JP6931845B2 - Work polishing device and work polishing method - Google Patents

Description

The present invention relates to a work polishing apparatus and a work polishing method for polishing a work such as a silicon wafer.

In lapping and polishing processes for polishing workpieces such as silicon wafers, usually, a slurry for polishing is supplied onto the surface plate from the slurry supply unit, and the workpiece is rotated together with the surface plate to form the workpiece with the surface plate. I try to polish between them.
In Patent Document 1 (Japanese Unexamined Patent Publication No. 2009-111094) and Patent Document 2 (Japanese Unexamined Patent Publication No. 2009-11109), in-plane uniformity and polishing of wafers are performed by using a slurry in which micro-nano bubbles and abrasive grains are mixed. In addition to improving the rate, in wrapping, a mirror polishing (polishing) method and a wrapping method for wafers, which can obtain the effect of reducing the amount of wear on the surface plate, have been proposed.

Japanese Unexamined Patent Publication No. 2009-11109 Japanese Unexamined Patent Publication No. 2009-11109

The slurry shown in Patent Document 1 and Patent Document 2 contains micro-nano bubbles and abrasive grains as described above. The micro-nano bubbles are considered to be bubbles having a size of 1 nm or more and less than 100 μm. Since the micro-nano bubbles have a large zeta potential, it is said that the dispersibility of the polishing particles in the slurry is improved and uniform polishing processing can be performed.
However, in the slurries shown in Patent Documents 1 and 2, the dispersibility of the polishing particles in the slurry is improved by the inclusion of micro-nano bubbles, but the diffusivity of the slurry itself on the polishing surface of the surface plate ( Spreading of the slurry on the surface plate) is not always good.
Therefore, in Patent Documents 1 and 2, it is necessary to supply a large amount of slurry in order to supply a required amount of slurry over the entire polished surface of the surface plate, which causes a problem of high cost.

The present invention has been made to solve the above problems, and an object of the present invention is that the slurry has good diffusivity over the entire polished surface of the surface plate, and therefore the work can be polished uniformly even with a small amount of slurry. It is an object of the present invention to provide a work polishing apparatus and a work polishing method capable of reducing costs.

In order to achieve the above object, the present invention includes the following configurations.
That is, the work polishing apparatus according to the present invention is a work polishing apparatus having a surface plate for polishing a work on a polished surface and a slurry supply unit for supplying a slurry on the surface plate. It is characterized in that it is a slurry supply unit that takes in a bubble shape having a size of millimeter (mm) or more inside.
Further, the slurry supply unit has a take-in unit that takes in gas into the slurry in the form of bubbles having a size of millimeter (mm) or more, and supplies the slurry in which the millibubbles are mixed onto the surface plate. Can be a department.

The gas may be air or another gas.
The intake portion has an intake port that opens to the atmosphere, and air can be taken in from the intake port.
The intake section includes a small-diameter pipe into which the slurry flows from the slurry storage section in the slurry supply section, a large-diameter pipe having a diameter larger than that of the small-diameter pipe, and a large-diameter pipe into which the lower side of the small-diameter pipe enters. A pipe having a diameter larger than that of a small-diameter pipe and a diameter smaller than that of the large-diameter pipe, and the upper end of the pipe is separated from the lower end of the small-diameter pipe at a required interval at the lower part of the large-diameter pipe. In this state, the upper side is connected, and the pipe is composed of an intermediate diameter pipe that supplies the slurry from the lower side onto the platen, and the upper end opening of the large diameter pipe can be used as the intake port.

The lower side of the small-diameter pipe can be made to enter the large-diameter pipe along the inner wall of the large-diameter pipe.
Alternatively, the lower side of the small-diameter pipe may be allowed to enter the large-diameter pipe in a state of being inclined with respect to the large-diameter pipe.
The nozzle opening at the lower end of the intermediate diameter pipe or the nozzle opening of the nozzle connected to the intermediate diameter pipe can be an opening long in the rotation direction of the surface plate.

