JP6851956B2 - ディジタルミラー装置を冷却するためのシステム及び方法 - Google Patents

ディジタルミラー装置を冷却するためのシステム及び方法 Download PDF

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Publication number
JP6851956B2
JP6851956B2 JP2017226306A JP2017226306A JP6851956B2 JP 6851956 B2 JP6851956 B2 JP 6851956B2 JP 2017226306 A JP2017226306 A JP 2017226306A JP 2017226306 A JP2017226306 A JP 2017226306A JP 6851956 B2 JP6851956 B2 JP 6851956B2
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Prior art keywords
heat sink
digital micromirror
coolant
micromirror device
cooling
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JP2017226306A
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Japanese (ja)
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JP2018101777A5 (https=
JP2018101777A (ja
Inventor
ロジャー・ジー・レイトン
マーク・エイ・アディレッタ
クリストファー・ディー・アトウッド
アリ・アール・ダーガム
フランシスコ・ジリーリ
ゲイリー・ディー・レディング
ピーター・ジェイ・ニストロム
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Xerox Corp
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Xerox Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G02B7/1815—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation with cooling or heating systems

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2017226306A 2016-12-20 2017-11-24 ディジタルミラー装置を冷却するためのシステム及び方法 Expired - Fee Related JP6851956B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/384,411 2016-12-20
US15/384,411 US10629515B2 (en) 2016-12-20 2016-12-20 System and method for cooling digital mirror devices

Publications (3)

Publication Number Publication Date
JP2018101777A JP2018101777A (ja) 2018-06-28
JP2018101777A5 JP2018101777A5 (https=) 2021-01-07
JP6851956B2 true JP6851956B2 (ja) 2021-03-31

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JP2017226306A Expired - Fee Related JP6851956B2 (ja) 2016-12-20 2017-11-24 ディジタルミラー装置を冷却するためのシステム及び方法

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Country Link
US (1) US10629515B2 (https=)
JP (1) JP6851956B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11126071B2 (en) * 2017-07-28 2021-09-21 Barco N.V. Spatial light modulating devices with cooling
US10508803B2 (en) * 2018-02-06 2019-12-17 Xerox Corporation Synthetic jets to cool digital micromirror devices
CN108957920B (zh) * 2018-08-08 2020-03-17 四川长虹电器股份有限公司 一种高功率照明dmd芯片循环泡沫材料液冷却装置
US11149937B2 (en) * 2020-01-30 2021-10-19 Toyota Motor Engineering & Manufacturing North America, Inc. Functionally graded manifold microchannel heat sinks
CN114895533A (zh) * 2022-05-16 2022-08-12 杭州新诺微电子有限公司 一种多场景模块化ldi风冷dmd相变散热机构
KR20240071670A (ko) 2022-11-16 2024-05-23 현대모비스 주식회사 고안정성 램프 방열 시스템
DE202023106158U1 (de) 2022-11-16 2024-01-12 Hyundai Mobis Co., Ltd. Leuchten-Wärmeableitungssystem

