JP6823494B2 - Temperature controller - Google Patents

Description

The present invention relates to a temperature control device.

Conventionally, as a technique related to a temperature control device, for example, those disclosed in Patent Document 1 and the like have already been proposed.

Patent Document 1 is recovered from a load of a semiconductor manufacturing facility for the main purpose of providing a temperature control system for the semiconductor manufacturing facility capable of minimizing the power consumed for cooling and heating. A temperature control system that cool-controls a heat medium (Coolant) and supplies it at a target temperature, and is a mixer that mixes a low-temperature heat medium and a high-temperature heat medium and supplies them to a load; And the first thermoelectric element block provided by cooling the heat medium of the first heat medium tank; the second thermoelectric element block provided by cooling the recovered heat medium and provided to the first heat medium tank. With the thermoelectric element block; the heat medium of the cooled first heat medium tank provided through the first thermoelectric element block is provided to the mixer at a first ratio, and the other heat medium is provided with the second thermoelectric element. A first three-way switching valve that bypasses the block to allow the first heat carrier tank to recover; a second heat carrier tank that stores the high temperature heat medium; and a heat medium in the second heat carrier tank. With a first heater for heating; a second heater for heating the recovery heat medium and providing it to the second heat medium tank; and a heat medium for a second heat medium tank heated through the first heater. With a second three-way switching valve that provides the mixer at a second ratio and bypasses the other heat medium to the second heater so that the second heat medium tank recovers; recover from load. The heat medium to be provided is provided to the second thermoelectric element block at the first ratio, and is configured to include a third three-way switching valve provided to the second heater at the second ratio. Is.

JP-A-2015-79930

In the present invention, the distribution ratio of the low temperature side fluid and the high temperature side fluid can be controlled with high accuracy as compared with the case where a conventional switching valve or the like having an intermediate opening degree is used as the three-way switching valve, and the temperature can be controlled. An object of the present invention is to provide a temperature control device capable of controlling the control temperature of a control means in a plurality of stages.

The invention according to claim 1 comprises a temperature control means having a temperature control flow path through which a temperature control fluid including a low temperature side fluid and a high temperature side fluid having an adjusted mixing ratio flows.
A first supply means for supplying the low temperature side fluid adjusted to a predetermined first temperature on the low temperature side, and
A second supply means for supplying the high temperature side fluid adjusted to a predetermined second temperature on the high temperature side, and
The low temperature side fluid connected to the first supply means and the second supply means and supplied from the first supply means and the high temperature side fluid supplied from the second supply means are mixed. With the mixing means supplied to the temperature control flow path
A flow rate control three-way valve that distributes the temperature control fluid flowing through the temperature control flow path to the first supply means and the second supply means while controlling the flow rate.
With
The three-way valve for flow control is
Rectangular cross section and the square tubular shape wherein the temperature control fluid flows out to be distributed to the first supply means of the inlet and the temperature control fluid temperature control fluid flows through the temperature control flow path flows A cylindrical shape in which a second valve port having a rectangular cross section and a square tube shape is formed from which the temperature control fluid to be distributed to the second supply means among the first valve port and the temperature control fluid flows out. The valve body, which has a valve seat consisting of empty spaces,
A predetermined center rotatably arranged in the valve seat of the valve body so as to switch the first valve port from the closed state to the open state and at the same time to switch the second valve port from the open state to the closed state. A valve body formed in a semi-cylindrical shape with angles and both end faces along the circumferential direction formed in a curved or planar shape.
A driving means for rotationally driving the valve body and
It is a temperature control device characterized by having.

According to the second aspect of the present invention, the flow rate control three-way valve supplies the temperature control flow path to the first supply according to the mixing ratio of the low temperature side fluid and the high temperature side fluid in the mixing means. The temperature control device according to claim 1, wherein the temperature control device is distributed to the means and the second supply means.

According to the third aspect of the present invention, the temperature control means includes first and second temperature detecting means for detecting the temperatures of the inflow portion and the outflow portion of the temperature control flow path.
Based on the detection results of the first and second temperature detecting means, the mixing means is set so that the temperature at an arbitrary point between the inflow portion and the outflow portion of the temperature control flow path becomes the target temperature. The temperature control device according to claim 1 or 2, wherein the mixing ratio of the low temperature side fluid and the high temperature side fluid is controlled.

According to the present invention, the distribution ratio of the low temperature side fluid and the high temperature side fluid can be controlled with high accuracy as compared with the case where a conventional three-way valve is used as the three-way switching valve, and the control temperature of the temperature control means can be controlled. It is possible to provide a temperature control device capable of controlling the above in a plurality of stages.

It is a conceptual diagram which shows the whole system including the constant temperature maintenance device (chiller device) as the temperature control device which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the plasma processing apparatus. It is a block diagram which shows the semiconductor element manufactured by the whole system including the constant temperature maintenance apparatus (chiller apparatus) as the temperature control apparatus which concerns on Embodiment 1 of this invention, and the plasma processing apparatus. It is a graph which shows the temperature controlled by mixing the low temperature and high temperature side fluids supplied from the constant temperature maintenance device (chiller device) which concerns on Embodiment 1 of this invention. It is a block diagram which shows the constant temperature maintenance apparatus (chiller apparatus) to which the three-way valve for flow rate control which concerns on Embodiment 1 of this invention is applied. It is an external perspective view which shows the three-way valve type motor valve as an example of the three-way valve for flow rate control which concerns on Embodiment 1 of this invention. It is the front view which shows the three-way valve type motor valve as an example of the three-way valve for flow rate control which concerns on Embodiment 1 of this invention, the right side view of the same, and the bottom view of the actuator part. FIG. 5 is a cross-sectional view taken along the line AA of FIG. 2B showing a three-way valve type motor valve as an example of the three-way valve for flow control according to the first embodiment of the present invention. It is sectional drawing of the main part which shows the three-way valve type motor valve as an example of the three-way valve for flow rate control which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the valve actuating part. It is a block diagram which shows the valve shaft. It is sectional drawing which shows the valve actuating part. It is a graph which shows the characteristic of the three-way valve type motor valve as an example of the three-way valve for flow rate control which concerns on Embodiment 1 of this invention. It is a graph which shows the characteristic of the three-way valve type motor valve as an example of the three-way valve for flow rate control which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the main part of the three-way valve type motor valve as an example of the three-way valve for flow rate control which concerns on Embodiment 1 of this invention. It is a schematic diagram which shows the temperature control characteristic of the chiller apparatus which concerns on Embodiment 1 of this invention. It is a graph which shows the characteristic of temperature.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[Embodiment 1]
FIG. 1 is a conceptual diagram showing an entire system including a constant temperature maintenance device (chiller device) that enables multi-step temperature control as an example of the temperature control device according to the first embodiment of the present invention.

