JP6902910B2 - Press brake die centering device and method - Google Patents

Description

The present invention relates to a die centering device and method for a press brake.

A press brake that bends a work that is a metal plate material includes an upper table on which a punch, which is an upper die, is mounted, and a lower table, which is mounted on a die, which is a lower die. In the press brake, the upper table is lowered to the lower table, and the work placed on the die is sandwiched between the punch and the die and bent.

When the die is replaced in the press brake, the punch and die are put together with the bolts for fixing the die to the die holder loosened, and the target pressure is applied to the die to center the die. , It is necessary to perform the die centering work of tightening the bolts and fixing the die to the die holder (see Patent Document 1).

Japanese Unexamined Patent Publication No. 2000-280024

Conventionally, the operator calculates and determines the pressure required for the mold centering work by the pressure calculation formula described in the instruction manual, or the pressure required for the mold centering work based on experience. Is decided. Since the pressure required for the mold centering operation depends on the pressure resistance or width of the mold, the pressure may be insufficient or too high. If the pressure is insufficient, the center of the mold may be misaligned, resulting in poor centering, and if the pressure is too high, the mold may be damaged.

The present invention provides a die centering device and method for a press brake, which enables a die centering operation with almost no risk of occurrence of centering failure and mold damage by an operator performing a simple operation. The purpose is to provide.

In the present invention, the maximum pressure is a pressure obtained by multiplying the narrower width of the punch width and the die width by the lower withstand voltage of the punch withstand voltage and the die withstand voltage as the maximum pressure. The height of the die centering pressure calculation unit that calculates the die centering pressure when the punch and the die are centered, and the height of the punch, the die, and the die holder that holds the die. Based on the above, the mold centering target position setting unit for setting the mold centering target position, which is the target position reached by the tip of the punch when the punch and the die are centered, and the die centering target position setting unit. A mold centering limit position setting unit that sets a mold centering limit position, which is a position lower than the mold centering target position and is a limit of a position where the tip of the punch reaches, and a mold centering limit position setting unit. A mold centering start position setting unit that is located above the target centering position and sets a die centering start position when centering the punch and the die, and the punch centering the die. When the punch is lowered from above the centering start position toward the die, the tip of the punch is located between the die centering start position and the die centering restriction position. When the pressure applied to the punch and the die reaches the mold centering pressure, the determination unit determines that the mold centering is completed, and when the determination unit determines that the mold centering is completed, the punch is released. When the upper table elevating control unit that stops the lowering of the mounted upper table and the determination unit determine that the mold centering is completed, the operator is informed visually and audibly that the mold centering is completed. providing a mold centering device pulp-less brakes and a notification unit for notifying at least one in the.

In the present invention, the maximum pressure is the pressure obtained by multiplying the narrower width of the punch width and the die width by the lower withstand voltage of the punch withstand voltage and the die withstand voltage. Based on the maximum pressure , the die centering pressure at the time of centering the punch and the die is calculated, and the control device holds the punch, the die, and the die holder. Based on the height, a mold centering target position, which is a target position reached by the tip of the punch when centering the punch and the die, is set, and the control device controls the die core. The mold centering limit position, which is a position lower than the centering target position and is the limit of the position where the tip of the punch reaches, is set, and the control device is above the mold centering target position. It is a position, and a mold centering start position when the punch and the die are centered is set, and the control device directs the punch toward the die from above the mold centering start position. When the punch is lowered, the pressure applied to the punch and the die is applied to the die while the tip of the punch is located between the die centering start position and the die centering restriction position. When the centering pressure is reached, it is determined that the die centering is completed, and when it is determined that the die centering is completed, the control device stops the lowering of the upper table to which the punch is mounted, and the metal is metallized. If it is determined that the mold centering has been completed, the control device, the operator in the mold centering method pulp-less brake to broadcast at least one in the visual information to the effect that the mold centering has been completed and audio information provide.

According to the die centering device and method of the press brake of the present invention, the die centering work can be performed by a simple operation with almost no risk of centering failure and mold damage. Can be done.

