JP6902964B2 - How to operate micromechanical sensor devices, sensor devices and micromechanical sensor devices that detect external magnetic fields - Google Patents

Description

The present invention relates to a micromechanical sensor device for detecting an external magnetic field, a micromechanical sensor device, and a method of operating the micromechanical sensor device.

Conventional Techniques Various measuring methods for specifying the strength of a magnetic field or the three-dimensional orientation are known. For example, Japanese Patent Application Publication No. 102010061780 (DE102010061780A1) discloses a micromechanical magnetic field sensor that includes three sensor elements. These three sensor elements are arranged so that the orientation of the three-dimensional magnetic field can be specified.

The cost of manufacturing reluctance sensors, especially Hall sensors, that are often used is extremely low, but is often inadequate due to sensitivity. On the contrary, relatively sensitive sensors are often susceptible to external shocks or vibrations.

German Patent Application Publication No. 102010061780

Disclosure of the Present Invention The present invention has a micromechanical sensor device for detecting an external magnetic field having the configuration described in the feature portion of claim 1 and a micromechanical having the configuration described in the feature portion of claim 8. Disclosed is a sensor device and an operating method of a micromechanical sensor device having the configuration described in the feature portion of claim 10.

Therefore, the present invention relates to a micromechanical sensor device that detects an external magnetic field in the first aspect. This micromechanical sensor device has a substrate, a first carrier mechanism, a second carrier mechanism, and a coupling mechanism. The first carrier mechanism includes a magnet mechanism, and the interaction between the external magnetic field and the magnet mechanism causes the first carrier mechanism to rotate about the first rotation axis relative to the substrate. It is attached to the board so that it can move. The second carrier mechanism is also attached to the substrate and is rotatable about the second rotation axis relative to the substrate. Here, the second rotation axis is parallel to the first rotation axis. The binding mechanism connects the first carrier mechanism to the second carrier mechanism as follows. That is, the rotation of the first carrier mechanism about the first rotation axis and the rotation of the second carrier mechanism about the second rotation axis are in opposite directions of rotation. It is possible and connected so that it is blocked in the same direction of rotation.

Therefore, the present invention relates to a micromechanical sensor device in another aspect. This micromechanical sensor device has at least three micromechanical sensor devices. Each of these micromechanical sensor devices differs in the orientation of each magnet mechanism and / or the orientation of each first rotation axis.

Therefore, in another aspect, the present invention relates to a method of operating a micromechanical sensor device that detects an external magnetic field. Here, the rotation angle of the first carrier mechanism and / or the rotation angle of the second carrier mechanism is measured, and the strength and / or orientation of the external magnetic field is specified based on the measured rotation angle. To do.

An advantageous embodiment is a constituent requirement of each dependent claim.

Advantages of the present invention An external shock or vibration causes a rotational moment, which acts similarly on the first carrier mechanism and the second carrier mechanism. That is, in the absence of the coupling mechanism, the rotation of the first carrier mechanism and the rotation of the second carrier mechanism around the first rotation axis or the second rotation axis in the same rotation direction Will be triggered. However, such rotational movement is blocked by the coupling mechanism. In this way, the rotation of the first carrier mechanism or the second carrier mechanism due to an external impact or vibration is blocked, or at least suppressed. Therefore, an external shock or vibration will not be interpreted as an action of an external magnetic field, and an erroneous signal will not be generated.

On the contrary, the first carrier mechanism may be displaced by the external magnetic field. In this case, the rotation is advantageously transmitted or mediated by the coupling mechanism in the direction opposite to the second carrier mechanism. Therefore, the external magnetic field causes rotation of the first or second carrier mechanism, and this rotation is measured, whereby the magnitude or orientation of the external magnetic field can be specified.

The present invention makes it possible to suppress the influence of external vibration or shock, thereby increasing the accuracy and robustness of the sensor device.