This chiller device 100 is used, for example, in a semiconductor manufacturing device that involves plasma etching processing or the like, as will be described later, and keeps the temperature of a semiconductor wafer or the like as an example of a temperature controlled object (work) W constant over multiple stages (multiple stages). It is controlled to maintain the temperature. Here, the term "multi-stage" mainly means three or more stages, but does not exclude two stages.

As shown in FIG. 1, the chiller device 100 includes a low temperature side fluid supply unit 101 that supplies a low temperature side fluid adjusted to a predetermined constant temperature on the low temperature side, and a predetermined constant temperature on the high temperature side. It is provided with a high temperature side fluid supply unit 102 that supplies the high temperature side fluid adjusted to. The low-temperature side fluid supplied from the low-temperature side fluid supply unit 101 and the high-temperature side fluid supplied from the high-temperature side fluid supply unit 102 are mixed in a mixing ratio via a first flow control three-way valve 103 as an example of the mixing means. Is mixed in an adjusted state and sent to the temperature control unit 104 as an example of a temperature control means including an electrostatic chuck (ESC: Electro Static Chuck) that holds a temperature control target (work) W as a temperature control fluid. Be done.

The temperature control unit 104 has a temperature control flow path 105 (see FIG. 2) in which the low temperature side fluid and the high temperature side fluid are mixed at a required mixing ratio and a temperature control fluid adjusted to a required temperature flows. doing. A second as an example of a distribution means that distributes the temperature control fluid to the low temperature side fluid supply unit 101 and the high temperature side fluid supply unit 102 at a required ratio (distribution ratio) on the outflow side of the temperature control flow path 105. The three-way valve 106 for controlling the flow rate of the above is provided.

Between the first flow control three-way valve 103 and the temperature control unit 104, there is a first flow sensor 107 that measures the flow rate of the temperature control fluid and a first temperature sensor that measures the temperature of the temperature control fluid. 108 is arranged. The temperature control unit 104 is provided with a third temperature sensor 109 that measures the temperature of the temperature control unit 104, if necessary. Further, a second temperature sensor 110 for measuring the temperature of the temperature control fluid is arranged between the temperature control unit 104 and the second flow rate control three-way valve 106.

The chiller device 100 is a temperature control fluid that is a mixed fluid by changing the mixing ratio of the low temperature side fluid supplied from the low temperature side fluid supply unit 101 and the high temperature side fluid supplied from the high temperature side fluid supply unit 102. The temperature is adjusted, and the temperature of the temperature control unit 104 provided with the temperature control flow path 105 through which the temperature control fluid flows is set to a required temperature range (for example, the temperature of the temperature control fluid flowing through the temperature control unit 104). It is controlled over −20 ° C. to + 120 ° C.).

The low temperature side fluid supply unit 101 supplies, for example, the low temperature side fluid set at −20 ° C. at a flow rate of 30 L / min and a pressure of 0.8 MPa. Further, the high temperature side fluid supply unit 102 supplies, for example, the high temperature side fluid set at + 100 ° C. at a flow rate of 30 L / min and a pressure of 0.8 MPa. The low temperature side fluid and the high temperature side fluid are the same fluid. Examples of the heat medium (brine) used as the low-temperature side fluid and the high-temperature side fluid include a fluorine-based inert liquid such as Fluorinert (registered trademark) that can be used in a temperature range of about -30 to + 120 ° C., ethylene glycol, and the like. Fluids are mentioned. However, if the temperature range is about +20 to + 80 ° C., the low temperature side fluid is water (pure water, etc.) adjusted to a temperature of about 0 to 30 ° C. at a pressure of 0 to 1 MPa, and the high temperature side fluid is Water (pure water or the like) adjusted to a temperature of about 50 to 80 ° C. can also be preferably used.

In FIG. 1, reference numeral 111 indicates a common tank for storing the temperature control fluid common to the low temperature side fluid supply unit 101 and the high temperature side fluid supply unit 102. From the common tank 111, the temperature control fluid is appropriately supplied to the low temperature side fluid supply unit 101 and the high temperature side fluid supply unit 102.

As a semiconductor manufacturing apparatus to which the chiller apparatus 100 is applied, a plasma processing apparatus 200 accompanied by plasma processing can be mentioned.

As shown in FIG. 2, the plasma processing apparatus 200 includes a vacuum vessel (chamber) 201. Inside the vacuum vessel (chamber) 201, an electrostatic chuck 104 (ESC: Electro Static Chuck) is provided as an example of a temperature control unit that holds the semiconductor wafer W to be temperature controlled in an electrostatically attracted state. ing. Inside the electrostatic chuck 104, a temperature control flow path 105 through which the temperature control fluid of the chiller device 100 flows is provided. Further, the plasma processing device 200 is also used as an electrostatic chuck 104, and is arranged so as to face the lower electrode (cathode electrode) 202 coupled to the lid portion and the lower electrode 202, and the lid portion is integrally formed. The upper electrode (anode electrode) 203 is provided.

Further, the vacuum vessel 201 is opened with a gas suction port 201a for introducing an active gas (reactive gas) for etching. The upper electrode 203 is connected to the ground potential (GND) via a lid portion extending outward. Further, the lower electrode 202 is connected to the radio frequency (RF) oscillator 204 and the blocking capacitor 205 via a lid portion extending outward. The radio frequency (RF) oscillator 204 is connected to the ground potential (GND). Further, in the vacuum vessel 201, light emission detection for monitoring the light emission state when etching by plasma treatment is performed by generating plasma for etching on the outside of the window portion provided on the wall facing the gas suction port 201a. A vessel 206 is provided.

Incidentally, in a state where the active gas is ionized by the plasma treatment, the positive ions of the active gas are attracted to the temperature control target W located on the lower electrode 202 side as the cathode electrode and are subjected to etching. The electrons generated by ionizing the active gas by plasma treatment behave in various ways. The electrons flow to the ground potential through the upper electrode 203, and a considerable portion of the electrons are stored in the blocking capacitor 205 through the lower electrode 202.

