JP6921501B2 - Imprinting method, imprinting equipment, and manufacturing method of goods - Google Patents

Description

The present invention relates to an imprinting method for forming a pattern on an imprinting material on a substrate using a mold, an imprinting apparatus, and a manufacturing method for manufacturing an article.

Imprint technology has been proposed as one of mass production lithography technologies for semiconductor devices and magnetic storage media. The imprint device cures the imprint material in a state where the mold and the imprint material are in contact with each other, and pulls the mold away from the cured imprint material to form a pattern of the imprint material on the substrate (Patent Document 1). .. In the imprinting apparatus, it is necessary to align the mold and the substrate to form a pattern of the cured imprint material.

The imprinting apparatus may form a plurality of shot regions on the substrate on which the pattern of the imprint material is formed by repeating the pattern formation at a plurality of positions on the substrate. On such a substrate, as many shot regions as possible are formed by reducing the gaps between adjacent shot regions in order to increase productivity. The positions of the plurality of shot regions formed on the substrate are predetermined.

Japanese Unexamined Patent Publication No. 2007-281072

When forming a pattern using the imprint device, the imprint material pattern (shot region) may already be formed only on a part of the substrate carried into the imprint device. For example, while the imprinting apparatus is forming a plurality of shot regions on the substrate, the substrate is carried out of the imprinting apparatus for some reason, and the substrate having a pattern of the imprint material partially formed is reinserted. This is because it is carried into the printing device. In this case, the imprinting apparatus must also form a pattern in an area adjacent to the shot area in which the pattern has already been formed.

However, the substrate is not always carried in the same manner to the board holding portion that holds the board before the board is carried out from the imprint device in the middle of imprinting and after the board is carried into the imprint device again. No. Therefore, for example, if an error (deviation) with respect to the board position when the board is first carried into the imprint device is generated, it is already formed when the pattern of the imprint material is formed in the remaining area. An abnormal imprint occurs in which the mold rides on the pattern (shot area) of the imprint material.

Therefore, an object of the present invention is to provide an imprint method capable of eliminating or reducing the occurrence of such abnormal imprints.

To achieve the above object, an imprint method according to one aspect of the present invention, each of the plurality of shot areas on the substrate based on the layout information position is set in the plurality of shot areas that form a pre-patterned In addition, it is an imprinting method of forming an imprint material pattern using a mold, and the imprint material pattern is formed only in a part of the shot area of the substrate carried in so as to be held by the holding portion. It is a substrate in which a pattern of imprint material is formed only in a part of the shot region in the step of determining whether or not the substrate is an imprinted substrate based on various operation parameters during the imprinting operation on the substrate and the process of determining the substrate. in no event it is determined that, if the pattern of the partial shot region is formed based on the corrected layout information in linear components and / or non-linear components, and confirmed on the basis of the various operating parameters, the confirmation a step of measuring the position of the pattern of the imprint material is a position corresponding to the components used for correction of layout information, based on the measurement result of the position of the pattern of the imprint material, layout Based on the step of correcting the position where the preset pattern of information is formed and the layout information corrected in the correction step, the pattern of the imprint material of the substrate held by the holding portion is formed. Each of the unprinted shot regions is characterized by having a step of forming a pattern of an imprint material using a mold.

According to the present invention, it is provided an imprint method capable of eliminating or reducing the occurrence of abnormal imprint when a substrate having a pattern formed on a part of the substrate is carried into an imprint apparatus. Can be done.

It is a figure which shows the structure of the imprinting apparatus of this invention. It is a figure explaining the imprint process of this invention. It is a figure explaining the imprint sequence of this invention. It is a figure which shows the appearance that a plurality of shot regions are arranged on a substrate. It is a figure explaining the imprint sequence of Example 1. FIG. It is a figure explaining the imprint sequence of Example 2. FIG. It is a figure explaining the imprint sequence of Example 3. FIG. It is a figure explaining the imprint sequence of Example 4. It is a figure for demonstrating the manufacturing method of an article.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In addition, in each figure, the same member is given the same reference number, and duplicate description is omitted.

(First Embodiment)
(About imprinting equipment)
The imprinting apparatus 100 of the present invention will be described with reference to FIG. The imprinting apparatus brings the imprint material supplied on the substrate into contact with the mold and gives the imprint material energy for curing, so that the uneven pattern of the mold is inverted and the uneven pattern of the cured product is transferred. It is a device to form. The imprinting apparatus can form a pattern of the imprinting material on the substrate 1 by pulling the mold away from the cured imprinting material.

