JP6816907B1 - Mycelium generation prevention method and mycelium generation prevention device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for surely preventing the generation of mycelium or the like generated in a plating solution stored in a plating tank when the operation of a plating operation line is stopped. SOLUTION: In order to achieve this object, a method for preventing the generation of mycelium or the like in a stored plating solution, in which ultraviolet rays are irradiated from above the liquid level of the stored plating solution in a plating tank using an ultraviolet lamp. A method for preventing the generation of mycelium, etc., which is characterized by this, is adopted. In addition, a mycelium generation prevention device for implementing this mycelium generation prevention method will be adopted. [Selection diagram] Fig. 1

Description

The present invention relates to a method for preventing the generation of mycelium and the like and a device for preventing the generation of mycelium and the like. In particular, the present invention relates to a method for preventing the generation of mycelium and the like in a stored plating solution and a device for preventing the generation of mycelium and the like.

The plating operation line is not always in operation, and may be stopped in accordance with the production plan. Even in the case of this suspension of operation, the plating solution that does not require a new bath may be stored in the plating tank. In such a case, if the operation is stopped for several days, mycelium or microorganisms (hereinafter referred to as "mycelium or the like") may be generated in the plating solution in the plating tank.

When such mycelium or the like is mixed in the plating solution, the quality of the plating film formed becomes significantly deteriorated. Therefore, after the operation of the plating operation line is stopped and before the operation is restarted, it is necessary to remove mycelium and the like generated in the plating solution. Moreover, the work of removing the mycelium and the like is usually performed manually and has a large labor load. Further, the fact that the work of removing mycelium and the like is necessary is not preferable because it takes a certain amount of time to restart the plating operation, which leads to an extension of the operation time and causes a decrease in productivity.

In order to solve such problems, sterilization by ultraviolet (UV) irradiation, a method using a photocatalyst / ozone, a method of adding chemicals (hypochlorous acid, formalin, etc.) and the like have been adopted. Above all, it has been desired to use an ultraviolet irradiation method that does not use unnecessary chemicals and does not deteriorate the plating solution.

In Patent Document 1, in order to provide an ultraviolet sterilizer for water that is safe and easy to handle, "it has an opening, an inlet and an outlet provided facing the outside, and is provided inside the apparatus main body. A UV jacket, a jacket lid that is detachably fixed to the opening of the UV jacket from the outside of the main body of the device, a UV lamp that emits a sterilizing line, and a UV lamp that is arranged in the flow path of the UV jacket and has the UV lamp inside. An outer tube that is stored in the UV jacket to block contact with the fluid in the UV jacket, a control board that generates a low DC voltage, and a high-frequency high voltage that is connected to the output end of the control board and lights the UV lamp. A water ultraviolet sterilizer including an generated inverter board is provided with a connector for connecting the inverter board and the control board outside the main body of the device. "

In Patent Document 2, "in a circulation pipe that includes a circulation pump and a filtration filter and circulates a solution having a high metal concentration in a plating-related tank, a magnetic field and a DC current are applied to at least a part of the pipe to cause microorganisms. A method for suppressing microbial growth in a plating-related tank, which is characterized by "preventing adhesion", has been adopted.

That is, in both Patent Document 1 and Patent Document 2, the plating solution stored in the plating tank is circulated while the operation of the plating operation line is stopped, and the generation of mycelium or the like in the plating solution is suppressed in the middle of the circulation path. It is to be processed.

Japanese Unexamined Patent Publication No. 10-85734 Japanese Unexamined Patent Publication No. 2011-52309

However, although the methods disclosed in Patent Documents 1 and 2 have been tested on a trial basis, it is difficult to stably suppress the generation of mycelium and the like in the plating solution stored in the plating tank. It could be confirmed. Therefore, in the market, a method for more reliably preventing mycelium and the like generated in the plating solution stored in the plating tank when the operation of the plating operation line is stopped has been desired.

Therefore, in order to solve the above problems, as a result of diligent research, we came up with the following method for preventing the generation of mycelium and the like in the stored plating solution and the device for preventing the generation of mycelium and the like.

A. Mycelium generation prevention method The mycelium generation prevention method according to the present application is a method for preventing the generation of mycelium, etc. in the stored plating solution, and is 0.5 cm to 300 cm above the liquid level of the stored plating solution in the plating tank. From the position of, the liquid level of the stored plating solution is irradiated with ultraviolet rays using an ultraviolet lamp of 1 W to 300 W.

