JP6812953B2 - Capacitive pressure sensor - Google Patents

Capacitive pressure sensor Download PDF

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JP6812953B2
JP6812953B2 JP2017220486A JP2017220486A JP6812953B2 JP 6812953 B2 JP6812953 B2 JP 6812953B2 JP 2017220486 A JP2017220486 A JP 2017220486A JP 2017220486 A JP2017220486 A JP 2017220486A JP 6812953 B2 JP6812953 B2 JP 6812953B2
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substrate
movable
pressure sensor
electrode
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JP2019090731A (en
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淳也 山本
淳也 山本
貴弘 増田
貴弘 増田
千紘 宮原
千紘 宮原
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Omron Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Description

本発明は、静電容量式圧力センサに関する。 The present invention relates to a capacitive pressure sensor.

圧力センサは、主として気体や液体の圧力を検出するものであり、気圧センサや高度センサ、水圧センサとして各種の装置に適用されている。また、近年においては、これを高度センサとして利用する場合の一態様として、位置情報を得るためのナビゲーション装置への応用やユーザの運動量を精緻に計測する計測器への応用等、その適用範囲が広がりつつある。 The pressure sensor mainly detects the pressure of gas or liquid, and is applied to various devices as a barometric pressure sensor, an altitude sensor, and a water pressure sensor. Further, in recent years, as one aspect of using this as an altitude sensor, its application range has been expanded to include application to a navigation device for obtaining position information and application to a measuring instrument for precisely measuring a user's momentum. It is spreading.

ＭＥＭＳ（Micro Electro Mechanical System）センサチップとしての静電容量式圧力
センサが知られている。静電容量式圧力センサは、可動電極を有するフレキシブル基板と、固定電極を有する硬質基板とを備えている。可動電極と固定電極との間には、ギャップに応じた静電容量が発生する。静電容量式圧力センサに圧力が印加されることにより、フレキシブル基板が撓み、可動電極と固定電極との間のギャップが変化することで、静電容量の変化を検出する。静電容量の変化に応じた圧力が検出される。静電容量式半導体物理量センサが提案されている（特許文献１参照）。 A capacitive pressure sensor as a MEMS (Micro Electro Mechanical System) sensor chip is known. The capacitance type pressure sensor includes a flexible substrate having a movable electrode and a hard substrate having a fixed electrode. A capacitance is generated between the movable electrode and the fixed electrode according to the gap. When pressure is applied to the capacitance type pressure sensor, the flexible substrate bends and the gap between the movable electrode and the fixed electrode changes, thereby detecting the change in capacitance. The pressure corresponding to the change in capacitance is detected. A capacitance type semiconductor physical quantity sensor has been proposed (see Patent Document 1).

特開２００６−１９４７７１号公報Japanese Unexamined Patent Publication No. 2006-194771

静電容量式圧力センサに圧力が繰り返して印加されることで、フレキシブル基板と硬質基板とが剥離する可能性がある。このような状況に鑑み、本発明は、フレキシブル基板と硬質基板との剥離を抑制した静電容量式圧力センサを提供することを目的とする。 Repeated application of pressure to the capacitive pressure sensor may cause the flexible substrate and the hard substrate to peel off. In view of such a situation, an object of the present invention is to provide a capacitive pressure sensor that suppresses peeling between a flexible substrate and a hard substrate.

本発明では、上記課題を解決するために、以下の手段を採用した。すなわち、本発明は、第１の電極を含み、可撓性を有するフレキシブル基板と、第１の電極に対向して配置される第２の電極を含み、フレキシブル基板との間に中空部を介してフレキシブル基板に対向配置された硬質基板と、フレキシブル基板と硬質基板との間であって、中空部を囲むように設けられ、フレキシブル基板と硬質基板とを接合する接合部と、接合部の周囲であって、フレキシブル基板と硬質基板との間に設けられた補強樹脂と、を備え、中空部において、第１の電極が第２の電極に対して撓むことで生じる静電容量の変化を検出することにより、第１の電極における第２の電極との対向面に向けて印加される圧力を測定する、静電容量式圧力センサであって、補強樹脂が、フレキシブル基板の一部、硬質基板の一部および接合部の一部を覆っている。 In the present invention, the following means are adopted in order to solve the above problems. That is, the present invention includes a flexible substrate including a first electrode and having flexibility, and a second electrode arranged to face the first electrode, via a hollow portion between the flexible substrate. A joint portion between the rigid substrate arranged opposite to the flexible substrate and the flexible substrate and the hard substrate so as to surround the hollow portion and join the flexible substrate and the hard substrate, and around the joint portion. It is provided with a reinforcing resin provided between the flexible substrate and the hard substrate, and changes in capacitance caused by bending of the first electrode with respect to the second electrode in the hollow portion can be obtained. A capacitance type pressure sensor that measures the pressure applied to the surface of the first electrode facing the second electrode by detecting the reinforcing resin, which is a part of a flexible substrate and is hard. It covers a part of the substrate and a part of the joint.

補強樹脂が、フレキシブル基板の一部を覆うことで、フレキシブル基板が補強される。補強樹脂が、硬質基板の一部を覆うことで、硬質基板が補強される。補強樹脂が、接合部の一部を覆うことで、接合部が補強される。補強樹脂が、フレキシブル基板、硬質基板および接合部を補強することで、フレキシブル基板と硬質基板との接合が維持され、フレキシブル基板と硬質基板との剥離が抑制される。 The flexible substrate is reinforced by covering a part of the flexible substrate with the reinforcing resin. The hard substrate is reinforced by covering a part of the hard substrate with the reinforcing resin. The joint is reinforced by the reinforcing resin covering a part of the joint. By reinforcing the flexible substrate, the hard substrate, and the joint portion with the reinforcing resin, the bonding between the flexible substrate and the hard substrate is maintained, and the peeling between the flexible substrate and the hard substrate is suppressed.

上記静電容量式圧力センサにおいて、補強樹脂のヤング率が、フレキシブル基板のヤン
グ率と同一であり又はフレキシブル基板のヤング率よりも小さくてもよく、フレキシブル基板のヤング率が、硬質基板のヤング率よりも小さくてもよい。これにより、静電容量式圧力センサに圧力が印加された際におけるフレキシブル基板の変形が阻害されず、静電容量式圧力センサに印加された圧力を高い精度で測定することができる。 In the above-mentioned capacitive pressure sensor, the Young's modulus of the reinforcing resin may be the same as the Young's modulus of the flexible substrate or smaller than the Young's modulus of the flexible substrate, and the Young's modulus of the flexible substrate is the Young's modulus of the hard substrate. May be smaller than. As a result, the deformation of the flexible substrate when the pressure is applied to the capacitance type pressure sensor is not hindered, and the pressure applied to the capacitance type pressure sensor can be measured with high accuracy.

上記静電容量式圧力センサにおいて、補強樹脂の厚みが、フレキシブル基板の厚みと同一であってもよく又はフレキシブル基板の厚みよりも小さくてもよく、フレキシブル基板の厚みが、硬質基板の厚みよりも小さくてもよい。これにより、静電容量式圧力センサに圧力が印加された際におけるフレキシブル基板の変形が阻害されず、静電容量式圧力センサに印加された圧力を高い精度で測定することができる。 In the capacitance type pressure sensor, the thickness of the reinforcing resin may be the same as the thickness of the flexible substrate or may be smaller than the thickness of the flexible substrate, and the thickness of the flexible substrate may be smaller than the thickness of the hard substrate. It may be small. As a result, the deformation of the flexible substrate when the pressure is applied to the capacitance type pressure sensor is not hindered, and the pressure applied to the capacitance type pressure sensor can be measured with high accuracy.

上記静電容量式圧力センサにおいて、補強樹脂が、硬質基板におけるフレキシブル基板との対向面の一部と、硬質基板の側面と、硬質基板におけるフレキシブル基板との対向面の反対面の少なくとも一部とを覆っていてもよい。硬質基板におけるフレキシブル基板との対向面は、硬質基板の上面である。硬質基板におけるフレキシブル基板との対向面の反対面は、硬質基板の下面である。硬質基板の側面は、硬質基板の上面および下面と連続しており、硬質基板の上面および下面と直交している。補強樹脂が、硬質基板におけるフレキシブル基板との対向面の一部と、硬質基板の側面と、硬質基板の下面の少なくとも一部を覆うことで、フレキシブル基板と硬質基板との剥離が更に抑制される。 In the capacitance type pressure sensor, the reinforcing resin is a part of the surface of the hard substrate facing the flexible substrate, the side surface of the rigid substrate, and at least a part of the opposite surface of the rigid substrate facing the flexible substrate. May be covered. The surface of the hard substrate facing the flexible substrate is the upper surface of the rigid substrate. The opposite surface of the rigid substrate to the flexible substrate is the lower surface of the rigid substrate. The side surface of the hard substrate is continuous with the upper surface and the lower surface of the hard substrate and is orthogonal to the upper surface and the lower surface of the hard substrate. By covering a part of the surface of the hard substrate facing the flexible substrate, the side surface of the hard substrate, and at least a part of the lower surface of the hard substrate, the reinforcing resin further suppresses the peeling between the flexible substrate and the hard substrate. ..

上記静電容量式圧力センサにおいて、フレキシブル基板は第１の電極を複数含んでよく、複数の第１の電極に対応する複数の第２の電極、複数の硬質基板、複数の接合部および複数の補強樹脂を備えてもよい。これにより、フレキシブル基板と複数の硬質基板との接合が維持され、フレキシブル基板と複数の硬質基板との剥離が抑制される。 In the capacitive pressure sensor, the flexible substrate may include a plurality of first electrodes, and a plurality of second electrodes corresponding to the plurality of first electrodes, a plurality of hard substrates, a plurality of joints, and a plurality of joints. A reinforcing resin may be provided. As a result, the bonding between the flexible substrate and the plurality of hard substrates is maintained, and the peeling of the flexible substrate and the plurality of hard substrates is suppressed.

本発明によれば、フレキシブル基板と硬質基板との剥離を抑制した静電容量式圧力センサを提供することができる。 According to the present invention, it is possible to provide a capacitance type pressure sensor that suppresses peeling between a flexible substrate and a hard substrate.

