JP6806183B2 - Sensor device and input device - Google Patents

Description

The present technology relates to sensor devices, input devices and electronic devices capable of electrostatically detecting an input operation.

As a sensor device for an electronic device, for example, a capacitance element is provided, and a configuration capable of detecting an operating position and a pressing force of an operator with respect to an input operating surface is known (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2011-170659

In recent years, input methods with a high degree of freedom have been performed by gesture operations using finger movements, but if the pressing force on the operation surface can be stably detected with high accuracy, a wider variety of input operations can be performed. Can be expected to be realized.

In view of the above circumstances, an object of the present technology is to provide a sensor device, an input device, and an electronic device capable of detecting an operating position and a pressing force with high accuracy.

In order to achieve the above object, the sensor device according to one embodiment of the present technology includes a first conductor layer, a second conductor layer, an electrode substrate, a first support, and a second support. Equipped with.
The first conductor layer is formed of a deformable sheet.
The second conductor layer is arranged so as to face the first conductor layer.
The electrode substrate has a plurality of first electrode wires and a plurality of second electrode wires arranged to face the plurality of first electrode wires and intersect with the plurality of first electrode wires. , It is deformably arranged between the first and second conductor layers, and it is possible to electrostatically detect a change in the distance from each of the first and second conductor layers.
The first support is a first structure formed between a plurality of first structures connecting the first conductor layer and the electrode substrate, and the plurality of first structures. It has a space part.
The second support is arranged between the plurality of adjacent first structures, and the plurality of second structures connecting the second conductor layer and the electrode substrate, and the plurality of structures. It has a second space formed between the second structures of the above.

According to the sensor device, when pressed from above the first conductor layer, the relative distance between each of the first and second conductor layers and the electrode substrate changes, and the pressing or the like is performed based on the change in the distance. It is possible to electrostatically detect the input operation of. Therefore, the amount of change in capacitance with respect to the input operation can be increased, and the detection sensitivity can be increased. Further, this makes it possible to detect not only a conscious pressing operation but also a minute pressing force during a contact operation, and it can be used as a touch sensor.

Further, the sensor device does not have a configuration in which the actuator and each electrode wire of the electrode substrate are directly capacitively coupled, but the input operation is performed via the first conductor layer, so that a finger wearing gloves, a stylus with a fine tip, etc. Even when the stylus is used, it is possible to detect the input operation with high accuracy.

The electrode substrate is formed in the intersection region of the plurality of first electrode wires and the plurality of second electrode wires, and the capacitance is increased according to the relative distance between the first and second conductor layers. It may further have a plurality of variable detection units.
This makes it possible to detect the input operation by the so-called mutual capacitance method, in which the detection is performed based on the amount of change in capacitance between the first and second electrode lines. Therefore, simultaneous detection of two or more points in the multi-touch operation becomes easy.

The plurality of detection units may be formed so as to face each of the plurality of first structures.
As a result, when the first structure is displaced toward the second conductor layer by the input operation from the first conductor layer, the detection unit facing the first structure is also second. It will be displaced toward the conductor layer side. Therefore, the relative distance between the detection unit and the second conductor layer can be easily changed, and the detection sensitivity can be improved.

Alternatively, the plurality of detection units may be formed so as to face each of the plurality of second structures.
With the above configuration, both the second structure and the detection unit are configured to face the first space unit. As a result, the relative distance between the first conductor layer and the detection unit can be easily changed via the first space portion, and the detection sensitivity can be improved.

The first support has a first frame body that connects between the first conductor layer and the electrode substrate and is arranged along the peripheral edge of the electrode substrate.
The second support may have a second frame that connects between the second conductor layer and the electrode substrate and is arranged so as to face the first frame.
The first and second frames reinforce the peripheral edge of the entire sensor device, improve the strength of the sensor device, and improve the handleability.

Further, the second conductor layer may have a stepped portion.
This makes it possible to increase the rigidity of the second conductor layer and increase the strength of the entire sensor device.

Further, in the sensor device according to one embodiment of the present technology, the second structure is not limited to the configuration arranged between the adjacent first structures, for example, the first structure and the second structure. And may be arranged to face each other.
As a result, the region in which the first structure and the second structure are arranged facing each other (overlapping) is not easily deformed, so that the region can be set to a region having low detection sensitivity. This makes it possible to control the detection sensitivity in the sensor device and increase the degree of freedom in device configuration.

Further, the electrode substrate is not limited to a configuration that electrostatically detects a change in distance from each of the first and second conductor layers, for example, with an operator made of a conductor and each of the second conductor layers. The change in the distance may be electrostatically detected.

Further, the first support is not limited to the configuration having the first space portion, and the plurality of first structures may be filled with an elastic material or the like.
Alternatively, the second support is not limited to the configuration having the second space portion, and the plurality of second structures may be filled with an elastic material or the like.

Further, each of the plurality of first electrode wires has a plurality of first unit electrode bodies including the plurality of first sub-electrodes, respectively.
Each of the plurality of second electrode wires includes a plurality of second sub-electrodes, and has a plurality of second unit electrode bodies facing each of the plurality of first unit electrode bodies.
The electrode substrate is
A base material on which the plurality of first electrode wires and the plurality of second electrode wires are arranged, and
A plurality of detections in which the plurality of first sub-electrodes of each first unit electrode body and the plurality of second sub-electrodes of each second unit electrode body face each other in the in-plane direction of the electrode substrate. It may have a part.
As a result, the first electrode wire and the second electrode wire can be capacitively coupled to face each other in the in-plane direction of the electrode substrate. As a result, the electrode substrate can be made thinner, and the entire sensor device can be made smaller. Further, since the detection unit is composed of the plurality of first and second sub-electrodes, it is possible to increase the capacitance coupling amount of the detection unit and increase the detection sensitivity as a sensor device.

An input device according to an embodiment of the present technology includes an operating member, a first conductor layer (conductor layer), an electrode substrate, a first support, and a second support.
The operating member is in the form of a deformable sheet having a first surface that accepts operations by the user and a second surface that is opposite to the first surface.
The first conductor layer is arranged so as to face the second surface.
The electrode substrate has a plurality of first electrode wires and a plurality of second electrode wires arranged to face the plurality of first electrode wires and intersect with the plurality of first electrode wires. It is deformably arranged between the operating member and the conductor layer, and it is possible to electrostatically detect a change in the distance from the first conductor layer.
The first support includes a plurality of first structures connecting the operating member and the electrode substrate, and a first space portion formed between the plurality of first structures. Has.
The second support is arranged between the plurality of adjacent first structures, and the plurality of second structures connecting the conductor layer and the electrode substrate, and the plurality of second structures. It has a second space formed between the structures of the above.

According to the above input device, when pressed from above the operating member, the relative distance between each of the operating member and the conductor layer and the electrode substrate changes, and the input operation such as pressing is electrostatically performed based on the change in the distance. Can be detected. Therefore, the amount of change in capacitance based on the input operation can be increased, and the detection sensitivity can be increased. As a result, the input device can detect not only a conscious pressing operation but also a minute pressing force during a contact operation, and can be used as an input device provided with a touch sensor.

The operating member further has a second conductor layer formed on the second surface.
The detection substrate can electrostatically detect a change in the distance between the first conductor layer and the second conductor layer.
As a result, the operator and each electrode wire of the electrode substrate are not directly capacitively coupled, but the input operation is performed through the metal film. Therefore, an operator such as a gloved finger or a stylus with a fine tip is used. Even in this case, it is possible to detect the input operation with high accuracy.

Further, the operating member may include a display unit.
As described above, the input device does not have a configuration in which each electrode wire of the electrode substrate with the operator is directly capacitively coupled. Therefore, when a display unit containing a conductor material is arranged between the electrode substrate and the actuator. Even if there is, the input operation can be detected with high accuracy. That is, the sensor device can be arranged on the back surface of the display unit, and the deterioration of the display quality of the display unit can be suppressed.

The operating member may include a plurality of key areas.
As a result, the input device can be applied as a keyboard device.

Further, the electrode substrate is formed in each of the intersecting regions of the plurality of first electrode wires and the plurality of second electrode wires, and a plurality of detections having a variable capacitance according to the relative distance to the conductor layer. It may have more parts.

Further, a control unit that is electrically connected to the electrode substrate and can generate information regarding an input operation for each of the plurality of key regions based on the outputs of the plurality of detection units may be further provided.
As a result, the input device can be controlled by the control unit corresponding to the key area in which the input operation is performed.

Each of the plurality of first structures may be arranged along the boundary between the plurality of key regions.
As a result, each key area can be configured to face the first space portion. Therefore, the distance between the operating member and the electrode substrate can be easily changed by the input operation in the key region, and the detection sensitivity of the input operation can be increased.

Further, each of the plurality of first electrode wires is a flat plate-shaped electrode arranged on the operating member side of the plurality of second electrode wires.
Each of the plurality of second electrode wires may include a plurality of electrode groups.
As a result, the first electrode wire can be connected to the ground and function as an electromagnetic shield. Therefore, it is possible to suppress the intrusion of electromagnetic waves from the outside of the electrode substrate and improve the reliability of the detection sensitivity without having the structure of the metal film or the like formed on the operating member.

Further, in the input device according to one embodiment of the present technology, the second structure is not limited to the configuration arranged between the adjacent first structures, for example, the first structure and the second structure. And may be arranged to face each other in the thickness direction of the input device.
Further, the electrode substrate is not limited to a configuration that electrostatically detects a change in distance from each of the first and second conductor layers, for example, with an operator made of a conductor and each of the second conductor layers. The change in the distance may be electrostatically detected.
Further, the first support is not limited to the configuration having the first space portion, and the plurality of first structures may be filled with an elastic material or the like.
Alternatively, the second support is not limited to the configuration having the second space portion, and the plurality of second structures may be filled with an elastic material or the like.

An input device according to an embodiment of the present technology includes an operating member, a back plate, an electrode substrate, a first support, and a second support.
The operating member is in the form of a deformable sheet having a first surface that receives an operation by a user, a second surface opposite to the first surface, and a conductor layer formed on the second surface. Is.
The back plate is arranged so as to face the second surface.
The electrode substrate has a plurality of first electrode wires and a plurality of second electrode wires arranged to face the plurality of first electrode wires and intersect with the plurality of first electrode wires. , Deformably arranged between the operating member and the back plate.
The first support has a plurality of first structures connecting the operating member and the electrode substrate.
The second support has a plurality of second structures connecting the back plate and the electrode substrate.