Further, a double-sided polishing apparatus having a lower surface plate and an upper surface plate, the nozzle provided on the upper surface plate as the slurry supply unit for supplying slurry to the lower surface plate, and the upper surface plate. It is provided at a position downstream of the nozzle in the direction in which the slurry flows, and may include a gas supply unit that ejects gas toward the slurry.

Further, the work polishing method according to the present invention is a work polishing method using the work polishing apparatus according to any one of the above, in which a slurry mixed with millibubbles is supplied onto the surface plate from the slurry supply unit, and the surface plate is supplied. It is characterized in that the slurry is diffused on the surface plate by spreading the millibubbles on the surface plate.
Further, the spread of millibubbles on the surface plate causes the slurry to spread so as to surround the outer peripheral edge of the work and to enter between the work and the surface plate.

The work polishing apparatus and the work polishing method according to the present invention have the following effects.
That is, the millibubbles mixed in the slurry have an action of spreading the slurry in the width direction (radial direction) of the surface plate. Therefore, since the slurry supplied on the surface plate from the slurry supply unit is uniformly spread on the surface plate, the slurry can be uniformly diffused on the surface plate without increasing the supply amount of the slurry so much. Good polishing of the work can be performed. Moreover, since the amount of slurry used can be kept low, the cost can be reduced.

It is explanatory drawing of the double-sided polishing apparatus. It is explanatory drawing of a carrier. It is explanatory drawing of the ring-shaped gutter. It is explanatory drawing which shows the flow-down hole arrangement provided in the upper surface plate. It is explanatory perspective view which shows an example of the structure of the intake part. It is explanatory sectional view which shows the principle of bubble generation. It is a photograph of a bubble generated in an intermediate diameter pipe. It is explanatory drawing of the state which arranged the small diameter pipe inclined with respect to the large diameter pipe. It is explanatory drawing of the apparatus which observes the spread state of a slurry on a surface plate. It is a photograph showing the spread state of the slurry mixed with bubbles on the surface plate. It is a photograph which shows the spread state of the slurry around the work. It is a photograph which shows the spread state of the bubble in the groove provided in the work. It is explanatory drawing which shows the shape of a nozzle mouth. It is a photograph which shows the spread state of a slurry on a surface plate when various nozzle mouths are used. It is explanatory drawing of the slurry supply part when the bottomed pipe is used for the large diameter pipe. It is a photograph which shows the spread of the slurry on the surface plate when the slurry supply part of FIG. 15 is used. It is explanatory drawing which shows the example which pumps the outside air to a supply pipe through a pipe. It is explanatory drawing which shows the example which ejects a gas from the gas supply part provided on the upper surface plate to the slurry supplied on the lower surface plate.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a front explanatory view of a double-sided polishing device (wrapping device) 30. Since a known basic structure of the double-sided polishing apparatus 30 can be adopted, it will be briefly described below.
The double-sided polishing apparatus 30 includes a lower surface plate 32 whose upper surface is a polished surface, and an upper surface plate 36 which is supported above the lower surface plate 32 so as to be movable up and down and whose lower surface is a polished surface.

The upper and lower surface plates 32 and 36 are rotated in opposite directions with respect to the axis by the driving device. That is, the upper surface plate 36 is provided so as to be rotatable and vertically movable about the axis by the driving device 40 arranged on the base 38. The drive device 40 has, for example, a cylinder device (not shown) as a vertical movement mechanism, and a motor (not shown) as a rotation mechanism.
Reference numeral 42 denotes a motor that rotationally drives the lower platen 32.

A carrier 44 having a through hole for holding a work is arranged between the lower surface plate 32 and the upper surface plate 36. The carrier 44 is rotationally driven so as to rotate and revolve by a sun gear (inner pin gear) 46 and an internal gear (outer pin gear) 48 arranged in the center hole of the lower platen 32 (FIG. 2). The sun gear 46 and the internal gear 48 are also rotated by a known mechanism.