図１は、実施形態に係る圧力センサの一例を示す図である。FIG. 1 is a diagram showing an example of a pressure sensor according to an embodiment. 図２は、実施形態に係る圧力センサの一例を示す図である。FIG. 2 is a diagram showing an example of a pressure sensor according to an embodiment. 図３は、実施形態に係る圧力センサの一例を示す図である。FIG. 3 is a diagram showing an example of the pressure sensor according to the embodiment. 図４は、静電容量測定回路の構成の一例を示す図である。FIG. 4 is a diagram showing an example of the configuration of the capacitance measurement circuit. 図５は、圧力センサに圧力が印加される前の状態の一例を示す図である。FIG. 5 is a diagram showing an example of a state before pressure is applied to the pressure sensor. 図６は、圧力センサに圧力が印加されたときの状態の一例を示す図である。FIG. 6 is a diagram showing an example of a state when pressure is applied to the pressure sensor. 図７は、実施形態に係る圧力センサの一例を示す図である。FIG. 7 is a diagram showing an example of the pressure sensor according to the embodiment. 図８は、実施形態に係る圧力センサの一例を示す図である。FIG. 8 is a diagram showing an example of the pressure sensor according to the embodiment. 図９は、実施形態に係る圧力センサの一例を示す図である。FIG. 9 is a diagram showing an example of the pressure sensor according to the embodiment. 図１０Ａは、実施形態に係る圧力センサの製造工程の一例を示す第１の図である。FIG. 10A is a first diagram showing an example of a manufacturing process of the pressure sensor according to the embodiment. 図１０Ｂは、実施形態に係る圧力センサの製造工程の一例を示す第２の図である。FIG. 10B is a second diagram showing an example of a manufacturing process of the pressure sensor according to the embodiment. 図１０Ｃは、実施形態に係る圧力センサの製造工程の一例を示す第３の図である。FIG. 10C is a third diagram showing an example of a manufacturing process of the pressure sensor according to the embodiment. 図１０Ｄは、実施形態に係る圧力センサの製造工程の一例を示す第４の図である。FIG. 10D is a fourth diagram showing an example of a manufacturing process of the pressure sensor according to the embodiment. 図１０Ｅは、実施形態に係る圧力センサの製造工程の一例を示す第５の図である。FIG. 10E is a fifth diagram showing an example of a manufacturing process of the pressure sensor according to the embodiment. 図１０Ｆは、実施形態に係る圧力センサの製造工程の一例を示す第６の図である。FIG. 10F is a sixth diagram showing an example of a manufacturing process of the pressure sensor according to the embodiment. 図１０Ｇは、実施形態に係る圧力センサの製造工程の一例を示す第７の図である。FIG. 10G is a seventh diagram showing an example of a manufacturing process of the pressure sensor according to the embodiment. 図１０Ｈは、実施形態に係る圧力センサの製造工程の一例を示す第８の図である。FIG. 10H is an eighth diagram showing an example of a manufacturing process of the pressure sensor according to the embodiment. 図１０Ｉは、実施形態に係る圧力センサの製造工程の一例を示す第９の図である。FIG. 10I is a ninth diagram showing an example of a manufacturing process of the pressure sensor according to the embodiment. 図１０Ｊは、実施形態に係る圧力センサの製造工程の一例を示す第１０の図である。FIG. 10J is a tenth diagram showing an example of a manufacturing process of the pressure sensor according to the embodiment.

以下、実施形態について図を参照しながら説明する。以下に示す実施形態は、本願の一態様であり、本願の技術的範囲を限定するものではない。 Hereinafter, embodiments will be described with reference to the drawings. The embodiments shown below are aspects of the present application and do not limit the technical scope of the present application.

＜適用例＞
図１は実施形態に係る圧力センサの一例を示す図である。図１は圧力センサ１００の断面図の一例である。圧力センサ１００は、静電容量式圧力センサの一例である。圧力センサ１００は、シート基板１１および可動電極１２を含み、可撓性を有する可動部１０と、基板部２１、固定電極２２および固定基板側メッキ部２４を含み、可動部１０との間に中空部１３を介して可動部１０に対向配置された固定基板部２０とを備える。固定電極２２は、可動電極１２に対向して配置されている。可動部１０は、フレキシブル基板の一例である。可動電極１２は、第１の電極の一例である。固定基板部２０は、硬質基板の一例である。固定電極２２は、第２の電極の一例である。また、圧力センサ１００は、可動部１０と固定基板部２０との間であって、中空部１３を囲むように設けられた固定基板側メッキ部２４を備える。更に、圧力センサ１００は、固定基板側メッキ部２４の周囲であって、可動部１０と固定基板部２０との間に設けられた補強樹脂３０を備える。補強樹脂３０は、可動部１０と固定基板部２０とを接着するが、可動部１０の変形を阻害しない部材であり、可動部１０および固定基板部２０よりも剛性が小さい。固定基板側メッキ部２４は、可動部１０と固定基板部２０とを接合する。固定基板側メッキ部２４は、接合部の一例である。圧力センサ１００は、中空部１３において、可動電極１２が固定電極２２に対して撓むことで生じる静電容量の変化を検出することにより、可動電極１２における固定電極２２との対向面に向けて印加される圧力を測定する。 <Application example>
FIG. 1 is a diagram showing an example of a pressure sensor according to an embodiment. FIG. 1 is an example of a cross-sectional view of the pressure sensor 100. The pressure sensor 100 is an example of a capacitance type pressure sensor. The pressure sensor 100 includes a sheet substrate 11 and a movable electrode 12, and includes a flexible movable portion 10, a substrate portion 21, a fixed electrode 22, and a fixed substrate side plating portion 24, and is hollow between the movable portion 10. A fixed substrate portion 20 is provided so as to face the movable portion 10 via the portion 13. The fixed electrode 22 is arranged so as to face the movable electrode 12. The movable portion 10 is an example of a flexible substrate. The movable electrode 12 is an example of the first electrode. The fixed substrate portion 20 is an example of a hard substrate. The fixed electrode 22 is an example of the second electrode. Further, the pressure sensor 100 includes a fixed substrate side plating portion 24 provided between the movable portion 10 and the fixed substrate portion 20 so as to surround the hollow portion 13. Further, the pressure sensor 100 includes a reinforcing resin 30 provided around the plating portion 24 on the fixed substrate side and between the movable portion 10 and the fixed substrate portion 20. The reinforcing resin 30 is a member that adheres the movable portion 10 and the fixed substrate portion 20 but does not hinder the deformation of the movable portion 10, and has lower rigidity than the movable portion 10 and the fixed substrate portion 20. The fixed substrate side plating portion 24 joins the movable portion 10 and the fixed substrate portion 20. The fixed substrate side plating portion 24 is an example of a joint portion. The pressure sensor 100 detects a change in capacitance caused by the movable electrode 12 bending with respect to the fixed electrode 22 in the hollow portion 13 so as to face the surface of the movable electrode 12 facing the fixed electrode 22. Measure the applied pressure.

補強樹脂３０は、可動部１０の一部、固定基板部２０の一部および固定基板側メッキ部２４の一部を覆っている。図１の例では、補強樹脂３０は、可動部１０の下面の一部と、固定基板部２０の上面の一部と、固定基板部２０の側面の一部と、固定基板側メッキ部２４の一部とを覆っている。補強樹脂３０が、可動部１０の一部を覆うことにより、可動部１０が補強される。補強樹脂３０が、固定基板部２０の一部を覆うことにより、固定基板部２０が補強される。補強樹脂３０が、固定基板側メッキ部２４の一部を覆うことにより、固定基板側メッキ部２４が補強される。可動部１０の下面と固定基板部２０の上面とが対向している。また、可動電極１２の下面と固定基板部２０の上面とが対向している。したがって、可動部１０の下面は、可動部１０における固定基板部２０との対向面であり、固定基板部２０の上面は、固定基板部２０における可動部１０との対向面である。固定基板部２０の側面は、固定基板部２０の上面および下面と連続しており、固定基板部２０の上面および下面と直交している。補強樹脂３０が、固定基板側メッキ部２４の周囲であって、可動部１０と固定基板部２０との間に設けられ、可動部１０の一部、固定基板部２０の一部および固定基板側メッキ部２４の一部を覆うことで、可動部１０と固定基板部２０との剥離が抑制される。補強樹脂３０は、可動部１０の変形を阻害しないように柔らかいことが好ましい。 The reinforcing resin 30 covers a part of the movable portion 10, a part of the fixed substrate portion 20, and a part of the fixed substrate side plating portion 24. In the example of FIG. 1, the reinforcing resin 30 is a part of the lower surface of the movable portion 10, a part of the upper surface of the fixed substrate portion 20, a part of the side surface of the fixed substrate portion 20, and a plated portion 24 on the fixed substrate side. It covers a part. The movable portion 10 is reinforced by the reinforcing resin 30 covering a part of the movable portion 10. The fixed substrate portion 20 is reinforced by the reinforcing resin 30 covering a part of the fixed substrate portion 20. The reinforcing resin 30 covers a part of the fixed substrate side plated portion 24 to reinforce the fixed substrate side plated portion 24. The lower surface of the movable portion 10 and the upper surface of the fixed substrate portion 20 face each other. Further, the lower surface of the movable electrode 12 and the upper surface of the fixed substrate portion 20 face each other. Therefore, the lower surface of the movable portion 10 is the surface of the movable portion 10 facing the fixed substrate portion 20, and the upper surface of the fixed substrate portion 20 is the surface of the fixed substrate portion 20 facing the movable portion 10. The side surface of the fixed substrate portion 20 is continuous with the upper surface and the lower surface of the fixed substrate portion 20, and is orthogonal to the upper surface and the lower surface of the fixed substrate portion 20. The reinforcing resin 30 is provided around the plating portion 24 on the fixed substrate side and between the movable portion 10 and the fixed substrate portion 20, and is a part of the movable portion 10, a part of the fixed substrate portion 20, and the fixed substrate side. By covering a part of the plated portion 24, peeling between the movable portion 10 and the fixed substrate portion 20 is suppressed. The reinforcing resin 30 is preferably soft so as not to hinder the deformation of the movable portion 10.

