JP6825677B2 - Adhesives, laminates, battery packaging and batteries - Google Patents
Adhesives, laminates, battery packaging and batteries Download PDFInfo
- Publication number
- JP6825677B2 JP6825677B2 JP2019197434A JP2019197434A JP6825677B2 JP 6825677 B2 JP6825677 B2 JP 6825677B2 JP 2019197434 A JP2019197434 A JP 2019197434A JP 2019197434 A JP2019197434 A JP 2019197434A JP 6825677 B2 JP6825677 B2 JP 6825677B2
- Authority
- JP
- Japan
- Prior art keywords
- anhydride
- acid
- acid anhydride
- adhesive
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 title claims description 69
- 230000001070 adhesive effect Effects 0.000 title claims description 69
- 238000004806 packaging method and process Methods 0.000 title 1
- 239000000463 material Substances 0.000 claims description 74
- 229920005672 polyolefin resin Polymers 0.000 claims description 62
- -1 methylcyclohexendicarboxylic acid anhydride Methylcyclohexenetetracarboxylic acid Chemical compound 0.000 claims description 40
- 229920000098 polyolefin Polymers 0.000 claims description 40
- 150000008065 acid anhydrides Chemical class 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 26
- 150000001875 compounds Chemical class 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 24
- 239000003795 chemical substances by application Substances 0.000 claims description 21
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 17
- 239000002253 acid Substances 0.000 claims description 16
- 239000011888 foil Substances 0.000 claims description 16
- 239000005022 packaging material Substances 0.000 claims description 15
- 239000012790 adhesive layer Substances 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 12
- 239000004593 Epoxy Substances 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 10
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 claims description 4
- 150000008064 anhydrides Chemical class 0.000 claims description 4
- 229940014800 succinic anhydride Drugs 0.000 claims description 4
- 150000003512 tertiary amines Chemical class 0.000 claims description 4
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 3
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 claims description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 claims description 2
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 claims description 2
- BLBSJBOFNFNGLV-UHFFFAOYSA-N 3-ethyl-oxacyclononadecane-2,19-dione Chemical compound CCC1CCCCCCCCCCCCCCCC(=O)OC1=O BLBSJBOFNFNGLV-UHFFFAOYSA-N 0.000 claims description 2
- XTBGPYSCCALXIA-UHFFFAOYSA-N 3-phenyl-oxacycloheptadecane-2,17-dione Chemical compound O=C1OC(=O)CCCCCCCCCCCCCC1C1=CC=CC=C1 XTBGPYSCCALXIA-UHFFFAOYSA-N 0.000 claims description 2
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 claims description 2
- 239000004805 Cyclohexane-1,2-dicarboxylic acid Substances 0.000 claims description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 2
- 239000002318 adhesion promoter Substances 0.000 claims description 2
- 239000011951 cationic catalyst Chemical class 0.000 claims description 2
- 150000002460 imidazoles Chemical class 0.000 claims description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 2
- 150000003003 phosphines Chemical class 0.000 claims description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N phthalic anhydride Chemical class C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims 1
- 239000002585 base Substances 0.000 description 63
- 238000000034 method Methods 0.000 description 24
- 239000003822 epoxy resin Substances 0.000 description 22
- 229920000647 polyepoxide Polymers 0.000 description 22
- 229920001577 copolymer Polymers 0.000 description 20
- 150000001336 alkenes Chemical class 0.000 description 14
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 12
- 239000000178 monomer Substances 0.000 description 12
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 239000003960 organic solvent Substances 0.000 description 9
- 235000011007 phosphoric acid Nutrition 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 238000010030 laminating Methods 0.000 description 8
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 8
- 239000006224 matting agent Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 229920001225 polyester resin Polymers 0.000 description 7
- 239000004645 polyester resin Substances 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 6
- 239000005977 Ethylene Substances 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 6
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 238000011282 treatment Methods 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 5
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 5
- 150000002334 glycols Chemical class 0.000 description 5
- 229910001416 lithium ion Inorganic materials 0.000 description 5
- 229920006122 polyamide resin Polymers 0.000 description 5
- 230000009257 reactivity Effects 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 125000004018 acid anhydride group Chemical group 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000007334 copolymerization reaction Methods 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 4
- 201000006747 infectious mononucleosis Diseases 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 4
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 150000003016 phosphoric acids Chemical class 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 229920005862 polyol Polymers 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- WWUCYCYSEUEANO-UHFFFAOYSA-N 2-(aziridin-1-yl)acetamide Chemical compound NC(=O)CN1CC1 WWUCYCYSEUEANO-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 3
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- WWZKQHOCKIZLMA-UHFFFAOYSA-N Caprylic acid Natural products CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 150000001718 carbodiimides Chemical class 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 150000003077 polyols Chemical class 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- GRWFGVWFFZKLTI-IUCAKERBSA-N (-)-α-pinene Chemical compound CC1=CC[C@@H]2C(C)(C)[C@H]1C2 GRWFGVWFFZKLTI-IUCAKERBSA-N 0.000 description 2
- GWQOYRSARAWVTC-UHFFFAOYSA-N 1,4-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=C(C(C)(C)OOC(C)(C)C)C=C1 GWQOYRSARAWVTC-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- YKTNISGZEGZHIS-UHFFFAOYSA-N 2-$l^{1}-oxidanyloxy-2-methylpropane Chemical group CC(C)(C)O[O] YKTNISGZEGZHIS-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
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- 239000004677 Nylon Substances 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
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- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
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- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920006124 polyolefin elastomer Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002742 polystyrene-block-poly(ethylene/propylene) -block-polystyrene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- MHZDONKZSXBOGL-UHFFFAOYSA-N propyl dihydrogen phosphate Chemical compound CCCOP(O)(O)=O MHZDONKZSXBOGL-UHFFFAOYSA-N 0.000 description 1
- PRAHMDIEZMWIRW-UHFFFAOYSA-N propyl dihydrogen phosphite Chemical compound CCCOP(O)O PRAHMDIEZMWIRW-UHFFFAOYSA-N 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- GRWFGVWFFZKLTI-UHFFFAOYSA-N rac-alpha-Pinene Natural products CC1=CCC2C(C)(C)C1C2 GRWFGVWFFZKLTI-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- IUCJMVBFZDHPDX-UHFFFAOYSA-N tretamine Chemical compound C1CN1C1=NC(N2CC2)=NC(N2CC2)=N1 IUCJMVBFZDHPDX-UHFFFAOYSA-N 0.000 description 1
- 229950001353 tretamine Drugs 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 description 1
- RYXYUARTMQUYKV-UHFFFAOYSA-N tris(4-butylphenyl)phosphane Chemical compound C1=CC(CCCC)=CC=C1P(C=1C=CC(CCCC)=CC=1)C1=CC=C(CCCC)C=C1 RYXYUARTMQUYKV-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/102—Primary casings; Jackets or wrappings characterised by their shape or physical structure
- H01M50/105—Pouches or flexible bags
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Sealing Battery Cases Or Jackets (AREA)
Description
本発明は、接着剤、詳しくは樹脂基材と金属基材とを接着するのに好適なポリオレフィン系接着剤、当該接着剤を用いて得られる積層体、二次電池用外装材及び電池に関する。 The present invention relates to an adhesive, specifically a polyolefin-based adhesive suitable for adhering a resin base material and a metal base material, a laminate obtained by using the adhesive, an exterior material for a secondary battery, and a battery.
リチウムイオン電池に代表される二次電池は、正極、負極およびその間に、電解液等を封入した構成をとっている。また、正極と負極の電気を外部に取り出すためのリード線を封入するための封入袋として、オレフィン樹脂からなるヒートシール層と、アルミニウム箔等の金属箔や金属蒸着層からなる金属基材とプラスチックを貼り合せた積層体を用いることが知られている(特許文献1、2)。 A secondary battery represented by a lithium ion battery has a configuration in which a positive electrode, a negative electrode, and an electrolytic solution or the like are sealed between them. Further, as an encapsulation bag for encapsulating lead wires for taking out electricity of the positive electrode and the negative electrode to the outside, a heat seal layer made of an olefin resin, a metal base material made of a metal foil such as an aluminum foil or a metal vapor deposition layer, and a plastic. It is known to use a laminated body obtained by laminating the above (Patent Documents 1 and 2).
しかしながら、オレフィン樹脂は非極性であるため、金属基材との接着が困難である。また、上述した積層体を用いて電池を組み立てる際には、電池素子の周縁に位置するシーラント層同士を熱融着して電池素子を密封することにより電池素子が封止される。このためヒートシール層と金属基材とを貼り合せる接着剤には、オレフィン樹脂のような非極性の基材と金属基材との接着性に加え、耐熱性が必要である。 However, since the olefin resin is non-polar, it is difficult to bond it to a metal substrate. Further, when assembling a battery using the above-mentioned laminate, the battery element is sealed by heat-sealing the sealant layers located on the periphery of the battery element to seal the battery element. Therefore, the adhesive for bonding the heat seal layer and the metal base material needs heat resistance in addition to the adhesiveness between the non-polar base material such as olefin resin and the metal base material.
本発明は、このような状況に鑑みなされたものであって、オレフィン樹脂のような非極性の基材と金属基材との接着性、耐熱性に優れた接着剤を提供することを目的とする。さらに、このような接着剤を用いて得られる積層体、当該積層体を用いて得られる二次電池外装材および電池を提供することを目的とする。 The present invention has been made in view of such a situation, and an object of the present invention is to provide an adhesive having excellent adhesiveness and heat resistance between a non-polar base material such as an olefin resin and a metal base material. To do. Further, it is an object of the present invention to provide a laminate obtained by using such an adhesive, a secondary battery exterior material and a battery obtained by using the laminate.
本発明は、オレフィン樹脂(A)、エポキシ化合物を含む硬化剤(B)、酸無水物(C)を含み、酸無水物(C)の配合量が、オレフィン樹脂(A)100質量部に対して0.05質量部以上10質量部以下である接着剤に関する。 The present invention contains an olefin resin (A), a curing agent (B) containing an epoxy compound, and an acid anhydride (C), and the blending amount of the acid anhydride (C) is 100 parts by mass of the olefin resin (A). The present invention relates to an adhesive having a weight of 0.05 parts by mass or more and 10 parts by mass or less.
本発明の接着剤は、オレフィン樹脂のような非極性の基材と金属基材との接着性、耐熱性に優れる。また、本発明の積層体は接着性、耐熱性に優れる。 The adhesive of the present invention is excellent in adhesiveness and heat resistance between a non-polar base material such as an olefin resin and a metal base material. Further, the laminate of the present invention is excellent in adhesiveness and heat resistance.
<接着剤>
本発明の接着剤は、オレフィン樹脂(A)、エポキシ化合物を含む硬化剤(B)、酸無水物(C)を含む。以下、本発明の接着剤の各成分について詳細に説明する。
<Adhesive>
The adhesive of the present invention contains an olefin resin (A), a curing agent containing an epoxy compound (B), and an acid anhydride (C). Hereinafter, each component of the adhesive of the present invention will be described in detail.
本発明の接着剤に用いられるオレフィン樹脂(A)としては、オレフィンモノマーの単独重合体や共重合体、オレフィンモノマーと他のモノマーとの共重合体、これら重合体の水素化物やハロゲン化物、酸や水酸基等の官能基を導入した変性体等、炭化水素骨格を主体とする重合体が挙げられ、1種または2種以上を組み合わせて用いることができる。酸基又は酸無水物基を有する結晶性オレフィン樹脂、水酸基を有する結晶性オレフィン樹脂を用いることが好ましい。 Examples of the olefin resin (A) used in the adhesive of the present invention include homopolymers and copolymers of olefin monomers, copolymers of olefin monomers and other monomers, and hydrides, halides, and acids of these polymers. Examples thereof include polymers mainly composed of a hydrocarbon skeleton, such as a modified product having a functional group introduced such as a hydroxyl group or a hydroxyl group, and one type or a combination of two or more types can be used. It is preferable to use a crystalline olefin resin having an acid group or an acid anhydride group, or a crystalline olefin resin having a hydroxyl group.
酸基又は酸無水物基を有するオレフィン樹脂としては、オレフィン系モノマーと、エチレン性不飽和カルボン酸またはエチレン性不飽和カルボン酸無水物との共重合体である酸変性オレフィン樹脂(A−1)や、ポリオレフィンにエチレン性不飽和カルボン酸またはエチレン性不飽和カルボン酸無水物をグラフト変性した樹脂である酸変性オレフィン樹脂(A−2)が挙げられる。 The olefin resin having an acid group or an acid anhydride group is an acid-modified olefin resin (A-1) which is a copolymer of an olefin monomer and an ethylenically unsaturated carboxylic acid or an ethylenically unsaturated carboxylic acid anhydride. Examples thereof include an acid-modified olefin resin (A-2), which is a resin obtained by graft-modifying an ethylenically unsaturated carboxylic acid or an ethylenically unsaturated carboxylic acid anhydride on a polyolefin.