Further, each of the plurality of second electrode wires is a flat plate-shaped electrode arranged on the back surface plate side of the plurality of first electrode wires.
Each of the plurality of first electrode wires may include a plurality of electrode groups.
As a result, the second electrode wire can be connected to the ground and function as an electromagnetic shield. Therefore, even if the back plate is not a conductor, it is possible to suppress the intrusion of electromagnetic waves from the outside of the electrode substrate and improve the reliability of the detection sensitivity.

An electronic device according to an embodiment of the present technology includes an operating member, a conductor layer, an electrode substrate, a first support, a second support, and a controller.
The operating member is in the form of a deformable sheet having a first surface that accepts operations by the user and a second surface that is opposite to the first surface.
The conductor layer is arranged so as to face the second surface.
The electrode substrate has a plurality of first electrode wires and a plurality of second electrode wires arranged to face the plurality of first electrode wires and intersect with the plurality of first electrode wires. , It is deformably arranged between the operating member and the conductor layer, and it is possible to electrostatically detect a change in the distance from the conductor layer.
The first support includes a plurality of first structures connecting the operating member and the electrode substrate, and a first space portion formed between the plurality of first structures. Has.
The second support is arranged between the plurality of adjacent first structures, and the plurality of second structures connecting the conductor layer and the electrode substrate, and the plurality of second structures. It has a second space formed between the structures of the above.
The controller is electrically connected to the electrode substrate and has a control unit capable of generating information regarding an input operation for each of the plurality of operating members based on the output of the electrode substrate.

As described above, according to the present technology, it is possible to detect the operating position and the pressing force with high accuracy.

It is the schematic sectional drawing of the input device which concerns on 1st Embodiment of this technique. It is an exploded perspective view of the said input device. It is the schematic sectional drawing of the main part of the said input device. It is a block diagram of the electronic device using the said input device. It is the schematic sectional drawing which shows the structural example of the conductor layer which concerns on the said input device. It is a schematic diagram explaining the connection method to the ground potential of the metal film and the conductor layer which concerns on the input device. It is a schematic diagram explaining the connection method to the ground potential of the metal film and the conductor layer which concerns on a modification. It is a schematic sectional view for demonstrating the structure of the detection part which concerns on the said input device. It is a schematic cross-sectional view which shows an example of the method of forming the 1st support which concerns on the said input device. It is schematic cross-sectional view which shows an example of the method of forming the 2nd support which concerns on the said input device. It is schematic cross-sectional view which shows the modification of the method of forming the 1st or 2nd support. It is a schematic plan view which shows the arrangement example of the 1st and 2nd structures which concerns on the said input device, and the 1st and 2nd electrode lines. It is a schematic plan view which shows the arrangement example of the opening of the conductor layer, the 1st and 2nd structures, and the 1st and 2nd electrode lines. FIG. 5 is a schematic cross-sectional view showing a state of force applied to the first and second structures when a point on the first surface of the input device is pressed downward in the Z-axis direction by an operator. A schematic cross-sectional view of a main part showing the mode of the input device when a point on the first structure of the first surface is operated by an operator, and an output output from the detection unit at that time. It is a figure which shows an example of a signal. It is a schematic cross-sectional view of a main part which shows the mode of the input device when the first surface is operated by an operator, and is the figure which shows an example of the output signal output from the detection part at that time. A shows an example when the operator is a stylus, and B shows an example when the operator is a finger. It is schematic cross-sectional view which shows the mounting example of the said input device in an electronic device. It is a schematic cross-sectional view which shows the structure of the modification 1 of the input device shown in FIG. 1, and shows the example which the adhesive layer is formed only partially. It is a figure which shows typically the state that the flexible display (display part) shown in FIG. 18 is attached to the whole surface including the outer peripheral part with respect to the metal film shown in FIG. It is a schematic cross-sectional view which shows the other structure of the modification 1 of the input device shown in FIG. 1, and is the figure which shows the example which the adhesive layer is formed by the predetermined plane pattern. It is a schematic diagram which shows the example of the plane pattern of the adhesive layer shown in FIG. It is a schematic plan view which shows the structural example of the 1st and 2nd electrode wire which concerns on the modification 2 of the input device shown in FIG. 1, A is the 1st electrode wire, and B is the 2nd electrode wire. .. It is a schematic diagram which shows the shape example of the unit electrode body which concerns on the 1st and 2nd electrode lines shown in FIG. 22. It is a schematic plan view which shows the arrangement example of the 1st and 2nd structures which concerns on the modification 3 of the input device shown in FIG. 1 and the 1st and 2nd electrode lines. FIG. 6 is a schematic cross-sectional view of a main part showing an aspect of the input device when the first surface of the input device according to FIG. 24 is operated by an operator. It is schematic cross-sectional view which shows the structure of the modification 4 of the input device shown in FIG. It is schematic cross-sectional view of the main part which shows the structural example 2 of the modification 5 of the input device shown in FIG. It is schematic cross-sectional view of the main part which shows the structural example 3 of the modification 5 of the input device shown in FIG. It is schematic cross-sectional view of the main part which shows the structural example 4 of the modification 5 of the input device shown in FIG. It is schematic cross-sectional view of the main part which shows the structural example 5 of the modification 5 of the input device shown in FIG. It is the schematic sectional drawing of the input device which concerns on 2nd Embodiment of this technique. It is the schematic sectional drawing which shows the structural example of the operation member which concerns on the said input device. It is an enlarged sectional view which shows the structure of the modification of the input device shown in FIG. FIG. 33 is a plan view showing an arrangement example of the first and second structures of the input device shown in FIG. 33, where A is a first structure and B is a second structure. FIG. 33 is a plan view showing a configuration example of a plurality of first and second electrode lines of the input device shown in FIG. 33, where A is a first electrode line and B is a second electrode line. It is an enlarged plan view which shows the arrangement example of the 1st and 2nd structures shown in FIG. 34. It is the schematic sectional drawing of the electronic device which incorporated the input device which concerns on 3rd Embodiment of this technique. It is a figure which shows the structure of the input device which concerns on 4th Embodiment of this technique, A is the schematic sectional view, and B is the enlarged sectional view which shows the main part of A. FIG. 38 is a schematic plan view showing a configuration example of the first and second electrode lines according to the input device shown in FIG. 38, where A shows the first electrode line and B shows the second electrode line. A is a plan view showing the arrangement of the first and second electrode lines according to the input device shown in FIG. 38. B is a cross-sectional view of A seen from the AA direction. It is a schematic cross-sectional view for demonstrating the structure of the detection part shown in FIG. 38. It is the schematic sectional drawing of the input device which concerns on one configuration example of 5th Embodiment of this technique. It is a schematic plan view which shows the arrangement example of the 1st and 2nd structures concerning the input device shown in FIG. 42, and the 1st and 2nd electrode lines. It is the schematic sectional drawing of the input device which concerns on other configuration example of 5th Embodiment of this technique. It is a schematic plan view which shows the arrangement example of the 1st and 2nd structures concerning the input device shown in FIG. 44, and the 1st and 2nd electrode lines. FIG. 42 is a schematic plan view showing a configuration example of the first and second electrode lines according to a modified example of the input device shown in FIG. 42, where A is a first electrode line and B is a second electrode line. .. FIG. 44 is a schematic plan view showing a configuration example of the first and second electrode lines according to a modification of the input device shown in FIG. 44, where A is a first electrode line and B is a second electrode line. It is a figure which shows the structure of the input device which concerns on the modification of 6th Embodiment of this technique, A is a perspective view, and B is a sectional view seen from the BB direction of A. It is a perspective view which shows the structure of the modification of the input device shown in FIG. 48.

Hereinafter, embodiments relating to the present technology will be described with reference to the drawings.

<First Embodiment>
1 is a schematic cross-sectional view of the input device 100 according to the first embodiment of the present technology, FIG. 2 is an exploded perspective view of the input device 100, FIG. 3 is a schematic cross-sectional view of a main part of the input device 100, and FIG. 4 is an input. It is a block diagram of the electronic device 70 using the apparatus 100. Hereinafter, the configuration of the input device 100 of this embodiment will be described. In the figure, the X-axis and the Y-axis indicate directions orthogonal to each other (in-plane direction of the input device 100), and the Z-axis is a direction orthogonal to the X-axis and the Y-axis (thickness direction or vertical direction of the input device 100). Is shown.

[Input device]
The input device 100 includes a flexible display (display unit) 11 that receives an operation by the user, and a sensor device 1 that detects the operation of the user. The input device 100 is configured as, for example, a flexible touch panel display, and is incorporated in an electronic device 70 described later. The sensor device 1 and the flexible display 11 have a flat plate shape extending in a direction perpendicular to the Z axis.

The flexible display 11 has a first surface 110 and a second surface 120 opposite the first surface 110. The flexible display 11 has both a function as an input operation unit and a function as a display unit in the input device 100. That is, the flexible display 11 makes the first surface 110 function as an input operation surface and a display surface, and displays an image corresponding to the operation by the user from the first surface 110 upward in the Z-axis direction. For example, an image corresponding to a keyboard, a GUI (Graphical User Interface), and the like are displayed on the first surface 110. Examples of the operator for operating the flexible display 11 include the finger f shown in FIG. 16B and the stylus s shown in FIG. 16A.

The specific configuration of the flexible display 11 is not particularly limited. For example, as the flexible display 11, so-called electronic paper, an organic EL (electroluminescence) panel, an inorganic EL panel, a liquid crystal panel, or the like can be adopted. The thickness of the flexible display 11 is also not particularly limited, and is, for example, about 0.1 mm to 1 mm.

The sensor device 1 includes a metal film (first conductor layer or second conductor layer) 12, a conductor layer (second conductor layer or first conductor layer) 50, an electrode substrate 20, and a first support. It has a body 30 and a second support 40. The sensor device 1 is arranged on the second surface 120 side of the flexible display 11.

The metal film 12 is formed in the form of a deformable sheet. The conductor layer 50 is arranged so as to face the metal film 12. The electrode substrate 20 comprises a plurality of first electrode wires 210 and a plurality of second electrode wires 220 arranged to face the plurality of first electrode wires 210 and intersecting the plurality of first electrode wires 210. It is deformably arranged between the metal film 12 and the conductor layer 50, and changes in distance between the metal film 12 and the conductor layer 50 can be electrostatically detected. The first support 30 is a first space portion formed between a plurality of first structures 310 connecting the metal film 12 and the electrode substrate 20 and the plurality of first structures 310. It has 330 and. The second support 40 is a plurality of second structures 410 arranged between a plurality of adjacent first structures 310, respectively, and connecting between the conductor layer 50 and the electrode substrate 20, and a plurality of second structures. It has a second space portion 430 formed between the structures 410 of the above.