It is a perspective view which shows the whole structure example of the press brake which mounts the die centering device of the press brake of one Embodiment. It is a side view which shows the punch and the die in the state where the center of the tip of the punch and the center of the V groove of a die coincide with each other. It is a block diagram which shows the structural example of the control device which comprises the die centering device of the press brake of one Embodiment. It is a flowchart which shows the whole process of a press brake at the time of performing a die centering work. It is a specific process of step S10 of FIG. 4, and is a flowchart which shows the process by the die centering apparatus and method of the press brake of one Embodiment. It is a specific process of step S10 of FIG. 4, and is a flowchart which shows the process which follows FIG. 5A. It is a conceptual diagram which shows the punch and the die when the width of a punch is narrower than the width of a die. It is a conceptual diagram which shows the punch and the die when the width of a punch is wider than the width of a die. It is a figure which shows the method of calculating the die centering pressure in the die centering apparatus and method of the press brake of one Embodiment. It is a flowchart which shows the specific process of step S112 of FIG. 5B. It is a flowchart which shows the specific process of step S113 of FIG. 5B. It is a side view which shows a plurality of states of a punch and a die in the die centering work by the die centering apparatus and method of the press brake of one Embodiment. It is a figure which shows the position of the upper table and the change of the pressure applied to a die in the die centering work by the die centering device and method of the press brake of one Embodiment.

Hereinafter, the press brake die centering device and method of one embodiment will be described with reference to the accompanying drawings. First, a schematic configuration of a press brake will be described with reference to FIG. The press brake includes an upper table 10 and a lower table 20. The upper table 10 is configured to move up and down by hydraulic cylinders 11L and 11R provided on the left and right.

The hydraulic cylinders 11L and 11R are driven by a hydraulic motor (not shown). The hydraulic cylinders 11L and 11R include a pressure sensor 110.

A punch Tp is attached to the upper table 10 by the punch holder 12 shown in FIG. A die Td is attached to the lower table 20 via a die holder 22 that holds the die Td. In FIG. 1, the punch holder 12 is not shown.

The control device 50 controls the entire press brake. The control device 50 may be a computer device called an NC device. An operation pendant 60 having a display 61, a handle 62 as an operation unit, and a handle enable button 63 is connected to the control device 50. A foot switch 70 having a closed foot pedal 71 for lowering the upper table 10 and an open foot pedal 72 for raising the upper table 10 is connected to the control device 50.

FIG. 2 shows a case where a die Td called a 2V die is used as an example. The position of the die Td in the front-rear direction is adjusted so that the center of the tip of the punch Tp and the center of the V-shaped groove of the die Td substantially coincide with each other by the die centering operation described later. At the time of die centering work, the bolt 221 for fixing the die Td to the die holder 22 is in a loosened state, and the operator tightens the bolt 221 after the die centering is completed to fix the position of the die Td in the front-rear direction. ..

As shown in FIG. 3, the control device 50 includes a PC board 51, an I / O board 52, and a PLC (Programmable Logic Controller) 53. The PC board 51 has a central processing unit (CPU) 511, an HMI (Human Machine Interface) application program, and a memory 512 that stores firmware for controlling the operation of each part of the press brake.

The CPU 511 causes the display 61 to display character or image information by executing the HMI application program. The CPU 511 generates a predetermined sound from the speaker 80 by executing the HMI application program. The speaker 80 includes a buzzer. In Figure 3, the speaker 80 are illustrated as provided on the operation pendant 60, position where the speaker 80 is arbitrary.

The I / O board 52 has a handle pulse signal from the handle 62, an operation input signal from the handle enable button 63, a pressure detection value from the pressure sensor 110, and position information of the upper table 10 detected by a linear encoder (not shown). Is taken in and supplied to the PC board 51. The I / O board 52 is connected to the control proportional valve of the upper table 10.

The PLC 53 takes in the operation input signals from the closed foot pedal 71 and the open foot pedal 72 and supplies them to the PC board 51. The PLC 53 is connected to a hydraulic valve (not shown) that controls the vertical movement of the upper table 10. The PC board 51 and the PLC 53 operate in cooperation with each other.

Next, the mold centering operation by the mold centering device and method of the present embodiment will be described. FIG. 4 shows the overall processing of the press brake, including the die centering work. In FIG. 4, the control device 50 determines in step S1 whether or not the home return of the upper table 10 is completed. The origin of the upper table 10 is, for example, a position at a distance of about 2 mm from the open end (upper end) of the upper table 10.