FIG. 1 is a schematic view showing a configuration of an imprinting apparatus 100 as one aspect of the present invention. For example, the imprint device 100 is used for manufacturing devices such as semiconductor devices. As shown in FIG. 1, in the following drawings, the X-axis and the Y-axis that are orthogonal to each other are taken in a plane parallel to the surface on which the pattern of the substrate 1 is formed and the surface on which the pattern of the mold 5 is formed. The direction orthogonal to the X-axis and the Y-axis will be described as the Z-axis.

As the imprint material, a curable composition (sometimes referred to as an uncured resin) that cures when energy for curing is applied is used. Electromagnetic waves, heat, etc. are used as the energy for curing. The electromagnetic wave is, for example, light such as infrared rays, visible rays, and ultraviolet rays whose wavelength is selected from the range of 10 nm or more and 1 mm or less.

The curable composition is a composition that is cured by irradiation with light or by heating. Of these, the photocurable composition that is cured by light may contain at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent, if necessary. The non-polymerizable compound is at least one selected from the group of sensitizers, hydrogen donors, internal release mold release agents, surfactants, antioxidants, polymer components and the like.

The imprint material is applied in the form of a film on the substrate by a spin coater or a slit coater. Alternatively, the liquid injection head may be applied on the substrate in the form of droplets or in the form of islands or films formed by connecting a plurality of droplets. The viscosity of the imprint material (viscosity at 25 ° C.) is, for example, 1 mPa · s or more and 100 mPa · s or less.

Glass, ceramics, metal, semiconductors, resins and the like are used for the substrate 1, and if necessary, a member made of a material different from the substrate may be formed on the surface thereof. The substrate is a silicon wafer, a compound semiconductor wafer, quartz glass, or the like.

The imprint device 100 includes a substrate holding portion 2 for holding the substrate 1 and a substrate driving mechanism 3 for moving the substrate holding portion 2. Here, the substrate holding portion 2 and the substrate driving mechanism 3 are collectively referred to as a substrate stage. The board stage can move the board 1 into the XY plane. Further, the substrate stage may have a function of moving the substrate 1 in the Z direction (vertical direction) in addition to a position in the XY plane (in the horizontal plane), and a function of tilting the plane of the substrate 1 (tilt). The board stage moves on the base frame 4 of the imprint device 100 to position the board 1.

Further, the imprint device 100 includes a mold drive mechanism 6, a light irradiation unit 7, a coating mechanism 8, a detection unit 11, and a control unit 12.

By holding the mold 5 and moving it in the Z direction, the mold drive mechanism 6 can bring the mold 5 into contact with the imprint material on the substrate or pull it away from the imprint material. The mold drive mechanism 6 may have a function of tilting the mold 5. The mold 5 has an uneven pattern formed on the surface facing the substrate 1.

The light irradiation unit 7 irradiates the imprint material with ultraviolet light through the mold 5 in a state where the mold 5 and the imprint material are in contact with each other to cure the imprint material. The light irradiation unit 7 includes a light source such as a halogen lamp that generates ultraviolet light, and a function (optical member) that collects and molds the ultraviolet light generated from the light source. The imprinting apparatus 100 of the present invention employs a photocuring method for curing the imprinting material on a substrate by irradiating light such as ultraviolet rays as a method for curing the imprinting material.

The imprint device 100 includes a coating mechanism 8 (dispenser), a storage unit 9 (tank), and a pipe 10. The coating mechanism 8 can apply (supply) a predetermined amount of the imprint material to a predetermined region of the substrate 1 by forming the imprint material into fine droplets and discharging the imprint material onto the substrate 1. The imprint material is stored in the storage unit 9, and the imprint material is supplied from the storage unit 9 to the coating mechanism 8 by the pipe 10.

The detection unit 11 (alignment scope) detects the alignment mark formed on the substrate 1 and the alignment mark formed on the mold 5. The control unit 12 of the imprint device 100 obtains the relative position between the substrate 1 and the mold 5 from the detection result of the alignment mark of the detection unit 11, and drives the substrate stage to align the substrate 1 and the mold 5. Can be done. For example, the detection unit 11 detects the alignment mark formed on the substrate 1 and the mold 5 after the imprint material is applied onto the substrate 1 by the coating mechanism 8. The control unit 12 aligns the substrate 1 and the mold 5 based on the detection result of the alignment mark.

(About imprint method)
A method of forming a pattern of an imprint material on the substrate 1 by using the imprint device 100 will be described. FIG. 2 is a flowchart illustrating a sequence of forming a pattern on the substrate 1 by imprint processing. The imprint operation of forming a pattern in one shot area with the configuration shown in FIG. 2 will be described.

FIG. 2A shows how the substrate 1 is carried into the imprinting apparatus 100 and the substrate 1 is held by the substrate holding portion 2. Then, the substrate 1 held by the substrate holding portion 2 moves under the coating mechanism 8 by the substrate driving mechanism 3.

