JP6864076B2 - エラストマー系組成物及びその用途 - Google Patents
エラストマー系組成物及びその用途 Download PDFInfo
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- JP6864076B2 JP6864076B2 JP2019502582A JP2019502582A JP6864076B2 JP 6864076 B2 JP6864076 B2 JP 6864076B2 JP 2019502582 A JP2019502582 A JP 2019502582A JP 2019502582 A JP2019502582 A JP 2019502582A JP 6864076 B2 JP6864076 B2 JP 6864076B2
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- 239000000203 mixture Substances 0.000 title claims description 77
- 229920001971 elastomer Polymers 0.000 title claims description 8
- 239000000806 elastomer Substances 0.000 title claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 81
- 229920000642 polymer Polymers 0.000 claims description 66
- 239000000463 material Substances 0.000 claims description 62
- -1 polysiloxane Polymers 0.000 claims description 53
- 239000003054 catalyst Substances 0.000 claims description 33
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 30
- 239000003431 cross linking reagent Substances 0.000 claims description 27
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 claims description 27
- 238000009833 condensation Methods 0.000 claims description 20
- 230000005494 condensation Effects 0.000 claims description 20
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 19
- 150000001875 compounds Chemical class 0.000 claims description 16
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 14
- 238000001723 curing Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 14
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- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical group [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 6
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- 238000005538 encapsulation Methods 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 claims description 4
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- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 3
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 claims description 2
- PZRWFKGUFWPFID-UHFFFAOYSA-N 3,9-dioctadecoxy-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C1OP(OCCCCCCCCCCCCCCCCCC)OCC21COP(OCCCCCCCCCCCCCCCCCC)OC2 PZRWFKGUFWPFID-UHFFFAOYSA-N 0.000 claims description 2
- WPMYUUITDBHVQZ-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoic acid Chemical compound CC(C)(C)C1=CC(CCC(O)=O)=CC(C(C)(C)C)=C1O WPMYUUITDBHVQZ-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- CFXCGWWYIDZIMU-UHFFFAOYSA-N Octyl-3,5-di-tert-butyl-4-hydroxy-hydrocinnamate Chemical compound CCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 CFXCGWWYIDZIMU-UHFFFAOYSA-N 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 claims description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 2
