JP6837291B2 - Wafer rotation holding mechanism and method for rotary table and wafer rotation holding device - Google Patents
Wafer rotation holding mechanism and method for rotary table and wafer rotation holding device Download PDFInfo
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- 230000007246 mechanism Effects 0.000 title claims description 43
- 238000000034 method Methods 0.000 title claims description 28
- 230000002093 peripheral effect Effects 0.000 claims description 37
- 230000005674 electromagnetic induction Effects 0.000 claims description 4
- 238000005530 etching Methods 0.000 description 20
- 238000004140 cleaning Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- -1 spin etching Chemical compound 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
本発明は、ウェーハ回転保持装置における回転テーブル用ウェーハ回転保持機構及び方法並びにウェーハ回転保持装置に関する。 The present invention relates to a wafer rotation holding mechanism and method for a rotary table in a wafer rotation holding device, and a wafer rotation holding device.
従来、半導体製造工程において、スピンエッチング、スピン乾燥、スピンコーティング等のようにシリコンなどの半導体ウェーハを回転させつつ各種の処理を行う工程（スピンプロセスとも呼ばれる）が増加してきている。具体的な装置としては、スピンエッチング装置、スピン乾燥装置、スピンコーティング装置等のウェーハ回転保持装置が知られている。その他、デバイスの製造工程におけるウェーハ表面の処理としては、バックグラインディング後のダメージ層を除去するためのエッチング処理の他に、現像液のウェーハへの塗布、回路パターンを露光したウェーハ表面に現像液が塗布されたウェーハに半導体回路を焼き付けたものの現像処理、ウェーハ表面の洗浄等をあげることができる。このようなウェーハをスピン処理するためのウェーハ回転保持装置や方法として、例えば特許文献１〜４に記載される装置や方法がある。 Conventionally, in the semiconductor manufacturing process, a process (also called a spin process) of performing various processes while rotating a semiconductor wafer such as silicon, such as spin etching, spin drying, and spin coating, has been increasing. As a specific device, a wafer rotation holding device such as a spin etching device, a spin drying device, and a spin coating device is known. In addition, as the treatment of the wafer surface in the device manufacturing process, in addition to the etching treatment for removing the damaged layer after back grinding, the developer is applied to the wafer, and the developer is applied to the surface of the wafer exposed to the circuit pattern. Development processing of a wafer coated with a semiconductor circuit on which a semiconductor circuit is printed, cleaning of the wafer surface, and the like can be mentioned. As a wafer rotation holding device and method for spin processing such a wafer, for example, there are devices and methods described in Patent Documents 1 to 4.
図４は従来のウェーハ回転保持装置を示す概略模式図であり、図５は図４の駆動部の詳細を示す要部拡大図である。図４及び図５に示した如く、従来のウェーハ回転保持装置３０における回転テーブル３２上のウェーハＷの保持方法は、１本の可動ピン３４と２本の固定ピン３６で構成される、３本の外周ピンでウェーハＷを保持するものである。図４において符号４０はウェーハＷの下面を支持するための支持ピンである。 FIG. 4 is a schematic schematic view showing a conventional wafer rotation holding device, and FIG. 5 is an enlarged view of a main part showing details of the drive unit of FIG. As shown in FIGS. 4 and 5, the method of holding the wafer W on the rotary table 32 in the conventional wafer rotation holding device 30 is composed of three movable pins 34 and two fixing pins 36. The wafer W is held by the outer peripheral pin of the above. In FIG. 4, reference numeral 40 is a support pin for supporting the lower surface of the wafer W.
ウェーハＷの投入の際には可動ピン３４を外側に開き、ウェーハＷをセットし、次に可動ピン３４を閉じる事により固定ピン３６側にウェーハＷを押し付け保持を行う。ウェーハＷを一度保持するとその状態でスピン処理を行い、スピン処理完了後、可動ピン３４を開きウェーハＷを取り出す構造になっている。可動ピン３４の駆動伝達方法はスピン停止中に外部から非回転構造物に取付けたシリンダー３８で押し上げ開閉を行う。スピン処理中は可動ピン３４がヒンジ構造になっておりスプリングにてウェーハＷを常時一定の圧力で固定ピン３６側に押し付けて保持する。 When the wafer W is loaded, the movable pin 34 is opened to the outside, the wafer W is set, and then the movable pin 34 is closed to press the wafer W toward the fixing pin 36 and hold the wafer W. Once the wafer W is held, spin processing is performed in that state, and after the spin processing is completed, the movable pin 34 is opened to take out the wafer W. The drive transmission method of the movable pin 34 is to push up and open and close by a cylinder 38 attached to the non-rotating structure from the outside while the spin is stopped. During the spin process, the movable pin 34 has a hinge structure, and the wafer W is constantly pressed against the fixing pin 36 side with a constant pressure by a spring to hold the wafer W.