酸変性オレフィン樹脂(A−1)の調整に用いられるオレフィン系モノマーとしては、炭素原子数が2〜8のオレフィン、例えば、エチレン、プロピレン、イソブチレン、1−ブテン、4−メチル−1−ペンテン、ヘキセン、ビニルシクロヘキサンなどが挙げられる。これらのなかでも特に接着強度が良好なものとなることから炭素原子数3〜8のオレフィンが好ましく、プロピレン、及び1−ブテンがより好ましく、とりわけプロピレンと1−ブテンとを併用することが溶剤に対する耐性に優れ、接着強度に優れる点から好ましい。 Examples of the olefin-based monomer used for preparing the acid-modified olefin resin (A-1) include olefins having 2 to 8 carbon atoms, for example, ethylene, propylene, isobutylene, 1-butene, 4-methyl-1-pentene, and the like. Examples include hexene and vinylcyclohexane. Among these, olefins having 3 to 8 carbon atoms are preferable, propylene and 1-butene are more preferable, and propylene and 1-butene are particularly used in combination with respect to the solvent because the adhesive strength is particularly good. It is preferable because it has excellent resistance and adhesive strength.
オレフィン系モノマーとの共重合に用いられるエチレン性不飽和カルボン酸またはエチレン性不飽和カルボン酸無水物としては、例えば、アクリル酸、メタクリル酸、マレイン酸、イタコン酸、シトラコン酸、メサコン酸、無水マレイン酸、4−メチルシクロヘキセ−4−エン−1,2−ジカルボン酸無水物、ビシクロ[2.2.2]オクト−5−エン−2,3−ジカルボン酸無水物、1,2,3,4,5,8,9,10−オクタヒドロナフタレン−2,3−ジカルボン酸無水物、2−オクタ−1,3−ジケトスピロ[4.4]ノン−7−エン、ビシクロ[2.2.1]ヘプト−5−エン−2,3−ジカルボン酸無水物、マレオピマル酸、テトラヒドロフタル酸無水物、メチル−ビシクロ[2.2.1]ヘプト−5−エン−2,3−ジカルボン酸無水物、メチル―ノルボルネン−5−エン−2,3−ジカルボン酸無水物、ノルボルン−5−エン−2,3−ジカルボン酸無水物等が挙げられる。これらのなかでも特にオレフィン系モノマーとの反応性、共重合した後の酸無水物の反応性に優れ、かつ、該化合物自体の分子量が小さく共重合体にした場合の官能基濃度が高くなる点から無水マレイン酸が好ましい。これらは単独で、あるいは2種以上併用して使用することができる。 Examples of the ethylenically unsaturated carboxylic acid or ethylenically unsaturated carboxylic acid anhydride used for copolymerization with an olefin-based monomer include acrylic acid, methacrylic acid, maleic acid, itaconic acid, citraconic acid, mesaconic acid, and maleic anhydride. Acid, 4-methylcyclohexe-4-ene-1,2-dicarboxylic acid anhydride, bicyclo [2.2.2] octo-5-ene-2,3-dicarboxylic acid anhydride, 1,2,3 4,5,8,9,10-Octahydronaphthalene-2,3-dicarboxylic acid anhydride, 2-octa-1,3-diketospiro [4.4] non-7-ene, bicyclo [2.2.1] ] Hept-5-ene-2,3-dicarboxylic acid anhydride, maleopimaric acid, tetrahydrophthalic acid anhydride, methyl-bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylic acid anhydride, Examples thereof include methyl-norbornen-5-ene-2,3-dicarboxylic acid anhydride, norborn-5-ene-2,3-dicarboxylic acid anhydride. Among these, the reactivity with the olefin-based monomer and the reactivity of the acid anhydride after copolymerization are particularly excellent, and the molecular weight of the compound itself is small and the functional group concentration is high when it is made into a copolymer. Therefore, maleic anhydride is preferable. These can be used alone or in combination of two or more.
酸変性オレフィン樹脂(A−1)の調整には、オレフィン系モノマー、チレン性不飽和カルボン酸またはエチレン性不飽和カルボン酸無水物に加え、その他のエチレン性不飽和基を持つ化合物、例えばスチレン、ブタジエン、イソプレン等を併用してもよい。 For the preparation of the acid-modified olefin resin (A-1), in addition to the olefin-based monomer, the tylene unsaturated carboxylic acid or the ethylenically unsaturated carboxylic acid anhydride, other compounds having an ethylenically unsaturated group, for example, styrene, You may use butadiene, isoprene and the like together.
酸変性オレフィン樹脂(A−2)の調整に用いられるポリオレフィンとしては、炭素原子数2〜8のオレフィンの単独重合体や共重合体、炭素原子数2〜8のオレフィンと他のモノマーとの共重合体等が挙げられ、具体的には、例えば、高密度ポリエチレン(HDPE)、低密度ポリエチレン(LDPE)、線状低密度ポリエチレン樹脂などのポリエチレン、ポリプロピレン、ポリイソブチレン、ポリ(1−ブテン)、ポリ(4−メチル−1−ペンテン)、ポリビニルシクロヘキサン、エチレン・プロピレンブロック共重合体、エチレン・プロピレンランダム共重合体、エチレン・1−ブテン共重合体、エチレン・4−メチル−1−ペンテン共重合体、エチレン・へキセン共重合体などのα―オレフィン共重合体、エチレン・酢酸ビニル共重合体、エチレン・メチルメタクリレート共重合体、エチレン・酢酸ビニル・メチルメタクリレート共重合体、プロピレン・1−ブテン共重合体などが挙げられる。これらの中で特に接着強度が良好なものとなる点から炭素原子数3〜8のオレフィンの単独重合体、炭素原子数3〜8のオレフィンの2種以上の共重合体が好ましく、プロピレンの単独重合体、又はプロピレン・1−ブテン共重合体がより好ましく、とりわけプロピレン・1−ブテン共重合体が溶剤に対する耐性に優れ、接着強度に優れる点から好ましい。 Examples of the polyolefin used for preparing the acid-modified olefin resin (A-2) include homopolymers and copolymers of olefins having 2 to 8 carbon atoms, and copolymers of olefins having 2 to 8 carbon atoms and other monomers. Examples thereof include copolymers, and specific examples thereof include polyethylenes such as high-density polyethylene (HDPE), low-density polyethylene (LDPE), and linear low-density polyethylene resins, polypropylene, polyisobutylene, and poly (1-butene). Poly (4-methyl-1-pentene), polyvinylcyclohexane, ethylene / propylene block copolymer, ethylene / propylene random copolymer, ethylene / 1-butene copolymer, ethylene / 4-methyl-1-pentene copolymer Combined, α-olefin copolymer such as ethylene / hexene copolymer, ethylene / vinyl acetate copolymer, ethylene / methyl methacrylate copolymer, ethylene / vinyl acetate / methyl methacrylate copolymer, propylene / 1-butene Examples thereof include copolymers. Among these, a homopolymer of an olefin having 3 to 8 carbon atoms and two or more copolymers of an olefin having 3 to 8 carbon atoms are preferable from the viewpoint of particularly good adhesive strength, and propylene alone. A polymer or a propylene / 1-butene copolymer is more preferable, and a propylene / 1-butene copolymer is particularly preferable because it has excellent resistance to a solvent and excellent adhesive strength.
ポリオレフィンとのグラフト変性に用いられるエチレン性不飽和カルボン酸またはエチレン性不飽和カルボン酸無水物としては、上述した、酸変性オレフィン樹脂(A−1)の調整においてオレフィン系モノマーとの共重合に用いられるものと同様のものを用いることができる。グラフト変性後の官能基の反応性が高く、また、グラフト変性したポリオレフィンの官能基濃度が高くなる点から無水マレイン酸が好ましい。これらは単独で、あるいは2種以上併用して使用することができる。 The ethylenically unsaturated carboxylic acid or ethylenically unsaturated carboxylic acid anhydride used for graft modification with polyolefin is used for copolymerization with an olefin-based monomer in the preparation of the acid-modified olefin resin (A-1) described above. The same ones that can be used can be used. Maleic anhydride is preferable because the reactivity of the functional group after the graft modification is high and the concentration of the functional group of the graft-modified polyolefin is high. These can be used alone or in combination of two or more.
グラフト変性によりポリオレフィンにエチレン性不飽和カルボン酸またはエチレン性不飽和カルボン酸無水物を反応させるには、具体的には、ポリオレフィンを溶融し、そこにエチレン性不飽和カルボン酸またはエチレン性不飽和カルボン酸無水物(グラフトモノマー)を添加してグラフト反応させる方法、ポリオレフィンを溶媒に溶解して溶液とし、そこにエチレン性不飽和カルボン酸またはエチレン性不飽和カルボン酸無水物を添加してグラフト反応させる方法、有機溶剤に溶解したポリオレフィンと、エチレン性不飽和カルボン酸またはエチレン性不飽和カルボン酸無水物とを混合し、ポリオレフィンの軟化温度または融点以上の温度で加熱し溶融状態にてラジカル重合と水素引き抜き反応を同時に行う方法等が挙げられる。 To react an ethylenically unsaturated carboxylic acid or an ethylenically unsaturated carboxylic acid anhydride with a polyolefin by graft modification, specifically, the polyolefin is melted and the ethylenically unsaturated carboxylic acid or the ethylenically unsaturated carboxylic acid is melted therein. A method of adding an acid anhydride (graft monomer) to cause a graft reaction, dissolving polyolefin in a solvent to prepare a solution, and adding ethylenically unsaturated carboxylic acid or ethylenically unsaturated carboxylic acid anhydride to the solution to cause a graft reaction. Method, Polyethylene dissolved in an organic solvent is mixed with ethylenically unsaturated carboxylic acid or ethylenically unsaturated carboxylic acid anhydride, heated at the softening temperature of the polyolefin or a temperature higher than the melting point, and radical polymerization and hydrogen in a molten state. Examples thereof include a method of simultaneously performing a withdrawal reaction.
いずれの場合にもグラフトモノマーを効率よくグラフト共重合させるためには、ラジカル開始剤の存在下にグラフト反応を実施することが好ましい。グラフト反応は、通常60〜350℃の条件で行われる。ラジカル開始剤の使用割合は変性前のポリオレフィン100重量部に対して、通常0.001〜1重量部の範囲である。 In either case, in order to efficiently carry out the graft copolymerization of the graft monomer, it is preferable to carry out the graft reaction in the presence of a radical initiator. The graft reaction is usually carried out under the condition of 60 to 350 ° C. The ratio of the radical initiator used is usually in the range of 0.001 to 1 part by weight with respect to 100 parts by weight of the polyolefin before modification.
ラジカル開始剤としては、有機ペルオキシドが好ましく、例えばベンゾイルペルオキシド、ジクロルベンゾイルペルオキシド、ジクミルペルオキシド、ジ−tert−ブチルペルオキシド、2,5−ジメチル−2,5−ジ(ペルオキシドベンゾエート)ヘキシン―3、1,4−ビス(tert−ブチルペルオキシイソプロピル)ベンゼン、ラウロイルペルオキシド、tert−ブチルペルアセテート、2,5−ジメチル−2,5−ジ(tert−ブチルペルオキシ)ヘキシン−3、2,5−ジメチル―2.5−ジ(tert−ブチルペルオキシ)ヘキサン、tert−ブチルペルベンゾエート、tert−ブチルペルフェニルアセテート、tert−ブチルペルイソブチレート、tert−ブチルペル―sec−オクトエート、tert−ブチルペルピバレート、クミルペルピバレートおよびtert−ブチルペルジエチルアセテートなどがあげられる。その他アゾ化合物、例えばアゾビスイソブチロニトリル、ジメチルアゾイソブチレートなどを用いることもできる。 As the radical initiator, an organic peroxide is preferable, for example, benzoyl peroxide, dichlorobenzoyl peroxide, dicumyl peroxide, di-tert-butyl peroxide, 2,5-dimethyl-2,5-di (peroxide benzoate) hexin-3, 1,4-Bis (tert-butylperoxyisopropyl) benzene, lauroyl peroxide, tert-butylperacetate, 2,5-dimethyl-2,5-di (tert-butylperoxy) hexin-3,2,5-dimethyl- 2.5-di (tert-butylperoxy) hexane, tert-butylperbenzoate, tert-butylperphenylacetate, tert-butylperisobutyrate, tert-butylper-sec-octate, tert-butylperpivalate, ku Examples thereof include milper pivalate and tert-butylperdiethyl acetate. Other azo compounds such as azobisisobutyronitrile and dimethylazoisobutyrate can also be used.
