JP6932060B2 - Elastic wiring board, manufacturing method of elastic wiring board and elastic wiring board with electronic parts - Google Patents

Description

The present invention relates to a stretchable wiring board, a method for manufacturing a stretchable wiring board, and a stretchable wiring board with electronic components.

In recent years, there has been increasing interest in biosensors and biometric information monitors in the wearable device and medical device markets. For example, in the sports industry, in order to further improve the physical ability and skill of athletes, attempts are being made to quantify physical movements with high accuracy. In such a case, a wearable biosensor that detects the movement of the living body may be applied. In the medical industry, attempts are being made to detect vital signs (biological information) such as electrocardiogram, heart rate, blood pressure, and body temperature for the treatment of diseases and measures against pre-illness. Information monitors may be applied.
Such biosensors are described in, for example, Patent Document 1, Patent Document 2, and Patent Document 3. All of the biosensors described in Patent Documents 1 to 3 can be attached to a living body and have elasticity to follow the movement of the living body and the shape of the attached surface. Further, in the configurations described in Patent Document 1, Patent Document 2 and Patent Document 3, external devices such as a power supply and a control board having a large mass and high rigidity are elastic wiring boards so as not to hinder the movement of the target part of the living body. It is connected externally without being mounted on the.

Japanese Unexamined Patent Publication No. 2016-219543 JP-A-2017-34083 JP-A-2017-69530

However, when the elastic wiring board and the external device are connected by wire or wirelessly, the action range and movement of the living body to which the biosensor is attached are limited by the length of the cable, the reliability of the connection, the range of transmission and reception of wireless signals, and the like. There is a drawback that In recent years, electronic devices have become significantly smaller and lighter, and many of them do not hinder the movement of living organisms even when mounted together with an elastic wiring board. For this reason, a configuration in which an electronic device that processes an electric signal detected by the stretchable wiring board is mounted on the stretchable wiring board is being studied.

From the viewpoint of hygiene, it is preferable that at least the part of the elastic wiring board to be attached to the living body is disposable. On the other hand, an electronic device that processes an electric signal does not necessarily come into contact with a living body, and it is not preferable to make it a disposable specification from the viewpoint of cost. For this reason, the user of the biosensor needs to connect the electronic device to the elastic wiring board and then attach the biosensor to himself or another living body.
When the stretchable wiring board described in Patent Document 1, Patent Document 2 and Patent Document 3 is applied to such a biosensor, the electronic device is fixed on the stretchable wiring board by using an adhesive or an adhesive tape. After that, the elastic wiring board is peeled off from the mount and attached to the living body. At this time, since the elastic substrate of the elastic wiring board is a resin film having a tack property in addition to being extremely thin, the elastic substrate is wrinkled or a part of the elastic substrate is stuck to another part. It may become unusable.

Further, when the electronic device is mounted on the stretchable wiring board, the weight of the stretchable wiring board becomes heavier than the configuration in which the stretchable wiring board and the electronic device are used separately, and the stretchable wiring board is easily peeled off from the surface to be attached. It is expected to be. As a result, on the stretchable wiring board on which the electronic device is mounted, a layer of an adhesive or an adhesive is formed on the back surface of the stretchable wiring board, and the stretchable wiring board is attached to the surface to be attached by the adhesive or the like. Is preferable. However, as described above, since the stretchable substrate is a very thin resin film, it is attached to the mount and handled from the manufacturing process of the stretchable wiring board to just before use. It is extremely difficult to form an adhesive or the like between such an elastic substrate and a mount.
The present invention has been made in view of these points, and prevents the elastic substrate from extending in an unintended direction, wrinkling, or sticking during handling of the elastic wiring board, and is an electronic device. The present invention relates to an elastic wiring board that can be easily connected to a surface to be attached, a method for manufacturing an elastic wiring board, and an elastic wiring board with electronic components.

The elastic wiring board of the present invention is provided between the elastic substrate on which the elastic wiring is formed, the elastic cover provided on the elastic substrate, and the elastic substrate and the elastic cover. A part of the stretchable substrate including the first pressure-sensitive adhesive layer has a defect portion, and at least a part of the first pressure-sensitive adhesive layer is exposed from the stretchable substrate through the defect portion.

In the method for manufacturing an elastic wiring board of the present invention, an elastic substrate having elastic wiring formed on one main surface and a first release member provided on the other main surface is first adhered to one main surface. An elastic cover provided with a second release member covering the agent layer and the first pressure-sensitive adhesive layer, and a third release member covering the second pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer on the other main surface. The second release member is peeled from the first pressure-sensitive adhesive layer, and the first pressure-sensitive adhesive layer is attached to the one main surface of the stretchable substrate.
A method for manufacturing an elastic wiring board in which the third release member is peeled off from the second pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer is attached to a surface to be attached.
The adhesion strength between the second pressure-sensitive adhesive layer and the third release member is A, the adhesion strength between the first pressure-sensitive adhesive layer and the second release member is B, and the elastic substrate and the first release member. When the adhesion strength is C, the relationship of A> B and A> C is established.

The elastic wiring board with electronic components of the present invention includes an elastic substrate in which elastic wiring is formed on at least one main surface, an elastic cover provided on the main surface side of the elastic substrate, and the above. A first pressure-sensitive adhesive layer provided between the stretchable substrate and the stretchable cover is included, a part of the stretchable substrate has a defect portion, and at least a part of the first pressure-sensitive adhesive layer is provided. Includes an elastic wiring board that is exposed from the stretchable substrate through the defect and an electronic component that is adhered to at least a part of the first pressure-sensitive adhesive layer that is exposed from the stretchable substrate through the defect.

An elastic wiring board that prevents the elastic substrate from extending in an unintended direction, wrinkling, or sticking while handling the elastic wiring board, and can be easily connected to electronic devices and the surface to be attached. It is possible to provide a method for manufacturing an elastic wiring board and an elastic wiring board with electronic components.