If the origin return of the upper table 10 is not completed (NO), the control device 50 returns the upper table 10 to the origin in step S2 and shifts the process to step S3. If the home return of the upper table 10 is completed (YES), the control device 50 shifts the process to step S3.

The control device 50 determines in step S3 whether or not an instruction to newly create a machining program has been given. If an instruction to create a new machining program is given (YES), the operator operates the operation unit of the operation pendant 60 while looking at the display 61 in step S4 to input various conditions of the machining program. , The process shifts to step S7. The conditions of the machining program are the mold to be used, the material of the work, the bending method of the work, and the like.

If the instruction to newly create the machining program is not given in step S3 (NO), the control device 50 determines whether or not the instruction to select the existing machining program is given in step S5. If the instruction to select the existing machining program is given (YES), the operator selects the existing machining program in step S6 and shifts the process to step S7. If no instruction is given to select an existing machining program (NO), the operator shifts the process to step S7.

The operator attaches the die holder 22 to the lower table 20 in step S7, and attaches the die Td to the die holder 22 in step S8. The operator attaches the punch Tp to the upper table 10 in step S9. After executing the above processing, the operator or the control device 50 executes the mold centering operation in step S10 to end the processing.

A specific process of the mold centering operation in step S10 will be described with reference to FIGS. 5A and 5B. In FIG. 5A, the operator presses the handle enable button 63 in step S101. When the handle enable button 63 is pressed, the control device 50 switches from the automatic mode to the manual operation mode in which the upper table 10 is manually operated.

In step S102, the firmware of the PC board 51 applies the mold centering pressure, the mold centering target position Ptarget (see FIG. 10), and the mold centering limit position Plimit (see FIG. 10) with respect to the HMI application program of the PC board 51. (See FIG. 10) is requested to transfer the data.

The HMI application program determines whether or not the mold is selected in step S103, and if the mold is not selected (NO), the mold information editing image is displayed on the display 61 in step S104. To do. When the operator inputs the withstand voltage of the mold, the width of the mold, and the height of the mold as the mold information in step S105, the HMI application program shifts the process to step S106. If the mold is selected in step S103 (YES), the HMI application program shifts the process to step S106.

As described in detail below, the HMI application program calculates the mold centering pressure in step S106, calculates the mold centering target position Ptarget in step S107, and calculates the mold centering target position Ptarget in step S108. The centering limit position Plimit is calculated.

6A, 6B, and 7 will be used to illustrate how the HMI application program calculates the mold centering pressure in step S106. If the pressure obtained by multiplying the respective widths of the punch Tp and the die Td by the respective pressure resistances is taken as the maximum pressure, the pressure resistance of the punch Tp or the die Td may be exceeded in the following cases. ..

FIG. 6A shows a case where the width of the punch Tp is narrower than the width of the die Td. At this time, if the withstand voltage of the punch Tp is larger than the withstand voltage of the die Td, the withstand voltage of the die Td may be exceeded within the range of the mold contact width in which the punch Tp and the die Td come into contact with each other. FIG. 6B shows a case where the width of the punch Tp is wider than the width of the die Td. At this time, if the withstand voltage of the punch Tp is smaller than the withstand voltage of the die Td, the withstand voltage of the punch Tp may be exceeded within the range of the mold contact width in which the punch Tp and the die Td come into contact with each other.

Therefore, the maximum pressure must be the maximum pressure that can be pressurized within the range of the mold contact width in which the punch Tp and the die Td come into contact with each other when the mold is centered. The maximum pressure in the mold contact width range is obtained by multiplying the width of the mold with the narrower width of the punch Tp and the die Td by the withstand voltage of the lower of the punch Tp and the die Td. Be done.

As shown in FIG. 7, the HMI application program sets the pressure obtained by multiplying the maximum pressure by the mold centering pressure coefficient set by the parameter as the mold centering pressure. The mold centering pressure coefficient may be, for example, a number of about 0.9 to 1.1. However, as shown in FIG. 7, the HMI application program limits the mold centering pressure to the D-axis origin set pressure when the mold centering pressure exceeds the D-axis origin set pressure.

The control device 50 (PC board 51) calculates the mold centering pressure when the punch Tp and the die Td are centered based on the mold information of the punch Tp and the die Td. Functions as a department.

