JP6834731B2 - Test control device, test control system, and test method - Google Patents

Description

The present invention relates to a test control device, a test control system, and a test method.

Semiconductor devices mounted on information processing devices (computers) such as server products have variations in characteristics, and even if a certain shipping test is passed, a failure may occur immediately after the product is shipped to a customer. A failure that occurs immediately after product shipment is called an initial failure. Examples of the semiconductor device mounted on the information processing device include a central processing unit (CPU), an integrated circuit for a specific application (ASIC), a memory, and the like.

FIG. 1 shows a configuration example of a conventional test control system that performs a shipping test of a CPU (processor). The test control system 101 of FIG. 1 includes a terminal device 111, a test control device 112, and a constant temperature bath 113. Test devices 114-1 to 114-N (N is an integer of 1 or more) are arranged in the constant temperature bath 113, and each test device 114-i (i = 1 to N) is equipped with a CPU 115-i. doing.

The terminal device 111 is an operator terminal such as a personal computer (PC), and the test control device 112 and the test device 114-i are information processing devices such as a server. The test device 114-i may be an information processing device having the same configuration as the information processing device on which the CPU 115-i is mounted after shipment.

The operator performs a basic test and a temperature margin test on CPU115-1 to CPU115-N by operating the test control device 112 via the terminal device 111 in order to prevent the occurrence of initial defects.

The basic test is a test in which the operation of CPU115-1 to CPU115-N is confirmed at the same time while the environmental temperature in the constant temperature bath 113 remains at room temperature. On the other hand, the temperature margin test is a test in which the environmental temperature in the constant temperature bath 113 is raised to a predetermined temperature, and the operation of CPU115-1 to CPU115-N is confirmed at the same time. By performing a temperature margin test in addition to the basic test, defective products in which initial defects occur can be eliminated.

A technique for controlling the temperature of a semiconductor device in a burn-in test is known (see, for example, Patent Documents 1 and 2).

Special Table 2007-526486 JP-A-2009-8625

In the temperature margin test for a semiconductor device such as a CPU described above, the test quality may deteriorate because the operating temperature during the test differs from the target temperature due to variations in the characteristics of the semiconductor device.

It should be noted that such a problem occurs not only in a test on a semiconductor device but also in a test on another device under test.

In one aspect, the present invention aims to improve the quality of testing on the device under test.

In one proposal, the test control device includes a prediction unit, a setting unit, and an output unit. The prediction unit predicts the operating temperature of the device under test at a predetermined environmental temperature set in the test. The setting unit sets the operating voltage of the device under test based on the temperature difference information which is the difference between the operating temperature predicted by the prediction unit and the target temperature. The output unit outputs voltage information indicating the operating voltage set by the setting unit.

According to one embodiment, the quality of the test on the device under test can be improved.

It is a block diagram of a test control system. It is a figure which shows the test information. It is a figure which shows the operating temperature. It is a functional block diagram of a test control device. It is a flowchart of a test control process. It is a functional block diagram of a test control system. It is a functional block diagram of the test apparatus. It is a figure which shows the device information. It is a figure which shows the test information at the time of correcting the operating voltage. It is a figure which shows the voltage correction information. It is a figure which shows the operating temperature when the operating voltage is corrected. It is a flowchart which shows the specific example of a test control process. It is a flowchart of a basic test. It is a flowchart (1) of a temperature margin test. It is a flowchart (2) of a temperature margin test. It is a flowchart (3) of a temperature margin test. It is a block diagram of an information processing apparatus.

Hereinafter, embodiments will be described in detail with reference to the drawings.
FIG. 2 shows an example of test information of the CPU shipping test in the test control system 101 of FIG. The device item number “i” (i = 1 to 4) represents the CPU 115-i to be tested, the S / N represents the serial number of the CPU 115-i, and the vendor is the vendor of the CPU 115-i. The name is represented, and the current value represents the rated current value of the CPU 115-i. The vendor of device "1" and device "2" is company A, and the vendor of device "3" and device "4" is company B.

In the temperature setting of the basic test, the environmental temperature in the constant temperature bath 113 is set to room temperature (25 ° C). The voltage setting represents the operating voltage of the CPU 115-i, the operating temperature represents the temperature output by the temperature sensor in the CPU 115-i, and the test result represents pass (OK) or fail (NG). The average temperature represents the average value of the operating temperatures of the devices “1” to “4”.

Each CPU 115-i performs a basic test of the CPU 115-i itself by executing the operation check program installed in the test device 114-i according to the instruction of the test control device 112, and sends the test result to the test control device 112. Output. In this example, the operating voltage of devices "1" to "4" is set to 1.00V, and the clock signal is set to a normal frequency. The average temperature of the basic test is 58 ° C, and the test results of all devices are OK.

After the basic test is completed, the test control device 112 determines the environmental temperature in the temperature margin test based on the average temperature. For example, when the target temperature of the CPU 115-i in the temperature margin test is 80 ° C, the difference (operating temperature difference) between the target temperature and the average temperature in the basic test is 22 ° C. Therefore, the test control device 112 determines the result of adding 22 ° C to 25 ° C, which is the environmental temperature of the basic test, as the environmental temperature in the temperature margin test. In this case, in the temperature setting of the temperature margin test, the environmental temperature in the constant temperature bath 113 is set to 47 ° C.

The items of voltage setting, operating temperature, and test result of the temperature margin test are the same as those of the voltage setting, operating temperature, and test result of the basic test.

The test control device 112 raises the environmental temperature in the constant temperature bath 113 to 47 ° C. Each CPU 115-i performs a temperature margin test of the CPU 115-i itself by executing an operation confirmation program according to the instruction of the test control device 112, and outputs the test result to the test control device 112. In this example, the test result of the device "1" is NG, and the test results of the devices "2" to "4" are OK.

FIG. 3 shows an example of the operating temperature of the devices “1” to “4” in the test information of FIG. In FIGS. 3A and 3B, the numbers on the horizontal axis represent S / N and the numbers on the vertical axis represent temperature (° C).