In the method for preventing the generation of mycelium and the like according to the present application, the wavelength of ultraviolet rays emitted from the ultraviolet lamp is preferably 172 nm to 380 nm.

In the method for preventing the generation of mycelium, etc. according to the present application, the irradiation of ultraviolet rays is performed continuously or intermittently, and in the case of intermittent irradiation, the cumulative irradiation time per hour is 1 minute to 59 minutes. It is preferable to perform intermittent irradiation.

In the method for preventing the generation of mycelium and the like according to the present application, it is preferable to irradiate the ultraviolet rays so that the ultraviolet rays hit the entire surface of the stored plating solution.

B. Mycelium generation prevention device The mycelium generation prevention device according to the present application uses an ultraviolet lamp above the stored plating solution in the plating tank in order to implement the above-mentioned mycelium generation prevention method according to the present application. It is characterized by providing an ultraviolet lamp mounting means for arranging.

In the mycelium generation prevention device according to the present application, it is preferable that the ultraviolet lamp attaching means is provided with a reflector for efficiently guiding the light of the ultraviolet lamp toward the stored plating solution.

The device for preventing the generation of mycelium, etc. according to the present application may be provided with an ultraviolet lamp control means for intermittently irradiating ultraviolet rays and performing intermittent irradiation with an integrated irradiation time of 1 minute to 59 minutes per hour. preferable.

By using the method for preventing the generation of mycelium or the like according to the present application, it is possible to reliably prevent the generation of mycelium or the like in the plating solution stored in the plating tank. Therefore, even if the plating operation line is temporarily stopped, the work of removing mycelium and the like until the restart is unnecessary, and the time until the restart can be significantly shortened.

In addition, the mycelium generation prevention device according to the present application can efficiently and uniformly irradiate the surface of the plating solution in the stored state with ultraviolet rays from the ultraviolet source. Moreover, as an apparatus, it is easy to change the design such as changing the mounting means and the shape of the reflector according to the shape of the existing plating tank and the like.

It is a schematic front view which shows an example of the mycelium generation prevention device which concerns on this application. It is a figure which looked at the mycelium generation prevention device which concerns on this application from the left side of FIG.

Hereinafter, the mycelium generation prevention method and the mycelium generation prevention device according to the present application will be described in order.

A. Form of mycelium generation prevention method according to the present application The mycelium generation prevention method according to the present application is, as shown in FIGS. 1 and 2, from above the liquid level S of the stored plating solution 11 in the plating tank 10. The ultraviolet lamp L is used to irradiate ultraviolet rays (ultraviolet light).

Height of arrangement of the ultraviolet lamp from the liquid surface: The irradiation of ultraviolet rays in the method for preventing the generation of mycelium or the like according to the present application is preferably performed from a position 0.5 cm to 300 cm away from the liquid surface S. This means that the ultraviolet lamp L is arranged at the "distance in the height direction between the ultraviolet lamp L and the liquid level S of the plating solution 11" indicated by the symbol h in FIG. 1, and h = 0.5 cm to 300 cm. Means. Here, when the ultraviolet lamp L is arranged at a position less than h = 0.5 cm from the liquid surface S, the droplets of the plating solution 11 are markedly adhered to the ultraviolet lamp L, and the ultraviolet rays to the liquid surface S (solid line in FIG. 2). If the irradiation area (arrow) is narrow and the surface of the plating solution 11 is heated, water evaporation may occur and the composition of the plating solution 11 may fluctuate, which is not preferable. On the other hand, when the ultraviolet lamp L is arranged at a position exceeding h = 300 cm from the liquid surface S, neither the droplets of the plating solution 11 nor the irradiation area of the ultraviolet rays on the liquid surface S is narrowed, but the highest output ultraviolet rays. Even if the lamp L is used, the irradiation intensity of ultraviolet rays on the surface of the plating solution 11 is lowered, and the bactericidal effect of mycelia and the like is lowered, which is not preferable.