The D-axis origin is the lower end position of the punch Tp when the punch Tp is in contact with the die Td. In other words, the D-axis origin is the lower end position of the punch Tp when the upper table is lowered and a predetermined pressure (D-axis origin setting pressure) is applied between the punch Tp and the die Td.

The HMI application program calculates the mold centering target position Ptarget shown in FIG. 10 based on the heights of the punch Tp, the die Td, and the die holder 22. In the HMI application program, the position near the lower end of the V-shaped groove may be set as the mold centering target position Ptarget.

The HMI application program sets the mold centering limit position Plimit shown in FIG. 10 at a position separated from the mold centering target position Ptarget by a predetermined distance in the closing direction. The distance from the mold centering target position Ptarget to the mold centering limit position Plimit may be, for example, about 0.1 to 0.9 mm.

Returning to FIG. 5A, the HMI application program transfers the data of the mold centering pressure, the mold centering target position Ptarget, and the mold centering limit position Plimit calculated as described above in step S109 to the PC board 51. Transfer to firmware.

Moving to FIG. 5B, the firmware calculates the mold centering start position Pstart shown in FIG. 10 in step S110. The firmware may set the mold centering start position Pstart at a position separated from the mold centering target position Ptarget by a predetermined distance set by a parameter on the open side. The distance from the mold centering start position Pstart to the mold centering target position Ptarget may be, for example, a predetermined distance of less than 1 mm.

As described above, the mold centering start position Pstart, the mold centering target position Ptarget, and the mold centering limit position Plimit are set in the firmware.

The control device 50 (PC board 51) is a target position reached by the tip of the punch Tp when centering the punch Tp and the die Td based on the heights of the punch Tp, the die Td, and the die holder 22. It functions as a mold centering target position setting unit for setting the mold centering target position Ptarget.

The control device 50 (PC board 51) is a position below the mold centering target position Ptarget, and is a mold for setting the mold centering limit position Plimit, which is the limit of the position where the tip of the punch Tp reaches. Functions as a centering restriction position setting unit. The control device 50 (PC board 51) is a position above the mold centering target position Ptarget, and is a mold for setting the mold centering start position Pstart when the punch Tp and the die Td are centered. It functions as a centering start position setting unit.

Depending on the degree of wear of the punch Tp or die Td and the mounting condition, the actual mold centering position is in either the open side (upper side) or the closed side (lower side) with respect to the mold centering target position Ptarget. It shifts. As will be described later, the firmware may determine that there is an actual mold centering position between the mold centering start position Pstart and the mold centering limit position Plimit.

The firmware determines in step S111 whether or not the closed foot pedal 71 has been turned on. If the closed foot pedal 71 is not turned on (NO), the firmware stops the upper table 10 in step S123 and shifts the process to step S124.

If the closed foot pedal 71 is turned on in step S111 (YES), the firmware monitors the pressure applied to the mold by the pressure detected value from the pressure sensor 110 in step S112, and punches Tp in step S113. Monitor the position of the tip of the. Details of steps S112 and S113 will be described later.

The firmware determines in step S114 whether or not the handle 62 has been rotated clockwise. The upper table 10 is lowered (closed movement) when the operator rotates the handle 62 clockwise, and the upper table 10 is raised (open movement) when the worker rotates the handle 62 counterclockwise. There is. If the handle 62 is rotated clockwise (YES), the firmware determines in step S115 whether the closing movement of the upper table 10 is prohibited based on the pressure or position monitored in step S112 or S113. To do.

If the closing movement is not prohibited (NO), in step S116, the firmware determines whether the current position of the tip of the punch Tp is equal to or less than the mold centering start position Pstart (the current position is the mold centering start position Pstart). Whether it is in or below it). If the current position is equal to or less than the mold centering start position Pstart (YES), the firmware limits the speed so that the upper table 10 closes and moves at a very low speed in step S117. In step S117, when the operator rotates the handle 62 clockwise to close and move the upper table 10, the upper table 10 closes and moves at a very low speed, and the I / O board 52 shifts the process to step S124.