Examples of the temperature control target W whose temperature is controlled by the chiller device 100 include a semiconductor element, a flat panel display (FPD), a solar cell, and the like. In the present embodiment, the temperature control target W includes a semiconductor wafer used for a three-dimensional NAND flash memory. As shown in FIG. 3, the three-dimensional NAND type flash memory 300 has a plurality of SiO ₂ layers 302 and Poly-Si layers 303 that are continuously laminated on the Si substrate 301. The number of layers of the SiO ₂ layer 302 and the Poly—Si layer 303 is set to, for example, 24 layers, but it goes without saying that the number may be larger or smaller than this. The flat plate-shaped Poly-Si layer 303 serves as a control electrode for NV-MOS, and the SiO ₂ layer 302 serves as an insulating layer located between them. Holes 304 penetrating from the uppermost layer to the lowermost layer are formed by etching in the laminated film of the plurality of laminated SiO ₂ layer 302 and Poly-Si layer 303. The opening size of the hole 304 is set to, for example, about 50 nm or less. The ratio (aspect ratio) between the opening size and the depth of the hole 304 is about 50 to 100 or more. As shown in FIG. 3B, a SONOS structure 305 is formed inside the hole 304. The SONOS structure 305 is composed of a SiO ₂ layer 306 arranged concentrically from the outer circumference, a SiN layer 307, a SiO ₂ layer 308, a Poly-Si layer 309, and a SiO ₂ layer 310 located at the center. The SiN layer 307 constituting the SONOS structure 305 is a layer for trapping the electric charge of the SONOS structure 305. The SiO ₂ layer 306 is composed of a thin film of 10 nm or less so that a current due to the tunnel effect flows, and an extremely thin film for strengthening the electric field from the control gate. Poly-Si in the vertical direction in the figure is a portion that becomes a MOS channel, and unlike a normal planar MOS, it is vertical in the hall 304 and is called a V-Channel (vertical channel). Further, in order to take out the continuity from the control electrode on the upper surface, the chip end is etched in a stepwise manner and the electrode is taken out.

The etching process for forming the holes 304 has an aspect ratio when the depth of the holes 304 is about 2400 nm and the diameter of the holes 304 is 50 nm when the number of layers of the SiO ₂ layer 302 and the Poly—Si layer 303 is 24. The ratio is 48 (= 2400/50). As described above, the etching process for forming the holes 304 is an etching process for a substance in which the SiO ₂ layer 302 and the Poly—Si layer 303 are laminated. It is necessary to vertically inject an etching gas (charged particles of plasma) over the entire surface of the semiconductor wafer W having a diameter of about 300 mm, and temperature control of the semiconductor wafer W is important.

In FIG. 3, reference numeral 311 indicates a string selection line, 312 indicates a bit line, 313 indicates a contact line, and 314 indicates an interconnect line.

Therefore, in order to uniformly etch the hole 304 having a high aspect ratio and improve the yield in manufacturing the three-dimensional NAND type flash memory 300, as shown in FIG. 4, plasma is used according to the etching process reached. It becomes necessary to continuously control the temperature of the temperature control target W of the processing apparatus 200 in multiple stages such as 20 ° C, 30 ° C, 40 ° C, and 80 ° C.

Further, the chiller apparatus 100 can not only accurately control the temperature of the semiconductor wafer W in multiple stages, but also need to satisfy the step time in each etching step for the transition time until the target temperature is reached. The step time in each etching process depends on the content of the etching process and the processing capacity of the plasma processing apparatus 200, but is 200 to 300 seconds per step, preferably one step between 20 ° C. and 80 ° C. over a plurality of steps. It is desirable to make the transition with a transition time of about 100 seconds (0.6 ° C./sec) per second.

FIG. 5 is a circuit diagram showing details of a constant temperature maintaining device (chiller device) according to the first embodiment of the present invention.

As described above, this chiller device 100 is used, for example, to control the temperature of the temperature controlled object (work) W held by the electrostatic chuck of the plasma processing device 200 (see FIG. 2) to a required temperature. .. As shown in FIG. 5, the chiller device 100 is roughly classified into a low temperature side fluid supply unit 101 that supplies a low temperature side fluid adjusted to a predetermined constant temperature (for example, −20 ° C.) on the low temperature side. The high temperature side fluid supply unit 102 that supplies the high temperature side fluid adjusted to a predetermined constant temperature (for example, + 100 ° C.) on the high temperature side, and the low temperature side fluid and the high temperature side supplied from the low temperature side fluid supply unit 101. The first flow control three-way valve 103 that mixes the high temperature side fluid supplied from the fluid supply unit 102 to adjust to the required temperature, and the temperature control fluid that has flowed through the temperature control unit 104 are cooled at a required distribution ratio. A second flow control three-way valve 106 that distributes to the side fluid supply unit 101 and the high temperature side fluid supply unit 102, a refrigeration unit 130 that cools the primary side of the low temperature side fluid supply unit 101, and a primary side of the refrigeration unit 130. It is provided with a cooling unit 150 for cooling the fluid.

The low temperature side fluid supply unit 101 includes an on-off valve 112 that introduces the temperature control fluid distributed to the low temperature side fluid supply unit 101 at a required distribution ratio by the second flow rate control three-way valve 106. The temperature control fluid introduced from the on-off valve 112 is supplied to the secondary side of the evaporator 113. A fourth temperature sensor 114 that detects the temperature of the temperature control fluid distributed to the low temperature side fluid supply unit 101 is arranged between the on-off valve 112 and the evaporator 113.

On the downstream side of the evaporator 113 along the flow of the temperature control fluid of the low temperature side fluid supply unit 101, a first heater 116 for heating the temperature control fluid via the fifth temperature sensor 115 is provided. ing. The first heater 116 communicates with the common tank 111, and the temperature control fluid is appropriately supplied from the common tank 111. In the evaporator 113 of the low temperature side fluid supply unit 101, the temperature control fluid distributed to the low temperature side fluid supply unit 101 by the second flow control three-way valve 106 at the required distribution ratio sets the original low temperature side fluid. It is cooled to a temperature lower than the temperature (for example, −20 ° C.) (for example, about −30 ° C.). As the first heater 116, for example, a temperature control fluid cooled by a heating means such as an electric heater to a temperature lower than the original set temperature (for example, −20 ° C.) of the low temperature side fluid by the evaporator 113. A fluid that is heated to the set temperature of the original low-temperature side fluid is used. On the downstream side along the flow of the temperature control fluid of the first heater 116, there is a low temperature side composed of the temperature control fluid heated to a required temperature (for example, −20 ° C.) by the first heater 116. A first pump 117 is arranged to circulate the fluid along the direction of the arrow. A sixth temperature sensor 118 and a second flow rate sensor 119 are arranged in the piping on the outflow side of the low temperature fluid in the first pump 117. The first pump 117 controls the suction amount of the low temperature side fluid by the inverter circuit 125 based on the flow rate of the low temperature side fluid detected by the second flow rate sensor 119 by a control device (not shown). As a result, the temperature control fluid is kept at a substantially constant amount in the common tank 111. The common tank 111 includes a level gauge LG for visually detecting the level of the temperature control fluid and a level sensor that automatically detects the level of the temperature control fluid according to the level of full, medium, lowest, etc. Have. The low temperature side fluid supplied to circulate by the first pump 117 is supplied to one inflow port of the first flow control three-way valve 103 via the first check valve 120.

