JP6825170B2 - Coating particles, conductive materials containing them, and methods for producing coating particles - Google Patents

Coating particles, conductive materials containing them, and methods for producing coating particles Download PDF

Info

Publication number
JP6825170B2
JP6825170B2 JP2020556006A JP2020556006A JP6825170B2 JP 6825170 B2 JP6825170 B2 JP 6825170B2 JP 2020556006 A JP2020556006 A JP 2020556006A JP 2020556006 A JP2020556006 A JP 2020556006A JP 6825170 B2 JP6825170 B2 JP 6825170B2
Authority
JP
Japan
Prior art keywords
particles
group
fine particles
insulating fine
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020556006A
Other languages
Japanese (ja)
Other versions
JPWO2020095796A1 (en
Inventor
裕之 稲葉
裕之 稲葉
智真 成橋
智真 成橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemical Industrial Co Ltd
Original Assignee
Nippon Chemical Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemical Industrial Co Ltd filed Critical Nippon Chemical Industrial Co Ltd
Application granted granted Critical
Publication of JP6825170B2 publication Critical patent/JP6825170B2/en
Publication of JPWO2020095796A1 publication Critical patent/JPWO2020095796A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • C23C18/1639Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641Organic substrates, e.g. resin, plastic
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1689After-treatment
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48After-treatment of electroplated surfaces
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • C25D5/56Electroplating of non-metallic surfaces of plastics

Description

本発明は、導電性粒子が絶縁層で被覆された被覆粒子に関する。 The present invention relates to coated particles in which conductive particles are coated with an insulating layer.

樹脂粒子の表面にニッケルや金などの金属皮膜を形成させた導電性粒子は、導電性接着剤、異方性導電膜、異方性導電接着剤等の導電性材料として使用されている。
近年、電子機器類の一層の小型化に伴い、電子回路の回路幅やピッチはますます小さくなっている。それに伴い、上述の導電性接着剤、異方性導電膜、異方性導電接着剤等に用いられる導電性粒子として、その粒径が小さなものが求められている。このような小さな粒径の導電性粒子を使用した場合、その接続性を高めるためには導電性材料中の導電性粒子の配合量を増加させなければならない。しかしながら、導電性粒子の配合量を増加させると、意図しない方向への導通、すなわち対向電極間とは異なる方向への導通により短絡が生じてしまい、該方向における絶縁性が得難いことが問題となっている。
The conductive particles in which a metal film such as nickel or gold is formed on the surface of the resin particles are used as a conductive material such as a conductive adhesive, an anisotropic conductive film, and an anisotropic conductive adhesive.
In recent years, with the further miniaturization of electronic devices, the circuit width and pitch of electronic circuits have become smaller and smaller. Along with this, as the conductive particles used in the above-mentioned conductive adhesive, anisotropic conductive film, anisotropic conductive adhesive and the like, those having a small particle size are required. When conductive particles having such a small particle size are used, the amount of the conductive particles blended in the conductive material must be increased in order to improve the connectivity. However, when the blending amount of the conductive particles is increased, a short circuit occurs due to conduction in an unintended direction, that is, conduction in a direction different from that between the counter electrodes, and it is difficult to obtain insulation in that direction. ing.

前記の問題を解決するために、導電性粒子の表面を、金属皮膜に対して親和性を有する官能基を有する絶縁性の物質で被覆して、導電性粒子の金属皮膜同士の接触を防止した絶縁層被覆導電性粒子が使用されている。このような導電性粒子において、その金属表面を絶縁性物質で被覆する前に、予め有機処理剤で表面処理する技術が知られている。 In order to solve the above-mentioned problems, the surface of the conductive particles was coated with an insulating substance having a functional group having an affinity for the metal film to prevent the metal films of the conductive particles from coming into contact with each other. Insulating layer coated conductive particles are used. There is known a technique of surface-treating such conductive particles with an organic treatment agent before coating the metal surface with an insulating substance.

例えば、特許文献1には、導電性粒子の金属表面を防錆剤で処理し、処理後の導電性粒子に、水酸基を有する絶縁性粒子を付着させることが記載されている。
また特許文献2には、導電性粒子の金属表面をトリアゾール化合物で処理し、処理後の導電性粒子に、アンモニウム基を有する絶縁性粒子を付着させることが記載されている。
For example, Patent Document 1 describes that the metal surface of conductive particles is treated with a rust preventive agent, and insulating particles having a hydroxyl group are attached to the treated conductive particles.
Further, Patent Document 2 describes that the metal surface of the conductive particles is treated with a triazole compound, and the insulating particles having an ammonium group are attached to the treated conductive particles.

特開2014−29857号公報Japanese Unexamined Patent Publication No. 2014-29857 国際公開第2016/063941号パンフレットInternational Publication No. 2016/063941 Pamphlet

絶縁性粒子に被覆された導電性粒子では、絶縁性粒子と導電性粒子との密着性の向上が課題であった。絶縁性粒子と導電性粒子との密着性は、対向電極とは異なる方向での絶縁性を得ながら対向電極間で導通を図る(以下、単に接続信頼性ともいう)上で重要である。この点に関し、特許文献1及び2は、防錆や酸化防止の目的で導電性粒子の金属表面を有機処理剤により処理するものであり、絶縁性粒子と導電性粒子との密着性を考慮したものではない。従って、本発明の目的は、前記の従来技術の有する課題を解決できる絶縁層被覆導電性粒子を提供することにある。 In the conductive particles coated with the insulating particles, it has been an issue to improve the adhesion between the insulating particles and the conductive particles. The adhesion between the insulating particles and the conductive particles is important for conducting conduction between the counter electrodes (hereinafter, also simply referred to as connection reliability) while obtaining insulation in a direction different from that of the counter electrodes. In this regard, Patent Documents 1 and 2 treat the metal surface of the conductive particles with an organic treatment agent for the purpose of preventing rust and oxidation, and consider the adhesion between the insulating particles and the conductive particles. It's not a thing. Therefore, an object of the present invention is to provide conductive particles coated with an insulating layer that can solve the problems of the prior art.

本発明者らは、前記の課題を解決するために鋭意研究を行った結果、電荷を有する官能基を含む絶縁層を用いた場合に、導電性粒子の表面に疎水基を有するチタン系化合物を有させると、絶縁層と、チタン系化合物を有する導電性粒子との親和性に優れ、従来技術と比べて導電性粒子への絶縁性物質の被覆率が一層高まることを見出し、本発明を完成した。 As a result of diligent research to solve the above-mentioned problems, the present inventors have obtained a titanium-based compound having a hydrophobic group on the surface of conductive particles when an insulating layer containing a charged functional group is used. The present invention was completed by finding that the insulating layer has an excellent affinity with the conductive particles having a titanium-based compound, and the coverage of the insulating substance on the conductive particles is further increased as compared with the prior art. did.

すなわち本発明は、芯材表面に金属皮膜が形成された導電性粒子と、前記金属皮膜の外表面に配された、疎水基を有するチタン系化合物と、前記チタン系化合物を有する前記導電性粒子の表面を被覆する絶縁層と、を有する被覆粒子であって、前記絶縁層が、電荷を有する官能基を含む化合物を有する、被覆粒子を提供するものである。 That is, in the present invention, the conductive particles having a metal film formed on the surface of the core material, the titanium-based compound having a hydrophobic group arranged on the outer surface of the metal film, and the conductive particles having the titanium-based compound. A coated particle having an insulating layer for coating the surface of the above, wherein the insulating layer has a compound containing a functional group having an electric charge.

図1は、実施例1で得られた被覆粒子の走査型電子顕微鏡像である。FIG. 1 is a scanning electron microscope image of the coated particles obtained in Example 1.

以下、本発明を好ましい実施形態に基づき説明する。
本実施形態の被覆粒子は、芯材表面に金属皮膜が形成され、且つ該金属皮膜の外表面に、疎水性基を有するチタン系化合物が配された導電性粒子と、該導電性粒子を被覆する絶縁層と、を有する被覆粒子であって、
前記絶縁層が、電荷を有する官能基を含む化合物を有する。金属皮膜の外表面は、金属皮膜における該芯材と反対側の表面を意味する。
Hereinafter, the present invention will be described based on a preferred embodiment.
The coated particles of the present embodiment are coated with conductive particles in which a metal film is formed on the surface of the core material and a titanium-based compound having a hydrophobic group is arranged on the outer surface of the metal film, and the conductive particles. A coating particle having an insulating layer and
The insulating layer has a compound containing a charged functional group. The outer surface of the metal film means the surface of the metal film opposite to the core material.

導電性粒子としては、導電性接着剤、異方性導電膜、異方性導電接着剤に従来用いている公知のものを用いることができる。
導電性粒子における芯材としては、粒子状であり、無機物であっても有機物であっても特に制限なく用いることができる。無機物の芯材粒子としては、金、銀、銅、ニッケル、パラジウム、ハンダ等の金属粒子、合金、ガラス、セラミック、シリカ、金属又は非金属の酸化物(含水物も含む)、アルミノ珪酸塩を含む金属珪酸塩、金属炭化物、金属窒化物、金属炭酸塩、金属硫酸塩、金属リン酸塩、金属硫化物、金属酸塩、金属ハロゲン化物及び炭素等が挙げられる。一方、有機物の芯材粒子としては、例えば、天然繊維、天然樹脂、ポリエチレン、ポリプロピレン、ポリ塩化ビニル、ポリスチレン、ポリブテン、ポリアミド、ポリアクリル酸エステル、ポリアクリルニトリル、ポリアセタール、アイオノマー、ポリエステル等の熱可塑性樹脂、アルキッド樹脂、フェノール樹脂、尿素樹脂、ベンゾグアナミン樹脂、メラミン樹脂、キシレン樹脂、シリコーン樹脂、エポキシ樹脂、ジアリルフタレート樹脂等が挙げられる。これらは単独で使用してもよいし、2種以上を組み合わせて使用してもよい。これらの中でも、金属からなる芯材粒子に比べて比重が小さくて沈降し難く、分散安定性に優れ、樹脂の弾性により電気接続を維持し易いという点で、樹脂材料からなる芯材粒子が好ましい。
As the conductive particles, known particles conventionally used for the conductive adhesive, the anisotropic conductive film, and the anisotropic conductive adhesive can be used.
The core material of the conductive particles is in the form of particles, and can be used without particular limitation whether it is an inorganic substance or an organic substance. Examples of the inorganic core particles include metal particles such as gold, silver, copper, nickel, palladium, and solder, alloys, glass, ceramics, silica, metal or non-metal oxides (including hydrous substances), and aluminosilicates. Examples thereof include metal silicates, metal carbides, metal nitrides, metal carbonates, metal sulfates, metal phosphates, metal sulfides, metal acid salts, metal halides and carbons. On the other hand, as the core material particles of the organic substance, for example, thermoplastics such as natural fiber, natural resin, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polybutene, polyamide, polyacrylic acid ester, polyacrylic nitrile, polyacetal, ionomer, polyester and the like. Examples thereof include resins, alkyd resins, phenol resins, urea resins, benzoguanamine resins, melamine resins, xylene resins, silicone resins, epoxy resins, diallyl phthalate resins and the like. These may be used alone or in combination of two or more. Among these, core material particles made of a resin material are preferable because they have a smaller specific gravity than metal core material particles, are less likely to settle, have excellent dispersion stability, and are easy to maintain electrical connection due to the elasticity of the resin. ..

芯材粒子として有機物を用いる場合、ガラス転移温度を有しないか、或いは、そのガラス転移温度は100℃超であることが、異方導電接続工程において芯材粒子の形状が維持されやすいことや金属皮膜を形成する工程において芯材粒子の形状を維持しやすい点から好ましい。また芯材粒子がガラス転移温度を有する場合、ガラス転移温度は、200℃以下であることが、異方導電接続において導電性粒子が軟化しやすく接触面積が大きくなることで導通が取りやすくなる点から好ましい。この観点から、芯材粒子がガラス転移温度を有する場合、ガラス転移温度は、100℃超180℃以下であることがより好ましく、100℃超160℃以下であることが特に好ましい。ガラス転移温度は、後述する実施例に記載の方法で測定できる。 When an organic substance is used as the core material particles, it is easy to maintain the shape of the core material particles in the anisotropic conductive connection step and that the glass transition temperature does not have a glass transition temperature or the glass transition temperature exceeds 100 ° C. It is preferable because the shape of the core material particles can be easily maintained in the step of forming the film. Further, when the core material particles have a glass transition temperature, the glass transition temperature is 200 ° C. or less, which means that the conductive particles tend to soften in the anisotropic conductive connection and the contact area becomes large, so that conduction can be easily obtained. Is preferable. From this viewpoint, when the core material particles have a glass transition temperature, the glass transition temperature is more preferably more than 100 ° C. and 180 ° C. or lower, and particularly preferably more than 100 ° C. and 160 ° C. or lower. The glass transition temperature can be measured by the method described in Examples described later.

芯材粒子として有機物を用いる場合において、その有機物が高度に架橋した樹脂であるときは、ガラス転移温度は下記実施例に記載の方法にて200℃まで測定を試みても、ほとんど観測されない。本明細書中ではこのような粒子を、ガラス転移点を有しない粒子ともいう。前記のこのようなガラス転移温度を有しない芯材粒子材料の具体例としては、前記で例示した有機物を構成する単量体に架橋性の単量体を併用して共重合させて得ることができる。架橋性の単量体としては、テトラメチレンジ(メタ)アクリレート、エチレングリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、ポリプロピレングリコールジ(メタ)アクリレート、エチレンオキシドジ(メタ)アクリレート、テトラエチレンオキシド(メタ)アクリレート、1,6−ヘキサンジ(メタ)アクリレート、ネオペンチルグリコールジ(メタ)アクリレート、1,9−ノナンジオールジ(メタ)アクリレート、トリメテロールプロパントリ(メタ)アクリレート、テトラメチロールメタンジ(メタ)アクリレート、テトラメチロールメタントリ(メタ)アクリレート、テトラメチロールメタンテトラ(メタ)アクリレート、テトラメチロールプロパンテトラ(メタ)アクリレート、ジペンタエリスリトールペンタ(メタ)アクリレート、グリセロールジ(メタ)アクリレート、グリセロールトリジ(メタ)アクリレート等の多官能(メタ)アクリレート、ジビニルベンゼン、ジビニルトルエン等の多官能ビニル系単量体、ビニルトリメトキシシラン、トリメトキシシリルスチレン、γ−(メタ)アクリロキシプロピルトリメトキシシラン等のシラン含有系単量体、トリアリルイソシアヌレート、ジアリルフタレート、ジアリルアクリルアミド、ジアリルエーテル等の単量体が挙げられる。特にCOG(Chip on Glass)分野ではこのような硬質な有機材料による芯材粒子が多く使用される。 When an organic substance is used as the core material particles, when the organic substance is a highly crosslinked resin, the glass transition temperature is hardly observed even if the measurement is attempted to 200 ° C. by the method described in the following Examples. In the present specification, such particles are also referred to as particles having no glass transition point. As a specific example of the core material having no glass transition temperature as described above, it is possible to obtain by copolymerizing the monomer constituting the organic substance exemplified above with a crosslinkable monomer in combination. it can. Examples of the crosslinkable monomer include tetramethylene di (meth) acrylate, ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, ethylene oxide di (meth) acrylate, and tetraethylene oxide. (Meta) acrylate, 1,6-hexanedi (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, trimeterol propantri (meth) acrylate, tetramethylol methandi (meth) Meta) acrylate, tetramethylol methanetri (meth) acrylate, tetramethylol methanetetra (meth) acrylate, tetramethylol propanetetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, glycerol di (meth) acrylate, glycerol tridi (meth) Polyfunctional (meth) acrylates such as meta) acrylates, polyfunctional vinyl monomers such as divinylbenzene and divinyltoluene, vinyltrimethoxysilane, trimethoxysilylstyrene, γ- (meth) acryloxipropyltrimethoxysilane, etc. Examples thereof include silane-containing monomers, triallyl isocyanurate, diallyl phthalate, diallyl acrylamide, diallyl ether and the like. Especially in the field of COG (Chip on Glass), core material particles made of such a hard organic material are often used.

芯材粒子の形状に特に制限はない。一般に、芯材粒子は球状である。しかし、芯材粒子は球状以外の形状、例えば、繊維状、中空状、板状又は針状であってもよく、その表面に多数の突起を有するもの又は不定形のものであってもよい。本発明においては、充填性に優れる、金属を被覆しやすいといった点で、球状の芯材粒子が好ましい。
導電性粒子の形状は、芯材粒子の形状にもよるが、特に制限はない。例えば、繊維状、中空状、板状又は針状であってもよく、その表面に突起を有するもの又は不定形のものであってもよい。本発明においては、充填性、接続性に優れるという点で、球状又は表面に突起を有する形状であることが好ましい。導電性粒子が表面に突起を有する形状である場合、表面に複数の突起を有することが好ましく、球状の表面に複数の突起を有することが更に好ましい。導電性粒子が複数の突起を有する形状である場合、芯材粒子が複数の突起を有するものであってもよいし、芯材粒子が突起を有さず、金属皮膜が複数の突起を有するものであってもよい。好ましくは芯材粒子が突起を有さず、金属皮膜が複数の突起を有するものである。
The shape of the core material particles is not particularly limited. Generally, the core material particles are spherical. However, the core material particles may have a shape other than a spherical shape, for example, a fibrous shape, a hollow shape, a plate shape, or a needle shape, and may have a large number of protrusions on the surface thereof or an irregular shape. In the present invention, spherical core material particles are preferable in terms of excellent filling property and easy coating of metal.
The shape of the conductive particles depends on the shape of the core material particles, but is not particularly limited. For example, it may be fibrous, hollow, plate-shaped or needle-shaped, and may have protrusions on its surface or may be amorphous. In the present invention, it is preferable that the shape is spherical or has protrusions on the surface in terms of excellent filling property and connectivity. When the conductive particles have a shape having protrusions on the surface, it is preferable to have a plurality of protrusions on the surface, and it is more preferable to have a plurality of protrusions on a spherical surface. When the conductive particles have a shape having a plurality of protrusions, the core material particles may have a plurality of protrusions, or the core material particles do not have the protrusions and the metal film has a plurality of protrusions. It may be. Preferably, the core material particles do not have protrusions and the metal film has a plurality of protrusions.

本発明の被覆粒子は、金属皮膜表面にチタン系化合物が配され、且つ、絶縁層が電荷を有する官能基を含む化合物を有することで絶縁層の導電性粒子への密着性に優れているところ、電気的な導通を確実なものとするために、導電性粒子表面に突起を有していてもよい。導電性粒子表面に突起を有することで、実装時に電極によって導電性粒子が圧縮されたときに、該突起により絶縁層を効果的に押し退けることができる。導電性粒子の突起の高さHは、絶縁層の厚さをLとしたときに、H/Lが0.1以上であることが、実装時に絶縁層を排除して電気的な導通を確実なものとする観点から好ましい。またH/Lが10以下であることが、充填性や対向電極とは異なる方向での絶縁性を得る観点から好ましい。これらの点から、H/Lは0.2以上5以下であることが更に一層好ましい。これらの好ましい範囲において、厚さLは、絶縁層が絶縁性微粒子である場合に絶縁性微粒子の平均粒子径を指す。 The coated particles of the present invention are excellent in adhesion to conductive particles of the insulating layer because a titanium-based compound is arranged on the surface of the metal film and the insulating layer has a compound containing a charged functional group. In order to ensure electrical conduction, protrusions may be provided on the surface of the conductive particles. By having the protrusions on the surface of the conductive particles, when the conductive particles are compressed by the electrodes at the time of mounting, the protrusions can effectively push away the insulating layer. As for the height H of the protrusions of the conductive particles, when the thickness of the insulating layer is L, H / L is 0.1 or more, which eliminates the insulating layer at the time of mounting to ensure electrical conduction. It is preferable from the viewpoint of making it simple. Further, it is preferable that the H / L is 10 or less from the viewpoint of obtaining the filling property and the insulating property in a direction different from that of the counter electrode. From these points, it is even more preferable that the H / L is 0.2 or more and 5 or less. In these preferable ranges, the thickness L refers to the average particle size of the insulating fine particles when the insulating layer is the insulating fine particles.