FIG. 2B shows a state in which the coating mechanism 8 coats the imprint material on the substrate 1 while moving the substrate 1 by the substrate driving mechanism 3 (coating step). By applying the imprint material while moving the substrate 1 under the coating mechanism 8, the imprint material can be supplied to a predetermined region on the substrate 1.

FIG. 2C shows a state in which the mold 5 is lowered by the mold drive mechanism 6 and brought into contact with the imprint material supplied on the substrate 1 (stamping step). At this time, the detection unit 11 detects the alignment mark formed on the substrate 1 and the alignment mark formed on the mold 5, and aligns the substrate 1 and the mold 5 based on the detection result.

FIG. 2D shows a state in which the light irradiation unit 7 is irradiating ultraviolet rays in a state where the mold 5 and the imprint material are in contact with each other. The imprint material is cured by the ultraviolet rays emitted from the light irradiation unit 7 (curing step). Then, by pulling the mold 5 away from the cured imprint material by the mold drive mechanism 6, a pattern of the imprint material is formed on the substrate 1, and the imprint process for one shot region is completed.

The imprinting apparatus 100 of the present embodiment can form an imprinting material pattern for a plurality of shot regions on the substrate 1 by repeating the imprinting process shown in FIG. Here, in one imprint process, the imprint material is cured in a state of being in contact with the pattern formed on the mold 5, and then released from the mold to form a pattern of the cured imprint material on the substrate 1. It is a process to do. Therefore, when a plurality of patterns corresponding to a plurality of shot regions are formed on the mold 5, patterns are formed on the plurality of shot regions on the substrate 1 by one imprint process.

When a pattern is formed in a plurality of shot areas by repeating the imprint process, the board 1 is imprinted in a state where the pattern is formed only in a part of the shot areas on the board due to a processing error of the imprint device 100 or the like. It may be carried out from the printing device 100. The substrate 1 in which the pattern is formed only in a part of the shot regions once carried out can be carried back into the imprint device 100 to form a pattern in the remaining shot regions (shot regions in which the patterns are not formed). be. At this time, the imprint process must be performed so as not to come into contact with the pattern already formed in the shot region on the substrate 1. In the examples described below, a sequence for forming a pattern in the remaining shot region (shot region in which the pattern is not formed) so as not to come into contact with the pattern already formed on the substrate 1 will be described.

FIG. 3 is a sequence showing a method of checking the operation parameters in advance performed before starting the imprint process. Here, it is included to obtain a correction value for correcting the position where the pattern is formed.

First, confirmation of various operation parameters during the imprint operation on the substrate in which the pattern is formed only in a part of the shot region is started (S11). Check the parameters in S12. Here, the confirmation of the parameter is to confirm the parameter for operating the imprint device when the pattern is formed by the above-mentioned imprint process. In particular, it is to confirm whether or not the pattern is formed by imprinting only in a part of the shot area on the substrate. For example, the information regarding the position of the pattern formed in a part of the shot area is confirmed. In S13, based on the result of the parameter confirmation performed in S12, it is determined whether or not there is a shot region in which a pattern is formed by imprinting on a part of the substrate. When it is determined in S13 that the pattern is not formed only in a part of the shot region on the substrate (NO in S13), the imprint process described with reference to FIG. 2 described above is started (S24).

(Imprint processing)
FIG. 4 is a diagram illustrating a case where a pattern is formed by an imprint process on a substrate on which a pattern is not formed. FIG. 4 shows how a plurality of shot regions 20 are arranged on the substrate 1 held by the substrate holding portion 2. The number displayed in the shot area indicates the number of the shot area. In FIG. 4, the shot areas are numbered from the first shot area to the ninth shot area.

In the normal imprint processing, a pattern is formed in each of the plurality of shot areas by performing the imprint processing in order from the first shot area shown in FIG. Here, the shot region corresponds to the pattern (pattern region) formed on the mold 5, and is the region where the pattern is formed on the substrate by one imprint process. When a pattern is formed on the substrate at the beginning (first layer, bottom layer), the shot area is not formed and the pattern is formed based on the layout information in which the position where the pattern is formed is set in advance. Form. FIG. 4 shows a region where the region of the pattern formed on the mold 5 contacts the imprint material as a shot region 20. However, the shot region may include a region where the imprint material contacts only a part of the pattern region formed on the mold 5 (so-called peripheral shot or edge shot).