If the current position is not less than or equal to the mold centering start position Pstart in step S116 (NO), the firmware allows the upper table 10 to close and move at high speed or low speed in step S118. In step S118, when the operator rotates the handle 62 clockwise to close and move the upper table 10, the upper table 10 closes and moves at high speed or low speed, and the firmware shifts the process to step S124.

If the closed movement is prohibited in step S115 (YES), the I / O board 52 stops the upper table 10 in step S119 and shifts the process to step S124.

If the handle 62 is not rotated clockwise in step S114 (NO), the firmware determines in step S120 whether the handle 62 has been rotated counterclockwise. If the handle 62 is rotated counterclockwise (YES), the firmware allows the upper table 10 to open and move at high speed or low speed in step S121. When the operator rotates the handle 62 counterclockwise to open and move the upper table 10 in step S121, the upper table 10 is opened and moved at high speed or low speed, and the firmware shifts the process to step S124.

If the handle 62 is not rotated counterclockwise in step S120 (NO), the firmware stops the upper table 10 in step S122 and shifts the process to step S124.

In step S124, the firmware determines whether or not the mold centering completion message is displayed on the display 61 by the HMI application program. Unless the display 61 displays the mold centering completion message by the HMI application program (NO), the firmware returns the process to step S111 and repeats the processes of steps S111 to S124. If the display 61 displays the mold centering completion message by the HMI application program (YES), the firmware finishes the mold centering operation.

A specific process of monitoring the pressure applied to the mold in step S112 of FIG. 5B will be described with reference to FIG. In FIG. 8, the firmware determines in step S201 whether or not the current pressure is equal to or higher than the mold centering pressure. If the current pressure is not greater than or equal to the mold centering pressure (NO), the firmware clears the message displayed on the display 61 by the HMI application program in step S209 and ends the pressure monitoring process.

If the current pressure is equal to or higher than the mold centering pressure in step S201 (YES), the firmware determines in step S202 whether or not the current position is equal to or lower than the mold centering start position Pstart. If the current pressure is equal to or higher than the mold centering pressure and the current position is equal to or lower than the mold centering start position Pstart, it means that the mold centering work is completed.

Therefore, if the current position is equal to or less than the mold centering start position Pstart (YES), the firmware stops the upper table 10 in step S203 to prohibit the closing movement, and in step S204, the metal from the speaker 80. Generates a mold centering completion sound. Further, in step S205, the firmware displays a mold centering completion message on the display 61 by the HMI application program, and ends the pressure monitoring process.

If the current position is not less than or equal to the mold centering start position Pstart in step S202 (NO), the firmware stops the upper table 10 in step S206 to prohibit the closing movement, and in step S207, the speaker 80. Generate more warning sound. The fact that the current position is not less than or equal to the mold centering start position Pstart even though the current pressure is equal to or higher than the mold centering pressure means that an abnormality has occurred before the mold centering work is completed. ..

Further, in step S208, the firmware displays a warning message on the display 61 by the HMI application program, and ends the pressure monitoring process.

A specific process of monitoring the position of the punch Tp in step S113 of FIG. 5B will be described with reference to FIG. In FIG. 9, the firmware determines in step S301 whether or not the closing movement of the upper table 10 is prohibited. If the closing movement of the upper table 10 is prohibited (YES), the firmware ends the position monitoring process.

If the closing movement of the upper table 10 is not prohibited in step S301 (NO), the firmware determines in step S302 whether or not the current position is equal to or less than the mold centering limit position Plimit. If the current position is equal to or less than the mold centering limit position Plimit (YES), the firmware stops the upper table 10 in step S303 to prohibit the closing movement, and generates a warning sound in step S304. Further, in step S305, the firmware displays a warning message on the display 61 by the HMI application program, and ends the position monitoring process.

If the current position is not equal to or less than the mold centering limit position Plimit (NO), the firmware clears the message displayed on the display 61 by the HMI application program in step S306, and ends the position monitoring process.

As can be seen from the pressure monitoring process shown in FIG. 8 and the position monitoring process shown in FIG. 9, when the firmware lowers the punch Tp from above the mold centering start position Pstart toward the die Td, the punch Tp When the pressure applied to the punch Tp and die Td reaches the mold centering pressure while the tip of the die is located between the mold centering start position Pstart and the mold centering limit position Plimit, the mold core It is determined that the delivery is completed. The control device 50 (PC board 51) functions as a determination unit for determining the completion of mold centering.