突起の高さHは、平均して20nm以上、特に50nm以上であることが好ましい。突起の数は、導電性粒子の粒径にもよるが、1つの粒子当たり、1〜20000個、特に5〜5000個であることが、導電性粒子の導電性の一層の向上の点から好ましい。また、突起のアスペクト比は、好ましくは0.3以上、より好ましくは0.5以上である。突起のアスペクト比が大きいと、電極表面に形成されている酸化皮膜を容易に突き破ることができるので有利である。アスペクト比とは、突起の高さHと突起の基部の長さDとの比、すなわちH/Dで定義される値である。突起の高さH、突起の基部の長さDは、電子顕微鏡により観察された20個の異なる粒子について測定した平均値であり、突起のアスペクト比は、電子顕微鏡により観察された20個の異なる粒子のアスペクト比を算出し、その平均値を求めたものである。基部の長さDとは電子顕微鏡における、突起の基部の、導電性粒子の表面に沿う長さをいう。 The height H of the protrusions is preferably 20 nm or more, particularly preferably 50 nm or more on average. The number of protrusions depends on the particle size of the conductive particles, but it is preferably 1 to 20000, particularly 5 to 5000, per particle from the viewpoint of further improving the conductivity of the conductive particles. .. The aspect ratio of the protrusions is preferably 0.3 or more, more preferably 0.5 or more. A large aspect ratio of the protrusions is advantageous because it can easily break through the oxide film formed on the electrode surface. The aspect ratio is a value defined by the ratio of the height H of the protrusion to the length D of the base of the protrusion, that is, H / D. The height H of the protrusion and the length D of the base of the protrusion are average values measured for 20 different particles observed by an electron microscope, and the aspect ratio of the protrusion is 20 different values observed by an electron microscope. The aspect ratio of the particles was calculated and the average value was calculated. The length D of the base refers to the length of the base of the protrusion along the surface of the conductive particles in the electron microscope.

導電性粒子の表面に形成されている突起のアスペクト比は上述のとおりであるところ、突起の基部の長さD自体は5〜500nm、特に10〜400nmであることが好ましく、突起の高さHについては20〜500nm、特に50〜400nmであることが好ましい。 The aspect ratio of the protrusions formed on the surface of the conductive particles is as described above, and the length D of the base of the protrusions itself is preferably 5 to 500 nm, particularly preferably 10 to 400 nm, and the height H of the protrusions. It is preferably 20 to 500 nm, particularly 50 to 400 nm.

表面に突起を有する導電性粒子は、絶縁層が絶縁性微粒子である場合、突起部分の被覆が不十分となることがある。本発明の被覆粒子は、後述する本発明で用いられるチタン系化合物自体が絶縁性を示すため、金属皮膜の外表面に該チタン系化合物を配することにより、表面に突起を有する導電性粒子の絶縁性をより高めることができる。 For conductive particles having protrusions on the surface, if the insulating layer is insulating fine particles, the coating of the protrusions may be insufficient. In the coated particles of the present invention, since the titanium compound itself used in the present invention described later exhibits insulating properties, by arranging the titanium compound on the outer surface of the metal film, the conductive particles having protrusions on the surface can be obtained. Insulation can be further improved.

導電性粒子における金属皮膜は、導電性を有するものであり、その構成金属としては、例えば、金、白金、銀、銅、鉄、亜鉛、ニッケル、スズ、鉛、アンチモン、ビスマス、コバルト、インジウム、チタン、アンチモン、ビスマス、ゲルマニウム、アルミニウム、クロム、パラジウム、タングステン、モリブデン等の金属又はこれらの合金のほか、ITO、ハンダ等の金属化合物等が挙げられる。中でも金、銀、銅、ニッケル、パラジウム又はハンダが、抵抗が少ないため好ましく、とりわけ、金、銀、銅、ニッケル、パラジウム、金合金、銀合金、銅合金、ニッケル合金又はパラジウム合金が、絶縁性微粒子における電荷を有する官能基との結合性が高いために好適に用いられ、これらの金属から選ばれる少なくとも1種を含むことが好ましいる。導電性粒子の金属皮膜における金属は、1種又は2種以上を組み合わせて用いることができる。 The metal film in the conductive particles has conductivity, and examples of the constituent metals include gold, platinum, silver, copper, iron, zinc, nickel, tin, lead, antimony, bismuth, cobalt, and indium. Examples thereof include metals such as titanium, antimony, bismuth, germanium, aluminum, chromium, palladium, tungsten and molybdenum, alloys thereof, and metal compounds such as ITO and solder. Among them, gold, silver, copper, nickel, palladium or solder is preferable because of its low resistance, and in particular, gold, silver, copper, nickel, palladium, gold alloy, silver alloy, copper alloy, nickel alloy or palladium alloy has insulating properties. It is preferably used because of its high bondability with a charged functional group in the fine particles, and preferably contains at least one selected from these metals. The metal in the metal film of the conductive particles may be used alone or in combination of two or more.

金属皮膜は、単層構造であっても、複数層からなる積層構造であってもよい。複数層からなる積層構造である場合には、最表層が、金、銀、銅、ニッケル、パラジウム、金合金、銀合金、銅合金、ニッケル合金又はパラジウム合金であることが好ましい。 The metal film may have a single-layer structure or a laminated structure composed of a plurality of layers. In the case of a laminated structure composed of a plurality of layers, it is preferable that the outermost layer is gold, silver, copper, nickel, palladium, a gold alloy, a silver alloy, a copper alloy, a nickel alloy or a palladium alloy.

また金属皮膜は、芯材粒子の表面全体を被覆していなくてもよく、その一部のみを被覆していてもよい。芯材粒子の表面の一部のみを被覆している場合は、被覆部位が連続していてもよく、例えばアイランド状に不連続に被覆していてもよい。金属皮膜の厚さは0.001μm以上2μm以下が好ましく挙げられる。金属皮膜が突起を有する場合、ここでいう金属皮膜の厚さに、突起の高さは含まないものとする。 Further, the metal film may not cover the entire surface of the core material particles, or may cover only a part thereof. When only a part of the surface of the core material particles is covered, the covering portions may be continuous, for example, island-like discontinuous coating may be performed. The thickness of the metal film is preferably 0.001 μm or more and 2 μm or less. When the metal film has protrusions, the height of the protrusions is not included in the thickness of the metal film referred to here.

芯材粒子の表面に金属皮膜を形成する方法としては、蒸着法、スパッタ法、メカノケミカル法、ハイブリダイゼーション法等を利用する乾式法、電解めっき法、無電解めっき法等を利用する湿式法が挙げられる。また、これらの方法を組み合わせて芯材粒子の表面に金属皮膜を形成してもよい。 As a method for forming a metal film on the surface of the core material particles, a dry method using a vapor deposition method, a sputtering method, a mechanochemical method, a hybridization method, etc., an electrolytic plating method, a wet method using an electroless plating method, etc. are used. Can be mentioned. Further, a metal film may be formed on the surface of the core material particles by combining these methods.

導電性粒子は、金属皮膜の外表面にチタン系化合物を有する。導電性粒子がチタン系化合物を表面に有する場合、電荷を有する絶縁層と密着しやすく、これによって導電性粒子表面における絶縁層による被覆率を十分なものにできるとともに導電性粒子からの絶縁層の剥離などが効果的に防止される。このため、絶縁層による対向電極間と異なる方向における短絡防止効果が発揮されやすく、当該方向での絶縁性の向上が期待できる。
従って本発明の被覆粒子により接続信頼性を向上しうる。
The conductive particles have a titanium-based compound on the outer surface of the metal film. When the conductive particles have a titanium-based compound on the surface, they easily adhere to the insulating layer having an electric charge, whereby the coverage of the insulating layer on the surface of the conductive particles can be sufficiently increased, and the insulating layer from the conductive particles can be sufficiently coated. Peeling is effectively prevented. Therefore, the short-circuit prevention effect of the insulating layer in a direction different from that between the counter electrodes is likely to be exhibited, and improvement in the insulating property in that direction can be expected.
Therefore, the coating particles of the present invention can improve the connection reliability.

チタン系化合物としては疎水性基を有する化合物が、絶縁層との親和性の点から好ましい。チタン系化合物における疎水性基としては有機基が挙げられ、その炭素原子数としては、その入手しやすさと絶縁層との親和性との観点から、2以上30以下が好ましく挙げられる。同様の観点から、チタン系化合物における疎水性基としては炭素原子数2以上30以下の脂肪族炭化水素基、炭素原子数6以上22以下のアリール基、炭素原子数7以上23以下のアリールアルキル基が好ましく挙げられる。前記のアリール基やアリールアルキル基は、炭素原子数1以上18以下の脂肪族炭化水素基に置換されていてもよい。
前記炭素原子数2以上30以下の脂肪族炭化水素基としては、直鎖状もしくは分岐鎖状の飽和脂肪族炭化水素基及び不飽和脂肪族炭化水素基が挙げられ、飽和脂肪族炭化水素基の例としては、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ドデシル基、トリデシル基、テトラデシル基、ペンタデシル基、ヘキサデシル基、ヘプタデシル基、オクタデシル基、ノナデシル基、イコシル基、ヘンイコシル基、ドコシル基等が挙げられる。不飽和脂肪族炭化水素基の例としては、アルケニル基として、ドデセニル基、トリデセニル基、テトラデセニル基、ペンタデセニル基、ヘキサデセニル基、ヘプタデセニル基、ノナデセニル基、イコセニル基、エイコセニル基、ヘンイコセニル基、ドコセニル基が挙げられる。
炭素原子数6以上22以下のアリール基としては、フェニル基、トリル基、ナフチル基、アントリル基等が挙げられる。
炭素原子数7以上23以下のアリールアルキル基としては、ベンジル基、フェネチル基、ナフチルメチル基等が挙げられる。
疎水性基としては直鎖状又は分岐鎖状の脂肪族炭化水素基が特に好ましく、直鎖状の脂肪族炭化水素基がとりわけ好ましい。
絶縁層と導電性粒子との親和性を高める点から、疎水性基としての脂肪族炭化水素基としては、特に炭素原子数4以上28以下のものが更に好ましく、6以上24以下のものが最も好ましい。
As the titanium-based compound, a compound having a hydrophobic group is preferable from the viewpoint of affinity with the insulating layer. Examples of the hydrophobic group in the titanium-based compound include an organic group, and the number of carbon atoms thereof is preferably 2 or more and 30 or less from the viewpoint of its availability and affinity with the insulating layer. From the same viewpoint, the hydrophobic groups in titanium compounds include aliphatic hydrocarbon groups having 2 to 30 carbon atoms, aryl groups having 6 to 22 carbon atoms, and arylalkyl groups having 7 to 23 carbon atoms. Is preferably mentioned. The aryl group or arylalkyl group may be substituted with an aliphatic hydrocarbon group having 1 to 18 carbon atoms.
Examples of the aliphatic hydrocarbon group having 2 or more and 30 or less carbon atoms include a linear or branched saturated aliphatic hydrocarbon group and an unsaturated aliphatic hydrocarbon group, and examples of the saturated aliphatic hydrocarbon group. Examples include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, dodecyl group, tridecyl group, tetradecyl group, pentadecyl group, hexadecyl group, heptadecyl. Examples thereof include a group, an octadecyl group, a nonadecil group, an icosyl group, a henicosyl group, a docosyl group and the like. Examples of unsaturated aliphatic hydrocarbon groups include dodecenyl group, tridecenyl group, tetradecenyl group, pentadecenyl group, hexadecenyl group, heptadecenyl group, nonadesenyl group, icosenyl group, eicosenyl group, henicosenyl group and docosenyl group as alkenyl groups. Be done.
Examples of the aryl group having 6 or more and 22 or less carbon atoms include a phenyl group, a tolyl group, a naphthyl group, an anthryl group and the like.
Examples of the arylalkyl group having 7 or more and 23 or less carbon atoms include a benzyl group, a phenethyl group, and a naphthylmethyl group.
As the hydrophobic group, a linear or branched aliphatic hydrocarbon group is particularly preferable, and a linear aliphatic hydrocarbon group is particularly preferable.
From the viewpoint of enhancing the affinity between the insulating layer and the conductive particles, the aliphatic hydrocarbon group as the hydrophobic group is more preferably 4 or more and 28 or less, and most preferably 6 or more and 24 or less. preferable.

チタン系化合物としては、例えば一般式(I)で表される構造を有する化合物が、導電性粒子の表面に有する場合に絶縁層と導電性粒子との親和性を容易に得られる点や溶媒に分散し易く導電性粒子表面を均一に処理できる点で特に好ましい。 As the titanium-based compound, for example, when the compound having the structure represented by the general formula (I) is present on the surface of the conductive particles, the affinity between the insulating layer and the conductive particles can be easily obtained and the solvent. It is particularly preferable because it is easy to disperse and the surface of the conductive particles can be treated uniformly.

(R12は2価又は3価の基であり、R13は炭素原子数4以上28以下の脂肪族炭化水素基、炭素原子数6以上22以下のアリール基又は炭素原子数7以上23以下のアリールアルキル基であり、p及びrはそれぞれ1以上3以下の整数であり、p+r=4を満たし、qは1又は2である整数であり、R12が2価の基である場合、qは1であり、R12が3価の基である場合、qは2である。qが2である場合、複数のR13は同一であっても異なってもよい。*は結合手を表す。) (R 12 is a divalent or trivalent group, R 13 is an aliphatic hydrocarbon group having 4 or more and 28 or less carbon atoms, an aryl group having 6 or more and 22 or less carbon atoms, or 7 or more and 23 or less carbon atoms. If it is an arylalkyl group, p and r are integers of 1 or more and 3 or less, satisfy p + r = 4, q is an integer of 1 or 2, and R 12 is a divalent group, q is. When it is 1 and R 12 is a trivalent group, q is 2. When q is 2, a plurality of R 13s may be the same or different. * Represents a bond. )

13で表される炭素原子数4以上28以下の脂肪族炭化水素基の例としては、上述した疎水性基における前記の脂肪族炭化水素基の例として挙げたものが挙げられる。Examples of the aliphatic hydrocarbon group having 4 or more and 28 or less carbon atoms represented by R 13 include those mentioned as an example of the above-mentioned aliphatic hydrocarbon group in the above-mentioned hydrophobic group.

12で表される2価の基としては、−O−、−COO−、−OCO−、−OSO2−等が挙げられる。R12で表される3価の基としては、−P(OH)(O−)2、−OPO(OH)−OPO(O−)2等が挙げられる。Examples of the divalent group represented by R 12 include -O-, -COO-, -OCO-, and -OSO 2- . Examples of the trivalent group represented by R 12 include -P (OH) (O-) 2 , -OPO (OH) -OPO (O-) 2, and the like.

一般式(I)において*は結合手であり、当該結合手は導電性粒子の金属皮膜に結合していてもよく、或いは、他の原子や基等に結合していてもよい。その場合の他の原子や基等については、後述する一般式(I’)において説明するものが挙げられる。 In the general formula (I), * is a bond, and the bond may be bonded to the metal film of the conductive particles, or may be bonded to another atom, group, or the like. Other atoms, groups, etc. in that case may be described in the general formula (I') described later.

一般式(I)で表される構造を有するチタン系化合物としては、一般式(I)におけるR12が2価の基である構造を有する化合物が、入手容易性や導電性粒子の導電特性を損なうことなく処理できる点で好ましい。一般式(I)においてR12が2価の基である構造は、下記一般式(II)で表される。As the titanium-based compound having the structure represented by the general formula (I), the compound having the structure in which R 12 is a divalent group in the general formula (I) has the availability and the conductive characteristics of the conductive particles. It is preferable in that it can be processed without damage. The structure in which R 12 is a divalent group in the general formula (I) is represented by the following general formula (II).

(R12は、−O−、−COO−、−OCO−、−OSO2−から選ばれる基であり、p、r及びR13は一般式(I)と同義である。) (R 12 is a group selected from -O-, -COO-, -OCO-, and -OSO 2- , and p, r and R 13 are synonymous with the general formula (I).)

一般式(I)及び(II)において、rは2又は3であることが、絶縁層と導電層の密着性が上がる観点で好ましく、rが3であることが最も好ましい。 In the general formulas (I) and (II), r is preferably 2 or 3, from the viewpoint of improving the adhesion between the insulating layer and the conductive layer, and most preferably r is 3.

チタン系化合物は、導電性粒子における表面の金属と化学的に結合していてもよく、結合していなくてもよい。例えば、チタン系化合物は、上述した通り一般式(I)及び(II)における結合手により金属皮膜と化学的に結合していてもよい。なお、化学結合には、共有結合、静電結合等が挙げられる。 The titanium-based compound may or may not be chemically bonded to the metal on the surface of the conductive particles. For example, the titanium-based compound may be chemically bonded to the metal film by the bonding force in the general formulas (I) and (II) as described above. Examples of chemical bonds include covalent bonds and electrostatic bonds.

チタン系化合物は、導電性粒子の表面に存在していればよく、その場合、導電性粒子の表面全体に存在していてもよく、表面の一部にのみ存在していてもよい。チタン系化合物は、導電性粒子の表面の一部又は全体を被覆する層を形成していてもよい。導電性粒子の表面にチタン系化合物を有することで、電荷を有する官能基を表面に有する絶縁層との親和性が高いものとなる。 The titanium-based compound may be present on the surface of the conductive particles, and in that case, it may be present on the entire surface of the conductive particles, or may be present only on a part of the surface. The titanium-based compound may form a layer that covers a part or the whole of the surface of the conductive particles. By having the titanium-based compound on the surface of the conductive particles, the affinity with the insulating layer having a charged functional group on the surface becomes high.

チタン系化合物を導電性粒子の金属皮膜の外表面に有させるためには、後述する好ましい被覆粒子の製造方法において、チタン系化合物による導電性粒子の表面処理を行えばよい。 In order to have the titanium-based compound on the outer surface of the metal film of the conductive particles, the surface treatment of the conductive particles with the titanium-based compound may be performed in a preferable method for producing coated particles described later.

導電性粒子の平均粒子径は、好ましくは0.1μm以上50μm以下、より好ましくは1μm以上30μm以下である。導電性粒子の平均粒子径が上記範囲内であることで、得られる被覆粒子が対向電極間とは異なる方向での短絡を発生させることなく、対向電極間での導通を確保しやすい。なお、本発明において、導電性粒子の平均粒子径は、走査型電子顕微鏡(Scanning Electron Microscope:SEM)を用いて測定した粒子径の平均値である。なお走査型電子顕微鏡画像において導電性粒子が球状である場合は、SEMを用いて測定する粒子径とは、円形の導電性粒子像の径である。絶縁性微粒子が球状でない場合、SEMを用いて測定する粒子径は、導電性粒子の像を横断する線分のうち最も大きい長さ(最大長さ)をいう。ただし、導電性粒子が突起を有する場合は、突起以外の部分についての上記の最大長さを平均粒子径とする。このことは、後述する絶縁性微粒子の平均粒子径についても同様である。
具体的には、導電性粒子の平均粒子径は実施例に記載の方法にて測定される。
The average particle size of the conductive particles is preferably 0.1 μm or more and 50 μm or less, and more preferably 1 μm or more and 30 μm or less. When the average particle diameter of the conductive particles is within the above range, it is easy to secure conduction between the counter electrodes without causing a short circuit in the obtained coated particles in a direction different from that between the counter electrodes. In the present invention, the average particle size of the conductive particles is an average value of the particle size measured using a scanning electron microscope (SEM). When the conductive particles are spherical in the scanning electron microscope image, the particle diameter measured by using SEM is the diameter of the circular conductive particle image. When the insulating fine particles are not spherical, the particle diameter measured using SEM refers to the largest length (maximum length) of the line segments traversing the image of the conductive particles. However, when the conductive particles have protrusions, the above-mentioned maximum length of the portion other than the protrusions is defined as the average particle diameter. This also applies to the average particle size of the insulating fine particles described later.
Specifically, the average particle size of the conductive particles is measured by the method described in Examples.

本発明における絶縁層はポリマーから構成され、且つ、電荷を有する官能基を含む化合物を有する。絶縁層としては、複数の絶縁性微粒子が層状に配置されたものからなるか、或いは、絶縁性の連続皮膜が挙げられる。 The insulating layer in the present invention is composed of a polymer and has a compound containing a charged functional group. Examples of the insulating layer include those in which a plurality of insulating fine particles are arranged in a layer, or an insulating continuous film.