ラジカル開始剤は、グラフト反応のプロセスにより最適なものを選定すればよいが、通常ジクミルペルオキシド、ジ−tert−ブチルペルオキシド、2,5−ジメチル−2,5−ジ(tert−ブチルペルオキシ)ヘキシン−3、2,5−ジメチル−2,5−ジ(tert−ブチルペルオキシ)ヘキサン、1,4−ビス(tert−ブチルペルオキシイソプロピル)ベンゼン等のジアルキルペルオキシドが好ましく用いられる。 The optimum radical initiator may be selected according to the graft reaction process, but usually dicumyl peroxide, di-tert-butyl peroxide, or 2,5-dimethyl-2,5-di (tert-butylperoxy) hexine. Dialkyl peroxides such as -3,2,5-dimethyl-2,5-di (tert-butylperoxy) hexane and 1,4-bis (tert-butylperoxyisopropyl) benzene are preferably used.
オレフィン樹脂(A)として酸変性オレフィン樹脂(A−1)や酸変性オレフィン樹脂(A−2)を用いる場合には、金属層の密着性がより向上し、耐電解質性に優れることから、1〜200mgKOH/gの酸価を有するものを用いることが好ましい。 When an acid-modified olefin resin (A-1) or an acid-modified olefin resin (A-2) is used as the olefin resin (A), the adhesion of the metal layer is further improved and the electrolyte resistance is excellent. It is preferable to use one having an acid value of ~ 200 mgKOH / g.
水酸基を有するオレフィン樹脂(A−3)としては、ポリオレフィンと水酸基含有(メタ)アクリル酸エステルや水酸基含有ビニルエーテルとの共重合体や、ポリオレフィンに水酸基含有(メタ)アクリル酸エステルや水酸基含有ビニルエーテルをグラフト変性した樹脂が挙げられる。ポリオレフィンは、オレフィン樹脂(A−2)の調整に用いるものと同様のものを用いることができる。変性方法としては、酸変性オレフィン樹脂(A−1)、(A−2)の調整方法と同様の方法を用いることができる。 As the olefin resin (A-3) having a hydroxyl group, a copolymer of polyolefin and a hydroxyl group-containing (meth) acrylic acid ester or a hydroxyl group-containing vinyl ether, or a hydroxyl group-containing (meth) acrylic acid ester or a hydroxyl group-containing vinyl ether grafted on a polyolefin. Examples include modified resins. As the polyolefin, the same polyolefin used for preparing the olefin resin (A-2) can be used. As the modification method, the same method as the method for adjusting the acid-modified olefin resins (A-1) and (A-2) can be used.
変性に用いる水酸基含有(メタ)アクリル酸エステルとしては、ヒドロキシエチル(メタ)アクリレート、ヒドロキシプロピル(メタ)アクリレート、グリセロール(メタ)アクリレート、ラクトン変性ヒドロキシエチル(メタ)アクリレート、ポリエチレングリコールモノ(メタ)アクリレート、ポリプロピレングリコールモノ(メタ)アクリレート等が挙げられる。
水酸基含有ビニルエーテルとしては、2−ヒドロキシエチルビニルエーテル、ジエチレングリコールモノビニルエーテル、4−ヒドロキシブチルビニルエーテル等が挙げられる。
Examples of the hydroxyl group-containing (meth) acrylic acid ester used for modification include hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, glycerol (meth) acrylate, lactone-modified hydroxyethyl (meth) acrylate, and polyethylene glycol mono (meth) acrylate. , Polypropylene glycol mono (meth) acrylate and the like.
Examples of the hydroxyl group-containing vinyl ether include 2-hydroxyethyl vinyl ether, diethylene glycol monovinyl ether, 4-hydroxybutyl vinyl ether and the like.
オレフィン樹脂(A)として、水酸基を有するオレフィン樹脂(A−3)を用いる場合には、金属層の密着性がより向上し、耐電解質性に優れることから、1〜200mgKOH/gの水酸基価を有するものを用いることが好ましい。 When an olefin resin (A-3) having a hydroxyl group is used as the olefin resin (A), the adhesion of the metal layer is further improved and the electrolyte resistance is excellent. Therefore, a hydroxyl value of 1 to 200 mgKOH / g can be used. It is preferable to use the one that has.
オレフィン樹脂(A)として、上述した酸変性オレフィン樹脂(A−2)や水酸基を有するオレフィン樹脂(A−3)の調整に用いるポリオレフィンを、変性せずにそのまま用いてもよい。 As the olefin resin (A), the above-mentioned acid-modified olefin resin (A-2) or the polyolefin used for adjusting the olefin resin (A-3) having a hydroxyl group may be used as it is without modification.
接着性を良好なものとするためオレフィン樹脂(A)の重量平均分子量は40,000以上であることが好ましい。また、適度な流動性を確保するためオレフィン樹脂(A)の重量平均分子量は150,000以下であることが好ましい。 The weight average molecular weight of the olefin resin (A) is preferably 40,000 or more in order to improve the adhesiveness. Further, the weight average molecular weight of the olefin resin (A) is preferably 150,000 or less in order to ensure appropriate fluidity.
尚、本願発明において、重量平均分子量(Mw)、数平均分子量(Mn)は、下記条件のゲルパーミエーションクロマトグラフィー(GPC)により測定される値である。 In the present invention, the weight average molecular weight (Mw) and the number average molecular weight (Mn) are values measured by gel permeation chromatography (GPC) under the following conditions.
測定装置 ;東ソー株式会社製 HLC−8320GPC
カラム ;東ソー株式会社製 TSKgel 4000HXL、TSKgel 3000HXL、TSKgel 2000HXL、TSKgel 1000HXL
検出器 ;RI(示差屈折計)
データ処理;東ソー株式会社製 マルチステーションGPC−8020modelII
測定条件 ;カラム温度 40℃
溶媒 テトラヒドロフラン
流速 0.35ml/分
標準 ;単分散ポリスチレン
試料 ;樹脂固形分換算で0.2質量%のテトラヒドロフラン溶液をマイクロフィルターでろ過したもの(100μl)
Measuring device; HLC-8320GPC manufactured by Tosoh Corporation
Column; TSKgel 4000HXL, TSKgel 3000HXL, TSKgel 2000HXL, TSKgel 1000HXL manufactured by Tosoh Corporation
Detector; RI (Differential Refractometer)
Data processing; Multi-station GPC-8020modelII manufactured by Tosoh Corporation
Measurement conditions; column temperature 40 ° C
Solvent tetrahydrofuran
Flow velocity 0.35 ml / min Standard; Monodisperse polystyrene sample; 0.2 mass% tetrahydrofuran solution in terms of resin solid content filtered through a microfilter (100 μl)
オレフィン樹脂(A)の融点は50℃以上であることが好ましく、60℃以上であることがより好ましく、65℃以上であることがより好ましい。オレフィン樹脂(A)の融点は120℃以下であることが好ましく、90℃以下であることがより好ましく、85℃以下であることがより好ましい。 The melting point of the olefin resin (A) is preferably 50 ° C. or higher, more preferably 60 ° C. or higher, and even more preferably 65 ° C. or higher. The melting point of the olefin resin (A) is preferably 120 ° C. or lower, more preferably 90 ° C. or lower, and even more preferably 85 ° C. or lower.
オレフィン樹脂の融点はDSC(示差走査熱量分析)により測定する。具体的には降温到達温度から昇温到達温度まで10℃/minで昇温後、10℃/minで降温到達温度まで冷却して熱履歴を除去した後、再度10℃/minで昇温到達点まで昇温する。2度目に昇温した際のピーク温度を融点とする。また、降温到達温度は結晶化温度よりも50℃以上低い温度に、昇温到達温度は融点温度よりも30℃位以上高い温度に設定する。降温到達温度、昇温到達温度は試測定して決定する。 The melting point of the olefin resin is measured by DSC (Differential Scanning Calorimetry). Specifically, after raising the temperature from the temperature at which the temperature falls to the temperature at which the temperature rises at 10 ° C./min, the temperature is cooled to the temperature at which the temperature falls at 10 ° C./min to remove the heat history, and then the temperature rises again at 10 ° C./min. The temperature rises to the point. The melting point is the peak temperature when the temperature is raised for the second time. Further, the temperature at which the temperature falls is set to a temperature 50 ° C. or higher lower than the crystallization temperature, and the temperature at which the temperature rises is reached is set to a temperature about 30 ° C. or higher higher than the melting point temperature. The temperature at which the temperature falls and the temperature at which the temperature rises rise are determined by trial measurement.
硬化剤(B)としては、エポキシ化合物を用いる。分子内にエポキシ基を有する化合物であれば特に限定されず、例えば、エチレングリコール、プロピレングリコール、ヘキサンジオール、ネオペンチルグリコール、トリメチロールエタン、トリメチロールプロパン、ペンタエリトリトール、グリセリン、ジグリセリン、ソルビトール、スピログリコールもしくは水添ビスフェノールA等の脂肪族ポリオールのポリグリシジルエーテル型エポキシ樹脂;
ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、ビスフェノールAD型エポキシ樹脂等のビスフェノール型エポキシ樹脂;
フェノールノボラック樹脂やクレゾールノボラック樹脂のグリシジルエールであるノボラック型エポキシ樹脂等の芳香族エポキシ樹脂;
ビスフェノールA、ビスフェノールF、ビスフェノールS、ビスフェノールADなどの芳香族系ポリヒドロキシ化合物のエチレンオキシドもしくはプロピレンオキシド付加体であるポリオールのポリグリシジルエーテル;
ポリエチレングリコール、ポリプロピレングリコールもしくはポリテトラメチレングリコール等のポリエーテルポリオールのポリグリシジルエーテル型エポキシ樹脂;ビス(3,4−エポキシシクロヘキシルメチル)アジペート、3,4−エポキシシクロヘキシルメチル−3’,4’−エポキシシクロヘキシルカルボキシレート等の環状脂肪族型ポリエポキシ樹脂;
プロパントリカルボン酸、ブタンテトラカルボン酸、アジピン酸、フタル酸、テレフタル酸もしくはトリメリット酸等のポリカルボン酸のポリグリシジルエステル型エポキシ樹脂;
ブタジエン、ヘキサジエン、オクタジエン、ドデカジエン、シクロオクタジエン、α−ピネンもしくはビニルシクロヘキセン等の炭化水素系ジエンのビスエポキシ樹脂;
ポリブタジエンもしくはポリイソプレン等のジエンポリマーのエポキシ樹脂;
テトラグリシジルジアミノジフェニルメタン、トリグリシジルパラアミノフェノール、テトラグリシジルビスアミノメチルシクロヘキサン、ジグリシジルアニリン、テトラグリシジルメタキシリレンジアミン等のグリシジルアミン型エポキシ樹脂;
トリアジン、ヒダントイン等の複素環を含有するエポキシ樹脂が挙げられる。
これらのエポキシ樹脂は単独で用いてもよいし、2種以上組み合わせて用いてもよい。
An epoxy compound is used as the curing agent (B). The compound is not particularly limited as long as it has an epoxy group in the molecule, and is not particularly limited, for example, ethylene glycol, propylene glycol, hexanediol, neopentyl glycol, trimethylolethane, trimethylolpropane, pentaerythritol, glycerin, diglycerin, sorbitol, and spiro. Polyglycidyl ether type epoxy resin of aliphatic polyol such as glycol or hydrogenated bisphenol A;
Bisphenol type epoxy resin such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AD type epoxy resin;
Aromatic epoxy resins such as phenol novolac resin and novolac type epoxy resin which is glycidyl ale of cresol novolak resin;
Ethylene oxide of aromatic polyhydroxy compounds such as bisphenol A, bisphenol F, bisphenol S, bisphenol AD, or polyglycidyl ether of polyol which is an adduct of propylene oxide;
Polyglycidyl ether type epoxy resin of polyether polyol such as polyethylene glycol, polypropylene glycol or polytetramethylene glycol; bis (3,4-epoxycyclohexylmethyl) adipate, 3,4-epoxycyclohexylmethyl-3', 4'-epoxy Cyclic aliphatic polyepoxy resin such as cyclohexylcarboxylate;
Polyglycidyl ester type epoxy resin of polycarboxylic acid such as propanetricarboxylic acid, butanetetracarboxylic acid, adipic acid, phthalic acid, terephthalic acid or trimellitic acid;
Hydrocarbon diene bisepoxy resins such as butadiene, hexadiene, octadiene, dodecadien, cyclooctadiene, α-pinene or vinylcyclohexene;
Diene polymer epoxy resin such as polybutadiene or polyisoprene;
Glycidylamine type epoxy resins such as tetraglycidyldiaminodiphenylmethane, triglycidylparaaminophenol, tetraglycidylbisaminomethylcyclohexane, diglycidylaniline, and tetraglycidylmethoxylylenediamine;
Epoxy resins containing a heterocycle such as triazine and hydantoin can be mentioned.
These epoxy resins may be used alone or in combination of two or more.
また、本発明に用いられるエポキシ化合物は、1分子中に2つ以上のエポキシ基と1つ以上の水酸基を備え、重量平均分子量が3000以下であるエポキシ化合物であることが好ましい。 Further, the epoxy compound used in the present invention is preferably an epoxy compound having two or more epoxy groups and one or more hydroxyl groups in one molecule and having a weight average molecular weight of 3000 or less.