The polygonal line 301 in FIG. 3A and the polygonal line 311 in FIG. 3B represent the rated current value of each device. The polygonal line 302 in FIG. 3A represents the operating temperature of each device in the basic test, and the straight line 303 represents the average temperature in the basic test. In this case, the difference 304 between the target temperature in the temperature margin test and the average temperature in the basic test is 22 ° C. The polygonal line 312 in FIG. 3B represents the operating temperature of each device in the temperature margin test, and the straight line 313 represents the target temperature in the temperature margin test.

In this way, when a plurality of CPU 115-i are tested at the same time in the same environment, the operating temperature of each CPU 115-i differs due to the variation in the characteristics of the CPU 115-i, and the test conditions of each CPU 115-i differ. There are many.

For example, in FIG. 3B, since the operating temperatures of the device “1” of the S / N “0001” and the device “2” of the S / N “0002” exceed the target temperature, these CPU 115-i Has been tested at excessively high temperatures. Therefore, it is unclear whether the test result NG of the device "1" represents a defective product. In this case, the temperature margin test is performed again on the CPU 115-1 of the device "1", and even if it is a non-defective product that can be shipped originally, it may be finally determined as a defective product.

On the other hand, since the operating temperatures of the device “3” of the S / N “1001” and the device “4” of the S / N “1002” have not reached the target temperature, these devices have not been tested at a sufficient temperature. .. Therefore, due to insufficient testing, initial defects may occur after shipment.

In order to reduce the possibility of excluding non-defective products as defective products or shipping defective products as non-defective products, it is desirable to control the temperature individually for each CPU 115-i. However, since the environmental temperature in the constant temperature bath 113 is kept uniform, it is difficult to change the temperature individually for each CPU 115-i.

FIG. 4 shows a functional configuration example of the test control device of the embodiment. The test control device 401 of FIG. 4 includes a prediction unit 411, a setting unit 412, and an output unit 413.

FIG. 5 is a flowchart showing an example of the test control process performed by the test control device 401 of FIG. First, the prediction unit 411 predicts the operating temperature of the device under test at a predetermined environmental temperature set in the test (step 501). Next, the setting unit 412 sets the operating voltage of the device under test based on the temperature difference information which is the difference between the operating temperature predicted by the prediction unit 411 and the target temperature (step 502). Then, the output unit 413 outputs voltage information indicating the operating voltage set by the setting unit 412 (step 503).

According to the test control device 401 of FIG. 4, the quality of the test for the device under test can be improved.

FIG. 6 shows a functional configuration example of the test control system including the test control device 401 of FIG. The test control system 601 of FIG. 6 includes a test control device 401, a terminal device 611, and a constant temperature bath 612. Test devices 641-1 to 641-N (N is an integer of 1 or more) are arranged in the constant temperature bath 612, and each test device 641-i (i = 1 to N) is a test device 642- It is equipped with i.

The test control device 401 includes a prediction unit 411, a setting unit 412, an output unit 413, an adjustment unit 621, a recording unit 622, and a storage unit 623, and the storage unit 623 includes device information 631, test information 632, and voltage correction information. Store 633.

The device information 631 includes information such as the S / N of each device under test 642-i, and the test information 632 includes voltage setting, operating temperature, and test results in the basic test and temperature margin test of each device under test 642-i. Etc. are included. The voltage correction information 633 includes information for obtaining the operating voltage from the difference between the operating temperature of each device under test 642-i and the target temperature in the temperature margin test.

For example, when the device under test 642-i is a semiconductor device, the higher the operating voltage, the higher the operating temperature of the device under test 642-i, and the lower the operating voltage, the lower the operating temperature of the device under test 642-i. .. Therefore, when the operating temperature is lower than the target temperature, the operating temperature can be brought closer to the target temperature by increasing the operating voltage, and when the operating temperature is higher than the target temperature, the operating voltage is decreased to operate. The temperature can be brought closer to the target temperature.

Therefore, by storing the voltage correction information 633 for obtaining the operating voltage that brings the operating temperature closer to the target temperature from the difference between the operating temperature and the target temperature in the storage unit 623 in advance, the operation can be performed quickly from the temperature difference. It becomes possible to obtain the voltage.

The terminal device 111 is an operator terminal such as a PC, the test device 641-i is a test control device 401, and the test device 641-i is an information processing device such as a server. The test device 641-i may be an information processing device having the same configuration as the information processing device on which the test device 642-i is mounted after shipment. When the test device 641-i is an information processing device, the test device 642-i is, for example, a semiconductor device such as a CPU, an ASIC, or a memory.

The test control device 401 can communicate with the terminal device 611 and the test device 641-1 to the test device 641-N via the communication network. By operating the test control device 401 via the terminal device 611, the operator performs a basic test and a temperature margin test on the test device 642-1 to the test device 642-N.

In the basic test, the test device 642-1 to the test device 642-N are tested in the constant temperature bath 612 set to the reference environmental temperature. In the temperature margin test, the test device 642-1 to the test device 642-N are tested in the constant temperature bath 612 set to a predetermined environmental temperature. For example, the reference environmental temperature may be room temperature, and the predetermined environmental temperature may be a predetermined high temperature.

The prediction unit 411 is based on the operating temperature of each device under test 642-i at the reference environment temperature and the difference between the environment temperature of the temperature margin test and the reference environment temperature, and each device under test 642 at the environment temperature of the temperature margin test. Predict the operating temperature of −i. As a result, the prediction unit 411 can obtain the operating temperature at the environmental temperature of the temperature margin test for each of the test devices 642-1 to 642-N.

The setting unit 412 corrects the operating voltage by obtaining the operating voltage of each device under test 642-i from the difference between the operating temperature predicted by the predicting unit 411 and the target temperature using the voltage correction information 633. Then, the output unit 413 outputs voltage information indicating the operating voltage of the device under test 642-i to the test device 641-i.

When the information of the specific device under test 642-i is not recorded in the voltage correction information 633, the setting unit 412 sets the operating voltage of the device under test 642-i as the reference voltage. Then, the output unit 413 outputs voltage information indicating the reference voltage to the test device 641-i.

