JP2018036265A - Micromechanical sensor device for detecting external magnetic field, sensor device, and method of operating micromechanical sensor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the influences of external vibrations or impacts to increase the accuracy and robustness of a sensor device.SOLUTION: A micromechanical sensor device comprises a substrate 2, a first carrier mechanism 3, a second carrier mechanism 5, and a coupling mechanism 6. The first carrier mechanism 3 has a magnetic mechanism 4 and is attached to the substrate 2 so that the first carrier mechanism 3 is rotatable about a first rotation axis A1 relative to the substrate 2 due to interaction between an external magnetic field and the magnetic mechanism 4. The second carrier mechanism 5 is attached to the substrate 2 and is rotatable about a second rotation axis A2 relative to the substrate 2. The second rotation axis A2 is parallel to the first rotation axis A1. The coupling mechanism 6 couples the first carrier mechanism 3 and the second carrier mechanism 5 so that rotation of the first carrier mechanism 3 about the first rotation axis A1 and rotation of the second carrier mechanism 5 about the second rotation axis A2 are allowed in opposite rotation directions but are prevented in the same rotation direction.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a micromechanical sensor device for detecting an external magnetic field, a micromechanical sensor device, and a method for operating the micromechanical sensor device.

Prior art Various measuring methods are known for specifying the strength of a magnetic field or three-dimensional orientation. For example, DE 102010061780 A1 (DE 102010061780 A1) discloses a micromechanical magnetic field sensor including three sensor elements. These three sensor elements are arranged so that the orientation of the three-dimensional magnetic field can be specified.

  The manufacturing costs of frequently used magnetoresistive sensors, especially Hall sensors, are very low but are often insufficient for sensitivity. In contrast, relatively sensitive sensors are often susceptible to external shocks or vibrations.

German Patent Application Publication No. 102010061780

DISCLOSURE OF THE INVENTION The present invention provides a micromechanical sensor device for detecting an external magnetic field having the configuration described in the characterizing portion of claim 1 and a micromechanical device having the configuration described in the characterizing portion of claim 8. A sensor device and a method of operating a micromechanical sensor device having the configuration described in the characterizing part of claim 10 are disclosed.

  Accordingly, in a first aspect, the present invention relates to a micromechanical sensor device that detects an external magnetic field. This micromechanical sensor device has a substrate, a first carrier mechanism, a second carrier mechanism, and a coupling mechanism. The first carrier mechanism includes a magnet mechanism, and the first carrier mechanism rotates about the first rotation axis relative to the substrate by the interaction between the external magnetic field and the magnet mechanism. It is attached to the substrate so as to be movable. The second carrier mechanism is also attached to the substrate and is rotatable about the second rotation axis relative to the substrate. Here, the second rotation axis is parallel to the first rotation axis. The coupling mechanism connects the first carrier mechanism with the second carrier mechanism as follows. In other words, the rotation of the first carrier mechanism about the first rotation axis and the rotation of the second carrier mechanism about the second rotation axis are in the opposite rotation directions. It is possible and connected so as to be prevented in the same rotation direction.

  Accordingly, the present invention in another aspect relates to a micromechanical sensor device. This micro mechanical sensor device has at least three micro mechanical sensor devices. Each of these micromechanical sensor devices differs in the orientation of each magnet mechanism and / or the orientation of each first pivot axis.

  Accordingly, the present invention, in another aspect, relates to a method of operating a micromechanical sensor device that detects an external magnetic field. Here, the rotation angle of the first carrier mechanism and / or the rotation angle of the second carrier mechanism is measured, and the strength and / or orientation of the external magnetic field is specified based on the measured rotation angle. To do.

  Advantageous embodiments are the constituent features of the respective dependent claims.

Advantages of the Invention External impacts or vibrations produce a rotational moment that acts in a similar manner on the first carrier mechanism and the second carrier mechanism. That is, when there is no coupling mechanism, the rotation of the first carrier mechanism and the rotation of the second carrier mechanism around the first rotation axis or the second rotation axis in the same rotation direction are performed. Will be caused. However, such rotational movement is prevented by the coupling mechanism. In this way, the rotation of the first carrier mechanism or the second carrier mechanism due to external impact or vibration is prevented or at least suppressed. Therefore, external shocks or vibrations are not interpreted as an action of an external magnetic field, and erroneous signals are not generated.