It is a perspective view for demonstrating the elastic wiring board with an electronic component of one Embodiment of this invention. (A) is a top view of the microcomputer shown in FIG. (B) is an end view of the microcomputer shown in (a). (A) is a top view of the stretchable wiring board shown in FIG. (B) is an end view of the stretchable wiring board shown in (a). (A) is a top view of the stretchable substrate of this embodiment. (B) is an end view of the stretchable substrate. (A) is a top view of the film base of this embodiment. (B) is an end view of the film base shown in (a). (A) is a top view of the elastic cover of this embodiment. (B) is an end view of the elastic cover. (A) is a top view of the stretchable substrate bonded to the film base of the present embodiment. (B) is an end view of the configuration shown in (a). (A) is a top view of the configuration in which the elastic substrate of the present embodiment is bonded to the elastic cover. (B) is an end view of the configuration shown in (a). It is a figure for demonstrating that the 1st release member is peeled off from the 1st pressure-sensitive adhesive layer of this embodiment. (A) is a diagram showing a state in which a microcomputer is attached to an elastic wiring board. (B) shows a state in which an external terminal of the film base is inserted into the terminal of the microcomputer and an electrical connection is made. (A) is a figure which shows the state which the 3rd release member of this embodiment was peeled off. (B) is a diagram showing a state in which the elastic wiring board with electronic components of the present embodiment is attached to the surface to be attached. It is a figure for demonstrating the modification 1 of this invention. It is a figure for demonstrating the modification 2 of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all drawings, similar components are designated by the same reference numerals, and duplicate description will be omitted as appropriate. Further, the drawings used for explaining the present embodiment include schematic drawings for explaining the configuration of the present embodiment, and also include drawings that do not accurately represent the thickness, length, width, and the like. Further, as a matter of course, the present embodiment is not limited to the illustrated shape, design and specifications.

[Overview]
The stretchable wiring board and the stretchable wiring board with electronic components of the present embodiment are attached to an observation target, and the activity of the target can be observed or a signal is sent to the target by sending and receiving an electric signal to and from the target. It is used for sending and so on. The objects to be observed include, for example, humans, animals and plants (living bodies), and the like. When the observation target is an animal (including a human), the elastic wiring board detects the myoelectric potential and biological reaction of the animal. When the observation target is a plant, an electrical stimulus is given to the target through the elastic wiring board, and an electric signal output in response to this is detected.
Further, the stretchable wiring board of the present embodiment, which is attached to an object and used, is a thin sheet-like member having a main surface in order to detect a weak signal with high accuracy. As used herein, the term "plane" does not have to be a geometrically perfect plane, but it is permissible to have recesses or protrusions. The "main surface" is a surface having a clearly larger area than the other surfaces, and the area and number thereof are not limited. Further, the term "film" as used herein broadly includes a generally thin shape such as a sheet or a film-like material. That is, the size of the individual thickness is not specified by the difference in the title of the sheet, film, film-like material, or the like.

Hereinafter, the elastic wiring board of the present embodiment and the elastic wiring board with electronic components using the same will be described by an example of attaching the stretchable wiring board to a living body (human body) and observing the myoelectric potential. The part of the living body to which the elastic wiring board is attached is not particularly limited, but in the present embodiment, for example, the elastic wiring board is attached to the upper arm, the thigh, the back of the hand and the arm where the movement of the fingers can be observed, and the like. Shall be.

FIG. 1 is a perspective view for explaining the elastic wiring board 1 with electronic components of the present embodiment. FIG. 2A is a top view of the microcomputer 3 shown in FIG. FIG. 2B is an end view of the end face of the microcomputer 3 shown in FIG. 2A as viewed in the direction of arrow lines I.I. The elastic wiring board 1 with electronic components includes a microcomputer (hereinafter referred to as “microcomputer”) 3 such as a one-chip microcomputer incorporating an electronic component 35, and an elastic wiring board 5 that adheres to the microcomputer 3. .. The electronic component 35 built in the microcomputer 3 is, for example, a circuit in which semiconductor elements such as a CPU (Central Processing Unit) and a memory are integrated in one LSI chip. The microcomputer 3 includes a sealing member 33 that seals the electronic component 35 and the electronic component 35. The sealing member 33 shown in FIG. 1 has a substantially rectangular parallelepiped shape having main surfaces 33a and 33b. Further, the sealing member 33 is provided with a terminal 31 that can be electrically connected to the electronic component 35.

The microcomputer 3 of the present embodiment is configured as an LSI substrate that measures a relatively small electric signal obtained from a surface to be attached such as a living body surface. Such a microcomputer 3 may have a function of detecting a biological signal, a function of amplifying the detected signal, a function of wirelessly transmitting the detected signal, and a power source. Further, in the present embodiment, for example, the battery in the sealing member 33 may be charged from a power source (not shown) via the terminal 31.
In the present embodiment, the elastic wiring board 5 is disposable and the microcomputer 3 is used a plurality of times. The microcomputer 3 is fixed to the elastic wiring board 5 each time the elastic wiring board 5 is used, and is removed from the elastic wiring board 5 each time the use is completed.

The elastic wiring board 5 includes an elastic substrate 51 in which the elastic wiring 52 is formed on at least one main surface 51b, and an elastic cover (FIG. 3) provided on the side of the main surface 51b of the elastic substrate 51. Includes a first pressure-sensitive adhesive layer (FIG. 3) provided between the stretchable substrate 51 and the stretchable cover. The stretchable substrate 51 has openings 55a, 55b, 55c, 55d which are defects in a part thereof. At least a portion of the first pressure-sensitive adhesive layer is exposed from the stretchable substrate 51 through the openings 55a, 55b, 55c, 55d. The microcomputer 3 is fixed to the stretchable wiring board 5 by the first adhesive layer exposed from the stretchable substrate 51 through the openings 55a, 55b, 55c, 55d.

In FIG. 1, the portions of the first pressure-sensitive adhesive layer exposed from the elastic substrate 51 through the openings 55a, 55b, 55c, 55d are shown as pressure-sensitive adhesive layer portions 56a, 56b, 56c, 56d, respectively.
Here, "the first adhesive layer is exposed from the elastic substrate through the opening" is not limited to the fact that the first adhesive layer is exposed on the outermost surface of the elastic wiring board 5. It suffices if the first pressure-sensitive adhesive layer is exposed from the elastic substrate 51. That is, the first pressure-sensitive adhesive layer of the present embodiment may face the openings 55a, 55b, 55c, 55d of the elastic substrate 51, and other members may be placed on the pressure-sensitive adhesive layer portions 56a, 56b, 56c, 56d. (For example, the protective film shown in FIG. 8) may be provided. In other words, the stretchable substrate 51 has a region that overlaps the first pressure-sensitive adhesive layer and a portion that does not exist on the first pressure-sensitive adhesive layer.

Further, in the elastic wiring board 1 with electronic components shown in FIG. 1, the microcomputer 3 is exposed from the elastic substrate 51 through the openings 55a, 55b, 55c, 55d on the adhesive layer portions 56a, 56b, 56c, 56d. Adhesive is adhered to at least a part of the pressure-sensitive adhesive layer portions 56a, 56b, 56c and 56d. Since the microcomputer 3 is attached to the living body by the stretchable wiring board 5, in the present embodiment, the microcomputer 3 is relatively "above" the stretchable wiring board 5 in the stretchable wiring board 1 with electronic components. The following description will be given assuming that it is "above". Further, the elastic wiring board 5 will be described below assuming that it is relatively "below" or "below" the microcomputer 3.
Such a vertical relationship refers to the relative relationship between the microcomputer 3 and the elastic wiring board 5, and is irrelevant to the direction of gravity.