The sensor device 1 (input device 100) according to the present embodiment is located between the metal film 12 and the electrode substrate 20 and the conductor layer 50 and the electrode substrate 20 by an input operation on the first surface 110 of the flexible display 11. The input operation is detected by electrostatically detecting the change in distance. The input operation is not limited to a conscious pressing (pushing) operation on the first surface 110, and may be a touching operation. That is, as will be described later, the input device 100 can detect even a minute pressing force (for example, about several tens of grams) applied by a general touch operation, and is therefore similar to a normal touch sensor. It is configured to enable touch operation.

The input device 100 has a control unit 60, and the control unit 60 includes a calculation unit 61 and a signal generation unit 62. The calculation unit 61 detects an operation by the user based on the change in the capacitance of the detection unit 20s. The signal generation unit 62 generates an operation signal based on the detection result by the calculation unit 61.

The electronic device 70 shown in FIG. 4 has a controller 710 that performs processing based on an operation signal generated by the signal generation unit 62 of the input device 100. The operation signal processed by the controller 710 is output to the flexible display 11 as, for example, an image signal. The flexible display 11 is connected to a drive circuit mounted on the controller 710 via a flexible wiring board 113 (see FIG. 2). The drive circuit may be mounted on the wiring board 113.

In the present embodiment, the flexible display 11 is configured as a part of the operation member 10 of the input device 100. That is, the input device 100 includes an operation member 10, an electrode substrate 20, a first support 30, a second support 40, and a conductor layer 50. Each of these elements will be described below.

(Operating member)
The operating member 10 has a laminated structure of a flexible display 11 including a first surface 110 and a second surface 120 and a metal film 12. That is, the operating member 10 has a first surface 110 that receives an operation by the user and a second surface 120 on which the metal film 12 is formed and is opposite to the first surface 110, and is configured in a deformable sheet shape. Will be done.

The metal film 12 is formed in a sheet shape that can be deformed according to the deformation of the flexible display 11, and is made of a metal foil or mesh material such as Cu (copper), Al (aluminum), or stainless steel (SUS). The thickness of the metal film 12 is not particularly limited, and is, for example, several tens of nm to several tens of μm. The metal film 12 is connected to, for example, a ground potential. The metal film may function as a conductive layer and is not limited to metal. For example, an oxide conductor such as ITO (indium tin oxide) or an organic conductor such as carbon nanotube may be used. As a result, the metal film 12 functions as an electromagnetic shield layer when mounted on the electronic device 70. That is, for example, it is possible to suppress the intrusion of electromagnetic waves from other electronic components mounted on the electronic device 70 and the leakage of electromagnetic waves from the input device 100, and contribute to the stability of the operation of the electronic device 70. The metal film 12 may each have a plurality of layers connected to the ground potential (see FIG. 7). Thereby, the function as an electromagnetic shield layer can be strengthened.

As shown in FIG. 3, for example, the metal film 12 is formed by attaching the adhesive adhesive layer 13 on which the metal foil is formed to the flexible display 11. The material of the adhesive layer 13 is not particularly limited as long as it has adhesiveness, but a resin film to which a resin material is applied may be used. Alternatively, it may be composed of a vapor deposition film or a sputter film directly formed on the flexible display 11, or may be a coating film such as a conductive paste printed on the surface of the flexible display 11. Further, a non-conductive film may be formed on the surface of the metal film 12. As the non-conductive film, for example, a scratch-resistant hard coat layer, a corrosion-resistant antioxidant film, or the like can be formed.

(Conductor layer)
The conductor layer 50 constitutes the lowermost portion of the input device 100 and is arranged so as to face the metal film 12 in the Z-axis direction. The conductor layer 50 also functions as, for example, a support plate for the input device 100, and is configured to have higher bending rigidity than, for example, the operating member 10 and the electrode substrate 20. The conductor layer 50 may be made of, for example, a metal plate containing an Al alloy, an Mg (magnesium) alloy or other metal material, or a conductor plate such as carbon fiber reinforced plastic. Alternatively, the conductor layer 50 may have a laminated structure in which a plating film, a vapor deposition film, a sputtering film, a conductor film such as a metal foil is formed on an insulator layer such as a plastic material. The thickness of the conductor layer 50 is not particularly limited, and is, for example, about 0.3 mm.

5A to 5E are schematic cross-sectional views showing a configuration example of the conductor layer 50. The conductor layer 50 is not limited to the example of being formed in a flat plate shape as shown in FIG. 5A, and may have the stepped portion 51 shown in FIGS. 5B, C, and E. Alternatively, the conductor layer 50 may be configured in a mesh shape having an opening 50h.

For example, the conductor layer 50B shown in FIG. 5B has a stepped portion 51B formed by bending the peripheral edge portion upward in the Z-axis direction, and the conductor layers 50C shown in FIGS. 5C and E are both located in the central portion. It has stepped portions 51C and 51E that are formed and depressed downward. With such a step portion 51, the bending rigidity of the conductor layer 50 in the Z-axis direction can be increased.

Further, the conductor layer 50E shown in FIGS. 5D and 5E is provided with one or more openings 50h. By providing the conductor layer 50 with the opening 50h in this way, it is possible to improve heat dissipation while maintaining rigidity. Therefore, it is possible to suppress the malfunction of the input device 100 and improve the reliability. Further, the opening 50h reduces the volume of the conductor layer 50 and makes it possible to reduce the weight of the input device 100. Further, the opening 50h makes it easier for air to flow when the volume of the second space 430 changes due to deformation, and the response time of the electrode substrate 20 is shortened. Here, the response time refers to the time from when the load on the operating member 10 changes until the actual capacity of the sensor device 1 changes.

Examples of the planar shape of the opening 50h include polygonal shapes such as triangles and quadrangles, circular shapes, elliptical shapes, oval shapes, indefinite shapes, and slit shapes, and these shapes may be used alone or in combination of two or more. ..

Further, when the conductor layer 50 is provided with the plurality of openings 50h, the arrangement pattern of the plurality of openings 50h is not particularly limited, but may be, for example, a regular pattern. As a result, the detection sensitivity can be made more uniform. Further, the regular pattern may be either a one-dimensional array or a two-dimensional array, and may be, for example, a mesh shape as shown in FIG. 5D. Alternatively, the plurality of openings 50h may be formed in a striped shape, or a geometric pattern may be formed as a whole.

The opening 50h is provided, for example, at a position or region that does not face any of the plurality of second structures 410. That is, the opening 50h and the second structure 410 are provided so as to be offset in the in-plane (XY in-plane) direction so as not to overlap in the Z-axis direction (thickness direction of the input device 100). As a result, the electrode substrate 20 and the conductor layer 50 can be stably connected by the second structure 410.

The conductor layer 50 is connected to, for example, a ground potential. As a result, the conductor layer 50 functions as an electromagnetic shield layer when mounted on the electronic device 70. That is, for example, it is possible to suppress the intrusion of electromagnetic waves from other electronic components mounted on the electronic device 70 and the leakage of electromagnetic waves from the input device 100, and contribute to the stability of the operation of the electronic device 70. Further, the electromagnetic shield function can be further enhanced by adopting the connection method as described below.

(How to connect the metal film and the conductor layer to the ground potential)
FIG. 6 is a schematic diagram illustrating a method of connecting the metal film 12 and the conductor layer 50 to the ground potential. As shown in the figure, the metal film 12 and the conductor layer 50 are connected to, for example, the ground of the control unit 60 of the input device 100 and the ground of the controller 710 of the electronic device 70.

Here, as one of the devices that affect the detection sensitivity of the sensor device 1, the flexible display 11 can be mentioned. If the metal film 12 and the conductor layer 50 are connected only to the ground of the control unit 60, the flexible display 11 may affect the ground potential of the control unit 60, and the electromagnetic shielding effect is sufficiently obtained. It may not be possible to exert it. Therefore, by connecting the metal film 12 and the conductor layer 50 to the ground of the controller 710 to which the flexible display 11 is connected, a more stable ground potential can be maintained and the electromagnetic shielding effect can be improved. .. Further, as shown in the figure, the electromagnetic shielding effect can be improved by connecting the metal film 12 and the conductor layer 50 with more contacts.

Alternatively, as shown in FIG. 7, the metal film 12 may be formed from a plurality of layers. In the example shown in the figure, the metal film 12 includes a first metal film 12a on the flexible display 11 side and a second metal film 12b on the electrode substrate 20 side. Thereby, for example, the first metal film 12a can be connected to the ground of the controller 710, and the second metal film 12b can be connected only to the control unit 60. Alternatively, the second metal film 12b may be connected to both the control unit 60 and the controller 710. This also makes it possible to improve the electromagnetic shielding effect.

(Electrode substrate)
The electrode substrate 20 is composed of a laminate of a first wiring board 21 having a first electrode wire 210 and a second wiring board 22 having a second electrode wire 220.

The first wiring board 21 has a first base material 211 (see FIG. 2) and a plurality of first electrode wires (X electrodes) 210. The first base material 211 is made of, for example, a flexible sheet material, specifically, an electrically insulating plastic sheet (film) such as PET, PEN, PC, PMMA, and polyimide. The thickness of the first base material 211 is not particularly limited, and is, for example, several tens of μm to several hundreds of μm.

The plurality of first electrode wires 210 are integrally provided on one surface of the first base material 211. The plurality of first electrode wires 210 are arranged at predetermined intervals along the X-axis direction, and are formed substantially linearly along the Y-axis direction. Each of the first electrode wires 210 is drawn out to the edge of the first base material 211 or the like, and is connected to different terminals. Further, each of the first electrode wires 210 is electrically connected to the control unit 60 via these terminals.

Each of the plurality of first electrode wires 210 may be composed of a single electrode wire, or may be composed of a plurality of electrode groups 21w (see FIG. 12) arranged along the X-axis direction. You may. Further, the plurality of electrode wires constituting each electrode group 21w may be connected to a common terminal, or may be divided into two or more different terminals and connected.

On the other hand, the second wiring board 22 has a second base material 221 (see FIG. 2) and a plurality of second electrode wires (Y electrodes) 220. The second base material 221 is composed of, for example, a flexible sheet material like the first base material 211, and specifically, an electrically insulating plastic sheet such as PET, PEN, PC, PMMA, or polyimide (). It is composed of film) and the like. The thickness of the second base material 221 is not particularly limited, and is, for example, several tens of μm to several hundreds of μm. The second wiring board 22 is arranged so as to face the first wiring board 21.