  Conversely, the first carrier mechanism may be displaced by an external magnetic field. In this case, the rotation is advantageously transmitted or mediated via a coupling mechanism in the direction of rotation opposite to the second carrier mechanism. Thus, the external magnetic field causes a rotation of the first or second carrier mechanism, and this rotation is measured, whereby the magnitude or orientation of the external magnetic field can be specified.

  The invention thereby makes it possible to suppress the influence of external vibrations or shocks and to increase the accuracy and robustness of the sensor device.

  In an advantageous development of the micromechanical sensor device, the coupling mechanism has a connection section that cannot be shrunk and advantageously cannot be stretched. This connection section is pivotally connected to the first carrier mechanism and the second carrier mechanism. Advantageously, this connection section is oriented perpendicular to the first pivot axis. Since the connection section cannot be contracted or stretched, rotation in the same rotation direction is prevented. This is because such a rotation will crush or pull away the non-shrinkable connection section. On the contrary, this pivotable suspension allows a certain amount of displacement, so that it can be rotated in the opposite direction of rotation.

  In another embodiment of the micromechanical sensor device, the coupling mechanism has a connection section oriented parallel to the first pivot axis. This connecting section can be twisted but does not deviate or bend.

  Advantageously, the coupling mechanism is configured as follows. That is, the rotation of the first carrier mechanism due to the interaction between the external magnetic field and the magnet mechanism is transmitted to the second carrier mechanism. Here, the rotation direction of the second carrier mechanism is opposite to the rotation direction of the first carrier mechanism. Therefore, the magnitude or orientation of the external magnetic field can be specified by measuring the rotation angle of the first or second carrier mechanism.

  In an advantageous development of the micromechanical sensor device, when the first carrier mechanism and the second carrier mechanism are in a non-displaced stationary position, the unconnected section is the first rotation of the first carrier mechanism. It lies in a plane perpendicular to the connecting line between the center of movement and the second center of rotation of the second carrier mechanism. Based on such an arrangement, the contraction force acts on the connection section during the rotational movement in the same rotational direction. However, since the connection section cannot be contracted or stretched, rotation in the same rotation direction is prevented. During the pivoting movement of the first or second carrier mechanism in the opposite pivoting direction, the coupling mechanism is swung relative to the rest position but is not contracted or extended, so Is kept possible.

  In an advantageous development, the micromechanical sensor device has a measuring device. The measuring device is configured to measure the rotation angle of the first carrier mechanism and / or the second carrier mechanism. The measuring device is advantageously configured to determine the magnitude and / or orientation of the external magnetic field based on the measured rotation angle.

  In an advantageous embodiment of the micromechanical sensor device, the measuring device is at least partly arranged on the first carrier mechanism and / or the second carrier mechanism.

  In another embodiment of the micromechanical sensor device, the measuring device includes an electrode disposed on the substrate and a counter electrode disposed on the first carrier mechanism and / or the second carrier mechanism. By measuring the change in potential difference between the electrode and the counter electrode, the rotation angle of the first carrier mechanism or the second carrier mechanism or the magnitude or orientation of the external magnetic field can be specified.

  In an advantageous embodiment of the micromechanical sensor device, the N pole S pole axis of the magnet mechanism is oriented parallel to the substrate.

  In an advantageous embodiment of the micromechanical sensor device, the micromechanical sensor device has an evaluation mechanism. The evaluation mechanism measures the respective rotation angles of the first carrier mechanism and / or the second carrier mechanism of at least three micromechanical sensor devices, and based on the measured rotation angles, the strength of the external magnetic field is measured. And / or to identify the orientation. Accordingly, the present invention provides a three-dimensional magnetic sensor.

1 is a schematic plan view of a micromechanical sensor device according to a first embodiment. FIG. 2 is a schematic perspective view of the micromechanical sensor device shown in FIG. 1. FIG. 2 is a schematic plan view of the micromechanical sensor device shown in FIG. 1 showing the influence of an external magnetic field. FIG. 2 is a schematic plan view of the micromechanical sensor device shown in FIG. 1 showing the impact of an impact on the micromechanical sensor device. FIG. 6 is a schematic plan view of a micromechanical sensor device according to another embodiment. 1 is a schematic plan view of a micromechanical sensor device according to an embodiment of the present invention.

