JP6913367B2 - Trowel temperature measuring device - Google Patents

Description

The present invention relates to a trowel temperature measuring device used to detect the temperature of the trowel tip of the solder trowel when soldering using the trowel.

When soldering a portion (to be soldered) to be soldered between a printed circuit board and an electronic component, a soldering iron as disclosed in Patent Document 1 is used. The soldering iron has a trowel tip that comes into contact with the soldering target and heats the soldering target, a cylindrical trowel body connected to the trowel tip, and a heater that heats the trowel tip. The trowel tip is heated with a trowel tip, and the solder is melted and soldered with the heated trowel tip.

On the other hand, from the viewpoint of improving the accuracy of soldering, it is desirable to control the temperature of the tip of the soldering iron and control the tip temperature to an appropriate temperature. Therefore, conventionally, it has been generally practiced to measure the temperature of the trowel tip by using a trowel tip temperature measuring device during the soldering operation. As an example of such a trowel temperature measuring device, there is one disclosed in Patent Document 2.

The one described in Patent Document 2 has a resin case, an operation unit and a measurement unit provided on the case, and the measurement unit has a metal sensor chip at a temperature measuring contact of a thermocouple. It is attached. When measuring the temperature of the trowel, the power switch is operated to turn on the power of the temperature measuring device, and the trowel tip is brought into contact with the sensor chip to display the detected temperature of the trowel on the display screen. It is output and the tip temperature can be confirmed through the display screen.

Since the patent document 2 has a method of directly contacting the trowel tip with the sensor chip of the temperature sensor to detect the temperature of the trowel tip, the temperature of the trowel tip is detected accurately and responsively. be able to. However, when the temperature of the trowel tip is repeatedly measured, the solder debris adhering to the trowel tip accumulates on the sensor chip, and it becomes impossible to measure the trowel tip temperature accurately. For this reason, it is necessary for the workers to manually clean each time, and there is still room for improvement in terms of work efficiency.

Registered Utility Model No. 3001893 Japanese Unexamined Patent Publication No. 2013-148369

The technical subject of the present invention is to manually clean the solder adhering to the temperature detection part of the temperature sensor when measuring the temperature of the trowel in the trowel temperature measuring device for measuring the temperature of the trowel tip of the soldering iron. The purpose is to be able to do it automatically and efficiently without any problems.

In order to solve the above problems, in the present invention, the tip temperature measuring device for measuring the temperature of the tip of the soldering iron in the soldering device, and the temperature measuring device measures the temperature of the tip. The temperature sensor has a temperature sensor and a sensor purification nozzle that injects compressed air, the temperature sensor has a temperature detection unit that detects the temperature of the tip by contacting the tip, and the sensor purification nozzle has a temperature detection unit. By arranging the injection port toward the temperature detection unit, the solder dust adhering to the temperature detection unit is blown off by air.

In the present invention, the temperature sensor includes a thermocouple in which the ends of two types of metal wires are joined to each other and the joint portion is used as a temperature measuring portion, and a metal measuring portion joined to the temperature measuring portion of the thermocouple. It has a temperature chip, and the temperature detection unit is formed by the temperature measurement chip, and the temperature detection unit is arranged in a U-shaped recess surrounded by side walls on three sides, left and right and rear. A solder debris discharge port for discharging the solder debris blown from the temperature detection unit to the outside is formed on the front side of the recess where the side wall is not formed, and the sensor purification nozzle is described in the sensor purification nozzle. The injection port may be arranged on the rear side wall side in a posture facing the solder waste discharge port side.
At this time, the temperature measuring tip is made of a plate-shaped member having a flat surface, and is supported by an elongated strip-shaped support member, and the support member is soldered to the rear side wall in the recess. It is preferable that the components are arranged at an intermediate position with the waste discharge port in a posture in which the longitudinal direction faces the left and right side wall directions.
Further, the temperature sensor and the sensor purification nozzle may be arranged on a common base plate.

In the trowel temperature measuring device of the present invention, air is injected from the injection port of the sensor purification nozzle toward the temperature detection unit that measures the trowel temperature, and the solder debris adhering to the temperature detection unit is blown with air. It is configured to blow away. Therefore, when measuring the temperature of the trowel tip, the work of removing the solder adhering to the temperature detection unit can be efficiently performed without the manual work of the operator.

It is an external perspective view which shows one Embodiment of the trowel temperature measuring apparatus which concerns on this invention. It is a top view of the trowel temperature measuring apparatus. It is a front view of FIG. It is a side view of FIG. It is an enlarged view of the main part which shows the temperature sensor which measures the temperature of a trowel tip.

1 to 5 show an embodiment of a trowel temperature measuring device according to the present invention. The tip temperature measuring device 20 is incorporated in a part of an automatic soldering device that automatically performs soldering, and measures the temperature of the tip 1a of the soldering iron 1 during the soldering process.