Output of ultraviolet lamp: It is preferable to use an ultraviolet lamp L having an output in the range of 1 W to 300 W. When the output of the ultraviolet lamp L is less than 1 W, even if the ultraviolet lamp L is placed close to the liquid surface S at h = 0.5 cm, the sterilization and sterilization effect on the mycelium generated on the liquid surface S can be obtained. It is not preferable because it cannot be obtained. On the other hand, when the output of the ultraviolet lamp L exceeds 300 W, the closer the ultraviolet lamp L is to the liquid surface S, the more water evaporates due to heating with respect to the liquid surface S, which may induce composition fluctuation of the plating solution 11. Is not preferable because it increases.

Wavelength of ultraviolet rays: The ultraviolet lamp L used in the method for preventing the generation of mycelium or the like according to the present application preferably has a wavelength of ultraviolet rays of 172 nm to 380 nm. As the wavelength of this ultraviolet ray, it is preferable to select a wavelength band including a wavelength of 253.7 nm, which is said to have the highest sterilization / sterilization effect. However, even if the wavelength of ultraviolet rays does not include 253.7 nm, if the wavelength is in the range of 172 nm to 380 nm, sufficient sterilization and sterilization can be performed by adjusting the irradiation time and the height h from the liquid surface S. The effect can be obtained.

Ultraviolet irradiation method: In the method for preventing the generation of mycelium or the like according to the present application, it is ideal that the ultraviolet irradiation is continuously irradiated while the plating solution 11 is stored in the plating tank 10. However, continuous irradiation with ultraviolet rays increases the amount of electricity used, which is likely to lead to an increase in manufacturing costs. Therefore, it is preferable to adopt a method of intermittently irradiating the ultraviolet rays by turning on / off the energization of the ultraviolet lamp L. In such a case, it is preferable to employ intermittent irradiation in which the integrated irradiation time per hour is 1 minute to 59 minutes for the irradiation of the plating solution 11 with ultraviolet rays. Here, the integrated irradiation time is the total time of irradiation with ultraviolet rays per hour by turning on / off the energization of the ultraviolet lamp L. That is, when the cumulative irradiation time per hour is 30 minutes, the ultraviolet lamp L is energized alternately in the "ON state for 15 minutes" and the "OFF state for 15 minutes" in one hour. When "30 minutes ON state" and "30 minutes OFF" are alternately performed in 1 hour, "10 minutes ON state" and "10 minutes OFF" are alternately performed in 1 hour. Cases etc. are included. The longer the cumulative irradiation time per hour, the more surely it is possible to prevent the generation of mycelium and the like generated in the plating solution.

Then, it is preferable that the ultraviolet irradiation in the method for preventing the generation of mycelium or the like according to the present application is performed so that the ultraviolet rays hit the entire surface of the stored plating solution 11. This is because when the ultraviolet rays do not hit the entire surface of the stored plating solution 11, mycelium and the like are likely to be generated in the portion not exposed to the ultraviolet rays, which is not preferable.

B. Form of mycelium generation prevention device according to the present application The mycelium generation prevention device 1 according to the present application is stored in a plating tank 10 in order to carry out the above-mentioned mycelium generation prevention method according to the present application. The ultraviolet lamp attaching means 2 for arranging the ultraviolet lamp L above the plating solution 11 is provided. At this time, the ultraviolet lamp attaching means 2 is as long as the ultraviolet lamp L can be arranged above the stored plating solution 11 so that the surface of the stored plating solution 11 in the plating tank 10 can be irradiated with the ultraviolet rays emitted by the ultraviolet lamp L. No special restrictions are required. As for various conditions such as the shape and output of the ultraviolet lamp L, it is preferable to adopt the conditions described in the above-mentioned method for preventing mycelium generation according to the present application.

The mycelium generation prevention device 1 according to the present application may be provided with a reflector 3 for efficiently guiding the light of the ultraviolet lamp L toward the stored plating solution 10 as the ultraviolet lamp attaching means 2. preferable. This is because by providing the reflector 3, it becomes easy to change the traveling direction of the ultraviolet rays (dashed line arrows in FIG. 2) irradiated by the ultraviolet lamp L and apply the ultraviolet rays to the entire surface of the stored plating solution 11. The reflector 3 at this time may be made of metal, glass, or resin as long as it has a mirror surface capable of reflecting light.