  In all the drawings, identical or functionally equivalent elements and devices are given the same reference numerals. Different embodiments can be arbitrarily combined with each other as long as it is advantageous.

Description of Examples A micromechanical sensor device 1a according to an embodiment of the present invention is shown in a schematic plan view in FIG. 1 and in a schematic perspective view in FIG. The micromechanical sensor device 1a has a substrate 2, preferably made of silicon, in which the first carrier mechanism 3 uses a first spring beam 8a to form a first columnar connection. It is attached to the section or the first substrate anchor 7a, is further connected to the substrate 2 via the first substrate anchor 7a, and is attached at a distance from the substrate 2.

  Further, the second carrier mechanism 5 is fixed to the second columnar connection section or the second substrate anchor 7b via the second spring beam 8b, and further the substrate via the second substrate anchor 7b. 2 and is spaced from the substrate 2. The first carrier mechanism 3 or the second carrier mechanism 5 has a first rotation axis A1 or a second rotation axis A2 extending through the first substrate anchor 7a or the second substrate anchor 7b. It can be pivoted or displaced about the center. The first rotation axis A1 is parallel to the second rotation axis A2, extends along the z-axis, and extends in the xy plane with respect to the substrate surface of the substrate 2 It extends vertically. The first substrate anchor 7 a forms the first rotation center of the first carrier mechanism 3, and the second substrate anchor 7 b forms the corresponding second rotation center 7 b of the second carrier mechanism 5. Form.

  The first carrier mechanism 3 has a magnet mechanism 4. The N pole S pole axis of the magnet mechanism 4 extends along the x axis. The x-axis extends parallel to the substrate and extends parallel to the second carrier mechanism 5 in a non-displaced rest position. The connection line between the first substrate anchor 7a and the second substrate anchor 7b extends in parallel to the y-axis line and extends perpendicular to the x-axis line.

  The first carrier mechanism 3 has a first protrusion 10a, and the second carrier mechanism 5 has a second protrusion 10b. These protrusions protrude in parallel to the connection line between the first substrate anchor 7a and the second substrate anchor 7b. A coupling mechanism 6 in the form of a connection section that cannot be shrunk and stretched is connected to the first protrusion 10a and the second protrusion 10b. Here, the coupling mechanism 6 can turn or bend relative to the first protrusion 10a or the second protrusion 10b. The coupling mechanism 6 extends parallel to the substrate surface of the substrate 2 and extends perpendicular to the connection line between the first substrate anchor 7a and the second substrate anchor 7b. . Accordingly, the coupling mechanism 6 is located on a surface extending perpendicularly to the connection line between the first substrate anchor 7a and the second substrate anchor 7b.

  The micromechanical sensor device further includes a measuring device. This measuring device includes a first comb tooth-like structure 9 a and a second comb tooth-like structure 9 b arranged in the second carrier mechanism 5. The capacity of the first comb tooth-shaped structure or the second comb tooth-shaped structure changes in relation to the rotation angle of the second carrier mechanism 5 around the second rotation axis A2. . This change in capacitance is measured by this measuring device, which outputs a corresponding measurement signal. The rotation angle of the second carrier mechanism 5 around the second rotation axis A2 can be specified by the measurement device based on this measurement signal.

  In another embodiment, electrodes are disposed on the substrate 2. In addition, a counter electrode is disposed on the first carrier mechanism 3 and / or the second carrier mechanism 5. Therefore, the rotation angle of the first carrier mechanism 3 or the second carrier mechanism 5 can be specified by measuring the potential difference between the electrode and the counter electrode.

  The principle of operation of the micromechanical sensor device 1a will be described below in more detail with reference to FIGS. FIG. 3 shows the influence of the external magnetic field B on the micromechanical sensor device 1a. The component of the external magnetic field B in the y direction generates a first rotational moment Ma based on the interaction with the magnet mechanism 4. This first rotational moment causes a rotational movement of the first carrier mechanism 3 about the first rotational axis A1. The coupling mechanism 6 is hard in the x direction, that is, cannot be contracted or stretched, but is deformable or pivotable in the y direction. Is generated. This second rotational moment causes a rotational movement of the second carrier mechanism 5 about the second rotational axis A2. The rotation direction or rotation angle of the first carrier mechanism 3 is opposite to the rotation direction or rotation angle of the second carrier mechanism 5. Accordingly, the coupling mechanism 6 is configured to transmit the rotational movement of the first carrier mechanism 3 to the second carrier mechanism 5, and the rotational direction of the second carrier mechanism 5 is the first carrier. This is opposite to the rotation direction of the mechanism 3.