- VYGRRCKMMADGBB-UHFFFAOYSA-N [3-hydroxy-2,2-bis(hydroxymethyl)propyl] phosphono hydrogen phosphate Chemical compound OCC(CO)(CO)COP(O)(=O)OP(O)(O)=O VYGRRCKMMADGBB-UHFFFAOYSA-N 0.000 claims description 2
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- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical class C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 claims description 2
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- 238000001125 extrusion Methods 0.000 claims description 2
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- JGSUMMPGKPITGK-UHFFFAOYSA-L zinc;n,n-dipentylcarbamodithioate Chemical compound [Zn+2].CCCCCN(C([S-])=S)CCCCC.CCCCCN(C([S-])=S)CCCCC JGSUMMPGKPITGK-UHFFFAOYSA-L 0.000 claims description 2
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- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims 2
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- SBKRBXBQFDKYSO-UHFFFAOYSA-N (3-tert-butyl-4-hydroxy-5-methylphenyl) propanoate Chemical compound CCC(=O)OC1=CC(C)=C(O)C(C(C)(C)C)=C1 SBKRBXBQFDKYSO-UHFFFAOYSA-N 0.000 claims 1
- HBZXUGZNUSHGGF-UHFFFAOYSA-N 2,6-ditert-butyl-4-(ethoxyphosphonoyloxymethyl)phenol Chemical compound CCOP(=O)OCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 HBZXUGZNUSHGGF-UHFFFAOYSA-N 0.000 claims 1
- DHTAIMJOUCYGOL-UHFFFAOYSA-N 2-ethyl-n-(2-ethylhexyl)-n-[(4-methylbenzotriazol-1-yl)methyl]hexan-1-amine Chemical compound C1=CC=C2N(CN(CC(CC)CCCC)CC(CC)CCCC)N=NC2=C1C DHTAIMJOUCYGOL-UHFFFAOYSA-N 0.000 claims 1
- YMVRFMCTZFUKIM-UHFFFAOYSA-N 2-tert-butyl-2-(4-hydroxyphenyl)-4,4-dimethylpentanamide Chemical compound C(C)(C)(C)CC(C(=O)N)(C1=CC=C(C=C1)O)C(C)(C)C YMVRFMCTZFUKIM-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims 1
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- 229910052791 calcium Inorganic materials 0.000 claims 1
- 239000011575 calcium Substances 0.000 claims 1
- SZRLKIKBPASKQH-UHFFFAOYSA-M dibutyldithiocarbamate Chemical compound CCCCN(C([S-])=S)CCCC SZRLKIKBPASKQH-UHFFFAOYSA-M 0.000 claims 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 claims 1
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 claims 1
- 239000000243 solution Substances 0.000 claims 1
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