硬化剤(B)として、エポキシ樹脂以外の化合物を併用してもよい。エポキシ樹脂と併用可能な他の硬化剤としては、多官能イソシアネート化合物、アジリジン基含有化合物、カルボジイミド、オキサゾリン、アミノ樹脂などが挙げられる。 A compound other than the epoxy resin may be used in combination as the curing agent (B). Other curing agents that can be used in combination with the epoxy resin include polyfunctional isocyanate compounds, aziridine group-containing compounds, carbodiimides, oxazolines, amino resins and the like.
多官能イソシアネート化合物としては、2,4−トリレンジイソシアネート、2,6−トリレンジイソシアネート、キシリレンジイソシアネート、ジフェニルメタンジイソシアネート、イソホロンジイソシアネート、1,5−ナフタレンジイソシアネート、ヘキサメチレンジイソシアネート、ビス(4−イソシアネートシクロヘキシル)メタン、若しくは水添化ジフェニルメタンジイソシアネート等のジイソシアネートおよびこれらから誘導された化合物、即ち、前記ジイソシアネートのイソシアヌレート体、アダクト体、ビウレット型、ウレトジオン体、アロファネート体、イソシアネート残基を有するプレポリマー(ジイソシアネートとポリオールから得られる低重合体)、若しくはこれらの複合体等が挙げられる。 Examples of the polyfunctional isocyanate compound include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, xylylene diisocyanate, diphenylmethane diisocyanate, isophorone diisocyanate, 1,5-naphthalenedi isocyanate, hexamethylene diisocyanate, and bis (4-isocyanate cyclohexyl). ) Diisocyanates such as methane or hydrogenated diphenylmethane diisocyanates and compounds derived from these, that is, prepolymers (diisocyanates) having isocyanurates, adducts, biuret types, uretdiones, allophanates, and isocyanate residues of the diisocyanates. And a low polymer obtained from polyol), or a complex thereof and the like.
上述したような多官能イソシアネート化合物の一部のイソシアネート基を、イソシアネート基と反応性を有する化合物と反応させて得られる化合物を硬化剤として使用してもよい。イソシアネート基と反応性を有する化合物としては、ブチルアミン、ヘキシルアミン、オクチルアミン、2−エチルヘキシルアミン、ジブチルアミン、エチレンジアミン、ベンジルアミン、アニリン等のアミノ基を含有する化合物類:メタノール、エタノール、プロパノール、イソプロパノール、ブタノール、ヘキサノール、オクタノール、2−エチルヘキシルアルコール、ドデシルアルコール、エチレングリコール、プロピレングリコール、ベンジルアルコール、フェノール等の水酸基を含有する化合物類:アリルグリシジルエーテル、2−エチルヘキシルグリシジルエーテル、フェニルグリシジルエーテル、ネオペンチルグリコールジグリシジルエーテル、1,6−ヘキサンジオールグリシジルエーテル、シクロヘキサンジメタノールジグリシジルエーテル等のエポキシ基を有する化合物類:酢酸、ブタン酸、ヘキサン酸、オクタン酸、コハク酸、アジピン酸、セバシン酸、フタル酸等のカルボン酸を含有する化合物等が挙げられる。 A compound obtained by reacting a part of the isocyanate groups of the above-mentioned polyfunctional isocyanate compound with a compound having reactivity with the isocyanate group may be used as a curing agent. Compounds that have reactivity with isocyanate groups include amino group-containing compounds such as butylamine, hexylamine, octylamine, 2-ethylhexylamine, dibutylamine, ethylenediamine, benzylamine, and aniline: methanol, ethanol, propanol, and isopropanol. , Butanol, Hexanol, Octanol, 2-ethylhexyl alcohol, dodecyl alcohol, ethylene glycol, propylene glycol, benzyl alcohol, phenol and other compounds containing hydroxyl groups: allyl glycidyl ether, 2-ethylhexyl glycidyl ether, phenyl glycidyl ether, neopentyl Compounds having an epoxy group such as glycol diglycidyl ether, 1,6-hexanediol glycidyl ether, cyclohexanedimethanol diglycidyl ether: acetic acid, butanoic acid, hexanoic acid, octanoic acid, succinic acid, adipic acid, sebacic acid, phthal Examples thereof include compounds containing carboxylic acids such as acids.
アジリジン基含有化合物としては、例えば、N,N´−ヘキサメチレン−1,6−ビス(1−アジリジンカルボキシアミド)、N,N´−ジフェニルメタン−4,4´−ビス(1−アジリジンカルボキシアミド)、トリメチロールプロパン−トリ−β−アジリジニルプロピオネート)、N,N´−トルエン−2,4−ビス(1−アジリジンカルボキシアミド)、トリエチレンメラミン、トリメチロールプロパン−トリ−β(2−メチルアジリジン)プロピオネート、ビスイソフタロイル−1−2−メチルアジリジン、トリ−1−アジリジニルフォスフィンオキサイド、トリス−1−2−メチルアジリジンフォスフィンオキサイド等が挙げられる。 Examples of the aziridine group-containing compound include N, N'-hexamethylene-1,6-bis (1-aziridinecarboxyamide) and N, N'-diphenylmethane-4,4'-bis (1-aziridinecarboxyamide). , Trimethylolpropan-tri-β-aziridinyl propionate), N, N'-toluene-2,4-bis (1-aziridinecarboxyamide), triethylenemelamine, trimethylalopropan-tri-β (2) -Methylaziridine) propionate, bisisophthaloyl-2-methylaziridine, tri-1-aziridinylphosphine oxide, tris-1--2-methylaziridinephosphine oxide and the like can be mentioned.
カルボジイミドとしては、N,N’−ジ−o−トルイルカルボジイミド、N,N’−ジフェニルカルボジイミド、N,N’−ジ−2,6−ジメチルフェニルカルボジイミド、N,N’―ビス(2,6−ジイソプロピルフェニル)カルボジイミド、N,N’−ジオクチルデシルカルボジイミド、N−トリイル−N’−シクロヘキシルカルボジイミド、N,N’−ジ−2,2−tert.−ブチルフェニルカルボジイミド、N−トリイル−N’−フェニルカルボジイミド、N,N’−ジ−p−アミノフェニルカルボジイミド、N,N’−ジ−p−ヒドロキシフェニルカルボジイミド、N,N’−ジ−シクロヘキシルカルボジイミド、N,N’−ジ−p−トルイルカルボジイミド等が挙げられる。 Examples of carbodiimides include N, N'-di-o-toluyl carbodiimide, N, N'-diphenylcarbodiimide, N, N'-di-2,6-dimethylphenylcarbodiimide, and N, N'-bis (2,6-bis). Diisopropylphenyl) carbodiimide, N, N'-dioctyldecylcarbodiimide, N-triyl-N'-cyclohexylcarbodiimide, N, N'-di-2,2-tert. -Butylphenylcarbodiimide, N-triyl-N'-phenylcarbodiimide, N, N'-di-p-aminophenylcarbodiimide, N, N'-di-p-hydroxyphenylcarbodiimide, N, N'-di-cyclohexylcarbodiimide , N, N'-di-p-toluyl carbodiimide and the like.
オキサゾリンとしては、2−オキサゾリン、2−メチル−2−オキサゾリン、2−フェニル−2−オキサゾリン、2,5−ジメチル−2−オキサゾリン、2,4−ジフェニル−2−オキサゾリンなどのモノオキサゾリン化合物、2,2’−(1,3−フェニレン)−ビス(2−オキサゾリン)、2,2’−(1,2−エチレン)−ビス(2−オキサゾリン)、2,2’−(1,4ブチレン)−ビス(2−オキサゾリン)、2,2’−(1,4−フェニレン)−ビス(2−オキサゾリン)などが挙げられる。 Examples of the oxazoline include monooxazoline compounds such as 2-oxazoline, 2-methyl-2-oxazoline, 2-phenyl-2-oxazoline, 2,5-dimethyl-2-oxazoline and 2,4-diphenyl-2-oxazoline, 2. , 2'-(1,3-phenylene) -bis (2-oxazoline), 2,2'-(1,2-ethylene) -bis (2-oxazoline), 2,2'-(1,4 butylene) -Bis (2-oxazoline), 2,2'-(1,4-phenylene) -bis (2-oxazoline) and the like can be mentioned.
アミノ樹脂としては、メラミン樹脂、ベンゾグアナミン樹脂、尿素樹脂等が挙げられる。 Examples of the amino resin include melamine resin, benzoguanamine resin, urea resin and the like.
硬化剤(B)の配合量は、オレフィン樹脂(A)100質量部に対して0.01質量部以上であることが好ましく、0.1質量部以上であることがより好ましく、0.5質量部以上であることがさらに好ましい。また、硬化剤(B)の配合量は、オレフィン樹脂(A)100質量部に対して10質量部以下であることが好ましく、8質量部以下であることがより好ましく、5質量部以下であることがさらに好ましい。これにより、優れた接着性と耐薬品性とを発現することができる。 The blending amount of the curing agent (B) is preferably 0.01 part by mass or more, more preferably 0.1 part by mass or more, and 0.5 part by mass with respect to 100 parts by mass of the olefin resin (A). It is more preferable to have more than one part. The amount of the curing agent (B) to be blended is preferably 10 parts by mass or less, more preferably 8 parts by mass or less, and 5 parts by mass or less with respect to 100 parts by mass of the olefin resin (A). Is even more preferable. Thereby, excellent adhesiveness and chemical resistance can be exhibited.
酸無水物(C)としては、環状脂肪族酸無水物、芳香族酸無水物、不飽和カルボン酸無水物等が挙げられ、1種または2種以上を組み合わせて用いることができる。より具体的には、例えば、フタル酸無水物、トリメリット酸無水物、ピロメリット酸無水物、ベンゾフェノンテトラカルボン酸無水物、ドデセニルコハク酸無水物、ポリアジピン酸無水物、ポリアゼライン酸無水物、ポリセバシン酸無水物、ポリ(エチルオクタデカン二酸)無水物、ポリ(フェニルヘキサデカン二酸)無水物、テトラヒドロフタル酸無水物、メチルテトラヒドロフタル酸無水物、メチルヘキサヒドロフタル酸無水物、ヘキサヒドロフタル酸無水物、メチルハイミック酸無水物、トリアルキルテトラヒドロフタル酸無水物、メチルシクロヘキセンジカルボン酸無水物、メチルシクロヘキセンテトラカルボン酸無水物、エチレングリコールビストリメリテート二無水物、ヘット酸無水物、ナジック酸無水物、メチルナジック酸無水物、5−(2,5−ジオキソテトラヒドロ−3−フラニル)−3−メチル−3−シクロヘキサン−1,2−ジカルボン酸無水物、3,4−ジカルボキシ−1,2,3,4−テトラヒドロ−1−ナフタレンコハク酸二無水物、1−メチル−ジカルボキシ−1,2,3,4−テトラヒドロ−1−ナフタレンコハク酸二無水物等が挙げられる。 Examples of the acid anhydride (C) include cyclic aliphatic acid anhydrides, aromatic acid anhydrides, unsaturated carboxylic acid anhydrides, and the like, and one type or a combination of two or more types can be used. More specifically, for example, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic acid anhydride, dodecenyl succinic anhydride, polyazipic acid anhydride, polyazereic acid anhydride, polysevacinic acid. Anhydrous, poly (ethyloctadecanedioic acid) anhydride, poly (phenylhexadecanedioic acid) anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride , Methyl hymic acid anhydride, trialkyltetrahydrophthalic acid anhydride, methylcyclohexene dicarboxylic acid anhydride, methylcyclohexene tetracarboxylic acid anhydride, ethylene glycol bistrimericate dianhydride, het acid anhydride, nadic acid anhydride, Methylnadic acid anhydride, 5- (2,5-dioxotetrahydro-3-furanyl) -3-methyl-3-cyclohexane-1,2-dicarboxylic acid anhydride, 3,4-dicarboxy-1,2, Examples thereof include 3,4-tetrahydro-1-naphthalene succinic anhydride, 1-methyl-dicarboxy-1,2,3,4-tetrahydro-1-naphthalene succinic anhydride and the like.
また、酸無水物(C)として上述した化合物をグリコールで変性したものを用いてもよい。変性に用いることができるグリコールとしては、エチレングリコール、プロピレングリコール、ネオペンチルグリコール等のアルキレングリコール類;ポリエチレングリコール、ポリプロピレングリコール、ポチテトラメチレンエーテルグリコール等のポリエーテルグリコール類等が挙げられる。更には、これらのうちの2種類以上のグリコール及び/又はポリエーテルグリコールの共重合ポリエーテルグリコールを用いることもできる。 Further, as the acid anhydride (C), the above-mentioned compound modified with glycol may be used. Examples of glycols that can be used for modification include alkylene glycols such as ethylene glycol, propylene glycol and neopentyl glycol; and polyether glycols such as polyethylene glycol, polypropylene glycol and potitetramethylene ether glycol. Furthermore, copolymerized polyether glycols of two or more kinds of these glycols and / or polyether glycols can also be used.