A film base 59 is attached to the elastic substrate 51. An external terminal 58 that can be electrically connected to another device is formed at the end of the film base 59. In the present embodiment, the external terminal 58 is pulled upward and electrically connected to the terminal 31 of the microcomputer 3 on the elastic wiring board 5. In the elastic wiring board 1 with electronic components of the present embodiment, the external terminal 58 and the elastic wiring 52 are electrically connected, and the electrodes 54a, 54b, 54c, 54d are electrically connected to the elastic wiring 52. ing. The electrodes 54a, 54b, 54c, 54d are in close contact with the surface of the living body, and electrical signals such as myoelectric potential are input to the electrodes 54a, 54b, 54c, 54d. The input electric signal reaches the external terminal 58 via the elastic wiring 52.

As described above, in the present embodiment, the electric signals input to the electrodes 54a, 54b, 54c, 54d are input to the microcomputer 3 via the elastic wiring 52 and the external terminal 58, and are processed by the microcomputer 3.
The processing of the electric signal in the microcomputer 3 may be, for example, noise removal, amplification, and filtering processing of the electric signal. Further, it may be a process of outputting a detection signal to the outside according to the value of the electric signal, or a process of recording the value of the input electric signal.
Hereinafter, the configurations of the elastic wiring board 5 and the microcomputer 3 will be described in order.

[Elastic wiring board]
3 (a) is a top view of the elastic wiring board 5 shown in FIG. 1, and FIG. 3 (b) shows the end faces of the elastic wiring board 5 shown in FIG. 3 (a) as arrows II-II. It is an end view seen in the direction. As described above, the elastic wiring board 5 of the present embodiment includes the elastic substrate 51 on which the elastic wiring 52 is formed, the elastic cover 6 provided on the elastic substrate 51, and the elastic substrate 51. It includes a first pressure-sensitive adhesive layer 71 provided between the sex cover 6 and the sex cover 6.
In the present embodiment, the stretchable wiring 52 is formed on the main surface 51b of the stretchable substrate 51, and the stretchable cover 6 is provided on the side of the main surface 51b. However, the present embodiment is not limited to forming the elastic wiring 52 and the elastic cover 6 on the same surface. For example, when the stretchable wiring board 5 is provided with the stretchable boards 51 in multiple layers, the stretchable wiring 52 and the stretchable cover 6 may be on different surfaces and are superposed on each other.

Further, the stretchable wiring board 5 has openings 55a, 55b, 55c, 55d due to a partial loss thereof. At least a portion of the first pressure-sensitive adhesive layer 71 is exposed from the stretchable substrate 51 through the openings 55a, 55b, 55c, 55d.
The "upper surface" in FIG. 3A refers to the surface of the stretchable wiring board 5 viewed from above when the stretchable wiring board 5 is used. That is, the upper surface of the elastic wiring board 5 of the present embodiment is the main surface 51a of the elastic substrate 51 shown in FIG. 3B, and the main surface 51a is the elastic wiring 52 and the electrodes 54a, 54b, 54c, 54d. Is formed on the back surface of the main surface 51b.

Further, the openings 55a, 55b, 55c, 55d are not limited to those shown in the size, shape, number, arrangement, and the like. For example, regarding the size, shape, number, arrangement, etc. of the openings 55a, 55b, 55c, 55d, the first adhesive layer 71 exposed through the openings 55a, 55b, 55c, 55d is an elastic wiring board with electronic components. It suffices as long as the microcomputer 3 does not come off during use of 1 and exhibits an adhesive force that allows the microcomputer 3 to be relatively easily removed from the elastic wiring board 1 with electronic components. Such an opening may have a smaller diameter than the illustrated openings 55a, 55b, 55c, 55d and may have a large number of holes.

As shown in FIG. 3B, a film base 59 is superposed on the stretchable substrate 51 from below, and the stretchable substrate 51 and the film base 59 are heated and pressurized to be fused to each other. An external terminal 58 is formed at the end of the 59, and after the elastic substrate 51 and the film base 59 are fused, the elastic wiring 52 and the plurality of electrodes 54a and 54b are formed in the inner region of the elastic substrate 51. , 54c, 54d are formed. The openings 55a, 55b, 55c, 55d, which are the defects of the elastic substrate 51, are the inner regions of the elastic substrate 51, and the electrodes 54a, 54c and 54b connected to the elastic wiring 52, 54d is formed in the electrode non-forming region where it is not formed. Such openings 55a, 55b, 55c, 55d do not interfere with the arrangement of the electrodes 54a, 54b, 54c, 54d, and the pressure-sensitive adhesive layer portions 56a, 56b, 56c have sufficient adhesive strength to fix the microcomputer 3. , 56d can be formed.

The opening area of the openings 55a, 55b, 55c, 55d is determined by the relationship between the strength of the elastic substrate 51 and the adhesive strength of the adhesive layer portions 56a, 56b, 56c, 56d. That is, the larger the opening area of the openings 55a, 55b, 55c, 55d, the greater the adhesive strength of the adhesive layer portions 56a, 56b, 56c, 56d, and the microcomputer 3 is firmly fixed to the elastic wiring board 5. Can be done. However, the larger the opening area of the openings 55a, 55b, 55c, 55d, the smaller the strength of the elastic substrate 51, and the higher the possibility of damage to the elastic wiring substrate 5.

An elastic cover 6 is provided on a part of the elastic substrate 51 and the film base 59. The elastic cover 6 is an elastic member that protects the elastic wiring 52 and the electrodes 54a, 54b, 54c, 54d formed on the main surface 51b of the elastic substrate 51. The elastic cover 6 is adhered to the main surface 51b of the elastic substrate 51 by the first adhesive layer 71. Further, a second pressure-sensitive adhesive layer 81 is formed on the back surface of the formation surface of the first pressure-sensitive adhesive layer 71 of the elastic cover 6. It is preferable that the first adhesive layer 71 has sufficient strength to fix the microcomputer 3 on the elastic wiring board 5 and has a strength that allows the microcomputer 3 to be manually removed from the elastic wiring board 5. .. The second pressure-sensitive adhesive layer 81 is a pressure-sensitive adhesive that attaches the elastic wiring board 5 to the living body, and is preferably manufactured of a material that does not damage the surface of the living body even if it comes into contact with the living body. It is preferable that the adhesive strength of the second pressure-sensitive adhesive layer 81 does not shift due to the movement of the surface to be attached and does not cause pain to the object to be attached when it is peeled off from the surface to be attached.