On the upper surface plate 36, a rotating disk 52 that is attached to the upper surface plate 36 via a plurality of support rods 50 and rotates together with the upper surface plate 36 is arranged.
A plurality of (two in the figure) ring-shaped gutters (slurry storage portions) 54 and 56 are concentrically fixed on the rotating disk 52.
Slurry flow holes 60 are provided on the bottom surfaces of the ring-shaped gutters 54 and 56.

Slurry is supplied to the ring-shaped gutters 54 and 56 from the slurry supply source 64 via the pipe 62. A flow rate adjusting valve 66 is arranged in the pipe 62.
First, the slurry is supplied from the pipe 62 into the receiving pipes 70, 70 erected on the arm 68. As shown in FIG. 3, the slurry is ringed from the receiving pipes 70 and 70 via a distribution tube (not shown) from the flow-down holes 73 and 74 provided in the four support arms 72 arranged radially. It is flowed down to the gutters 54 and 56.
These arms 68 and support arms 72 are supported by a base 38 by a support portion (not shown).

As shown in FIG. 4, the upper surface plate 36 is formed with the flow-down holes 76 of the slurry radially, and the flow-down holes 76 of the upper surface plate 36 and the flow-down holes 60 provided in the ring-shaped gutters 54 and 56. Is connected by the supply pipe 78. The slurry is supplied onto the polished surface of the lower platen 32 through the supply pipe 78.

Then, among the concentric ring-shaped gutters, the inner ring-shaped gutter 54 supplies the slurry to the three flow-down holes 76 on the inner peripheral side of the flow-down holes 76 provided in the upper surface plate 36. , The slurry is supplied to the zone on the inner peripheral side of the polished surface of the lower surface plate 32.
From the outer ring-shaped gutter 56, the slurry is supplied to the three flow-down holes 76 on the outer peripheral side of the flow-down holes 76 provided in the upper surface plate 36, and the zone on the outer peripheral side of the polished surface of the lower surface plate 32 is supplied. To supply the slurry to.
The slurry flowing down from the lower platen 32 is returned to the slurry supply source 64 by the recovery gutter 80 and the return pipe 81, and is circulated and used.

The slurry supply unit is composed of a slurry supply source 64, a pipe 62, a receiving pipe 70, a ring-shaped gutter (slurry storage unit) 54 and 56, a supply pipe 78, a flow-down hole 76, and the like.
Therefore, while supplying the slurry onto the lower surface plate 32 through the supply pipe 78, by rotating the upper and lower surface plates 32 and 36 and rotating the carrier 44, both sides of the work sandwiched between the upper and lower surface plates 32 and 36 are rotated. Can be polished.
At that time, the slurry is supplied from the inner ring-shaped gutter 54 to the inner peripheral side zone of the lower platen 32 through the supply pipe 78, and the slurry is supplied to the outer peripheral side zone from the outer ring-shaped gutter 56 through the supply pipe 78. Will be done.
The ring-shaped gutters may be one or a plurality of ring-shaped gutters arranged concentrically.

FIG. 5 is an explanatory diagram showing an example of an air intake portion 82 in the supply pipe 78.
The intake unit 82 is connected to a ring-shaped trough (slurry storage unit) 54, 56 in the slurry supply unit directly or via an appropriate relay pipe (not shown) from a small-diameter pipe 84 and the small-diameter pipe 84. A large-diameter pipe 86 into which the lower side of the small-diameter pipe 84 enters, and an intermediate-diameter pipe having a larger diameter than the small-diameter pipe 84 and a smaller diameter than the large-diameter pipe 86. The upper side is connected to the lower part of the pipe 86 with the upper end separated from the lower end of the small diameter pipe 84 at a required interval, and the lower side is connected to the flow-down hole 76 and has an intermediate diameter for supplying slurry onto the lower platen 32. It has a pipe 88.
The upper end opening of the large-diameter pipe 86 is an intake port that opens to the atmosphere.