The plurality of second electrode wires 220 are configured similarly to the plurality of first electrode wires 210. That is, the plurality of second electrode wires 220 are integrally provided on one surface of the second base material 221, are arranged at predetermined intervals along the Y-axis direction, and are arranged in the X-axis direction. It is formed almost linearly along it. Further, each of the plurality of second electrode wires 220 may be composed of a single electrode wire, or may be composed of a plurality of electrode groups 22w (see FIG. 12) arranged along the Y-axis direction. May be good.

Each of the second electrode wires 220 is drawn out to the edge of the second base material 221 and is connected to different terminals. The plurality of electrode wires constituting each electrode group 22w may be connected to a common terminal, or may be divided into two or more different terminals and connected. Further, each of the second electrode wires 210 is electrically connected to the control unit 60 via these terminals.

The first electrode wire 210 and the second electrode wire 220 may be formed by printing a conductive paste or the like by a printing method such as screen printing, gravure offset printing, or inkjet printing, or a photolithography technique for a metal foil or a metal layer. It may be formed by the patterning method used. Further, since both the first and second base materials 211 and 221 are composed of a flexible sheet, the electrode substrate 20 as a whole can be configured to have flexibility.

As shown in FIG. 3, the electrode substrate 20 has an adhesive layer 23 that joins the first wiring board 21 and the second wiring board 22 to each other. The adhesive layer 23 has electrical insulation properties, and is made of, for example, a cured product of an adhesive, an adhesive material such as an adhesive tape, or the like.

With such a configuration, the first electrode wire 210 is arranged so as to face the second electrode wire 220 and the electrode substrate 20 in the thickness direction, that is, in the Z-axis direction. Further, the electrode substrate 20 has a plurality of detection units 20s formed in the intersection region of the first electrode wire 210 and the second electrode wire 220, respectively.

FIG. 8A is a schematic cross-sectional view for explaining the configuration of the detection unit 20s. The detection unit 20s is provided between the first electrode wire 210, the second electrode wire 220 facing the first electrode wire 210 in the Z-axis direction, and the first and second electrode wires 210 and 220. It is composed of a mutual capacitance type capacitive element having a dielectric layer. In FIGS. 8A and 8B, it will be described that the first and second electrode wires 210 and 220 are each composed of a single electrode wire.

FIG. 8A shows an example in which the first electrode wire 210 (210x1,210x2, 210x3) and the second electrode wire 220 (220y) are arranged so as to face each other in the Z-axis direction. In the example shown in FIG. 8A, the first wiring board 21 and the second wiring board 22 are bonded to each other by the adhesive layer 23, and the first base material 211 and the adhesive layer 23 of the first wiring board 21 are bonded to each other. Consists of the dielectric layer. In this case, detection units 20s1, 20s2, 20s3 are formed in the intersection region where each of the first electrode lines 210x1,210x2, 210x3 and the second electrode line 220y are capacitively coupled, respectively, and these capacitances C1 and C2 are formed. , C3 are configured to change according to the capacitance coupling between each of the metal film 12 and the conductor layer 50 and the first electrode line 210x1,210x2, 210x3 and the second electrode line 220y. The initial capacitance of the detection unit 20s depends on, for example, the facing area between the first and second electrode wires 210 and 220, the facing distance between the first and second electrode wires 210 and 220, and the dielectric constant of the adhesive layer 23. Set.

Further, FIG. 8B shows a modified example of the configuration of the detection unit 20s, in which the first electrode line 210D (210Dx1,210Dx2,210Dx3) and the second electrode line 220D (220Dy1,220Dy2,220Dy3) are the first base. An example is shown in which the materials 211D are arranged in the same plane and are capacitively coupled in the XY plane. In this case, the first electrode wire 210D and the second electrode wire 220D are arranged so as to face the in-plane direction (for example, the X-axis direction) of the electrode substrate 20, and for example, the first substrate 211D is the detection unit. A dielectric layer of 20Ds (20Ds1, 20Ds2, 20Ds3) is formed. Even in such an arrangement, the capacitances C11, C12, and C13 of the detection units 20Ds1, 20Ds2, and 20Ds3 are capacitively coupled to the metal film 12 and the conductor layer 50, respectively, and the first and second electrode wires 210Dx, 220Dy. It is variably configured according to. Further, in the above configuration, the second base material and the adhesive layer are unnecessary, which can contribute to the thinning of the input device 100.

In the present embodiment, each of the plurality of detection units 20s is arranged so as to face the first structure 310, which will be described later, in the Z-axis direction. Alternatively, it may be arranged so as to face the second structure 410 described later in the Z-axis direction. Further, in the present embodiment, the first wiring board 21 is laminated so as to be an upper layer than the second wiring board 22, but the second wiring board 22 is not limited to this, and the second wiring board 22 is more than the first wiring board 21. It may be laminated so as to be an upper layer.

(Control unit)
The control unit 60 is electrically connected to the electrode substrate 20. More specifically, the control unit 60 is connected to each of the plurality of first and second electrode lines 210 and 220 via terminals. The control unit 60 constitutes a signal processing circuit capable of generating information regarding an input operation with respect to the first surface 110 based on the outputs of the plurality of detection units 20s. The control unit 60 acquires the amount of change in capacitance of each detection unit 20s while scanning each of the plurality of detection units 20s in a predetermined cycle, and generates information on the input operation based on the amount of change in capacity.

The control unit 60 is typically composed of a computer having a CPU / MPU, a memory, and the like. The control unit 60 may be composed of a single chip component or a plurality of circuit components. The control unit 60 may be mounted on the input device 100, or may be mounted on the electronic device 70 in which the input device 100 is incorporated. In the former case, for example, it is mounted on a flexible wiring board connected to the electrode board 20. In the latter case, it may be integrally configured with the controller 710 that controls the electronic device 70.

The control unit 60 has a calculation unit 61 and a signal generation unit 62 as described above, and executes various functions according to a program stored in a storage unit (not shown). The calculation unit 61 determines the operation position in the XY coordinate system on the first surface 110 based on the electrical signals (input signals) output from the first and second electrode lines 210 and 220 of the electrode substrate 20. After calculation, the signal generation unit 62 generates an operation signal based on the result. As a result, the flexible display 11 can display an image based on the input operation on the first surface 110.

The calculation unit 61 shown in FIGS. 3 and 4 calculates the XY coordinates of the operation position by the operator on the first surface 110 based on the output from each detection unit 20s to which the unique XY coordinates are assigned. Specifically, the calculation unit 61 is a detection unit 20s formed in the intersecting region of each X electrode 210 and Y electrode 220 based on the amount of change in capacitance obtained from each X electrode 210 and Y electrode 220. Calculate the amount of change in capacitance in. It is possible to calculate the XY coordinates of the operation position by the operator from the ratio of the amount of change in the capacitance of each detection unit 20s.

Further, the calculation unit 61 can determine whether or not the first surface 110 is being operated. Specifically, for example, when the amount of change in the capacitance of the entire detection unit 20s or the amount of change in the capacitance of each of the detection units 20s is equal to or greater than a predetermined threshold value, the first surface 110 is operated. Can be determined to be. Further, by setting the threshold value to 2 or more, it is possible to distinguish between, for example, a touch operation and a (conscious) push operation. Further, it is also possible to calculate the pressing force based on the amount of change in the capacitance of the detection unit 20s.

The calculation unit 61 can output these calculation results to the signal generation unit 62.

The signal generation unit 62 generates a predetermined operation signal based on the calculation result of the calculation unit 61. The operation signal is, for example, an image control signal for generating a display image to be output to the flexible display 11, an operation signal corresponding to a key of a keyboard image displayed at an operation position on the flexible display 11, or a GUI (Graphical User). It may be an operation signal or the like related to the operation corresponding to the Interface).

Here, the input device 100 is configured to cause a change in the distance between each of the metal film 12 and the conductor layer 50 and the electrode substrate 20 (detection unit 20s) by operating on the first surface 110, and the first and first devices 100 are configured. It has 2 supports 30, 40. Hereinafter, the first and second supports 30 and 40 will be described.

(Basic configuration of the first and second supports)
The first support 30 is arranged between the operating member 10 and the electrode substrate 20. The first support 30 has a plurality of first structures 310, a first frame 320, and a first space portion 330. In the present embodiment, the first support 30 is bonded onto the electrode substrate 20 via the adhesive layer 35 (see FIG. 3). The adhesive layer 35 may be an adhesive, or may be made of an adhesive material such as an adhesive or an adhesive tape.

As shown in FIG. 3, the first support 30 according to the present embodiment is formed at a predetermined position on the base material 31, the structural layer 32 provided on the surface (upper surface) of the base material 31, and the structural layer 32. It has a laminated structure of a plurality of joint portions 341. The base material 31 is composed of an electrically insulating plastic sheet such as PET, PEN, or PC. The thickness of the base material 31 is not particularly limited, and is, for example, several μm to several 100 μm.

The structural layer 32 is made of an electrically insulating resin material such as UV resin, and forms a plurality of first convex portions 321 and second convex portions 322 and concave portions 323 on the base material 31. Each of the first convex portions 321 has a shape such as a columnar shape, a prismatic shape, or a frustum shape protruding in the Z-axis direction, and is arranged on the base material 31 at predetermined intervals. The second convex portion 322 is formed with a predetermined width so as to surround the periphery of the base material 31.

Further, the structural layer 32 is made of a material having relatively high rigidity so that the electrode substrate 20 can be deformed by an input operation on the first surface 110, and is formed together with the operation member 10 during the input operation. It may be composed of a deformable elastic material. That is, the elastic modulus of the structural layer 32 is not particularly limited, and can be appropriately selected within a range in which the desired operational feeling and detection sensitivity can be obtained.

The recess 323 is composed of a flat surface formed between the first and second convex portions 321 and 322. That is, the space region on the recess 323 constitutes the first space portion 330. Further, in the present embodiment, an adhesion prevention layer 342 formed of a UV resin or the like having low adhesiveness is formed on the recess 323 (not shown in FIG. 3). The shape of the adhesion prevention layer 342 is not particularly limited, and it may be formed in an island shape or may be formed of a flat film on the recess 323.

Further, a joint portion 341 made of an adhesive resin material or the like is formed on each of the first and second convex portions 321 and 322. That is, each of the first structures 310 is composed of a laminated body of the first convex portion 321 and the joint portion 341 formed on the first convex portion 321 and each of the first frame bodies 320 is a second convex portion 322. It is composed of a laminated body of and a joint portion 341 formed on the laminate. As a result, the thickness (height) of the first structure 310 and the first frame 320 is configured to be substantially the same, and in the present embodiment, for example, it is in the range of several μm to several 100 μm. The height of the adhesion prevention layer 342 is not particularly limited as long as it is lower than the height of the first structure 310 and the first frame 320, and is lower than, for example, the first and second convex portions 321 and 322. Is formed to be.