(Example 1)
Returning to FIG. 3, the continuation of the flowchart will be described. When the board carried out in the middle of forming a pattern on the board is carried in again, the linear component may be corrected for the carried-in board, the non-linear component may be corrected, or the linear component and the non-linear component may be corrected. be. In the first embodiment, a case where the pattern is formed only in a part of the shot region on the substrate and the linear component is corrected will be described. When it is determined in S13 that the pattern is formed only in a part of the shot region on the substrate (YES in S13), the parameter is confirmed again (S14). In the parameter confirmation in S14, it is confirmed whether or not the arrangement (arrangement) of a part of the shot regions on the substrate on which the pattern of the imprint material is formed is corrected by the linear component. Here, the parameters include the presence / absence of linear correction for the shot region formed on a part of the substrate. The correction of the linear component is, for example, in the shot region arranged on the substrate, the shift error, the rotation error, and the magnification difference of the shot region are corrected for each arrangement. The arrangement of the shot area on the substrate is obtained by measuring a part of the shot area (sample shot area) of the shot area arranged on the substrate.

In S15, based on the result of the parameter confirmation performed in S14, it is determined whether or not the shot region in which the pattern is formed by imprint is corrected by the linear component. That is, in S15, it is confirmed whether the correction of the linear component is ON or OFF for the arranged shot regions. When it is determined in S15 that the shot regions arranged on the substrate are corrected by the linear components (YES in S15), the linear components of the arranged shot regions are measured (S16).

In S16, the linear component is measured for a part of the shot region where the pattern is formed, and in S17, the correction value based on the measurement result is used as a parameter for pattern formation. Here, the correction value is a correction value used to obtain the location (arrangement) of the shot region to be formed when the pattern is formed on the substrate carried into the imprinting apparatus. By specifying the position of the shot region on the substrate on which the pattern is not formed based on this correction value, the pattern is formed on the substrate without contacting the shot region on which the pattern is already formed with the mold 5. Can be done.

Further, in S18, it is determined whether or not to perform non-linear correction for the shot region in which the pattern is formed by imprinting. When the non-linear correction is not performed, pattern formation is started for the shot region where the pattern is not formed, based on the position of the shot region reflecting the correction of the linear component measured in S16 described above. That is, when it is determined in S18 that the non-linear correction is not performed on the shot region in which the pattern is formed (NO in S18), the normal imprint processing is started (S24).

FIG. 5 shows a position correction method and a correction state of a part of the shot area in which the pattern is formed by the above imprint sequence. FIG. 5 is a diagram showing a method of correcting the position of the pattern formed in a part of the shot area by the imprint sequence of Example 1 and forming the pattern of the imprint material in the remaining shot area. The flow of this embodiment includes a step of determining the necessity of linear correction and the necessity of non-linear correction, but when a pattern is formed on a part of the substrate in S13, the step of determining is performed. The linear component measurement may be performed in S16 and the imprint process may be started in S24 without including.

Here, it is assumed that the pattern has already been formed in the first shot region to the 21st shot region in the shot region on the substrate 1. The linear correction measures the position of the second, fifth, sixth, 11, 14, and 19 shot regions (measurement shot region 1a) arbitrarily selected from the shot regions from the first shot region to the 21st shot region. It is done by. The measurement shot area 1a is an arbitrarily selected shot area. Then, in the measurement shot area 1a where the position is measured, a measurement mark 1b is formed in the shot area as shown in FIG. 5 (b). The measurement mark 1b is a mark formed at the same time as the pattern already formed by imprinting. By detecting a plurality of such measurement marks 1b by the detection unit 11, the position of the shot region in which the pattern has already been formed by imprinting can be measured. The measurement mark formed in the shot region may be detected by using a detection unit that detects the mark via a mold, or by using a measurement unit (so-called off-axis scope) arranged in the apparatus without using a mold. May be detected. Then, based on the measurement results of the positions of the plurality of measurement shot areas 1a, the position information (arrangement state) of the shot areas in which the patterns are already formed arranged on the substrate is obtained. For example, by detecting a plurality of measurement marks 1b formed in the shot region and statistically processing the detection results, it is possible to obtain the arrangement state of the shot region in which the pattern has already been formed. The position information of the remaining shot areas can be corrected from the obtained shot area arrangement state. The layout information in which the position where the pattern is formed is set in advance is corrected based on the measurement result of the shot area where the pattern is formed. Then, from the corrected layout information, the position of the shot area where the pattern is not formed is obtained. Then, a pattern can be formed in the remaining shot area based on the position of the corrected shot area.

From the position information obtained in this way, the linear component of the array of the shot region in which the pattern is already formed by imprinting is calculated. The calculated linear component of the shot region is reflected in the linear correction of the positions of the shot regions 22A, 23A, 24A to which the pattern is not formed by imprinting. By reflecting in the linear correction of the position of the shot area where the pattern is not formed by imprint, it is possible to prevent the shot area where the pattern has already been formed by imprint and the shot which will form the pattern by imprint from overlapping. It will be possible. That is, it is possible to prevent the mold from coming into contact with the pattern already formed by imprinting, and to prevent the mold from being damaged.