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- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- DYHSBBDFFBVQSS-UHFFFAOYSA-J dicalcium;2,6-ditert-butyl-4-(1-phosphonatopropyl)phenol Chemical compound [Ca+2].[Ca+2].CCC(P([O-])([O-])=O)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1.CCC(P([O-])([O-])=O)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 DYHSBBDFFBVQSS-UHFFFAOYSA-J 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- GBFVZTUQONJGSL-UHFFFAOYSA-N ethenyl-tris(prop-1-en-2-yloxy)silane Chemical compound CC(=C)O[Si](OC(C)=C)(OC(C)=C)C=C GBFVZTUQONJGSL-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000003840 hydrochlorides Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- ZWXYOPPJTRVTST-UHFFFAOYSA-N methyl-tris(prop-1-en-2-yloxy)silane Chemical compound CC(=C)O[Si](C)(OC(C)=C)OC(C)=C ZWXYOPPJTRVTST-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- AUWJDAPPVUMSJY-UHFFFAOYSA-N n-methyl-3-triethoxysilyl-n-(3-triethoxysilylpropyl)propan-1-amine Chemical compound CCO[Si](OCC)(OCC)CCCN(C)CCC[Si](OCC)(OCC)OCC AUWJDAPPVUMSJY-UHFFFAOYSA-N 0.000 description 1
- WTXITWGJFPAEIU-UHFFFAOYSA-N n-methyl-3-trimethoxysilyl-n-(3-trimethoxysilylpropyl)propan-1-amine Chemical compound CO[Si](OC)(OC)CCCN(C)CCC[Si](OC)(OC)OC WTXITWGJFPAEIU-UHFFFAOYSA-N 0.000 description 1
- 125000005487 naphthalate group Chemical group 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 125000006353 oxyethylene group Chemical group 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 125000005003 perfluorobutyl group Chemical group FC(F)(F)C(F)(F)C(F)(F)C(F)(F)* 0.000 description 1
- VCAFTIGPOYBOIC-UHFFFAOYSA-N phenyl dihydrogen phosphite Chemical compound OP(O)OC1=CC=CC=C1 VCAFTIGPOYBOIC-UHFFFAOYSA-N 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- XPGAWFIWCWKDDL-UHFFFAOYSA-N propan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCC[O-].CCC[O-].CCC[O-].CCC[O-] XPGAWFIWCWKDDL-UHFFFAOYSA-N 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004526 silane-modified polyether Substances 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- UQMGAWUIVYDWBP-UHFFFAOYSA-N silyl acetate Chemical class CC(=O)O[SiH3] UQMGAWUIVYDWBP-UHFFFAOYSA-N 0.000 description 1
- GRJISGHXMUQUMC-UHFFFAOYSA-N silyl prop-2-enoate Chemical compound [SiH3]OC(=O)C=C GRJISGHXMUQUMC-UHFFFAOYSA-N 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 150000004867 thiadiazoles Chemical group 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000001425 triazolyl group Chemical group 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- 125000004205 trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Classifications