Further, in the control device 50 (I / O board 52), if the pressure applied to the punch Tp and the die Td reaches the mold centering pressure before the tip of the punch Tp is located at the mold centering start position Pstart, the metal It is determined that the mold centering has not been completed normally. In the I / O board 52, if the tip of the punch Tp is located at the mold centering limit position Plimit before the pressure applied to the punch Tp and the die Td reaches the mold centering pressure, the mold centering is completed normally. Judge that it did not exist.

The control device 50 (PC board 51) functions as an upper table elevating control unit that stops the lowering of the upper table 10 on which the punch Tp is mounted when the determination unit determines that the die centering is completed. When the determination unit determines that the mold centering has not been completed normally, the upper table elevating control unit stops the lowering of the upper table 10.

In FIGS. 8 and 9, the operator is notified by the sound generated by the speaker 80 and the message displayed on the display 61 whether or not the mold centering is normally completed. And at least one of the visual information on the display 61 may be notified. When the determination unit determines that the mold centering is completed, the control device 50 (PC board 51) notifies the operator that the mold centering is completed, and the determination unit normally completes the mold centering. If it is determined that the mold has not been centered, it functions as a notification unit for notifying the operator that the mold centering has not been completed normally.

The mold centering operation shown in FIG. 10 is executed by the processes shown in the flowcharts of FIGS. 5A, 5B, 8 and 9. In FIG. 10, (a) shows a state 1 in which the punch Tp is on the open side of the mold centering start position Pstart, and (b) shows a state 1 in which the tip of the punch Tp moved to the closed side starts mold centering. The state 2 in which the position Pstart has been reached is shown. In FIG. 10B, the mold centering start position Pstart is shown on the open side of the actual mold centering start position Pstart for easy understanding.

In FIG. 10, (c) shows a state 3 in which the tip of the punch Tp has passed the mold centering start position Pstart and is in contact with the V groove of the die Td, and (d) shows the state 3 in which the tip of the punch Tp is in contact with the mold centering. It shows a state 4 in which the mold centering work is completed by approaching the target position Ptarget.

In state 1, the center of the tip of the punch Tp and the center of the V-shaped groove of the die Td are deviated from each other. When the operator manually rotates the handle 62 clockwise to lower the upper table 10, the punch Tp is lowered, and the tip of the punch Tp comes into contact with the V-groove of the die Td to enter the state 3. When the punch Tp is further lowered, the die Td slides back and forth with respect to the center of the tip of the punch Tp.

Subsequently, when the punch Tp further decreases toward the mold centering target position Ptarget, the pressure applied to the punch Tp and the die Td reaches the mold centering pressure, and the center of the tip of the punch Tp and the V-shape of the die Td are formed. The state 4 is almost the same as the center of the groove.

When the die centering work is completed in this way, the operator releases the operation of the handle 62 and tightens the bolt 221 to fix the die Td to the die holder 22.

FIG. 11 shows an example of a state in which the position of the upper table 10 and the pressure applied to the punch Tp and the die Td change with the progress of time. The upper table 10 descends at high speed or low speed until the tip of the punch Tp reaches the mold centering start position Pstart, and descends at a very slow speed when reaching the mold centering start position Pstart.

The pressure applied to the punch Tp and the die Td changes as shown in the state 1 and the state 2, and the pressure increases in the state 3. In the state 4, the pressure reaches the mold centering pressure, the upper table 10 is stopped, and the upper table 10 is held at a substantially constant pressure.

As described above, according to the press brake die centering device and method of the present embodiment, the operator switches to the manual operation mode in which the upper table 10 is manually operated, and manually rotates the handle 62 to upper the upper table 10. All you have to do is lower the table 10. According to the die centering device and method of the press brake of the present embodiment, it is possible to perform the die centering operation with almost no risk of centering failure and mold damage.

The present invention is not limited to the present embodiment described above, and various modifications can be made without departing from the gist of the present invention.