前述した従来の回転テーブル３２に置いたウェーハＷを外周ピンにて固定する方法では、外周ピンの保持位置が処理中、一定である為、その部分にエッチングによるピンの痕跡が発生したり、接触部に洗浄残りが発生し、又ピンによる外周回り込みが阻害されバラツキが発生するといった問題があった。 In the above-mentioned method of fixing the wafer W placed on the rotary table 32 with the outer peripheral pin, since the holding position of the outer peripheral pin is constant during the processing, traces of the pin due to etching may occur or contact with the portion. There is a problem that a cleaning residue is generated in the portion, and the outer circumference is hindered by the pin to cause variation.
本発明は、上記従来技術に鑑みてなされたもので、外周ガイドピンを回転させる事によりウェーハとの接触位置をスピン処理中に移動させエッチングによる外周ピンの痕跡を軽減させ、洗浄残りを無くす事ができるようにした、回転テーブル用ウェーハ回転保持機構及び方法並びにウェーハ回転保持装置を提供することを目的とする。 The present invention has been made in view of the above-mentioned prior art, and by rotating the outer peripheral guide pin, the contact position with the wafer is moved during the spin processing to reduce the trace of the outer peripheral pin due to etching and eliminate the cleaning residue. It is an object of the present invention to provide a wafer rotation holding mechanism and method for a rotary table and a wafer rotation holding device.
上記課題を解決するために、本発明の回転テーブル用ウェーハ回転保持機構は、ウェーハ回転保持装置の回転テーブル用ウェーハ回転保持機構であって、回転軸と、前記回転軸の先端に載置され且つ上面にウェーハを保持する回転テーブルと、前記回転軸に動力を供給する駆動モータと、前記回転テーブルに設けられ且つウェーハの外周を保持するための回転可能な外周ガイドピンと、を有する、回転テーブル用ウェーハ回転保持機構である。 In order to solve the above problems, the rotary table wafer rotation holding mechanism of the present invention is a rotary table wafer rotation holding mechanism of the wafer rotation holding device, and is mounted on the rotation shaft and the tip of the rotation shaft. For a rotary table having a rotary table that holds the wafer on the upper surface, a drive motor that supplies power to the rotary shaft, and a rotatable outer peripheral guide pin that is provided on the rotary table and that holds the outer periphery of the wafer. It is a wafer rotation holding mechanism.
前記外周ガイドピンが、前記回転テーブル内に設けられた回転制御用モータにより制御されることが好適である。 It is preferable that the outer peripheral guide pin is controlled by a rotation control motor provided in the rotary table.
本発明の回転テーブル用ウェーハ回転保持方法は、前記回転テーブル用ウェーハ回転保持機構を用いて、前記ウェーハを回転保持してなる回転テーブル用ウェーハ回転保持方法である。 The rotary table wafer rotation holding method of the present invention is a rotary table wafer rotation holding method in which the wafer is rotationally held by using the rotary table wafer rotation holding mechanism.
本発明のウェーハ回転保持装置は、前記回転テーブル用ウェーハ回転保持機構を備えてなるウェーハ回転保持装置である。 The wafer rotation holding device of the present invention is a wafer rotation holding device including the wafer rotation holding mechanism for a rotary table.
前記ウェーハ回転保持装置が、スピン処理機構を備えるのが好適である。 It is preferable that the wafer rotation holding device includes a spin processing mechanism.
本発明によれば、外周ガイドピンを回転させる事によりウェーハとの接触位置をスピン処理中に移動させエッチングによる外周ピンの痕跡を軽減させ、洗浄残りやバラツキを無くす事ができるようにした、回転テーブル用ウェーハ回転保持機構及び方法並びにウェーハ回転保持装置を提供することができるという著大な効果を奏する。 According to the present invention, by rotating the outer peripheral guide pin, the contact position with the wafer is moved during the spin processing to reduce the trace of the outer peripheral pin due to etching, and it is possible to eliminate the cleaning residue and the variation. It has a great effect of being able to provide a wafer rotation holding mechanism and method for a table and a wafer rotation holding device.
