule-type endoscope 10100 can be miniaturized and a clearer surgical site image can be obtained, the accuracy of the examination is improved.

<16. Application example to endoscopic surgery system>
The technique according to the present disclosure may be applied to, for example, an endoscopic surgery system.

FIG. 38 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technique according to the present disclosure can be applied.

FIG. 38 shows a surgeon (doctor) 11131 performing surgery on patient 11132 on patient bed 11133 using the endoscopic surgery system 11000. As shown, the endoscopic surgery system 11000 includes an endoscope 11100, other surgical tools 11110 such as an abdominal tube 11111 and an energy treatment tool 11112, and a support arm device 11120 that supports the endoscope 11100. , A cart 11200 equipped with various devices for endoscopic surgery.

The endoscope 11100 is composed of a lens barrel 11101 in which a region having a predetermined length from the tip is inserted into the body cavity of the patient 11132, and a camera head 11102 connected to the base end of the lens barrel 11101. In the illustrated example, the endoscope 11100 configured as a so-called rigid mirror having a rigid barrel 11101 is illustrated, but the endoscope 11100 may be configured as a so-called flexible mirror having a flexible barrel. good.

An opening in which an objective lens is fitted is provided at the tip of the lens barrel 11101. A light source device 11203 is connected to the endoscope 11100, and the light generated by the light source device 11203 is guided to the tip of the lens barrel by a light guide extending inside the lens barrel 11101, and is an objective. It is irradiated toward the observation target in the body cavity of the patient 11132 through the lens. The endoscope 11100 may be a direct endoscope, a perspective mirror, or a side endoscope.

An optical system and an image pickup element are provided inside the camera head 11102, and the reflected light (observation light) from the observation target is focused on the image pickup element by the optical system. The observation light is photoelectrically converted by the image sensor, and an electric signal corresponding to the observation light, that is, an image signal corresponding to the observation image is generated. The image signal is transmitted as RAW data to the camera control unit (CCU: Camera Control Unit) 11201.

The CCU11201 is composed of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and the like, and comprehensively controls the operations of the endoscope 11100 and the display device 11202. Further, the CCU 11201 receives an image signal from the camera head 11102, and performs various image processing on the image signal for displaying an image based on the image signal, such as development processing (demosaic processing).

The display device 11202 displays an image based on the image signal processed by the CCU 11201 under the control of the CCU 11201.

The light source device 11203 is composed of, for example, a light source such as an LED (Light Emitting Diode), and supplies irradiation light to the endoscope 11100 when photographing an operating part or the like.

The input device 11204 is an input interface to the endoscopic surgery system 11000. The user can input various information and input instructions to the endoscopic surgery system 11000 via the input device 11204. For example, the user inputs an instruction to change the imaging conditions (type of irradiation light, magnification, focal length, etc.) by the endoscope 11100.

The treatment tool control device 11205 controls the drive of the energy treatment tool 11112 for cauterizing, incising, sealing a blood vessel, or the like of a tissue. The pneumoperitoneum device 11206 uses a gas in the pneumoperitoneum tube 11111 to inflate the body cavity of the patient 11132 for the purpose of securing the field of view by the endoscope 11100 and securing the work space of the operator. To send. The recorder 11207 is a device capable of recording various information related to surgery. The printer 11208 is a device capable of printing various information related to surgery in various formats such as texts, images, and graphs.

The light source device 11203 that supplies the irradiation light to the endoscope 11100 when photographing the surgical site can be composed of, for example, an LED, a laser light source, or a white light source composed of a combination thereof. When a white light source is configured by combining RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high accuracy. Therefore, the light source device 11203 adjusts the white balance of the captured image. It can be carried out. Further, in this case, the laser light from each of the RGB laser light sources is irradiated to the observation target in a time-divided manner, and the drive of the image sensor of the camera head 11102 is controlled in synchronization with the irradiation timing to support each of RGB. It is also possible to capture the image in a time-divided manner. According to this method, a color image can be obtained without providing a color filter on the image sensor.