まず、絶縁層が絶縁性微粒子からなり、該微粒子が電荷を有する官能基を有する化合物を含む場合について説明する。この場合、被覆粒子を電極間で熱圧着することで絶縁性微粒子が溶融、変形、剥離又は導電性粒子表面を移動することにより熱圧着された部分における導電性粒子の金属表面が露出し、これにより電極間での導通を可能として接続性が得られる。一方、被覆粒子における熱圧着方向以外の方向を向く表面部分は、絶縁性微粒子による導電性粒子表面の被覆状態が概ね維持されているため、熱圧着方向以外の方向における導通が防止される。
絶縁性微粒子は、その表面に電荷を有する官能基(以下単に「荷電官能基」ともいう。)を含むことにより、チタン系化合物を表面に有する導電性粒子に密着しやすく、これによって導電性粒子表面における絶縁性微粒子に被覆される割合を十分なものにできるとともに導電性粒子からの絶縁性微粒子の剥離などが効果的に防止される。このため、絶縁性微粒子による対向電極間と異なる方向における短絡防止効果が発揮されやすく、当該方向での絶縁性の向上が期待できる。
また本発明の被覆粒子は、荷電官能基が同じ電荷を有することにより、絶縁性微粒子同士が反発しあうため導電性粒子表面に単層の絶縁性微粒子の層を形成しやすい。従って、本発明の被覆粒子を異方導電材料等に用いた場合に絶縁性微粒子が重層して存在していることによる熱圧着に伴う導通不良が効果的に防止され、接続性の向上が期待できる。
従って絶縁層が荷電官能基をその表面に含む絶縁性微粒子からなる本発明の被覆粒子により接続信頼性を向上しうる。
First, a case where the insulating layer is made of insulating fine particles and the fine particles contain a compound having a functional group having an electric charge will be described. In this case, the insulating fine particles are melted, deformed, peeled off, or moved on the surface of the conductive particles by thermocompression bonding the coated particles between the electrodes, so that the metal surface of the conductive particles in the thermocompression bonded portion is exposed. This enables continuity between the electrodes and provides connectivity. On the other hand, since the surface portion of the coated particles facing a direction other than the thermocompression bonding direction is generally maintained in a state of being coated on the surface of the conductive particles by the insulating fine particles, conduction in a direction other than the thermocompression bonding direction is prevented.
By containing a functional group having an electric charge on its surface (hereinafter, also simply referred to as “charged functional group”), the insulating fine particles easily adhere to the conductive particles having a titanium-based compound on the surface, whereby the conductive particles The ratio of the surface covered with the insulating fine particles can be made sufficient, and the peeling of the insulating fine particles from the conductive particles can be effectively prevented. Therefore, the short-circuit prevention effect of the insulating fine particles in a direction different from that between the counter electrodes is likely to be exhibited, and improvement in the insulating property in that direction can be expected.
Further, in the coated particles of the present invention, since the charged functional groups have the same charge, the insulating fine particles repel each other, so that a single layer of insulating fine particles is easily formed on the surface of the conductive particles. Therefore, when the coated particles of the present invention are used as an anisotropic conductive material or the like, poor conduction due to thermocompression bonding due to the presence of insulating fine particles in layers is effectively prevented, and improvement in connectivity is expected. it can.
Therefore, the connection reliability can be improved by the coating particles of the present invention in which the insulating layer is composed of insulating fine particles having a charged functional group on its surface.

絶縁性微粒子は荷電官能基をその表面に有することが好ましい。本明細書中、絶縁性微粒子が荷電官能基を有し、且つ走査型電子顕微鏡観察により絶縁性微粒子が導電性粒子表面に付着していることが確認できれば、「絶縁性微粒子が電荷を有する官能基を表面に有する」ことに該当するとする。 Insulating fine particles preferably have a charged functional group on their surface. In the present specification, if it is confirmed that the insulating fine particles have a charged functional group and that the insulating fine particles are attached to the surface of the conductive particles by observation with a scanning electron microscope, "the functionality of the insulating fine particles having a charge". It corresponds to "having a group on the surface".

絶縁性微粒子の形状は、特に制限はなく、球状であってもよく、或いは球状以外の形状であってもよい。球状以外の形状としては例えば、繊維状、中空状、板状又は針状が挙げられる。また絶縁性微粒子はその表面に多数の突起を有するもの又は不定形のものであってもよい。導電性粒子への付着性の点や合成の容易性の点で球状の絶縁性微粒子が好ましい。 The shape of the insulating fine particles is not particularly limited and may be spherical or non-spherical. Examples of the shape other than the spherical shape include a fibrous shape, a hollow shape, a plate shape, and a needle shape. Further, the insulating fine particles may have a large number of protrusions on the surface thereof or may have an amorphous shape. Spherical insulating fine particles are preferable in terms of adhesion to conductive particles and ease of synthesis.

絶縁性微粒子において荷電官能基は、絶縁性微粒子を構成する物質の一部として、該物質の化学構造の一部をなしていることが好ましい。絶縁性微粒子において荷電官能基は、絶縁性微粒子を構成するポリマーにおける構造中に含有されていることが好ましい。荷電官能基は、絶縁性微粒子を構成するポリマーに化学結合していることが好ましく、より好ましくはポリマーの側鎖に結合している。本明細書中、絶縁性微粒子が荷電官能基を有し、且つ走査型電子顕微鏡観察により絶縁性微粒子が金属被覆粒子表面に付着していることが確認できれば、「絶縁性微粒子が電荷を有する官能基を表面に有する」ことに該当するとする。 In the insulating fine particles, the charged functional group preferably forms a part of the chemical structure of the substance as a part of the substance constituting the insulating fine particles. In the insulating fine particles, the charged functional group is preferably contained in the structure of the polymer constituting the insulating fine particles. The charged functional group is preferably chemically bonded to the polymer constituting the insulating fine particles, and more preferably bonded to the side chain of the polymer. In the present specification, if it is confirmed that the insulating fine particles have a charged functional group and that the insulating fine particles are attached to the surface of the metal-coated particles by observation with a scanning electron microscope, "the insulating fine particles have a charged functional group". It corresponds to "having a group on the surface".

荷電官能基としては、正の電荷を有する官能基として、ホスホニウム基、アンモニウム基、スルホニウム基、アミノ基等が好適に挙げられる。また負の電荷を有する官能基として、カルボキシル基、水酸基、チオール基、スルホン酸基、リン酸基等が好適に挙げられる。 Preferred examples of the charged functional group include a phosphonium group, an ammonium group, a sulfonium group, an amino group and the like as a functional group having a positive charge. Further, as the functional group having a negative charge, a carboxyl group, a hydroxyl group, a thiol group, a sulfonic acid group, a phosphoric acid group and the like are preferably mentioned.

荷電官能基としては、特にホスホニウム基、アンモニウム基、スルホニウム基等のオニウム系の官能基であることが、チタン系化合物又はアミド系化合物を表面に有する導電性粒子に絶縁層が一層密着しやすい点で好ましく、ホスホニウム基が最も好ましい。 As the charged functional group, in particular, an onium-based functional group such as a phosphonium group, an ammonium group, or a sulfonium group makes it easier for the insulating layer to adhere to conductive particles having a titanium-based compound or an amide-based compound on the surface. The phosphonium group is most preferable.

オニウム系官能基は、下記一般式(1)で表されるものが好ましく挙げられる。
(式中、Xはリン原子、窒素原子、又は硫黄原子であり、Rは同じであっても異なっていてもよく、水素原子、直鎖状、分岐鎖状若しくは環状のアルキル基、又はアリール基である。nは、Xが窒素原子、リン原子の場合は1であり、Xが硫黄原子の場合は0である。*は結合手である。)
As the onium-based functional group, those represented by the following general formula (1) are preferably mentioned.
(In the formula, X is a phosphorus atom, a nitrogen atom, or a sulfur atom, and R may be the same or different, and may be a hydrogen atom, a linear, branched or cyclic alkyl group, or an aryl group. N is 1 when X is a nitrogen atom and a phosphorus atom, and is 0 when X is a sulfur atom. * Is a bonder.)

例えば正の荷電を有する官能基に対する対イオンとしては、ハロゲン化物イオンが好適に挙げられる。ハロゲン化物イオンの例としては、Cl-、F-、Br-、I-が挙げられる。For example, a halide ion is preferably used as a counter ion for a functional group having a positive charge. Examples of halide ions, Cl -, F -, Br -, I - , and the like.

Rで表される直鎖状のアルキル基としては、メチル基、エチル基、n−プロピル基、n−ブチル基、n−ペンチル基、n−ヘキシル基、n−ヘプチル基、n−オクチル基、n−ノニル基、n−デシル基、n−ウンデシル基、n−ドデシル基、n−トリデシル基、n−テトラデシル基、n−ペンタデシル基、n−ヘキサデシル基、n−ヘプタデシル基、n−オクタデシル基、n−ノナデシル基、n−イコシル基等が挙げられる。 Examples of the linear alkyl group represented by R include a methyl group, an ethyl group, an n-propyl group, an n-butyl group, an n-pentyl group, an n-hexyl group, an n-heptyl group and an n-octyl group. n-nonyl group, n-decyl group, n-undecyl group, n-dodecyl group, n-tridecyl group, n-tetradecyl group, n-pentadecyl group, n-hexadecyl group, n-heptadecyl group, n-octadecyl group, Examples thereof include an n-nonadecil group and an n-icosyl group.

Rで表される分岐鎖状のアルキル基としては、イソプロピル基、イソブチル基、s−ブチル基、t−ブチル基、イソペンチル基、s−ペンチル基、t−ペンチル基、イソヘキシル基、s−ヘキシル基、t−ヘキシル基、エチルヘキシル基等が挙げられる。 The branched alkyl group represented by R includes an isopropyl group, an isobutyl group, an s-butyl group, a t-butyl group, an isopentyl group, an s-pentyl group, a t-pentyl group, an isohexyl group and an s-hexyl group. , T-hexyl group, ethylhexyl group and the like.

Rで表される環状のアルキル基としては、シクロプロピル基、シクロブチル基、シクロペンチル基、シクロヘキシル基、シクロヘプチル基、シクロオクチル基、シクロオクタデシル基といったシクロアルキル基等が挙げられる。 Examples of the cyclic alkyl group represented by R include cycloalkyl groups such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group and cyclooctadecyl group.

Rで表されるアリール基としては、フェニル基、ベンジル基、トリル基、o-キシリル基等が挙げられる。 Examples of the aryl group represented by R include a phenyl group, a benzyl group, a tolyl group, an o-xylyl group and the like.

Rは、導電性粒子と絶縁性微粒子との密着性を高める点や、異方性導電膜の内部で熱圧着されたときに、絶縁性微粒子が導電性粒子から脱離して導通が確保されやすくなる点から、炭素原子数1以上12以下のアルキル基であることが好ましく、炭素原子数1以上10以下のアルキル基であることがより好ましく、炭素原子数1以上8以下のアルキル基であることが最も好ましい。また絶縁性微粒子が導電性粒子に近接し密着することが容易になる点から、Rが直鎖状アルキル基であることも好ましい。 R is a point that enhances the adhesion between the conductive particles and the insulating fine particles, and when the anisotropic conductive film is thermally pressure-bonded, the insulating fine particles are easily separated from the conductive particles to ensure continuity. From this point of view, it is preferably an alkyl group having 1 or more and 12 or less carbon atoms, more preferably an alkyl group having 1 or more and 10 or less carbon atoms, and an alkyl group having 1 or more and 8 or less carbon atoms. Is the most preferable. Further, it is also preferable that R is a linear alkyl group from the viewpoint that the insulating fine particles are close to the conductive particles and easily adhere to each other.

絶縁性微粒子の表面に荷電官能基を有させる手法としては、エチレン性不飽和結合を有する重合性化合物からなる重合性組成物の重合体によって絶縁性微粒子を構成する際に、該重合性組成物に、荷電官能基を有し且つエチレン性不飽和結合を有する重合性化合物を含ませることが好ましい。 As a method of having a charged functional group on the surface of the insulating fine particles, when the insulating fine particles are composed of a polymer of a polymerizable composition composed of a polymerizable compound having an ethylenically unsaturated bond, the polymerizable composition Preferably contains a polymerizable compound having a charged functional group and an ethylenically unsaturated bond.

重合性組成物を構成するエチレン性不飽和結合を有する重合性化合物としては、スチレン類、オレフィン類、エステル類、α,β不飽和カルボン酸類、アミド類、ニトリル類などが挙げられる。スチレン類としては、スチレン、o,m,p−メチルスチレン、ジメチルスチレン、エチルスチレン、クロロスチレン等の核置換スチレンやα−メチルスチレン、α−クロロスチレン、β−クロロスチレンなどのスチレン誘導体等が挙げられる。オレフィン類としては、エチレン、プロピレン等が挙げられる。エステル類としては、酢酸ビニル、プロピオン酸ビニル、ビニルベンゾエート等のビニルエステル、及び、(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸プロピル、(メタ)アクリル酸フェニル等の(メタ)アクリル酸のエステル等が挙げられる。α,β不飽和カルボン酸類としては、アクリル酸、メタクリル酸、イタコン酸、マレイン酸等が挙げられる。これらα,β不飽和カルボン酸の塩もα,β不飽和カルボン酸類に含まれる。アミド類としては、アクリルアミド、メタクリルアミド等が挙げられる。ニトリル類としては、アクリロニトリル等が挙げられる。これらは更に置換されていてもよく、置換基としては、ホスホニウム基、アミノ基、第4級アンモニウム基、アミド基、スルホニウム基、スルホン酸基、チオール基、カルボキシル基、リン酸基、シアノ基、アルデヒド基、エステル基、カルボニル基等が挙げられる。これらのモノマーは、1種または2種以上組み合わせて用いることができる。絶縁性微粒子を構成するポリマーとしては、とりわけ、スチレン類、エステル類及びニトリル類から選ばれる少なくとも1種の重合性単量体の重合体であることが、重合率が高い点、容易に球状にできる点で好ましい。絶縁性微粒子を構成するポリマーが、複数種の構成単位を有する場合、ポリマーにおけるそれらの構成単位の存在態様はランダムであっても交互であってもブロックであってもよい。絶縁性微粒子を構成するポリマーは架橋されていてもよく、非架橋であってもよい。絶縁性微粒子を構成するポリマーを架橋させる場合は架橋剤として、例えば、ジビニルベンゼン、ジビニルナフタレン等の芳香族ジビニル化合物;メタクリル酸アリル、トリアクリルホルマール、トリアリルイソシアネート、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、トリエチレングリコールジ(メタ)アクリレート、1,4−ブタンジオールジ(メタ)アクリレート、1,9−ノナンジオールジ(メタ)アクリレート、1,10−デカンジオールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、ネオペンチルグリコールジ(メタ)アクリレート、1,6−ヘキサンジオールジ(メタ)アクリレート、トリメチロールプロパントリメタクリレート、グリセリンジメタクリレート、ジメチロール−トリシクロデカンジアクリレート、ペンタエリスリトールトリ(メタ)アクリレート、ペンタエリスリトールテトラアクリレート、ジペンタエリスリトールヘキサアクリレート、ネオペンチルグリコールアクリル酸安息香酸エステル、トリメチロールプロパンアクリル酸安息香酸エステル、2−ヒドロキシ−3−アクリロイロキシプロピルメタクリレート、ヒドロキシピバリン酸ネオペンチルグリコールジアクリレート、ジトリメチロールプロパンテトラアクリレート、2−ブチル−2−エチル−1,3−プロパンジオールジアクリレート等のジ(メタ)アクリレート化合物を挙げることができる。 Examples of the polymerizable compound having an ethylenically unsaturated bond constituting the polymerizable composition include styrenes, olefins, esters, α and β unsaturated carboxylic acids, amides, and nitriles. Examples of styrenes include nuclear-substituted styrenes such as styrene, o, m, p-methylstyrene, dimethylstyrene, ethylstyrene and chlorostyrene, and styrene derivatives such as α-methylstyrene, α-chlorostyrene and β-chlorostyrene. Can be mentioned. Examples of olefins include ethylene and propylene. Examples of the esters include vinyl esters such as vinyl acetate, vinyl propionate and vinyl benzoate, and methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, phenyl (meth) acrylate and the like. Examples include esters of (meth) acrylic acid. Examples of α and β unsaturated carboxylic acids include acrylic acid, methacrylic acid, itaconic acid, maleic acid and the like. Salts of these α and β unsaturated carboxylic acids are also included in the α and β unsaturated carboxylic acids. Examples of amides include acrylamide and methacrylamide. Examples of nitriles include acrylonitrile. These may be further substituted, and examples of the substituent include a phosphonium group, an amino group, a quaternary ammonium group, an amide group, a sulfonium group, a sulfonic acid group, a thiol group, a carboxyl group, a phosphoric acid group and a cyano group. Examples thereof include an aldehyde group, an ester group and a carbonyl group. These monomers can be used alone or in combination of two or more. As the polymer constituting the insulating fine particles, in particular, a polymer of at least one polymerizable monomer selected from styrenes, esters and nitriles has a high polymerization rate and is easily spherical. It is preferable in that it can be done. When the polymer constituting the insulating fine particles has a plurality of types of structural units, the mode of existence of these structural units in the polymer may be random, alternate, or block. The polymer constituting the insulating fine particles may be crosslinked or non-crosslinked. When cross-linking the polymer constituting the insulating fine particles, as a cross-linking agent, for example, an aromatic divinyl compound such as divinylbenzene or divinylnaphthalene; allyl methacrylate, triacrylicformal, triallyl isocyanate, ethylene glycol di (meth) acrylate, Diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, 1,10-decanediol di (meth) Acrylate, polyethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, trimethyl propantrimethacrylate, glycerin dimethacrylate, dimethylol-tricyclodecanediacrylate, penta Elythritol tri (meth) acrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, neopentyl glycol acrylic acid benzoic acid ester, trimethylpropanacrylic acid benzoic acid ester, 2-hydroxy-3-acryloyloxypropyl methacrylate, hydroxypivalin Examples thereof include di (meth) acrylate compounds such as an acid neopentyl glycol diacrylate, ditrimethylolpropane tetraacrylate, and 2-butyl-2-ethyl-1,3-propanediol diacrylate.

荷電官能基を含み且つエチレン性不飽和結合を有する重合性化合物としては、例えばオニウム系の官能基を有するエチレン性不飽和結合を有する重合性化合物としてN,N−ジメチルアミノエチルメタクリレート、N,N−ジメチルアミノプロピルアクリルアミド、N,N,N−トリメチル−N−2−メタクリロイルオキシエチルアンモニウムクロライド等のアンモニウム基含有モノマー;メタクリル酸フェニルジメチルスルホニウムメチル硫酸塩等のスルホニウム基を有するモノマー;4−(ビニルベンジル)トリエチルホスホニウムクロライド、4−(ビニルベンジル)トリメチルホスホニウムクロライド、4−(ビニルベンジル)トリブチルホスホニウムクロライド、4−(ビニルベンジル)トリオクチルホスホニウムクロライド、4−(ビニルベンジル)トリフェニルホスホニウムクロライド、2−(メタクロイルオキシエチル)トリメチルホスホニウムクロライド、2−(メタクロイルオキシエチル)トリエチルホスホニウムクロライド、2−(メタクロイルオキシエチル)トリブチルホスホニウムクロライド、2−(メタクロイルオキシエチル)トリオクチルホスホニウムクロライド、2−(メタクロイルオキシエチル)トリフェニルホスホニウムクロライド等のホスホニウム基を有するモノマーなどが挙げられる。 Examples of the polymerizable compound containing a charged functional group and having an ethylenically unsaturated bond include N, N-dimethylaminoethyl methacrylate, N, N as a polymerizable compound having an ethylenically unsaturated bond having an onium-based functional group. -Ammonium group-containing monomer such as dimethylaminopropylacrylamide, N, N, N-trimethyl-N-2-methacryloyloxyethylammonium chloride; monomer having a sulfonium group such as phenyldimethylsulfonium methacrylate; 4- (vinyl) Benzyl) triethylphosphonium chloride, 4- (vinylbenzyl) trimethylphosphonium chloride, 4- (vinylbenzyl) tributylphosphonium chloride, 4- (vinylbenzyl) trioctylphosphonium chloride, 4- (vinylbenzyl) triphenylphosphonium chloride, 2- (Metacloyloxyethyl) trimethylphosphonium chloride, 2- (methacloyloxyethyl) triethylphosphonium chloride, 2- (methacloyloxyethyl) tributylphosphonium chloride, 2- (methacloyloxyethyl) trioctylphosphonium chloride, 2-( Examples thereof include a monomer having a phosphonium group such as metachlorooxyethyl) triphenylphosphonium chloride.

絶縁性微粒子が、荷電官能基を有しエチレン性不飽和結合を有する重合性化合物と、荷電官能基を有さずエチレン性不飽和結合を有する重合性化合物との共重合体である場合、荷電官能基を有する重合性化合物と荷電官能基を有さない重合性化合物とは同種であっても異なる種類であってもよい。ここでいう種類の例としては、前述したスチレン類、オレフィン類、エステル類、不飽和カルボン酸類、アミド類、ニトリル類が挙げられる。例えば荷電官能基を有しエチレン性不飽和結合を有する重合性化合物の少なくとも1種と荷電官能基を有さずエチレン性不飽和結合を有する重合性化合物の少なくとも1種とが同じ種類、例えばスチレン類であってもよい。 When the insulating fine particles are a copolymer of a polymerizable compound having a charged functional group and having an ethylenically unsaturated bond and a polymerizable compound having no charged functional group and having an ethylenically unsaturated bond, the insulating fine particles are charged. The polymerizable compound having a functional group and the polymerizable compound having no charged functional group may be of the same type or different types. Examples of the types referred to here include the above-mentioned styrenes, olefins, esters, unsaturated carboxylic acids, amides, and nitriles. For example, at least one polymerizable compound having a charged functional group and having an ethylenically unsaturated bond and at least one polymerizable compound having no charged functional group and having an ethylenically unsaturated bond are of the same type, for example, styrene. It may be a kind.