Further, on the downstream side of the second flow sensor 119 along the flow of the temperature control fluid, an orifice 121 interposed in parallel with the pipe on the inflow side is provided. The orifice 121 constitutes a circuit for holding the total circulation amount of the temperature control fluid when the low temperature side of the first flow control three-way valve 103 is shut off, and functions as a throttle for pressure adjustment. To do. Further, on the downstream side of the first check valve 120, a second check valve 120 and a first shutoff constituting a circuit for air purging at the time of maintenance and collecting the temperature control fluid in the common tank 111. A valve 123 and further a pressure reducing valve 124 are connected.

On the primary side of the evaporator 113 of the low temperature side fluid supply unit 101, a freezing unit 130 for cooling the primary side of the evaporator 113 is arranged. The freezing unit 130 constitutes a vaporization compression type freezing cycle in which a refrigerant (for example, R410 or the like) circulates. The freezing unit 130 compresses the refrigerant gas by the electric compressor 131 and sends it as high-pressure gas to the secondary side of the condenser 132. A first pressure sensor 136 and a seventh temperature sensor 137 are provided on the suction side of the electric compressor 131. The electric compressor 131 is controlled by the inverter circuit 140. Further, an accumulator 141 is connected to the suction side of the electric compressor 131. The accumulator 141 separates the inflowing refrigerant gas and the liquid refrigerant to prevent the liquid refrigerant from being sucked into the electric compressor 131. Further, an eighth temperature sensor 138 is arranged on the outflow side of the electric compressor 131. Further, the upstream portion on the primary side of the evaporator 113 and the upstream portion on the secondary side of the condenser 132 are connected by a bypass pipe via a solenoid valve 139. In the condenser 132, the high-pressure gas is condensed and depressurized via the expansion valve 133 of the pressure reducing mechanism, and then sent to the primary side of the evaporator 113 via the solenoid valve 134 to cool the secondary side of the evaporator 113. To do. The evaporator 113 is a primary temperature adjusting circuit having a circuit configuration in which reduced pressure gas is evaporated and sucked into the suction side of the electric compressor 131 to repeat compression again. A second solenoid valve 135 is connected in parallel to the primary side of the evaporator 113.

Further, a cooling unit 150 for cooling the primary side of the condenser 132 is arranged on the primary side of the condenser 132 of the low temperature side fluid supply unit 101. Cooling water is introduced into the cooling unit 150 via on-off valves 151 and 152 arranged on the inflow side and the outflow side, respectively. The cooling water introduced into the cooling unit 150 is supplied to the primary side of the condenser 132 of the low temperature side fluid supply unit 101, cools the secondary side of the condenser 132, and then is water control provided in the outlet side pipe. Returned via valve (WPR) 152. The cooling unit 150 controls the opening and closing of the water control valve (WPR) 152 according to the pressure detected by the pressure gauge 155 connected to the discharge side of the condenser 132 while the pressure switch 154 is on, and flows through the pipe. The flow rate of cooling water is controlled.

Further, as will be described later, the cooling unit 150 is also used as a cooling unit for cooling the heat exchanger 163 of the high temperature side fluid supply unit 102.

In the illustrated embodiment, the case where the condenser 132 is cooled by the water-cooled cooling unit 150 has been described, but the cooling unit 150 is configured to cool the condenser 132 with cold air using a cooling fan. You may.

On the other hand, as shown in FIG. 5, in the high temperature side fluid supply unit 102, the temperature control fluid distributed to the high temperature side fluid supply unit 102 by the second flow rate control three-way valve 106 at a required distribution ratio is the second. It includes a heat exchanger 163 supplied via an on-off valve 161 and a three-way valve 162. The temperature control fluid distributed to the high temperature side fluid supply unit 101 by the second flow rate control three-way valve 106 is supplied to the secondary side of the heat exchanger 163. A seventh temperature sensor 164 for detecting the temperature of the temperature control fluid distributed to the high temperature side fluid supply unit 102 is provided between the on-off valve 161 and the heat exchanger 163.

A second heater 166 for heating the temperature control fluid via the eighth temperature sensor 165 is provided on the downstream side of the heat exchanger 163 of the high temperature side fluid supply unit 102 along the flow of the temperature control fluid. Has been done. In the heat exchanger 163 of the high temperature side fluid supply unit 102, the temperature of the temperature control fluid distributed to the high temperature side fluid supply unit 102 side at the required distribution ratio by the second flow rate control three-way valve 106 is originally set. Adjust to a temperature lower than the temperature (for example, + 80 ° C.) (for example, about + 70 ° C.). As the second heater 166, for example, one that heats the temperature control fluid to the temperature of the required high temperature side fluid by a heating means such as an electric heater is used. On the downstream side along the flow of the temperature control fluid of the second heater 166, the high temperature side fluid heated to the required temperature (for example, + 80 ° C.) by the second heater 166 is along the arrow direction. A second pump 167 is arranged for circulation. Further, on the downstream side along the flow of the high temperature side fluid of the second pump 167, a ninth temperature sensor 168 for detecting the temperature of the high temperature side fluid and a third flow rate for detecting the flow rate of the high temperature side fluid are provided. The sensor 169 is arranged.

The second pump 167 controls the suction amount of the high temperature side fluid by the inverter circuit 174 based on the flow rate of the high temperature side fluid detected by the third flow rate sensor 169 by a control device (not shown). As a result, the temperature control fluid is kept at a substantially constant amount in the common tank 111.

Further, on the downstream side of the third flow sensor 169 along the flow of the high temperature side fluid, an orifice 171 interposed in parallel with the pipe on the inflow side is provided. Similar to the above-mentioned orifice 121, the orifice 171 constitutes a circuit for maintaining the total circulation amount of the temperature control fluid when the high temperature side of the first flow rate control three-way valve 103 is shut off. Functions as a throttle for pressure adjustment. Further, on the downstream side of the third check valve 170, a fourth check valve 172 and a second check valve constituting a circuit for air purging at the time of maintenance to collect the temperature control fluid in the common tank 111 and a second shutoff. A valve 173 and further a pressure reducing valve 124 are connected.

The above-mentioned cooling unit 150 for cooling the primary side of the heat exchanger 163 is connected to the primary side of the heat exchanger 163 of the high temperature side fluid supply unit 102 via a control valve 156.

The three-way valve 162 bypasses the heat exchanger 163 and the flow rate of the temperature control fluid supplied to the heat exchanger 163 according to the temperature of the temperature control fluid measured by the eighth temperature sensor 164. The flow rate of the temperature control fluid directly supplied to the heater 166 is controlled.