以下に本発明の実施の形態を説明するが、これら実施の形態は例示的に示されるもので、本発明の技術思想から逸脱しない限り種々の変形が可能なことはいうまでもない。図示において、同一部材は同一符号であらわされる。 Embodiments of the present invention will be described below, but these embodiments are shown by way of example, and it goes without saying that various modifications are possible as long as they do not deviate from the technical idea of the present invention. In the figure, the same members are represented by the same reference numerals.
図１及び図２において、符号１０は、本発明の回転テーブル用ウェーハ回転保持機構を示す。回転テーブル用ウェーハ回転保持機構１０は、ウェーハ回転保持装置１１の回転テーブル用ウェーハ保持機構であって、回転軸１８と、前記回転軸１８の先端に載置され且つ上面にウェーハＷを保持する回転テーブル１２と、前記回転軸１８に動力を供給する駆動モータ２０と、前記回転テーブル１２に設けられ且つウェーハＷの外周を保持するための回転可能な外周ガイドピン１６と、を有するものである。図１及び２において、符号１４はウェーハＷの外周を保持する外周ピンであり、図３及び４の可動ピン３４と同様、ウェーハＷのセット時に開閉する可動ピンである。該可動ピン１４は回転可能としてもよい。符号２４はウェーハＷの下面を支持するための支持ピンである。 In FIGS. 1 and 2, reference numeral 10 indicates a wafer rotation holding mechanism for a rotary table of the present invention. The rotary table wafer rotation holding mechanism 10 is a rotary table wafer holding mechanism of the wafer rotation holding device 11, and is a rotation shaft 18 and a rotation that is placed on the tip of the rotary shaft 18 and holds the wafer W on the upper surface. It has a table 12, a drive motor 20 that supplies power to the rotary shaft 18, and a rotatable outer peripheral guide pin 16 that is provided on the rotary table 12 and holds the outer circumference of the wafer W. In FIGS. 1 and 2, reference numeral 14 is an outer peripheral pin that holds the outer circumference of the wafer W, and is a movable pin that opens and closes when the wafer W is set, like the movable pin 34 of FIGS. 3 and 4. The movable pin 14 may be rotatable. Reference numeral 24 is a support pin for supporting the lower surface of the wafer W.
本発明の回転保持機構１０は、外周ガイドピン１６を回転させる事により回転テーブル１２上でウェーハＷを回転させるものであり、これにより外周ピンとウェーハＷとの接触位置をスピン処理中に移動させ、エッチングによる外周ピンの痕跡を軽減させ、ムラを減少させ、洗浄残りを無くす事ができる。 The rotation holding mechanism 10 of the present invention rotates the wafer W on the rotary table 12 by rotating the outer peripheral guide pin 16, whereby the contact position between the outer peripheral pin and the wafer W is moved during the spin process. It is possible to reduce the traces of the outer peripheral pin due to etching, reduce unevenness, and eliminate the cleaning residue.
外周ガイドピン１６の回転駆動方法は特に制限はないが、図１に示した如く、回転テーブル１２内部に外周ガイドピン１６の回転を制御する回転制御用モータ２２を組み込み、複数の外周ガイドピン１６を連動して一定方向に回転させ、ウェーハＷに伝達することによりウェーハＷを回転させ、ウェーハＷの外周ガイドピン１６に接する位置をずらし、ウェーハＷにおける外周ピンの痕跡を無くす方法が好適である。複数の外周ガイドピンを連動して一定方向に回転させる方法としては、例えば、複数の外周ガイドピンを回転テーブル内部にてギヤで連結させ、回転テーブル内部に設けた回転制御用モータによりギヤを回転させることが好ましい。 The rotation driving method of the outer peripheral guide pin 16 is not particularly limited, but as shown in FIG. 1, a rotation control motor 22 for controlling the rotation of the outer peripheral guide pin 16 is incorporated inside the rotary table 12, and a plurality of outer peripheral guide pins 16 are incorporated. A method is preferable in which the wafer W is rotated by interlocking and rotating in a fixed direction and transmitted to the wafer W, the position of the wafer W in contact with the outer peripheral guide pin 16 is shifted, and the trace of the outer peripheral pin on the wafer W is eliminated. .. As a method of interlocking a plurality of outer peripheral guide pins to rotate in a fixed direction, for example, a plurality of outer peripheral guide pins are connected by a gear inside the rotary table, and the gear is rotated by a rotation control motor provided inside the rotary table. It is preferable to let it.