(Example 2)
Next, in the second embodiment, a case where a linear component and a non-linear component are corrected with respect to the carried-in substrate when the carried-out substrate is carried in again in the middle of forming a pattern on the substrate will be described. In the second embodiment, a case where linear correction is performed and then non-linear correction is performed will be described. That is, when it is determined that the non-linear correction is performed on a part of the shot region where the pattern is formed in S18 (YES in S18), the non-linear deviation after the linear component correction which is the non-linear component correction is measured. Process (S19). In the correction of the linear component, the arrangement of the shot region on the substrate is obtained by measuring a part of the shot region (sample shot region) of the shot region arranged on the substrate. On the other hand, in the correction of the non-linear component, the shot regions arranged on the substrate are individually measured, the position on the substrate is measured for each shot region, and the position information of the remaining shot regions is corrected based on the measurement result. To do.

Since the steps up to S18 are the same as those in the first embodiment, the description thereof will be omitted. Then, the non-linear component after the linear component correction obtained in S19 is measured. In S20, a correction value based on the measurement result is used as a parameter for pattern formation. Imprint processing is performed in the area where the pattern is not formed (continuous shot position), reflecting the correction that takes into account the difference between the linear component measurement result obtained in S16 and the nonlinear component measurement result obtained in S19. Start (restart).

FIG. 6 shows a position correction method and a correction state of a part of the shot area in which the pattern is formed by the above imprint sequence. FIG. 6 corrects the position of the pattern formed in a part of the shot region by the imprint sequence of the second embodiment, and forms the imprint material pattern in the remaining shot region (the region where the pattern is not formed). It is a figure which showed the method.

Here, it is assumed that the pattern has already been formed in the first shot region to the 21st shot region in the shot region on the substrate 1. The linear correction measures the position of the second, fifth, sixth, 11, 14, and 19 shot regions (measurement shot region 1a) arbitrarily selected from the shot regions from the first shot region to the 21st shot region. It is done by. The measurement shot area 1a is an arbitrarily selected shot area. Then, in the measurement shot area 1a where the position is measured, a measurement mark 1b is formed in the shot area as shown in FIG. 6B. The measurement mark 1b is a mark formed at the same time as the pattern already formed by imprinting. Then, based on the measurement results of the positions of the plurality of measurement shot areas 1a, the position information (arrangement state) of the shot areas in which the patterns are already formed arranged on the substrate is obtained. For example, by detecting a plurality of measurement marks 1b formed in each of the plurality of shot regions and statistically processing the detection results, it is possible to obtain the arrangement state of the shot regions in which the pattern has already been formed. The position information of the remaining shot areas can be corrected from the obtained shot area arrangement state. Here, the linear component of the shot array is calculated, and the calculated linear component of the shot region is reflected in the linear correction of the positions of the shot regions 22A, 23A, 24A to which the pattern is not formed by imprinting.

Further, in the second embodiment, the non-linear component of the array of the 15th to 19th shot regions in which the pattern is already formed by the imprint sequence is formed in the measurement shot region 1a also shown in FIG. 6B, and the measurement mark 1b is formed. It is calculated from the measurement result of. The position of each shot region is determined by detecting the alignment mark formed on the substrate for each shot region by the detection unit 11. Further, regardless of the detection unit 11 that detects the alignment mark via the mold 5, the scope may be provided so that the alignment mark formed on the substrate can be detected directly without the intervention of the mold. Then, the difference from the linear component of the shot region calculated earlier is reflected in the non-linear correction of the position of the shot region (22A, 23A, 24A to) where the pattern is not formed by imprinting (from the middle). By reflecting it in the non-linear correction, it is possible to prevent the shot region in which the pattern has already been formed by imprint and the shot in which the pattern will be formed by imprint from overlapping. That is, it is possible to prevent the mold from coming into contact with the pattern already formed by imprinting, and to prevent the mold from being damaged.

(Example 3)
Next, in the third embodiment, a case where a non-linear component is corrected for the carried-in substrate when the carried-out substrate is carried in again in the middle of forming a pattern on the substrate will be described. The third embodiment is a case where the linear correction is not performed in S15 (linear correction is OFF) as a result of checking the parameters again in S14. When the linear correction is not performed (NO in S15) and the non-linear correction is performed (YES in S21), the non-linear component measurement for measuring the non-linear deviation is performed in S22. In order to reflect only the correction value of the non-linear component measured in S22, the correction value based on the measurement result in S23 is used as a parameter for pattern formation. Imprinting is started (restarted) from the continuous shot position, reflecting the correction that takes into account the result of the nonlinear component measurement obtained in S22.