とりわけ、絶縁性微粒子を構成するポリマーは、下記一般式(2)又は一般式(3)で表される構成単位を有することがモノマーの入手容易性やポリマー合成の容易性の点から好ましい。式(2)及び式(3)中のRの例としては、一般式(1)中のRの例として上記で説明した通りである。荷電官能基は、式(2)のベンゼン環のCH基に対しパラ位、オルト位、メタ位の何れに結合していてもよく、パラ位に結合することが好ましい。式(2)及び式(3)中、一価のAnとしてはハロゲン化物イオンが好適に挙げられる。ハロゲン化物イオンの例としては、Cl-、F-、Br-、I-が挙げられる。In particular, it is preferable that the polymer constituting the insulating fine particles has a structural unit represented by the following general formula (2) or general formula (3) from the viewpoint of easy availability of the monomer and ease of polymer synthesis. Examples of R in the formulas (2) and (3) are as described above as examples of R in the general formula (1). The charged functional group may be bonded to any of the para-position, the ortho-position, and the meta-position with respect to the CH group of the benzene ring of the formula (2), and is preferably bonded to the para-position. In the formulas (2) and (3), a halide ion is preferably mentioned as the monovalent An . Examples of halide ions, Cl -, F -, Br -, I - , and the like.

(式中、X、R、nは一般式(1)と同義である。mは0〜5の整数である。Anは一価のアニオンを示す。) (In the formula, X, R, n are synonymous with the general formula (1). M is an integer of 0 to 5. An indicates a monovalent anion.)

(式中、X、R、nは一般式(1)と同義である。Anは一価のアニオンを示す。m1は1〜5の整数である。R5は、水素原子又はメチル基である。) (In the formula, X, R, n are synonymous with the general formula (1). An represents a monovalent anion. M 1 is an integer of 1 to 5. R 5 is a hydrogen atom or a methyl group. Is.)

絶縁性微粒子を構成するポリマーにおいて、全構成単位中、荷電官能基が結合した構成単位の割合は、0.01モル%以上5.0モル%以下であることが好ましく、0.02モル%以上2.0モル%以下であることがより好ましい。ここで、ポリマー中の構成単位の数は、1つのエチレン性不飽和結合に由来する構造を1の構成単位としてカウントする。 In the polymer constituting the insulating fine particles, the ratio of the structural unit to which the charged functional group is bonded is preferably 0.01 mol% or more and 5.0 mol% or less, and 0.02 mol% or more. More preferably, it is 2.0 mol% or less. Here, the number of structural units in the polymer counts the structure derived from one ethylenically unsaturated bond as one structural unit.

上記一般式(2)において、mは0〜2が好ましく、0又は1がより好ましく、1が特に好ましい。上記一般式(3)においてm1は1〜3が好ましく、1又は2がより好ましく、2が最も好ましい。In the above general formula (2), m is preferably 0 to 2, more preferably 0 or 1, and particularly preferably 1. In the above general formula (3), m 1 is preferably 1 to 3, more preferably 1 or 2, and most preferably 2.

絶縁性微粒子を構成するポリマーは、2種以上、更に好ましくは3種以上の構成単位を有するコポリマーであり、これら構成単位の少なくとも1種が構造中にエステル結合を有することが好ましい。これにより、ポリマーのガラス転移温度を好適に低いものとしやすく、絶縁性微粒子における導電性粒子と接触する面積の割合を高めて絶縁性微粒子と導電性粒子との密着性を高めることができるほか、絶縁性微粒子同士の結合度を高めることができ、被覆粒子間での絶縁性をより高いものとすることができる。 The polymer constituting the insulating fine particles is a copolymer having two or more kinds, more preferably three or more kinds of constitutional units, and it is preferable that at least one kind of these constitutional units has an ester bond in the structure. As a result, the glass transition temperature of the polymer can be easily lowered to a suitable level, the ratio of the area of the insulating fine particles in contact with the conductive particles can be increased, and the adhesion between the insulating fine particles and the conductive particles can be improved. The degree of bonding between the insulating fine particles can be increased, and the insulating property between the coated particles can be made higher.

構造中にエステル結合を有する構成単位としては、構造中にエチレン性不飽和結合及びエステル結合を併せ持つ重合性化合物に由来するものが挙げられる。そのような重合性化合物としては前記で挙げたエステル類、具体的には、プロピオン酸ビニル、ビニルベンゾエート等のビニルエステルや(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸プロピル、(メタ)アクリル酸ブチル、(メタ)アクリル酸ヘキシル、(メタ)アクリル酸フェニル等の(メタ)アクリル酸のエステル等が挙げられる。とりわけ構造中にエチレン性不飽和結合及びエステル結合を併せ持つ重合性化合物としては、その構造中に、−COOR1又は−OCOR2(R1及びR2はアルキル基)で表される基を有するものが好ましく、とりわけ、これらの基がH2C=CH*、又はH2C=C(CH3)*(*は、上記の−COOR1又は−OCOR2で表される基における結合手の結合先である)に結合した化合物が好ましい。R1及びR2としては、直鎖状又は分岐鎖状のアルキル基が好ましく、炭素原子数が1以上12以下であることが好ましく、2以上10以下であることがより好ましい。これらは1種又は2種以上を組み合わせて用いることができる。Examples of the structural unit having an ester bond in the structure include those derived from a polymerizable compound having both an ethylenically unsaturated bond and an ester bond in the structure. Examples of such polymerizable compounds include the esters listed above, specifically, vinyl esters such as vinyl propionate and vinyl benzoate, methyl (meth) acrylate, ethyl (meth) acrylate, and (meth) acrylic acid. Examples thereof include esters of (meth) acrylic acid such as propyl, butyl (meth) acrylate, hexyl (meth) acrylate, and phenyl (meth) acrylate. In particular, as a polymerizable compound having both an ethylenically unsaturated bond and an ester bond in its structure, a compound having a group represented by -COOR 1 or -OCOR 2 (R 1 and R 2 are alkyl groups) in its structure. In particular, these groups are H 2 C = CH * or H 2 C = C (CH 3 ) * (* is the bond of the bond in the group represented by -COOR 1 or -OCOR 2 above. The compound bound to) above is preferable. As R 1 and R 2 , a linear or branched alkyl group is preferable, the number of carbon atoms is preferably 1 or more and 12 or less, and more preferably 2 or more and 10 or less. These can be used alone or in combination of two or more.

絶縁性微粒子を構成するポリマーにおいて、全構成単位中、構造中にエステル結合を有する構成単位の割合は、絶縁性微粒子のガラス転移温度を好適な範囲とする観点や、重合反応進行時に生成した絶縁性微粒子が、熱によって溶融し反応容器の壁面に付着することなく取り出せる観点から0.1モル%以上30モル%以下であることが好ましく、1モル%以上25モル%以下であることがより好ましい。ここでいう構造中にエステル結合を有する構成単位の好ましい例は、例えば以下の一般式(4)で表される。 In the polymer constituting the insulating fine particles, the ratio of the structural units having an ester bond in the structure to the total structural units is from the viewpoint of setting the glass transition temperature of the insulating fine particles in a suitable range and the insulation generated during the polymerization reaction. From the viewpoint that the sex fine particles can be taken out without being melted by heat and adhering to the wall surface of the reaction vessel, it is preferably 0.1 mol% or more and 30 mol% or less, and more preferably 1 mol% or more and 25 mol% or less. .. A preferable example of the structural unit having an ester bond in the structure referred to here is represented by, for example, the following general formula (4).

(式中、R3は水素原子又はメチル基を表す。R4は−COOR1又は−OCOR2で表される基である。) (In the formula, R 3 represents a hydrogen atom or a methyl group. R 4 is a group represented by -COOR 1 or -OCOR 2. )

絶縁性微粒子のガラス転移温度は、導電性粒子の芯材のガラス転移温度よりも低いことが好ましい。このように構成することで、絶縁性微粒子における導電性粒子と接触する面積の割合、及び絶縁性微粒子同士の付着性を容易に高めることができる。 The glass transition temperature of the insulating fine particles is preferably lower than the glass transition temperature of the core material of the conductive particles. With such a configuration, the ratio of the area of the insulating fine particles in contact with the conductive particles and the adhesiveness between the insulating fine particles can be easily increased.

より具体的には、絶縁性微粒子のガラス転移温度は、100℃以下であることが好ましく、95℃以下であることがより好ましく、90℃以下であることが特に好ましい。
また絶縁性微粒子のガラス転移温度は、40℃以上であることが、被覆粒子の保存時等の形状安定性や絶縁性微粒子の合成の容易性の点から好ましく、45℃以上であることがより好ましく、50℃以上であることが特に好ましい。ガラス転移温度は、後述する実施例に記載の方法で測定できる。
More specifically, the glass transition temperature of the insulating fine particles is preferably 100 ° C. or lower, more preferably 95 ° C. or lower, and particularly preferably 90 ° C. or lower.
Further, the glass transition temperature of the insulating fine particles is preferably 40 ° C. or higher, preferably 45 ° C. or higher from the viewpoint of shape stability of the coated particles during storage and the ease of synthesizing the insulating fine particles. It is preferable, and it is particularly preferable that the temperature is 50 ° C. or higher. The glass transition temperature can be measured by the method described in Examples described later.

前記と同様の点から芯材がガラス転移温度を有する場合、絶縁性微粒子のガラス転移温度と導電性粒子の芯材のガラス転移温度との差は、160℃以下であることが好ましく、120℃以下であることがより好ましく、100℃以下であることが特に好ましい。絶縁性微粒子のガラス転移温度と導電性粒子の芯材のガラス転移温度との差は、5℃以上であることが好ましく、10℃以上であることがより好ましい。 From the same point as above, when the core material has a glass transition temperature, the difference between the glass transition temperature of the insulating fine particles and the glass transition temperature of the core material of the conductive particles is preferably 160 ° C. or less, preferably 120 ° C. The temperature is more preferably 100 ° C. or lower, and particularly preferably 100 ° C. or lower. The difference between the glass transition temperature of the insulating fine particles and the glass transition temperature of the core material of the conductive particles is preferably 5 ° C. or higher, and more preferably 10 ° C. or higher.

ガラス転移温度の測定方法は、例えば以下の方法が挙げられる。
示差走査熱量計「STAR SYSTEM」(METTLER TOLEDO社製)を用いて、試料0.04〜0.06gを、200℃まで昇温し、その温度から降温速度5℃/minで25℃まで冷却した。次いで試料を昇温速度5℃/minで昇温し、熱量を測定した。ピークが観測されるときはそのピークの温度を、ピークが観測されずに段差が観測されるときは該段差部分の曲線の最大傾斜を示す接線と該段差の高温側のベースラインの延長線との交点の温度をガラス転移温度とした。
Examples of the method for measuring the glass transition temperature include the following methods.
Using a differential scanning calorimeter "STAR SYSTEM" (manufactured by METTLER TOLEDO), 0.04 to 0.06 g of the sample was heated to 200 ° C. and cooled from that temperature to 25 ° C. at a temperature lowering rate of 5 ° C./min. .. Next, the temperature of the sample was raised at a heating rate of 5 ° C./min, and the amount of heat was measured. When a peak is observed, the temperature of the peak is used, and when a step is observed without a peak, a tangent line indicating the maximum slope of the curve of the step portion and an extension of the baseline on the high temperature side of the step are used. The temperature at the intersection of was taken as the glass transition temperature.

絶縁性微粒子の平均粒子径(D)は、好ましくは10nm以上3,000nm以下、より好ましくは15nm以上2,000nm以下である。絶縁性微粒子の平均粒子径が上記範囲内であることで、得られる被覆粒子が対向電極間とは異なる方向での短絡を発生させることなく、対向電極間での導通を確保しやすい。なお、本発明において、絶縁性微粒子の平均粒子径は、走査型電子顕微鏡を用いた観察において測定した値であり、具体的には後述する実施例に記載の方法にて測定される。 The average particle size (D) of the insulating fine particles is preferably 10 nm or more and 3,000 nm or less, and more preferably 15 nm or more and 2,000 nm or less. When the average particle size of the insulating fine particles is within the above range, it is easy to ensure continuity between the counter electrodes without causing a short circuit in the obtained coated particles in a direction different from that between the counter electrodes. In the present invention, the average particle size of the insulating fine particles is a value measured by observation using a scanning electron microscope, and specifically, it is measured by the method described in Examples described later.

前述の方法によって測定された絶縁性微粒子の粒度分布には幅がある。一般に、粉体の粒度分布の幅は、下記計算式(1)で示される変動係数(Coefficient of Variation、以下「C.V.」とも記載する)により表される。
C.V.(%)=(標準偏差/平均粒子径)×100・・・(1)
このC.V.が大きいということは粒度分布に幅があることを示し、一方、C.V.が小さいということは粒度分布がシャープであることを示す。本実施形態の被覆粒子は、C.V.が好ましくは0.1%以上20%以下、より好ましくは0.5%以上15%以下、最も好ましくは1%以上10%以下の絶縁性微粒子を用いることが望ましい。C.V.がこの範囲であることにより、絶縁性微粒子による被覆層の厚みを均一にできる利点がある。
The particle size distribution of the insulating fine particles measured by the above method varies. Generally, the width of the particle size distribution of the powder is represented by the coefficient of variation (hereinafter, also referred to as “CV”) represented by the following formula (1).
C. V. (%) = (Standard deviation / average particle size) x 100 ... (1)
This C.I. V. Larger indicates that the particle size distribution has a range, while C.I. V. A small value indicates that the particle size distribution is sharp. The coated particles of the present embodiment are C.I. V. It is preferable to use insulating fine particles of 0.1% or more and 20% or less, more preferably 0.5% or more and 15% or less, and most preferably 1% or more and 10% or less. C. V. However, there is an advantage that the thickness of the coating layer made of the insulating fine particles can be made uniform.

また、絶縁層としては、前記の絶縁性微粒子からなるものに替えて、ポリマーからなり荷電官能基を有する連続皮膜であってもよい。絶縁層が、荷電官能基を有する化合物を含む連続皮膜である場合、該被覆粒子を電極間で熱圧着することで該連続皮膜が溶融、変形又は剥離することにより導電性粒子の金属表面が露出し、これにより電極間での導通を可能とし接続性が得られる。特に、被覆粒子を電極間で熱圧着することで連続皮膜が破けることにより金属表面が露出する場合が多い。一方、被覆粒子における熱圧着方向とは異なる方向を向く表面部分では、連続皮膜による導電性粒子の被覆状態が概ね維持されているため、熱圧着方向以外の方向における導通が防止される。絶縁性皮膜も荷電官能基を表面に有することが好ましい。 Further, the insulating layer may be a continuous film made of a polymer and having a charged functional group instead of the above-mentioned insulating fine particles. When the insulating layer is a continuous film containing a compound having a charged functional group, the metal surface of the conductive particles is exposed by thermocompression bonding the coating particles between the electrodes to melt, deform or peel the continuous film. This allows conduction between the electrodes and provides connectivity. In particular, the metal surface is often exposed by tearing the continuous film by thermocompression bonding the coated particles between the electrodes. On the other hand, in the surface portion of the coated particles facing a direction different from the thermocompression bonding direction, the coating state of the conductive particles by the continuous coating is generally maintained, so that conduction in a direction other than the thermocompression bonding direction is prevented. The insulating film also preferably has a charged functional group on its surface.

絶縁層が連続皮膜からなる場合であっても荷電官能基を有することにより、絶縁性の連続皮膜が、チタン系化合物を表面に有する導電性粒子に密着しやすい。また後述するように連続皮膜が絶縁性微粒子を加熱してなるか、或いは導電性粒子を被覆した絶縁性微粒子を有機溶剤で溶解させたものである場合、絶縁層の前駆体となる絶縁性微粒子を均一に配列することができるため、絶縁性微粒子の溶融又は溶解によって得られる被膜の膜厚を均一にできる効果がある。これらの理由によって絶縁層が連続皮膜からなる場合であってもチタン系化合物と荷電官能基を有することにより、対向電極間と異なる方向における短絡防止効果が発揮されやすく、当該方向での絶縁性が向上し、接続信頼性が高いものとなる。絶縁層が荷電官能基を有する化合物を含む連続皮膜である場合、該皮膜は導電性粒子の表面全体を被覆するものであってもよく、表面の一部を被覆するものであってもよい。また連続皮膜の表面は平坦であってもよく、絶縁性微粒子を溶融又は溶解してなることに由来する凹凸を表面に有していてもよい。 Even when the insulating layer is composed of a continuous film, the insulating continuous film easily adheres to the conductive particles having a titanium-based compound on the surface because it has a charged functional group. Further, as described later, when the continuous film is formed by heating the insulating fine particles or the insulating fine particles coated with the conductive particles are dissolved in an organic solvent, the insulating fine particles which are precursors of the insulating layer Can be uniformly arranged, so that there is an effect that the film thickness obtained by melting or dissolving the insulating fine particles can be made uniform. For these reasons, even when the insulating layer is composed of a continuous film, by having a titanium compound and a charged functional group, it is easy to exert a short-circuit prevention effect in a direction different from that between the counter electrodes, and the insulating property in that direction is improved. It will be improved and the connection reliability will be high. When the insulating layer is a continuous film containing a compound having a charged functional group, the film may cover the entire surface of the conductive particles, or may cover a part of the surface. Further, the surface of the continuous film may be flat, or may have irregularities on the surface resulting from melting or dissolving insulating fine particles.

連続皮膜の厚さは、10nm以上であることが、対向電極間と異なる方向における絶縁性の向上の点から好ましく、3,000nm以下であることが、対向電極間での導通しやすさの点で好ましい。この点から、連続皮膜の厚さは、10nm以上3,000nm以下であることが好ましく、15nm以上2,000nm以下であることがより好ましい。 The thickness of the continuous film is preferably 10 nm or more from the viewpoint of improving the insulating property in a direction different from that between the counter electrodes, and 3,000 nm or less is preferable from the viewpoint of ease of conduction between the counter electrodes. Is preferable. From this point of view, the thickness of the continuous film is preferably 10 nm or more and 3,000 nm or less, and more preferably 15 nm or more and 2,000 nm or less.

絶縁性微粒子と同様、連続皮膜において荷電官能基は、連続皮膜を構成する物質の一部として、該物質の化学構造の一部をなしていることが好ましい。連続皮膜において荷電官能基は、連続皮膜を構成するポリマーの構成単位の少なくとも1種の構造中に含有されていることが好ましい。荷電官能基は、連続皮膜を構成するポリマーに化学結合していることが好ましく、より好ましくはポリマーの側鎖に結合している。
連続皮膜が有する荷電官能基としては上記絶縁性微粒子が有する荷電官能基と同様のものが挙げられる。
また連続皮膜を構成するポリマーの構成単位及びその組成の例としては上述した絶縁性微粒子を構成するポリマーの構成単位及びその組成の例として上記で挙げたものと同様のものが挙げられ、上記の構成単位の好ましい比率範囲は、全て連続皮膜についても当てはまる。連続皮膜のガラス転移温度としては、上述した絶縁性微粒子のガラス転移温度と同様のものが挙げられる。連続皮膜のガラス転移温度と芯材粒子のガラス転移温度との関係としては、上述した絶縁性微粒子のガラス転移温度と芯材粒子のガラス転移温度との関係と、同様の関係が挙げられる。
Like the insulating fine particles, the charged functional group in the continuous film preferably forms a part of the chemical structure of the substance as a part of the substance constituting the continuous film. In the continuous film, the charged functional group is preferably contained in at least one structure of the structural unit of the polymer constituting the continuous film. The charged functional group is preferably chemically bonded to the polymer constituting the continuous film, and more preferably bonded to the side chain of the polymer.
Examples of the charged functional group of the continuous film include the same as the charged functional group of the insulating fine particles.
Further, as an example of the structural unit of the polymer constituting the continuous film and its composition, the same as the above-mentioned structural unit of the polymer constituting the insulating fine particles and the composition thereof can be mentioned. The preferred range of ratios for the building blocks also applies to all continuous films. Examples of the glass transition temperature of the continuous film include those similar to the glass transition temperature of the insulating fine particles described above. Examples of the relationship between the glass transition temperature of the continuous film and the glass transition temperature of the core material particles include the same relationship as the relationship between the glass transition temperature of the insulating fine particles and the glass transition temperature of the core material particles described above.