Here, when the metal reflector 3 is used, it is preferable to use a stainless steel material, a nickel material, or a titanium material having excellent corrosion resistance to the plating solution 11. At this time, in order to facilitate the attachment / detachment work of the reflector 3, a lightweight material such as an aluminum plate or a duralumin plate is used as a core material, and a highly corrosion-resistant layer such as a stainless steel layer, a nickel layer, or a titanium layer is provided only on the surface thereof. It doesn't matter. When glass, acrylic resin, or the like is used as the reflector 3, the inside of the plating tank 10 can be seen from the bright side where the ultraviolet lamp L is lit, and from the dark side outside the plating device on the back surface. It is also preferable to use an inorganic or organic mirror glass that is visible. This is because the ultraviolet rays are effectively cut so as not to adversely affect the human body, and the inside of the plating tank 10 can be visually confirmed with the reflector 3 attached. Further, in the case of the above-mentioned resin-made reflector, the surface that reflects ultraviolet rays may be provided with a metal surface having a mirror gloss formed by using an electroless plating method, an electrolytic plating method, a physical vapor deposition method, or the like. preferable. This is to obtain higher reflection efficiency.

The mycelium generation prevention device 1 according to the present application intermittently irradiates ultraviolet rays, and is an ultraviolet lamp control means for performing intermittent irradiation having an integrated irradiation time of 1 minute to 59 minutes per hour. (Not shown) is preferably provided. The "ultraviolet lamp control means" referred to here is electrically connected to the ultraviolet lamp L, and as described in the above-mentioned "ultraviolet irradiation method", continuously irradiates ultraviolet rays or energizes the ultraviolet lamp L. This is for controlling the intermittent ultraviolet irradiation that turns ON / OFF. Since the control method is as described above, the duplicate description here will be omitted.

Hereinafter, the present invention will be described with reference to Examples and Comparative Examples.

In the first embodiment, the mycelium generation prevention device 1 is provided on both sides of the plating tank 10 so that the ultraviolet rays hit the entire surface of the stored plating solution 11. In the mycelium generation prevention device 1 used in the first embodiment, as shown in FIGS. 1 and 2, the ultraviolet lamp attaching means 2 has an arm shape. The ultraviolet lamp attaching means 2 is provided with an ultraviolet lamp attaching jig (not shown) on one end side in order to arrange the ultraviolet lamp L above the stored plating solution 11 housed in the plating tank 10. On the other hand, on the other end side of the ultraviolet lamp mounting means 2, a clamp (not shown) for fixing itself to the upper end of the side wall surface of the plating tank 10 is provided. That is, the mycelium generation prevention device 1 used in the first embodiment has an ultraviolet lamp L and an ultraviolet lamp having an arm shape and provided with an ultraviolet lamp mounting jig on one end side and a clamp for fixing on the other end side. It is provided with a lamp mounting means 2. Further, as shown by the broken lines in FIGS. 1 and 2, a stainless steel reflector 3 is provided. Then, in this Example 1, a confirmation test for preventing the occurrence of mycelium or the like was conducted according to the above-mentioned configuration.

The conditions for the mycelium generation prevention confirmation test are as shown in Table 1 below.

Then, under the conditions shown in Table 1, the corresponding plating solution is stored, the occurrence status of mycelium, etc. after 8 hours, 12 hours, 24 hours, and 48 hours has passed, and comparison with the comparative example is possible. The results are shown in Table 2.

In Example 2, the mycelium generation prevention confirmation test was carried out in the same manner as in Example 1. In the second embodiment, in the ultraviolet irradiation method, the ultraviolet lamp L is energized by the ultraviolet lamp control means alternately in the “ON state for 5 minutes” and the “OFF state for 15 minutes”, and the integrated irradiation per hour is performed. The time was controlled to be 15 minutes. Other than that, the experiment was carried out under the same conditions as in Example 1.

In Example 3, the mycelium generation prevention confirmation test was carried out in the same manner as in Example 1. In the third embodiment, in the ultraviolet irradiation method, the ultraviolet lamp L is energized by the ultraviolet lamp control means alternately in the “ON state for 10 minutes” and the “OFF state for 10 minutes”, and the integrated irradiation per hour is performed. The time was controlled to be 30 minutes. Other than that, the experiment was carried out under the same conditions as in Example 1.

In Example 4, the mycelium generation prevention confirmation test was carried out in the same manner as in Example 1. In the fourth embodiment, in the ultraviolet irradiation method of the first embodiment, the ultraviolet lamp L is energized by the ultraviolet lamp control means alternately in "ON state for 20 minutes" and "OFF for 10 minutes" for 1 hour. The total irradiation time per unit was controlled to be 40 minutes. Other than that, the experiment was carried out under the same conditions as in Example 1.