FIG. 7 shows an example of a functional configuration of the test apparatus 641-i. The test device 641-i of FIG. 7 includes a device under test 642-i, a monitoring unit 701, and an execution unit 702. In the basic test and the temperature margin test, the execution unit 702 sets the operating voltage of the device under test 642-i to the voltage indicated by the voltage information output from the test control device 401, and operates the device under test 642-i. Execute the operation check program to be checked. The monitoring unit 701 monitors the operation of the device under test 642-i during the test, acquires information such as the operating temperature and the test result, and outputs the acquired information to the test control device 401.

For example, when the device under test 642-i is a CPU, the device under test 642-i itself operates as a monitoring unit 701 and an execution unit 702 to execute an operation confirmation program. Then, the execution unit 702 performs an operation using the predetermined input data according to the instruction described in the operation confirmation program, and generates an operation result. The monitoring unit 701 checks the presence or absence of an error from the generated calculation result, generates an NG test result if there is an error, and generates an OK test result if there is no error. In this case, the monitoring unit 701 can acquire the operating temperature from the temperature sensor built in the CPU.

When the device under test 642-i is an ASIC, the execution unit 702 inputs predetermined input data to the device under test 642-i according to an instruction described in the operation check program. The monitoring unit 701 checks the presence or absence of an error from the output data output from the device under test 642-i. In this case, the monitoring unit 701 can acquire the operating temperature from the temperature sensor installed on the surface of the ASIC.

When the test device 642-i is a memory, the execution unit 702 writes predetermined data to the test device 642-i and reads the data from the test device 642-i according to the instruction described in the operation check program. .. The monitoring unit 701 checks the presence or absence of an error from the data read from the device under test 642-i. In this case, the monitoring unit 701 can acquire the operating temperature from the temperature sensor installed on the surface of the memory.

The recording unit 622 of the test control device 401 records the information output from the test device 641-i in the test information 632. In the temperature margin test, the adjusting unit 621 adjusts the operating voltage of the device under test 642-i based on the operating temperature of the device under test 642-i output from the test device 642-i, thereby adjusting the operating voltage thereof. To correct. For example, the adjusting unit 621 increases the operating voltage by a predetermined value when the operating temperature of the device under test 642-i under test is lower than the target temperature, and determines the operating voltage when the operating temperature is higher than the target temperature. Decrease by the value. The increase / decrease value of the operating voltage in one adjustment may be within 5% of the reference voltage.

When the operating temperature of the specific device under test 642-i, which is not recorded in the voltage correction information 633, reaches the target temperature by adjusting the operating voltage, the recording unit 622 of the device under test 642-i Generates information for obtaining the adjusted operating voltage from the temperature difference. Then, the recording unit 622 records the generated information in the voltage correction information 633.

As a result, when performing a temperature margin test on the device under test 642-i of the same type as the specific device under test 642-i, the recorded voltage correction information 633 is used to quickly determine the operating voltage from the temperature difference. Can be obtained.

FIG. 8 shows an example of device information 631 when the device under test 642-i of FIG. 6 is the CPU 115-i of FIG. 1 (i = 1 to 4). The information on the device, S / N, vendor, and current value is the same as the information on each item in FIG. Company A is a vendor with a track record of delivering in the past, and Company B is a new vendor with no track record of delivering in the past.

FIG. 9 shows an example of test information 632 when the device under test 642-i in FIG. 6 is the CPU 115-i in FIG. The information on the device, S / N, vendor, and current value is the same as the information on each item in FIG. Further, the information of each item of the basic test, the target temperature of the temperature margin test, the operating temperature difference, and the information of the voltage setting are the same as the information of FIG. The voltage setting of 1.00V in the basic test corresponds to the reference voltage, and the ambient temperature in the temperature margin test is set to 47 ° C.

The predicted temperature of the temperature margin test represents the operating temperature of the device under test 642-i predicted by the prediction unit 411. In this case, the prediction unit 411 obtains the predicted temperature by adding the operating temperature difference to the operating temperature of each device under test 642-i in the basic test. The test temperature difference represents the difference between the predicted temperature and the target temperature.

For example, since the operating temperature of the device “1” in the basic test is 66 ° C and the operating temperature difference is 22 ° C, the predicted temperature at the environmental temperature of 47 ° C is 88 ° C. Therefore, the test temperature difference of device "1" is + 8 ° C.

On the other hand, since the operating temperature of the device “4” in the basic test is 52 ° C and the operating temperature difference is 22 ° C, the predicted temperature at the environmental temperature of 47 ° C is 74 ° C. Therefore, the test temperature difference of device "4" is −6 ° C.

The correction items of the temperature margin test include the initial correction value, the initial voltage, the adjustment value, and the final correction value. The initial voltage represents the operating voltage set by the setting unit 412 at the start of the temperature margin test, and the initial correction value represents the difference between the reference voltage and the initial voltage in the basic test. The adjustment value represents the difference between the operating voltage and the initial voltage adjusted by the adjustment unit 621 in the temperature margin test, and the final correction value represents the sum of the initial correction value and the adjustment value.

FIG. 10 shows an example of voltage correction information 633 when the device under test 642-i of FIG. 6 is the CPU 115-i of FIG. In the voltage correction information 633 of FIG. 10, the correspondence between the temperature difference and the initial correction value of the operating voltage is recorded. FIG. 10A shows the voltage correction information 633 at the start of the temperature margin test, and FIG. 10B shows the voltage correction information 633 at the end of the temperature margin test.

In the voltage correction information 633 of FIG. 10A, the initial correction value of the CPU of the company A for each of the plurality of test temperature differences of +10 ° C to -10 ° C is recorded, and the initial correction value of the CPU of the company A is recorded, which is a new vendor. The initial correction value is not recorded for the CPU of. In this case, the setting unit 412 sets the operating voltage for the device "1" and the device "2" of the company A using the initial correction value of FIG. 10 (a), and the device "3" and the device of the company B. For "4", the operating voltage is set to the reference voltage.

For example, since the test temperature difference of the device “1” of the company A is + 8 ° C, the setting unit 412 sets the initial correction value of the device “1” by -4% from the voltage correction information 633 of FIG. 10 (a). The initial voltage is set to 0.96V, which is 4% lower than the reference voltage of 1.00V. Further, since the test temperature difference of the device "2" of the company A is + 2 ° C, the setting unit 412 sets the initial correction value of the device "2" by -1% from the voltage correction information 633 of FIG. 10 (a). The initial voltage is set to 0.99V, which is 1% lower than the reference voltage of 1.00V.