絶縁層が連続皮膜である場合、導電性粒子を、その表面に荷電官能基を有する絶縁性微粒子で被覆した後、該絶縁性微粒子を加熱させて得られた連続皮膜であることが好ましい。この場合、上述したように、導電性粒子に対し絶縁性微粒子が、導電性粒子に密着しやすく、これによって導電性粒子表面における絶縁性微粒子に被覆される割合が十分なものになるとともに導電性粒子からの絶縁性微粒子の剥離が防止されやすい。また、上述したように、荷電官能基を有する絶縁性微粒子は、単層で導電性粒子を被覆しやすい。これらの理由から、導電性粒子を被覆する絶縁性微粒子を加熱して得られた連続皮膜を、厚みが均一で且つ導電性粒子表面における被覆割合の高いものとすることができる。 When the insulating layer is a continuous film, it is preferable that the conductive particles are coated with insulating fine particles having a charged functional group on the surface thereof, and then the insulating fine particles are heated to obtain a continuous film. In this case, as described above, the insulating fine particles easily adhere to the conductive particles with respect to the conductive particles, whereby the ratio of the insulating fine particles covered with the insulating fine particles on the surface of the conductive particles becomes sufficient and the conductive particles are conductive. It is easy to prevent the insulating fine particles from peeling off from the particles. Further, as described above, the insulating fine particles having a charged functional group easily cover the conductive particles with a single layer. For these reasons, the continuous film obtained by heating the insulating fine particles that coat the conductive particles can have a uniform thickness and a high coating ratio on the surface of the conductive particles.

なお、本来ならば、特定の絶縁性微粒子に加熱処理を施すことにより得られる連続皮膜の構造や特性については全て、何らかの手段を用いて測定した上で、本願明細書において直接明記することが望ましい。
しかしながら、少なくとも出願時においては、出願人の技術レベルでは本発明の効果と関係するその他の連続皮膜の構造又は特性を確認することができなかった。
また仮に全ての要因を突き止めたとしても、それら要因に係る連続皮膜の構造や特性を、新たな測定方法を確立して特定する必要があり、そのためには、著しく過大な経済的支出及び時間を要する。
以上の事情より、特許出願の性質上、迅速性等を必要とすることに鑑みて、出願人は、連続皮膜の好ましい特徴の一つとして、上記の製造方法にて製造されるものであることを記載した。
Originally, it is desirable that all the structures and properties of the continuous coating obtained by heat-treating specific insulating fine particles are measured by some means and then directly specified in the present specification. ..
However, at least at the time of filing, the structure or properties of other continuous coatings related to the effects of the present invention could not be confirmed at the technical level of the applicant.
Even if all the factors are identified, it is necessary to establish a new measurement method to identify the structure and characteristics of the continuous coating related to those factors, which requires extremely excessive economic expenditure and time. It takes.
From the above circumstances, in view of the fact that the nature of the patent application requires quickness, etc., the applicant shall be manufactured by the above-mentioned manufacturing method as one of the preferable features of the continuous coating. Was described.

次いで本実施形態の被覆粒子の好適な製造方法について説明する。
本製造方法は、荷電官能基を有する重合性化合物を含む重合性組成物を重合させて、表面に荷電官能基を有する絶縁性微粒子を得る第1工程、
導電性粒子の表面にチタン系化合物を有させる第2工程、
絶縁性微粒子を含む分散液と、表面にチタン系化合物を有する導電性粒子とを混合して、導電性粒子表面に絶縁性微粒子を付着させる第3工程、とを有する。
第1工程及び第2工程は、何れを先に行ってもよく、同時に行ってもよい。
Next, a suitable method for producing the coated particles of the present embodiment will be described.
The first step of the present production method is to polymerize a polymerizable composition containing a polymerizable compound having a charged functional group to obtain insulating fine particles having a charged functional group on the surface.
The second step of having a titanium compound on the surface of the conductive particles,
It has a third step of mixing a dispersion liquid containing insulating fine particles and conductive particles having a titanium-based compound on the surface to attach the insulating fine particles to the surface of the conductive particles.
Either of the first step and the second step may be performed first, or may be performed at the same time.

(第1工程)
上記重合性組成物は、2種以上の重合性化合物からなるものであり、少なくとも1種が荷電官能基を含むものが挙げられる。重合性化合物としては、上述した絶縁性微粒子を構成するポリマーの構成単位となるエチレン性不飽和結合を有する重合性化合物が挙げられる。また、好ましい重合性化合物やその構成比としては、上述した、絶縁性微粒子を構成するポリマーの好ましい構成単位やその好ましい量比を与えるものが挙げられる。
(First step)
The above-mentioned polymerizable composition is composed of two or more kinds of polymerizable compounds, and examples thereof include those in which at least one kind contains a charged functional group. Examples of the polymerizable compound include a polymerizable compound having an ethylenically unsaturated bond, which is a constituent unit of the polymer constituting the above-mentioned insulating fine particles. In addition, examples of the preferable polymerizable compound and its composition ratio include those that give a preferable composition unit of the polymer constituting the insulating fine particles and a preferable amount ratio thereof.

重合方法としては、乳化重合、ソープフリー乳化重合、分散重合、懸濁重合等が挙げられ、何れであってもよいが、ソープフリー乳化重合であると、単分散な微粒子を、界面活性剤を使用せずに製造できる利点があることから好ましい。ソープフリー乳化重合の場合、重合開始剤としては、水溶性開始剤が用いられる。重合は窒素やアルゴン等の不活性雰囲気下で行うことが好ましい。
以上により、表面に荷電官能基を有する絶縁性微粒子が得られる。
Examples of the polymerization method include emulsion polymerization, soap-free emulsion polymerization, dispersion polymerization, suspension polymerization and the like, and any of them may be used. However, in the case of soap-free emulsion polymerization, monodisperse fine particles are used and a surfactant is used. It is preferable because it has the advantage that it can be manufactured without using it. In the case of soap-free emulsion polymerization, a water-soluble initiator is used as the polymerization initiator. The polymerization is preferably carried out in an inert atmosphere such as nitrogen or argon.
As described above, insulating fine particles having a charged functional group on the surface can be obtained.

(第2工程)
チタン系化合物を表面に有する導電性粒子は、溶媒中でチタン系化合物と混合させた後に、ろ過することで得られる。表面処理に用いるチタン系化合物としては、上述した疎水性基を有するものが挙げられ、上述する一般式(I)で表される構造を有するものが好ましく挙げられる。一般式(I)で表される構造を有する化合物としては、一般式(I’)で表される化合物が好ましく挙げられる。チタン系化合物による処理前において、導電性粒子は別の有機剤で処理されていてもよく、未処理であってもよい。
(Second step)
Conductive particles having a titanium-based compound on the surface can be obtained by mixing with the titanium-based compound in a solvent and then filtering. Examples of the titanium-based compound used for the surface treatment include those having the above-mentioned hydrophobic group, and preferably those having the above-mentioned structure represented by the general formula (I). As the compound having the structure represented by the general formula (I), the compound represented by the general formula (I') is preferably mentioned. Before the treatment with the titanium-based compound, the conductive particles may be treated with another organic agent or may not be treated.

(R12、R13、p、q及びrは上記一般式(I)と同義である。R11は炭化水素基である。pが2以上である場合、複数のR11は同一であっても異なってもよく、また2つのR11は互いに結合していてもよく、R11で表される基中のメチレン基は−O−、−COO−又は−OCO−で置換されていてもよい。) (R 12 , R 13 , p, q and r are synonymous with the above general formula (I). R 11 is a hydrocarbon group. When p is 2 or more, a plurality of R 11 are the same. may be different, also the two R 11 may be bonded to each other, a methylene group in the group represented by R 11 is -O -, - COO- or may be substituted with -OCO- .)

一般式(I’)において、R11で表される炭化水素基としては炭素原子数1以上12以下のアルキル基が挙げられる。pが2以上である場合、2つのR11が互いに結合した連結基としては−(CH2W−で表される基(wは2以上12以下の整数)が挙げられる。これらR11で表される基中のメチレン基は、酸素原子同士が連続しない条件で、−O−、−COO−、−OCO−により1回又は2回以上置き換えられていてもよい。R11で表される炭素原子数1以上12以下のアルキル基としては、メチル基、エチル基、n−プロピル基、i−プロピル基、n−ブチル基、sec−ブチル基、tert−ブチル基などが挙げられる。In the general formula (I'), examples of the hydrocarbon group represented by R 11 include an alkyl group having 1 to 12 carbon atoms. When p is 2 or more, the linking group in which the two R 11s are bonded to each other includes a group represented by − (CH 2 ) W − (w is an integer of 2 or more and 12 or less). The methylene group in the group represented by R 11 may be replaced once or twice or more by -O-, -COO-, and -OCO- under the condition that the oxygen atoms are not continuous. Examples of the alkyl group represented by R 11 having 1 or more and 12 or less carbon atoms include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, a sec-butyl group, and a tert-butyl group. Can be mentioned.

導電性粒子とチタン系化合物とを混合させる溶媒としては、水や有機溶媒が挙げられる。有機溶媒としては、トルエン、メタノール、エタノール、アセトン、メチルエチルケトン、テトラヒドロフラン、アセトニトリル、N−メチルピロリドン、ジメチルホルムアミド等が挙げられる。溶媒に導電性粒子とチタン系化合物とを投入した分散液において、チタン系化合物の濃度としては、0.1質量%以上20質量%以下が挙げられる。またこの分散液における導電性粒子の濃度としては1質量%以上50質量%以下が挙げられる。処理後の分散液をろ過することで表面にチタン系化合物を有する導電性粒子が得られる。 Examples of the solvent for mixing the conductive particles and the titanium-based compound include water and an organic solvent. Examples of the organic solvent include toluene, methanol, ethanol, acetone, methyl ethyl ketone, tetrahydrofuran, acetonitrile, N-methylpyrrolidone, dimethylformamide and the like. In the dispersion liquid in which the conductive particles and the titanium-based compound are added to the solvent, the concentration of the titanium-based compound is 0.1% by mass or more and 20% by mass or less. The concentration of the conductive particles in this dispersion is 1% by mass or more and 50% by mass or less. By filtering the dispersion liquid after the treatment, conductive particles having a titanium-based compound on the surface can be obtained.

チタン系化合物により表面処理する場合には、室温で導電性粒子とチタン系化合物と溶媒を混合することにより処理することができる。あるいは、導電性粒子とチタン系化合物を溶媒中で混合後、加熱して加水分解を促進してもよい。加熱温度は例えば30℃以上50℃以下が挙げられる。 When the surface is treated with a titanium-based compound, the treatment can be performed by mixing conductive particles, a titanium-based compound, and a solvent at room temperature. Alternatively, the conductive particles and the titanium-based compound may be mixed in a solvent and then heated to promote hydrolysis. The heating temperature is, for example, 30 ° C. or higher and 50 ° C. or lower.

(第3工程)
次いで、絶縁性微粒子を含む分散液と表面にチタン系化合物を有する導電性粒子とを混合して、導電性粒子表面に絶縁性微粒子を付着させる。
分散液の液媒としては、水及び有機溶媒並びにその混合物が挙げられ、水、エタノール、又はエタノールと水との混合液が好ましい。
(Third step)
Next, the dispersion liquid containing the insulating fine particles and the conductive particles having a titanium-based compound on the surface are mixed to attach the insulating fine particles to the surface of the conductive particles.
Examples of the liquid medium of the dispersion liquid include water, an organic solvent, and a mixture thereof, and water, ethanol, or a mixed liquid of ethanol and water is preferable.

分散液は無機塩、有機塩又は有機酸を含有することが、被覆率が一定以上の被覆粒子を得やすい点から好ましい。無機塩、有機塩又は有機酸としては、陰イオンを解離するものが好適に用いられ、この陰イオンとしては、Cl-、F-、Br-、I-、SO4 2-、CO3 2-、NO3 -、COO-、RCOO-(Rは有機基)等が好適である。無機塩としては、例えばNaCl、KCl、LiCl、MgCl2、BaCl2、NaF、KF、LiF、MgF2、BaF2、NaBr、KBr、LiBr、MgBr2、BaBr2、NaI、KI、LiI、MgI2、BaI2、Na2SO4、K2SO4、Li2SO4、MgSO4、Na2CO3、NaHCO3、K2CO3、KHCO3、Li2CO3、LiHCO3、MgCO3、NaNO3、KNO3、LiNO3、MgNO3、BaNO3等を用いることができる。また有機塩としては、シュウ酸Na、酢酸Na、クエン酸Na、酒石酸Na等を用いることができる。有機酸としてはグリシン等のアミノ酸や、コハク酸、シュウ酸、酢酸、クエン酸、酒石酸、マロン酸、フマル酸、マレイン酸等を用いることができる。It is preferable that the dispersion liquid contains an inorganic salt, an organic salt or an organic acid from the viewpoint that it is easy to obtain coated particles having a coverage rate of a certain level or higher. Inorganic salts, the organic salts or organic acid, is preferably used which dissociate anion, as the anion, Cl -, F -, Br -, I -, SO 4 2-, CO 3 2- , NO 3 -, COO -, RCOO - (R is an organic group) is preferred, and the like. As the inorganic salt, for example NaCl, KCl, LiCl, MgCl 2 , BaCl 2, NaF, KF, LiF, MgF 2, BaF 2, NaBr, KBr, LiBr, MgBr 2, BaBr 2, NaI, KI, LiI, MgI 2 , BaI 2 , Na 2 SO 4 , K 2 SO 4 , Li 2 SO 4 , 0054 4 , Na 2 CO 3 , NaHCO 3 , K 2 CO 3 , KHCO 3 , Li 2 CO 3 , LiHCO 3 , MgCO 3 , NaNO 3 , KNO 3 , LiNO 3 , MgNO 3 , BaNO 3, etc. can be used. As the organic salt, Na oxalate, Na acetate, Na citrate, Na tartrate and the like can be used. As the organic acid, amino acids such as glycine, succinic acid, oxalic acid, acetic acid, citric acid, tartaric acid, malonic acid, fumaric acid, maleic acid and the like can be used.

好ましい無機塩、有機塩及び有機酸の濃度は、導電性粒子表面積において絶縁性微粒子が占める被覆面積としてどの程度とするかにより異なるが、導電性粒子混合後の分散液中において、例えば、0.1mmol/L以上100mmol/L以下となる濃度であると、好適な被覆率を有し、また絶縁性微粒子が単層である被覆粒子を得やすいために好ましい。この観点から、当該分散液中の無機塩、有機塩及び有機酸の濃度は1.0mmol/L以上80mmol/L以下であることが特に好ましい。 The preferable concentrations of the inorganic salt, the organic salt and the organic acid vary depending on how much the insulating fine particles occupy the covering area in the surface area of the conductive particles, and are described in, for example, in the dispersion liquid after mixing the conductive particles. A concentration of 1 mmol / L or more and 100 mmol / L or less is preferable because it has a suitable coating ratio and it is easy to obtain coated particles having a single layer of insulating fine particles. From this viewpoint, the concentration of the inorganic salt, the organic salt and the organic acid in the dispersion is particularly preferably 1.0 mmol / L or more and 80 mmol / L or less.

絶縁性微粒子及び導電性粒子を液媒中で混合させるにあたっては、絶縁性微粒子を含む分散液と導電性粒子とを混合してもよく、導電性粒子を含む分散液と絶縁性微粒子とを混合してもよく、或いは、液媒に絶縁性微粒子及び導電性粒子をそれぞれ投入してもよく、絶縁性微粒子を含む分散媒と導電性粒子を含む分散媒とを混合してもよい。導電性粒子と絶縁性微粒子とを含む分散液中に、導電性粒子は質量基準で100ppm以上100,000ppm以下含有されていることが好ましく、500ppm以上80,000ppm以下含有されていることがより好ましい。
導電性粒子と絶縁性微粒子とを含む分散液中に、絶縁性微粒子は質量基準で10ppm以上50,000ppm以下含有されていることが好ましく、250ppm以上30,000以下含有されていることがより好ましい。
When mixing the insulating fine particles and the conductive particles in the liquid medium, the dispersion liquid containing the insulating fine particles and the conductive particles may be mixed, or the dispersion liquid containing the conductive particles and the insulating fine particles are mixed. Alternatively, the insulating fine particles and the conductive particles may be charged into the liquid medium, respectively, or the dispersion medium containing the insulating fine particles and the dispersion medium containing the conductive particles may be mixed. The dispersion liquid containing the conductive particles and the insulating fine particles preferably contains 100 ppm or more and 100,000 ppm or less of the conductive particles on a mass basis, and more preferably 500 ppm or more and 80,000 ppm or less. ..
In the dispersion liquid containing the conductive particles and the insulating fine particles, the insulating fine particles are preferably contained at 10 ppm or more and 50,000 ppm or less, more preferably 250 ppm or more and 30,000 ppm or less on a mass basis. ..

導電性粒子と混合する時点における分散液の温度は、一般に、20℃以上100℃以下であることが、品質が一定な被覆粒子が得やすい点から好ましく、40℃以上であることが特に好ましい。特に絶縁性微粒子のガラス転移温度をTg℃としたときに、分散液の温度は、Tg−30℃以上Tg+30℃以下であることが好ましい。この範囲であると、絶縁性微粒子がその形状を維持しながら導電性粒子に密着し、絶縁性微粒子と導電性粒子との間に好適な接触面積を得やすいため好ましい。尤も、本発明の荷電官能基を有する絶縁性微粒子は、導電性粒子との親和性が高いため、上記温度の範囲内であれば十分に被覆することが可能である。 The temperature of the dispersion liquid at the time of mixing with the conductive particles is generally preferably 20 ° C. or higher and 100 ° C. or lower, from the viewpoint that coated particles having constant quality can be easily obtained, and particularly preferably 40 ° C. or higher. In particular, when the glass transition temperature of the insulating fine particles is Tg ° C., the temperature of the dispersion is preferably Tg-30 ° C. or higher and Tg + 30 ° C. or lower. Within this range, the insulating fine particles adhere to the conductive particles while maintaining their shape, and it is easy to obtain a suitable contact area between the insulating fine particles and the conductive particles, which is preferable. However, since the insulating fine particles having the charged functional group of the present invention have a high affinity with the conductive particles, they can be sufficiently coated within the above temperature range.

導電性粒子混合後の分散液において、絶縁性微粒子の導電性粒子への付着に供する時間は、好ましくは0.1時間以上24時間以下である。この間、分散液を撹拌することが好ましい。次いで、分散液の固形分を必要に応じ、洗浄、乾燥し、荷電官能基を有する絶縁性微粒子が導電性粒子表面に付着した被覆粒子が得られる。 In the dispersion liquid after mixing the conductive particles, the time for adhering the insulating fine particles to the conductive particles is preferably 0.1 hour or more and 24 hours or less. During this time, it is preferable to stir the dispersion. Then, the solid content of the dispersion liquid is washed and dried as necessary to obtain coated particles in which insulating fine particles having a charged functional group are attached to the surface of the conductive particles.

上述したように、絶縁性微粒子が導電性粒子表面に付着した被覆粒子を加熱することにより、絶縁性微粒子を溶融状態として、導電性粒子表面を膜状に被覆することができる。絶縁性微粒子を膜状にすることにより、絶縁性がより強固なものとなる。加熱する方法としては、絶縁性微粒子を導電性粒子表面に付着させた後の分散液を加温する方法、被覆粒子を水などの溶媒中で加温する方法、被覆粒子を不活性ガスなどの気相中で加温する方法等が挙げられる。加熱温度としては、絶縁性微粒子が脱落することなく均一な膜状を形成しやすい点から、絶縁性微粒子を構成するポリマーのガラス転移温度をTgとしたときにTg+1℃以上Tg+60℃以下が好ましく、Tg+5℃以上Tg+50℃以下がより好ましく、Tg+15℃超であることが最も好ましい。加熱時間としては、均一な膜状を形成しやすい点から、0.1時間以上24時間以下であることが好ましい。また、被覆粒子を気相中で加温する場合、その圧力条件は大気圧下、減圧下又は加圧下で行うことができる。 As described above, by heating the coated particles in which the insulating fine particles are attached to the surface of the conductive particles, the surface of the conductive particles can be coated in a film shape with the insulating fine particles in a molten state. By forming the insulating fine particles into a film, the insulating property becomes stronger. Examples of the heating method include a method of heating the dispersion liquid after adhering insulating fine particles to the surface of conductive particles, a method of heating the coated particles in a solvent such as water, and a method of heating the coated particles in an inert gas. Examples include a method of heating in the gas phase. The heating temperature is Tg + 1 ° C. or higher and Tg + 60 ° C. when the glass transition temperature of the polymer constituting the insulating fine particles is Tg because it is easy to form a uniform film without the insulating fine particles falling off. The following is preferable, Tg + 5 ° C. or higher and Tg + 50 ° C. or lower are more preferable, and Tg + 15 ° C. or higher is most preferable. The heating time is preferably 0.1 hour or more and 24 hours or less from the viewpoint that a uniform film shape can be easily formed. Further, when the coated particles are heated in the gas phase, the pressure condition can be under atmospheric pressure, reduced pressure or pressurized.