FIG. 7 shows a position correction method and a correction state of a part of the shot area in which the pattern is formed by the above imprint sequence. FIG. 7 is a diagram showing a method of correcting the position of the pattern formed in a part of the shot area by the imprint sequence of Example 3 and forming the pattern of the imprint material in the remaining shot area.

Here, it is assumed that the pattern has already been formed in the first shot region to the 21st shot region in the shot region on the substrate 1. In the non-linear correction, among the shot regions from the first shot region to the 21st shot region, the non-linear component of the position (array) of the 15th to 19th shot regions is measured as in FIG. 6 (b) of the second embodiment. It is calculated from the measurement result of the measurement mark 1b formed in the region 1a. The calculated non-linear component of the position (array) of the shot area where the pattern is already formed by imprint, and the position of the shot area (22A, 23A, 24A ~) where the pattern is not formed by imprint (from the middle). It is reflected in the non-linear correction of. In this way, when performing nonlinear correction, it is desirable to detect the pattern or mark of the shot region adjacent to the region where the pattern is not formed on the substrate among the shot regions where the pattern is already formed.

By reflecting it in the non-linear correction, it is possible to prevent the shot region in which the pattern has already been formed by imprint and the shot in which the pattern will be formed by imprint from overlapping. That is, it is possible to prevent the mold from coming into contact with the pattern already formed by imprinting, and to prevent the mold from being damaged.

(Example 4)
Next, a case will be described in which a part of the patterns on the substrate that has been carried in again corrects the linear component with respect to the substrate formed by correcting the non-linear component. In the fourth embodiment, the substrate on which the pattern is formed in a part of the substrate by such an imprint sequence is linearly corrected in S15, and the pattern is formed without performing the non-linear correction in S18. Imprint is started (restarted) from the continuous shot position, reflecting the correction value calculated at the same time as the correction value of the non-linear component and the correction value of the linear component by measuring the non-linear component for the shot region where the pattern has already been formed by imprint. do. This is an exceptional case of the flowchart shown in FIG.

FIG. 8 shows a position correction method and a correction state of a shot region in which a pattern is formed on a part of the substrate by the above imprint sequence. FIG. 8 shows a method of correcting the position of a shot region (pattern) formed in a part of the substrate by the imprint sequence of the fourth embodiment and forming a pattern in the remaining region where the pattern is not formed on the substrate. It is a figure shown.

Here, it is assumed that the pattern has already been formed in the first shot region to the 21st shot region in the shot region on the substrate 1. Of the shot regions in which the pattern is formed by imprinting, the positions of the 15th to 19th shot regions are measured by measuring the measurement mark 1b formed in the shot region 1a as in FIG. 6 (b) of the second embodiment. Calculate from the result.

In this way, among the shot regions in which the pattern is partially formed on the substrate, the pattern is already formed by measuring the position of the shot region adjacent to the region in which the pattern is not formed on the substrate. The non-linear component of the position of the existing pattern can be obtained. The shot area for measuring the position of the pattern is not limited to the 15th to 19th shot areas, and the positions of other shot areas may be obtained.

From the calculated non-linear component of the position of the shot region where the pattern is already formed, the correction value of the position of the pattern (22A, 23A, 24A ~) formed in the region on the substrate where the pattern is not formed by imprinting. Reflect in. A linear correction value is calculated so that the positions of the shot areas (22A, 23A, 24A to) starting (restarting) from the middle do not overlap with the shot areas in which the pattern has already been formed by imprinting. By reflecting the linear correction value in the shot area (22A, 23A, 24A ~) to be imprinted, it is possible to prevent the shot area in which the pattern has already been formed by imprint and the shot in which the pattern will be formed by imprint from overlapping. Becomes possible. That is, it is possible to prevent the mold from coming into contact with the pattern already formed by imprinting, and to prevent the mold from being damaged.

(Example 5)
On the other hand, when the board carried out in the middle of forming a pattern on the board is carried in again, neither the correction of the linear component nor the correction of the non-linear component may be performed on the carried-in board. The fifth embodiment is a case where the linear correction is not performed in S15 (linear correction is OFF) and the non-linear correction is not performed in S21 (non-linear correction is OFF) as a result of checking the parameters again in S14. At this time, the normal imprint processing is not performed (S25). If linear correction and non-linear correction are not performed, the shot area where the pattern is formed may overlap with the mold. The normal imprinting process is not performed because the mold may stick up on the cured portion of the shot area where the pattern is formed and the mold may be damaged. At this time, the imprinting apparatus may indicate that imprinting is not possible.

(Explanation of manufacturing method of goods)
The pattern of the cured product formed by using the imprint device 100 is used permanently for at least a part of various articles or temporarily when producing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for imprinting.

The pattern of the cured product is used as it is as a constituent member of at least a part of the above-mentioned article, or is temporarily used as a resist mask. The resist mask is removed after etching, ion implantation, or the like in the substrate processing process.