On the other hand, for the device "3" and the device "4" of Company B, the setting unit 412 determines the initial correction value to 0% and sets the reference voltage 1.00V to the initial voltage.

Since the adjustment value of the device "1" and the device "2" is 0%, the final correction value of these devices is the same as the initial correction value. On the other hand, since the adjustment value of the device "3" is + 1%, the final correction value is also + 1%, and since the adjustment value of the device "4" is + 2%, the final correction value is also + 2%.

In the temperature margin test of FIG. 9, by correcting the operating voltage for each device, the operation confirmation program is executed in a state where the operating temperature of each device matches the target temperature of 80 ° C. In this case, the test results of the devices "1" to "3" are OK, and the test results of the device "4" are NG.

Of these, device "1" was tested at an operating voltage of 88 ° C in the temperature margin test of FIG. 2, and the test result was NG. However, as a result of testing at a target temperature of 80 ° C, the test result was OK. It turns out that On the other hand, the device "4" was tested at an operating voltage of 74 ° C in the temperature margin test of FIG. 2, and the test result was OK. However, as a result of the test at the target temperature of 80 ° C, the test result was NG. Become.

By correcting the operating voltage for each device in this way, it is possible to absorb variations in characteristics between the devices and unify the operating temperature of each device to the target temperature. As a result, the possibility of excluding non-defective products as defective products or shipping defective products as non-defective products can be reduced, and the test quality of the temperature margin test can be improved. In addition, since it is not necessary to retest or repair the device tested at an excessively high temperature, the test man-hours or the repair man-hours are reduced.

The recording unit 622 updates the voltage correction information 633 by recording the final correction value obtained in the temperature margin test as the initial correction value in the voltage correction information 633 for each of the company A and the company B. As a result, as shown in FIG. 10B, the initial correction value of Company B is added.

For example, since the test temperature difference of the device “3” of Company B is -4 ° C and the final correction value is + 1%, + 1% is recorded as the initial correction value corresponding to -4 ° C. Further, since the test temperature difference of the device "4" of Company B is -6 ° C and the final correction value is + 2%, + 2% is recorded as the initial correction value corresponding to -6 ° C. Further, 0% is recorded as the initial correction value corresponding to 0 ° C.

For test temperature differences other than 0 ° C, -4 ° C, and -6 ° C, each is sequentially based on the results of temperature margin tests on devices of company B other than device "3" and device "4". The initial correction value corresponding to the test temperature difference can be added.

When a plurality of final correction values are obtained for the same test temperature difference as a result of performing multiple temperature margin tests on devices of the same vendor, the recording unit 622 sets the average value of those final correction values. May be recorded as the initial correction value.

FIG. 11 shows an example of the operating temperature of the devices “1” to “4” in the test information 632 of FIG. In FIG. 11, the numbers on the horizontal axis represent S / N, and the numbers on the vertical axis represent temperature (° C). The polygonal line 1101 represents the final correction value in FIG. 9, the polygonal line 1102 represents the current value in FIG. 9, the polygonal line 1103 represents the operating temperature of each device in the temperature margin test, and the straight line 1104 represents the target in the temperature margin test. Represents temperature. In this case, the operating temperature indicated by the polygonal line 1103 is in good agreement with the target temperature of 80 ° C. indicated by the straight line 1104.

FIG. 12 is a flowchart showing a specific example of the test control process performed by the test control system 601 of FIG. Prior to the start of the test control process, the operator operates the terminal device 611 to register the information of the test device 642-1 to the test device 642-N in the device information 631. Then, the operator mounts the test device 642-1 to the test device 642-N on the test device 641-1 to the test device 641-N, respectively.

In the test control process, the test control device 401 and the test device 641-i first perform a basic test on the device under test 642-i (step 1201), and then perform a temperature margin test on the device under test 642-i. (Step 1202).

FIG. 13 is a flowchart showing an example of the basic test in step 1201 of FIG. First, the operator operates the terminal device 611 to instruct the test control device 401 to start the test (step 1301). The test control device 401 turns on the power of the test devices 641-1 to 641-N (step 1302), and acquires the S / N of the test device 642-i mounted on each test device 641-i. (Step 1303).

Next, the test control device 401 sets the environmental temperature of the constant temperature bath 612 to the reference environmental temperature, sets the operating voltage of each device under test 642-i to the reference voltage, and sets the monitoring unit 701 of the test device 641-i. Is instructed to start the test (step 1304). The monitoring unit 701 sets the operating voltage of the device under test 642-i to the reference voltage, starts the execution unit 702, and the execution unit 702 executes the operation confirmation program (step 1305).

The monitoring unit 701 monitors the operating temperature of the device under test 642-i under test, and after the operating temperature rises and stabilizes, acquires the operating temperature at that time. For example, the monitoring unit 701 monitors the operating temperature at predetermined time intervals, and when the amount of change in the operating temperature becomes less than the threshold value, it can be determined that the operating temperature is stable. When the execution of the operation check program is completed, the monitoring unit 701 generates a test result based on the presence or absence of an error during execution, and transmits the operating temperature and the test result to the test control device 401.

The recording unit 622 of the test control device 401 records the operating temperature and the test result received from the test device 641-i in the basic test item of the test information 632 (step 1306).

14A-14C are flowcharts showing an example of the temperature margin test in step 1202 of FIG. The processes of steps 1401 to 1403 are the same as the processes of steps 1301 to 1303 of FIG.

The operator removes the test device 642-i whose test result is NG in the basic test from the test device 641-i, and conducts the temperature margin test only on the test device 642-i whose test result is OK. To do. Therefore, the number of devices under test 642-i to be tested at the same time may differ between the basic test and the temperature margin test. Therefore, in step 1403, the S / N of the device under test 642-i is acquired again.

Next, the test control device 401 acquires the operating temperature of each device under test 642-i in the basic test from the test information 632 (step 1404), and calculates the average value (mean temperature) of the acquired plurality of operating temperatures. And record in the test information 632 (step 1405). Then, the test control device 401 calculates the difference (operating temperature difference) between the target temperature and the average temperature in the temperature margin test and records it in the test information 632 (step 1406).