The plurality of first structures 310 are arranged corresponding to the arrangement of each of the detection units 20s. In the present embodiment, the plurality of first structures 310 are arranged, for example, with the plurality of detection units 20s facing each other in the Z-axis direction.

On the other hand, the first frame body 320 is formed so as to surround the periphery of the first support 30 along the peripheral edge of the electrode substrate 20. The length, that is, the width of the first frame 320 in the lateral direction is not particularly limited as long as the strength of the first support 30 and the input device 100 as a whole can be sufficiently secured.

On the other hand, the second support 40 is arranged between the electrode substrate 20 and the conductor layer 50. The second support 40 has a plurality of second structures 410, a second frame 420, and a second space portion 430.

As shown in FIG. 3, in the second support 40 according to the present embodiment, the second structure 410 and the second frame 420 are directly formed on the conductor layer 50. The second structure 410 and the second frame 420 are made of, for example, an adhesive and insulating resin material, and also serve as a joint portion for joining the conductor layer 50 and the electrode substrate 20. The thickness of the second structure 410 and the second frame 420 is not particularly limited, but is, for example, several μm to several 100 μm.

The second structure 410 is arranged between the adjacent first structures 310, respectively. That is, the second structure 410 is arranged corresponding to the arrangement of each of the detection units 20s, and is arranged between the adjacent detection units 20s in the present embodiment. On the other hand, the second frame 420 is formed so as to surround the circumference of the second support 40 along the peripheral edge of the conductor layer 50. The width of the second frame 420 is not particularly limited as long as the strength of the second support 40 and the input device 100 as a whole can be sufficiently secured, and for example, the width is substantially the same as that of the first frame 320.

Further, the elastic modulus of the second structure 410 is not particularly limited as in the structural layer 32 constituting the first structure 310. That is, it can be appropriately selected within a range in which the desired operational feeling and detection sensitivity can be obtained, and may be made of an elastic material that can be deformed together with the electrode substrate 20 during an input operation.

Further, the second space portion 430 is formed between the second structures 410 and constitutes a space area around the second structure 410 and the second frame 420. In the present embodiment, the second space portion 430 accommodates each detection unit 20s and each first structure 310 when viewed from the Z-axis direction.

The first and second supports 30 and 40 having the above configuration are formed as follows.

(Method of forming the first and second supports)
9A, B, and C are schematic cross-sectional views showing an example of a method for forming the first support 30. First, a UV resin is placed on the base material 31a to form a predetermined pattern on the resin. As a result, as shown in FIG. 9A, a structural layer 32a having a plurality of first and second convex portions 321a, 322a and concave portions 323a is formed. As the UV resin, a solid sheet material or a liquid UV curable material may be used. The pattern forming method is not particularly limited. For example, the uneven shape pattern of the mold is transferred to the UV resin by a roll-shaped mold on which a predetermined uneven shape pattern is formed, and UV irradiation is performed from the base material 31a side. The method of curing the UV resin can be applied. In addition to molding using UV resin, for example, it may be formed by general thermoforming (for example, press molding or injection molding) or by discharging a resin material by a dispenser or the like.

Next, referring to FIG. 9B, a UV resin or the like having low adhesiveness is applied to the recess 323a in a predetermined pattern by, for example, a screen printing method to form an adhesive prevention layer 342a. As a result, for example, when the resin material forming the structural layer 32a has high adhesiveness, it is possible to prevent the metal film 12 arranged on the first support 30 from adhering to the recess 323. .. The adhesive prevention layer 342a may not be formed if the resin material forming the structural layer 32a has low adhesiveness.

Further, referring to FIG. 9C, a joint portion 341a made of a highly adhesive UV resin or the like is formed on the convex portion 321a by, for example, a screen printing method. The joint portion 341a joins the first support 30 and the metal film 12. By the above-mentioned forming method, it is possible to form the first structure 310 and the first frame 320 having a desired shape.

On the other hand, FIG. 10 is a schematic cross-sectional view showing an example of a method for forming the second support 40. In FIG. 10, a second structure 410b and a second frame 420b are formed by directly applying, for example, a UV resin having high adhesiveness to the conductor layer 50b in a predetermined pattern by a screen printing method. This makes it possible to significantly reduce the number of processes and increase productivity.

The above forming method is an example. For example, the first support 30 may be formed by the method shown in FIG. 10, or the second support 40 may be formed by the method shown in FIG. Further, the first and second supports 30 and 40 can also be formed by the method shown in FIG. 11 below.

11A and 11B are schematic cross-sectional views showing a modified example of the method of forming the first and second supports 30 and 40. Note that FIG. 11 will be described with reference numerals corresponding to the first support 30. In FIG. 11A, UV resin or the like is applied in a predetermined pattern on the base material 31C or the like by, for example, a screen printing method to form the first and second convex portions 311c and 312c. Further, a joint portion 341c made of a highly adhesive UV resin or the like is formed on the first and second convex portions 311c and 312c by, for example, a screen printing method. As a result, the first structure 310 (second structure 410) composed of the first convex portion 311c and the joint portion 341c, and the first structure composed of the second convex portion 312c and the joint portion 341c. A frame body 320 (or a second frame body 420) can be formed.

Next, the planar arrangement of the first and second structures 310 and 410 will be described with reference to the relationship with the first and second electrode lines (X electrode and Y electrode) 210 and 220.

(Example of arrangement of first and second structures)
12A and 12B are schematic planes showing an arrangement example of the first and second structures 310 and 410 and the first electrode wire (X electrode) 210 and the second electrode wire (Y electrode) 220. It is a figure. 12A and 12B show an example in which each X electrode 210 and each Y electrode 220 have electrode groups 21w and 22w, respectively. Further, since each detection unit 20s is formed in the intersecting region of the X electrode 210 and the Y electrode 220 as described above, in FIGS. 12A and 12B, for example, four detection units 20s surrounded by a thick broken line are arranged. The black circles shown in FIGS. 12A and 12B indicate the first structure 310, and the white circles indicate the second structure 410.

FIG. 12A shows an example in which the numbers of the first structure 310 and the second structure 410 are substantially the same. That is, the first structure 310 is arranged substantially on the substantially center of the detection unit 20s. The pitches of the first structure 310 in the X-axis direction and the Y-axis direction are the same as the pitches in the X-axis direction and the Y-axis direction of the detection unit 20s, and are P1. Further, the second structure 410 has the same pitch P1 as the first structure 310, and the first structure 310 and the detection unit 20s adjacent to each other in the diagonal direction forming about 45 ° with each of the X-axis and Y-axis directions. They are arranged at equal intervals between.

Further, FIG. 12B shows an example in which the numbers of the first structure 310 and the second structure 410 are different. That is, the first structure 310 is arranged at a pitch P1 on substantially the center of the detection unit 20s, as in the example shown in FIG. 12A. On the other hand, the second structure 410 is arranged and numbered differently from FIG. 12A, and is arranged at a pitch P2 that is 1/2 times the pitch P1 of the first structure 310 when viewed from the Z-axis direction. , The second structure 410 is arranged so as to surround the first structure 310 and the detection unit 20s. By arranging the number of the second structures 410 to be larger than the number of the first structures 310, the strength of the entire input device 100 can be increased.

Further, by adjusting the number and arrangement (pitch) of the first and second structures 310 and 410, the metal film 12 and the conductor layer 50 with respect to the pressing force can be obtained so as to obtain the desired operation feeling and detection sensitivity. The amount of change in the distance between each and the detection unit 20s can be adjusted.

When the conductor layer 50 has an opening of 50h, the opening 50h, the first and second structures 310 and 410, and the first and second electrode wires 210 and 220 are arranged as follows. Can be.

(Example of arrangement of openings in the conductor layer)
13A and 13B are schematic plan views showing an arrangement example of the opening 50h of the conductor layer 50, the first and second structures 310 and 410, and the first and second electrode wires 210 and 220. is there. Further, FIG. 13A shows an example in which the opening 50h has an oval shape, and FIG. 13B shows an example in which the opening 50h has a circular shape. The plurality of openings 50h shown in FIGS. 13A and 13B are arranged so as to surround the detection unit 20s when viewed from the Z-axis direction. Further, the plurality of openings 50h are in-plane (XY in-plane) with respect to the second structure 410 so that neither the first and second structures 310, 410 and the detection unit 20s overlap in the Z-axis direction. ) It is provided so as to be offset in the direction.

Further, as shown in the figure, the opening 50h is arranged at a position not facing the detection unit 20s, for example. That is, the opening 50h and the detection unit 20s are provided so as to be offset in the in-plane (XY in-plane) direction so as not to overlap in the Z-axis direction. As a result, changes in the initial capacitance and capacitance change rate of the detection unit 20s are suppressed as compared with the case where the opening 50h of the conductor layer 50 is arranged at a position facing the detection unit 20s, and the change in the capacity change rate is suppressed in the input device 100. The detection sensitivity can be maintained more uniformly.

The openings 50h can be arranged at substantially the same period as the detection unit 20s, and are arranged symmetrically with respect to the center of the detection unit 20s, for example. More specifically, the openings 50h are arranged line-symmetrically with respect to the center lines of the first and second electrode lines 210 and 220, respectively. This also makes it possible to prevent the detection sensitivity from becoming non-uniform in the input device 100.

As described above, the first and second supports 30, 40 according to the present embodiment include (1) the first and second structures 310, 410 and the first and second space portions 330, 430. (2) The first structure 310 and the second structure 410 do not overlap when viewed from the Z-axis direction, and the first structure 310 is arranged on the second space portion 430. It has the characteristic of Therefore, as shown below, the metal film 12 and the conductor layer 50 can be deformed even by a minute pressing force of about several tens of grams during operation.

(Operation of the first and second supports)
FIG. 14 is a schematic cross section showing the state of the force applied to the first and second structures 310 and 410 when the point P on the first surface 110 is pressed downward in the Z-axis direction by the operator h. It is a figure. The white arrows in the figure schematically indicate the magnitude of the force downward in the Z-axis direction (hereinafter, simply referred to as “downward”). FIG. 14 does not show aspects such as bending of the metal film 12 and the electrode substrate 20, elastic deformation of the first and second structures 310 and 410, and the like. In the following description, even if the user performs a touch operation without being aware of the pressing force, a minute pressing force is actually applied. Therefore, these input operations are collectively referred to as "pressing".