＜実施例＞
図２および図３は実施形態に係る圧力センサの一例を示す図である。図２は圧力センサ１００を平面視した図の一例であり、図３は図２のＡ−Ａ線における断面図の一例である。図２では、平面視においては目視できない固定基板側メッキ部２４、第１中空部１８、第２中空部１９、固定電極２２および基板部２１が点線で示されている。図２では、３つの圧力センサ１００（１００ａ、１００ｂ、１００ｃ）が例示されるとともに、コネクタ２００および静電容量測定回路３００も例示される。３つの圧力センサ１００ａ、１００ｂ、１００ｃは、シート基板１１を共有する。図３を参照すると理解できるように、圧力センサ１００は、可動電極１２を含み可撓性を有する可動部１０と固定電極２２を含む固定基板部２０とを備える。圧力センサ１００は、可動部１０の可動電極１２と固定基板部２０の固定電極２２とが対向するように、可動部１０と固定基板部２０とを接合して形成される。可動電極１２は、第１可動電極１２１および第１可動電極１２１と離間して設けられる第２可動電極１２２を含む。第１可動電極１２１と固定電極２２との間には、第１中空部１８が形成される。第１中空部１８が形成されることで、シート基板１１上の第１可動電極１２１に相当する領域に圧力が印加されたときに、可動部１０は固定基板部２０に向けて変形可能となる。また、第２可動電極１２２と固定電極２２との間には、第２中空部１９が形成される。図２では、第１中空部１８および第２中空部１９の断面形状は略円形に形成されているが、第１中空部１８および第２中空部１９の断面形状が略円形に限定されるわけではない。第１中空部１８および第２中空部１９の断面形状は、略多角形に形成されていてもよく、例えば、略四角形、略六角形、略八角形等であってもよい。以下、本明細書において、図２における第２中空部１９から第１中空部１８に向かう方向を右、その逆方向を左とする。また、図２において、圧力センサ１００ａから圧力センサ１００ｃに向かう方向を後ろ、その逆方向を前とする。さらに、図３における可動部１０から固定基板部２０に向かう方向を下、その逆方向を上とする。 <Example>
2 and 3 are diagrams showing an example of the pressure sensor according to the embodiment. FIG. 2 is an example of a plan view of the pressure sensor 100, and FIG. 3 is an example of a cross-sectional view taken along the line AA of FIG. In FIG. 2, the fixed substrate side plating portion 24, the first hollow portion 18, the second hollow portion 19, the fixed electrode 22, and the substrate portion 21, which cannot be seen in a plan view, are shown by dotted lines. In FIG. 2, three pressure sensors 100 (100a, 100b, 100c) are exemplified, and a connector 200 and a capacitance measuring circuit 300 are also exemplified. The three pressure sensors 100a, 100b, and 100c share the sheet substrate 11. As can be understood with reference to FIG. 3, the pressure sensor 100 includes a movable portion 10 including a movable electrode 12 and having flexibility, and a fixed substrate portion 20 including a fixed electrode 22. The pressure sensor 100 is formed by joining the movable portion 10 and the fixed substrate portion 20 so that the movable electrode 12 of the movable portion 10 and the fixed electrode 22 of the fixed substrate portion 20 face each other. The movable electrode 12 includes a first movable electrode 121 and a second movable electrode 122 provided apart from the first movable electrode 121. A first hollow portion 18 is formed between the first movable electrode 121 and the fixed electrode 22. By forming the first hollow portion 18, when pressure is applied to the region corresponding to the first movable electrode 121 on the sheet substrate 11, the movable portion 10 can be deformed toward the fixed substrate portion 20. .. Further, a second hollow portion 19 is formed between the second movable electrode 122 and the fixed electrode 22. In FIG. 2, the cross-sectional shapes of the first hollow portion 18 and the second hollow portion 19 are formed in a substantially circular shape, but the cross-sectional shapes of the first hollow portion 18 and the second hollow portion 19 are limited to a substantially circular shape. is not. The cross-sectional shapes of the first hollow portion 18 and the second hollow portion 19 may be formed in a substantially polygonal shape, and may be, for example, a substantially quadrangle, a substantially hexagon, a substantially octagon, or the like. Hereinafter, in the present specification, the direction from the second hollow portion 19 to the first hollow portion 18 in FIG. 2 is defined as the right, and the opposite direction is defined as the left. Further, in FIG. 2, the direction from the pressure sensor 100a toward the pressure sensor 100c is the back, and the opposite direction is the front. Further, the direction from the movable portion 10 to the fixed substrate portion 20 in FIG. 3 is downward, and the opposite direction is upward.

可動部１０は、シート基板１１、可動電極１２、可動部側メッキ部１４を含む。シート基板１１は、可撓性を有する部材（例えば、ポリイミド）で形成される。シート基板１１の厚さは、例えば、２５μｍである。ここで、シート基板１１の厚さは、シート基板１１の上下方向の長さである。シート基板１１の下方向の面には導電性を有する部材（例えば銅）によって形成される可動電極１２が設けられる。可動電極１２は、上述のように、第１可動電極１２１および第１可動電極１２１と離間して設けられる第２可動電極１２２を含む。可動電極１２の厚さは、例えば、１０μｍである。第１可動電極１２１の左右方向の長さは、例えば、２．０ｍｍである。第２可動電極１２２の左右方向の長さは、例えば、０．５ｍｍである。第１可動電極１２１および第２可動電極１２２の前後方向の長さは、例えば、１ｍｍから２ｍｍである。第１可動電極１２１と第２可動電極１２２との間の距離は、例えば、０．１ｍｍである。可動電極１２の下方向の面には、可動部側メッキ部１４が設けられる。可動部側メッキ部１４は、第１可動電極１２１の下方向の面に設けられる第１メッキ部１４１と第２可動電極１２２の下方向の面に設けられる第２メッキ部１４２を含む。可動部側メッキ部１４は、例えば、金メッキによって形成される。 The movable portion 10 includes a sheet substrate 11, a movable electrode 12, and a movable portion side plating portion 14. The sheet substrate 11 is made of a flexible member (for example, polyimide). The thickness of the sheet substrate 11 is, for example, 25 μm. Here, the thickness of the sheet substrate 11 is the length of the sheet substrate 11 in the vertical direction. A movable electrode 12 formed of a conductive member (for example, copper) is provided on the downward surface of the sheet substrate 11. As described above, the movable electrode 12 includes a first movable electrode 121 and a second movable electrode 122 provided apart from the first movable electrode 121. The thickness of the movable electrode 12 is, for example, 10 μm. The length of the first movable electrode 121 in the left-right direction is, for example, 2.0 mm. The length of the second movable electrode 122 in the left-right direction is, for example, 0.5 mm. The length of the first movable electrode 121 and the second movable electrode 122 in the front-rear direction is, for example, 1 mm to 2 mm. The distance between the first movable electrode 121 and the second movable electrode 122 is, for example, 0.1 mm. A movable portion side plating portion 14 is provided on the downward surface of the movable electrode 12. The movable portion side plating portion 14 includes a first plating portion 141 provided on the lower surface of the first movable electrode 121 and a second plating portion 142 provided on the lower surface of the second movable electrode 122. The movable portion side plating portion 14 is formed by, for example, gold plating.

固定基板部２０は、基板部２１、固定電極２２、絶縁部２３および固定基板側メッキ部２４を含む。基板部２１は、容易には変形しない部材（例えば、ガラス）で形成される。基板部２１の厚さは、例えば、３００μｍから６００μｍである。基板部２１は容易には変形しない部材で形成されるため、シート基板１１への圧力の印加により可動部１０が撓んでも、固定基板部２０の変形は抑制される。基板部２１の上側の面上には導電性を有する部材（例えばクロム）によって形成された固定電極２２が配置される。さらに、固定電極の２２の周囲を囲むとともに、固定電極２２の上方の一部を覆う絶縁部２３が設けられる。絶縁部２３は絶縁体（例えば、テトラエトキシシラン（ＴＥＯＳ）や二酸化ケイ素）によって形成される。絶縁部２３の厚さは、例えば、０．５μｍである。絶縁部２３には、平面視において第１可動電極１２１と固定電極２２とが重なる領域の一部には上述した
第１中空部１８の一部を形成する箇所が設けられる。また、平面視において第２可動電極１２２と固定電極２２とが重なる領域の一部には上述した第２中空部１９を形成するための箇所が設けられる。絶縁部２３において、第１中空部１８の一部および第２中空部１９を形成するための箇所は、絶縁部２３の可動部１０側の面から固定電極２２側の面まで達する貫通孔として形成される。第１中空部１８を平面視したときの直径は、例えば、０．６ｍｍから１．２ｍｍである。圧力センサ１００を平面視した場合において、第２中空部１９の面積は、第１中空部１８の面積よりも小さい。すなわち、第２中空部１９を平面視したときの直径は、第１中空部１８を平面視したときの直径よりも小さい。圧力が印加されていないときにおける第１中空部１８の第１可動電極１２１と固定電極２２との間の距離ｄは、例えば、１μｍである。絶縁部２３の上側の面の一部の他、第２中空部１９の内側面および底部には、固定基板側メッキ部２４が設けられる。固定基板側メッキ部２４は、第３メッキ部２４１と第４メッキ部２４２を含む。第３メッキ部２４１は、絶縁部２３の上側の面において、第１中空部１８の一部を形成する貫通孔の縁近傍の領域に当該領域を囲むようにして設けられる。このようにして第３メッキ部２４１に囲まれた部分と絶縁部２３に設けられた貫通孔によって形成される空間が第１中空部である。第４メッキ部２４２は、絶縁部２３の上側の面において、第２中空部１９を形成するための貫通孔の縁近傍の領域に、当該領域を囲むようにして設けられるとともに、該貫通孔の内側面、及び該貫通孔の底部に該当する固定電極２２の上面にも設けられる。即ち、第４メッキ部２４２は、絶縁部２３の上側の面から第２可動電極１２２に向けて突出して形成される部分と、貫通孔の内部を覆う部分とから形成され、これらに囲まれた空間が第２中空部１９となる。なお、固定基板側メッキ部２４は、例えば、金メッキによって形成される。可動部側メッキ部１４と固定基板側メッキ部２４とが接合されることで可動部１０と固定基板部２０とが一体となり、圧力センサ１００が形成される。また、第２メッキ部１４２と第４メッキ部２４２とが接合されることで、第２可動電極１２２と固定電極２２とが電気的に接続される。 The fixed substrate portion 20 includes a substrate portion 21, a fixed electrode 22, an insulating portion 23, and a fixed substrate side plating portion 24. The substrate portion 21 is formed of a member (for example, glass) that is not easily deformed. The thickness of the substrate portion 21 is, for example, 300 μm to 600 μm. Since the substrate portion 21 is formed of a member that does not easily deform, even if the movable portion 10 bends due to the application of pressure to the sheet substrate 11, the deformation of the fixed substrate portion 20 is suppressed. A fixed electrode 22 formed of a conductive member (for example, chromium) is arranged on the upper surface of the substrate portion 21. Further, an insulating portion 23 is provided that surrounds the fixed electrode 22 and covers a part above the fixed electrode 22. The insulating portion 23 is formed of an insulator (for example, tetraethoxysilane (TEOS) or silicon dioxide). The thickness of the insulating portion 23 is, for example, 0.5 μm. The insulating portion 23 is provided with a portion forming a part of the first hollow portion 18 described above in a part of the region where the first movable electrode 121 and the fixed electrode 22 overlap in a plan view. Further, a portion for forming the above-mentioned second hollow portion 19 is provided in a part of the region where the second movable electrode 122 and the fixed electrode 22 overlap in a plan view. In the insulating portion 23, a part of the first hollow portion 18 and a portion for forming the second hollow portion 19 are formed as through holes extending from the surface of the insulating portion 23 on the movable portion 10 side to the surface on the fixed electrode 22 side. Will be done. The diameter of the first hollow portion 18 when viewed in a plan view is, for example, 0.6 mm to 1.2 mm. When the pressure sensor 100 is viewed in a plan view, the area of the second hollow portion 19 is smaller than the area of the first hollow portion 18. That is, the diameter when the second hollow portion 19 is viewed in a plane is smaller than the diameter when the first hollow portion 18 is viewed in a plane. The distance d between the first movable electrode 121 and the fixed electrode 22 of the first hollow portion 18 when no pressure is applied is, for example, 1 μm. In addition to a part of the upper surface of the insulating portion 23, a fixed substrate side plated portion 24 is provided on the inner side surface and the bottom portion of the second hollow portion 19. The fixed substrate side plating portion 24 includes a third plating portion 241 and a fourth plating portion 242. The third plating portion 241 is provided on the upper surface of the insulating portion 23 so as to surround the region in the region near the edge of the through hole forming a part of the first hollow portion 18. The space formed by the portion surrounded by the third plating portion 241 and the through hole provided in the insulating portion 23 in this way is the first hollow portion. The fourth plated portion 242 is provided on the upper surface of the insulating portion 23 in a region near the edge of the through hole for forming the second hollow portion 19 so as to surround the region, and the inner surface surface of the through hole. , And the upper surface of the fixed electrode 22 corresponding to the bottom of the through hole. That is, the fourth plated portion 242 is formed of a portion formed so as to project from the upper surface of the insulating portion 23 toward the second movable electrode 122 and a portion covering the inside of the through hole, and is surrounded by these. The space becomes the second hollow portion 19. The fixed substrate side plating portion 24 is formed by, for example, gold plating. By joining the movable portion side plating portion 14 and the fixed substrate side plating portion 24, the movable portion 10 and the fixed substrate portion 20 are integrated, and the pressure sensor 100 is formed. Further, by joining the second plating portion 142 and the fourth plating portion 242, the second movable electrode 122 and the fixed electrode 22 are electrically connected.