外周ガイドピン１６の回転速度は特に制限はないが、ウェーハＷに痕跡を残さない程度にウェーハが回転すればよく、例えば、エッチング処理時間６０秒（約２０μｍ）において外周ガイドピンを１０〜３０ｍｍ／分の速度で回転させ、１０〜３０ｍｍ程度ウェーハＷを移動させる事により、外周ピンの痕跡を軽減させることができる。 The rotation speed of the outer peripheral guide pin 16 is not particularly limited, but the wafer may rotate to such an extent that no trace is left on the wafer W. For example, the outer peripheral guide pin is set to 10 to 30 mm / 30 mm in an etching processing time of 60 seconds (about 20 μm). By rotating the wafer W at a speed of 1 minute and moving the wafer W by about 10 to 30 mm, the trace of the outer peripheral pin can be reduced.
図示例では、回転軸１８はＳＵＳ（ステンレス鋼）製、回転テーブル１２は工業用プラスチックなどの合成樹脂製である。回転テーブル１２の回転数は特に制限はないが、１００〜１０００ｒｐｍが好適である。 In the illustrated example, the rotary shaft 18 is made of SUS (stainless steel), and the rotary table 12 is made of synthetic resin such as industrial plastic. The number of rotations of the rotary table 12 is not particularly limited, but 100 to 1000 rpm is preferable.
外周ガイドピン１６の形状は特に制限はないが、円柱形状が好適である。図示例では直径３ｍｍ程度の円柱形状のピンである。外周ガイドピン１６は複数本設けられ、４本以上設けられることが望ましく、オリエンテーションフラット（ＯＦ）又はノッチに対応して設けることが好適である。外周ガイドピン１６の配置は均等が望ましい。 The shape of the outer peripheral guide pin 16 is not particularly limited, but a cylindrical shape is preferable. In the illustrated example, it is a cylindrical pin having a diameter of about 3 mm. A plurality of outer peripheral guide pins 16 are provided, and it is desirable that four or more of them are provided, and it is preferable to provide them corresponding to an orientation flat (OF) or a notch. It is desirable that the outer peripheral guide pins 16 are evenly arranged.
回転制御用モータの電源供給方法としては特に制限はなく、例えば、回転テーブル内に電池を組み込み電源を供給し、回転テーブルを回転にする事により遠心力にてモータ駆動のスイッチングを行う方法、回転軸からスリップリングを利用して電源を供給し、給電と同時に回転を開始する方法、電磁誘導を使用して回転テーブルに電源を供給し、給電と同時に回転を開始する方法等が挙げられる。 The power supply method of the rotation control motor is not particularly limited. For example, a method of incorporating a battery in a rotary table to supply power and rotating the rotary table to switch the motor drive by centrifugal force, rotation. Examples include a method of supplying power from a shaft using a slip ring and starting rotation at the same time as power supply, a method of supplying power to a rotary table using electromagnetic induction and starting rotation at the same time as power supply.
電源供給手段として電磁誘導による方法を用いた一つの実施の形態として、電力供給機構７０を図３に示す。図３において、電力供給機構７０は、回転軸１８と、前記回転軸１８の先端に載置され且つ上面にウェーハＷを保持する回転テーブル１２と、前記回転軸１８に動力を供給する駆動モータ２０と、前記回転軸１８の周囲に巻回された固定側１次コイル７２と、前記固定側１次コイル７２に接続された電力供給源７４と、前記固定側１次コイル７２に対応して所定距離離間して設けられ、且つ前記回転テーブル１２に取り付けられた回転テーブル側２次コイル７６と、を含むものである。前記回転テーブル側２次コイル７６に電線８０を介して回転制御用モータを接続することにより、電磁誘導により、前記２次コイル７６を介して回転制御用モータに電力が供給される。 FIG. 3 shows a power supply mechanism 70 as an embodiment using a method by electromagnetic induction as a power supply means. In FIG. 3, the power supply mechanism 70 includes a rotary shaft 18, a rotary table 12 mounted on the tip of the rotary shaft 18 and holding a wafer W on the upper surface, and a drive motor 20 for supplying power to the rotary shaft 18. A fixed side primary coil 72 wound around the rotating shaft 18, a power supply source 74 connected to the fixed side primary coil 72, and a predetermined position corresponding to the fixed side primary coil 72. It includes a rotary table side secondary coil 76 which is provided at a distance and is attached to the rotary table 12. By connecting the rotation control motor to the rotary table side secondary coil 76 via the electric wire 80, electric power is supplied to the rotation control motor via the secondary coil 76 by electromagnetic induction.