For example, when the point P on the first space 330p0 is pressed downward by the force F, the metal film 12 immediately below the point P bends downward. Along with this, the first structures 310p1 and 310p2 adjacent to the first space 330p0 receive the force F1 and elastically deform in the Z-axis direction to slightly reduce the thickness. Further, due to the bending of the metal film 12, the first structures 310p3 and 310p4 adjacent to the first structures 310p1 and 310p2 also receive a force F2 smaller than F1. Further, a force is also applied to the electrode substrate 20 by the forces F1 and F2, and the electrode substrate 20 is bent downward around the region directly below the first structure 310p1, 310p2. As a result, the second structure 410p0 arranged between the first structures 310p1 and 310p2 receives the force F3 and is elastically deformed in the Z-axis direction to slightly reduce the thickness. Further, the second structure 410p1 arranged between the first structures 310p1 and 310p3 and the second structure 410p2 arranged between the first structures 310p2 and 310p4 also have F4 smaller than F3, respectively. receive.

In this way, the first and second structures 310 and 410 can transmit the force in the thickness direction, and the electrode substrate 20 can be easily deformed. Further, the metal film 12 and the electrode substrate 20 are bent and are affected by the pressing force in the in-plane direction (direction parallel to the X-axis direction and the Y-axis direction), so that not only the region directly below the actuator h but also the region thereof is affected. Forces can also be exerted on nearby first and second structures 310,410.

Further, regarding the above feature (1), the metal film 12 and the electrode substrate 20 can be easily deformed by the first and second space portions 330 and 430. Further, the first and second structures 310 and 410 composed of pillars and the like can apply a high pressure to the electrode substrate 20 with respect to the pressing force of the actuator h, and the electrode substrate 20 can be efficiently flexed. You can do it.

Further, with respect to the above feature (2), since the first and second structures 310 and 410 are not overlapped when viewed from the Z-axis direction, the first structure 310 is a second space portion below the first structure 310. The electrode substrate 20 can be easily bent via the 430.

The following is an example of the amount of change in the capacitance of the detection unit 20s during a specific operation.

(Output example of the detector)
15A and 15B are a schematic cross-sectional view of a main part showing an aspect of the input device 100 when the first surface 110 is operated by the operator h, and an output signal output from the detection unit 20s at that time. It is a figure which shows an example. The bar graphs shown along the X-axis in FIGS. 15A and 15B schematically show the amount of change in capacitance from the reference value in each detection unit 20s. Further, FIG. 15A shows an aspect when the operator h presses on the first structure 310 (310a2), and FIG. 15B shows an embodiment when the operator h presses on the first space portion 330 (330b1). The aspect of is shown.

In FIG. 15A, the first structure 310a2 immediately below the operating position receives the most force, and the first structure 310a2 itself is elastically deformed and displaced downward. Due to the displacement, the detection unit 20sa2 directly below the first structure 310a2 is displaced downward. As a result, the detection unit 20sa2 and the conductor layer 50 come close to each other via the second space portion 430a2. That is, the detection unit 20sa2 obtains the change amount Ca2 of the capacitance by slightly changing the distance from the metal film 12 and greatly changing the distance from the conductor layer 50. On the other hand, due to the influence of the bending of the metal film 12, the first structures 310a1 and 310a3 are also slightly displaced downward, and the amount of change in capacitance in the detection units 20sa1 and 20sa3 becomes Ca1 and Ca3, respectively.

In the example shown in FIG. 15A, Ca2 is the largest, Ca1 and Ca3 are substantially the same, and are smaller than Ca2. That is, as shown in FIG. 15A, the changes in capacitance Ca1, Ca2, and Ca3 show a chevron distribution with Ca2 as the apex. In this case, the calculation unit 61 can calculate the center of gravity and the like based on the ratio of Ca1, Ca2, and Ca3, and can calculate the XY coordinates on the detection unit 20sa2 as the operation position.

On the other hand, in FIG. 15B, the first structures 310b1 and 310b2 in the vicinity of the operation position are slightly elastically deformed and displaced downward due to the bending of the metal film 12. Due to the displacement, the electrode substrate 20 is bent, and the detection units 20sb1, 20sb2 directly below the first structure 310b1, 310b2 are displaced downward. As a result, the detection units 20sb1, 20sb2 and the conductor layer 50 come close to each other via the second space portions 430b1, 430b2. That is, the detection units 20sb1 and 20sb2 obtain the amounts of change in capacitance Cb1 and Cb2, respectively, by slightly changing the distance to the metal film 12 and relatively largely changing the distance to the conductor layer 50.

In the example shown in FIG. 15B, Cb1 and Cb2 are substantially the same. As a result, the calculation unit 61 can calculate the XY coordinates between the detection units 20sb1 and 20sb2 as the operation position.

As described above, according to the present embodiment, since both the thicknesses of the detection unit 20s and the metal film 12 and the thicknesses of the detection unit 20s and the conductor layer 50 are variable by the pressing force, the capacitance of the detection unit 20s is increased. The amount of change can be made larger. This makes it possible to increase the detection sensitivity of the input operation.

Further, the XY coordinates of the operating position can be calculated regardless of whether the operating position on the flexible display 11 is on the first structure 310 or on the first space 330. That is, since the metal film 12 spreads the influence of the pressing force in the in-plane direction, the capacitance is not only in the detection unit 20s directly under the operation position but also in the detection unit 20s near the operation position when viewed from the Z-axis direction. Changes can be made. As a result, it is possible to suppress variations in the detection accuracy within the first surface 110 and maintain high detection accuracy over the entire surface of the first surface 110.

Here, a finger or a stylus is often used as an operator. As a feature of both, since the finger has a larger contact area than the stylus, when the same load (pressing pressure) is applied, the finger has a smaller pressure with respect to the pressing force (hereinafter referred to as operating pressure). .. On the other hand, the stylus has a small contact area, and for example, in a general mutual capacitance type capacitance sensor, there is a problem that the capacitance coupling amount with the sensor element is small and the detection sensitivity is low. According to this embodiment, the input operation can be detected with high accuracy regardless of which of these controls is used. Hereinafter, description will be made with reference to FIGS. 16A and 16B.

16A and 16B are a schematic cross-sectional view of a main part showing an aspect of the input device 100 when the first surface 110 is operated by a stylus or a finger, and an output signal output from the detection unit 20s at that time. 16A shows a case where the operator is a stylus s, and FIG. 16B shows a case where the operator is a finger f. Further, the bar graphs shown along the X-axis in FIGS. 16A and 16B schematically show the amount of change in the capacitance of each detection unit 20s from the reference value, as in FIGS. 15A and 15B.

As shown in FIG. 16A, the stylus s deforms the metal film 12 and exerts a pressing force on the first structure 310c2 immediately below the operating position. Here, since the stylus s has a small contact area, a large operating pressure can be applied to the metal film 12 and the first structure 310c2. Therefore, the metal film 12 can be greatly deformed, and as a result, a large change in capacitance can be generated as shown in the amount of change in capacitance Cc2 of the detection unit 20sc2. As a result, the changes in capacitance Cc1, Cc2, and Cc3 of each of the detection units 20sc1, 20sc2, and 20sc3 have a chevron-shaped distribution with Cc2 as the apex.

As described above, the input device 100 according to the present embodiment can detect the amount of change in capacitance based on the in-plane distribution of the operating pressure. This is because the input device 100 does not detect the amount of change in capacitance due to direct capacitance coupling with the operator, but detects the amount of change in capacitance through the deformable metal film 12 and the electrode substrate 20. By detecting. Therefore, even an operator such as a stylus s having a small contact area can accurately detect the operating position and pressing force.

On the other hand, as shown in FIG. 16B, since the finger f has a large contact area, the operating pressure is small, but the metal film 12 in a wider range than the stylus s can be directly deformed. As a result, the first structures 310d1, 310d2, 310d3 can be displaced downward to generate the amount of change in capacitance Cd1, Cd2, Cd3 of each of the detection units 20sd1, 20sd2, 20sd3. Cd1, Cd2, and Cd3 have a gentle chevron distribution as compared with Cc1, Cc2, and Cc3 according to FIG. 16A.

As described above, the input device 100 according to the present embodiment detects the amount of change in capacitance based on the capacitance coupling between each of the metal film 12 and the conductor layer 50 and the detection unit 20s, so that the finger f Even an operator having such a large contact area can cause a sufficient change in capacitance. Further, in determining whether or not the operation has been performed, for example, by using the total value of the changes in the capacitances of all the detection units 20sd1, 20sd2, 20sd3 in which the capacitance has changed, even if the operating pressure is determined. Even when is small, the contact can be accurately determined based on the pressing force of the entire first surface 110. Further, since the capacitance changes based on the operating pressure distribution in the first surface 110, the operating position can be calculated according to the user's intuition based on the ratio of these changes.

Further, in the case of a general capacitance sensor, the operation position and the like are detected by utilizing the capacitance coupling between the operator and the X and Y electrodes. That is, when a conductor is arranged between the operator and the X and Y electrodes, it is difficult to detect the input operation due to the capacitive coupling between the conductor and the X and Y electrodes. Further, in the configuration where the thickness between the operator and the X and Y electrodes is large, there is a problem that the amount of capacitive coupling between them becomes small and the detection sensitivity decreases. Due to these circumstances, it is necessary to arrange the sensor device on the display surface of the display, and deterioration of the display quality of the display has been a problem.

Since the input device 100 (sensor device 1) according to the present embodiment utilizes the capacitive coupling between each of the metal film 12 and the conductor layer 50 and the X and Y electrodes 210 and 220, it is conductive between the operator and the sensor device. There is no effect on detection sensitivity even when the body is placed. Further, it suffices if the metal film 12 can be deformed by the pressing force of the operator, and there is little limitation on the thickness between the operator and the X and Y electrodes. Therefore, even when the sensor device 1 is arranged on the back surface of the flexible display 11, the operating position and pressing force can be detected with high accuracy, and deterioration of the display characteristics of the flexible display 11 can be suppressed.

Further, since there is little limitation on the thickness of the insulator (dielectric) existing between the operator and the X and Y electrodes, even when the user wears gloves or the like which is an insulator for operation. , The detection sensitivity does not decrease. Therefore, it can contribute to the improvement of user convenience.

[Electronics]
17A and 17B are diagrams showing an example of mounting the input device 100 according to the present embodiment on the electronic device 70. The electronic device 70a according to FIG. 17A has a housing 720a including an opening 721a in which the input device 100 is arranged. Further, a support portion 722a is formed in the opening 721a to support the peripheral edge portion of the conductor layer 50 via a joint portion 723a such as an adhesive tape. Further, the method of joining the conductor layer 50 and the support portion 722a is not limited to the above, and may be fixed with screws or the like, for example.