In an advantageous evolution of the micromechanical sensor device, the coupling mechanism has a connection section that is non-shrinkable and advantageously non-stretchable. This connection section is rotatably connected to the first carrier mechanism and the second carrier mechanism. Advantageously, this connecting section is oriented perpendicular to the first rotation axis. Since the connecting section cannot be contracted or stretched, rotation in the same rotation direction is prevented. This is because such rotation will crush or pull away the non-shrinkable connecting sections. On the contrary, this swivel suspension allows some displacement, so that it can rotate in the opposite direction of rotation.

In another embodiment of the micromechanical sensor device, the coupling mechanism has a connecting section oriented parallel to the first rotation axis. This connecting section is twistable, but does not deviate or bend.

Advantageously, the coupling mechanism is configured as follows. That is, the rotation of the first carrier mechanism due to the interaction between the external magnetic field and the magnet mechanism is transmitted to the second carrier mechanism. Here, the rotation direction of the second carrier mechanism is opposite to the rotation direction of the first carrier mechanism. Therefore, the magnitude or orientation of the external magnetic field can be specified by measuring the rotation angle of the first or second carrier mechanism.

In an advantageous development of the micromechanical sensor device, when the first carrier mechanism and the second carrier mechanism are in an undisplaced stationary position, the non-shrinkable and non-stretchable connection section is the first. It is located on a plane perpendicular to the connecting line between the first rotation center of the carrier mechanism and the second rotation center of the second carrier mechanism. Based on such an arrangement configuration, a contraction force acts on the connecting section during the rotational movement in the same rotational direction. However, since the connecting section cannot be contracted or stretched, rotation in the same rotation direction is prevented. During the rotational movement of the first or second carrier mechanism in the opposite direction of rotation, the coupling mechanism is swung relative to the stationary position, but is not contracted or stretched, so that such rotational movement. Is kept possible.

In a favorable development, the micromechanical sensor device has a measuring device. This measuring device is configured to measure the rotation angle of the first carrier mechanism and / or the second carrier mechanism. The measuring device is advantageously configured to determine the magnitude and / or orientation of the external magnetic field based on the measured angle of rotation.

In an advantageous embodiment of the micromechanical sensor device, the measuring device is at least partially located on the first carrier mechanism and / or the second carrier mechanism.

In another embodiment of the micromechanical sensor device, the measuring device comprises an electrode located on a substrate and a counter electrode located on a first carrier mechanism and / or a second carrier mechanism. By measuring the change in the potential difference between the electrode and the counter electrode, the rotation angle of the first carrier mechanism or the second carrier mechanism or the magnitude or orientation of the external magnetic field can be specified.

In an advantageous embodiment of the micromechanical sensor device, the north and south axes of the magnet mechanism are oriented parallel to the substrate.

In an advantageous embodiment of the micromechanical sensor device, the micromechanical sensor device has an evaluation mechanism. This evaluation mechanism measures each rotation angle of the first carrier mechanism and / or the second carrier mechanism of at least three micromechanical sensor devices, and based on the measured rotation angle, the strength of the external magnetic field. And / or configured to identify orientation. Therefore, the present invention provides a three-dimensional magnetic sensor.

The schematic plan view of the micromechanical sensor device according to 1st Embodiment. The schematic perspective view of the micromechanical sensor device shown in FIG. Schematic plan view of the micromechanical sensor device shown in FIG. 1 showing the effect of an external magnetic field. The schematic plan view of the micromechanical sensor device shown in FIG. 1 showing the effect of impact on the micromechanical sensor device. Schematic plan view of a micromechanical sensor device according to another embodiment. A schematic plan view of a micromechanical sensor device according to an embodiment of the present invention.

In all drawings, the same or functionally equivalent elements and devices are numbered the same. As long as it is advantageous, different embodiments can be arbitrarily combined with each other.

Description of Examples A micromechanical sensor device 1a according to an embodiment of the present invention is shown in FIG. 1 in a schematic plan view and in FIG. 2 in a schematic perspective view. The micromechanical sensor device 1a preferably has a substrate 2 made of silicon, where the first carrier mechanism 3 uses a first spring beam (Federbalken) 8a to make a first columnar connection. It is attached to the section or the first substrate anchor 7a, is further connected to the substrate 2 via the first substrate anchor 7a, and is attached at intervals from the substrate 2.