本発明のウェーハ回転保持装置が、スピン処理機構を備えることが好適である。該スピン処理機構としては、例えば、スピンエッチング装置、スピン乾燥装置、スピンコーティング装置等における、エッチング処理機構、乾燥機構、コーティング機構等が挙げられる。その他のスピン処理機構としては、デバイスの製造工程におけるウェーハ表面の処理として、バックグラインディング後のダメージ層を除去するためのエッチング処理機構の他に、現像液のウェーハへの塗布機構、回路パターンを露光したウェーハ表面に現像液が塗布されたウェーハに半導体回路を焼き付けたものの現像処理機構、ウェーハ表面の洗浄機構等が挙げられる。使用される処理薬液としては特に制限はなく、酸系／アルカリ系のエッチング洗浄液、及びリンス水が好適に用いられる。 It is preferable that the wafer rotation holding device of the present invention includes a spin processing mechanism. Examples of the spin processing mechanism include an etching processing mechanism, a drying mechanism, a coating mechanism, and the like in a spin etching apparatus, a spin drying apparatus, a spin coating apparatus, and the like. Other spin processing mechanisms include an etching processing mechanism for removing the damaged layer after back grinding, a mechanism for applying the developer to the wafer, and a circuit pattern as the treatment of the wafer surface in the device manufacturing process. Examples thereof include a development processing mechanism for a wafer in which a developing solution is applied to an exposed wafer surface and a semiconductor circuit printed on the wafer, a wafer surface cleaning mechanism, and the like. The treatment chemical solution to be used is not particularly limited, and an acid-based / alkaline-based etching cleaning solution and rinse water are preferably used.
本発明の回転テーブル用ウェーハ保持方法は、回転テーブル用ウェーハ回転保持機構を用いて前記ウェーハを保持する方法である。また、ウェーハ回転保持装置は、回転テーブル用ウェーハ回転保持機構を備えた装置である。 The rotary table wafer holding method of the present invention is a method of holding the wafer by using the rotary table wafer rotation holding mechanism. Further, the wafer rotation holding device is a device provided with a wafer rotation holding mechanism for a rotary table.
次に、図１記載のウェーハ回転保持装置を用いた本実施形態の作用を説明する。図１記載のウェーハ回転保持装置を用い、例えば、下記エッチング条件にて、８インチのシリコン単結晶ウェーハのスピンエッチング処理を行う。
＜エッチング条件＞
エッチング処理時間１分、外周ガイドピンの回転速度：２０ｍｍ／分、エッチング液：フッ酸及び硝酸をベースにした混酸、エッチング液温度：２４℃、回転テーブルの回転数：９００ｒｐｍ、エッチング液流量：３Ｌ／分。
前記ウェーハ回転保持装置において、直径３ｍｍ程度の円柱形状の４本の外周ガイドピンを回転テーブルに設け、該４本の外周ガイドピンを回転テーブル内部にてギヤで連結させ、スピンテーブル内に組み込んだ回転制御用モータでギヤを回転させることにより外周ガイドピンを回転させ、それによりウェーハを回転させる。また、回転テーブルにウェーハの外周ピンとして、ウェーハのセット時に開閉する可動ピンを設ける。前記可動ピンは、フリーに回転可能とされており、駆動機構は備えられていない。前記ウェーハが回転することで、前記可動ピンも回転せしめられる。このようにすれば、スピンエッチング処理後、ウェーハに外周ピンによる痕跡や洗浄残り、バラツキが発生しなくなるという効果を奏する。
Next, the operation of the present embodiment using the wafer rotation holding device shown in FIG. 1 will be described. Using the wafer rotation holding device shown in FIG. 1, for example, spin etching processing of an 8-inch silicon single crystal wafer is performed under the following etching conditions.