第２可動電極１２２とコネクタ２００とは第２可動電極１２２から延びる信号線１５によって接続される。また、圧力センサ１００ａ、１００ｂの第１可動電極１２１の間および圧力センサ１００ｂ、１００ｃの第１可動電極１２１の間は、第１可動電極１２１から延びるグランド（ＧＮＤ）線１６ａによって接続される。図２において、隣り合った圧力センサ１００の間の距離は、例えば、０．１ｍｍから０．３ｍｍである。すなわち、ＧＮＤ線１６ａの長さは、０．１ｍｍから０．３ｍｍである。さらに、圧力センサ１００ｃの第１可動電極１２１は、第１可動電極１２１から延びるＧＮＤ線１６ｂによってコネクタ２００と接続される。すなわち、圧力センサ１００ａ、１００ｂ、１００ｃでは、ＧＮＤが共有される。図２および図３を参照すると理解できるように、圧力センサ１００では、信号線１５とＧＮＤ線１６のいずれもがシート基板１１の下側の面に形成される。すなわち、圧力センサ１００では、第１可動電極１２１から延びる配線と固定電極２２から延びる配線とが同一の層に形成される。圧力センサ１００は、このような構成を採用することで、簡易な配線構造が実現される。 The second movable electrode 122 and the connector 200 are connected by a signal line 15 extending from the second movable electrode 122. Further, between the first movable electrodes 121 of the pressure sensors 100a and 100b and between the first movable electrodes 121 of the pressure sensors 100b and 100c are connected by a ground (GND) wire 16a extending from the first movable electrode 121. In FIG. 2, the distance between adjacent pressure sensors 100 is, for example, 0.1 mm to 0.3 mm. That is, the length of the GND line 16a is 0.1 mm to 0.3 mm. Further, the first movable electrode 121 of the pressure sensor 100c is connected to the connector 200 by a GND wire 16b extending from the first movable electrode 121. That is, the pressure sensors 100a, 100b, and 100c share the GND. As can be understood with reference to FIGS. 2 and 3, in the pressure sensor 100, both the signal line 15 and the GND line 16 are formed on the lower surface of the sheet substrate 11. That is, in the pressure sensor 100, the wiring extending from the first movable electrode 121 and the wiring extending from the fixed electrode 22 are formed in the same layer. By adopting such a configuration, the pressure sensor 100 realizes a simple wiring structure.

上述した構成を有する圧力センサ１００は、距離ｄ（図３参照）離れて配置された第１可動電極１２１の固定電極２２と重なり合う領域と固定電極２２の第１可動電極１２１と重なり合う領域とを電極板とするコンデンサとして動作する。コンデンサの静電容量Ｃは、例えば、上述した距離ｄおよび第１可動電極１２１と固定電極２２とが重なり合う領域の面積Ｓ（図２参照）を用いて、以下の（式１）によって算出される。 The pressure sensor 100 having the above-described configuration has electrodes of a region overlapping the fixed electrode 22 of the first movable electrode 121 and a region overlapping the first movable electrode 121 of the fixed electrode 22 arranged at a distance d (see FIG. 3). Operates as a plate capacitor. The capacitance C of the capacitor is calculated by the following (Equation 1), for example, using the above-mentioned distance d and the area S (see FIG. 2) of the region where the first movable electrode 121 and the fixed electrode 22 overlap. ..

Figure 0006812953
Figure 0006812953

上記（式１）において、ε0は真空の誘電率であり、εrは大気の比誘電率である。すなわち、（式１）によれば、可動部１０に力が加えられることによって生じる第１可動電極１２１と固定電極２２との間の距離ｄの変動に応じて、静電容量Ｃが変動することがわかる。 In the above (Equation 1), ε 0 is the permittivity of vacuum and ε r is the relative permittivity of the atmosphere. That is, according to (Equation 1), the capacitance C fluctuates according to the fluctuation of the distance d between the first movable electrode 121 and the fixed electrode 22 caused by the force applied to the movable portion 10. I understand.

また、圧力Ｐは、例えば、上述した面積Ｓを用いて以下の（式２）によって算出される。 Further, the pressure P is calculated by the following (Equation 2) using, for example, the above-mentioned area S.

Figure 0006812953
Figure 0006812953

上記（式２）において、Ｆは圧力センサ１００に印加される力の大きさである。上述の通り、基板部２１は容易には変形しない部材によって形成されるため、圧力センサ１００に力が印加されても圧力算出の基準となる面積Ｓの変動が抑制される。そのため、圧力センサ１００は、基板部２１が容易に変形する部材で形成された圧力センサよりも高い精度で圧力を検出できる。 In the above (Equation 2), F is the magnitude of the force applied to the pressure sensor 100. As described above, since the substrate portion 21 is formed of a member that does not easily deform, fluctuation of the area S, which is a reference for pressure calculation, is suppressed even if a force is applied to the pressure sensor 100. Therefore, the pressure sensor 100 can detect the pressure with higher accuracy than the pressure sensor formed of a member whose substrate portion 21 is easily deformed.

図４は、静電容量測定回路３００の構成の一例を示す図である。図４では、圧力センサ１００ａ、１００ｂ、１００ｃも例示されている。また、図４では、コネクタ２００の図示は省略している。静電容量測定回路３００は、２つのマルチプレクサ３０１、３０１（図中では、MUXと記載）とコンバータ３０２を備える。マルチプレクサ３０１、３０１の
各々には、圧力センサ１００ａ、１００ｂ、１００ｃの静電容量の変動に伴う信号が信号線１５を介して入力される。マルチプレクサ３０１、３０１の各々は、圧力センサ１００ａ、１００ｂ、１００ｃから入力された信号のうち選択されたひとつを出力する。図４において、マルチプレクサ３０１、３０１が出力する信号の選択に用いられる選択信号の図示は省略されている。コンバータ３０２は、マルチプレクサ３０１、３０１の各々から出力された信号はコンバータ３０２に入力される。コンバータ３０２は、例えば、マルチプレクサ３０１、３０１から入力される信号値と圧力との対応関係を記憶している。コンバータ３０２が管理する対応関係は、例えば、入力される信号値と圧力との対応を示すテーブルであってもよいし、入力される信号値から圧力を算出する数式であってもよい。コンバータ３０２は、例えば、当該対応関係にしたがって、マルチプレクサ３０１、３０１から入力された信号値を圧力を示す信号値に変換し、圧力を示す信号値を出力する。 FIG. 4 is a diagram showing an example of the configuration of the capacitance measurement circuit 300. In FIG. 4, pressure sensors 100a, 100b, and 100c are also illustrated. Further, in FIG. 4, the connector 200 is not shown. The capacitance measuring circuit 300 includes two multiplexers 301 and 301 (denoted as MUX in the figure) and a converter 302. A signal accompanying a change in the capacitance of the pressure sensors 100a, 100b, and 100c is input to each of the multiplexers 301 and 301 via the signal line 15. Each of the multiplexers 301 and 301 outputs a selected signal from the signals input from the pressure sensors 100a, 100b and 100c. In FIG. 4, the selection signal used for selecting the signal output by the multiplexers 301 and 301 is not shown. In the converter 302, the signals output from each of the multiplexers 301 and 301 are input to the converter 302. The converter 302 stores, for example, the correspondence between the signal values input from the multiplexers 301 and 301 and the pressure. The correspondence relationship managed by the converter 302 may be, for example, a table showing the correspondence between the input signal value and the pressure, or a mathematical formula for calculating the pressure from the input signal value. For example, the converter 302 converts the signal values input from the multiplexers 301 and 301 into signal values indicating pressure according to the correspondence, and outputs a signal value indicating pressure.