The soldering apparatus includes the solder trowel 1 having a trowel tip 1a, a solder supply nozzle 4 that supplies the linear solder 3 to the trowel tip 1a, and a trowel that removes solder adhering to the trowel tip 1a between soldering. It has a tip cleaner 5, the trowel tip temperature measuring device 20, and a control device 16 that controls the entire soldering device according to a set program.

The solder trowel 1 is detachably attached to a work arm (not shown). The solder trowel 1 has a cylindrical trowel body portion 1b made of a metal such as stainless steel, and the trowel tip 1a that is replaceably attached to the trowel body portion 1b. Further, the solder trowel 1 heats the trowel tip 1a by a heater built in the trowel body 1b, melts the linear solder 3 sent from the solder supply nozzle 4 into the trowel tip 1a, and supplies the solder to the object to be soldered. It is configured to solder the object to be soldered.

The solder supply nozzle 4 is located near the solder trowel 1 via a holder in a state where the tip of the solder supply nozzle 4 is arranged near the trowel tip 1a and is inclined with respect to the central axis of the solder trowel 1. It is arranged. The solder supply nozzle 4 is configured to supply the linear solder 3 sent from a solder supply device (not shown) through a tube from the tip of the solder supply nozzle 4 toward the trowel tip 1a.

The trowel cleaner 5 includes a rectangular box-shaped cleaner case 6 having an open upper surface, a lid 9 detachably attached to the upper surface of the cleaner case 6, and a trowel purification nozzle that injects compressed air. It has 15 and.
In the cleaner case 6, a nozzle insertion port 8 is provided on the front surface 6a located on one end side in the longitudinal direction of the cleaner case 6, and the injection port 15a of the tip purification nozzle 15 is provided through the nozzle insertion port 8. Is inserted inside the cleaner case 6. Further, the lid 9 is provided with a trowel tip insertion port 10 on one end side in the longitudinal direction of the lid 9, and the trowel tip 1a of the solder trowel 1 and the tip of the solder supply nozzle 4 pass through the trowel tip insertion port 10. It is inserted inside the cleaner case 6.

Further, the trowel cleaner 5 includes a bracket 12 attached to the front surface 6a of the cleaner case 6 by a fixing means such as a bolt, a rod 13 having a lower end fixed to the bracket 12, and an upper end portion of the rod 13. The holder 14 is fixed to the holder 14, and the trowel purification nozzle 15 is attached to the holder 14 so that the inclination angle around the horizontal axis and the direction around the vertical axis can be adjusted. .. A connection port 15b to which an air pipe is connected is provided on the base end side of the trowel purification nozzle 15, one end of the air pipe is connected to the connection port 15b, and the other end of the air pipe is compressed air. Is connected to an air supply device (not shown) such as an air tank for supplying the air.

When the trowel tip 1a is inserted into the trowel cleaner 5 through the trowel tip insertion port 10 of the lid 9, compressed air is supplied from the air supply device to the trowel purification nozzle 15, and the trowel purification nozzle is supplied. Compressed air is injected from the injection port 15a of the 15 toward the trowel tip 1a, and the solder debris adhering to the trowel tip 1a is peeled off. The solder debris peeled off from the tip 1a by the compressed air falls into a collection container such as a tray arranged at the bottom of the cleaner case 6 and is collected.

The control device 16 stores an operation program or the like required for automatic soldering, and when an operation start button provided at a predetermined position of the soldering device is pressed, soldering is performed according to the set program. The soldering of the object to be attached and the temperature measurement of the trowel tip 1a by the trowel tip temperature measuring device 20 are all automatically performed.

Next, the trowel tip temperature measuring device 20 will be described. The temperature measuring device 20 has a temperature sensor 22 that measures the temperature of the tip 1a, and a sensor purification nozzle 21 that injects compressed air from an injection port 21a at the tip toward the temperature sensor 22.

As shown in FIG. 5, the temperature sensor 22 includes a thermocouple 23 in which the ends of two different types of metal wires 23a and 23b are joined to each other and the joint is used as a temperature measuring unit 24, and the thermocouple. A metal temperature measuring tip 22a joined to the temperature measuring section 24 of 23 by welding is provided, a temperature detecting section is formed by the temperature measuring tip 22a, and the tip 1a is attached to the temperature detecting section. It is configured to detect the temperature of the tip 1a by contacting it. Therefore, in the following description, the temperature detection unit may be designated by the same reference numeral “22a” as the temperature measuring chip.
The temperature measuring chip 22a is a disk-shaped member having a flat outer surface, and is supported by an elongated strip-shaped support member 25 so that the outer surface is exposed to the outside, and the temperature is formed on the outer surface. A detection unit is formed (see FIGS. 1 and 2).

The temperature sensor 22 is attached to a hollow sensor holder 26 having a rectangular shape in a plan view, and is mounted on the base plate 37 via the sensor holder 26.
The sensor holder 26 is formed in a pyramid shape by sequentially placing the first, second, and third support plates 28, 29, and 30 whose areas are gradually reduced on the upper surface of the base 27, and is formed in the uppermost stage. A sensor support portion 31 that supports the temperature sensor 22 is arranged on the support plate 30.

The sensor support portion 31 is surrounded on three sides by a bottom plate 31a, left and right side walls 31b and 31b rising from the bottom plate 31a, a rear side wall 31c, and the left and right side walls 31b and 31b and a rear side wall 31c. For discharging the solder debris blown from the temperature detection unit 22a by the sensor purification nozzle 21 to the front portion having the character-shaped recess 32 and the side walls 31b and 31b of the recess 32 not being formed. A solder scrap discharge port 33 is formed.

Further, the support member 25 has a posture in which the longitudinal direction of the support member 25 is directed to the left and right side walls 31b and 31b at an intermediate position between the rear side wall 31c inside the recess 32 and the solder waste discharge port 33. The temperature detection unit 22a is arranged at the center of the support member 25 in the longitudinal direction.
The ends of the two metal wires 23a and 23b of the thermocouple 23 are connected to the communication cable 36 inside the sensor holder 26, and are connected to the control device 16 through the communication cable 36.

On the other hand, the sensor purification nozzle 21 is supported by the nozzle support mechanism 38 at a position opposite to the solder waste discharge port 33 in the recess 32, that is, at a position on the rear side wall 31c side, so that the sensor purification nozzle 21 is rearward. The injection port 21a is arranged above the side wall 31c so as to face the temperature detection unit 22a of the temperature sensor 22. The base end side of the sensor purification nozzle 21 has a connection port 21b connected to an air supply source, and the air supplied from the air supply source to the connection port 21b detects the temperature from the injection port 21a at the tip. It is configured to be jetted toward the portion 22a. The air supply source connected to the sensor purification nozzle 21 may be the same as or different from the air supply source connected to the trowel purification nozzle 15.

The nozzle support mechanism 38 is arranged on the base plate 37, and the base plate 37 is connected to the side surface 6b of the trowel cleaner 5 by a mounting portion 37a. The nozzle support mechanism 38 includes a prismatic column 39 vertically rising from the base plate 37, a first rod 40 extending horizontally from the upper end of the column 39, and a bracket 41 connected to the tip of the first rod 40. A second rod 42 having a lower end connected to the bracket 41 and a nozzle holder 43 provided at the upper end of the second rod 42 are provided, and the sensor purification nozzle is attached to the nozzle holder 43. 21 is attached so that the tilt angle around the horizontal axis and the orientation around the vertical axis can be adjusted.

A case where the temperature of the tip 1a of the soldering iron 1 is measured by using the temperature measuring device 20 having the above configuration will be described. As described above, the temperature measuring device 20 is incorporated in a part of the soldering device, and measures the temperature of the trowel tip 1a in a series of soldering steps by the soldering device.

When soldering, the control device 16 is subjected to the heating target temperature of the trowel 1a by the heater built in the trowel 1, the order of soldering to a plurality of soldering targets, and the trowel tip by the temperature measuring device 20. The timing for measuring the temperature of 1a is appropriately determined. After that, by pressing the operation start switch provided in the soldering apparatus, the trowel tip 1a is heated to a predetermined heating target temperature by the heater built in the trowel body 1b, and the solder trowel 1 is heated. Moves toward the soldering target, and soldering is performed on a plurality of soldering targets.

When the set number (1 group) of soldering targets is soldered, the trowel 1 starts moving toward the trowel cleaner 5, and the trowel 1a is the trowel insertion port 10. The soldering iron 1 is lowered while being positioned directly above, and the iron tip 1a is inserted into the inside of the iron tip cleaner 5 through the iron tip insertion port 10. By doing so, air is injected from the trowel purification nozzle 15 toward the trowel tip 1a, the solder debris adhering to the trowel tip 1a at the time of soldering is peeled off, and the trowel tip 1a is cleaned.

Subsequently, the next group of soldering targets is soldered, and after the soldering of a plurality of groups of soldering targets is performed in the same manner, the temperature of the trowel tip 1a is measured by the temperature measuring device 20. NS. The measurement is performed as follows.
That is, after cleaning the trowel 1a with the trowel cleaner 5, the solder trowel 1 is moved to the position of the temperature measuring device 20 adjacent to the trowel cleaner 5, and the trowel 1a is moved to the temperature sensor 22. The solder trowel 1 is lowered while being positioned directly above the temperature detection unit 22a, and the trowel tip 1a is brought into contact with the temperature detection unit 22a. At this time, in order to eliminate the gap between the trowel tip 1a and the temperature detection unit 22a and measure the temperature of the trowel tip 1a more accurately, a small amount of linear solder 3 was supplied from the solder supply nozzle 4 to the trowel tip 1a. In this state, the trowel tip 1a is brought into contact with the temperature detection unit 22a. When the temperature measurement of the tip 1a is started, the measured temperature information is input to the control device 16 through the communication cable 36 to perform necessary information processing, and is displayed on the display means of the control device 16. NS.