The flow-down hole 76 serves as a nozzle for discharging the slurry. The lower end of the flow hole 76 is the nozzle port.
By allowing the lower side of the intermediate diameter pipe 88 to enter the flow-down hole 76, the lower side of the intermediate diameter may serve as a nozzle as it is. In this case, the lower end of the intermediate diameter pipe 88 serves as the nozzle opening.
That is, an appropriate nozzle (which becomes a flow-down hole 76 in the present embodiment) may be attached to the lower end of the intermediate diameter pipe 88 to serve as a nozzle, or the lower side of the intermediate diameter pipe 88 may be used as it is.

The diameter of each pipe is not particularly limited, but in the present embodiment, the small diameter pipe 84 has an outer diameter of 8 mm and an inner diameter of 3 mm, and the large diameter pipe 86 has an inner diameter of 12 mm and an intermediate diameter. 88 had an outer diameter of 12 mm and an inner diameter of 7 mm.
The distance between the lower end of the small diameter pipe 84 and the upper end of the intermediate diameter pipe 88 is about 20 mm.
The length of the intermediate diameter pipe 88 was set to about 10 cm.

By configuring the intake portion 82 as described above, when the slurry is allowed to flow down into the small diameter pipe 84, the intermediate diameter is as shown in FIG. 7, although it depends on the viscosity of the slurry and the supply amount of the slurry. Bubbles having a diameter of 1 mm or more (millimeter (mm) size bubbles: millibubbles) are continuously taken into the slurry flowing down the pipe 88 at appropriate intervals.
FIG. 6 is an explanatory diagram of a state in which millibubbles are incorporated into the slurry.

As shown in FIG. 6A, the slurry flowing from the small diameter pipe 84 into the large diameter pipe 86 is once received by the upper end edge of the intermediate diameter pipe 88, spreads in the circumferential direction along the upper end edge, and gradually spreads. The bulge, as shown in FIG. 6B, connects and closes the central portion, which forms a cavity (bubble) in the slurry. This cavity is lowered downward, and the next cavity is formed above the cavity as shown in FIG. 6C.
FIG. 7 is a photograph showing the state of the millibubbles formed in the pipe 88 having an intermediate diameter. From FIG. 7, it can be seen that the size of the millibubble is actually a bubble having a size sufficiently larger than 1 mm.
In the observations shown in FIGS. 7 and 7 and below, water was used as the slurry in place of water in order to make it easier to observe the bubbles in the slurry.

The lower side of the small diameter pipe 84 is not simply along the inner wall of the large diameter pipe 86, but as shown in FIG. 8, the lower side of the small diameter pipe 84 is along the inner wall of the large diameter pipe 86. In addition, the pipe 86 may be allowed to enter the large diameter pipe 86 in an inclined state with respect to the large diameter pipe 86. As a result, the slurry swirls along the inner wall of the large-diameter pipe 86, spreads in the circumferential direction along the upper end edge of the intermediate-diameter pipe 88, and becomes a stable flow, so that the slurry can be more reliably contained in the slurry. Millibubbles can be formed. By adjusting the inclination angle of the small-diameter pipe 84 according to the flow rate, viscosity, etc. of the slurry, the size of bubbles, the frequency of occurrence, and the like can be adjusted.

Diagonal or spiral grooves (not shown) may be formed in the inner wall of the large diameter pipe 86 in order to more reliably generate a spiral flow of slurry in the large diameter pipe 86. Further, in order to form the spiral flow of the slurry more reliably, the upper end edge of the pipe 88 having an intermediate diameter may be formed in a mortar shape that becomes lower toward the inside of the pipe (not shown).
Further, in the above embodiment, the slurry is allowed to flow naturally into the small-diameter pipe 84, but in some cases, the slurry is forcibly sent into the small-diameter pipe 84 by a pump (not shown). You may.

FIG. 9 is a schematic view showing an apparatus for observing the behavior of the slurry 90 mixed with millibubbles supplied from the intermediate diameter pipe 88 onto the lower platen 32.
The slurry 90 is supplied onto the lower surface plate 32 from the nozzle opening at the lower end of the pipe 88 by inserting the lower side of the pipe 88 into a hole provided in the transparent acrylic plate 92 that looks like an upper surface plate. Further, a transparent glass work 94 is arranged between the lower platen 32 and the acrylic plate 92.