Next, the test control device 401 adds the operating temperature difference to the environmental temperature of the constant temperature bath 612 in the basic test to determine the environmental temperature of the constant temperature bath 612 in the temperature margin test (step 1407). For example, since the environmental temperature in the basic test of FIG. 9 is 25 ° C and the operating temperature difference is 22 ° C, the environmental temperature in the temperature margin test is determined to be 47 ° C.

Next, the prediction unit 411 of the test control device 401 adds the operating temperature difference to the operating temperature of each device under test 642-i in the basic test to obtain the predicted temperature of each device under test 642-i in the temperature margin test. Calculate (step 1408). Then, the prediction unit 411 calculates the difference (test temperature difference) between the predicted temperature and the target temperature of each device under test 642-i and records it in the test information 632 (step 1409).

For example, since the operating temperature of the device “1” in FIG. 9 in the basic test is 66 ° C and the operating temperature difference is 22 ° C, the predicted temperature of the device “1” is 88 ° C, and the test temperature difference. Is + 8 ° C.

Next, the setting unit 412 selects any one of the test devices 642-1 to the test device 642-N (step 1410), and the selected device 642-i is selected. It is determined whether or not to correct the operating voltage of (step 1411).

At this time, the setting unit 412 determines that the operating voltage is not corrected if the test temperature difference of the device under test 642-i is 0 ° C. On the other hand, when the test temperature difference of the device under test 642-i is not 0 ° C, the setting unit 412 refers to the voltage correction information 633 and sets the initial correction value of the device under test 642-i to the voltage correction information 633. If it is recorded, it is determined that the operating voltage is corrected. On the other hand, if the initial correction value of the device under test 642-i is not recorded in the voltage correction information 633, the setting unit 412 determines that the operating voltage is not corrected.

For example, in the case of the voltage correction information 633 of FIG. 10A, the setting unit 412 acquires the vendor name corresponding to the S / N of the device under test 642-i from the device information 631 of FIG. Then, the setting unit 412 determines that the operating voltage is corrected if the acquired vendor name is company A, and determines that the operating voltage is not corrected if the acquired vendor name is company B.

When the operating voltage is corrected (step 1411, YES), the setting unit 412 acquires the initial correction value from the voltage correction information 633 (step 1412), and when the operating voltage is not corrected (step 1411, NO), the initial correction value. Is set to 0% (step 1413). Then, the setting unit 412 adds the voltage indicated by the initial correction value to the reference voltage, calculates the initial voltage, and records the calculated initial voltage in the test information 632 (step 1414).

When the initial correction value is a positive value, the initial voltage becomes higher than the reference voltage, and when the initial correction value is a negative value, the initial voltage becomes lower than the reference voltage. When the initial correction value is 0%, the initial voltage matches the reference voltage.

For example, since the test temperature difference of the device “1” in FIG. 9 is + 8 ° C and the vendor name is company A, from the voltage correction information 633 in FIG. 10 (a), the company A corresponding to + 8 ° C The initial correction value-4% is acquired. Then, a voltage of 0.96V, which is 4% lower than the reference voltage of 1.00V, is set as the initial voltage of the device “1”.

Next, the setting unit 412 checks whether or not all the test devices 642-i have been selected (step 1415). When the unselected apparatus to be tested 642-i remains (step 1415, NO), the setting unit 412 repeats the processes after step 1410 for the next apparatus to be tested 642-i.

On the other hand, when all the devices under test 642-i are selected (step 1415, YES), the output unit 413 sets the operating voltage of each device under test 642-i as the initial voltage, and provides the voltage information to the test device 641-. It is transmitted to i (step 1416). Then, the test control device 401 sets the environmental temperature of the constant temperature bath 612 to the environmental temperature in the temperature margin test, and instructs the monitoring unit 701 of the test device 641-i to start the test (step 1417).

The monitoring unit 701 sets the operating voltage of the device under test 642-i to the initial voltage based on the voltage information received from the test control device 401, and starts the execution unit 702. The execution unit 702 executes the operation check program (step 1418). Then, the monitoring unit 701 monitors the operating temperature of the device under test 642-i under test, and after the operating temperature rises and stabilizes, acquires the operating temperature at that time and transmits it to the test control device 401. (Step 1419).

Next, the adjusting unit 621 of the test control device 401 selects any one of the test devices 642-1 to the test device 642-N (step 1420). Then, the adjusting unit 621 determines whether or not the operating temperature of the selected apparatus 642-i to be tested has reached the target temperature (step 1421). For example, the adjusting unit 621 can determine that the operating temperature has reached the target temperature when the difference between the operating temperature and the target temperature is less than a predetermined value.

When the operating temperature does not reach the target temperature (step 1421, NO), the adjusting unit 621 adjusts the operating voltage of the device under test 642-i (step 1422). For example, the adjusting unit 621 increases the operating voltage by 1% when the operating temperature of the device under test 642-i is lower than the target temperature, and decreases the operating voltage by 1% when the operating temperature is higher than the target temperature. Let me.

Next, the adjusting unit 621 instructs the monitoring unit 701 of the test apparatus 641-i to perform a retest, and the executing unit 702 executes the operation check program again (step 1423). Then, the monitoring unit 701 acquires the operating temperature of the device under test 642-i and transmits it to the test control device 401 (step 1424). Then, the adjusting unit 621 repeats the processes after step 1421.

On the other hand, when the operating temperature reaches the target temperature (steps 1421, YES), the adjusting unit 621 records the difference between the adjusted operating voltage and the initial voltage as an adjustment value in the test information 632, and records the initial correction value and the initial correction value. The total of the adjustment values is recorded in the test information 632 as the final correction value. After that, the execution unit 702 continues the execution of the operation check program, and when the execution of the operation check program is completed, the monitoring unit 701 generates a test result based on the presence or absence of an error during execution, and tests and controls the test result. Send to device 401.

The recording unit 622 of the test control device 401 records the test result received from the test device 641-i in the temperature margin test item of the test information 632 (step 1425).

Next, the adjusting unit 621 checks whether or not all the devices under test 642-i have been selected (step 1426). When the unselected apparatus 642-i to be tested remains (step 1426, NO), the adjusting unit 621 repeats the processes after step 1420 for the next apparatus to be tested 642-i.