図５は、圧力センサ１００に圧力が印加される前の状態の一例を示し、図６は、圧力センサ１００に圧力が印加されたときの状態の一例を示す。圧力センサ１００では、第１中空部１８の上方から圧力が印加されると、図６に例示されるように、シート基板１１および第１可動電極１２１を含む可動部１０が印加された力に応じて固定基板部２０の方向に向けて撓む。また、圧力センサ１００に力が印加されなくなると、圧力センサ１００は図６の状態から図５の状態に戻る。すなわち、圧力センサ１００では、印加された力に応じて、第１可動電極１２１と固定電極２２との間の距離ｄが変動する。距離ｄが変動すると、（式１）により、圧力センサ１００の静電容量が変動する。例えば、図２に例示される静電容量測定回路３００によって圧力センサ１００の静電容量の変動が測定されることで、圧力センサ１００に印加された圧力が検出される。 FIG. 5 shows an example of the state before the pressure is applied to the pressure sensor 100, and FIG. 6 shows an example of the state when the pressure is applied to the pressure sensor 100. In the pressure sensor 100, when a pressure is applied from above the first hollow portion 18, as illustrated in FIG. 6, the movable portion 10 including the seat substrate 11 and the first movable electrode 121 responds to the applied force. It bends toward the fixed substrate portion 20. When no force is applied to the pressure sensor 100, the pressure sensor 100 returns from the state of FIG. 6 to the state of FIG. That is, in the pressure sensor 100, the distance d between the first movable electrode 121 and the fixed electrode 22 fluctuates according to the applied force. When the distance d fluctuates, the capacitance of the pressure sensor 100 fluctuates according to (Equation 1). For example, the pressure applied to the pressure sensor 100 is detected by measuring the fluctuation of the capacitance of the pressure sensor 100 by the capacitance measuring circuit 300 illustrated in FIG.

ところで、圧力センサ１００は、第１中空部１８の他に第２中空部１９を有する。第２中空部１９の内側面には、上述の通り、固定電極２２から第２可動電極１２２に達する円筒形状の第４メッキ部２４２が形成される。固定電極２２と第２可動電極１２２とを電気的に接続するだけであれば、第４メッキ部２４２を円筒形状に形成せずに、一本の配線で接続するだけでも足りる。しかしながら、実施形態に係る圧力センサ１００は、離間して
設けられる第１可動電極１２１と第２可動電極１２２とのいずれもがシート基板１１に設けられている。そのため、第１可動電極１２１の上方から力が印加されると、第１可動電極１２１が固定電極２２側に撓むとともに、第２可動電極１２２も固定電極２２側に歪む。圧力の高精度な検出のためには、第１可動電極１２１は、前後方向および左右方向において偏りなく固定電極２２に対して撓むことが好ましい。しかしながら、第２可動電極１２２が固定電極２２側に歪んでしまうと、第１可動電極１２１は当該撓みの影響を受け、固定電極２２に対して偏りなく撓むことが困難となる。そこで、実施形態に係る圧力センサ１００では、第４メッキ部２４２を平面視したときの断面形状を略円形または略多角形に形成している。このことにより、固定電極２２と第２可動電極１２２とを一本の配線で接続する構成に比べて、圧力が印加された際の第２可動電極１２２部分における歪みが抑制される。これによって、第１可動電極１２１が固定電極２２に対して撓む際に、前後方向および左右方向に偏りが生じることが抑制される。さらに、一本の配線で第２可動電極１２２を支える場合よりも、断面形状が略円形または略多角形に形成された第４メッキ部２４２は安定して第２可動電極１２２を支えることができる。 By the way, the pressure sensor 100 has a second hollow portion 19 in addition to the first hollow portion 18. As described above, a cylindrical fourth plated portion 242 reaching from the fixed electrode 22 to the second movable electrode 122 is formed on the inner surface of the second hollow portion 19. If the fixed electrode 22 and the second movable electrode 122 are only electrically connected, it is sufficient to connect the fourth plated portion 242 with a single wire without forming the fourth plated portion 242 into a cylindrical shape. However, in the pressure sensor 100 according to the embodiment, both the first movable electrode 121 and the second movable electrode 122 provided apart from each other are provided on the sheet substrate 11. Therefore, when a force is applied from above the first movable electrode 121, the first movable electrode 121 bends toward the fixed electrode 22, and the second movable electrode 122 also distorts toward the fixed electrode 22. For highly accurate detection of pressure, it is preferable that the first movable electrode 121 flexes with respect to the fixed electrode 22 without bias in the front-rear direction and the left-right direction. However, if the second movable electrode 122 is distorted toward the fixed electrode 22, the first movable electrode 121 is affected by the bending, and it becomes difficult to bend the first movable electrode 121 without bias with respect to the fixed electrode 22. Therefore, in the pressure sensor 100 according to the embodiment, the cross-sectional shape of the fourth plating portion 242 when viewed in a plan view is formed to be substantially circular or substantially polygonal. As a result, distortion in the second movable electrode 122 portion when pressure is applied is suppressed as compared with the configuration in which the fixed electrode 22 and the second movable electrode 122 are connected by a single wire. As a result, when the first movable electrode 121 bends with respect to the fixed electrode 22, bias in the front-rear direction and the left-right direction is suppressed. Further, the fourth plated portion 242 having a substantially circular or substantially polygonal cross-sectional shape can stably support the second movable electrode 122 as compared with the case where the second movable electrode 122 is supported by a single wire. ..

図７および図８は、実施形態に係る圧力センサの一例を示す図である。図７および図８は、図２のＡ−Ａ線における断面図の一例である。圧力センサ１００は、第１中空部１８および第２中空部１９の周囲であって、可動部１０と固定基板部２０との間に設けられた補強樹脂３０を備える。図７および図８に示す例では、補強樹脂３０が、第１中空部１８および第２中空部１９の周囲であって、可動部１０と固定基板部２０との間に設けられている。補強樹脂３０は、可動部１０と固定基板部２０とを接着する。図７に示す例では、補強樹脂３０が、可動部１０の下面の一部、固定基板部２０の上面の一部および固定基板部２０の側面の一部を覆っている。図８に示す例では、補強樹脂３０が、可動部１０の下面の一部、固定基板部２０の上面の一部、固定基板部２０の側面および下面を覆っている。補強樹脂３０が、可動部１０の一部および固定基板部２０の一部を覆うことにより、可動部１０および固定基板部２０が補強される。単一の補強樹脂３０が、可動部１０の一部および固定基板部２０の一部を覆ってもよいし、複数の補強樹脂３０が、可動部１０の一部および固定基板部２０の一部を覆ってもよい。 7 and 8 are diagrams showing an example of the pressure sensor according to the embodiment. 7 and 8 are examples of cross-sectional views taken along the line AA of FIG. The pressure sensor 100 includes a reinforcing resin 30 provided around the first hollow portion 18 and the second hollow portion 19 and between the movable portion 10 and the fixed substrate portion 20. In the examples shown in FIGS. 7 and 8, the reinforcing resin 30 is provided around the first hollow portion 18 and the second hollow portion 19 and between the movable portion 10 and the fixed substrate portion 20. The reinforcing resin 30 adheres the movable portion 10 and the fixed substrate portion 20. In the example shown in FIG. 7, the reinforcing resin 30 covers a part of the lower surface of the movable portion 10, a part of the upper surface of the fixed substrate portion 20, and a part of the side surface of the fixed substrate portion 20. In the example shown in FIG. 8, the reinforcing resin 30 covers a part of the lower surface of the movable portion 10, a part of the upper surface of the fixed substrate portion 20, and the side surface and the lower surface of the fixed substrate portion 20. The movable portion 10 and the fixed substrate portion 20 are reinforced by the reinforcing resin 30 covering a part of the movable portion 10 and a part of the fixed substrate portion 20. A single reinforcing resin 30 may cover a part of the movable portion 10 and a part of the fixed substrate portion 20, and a plurality of reinforcing resins 30 may cover a part of the movable portion 10 and a part of the fixed substrate portion 20. May be covered.

図７および図８の圧力センサは例示であり、図７および図８の圧力センサの例に限定されない。例えば、補強樹脂３０が、可動部１０の下面の一部および固定基板部２０の上面の一部を覆うと共に、固定基板部２０の側面の全部および下面の一部を覆ってもよい。例えば、補強樹脂３０が、可動部１０の下面の一部および固定基板部２０の上面の一部を覆うと共に、固定基板部２０の側面の一部および下面の一部を覆ってもよい。例えば、補強樹脂３０が、可動部１０の下面の一部および固定基板部２０の上面の一部を覆うと共に、固定基板部２０の側面の一部および下面の全部を覆ってもよい。 The pressure sensors of FIGS. 7 and 8 are exemplary and are not limited to the pressure sensors of FIGS. 7 and 8. For example, the reinforcing resin 30 may cover a part of the lower surface of the movable portion 10 and a part of the upper surface of the fixed substrate portion 20, and may cover the entire side surface of the fixed substrate portion 20 and a part of the lower surface. For example, the reinforcing resin 30 may cover a part of the lower surface of the movable portion 10 and a part of the upper surface of the fixed substrate portion 20, and may cover a part of the side surface and a part of the lower surface of the fixed substrate portion 20. For example, the reinforcing resin 30 may cover a part of the lower surface of the movable portion 10 and a part of the upper surface of the fixed substrate portion 20, and may cover a part of the side surface of the fixed substrate portion 20 and the entire lower surface.