By making the acrylic plate 92 and the work 94 transparent, the behavior of the slurry 90 (substitute with water) supplied to the lower platen 32 can be observed. Reference numeral 96 denotes a video camera for observation.
FIG. 10 is a photograph of the behavior of the slurry 90 when the slurry 90 is supplied from the pipe 88 onto the lower platen 32 while rotating the lower platen 32 at a required rotation speed with a video camera 96.
As shown in FIG. 10, in the slurry 90, since the bubble 98 spreads on the lower platen 32, the slurry 90 also spreads in the width direction (direction orthogonal to the rotation direction of the lower platen 32) and is thick on the lower platen 32. It can be seen that it spreads in a width.

11A and 11B are photographs showing the state of the slurry 90 around the work 94. As can be seen from FIGS. 11A and 11B, it can be seen that the bubble 98 spreads along the outer circumference of the work 94 at a position away from the work 94, and the slurry 90 spreads on the outer peripheral portion immediately closest to the work 94.
That is, the slurry 90 enters the lower surface side of the work 94, and the bubble (air) 98 does not enter the lower surface side of the work 94.

Therefore, the slurry 90 that has spread so as to surround the work 94 spreads uniformly on the lower surface side of the work 94 and enters the work 94, so that the work 94 can be uniformly polished. Since the bubble 98 does not enter the lower surface side of the work 94, the bubble 98 does not hinder the polishing of the work 94. The bubble 98 has an action of spreading the slurry 90 in the width direction (radial direction) of the lower platen 32. Therefore, since the slurry 90 supplied from each supply pipe 78 onto the lower platen 32 is uniformly spread on the lower platen 32, the slurry 90 can be supplied to the lower platen 32 without increasing the supply amount of the slurry 90 so much. It can be uniformly diffused upward, and the work 94 can be well polished.

11A and 11B are observation results on the grooveless surface plate 32.
However, the surface plate used for the actual lapping process is generally a grooved surface plate. Therefore, in order to facilitate observation, the behavior of bubbles in the groove was observed using a model in which a groove was formed on the lower surface side of the work 94 made of a transparent glass plate. A groove having a width of 1 mm was formed on the lower surface side of the work 94, and the case where the groove was oriented in the radial direction of the surface plate was observed. The results are shown in FIGS. 12A and 12B. From the figure, it can be seen that the size of the bubbles inside the groove is constant regardless of the passage of time, and that the bubbles do not invade the machined portion (between the work 94 and the lower platen 32). From this, it can be seen that even in the surface plate having the groove formed, the millibubbles stay in the groove and the polishing of the work is not hindered.

Next, the relationship between the shape of the nozzle mouth and the spread of the slurry 90 on the lower platen 32 was investigated.
13A is a schematic view showing a circular nozzle opening, FIG. 13B is a schematic view showing a nozzle opening long in the radial direction of the platen 32, and FIG. 13C is a schematic view showing a nozzle opening long in the rotation direction (tangential direction) of the platen 32.
FIG. 14A is a photograph showing a spread state of the slurry (without bubble mixing) when the nozzle port of FIG. 13B is used. FIG. 14B is a photograph showing a spread state of the slurry (without bubble mixing) when the nozzle port of FIG. 13C is used. FIG. 14C is a photograph showing a spread state of the slurry (without bubble mixing) when the nozzle port of FIG. 13A is used.