  Advantageously, the mass of the first carrier mechanism 3 and the mass of the second carrier mechanism 5 and / or the moment of inertia of the first carrier mechanism 3 and the moment of inertia of the second carrier mechanism 5 are substantially equal to each other. Since they have the same size, the rotation angles are the same size, but the signs are opposite. The magnitude of the rotation angle is related to the strength and / or orientation of the external magnetic field B. Therefore, the measuring apparatus can specify the strength and / or orientation of the external magnetic field B by measuring the rotation angle.

  FIG. 4 shows the impact or vibration action of the micromechanical sensor device 1a. The first rotational moment Ma acts on the first carrier mechanism 3, and the second rotational moment Mb acts on the second carrier mechanism 5. The first rotation moment Ma and the second rotation moment Mb point along the first rotation axis or the second rotation axis, that is, in this case, the same direction along the z-axis. . The first rotational moment Ma and the second rotational moment Mb each form a force, and these forces act on the first protrusion 10a or the second protrusion 10b in opposite directions. Since the first projecting portion 10a is connected to the second projecting portion 10b via the connection section 6, the first carrier mechanism 3 rotates and the second carrier mechanism 5 in the same rotational direction. Is prevented from rotating. Accordingly, the vibration or impact of the micromechanical sensor device 1a does not transmit the rotational motion to the first or second carrier mechanism 3 or 5. The coupling mechanism 6 prevents the first carrier mechanism 3 or the second carrier mechanism 5 from rotating in the same rotation direction.

  The micromechanical sensor device shown in FIGS. 1 to 4 allows detection of the component of the external magnetic field B along the y-axis, or along the x-axis by rotating the micromechanical sensor device 1a by 90 °. While the component of the external magnetic field B can also be detected, that is, the component of the magnetic field B on the substrate surface of the substrate 2 can be detected, FIG. 5 shows the component of the external magnetic field B along the z-axis. A schematic plan view of a micromechanical sensor device 1b that allows detection is shown. Here, the N pole S pole axis of the magnet mechanism 4 is disposed along the y axis, that is, along the connection line between the first substrate anchor 7a and the second substrate anchor 7b. The first carrier mechanism 3 and the second carrier mechanism 5 are rotatable about the first rotation axis A1 or the second rotation axis A1. The rotation axis extends along the x-axis, that is, parallel to the substrate surface of the substrate 2. The z component of the external magnetic field B generates a rotational moment. This rotational moment displaces the first carrier mechanism 3 about the first rotation axis A1. Here, the second carrier mechanism 5 is displaced in the opposite rotation direction by the coupling with the coupling mechanism 6. Accordingly, the first protrusion 10a or the second protrusion 10b is displaced in the same direction along the z-axis. The vibrations or impacts of the micromechanical sensor device generate the same rotational moment on the first carrier mechanism 3 and the second carrier mechanism 5, so that the first protrusion 10a and the second protrusion 10b are in different directions. Is displaced along the z-axis. However, such movement is prevented by the coupling mechanism 6. For this purpose, the coupling mechanism 6 is configured as follows. That is, the coupling mechanism 6 can be twisted along the x-axis, but is not deflected or displaced relative to the first protrusion or the second protrusions 10a and 10b along the z-axis. Is configured to not.

  FIG. 6 shows a schematic plan view of the micromechanical sensor device 11. This includes a first micromechanical sensor device 12, a second micromechanical sensor device 13, and a third micromechanical sensor device 14. The first micromechanical sensor device 12 and the second micromechanical sensor device 13 are rotated on each other by 90 ° and arranged on a common substrate 2, and are shown in FIGS. 1 to 4. It corresponds to the form and is designed to measure the y or x component of the external magnetic field B. The third micromechanical sensor device 14 is also disposed on the substrate 2, corresponds to the embodiment shown in FIG. 5, and is configured to measure the z component of the external magnetic field B. . The micromechanical sensor device 11 further includes an evaluation mechanism 12. The evaluation mechanism measures each rotation angle of the first carrier mechanism 3 and / or the second carrier mechanism 5 of the first to third sensor devices 12, 13, and 14, and based on the measured rotation angle. The strength and / or orientation of the external magnetic field B is specified. Thus, the micromechanical sensor device 11 can detect the three-dimensional progress of the external magnetic field B.