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
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- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/005—Stabilisers against oxidation, heat, light, ozone
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- C08K5/00—Use of organic ingredients
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- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3472—Five-membered rings
- C08K5/3475—Five-membered rings condensed with carbocyclic rings
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- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/39—Thiocarbamic acids; Derivatives thereof, e.g. dithiocarbamates
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- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/45—Heterocyclic compounds having sulfur in the ring
- C08K5/46—Heterocyclic compounds having sulfur in the ring with oxygen or nitrogen in the ring
- C08K5/47—Thiazoles
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- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
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- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
- C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
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- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C08L2312/00—Crosslinking
- C08L2312/08—Crosslinking by silane
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
- Silicon Polymers (AREA)
Description
(a)誘電体絶縁として機能することと、
(b)回路を湿気及び他の汚染物質から保護することと、
(c)構成部品上で機械応力及び熱応力を軽減することと、
により、高感度な回路に対する高レベルの応力緩和をもたらし、悪環境から電子アセンブリ及び構成部品を保護するために使用される。
(i)1分子当たり少なくとも1個、通常少なくとも2個のヒドロキシル官能基を有する、少なくとも1個の縮合硬化性シリル末端ポリマーと、
(ii)
1分子基当たり少なくとも2個の加水分解性基、あるいは少なくとも3個の加水分解性基を有するシラン、及び/又は
少なくとも2個のシリル基を有するシリル官能性分子であって、各シリル基が少なくとも1個の加水分解性基を含有するシリル官能性分子
の群から選択される架橋剤と、
(iii)チタネート及び/又はジルコネートの群から選択される縮合触媒と、
(iv)フリーラジカルの形成を防止する、又はフリーラジカルを除去する少なくとも1種の化学化合物と、
の縮合反応生成物であり、
全てのケイ素結合ヒドロキシル基の加水分解性基に対するモル比が、シランに関しては0.5:1〜2:1であり、シリル官能性分子に関しては0.5:1〜10:1であり、触媒M−OR官能基(Mはチタン又はジルコニウムである)の、合計のケイ素結合ヒドロキシル基に対するモル比が0.01:1〜0.5:1であることを特徴とする、シリコーン材料を提供する。
(i)1分子当たり少なくとも1個、通常少なくとも2個のヒドロキシル官能基を有する、少なくとも1個の縮合硬化性シリル末端ポリマーと、
(ii)
1分子基当たり少なくとも2個の加水分解性基、あるいは少なくとも3個の加水分解性基を有するシラン、及び/又は
少なくとも2個のシリル基を有するシリル官能性分子であって、各シリル基が少なくとも1個の加水分解性基を含有するシリル官能性分子
の群から選択される架橋剤と、
(iii)チタネート及び/又はジルコネートの群から選択される縮合触媒と、
(iv)フリーラジカルの形成を防止する、又はフリーラジカルを除去する少なくとも1種の化学化合物と、
を含み、
全てのケイ素結合ヒドロキシル基の加水分解性基に対するモル比が、シランに関しては0.5:1〜2:1であり、シリル官能性分子に関しては0.5:1〜10:1であり、触媒M−OR官能基(Mはチタン又はジルコニウムである)の、合計のケイ素結合ヒドロキシル基に対するモル比が0.01:1〜0.5:1であることを特徴とする、縮合硬化性シリコーン組成物について記載する。