From FIG. 14, it can be seen that the shape of the nozzle port is large in the radial direction of the surface plate 32 of the slurry 90 when the nozzle port has a shape long in the rotation direction of the surface plate 32 shown in FIG. 13C (see FIG. 13C). FIG. 14B).
Further, FIG. 14D is a photograph showing the spread state of the slurry 90 when the shape of the nozzle port is circular as shown in FIG. 13A and the slurry 90 is mixed with bubbles. As can be seen from FIGS. 14A to 14D, it can be seen that in the case of FIG. 14D, that is, in the case of the slurry 90 mixed with bubbles, the spread of the surface plate 32 in the radial direction is the largest.
Therefore, when the shape of the nozzle port is long in the rotation direction of the surface plate 32 of FIG. 13C and a slurry in which bubbles are mixed in the slurry 90 is used, the slurry 90 spreads in the radial direction of the surface plate 32. Is expected to become even larger.

In the above embodiment, the small diameter pipe 84, the large diameter pipe 86, and the intermediate diameter pipe 88 are all described as pipes having a circular cross section, but they do not necessarily have to be pipes having a circular cross section, for example, a pipe having a polygonal cross section. It may be a pipe. Further, the large-diameter pipe 86 may be a bottomed pipe as shown in FIGS. 15A to 15C.

FIG. 15A shows an example in which the large-diameter pipe 86 has a bottomed pipe shape with a circular cross section, and the upper portion of the intermediate-diameter pipe (circular cross section) 88 is connected to a hole provided at the bottom of the large-diameter pipe 86. FIG. 15B shows an example in which the large-diameter pipe 86 has a bottomed pipe shape with a square cross section, and the upper portion of the intermediate-diameter pipe (circular cross section) 88 is connected to a hole provided at the bottom of the large-diameter pipe 86. FIG. 15C shows an example in which the large-diameter pipe 86 has a bottomed pipe shape having a rectangular cross section, and the upper portion of the intermediate-diameter pipe (circular cross section) 88 is connected to a hole provided at the bottom of the large-diameter pipe 86.

FIG. 16A is a photograph showing the spread state of the slurry on the surface plate when the large-diameter pipe 86 is used as the pipe shown in FIG. 15A. FIG. 16B is a photograph showing the spread state of the slurry on the surface plate when the large-diameter pipe 86 is used as the pipe shown in FIG. 15B. FIG. 16C is a photograph showing the spread state of the slurry on the surface plate when the large-diameter pipe 86 is used as the pipe shown in FIG. 15C.
As can be seen from FIGS. 16A to 16C, the bubbles generated when the large-diameter pipe 86 is made into a pipe having a square cross section are smaller than those generated when the pipe 86 has a circular cross section, and the bubbles generated when the pipe is made into a pipe having a rectangular cross section are smaller. There is.
It is considered that the size of the generated bubble is related not only to the shape of the cross section of the large-diameter pipe 86 but also to the size of the area of the bottom of the large-diameter pipe 86.

In the above embodiment, the case where the small diameter pipe 84, the large diameter pipe 86, and the intermediate diameter pipe 88 are used as the air intake portion 82 has been described, but it does not necessarily have to be this intake portion. For example, an intake port that simply opens to the atmosphere may be provided at the bent portion of the supply pipe 78 to serve as an intake portion for external air (not shown).

Alternatively, as shown in FIG. 17, the intake unit 82 may simply send the external air directly to the supply pipe 78 through the pipe 100 by the pump P. In this case, it is preferable to attach the foam 102 having open cells to the tip of the pipe 100 so that the foam-like gas is ejected from the foam 102 to the slurry in the supply pipe 78. This also allows the formation of millibubbles in the slurry. In this case, the gas for bubbles may be oxygen, nitrogen, or the like instead of air.

Further, in the above embodiment, in order to form the millibubble 98 in the slurry 90, the air intake portion 82 is provided in the supply pipe 78, but as shown in FIG. 18, the slurry of the upper surface plate 36 A gas supply unit 104 may be separately provided at a portion on the downstream side of the supply pipe 78. Millibubbles 98 can be mixed into the slurry 90 by ejecting gas (air or the like) from the gas supply unit 104 via the foam 102 toward the slurry 90 supplied from the supply pipe 78 onto the lower platen 32. can. Gas is supplied to the gas supply unit 104 via a rotary valve (shown). In this case, the upper surface plate 36 itself is also a constituent part of the slurry supply unit for incorporating millibubbles into the slurry.