また、絶縁性微粒子が導電性粒子表面に付着した被覆粒子は、その分散液に有機溶剤を添加することによっても、絶縁性微粒子を流動状態にすることができるため、導電性粒子表面を膜状に被覆することができる。絶縁性微粒子を溶解させる場合、この有機溶剤としてはテトラヒドロフラン、トルエン、メチルエチルケトン、N−メチル−2−ピロリドン及びN,N−ジメチルホルムアミド等を用いることができる。有機溶剤の添加量としては、絶縁性微粒子が脱落することなく均一な膜状を形成しやすい点から、分散液中の被覆粒子1質量部に対して1質量部以上100質量部以下であることが好ましく、5質量部以上50質量部以下であることがより好ましい。添加温度としては、絶縁性微粒子が脱落することなく均一な膜状を形成しやすい点から、10℃以上100℃以下が好ましく、20℃以上80℃以下がより好ましい。また添加してから膜状にさせる時間としては、均一な膜状を形成させる点から、0.1時間以上24時間以下であることが好ましい。 Further, the coated particles in which the insulating fine particles adhere to the surface of the conductive particles can be made into a fluid state by adding an organic solvent to the dispersion liquid, so that the surface of the conductive particles is in the form of a film. Can be coated on. When the insulating fine particles are dissolved, tetrahydrofuran, toluene, methyl ethyl ketone, N-methyl-2-pyrrolidone, N, N-dimethylformamide and the like can be used as the organic solvent. The amount of the organic solvent added should be 1 part by mass or more and 100 parts by mass or less with respect to 1 part by mass of the coating particles in the dispersion liquid because it is easy to form a uniform film without the insulating fine particles falling off. Is preferable, and more preferably 5 parts by mass or more and 50 parts by mass or less. The addition temperature is preferably 10 ° C. or higher and 100 ° C. or lower, and more preferably 20 ° C. or higher and 80 ° C. or lower, from the viewpoint that a uniform film shape is easily formed without the insulating fine particles falling off. The time for forming a film after the addition is preferably 0.1 hour or more and 24 hours or less from the viewpoint of forming a uniform film.

導電性粒子表面を膜状に被覆した被覆粒子は、連続皮膜をより安定化させるために、アニーリング処理を行ってもよい。アニーリング処理の方法としては、被覆粒子を不活性ガスなどの気相中で加温する方法等が挙げられる。加熱温度としては、絶縁性微粒子を構成するポリマーのガラス転移温度をTgとしたときにTg+1℃以上Tg+60℃以下が好ましく、Tg+5℃以上Tg+50℃以下がより好ましい。加熱雰囲気としては特に制限されず、窒素、アルゴン等の不活性ガス雰囲気又は空気等の酸化性雰囲気において、大気圧下、減圧下又は加圧下の何れの条件で行うこともできる。 The coated particles having the surface of the conductive particles coated in a film shape may be subjected to an annealing treatment in order to further stabilize the continuous film. Examples of the annealing treatment method include a method of heating the coated particles in a gas phase such as an inert gas. The heating temperature is preferably Tg + 1 ° C. or higher and Tg + 60 ° C. or lower, and more preferably Tg + 5 ° C. or higher and Tg + 50 ° C. or lower, when the glass transition temperature of the polymer constituting the insulating fine particles is Tg. The heating atmosphere is not particularly limited, and the heating can be performed under any conditions of atmospheric pressure, reduced pressure, or pressurized in an inert gas atmosphere such as nitrogen or argon or an oxidizing atmosphere such as air.

以上、好ましい製造方法を説明したが、本発明の被覆粒子は他の製造方法によっても製造することができる。例えば、荷電官能基を有しない絶縁性微粒子を予め重合反応により製造し、得られた絶縁性微粒子を荷電官能基を有する化合物と反応させる等して、絶縁性微粒子表面に荷電官能基を導入してもよい。 Although the preferred production method has been described above, the coated particles of the present invention can also be produced by other production methods. For example, an insulating fine particle having no charged functional group is produced in advance by a polymerization reaction, and the obtained insulating fine particle is reacted with a compound having a charged functional group to introduce a charged functional group on the surface of the insulating fine particle. You may.

以上のようにして得られた被覆粒子は、チタン系化合物を表面に有する導電性粒子と、荷電官能基を有する絶縁性微粒子や連続皮膜とを組みあわせた利点による被覆粒子間の絶縁性及び対向電極間での接続性を活かして、導電性接着剤、異方性導電膜、異方性導電接着剤等の導電性材料として好適に使用される。 The coated particles obtained as described above have an insulating property and opposition between the coated particles due to the advantage of combining the conductive particles having a titanium-based compound on the surface and the insulating fine particles having a charged functional group or a continuous film. Utilizing the connectivity between electrodes, it is suitably used as a conductive material such as a conductive adhesive, an anisotropic conductive film, and an anisotropic conductive adhesive.

以下、本発明を実施例により説明する。しかしながら本発明の範囲はこれらの実施例に限定されるものではない。例中の特性は下記の方法により測定した。 Hereinafter, the present invention will be described with reference to Examples. However, the scope of the present invention is not limited to these examples. The characteristics in the example were measured by the following method.

(1)平均粒子径
測定対象の走査型電子顕微鏡(SEM)写真(絶縁性微粒子は倍率100,000倍、導電性粒子は倍率10,000倍)から、任意に200個の粒子を抽出して、それらについて上記の粒子径を測定し、その平均値を平均粒子径とした。
(1) Average particle size 200 particles are arbitrarily extracted from a scanning electron microscope (SEM) photograph (insulating fine particles have a magnification of 100,000 times and conductive particles have a magnification of 10,000 times). , The above particle size was measured for them, and the average value was taken as the average particle size.

(2)C.V.(変動係数)
前記平均粒子径の測定から、下記式により求めた。
C.V.(%)=(標準偏差/平均粒子径)×100
(2) C.I. V. (Coefficient of variation)
From the measurement of the average particle size, it was calculated by the following formula.
C. V. (%) = (Standard deviation / average particle size) x 100

(3)ガラス転移温度
示差走査熱量測定装置(METTLER TOLEDO社製、STAR SYSTEM)にて昇降温速度5℃/min、窒素雰囲気下、測定温度25℃から200℃までの熱量変化を上記の手順で測定した。
(3) Glass transition temperature With a differential scanning calorimetry device (METTTLER TOLEDO, STAR SYSTEM), the calorific value changes from a measured temperature of 25 ° C to 200 ° C under a nitrogen atmosphere at a lifting temperature of 5 ° C / min using the above procedure. It was measured.

(実施例1)
[ホスホニウム系絶縁性微粒子の製造]
長さ60mmの撹拌羽根を取り付けた200mLの4つ口フラスコに、純水を100mL投入した。その後、スチレンモノマー(関東化学製)30.00mmol、n−ブチルアクリレート(関東化学製)5.3mmol、4−(ビニルベンジル)トリエチルホスホニウムクロライド(日本化学工業製)0.30mmol、及び重合開始剤として2,2’−アゾビス(2−メチルプロピオンアミジン)ジヒドロクロライド(和光純薬工業製、V−50)0.50mmolを投入した。窒素を15分間通気し、溶存酸素を追い出した後、60℃に昇温し、6時間保持して重合反応を進行させた。重合後の微粒子の分散液を目開き150μmのSUS篩にかけ、凝集物を除去した。凝集物を除去した分散液を、遠心分離機(日立工機製、CR−21N)にて20,000rpm、20分間の条件にて微粒子を沈降させ、上澄み液を除去した。得られた固形物に純水を加えて洗浄して、ポリ(スチレン/n−ブチルアクリレート/4−(ビニルベンジル)トリエチルホスホニウムクロライド)の球状の微粒子を得た。得られた微粒子の平均粒子径は86nmであり、C.V.が7.4%であった。またガラス転移温度は約62℃であった。
[絶縁性微粒子被覆導電性粒子の製造]
球状の樹脂粒子の表面に厚さが0.125μmのニッケル皮膜を有する、平均粒子径が3μmのNiめっき粒子(日本化学工業製)を用意した。樹脂粒子は架橋性のアクリル樹脂からなり、ガラス転移温度が120℃であった。前記のNiめっき粒子5.0gにトルエン25mLを投入、撹拌してNiめっき粒子の分散液を得た。Ti系カップリング剤(味の素ファインテクノ製、プレンアクトKR−TTS、上記一般式(I’)においてpが3、rが1、R11がイソプロピル基、R12が−OCO−、q=1、R13がヘプタデシル基である化合物)0.1gをこの分散液に投入して室温にて20分間撹拌し表面処理を行った。その後、目開きが2.0μmのメンブレンフィルターでろ過し、Ti系カップリング剤の層を表面に有するNiめっき粒子を回収した。回収したNiめっき粒子に質量基準でエタノール:純水=75:25の混合液の100mLを投入して表面処理を行ったNiめっき粒子の分散液を得た。この分散液に、上記で得られた絶縁性微粒子と、Na2SO4を投入し、これを40℃で30分間撹拌した。絶縁性微粒子及びNa2SO4の投入後、分散液中、絶縁性微粒子の固形分濃度は質量基準で10,000ppmであり、Na2SO4の濃度は5mmol/Lであった。上澄み液を除去後、純水により洗浄を3回繰り返した後、50℃で真空乾燥して絶縁性微粒子被覆導電性粒子を得た。得られた導電性粒子における絶縁性微粒子による被覆率を下記方法にて求めた。結果を表1に示す。得られた被覆粒子のSEM写真を図1に示す。
(Example 1)
[Manufacturing of phosphonium-based insulating fine particles]
100 mL of pure water was put into a 200 mL four-necked flask equipped with a stirring blade having a length of 60 mm. After that, styrene monomer (manufactured by Kanto Chemical Co., Inc.) 30.00 mmol, n-butyl acrylate (manufactured by Kanto Chemical Co., Inc.) 5.3 mmol, 4- (vinylbenzyl) triethylphosphonium chloride (manufactured by Nippon Kagaku Kogyo) 0.30 mmol, and as a polymerization initiator. 2.50 mmol of 2,2'-azobis (2-methylpropionamidine) dihydrochloride (manufactured by Wako Pure Chemical Industries, Ltd., V-50) was added. Nitrogen was aerated for 15 minutes to expel dissolved oxygen, then the temperature was raised to 60 ° C. and held for 6 hours to allow the polymerization reaction to proceed. The dispersion of fine particles after polymerization was sieved through a SUS sieve having an opening of 150 μm to remove agglomerates. The dispersion liquid from which the agglomerates had been removed was subjected to sedimentation of fine particles in a centrifuge (manufactured by Hitachi, Ltd., CR-21N) at 20,000 rpm for 20 minutes to remove the supernatant liquid. Pure water was added to the obtained solid and washed to obtain spherical fine particles of poly (styrene / n-butyl acrylate / 4- (vinylbenzyl) triethylphosphonium chloride). The average particle size of the obtained fine particles was 86 nm, and C.I. V. Was 7.4%. The glass transition temperature was about 62 ° C.
[Manufacturing of conductive particles coated with insulating fine particles]
Ni-plated particles (manufactured by Nippon Chemical Industrial Co., Ltd.) having a nickel film having a thickness of 0.125 μm and an average particle diameter of 3 μm were prepared on the surface of the spherical resin particles. The resin particles were made of crosslinkable acrylic resin and had a glass transition temperature of 120 ° C. Toluene (25 mL) was added to 5.0 g of the Ni-plated particles and stirred to obtain a dispersion of Ni-plated particles. Ti-based coupling agent (manufactured by Ajinomoto Fine-Techno, Plenact KR-TTS, in the above general formula (I'), p is 3, r is 1, R 11 is an isopropyl group, R 12 is -OCO-, q = 1, R 0.1 g of (compound 13 having a heptadecyl group) was added to this dispersion and stirred at room temperature for 20 minutes for surface treatment. Then, it was filtered through a membrane filter having a mesh size of 2.0 μm, and Ni-plated particles having a layer of Ti-based coupling agent on the surface were recovered. A dispersion of Ni-plated particles was surface-treated by adding 100 mL of a mixed solution of ethanol: pure water = 75:25 to the recovered Ni-plated particles on a mass basis. The insulating fine particles obtained above and Na 2 SO 4 were added to this dispersion, and the mixture was stirred at 40 ° C. for 30 minutes. After the addition of the insulating fine particles and Na 2 SO 4 , the solid content concentration of the insulating fine particles in the dispersion was 10,000 ppm on a mass basis, and the concentration of Na 2 SO 4 was 5 mmol / L. After removing the supernatant, washing with pure water was repeated three times, and then vacuum dried at 50 ° C. to obtain insulating fine particle-coated conductive particles. The coverage of the obtained conductive particles with the insulating fine particles was determined by the following method. The results are shown in Table 1. An SEM photograph of the obtained coated particles is shown in FIG.

(実施例2)
[ホスホニウム系絶縁性微粒子の製造]
実施例1と同じ方法で絶縁性微粒子を得た。
[絶縁性微粒子被覆導電性粒子の製造]
球状の樹脂粒子の表面に、平均高さが0.1μm、平均の基部の長さが0.197μm、アスペクト比0.5である、1,030個の突起を有し且つ厚さが0.125μmのニッケル皮膜を有する、平均粒子径が3μmのNiめっき粒子(日本化学工業製)を用意した。樹脂粒子は架橋性のアクリル樹脂からなり、ガラス転移温度が120℃であった。前記のNiめっき粒子5.0gにトルエン25mLを投入、撹拌してNiめっき粒子の分散液を得た。Ti系カップリング剤(味の素ファインテクノ製、プレンアクトKR−TTS、上記一般式(I’)においてpが3、rが1、R11がイソプロピル基、R12が−OCO−、q=1、R13がヘプタデシル基である化合物)0.1gをこの分散液に投入して室温にて20分間撹拌し表面処理を行った。その後、目開きが2.0μmのメンブレンフィルターでろ過し、Ti系カップリング剤の層を表面に有するNiめっき粒子を回収した。回収したNiめっき粒子に質量基準でエタノール:純水=75:25の混合液の100mLを投入して表面処理を行ったNiめっき粒子の分散液を得た。この分散液に、上記で得られた絶縁性微粒子と、Na2SO4を投入し、これを40℃で30分間撹拌した。絶縁性微粒子及びNa2SO4の投入後、分散液中、絶縁性微粒子の固形分濃度は質量基準で10,000ppmであり、Na2SO4の濃度は5mmol/Lであった。上澄み液を除去後、純水により洗浄を3回繰り返した後、50℃で真空乾燥して絶縁性微粒子被覆導電性粒子を得た。得られた導電性粒子における絶縁性微粒子による被覆率を下記方法にて求めた。結果を表1に示す。
(Example 2)
[Manufacturing of phosphonium-based insulating fine particles]
Insulating fine particles were obtained in the same manner as in Example 1.
[Manufacturing of conductive particles coated with insulating fine particles]
The surface of the spherical resin particles has 1,030 protrusions having an average height of 0.1 μm, an average base length of 0.197 μm, and an aspect ratio of 0.5, and has a thickness of 0. Ni-plated particles (manufactured by Nippon Kagaku Kogyo Co., Ltd.) having a nickel film of 125 μm and having an average particle diameter of 3 μm were prepared. The resin particles were made of crosslinkable acrylic resin and had a glass transition temperature of 120 ° C. Toluene (25 mL) was added to 5.0 g of the Ni-plated particles and stirred to obtain a dispersion of Ni-plated particles. Ti-based coupling agent (manufactured by Ajinomoto Fine-Techno, Plenact KR-TTS, in the above general formula (I'), p is 3, r is 1, R 11 is an isopropyl group, R 12 is -OCO-, q = 1, R 0.1 g of (compound 13 having a heptadecyl group) was added to this dispersion and stirred at room temperature for 20 minutes for surface treatment. Then, it was filtered through a membrane filter having a mesh size of 2.0 μm, and Ni-plated particles having a layer of Ti-based coupling agent on the surface were recovered. A dispersion of Ni-plated particles was surface-treated by adding 100 mL of a mixed solution of ethanol: pure water = 75:25 to the recovered Ni-plated particles on a mass basis. The insulating fine particles obtained above and Na 2 SO 4 were added to this dispersion, and the mixture was stirred at 40 ° C. for 30 minutes. After the addition of the insulating fine particles and Na 2 SO 4 , the solid content concentration of the insulating fine particles in the dispersion was 10,000 ppm on a mass basis, and the concentration of Na 2 SO 4 was 5 mmol / L. After removing the supernatant, washing with pure water was repeated three times, and then vacuum dried at 50 ° C. to obtain insulating fine particle-coated conductive particles. The coverage of the obtained conductive particles with the insulating fine particles was determined by the following method. The results are shown in Table 1.

(実施例3)
[ホスホニウム系絶縁性微粒子の製造]
実施例1と同じ方法で絶縁性微粒子を得た。
[絶縁性微粒子被覆導電性粒子の製造]
Ti系カップリング剤(味の素ファインテクノ製、プレンアクトKR−41B、上記一般式(I’)においてpが3、rが1、R11がイソプロピル基、R12が−P(OH)(O−)、q=1、R13がオクチル基である化合物)0.1gをNiめっき粒子の分散液に投入して表面処理を行うこと以外は、実施例1と同じ方法で絶縁性微粒子被覆導電性粒子を得た。得られた被覆粒子における絶縁性微粒子の被覆率を下記方法にて求めた。結果を表1に示す。
(Example 3)
[Manufacturing of phosphonium-based insulating fine particles]
Insulating fine particles were obtained in the same manner as in Example 1.
[Manufacturing of conductive particles coated with insulating fine particles]
Ti-based coupling agent (manufactured by Ajinomoto Fine-Techno, Plenact KR-41B, in the above general formula (I'), p is 3, r is 1, R 11 is an isopropyl group, and R 12 is -P (OH) (O-). 2. Insulating fine particle coating conductivity by the same method as in Example 1 except that 0.1 g of (a compound in which q = 1, R 13 is an octyl group) is added to a dispersion of Ni-plated particles to perform surface treatment. Obtained particles. The coverage of the insulating fine particles in the obtained coated particles was determined by the following method. The results are shown in Table 1.

(実施例4)
[ホスホニウム系絶縁性微粒子の製造]
実施例1と同じ方法で絶縁性微粒子を得た。
[絶縁性微粒子被覆導電性粒子の製造]
Ti系カップリング剤(味の素ファインテクノ製、プレンアクトKR−41B、上記一般式(I’)においてpが3、rが1、R11がイソプロピル基、R12が−P(OH)(O−)、q=1、R13がオクチル基である化合物)0.1gをNiめっき粒子の分散液に投入して表面処理を行うこと以外は、実施例2と同じ方法で絶縁性微粒子被覆導電性粒子を得た。得られた被覆粒子における絶縁性微粒子の被覆率を下記方法にて求めた。結果を表1に示す。
(Example 4)
[Manufacturing of phosphonium-based insulating fine particles]
Insulating fine particles were obtained in the same manner as in Example 1.
[Manufacturing of conductive particles coated with insulating fine particles]
Ti-based coupling agent (manufactured by Ajinomoto Fine-Techno, Plenact KR-41B, in the above general formula (I'), p is 3, r is 1, R 11 is an isopropyl group, and R 12 is -P (OH) (O-). 2. Insulating fine particle coating conductivity by the same method as in Example 2 except that 0.1 g of (a compound in which q = 1, R 13 is an octyl group) is added to a dispersion of Ni-plated particles to perform surface treatment. Obtained particles. The coverage of the insulating fine particles in the obtained coated particles was determined by the following method. The results are shown in Table 1.

(実施例5)
実施例1で得られた絶縁性微粒子被覆導電性粒子1.0gを、純水20mL中に添加して分散液とし、該分散液を95℃で6時間撹拌した。撹拌終了後、目開きが2μmのメンブレンフィルターを用いて固形分を分離し、乾燥して、最大厚さが50nm、最小厚さが20nmである連続皮膜からなる絶縁層で被覆された被覆粒子を得た。得られた被覆粒子における連続皮膜からなる絶縁層による被覆率を下記方法にて求めた。結果を表1に示す。
(Example 5)
1.0 g of the insulating fine particle-coated conductive particles obtained in Example 1 was added to 20 mL of pure water to prepare a dispersion, and the dispersion was stirred at 95 ° C. for 6 hours. After the stirring is completed, the solid content is separated using a membrane filter having a mesh size of 2 μm, and dried to obtain coated particles coated with an insulating layer consisting of a continuous film having a maximum thickness of 50 nm and a minimum thickness of 20 nm. Obtained. The coverage of the obtained coated particles with an insulating layer composed of a continuous coating was determined by the following method. The results are shown in Table 1.