X3−A−X1(1)
[式中、X3及びX1は独立して、ヒドロキシル又は加水分解性基で終了するシロキサン基から選択され、Aはポリマー鎖、あるいはシロキサンポリマー鎖を含有するシロキサン及び/又は有機物質である。]
を有することができる。
上で定義したとおりの−Si(OH)3、−(Ra)Si(OH)2、−(Ra)2Si(OH)、又は−(Ra)2Si−Rc−Si(Rd)p(OH)3−pが挙げられる。X3及び/又はX1末端基は、ヒドロキシジアルキルシリル基、例えばヒドロキシジメチルシリル基であるのが好ましい。
−(R5 sSiO(4−s)/2)− (2)
のシロキサン単位を含み、
式中、各R5は独立して、塩素又はフッ素などの1個以上のハロゲン基で任意に置換されている1〜10個の炭素原子を有するヒドロカルビル基などの有機基であり、sは0、1、又は2であり、通常sは約2である。基R5の具体例としては、メチル、エチル、プロピル、ブチル、ビニル、シクロヘキシル、フェニル、トリル、塩素又はフッ素で置換されたプロピル基(3,3,3−トリフルオロプロピル、クロロフェニル、β−(ペルフルオロブチル)エチル若しくはクロロシクロヘキシル基など)が挙げられる。好適には、少なくともいくつか、又はほぼ全ての基R5はメチルである。
−[−Re−O−(−Rf−O−)w−Pn−CRg 2−Pn−O−(−Rf−O−)q−Re]−
[式中、Pnは1,4−フェニレン基であり、各Reは同一であるか又は異なり、2〜8個の炭素原子を有する二価の炭化水素基であり、各Rfは同一であるか又は異なり、エチレン基又はプロピレン基であり、各Rgは同一であるか又は異なり、水素原子又はメチル基であり、下付き文字w及びqはそれぞれ、3〜30の範囲の正の整数である。]
の構造の単位を挙げることができる。
1分子基当たり少なくとも2個の加水分解性基、あるいは少なくとも3個の加水分解性基を有するシラン、及び/又は
少なくとも2個のシリル基を有するシリル官能性分子であって、各シリル基が少なくとも1個の加水分解性基を含有するシリル官能性分子である。
R” 4−rSi(OR5)r(3)
[式中、R5は上述したとおりであり、rは2、3、又は4の値を有する。]
により記述することができる。典型的なシランは、R”がメチル、エチル、又はビニル、又はイソブチルであるものである。R”は、直鎖及び分枝鎖アルキル、アリル、フェニル、及び置換フェニル、アセトキシ、オキシムから選択される有機基である。場合によっては、R5はメチル又はエチルを表し、rは3である。
(R4O)m(Y1)3−m−Si(CH2)x−((NHCH2CH2)t−Q(CH2)x)n−Si(OR4)m(Y1)3−m(4)
[式中、R4はC1−10アルキル基であり、Y1は1〜8個の炭素を含有するアルキル基であり、
Qは孤立電子対を有するへテロ原子を含有する化学基、例えばアミン、N−アルキルアミン、又は尿素であり、各xは1〜6の整数であり、tは0又は1であり、各mは独立して1、2、又は3であり、nは0又は1である。]
により表されるものなどの、少なくとも1個の加水分解性基を含有する、2個のシリル基を含有するポリマーであってよい。
などの式を有することができる。通常、各末端シリル基は、2又は3個のアルコキシ基を有する。
ビス(4−トリエトキシシリルブチル)アミン、ビス(3−トリメトキシシリルプロピル)N−メチルアミン、
ビス(3−トリエトキシシリルプロピル)N−メチルアミン、ビス(4−トリメトキシシリルブチル)N−メチルアミン、ビス(4−トリメトキシシリルブチル)N−メチルアミン、ビス(3−トリメトキシシリルプロピル)尿素、
ビス(3−トリメトキシシリルプロピル)尿素、ビス(4−トリメトキシシリルプロピル)尿素、ビス(4−トリエトキシシリルブチル)尿素、ビス(3−ジメトキシメチルシリルプロピル)アミン、ビス(3−ジエトキシメチルシリルプロピル)アミン、ビス(4−ジメトキシメチルシリルブチル)アミン、ビス(4−ジエトキシメチルシリルブチル)アミン、
ビス(3−ジメトキシメチルシリルプロピル)N−メチルアミン、
ビス(3−ジエトキシメチルシリルプロピル)N−メチルアミン、
ビス(4−ジメトキシメチルシリルブチル)N−メチルアミン、
ビス(4−ジエトキシメチルシリルブチル)N−メチルアミン、ビス(3−ジメトキシメチルシリルプロピル)尿素、ビス(3−ジエトキシメチルシリルプロピル)尿素、ビス(4−ジメトキシメチルシリルブチル)尿素、
ビス(4−ジエトキシメチルシリルブチル)尿素、ビス(3−ジメトキシエチルシリルプロピル)アミン、
ビス(3−ジエトキシエチルシリルプロピル)アミン、ビス(4−ジメトキシエチルシリルブチル)アミン、
ビス(4−ジエトキシエチルシリルブチル)アミン、ビス(3−ジメトキシエチルシリルプロピル)N−メチルアミン、ビス(3−ジエトキシエチルシリルプロピル)N−メチルアミン、ビス(4−ジメトキシエチルシリルブチル)N−メチルアミン、
ビス(4−ジエトキシエチルシリルブチル)N−メチルアミン、ビス(3−ジメトキシエチルシリルプロピル)尿素、ビス(3−ジエトキシエチルシリルプロピル)尿素、ビス(4−ジメトキシエチルシリルブチル)尿素、及び/又は
ビス(4−ジエトキシエチルシリルブチル)尿素、ビス(トリエトキシシリルプロピル)アミン、ビス(トリメトキシシリルプロピル)アミン、ビス(トリメトキシシリルプロピル)尿素、ビス(トリエトキシシリルプロピル)尿素、ビス(ジエトキシメチルシリルプロピル)N−メチルアミン、ジ又はトリアルコキシシリル末端ポリジアルキルシロキサン、ジ又はトリアルコキシシリル末端ポリアリールアルキルシロキサン、ジ又はトリアルコキシシリル末端ポリプロピレンオキシド、ポリウレタン、ポリアクリレート、ポリイソブチレン、ジ又はトリアセトキシシリル末端ポリジアルキル、ポリアリールアルキルシロキサン、ジ又はトリオキシモシリル末端ポリジアルキル、ポリアリールアルキルシロキサン、ジ又はトリアセトノキシ末端ポリジアルキル又はポリアリールアルキルが挙げられる。使用する架橋剤(ii)は、上述の2つ以上の任意の組み合わせもまた含んでよい。