Further, the second carrier mechanism 5 is fixed to the second columnar connection section or the second substrate anchor 7b via the second spring beam 8b, and further, the substrate is fixed to the substrate via the second substrate anchor 7b. It is connected to 2 and is arranged at a distance from the substrate 2. The first carrier mechanism 3 or the second carrier mechanism 5 extends the first rotation axis A1 or the second rotation axis A2 extending through the first substrate anchor 7a or the second substrate anchor 7b. It is rotatable or displaceable in the center. The first rotation axis A1 extends parallel to the second rotation axis A2 along the z-axis line and extends in the xy plane with respect to the substrate surface of the substrate 2. It extends vertically. The first substrate anchor 7a forms the first rotation center 7a of the first carrier mechanism 3, and the second substrate anchor 7b is the corresponding second rotation center 7b of the second carrier mechanism 5. To form.

The first carrier mechanism 3 has a magnet mechanism 4. The N-pole and S-pole axes of the magnet mechanism 4 extend along the x-axis. The x-axis extends parallel to the substrate and, in an undisplaced stationary position, parallel to the second carrier mechanism 5. The connecting line between the first substrate anchor 7a and the second substrate anchor 7b extends parallel to the y-axis and perpendicular to the x-axis.

The first carrier mechanism 3 has a first protrusion 10a, and the second carrier mechanism 5 has a second protrusion 10b. These protrusions project parallel to the connecting line between the first substrate anchor 7a and the second substrate anchor 7b. The coupling mechanism 6 in the form of a non-shrinkable and non-stretchable connecting section is connected to the first protruding portion 10a and the second protruding portion 10b. Here, the coupling mechanism 6 is rotatable or flexible relative to the first protrusion 10a or the second protrusion 10b. The coupling mechanism 6 extends parallel to the substrate surface of the substrate 2 and perpendicular to the connecting line between the first substrate anchor 7a and the second substrate anchor 7b. .. Therefore, the coupling mechanism 6 is located on a surface extending perpendicular to the connecting line between the first substrate anchor 7a and the second substrate anchor 7b.

The micromechanical sensor device further includes a measuring device. This measuring device includes a first comb toothed structure 9a and a second comb toothed structure 9b arranged in the second carrier mechanism 5. The capacity of the tooth-like structure of the first comb or the tooth-like structure of the second comb changes in relation to the rotation angle of the second carrier mechanism 5 about the second rotation axis A2. .. This capacitance change is measured by this measuring device, which outputs a corresponding measurement signal. The rotation angle of the second carrier mechanism 5 about the second rotation axis A2 can be specified by the measuring device based on this measurement signal.

In another embodiment, the electrodes are arranged on the substrate 2. Further, a counter electrode is arranged in the first carrier mechanism 3 and / or the second carrier mechanism 5. Therefore, the rotation angle of the first carrier mechanism 3 or the second carrier mechanism 5 can be specified by measuring the potential difference between the electrode and the counter electrode.

The operating principle of the micromechanical sensor device 1a will be described in more detail below with reference to FIGS. 3 and 4. FIG. 3 shows the influence of the external magnetic field B on the micromechanical sensor device 1a. The component of the external magnetic field B in the y direction generates a first rotational moment Ma based on the interaction with the magnet mechanism 4. This first rotational moment causes a rotational movement of the first carrier mechanism 3 about the first rotational axis A1. The binding mechanism 6 is rigid in the x direction, that is, non-shrinkable or non-stretchable, but deformable or swivelable in the y direction. Rotational moment Mb is generated. This second rotational moment causes a rotational movement of the second carrier mechanism 5 about the second rotational axis A2. The rotation direction or rotation angle of the first carrier mechanism 3 is opposite to the rotation direction or rotation angle of the second carrier mechanism 5. Therefore, the coupling mechanism 6 is configured to transmit the rotational movement of the first carrier mechanism 3 to the second carrier mechanism 5, and the rotational direction of the second carrier mechanism 5 is the first carrier. It is opposite to the rotation direction of the mechanism 3.