  Furthermore, the invention relates to a method of operating the micromechanical sensor devices 1a, 1b or the micromechanical sensor device 11 according to one of the embodiments described above. Here, the rotation angle of the first carrier mechanism 3 and / or the second carrier mechanism 5 is measured, and the strength and / or orientation of the external magnetic field is specified based on the measured rotation angle.

In an advantageous development of the micromechanical sensor device, when the first carrier mechanism and the second carrier mechanism are in a non-displaced stationary position, the non-shrinkable and non-stretchable connecting section is the first It is located on a plane perpendicular to the connecting line between the first rotation center of the carrier mechanism and the second rotation center of the second carrier mechanism. Based on such an arrangement, the contraction force acts on the connection section during the rotational movement in the same rotational direction. However, since the connection section cannot be contracted or stretched, rotation in the same rotation direction is prevented. During the pivoting movement of the first or second carrier mechanism in the opposite pivoting direction, the coupling mechanism is swung relative to the rest position but is not contracted or extended, so Is kept possible.

Further, the second carrier mechanism 5 is fixed to the second columnar connection section or the second substrate anchor 7b via the second spring beam 8b, and further the substrate via the second substrate anchor 7b. 2 and is spaced from the substrate 2. The first carrier mechanism 3 or the second carrier mechanism 5 has a first rotation axis A1 or a second rotation axis A2 extending through the first substrate anchor 7a or the second substrate anchor 7b. It can be pivoted or displaced about the center. The first rotation axis A1 is parallel to the second rotation axis A2, extends along the z-axis, and extends in the xy plane with respect to the substrate surface of the substrate 2 It extends vertically. The first substrate anchor 7 a forms the first rotation center 7 a of the first carrier mechanism 3, and the second substrate anchor 7 b corresponds to the corresponding second rotation center 7 b of the second carrier mechanism 5. Form.

The micromechanical sensor device shown in FIGS. 1 to 4 allows detection of the component of the external magnetic field B along the y-axis, or along the x-axis by rotating the micromechanical sensor device 1a by 90 °. While the component of the external magnetic field B can also be detected, that is, the component of the magnetic field B on the substrate surface of the substrate 2 can be detected, FIG. 5 shows the component of the external magnetic field B along the z axis. A schematic plan view of a micromechanical sensor device 1b that allows detection is shown. Here, the N pole S pole axis of the magnet mechanism 4 is disposed along the y axis, that is, along the connection line between the first substrate anchor 7a and the second substrate anchor 7b. The first carrier mechanism 3 and the second carrier mechanism 5 are rotatable about the first rotation axis A1 or the second rotation axis A2 . The rotation axis extends along the x-axis, that is, parallel to the substrate surface of the substrate 2. The z component of the external magnetic field B generates a rotational moment. This rotational moment displaces the first carrier mechanism 3 about the first rotation axis A1. Here, the second carrier mechanism 5 is displaced in the opposite rotation direction by the coupling with the coupling mechanism 6. Accordingly, the first protrusion 10a or the second protrusion 10b is displaced in the same direction along the z-axis. The vibrations or impacts of the micromechanical sensor device generate the same rotational moment on the first carrier mechanism 3 and the second carrier mechanism 5, so that the first protrusion 10a and the second protrusion 10b are in different directions. Is displaced along the z-axis. However, such movement is prevented by the coupling mechanism 6. For this purpose, the coupling mechanism 6 is configured as follows. That is, the coupling mechanism 6 can be twisted along the x-axis, but is not deflected or displaced relative to the first protrusion or the second protrusions 10a and 10b along the z-axis. Is configured to not.