(実施例6)
[ホスホニウム系絶縁性微粒子の製造]
長さ60mmの撹拌羽根を取り付けた200mLの4つ口フラスコに、純水を100mL投入した。その後、架橋性モノマーとしてジビニルベンゼンモノマー(新日鉄住金製)15.0mmol、非架橋性モノマーとしてスチレンモノマー(関東化学製)30.00mmol、及びn−ブチルアクリレート(関東化学製)5.3mmol、4−(ビニルベンジル)トリエチルホスホニウムクロライド(日本化学工業製)0.03mmol、並びに重合開始剤として2,2’−アゾビス(2−メチルプロピオンアミジン)ジヒドロクロライド(和光純薬工業製、V−50)0.50mmolを投入した。窒素を15分間通気し、溶存酸素を追い出した後、60℃に昇温し、6時間保持して重合反応を進行させた。重合後の微粒子の分散液を目開き150μmのSUS篩にかけ、凝集物を除去した。凝集物を除去した分散液を、遠心分離機(日立工機製、CR−21N)にて20,000rpm、20分間の条件にて遠心分離して微粒子を沈降させ、上澄み液を除去した。得られた固形物に純水を加えて洗浄して、ポリ(スチレン/ジビニルベンゼン/n−ブチルアクリレート/4−(ビニルベンジル)トリエチルホスホニウムクロライド)の球状の微粒子を得た。得られた微粒子の平均粒子径は220nmであり、C.V.が9.7%であった。
[絶縁性微粒子被覆導電性粒子の製造]
実施例1と同じ方法で絶縁性微粒子被覆導電性粒子を得た。得られた被覆粒子における絶縁性微粒子の被覆率を下記方法にて求めた。結果を表1に示す。
(Example 6)
[Manufacturing of phosphonium-based insulating fine particles]
100 mL of pure water was put into a 200 mL four-necked flask equipped with a stirring blade having a length of 60 mm. After that, divinylbenzene monomer (manufactured by Nippon Steel & Sumitomo Metal) 15.0 mmol as a crosslinkable monomer, styrene monomer (manufactured by Kanto Chemical Co., Ltd.) 30.00 mmol as a non-crosslinkable monomer, and n-butyl acrylate (manufactured by Kanto Chemical Co., Inc.) 5.3 mmol, 4- (Vinylbenzyl) Triethylphosphonium chloride (manufactured by Nippon Chemical Co., Ltd.) 0.03 mmol, and 2,2'-azobis (2-methylpropionamidine) dihydrochloride (manufactured by Wako Pure Chemical Industries, Ltd., V-50) as a polymerization initiator 0. 50 mmol was charged. Nitrogen was aerated for 15 minutes to expel dissolved oxygen, then the temperature was raised to 60 ° C. and held for 6 hours to allow the polymerization reaction to proceed. The dispersion of fine particles after polymerization was sieved through a SUS sieve having an opening of 150 μm to remove agglomerates. The dispersion liquid from which the agglomerates had been removed was centrifuged with a centrifuge (manufactured by Hitachi, Ltd., CR-21N) at 20,000 rpm for 20 minutes to settle the fine particles, and the supernatant liquid was removed. Pure water was added to the obtained solid and washed to obtain spherical fine particles of poly (styrene / divinylbenzene / n-butyl acrylate / 4- (vinylbenzyl) triethylphosphonium chloride). The average particle size of the obtained fine particles was 220 nm, and C.I. V. Was 9.7%.
[Manufacturing of conductive particles coated with insulating fine particles]
Insulating fine particle-coated conductive particles were obtained in the same manner as in Example 1. The coverage of the insulating fine particles in the obtained coated particles was determined by the following method. The results are shown in Table 1.

(実施例7)
[アンモニウム系絶縁性微粒子の製造]
長さ60mmの撹拌羽根を取り付けた200mLの4つ口フラスコに、純水を100mL投入した。その後、スチレンモノマー(関東化学社製)30.00mmol、n−ブチルアクリレート(関東化学社製)5.3mmol、4−(ビニルベンジル)トリエチルアンモニウムクロライド(日本化学工業社製)0.30mmol、及び重合開始剤として2,2’−アゾビス(2−メチルプロピオンアミジン)ジヒドロクロライド(和光純薬工業製、V−50)0.50mmolを投入した。窒素を15分間通気し、溶存酸素を追い出した後、60℃に昇温し、6時間保持して重合反応を進行させた。重合後の微粒子の分散液を目開き150μmのSUS篩にかけ、凝集物を除去した。凝集物を除去した分散液を、遠心分離機(日立工機製、CR−21N)にて20,000rpm、20分間の条件にて遠心して微粒子を沈降させ、上澄み液を除去した。得られた固形物に純水を加えて洗浄して、ポリ(スチレン/n−ブチルアクリレート/4−(ビニルベンジル)トリエチルアンモニウムクロライド)の球状の微粒子を得た。得られた微粒子の平均粒子径は90nmであり、C.V.が8.6%であった。またガラス転移温度は約59℃であった。
[絶縁性微粒子被覆導電性粒子の製造]
球状の樹脂粒子の表面に厚さが0.125μmのニッケル皮膜を有する、平均粒子径が3μmのNiめっき粒子(日本化学工業製)を用意した。樹脂粒子は架橋性のアクリル樹脂からなり、ガラス転移温度が120℃であった。前記のNiめっき粒子5.0gにトルエン25mLを投入、撹拌してNiめっき粒子の分散液を得た。Ti系カップリング剤(味の素ファインテクノ製、プレンアクトKR−TTS、上記一般式(I’)においてpが3、rが1、R11がイソプロピル基、R12が−OCO−、q=1、R13がヘプタデシル基である化合物)0.1gをこの分散液に投入して室温にて20分間撹拌し表面処理を行った。その後、目開きが2.0μmのメンブレンフィルターでろ過し、Ti系カップリング剤の層を表面に有するNiめっき粒子を回収した。回収したNiめっき粒子に質量基準でエタノール:純水=75:25の混合液の100mLを投入して表面処理を行ったNiめっき粒子の分散液を得た。この分散液に、上記で得られた絶縁性微粒子と、Na2SO4を投入し、これを40℃で30分間撹拌した。絶縁性微粒子及びNa2SO4の投入後、分散液中、絶縁性微粒子の固形分濃度は質量基準で10,000ppmであり、Na2SO4の濃度は5mmol/Lであった。上澄み液を除去後、純水により洗浄を3回繰り返した後、50℃で真空乾燥して絶縁性微粒子被覆導電性粒子を得た。得られた被覆粒子における絶縁性微粒子の被覆率を下記方法にて求めた。結果を表1に示す。
(Example 7)
[Manufacturing of ammonium-based insulating fine particles]
100 mL of pure water was put into a 200 mL four-necked flask equipped with a stirring blade having a length of 60 mm. After that, styrene monomer (manufactured by Kanto Chemical Co., Inc.) 30.00 mmol, n-butyl acrylate (manufactured by Kanto Chemical Co., Inc.) 5.3 mmol, 4- (vinylbenzyl) triethylammonium chloride (manufactured by Nippon Chemical Co., Ltd.) 0.30 mmol, and polymerization. As an initiator, 0.50 mmol of 2,2'-azobis (2-methylpropionamidine) dihydrochloride (manufactured by Wako Pure Chemical Industries, Ltd., V-50) was added. Nitrogen was aerated for 15 minutes to expel dissolved oxygen, then the temperature was raised to 60 ° C. and held for 6 hours to allow the polymerization reaction to proceed. The dispersion of fine particles after polymerization was sieved through a SUS sieve having an opening of 150 μm to remove agglomerates. The dispersion liquid from which the agglomerates had been removed was centrifuged in a centrifuge (manufactured by Hitachi, Ltd., CR-21N) at 20,000 rpm for 20 minutes to settle the fine particles, and the supernatant liquid was removed. Pure water was added to the obtained solid and washed to obtain spherical fine particles of poly (styrene / n-butyl acrylate / 4- (vinylbenzyl) triethylammonium chloride). The average particle size of the obtained fine particles was 90 nm, and C.I. V. Was 8.6%. The glass transition temperature was about 59 ° C.
[Manufacturing of conductive particles coated with insulating fine particles]
Ni-plated particles (manufactured by Nippon Chemical Industrial Co., Ltd.) having a nickel film having a thickness of 0.125 μm and an average particle diameter of 3 μm were prepared on the surface of the spherical resin particles. The resin particles were made of crosslinkable acrylic resin and had a glass transition temperature of 120 ° C. Toluene (25 mL) was added to 5.0 g of the Ni-plated particles and stirred to obtain a dispersion of Ni-plated particles. Ti-based coupling agent (manufactured by Ajinomoto Fine-Techno, Plenact KR-TTS, in the above general formula (I'), p is 3, r is 1, R 11 is an isopropyl group, R 12 is -OCO-, q = 1, R 0.1 g of (compound 13 having a heptadecyl group) was added to this dispersion and stirred at room temperature for 20 minutes for surface treatment. Then, it was filtered through a membrane filter having a mesh size of 2.0 μm, and Ni-plated particles having a layer of Ti-based coupling agent on the surface were recovered. A dispersion of Ni-plated particles was surface-treated by adding 100 mL of a mixed solution of ethanol: pure water = 75:25 to the recovered Ni-plated particles on a mass basis. The insulating fine particles obtained above and Na 2 SO 4 were added to this dispersion, and the mixture was stirred at 40 ° C. for 30 minutes. After the addition of the insulating fine particles and Na 2 SO 4 , the solid content concentration of the insulating fine particles in the dispersion was 10,000 ppm on a mass basis, and the concentration of Na 2 SO 4 was 5 mmol / L. After removing the supernatant, washing with pure water was repeated three times, and then vacuum dried at 50 ° C. to obtain insulating fine particle-coated conductive particles. The coverage of the insulating fine particles in the obtained coated particles was determined by the following method. The results are shown in Table 1.

(比較例1)
[ホスホニウム系絶縁性微粒子の製造]
実施例1と同じ方法で絶縁性微粒子を得た。
[絶縁性微粒子被覆導電性粒子の製造]
実施例1においてTi系カップリング剤による表面処理を行わなかった。詳細には、球状の樹脂粒子の表面に厚さが0.125μmのニッケル皮膜を有する、平均粒子径が3μmのNiめっき粒子(日本化学工業製)を用意した。樹脂粒子は、架橋性のアクリル樹脂からなりガラス転移温度が120℃であった。前記のNiめっき粒子5.0gに純水100mLを投入、撹拌してNiめっき粒子の分散液を得た。この分散液に、実施例1で得られたホスホニウム系絶縁性微粒子と、Na2SO4を投入し、40℃で30分間撹拌した。絶縁性微粒子及びNa2SO4の投入後、分散液中、絶縁性微粒子の固形分濃度は質量基準で10,000ppmであり、Na2SO4の濃度は5mmol/Lであった。上澄み液を除去後、純水により洗浄を3回繰り返した後、50℃で真空乾燥して絶縁性微粒子被覆導電性粒子を得た。得られた導電性粒子における絶縁性微粒子の被覆率を表1に示す。
(Comparative Example 1)
[Manufacturing of phosphonium-based insulating fine particles]
Insulating fine particles were obtained in the same manner as in Example 1.
[Manufacturing of conductive particles coated with insulating fine particles]
In Example 1, no surface treatment with a Ti-based coupling agent was performed. Specifically, Ni-plated particles (manufactured by Nippon Chemical Industrial Co., Ltd.) having a nickel film having a thickness of 0.125 μm on the surface of spherical resin particles and having an average particle diameter of 3 μm were prepared. The resin particles were made of a crosslinkable acrylic resin and had a glass transition temperature of 120 ° C. 100 mL of pure water was added to 5.0 g of the Ni-plated particles and stirred to obtain a dispersion of Ni-plated particles. The phosphonium-based insulating fine particles obtained in Example 1 and Na 2 SO 4 were added to this dispersion, and the mixture was stirred at 40 ° C. for 30 minutes. After the addition of the insulating fine particles and Na 2 SO 4 , the solid content concentration of the insulating fine particles in the dispersion was 10,000 ppm on a mass basis, and the concentration of Na 2 SO 4 was 5 mmol / L. After removing the supernatant, washing with pure water was repeated three times, and then vacuum dried at 50 ° C. to obtain insulating fine particle-coated conductive particles. Table 1 shows the coverage of the insulating fine particles in the obtained conductive particles.

(比較例2)
[ホスホニウム系絶縁性微粒子の製造]
実施例1と同じ絶縁性微粒子を得た。
[絶縁性微粒子被覆導電性粒子の製造]
実施例2においてTi系カップリング剤による表面処理を行わなかった。詳細には、球状の樹脂粒子の表面に、平均高さが0.1μm、平均の基部の長さが0.197μm、アスペクト比0.5である、1,030個の突起を有し且つ厚さが0.125μmのニッケル皮膜を有する、平均粒子径が3μmのNiめっき粒子(日本化学工業株製)を用意した。樹脂粒子は架橋性のアクリル樹脂からなり、ガラス転移温度が120℃であった。前記のNiめっき粒子5.0gに純水100mLを投入、撹拌してNiめっき粒子の分散液を得た。この分散液に、実施例1で得られたホスホニウム系絶縁性微粒子と、Na2SO4を投入し、40℃で30分間撹拌した。絶縁性微粒子及びNa2SO4の投入後、分散液中、絶縁性微粒子の固形分濃度は質量基準で10,000ppmであり、Na2SO4の濃度は5mmol/Lであった。上澄み液を除去後、純水により洗浄を3回繰り返した後、50℃で真空乾燥して絶縁性微粒子被覆導電性粒子を得た。得られた導電性粒子における絶縁性微粒子の被覆率を表1に示す。
(Comparative Example 2)
[Manufacturing of phosphonium-based insulating fine particles]
The same insulating fine particles as in Example 1 were obtained.
[Manufacturing of conductive particles coated with insulating fine particles]
In Example 2, no surface treatment with a Ti-based coupling agent was performed. Specifically, the surface of the spherical resin particles has 1,030 protrusions having an average height of 0.1 μm, an average base length of 0.197 μm, and an aspect ratio of 0.5, and is thick. Ni-plated particles (manufactured by Nippon Kagaku Kogyo Co., Ltd.) having a nickel film having a thickness of 0.125 μm and having an average particle diameter of 3 μm were prepared. The resin particles were made of crosslinkable acrylic resin and had a glass transition temperature of 120 ° C. 100 mL of pure water was added to 5.0 g of the Ni-plated particles and stirred to obtain a dispersion of Ni-plated particles. The phosphonium-based insulating fine particles obtained in Example 1 and Na 2 SO 4 were added to this dispersion, and the mixture was stirred at 40 ° C. for 30 minutes. After the addition of the insulating fine particles and Na 2 SO 4 , the solid content concentration of the insulating fine particles in the dispersion was 10,000 ppm on a mass basis, and the concentration of Na 2 SO 4 was 5 mmol / L. After removing the supernatant, washing with pure water was repeated three times, and then vacuum dried at 50 ° C. to obtain insulating fine particle-coated conductive particles. Table 1 shows the coverage of the insulating fine particles in the obtained conductive particles.

(比較例3)
[アンモニウム系絶縁性微粒子の製造]
実施例7と同じ方法で絶縁性微粒子を得た。
[絶縁性微粒子被覆導電性粒子の製造]
実施例7において、Ti系カップリング剤による表面処理を行わなかった。詳細には、球状の樹脂粒子の表面に厚さが0.125μmのニッケル皮膜を有する、平均粒子径が3μmのNiめっき粒子(日本化学工業製)を用意した。樹脂粒子は、架橋性のアクリル樹脂からなり、ガラス転移温度が120℃であった。前記のNiめっき粒子5.0gに純水100mLを投入、撹拌してNiめっき粒子の分散液を得た。この分散液に、上記実施例7で得られたアンモニウム系絶縁性微粒子と、NaSOを投入し、40℃で30分間撹拌した。絶縁性微粒子及びNaSOの投入後、分散液中、絶縁性微粒子の固形分濃度は質量基準で10,000ppmであり、NaSOの濃度は5mmol/Lであった。上澄み液を除去後、純水により洗浄を3回繰り返した後、50℃で真空乾燥して絶縁性微粒子被覆導電性粒子を得た。得られた被覆粒子における絶縁性微粒子の被覆率を下記方法にて求めた。結果を表1に示す。
(Comparative Example 3)
[Manufacturing of ammonium-based insulating fine particles]
Insulating fine particles were obtained in the same manner as in Example 7.
[Manufacturing of conductive particles coated with insulating fine particles]
In Example 7, no surface treatment with a Ti-based coupling agent was performed. Specifically, Ni-plated particles (manufactured by Nippon Chemical Industrial Co., Ltd.) having a nickel film having a thickness of 0.125 μm on the surface of spherical resin particles and having an average particle diameter of 3 μm were prepared. The resin particles were made of a crosslinkable acrylic resin and had a glass transition temperature of 120 ° C. 100 mL of pure water was added to 5.0 g of the Ni-plated particles and stirred to obtain a dispersion of Ni-plated particles. The ammonium-based insulating fine particles obtained in Example 7 and Na 2 SO 4 were added to this dispersion, and the mixture was stirred at 40 ° C. for 30 minutes. After the addition of the insulating fine particles and Na 2 SO 4 , the solid content concentration of the insulating fine particles in the dispersion was 10,000 ppm on a mass basis, and the concentration of Na 2 SO 4 was 5 mmol / L. After removing the supernatant, washing with pure water was repeated three times, and then vacuum dried at 50 ° C. to obtain insulating fine particle-coated conductive particles. The coverage of the insulating fine particles in the obtained coated particles was determined by the following method. The results are shown in Table 1.

(参考例1)
参考例1は、被覆粒子の導通性及び絶縁性の評価を、比較例2と同じ被覆率で比較するためのものである。
[ホスホニウム系絶縁性微粒子の製造]
実施例1と同じ方法で絶縁性微粒子を得た。
[絶縁性微粒子被覆導電性粒子の製造]
球状の樹脂粒子の表面に、平均高さが0.1μm、平均の基部の長さが0.197μm、アスペクト比0.5である、1,030個の突起を有し且つ厚さが0.125μmのニッケル皮膜を有する、平均粒子径が3μmのNiめっき粒子(日本化学工業製)を用意した。樹脂粒子は架橋性のアクリル樹脂からなり、ガラス転移温度が120℃であった。前記のNiめっき粒子5.0gにトルエン25mLを投入、撹拌してNiめっき粒子の分散液を得た。Ti系カップリング剤(味の素ファインテクノ製、プレンアクトKR−TTS、上記一般式(I’)においてpが3、rが1、R11がイソプロピル基、R12が−OCO−、q=1、R13がヘプタデシル基である化合物)0.1gをこの分散液に投入して室温にて20分間撹拌し表面処理を行った。その後、目開きが2.0μmのメンブレンフィルターでろ過し、Ti系カップリング剤の層を表面に有するNiめっき粒子を回収した。回収したNiめっき粒子に質量基準でエタノール:純水=75:25の混合液の100mLを投入して表面処理を行ったNiめっき粒子の分散液を得た。この分散液に、上記で得られた絶縁性微粒子と、Na2SO4を投入し、これを40℃で30分間撹拌した。絶縁性微粒子及びNa2SO4の投入後、分散液中、絶縁性微粒子の固形分濃度は質量基準で4,000ppmであり、Na2SO4の濃度は5mmol/Lであった。上澄み液を除去後、純水により洗浄を3回繰り返した後、50℃で真空乾燥して絶縁性微粒子被覆導電性粒子を得た。得られた被覆粒子における絶縁性微粒子の被覆率を下記方法にて求めた。結果を表1に示す。
(Reference example 1)
Reference Example 1 is for comparing the evaluation of the conductivity and the insulating property of the coated particles with the same coverage as that of Comparative Example 2.
[Manufacturing of phosphonium-based insulating fine particles]
Insulating fine particles were obtained in the same manner as in Example 1.
[Manufacturing of conductive particles coated with insulating fine particles]
The surface of the spherical resin particles has 1,030 protrusions having an average height of 0.1 μm, an average base length of 0.197 μm, and an aspect ratio of 0.5, and has a thickness of 0. Ni-plated particles (manufactured by Nippon Kagaku Kogyo Co., Ltd.) having a nickel film of 125 μm and having an average particle diameter of 3 μm were prepared. The resin particles were made of crosslinkable acrylic resin and had a glass transition temperature of 120 ° C. Toluene (25 mL) was added to 5.0 g of the Ni-plated particles and stirred to obtain a dispersion of Ni-plated particles. Ti-based coupling agent (manufactured by Ajinomoto Fine-Techno, Plenact KR-TTS, in the above general formula (I'), p is 3, r is 1, R 11 is an isopropyl group, R 12 is -OCO-, q = 1, R 0.1 g of (compound 13 having a heptadecyl group) was added to this dispersion and stirred at room temperature for 20 minutes for surface treatment. Then, it was filtered through a membrane filter having a mesh size of 2.0 μm, and Ni-plated particles having a layer of Ti-based coupling agent on the surface were recovered. A dispersion of Ni-plated particles was surface-treated by adding 100 mL of a mixed solution of ethanol: pure water = 75:25 to the recovered Ni-plated particles on a mass basis. The insulating fine particles obtained above and Na 2 SO 4 were added to this dispersion, and the mixture was stirred at 40 ° C. for 30 minutes. After the addition of the insulating fine particles and Na 2 SO 4 , the solid content concentration of the insulating fine particles in the dispersion was 4,000 ppm on a mass basis, and the concentration of Na 2 SO 4 was 5 mmol / L. After removing the supernatant, washing with pure water was repeated three times, and then vacuum dried at 50 ° C. to obtain insulating fine particle-coated conductive particles. The coverage of the insulating fine particles in the obtained coated particles was determined by the following method. The results are shown in Table 1.