Next, a specific manufacturing method of the article will be described. As shown in FIG. 9A, a substrate 1z such as a silicon wafer on which a work material 2z such as an insulator is formed on the surface is prepared, and subsequently, a substrate 1z such as a silicon wafer is introduced into the surface of the work material 2z by an inkjet method or the like. The printing material 3z is applied. Here, a state in which a plurality of droplet-shaped imprint materials 3z are applied onto the substrate is shown.

As shown in FIG. 9B, the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side on which the uneven pattern is formed facing. As shown in FIG. 9C, the substrate 1 to which the imprint material 3z is applied is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the work material 2z. In this state, when light is irradiated through the mold 4z as energy for curing, the imprint material 3z is cured.

As shown in FIG. 9D, when the mold 4z and the substrate 1z are separated from each other after the imprint material 3z is cured, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. The pattern of the cured product has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product and the concave portion of the mold corresponds to the convex portion of the cured product, that is, the uneven pattern of the mold 4z is transferred to the imprint material 3z. It will be done.

As shown in FIG. 9E, when etching is performed using the pattern of the cured product as an etching resistant mask, the portion of the surface of the work material 2z that has no cured product or remains thin is removed, and the groove 5z is formed. Become. As shown in FIG. 9 (f), when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the work material 2z can be obtained. Here, the pattern of the cured product is removed, but it may not be removed even after processing, and may be used, for example, as a film for interlayer insulation contained in a semiconductor element or the like, that is, as a constituent member of an article.

The above-described invention is highly effective when a pattern is formed on the first layer (a substrate on which an underlying pattern is not formed) on a substrate by using an imprinting apparatus. When the pattern is not formed on the substrate, it is necessary to form the pattern on the remaining area on the substrate on which the pattern is not formed by measuring the position of the pattern on which the pattern is already formed on the substrate. be.

The imprinting apparatus of the present invention inserts an adjacent shot area into a pattern already formed in an imprinted shot area on a substrate in which a pattern is formed only in a part of the shot area on the substrate. It is possible to prevent the mold to be printed from coming into contact with each other. Therefore, for the substrate (the substrate on which the pattern is partially formed) that has been carried into the imprinting apparatus again, the mold does not ride on (contact) the shot region where the pattern has already been formed, and the pattern is formed. Can be resumed.

Further, when the underlying pattern is formed, even if the substrate on which a part of the pattern is formed is carried into the imprinting apparatus, the alignment is performed by detecting the mark formed on the underlying pattern. be able to. On the other hand, the present invention can be applied even when a pattern is formed on the base but no mark is formed in the shot region, or when the mark cannot be detected. By measuring the position of the pattern on which the pattern is already formed on the substrate, the pattern formation is restarted in the region where the pattern is not formed on a part of the substrate regardless of the state of the underlying pattern. be able to.

Furthermore, rather than imprinting according to the underlying pattern, it is better to form the pattern according to the correction value of the pattern position (arrangement) obtained by statistical processing from the position of the pattern formed on a part of the substrate. The present invention can also be applied in good cases. For example, it is a case where it is desired to detect a mark formed in a part of a shot region and form a pattern according to an array of positions at which a pattern obtained by global alignment is formed. As described above, the imprinting apparatus of the present invention is not limited to the case where the pattern is formed on the first layer on the substrate, but also includes the case where the pattern is formed by the imprinting process on the substrate on which the pattern is formed on the substrate. ..

In the present invention, a correction value for correcting the position where the pattern is formed in the region where the pattern is not formed is obtained from the position where the pattern is already formed, and the region where the pattern is not formed is determined based on the correction value. Resume pattern formation. This correction value can be used to align the substrate and the mold when the mold is brought into contact with the imprint material on the substrate. Further, in order to correct the position of the region forming the pattern, it is necessary to correct the supply position of the imprint material supplied on the substrate. Therefore, the obtained correction value may be used to correct the coating position when the coating mechanism 8 coats the imprint material on the substrate.

In the above-described embodiment, the present invention has described the case where a pattern is formed by an imprint device, but none of the examples is limited to the imprint device. For example, a pattern forming apparatus other than the imprinting apparatus may be used, such as a projection exposure apparatus that projects a pattern formed on an original plate onto a substrate by a projection optical system and transfers the pattern.