As the first pressure-sensitive adhesive layer 71, an acrylic pressure-sensitive adhesive, a urethane-based pressure-sensitive adhesive, and a silicone-based pressure-sensitive adhesive can be used. The acrylic pressure-sensitive adhesive is a pressure-sensitive adhesive made of an acrylic polymer, and it is possible to control the sticky physical properties by selecting the type of monomer, controlling the molecular weight of the polymer, the cross-linking density, and the like. Urethane-based pressure-sensitive adhesives are pressure-sensitive adhesives made of polyurethane obtained by condensing compounds having an isocyanate group and a hydroxy group. Urethane-based adhesives have excellent removability. The silicone-based pressure-sensitive adhesive is a pressure-sensitive adhesive composed of a polymer having a siloxane bond as a main skeleton. The silicone-based adhesive can also adhere to silicone rubber and fluororesin. As the second pressure-sensitive adhesive layer 81, a pressure-sensitive adhesive used for adhesive plasters and surgical tapes is used. Such adhesives include acrylic adhesives and rubber adhesives.
In the present embodiment, as will be described later, the adhesiveness of the first adhesive layer 71 and the second adhesive layer 81 is controlled, and when the elastic wiring board 5 is attached, when the microcomputer 3 is attached, and when the elastic wiring board 5 is attached. The relative strengths of the first pressure-sensitive adhesive layer 71 and the second pressure-sensitive adhesive layer 81 are adjusted so that they can be easily handled both when the microcomputer 3 is peeled off and when the microcomputer 3 is removed.

The "adhesive" referred to in the present embodiment is a resin component that adheres to the surface to be attached and immediately exerts an adhesive force on the surface to be attached, and can repeatedly exert an adhesive force depending on the state of the surface to be attached. Is. The properties of such adhesives differ from adhesives that become solid after drying with a liquid or gel before bonding. Further, in addition to the above-mentioned "adhesive", it is also possible to apply a "gel sheet" which has both liquid and solid properties while containing an electrolyte component and always stably maintains a wet state.
It is desirable that these "adhesives" and "gel sheets" have biosafety so as not to adversely affect living tissues such as skin.

Further, as shown in FIGS. 3A and 3B, the elastic cover 6 has electrode openings 63a, 63b that expose at least a part of the electrodes 54a, 54b, 54c, 54d from the elastic cover. , 63c, 63d. By having the electrode openings 63a, 63b, 63c, 63d, the elastic substrate 51 allows the electrodes 54a, 54b, 54c, 54d to come into direct contact with and adhere to the surface to be attached, and to transmit minute signals such as myoelectric potential. It becomes possible to detect with high accuracy.
Further, when the stretchable wiring board 5 is used by being attached to a living body, a biological conductive cream may be applied between the stretchable wiring board 5 and the surface of the living body. In such a case, the elastic cover 6 having the electrode openings 63a, 63b, 63c, 63d functions as a mask to prevent the biological conductive cream from adhering to parts other than the electrodes 54a, 54b, 54c, 54d. Fulfill.
Next, the members constituting the stretchable wiring board 5 described above will be described in order.

(Stretchable substrate)
4 (a) is a top view of the elastic substrate 51, and FIG. 4 (b) is an end view of the end face of the elastic substrate 51 as viewed in the direction of arrow lines III-III in FIG. 4 (a). be. However, FIG. 4A clearly shows the elastic wiring 52 and the electrodes 54a, 54b, 54c, 54d formed on the main surface 51b of the elastic substrate 51, so that the elastic substrate 51 shows a virtual line. The dotted chain line, the elastic wiring 52, and the electrodes 54a, 54b, 54c, and 54d are shown by solid lines.
The elastic substrate 51 is attached to the first release member 4 as shown in FIG. 4 (b). The elastic substrate 51 and the first release member 4 are attached to each other by the tackiness (adhesiveness) of the elastic substrate 51. The first release member 4 is a lightly peelable paper separator, and the stretchable substrate 51 of a thin film having tackiness is unintentionally stretched, the portions of the stretchable substrate 51 are adhered to each other, wrinkled, or wrinkled. It supports the elastic substrate 51 in order to prevent it from being bent or the like.

The first release member 4 is overlapped with the base material to be the stretchable substrate 51 even before the stretchable substrate 51 is formed. Elastic wiring 52 and electrodes 54a, 54b, 54c, 54d are printed on this base material. Further, the openings 55a, 55b, 55c, 55d are die-cut on the base material, and then die-cut into the shape of the elastic substrate 51. The first release member 4 is attached to the stretchable substrate 51 due to the tackiness of the stretchable substrate 51. Therefore, the first release member 4 is formed with openings 45a, 45b, 45c, 45d having the same opening shape at the same time as the openings 55a, 55b, 55c, 55d. The order of printing the elastic wiring 52 and the electrodes 54a, 54b, 54c, 54d on the elastic substrate 51 and die-cutting the openings 55a, 55b, 55c, 55d may come first.

The thickness of the elastic wiring 52 and the electrodes 54a, 54b, 54c, 54d formed on the main surface 51b of the elastic substrate 51 is the change in resistance of the elastic wiring 52 from no load to extension, as well as the elastic wiring substrate. It can be determined based on the restrictions of the overall thickness dimension and width dimension of 5. From the viewpoint of ensuring good elasticity by following the dimensional change at the time of extension of the elastic wiring 52, the thickness dimension of each elastic wiring 52 and the electrodes 54a, 54b, 54c, 54d shall be 25 μm or less. It is possible, preferably 10 μm or more and 15 μm or less. Further, the width dimension of the elastic wiring 52 is preferably 1000 μm or less, more preferably 500 μm or less, and further preferably 200 μm or less.

The stretchable substrate 51 has higher stretchability than the film base 59. Preferable materials constituting the elastic substrate 51 include, but are not limited to, elastomer materials such as nitrile rubber, latex rubber, and urethane-based elastomer. In particular, by using a urethane-based elastomer sheet used for medical purposes, high safety can be obtained even when the urethane-based elastomer sheet is attached to a living body via the second pressure-sensitive adhesive layer 81.

The thickness of the stretchable substrate 51 is not particularly limited, but from the viewpoint of not hindering the expansion and contraction movement of the surface to be attached to which the stretchable wiring board 5 is applied, for example, the thickness is preferably 100 μm or less. The thickness of the stretchable substrate 51 is more preferably 25 μm or less, and even more preferably 10 μm or less.