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4748495A (en) * 1985-08-08 1988-05-31 Dypax Systems Corporation High density multi-chip interconnection and cooling package
US5490009A (en) * 1994-10-31 1996-02-06 Texas Instruments Incorporated Enhanced resolution for digital micro-mirror displays
US6421165B2 (en) * 1996-02-07 2002-07-16 Light & Sound Design Ltd. Programmable light beam shape altering device using programmable micromirrors
US5940271A (en) 1997-05-02 1999-08-17 Lsi Logic Corporation Stiffener with integrated heat sink attachment
JP3853167B2 (ja) * 2000-03-24 2006-12-06 ヒューレット・パッカード・カンパニー 現場交換可能モジュール
KR100332967B1 (ko) * 2000-05-10 2002-04-19 윤종용 디지털 마이크로-미러 디바이스 패키지의 제조 방법
US6345507B1 (en) * 2000-09-29 2002-02-12 Electrografics International Corporation Compact thermoelectric cooling system
US6814445B2 (en) 2001-06-30 2004-11-09 Texas Instruments Incorporated DMD heat sink socket assembly
US6816375B2 (en) 2001-08-03 2004-11-09 Texas Instruments Incorporated Heat sink attachment
US6545352B1 (en) 2002-02-15 2003-04-08 Ericsson Inc. Assembly for mounting power semiconductive modules to heat dissipators
US7032389B2 (en) * 2003-12-12 2006-04-25 Thermoelectric Design, Llc Thermoelectric heat pump with direct cold sink support
US6992382B2 (en) * 2003-12-29 2006-01-31 Intel Corporation Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon
JP4343032B2 (ja) * 2004-05-31 2009-10-14 株式会社東芝 冷却構造および投射型画像表示装置
US7149087B2 (en) * 2004-09-08 2006-12-12 Thermal Corp. Liquid cooled heat sink with cold plate retention mechanism
US20070020107A1 (en) * 2005-06-29 2007-01-25 Ioan Sauciuc High pressure pump for cooling electronics
US7564129B2 (en) * 2007-03-30 2009-07-21 Nichicon Corporation Power semiconductor module, and power semiconductor device having the module mounted therein
US9453691B2 (en) * 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
TWI345127B (en) 2007-11-27 2011-07-11 Coretronic Corp Dmd module
US8232637B2 (en) * 2009-04-30 2012-07-31 General Electric Company Insulated metal substrates incorporating advanced cooling
US20100328619A1 (en) * 2009-06-24 2010-12-30 Harland Mark A Cooling cell for light modulator
US8384984B2 (en) * 2011-03-28 2013-02-26 Lighting Science Group Corporation MEMS wavelength converting lighting device and associated methods
US8508791B1 (en) * 2012-01-23 2013-08-13 Xerox Corporation Image feedforward laser power control for a multi-mirror based high power imager
JP6006480B2 (ja) * 2011-07-29 2016-10-12 株式会社ティラド 液冷ヒートシンク
US8872875B2 (en) 2011-08-24 2014-10-28 Palo Alto Research Center Incorporated Single-pass imaging system with anamorphic optical system
TW201400972A (zh) * 2012-06-29 2014-01-01 Delta Electronics Inc 適用於數位光源投影系統之散熱模組
US9265176B2 (en) * 2013-03-08 2016-02-16 International Business Machines Corporation Multi-component electronic module with integral coolant-cooling
US10214109B2 (en) * 2013-11-28 2019-02-26 Fuji Electric Co., Ltd. Method for manufacturing cooler for semiconductor-module, cooler for semiconductor-module, semiconductor-module and electrically-driven vehicle
JP2015159254A (ja) * 2014-02-25 2015-09-03 三桜工業株式会社 冷却装置及び冷却装置の製造方法
US10107467B2 (en) * 2014-06-26 2018-10-23 Texas Instruments Incorporated Methods and apparatus for illumination with DMD and laser modulated adaptive beam shaping
EP3026490B1 (en) * 2014-11-28 2018-06-20 Ricoh Company, Ltd. Image projection device and image projection method
US9693488B2 (en) * 2015-02-13 2017-06-27 Deere & Company Electronic assembly with one or more heat sinks
US9952486B2 (en) * 2015-03-18 2018-04-24 Ricoh Company, Ltd. High resolution image projection apparatus with horizontally actuated image generation unit
WO2016203885A1 (ja) * 2015-06-17 2016-12-22 富士電機株式会社 パワー半導体モジュール及び冷却器
DE102015211473A1 (de) * 2015-06-22 2016-12-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Klimatisierung eines Raumes
US9819916B2 (en) * 2015-12-25 2017-11-14 Ricoh Company, Ltd. Movable apparatus, image generation apparataus, and image projection apparatus

Also Published As

Publication number Publication date
US20180177076A1 (en) 2018-06-21
US10629515B2 (en) 2020-04-21
JP2018101777A (ja) 2018-06-28

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