As described above, the imprinting apparatus of the present invention measures the position (arrangement) of the shot region in which the pattern is formed on a part of the substrate by measuring an arbitrary mark formed in the shot region in which the pattern is formed. ) Is calculated. Based on the calculated position (arrangement) of the shot area, a pattern is formed in the remaining shot area (the shot area in which the imprint pattern is not formed). Even when the substrate carried out in the middle of pattern formation is carried into the imprinting apparatus again and the imprinting process is restarted for the remaining shot area, the alignment formed in the shot area where the pattern is formed. Detect the mark. In particular, by detecting the alignment mark formed in the shot area adjacent to the shot area in which the pattern is not formed, the imprint process can be restarted in the shot area adjacent to the shot area in which the pattern is formed. .. By measuring the alignment mark formed in the shot area adjacent to the shot area where the pattern is not formed, the position (array) of the adjacent shot area is calculated so that the positions where imprinting is started do not overlap. The position can be corrected to.

100 Imprint device 1 Board 2 Board holding part 3 Board driving mechanism 5 Mold 8 Coating mechanism 11 Detection part 12 Control part

Claims (9)

Each of the plurality of shot areas on the substrate based on the layout information position is set in the plurality of shot areas that form a pre-patterned, a imprint method of forming a pattern of the imprint material using a mold ,
It is determined based on various operation parameters during the imprint operation on the substrate whether the substrate carried in so as to be held by the holding portion is a substrate in which the imprint material pattern is formed only in a part of the shot area. And the process to do
In the step of the determination, when it is determined that the substrate on which a pattern is formed of only the imprint material to a portion of the shot area Oite, the pattern of the partial shot area by linear components and / or nonlinear components or formed based on the corrected layout information, the confirmed on the basis of various operating parameters, a position corresponding to the components used in the correction of the verified layout information pattern of the imprint material The process of measuring the position and
A step of correcting the position based on the measurement result of the position of the pattern of the imprint material, is pre-set pattern of layout information is formed,
Based on the layout information corrected in the correction step, the imprint material pattern is formed by using a mold in each of the shot regions where the imprint material pattern of the substrate held by the holding portion is not formed. An imprinting method comprising: The step of measuring the position of the pattern of the imprint material is that the imprint material is adjacent to a region of the pattern formed on a part of the substrate on which the pattern of the imprint material is not formed. The imprint method according to claim 1, further comprising a step of measuring the position of the pattern. The imprint method according to claim 1 or 2, wherein the step of measuring the position of the pattern of the imprint material includes a step of detecting an alignment mark of a shot region formed on the substrate. In the step of measuring the position of the pattern of the imprint material, a plurality of alignment marks formed in each of the plurality of shot regions are detected, and the detection results are statistically processed to form a part of the substrate. Find the arrangement of the shot areas where the pattern of the imprint material is formed.
The imprint method according to claim 3, wherein the arrangement of the shot regions in which the pattern on the substrate is not formed is obtained based on the obtained arrangement of the shot regions. The step of measuring the position of the pattern of the imprint material is according to any one of claims 1 to 4, wherein the position of the edge of the pattern of the imprint material formed on the substrate is detected. Imprint method. The pattern formed on a part of the substrate and the pattern formed on the region where the pattern of the imprint material on the substrate is not formed are the patterns formed on the first layer on the substrate. The imprint method according to any one of claims 1 to 5, characterized in that. Based on the measurement result of the position of the pattern obtained in the step of measuring the position of the pattern of the imprint material, the position of the shot region where the pattern of the imprint material is not formed on the substrate is corrected, and the above is described. The imprint method according to claim 3, wherein the imprint material is supplied onto the substrate. A step of forming a pattern in a region where a pattern of an imprint material is not formed on a substrate by using the imprint method according to any one of claims 1 to 7.
A step of processing the substrate on which the pattern is formed in the step and a step of processing the substrate.
A method of manufacturing an article, which comprises. An imprinting device that forms a pattern of imprinting material on a substrate using a mold.
A holding part that holds the board and
A detection unit that detects the position of the pattern of the imprint material formed on the substrate held by the holding unit, and a detection unit that detects the position of the pattern of the imprint material.
To each of the plurality of shot areas on the substrate based on the set layout information positions of the plurality of shot areas that form a pre-patterned, control unit for controlling so as to form a pattern of the imprint material using a mold And with
Wherein the control unit substrate carried on so that is held by the holding unit, if it is a substrate on which the pattern of the imprint material is formed only on a part of the shot areas, various time imprinting operation with respect to the substrate When the judgment is made based on the operation parameters, it is confirmed based on the various operation parameters whether the pattern of the partial shot region is formed based on the layout information corrected by the linear component and / or the non-linear component. detection unit is detecting the position of the pattern of the imprint material is formed corrected a position corresponding to the components used in the said confirmation layout information, the imprint material pattern of the detection unit detects position based on the location, the corrected position preset pattern is formed in the layout information, the based on the corrected layout information, the shot pattern of the imprint material is not formed region of the substrate A mold is used to control each of the imprinted materials to form a pattern.
An imprinting device characterized by this.

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