Further, the drive of the light source device 11203 may be controlled so as to change the intensity of the output light at predetermined time intervals. By controlling the drive of the image sensor of the camera head 11102 in synchronization with the timing of changing the light intensity to acquire an image in a time-divided manner and synthesizing the image, so-called high dynamic without blackout and overexposure. Range images can be generated.

Further, the light source device 11203 may be configured to be able to supply light in a predetermined wavelength band corresponding to special light observation. In special light observation, for example, by utilizing the wavelength dependence of light absorption in body tissue to irradiate light in a narrow band as compared with the irradiation light (that is, white light) in normal observation, the surface layer of the mucous membrane. A so-called narrow band imaging (Narrow Band Imaging) is performed in which a predetermined tissue such as a blood vessel is photographed with high contrast. Alternatively, in the special light observation, fluorescence observation may be performed in which an image is obtained by fluorescence generated by irradiating with excitation light. In fluorescence observation, the body tissue is irradiated with excitation light to observe the fluorescence from the body tissue (autofluorescence observation), or a reagent such as indocyanine green (ICG) is locally injected into the body tissue and the body tissue is injected. It is possible to obtain a fluorescence image by irradiating excitation light corresponding to the fluorescence wavelength of the reagent. The light source device 11203 may be configured to be capable of supplying narrow band light and / or excitation light corresponding to such special light observation.

FIG. 39 is a block diagram showing an example of the functional configuration of the camera head 11102 and CCU11201 shown in FIG. 38.

The camera head 11102 includes a lens unit 11401, an imaging unit 11402, a driving unit 11403, a communication unit 11404, and a camera head control unit 11405. CCU11201 has a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and CCU11201 are communicably connected to each other by a transmission cable 11400.

The lens unit 11401 is an optical system provided at a connection portion with the lens barrel 11101. The observation light taken in from the tip of the lens barrel 11101 is guided to the camera head 11102 and incident on the lens unit 11401. The lens unit 11401 is configured by combining a plurality of lenses including a zoom lens and a focus lens.

The image pickup unit 11402 is composed of an image pickup element. The image sensor constituting the image pickup unit 11402 may be one (so-called single plate type) or a plurality (so-called multi-plate type). When the image pickup unit 11402 is composed of a multi-plate type, for example, each image pickup element may generate an image signal corresponding to each of RGB, and a color image may be obtained by synthesizing them. Alternatively, the image pickup unit 11402 may be configured to have a pair of image pickup elements for acquiring image signals for the right eye and the left eye corresponding to 3D (Dimensional) display, respectively. The 3D display enables the operator 11131 to more accurately grasp the depth of the biological tissue in the surgical site. When the image pickup unit 11402 is composed of a multi-plate type, a plurality of lens units 11401 may be provided corresponding to each image pickup element.

Further, the imaging unit 11402 does not necessarily have to be provided on the camera head 11102. For example, the imaging unit 11402 may be provided inside the lens barrel 11101 immediately after the objective lens.

The drive unit 11403 is composed of an actuator, and moves the zoom lens and the focus lens of the lens unit 11401 by a predetermined distance along the optical axis under the control of the camera head control unit 11405. As a result, the magnification and focus of the image captured by the imaging unit 11402 can be adjusted as appropriate.

The communication unit 11404 is configured by a communication device for transmitting and receiving various types of information to and from the CCU11201. The communication unit 11404 transmits the image signal obtained from the image pickup unit 11402 as RAW data to the CCU 11201 via the transmission cable 11400.

Further, the communication unit 11404 receives a control signal for controlling the drive of the camera head 11102 from the CCU 11201 and supplies the control signal to the camera head control unit 11405. The control signal includes, for example, information to specify the frame rate of the captured image, information to specify the exposure value at the time of imaging, and / or information to specify the magnification and focus of the captured image, and the like. Contains information about the condition.

The imaging conditions such as the frame rate, exposure value, magnification, and focus may be appropriately specified by the user, or may be automatically set by the control unit 11413 of CCU11201 based on the acquired image signal. good. In the latter case, the endoscope 11100 is equipped with a so-called AE (Auto Exposure) function, an AF (Auto Focus) function, and an AWB (Auto White Balance) function.