<Etching conditions>
Etching processing time 1 minute, rotation speed of outer peripheral guide pin: 20 mm / min, etching solution: mixed acid based on hydrofluoric acid and nitric acid, etching solution temperature: 24 ° C., rotary table rotation speed: 900 rpm, etching solution flow rate: 3 L / Minute.
In the wafer rotation holding device, four cylindrical outer peripheral guide pins having a diameter of about 3 mm are provided on the rotary table, and the four outer peripheral guide pins are connected by gears inside the rotary table and incorporated into the spin table. The rotation control motor rotates the gear to rotate the outer peripheral guide pin, thereby rotating the wafer. Further, the rotary table is provided with a movable pin that opens and closes when the wafer is set as an outer peripheral pin of the wafer. The movable pin is freely rotatable and is not provided with a drive mechanism. By rotating the wafer, the movable pin is also rotated. In this way, after the spin etching process, there is an effect that traces due to the outer peripheral pins, cleaning residue, and variation do not occur on the wafer.
１０：回転テーブル用ウェーハ回転保持機構、１１：ウェーハ回転保持装置、１２，３２：回転テーブル、１４：外周ピン、１６：外周ガイドピン、１８：回転軸、２０：駆動モータ、２２：回転制御用モータ、２４，４０：支持ピン、３４：可動ピン、３６：固定ピン、３８：シリンダー、７０：電力供給機構、７２：固定側１次コイル、７４：電力供給源、７６：回転テーブル側２次コイル、Ｗ：ウェーハ。 10: Wafer rotation holding mechanism for rotary table, 11: Wafer rotation holding device, 12, 32: Rotating table, 14: Outer peripheral pin, 16: Outer peripheral guide pin, 18: Rotating shaft, 20: Drive motor, 22: For rotation control Motor, 24, 40: Support pin, 34: Movable pin, 36: Fixed pin, 38: Cylinder, 70: Power supply mechanism, 72: Fixed side primary coil, 74: Power supply source, 76: Rotating table side secondary Coil, W: Wafer.
Claims (4)
回転テーブルを１００〜１０００ｒｐｍの回転数で回転させる回転軸と、
前記回転軸の先端に載置され且つ上面にウェーハを保持する前記回転テーブルと、
前記回転軸に動力を供給する駆動モータと、
前記回転テーブルに設けられ、前記回転テーブル内に設けられた回転制御用モータにより制御され、且つウェーハの外周を保持するための回転可能な円柱形状の外周ガイドピンと、
前記回転テーブルに設けられ、前記ウェーハのセット時に開閉し、且つ駆動機構を備えずにフリーに回転可能である、前記ウェーハの外周を保持するための可動ピンと、
電磁誘導により、前記回転制御用モータに電力が供給される為の電力供給機構と、
を有し、
前記電力供給機構が、前記回転軸の周囲に巻回された固定側１次コイルと、前記固定側１次コイルに接続された電力供給源と、前記固定側１次コイルに対応して所定距離離間して設けられ、且つ前記回転テーブルに取り付けられた回転テーブル側２次コイルと、を含み、
前記外周ガイドピンを１０〜３０ｍｍ／分の速度で回転させる事により前記回転テーブル上で前記ウェーハを回転せしめてなる、回転テーブル用ウェーハ回転保持機構。 A wafer rotation holding mechanism for a rotary table of a wafer rotation holding device.
A rotating shaft that rotates the rotary table at a rotation speed of 100 to 1000 rpm,
It said rotary table for holding the wafer placed on and the upper surface to the tip of the rotary shaft,
A drive motor that supplies power to the rotating shaft,
A rotatable cylindrical outer peripheral guide pin provided on the rotary table, controlled by a rotation control motor provided in the rotary table, and for holding the outer circumference of the wafer.
A movable pin provided on the rotary table, which opens and closes when the wafer is set and can rotate freely without a drive mechanism, and a movable pin for holding the outer circumference of the wafer.
A power supply mechanism for supplying power to the rotation control motor by electromagnetic induction, and
Have,
The power supply mechanism is a predetermined distance corresponding to a fixed-side primary coil wound around the rotary shaft, a power supply source connected to the fixed-side primary coil, and the fixed-side primary coil. Includes a rotary table side secondary coil, which is provided at a distance and is attached to the rotary table.
A wafer rotation holding mechanism for a rotary table, which rotates the wafer on the rotary table by rotating the outer peripheral guide pin at a speed of 10 to 30 mm / min.
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