(被覆率の評価)
実施例1〜7、比較例1〜3及び参考例1で得られた被覆粒子の被覆率を評価した。なお、被覆率は次の方法により求めた。また、下記の半径は上記平均粒子径を用いた。
<被覆率の測定方法>
実施例5以外の実施例、比較例及び参考例1においては、Niめっき粒子の表面に、絶縁性微粒子が最密充填で配列したときの絶縁性微粒子の個数Nを以下の計算式で算出した。
N=4π(R+r)2/2√3r2
(R:Niめっき粒子の半径(nm)、r:絶縁性微粒子の半径(nm))
SEMにてNiめっき粒子に付着した絶縁性微粒子の個数nを数え、以下の式から被覆率を算出した。
被覆率(%)=(n/N)×100
評価に用いた被覆率は、Niめっき粒子20個の平均値とした。
実施例5においては、被覆粒子のSEM写真画像の反射電子組成(COMPO)像を自動画像解析装置(株式会社ニレコ製、ルーゼックス(登録商標)AP)に取り込み、前記COMPO像における20個の被覆粒子を対象として算出した。
(Evaluation of coverage)
The coverage of the coated particles obtained in Examples 1 to 7, Comparative Examples 1 to 3 and Reference Example 1 was evaluated. The coverage was determined by the following method. Moreover, the above-mentioned average particle diameter was used for the following radius.
<Measurement method of coverage>
In Examples, Comparative Examples, and Reference Examples 1 other than Example 5, the number N of the insulating fine particles when the insulating fine particles were densely packed on the surface of the Ni-plated particles was calculated by the following formula. ..
N = 4π (R + r) 2 / 2√3r 2
(R: radius of Ni-plated particles (nm), r: radius of insulating fine particles (nm))
The number n of the insulating fine particles adhering to the Ni-plated particles was counted by SEM, and the coverage was calculated from the following formula.
Coverage (%) = (n / N) x 100
The coverage used for the evaluation was an average value of 20 Ni-plated particles.
In Example 5, the reflected electron composition (COMPO) image of the SEM photographic image of the coated particles was taken into an automatic image analyzer (Nireco Corporation, Luzex® AP), and 20 coated particles in the COMPO image. Was calculated for the target.

表1に示す通り、チタン系化合物としてTi系カップリング剤により導電性粒子を処理した後、絶縁性微粒子を被覆した被覆粒子は、Ti系カップリング剤により処理せずに得られた被覆粒子と比べて良好な被覆率を示した。
また本発明の被覆粒子は、表面に多数の突起を有する導電性粒子を用いた場合も良好な被覆率を示した。
以上により、導電性粒子を絶縁層で被覆した被覆粒子において、導電性粒子表面にチタン系化合物を有させ、且つ電荷を有する官能基を絶縁層に有させることにより、導電性粒子と絶縁層との密着性が相乗的に向上することが判る。
As shown in Table 1, the coated particles coated with the insulating fine particles after treating the conductive particles with the Ti-based coupling agent as the titanium-based compound are the coated particles obtained without the treatment with the Ti-based coupling agent. It showed a good coverage in comparison.
Further, the coating particles of the present invention showed a good coverage even when conductive particles having a large number of protrusions on the surface were used.
As described above, in the coated particles in which the conductive particles are coated with the insulating layer, the conductive particles and the insulating layer are formed by having a titanium-based compound on the surface of the conductive particles and having a functional group having an electric charge in the insulating layer. It can be seen that the adhesion of the particles is synergistically improved.

(導通性及び絶縁性の評価)
実施例2、比較例2及び参考例1の被覆粒子を用いて、導通性及び絶縁性の評価を以下の方法で行った。
(Evaluation of conductivity and insulation)
The conductivity and the insulating property were evaluated by the following methods using the coated particles of Example 2, Comparative Example 2 and Reference Example 1.

<導通性の評価>
エポキシ樹脂100質量部、硬化剤150質量部及びトルエン70質量部を混合した絶縁性接着剤と、実施例2、比較例2及び参考例1で得られた被覆粒子15質量部とを混合して、絶縁性ペーストを得た。このペーストをシリコーン処理ポリエステルフィルム上にバーコーターを用いて塗布し、その後、ペーストを乾燥させて、フィルム上に薄膜を形成した。得られた薄膜形成フィルムを、全面がアルミニウムを蒸着させたガラス基板と、銅パターンが50μmピッチに形成されたポリイミドフィルム基板との間に配して、電気接続を行った。この基板間の導通抵抗を測定することで、被覆粒子の導通性を室温下(25℃・50%RH)で評価した。抵抗値が低いほど被覆粒子の導通性が高いものであると評価できる。被覆粒子の導通性評価は、抵抗値が2Ω未満であるものを「非常に良好」(表2中、記号「○」で示す。)とし、抵抗値が2Ω以上5Ω未満であるものを「良好」(表2中、記号「△」で示す。)とし、抵抗値が5Ω以上であるものを「不良」(表2中、記号「×」で示す。)とした。結果を表2に示す。
<Evaluation of continuity>
An insulating adhesive obtained by mixing 100 parts by mass of an epoxy resin, 150 parts by mass of a curing agent and 70 parts by mass of toluene is mixed with 15 parts by mass of the coated particles obtained in Example 2, Comparative Example 2 and Reference Example 1. , An insulating paste was obtained. This paste was applied onto a silicone-treated polyester film using a bar coater, and then the paste was dried to form a thin film on the film. The obtained thin film-forming film was arranged between a glass substrate on which aluminum was vapor-deposited on the entire surface and a polyimide film substrate on which copper patterns were formed at a pitch of 50 μm, and electrical connection was made. By measuring the conduction resistance between the substrates, the conductivity of the coated particles was evaluated at room temperature (25 ° C., 50% RH). It can be evaluated that the lower the resistance value, the higher the conductivity of the coated particles. The conductivity evaluation of the coated particles is "very good" when the resistance value is less than 2Ω (indicated by the symbol "○" in Table 2), and "good" when the resistance value is 2Ω or more and less than 5Ω. (Indicated by the symbol "Δ" in Table 2), and those having a resistance value of 5Ω or more were designated as "defective" (indicated by the symbol "x" in Table 2). The results are shown in Table 2.

<絶縁性の評価>
微小圧縮試験機MCTM−500(株式会社島津製作所製)を用いて、20個の被覆粒子を対象として、負荷速度0.5mN/秒の条件で実施例2、比較例2及び参考例1の被覆粒子を圧縮し、抵抗値が検出されるまでの圧縮変位を測定することで被覆粒子の絶縁性を評価した。抵抗値が検出されるまでの圧縮変位が大きいほど、被覆粒子の絶縁性が高いものであると評価できる。被覆粒子の絶縁性評価は、抵抗値が検出されるまでの圧縮変位の算術平均値が10%以上であるものを「非常に良好」(表2中、記号「○」で示す。)とし、圧縮変位の算術平均値が3%超10%未満であるものを「良好」(表2中、記号「△」で示す。)とし、圧縮変位の算術平均値が3%以下であるものを「不良」(表2中、記号「×」で示す。)とした。結果を表2に示す。
<Evaluation of insulation>
Using the micro-compression tester MCTM-500 (manufactured by Shimadzu Corporation), 20 coated particles were coated with Example 2, Comparative Example 2 and Reference Example 1 under the condition of a load speed of 0.5 mN / sec. The insulating properties of the coated particles were evaluated by compressing the particles and measuring the compressive displacement until the resistance value was detected. It can be evaluated that the larger the compressive displacement until the resistance value is detected, the higher the insulating property of the coated particles. For the insulation evaluation of the coated particles, those having an arithmetic mean value of compressive displacement of 10% or more until the resistance value is detected are regarded as "very good" (indicated by the symbol "○" in Table 2). An arithmetic mean value of compression displacement of more than 3% and less than 10% is regarded as "good" (indicated by the symbol "△" in Table 2), and an arithmetic mean value of compression displacement of 3% or less is "good". "Defective" (indicated by the symbol "x" in Table 2). The results are shown in Table 2.

表2に示す通り、Ti系カップリング剤で表面処理した実施例2の被覆粒子は、表面処理をしていない比較例2の被覆粒子と比べて、導通性を維持しつつ絶縁性にも優れていることが判る。また、比較例2と同程度の被覆率とした参考例1は、比較例2と被覆率が同程度でありながらも絶縁性に優れていることから、Ti系カップリング剤による絶縁効果が得られていることが判る。 As shown in Table 2, the coated particles of Example 2 surface-treated with a Ti-based coupling agent are superior in insulating properties while maintaining conductivity as compared with the coated particles of Comparative Example 2 which are not surface-treated. You can see that. Further, Reference Example 1, which has the same coverage as Comparative Example 2, has the same coverage as Comparative Example 2 but is excellent in insulating properties, so that the insulation effect of the Ti-based coupling agent can be obtained. It turns out that it is done.

本発明の被覆粒子は、絶縁層が有するホスホニウム基と、導電性の導電性粒子の表面に配されたチタン系化合物とに起因して、絶縁層と導電性粒子が優れた密着性を有する。このような本発明の被覆粒子は、高い接続信頼性を有しうる。 In the coating particles of the present invention, the insulating layer and the conductive particles have excellent adhesion due to the phosphonium group contained in the insulating layer and the titanium-based compound arranged on the surface of the conductive conductive particles. Such coated particles of the present invention can have high connection reliability.

Claims (13)

芯材表面に金属皮膜が形成され、且つ疎水性基を有するチタン系化合物が該金属皮膜の外表面に配された導電性粒子と、
前記導電性粒子を被覆する絶縁層と、を有する被覆粒子であって、
前記絶縁層が、電荷を有する官能基を含む化合物を有する、被覆粒子。
Conductive particles in which a metal film is formed on the surface of the core material and a titanium-based compound having a hydrophobic group is arranged on the outer surface of the metal film,
A coated particle having an insulating layer for coating the conductive particle.
Coated particles in which the insulating layer contains a compound containing a charged functional group.
前記絶縁層が、複数の微粒子からなるか、又は連続皮膜である、請求項1に記載の被覆粒子。 The coating particle according to claim 1, wherein the insulating layer is composed of a plurality of fine particles or is a continuous film. 前記疎水性基が、炭素原子数2以上30以下の脂肪族炭化水素基である、請求項1又は2に記載の被覆粒子。 The coated particle according to claim 1 or 2, wherein the hydrophobic group is an aliphatic hydrocarbon group having 2 to 30 carbon atoms. 前記電荷を有する官能基が、ホスホニウム基又はアンモニウム基である、請求項1〜3の何れか1項に記載の被覆粒子。 The coated particle according to any one of claims 1 to 3, wherein the functional group having an electric charge is a phosphonium group or an ammonium group. 前記金属皮膜が、ニッケル、金、銀、銅、パラジウム、ニッケル合金、金合金、銀合金、銅合金及びパラジウム合金から選ばれる少なくとも1種を含む金属皮膜である、請求項1〜4の何れか1項に記載の被覆粒子。 Any of claims 1 to 4, wherein the metal film is a metal film containing at least one selected from nickel, gold, silver, copper, palladium, nickel alloys, gold alloys, silver alloys, copper alloys and palladium alloys. The coated particle according to item 1. 前記絶縁層が、スチレン類、エステル類及びニトリル類から選ばれる少なくとも1種の重合性単量体の重合体からなる、請求項1〜5の何れか1項に記載の被覆粒子。 The coating particle according to any one of claims 1 to 5, wherein the insulating layer is made of a polymer of at least one polymerizable monomer selected from styrenes, esters and nitriles. 前記導電性粒子が、表面に複数の突起を有する、請求項1〜6の何れか1項に記載の被覆粒子。 The coated particle according to any one of claims 1 to 6, wherein the conductive particle has a plurality of protrusions on the surface. 請求項1〜7の何れか1項に記載の被覆粒子と絶縁性樹脂とを含む導電性材料。 A conductive material containing the coating particles according to any one of claims 1 to 7 and an insulating resin. 電荷を有する官能基を有する重合性化合物を含む重合性組成物を重合させて、表面に電荷を有する官能基を有する絶縁性微粒子を得る第1工程、及び導電性粒子の表面に疎水性基を有するチタン系化合物を有させる第2工程(第1工程及び第2工程は、何れを先に行ってもよく、同時に行ってもよい。)、並びに
絶縁性微粒子を含む分散液と、表面に疎水性基を有するチタン系化合物を有する導電性粒子とを混合して、導電性粒子表面に荷電官能基を有する絶縁性微粒子を付着させる第3工程、を有する被覆粒子の製造方法。
The first step of polymerizing a polymerizable composition containing a polymerizable compound having a charged functional group to obtain insulating fine particles having a charged functional group on the surface, and a hydrophobic group on the surface of the conductive particles. The second step (the first step and the second step may be performed first or at the same time) for having the titanium-based compound to have, a dispersion liquid containing insulating fine particles, and hydrophobicity on the surface. A method for producing coated particles, which comprises a third step of mixing conductive particles having a titanium-based compound having a sex group and adhering insulating fine particles having a charged functional group to the surface of the conductive particles.
更に、前記第3工程で得られた被覆粒子を加熱することにより、絶縁性微粒子を溶融状態として導電性粒子表面を膜状に被覆する第4工程を有する、請求項9に記載の被覆粒子の製造方法。 The coated particles according to claim 9, further comprising a fourth step of heating the coated particles obtained in the third step to melt the insulating fine particles and coat the surface of the conductive particles in a film shape. Production method. 更に、前記第3工程で得られた被覆粒子を、その分散液に有機溶剤を添加することにより、絶縁性微粒子を溶解状態として、導電性粒子表面を膜状に被覆する第4工程を有する、請求項9に記載の被覆粒子の製造方法。 Further, the coating particles obtained in the third step have a fourth step of coating the surface of the conductive particles in a film shape with the insulating fine particles in a dissolved state by adding an organic solvent to the dispersion liquid. The method for producing coated particles according to claim 9. 前記疎水性基が、炭素原子数2以上30以下の脂肪族炭化水素基である、請求項9〜11の何れか1項に記載の被覆粒子の製造方法。 The method for producing coated particles according to any one of claims 9 to 11, wherein the hydrophobic group is an aliphatic hydrocarbon group having 2 to 30 carbon atoms. 前記電荷を有する官能基が、ホスホニウム基又はアンモニウム基である、請求項9〜12の何れか1項に記載の被覆粒子の製造方法。 The method for producing coated particles according to any one of claims 9 to 12, wherein the charged functional group is a phosphonium group or an ammonium group.
JP2020556006A 2018-11-07 2019-10-30 Coating particles, conductive materials containing them, and methods for producing coating particles Active JP6825170B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018209996 2018-11-07
JP2018209996 2018-11-07
PCT/JP2019/042620 WO2020095796A1 (en) 2018-11-07 2019-10-30 Coated particle, electrically conductive material comprising same, and method of manufacturing coated particle

Publications (2)

Publication Number Publication Date
JP6825170B2 true JP6825170B2 (en) 2021-02-03
JPWO2020095796A1 JPWO2020095796A1 (en) 2021-03-25

Family

ID=70611833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020556006A Active JP6825170B2 (en) 2018-11-07 2019-10-30 Coating particles, conductive materials containing them, and methods for producing coating particles

Country Status (5)

Country Link
JP (1) JP6825170B2 (en)
KR (1) KR20210083246A (en)
CN (1) CN112740338B (en)
TW (1) TWI820245B (en)
WO (1) WO2020095796A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115989252A (en) * 2020-08-24 2023-04-18 日本化学工业株式会社 Coated particles and method for producing same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001513697A (en) * 1997-02-24 2001-09-04 スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー Aerosol method and apparatus, particle product, and electronic device manufactured from the particle product
JP4563110B2 (en) * 2004-08-20 2010-10-13 積水化学工業株式会社 Method for producing conductive fine particles
TWI356425B (en) * 2005-03-24 2012-01-11 Nippon Catalytic Chem Ind Coated fine particle and their manufacturing metho
JP4872620B2 (en) * 2006-11-17 2012-02-08 Tdk株式会社 Method for producing transparent conductive film
CN102474023A (en) * 2009-07-01 2012-05-23 日立化成工业株式会社 Coated conductive particles and method for producing same
JP4640532B2 (en) * 2009-07-02 2011-03-02 日立化成工業株式会社 Coated conductive particles
JP5512306B2 (en) * 2010-01-29 2014-06-04 日本化学工業株式会社 Method for producing conductive particles
CN102560448B (en) * 2010-12-21 2014-01-08 苏州纳微生物科技有限公司 Preparation method of composite microsphere containing dendritic structure polymer, anisotropic conductive material and anisotropic conductive film
JP5609716B2 (en) * 2011-03-07 2014-10-22 デクセリアルズ株式会社 Light-reflective anisotropic conductive adhesive and light-emitting device
CN103030728B (en) * 2011-09-06 2017-09-26 日立化成株式会社 Insulating wrapped particle, insulating wrapped conducting particles, anisotropic conductive material and connection structural bodies
JP2013203932A (en) * 2012-03-29 2013-10-07 Mitsubishi Chemicals Corp Polycarbonate resin composition and molded article
JP6188456B2 (en) * 2012-07-03 2017-08-30 積水化学工業株式会社 Conductive particles with insulating particles, conductive material, and connection structure
JP6411119B2 (en) * 2013-08-02 2018-10-24 積水化学工業株式会社 Base particle, conductive particle, conductive material, and connection structure
JPWO2016063941A1 (en) * 2014-10-22 2017-08-03 積水化学工業株式会社 Conductive particles, conductive materials, and connection structures
CN107615403B (en) * 2015-09-24 2021-12-24 积水化学工业株式会社 Conductive particle, conductive material, and connection structure
WO2017138482A1 (en) * 2016-02-10 2017-08-17 日立化成株式会社 Conductive particles, insulated coated conductive particles, anisotropic conductive adhesive, connected structure and method for producing conductive particles
CN108604481A (en) * 2016-02-10 2018-09-28 日立化成株式会社 Insulation-coated electroconductive particles, anisotropic conductive adhesive and connection structural bodies
JP2017224602A (en) * 2016-06-13 2017-12-21 積水化学工業株式会社 Conductive material, connection structure and method for producing connection structure

Also Published As

Publication number Publication date
CN112740338B (en) 2022-09-06
TWI820245B (en) 2023-11-01
CN112740338A (en) 2021-04-30
TW202031936A (en) 2020-09-01
KR20210083246A (en) 2021-07-06
WO2020095796A1 (en) 2020-05-14
JPWO2020095796A1 (en) 2021-03-25

Similar Documents

Publication Publication Date Title
JP6458204B1 (en) Coated particle and method for producing the same
JP6772401B2 (en) Coating particles
JP6825170B2 (en) Coating particles, conductive materials containing them, and methods for producing coating particles
JP7404099B2 (en) Coated particles, their manufacturing method, and conductive materials containing them
JP7358065B2 (en) coated particles
WO2022044913A1 (en) Coated particles and method for manufacturing same
JP7062555B2 (en) Coated particles
JP7160801B2 (en) Coated particles and method for producing the same
JP7373965B2 (en) Coated particles, conductive materials containing the same, and methods for producing coated particles
JP7430610B2 (en) Coated particles and their manufacturing method
JP2022126363A (en) Method for producing coated particles
JP2024016497A (en) Insulating fine particles and coated particles

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20201118

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20201118

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20201118

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20201202

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210105

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210113

R150 Certificate of patent or registration of utility model

Ref document number: 6825170

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250