The camera head control unit 11405 controls the drive of the camera head 11102 based on the control signal from the CCU 11201 received via the communication unit 11404.

The communication unit 11411 is composed of a communication device for transmitting and receiving various information to and from the camera head 11102. The communication unit 11411 receives an image signal transmitted from the camera head 11102 via the transmission cable 11400.

Further, the communication unit 11411 transmits a control signal for controlling the drive of the camera head 11102 to the camera head 11102. Image signals and control signals can be transmitted by telecommunications, optical communication, or the like.

The image processing unit 11412 performs various image processing on the image signal which is the RAW data transmitted from the camera head 11102.

The control unit 11413 performs various controls related to the imaging of the surgical site and the like by the endoscope 11100 and the display of the captured image obtained by the imaging of the surgical site and the like. For example, the control unit 11413 generates a control signal for controlling the drive of the camera head 11102.

Further, the control unit 11413 causes the display device 11202 to display the captured image in which the surgical unit or the like is reflected, based on the image signal that has been image-processed by the image processing unit 11412. At this time, the control unit 11413 may recognize various objects in the captured image by using various image recognition techniques. For example, the control unit 11413 detects the shape, color, and the like of the edge of an object included in the captured image to remove surgical tools such as forceps, a specific biological part, bleeding, and mist when using the energy treatment tool 11112. Can be recognized. When displaying the captured image on the display device 11202, the control unit 11413 may superimpose and display various surgical support information on the image of the surgical unit by using the recognition result. By superimposing and displaying the surgical support information and presenting it to the surgeon 11131, it is possible to reduce the burden on the surgeon 11131 and to allow the surgeon 11131 to proceed with the surgery reliably.

The transmission cable 11400 connecting the camera head 11102 and CCU11201 is an electric signal cable corresponding to electric signal communication, an optical fiber corresponding to optical communication, or a composite cable thereof.

Here, in the illustrated example, the communication is performed by wire using the transmission cable 11400, but the communication between the camera head 11102 and the CCU11201 may be performed wirelessly.

The above is an example of an endoscopic surgery system to which the technique according to the present disclosure can be applied. The technique according to the present disclosure can be applied to the imaging unit 11402 of the camera head 11102 in the configuration described above. Specifically, the solid-state image sensor 1 or the camera module 700 can be applied as the image pickup unit 11402. By applying the technique according to the present disclosure to the imaging unit 11402, it is possible to obtain a clearer surgical site image while reducing the size of the camera head 11102.

Although the endoscopic surgery system has been described here as an example, the technique according to the present disclosure may be applied to other, for example, a microscopic surgery system.

<17. Application example to mobile>
Further, the technology according to the present disclosure can be used as a device mounted on a moving body of any kind such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, a personal mobility, an airplane, a drone, a ship, and a robot. It may be realized.

FIG. 40 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile control system to which the technique according to the present disclosure can be applied.

The vehicle control system 12000 includes a plurality of electronic control units connected via the communication network 12001. In the example shown in FIG. 40, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside information detection unit 12030, an in-vehicle information detection unit 12040, and an integrated control unit 12050. Further, as a functional configuration of the integrated control unit 12050, a microcomputer 12051, an audio image output unit 12052, and an in-vehicle network I / F (interface) 12053 are shown.

The drive system control unit 12010 controls the operation of the device related to the drive system of the vehicle according to various programs. For example, the drive system control unit 12010 provides a driving force generator for generating the driving force of the vehicle such as an internal combustion engine or a driving motor, a driving force transmission mechanism for transmitting the driving force to the wheels, and a steering angle of the vehicle. It functions as a control device such as a steering mechanism for adjusting and a braking device for generating a braking force of a vehicle.

The body system control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a keyless entry system, a smart key system, a power window device, or a control device for various lamps such as a head lamp, a back lamp, a brake lamp, a winker, or a fog lamp. In this case, the body system control unit 12020 may be input with radio waves transmitted from a portable device that substitutes for the key or signals of various switches. The body system control unit 12020 receives inputs of these radio waves or signals and controls a vehicle door lock device, a power window device, a lamp, and the like.