酸無水物(C)の配合量は、オレフィン樹脂(A)100質量部に対して0.05質量部以上であることが好ましく、0.8質量部以上であることがより好ましい。また、酸無水物(C)の配合量は、オレフィン樹脂(A)100質量部に対して10質量部以下であることが好ましく、8質量部以下であることがより好ましい。これにより、接着剤と金属との密着性が向上し、初期接着強度とヒートシール後の接着強度に優れた接着剤とすることができる。 The blending amount of the acid anhydride (C) is preferably 0.05 parts by mass or more, and more preferably 0.8 parts by mass or more with respect to 100 parts by mass of the olefin resin (A). The amount of the acid anhydride (C) to be blended is preferably 10 parts by mass or less, and more preferably 8 parts by mass or less, based on 100 parts by mass of the olefin resin (A). As a result, the adhesiveness between the adhesive and the metal is improved, and it is possible to obtain an adhesive having excellent initial adhesive strength and adhesive strength after heat sealing.
本発明の接着剤が接着性、耐熱性に優れる理由は定かではないが、次のように推測される。本発明で用いる酸無水物(C)は極性基を備え、金属基材への親和性に優れる。また、比較的分子量が小さいために、相対的に移動が容易である。塗工した接着剤が完全に硬化するまでに間に金属基材側に移動し、いわゆるアンカー剤のような役割を果たすことで接着性、耐熱性の向上に寄与していると考えられる。一方、接着剤に含まれる酸無水物(C)の量が多すぎると、酸無水物(C)が金属基材と接着剤との間に擬似的に強度の低い層を形成してしまい、これに起因して接着性が低下すると考えられる。 The reason why the adhesive of the present invention is excellent in adhesiveness and heat resistance is not clear, but it is presumed as follows. The acid anhydride (C) used in the present invention has a polar group and has an excellent affinity for a metal substrate. Moreover, since the molecular weight is relatively small, it is relatively easy to move. It is considered that the applied adhesive moves to the metal base material side before it is completely cured and plays a role like a so-called anchoring agent, thereby contributing to the improvement of adhesiveness and heat resistance. On the other hand, if the amount of the acid anhydride (C) contained in the adhesive is too large, the acid anhydride (C) will form a pseudo-low strength layer between the metal base material and the adhesive. It is considered that the adhesiveness is lowered due to this.
本発明の接着剤は、上記各成分に加え、さらに有機溶剤(D)を配合することにより流動性を確保し、適正な塗工性を発現させることができる。このような有機溶剤としては、接着剤塗工時の乾燥工程における過熱により揮発させて除去できるものであれば特に限定されず、例えば、トルエン、キシレン等の芳香族系有機溶剤;n−ヘキサン、n−ヘプタン等の脂肪族系有機溶剤;シクロヘキサン、メチルシクロヘキサン等の脂環族系有機溶剤;トリクロロエチレン、ジクロロエチレン、クロロベンゼン、クロロホルム等のハロゲン系有機溶剤;メチルエチルケトン、メチルイソブチルケトン、シクロヘキサノンなどのケトン系溶剤;酢酸エチル、酢酸ブチル等のエステル系溶剤;エタノール、メタノール、n−プロパノール、2−プロパノール(イソプロピルアルコール)、ブタノール、ヘキサノール等のアルコール系溶剤;ジイソプロピルエーテル、ブチルセロソルブ、テトラヒドロフラン、ジオキサン、ブチルカルビトール等のエーテル系溶剤;ジエチレングリコールモノメチルエーテル、トリエチレングルコールモノメチルエーテル、プロピレングリコールモノメチルエーテル等のグリコールエーテル系溶剤;エチレングリコールモノメチルエーテルアセテート、プロプレングリコールモノメチルエーテルアセテート、ジエチレングリコールモノエチルエーテルアセテート等のグリコールエステル系溶剤等が挙げられ、これらは単独で使用しても良いし、2種以上を併用しても良い。 The adhesive of the present invention can secure fluidity and exhibit appropriate coatability by further blending an organic solvent (D) in addition to the above components. The organic solvent is not particularly limited as long as it can be volatilized and removed by overheating in the drying step at the time of coating the adhesive, and for example, an aromatic organic solvent such as toluene or xylene; n-hexane, etc. An aliphatic organic solvent such as n-heptane; an alicyclic organic solvent such as cyclohexane and methylcyclohexane; a halogen-based organic solvent such as trichloroethylene, dichloroethylene, chlorobenzene and chloroform; a ketone solvent such as methylethylketone, methylisobutylketone and cyclohexanone. Ester solvents such as ethyl acetate and butyl acetate; Alcohol solvents such as ethanol, methanol, n-propanol, 2-propanol (isopropyl alcohol), butanol, hexanol; diisopropyl ether, butyl cellosolve, tetrahydrofuran, dioxane, butyl carbitol, etc. Ether-based solvent; glycol ether-based solvent such as diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, propylene glycol monomethyl ether; glycol ester-based solvent such as ethylene glycol monomethyl ether acetate, proprene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate Examples thereof include solvents, and these may be used alone or in combination of two or more.
オレフィン樹脂(A)として、非塩素系のオレフィン樹脂、酸基又は酸無水物基を有するオレフィン樹脂や水酸基を有するオレフィン樹脂を用いた場合であってもその溶解性に優れることから、脂環族系有機溶剤と、エステル系溶剤と、アルコール系溶剤の混合溶媒を用いることが好ましい。特に、酸基又は酸無水物基を有するオレフィン樹脂を用いた場合にはその溶解性に優れることからメチルシクロヘキサンと酢酸エチルとイソプロピルアルコールとの混合溶媒を用いることが好ましい。 Even when a non-chlorine olefin resin, an olefin resin having an acid group or an acid anhydride group, or an olefin resin having a hydroxyl group is used as the olefin resin (A), its solubility is excellent. It is preferable to use a mixed solvent of an organic solvent, an ester solvent, and an alcohol solvent. In particular, when an olefin resin having an acid group or an acid anhydride group is used, it is preferable to use a mixed solvent of methylcyclohexane, ethyl acetate and isopropyl alcohol because of its excellent solubility.
有機溶剤の使用量としては、オレフィン樹脂(A)と有機溶剤(D)との合計質量に対する、オレフィン樹脂(A)の割合が10〜30質量%となる割合であることが好ましい。これにより、塗工性、金属フィルムへの濡れ性に優れた接着剤とすることができる。 The amount of the organic solvent used is preferably such that the ratio of the olefin resin (A) to the total mass of the olefin resin (A) and the organic solvent (D) is 10 to 30% by mass. This makes it possible to obtain an adhesive having excellent coatability and wettability to a metal film.
本発明の接着剤は、必要に応じて粘着付与剤、可塑剤、熱可塑性エラストマー、反応性エラストマー、リン酸化合物、シランカップリング剤、接着促進剤等の各種添加剤を用いることができる。これらの添加剤の含有量は、本発明の接着剤の機能を損なわない範囲内で適宜調整すればよい。 As the adhesive of the present invention, various additives such as a tackifier, a plasticizer, a thermoplastic elastomer, a reactive elastomer, a phosphoric acid compound, a silane coupling agent, and an adhesion accelerator can be used, if necessary. The content of these additives may be appropriately adjusted within a range that does not impair the function of the adhesive of the present invention.
ここで使用し得る粘着付与剤としては、例えば、ロジン系又はロジンエステル系粘着付与剤、テルペン系又はテルペンフェノール系粘着付与剤、飽和炭化水素樹脂、クマロン系粘着付与剤、クマロンインデン系粘着付与剤、スチレン樹脂系粘着付与剤、キシレン樹脂系粘着付与剤、フェノール樹脂系粘着付与剤、石油樹脂系粘着付与剤などが挙げられる。これらはそれぞれ単独で用いても良いし、二種類以上を併用しても良い。 Examples of the tackifiers that can be used here include rosin-based or rosin ester-based tackifiers, terpene-based or terpene-phenol-based tackifiers, saturated hydrocarbon resins, kumaron-based tackifiers, and kumaron-inden-based tackifiers. Examples thereof include agents, styrene resin-based tackifiers, xylene resin-based tackifiers, phenol resin-based tackifiers, and petroleum resin-based tackifiers. Each of these may be used alone, or two or more types may be used in combination.
可塑剤としては、ポリイソプレン、ポリブテン、プロセルオイル等が挙げられ、熱可塑性エラストマーとしてはスチレン・ブタジエン共重合物(SBS)、スチレン・ブタジエン共重合の水素添加物(SEBS)、SBBS、スチレン・イソプレン共重合の水素添加物(SEPS)、スチレンブロック共重合体(TPS)、オレフィン系エラストマー(TPO)等が、反応性エラストマーはこれらのエラストマーを酸変性したものが挙げられる。 Examples of the plasticizer include polyisoprene, polybutene, procel oil and the like, and examples of the thermoplastic elastomer include a styrene-butadiene copolymer (SBS), a hydrogenated product of a styrene-butadiene copolymer (SEBS), SBBS, and a styrene-isoprene. Examples thereof include copolymerized hydrogenated products (SEPS), styrene block copolymers (TPS), olefin-based elastomers (TPO), and reactive elastomers obtained by acid-modifying these elastomers.
リン酸化合物としては、例えば次亜リン酸、亜リン酸、オルトリン酸、次リン酸等のリン酸類、例えばメタリン酸、ピロリン酸、トリポリリン酸、ポリリン酸、ウルトラリン酸等の縮合リン酸類、例えばオルトリン酸モノメチル、オルトリン酸モノエチル、オルトリン酸モノプロピル、オルトリン酸モノブチル、オルトリン酸モノ−2−エチルヘキシル、オルトリン酸モノフェニル、亜リン酸モノメチル、亜リン酸モノエチル、亜リン酸モノプロピル、亜リン酸モノブチル、亜リン酸モノ−2−エチルヘキシル、亜リン酸モノフェニル、オルトリン酸ジ−2−エチルヘキシル、オルトリン酸ジフェニル亜リン酸ジメチル、亜リン酸ジエチル、亜リン酸ジプロピル、亜リン酸ジブチル、亜リン酸ジ−2−エチルヘキシル、亜リン酸ジフェニル等のモノ、ジエステル化物、縮合リン酸とアルコール類とからのモノ、ジエステル化物、例えば前記のリン酸類に、例えばエチレンオキシド、プロピレンオキシド等のエポキシ化合物を付加させたもの、例えば脂肪族又は芳香族のジグリシジルエーテルに前記のリン酸類を付加させて得られるエポキシリン酸エステル類等が挙げられる。 Examples of the phosphoric acid compound include phosphoric acids such as hypophosphoric acid, phosphoric acid, orthophosphoric acid and hypophosphoric acid, and condensed phosphoric acids such as metaphosphoric acid, pyrophosphoric acid, tripolyphosphoric acid, polyphosphoric acid and ultraphosphoric acid, for example. Monomethyl orthophosphate, monoethyl orthophosphate, monopropyl orthophosphate, monobutyl orthophosphate, mono-2-ethylhexyl orthophosphate, monophenyl orthophosphate, monomethyl phosphite, monoethyl phosphite, monopropyl phosphite, monobutyl phosphite , Mono-2-ethylhexyl phosphite, monophenyl phosphite, di-2-ethylhexyl orthophosphate, dimethyl diphenyl phosphite, diethyl phosphite, dipropyl phosphite, dibutyl phosphite, phosphite Monos such as di-2-ethylhexyl and diphenyl phosphite, diesterates, monos from condensed phosphoric acid and alcohols, diesterates, for example, the above phosphoric acids are added with epoxy compounds such as ethylene oxide and propylene oxide. Examples thereof include epoxy phosphoric acid esters obtained by adding the above-mentioned phosphoric acids to an aliphatic or aromatic diglycidyl ether.
シランカップリング剤としては例えば、γ−アミノプロピルトリエトキシシラン、γ−アミノプロピルトリメトキシシラン、N−β(アミノエチル)−γ−アミノプロピルトリメトキシシラン、N−β(アミノエチル)−γ−アミノプロピルトリメチルジメトキシシラン、N−フェニル−γ−アミノプロピルトリメトキシシラン等のアミノシラン;β−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−グリシドキシプロピルトリエトキシシラン等のエポキシシラン;ビニルトリス(β−メトキシエトキシ)シラン、ビニルトリエトキシシラン、ビニルトリメトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン等のビニルシラン;ヘキサメチルジシラザン、γ−メルカプトプロピルトリメトキシシラン等を挙げることが出来る。 Examples of the silane coupling agent include γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, N-β (aminoethyl) -γ-aminopropyltrimethoxysilane, and N-β (aminoethyl) -γ-. Aminosilanes such as aminopropyltrimethyldimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane; β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycid Epoxysilanes such as xypropyltriethoxysilane; vinylsilanes such as vinyltris (β-methoxyethoxy) silane, vinyltriethoxysilane, vinyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane; hexamethyldisilazane, γ-mercaptopropyl Examples thereof include trimethoxysilane.