As described above, in the chiller device 100 according to the present embodiment, the low temperature side fluid supplied from the low temperature side fluid supply unit 101 and the high temperature side fluid supplied from the high temperature side fluid supply unit 102 are used for the first flow rate control. It is mixed by the three-way valve 103 at a required mixing ratio and supplied to the temperature control flow path 105. Further, the temperature control fluid supplied to the temperature control flow path 105 is distributed to the low temperature side fluid supply unit 101 and the high temperature side fluid supply unit 102 at a required distribution ratio by the second flow rate control three-way valve 106. , It is circulated to the low temperature side fluid supply unit 101 and the high temperature side fluid supply unit 102.

<Structure of three-way valve for flow control>
The chiller device 100 described above includes first and second flow control three-way valves as mixing means and distribution means. The first and second three-way valves for flow control are basically configured in the same manner except that the inflow port and the outflow port have an opposite relationship. Here, a three-way valve type motor valve used as a second flow control three-way valve 106 as a distribution means will be described as a representative.

The three-way valve type motor valve 1 is configured as a rotary three-way valve. As shown in FIG. 6, the three-way valve type motor valve 1 is roughly classified and is arranged between the valve portion 2 arranged at the lower part, the actuator part 3 arranged at the upper part, and the valve part 2 and the actuator part 3. It is composed of a sealing portion 4 and a coupling portion 5.

As shown in FIGS. 7 to 9, the valve portion 2 includes a valve body 6 formed in a substantially rectangular parallelepiped shape by a metal such as SUS. As shown in FIG. 8, the valve body 6 has a first flow in which a fluid distributed to a low-temperature side fluid supply unit 101 as a first fluid flows out on one side surface (left side surface in the illustrated example). The outlet 7 and the first valve opening 9 having a rectangular cross section communicating with the valve seat 8 formed of a cylindrical vacant space are opened. On the left side surface of the valve body 6, a first flange member 10 for connecting a pipe (not shown) for flowing out the fluid distributed to the low temperature side fluid supply unit 101 is attached by four hexagon socket head bolts 11. There is. The first flange member 10 is made of a metal such as SUS like the valve body 6. The first flange member 10 includes a flange portion 12 formed in the same side surface rectangular shape as the side surface shape of the valve body 6, an insertion portion 13 projecting from the inner side surface of the flange portion 12 in a thin cylindrical shape, and the like. It has a pipe connecting portion 14 which is projected from the outer surface of the flange portion 12 in a substantially cylindrical shape with a thick wall and to which a pipe (not shown) is connected. The inner circumference of the pipe connecting portion 14 is set to, for example, Rc1 / 2, which is a tapered female screw having a diameter of about 21 mm. A chamfer 16 for mounting the O-ring 15 is provided between the outer inner peripheral end of the first outlet 7 of the valve body 6 and the flange portion 12 of the first flange member 10.

The valve body 6 has a second outlet 17 on the other side surface (the right side surface in the illustrated example) through which the fluid distributed to the high temperature side fluid supply unit 102 as the second fluid flows out, and a cylindrical shape. The second valve openings 18 having a rectangular cross section communicating with the valve seat 8 formed of an empty space are opened. On the right side surface of the valve body 6, a second flange member 19 for connecting a pipe (not shown) for flowing out the fluid distributed to the high temperature side fluid supply unit 102 is attached by four hexagon socket head bolts 20. There is. The second flange member 19 is made of a metal such as SUS like the first flange member 10. The second flange member 19 includes a flange portion 21 formed in the same side surface rectangular shape as the side surface shape of the valve body 6, an insertion portion 22 projecting from the inner side surface of the flange portion 21 in a thin cylindrical shape, and the like. It has a pipe connecting portion 23 which is projected from the outer surface of the flange portion 21 in a substantially cylindrical shape with a thick wall and to which a pipe (not shown) is connected. The inner circumference of the pipe connecting portion 23 is set to, for example, Rc1 / 2, which is a tapered female screw having a diameter of about 21 mm. A chamfer 25 for mounting the O-ring 24 is provided between the outer inner peripheral end of the second outlet 17 of the valve body 6 and the flange portion 21 of the second flange member 19.

Further, the inflow port 26 into which the temperature control fluid to be divided into the fluid distributed to the low temperature side fluid supply unit 101 and the fluid distributed to the high temperature side fluid supply unit 102 flows into the valve body 6 on the lower end surface thereof. Is open. A third flange member 27 for connecting a pipe (not shown) for flowing a temperature control fluid is attached to the lower end surface of the valve body 6 by four hexagon socket head cap screws 28. The third flange member 27 is made of a metal such as SUS like the first and second flange members 10 and 19. The third flange member 27 includes a flange portion 29 formed in a flat rectangular shape smaller than the shape of the lower end surface of the valve body 6, an insertion portion 30 projecting from the upper end surface of the flange portion 29 in a thin cylindrical shape, and the like. It has a pipe connecting portion 31 which is projected from the lower end surface of the flange portion 29 in a substantially cylindrical shape with a thick wall and to which a pipe (not shown) is connected. The inner circumference of the pipe connecting portion 31 is set to, for example, Rc1 / 2, which is a tapered female screw having a diameter of about 21 mm. A chamfer 33 for mounting the O-ring 32 is provided between the lower end inner peripheral end of the inflow port 26 of the valve body 6 and the flange portion 29 of the third flange member 27.

At the center of the valve body 6, a valve seat 8 is provided in which a second valve opening 18 having a rectangular cross section is formed like the first valve opening 9 having a rectangular cross section. The valve seat 8 is formed of a vacant space formed in a cylindrical shape corresponding to the outer shape of the valve body described later. The valve seat 8 formed in a cylindrical shape is provided so as to penetrate the upper end surface of the valve body 6. As shown in FIG. 10, the first valve port 9 and the second valve port 18 provided in the valve body 6 are axisymmetric with respect to the central axis (rotation axis) C of the valve seat 8 formed in a cylindrical shape. It is located in. More specifically, the first valve port 9 and the second valve port 18 are arranged so as to be orthogonal to the valve seat 8 formed in a cylindrical shape, and one end of the first valve port 9 is provided. The edge is opened at a position facing the other end edge of the second valve port 18 (position different by 180 degrees) via the central axis C. Further, the other end edge of the first valve port 9 is opened at a position facing one end edge of the second valve port 18 (a position different by 180 degrees) via the central axis C.

Further, as shown in FIG. 9, the first valve port 9 and the second valve port 18 are formed of openings formed in a rectangular cross section such as a square cross section. The length of one side of the first valve port 9 and the second valve port 18 is set to be smaller than the diameters of the first outlet 7 and the second outlet 17, and the first outlet 7 is set. It is formed in a rectangular cross section inscribed in the second outlet 17.