The vehicle exterior information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, the imaging unit 12031 is connected to the vehicle exterior information detection unit 12030. The vehicle outside information detection unit 12030 causes the image pickup unit 12031 to capture an image of the outside of the vehicle and receives the captured image. The vehicle exterior information detection unit 12030 may perform object detection processing or distance detection processing such as a person, a vehicle, an obstacle, a sign, or a character on the road surface based on the received image.

The imaging unit 12031 is an optical sensor that receives light and outputs an electric signal according to the amount of the light received. The image pickup unit 12031 can output an electric signal as an image or can output it as distance measurement information. Further, the light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

The in-vehicle information detection unit 12040 detects in-vehicle information. For example, a driver state detection unit 12041 that detects the driver's state is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that images the driver, and the in-vehicle information detection unit 12040 determines the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041. It may be calculated, or it may be determined whether the driver is dozing.

The microcomputer 12051 calculates the control target value of the driving force generator, the steering mechanism, or the braking device based on the information inside and outside the vehicle acquired by the outside information detection unit 12030 or the inside information detection unit 12040, and the drive system control unit. A control command can be output to 12010. For example, the microcomputer 12051 realizes ADAS (Advanced Driver Assistance System) functions including vehicle collision avoidance or impact mitigation, follow-up driving based on inter-vehicle distance, vehicle speed maintenance driving, vehicle collision warning, vehicle lane deviation warning, and the like. It is possible to perform cooperative control for the purpose of.

Further, the microcomputer 12051 controls the driving force generator, the steering mechanism, the braking device, and the like based on the information around the vehicle acquired by the vehicle exterior information detection unit 12030 or the vehicle interior information detection unit 12040, so that the driver can control the vehicle. It is possible to perform coordinated control for the purpose of automatic driving, etc., which runs autonomously without depending on the operation.

Further, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information outside the vehicle acquired by the vehicle exterior information detection unit 12030. For example, the microcomputer 12051 controls the headlamps according to the position of the preceding vehicle or the oncoming vehicle detected by the external information detection unit 12030, and performs coordinated control for the purpose of anti-glare such as switching the high beam to the low beam. It can be carried out.

The audio-image output unit 12052 transmits an output signal of at least one of audio and an image to an output device capable of visually or audibly notifying information to the passenger or the outside of the vehicle. In the example of FIG. 40, an audio speaker 12061, a display unit 12062, and an instrument panel 12063 are exemplified as output devices. The display unit 12062 may include, for example, at least one of an onboard display and a heads-up display.

FIG. 41 is a diagram showing an example of the installation position of the imaging unit 12031.

In FIG. 41, the vehicle 12100 has image pickup units 12101, 12102, 12103, 12104, 12105 as the image pickup unit 12031.

The imaging units 12101, 12102, 12103, 12104, 12105 are provided at positions such as, for example, the front nose, side mirrors, rear bumpers, back doors, and the upper part of the windshield in the vehicle interior of the vehicle 12100. The image pickup unit 12101 provided on the front nose and the image pickup section 12105 provided on the upper part of the windshield in the vehicle interior mainly acquire an image in front of the vehicle 12100. The imaging units 12102 and 12103 provided in the side mirrors mainly acquire images of the side of the vehicle 12100. The imaging unit 12104 provided on the rear bumper or the back door mainly acquires an image of the rear of the vehicle 12100. The images in front acquired by the imaging units 12101 and 12105 are mainly used for detecting a preceding vehicle or a pedestrian, an obstacle, a traffic light, a traffic sign, a lane, or the like.

Note that FIG. 41 shows an example of the photographing range of the imaging units 12101 to 12104. The imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, the imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and the imaging range 12114 indicates the imaging range of the imaging units 12102 and 12103. The imaging range of the imaging unit 12104 provided on the rear bumper or the back door is shown. For example, by superimposing the image data captured by the imaging units 12101 to 12104, a bird's-eye view image of the vehicle 12100 as viewed from above can be obtained.

At least one of the imaging units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the image pickup units 12101 to 12104 may be a stereo camera composed of a plurality of image pickup elements, or an image pickup element having pixels for phase difference detection.