On the other hand, when all the devices under test 642-i are selected (step 1426, YES), the recording unit 622 has a new vendor among the vendors of the devices under test 642-1 to the device under test 642-N. It is determined whether or not to do so (step 1427). For example, if the initial correction value of any vendor is not registered in the voltage correction information 633, the recording unit 622 can determine that the vendor is a new vendor.

If a new vendor exists (step 1427, YES), the recording unit 622 adds the final correction value of the vendor's device under test 642-i to the voltage correction information 633 as an initial correction value (step 1428). On the other hand, if there is no new vendor (step 1427, NO), the test controller 401 ends the process. The recording unit 622 may update the initial correction value of the vendor in the voltage correction information 633 based on the final correction value of the test device 642-i of the existing vendor.

Even if the operating temperature of the device under test 642-i that operates at the initial voltage is different from the target temperature, the operating temperature can be brought closer to the target temperature by adjusting the operating voltage of the device under test 642-i. Becomes possible.

For the device under test from the new vendor, the operation confirmation program is repeatedly executed while adjusting the operating voltage until the operating temperature reaches the target temperature, so the test time for the temperature margin test may become longer. .. However, for the test device 642-i of the existing vendor, since the initial correction value of the operating voltage is registered in the voltage correction information 633, the operating temperature can be brought close to the target temperature from the beginning. Therefore, the time until the operating temperature reaches the target temperature is shortened, and the temperature margin test can be efficiently performed.

The test control device 401 may repeat the processes of steps 1421-1424 a predetermined number of times instead of repeating the processes until the operating temperature reaches the target temperature. In this case, when the repetition of a predetermined number of times is completed, the test control device 401 performs the processes after step 1425.

The configuration of the test control device 401 in FIG. 4 is only an example, and some components may be omitted or changed depending on the application or conditions of the test control device 401.

The configuration of the test control system of FIGS. 1 and 6 is only an example, and some components may be omitted or changed depending on the use or conditions of the test control system. For example, in the test control system 601 of FIG. 6, when the operating voltage of the device under test 642-i is not adjusted after the start of the temperature margin test, the adjusting unit 621 can be omitted. When the operator directly operates the test control device 401, the terminal device 611 can be omitted. When the temperature sensor is not built in the test device 642-i, the temperature sensor can be installed on the surface of the test device 642-i to acquire the operating temperature of the test device 642-i.

As the test device 641-i on which the device to be tested 642-i is mounted, a printed circuit board or the like can be used instead of the information processing device. When the test device 642-i mounted on the printed circuit board is not a CPU but an ASIC, a memory, etc., the test control device 401 executes an operation check program instead of the test device 641-i and generates a test result. To do. The device to be tested 642-i may be a circuit component other than a semiconductor device, an electric product, or the like.

The configuration of the test device 641-i in FIG. 7 is only an example, and some components may be omitted or changed depending on the application or conditions of the test device 641-i. For example, when the device under test 642-i is a CPU, the device under test 642-i itself operates as a monitoring unit 701 and an execution unit 702.

The flowcharts of FIGS. 5 and 12 to 14C are merely examples, and some processes may be omitted or changed depending on the configuration or conditions of the test control system 601. For example, if the basic test is performed in advance and the test result is recorded in the test information 632, the process of step 1201 in FIG. 12 can be omitted. If the operating voltage of the device under test 642-i is not adjusted after the start of the temperature margin test, the process of steps 1422-1424 in FIG. 14C can be omitted.

If it is known in advance that all the vendors of the device under test 642-1 to the device under test 642-N are existing vendors, the processes of steps 1427 and 1428 in FIG. 14C can be omitted.

In step 1405 and step 1406 of FIG. 14A, the test control device 401 calculates another statistical value such as the median value of the plurality of operating temperatures instead of the average value of the plurality of operating temperatures, and sets the target temperature and the statistical value. The difference may be calculated as the operating temperature difference. The increase / decrease value of the operating voltage in step 1422 in FIG. 14C may be a value larger than 1% of the reference voltage, or may be a predetermined value independent of the reference voltage.

The test information of FIGS. 2 and 9, the device information of FIG. 8, and the voltage correction information of FIG. 10 are merely examples, and some items may be omitted or changed. For example, when performing the test control process of FIG. 12, the item of the current value of FIG. 9 can be omitted. When the operating voltage of the device under test 642-i is not adjusted after the start of the temperature margin test, the items of the adjustment value and the final correction value in FIG. 9 can be omitted. The data recorded in each item changes depending on the device mounted as the device under test 642-i.

The operating temperatures of FIGS. 3 and 11 are merely examples, and the operating temperatures vary depending on the environmental temperature of the constant temperature bath and the device mounted as the device under test 642-i.

FIG. 15 shows a configuration example of an information processing device (computer) used as the test control device 401 of FIGS. 4 and 6. The information processing device of FIG. 15 includes a CPU 1501, a memory 1502, an input device 1503, an output device 1504, an auxiliary storage device 1505, a medium drive device 1506, and a network connection device 1507. These components are connected to each other by bus 1508.

The memory 1502 is, for example, a semiconductor memory such as a Read Only Memory (ROM), a Random Access Memory (RAM), or a flash memory, and stores a program and data used for processing. The memory 1502 can be used as the storage unit 623 of FIG.

The CPU 1501 operates as a prediction unit 411, a setting unit 412, an adjustment unit 621, and a recording unit 622 in FIGS. 4 and 6 by executing a program using, for example, the memory 1502.

The input device 1503 is, for example, a keyboard, a pointing device, or the like, and is used for inputting instructions and information from an operator or a user. The output device 1504 is, for example, a display device, a printer, a speaker, or the like, and is used for inquiring or instructing an operator or a user and outputting a processing result.

The auxiliary storage device 1505 is, for example, a magnetic disk device, an optical disk device, a magneto-optical disk device, a tape device, or the like. The auxiliary storage device 1505 may be a hard disk drive. The information processing device can store programs and data in the auxiliary storage device 1505 and load them into the memory 1502 for use. The auxiliary storage device 1505 can be used as the storage unit 623 of FIG.