At that time, the trowel tip 1a is kept in contact with the temperature detection unit 22a until the measurement temperature stabilizes, and when the measurement temperature stabilizes, the control device 16 determines that the temperature at that time is the measurement temperature. The time for keeping the trowel tip 1a in contact with the temperature detection unit 22a is usually within about 10 to 20 seconds.
Then, when the temperature of the soldering tip 1a is measured, the control device 16 compares the measured temperature with the heating target temperature set in advance in the control device 16, and the measurement temperature and the heating target temperature are compared with each other. When the difference (temperature range) from is within a certain range (for example, ± 10 ° C.), the tip 1a of the soldering iron 1 and the heater are judged to be normal, and the soldering iron 1 is used as it is for subsequent soldering. Soldering is done.
On the other hand, when the temperature range deviates from a certain range, the tip 1a of the soldering iron 1 and the heater are determined to be abnormal, an error signal is displayed, the soldering work is stopped, and the next soldering is performed. Before soldering the target, the defective member is replaced.

When the temperature measurement of the trowel tip 1a is completed, the solder trowel 1 is raised to separate the trowel tip 1a from the temperature detection unit 22a, and compressed air is injected from the sensor purification nozzle 21 toward the temperature detection unit 22a. .. As a result, the solder debris adhering to the temperature detection unit 22a is blown off by the jet flow of the air, and is removed through the solder debris discharge port 33. At this time, a dust collection box may be arranged in front of the solder waste discharge port 33 so that the blown-out solder dust can be collected in the dust collection box.

As a result, the temperature detection unit 22a is kept in a clean state, so that the next temperature measurement can be performed with high accuracy. Further, since it is not necessary for the worker to manually perform the cleaning work of the temperature detection unit 22a using a cloth or the like, the cleaning work can be performed very easily, reliably and quickly, and this temperature detection can be performed. Further automation of the soldering process can be achieved, including cleaning of the portion 22a.

The trowel temperature measuring device 20 can also be used when measuring the trowel temperature of a soldering iron of a hand-held soldering device. Further, the trowel tip temperature measuring device 20 is provided with a switch at an appropriate position thereof, and after the temperature of the trowel tip 1a is measured, the sensor purification nozzle 21 is connected to the temperature detection unit 22a by operating this switch. It can also be configured to inject air towards.

1 Solder trowel 1a Trowel tip 20 Trowel temperature measuring device 21 Sensor purification nozzle 21a Injection port 22 Temperature sensor 22a Temperature detector (temperature measuring chip)
31b, 31c Side wall 33 Solder waste outlet 37 Base plate

Claims (4)

A tip temperature measuring device for measuring the temperature of the tip of a soldering iron in a soldering device, the temperature measuring device includes a temperature sensor for measuring the temperature of the tip and a sensor purification nozzle for injecting compressed air. And have
The temperature sensor has a temperature detection unit that detects the temperature of the trowel tip by bringing the trowel tip into contact with the trowel tip.
The sensor purification nozzle is configured to blow off solder debris adhering to the temperature detection unit with air by arranging the injection port toward the temperature detection unit.
A trowel temperature measuring device characterized by this. The temperature sensor includes a thermocouple in which the ends of two types of metal wires are joined to each other and the joint portion is used as a temperature measuring portion, and a metal temperature measuring chip bonded to the temperature measuring portion of the thermocouple. The temperature detection unit is formed by the temperature measuring chip.
The temperature detection unit is arranged in a U-shaped recess surrounded by side walls on three sides, left and right and rear, and is blown off from the temperature detection unit on the front side of the recess where the side wall is not formed. A solder scrap discharge port is formed to discharge the solder scraps to the outside.
The sensor purification nozzle is arranged on the rear side wall side in a posture in which the injection port faces the solder waste discharge port side.
The trowel temperature measuring device according to claim 1. The temperature measuring tip is made of a plate-shaped member having a flat surface, and is supported by a support member having an elongated strip-shaped shape, and the support member is the rear side wall and a solder debris discharge port in the recess. It is arranged at an intermediate position with and in a posture in which the longitudinal direction faces the left and right side wall directions.
The trowel temperature measuring device according to claim 2. The temperature sensor and the sensor purification nozzle are arranged on a common base plate.
The trowel temperature measuring device according to any one of claims 1 to 3.

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