2,5−ジメルカプト−1,3,4−チアジアゾール、N,N−ビス(2−エチルヘキシル)−ar−メチル−1H−ベンゾトリアゾール−1−メタンアミン、アルキル化ジフェニルアミン、亜鉛ジアミルジチオカルバメート、メチレンビス(ジブチルジチオカルバメート)であってよい。
a)1成分にポリマー(i)及び架橋剤(ii)、並びに別の成分にポリマー(i)及び触媒(iii)、
b)1成分に架橋剤(ii)、並びに別の成分にポリマー(i)及び触媒(iii)、又は
c)2種以上のポリマー(i)を利用する場合は、1成分に第1ポリマー(i)及び架橋剤(ii)、並びに別の成分に第2ポリマー(i)及び触媒(iii)、
d)1成分にポリマー(i)、並びに別の成分に架橋剤(ii)及び触媒(iii)。
各場合において、任意の充填剤、特に湿気含有充填剤が存在する場合、充填剤及び触媒は同じ成分中には存在しない。通常、存在する場合、充填剤は、他の添加剤もまた含有し得るベース成分中で、ポリマー(i)と混合される。
2つの成分は、任意の好適な比、例えば、ベース成分:触媒パッケージを、例えば15:1〜1:1、あるいは10:1〜1:1、あるいは5:1〜1:1、好ましくは1:1で混合することができる。
R5 eSi(OR6)4−e
[式中、R5は置換又は非置換の、6〜20個の炭素原子の一価の炭化水素基であり、例えば、ヘキシル、オクチル、ドデシル、テトラデシル、ヘキサデシル、及びオクタデシルなどのアルキル基、並びに、6〜20個の炭素原子のアルキル基を有する、ベンジル及びフェニルエチルなどのアラルキル基が好ましく、R6は1〜6個の炭素原子のアルキル基であり、文字eは1、2、又は3に等しい。]
などのシランもまた、充填剤用の処理剤として利用することができる。
ポリマー(i):OH末端ポリジメチルシロキサン(粘度約13,500mPa.s)
架橋剤(ii):1,6−ビス(トリメトキシシリル)ヘキサン、又は3−メルカプトプロピルトリメトキシシラン、又はトリメトキシシリル末端ポリジメチルシロキサン(粘度約56,000mPa.s)
触媒:テトラn−ブチルチタネート
抗酸化剤:Songnox 11B(Songwon Int.から入手可能なフェノール−ホスファイト抗酸化剤ブレンド)
腐食防止剤:Cuvan 826(Vanderbilt Chemicalsから入手可能な2,5−ジメルカプト−1,3,4−チアジアゾール誘導体)
比較の2成分ヒドロシリル化ゲル:Sylgard(登録商標)527シリコーン誘電体(ダウ・コーニング社から入手可能)
Claims (14)
- (i)1分子当たり少なくとも1個のヒドロキシル基を有する、少なくとも1個のポリシロキサン系ポリマーと、
(ii)1分子基当たり少なくとも2個の加水分解性基、あるいは少なくとも3個の加水分解性基を有するシラン、及び/又は
少なくとも2個のシリル基を有するシリル官能性分子であって、各シリル基が少なくとも1個の加水分解性基を含有するシリル官能性分子
の群から選択される架橋剤と、
(iii)チタネート及び/又はジルコネートの群から選択される縮合触媒と、
(iv)フリーラジカルの形成を防止する、又はフリーラジカルを除去する少なくとも1種の化学化合物と、
を含み、
構成成分(i)、(ii)、及び(iii)が全て同じ液中に存在せず、全てのケイ素結合ヒドロキシル基の全ての加水分解性基に対するモル比が、シランに関しては0.5:1〜2:1であり、シリル官能性分子に関しては0.5:1〜10:1であり、触媒M−OR官能基(Mはチタン又はジルコニウムである)の、合計のケイ素結合ヒドロキシル基に対するモル比が0.01:1〜0.5:1であることを特徴とし、
フリーラジカルの形成を防止する又はフリーラジカルを除去する少なくとも1種の化学化合物(iv)が、ペンタエリスリトールテトラキス(3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート)、トリエチレングリコールビス(3−tert−ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオネート、4,4’−チオビス(6−tert−ブチル−m−クレゾール)、(2−[1−(2−ヒドロキシ−3,5−ジ−tert−ペンチルフェニル)エチル]−4,6−ジ−tert−ペンチルフェニルアクリレート)、2,6−ジ−tert−ブチル−4−(4,6−ビス(オクチルチオ)−1,3,5−トリアジン−2−イルアミノ)フェノール、3,5−ビス(1,1−ジメチルエチル)−4−ヒドロキシベンゼンプロパン酸チオジ−2,1−エタンジイルエステル、2,4−ビス(ドデシルチオメチル)−6−メチルフェノール、オクタデシル3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート、N,N’−ヘキサン−1,6−ジイルビス(3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニルプロピオンアミド))、オクチル−3,5−ジ−tert−ブチル−4−ヒドロキシ−ヒドロシンナメート、カルシウムビス(モノエチル(3,5−ジ−tert−ブチル−4−ヒドロキシルベンジル)ホスホネート)、2,2’−メチレンビス(6−tert−ブチル−4−メチルフェノール)、(2−プロペン酸、2−(1,1−ジメチルエチル)−6−[[3−(1,1−ジメチルエチル)−2−ヒドロキシ−5−メチルフェニル]メチル]−4−メチルフェニルエステル)、ポリ(ジシクロペンタジエン−co−p−クレゾール)、2,5−ジ(tert−アミル)ヒドロキノン、及びこれらの混合物から選択される一次抗酸化剤、トリス(2,4−ジ−tert−ブチルフェニル)ホスファイト、O,O’−ジオクタデシルペンタエリスリトールビス(ホスファイト)、ビス(2,4−ジ−tert−ブチルフェニル)ペンタエリスリトールジホスフェートから選択される二次抗酸化剤、2,5−ジメルカプト−1,3,4−チアジアゾール、N,N−ビス(2−エチルヘキシル)−ar−メチル−1H−ベンゾトリアゾール−1−メタンアミン、アルキル化ジフェニルアミン、亜鉛ジアミルジチオカルバメート、及びメチレンビス(ジブチルジチオカルバメート)から選択される抗腐食性添加剤、又はこれらの混合物から選択される、シリコーン材料及び/又はエラストマーを作製するための多液型室温縮合硬化性シリコーン組成物。 - 前記液を、以下のとおりに分けることができる:
a)1液にポリマー(i)及び架橋剤(ii)、並びに別の液にポリマー(i)及び触媒(iii)、あるいは
b)1液に架橋剤(ii)、並びに別の液にポリマー(i)及び触媒(iii)、又は
c)2種以上のポリマー(i)を利用する場合は、1液に第1ポリマー(i)及び架橋剤(ii)、並びに別の液に第2ポリマー(i)及び触媒(iii)、又は
d)1液にポリマー(i)、並びに別の液に前記架橋剤(ii)及び触媒(iii)
2液で保管され、
化合物(iv)が、前記a)からd)においていずれかまたは両方の液中に存在してよい、請求項1に記載の多液型縮合硬化性シリコーン組成物。 - (i)1分子当たり少なくとも1個のヒドロキシル基を有する、少なくとも1個のポリシロキサン系ポリマーと、
(ii)1分子基当たり少なくとも2個の加水分解性基、あるいは少なくとも3個の加水分解性基を有するシラン、及び/又は
少なくとも2個のシリル基を有するシリル官能性分子であって、各シリル基が少なくとも1個の加水分解性基を含有するシリル官能性分子
の群から選択される架橋剤と、
(iii)チタネート及び/又はジルコネートの群から選択される縮合触媒と、
(iv)フリーラジカルの形成を防止する、又はフリーラジカルを除去する少なくとも1種の化学化合物と、
を含み、
全てのケイ素結合ヒドロキシル基の加水分解性基に対するモル比が、シランに関しては0.5:1〜2:1であり、シリル官能性分子に関しては0.5:1〜10:1であり、触媒M−OR官能基(Mはチタン又はジルコニウムである)の、合計のケイ素結合ヒドロキシル基に対するモル比が0.01:1〜0.5:1であることを特徴とする、
請求項1または2に記載の多液型縮合硬化性シリコーン組成物の縮合反応生成物である、シリコーン材料。 - 請求項1または2に記載の組成物から作製されるシリコーン材料を含む、電気部品又は電子部品用のシーラント。
- 請求項3に記載のシリコーン材料を備えた、電気部品又は電子部品。
- 前記電気部品又は電子部品が電力デバイスである、請求項5に記載の電気部品又は電子部品。
- 前記電力デバイスが、モーター制御装置、輸送用モーター制御装置、動力発生システム、又は宇宙輸送システムである、請求項6に記載の電気部品又は電子部品。
- 請求項1または2に記載の多液型縮合硬化性シリコーン組成物を使用した、半導体チップの保護方法。
- 電気部品又は電子部品の封止、ポッティング、カプセル化、又は充填のための、請求項3に記載のシリコーン材料から作製されるゲルの使用。
- 請求項1または2に記載の多液型組成物を混合し、得られた混合物を硬化することによる、請求項4に記載のシリコーン材料の作製方法。
- 電子デバイス、太陽光起電力モジュール、及び/又は発光ダイオード用のカプセル化用材料又はポッタントとしての、請求項3に記載のシリコーン材料の使用。
- 感圧接着剤としての、又は、振動若しくは音緩衝用途における、又は、ディスプレイ若しくは導波管用の積層体、接着剤、光学的に透明なコーティングの製造における、請求項3に記載のシリコーン材料から作製したゲルの使用。
- 積層プロセスにおいて基材を積層するための、請求項3に記載のシリコーン材料の使用。
- 前記混合物が、カーテンコーター、スプレー装置、ダイコーター、ディップコーター、押出コーター、ナイフコーター、及びスクリーンコーターから選択される散布器を使用して、硬化前に基材上に適用される、請求項10に記載の方法。
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GBGB1613413.2A GB201613413D0 (en) | 2016-08-03 | 2016-08-03 | Elastomeric compositions and their applications |
PCT/EP2017/069743 WO2018024856A1 (en) | 2016-08-03 | 2017-08-03 | Elastomeric compositions and their applications |
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EP3250630A1 (en) | 2015-01-28 | 2017-12-06 | Dow Corning Corporation | Elastomeric compositions and their applications |
GB201613414D0 (en) | 2016-08-03 | 2016-09-14 | Dow Corning | Elastomeric compositions and their applications |