As shown in FIG. 11, the valve shaft 34 as an example of the valve body is formed of a metal such as SUS to have a substantially cylindrical outer shape. The valve shaft 34 is roughly divided into a valve body portion 35 that functions as a valve body, and upper and lower shaft support portions 36 and 37 that are provided above and below the valve body portion 35 and rotatably support the valve shaft 34. A seal portion 38 provided on the upper portion of the shaft support portion 36 and a coupling portion 40 provided on the upper portion of the seal portion 38 via the tapered portion 39 are integrally provided.

The upper and lower shaft support portions 36 and 37 are each formed in a cylindrical shape having an outer diameter smaller than that of the valve body portion 35 and having the same diameter. The length of the lower shaft branch 37 along the axial direction is set to be slightly longer than that of the upper shaft branch 36. As shown in FIG. 8, the lower shaft support portion 37 is rotatably supported by a lower end portion of a valve seat 8 provided on the valve body 6 via a bearing 41. An annular support portion 42 that supports the bearing 41 is provided below the valve seat 8 so as to project toward the inner circumference. The bearing 41, the support portion 42, and the insertion portion 30 of the third flange member 27 are set to have the same inner diameter, and the temperature control fluid that has passed through the inside of the valve body portion 35 does not generate any resistance. It is configured to flow out to the connecting portion 31 of the flange member 27 of the above. On the other hand, a thrust washer 43 is mounted on the upper shaft branch 36 to reduce the load generated when the valve shaft 34 is pressed against the seal housing 53 described later.

Further, as shown in FIGS. 10 and 11, the valve body portion 35 has an opening height H2 lower than the opening height H1 (see FIG. 8) of the first and second valve openings 9 and 18. It is formed in a cylindrical shape provided with a cylindrical opening 44. The valve operating portion 45 provided with the opening 44 of the valve body portion 35 has a semi-cylindrical shape (for example, about 190 degrees) having a predetermined central angle α (excluding the opening 44 in the cylindrical portion). It is formed in a substantially semi-cylindrical shape). The valve operating portion 45 switches the first valve opening 9 from the closed state to the open state including the valve body portions 35 located above and below the opening 44, and at the same time, opens the second valve opening 18 in the opposite direction. It is rotatably arranged in the valve seat 8 and in contact with the inner peripheral surface of the valve seat 8 so as to switch from the closed state to the closed state. As shown in FIG. 11, the upper and lower valve shaft portions 46 and 47 arranged above and below the valve operating portion 45 are formed in a cylindrical shape having the same outer diameter as the valve operating portion 45, and are formed in a cylindrical shape of the valve seat 8. In order to prevent the metals from biting each other on the inner peripheral surface, they are rotatably arranged so as to be in a non-contact state through a minute gap. Inside the valve operating portion 45, the upper and lower valve shaft portions 46, 47, and the seal portion 38, a cylindrical vacant space 48 having a small diameter at the upper end is provided so as to penetrate toward the lower end. ..

Further, the valve operating portion 45 has a curved cross-sectional shape formed along a direction in which both end faces 45a and 45b along the circumferential direction (rotational direction) intersect (orthogonally) the central axis C thereof. Further, as shown in FIG. 10, the valve operating portion 45 has an arc shape in which the cross-sectional shape intersecting the rotation axes C of both end portions 45a and 45b along the circumferential direction forms a convex shape toward the opening 44. It is formed. The radius of curvature of both end portions 45a and 45b is set to, for example, 1/2 of the thickness T of the valve operating portion 45. As a result, the cross-sectional shapes of both ends 45a and 45b become semicircular.

The cross-sectional shape of the valve operating portion 45 that intersects the rotation axis C of both end portions 45a and 45b along the circumferential direction is not limited to an arc shape, and both end surfaces 45a and 45b along the circumferential direction (rotation direction). Should be formed in a curved shape. As shown in FIG. 10B, the valve operating portion 45 includes a first curved portion 50 whose cross-sectional shape intersecting the rotation axes C of both end portions 45a and 45b along the circumferential direction is located on the outer peripheral surface side. It is also possible to form a curved shape in which a second curved portion 51 located on the inner peripheral surface side and having a radius of curvature smaller than that of the first curved portion 50 is smoothly connected.

As shown in FIG. 10, both ends 45a and 45b of the valve operating portion 45 along the circumferential direction are cooled to a low temperature when the valve shaft 34 is rotationally driven to open and close the first and second valve openings 9 and 18. In the flow of the side fluid and the high temperature side fluid, the first and second valve openings 9 and 18 are moved (rotated) so as to protrude or retract from the ends along the circumferential direction. The valve openings 9 and 18 of No. 2 are shifted from the open state to the closed state or from the closed state to the open state. At this time, the both end portions 45a and 45b along the circumferential direction of the valve operating portion 45 linearly change the opening areas of the first and second valve openings 9 and 18 with respect to the rotation angle of the valve shaft 34. Therefore, the cross-sectional shape is formed into a curved surface shape.

Further, as shown in FIG. 15, when both end portions 45a and 45b along the circumferential direction of the valve operating portion 45 are formed in a planar shape along the radial direction, the opening degree of the valve shaft 34 is 50%. When the amount exceeds, the inner peripheral end of the valve operating portion 45 protrudes from the outer peripheral end in a direction that reduces the opening widths of the first and second valve openings 9, 18 and the first and first valve shafts 34 with respect to the rotation angle. This is because it is difficult to change the opening areas of the valve openings 9 and 18 of No. 2 linearly as compared with the case where the valve ports 9 and 18 are formed in a curved shape. However, the present invention does not exclude the case where both end portions 45a and 45b along the circumferential direction of the valve operating portion 45 are formed in a planar shape along the radial direction.

On the other hand, when both end portions 45a and 45b along the circumferential direction of the valve operating portion 45 are formed to have a curved cross-sectional shape, the opening degree of the valve shaft 34 increases as shown in FIG. 12B. Even if it exceeds 50%, it is possible to linearly change the opening areas of the first and second valve openings 9 and 18 with respect to the rotation angle of the valve shaft 34.

Therefore, both end portions 45a and 45b along the circumferential direction of the valve operating portion 45 are like blades protruding from the flow of the fluid flowing out from the first and second valve openings 9 and 18 into the valve chamber 8. It is assumed that the effect will occur. Therefore, both end portions 45a and 45b along the circumferential direction of the valve operating portion 45, which acts like a blade protruding into the fluid, are important for limiting or opening the flow of the fluid to control the flow rate of the fluid. Plays a role. Depending on the flow of the fluid around both ends 45a and 45b along the circumferential direction of the valve operating portion 45 protruding into the fluid, the opening areas of the first and second valve openings 9 and 18 may be used as the valve operation of the valve shaft 34. Even when the fluid is changed linearly by the portion 45, the flow rates of the low-temperature side and high-temperature side fluids flowing out and mixed in the valve chamber 8 are not always changed linearly (linearly).