The stretchable substrate 51 preferably has a maximum elongation rate of 10% or more, more preferably 50% or more, further preferably 100% or more, and particularly preferably 200% or more. The stretchable substrate 51 made of the above-mentioned material can exhibit, for example, a maximum elongation rate of 300% or more. Here, the maximum elongation rate of the elastic substrate 51 means the maximum value of the elongation rate that can be elastically deformed in one direction in the in-plane direction.
In the present specification, the elongation rate means the ratio of extension in one direction in the in-plane direction by applying a force to the dimension when no external force is applied (elongation rate 0% dimension). For example, if the elongation rate is 50%, the elongation rate is 1.5 times the elongation rate of 0% dimension, and if the elongation rate is 100%, the elongation rate is twice that of the 0% elongation rate dimension.

(Film base)
FIG. 5A is a top view of the film base 59. 5 (b) is an end view of the end face of the film base 59 shown in FIG. 5 (a) as viewed in the direction of arrow lines IV-IV. The upper surface of the film base 59 shown in FIG. 5A indicates the upper surface of the elastic wiring board 5 in which the film base 59 is bonded to the elastic substrate 51 in a used state. The film base 59 has a main surface 59a and a main surface 59b, and an external terminal 58 is formed on the main surface 59a. The external terminal 58 is composed of a plurality of terminal portions 581. In the present embodiment, the terminal portion 581 is directly connected to the plurality of elastic wirings 52 in a one-to-one manner. The terminal portion 581 and the elastic wiring 52 are joined by, for example, a laminate connection or a pressure press.
The external terminal 58 is mainly formed of a coating film of carbon paste, and such a coating film has the surface hardness and wear resistance required for connector contacts. Further, the film base 59 and the external terminal 58 are collectively referred to as an external pull-out cable, and the external pull-out cable can also be produced by a known FPC (Flexible Printed Circuits).

The film base 59 is a flexible member and has a Young's modulus larger than that of the elastic substrate 51. In the present embodiment, the film base 59 is a member having lower elasticity than the elastic substrate 51 and substantially hardly expanding and contracting. The material of the film base 59 is not particularly limited, but has low sliding property, corrosion resistance and high strength such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polyphenylene sulfide (PPS) or fluororesin. Synthetic resin can be used. In addition, a paper material having appropriate durability such as cellulose nanofiber paper may be used for the film base 59.
By attaching such a film base 59 to the elastic substrate 51, it is possible to facilitate the handling of the elastic wiring board 5 when the external terminal 58 is inserted into the terminal 31.

The thickness of the film base 59 can be 10 μm or more and 200 μm or less, preferably 25 μm or more and 150 μm or less, and more preferably 50 μm or more and 100 μm or less. Further, the thickness of the film base 59 is preferably thicker than the thickness of the elastic substrate 51. By setting the thickness of the film base 59 within the above range, the in-plane rigidity of the region where the external terminal 58 is formed can be sufficiently increased, and the overall thickness of the stretchable wiring board 5 can be suppressed.

(Elastic cover)
FIG. 6A is a top view of the elastic cover 6. FIG. 6B is an end view of the end face of the elastic cover 6 as seen on the side of the arrow line VV shown in FIG. 6A. The “upper surface” of the elastic cover 6 shown in FIG. 6A is a surface 6a of the elastic cover 6 when used as a part of the elastic wiring board 1 with electronic components as viewed from the side of the microcomputer 3. Yes, the back surface is the surface 6b. However, in FIGS. 6A and 6B, the second release member 7 and the third release member are removed when the elastic cover 6 is used as the elastic wiring board 1 with electronic components. 8 indicates a state in which it is attached.
In the elastic cover 6 shown in FIGS. 6 (a) and 6 (b), the second release member 7 is on the side of the elastic substrate 51, and the third release is on the side opposite to the side facing the second release member 7. The member 8 is attached. A first adhesive layer 71 is formed between the elastic cover 6 and the second release member 7, and the first adhesive layer 71 fixes the second release member 7 to the elastic cover 6. Further, a second adhesive layer 81 is formed between the elastic cover 6 and the third release member 8, and the second adhesive layer 81 fixes the third release member 8 to the elastic cover 6. There is.

The base material to be the elastic cover 6 is bonded to the second release member 7 and the third release member 8 by the first adhesive layer 71 and the second adhesive layer 81, and then the elastic cover 6 is die-cut or the like. Is molded into. At this time, electrode openings 63a, 63b, 63c, and 63d are formed on the base material by die cutting at the same time as molding. The second release member 7 previously bonded to the base material has openings 73a, 73b, 73c, 73d at the same time as the openings of the electrode openings 63a, 63b, 63c, 63d, and is used as the third release member. In No. 8, the openings 83a, 83b, 83c, 83d are opened at the same time as the openings 63a, 63b, 63c, 63d for the electrodes.

The degree of peelability of the release member can be divided into three stages: light peeling, medium peeling, and heavy peeling. In the present embodiment, the degree of peeling of the second release member 7 is light peeling, and the degree of peeling of the third release member 8 is heavy peeling. The guideline for light peeling, medium peeling, and heavy peeling is as follows.
Light peeling 100 mN / 25 mm or less Medium peeling 100 mN or more, 1000 mN / 25 mm or less Heavy peeling 1000 mN / 25 mm or more According to this embodiment, the third release member 8 is peeled off when the second release member 7 is peeled off. Can be prevented.

As described above, the stretchable substrate 51 is formed with stretchable wiring 52 and electrodes 54a, 54b, 54c, 54d having elasticity. The elastic cover 6 is a member that covers at least a part of the elastic wiring 52 and the electrodes 54a, 54b, 54c, 54d and protects the elastic wiring 52 and the electrodes 54a, 54b, 54c, 54d. Such an elastic cover 6 is preferably made of an insulating and elastic material. For the elastic cover 6, for example, an elastomer material can be used, and a resin material common to the elastic substrate 51 may be used. Thereby, the stretchable wiring 52 can be protected without impairing the stretchability of the stretchable substrate 51. The elastic cover 6 of the present embodiment is joined by attaching the elastic cover 6 prepared in advance in the form of a sheet to the film base 59 and the elastic substrate 51.
The thickness of the elastic cover 6 is not particularly limited, but from the viewpoint of not hindering the elasticity of the elastic wiring board 5, it is preferably 100 μm or less, more preferably 50 μm or less, and 30 μm or less. Is even more preferable.

[Manufacturing method of elastic wiring board]
Next, the manufacturing process of the stretchable wiring board 5 for assembling the stretchable substrate 51, the film base 59, and the stretchable cover 6 described above to complete the stretchable wiring board 5 will be described.
7 (a) and 7 (b) are views for explaining a state in which the elastic substrate 51 and the film base 59 are bonded together. FIG. 7A is a top view of the elastic substrate 51 bonded to the film base 59. FIG. 7B is an end view of the end face of the configuration shown in FIG. 7A as viewed in the direction of the arrow VI-VI. 8 (a) and 8 (b) show a configuration in which the elastic cover 6 and the film layer 9 are attached to the elastic substrate 51 and the film base 59 shown in FIGS. 7 (a) and 7 (b). It is a figure which shows. FIG. 8A is a top view of the above configuration. The upper surface referred to here is a view of the assembled elastic substrate 51, film base 59, elastic cover 6 and film layer 9 as viewed from the side to which the microcomputer 3 is adhered. Therefore, in FIG. 8A, the first release member 4 and the film layer 9 are visible. FIG. 8 (b) is a view of the end face of the configuration shown in FIG. 8 (a) viewed on the side of the arrow VII-VII.

As shown in FIGS. 7 (a) and 7 (b), in the method of manufacturing the stretchable wiring board of the present embodiment, the external lead-out cable is attached to the stretchable board 51. The bonding of the external pull-out cable and the stretchable substrate 51 can be realized, for example, by fusion-bonding the external pull-out cable and the stretchable board 51 by hot-pressing. Therefore, in the present embodiment, it is preferable that the elastic substrate 51 is made of a thermoplastic elastomer material, and the elastomer material is thinly coated on the side of the fusion surface of the film base 59. Further, in the present embodiment, the material forming the elastic wiring 52 is a conductive paste using a thermoplastic resin as a binder, and is fused and bonded to the carbon coating film forming the external terminal 58 to be electrically connected. Conceivable.

Further, in the method of manufacturing the stretchable wiring board of the present embodiment, as shown in FIGS. 8 (a) and 8 (b), the stretchable board 51 shown in FIGS. 7 (a) and 7 (b) is used. , Includes a step of sticking to the elastic cover 6. In the stretchable substrate 51, the stretchable wiring 52 and the electrodes 54a, 54b, 54c, 54d are formed on one main surface 51b, and the first release member 4 is formed on the other main surface 51a. Further, the elastic cover 6 is formed with a first adhesive layer 71 and a second release member 7 (FIG. 6) covering the first adhesive layer on one main surface, and a second adhesive on the other main surface. A third release member 8 is provided to cover the layer 81 and the second pressure-sensitive adhesive layer. In such a bonding step of the elastic cover 6, the second release member 7 is peeled from the first pressure-sensitive adhesive layer 71, and the first pressure-sensitive adhesive layer 71 is bonded to the main surface 51b of the stretchable substrate 51. Further, in the elastic wiring board 5, the third release member 8 is peeled off from the second adhesive layer 81, and the second adhesive layer 81 is attached to the surface to be attached.

In FIGS. 8A and 8B, in the present embodiment, the physical properties of the first pressure-sensitive adhesive layer 71, the second pressure-sensitive adhesive layer 81, the second release member 7, and the third release member 8 are subjected to the second adhesion. The adhesion strength between the agent layer 81 and the third release member 8 is A, the adhesion strength between the first adhesive layer 71 and the second release member 7 is B, and the adhesion strength between the elastic substrate 51 and the first release member 4 is When C is set, adjustments are made so that the relationship of A> B and A> C is established.
As described above, the physical properties of the first pressure-sensitive adhesive layer 71 and the second pressure-sensitive adhesive layer 81 can be adjusted by selecting the materials and the cross-linking densities of the first pressure-sensitive adhesive layer 71 and the second pressure-sensitive adhesive layer 81. .. Further, the adhesion strength of the first release member 4, the second release member 7, and the third release member 8 can be adjusted by selecting the material and surface processing of the release member. For the surface processing of the release member, for example, a mold release process for coating the surface of the release member to reduce the adhesiveness to the release member, an embossing process for forming fine irregularities on the surface of the release member, and the like can be considered. ..

As shown in FIG. 9, the elastic wiring board 1 with electronic components of the present embodiment is first from the openings 55a, 55b, 55c, 55d by peeling the first release member 4 from the first adhesive layer 71. The pressure-sensitive adhesive layer 71 is exposed, and the microcomputer 3 is attached thereto. Subsequently, the third release member 8 is peeled off from the second pressure-sensitive adhesive layer 81, and the stretchable wiring board 5 is attached to the surface to be attached such as the surface of a living body by the second pressure-sensitive adhesive layer 81. In the present embodiment, when the adhesion strength A is made larger than the adhesion strength B, the second release member 7 is peeled off from the first adhesive layer 71 and the elastic cover 6 is attached to the elastic substrate 51. It is possible to prevent the third release member 8 from peeling off from the second pressure-sensitive adhesive layer 81.
Further, in the present embodiment, by making the adhesion strength A larger than the adhesion strength C, the third release member is peeled off when the first release member 4 is peeled off in order to attach the microcomputer 3 to the first adhesive layer 71. It is possible to prevent the 8 from peeling from the second pressure-sensitive adhesive layer 81.

[Handling of elastic wiring boards with electronic components]
Next, the handling of the stretchable wiring board 1 with electronic components, which is composed of the stretchable wiring board 5 manufactured as described above and the microcomputer 3 adhered to the stretchable wiring board 5, will be described.
FIG. 10A shows a state in which the microcomputer 3 is attached to the elastic wiring board 5. FIG. 10B shows a state in which the external terminal 58 of the film base 59 is inserted into the terminal 31 of the microcomputer 3 and is electrically connected. As shown in FIGS. 10A and 10B, the third release member 8 is attached to the elastic wiring board 5 when the microcomputer 3 is adhered. In the elastic wiring board 1 with electronic components shown in FIG. 10 (b), as shown in FIG. 11 (a), the third release member 8 is peeled off to expose the second adhesive layer 81, and FIG. 11 (a) shows. As shown in b), it is attached to the surface to be attached by the second pressure-sensitive adhesive layer 81. In FIG. 11B, the surface to be attached is shown as the surface S of the living body.

In the elastic wiring board 1 with electronic components of the present embodiment, the adhesion strength between the second pressure-sensitive adhesive layer 81 and the third release member 8 is A, and the adhesion strength between the microcomputer 3 and the first pressure-sensitive adhesive layer 71 is D. In that case, the relationship A <D is established.
By doing so, as shown in FIG. 11A, when the third release member 8 is peeled from the elastic wiring board 1 with electronic components, the microcomputer 3 is peeled from the first adhesive layer 71. You can prevent that.

Further, in the elastic wiring board 1 with electronic components of the present embodiment, the adhesion strength between the second pressure-sensitive adhesive layer 81 and the surface to be attached is E, and the adhesion strength between the first pressure-sensitive adhesive layer 71 and the microcomputer 3 is D. In that case, the relationship of E <D is established.
By doing so, in this embodiment, when the measurement by the elastic wiring board 1 with electronic components is completed and the microcomputer 3 is removed from the elastic wiring board 1 with electronic components, one of the first adhesive layers 71 It is possible to prevent the parts from adhering to the side of the microcomputer 3 and to save the trouble of cleaning the bonded surface between the microcomputer 3 and the elastic wiring board 5 every time the elastic wiring board 5 is replaced.