GB201613412D0 (en) | 2016-08-03 | 2016-09-14 | Dow Corning | Elastomeric compositions and their applications |
GB201613397D0 (en) | 2016-08-03 | 2016-09-14 | Dow Corning | Cosmetic composition comprising silicone materials |
GB201613399D0 (en) | 2016-08-03 | 2016-09-14 | Dow Corning | Cosmetic composition comprising silicone materials |
GB201707439D0 (en) | 2017-05-09 | 2017-06-21 | Dow Corning | Lamination Process |
GB201707437D0 (en) * | 2017-05-09 | 2017-06-21 | Dow Corning | Lamination adhesive compositions and their applications |
WO2021068187A1 (en) * | 2019-10-11 | 2021-04-15 | Dow Silicones Corporation | Silicone compositions and their applications |
EP4180488A1 (en) * | 2020-07-07 | 2023-05-17 | Shin-Etsu Chemical Co., Ltd. | Two-component type room temperature fast-curing organopolysiloxane composition, cured product thereof and article |
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US5840794A (en) * | 1997-01-10 | 1998-11-24 | Dow Corning Corporation | Alkoxy functional sealants with rapid development of green strength |
WO2000075234A1 (fr) * | 1999-06-08 | 2000-12-14 | Rhodia Chimie | Compositions a base d'organopolysiloxanes et de polymere silyle durcissant en elastomeres des la temperature ambiante en presence d'humidite |
US20060122295A1 (en) * | 2002-10-08 | 2006-06-08 | Borealis Polymers Oy | Stabilized polymer composition |
US20070244249A1 (en) * | 2006-04-06 | 2007-10-18 | General Electric Company | Two-part translucent silicone rubber-forming composition |
JP5127277B2 (ja) * | 2007-04-05 | 2013-01-23 | 新日鉄住金マテリアルズ株式会社 | 表面平坦性絶縁膜形成用塗布溶液、表面平坦性絶縁膜被覆基材、及び表面平坦性絶縁膜被覆基材の製造方法 |
WO2010000638A1 (en) * | 2008-07-02 | 2010-01-07 | Basf Se | Blends of stabilizers for aliphatic polyesters |
US9051435B2 (en) * | 2008-12-16 | 2015-06-09 | The Yokohama Rubber Co., Ltd. | Silanol condensation catalyst, heat-curable silicone resin composition for sealing photosemiconductors and sealed photosemiconductor using same |
JP5180140B2 (ja) | 2009-04-20 | 2013-04-10 | 帝人株式会社 | 脂肪族ポリエステル樹脂組成物及び脂肪族ポリエステル樹脂成形体 |
MX2012003993A (es) * | 2009-10-26 | 2012-08-15 | Dow Corning | Composiciones de organosiloxano. |
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CN105505297A (zh) * | 2016-01-15 | 2016-04-20 | 浙江新安化工集团股份有限公司 | 耐黄变、贮存良好单组份脱醇型太阳能光伏组件密封胶及其制备方法 |
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US20200190324A1 (en) | 2020-06-18 |
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CN109476918B (zh) | 2021-12-31 |
WO2018024856A1 (en) | 2018-02-08 |
EP3494178B1 (en) | 2020-06-03 |
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