Further, in the input device 100 according to the present embodiment, since the first and second frames 320 and 420 are formed along the peripheral edge, stable strength can be maintained even at the time of mounting.

The electronic device 70b according to FIG. 17B also has substantially the same configuration as the electronic device 70a, and has a housing 720b including an opening 721a and a support portion 722a. The difference is that it has at least one auxiliary support 724b that supports the back surface of the conductor layer 50. The auxiliary support portion 724b may or may not be joined to the conductor layer 50 with an adhesive tape or the like. With the above configuration, the input device 100 can be supported more stably.

[Modification 1]
In the first embodiment described above, it has been described that the metal film 12 is formed by attaching the adhesive layer 13 which is an adhesive resin film on which the metal foil is formed to the flexible display 11, but the present invention is limited to this. Not done. For example, when the metal film 12 is a metal foil or the like having no resin film, the adhesive layer 13 may be an adhesive, an adhesive or the like capable of attaching the metal film 12 to the flexible display 11.

In this case, the adhesive layer 13 may be provided on the entire surface of the flexible display 11 as shown in FIG. As a result, the metal film 12 and the flexible display 11 are firmly adhered to each other in the entire surface, and uniform sensitivity can be obtained.

On the other hand, FIGS. 18A and 18B are schematic cross-sectional views showing a modified example in which the adhesive layer 13 is only partially formed. As shown in FIG. 18A, the adhesive layer 13 may be formed only on the outer peripheral portion of the flexible display 11 and the metal film 12, for example, the region above the first frame body 320 and the second frame body 420. It may be formed in. As a result, the joint area in the Z-axis direction is larger than that of each of the first structure 310 and the second structure 410, and the first frame 320 and the first frame 320 and the first frame are arranged so as to be laminated in the Z-axis direction. It is possible to join the metal film 12 and the flexible display 11 above the frame body 420 of 2. Therefore, even if a force that pulls the operating member 10 upward is applied, the first and second structures 310 and 410 may be damaged, and the electrode substrate 20 and the respective structures 310 and 410 may be damaged. It is possible to prevent peeling and the like.

Alternatively, as shown in FIG. 18B, the adhesive layer 13 may be formed in a display region of the flexible display 11, that is, a region including a central portion excluding the outer peripheral portion. As a result, as shown below, it is possible to suppress damage to the flexible display 11 and abnormal detection sensitivity.

19A and 19B are diagrams schematically showing how the flexible display 11 is attached to the metal film 12 on the entire surface including the outer peripheral portion. Note that in FIGS. 19A and 19B, the adhesive layer 13 is not shown.

For example, as schematically shown in FIG. 19A, if wiring, a driver, or the like is provided on the outer peripheral portion 11a of the flexible display 11 and there is a bulge or a step, if the outer peripheral portion 11a is forcibly joined, the outer peripheral portion in particular 11a may be damaged. Further, as in the region surrounded by the broken line in the figure, a gap may occur at the boundary between the outer peripheral portion 11a and the other region, resulting in an abnormality in the detection sensitivity.

Further, as schematically shown in FIG. 19B, even if a sealing material or the like (not shown) is provided on the surface of the flexible display 11 and there is warpage or the like, if the outer peripheral portion 11a is forcibly joined, the flexible display 11 is damaged. there's a possibility that. Further, as shown in the area surrounded by the broken line in the figure, there is a possibility that the detection sensitivity becomes abnormal due to the floating of the flexible display 11. That is, the above-mentioned problems can be suppressed by not forcibly joining the flexible display 11 to the outer peripheral portion 11a.

Further, FIG. 20 is a schematic cross-sectional view showing another modification of the adhesive layer 13. As shown in the figure, the adhesive layer 13 may be formed in a predetermined plane pattern. FIG. 21 is a diagram showing an example of a plane pattern of the adhesive layer 13. The adhesive layer 13 may have a columnar pattern as shown in FIG. 21A, a striped pattern as shown in FIG. 21B, or a grid pattern as shown in FIG. 21C. When the adhesive layer 13 has such a pattern, it is possible to prevent air bubbles from being mixed into the adhesive layer 13 when the flexible display 11 and the metal film 12 are bonded to each other, and to improve the yield.

Further, when the adhesive layer 13 has a predetermined plane pattern, the thickness of the adhesive layer 13 along the Z-axis direction can be formed to be thinner than the thickness of the metal film 12. As a result, the reliability of joining the flexible display 11 and the metal film 12 can be improved. Further, the predetermined pattern can be configured more finely than the arrangement pattern of the first structure 310. Specifically, the length between the columns in the case of the columnar pattern and the length between the adjacent lines in the case of the stripe shape or the grid pattern are shorter than the size of the adjacent first structure 310. For example, it can be configured to have a length of 1/10 or less. As a result, it is possible to prevent the pattern of the adhesive layer 13 from interfering with the size of the first structure 310 and causing non-uniformity and periodicity in the detection sensitivity.

[Modification 2]
In the first embodiment described above, each of the plurality of first electrode wires 210 and the plurality of second electrode wires 220 may be composed of a single electrode wire, or the plurality of electrode groups 21w and 22w. Although it has been explained that it may be configured by, further, the configuration can be as follows.

FIG. 22A is a schematic plan view showing a configuration example of the first electrode wire 210. For example, the first electrode wire 210 has a plurality of unit electrode bodies 210 m and a plurality of connecting portions 210 n for connecting the plurality of unit electrode bodies 210 m to each other. Each unit electrode body 210m includes a plurality of sub-electrodes (electrode elements) 210w. The plurality of sub-electrodes 210w are electrodes composed of a plurality of electrode elements in which the electrode wires are branched, and have a regular or irregular pattern. FIG. 22A shows an example in which the plurality of sub electrodes 210w have a regular pattern. In this example, the plurality of sub-electrodes 210w are linear conductive members extending in the Y-axis direction, and the conductive members are arranged in a stripe shape. The connecting portion 210n extends in the Y-axis direction and connects the adjacent unit electrode bodies 210m to each other.

FIG. 22B is a schematic plan view showing a configuration example of the second electrode wire 220. For example, the second electrode wire 220 has a plurality of unit electrode bodies 220 m and a plurality of connecting portions 220 n for connecting the plurality of unit electrode bodies 220 m to each other. The unit electrode body 220m includes a plurality of sub-electrodes (electrode elements) 220w. The plurality of sub-electrodes 220w have a regular or irregular pattern, and FIG. 22B shows an example in which the plurality of sub-electrodes 220w have a regular pattern. In this example, the plurality of sub-electrodes 220w are linear conductive members extending in the X-axis direction, and the conductive members are arranged in a stripe shape. The connecting portion 220n extends in the X-axis direction and connects adjacent unit electrode bodies 220m to each other.

The first and second electrode lines 210 and 220 are arranged so as to intersect each other so that the unit electrode body 210 m and the unit electrode body 220 m are opposed to each other in the Z-axis direction when viewed from the Z-axis direction, and the intersecting regions are formed. The detection unit 20s is configured. The unit electrode bodies 210 m and 220 m are not limited to the above-mentioned configurations, and various configurations can be adopted.

23A to 23P are schematic views showing shape examples of the unit electrode bodies 210 m and 220 m. Although FIGS. 23A to 23P show examples of the unit electrode body 210 m, the unit electrode body 220 m may have these shapes.

FIG. 23A shows an example in which the unit electrode body 210 m is composed of an aggregate of a plurality of linear electrode patterns extending radially from the central portion. FIG. 23B shows an example in which one of the radial wire electrodes shown in the example of FIG. 23A is formed thicker than the other wire electrodes. As a result, the amount of change in capacitance on the thick wire electrode can be increased as compared with that on other wire electrodes. Further, FIGS. 23C and 23D show an example in which an annular linear electrode is arranged substantially in the center and the linear electrode is formed radially from the annular linear electrode. As a result, it is possible to suppress the concentration of the linear electrodes in the central portion and prevent the occurrence of the sensitivity lowering region.

23E to 23H show an example in which a plurality of linear electrodes formed in an annular shape or a rectangular annular shape are combined to form an aggregate. As a result, the density of the electrodes can be adjusted, and the formation of the sensitivity-reduced region can be suppressed. Further, FIGS. 23I to 23L show an example in which a plurality of linear electrodes arranged in the X-axis direction or the Y-axis direction are combined to form an aggregate. By adjusting the shape, length, pitch, etc. of the linear electrode, it is possible to obtain a desired electrode density. Further, FIGS. 23M to 23P are examples in which the line electrodes are asymmetrically arranged in the X-axis direction or the Y-axis direction.

The combination of the shapes of the unit electrode bodies 210 m and 220 m of the first and second electrode wires 210 and 220 may be two sets of the same type among the shapes shown in FIGS. 22A, 22B and 23A to 23P. Two different sets may be used. The shape of the unit electrodes such as the connecting portions 210n and 220n other than the unit electrodes 210m and 220m is not particularly limited, and may be linear, for example.

[Modification 3]
In the first embodiment described above, it has been described that the first structure 310 is arranged substantially on the substantially center of the detection unit 20s, but the present invention is not limited to this. For example, the detection unit 20s may be arranged to face the second structure 410, and the second structure 410 may be arranged substantially on the substantially center of the detection unit 20s.

24A and 24B show an arrangement example of the first and second structures 310 and 410 according to this modification, and the first electrode wire (X electrode) 210 and the second electrode wire (Y electrode) 220. It is a schematic plan view which shows, and is the figure corresponding to FIGS. 12A and 12B.

FIG. 24A corresponds to FIG. 12A and shows an example in which the numbers of the first structure 310 and the second structure 410 are substantially the same. Further, in this modification, the second structure 410 is arranged substantially on the substantially center of the detection unit 20s. The pitches of the second structure 410 in the X-axis direction and the Y-axis direction are the same as the pitches in the X-axis direction and the Y-axis direction of the detection unit 20s, and are P1. Further, the first structure 310 has the same pitch P1 as the second structure 410, and the second structure 410 and the detection unit 20s adjacent to each other in the X-axis and Y-axis directions at an oblique direction of about 45 °. They are arranged at equal intervals between.

Further, FIG. 24B shows an example in which the numbers of the first structure 310 and the second structure 410 are different according to FIG. 12B. That is, the second structure 410 is arranged at a pitch P1 on the substantially center of the detection unit 20s, as in the example shown in FIG. 24A. On the other hand, the first structure 310 is arranged and numbered differently from FIG. 24A, and is arranged at a pitch P2 that is 1/2 times the pitch P1 of the second structure 410. The first structure 310 is arranged so as to surround the second structure 410 and the detection unit 20s when viewed from the Z-axis direction. By arranging the number of the first structures 310 to be larger than the number of the second structures 410, the strength of the entire input device 100 can be increased.