In the above handling, in the present embodiment, the elastic substrate 51 is supported by another release member when the second release member 7 and the first release member 4 are peeled off. Therefore, the stretchable wiring board 5 of the present embodiment is subjected to a series of operations of adhesion of the microcomputer 3 to the stretchable wiring board 5, sticking to the sticking surface of the stretchable wiring board 1 with electronic components, and peeling. It is possible to simplify the handling of the elastic wiring board 1 with parts and the elastic wiring board 5 and improve the work efficiency.

Further, in the present embodiment, it is desirable that the microcomputer 3 is in close contact with the surface S of the living body from the viewpoint of signal detection sensitivity. In this embodiment, in order to bring the microcomputer 3 into close contact with the surface S of the living body, the sealing member 33 shown in FIG. 2 is a low-resilience foam member.
The "low-resilience foam member" referred to in the present embodiment is a member produced by stirring and mixing a foaming agent, a defoaming agent, a catalyst, etc. with a polyol and a polyisosianate as main components. A colorant, a flame retardant, or the like is added to the low-resilience foam member as needed. The low resilience foam has slow resilience after compression. In this embodiment, for example, the standard of the low-resilience foam member is set as follows.
Density: 40 kg / m ³ or more, 80 kg / m ³ or less Hardness: 40 N or more, 53 N or less Repulsive elasticity: 2% or more, 4% or less Compression deflection test (hysteresis loss): 56% or more, 68% or less

Table 1 shows examples of physical properties in the above range. In Table 1, the hardness is based on the JIS K 6400-2 standard. The impact resilience is based on the JIS K 6400-3 standard. The compression deflection test is based on the JIS K 6400-2 standard.

As described above, in the present embodiment, when the low-resilience foam member is used for the sealing member 33, the sealing member 33 of the microcomputer 3 is used as the adhesive layer portions 56a, 56b, 56c, 56d of the elastic wiring board 5. The sealing member 33 is compressed and firmly adhered to the pressure-sensitive adhesive layer portions 56a, 56b, 56c, and 56d. After that, the deformation of the sealing member 33 is slowly restored, and the adhesiveness is maintained for a relatively long time. Therefore, the microcomputer 3 comes into close contact with the elastic wiring board 5 during the measurement of the biological signal by the elastic wiring board 1 with electronic components, and the noise of the signal detected by the microcomputer 3 is reduced.

[Modification 1]
FIG. 12 is an end view of the microcomputer 30 of the first modification of the microcomputer of the present embodiment. The end view of the microcomputer 30 shown in FIG. 12 is an end view of the microcomputer 30 (not shown) viewed on the side of the arrow line I-I shown in FIG. 2 (a). The microcomputer 30 is sealed in the sealing member 330. The sealing member 330 has main surfaces 330a and 330b, and at least the main surface 330b facing the surface to be attached has a curved surface.
In such a modification 1, the main surface 330b is curved along the surface to be attached such as the surface of the living body S, and even when the sealing member 330 is made of a hard resin, the microcomputer 30 and the elastic wiring board 5 are used. Is fixed in close contact with the surface to be attached.
Such a modification 1 makes it possible to achieve both protection of the LSI substrate in the microcomputer 30 and noise reduction of the detection signal.

[Modification 2]
FIG. 13 is a top view of the stretchable substrate 510 of the second modification of the stretchable substrate of the present embodiment. The stretchable substrate 510 is elastic, whereas the defects formed in the stretchable substrate 51 of the above embodiment are openings 55a, 55b, 55c, 55d opened in the plane of the stretchable substrate 51. The missing portion of the substrate 510 is a notch 550a, 550b, 550c, 550d, 550e over the peripheral edge of the elastic substrate 510.
In the second modification, the first pressure-sensitive adhesive layer 71 is exposed from the elastic substrate 510 through the notches 550a, 550b, 550c, 550d, and 550e. Therefore, in the second modification, the adhesive layer portions 560a, 560b, 560c, 560d, and 560e are formed on the outer peripheral portion of the elastic substrate 510.

According to such a modification 2, the microcomputer 3 is adhered to the elastic substrate 510 at the peripheral edge of the main surface 33b, and a gap is less likely to be formed between the main surface 33b and the elastic substrate 510. Therefore, in the modified example 2, the possibility that the microcomputer 3 firmly adheres to the elastic substrate 510 and the microcomputer 3 peels off from the elastic substrate 51 can be reduced. However, according to such a modification 2, it becomes difficult to peel off the first release member 4 from the elastic substrate 510 when the microcomputer 3 is attached. Therefore, when the elastic substrate 510 of the second modification is used, a tab for peeling may be formed on the first release member 4 around the notch portions 550a, 550b, 550c, 550d, and 550e.