接着促進剤としては、2−メチルイミダゾール、1,2−ジメチルイミダゾール、2−フェニル−4−メチルイミダゾール、2−エチル−4−メチルイミダゾール、1−ベンジル−2−メチルイミダゾール、1−シアノエチル−2−エチル−4−メチルイミダゾール等のイミダゾール系化合物、トリエチルアミン、トリエチレンジアミン、N’−メチル−N−(2−ジメチルアミノエチル)ピペラジン、1,8−ジアザビシクロ[5.4.0]ウンデセン(DBU)、1,5−ジアザビシクロ[4.3.0]−ノネン、6−ジブチルアミノ−1,8−ジアザビシクロ[5.4.0]ウンデセン等の3級アミン類及びこれら3級アミン類をフェノール、オクチル酸、4級化テトラフェニルボレート塩等でアミン塩にした化合物、トリアリルスルホニウムヘキサフルオロアンチモネート、ジアリルヨードニウムヘキサフルオロアンチモネート等のカチオン触媒、トリブチルホスフィン、メチルジフェニルホスフィン、トリフェニルホスフィン、トリス(4−メチルフェニル)ホスフィン、トリス(4−ブチルフェニル)ホスフィン、ジフェニルホスフィン、フェニルホスフィン等の有機ホスフィン化合物などが挙げられる。これらは単独で使用しても良いし、2種以上を併用しても良い。 Adhesion promoters include 2-methylimidazole, 1,2-dimethylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2. Imidazole compounds such as -ethyl-4-methylimidazole, triethylamine, triethylenediamine, N'-methyl-N- (2-dimethylaminoethyl) piperazin, 1,8-diazabicyclo [5.4.0] undecene (DBU) , 1,5-diazabicyclo [4.3.0] -nonen, 6-dibutylamino-1,8-diazabicyclo [5.4.0] Undecene and other tertiary amines and these tertiary amines are phenol and octyl. Compounds made into amine salts with acid, quaternized tetraphenylborate salt, etc., cationic catalysts such as triarylsulfonium hexafluoroantimonate, diallyliodonium hexafluoroantimonate, tributylphosphine, methyldiphenylphosphine, triphenylphosphine, tris (4) Examples thereof include organic phosphine compounds such as −methylphenyl) phosphine, tris (4-butylphenyl) phosphine, diphenylphosphine, and phenylphosphine. These may be used alone or in combination of two or more.
上述した各成分を混合することにより本発明の接着剤を調整することができる。この際、各成分は同時に混合して接着剤としてもよいが、硬化剤(B)以外の成分を予め混合してプレミクスチャーを調整しておき、接着剤の使用時に硬化剤(B)を混合する2液型の接着剤とすることが接着剤の安定性、作業性に優れることから好ましい。 The adhesive of the present invention can be prepared by mixing each of the above-mentioned components. At this time, each component may be mixed at the same time to form an adhesive, but components other than the curing agent (B) may be mixed in advance to adjust the texture, and the curing agent (B) may be mixed when the adhesive is used. It is preferable to use a two-component adhesive because the adhesive is excellent in stability and workability.
本発明の接着剤は、オレフィン樹脂のような非極性の基材と金属基材との接着性、耐熱性に優れる。 The adhesive of the present invention is excellent in adhesiveness and heat resistance between a non-polar base material such as an olefin resin and a metal base material.
<積層体>
本発明の積層体は、第1の基材と、第2の基材と、第1の基材と第2の基材との間に配置され、第1の基材と第2の基材とを貼り合せる接着層とを含む。接着層は、上述した接着剤の硬化塗膜である。第1の基材、第2の基材に加えてさらに他の基材を含んでいてもよい。第1の基材と他の基材、第2の基材と他の基材とを貼り合せる接着層は、本発明の接着剤の硬化塗膜であってもよいし、そうでなくてもよい。
<Laminated body>
The laminate of the present invention is arranged between the first base material, the second base material, the first base material and the second base material, and is arranged between the first base material and the second base material. Includes an adhesive layer to bond with. The adhesive layer is a cured coating film of the above-mentioned adhesive. In addition to the first base material and the second base material, other base materials may be contained. The adhesive layer for bonding the first base material to the other base material and the second base material to the other base material may or may not be a cured coating film of the adhesive of the present invention. Good.
第1の基材、第2の基材、他の基材としては、例えば、紙、オレフィン系樹脂、アクリロニトリル−ブタジエン−スチレン共重合体(ABS樹脂)、ポリ塩化ビニル系樹脂、フッ素系樹脂、ポリ(メタ)アクリル系樹脂、カーボネート系樹脂、ポリアミド系樹脂、ポリイミド系樹脂、ポリフェニレンエーテル系樹脂、ポリフェニレンスルフィド系樹脂やポリエステル系樹脂から得られた合成樹脂フィルム、銅箔、アルミニウム箔の様な金属箔等を用いることが出来る。 Examples of the first base material, the second base material, and other base materials include paper, olefin resin, acrylonitrile-butadiene-styrene copolymer (ABS resin), polyvinyl chloride resin, and fluororesin. Metals such as poly (meth) acrylic resin, carbonate resin, polyamide resin, polyimide resin, polyphenylene ether resin, synthetic resin film obtained from polyphenylene sulfide resin or polyester resin, copper foil, aluminum foil Foil or the like can be used.
本発明の接着剤は、オレフィン樹脂のような非極性の基材と、金属基材との接着性に優れるため、第1の基材と第2の基材のうち一方が非極性の基材であり、他方が金属基材であることが好ましいが、これに限定されない。 Since the adhesive of the present invention has excellent adhesiveness between a non-polar base material such as an olefin resin and a metal base material, one of the first base material and the second base material is a non-polar base material. The other is preferably, but is not limited to, a metal base material.
本発明の積層体は、第1の基材と第2の基材の一方に本発明の接着剤を塗布し、次いで他方を積層し、接着剤を硬化させて得られる。接着剤を塗布した後、第1の基材と第2の基材とを積層するまでの間に乾燥工程を設けることが好ましい。
接着剤の塗工方式としては、グラビアコーター方式、マイクログラビアコーター方式、リバースコーター方式、バーコーター方式、ロールコーター方式、ダイコーター方式等を用いることが出来る。接着剤の塗布量は、乾燥後の塗布重量が0.5〜20.0g/m2となるよう調整することが好ましい。0.5g/m2を下回ると連続均一塗布性が低下し易くなり、20.0g/m2を上回ると塗布後における溶剤離脱性も低下し、作業性の低下や残留溶剤の問題が生じ易くなる。
The laminate of the present invention is obtained by applying the adhesive of the present invention to one of the first base material and the second base material, then laminating the other, and curing the adhesive. It is preferable to provide a drying step between the application of the adhesive and the laminating of the first base material and the second base material.
As the adhesive coating method, a gravure coater method, a microgravure coater method, a reverse coater method, a bar coater method, a roll coater method, a die coater method and the like can be used. The amount of the adhesive applied is preferably adjusted so that the applied weight after drying is 0.5 to 20.0 g / m 2 . If it is less than 0.5 g / m 2 , the continuous uniform coating property is likely to be lowered, and if it is more than 20.0 g / m 2 , the solvent releasability after coating is also lowered, and problems of workability and residual solvent are likely to occur. Become.
第1の基材と第2の基材とを積層する際のラミネートロールの温度は25〜120℃、圧力は3〜300kg/cm2であることが好ましい。
第1の基材と第2の基材とを貼り合せた後、エージング工程を設けることが好ましい。エージング条件は、25〜100℃、12〜240時間であることが好ましい。
The temperature of the laminating roll when laminating the first base material and the second base material is preferably 25 to 120 ° C., and the pressure is preferably 3 to 300 kg / cm 2 .
It is preferable to provide an aging step after laminating the first base material and the second base material. The aging conditions are preferably 25 to 100 ° C. and 12 to 240 hours.
<電池用包装材>
本発明の電池用包装材は、一例として、第1の基材と、第2の基材と、第3の基材と、第1の基材と第2の基材を貼り合せる第1の接着層と、第2の基材と第3の基材とを貼り合せる第2の接着層とを含む。第1の基材はポリオレフィンフィルムであり、第2の基材は金属箔である。第3の基材はナイロン、ポリエステル等の樹脂フィルムである。第1の接着層は本発明の接着剤の硬化塗膜である。第2の接着層は本発明の接着剤の硬化塗膜であってもよいし、そうでなくてもよい。第3の基材の第2の接着層が設けられるのとは反対側に、さらに接着層を介して、または介さずに他の基材を配置してもよいし、コーティング層を設けてもよい。他の基材やコーティング層を設けなくてもよい。
<Battery packaging material>
As an example, the packaging material for a battery of the present invention has a first base material, a second base material, a third base material, a first base material, and a second base material bonded together. It includes an adhesive layer and a second adhesive layer for bonding the second base material and the third base material. The first base material is a polyolefin film, and the second base material is a metal foil. The third base material is a resin film such as nylon or polyester. The first adhesive layer is a cured coating film of the adhesive of the present invention. The second adhesive layer may or may not be a cured coating of the adhesive of the present invention. Another substrate may be placed on the opposite side of the third substrate from which the second adhesive layer is provided, with or without an adhesive layer, or a coating layer may be provided. Good. It is not necessary to provide another base material or coating layer.
ポリオレフィンフィルムとしては、従来から公知のオレフィン樹脂の中から適宜選択すればよい。例えば、特に限定されないが、ポリエチレン、ポリプロピレン、エチレンプロピレン共重合体などを用いることができる。無延伸フィルムであることが好ましい。ポリオレフィンフィルムの膜厚は、特に限定されないが、10μm以上であることが好ましく、20μm以上であることがより好ましく、25μm以上であることがさらに好ましい。また、100μm以下であることが好ましく、95μm以下であることがより好ましく、90μm以下であることがさらに好ましい。
第1の基材は、後述する電池を製造する際に、本発明の電池用包装材同士をヒートシールして貼り合せる際のシーラント層として機能する。
The polyolefin film may be appropriately selected from conventionally known olefin resins. For example, although not particularly limited, polyethylene, polypropylene, ethylene propylene copolymer and the like can be used. It is preferably a non-stretched film. The film thickness of the polyolefin film is not particularly limited, but is preferably 10 μm or more, more preferably 20 μm or more, and further preferably 25 μm or more. Further, it is preferably 100 μm or less, more preferably 95 μm or less, and further preferably 90 μm or less.
The first base material functions as a sealant layer when the battery packaging materials of the present invention are heat-sealed and bonded to each other when the battery described later is manufactured.
金属箔としては、アルミニウム、銅、ニッケル等が挙げられる。これらの金属箔は、サンドブラスト処理、研磨処理、脱脂処理、エッチング処理、防錆剤浸漬又はスプレーによる表面処理、3価クロム化成処理、リン酸塩化成処理、硫化物化成処理、陽極酸化被膜形成、フッ素樹脂コーティング等の表面処理を施したものであってもよい。これらのなかでも3価クロム化成処理を施したものが密着性保持性能(耐環境劣化性)、防食性に優れる点から好ましい。また、この金属フィルムの厚みは腐食防止の観点から10〜100μmの範囲であることが好ましい。 Examples of the metal foil include aluminum, copper, nickel and the like. These metal foils are sandblasted, polished, degreased, etched, surface-treated by rust preventive immersion or spraying, trivalent chromium chemical conversion treatment, phosphate chemical conversion treatment, sulfide chemical conversion treatment, anodic oxide film formation, etc. It may be surface-treated such as a fluororesin coating. Among these, those subjected to trivalent chromium chemical conversion treatment are preferable because they are excellent in adhesion retention performance (environmental deterioration resistance) and corrosion resistance. Further, the thickness of this metal film is preferably in the range of 10 to 100 μm from the viewpoint of corrosion prevention.