For example, the microcomputer 12051 has a distance to each three-dimensional object within the imaging range 12111 to 12114 based on the distance information obtained from the imaging units 12101 to 12104, and a temporal change of this distance (relative velocity with respect to the vehicle 12100). By obtaining can. Further, the microcomputer 12051 can set an inter-vehicle distance to be secured in front of the preceding vehicle in advance, and can perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), and the like. In this way, it is possible to perform coordinated control for the purpose of automatic driving or the like in which the vehicle travels autonomously without depending on the operation of the driver.

For example, the microcomputer 12051 converts three-dimensional object data related to a three-dimensional object into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, electric poles, and other three-dimensional objects based on the distance information obtained from the imaging units 12101 to 12104. It can be classified and extracted and used for automatic avoidance of obstacles. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that can be seen by the driver of the vehicle 12100 and obstacles that are difficult to see. Then, the microcomputer 12051 determines the collision risk indicating the risk of collision with each obstacle, and when the collision risk is equal to or higher than the set value and there is a possibility of collision, the microcomputer 12051 is used via the audio speaker 12061 or the display unit 12062. By outputting an alarm to the driver and performing forced deceleration and avoidance steering via the drive system control unit 12010, driving support for collision avoidance can be provided.

At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether or not a pedestrian is present in the captured image of the imaging units 12101 to 12104. Such pedestrian recognition includes, for example, a procedure for extracting feature points in an image captured by an imaging unit 12101 to 12104 as an infrared camera, and a pattern matching process for a series of feature points indicating the outline of an object to determine whether or not the pedestrian is a pedestrian. It is done by the procedure to determine. When the microcomputer 12051 determines that a pedestrian is present in the captured images of the imaging units 12101 to 12104 and recognizes the pedestrian, the audio image output unit 12052 outputs a square contour line for emphasizing the recognized pedestrian. The display unit 12062 is controlled so as to superimpose and display. Further, the audio image output unit 12052 may control the display unit 12062 so as to display an icon or the like indicating a pedestrian at a desired position.

The example of the vehicle control system to which the technique according to the present disclosure can be applied has been described above. The technique according to the present disclosure can be applied to the imaging unit 12031 among the configurations described above. Specifically, the solid-state image sensor 1 or the camera module 700 can be applied as the image pickup unit 12031. By applying the technique according to the present disclosure to the imaging unit 12031, it is possible to obtain a photographed image that is easier to see and to acquire distance information while reducing the size. Further, by using the obtained captured image and distance information, it is possible to reduce the fatigue of the driver and improve the safety level of the driver and the vehicle.

Further, this technique is applicable not only to a solid-state image sensor but also to all semiconductor devices having other semiconductor integrated circuits.

The embodiment of the present technology is not limited to the above-described embodiment, and various changes can be made without departing from the gist of the present technology.

For example, a form in which all or a part of the plurality of embodiments described above can be combined can be adopted.

It should be noted that the effects described in the present specification are merely examples and are not limited, and effects other than those described in the present specification may be obtained.