10 Upper table 20 Lower table 22 Die holder 50 Control device 51 PC board 52 I / O board 53 PLC
61 Display 62 Handle 63 Handle Enabled Button 80 Speaker Td Die Tp Punch

Claims (6)

The maximum pressure is the product of the narrower width of the punch width and the die width multiplied by the lower pressure resistance of the punch pressure resistance and the die pressure resistance, and based on the maximum pressure. A mold centering pressure calculation unit that calculates the mold centering pressure when the punch and the die are centered.
Based on the heights of the punch, the die, and the die holder that holds the die, the die centering is the target position that the tip of the punch reaches when centering the punch and the die. Mold centering target position setting unit for setting the target position,
A mold centering restriction position setting unit that sets a mold centering restriction position that is a position lower than the mold centering target position and is a limit of a position where the tip of the punch reaches.
A mold centering start position setting unit that is located above the mold centering target position and sets a mold centering start position when the punch and the die are centered.
When the punch is lowered from above the mold centering start position toward the die, the tip of the punch is positioned between the mold centering start position and the mold centering restriction position. When the pressure applied to the punch and the die reaches the mold centering pressure in this state, a determination unit for determining that the mold centering is completed, and a determination unit.
When the determination unit determines that the centering of the mold is completed, the upper table elevating control unit that stops the lowering of the upper table on which the punch is mounted
When the determination unit determines that the mold centering is completed, the notification unit notifies the operator that the mold centering is completed at least on one of the visual information and the auditory information.
Mold centering devices of pulp-less brake equipped with. The determination unit receives the punch and the die when the pressure applied to the punch and the die reaches the mold centering pressure before the tip of the punch is located at the die centering start position, or applies to the punch and the die. If the tip of the punch is located at the die centering limiting position before the pressure reaches the die centering pressure, it is determined that the die centering has not been completed normally.
When the determination unit determines that the mold centering has not been completed normally, the upper table elevating control unit stops the lowering of the upper table.
When the determination unit determines that the mold centering has not been completed normally, the notification unit notifies the operator at least one of the visual information and the auditory information that the mold centering has not been completed normally. To do
Mold centering apparatus of a press brake according to請Motomeko 1. The mold centering pressure calculation unit sets a pressure obtained by multiplying the maximum pressure by a predetermined coefficient as the mold centering pressure, and the mold centering pressure is predetermined in a state where the punch is in contact with the die. The die centering device for a press brake according to claim 1 or 2, wherein the mold centering pressure is limited to the set pressure when the set pressure is exceeded. The control device sets the maximum pressure as the maximum pressure obtained by multiplying the narrower width of the punch width and the die width by the lower pressure resistance of the punch pressure resistance and the die pressure resistance. Based on, the mold centering pressure when centering the punch and the die is calculated.
At a target position where the tip of the punch reaches when the control device centers the punch and die based on the height of the punch, the die, and the die holder holding the die. Set a certain mold centering target position,
The control device sets a mold centering limit position, which is a position below the mold centering target position and is a limit of a position where the tip of the punch reaches.
The control device is located above the mold centering target position, and the mold centering start position when the punch and the die are centered is set.
When the control device lowers the punch from above the mold centering start position toward the die, the tip of the punch is at the mold centering start position and the mold centering restriction position. When the pressure applied to the punch and the die reaches the mold centering pressure while being located between and, it is determined that the mold centering is completed.
When it is determined that the mold centering is completed, the control device stops the lowering of the upper table on which the punch is mounted.
When it is determined that the mold centering is completed, the control device notifies the operator that the mold centering is completed by at least one of the visual information and the auditory information.
Mold centering method of flop-less brake. The control device applies the punch and the die when the pressure applied to the punch and the die reaches the mold centering pressure before the tip of the punch is located at the die centering start position, or applies to the punch and the die. If the tip of the punch is located at the die centering limiting position before the pressure reaches the die centering pressure, it is determined that the die centering has not been completed normally.
If it is determined that the mold centering has not been completed normally, the control device stops the lowering of the upper table.
If it is determined that the mold centering has not been completed normally, the control device notifies the operator at least one of the visual information and the auditory information that the mold centering has not been completed normally.
Mold centering method of the press brake according to請Motomeko 4. In the control device, the pressure obtained by multiplying the maximum pressure by a predetermined coefficient is defined as the mold centering pressure, and the mold centering pressure is a predetermined set pressure in a state where the punch is in contact with the die. The method for centering a die of a press brake according to claim 4 or 5, wherein the centering pressure of the die is limited to the set pressure.

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