The medium drive device 1506 drives the portable recording medium 1509 to access the recorded contents. The portable recording medium 1509 is a memory device, a flexible disk, an optical disk, a magneto-optical disk, or the like. The portable recording medium 1509 may be a Compact Disk Read Only Memory (CD-ROM), a Digital Versatile Disk (DVD), a Universal Serial Bus (USB) memory, or the like. An operator or a user can store programs and data in the portable recording medium 1509 and load them into the memory 1502 for use.

As described above, the computer-readable recording medium for storing the programs and data used for processing is a physical (non-temporary) recording such as a memory 1502, an auxiliary storage device 1505, or a portable recording medium 1509. It is a medium.

The network connection device 1507 is a communication interface that is connected to a communication network such as a Local Area Network or Wide Area Network and performs data conversion associated with the communication. The information processing device can receive programs and data from an external device via the network connection device 1507, load them into the memory 1502, and use them. The network connection device 1507 can be used as the output unit 413 of FIGS. 4 and 6.

The information processing apparatus does not have to include all the components of FIG. 15, and some components may be omitted depending on the application or conditions. For example, if the information processing device does not need to interact with the operator or user, the input device 1503 and the output device 1504 may be omitted. Further, when the portable recording medium 1509 is not used, the medium driving device 1506 may be omitted.

As the terminal device 611 and the test device 641-i in FIG. 6, the same information processing device as in FIG. 15 can be used. For example, when the information processing device of FIG. 15 is the test device 641-i, the CPU 1501 operates as the monitoring unit 701 and the execution unit 702 of FIG. 7 by executing the program using the memory 1502.

Having described in detail the embodiments of the disclosure and its advantages, those skilled in the art will be able to make various changes, additions and omissions without departing from the scope of the invention as expressly stated in the claims. Let's do it.

The following additional notes will be further disclosed with respect to the embodiments described with reference to FIGS. 1 to 15.
(Appendix 1)
A predictor that predicts the operating temperature of the device under test at a predetermined environmental temperature set in the test,
A setting unit that sets the operating voltage of the device under test based on the first temperature difference information, which is the difference between the operating temperature predicted by the prediction unit and the target temperature.
An output unit that outputs voltage information indicating the operating voltage set by the setting unit, and
A test control device comprising.
(Appendix 2)
The test control device further includes a storage unit for storing information for obtaining an operating voltage from the first temperature difference information for each of the plurality of test devices including the test device.
In the test, the plurality of devices under test are tested in a constant temperature bath set to the predetermined environmental temperature.
The prediction unit predicts the operating temperature of each of the plurality of test devices,
The setting unit sets the operating voltage of each of the plurality of test devices based on the first temperature difference information of each of the plurality of test devices and the information stored in the storage unit.
The test control device according to Appendix 1, wherein the voltage information indicates the operating voltage of each of the plurality of test devices.
(Appendix 3)
The prediction unit is a second temperature difference information which is a difference between the operating temperature of each of the plurality of test devices at a reference environmental temperature different from the predetermined environmental temperature and the predetermined environmental temperature and the reference environmental temperature. The test control device according to Appendix 2, wherein the operating temperature of each of the plurality of test devices at a predetermined environmental temperature is predicted based on the above.
(Appendix 4)
The test control device further includes an adjusting unit and a recording unit.
In the test, the plurality of test devices and other test devices different from the plurality of test devices are tested in the constant temperature bath.
The prediction unit predicts the operating temperature of the other device under test at the predetermined environmental temperature, and predicts the operating temperature of the other device under test.
The setting unit sets the operating voltage of the other device under test as a reference voltage.
The voltage information indicates that the operating voltage of the other device under test is the reference voltage.
After the operating voltage of the other device under test in the constant temperature bath is set to the reference voltage, the adjusting unit adjusts the operating voltage of the other device under test.
When the operating temperature of the other device under test reaches the target temperature by adjusting the operating voltage of the other device under test, the recording unit is the first of the other devices under test. The test control device according to Appendix 2 or 3, wherein the information for obtaining the adjusted operating voltage from the temperature difference information of the above is stored in the storage unit.
(Appendix 5)
A test control system including a test device equipped with a test device and a test control device for controlling the test of the test device.
The test control device is
A prediction unit that predicts the operating temperature of the device under test at a predetermined environmental temperature set in the test, and
A setting unit that sets the operating voltage of the device under test based on the first temperature difference information, which is the difference between the operating temperature predicted by the prediction unit and the target temperature.
An output unit that outputs voltage information indicating the operating voltage set by the setting unit to the test apparatus, and an output unit.
A test control system characterized by being equipped with.
(Appendix 6)
The test control device further includes a storage unit for storing information for obtaining an operating voltage from the first temperature difference information for each of the plurality of test devices including the test device.
In the test, the plurality of devices under test are tested in a constant temperature bath set to the predetermined environmental temperature.
The prediction unit predicts the operating temperature of each of the plurality of test devices,
The setting unit sets the operating voltage of each of the plurality of test devices based on the first temperature difference information of each of the plurality of test devices and the information stored in the storage unit.
The test control system according to Appendix 5, wherein the voltage information indicates the operating voltage of each of the plurality of devices under test.
(Appendix 7)
The prediction unit is a second temperature difference information which is a difference between the operating temperature of each of the plurality of test devices at a reference environmental temperature different from the predetermined environmental temperature and the predetermined environmental temperature and the reference environmental temperature. The test control system according to Appendix 6, wherein the operating temperature of each of the plurality of test devices at a predetermined environmental temperature is predicted based on the above.
(Appendix 8)
The test control device further includes an adjusting unit and a recording unit.
In the test, the plurality of test devices and other test devices different from the plurality of test devices are tested in the constant temperature bath.
The prediction unit predicts the operating temperature of the other device under test at the predetermined environmental temperature, and predicts the operating temperature of the other device under test.
The setting unit sets the operating voltage of the other device under test as a reference voltage.
The voltage information indicates that the operating voltage of the other device under test is the reference voltage.
After the operating voltage of the other device under test in the constant temperature bath is set to the reference voltage, the adjusting unit adjusts the operating voltage of the other device under test.
When the operating temperature of the other device under test reaches the target temperature by adjusting the operating voltage of the other device under test, the recording unit is the first of the other devices under test. The test control system according to Appendix 6 or 7, wherein the information for obtaining the adjusted operating voltage from the temperature difference information of the above is stored in the storage unit.
(Appendix 9)
In the test method of the device under test using the test control device,
The prediction unit included in the test control device predicts the operating temperature of the test device at a predetermined environmental temperature set in the test.
The setting unit included in the test control device sets the operating voltage of the device under test based on the first temperature difference information which is the difference between the operating temperature predicted by the prediction unit and the target temperature.
A test method characterized in that an output unit included in the test control device outputs voltage information indicating an operating voltage set by the setting unit.
(Appendix 10)
The test control device further includes a storage unit for storing information for obtaining an operating voltage from the first temperature difference information for each of the plurality of test devices including the test device.
In the test, the plurality of devices under test are tested in a constant temperature bath set to the predetermined environmental temperature.
The prediction unit predicts the operating temperature of each of the plurality of test devices,
The setting unit sets the operating voltage of each of the plurality of test devices based on the first temperature difference information of each of the plurality of test devices and the information stored in the storage unit.
The test method according to Appendix 9, wherein the voltage information indicates the operating voltage of each of the plurality of devices under test.
(Appendix 11)
The prediction unit is a second temperature difference information which is a difference between the operating temperature of each of the plurality of test devices at a reference environmental temperature different from the predetermined environmental temperature and the predetermined environmental temperature and the reference environmental temperature. The test method according to Appendix 10, wherein the operating temperature of each of the plurality of test devices at a predetermined environmental temperature is predicted based on the above.
(Appendix 12)
The test control device further includes an adjusting unit and a recording unit.
In the test, the plurality of test devices and other test devices different from the plurality of test devices are tested in the constant temperature bath.
The prediction unit predicts the operating temperature of the other device under test at the predetermined environmental temperature, and predicts the operating temperature of the other device under test.
The setting unit sets the operating voltage of the other device under test as a reference voltage.
The voltage information indicates that the operating voltage of the other device under test is the reference voltage.
After the operating voltage of the other device under test in the constant temperature bath is set to the reference voltage, the adjusting unit adjusts the operating voltage of the other device under test.
When the operating temperature of the other device under test reaches the target temperature by adjusting the operating voltage of the other device under test, the recording unit is the first of the other devices under test. The test method according to Appendix 10 or 11, wherein the information for obtaining the adjusted operating voltage from the temperature difference information of the above is stored in the storage unit.