第3の基材として用いることができる樹脂フィルムとしては、ポリエステル樹脂、ポリアミド樹脂、エポキシ樹脂、アクリル樹脂、フッ素樹脂、ポリウレタン樹脂、珪素樹脂、フェノール樹脂、及びこれらの混合物や共重合物等の樹脂フィルムが挙げられる。これらの中でも、好ましくはポリエステル樹脂、ポリアミド樹脂が挙げられ、より好ましくは2軸延伸ポリエステル樹脂、2軸延伸ポリアミド樹脂が挙げられる。ポリエステル樹脂としては、具体的には、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート、ポリブチレンナフタレート、共重合ポリエステル、ポリカーボネート等が挙げられる。また、ポリアミド樹脂としては、具体的には、ナイロン6、ナイロン6,6、ナイロン6とナイロン6,6との共重合体、ナイロン6,10、ポリメタキシリレンアジパミド(MXD6)等が挙げられる。 Examples of the resin film that can be used as the third base material include polyester resin, polyamide resin, epoxy resin, acrylic resin, fluororesin, polyurethane resin, silicon resin, phenol resin, and resins such as mixtures and copolymers thereof. The film is mentioned. Among these, polyester resin and polyamide resin are preferable, and biaxially stretched polyester resin and biaxially stretched polyamide resin are more preferable. Specific examples of the polyester resin include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polybutylene naphthalate, copolymerized polyester, and polycarbonate. Specific examples of the polyamide resin include nylon 6, nylon 6, 6, a copolymer of nylon 6 and nylon 6, 6, nylon 6, 10, and polymethoxylylen adipamide (MXD6). Be done.
コーティング層は、例えばポリ塩化ビニリデン、ポリエステル樹脂、ウレタン樹脂、アクリル樹脂、エポキシ樹脂などにより形成することができる。2液硬化型樹脂により形成することが好ましい。コーティング層を形成する2液硬化型樹脂としては、例えば、2液硬化型ウレタン樹脂、2液硬化型ポリエステル樹脂、2液硬化型エポキシ樹脂などが挙げられる。また、コーティング層には、マット化剤を配合してもよい。 The coating layer can be formed of, for example, polyvinylidene chloride, polyester resin, urethane resin, acrylic resin, epoxy resin, or the like. It is preferably formed of a two-component curable resin. Examples of the two-component curable resin forming the coating layer include a two-component curable urethane resin, a two-component curable polyester resin, and a two-component curable epoxy resin. Moreover, you may mix the matting agent in the coating layer.
マット化剤としては、例えば、粒径が0.5nm〜5μm程度の微粒子が挙げられる。マット化剤の材質については、特に制限されないが、例えば、金属、金属酸化物、無機物、有機物等が挙げられる。また、マット化剤の形状についても、特に制限されないが、例えば、球状、繊維状、板状、不定形、バルーン状等が挙げられる。マット化剤として、具体的には、タルク,シリカ,グラファイト、カオリン、モンモリロイド、モンモリロナイト、合成マイカ、ハイドロタルサイト、シリカゲル、ゼオライト、水酸化アルミニウム、水酸化マグネシウム、酸化亜鉛,酸化マグネシウム,酸化アルミニウム,酸化ネオジウム,酸化アンチモン、酸化チタン、酸化セリウム、硫酸カルシウム,硫酸バリウム、炭酸カルシウム,ケイ酸カルシウム、炭酸リチウム、安息香酸カルシウム,シュウ酸カルシウム,ステアリン酸マグネシウム、カーボンブラック、カーボンナノチューブ類、高融点ナイロン、架橋アクリル、架橋スチレン、架橋ポリエチレン、ベンゾグアナミン、金、アルミニウム、銅、ニッケル等が挙げられる。これらのマット化剤は、1種単独で使用してもよく、また2種以上を組み合わせて使用してもよい。これらのマット化剤の中でも、分散安定性やコスト等の観点から、好ましくはりシリカ、硫酸バリウム、酸化チタンが挙げられる。また、マット化剤には、表面に絶縁処理、高分散性処理等の各種表面処理を施しておいてもよい。 Examples of the matting agent include fine particles having a particle size of about 0.5 nm to 5 μm. The material of the matting agent is not particularly limited, and examples thereof include metals, metal oxides, inorganic substances, and organic substances. The shape of the matting agent is also not particularly limited, and examples thereof include a spherical shape, a fibrous shape, a plate shape, an amorphous shape, and a balloon shape. Specific examples of the matting agent include talc, silica, graphite, kaolin, montmoriloid, montmorillonite, synthetic mica, hydrotalcite, silica gel, zeolite, aluminum hydroxide, magnesium hydroxide, zinc oxide, magnesium oxide, and aluminum oxide. , Neodium oxide, Antimon oxide, Titanium oxide, Serium oxide, Calcium sulfate, Barium sulfate, Calcium carbonate, Calcium silicate, Lithium carbonate, Calcium benzoate, Calcium silicate, Magnesium stearate, Carbon black, Carbon nanotubes, High melting point Examples thereof include nylon, crosslinked acrylic, crosslinked styrene, crosslinked polyethylene, benzoguanamine, gold, aluminum, copper and nickel. These matting agents may be used alone or in combination of two or more. Among these matting agents, preferably silica, barium sulfate, and titanium oxide are mentioned from the viewpoint of dispersion stability and cost. Further, the matting agent may be subjected to various surface treatments such as an insulating treatment and a highly dispersible treatment on the surface.
このような積層体を、電池とした際に第1の基材であるポリオレフィンフィルムが第3の基材よりも内側になるようにして成型し、本発明の二次電池外装材となる。成型方法としては、特に制限はなく、一例として以下のような方法が挙げられる。 Such a laminate is molded so that the polyolefin film, which is the first base material, is inside the third base material when it is used as a battery, and becomes the secondary battery exterior material of the present invention. The molding method is not particularly limited, and examples thereof include the following methods.
・加熱圧空成型法:電池用包装材を高温、高圧のエアーが供給される孔を有する下型と、ポケット形状の凹部を有する上型に挟み、加熱軟化させながらエアーを供給して凹部を形成する方法。
・プレヒーター平板式圧空成型法:電池用包装材を加熱軟化させた後、高圧のエアーが供給される孔を有する下型と、ポケット形状の凹部を有する上型に挟み、エアーを供給して凹部を形成する方法。
・ドラム式真空成型法:電池用包装材を加熱ドラムで部分的に加熱軟化後、ポケット形状の凹部を有するドラムの該凹部を真空引きして凹部を成型する方法。
・ピン成型法:底材シートを加熱軟化後ポケット形状の凹凸金型で圧着する方法。
・プレヒータープラグアシスト圧空成型法:電池用包装材を加熱軟化させた後、高圧のエアーが供給される孔を有する下型と、ポケット形状の凹部を有する上型に挟み、エアーを供給して凹部を形成する方法であって、成型の際に、凸形状のプラグを上昇及び降下をさせて成型を補助する方法。
-Heat-compressed air molding method: The packaging material for batteries is sandwiched between a lower mold with holes for supplying high-temperature and high-pressure air and an upper mold with pocket-shaped recesses, and air is supplied while being heated and softened to form recesses. how to.
-Preheater flat plate type compressed air molding method: After heating and softening the packaging material for batteries, air is supplied by sandwiching it between a lower mold with holes for supplying high-pressure air and an upper mold with pocket-shaped recesses. A method of forming a recess.
-Drum type vacuum forming method: A method in which a battery packaging material is partially heated and softened with a heating drum, and then the concave portion of a drum having a pocket-shaped concave portion is evacuated to form the concave portion.
-Pin molding method: A method in which the bottom material sheet is heat-softened and then crimped with a pocket-shaped uneven mold.
-Preheater plug assist compressed air molding method: After heating and softening the packaging material for batteries, air is supplied by sandwiching it between a lower mold with holes for supplying high-pressure air and an upper mold with pocket-shaped recesses. A method of forming a concave portion, which assists molding by raising and lowering a convex plug at the time of molding.
成型後の底材の肉厚が均一であることから、加熱真空成型法であるプレヒータープラグアシスト圧空成型法が好ましい。
このようにして得られた本発明の電池用包装材は、正極、負極、電解質等の電池素子を密封して収容する電池用容器として好適に使用することができる。
Since the wall thickness of the bottom material after molding is uniform, the preheater plug assist compressed air molding method, which is a heating vacuum forming method, is preferable.
The battery packaging material of the present invention thus obtained can be suitably used as a battery container for sealing and accommodating battery elements such as a positive electrode, a negative electrode, and an electrolyte.
<電池>
本発明の電池は、正極、負極、及び電解質を備えた電池素子を、本発明の電池用包装材で、前記正極及び負極の各々に接続された金属端子が外側に突出させた状態で、電池素子の周縁にフランジ部(シーラント層同士が接触する領域)が形成できるようにして被覆し、前記フランジ部のシーラント層同士をヒートシールして密封させることによって得られる。
<Battery>
The battery of the present invention is a battery in which a battery element provided with a positive electrode, a negative electrode, and an electrolyte is projected outward with metal terminals connected to each of the positive electrode and the negative electrode in the battery packaging material of the present invention. It is obtained by covering the peripheral edge of the element so that a flange portion (a region where the sealant layers come into contact with each other) can be formed, and heat-sealing the sealant layers of the flange portion with each other.
本発明の電池用包装材を用いて得られる電池としては、一次電池、二次電池のいずれであってもよいが、好ましくは二次電池である。二次電池としては特に制限されず、例えば、リチウムイオン電池、リチウムイオンポリマー電池、鉛蓄電池、ニッケル・水素蓄電池、ニッケル・カドミウム蓄電池、ニッケル・鉄蓄電池、ニッケル・亜鉛蓄電池、酸化銀・亜鉛蓄電池、金属空気電池、多価カチオン電池、コンデンサー、キャパシター等が挙げられる。これらの二次電池の中でも、本発明の電池用包装材の好適な適用対象として、リチウムイオン電池及びリチウムイオンポリマー電池が挙げられる。 The battery obtained by using the battery packaging material of the present invention may be either a primary battery or a secondary battery, but is preferably a secondary battery. The secondary battery is not particularly limited, and for example, a lithium ion battery, a lithium ion polymer battery, a lead storage battery, a nickel / hydrogen storage battery, a nickel / cadmium storage battery, a nickel / iron storage battery, a nickel / zinc storage battery, a silver oxide / zinc storage battery, etc. Examples thereof include metal air batteries, multivalent cation batteries, capacitors, and capacitors. Among these secondary batteries, lithium ion batteries and lithium ion polymer batteries can be mentioned as suitable application targets of the battery packaging material of the present invention.
以下、実施例と比較例により本発明を説明するが、本発明はこれに限定されるものではない。配合組成その他の数値は特記しない限り質量基準である。 Hereinafter, the present invention will be described with reference to Examples and Comparative Examples, but the present invention is not limited thereto. The composition and other values are based on mass unless otherwise specified.
(実施例1)
オレフィン樹脂(A)としてトーヨタックPMA−Lを100部、トリフェニルホスフィンを0.05部、FTR−8120を1.0部、酸無水物(C)としてEPICLON B−570−Hを0.1部、を混合溶媒(シクロメチルヘキサン/酢酸エチル/イソプロピルアルコール=71/8/1)に溶解させ、不揮発分20%にした。次いでエポキシ化合物を含む硬化剤(B)としてデナコールEX-321を2.0部加え、よく攪拌して実施例1の接着剤を調製した。
(Example 1)
100 parts of Toyotac PMA-L as olefin resin (A), 0.05 parts of triphenylphosphine, 1.0 part of FTR-8120, 0.1 part of EPICLON B-570-H as acid anhydride (C) , Was dissolved in a mixed solvent (cyclomethylhexane / ethyl acetate / isopropyl alcohol = 71/8/1) to give a non-volatile content of 20%. Next, 2.0 parts of Denacol EX-321 was added as a curing agent (B) containing an epoxy compound, and the mixture was well stirred to prepare the adhesive of Example 1.
調製した接着剤をアルミニウム箔(東洋アルミニウム社製アルミニウム箔「1N30H」:膜厚30μm)の光沢面にバーコーターで塗布量2g/m2(dry)で塗布し、80℃−1分間乾燥させた後、未延伸ポリオレフィンフィルム(オカモト株式会社製「ET−20」膜厚:40μm)と100℃で貼り合せた。次にアルミニウム箔のマット面に「ディックドライ LX−906」(DIC株式会社製)を主剤とし、「KW−75」(DIC株式会社製)を硬化剤として、重量比が主剤/硬化剤=100/10となるように配合した接着剤をバーコーターで塗布量4g/m2(dry)で塗布した後、厚さ25μmの延伸ポリアミドフィルムを積層した。その後80℃2日間の養生(エージング)を行い、ラミネート物を得た。 The prepared adhesive was applied to the glossy surface of an aluminum foil (aluminum foil "1N30H" manufactured by Toyo Aluminum Co., Ltd .: film thickness 30 μm) with a bar coater at a coating amount of 2 g / m 2 (dry), and dried at 80 ° C. for 1 minute. After that, it was bonded to an unstretched polyolefin film (“ET-20” film thickness manufactured by Okamoto Co., Ltd .: 40 μm) at 100 ° C. Next, on the matte surface of the aluminum foil, "Dick Dry LX-906" (manufactured by DIC Corporation) is used as the main agent, and "KW-75" (manufactured by DIC Corporation) is used as the curing agent, and the weight ratio is the main agent / curing agent = 100. The adhesive blended so as to be 1/10 was applied with a bar coater at a coating amount of 4 g / m 2 (dry), and then a stretched polyamide film having a thickness of 25 μm was laminated. Then, it was cured (aged) at 80 ° C. for 2 days to obtain a laminate.