According to various studies by the present inventors, both ends of the valve operating portion 45 along the circumferential direction are used to linearly control the flow rates of the low-temperature side and high-temperature side fluids divided in the valve chamber 8. It was found that the cross-sectional shapes of 45a and 45b play an important role. Then, the present inventors linearly (linearly) the flow rates of the low-temperature side and high-temperature side fluids by forming the cross-sectional shapes of both end portions 45a and 45b along the circumferential direction of the valve operating portion 45 into a curved surface shape. We found that we could control it.

As shown in FIG. 8, the seal portion 4 seals the valve shaft 34 in a liquid-tight state. The seal portion 4 has a seal housing 53 formed in a cylindrical shape having an insertion hole 52 through which the valve shaft 34 is inserted by a metal such as SUS. The seal housing 53 is inserted and fixed in a cylindrical recess 54 provided on the upper end surface of the valve body 6 with a sealant applied, or is screwed into the recess 54 by a male screw portion (not shown) provided on the outer circumference. It is attached to the valve body 6 in a sealed state by means such as being worn. On the inner peripheral surface of the seal housing 53, two annular seal members 55 and 56 composed of an O-ring or the like for sealing the valve shaft 34 are arranged vertically. As the sealing members 55 and 56, for example, an O-ring made of hydrogenated acrylonitrile-butadiene rubber (H-NBR) having excellent heat resistance, oil resistance, and weather resistance is used. The seal housing 53 is mounted in the recess 54 of the valve body 6 so as to be aligned with the parallel pin 57.

The coupling portion 5 is arranged between the valve body 6 in which the seal portion 4 is built and the actuator portion 3. The coupling portion 5 is for connecting the valve shaft 34 and the rotating shaft 58 that integrally rotates the valve shaft 34. The coupling portion 5 is in a state of penetrating inside the spacer member 59 arranged between the seal portion 4 and the actuator portion 3, the adapter plate 60 fixed to the upper portion of the spacer member 59, and the spacer member 59 and the adapter plate 60. It is housed in the cylindrical space 61 formed by the above, and is composed of a coupling member 62 that connects the valve shaft 34 and the rotating shaft 58. The spacer member 59 is made of a metal such as SUS and is formed in a rectangular cylinder shape having a substantially same planar shape as the valve body 6 and having a relatively low height. The spacer member 59 is fixed to both the valve body 6 and the adapter plate 60 by means such as screwing. Further, as shown in FIG. 2C, the adapter plate 60 is formed of a metal such as SUS into a flat polygonal plate shape. The adapter plate 60 is attached in a state of being fixed to the base 64 of the actuator portion 3 by a hexagon socket head cap screw 63.

As shown in FIG. 8, the coupling member 62 is formed in a cylindrical shape by a metal, a heat-resistant synthetic resin, or the like. A concave groove 65 is provided at the upper end of the valve shaft 34 so as to penetrate along the horizontal direction. The valve shaft 34 is connected and fixed to the coupling member 62 via the concave groove 65 by a connecting pin 66 provided so as to penetrate the coupling member 62. On the other hand, the lower end of the rotating shaft 58 is connected and fixed to the coupling member 62 by a connecting pin 67 provided so as to penetrate the coupling member 62. The spacer member 59 has an opening 68 on the side surface for detecting the liquid leaked through the insertion hole 52 when the liquid leaks from the sealing members 55 and 56. The opening 68 is set to, for example, Rc1 / 16, which is a tapered female screw having a diameter of about 8 mm.

As shown in FIG. 7, the actuator unit 3 includes a base 64 formed in a rectangular shape in a plane. A casing 70 formed as a rectangular parallelepiped box body containing a driving means including a stepping motor, an encoder, and the like is mounted on the upper portion of the base 64 by screw 71 fixing. The driving means of the actuator unit 3 may be any as long as it can rotate the rotating shaft 58 in a desired direction with a predetermined accuracy based on a control signal, and its configuration is not limited. The driving means includes a stepping motor, a driving force transmission mechanism that transmits the rotational driving force of the stepping motor to the rotating shaft 58 via a driving force transmitting means such as a gear, and an angle of an encoder or the like that detects the rotational angle of the rotating shaft 58. It consists of sensors.

In FIG. 7, reference numeral 72 indicates a stepping motor side cable, and 73 indicates an angle sensor side cable. The stepping motor side cable 72 and the angle sensor side cable 73 are each connected to a control device (not shown) that controls the three-way valve type motor valve 1.

<Operation of chiller device>
In the chiller device, the temperature of the temperature controlled object is controlled as follows.

In the chiller device 100 according to the present embodiment, for example, as shown in FIG. 4, the temperature of the temperature control unit 104 is controlled. In the chiller device 100, as shown in FIG. 5, the low temperature side fluid supply unit 101 supplies the low temperature side fluid adjusted to a required temperature (for example, −20 ° C.). Further, a high temperature side fluid adjusted to a required temperature (for example, + 100 ° C.) is supplied from the high temperature side fluid supply unit 102.

The low temperature side fluid supplied from the low temperature side fluid supply unit 101 and the high temperature side fluid supplied from the high temperature side fluid supply unit 102 are mixed by the first flow control three-way valve 103 at a required mixing ratio, and are required. It is supplied to the temperature control unit 104 as a temperature control fluid.

When the temperature of the temperature control unit 104 is set to + 20 ° C. as shown in FIG. 4, the low temperature side supplied from the low temperature side fluid supply unit 101 so that the temperature of the temperature control fluid becomes + 20 ° C. The fluid and the high temperature side fluid supplied from the high temperature side fluid supply unit 102 are mixed by the first flow control three-way valve 103.

At this time, the low temperature side fluid supplied from the low temperature side fluid supply unit 101 and the high temperature side fluid supplied from the high temperature side fluid supply unit 102 are supplied by the first flow control three-way valve 103 as shown in FIG. The mixing ratio is controlled. That is, when the temperature of the temperature control unit 104 is Tsp, which is the required set temperature, the temperature on the inflow side of the temperature control unit 104 is detected by the first temperature sensor 108 and as shown in FIG. , The temperature on the outflow side of the temperature control unit 104 is detected by the third temperature sensor 110.

The control device divides the deviation ΔT between the temperature on the inflow side of the temperature control unit 104 and the temperature on the outflow side of the temperature control unit 104 into a required number (for example, 80), and serves as an arbitrary point of the temperature control unit 104. The low temperature side fluid supplied from the low temperature side fluid supply unit 101 and the high temperature side fluid supplied from the high temperature side fluid supply unit 102 so that the temperature at the intermediate point (center) becomes Tsp, which is the required set temperature. Control the mixing ratio.