101, 601 Test control system 111, 611 Terminal device 112, 401 Test control device 113, 612 Constant temperature bath 114-1 to 114-N, 641-1 to 641-N Test device 115-1 to 115-N, 1501 CPU
301, 302, 311, 312, 1101-1103 Folded line 303, 313, 1104 Straight line 304 Difference 411 Prediction unit 412 Setting unit 413 Output unit 621 Adjustment unit 622 Recording unit 623 Storage unit 631 Device information 632 Test information 633 Voltage correction information 642 1-642-N Tested device 701 Monitoring unit 702 Execution unit 1502 Memory 1503 Input device 1504 Output device 1505 Auxiliary storage device 1506 Media drive device 1507 Network connection device 1508 Bus 1509 Portable recording medium

Claims (6)

A predictor that predicts the operating temperature of the device under test at a predetermined environmental temperature set in the test,
A setting unit that sets the operating voltage of the device under test based on the first temperature difference information, which is the difference between the operating temperature predicted by the prediction unit and the target temperature.
An output unit that outputs voltage information indicating the operating voltage set by the setting unit, and
A test control device comprising. The test control device further includes a storage unit for storing information for obtaining an operating voltage from the first temperature difference information for each of the plurality of test devices including the test device.
In the test, the plurality of devices under test are tested in a constant temperature bath set to the predetermined environmental temperature.
The prediction unit predicts the operating temperature of each of the plurality of test devices,
The setting unit sets the operating voltage of each of the plurality of test devices based on the first temperature difference information of each of the plurality of test devices and the information stored in the storage unit.
The test control device according to claim 1, wherein the voltage information indicates an operating voltage of each of the plurality of test devices. The prediction unit is a second temperature difference information which is a difference between the operating temperature of each of the plurality of test devices at a reference environmental temperature different from the predetermined environmental temperature and the predetermined environmental temperature and the reference environmental temperature. The test control device according to claim 2, wherein the operating temperature of each of the plurality of test devices at a predetermined environmental temperature is predicted based on the above. The test control device further includes an adjusting unit and a recording unit.
In the test, the plurality of test devices and other test devices different from the plurality of test devices are tested in the constant temperature bath.
The prediction unit predicts the operating temperature of the other device under test at the predetermined environmental temperature, and predicts the operating temperature of the other device under test.
The setting unit sets the operating voltage of the other device under test as a reference voltage.
The voltage information indicates that the operating voltage of the other device under test is the reference voltage.
After the operating voltage of the other device under test in the constant temperature bath is set to the reference voltage, the adjusting unit adjusts the operating voltage of the other device under test.
When the operating temperature of the other device under test reaches the target temperature by adjusting the operating voltage of the other device under test, the recording unit is the first of the other devices under test. The test control device according to claim 2 or 3, wherein the information for obtaining the adjusted operating voltage from the temperature difference information of the above is stored in the storage unit. A test control system including a test device equipped with a test device and a test control device for controlling the test of the test device.
The test control device is
A prediction unit that predicts the operating temperature of the device under test at a predetermined environmental temperature set in the test, and
A setting unit that sets the operating voltage of the device under test based on the first temperature difference information, which is the difference between the operating temperature predicted by the prediction unit and the target temperature.
An output unit that outputs voltage information indicating the operating voltage set by the setting unit to the test apparatus, and an output unit.
A test control system characterized by being equipped with. In the test method of the device under test using the test control device,
The prediction unit included in the test control device predicts the operating temperature of the test device at a predetermined environmental temperature set in the test.
The setting unit included in the test control device sets the operating voltage of the device under test based on the first temperature difference information which is the difference between the operating temperature predicted by the prediction unit and the target temperature.
A test method characterized in that an output unit included in the test control device outputs voltage information indicating an operating voltage set by the setting unit.

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