The present technology can also have the following configurations.
(1)
It is provided with an abutting portion that abuts against the substrate when molding the resin material on the substrate into a predetermined shape.
A mold having a structure in which a space for allowing the resin material to flow in and out is formed in a state where the abutting portion is abutted against the substrate.
(2)
The mold according to (1) above, which comprises three or more columnar bodies as the abutting portion.
(3)
The mold according to (1) or (2) above, wherein the abutting portion is arranged inside the outer peripheral portion in a plan view.
(4)
The mold according to any one of (1) to (3) above, wherein the columnar body has a cylindrical shape or a polygonal shape.
(5)
The mold according to any one of (1) to (3) above, wherein the columnar body has a conical shape or a polygonal pyramid shape.
(6)
The mold according to any one of (1) to (5) above, wherein the shape of the tip of the abutting portion in contact with the substrate is a substantially spherical shape.
(7)
The mold according to any one of (1) to (5) above, wherein the shape of the tip of the abutting portion in contact with the substrate is a pyramid shape or a conical shape.
(8)
The mold according to any one of (1) to (4) above, wherein the abutting portion is configured to come into contact with the substrate on a surface.
(9)
The mold according to any one of (1) to (7) above, wherein the abutting portion is configured to come into contact with the substrate at a point.
(10)
The mold according to any one of (1) to (9) above, wherein a light-shielding film is formed in a part of the region.
(11)
A step of pressing a mold against a resin material on a substrate, transferring the shape of the mold to the resin material, and forming a lens resin portion is provided.
The mold includes an abutting portion that abuts against the substrate when the resin material on the substrate is molded into a predetermined shape.
A method for manufacturing a semiconductor device, which has a configuration in which a space for allowing the resin material to flow in and out is formed in a state where the abutting portion is abutted against the substrate.
(12)
The method for manufacturing a semiconductor device according to (11), wherein the substrate on which the lens resin portion is formed is attached to a semiconductor substrate on which pixels for converting incident light into an electric signal are formed.
(13)
A resin material is dropped onto the substrate bonded to a semiconductor substrate on which pixels for converting incident light into an electric signal are formed, and the mold is pressed to transfer the shape of the mold to the resin material. The method for manufacturing a semiconductor device according to (11) above, wherein the lens resin portion is formed.

1 Solid-state imaging device, 11 1st structure (upper structure), 12 2nd structure (lower structure), 13 Laminated structure, 14 External terminals, 18 Protective substrate, 19 Lens resin part, 31 pixels, 502 Lens material, 503 mold, 511 abutting part, 512 shading film, 540 mold, 541 abutting part, 700 camera module, 701 lens substrate, 702 laminated lens structure, 703 optical unit, 705 light receiving element, 722 lens Resin part, 723 through hole, 921 mold substrate, 922 mold, 941 mold substrate, 942 mold, 2000 image pickup device, 2001 image sensor, 2002 camera module

Claims (9)

A lens portion having a predetermined uneven shape surface and
An abutting portion that is arranged outside the lens portion in a plan view and has a height different from that of the predetermined concave-convex shape surface of the lens portion.
With a guide unit that has a tapered side surface and controls the position in the plane direction in contact with the inclined surface of the substrate.
With
The abutting portion is abutted against the substrate when molding the resin material on the substrate to the predetermined concave-convex shape,
A mold having a structure in which a gap for allowing the resin material to flow in and out is formed outside the space between the lens portion and the substrate in a state where the abutting portion is abutted against the substrate. The mold according to claim 1, wherein the guide portion is arranged between the lens portion and the abutting portion in a plan view. The mold according to claim 1, wherein the abutting portion is arranged on the outer peripheral portion of the mold in a plan view. The mold according to claim 1, wherein the abutting portion is abutted against the substrate at a position higher than the lens portion. The mold according to claim 1, wherein the abutting portion is configured to be in surface contact with the substrate. The mold according to claim 1, wherein a light-shielding film is formed on the outside of the lens portion in a plan view. A step of pressing a mold against a resin material on a substrate and transferring the uneven shape of the mold to the resin material to form a lens resin portion is provided.
The mold is
A lens portion having a predetermined uneven shape surface and
An abutting portion that is arranged outside the lens portion in a plan view and has a height different from that of the predetermined concave-convex shape surface of the lens portion.
A guide portion having a tapered side surface and contacting the inclined surface of the substrate to control the position in the plane direction.
With
The abutting portion, said abutting against the substrate when molding the resin material on the substrate to the predetermined concave-convex shape,
Wherein in a state where the abutting portion is abutted on the substrate, a method of manufacturing a semiconductor device is a structure where gaps are formed in which the to and out of the resin material flow outward from the space between the substrate and the lens unit. The method for manufacturing a semiconductor device according to claim 7 , wherein the substrate on which the lens resin portion is formed is attached to a semiconductor substrate on which pixels for converting incident light into an electric signal are formed. Was added dropwise to the resin material on the substrate that is bonded to the semiconductor substrate in which the pixels are formed to convert the incident light into an electric signal, is pressed against the mold, the mold shape the resin material The method for manufacturing a semiconductor device according to claim 7 , wherein the lens resin portion is formed by transfer.

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