Further, as shown in FIG. 5, the chiller device 100 uses the second flow rate control three-way valve 106 to connect the temperature control fluid flowing through the temperature control unit 104 to the low temperature side fluid supply unit 101 and the high temperature side fluid supply unit 102. Divide into.

The division ratio of the low temperature side fluid supply unit 101 and the high temperature side fluid supply unit 102 in the second flow rate control three-way valve 106 is basically the low temperature side fluid and the high temperature side in the first flow rate control three-way valve 103. It is set to a value equal to the mixing ratio with the fluid. However, the temperature control fluid mixed by the first flow rate control three-way valve 103 at a required mixing ratio flows through the temperature control flow path 105 of the temperature control unit 104 to the second flow rate control three-way valve 106. In order to reach the temperature control fluid, the first flow rate control three-way valve 103 delays the time required for the temperature control fluid to reach the second flow rate control three-way valve 106, and the second flow rate control three-way valve 106 The division ratio in is controlled.

As described above, the temperature control fluid divided into the low temperature side fluid supply unit 101 and the high temperature side fluid supply unit 102 by the second flow rate control three-way valve 106 has the same temperature. As shown in FIG. 17, the temperature of this temperature control fluid is Tsp + X / 80 × ΔT.

Therefore, the low temperature side fluid supply unit 101 cools the temperature control fluid having a temperature of Tsp + X / 80 × ΔT to a required temperature (-20 ° C.) and supplies it to the first flow rate control three-way valve 103. Further, the high temperature side fluid supply unit 102 heats the temperature control fluid having a temperature of Tsp + X / 80 × ΔT to a required temperature (+ 100 ° C.) and supplies it to the first flow rate control three-way valve 103.

Similarly, when the temperature of the temperature control unit 104 is set to + 30 ° C, + 40 ° C, and + 80 ° C as shown in FIG. 4, the temperature of the temperature control fluid becomes + 30 ° C, + 40 ° C, and + 80 ° C, respectively. As described above, the mixing ratio of the low temperature side fluid supplied from the low temperature side fluid supply unit 101 and the high temperature side fluid supplied from the high temperature side fluid supply unit 102 is adjusted by the first flow control three-way valve 103. Is mixed with. In the plasma processing device 200, the temperature of the semiconductor wafer (heat load), which is the temperature control target W, rises as shown in FIG. 17 due to the generation of plasma accompanying the etching process. Therefore, the chiller device 100 is shown in FIGS. As shown in 16, the temperature of the temperature control fluid is controlled so that the temperature Tin on the inflow side with respect to the target temperature Tsp is Tin = Tsp-{(80-X) / 80} × ΔT.

As described above, according to the chiller device 100 described above, the distribution ratio of the low temperature side fluid and the high temperature side fluid is higher than that in the case of using a conventional switching valve or the like having no intermediate opening degree as the three-way switching valve. It can be controlled with accuracy, and the control temperature of the temperature control means can be controlled in a plurality of stages.

Moreover, the chiller device 100 has a mixing ratio of the low temperature side fluid and the high temperature side fluid to be supplied to the first flow control three-way valve 103, although it depends on the supply capacity of the low temperature side fluid supply unit 101 and the high temperature side fluid supply unit 102. And since the temperature of the temperature control fluid can be controlled only by controlling the distribution ratio of the low temperature side fluid and the high temperature side fluid distributed by the second flow rate control three-way valve 106, the transition time until the target temperature is reached. Can be significantly shortened.

1 ... Three-way valve type motor valve 2 ... Valve part 3 ... Actuator part 4 ... Seal part 5 ... Coupling part 6 ... Valve body 7 ... First inflow port 8 ... Valve seat 9 ... First valve port 10 ... First Flange member 11 ... Hexagon socket head bolt 12 ... Flange part 13 ... Insertion part 14 ... Piping connection part 15 ... O-ring 16 ... Chamfering 17 ... Second inflow port 18 ... Second valve port 19 ... Second flange member 20 ... Hexagon socket head bolt 21 ... Flange part 22 ... Insertion part 23 ... Piping connection part 34 ... Valve shaft 35 ... Valve body part 45 ... Valve operating parts 45a, 45b ... Both ends 100 ... Chiller device 101 ... Low temperature side fluid supply part 102 ... High temperature side fluid supply unit 103 ... Mixing means (three-way valve for flow control)
106 ... Three-way valve for flow control

Claims (3)

A temperature control means having a temperature control flow path through which a temperature control fluid composed of a low temperature side fluid and a high temperature side fluid whose mixing ratio is adjusted flows.
A first supply means for supplying the low temperature side fluid adjusted to a predetermined first temperature on the low temperature side, and
A second supply means for supplying the high temperature side fluid adjusted to a predetermined second temperature on the high temperature side, and
The low temperature side fluid connected to the first supply means and the second supply means and supplied from the first supply means and the high temperature side fluid supplied from the second supply means are mixed. With the mixing means supplied to the temperature control flow path
A flow rate control three-way valve that distributes the temperature control fluid flowing through the temperature control flow path to the first supply means and the second supply means while controlling the flow rate.
With
The three-way valve for flow control is
Rectangular cross section and the square tubular shape wherein the temperature control fluid flows out to be distributed to the first supply means of the inlet and the temperature control fluid temperature control fluid flows through the temperature control flow path flows A cylindrical shape in which a second valve port having a rectangular cross section and a square tube shape is formed from which the temperature control fluid to be distributed to the second supply means among the first valve port and the temperature control fluid flows out. The valve body, which has a valve seat consisting of empty spaces,
A predetermined center rotatably arranged in the valve seat of the valve body so as to switch the first valve port from the closed state to the open state and at the same time to switch the second valve port from the open state to the closed state. A valve body formed in a semi-cylindrical shape with angles and both end faces along the circumferential direction formed in a curved or planar shape.
A driving means for rotationally driving the valve body and
A temperature control device characterized by having. The flow rate control three-way valve distributes the temperature control flow path to the first supply means and the second supply means according to the mixing ratio of the low temperature side fluid and the high temperature side fluid in the mixing means. The temperature control device according to claim 1, wherein the temperature control device is provided. The temperature control means includes first and second temperature detecting means for detecting the temperatures of the inflow portion and the outflow portion of the temperature control flow path.
Based on the detection results of the first and second temperature detecting means, the mixing means is set so that the temperature at an arbitrary point between the inflow portion and the outflow portion of the temperature control flow path becomes the target temperature. The temperature control device according to claim 1 or 2, wherein the mixing ratio of the low temperature side fluid and the high temperature side fluid is controlled.

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