The above embodiments and examples include the following technical ideas.
<1> An elastic substrate on which elastic wiring is formed, an elastic cover provided on the elastic substrate, and the like.
Includes a first pressure-sensitive adhesive layer provided between the stretchable substrate and the stretchable cover.
A stretchable wiring board in which a part of the stretchable substrate has a defect portion and at least a part of the first pressure-sensitive adhesive layer is exposed from the stretchable substrate through the defect portion.
<2> A plurality of electrodes connected to the stretchable wiring are formed on the stretchable substrate, and the defect portion is an inner region of the stretchable substrate and the electrode is not formed. The elastic wiring board of <1>, which is an opening formed in the region.
<3> The stretchable wiring board of <1>, wherein the defective portion is a notch portion over the peripheral edge of the stretchable substrate.
<4> The elastic wiring board according to any one of <1> to <3>, wherein the elastic cover has an electrode opening for exposing at least a part of the electrodes from the elastic cover.
<5> An elastic substrate having elastic wiring formed on one main surface and a first release member provided on the other main surface, and a first adhesive layer and the first adhesive layer on one main surface. The second release member is attached to the elastic cover provided with the second release member covering the second release member and the second release member provided with the second adhesive layer and the third release member covering the second adhesive layer on the other main surface. A step of peeling from the pressure-sensitive adhesive layer and attaching the first pressure-sensitive adhesive layer to the one main surface of the stretchable substrate is included.
A method for manufacturing an elastic wiring board in which the third release member is peeled off from the second pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer is attached to a surface to be attached.
The adhesion strength between the second pressure-sensitive adhesive layer and the third release member is A, the adhesion strength between the first pressure-sensitive adhesive layer and the second release member is B, and the elastic substrate and the first release member. A method for manufacturing an elastic wiring board in which the relationship of A> B and A> C is established when the adhesion strength is C.
<6> An elastic substrate having elastic wiring formed on at least one main surface, an elastic cover provided on the main surface side of the elastic substrate, the elastic substrate, and the elastic cover. A first pressure-sensitive adhesive layer provided between the two, a part of the stretchable substrate has a defect portion, and at least a part of the first pressure-sensitive adhesive layer has a defect portion, and the stretchable substrate is formed through the defect portion. With the elastic wiring board exposed from
A stretchable wiring board with an electronic component including an electronic component that is adhered to at least a part of the first pressure-sensitive adhesive layer that is exposed from the stretchable substrate through the defect portion.
<7> The stretchable wiring board includes a second pressure-sensitive adhesive layer provided on the side opposite to the first pressure-sensitive adhesive layer with the stretchable cover interposed therebetween, and a third release member covering the second pressure-sensitive adhesive layer. And, including
When the adhesion strength between the second pressure-sensitive adhesive layer and the third release member is A and the adhesion strength between the electronic component and the first pressure-sensitive adhesive is D, the relationship A <D is established, <6>. Elastic wiring board with electronic components.
<8> The stretchable wiring board includes a second pressure-sensitive adhesive layer provided on the side opposite to the first pressure-sensitive adhesive layer with the stretchable cover interposed therebetween, and a third release member covering the second pressure-sensitive adhesive layer. And are further included, and are attached to the surface to be attached by the second pressure-sensitive adhesive layer.
When the adhesion strength between the second pressure-sensitive adhesive layer and the surface to be attached is E and the adhesion strength between the first pressure-sensitive adhesive layer and the electronic component is D, the relationship of E <D is established, <6>. Elastic wiring board with electronic components.
<9> The electronic component is sealed in a sealing member, and the sealing member is an elastic wiring board with an electronic component according to any one of <6> to <8>, which includes a low-resilience foam member.
<10> The electronic component is sealed by a sealing member, and the sealing member has a curved surface at least toward the surface to be attached. Sex wiring board.

1 ... Stretchable wiring board with electronic components 3, 30 ... Microcomputer 4 ... First release member 5 ... Stretchable wiring board 6 ... Stretchable cover 7 ... Second release member 8 ... Third release member 9 ... Film layer 31 ... Terminals 33, 330 ... Sealing members 33a, 33b, 330a, 330b ... Main surface 35 ... Electronic components 45a, 45b, 45c , 45d ... Openings 51, 510 ... Elastic substrates 51a, 51b ... Main surface 52 ... Elastic wiring 54a, 54b, 54c, 54d ... Electrodes 55a, 55b, 55c, 55d ... .. Openings 56a, 56b, 56c, 56d, 560a, 560b, 560c, 560d, 560e ... Adhesive layer 58 ... External terminals 59 ... Film base 59a, 59b ... Main surface 63a, 63b, 63c, 63d ... Electrode opening 71 ... First adhesive layer 73a, 73b, 73c, 73d, 83a, 83b, 83c, 83d ... Opening 81 ... Second adhesive layer 550a, 550b, 550c, 550d, 550e ... Notch 560a, 560b, 560c, 560d, 560e ... Adhesive layer part 581 ... Terminal part

Claims (8)

An elastic substrate on which elastic wiring is formed and
The elastic cover provided on the elastic substrate and
Includes a first pressure-sensitive adhesive layer provided between the stretchable substrate and the stretchable cover.
A part of the stretchable substrate has a defect, and at least a part of the first pressure-sensitive adhesive layer is exposed from the elastic substrate through the defect .
The defective portion is an elastic wiring board which is a notch portion which is applied to the peripheral edge of the elastic substrate. A plurality of electrodes connected to the stretchable wiring are formed on the stretchable substrate.
The stretchable wiring board according to claim 1, wherein the stretchable cover has an electrode opening for exposing at least a part of the electrodes from the stretchable cover. A first adhesive layer and a first adhesive layer are covered with an elastic substrate having elastic wiring formed on one main surface and a first release member provided on the other main surface. The second release member is attached to the first pressure-sensitive adhesive on an elastic cover provided with two release members and a second release member on the other main surface and a third release member covering the second pressure-sensitive adhesive layer. Including a step of peeling from the layer and adhering the first pressure-sensitive adhesive layer to the one main surface of the stretchable substrate.
A method for manufacturing an elastic wiring board in which the third release member is peeled off from the second pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer is attached to a surface to be attached.
The adhesion strength between the second pressure-sensitive adhesive layer and the third release member is A, the adhesion strength between the first pressure-sensitive adhesive layer and the second release member is B, and the elastic substrate and the first release member. A method for manufacturing an elastic wiring board in which the relationship of A> B and A> C is established when the adhesion strength is C. An elastic substrate having elastic wiring formed on at least one main surface, an elastic cover provided on the main surface side of the elastic substrate, and between the elastic substrate and the elastic cover. A part of the stretchable substrate including the provided first pressure-sensitive adhesive layer has a defect portion, and at least a part of the first pressure-sensitive adhesive layer is exposed from the stretchable substrate through the defect portion. Elastic wiring board and
Look including a an electronic component is adhered to at least a portion of the first pressure-sensitive adhesive layer exposed from the elastic substrate through the defect,
The defective portion is a stretchable wiring board with electronic components, which is a notch portion that covers the peripheral edge of the stretchable substrate. The stretchable wiring board includes a second pressure-sensitive adhesive layer provided on the side opposite to the first pressure-sensitive adhesive layer with the stretchable cover interposed therebetween, and a third release member covering the second pressure-sensitive adhesive layer. Including more
Claim that the relationship of A <D is established when the adhesion strength between the second pressure-sensitive adhesive layer and the third release member is A and the adhesion strength between the electronic component and the first pressure-sensitive adhesive layer is D. The elastic wiring board with electronic components according to 4. The stretchable wiring board includes a second pressure-sensitive adhesive layer provided on the side opposite to the first pressure-sensitive adhesive layer with the stretchable cover interposed therebetween, and a third release member covering the second pressure-sensitive adhesive layer. Further included, affixed to the surface to be affixed by the second pressure-sensitive adhesive layer,
If you and the second adhesion strength between the adhesive layer and the target application surface E, the adhesion strength between the first adhesive layer and the electronic component D, E <relation D is met, according to claim 4 Or the elastic wiring board with electronic components according to 5. The elastic wiring board with an electronic component according to any one of claims 4 to 6 , wherein the electronic component is sealed in a sealing member, and the sealing member includes a low-resilience foam member. The elastic wiring board with an electronic component according to any one of claims 4 to 6 , wherein the electronic component is sealed by a sealing member, and the sealing member has a curved surface at least on a surface facing the surface to be attached. ..

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