Advantageously, the mass of the first carrier mechanism 3 and the mass of the second carrier mechanism 5 and / or the moment of inertia of the first carrier mechanism 3 and the moment of inertia of the second carrier mechanism 5 are substantially the same. Since they are of the same size, the rotation angles are of the same size, but the signs are opposite. The magnitude of the rotation angle is related to the strength and / or orientation of the external magnetic field B. Therefore, the measuring device can specify the strength and / or orientation of the external magnetic field B by measuring this rotation angle.

FIG. 4 shows the action of impact or vibration of the micromechanical sensor device 1a. The first rotational moment Ma acts on the first carrier mechanism 3, and the second rotational moment Mb acts on the second carrier mechanism 5. The first rotation moment Ma and the second rotation moment Mb point in the same direction along the first rotation axis or the second rotation axis, that is, in this case, along the z-axis. .. The first rotational moment Ma and the second rotational moment Mb form forces, respectively, and these forces act on the first protrusion 10a or the second protrusion 10b in opposite directions. Since the first protrusion 10a is connected to the second protrusion 10b via the connection section 6, the rotational movement of the first carrier mechanism 3 and the second carrier mechanism 5 in the same rotation direction Rotational movement is blocked. Therefore, the vibration or impact of the micromechanical sensor device 1a does not transmit the rotational motion to the first or second carrier mechanisms 3 and 5. The coupling mechanism 6 prevents the first carrier mechanism 3 or the second carrier mechanism 5 from rotating in the same rotation direction.

The micromechanical sensor device shown in FIGS. 1 to 4 enables detection of a component of the external magnetic field B along the y-axis, or rotates the micromechanical sensor device 1a by 90 ° along the x-axis. It also enables the detection of the component of the external magnetic field B, that is, the component of the magnetic field B on the substrate surface of the substrate 2, whereas FIG. 5 shows the component of the external magnetic field B along the z-axis line. A schematic plan view of the micromechanical sensor device 1b that enables detection is shown. The N-pole and S-pole axes of the magnet mechanism 4 are arranged here along the y-axis, that is, along the connecting line between the first substrate anchor 7a and the second substrate anchor 7b. The first carrier mechanism 3 and the second carrier mechanism 5 are rotatable about the first rotation axis A1 or the second rotation axis A2 . This rotation axis extends along the x-axis, that is, parallel to the substrate surface of the substrate 2. The z component of the external magnetic field B generates a rotational moment. This rotational moment displaces the first carrier mechanism 3 about the first rotational axis A1. Here, the second carrier mechanism 5 is displaced in the opposite rotation direction by coupling with the coupling mechanism 6. Therefore, the first protrusion 10a or the second protrusion 10b is displaced in the same direction along the z-axis. Since the vibration or impact of the micromechanical sensor device generates the same rotational moment on the first carrier mechanism 3 and the second carrier mechanism 5, the first protrusion 10a and the second protrusion 10b have different directions. Is displaced along the z-axis. However, such movement is blocked by the coupling mechanism 6. For this purpose, the coupling mechanism 6 is configured as follows. That is, the coupling mechanism 6 can be twisted along the x-axis, but is not deflected or displaced relative to the first or second protrusions 10a and 10b along the z-axis. It is configured not to.

FIG. 6 shows a schematic plan view of the micromechanical sensor device 11. It has a first micromechanical sensor device 12, a second micromechanical sensor device 13, and a third micromechanical sensor device 14. The first micromechanical sensor device 12 and the second micromechanical sensor device 13 rotate each other by 90 ° and are arranged on a common substrate 2, and the implementations shown in FIGS. 1 to 4 are performed. It corresponds to the form and is designed to measure the y or x component of the external magnetic field B. The third micromechanical sensor device 14 is also arranged on the substrate 2, corresponds to the embodiment shown in FIG. 5, and is configured to measure the z component of the external magnetic field B. .. The micromechanical sensor device 11 further includes an evaluation mechanism 15. The evaluation mechanism 15 measures each rotation angle of the first carrier mechanism 3 and / or the second carrier mechanism 5 of the first to third sensor devices 12, 13, and 14, and is based on the measured rotation angle. Therefore, it is configured to specify the strength and / or orientation of the external magnetic field B. The micromechanical sensor device 11 can thereby detect the three-dimensional course of the external magnetic field B.