In the above embodiment, the double-sided polishing device (wrapping device) has been described as the polishing device, but the present invention can also be applied to a double-sided polishing type polishing device in which a polishing pad is attached to a surface plate, or a single-sided polishing type polishing device. Of course.

30 Double-sided polishing device, 32 Lower platen, 36 Upper platen, 38 base, 40 Drive unit, 42 Motor, 44 Carrier, 46 Sun gear, 48 Internal gear, 52 Rotating disk, 54 Ring-shaped gutter, 56 Ring-shaped gutter, 60 gutter holes, 62 pipes, 64 slurry supply sources, 66 flow control valves, 76 gutter holes, 78 supply pipes, 82 intakes, 84 small diameter pipes, 86 large diameter pipes, 88 intermediate diameter pipes, 90 slurries, 92 Acrylic board, 94 works, 96 video cameras, 98 bubbles, 100 pipes, 102 foams, 104 gas supply parts

Claims (12)

A surface plate that polishes the work on the polished surface,
In a work polishing apparatus having a slurry supply unit for supplying a slurry on the surface plate,
The slurry supply unit is a work polishing apparatus characterized in that the slurry supply unit is a slurry supply unit that takes gas into a slurry in the form of bubbles having a size of millimeter (mm) or more. The slurry supply unit has a take-in unit that takes in gas into the slurry in the form of bubbles having a size of millimeter (mm) or more, and is a slurry supply unit that supplies the slurry mixed with the millibubbles onto the surface plate. The work polishing apparatus according to claim 1, wherein the work polishing apparatus is provided. The work polishing apparatus according to claim 1 or 2, wherein the gas is air. The work polishing apparatus according to claim 2 , wherein the intake portion has an intake port that opens to the atmosphere. The intake part
A small-diameter pipe into which the slurry flows from the slurry storage section in the slurry supply section, and
A large-diameter pipe having a diameter larger than that of the small-diameter pipe and into which the lower side of the small-diameter pipe enters,
A pipe having a diameter larger than that of the small-diameter pipe and a diameter smaller than that of the large-diameter pipe, and the upper end of the pipe is separated from the lower end of the small-diameter pipe at a required interval at the lower part of the large-diameter pipe. The upper side is connected in this state, and the pipe has an intermediate diameter for supplying the slurry from the lower side onto the platen.
The work polishing apparatus according to claim 4, wherein the upper end opening of the large-diameter pipe serves as the intake port. The work polishing apparatus according to claim 5, wherein the lower side of the small-diameter pipe enters the large-diameter pipe along the inner wall of the large-diameter pipe. The work polishing apparatus according to claim 6, wherein the lower side of the small-diameter pipe enters the large-diameter pipe in a state of being inclined with respect to the large-diameter pipe. Claims 5 to 7 are characterized in that the nozzle opening at the lower end of the intermediate diameter pipe or the nozzle opening of the nozzle connected to the intermediate diameter pipe is an opening long in the rotation direction of the surface plate. The work polishing apparatus according to any one of the items. A double-sided polishing machine with a lower surface plate and an upper surface plate.
The slurry supply unit is
A nozzle provided on the upper surface plate for supplying the slurry to the lower surface plate, and a nozzle on the upper surface plate located downstream of the nozzle in the direction in which the slurry flows, and gas toward the slurry. The work polishing apparatus according to claim 1, further comprising a gas supply unit for ejecting. The work polishing apparatus according to any one of claims 1 to 9, wherein the lapping apparatus has a groove on the polished surface of the surface plate. A work polishing method using the work polishing apparatus according to any one of claims 1 to 10.
A work polishing method characterized by supplying a slurry mixed with millibubbles onto the surface plate from the slurry supply unit and spreading the millibubbles on the surface plate to diffuse the slurry onto the surface plate. The work polishing method according to claim 11, wherein the slurry spreads on the surface plate so as to surround the outer peripheral edge of the work and enters between the work and the surface plate.

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