Comparative example

[Comparative Example 1]
In Comparative Example 1, a confirmation test for preventing the occurrence of mycelium and the like was carried out in the same manner as in Example 1. In Comparative Example 1, in the ultraviolet irradiation method, the ultraviolet lamp L is energized by the ultraviolet lamp control means alternately in the “ON state for 0.2 minutes” and “OFF for 19.8 minutes” for 1 hour. The cumulative irradiation time per unit was controlled to be 0.6 minutes. Other than that, the experiment was carried out under the same conditions as in Example 1.

[Comparative Example 2]
In Comparative Example 2, a confirmation test for preventing the occurrence of mycelium and the like was carried out in the same manner as in Example 1. In Comparative Example 2, the experiment was carried out under the same conditions as in Example 1 except that the ultraviolet lamp L was not used.

[Comparison between Examples and Comparative Examples]
The results of the mycelium generation prevention confirmation test between Examples 1 to 4 and Comparative Examples 1 and 2 are shown in Table 2 below.

From the results shown in Table 2, by irradiating ultraviolet rays from above the liquid level S of the stored plating solution 11 in the plating tank 10 using the ultraviolet lamp L, the plating solution 11 is charged when the operation of the plating operation line is stopped. It was found that the generation of mycelium and the like can be reliably prevented. In addition, from the results of Comparative Example 1, when the irradiation of ultraviolet rays is performed intermittently so that the cumulative irradiation time per hour is less than 1 minute, the generation of mycelium or the like in the plating solution 11 is surely prevented. It turned out to be difficult above. Further, from the results of Examples 3 and 4, the ultraviolet irradiation is performed intermittently so that the cumulative irradiation time per hour is 30 minutes or more, so that the operation stop time of the plating operation line is as long as 72 hours. Even if it was present, it was found that the generation of mycelium and the like in the plating solution 11 could be reliably prevented.

The mycelium generation prevention method and the mycelium generation prevention device according to the present application reliably prevent the generation of mycelium and the like generated in the plating solution stored in the plating tank when the operation of the plating operation line is stopped. Therefore, the mycelium generation prevention method and the mycelium generation prevention device according to the present application can be suitably used for the plating operation line.

1 Mycelium generation prevention device 2 UV lamp mounting means 3 Reflector 10 Plating tank 11 Plating liquid h Distance in the height direction between the UV lamp and the liquid level of the plating liquid S Liquid level (plating liquid)
L UV lamp

Claims (7)

It is a method to prevent the generation of mycelium etc. in the stored plating solution.
It is characterized by irradiating the liquid level of the stored plating solution with ultraviolet rays from a position 0.5 cm to 300 cm above the liquid level of the stored plating solution in the plating tank using an ultraviolet lamp of 1 W to 300 W. How to prevent the occurrence of mycelium, etc. The method for preventing the generation of mycelium or the like according to claim 1, wherein the wavelength of ultraviolet rays emitted from the ultraviolet lamp is 172 nm to 380 nm. Irradiation of the ultraviolet rays, which carried out continuously or intermittently, in the case of intermittent, the claim 1 or claim 2 total irradiation time per hour to perform intermittent irradiation of 1 minute to 59 minutes The method for preventing the occurrence of mycelium, etc. The method for preventing the generation of mycelium or the like according to any one of claims 1 to 3 , wherein the irradiation of the ultraviolet rays is performed so that the ultraviolet rays hit the entire surface of the stored plating solution. A device for preventing the generation of mycelium or the like according to any one of claims 1 to 4 , wherein the device for preventing the generation of mycelium or the like is carried out.
A device for preventing the generation of mycelium or the like, which comprises an ultraviolet lamp attaching means for arranging an ultraviolet lamp above the stored plating solution in the plating tank. The device for preventing the generation of mycelium or the like according to claim 5 , wherein the ultraviolet lamp attaching means includes a reflector for efficiently guiding the light of the ultraviolet lamp toward the stored plating solution. The mycelium or the like according to claim 5 or 6 , further comprising an ultraviolet lamp control means for intermittently irradiating ultraviolet rays and performing intermittent irradiation with an integrated irradiation time of 1 minute to 59 minutes per hour. Prevention device.

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