Further, the present invention relates to an operation method of the micromechanical sensor devices 1a and 1b or a micromechanical sensor device 11 according to one of the above-described embodiments. Here, the rotation angles of the first carrier mechanism 3 and / or the second carrier mechanism 5 are measured, and the strength and / or orientation of the external magnetic field is specified based on the measured rotation angles.

Claims (10)

In the micromechanical sensor device (1a; 1b) that detects the external magnetic field (B),
Substrate (2) and
It is a first carrier mechanism (3) having a magnet mechanism (4), and the first carrier mechanism (3) becomes the substrate by the interaction between the external magnetic field (B) and the magnet mechanism (4). (2) with respect to a relatively first first carrier mechanism attached to said substrate (2) as the central pivot axis (A1) is a pivotable and (3),
The second carrier mechanism (5) attached to the substrate ( 2 ) is rotatable about the second rotation axis (A2) relative to the substrate (2). With the second carrier mechanism (5), the second rotation axis (A2) is parallel to the first rotation axis (A1).
The rotation of the first carrier mechanism (3) centered on the first rotation axis (A1) and the second carrier mechanism (5) centered on the second rotation axis (A2). ) Is possible in the opposite rotation direction and is blocked in the same rotation direction, so that the first carrier mechanism (3) and the second carrier mechanism (5) The coupling mechanism (6) that connects and
Micromechanical sensor device (1a; 1b). The binding mechanism (6) has a non-shrinkable and non-stretchable connecting section (6), and the connecting section (6) is the first carrier mechanism (3) and the second carrier. The micromechanical sensor device (1a; 1b) according to claim 1, which is rotatably connected to the mechanism (5). The non-shrinkable and non-stretchable connecting section (6) is the first carrier in an undisplaced stationary position of the first carrier mechanism (3) and the second carrier mechanism (5). Located on a plane perpendicular to the connecting line between the first rotation center (7a) of the mechanism (3) and the second rotation center (7b) of the second carrier mechanism (5). The micromechanical sensor device (1a; 1b) according to claim 2. 1. The first carrier mechanism (3) and / or a measuring device (9a, 9b) configured to measure the rotation angle of the second carrier mechanism (5) is provided. The micromechanical sensor device (1a; 1b) according to any one of 3 to 3. The micromechanical according to claim 4 , wherein the measuring devices (9a, 9b) are at least partially arranged in the first carrier mechanism (3) and / or the second carrier mechanism (5). Sensor device (1a; 1b). The measuring device (9a, 9b) has an electrode arranged on the substrate and a counter electrode arranged on the first carrier mechanism (3) and / or the second carrier mechanism (5). The micromechanical sensor device (1a; 1b) according to claim 4 or 5 , which includes. The micromechanical sensor device (1a; 1b) according to any one of claims 1 to 6, wherein the N-pole and S-pole axes of the magnet mechanism (4) are oriented in parallel with the substrate (2). ). It is a micromechanical sensor device (11).
The micromechanical sensor device (1a; 1b) according to any one of claims 1 to 7 is provided, and each of the micromechanical sensor devices has the orientation and / or the magnet mechanism (4). The orientation of the first rotation axis (A1) is different.
Micromechanical sensor device (11). It has an evaluation mechanism ( 15 ) and
The evaluation mechanism ( 15 ) measures and measures the rotation angles of the first carrier mechanism (3) and / or the second carrier mechanism (5) of at least three of the micromechanical sensor devices. The micromechanical sensor device (11) according to claim 8, which is configured to specify the strength and / or orientation of the external magnetic field (B) based on the rotation angle. The operation method of the micromechanical sensor device (1a; 1b) for detecting an external magnetic field (B) according to any one of claims 1 to 7.
The rotation angle of the first carrier mechanism (3) and / or the second carrier mechanism (5) is measured, and the strength and / or orientation of the external magnetic field is based on the measured rotation angle. To identify,
How to operate the micromechanical sensor device (1a; 1b).

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