図９は、実施形態に係る圧力センサの一例を示す図である。図９は、図２のＡ−Ａ線における断面図の一例である。図９に示す例では、補強樹脂３０が、シート基板１１、可動電極１２および可動部側メッキ部１４に接触している。図１０に示す例に限定されず、補強樹脂３０が、可動電極１２および可動部側メッキ部１４に接触し、シート基板１１と非接触であってもよい。また、補強樹脂３０が、可動部側メッキ部１４に接触し、シート基板１１および可動電極１２と非接触であってもよい。図９に示すように、可動部１０と固定基板部２０との間には、第１中空部１８を囲むように設けられた第３メッキ部２４１と、第２中空部１９を囲むように設けられた第４メッキ部２４２とが配置されている。したがって、補強樹脂３０は、第３メッキ部２４１および第４メッキ部２４２を含む固定基板側メッキ部２４の周囲に設けられている。補強樹脂３０が、第３メッキ部２４１の一部および第４メッキ部２４２の一部を覆っている。補強樹脂３０が、第３メッキ部２４１の一部および第４メッキ部２４２の一部を覆うことにより、第３メッキ部２４１および第４メッキ部２４２が補強される。単一の補強樹脂３０が、可動部１０の一部および固定基板部
２０の一部、第３メッキ部２４１の一部および第４メッキ部２４２の一部を覆ってもよい。複数の補強樹脂３０が、可動部１０の一部、固定基板部２０の一部、第３メッキ部２４１の一部および第４メッキ部２４２の一部を覆ってもよい。単一の補強樹脂３０が、可動部１０の一部、固定基板部２０の一部、第３メッキ部２４１の一部および第４メッキ部２４２の一部を覆ってもよい。複数の補強樹脂３０が、可動部１０の一部、固定基板部２０の一部、第３メッキ部２４１の一部および第４メッキ部２４２の一部を覆ってもよい。 FIG. 9 is a diagram showing an example of the pressure sensor according to the embodiment. FIG. 9 is an example of a cross-sectional view taken along the line AA of FIG. In the example shown in FIG. 9, the reinforcing resin 30 is in contact with the sheet substrate 11, the movable electrode 12, and the movable portion side plating portion 14. Not limited to the example shown in FIG. 10, the reinforcing resin 30 may be in contact with the movable electrode 12 and the movable portion side plating portion 14 and may not be in contact with the sheet substrate 11. Further, the reinforcing resin 30 may be in contact with the movable portion side plating portion 14 and may not be in contact with the sheet substrate 11 and the movable electrode 12. As shown in FIG. 9, between the movable portion 10 and the fixed substrate portion 20, a third plating portion 241 provided so as to surround the first hollow portion 18 and a second hollow portion 19 are provided so as to surround the second hollow portion 19. The 4th plating portion 242 is arranged. Therefore, the reinforcing resin 30 is provided around the fixed substrate side plating portion 24 including the third plating portion 241 and the fourth plating portion 242. The reinforcing resin 30 covers a part of the third plating portion 241 and a part of the fourth plating portion 242. The reinforcing resin 30 covers a part of the third plating portion 241 and a part of the fourth plating portion 242 to reinforce the third plating portion 241 and the fourth plating portion 242. A single reinforcing resin 30 may cover a part of the movable part 10, a part of the fixed substrate part 20, a part of the third plating part 241 and a part of the fourth plating part 242. A plurality of reinforcing resins 30 may cover a part of the movable part 10, a part of the fixed substrate part 20, a part of the third plating part 241 and a part of the fourth plating part 242. A single reinforcing resin 30 may cover a part of the movable part 10, a part of the fixed substrate part 20, a part of the third plating part 241 and a part of the fourth plating part 242. A plurality of reinforcing resins 30 may cover a part of the movable part 10, a part of the fixed substrate part 20, a part of the third plating part 241 and a part of the fourth plating part 242.

補強樹脂３０が、第１中空部１８および第２中空部１９の周囲であって、可動部１０と固定基板部２０との間に埋め込まれ、可動部１０の一部、固定基板部２０の一部および固定基板側メッキ部２４の一部を覆うことで、可動部１０と固定基板部２０との剥離が抑制される。補強樹脂３０が、固定基板部２０の下面の少なくとも一部を更に覆うことで、可動部１０と固定基板部２０との剥離が更に抑制される。補強樹脂３０が、可動部１０と固定基板部２０とを接着することで、可動部１０と固定基板部２０との接合が維持され、可動部１０と固定基板部２０との剥離が抑制される。可動部側メッキ部１４と固定基板側メッキ部２４とが接合されることにより、可動部１０と固定基板部２０とが接合される。補強樹脂３０が、可動部１０の一部、固定基板部２０の一部および固定基板側メッキ部２４の一部を覆うことで、可動部１０と固定基板部２０との接合が維持され、可動部１０と固定基板側メッキ部２４との剥離が抑制される。補強樹脂３０が、第１中空部１８および第２中空部１９の周囲であって、可動部１０と固定基板部２０との間に埋め込まれることで、圧力センサ１００内への水の侵入が抑制され、圧力センサ１００のショートが抑制される。また、補強樹脂３０は、図２に示される信号線１５およびＧＮＤ線１６のいずれか一方または両方を覆っていてもよい。補強樹脂３０が信号線１５およびＧＮＤ線１６を覆うことで、信号線１５およびＧＮＤ線１６の断線が抑制される。 The reinforcing resin 30 is embedded around the first hollow portion 18 and the second hollow portion 19 between the movable portion 10 and the fixed substrate portion 20, and is a part of the movable portion 10 and one of the fixed substrate portions 20. By covering a part of the portion and the plating portion 24 on the fixed substrate side, peeling of the movable portion 10 and the fixed substrate portion 20 is suppressed. By further covering at least a part of the lower surface of the fixed substrate portion 20 with the reinforcing resin 30, peeling between the movable portion 10 and the fixed substrate portion 20 is further suppressed. When the reinforcing resin 30 adheres the movable portion 10 and the fixed substrate portion 20, the bonding between the movable portion 10 and the fixed substrate portion 20 is maintained, and the peeling of the movable portion 10 and the fixed substrate portion 20 is suppressed. .. By joining the movable portion side plating portion 14 and the fixed substrate side plating portion 24, the movable portion 10 and the fixed substrate portion 20 are joined. The reinforcing resin 30 covers a part of the movable portion 10, a part of the fixed substrate portion 20, and a part of the plated portion 24 on the fixed substrate side, so that the joint between the movable portion 10 and the fixed substrate portion 20 is maintained and is movable. Peeling between the portion 10 and the plating portion 24 on the fixed substrate side is suppressed. By embedding the reinforcing resin 30 around the first hollow portion 18 and the second hollow portion 19 between the movable portion 10 and the fixed substrate portion 20, water intrusion into the pressure sensor 100 is suppressed. The short circuit of the pressure sensor 100 is suppressed. Further, the reinforcing resin 30 may cover either or both of the signal line 15 and the GND line 16 shown in FIG. By covering the signal line 15 and the GND line 16 with the reinforcing resin 30, the disconnection of the signal line 15 and the GND line 16 is suppressed.

圧力センサ１００に圧力が印加された際における可動部１０の変形を阻害しないように、補強樹脂３０は柔らかいことが好ましい。補強樹脂３０として、例えば、エポキシ樹脂、ポリイミド樹脂が挙げられる。補強樹脂３０のヤング率（弾性率）が、可動部１０のヤング率と同一又は可動部１０のヤング率よりも小さいことが好ましい。可動部１０のヤング率は、固定基板部２０のヤング率よりも小さい。したがって、補強樹脂３０のヤング率（Ｅ１）、可動部１０のヤング率（Ｅ２）および固定基板部２０のヤング率（Ｅ３）は、Ｅ１≦Ｅ２＜Ｅ３の順であってもよい。これにより、圧力センサ１００に圧力が印加された際における可動部１０の変形が阻害されず、圧力センサ１００に印加された圧力を高い精度で測定することができる。シート基板１１の材料と、補強樹脂３０の材料とが同一であってもよい。可動電極１２が、銅（Ｃｕ）等の金属である場合、可動電極１２のヤング率は、シート基板１１および補強樹脂３０のヤング率よりも大きい。したがって、シート基板１１の材料と、補強樹脂３０の材料とが同一であり、可動電極１２が金属である場合、補強樹脂３０のヤング率は、可動部１０のヤング率よりも小さい。 The reinforcing resin 30 is preferably soft so as not to hinder the deformation of the movable portion 10 when pressure is applied to the pressure sensor 100. Examples of the reinforcing resin 30 include epoxy resin and polyimide resin. It is preferable that the Young's modulus (elastic modulus) of the reinforcing resin 30 is the same as the Young's modulus of the movable portion 10 or smaller than the Young's modulus of the movable portion 10. The Young's modulus of the movable portion 10 is smaller than the Young's modulus of the fixed substrate portion 20. Therefore, the Young's modulus (E1) of the reinforcing resin 30, the Young's modulus (E2) of the movable portion 10, and the Young's modulus (E3) of the fixed substrate portion 20 may be in the order of E1 ≦ E2 <E3. As a result, the deformation of the movable portion 10 when the pressure is applied to the pressure sensor 100 is not hindered, and the pressure applied to the pressure sensor 100 can be measured with high accuracy. The material of the sheet substrate 11 and the material of the reinforcing resin 30 may be the same. When the movable electrode 12 is a metal such as copper (Cu), the Young's modulus of the movable electrode 12 is larger than the Young's modulus of the sheet substrate 11 and the reinforcing resin 30. Therefore, when the material of the sheet substrate 11 and the material of the reinforcing resin 30 are the same and the movable electrode 12 is made of metal, the Young's modulus of the reinforcing resin 30 is smaller than the Young's modulus of the movable portion 10.