FIG. 6 shows a schematic plan view of the micromechanical sensor device 11. This includes a first micromechanical sensor device 12, a second micromechanical sensor device 13, and a third micromechanical sensor device 14. The first micromechanical sensor device 12 and the second micromechanical sensor device 13 are rotated on each other by 90 ° and arranged on a common substrate 2, and are shown in FIGS. 1 to 4. It corresponds to the form and is designed to measure the y or x component of the external magnetic field B. The third micromechanical sensor device 14 is also disposed on the substrate 2, corresponds to the embodiment shown in FIG. 5, and is configured to measure the z component of the external magnetic field B. . The micromechanical sensor device 11 further includes an evaluation mechanism 15 . The evaluation mechanism 15 measures each rotation angle of the first carrier mechanism 3 and / or the second carrier mechanism 5 of the first to third sensor devices 12, 13, and 14, and based on the measured rotation angle. Thus, the strength and / or orientation of the external magnetic field B is specified. Thus, the micromechanical sensor device 11 can detect the three-dimensional progress of the external magnetic field B.

Claims (10)

In the micro mechanical sensor device (1a; 1b) for detecting the external magnetic field (B),
A substrate (2);
A first carrier mechanism (3) having a magnet mechanism (4), wherein the first carrier mechanism (3) is caused to interact with the substrate by an interaction between the external magnetic field (B) and the magnet mechanism (4). A first carrier mechanism (3) attached to the substrate (2) so as to be rotatable about a first rotation axis (A1) relative to (1);
A second carrier mechanism (5) attached to the substrate (2), which is rotatable about a second rotation axis (A2) relative to the substrate (1); A second carrier mechanism (5), wherein the second pivot axis (A2) is parallel to the first pivot axis (A1);
Rotation of the first carrier mechanism (3) about the first rotation axis (A1) and second carrier mechanism (5) about the second rotation axis (A2) ) Rotation is possible in the opposite rotation direction and is prevented in the same rotation direction, the first carrier mechanism (3) and the second carrier mechanism (5) A coupling mechanism (6) connecting
A micromechanical sensor device (1a; 1b) comprising:   The coupling mechanism (6) has a connection section (6) that cannot contract and cannot be stretched, and the connection section (6) includes the first carrier mechanism (3) and the second carrier. The micromechanical sensor device (1a; 1b) according to claim 1, wherein the micromechanical sensor device (1a; 1b) is pivotally connected to the mechanism (5).   The non-connection section (6) is a first position of the first carrier mechanism (3) at a non-displaced stationary position of the first carrier mechanism (3) and the second carrier mechanism (5). The center of rotation (7a) and the second center of rotation (7b) of the second carrier mechanism (5) are located in a plane perpendicular to the connecting line. Micromechanical sensor device (1a; 1b).   2. A measuring device (9a, 9b) configured to measure the rotational angle of the first carrier mechanism (3) and / or the second carrier mechanism (5). The micro mechanical sensor device (1a; 1b) according to any one of claims 1 to 3.   5. The measuring device (9a, 9b) according to any of the preceding claims, wherein the measuring device (9a, 9b) is at least partly arranged in the first carrier mechanism (3) and / or the second carrier mechanism (5). The micro mechanical sensor device (1a; 1b) according to one item.   The measuring device (9a, 9b) includes an electrode disposed on the substrate and a counter electrode disposed on the first carrier mechanism (3) and / or the second carrier mechanism (5). A micromechanical sensor device (1a; 1b) according to any one of the preceding claims, comprising:   The micromechanical sensor device (1a; 1b) according to any one of claims 1 to 6, wherein an N-pole S-polar axis of the magnet mechanism (4) is oriented parallel to the substrate (2). ). A micromechanical sensor device (11) comprising:
It has at least three micromechanical sensor devices (1a; 1b) according to any one of claims 1 to 7, wherein each of the micromechanical sensor devices has an orientation of the magnet mechanism (4) and / or The orientation of the first pivot axis (A1) is different,
Micromechanical sensor device (11). Has an evaluation mechanism (12),
The evaluation mechanism (12) measures and measures each rotation angle of the first carrier mechanism (3) and / or the second carrier mechanism (5) of at least three of the micromechanical sensor devices. The micromechanical sensor device (11) according to claim 8, wherein the micromechanical sensor device (11) is configured to specify the strength and / or orientation of the external magnetic field (B) based on a rotation angle. A method for operating a micromechanical sensor device (1a; 1b) for detecting an external magnetic field (B) according to any one of claims 1 to 8,
The rotation angle of the first carrier mechanism (3) and / or the second carrier mechanism (5) is measured, and the strength and / or orientation of the external magnetic field is based on the measured rotation angle. Identify
A method of operating the micromechanical sensor device (1a; 1b).

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