(実施例2〜10)
アルミニウム箔と未延伸ポリオレフィンフィルムの貼り合せに用いる接着剤の配合を表1、2に記載の配合に変更した以外は実施例1と同様にして接着剤を調整し、ラミネート物を得た。
(Examples 2 to 10)
The adhesive was adjusted in the same manner as in Example 1 except that the composition of the adhesive used for laminating the aluminum foil and the unstretched polyolefin film was changed to the composition shown in Tables 1 and 2, to obtain a laminate.
(比較例1〜5)
アルミニウム箔と未延伸ポリオレフィンフィルムの貼り合せに用いる接着剤の配合を表3に記載の配合に変更した以外は実施例1と同様にして接着剤を調整し、ラミネート物を得た。
(Comparative Examples 1 to 5)
The adhesive was adjusted in the same manner as in Example 1 except that the composition of the adhesive used for laminating the aluminum foil and the unstretched polyolefin film was changed to the composition shown in Table 3, to obtain a laminate.
なお、実施例、比較例で用いた化合物の詳細は以下の通りである。
トーヨータックPMA−L:無水マレイン酸変性オレフィン樹脂、酸価:35mgKOH/g、融点:70℃、東洋紡社製
トーヨータックPMA−KE:無水マレイン酸変性オレフィン樹脂、酸価:44mgKOH/g、融点:80℃、東洋紡社製
FTR8120:スチレン樹脂、三井化学社製
EPICRON B−570−H:メチルテトラヒドロフタル酸無水物、DIC社製
YH−306:トリアルキルテトラヒドロ無水フタル酸、三菱化学社製
デコナール EX−321:トリメチロールプロパンポリグリシジルエーテル型エポキシ樹脂、ナガセケムテックス社製
EPICLON 860:ビスフェノールA型エポキシ樹脂、DIC社製
EPICLON N−665:クレゾールノボラック型エポキシ樹脂、DIC社製
The details of the compounds used in Examples and Comparative Examples are as follows.
Toyo Tuck PMA-L: Maleic anhydride-modified olefin resin, acid value: 35 mgKOH / g, melting point: 70 ° C., Toyo Tuck PMA-KE: maleic anhydride modified olefin resin, acid value: 44 mgKOH / g, melting point: 80 ° C, FTR8120 manufactured by Toyo Boseki, styrene resin, EPICRON B-570-H manufactured by Mitsui Chemicals, methyltetrahydrophthalic anhydride, YH-306 manufactured by DIC: trialkyltetrahydrophthalic anhydride, Deconal EX-produced by Mitsubishi Chemicals. 3211: Trimethylol propanepolyglycidyl ether type epoxy resin, Nagase ChemteX EPICLON 860: Bisphenol A type epoxy resin, DIC EPICLON N-665: Cresol novolac type epoxy resin, DIC
なおオレフィン樹脂の酸価は、FT−IR(日本分光社製、FT−IR4200)を使用し、無水マレイン酸のクロロホルム溶液によって作成した検量線から得られる係数(f)、無水マレイン酸変性ポリオレフィン溶液における無水マレイン酸の無水環の伸縮ピーク(1780cm-1)の吸光度(I)とマレイン酸のカルボニル基の伸縮ピーク(1720cm-1)の吸光度(II)を用いて下記式により算出した値である。下記式において無水マレイン酸の分子量を98.06、水酸化カリウムの分子量は56.11とした。 The acid value of the olefin resin is a coefficient (f) obtained from a calibration curve prepared by using FT-IR (FT-IR4200 manufactured by Nippon Kogaku Co., Ltd.) and a chloroform solution of maleic anhydride, and a maleic anhydride-modified polyolefin solution. It is a value calculated by the following formula using the absorbance (I) of the expansion and contraction peak (1780 cm -1 ) of the anhydrous ring of maleic anhydride and the absorbance (II) of the expansion and contraction peak (1720 cm -1 ) of the carbonyl group of maleic anhydride. .. In the following formula, the molecular weight of maleic anhydride was 98.06, and the molecular weight of potassium hydroxide was 56.11.
(初期接着強度の測定)
株式会社島津製作所の「オートグラフAGS−J」を使用し、前記ラミネート物のアルミニウム箔と未延伸ポリオレフィンフィルムの界面の接着強度を剥離速度50mm/min、剥離幅15mm、剥離形態T型の条件で評価した。
(Measurement of initial adhesive strength)
Using "Autograph AGS-J" manufactured by Shimadzu Corporation, the adhesive strength at the interface between the aluminum foil of the laminate and the unstretched polyolefin film is set under the conditions of a peeling speed of 50 mm / min, a peeling width of 15 mm, and a peeling form of T type. evaluated.
(耐熱性)
ヒートシール後のラミネート物の接着強度を測定しようとしても、ポリオレフィンフィルムが破損し、ポリオレフィンフィルムとアルミニウム箔との間ではなく、ヒートシールされたポリオレフィンフィルム同士の間で剥離していく場合がある。ヒートシール前後での接着強度の比較による耐熱性の評価は必ずしも正確ではない。このため、耐熱性については以下のようにして評価した。
(Heat-resistant)
Even if an attempt is made to measure the adhesive strength of the laminate after heat sealing, the polyolefin film may be damaged and peeled off not between the polyolefin film and the aluminum foil but between the heat-sealed polyolefin films. The evaluation of heat resistance by comparing the adhesive strength before and after heat sealing is not always accurate. Therefore, the heat resistance was evaluated as follows.
前記ラミネート物の未延伸ポリオレフィンフィルム側を谷折りし、未延伸ポリオレフィンフィルム側同士を190℃3秒の条件でヒートシールバーを当てた。次いで株式会社島津製作所の「オートグラフAGS−J」を使用し、剥離速度500mm/min、剥離幅15mm、剥離形態T型の条件で1cm剥離させたときの界面を評価した。
◎:未延伸ポリオレフィンフィルム/未延伸ポリオレフィンフィルム間の剥離が90%以上(実用上特に優れる)
○:未延伸ポリオレフィンフィルム/未延伸ポリオレフィンフィルム間の剥離が60%以上90%未満(実用上優れる)
△:未延伸ポリオレフィンフィルム/未延伸ポリオレフィンフィルム間の剥離が50%以上60%未満(実用域)
×:未延伸ポリオレフィンフィルム/未延伸ポリオレフィンフィルム間の剥離が50%未満
The unstretched polyolefin film side of the laminate was valley-folded, and the unstretched polyolefin film sides were subjected to a heat seal bar at 190 ° C. for 3 seconds. Next, using "Autograph AGS-J" manufactured by Shimadzu Corporation, the interface when peeled by 1 cm under the conditions of a peeling speed of 500 mm / min, a peeling width of 15 mm, and a peeling form T type was evaluated.
⊚: Peeling between unstretched polyolefin film / unstretched polyolefin film is 90% or more (particularly excellent in practical use).
◯: Peeling between the unstretched polyolefin film / unstretched polyolefin film is 60% or more and less than 90% (excellent in practical use).
Δ: Peeling between the unstretched polyolefin film / unstretched polyolefin film is 50% or more and less than 60% (practical range)
X: Detachment between unstretched polyolefin film / unstretched polyolefin film is less than 50%
表1〜表3から明らかなように、本発明の接着剤は比較例の接着剤よりも耐熱性に優れる。 As is clear from Tables 1 to 3, the adhesive of the present invention is superior in heat resistance to the adhesive of the comparative example.
本発明の接着剤はオレフィン樹脂のような非極性の基材と金属基材との接着性、耐熱性に優れ、本発明の接着剤を用いて得られる積層体は、例えば電池用包装材に好適に用いることができる。また本発明の接着剤の用途としては電池用包装材やそのための積層体に限定されず、家電外板、家具用素材、建築内装用部材など非極性の基材と金属基材との接着性が必要とされる分野に広く利用可能である。 The adhesive of the present invention is excellent in adhesiveness and heat resistance between a non-polar base material such as an olefin resin and a metal base material, and the laminate obtained by using the adhesive of the present invention can be used as a packaging material for batteries, for example. It can be preferably used. Further, the use of the adhesive of the present invention is not limited to the packaging material for batteries and the laminate for that purpose, and the adhesiveness between a non-polar base material such as a home appliance outer panel, a furniture material, and a building interior member and a metal base material. Is widely available in fields where
Claims (9)
樹脂フィルムと、
前記ポリオレフィンフィルムと前記樹脂フィルムとの間に配置された金属箔と、
前記ポリオレフィンフィルムと前記金属箔との間に配置された接着層と、を含み、
前記接着層が請求項1乃至4のいずれか一項に記載の接着剤の硬化塗膜であることを特徴とする電池用包装材。 Polyolefin film and
With resin film
A metal foil arranged between the polyolefin film and the resin film,
Includes an adhesive layer disposed between the polyolefin film and the metal foil.
A packaging material for a battery, wherein the adhesive layer is a cured coating film of the adhesive according to any one of claims 1 to 4 .
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
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JP2017249400 | 2017-12-26 |
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JP7254670B2 (en) * | 2019-09-26 | 2023-04-10 | 東洋紡株式会社 | laminate |
EP4067451A1 (en) * | 2019-11-27 | 2022-10-05 | Toyobo Co., Ltd. | Polyolefin-based adhesive composition |
JP6777255B1 (en) * | 2019-12-27 | 2020-10-28 | 東洋インキScホールディングス株式会社 | Primer for solar cell module forming sheet, solar cell module forming sheet, and solar cell module |
CN114262579B (en) * | 2021-12-30 | 2023-11-24 | 江苏睿捷新材料科技有限公司 | Metal composite film and application thereof |
CN115074056B (en) * | 2022-06-29 | 2023-03-21 | 惠州市广麟材耀科技有限公司 | Aluminum-plastic film inner layer adhesive for lithium battery packaging and preparation method thereof |
WO2024053576A1 (en) * | 2022-09-08 | 2024-03-14 | 三井化学株式会社 | Adhesive composition, laminate, packaging material, and packaging material for battery cases |
CN116001384A (en) * | 2022-12-13 | 2023-04-25 | 江苏睿捷新材料科技有限公司 | Metal composite film with excellent heat resistance, moisture barrier and insulating properties |
CN117050235B (en) * | 2023-08-16 | 2024-02-06 | 达高工业技术研究院(广州)有限公司 | Adhesive resin, preparation method thereof, composite adhesive and application thereof |
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JP2006036832A (en) * | 2004-07-23 | 2006-02-09 | Fujikura Ltd | Nonhalogen flame-retardant adhesive composition, copper-clad laminate for flexible printed wiring board, flexible printed board and coverlay film for flexible printed wiring board using the same |
JP2009051100A (en) * | 2007-08-27 | 2009-03-12 | Showa Highpolymer Co Ltd | Laminated body and production method therefor |
TWI511351B (en) * | 2010-10-14 | 2015-12-01 | Toppan Printing Co Ltd | Lithium-ion battery exterior materials |
JP5664836B2 (en) * | 2012-09-25 | 2015-02-04 | Dic株式会社 | Laminate adhesive, laminate using the same, and secondary battery |
JP6672587B2 (en) * | 2013-12-27 | 2020-03-25 | 凸版印刷株式会社 | Exterior materials for lithium batteries |
JP5700166B1 (en) * | 2014-08-01 | 2015-04-15 | 東洋インキScホールディングス株式会社 | Adhesive composition, laminate, storage device packaging, storage device container, and storage device |
KR20160047468A (en) * | 2014-09-17 | 2016-05-02 | 디아이씨 가부시끼가이샤 | Adhesive for the laminating, the laminate using it and rechargeable battery |
JP5900680B1 (en) * | 2015-03-25 | 2016-04-06 | 東洋インキScホールディングス株式会社 | Adhesive composition, laminate, storage device packaging, storage device container, and storage device |
JP6660688B2 (en) * | 2015-08-06 | 2020-03-11 | 藤森工業株式会社 | Adhesive laminate, method for producing adhesive laminate, and laminate |
US20180248156A1 (en) * | 2015-08-28 | 2018-08-30 | Dic Corporation | Laminating adhesive, multilayer film, and secondary battery produced by using the same |
CN106893525A (en) * | 2015-12-21 | 2017-06-27 | 上海邦中新材料有限公司 | One kind is for steel pipe corrosion-proof adhering resin and preparation method thereof |
JP6083493B1 (en) * | 2016-05-10 | 2017-02-22 | Dic株式会社 | Laminate adhesive, laminate using the same, and secondary battery |
JP6278167B1 (en) * | 2016-08-10 | 2018-02-14 | 東洋紡株式会社 | Polyolefin adhesive composition |
JP6553312B2 (en) * | 2017-01-10 | 2019-07-31 | 住友精化株式会社 | Epoxy resin composition |
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