曲げ応力σは、曲げモーメントＭ／断面係数Ｚにより求めることができる。矩形部材の断面係数Ｚについて、部材の幅をｂ、部材の厚み（高さ）をｈとすると、Ｚ＝ｂｈ２／６となる。可動部１０、固定基板部２０および補強樹脂３０のそれぞれの幅が一定である場合、可動部１０、固定基板部２０および補強樹脂３０のそれぞれの厚みＴが小さくなるにつれて、可動部１０、固定基板部２０および補強樹脂３０のそれぞれの断面係数Ｚが小さくなる。可動部１０、固定基板部２０および補強樹脂３０のそれぞれの断面係数Ｚが小さくなるにつれて、可動部１０、固定基板部２０および補強樹脂３０のそれぞれの曲げ応力σが大きくなる。したがって、可動部１０、固定基板部２０および補強樹脂３０のそれぞれの幅が一定である場合、可動部１０、固定基板部２０および補強樹脂３０のそれぞれの厚みＴが小さくなるにつれて、可動部１０、固定基板部２０および補強樹脂３０のそれぞれの剛性が小さくなる。補強樹脂３０は、可動部１０の変形を阻害しないように柔らかいことが好ましいため、補強樹脂３０の厚み（Ｔ１）、可動部１０の厚み（Ｔ２）および固
定基板部２０の厚み（Ｔ３）は、Ｔ１≦Ｔ２＜Ｔ３の順であってもよい。これにより、圧力センサ１００に圧力が印加された際における可動部１０の変形が阻害されず、圧力センサ１００に印加された圧力を高い精度で測定することができる。 The bending stress σ can be obtained from the bending moment M / section modulus Z. For the section modulus Z of the rectangular member, the width of the member b, and the thickness of the member (height) is is h, the Z = bh 2/6. When the widths of the movable portion 10, the fixed substrate portion 20 and the reinforcing resin 30 are constant, as the thickness T of each of the movable portion 10, the fixed substrate portion 20 and the reinforcing resin 30 decreases, the movable portion 10, the fixed substrate portion 10 and the reinforcing resin 30 become smaller. The cross-sectional coefficient Z of each of the portion 20 and the reinforcing resin 30 becomes smaller. As the cross-sectional coefficients Z of the movable portion 10, the fixed substrate portion 20 and the reinforcing resin 30 decrease, the bending stress σ of each of the movable portion 10, the fixed substrate portion 20 and the reinforcing resin 30 increases. Therefore, when the widths of the movable portion 10, the fixed substrate portion 20 and the reinforcing resin 30 are constant, as the thickness T of each of the movable portion 10, the fixed substrate portion 20 and the reinforcing resin 30 becomes smaller, the movable portion 10 The rigidity of each of the fixed substrate portion 20 and the reinforcing resin 30 is reduced. Since the reinforcing resin 30 is preferably soft so as not to hinder the deformation of the movable portion 10, the thickness of the reinforcing resin 30 (T1), the thickness of the movable portion 10 (T2), and the thickness of the fixed substrate portion 20 (T3) are set. The order may be T1 ≦ T2 <T3. As a result, the deformation of the movable portion 10 when the pressure is applied to the pressure sensor 100 is not hindered, and the pressure applied to the pressure sensor 100 can be measured with high accuracy.

図２に示したように、シート基板１１を共有して複数の圧力センサ１００を並べることが可能である。すなわち、単一のシート基板１１に複数の可動電極１２を設けることにより、単一のシート基板１１に複数の可動電極１２、複数の固定基板部２０および複数の固定基板側メッキ部２４を列状またはアレイ状に配置することが可能である。したがって、圧力センサ１００は、単一のシート基板１１を共有する複数のセンサ素子を有する。単一のシート基板１１に複数の補強樹脂３０を配置し、複数の補強樹脂３０のそれぞれが各可動電極１２、各固定基板部２０および各固定基板側メッキ部２４を覆っている。この場合、複数の可動電極１２同士が離間し、複数の固定基板部２０同士が離間し、複数の固定基板側メッキ部２４同士が離間し、複数の補強樹脂３０同士が離間している。そのため、圧力センサ１００に圧力が印加された際、隣接する複数のセンサ素子の一方が、隣接する複数のセンサ素子の他方に含まれる可動部１０の変形を阻害しない。したがって、圧力センサ１００に圧力が印加された際における可動部１０の変形が阻害されず、圧力センサ１００に印加された圧力を高い精度で測定することができる。単一のシート基板１１に単一の補強樹脂３０を配置し、単一の補強樹脂３０が、複数の可動電極１２、複数の固定基板部２０および複数の固定基板側メッキ部２４を覆ってもよい。 As shown in FIG. 2, it is possible to share the sheet substrate 11 and arrange a plurality of pressure sensors 100. That is, by providing the plurality of movable electrodes 12 on the single sheet substrate 11, the plurality of movable electrodes 12, the plurality of fixed substrate portions 20, and the plurality of fixed substrate side plating portions 24 are arranged in a row on the single sheet substrate 11. Alternatively, it can be arranged in an array. Therefore, the pressure sensor 100 has a plurality of sensor elements that share a single sheet substrate 11. A plurality of reinforcing resins 30 are arranged on a single sheet substrate 11, and each of the plurality of reinforcing resins 30 covers each movable electrode 12, each fixed substrate portion 20, and each fixed substrate side plating portion 24. In this case, the plurality of movable electrodes 12 are separated from each other, the plurality of fixed substrate portions 20 are separated from each other, the plurality of fixed substrate side plating portions 24 are separated from each other, and the plurality of reinforcing resins 30 are separated from each other. Therefore, when pressure is applied to the pressure sensor 100, one of the plurality of adjacent sensor elements does not hinder the deformation of the movable portion 10 included in the other of the plurality of adjacent sensor elements. Therefore, the deformation of the movable portion 10 when the pressure is applied to the pressure sensor 100 is not hindered, and the pressure applied to the pressure sensor 100 can be measured with high accuracy. Even if a single reinforcing resin 30 is arranged on a single sheet substrate 11, and the single reinforcing resin 30 covers a plurality of movable electrodes 12, a plurality of fixed substrate portions 20, and a plurality of fixed substrate side plating portions 24. Good.

＜圧力センサ１００の製造工程＞
図１０Ａから図１０Ｉは、圧力センサ１００の製造工程の一例を示す図である。以下、図１０Ａから図１０Ｉを参照して、圧力センサ１００の製造工程の一例について説明する。 <Manufacturing process of pressure sensor 100>
10A to 10I are diagrams showing an example of a manufacturing process of the pressure sensor 100. Hereinafter, an example of the manufacturing process of the pressure sensor 100 will be described with reference to FIGS. 10A to 10I.

（固定基板部２０の製造工程）
図１０Ａから図１０Ｅは固定基板部２０の製造工程の一例を示す。図１０Ａでは、基板部２１の可動部１０に対向する面上に固定電極２２が形成される。続いて、図１０Ｂでは、固定電極２２を覆うように絶縁膜２３１が形成される。さらに、図１０Ｂでは、絶縁膜２３１の可動部１０に対向する面上にレジスト膜５１が形成される。図１０Ｃでは、レジスト膜５１に対して所望のパターンが形成されたフォトマスクを用いてフォトレジストを行うことで、絶縁膜２３１上に所定パターンのレジスト膜５１が形成される。図１０Ｄでは、エッチング処理が行われ、さらにレジスト膜５１が除去されることで、絶縁部２３が形成される。図１０Ｅでは、絶縁部２３の可動部１０に対向する面上に固定基板側メッキ部２４が形成される。図１０Ｅに例示される工程では、固定基板側メッキ部２４を形成しない領域にメッキレジストが行われた上でメッキ処理を行うことで、所望の領域に固定基板側メッキ部２４が形成される。なお、固定基板側メッキ部２４の形成はスパッタリングにより形成してもよい。即ち、スパッタ装置にて絶縁部２３の可動部１０に対向する面上にメッキ層を成膜した後で、レジストを塗布してエッチングすることによって固定基板側メッキ部２４のパターンを形成するのであってもよい。 (Manufacturing process of fixed substrate portion 20)
10A to 10E show an example of the manufacturing process of the fixed substrate portion 20. In FIG. 10A, the fixed electrode 22 is formed on the surface of the substrate portion 21 facing the movable portion 10. Subsequently, in FIG. 10B, the insulating film 231 is formed so as to cover the fixed electrode 22. Further, in FIG. 10B, the resist film 51 is formed on the surface of the insulating film 231 facing the movable portion 10. In FIG. 10C, a resist film 51 having a predetermined pattern is formed on the insulating film 231 by performing photoresist on the resist film 51 using a photomask in which a desired pattern is formed. In FIG. 10D, the insulating portion 23 is formed by performing the etching process and further removing the resist film 51. In FIG. 10E, the fixed substrate side plating portion 24 is formed on the surface of the insulating portion 23 facing the movable portion 10. In the step exemplified in FIG. 10E, the fixed substrate side plating portion 24 is formed in a desired region by performing the plating treatment after applying the plating resist to the region where the fixed substrate side plating portion 24 is not formed. The plating portion 24 on the fixed substrate side may be formed by sputtering. That is, after a plating layer is formed on the surface of the insulating portion 23 facing the movable portion 10 by a sputtering device, a resist is applied and etched to form a pattern of the plating portion 24 on the fixed substrate side. You may.

（可動部１０の製造工程）
図１０Ｆおよび図１０Ｇは可動部１０の製造工程の一例を示す。図１０Ｆでは、可撓性を有するシート基板１１の固定基板部２０に対向する面上に可動電極１２が形成される。さらに、可動電極１２の固定基板部２０に対向する面に対してメッキ処理が行われることで、可動部側メッキ部１４が形成される。図１０Ｇでは、可動部側メッキ部１４の固定基板部２０に対向する面上において、第１可動電極１２１および第２可動電極１２２に相当する領域に対してエッチングレジストが行われた上でエッチングが行われることで、第１可動電極１２１および第２可動電極１２２が形成される。 (Manufacturing process of moving part 10)
10F and 10G show an example of the manufacturing process of the movable portion 10. In FIG. 10F, the movable electrode 12 is formed on the surface of the flexible sheet substrate 11 facing the fixed substrate portion 20. Further, the surface of the movable electrode 12 facing the fixed substrate portion 20 is plated to form the movable portion side plated portion 14. In FIG. 10G, etching is performed after etching resist is applied to the regions corresponding to the first movable electrode 121 and the second movable electrode 122 on the surface of the movable portion side plating portion 14 facing the fixed substrate portion 20. By doing so, the first movable electrode 121 and the second movable electrode 122 are formed.

（可動部１０と固定基板部２０の接合工程）
図１０Ｈおよび図１０Ｉは、固定基板部２０と可動部１０とを接合する工程の一例を示す。図１０Ｈでは、可動部１０と固定基板部２０とが接合される。接合方法には特に限定は無い。可動部１０と固定基板部２０とは、例えば、常温接合によって接合されてもよい。常温接合では、例えば、可動部１０の可動部側メッキ部１４の固定基板部２０に対向する面と固定基板部２０の固定基板側メッキ部２４の可動部１０に対向する面に対して、当該面を平滑にする処理と、当該面から不純物を除去して清浄にする処理が行われる。これらの処理が施された可動部側メッキ部１４と固定基板側メッキ部２４とが接触すると、可動部側メッキ部１４と固定基板側メッキ部２４との間で働く分子間力によって、可動部１０と固定基板部２０とが接合される。図１０Ｉでは、図１０Ａから図１０Ｈまでの工程によって製造された圧力センサ１００をシート基板１１を共有する形で３つ並べた様子を例示する。圧力センサ１００は、図１０Ｉに例示するように、シート基板１１を共有して複数の圧力センサ１００を並べることで、圧力検出の対象とする面積を広げることが可能である。 (Joining process of moving part 10 and fixed substrate part 20)
10H and 10I show an example of a step of joining the fixed substrate portion 20 and the movable portion 10. In FIG. 10H, the movable portion 10 and the fixed substrate portion 20 are joined. The joining method is not particularly limited. The movable portion 10 and the fixed substrate portion 20 may be joined by, for example, room temperature joining. In the room temperature bonding, for example, the surface of the movable portion 10 facing the fixed substrate portion 20 of the movable portion side plating portion 14 and the surface of the fixed substrate portion 20 facing the movable portion 10 of the fixed substrate side plating portion 24 are concerned. A process of smoothing the surface and a process of removing impurities from the surface to clean the surface are performed. When the movable portion side plating portion 14 and the fixed substrate side plating portion 24 that have been subjected to these treatments come into contact with each other, the movable portion is caused by the intermolecular force acting between the movable portion side plating portion 14 and the fixed substrate side plating portion 24. 10 and the fixed substrate portion 20 are joined. FIG. 10I illustrates a state in which three pressure sensors 100 manufactured by the steps from FIGS. 10A to 10H are arranged so as to share the sheet substrate 11. As illustrated in FIG. 10I, the pressure sensor 100 can expand the area targeted for pressure detection by arranging a plurality of pressure sensors 100 in common with the sheet substrate 11.

また、可動部１０と固定基板部２０の接合工程において可動部側メッキ部１４及び固定基板側メッキ部２４の表面を平坦化する処理を行わずに、可動部１０、固定基板部２０それぞれの製造工程で、表面の平坦性を担保するようにしてもよい。例えば、可動部１０の製造工程において、シート基板１１に対して可動電極１２となる金属（例えば銅）をＣＭＰ（Chemical Mechanical Polishing）処理して平坦にし、その上にスパッタ装置で可動
部側メッキ部１４を成膜するのであってもよい。 Further, in the joining process of the movable portion 10 and the fixed substrate portion 20, the movable portion 10 and the fixed substrate portion 20 are manufactured without performing the process of flattening the surfaces of the movable portion side plating portion 14 and the fixed substrate side plating portion 24. The flatness of the surface may be ensured in the process. For example, in the manufacturing process of the movable portion 10, a metal (for example, copper) to be a movable electrode 12 is subjected to CMP (Chemical Mechanical Polishing) treatment on the sheet substrate 11 to make it flat, and a plating device on the movable portion side is used on the metal (for example, copper). 14 may be formed.

（補強樹脂３０の形成工程）
図１０Ｊは、補強樹脂３０の形成工程の一例を示す。図１０Ｊでは、補強樹脂３０が、第１中空部１８および第２中空部１９の周囲であって、可動部１０と固定基板部２０との間に形成される。図１０Ｊに例示される工程では、補強樹脂３０が、可動部１０の下面の一部および固定基板部２０の側面に形成される。ディスペンサによって補強樹脂３０を可動部１０および固定基板部２０に塗布してもよい。シート状の補強樹脂３０を可動部１０および固定基板部２０に貼り付けてもよい。 (Forming process of reinforcing resin 30)
FIG. 10J shows an example of the forming process of the reinforcing resin 30. In FIG. 10J, the reinforcing resin 30 is formed around the first hollow portion 18 and the second hollow portion 19 and between the movable portion 10 and the fixed substrate portion 20. In the process illustrated in FIG. 10J, the reinforcing resin 30 is formed on a part of the lower surface of the movable portion 10 and the side surface of the fixed substrate portion 20. The reinforcing resin 30 may be applied to the movable portion 10 and the fixed substrate portion 20 by a dispenser. The sheet-shaped reinforcing resin 30 may be attached to the movable portion 10 and the fixed substrate portion 20.

以上で開示した実施形態や変形例はそれぞれ組み合わせる事ができる。 The embodiments and modifications disclosed above can be combined with each other.

１００、１００ａ、１００ｂ、１００ｃ・・・圧力センサ
１０・・・可動部
１１・・・シート基板
１２・・・可動電極
１３・・・中空部
１２１・・・第１可動電極
１２２・・・第２可動電極
１４・・・可動部側メッキ部
１４１・・・第１メッキ部
１４２・・・第２メッキ部
１５・・・信号線
１６、１６ａ、１６ｂ・・・ＧＮＤ線
１８・・・第１中空部
１９・・・第２中空部
２０・・・固定基板部
２１・・・基板部
２２・・・固定電極
２３・・・絶縁部
２４・・・固定基板側メッキ部
２４１・・・第３メッキ部
２４２・・・第４メッキ部
３０・・・補強樹脂
５１・・・レジスト膜
２００・・・コネクタ
２３１・・・絶縁膜
３００・・・静電容量測定回路
３０１・・・マルチプレクサ
３０２・・・コンバータ 100, 100a, 100b, 100c ... Pressure sensor 10 ... Movable part 11 ... Sheet substrate 12 ... Movable electrode 13 ... Hollow part 121 ... 1st movable electrode 122 ... 2nd Movable electrode 14 ... Movable part side plated part 141 ... 1st plated part 142 ... 2nd plated part 15 ... Signal line 16, 16a, 16b ... GND line 18 ... 1st hollow Part 19 ... Second hollow part 20 ... Fixed substrate part 21 ... Substrate part 22 ... Fixed electrode 23 ... Insulation part 24 ... Fixed substrate side plating part 241 ... Third plating Part 242 ... 4th plating part 30 ... Reinforcing resin 51 ... Resist film 200 ... Connector 231 ... Insulation film 300 ... Capacitance measurement circuit 301 ... multiplexer 302 ... converter

Claims (4)

第１の電極を含み、可撓性を有するフレキシブル基板と、
前記第１の電極に対向して配置される第２の電極を含み、前記フレキシブル基板との間に中空部を介して前記フレキシブル基板に対向配置された硬質基板と、
前記フレキシブル基板と前記硬質基板との間であって、前記中空部を囲むように設けられ、前記フレキシブル基板と前記硬質基板とを接合する接合部と、
前記接合部の周囲であって、前記フレキシブル基板と前記硬質基板との間に設けられた補強樹脂と、
を備え、
前記中空部において、前記第１の電極が前記第２の電極に対して撓むことで生じる静電容量の変化を検出することにより、前記第１の電極における前記第２の電極との対向面に向けて印加される圧力を測定する、静電容量式圧力センサであって、
前記フレキシブル基板は前記第１の電極を複数含んでおり、
複数の前記第１の電極に対応する複数の前記第２の電極、複数の前記硬質基板、複数の前記接合部および複数の前記補強樹脂を備え、
複数の前記補強樹脂のそれぞれが、前記フレキシブル基板の一部、複数の前記硬質基板のそれぞれの一部および複数の前記接合部のそれぞれの一部を覆っている、
静電容量式圧力センサ。 A flexible substrate containing a first electrode and having flexibility,
Includes a second electrode disposed to face the first electrode, and a rigid substrate that is opposed to the flexible-smoking substrate through a hollow portion between the flexible substrate,
A joint portion between the flexible substrate and the hard substrate, which is provided so as to surround the hollow portion and joins the flexible substrate and the hard substrate.
A reinforcing resin provided around the joint portion between the flexible substrate and the hard substrate, and
With
By detecting a change in capacitance caused by bending of the first electrode with respect to the second electrode in the hollow portion, the surface of the first electrode facing the second electrode. A capacitive pressure sensor that measures the pressure applied toward
The flexible substrate includes a plurality of the first electrodes.
It comprises a plurality of the second electrodes corresponding to the plurality of the first electrodes, a plurality of the hard substrates, a plurality of the joints, and a plurality of the reinforcing resins.
Each of the plurality of reinforcing resins covers a part of the flexible substrate, a part of each of the plurality of hard substrates, and a part of each of the plurality of joints.
Capacitive pressure sensor. 複数の前記補強樹脂のそれぞれのヤング率が、前記フレキシブル基板のヤング率と同一であり又は前記フレキシブル基板のヤング率よりも小さく、
前記フレキシブル基板のヤング率が、複数の前記硬質基板のそれぞれのヤング率よりも小さい、
請求項１に記載の静電容量式圧力センサ。 The Young's modulus of each of the plurality of reinforcing resins is the same as the Young's modulus of the flexible substrate or smaller than the Young's modulus of the flexible substrate.
The Young's modulus of the flexible substrate is smaller than the Young's modulus of each of the plurality of hard substrates.
The capacitive pressure sensor according to claim 1. 複数の前記補強樹脂のそれぞれの厚みが、前記フレキシブル基板の厚みと同一であり又は前記フレキシブル基板の厚みよりも小さく、
前記フレキシブル基板の厚みが、複数の前記硬質基板のそれぞれの厚みよりも小さい、
請求項１又は２に記載の静電容量式圧力センサ。 The thickness of each of the plurality of reinforcing resins is the same as the thickness of the flexible substrate or smaller than the thickness of the flexible substrate.
The thickness of the flexible substrate is smaller than the thickness of each of the plurality of hard substrates.
The capacitive pressure sensor according to claim 1 or 2. 複数の前記補強樹脂のそれぞれが、複数の前記硬質基板のそれぞれにおける前記フレキ
シブル基板との対向面の一部と、複数の前記硬質基板のそれぞれの側面の少なくとも一部と、複数の前記硬質基板のそれぞれにおける前記フレキシブル基板との対向面の反対面の少なくとも一部とを覆っている、
請求項１又は２に記載の静電容量式圧力センサ。 Each of the plurality of the reinforcing resin, a part of the facing surfaces of the flexible substrate in each of the plurality of the hard substrate, at least a portion of each side of the plurality of the hard substrate, the plurality of the hard substrate Each covers at least a part of the opposite surface to the flexible substrate.
The capacitive pressure sensor according to claim 1 or 2 .
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