25A and 25B are schematic cross-sectional views before and after pressing the point P on the first surface 110 downward in the Z-axis direction by the operator h for the above-mentioned modification. FIG. 25A shows a state before actually pressing, and corresponds to FIG. FIG. 25B shows a state of being pressed and corresponds to FIG.

For example, when the point P on the first space portion 330p0 is pressed downward, the region on the first space portion 330p0 of the metal film 12 bends downward, and the first space portion 330p collapses in the Z-axis direction. The metal film 12 and the detection unit 20s are close to each other. Further, the first structures 310p1, 310p2 adjacent to the first space 330p0 also receive a force. As a result, the regions of the electrode substrate 20 connected to the first structures 310p1 and 310p2 also bend downward, and the second structure 410p0 also elastically deforms in the Z-axis direction, so that the thickness is slightly reduced. That is, the detection unit 20s located below the operator h and the conductor layer 50 are close to each other.

As described above, even in this modification in which the second structure 410 faces the detection unit 20s, the forces can be transmitted in the thickness direction by the first and second structures 310 and 410, and the electrode substrate 20 can be used. It can be easily deformed. As a result, the input device 100 according to the present modification can efficiently change the capacitance of the detection unit 20s and accurately detect the pressing force and the pressing position, as in the first embodiment. Become.

Further, as shown in FIGS. 25A and 25B, the second support 40 is formed at a predetermined position on the base material 41, the structural layer 42 provided on the surface (upper surface) of the base material 41, and the structural layer 42. It may have a laminated structure of a plurality of joint portions 441. On the other hand, the first support 30 does not have to have such a laminated structure. As a result, the operability can be improved while maintaining the strength of the input device 100 even in this modification.

[Modification example 4]
FIG. 26 is a schematic cross-sectional view showing another modification of the present embodiment. As shown in the figure, the operating member 10 may have a protective film 14 arranged on the metal film 12 facing the first support 30. That is, the protective film 14 is arranged so as to face the electrode substrate 20. The protective film 14 may be an antioxidant resin film or the like, and is formed on the metal film 12 by, for example, coating. By providing such a protective film 14, it is possible to prevent corrosion and damage of the metal film 12. Therefore, the reliability of the metal film 12 can be improved and good detection sensitivity can be maintained.

[Modification 5]
The electrode substrate 20 is composed of a laminate of a first wiring board 21, a second wiring board 22, and an adhesive layer 23 between them, and is formed on the first wiring board 21 via an adhesive layer 35. It has been described that the base material 31 of the first support 30 is arranged, but the present invention is not limited to this. For example, the configuration may be as shown below.

(Configuration Example 1)
The input device 100 (sensor device 1) may have an insulating cover layer instead of the base material 31 and the adhesive layer 35. Such a cover layer is formed of, for example, an insulating UV curable resin or a thermosetting resin, and may have a thickness of several μm to several hundred μm. The cover layer may be a single layer or may include a plurality of layers. Further, a first structure 310, a first frame 320, and a first space 330 of the first support 30 are arranged on the cover layer. The first structure 310 and the first frame 320 can be formed by, for example, a screen printing method or a UV molding method. With such a configuration, the thickness of the electrode substrate 20 and the first support 30 can be reduced, which can contribute to the reduction of the thickness of the entire input device 100.

(Configuration Example 2)
FIG. 27 is a schematic cross-sectional view of a main part showing the configuration example 2 according to the present modification. As shown in the figure, this configuration example has an insulating layer 24 instead of the first base material 211 and the adhesive layer 23. That is, the insulating layer 24 is formed on the second wiring board 22 including the second electrode wire 220, and the first electrode wire 210 is formed on the insulating layer 24. The insulating layer 24 is formed of, for example, an insulating UV curable resin, a thermosetting resin, or the like, and may have a thickness of several μm to several hundred μm. With such a configuration, the electrode substrate 20 can be made thinner, which can contribute to making the entire input device 100 thinner. The input device 100 according to this configuration example may have a cover layer instead of the base material 31 and the adhesive layer 35 as described in the configuration example 1.

(Configuration Example 3)
28A and 28B are schematic cross-sectional views of a main part showing a configuration example 3 according to this modification. As shown in FIG. 28A, the electrode substrate 20 according to this configuration example has one base material 211, and the first electrode wire 210 and the second electrode wire 220 are formed on both surfaces of the base material 211. There is. That is, the base material 211 has a structure in which two layers of electrodes are formed by double-sided printing. In this case, as shown in FIG. 28A, the cover layer 25 may be formed on the surface (lower surface) of the base material 211 on which the second electrode wire 220 is formed. The cover layer 25 is formed of, for example, an insulating UV curable resin or a thermosetting resin, and may have a thickness of several μm to several hundred μm. Alternatively, as shown in FIG. 28B, the adhesive layer 23 and the second base material 221 are formed on the lower surface of the first base material 211 in which the first and second electrode wires 210 and 220 are formed on both sides. May be. Further, although not shown, the second support 40 may be formed directly on the lower surface of the base material 211. The input device 100 according to this configuration example may have a cover layer instead of the base material 31 and the adhesive layer 35 as described in the configuration example 1.

(Configuration Example 4)
29A and 29B are schematic cross-sectional views of a main part showing a configuration example 4 according to this modification. As shown in the figure, the electrode substrate 20 according to this configuration example includes a first wiring board 21 including a first electrode wire 210 and a first base material 211, and a second electrode wire 220 and a second substrate. The second wiring board 22 including the base material 221 and the adhesive layer 23 are provided, but the orientation of the second wiring board 22 with respect to the first wiring board 21 is different from the configuration shown in FIG. .. That is, the second electrode wire 220 is formed so as to face the second support 40, not the side facing the adhesive layer 23. In this case, as shown in FIG. 29A, the insulating cover layer 25 may be formed on the lower surface of the second base material 221. Alternatively, as shown in FIG. 29B, the adhesive layer 252 and the third base material 251 may be formed on the lower surface of the second base material 221. Further, although not shown, the second support 40 may be formed directly on the lower surface of the second base material 221. The input device 100 according to this configuration example may have an insulating cover layer instead of the base material 31 and the adhesive layer 35 as described in the configuration example 1.

(Configuration Example 5)
FIG. 30 is a schematic cross-sectional view of a main part showing a configuration example 5 according to this modified example. As shown in the figure, the electrode substrate 20 is arranged upside down from the configuration described with reference to FIG. 3 and the like. Further, the first support 30 does not have the base material 31, and the second support 40 has the base material 41 formed on the electrode substrate 20 side. In this case, as shown in FIG. 30, an adhesive layer 45 may be provided between the base material 41 of the second support 40 and the first wiring board 21 of the electrode substrate 20, and the electrode substrate 20 may be provided. It is not necessary to have an adhesive layer between the first support 30 and the first support 30. It should be noted that this configuration example may be configured by appropriately combining with the configurations described as the configuration examples 1 to 4. For example, the base material 41 and the adhesive layer 45 can be used as the cover layer described above.

<Second embodiment>
FIG. 31 is a schematic cross-sectional view of the input device 100A according to the second embodiment of the present technology. The configuration of the input device 100A according to the present embodiment other than the operating member 10A is the same as that of the first embodiment, and the description thereof will be omitted as appropriate. FIG. 31 is a diagram corresponding to FIG. 1 according to the first embodiment.

(overall structure)
The input device 100A according to the present embodiment has a flexible sheet 11A instead of the flexible display, and a sensor device 1 similar to the first embodiment. A plurality of key areas 111A are arranged on the flexible sheet 11A as described later, and the input device 100A is used as a keyboard device as a whole.

(Input device)
The flexible sheet 11A is composed of a flexible insulating plastic sheet such as PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PMMA (polymethyl methacrylate), PC (polycarbonate), PI (polyimide) and the like. To. The thickness of the flexible sheet 11A is not particularly limited, and is, for example, about several tens of μm to several hundreds of μm.

The flexible sheet 11A is not limited to a single-layer structure, and may have a configuration in which two or more layers of sheets are laminated. In this case, in addition to the above-mentioned plastic sheet, for example, a flexible insulating plastic sheet such as PET, PEN, PMMA, PC, or PI may be laminated as a base material.

The flexible sheet 11A has a first surface 110A as an operation surface and a second surface 120A on the back surface of the first surface 110A. A plurality of key regions 111A are arranged on the first surface 110A. On the other hand, the metal film 12 is laminated on the second surface 120A.

The flexible sheet 11A and the metal film 12 may be made of a composite sheet or the like in which a metal foil is previously attached to the surface of the resin sheet, or may be a vapor-deposited film or a sputtered film formed on the second surface 120A. It may be configured. Alternatively, it may be a coating film such as a conductive paste printed on the second surface 120A.

Each key area 111A corresponds to a key top pressed by the user, and has a shape and size according to the type of key. Each key area 111A may be provided with an appropriate key display, and the key display may display the type of the key or the position (outline) of each key. It may be, or both of them may be displayed. For the display, an appropriate printing method, for example, screen printing, flexographic printing, gravure printing, or the like can be adopted.

The first surface 110A has a form in which a groove 112A is formed around the key region 111A. Appropriate processing techniques such as press molding, etching, and laser processing can be adopted for forming the uneven surface corresponding to the key region 111A. Alternatively, the flexible sheet 11A having an uneven surface may be formed by a molding technique such as injection molding.

Further, the configuration of the flexible sheet 11A is not limited to the above example. For example, FIGS. 32A and 32B are diagrams schematically showing a modified example of the flexible sheet 11A. The flexible sheet 11Aa shown in FIG. 32A shows an example in which the first surface 110A is formed of a flat surface. In this case, each key area (not shown) may be described by printing or the like, or may be used as a touch sensor without having a key area. Further, the flexible sheet 11Ab shown in FIG. 32B is formed by press-molding the flexible sheet 11A or the like, and each key region 111Ab is independently deformable in the vertical direction (sheet thickness direction).

Further, the flexible sheet 11A may be made of a conductive material such as metal. As a result, the metal film 12 becomes unnecessary, and the operating member 10A can be made thinner. In this case, the flexible sheet 11A also has a function as a metal film 12, and is connected to, for example, a ground potential.

In the present embodiment, when the user performs a key input operation, the central portion of the key area 111A is pressed. Therefore, the first and second structures 310 and 410 and the detection unit 20s can be arranged as follows.

(Arrangement example 1)
For example, as shown in FIG. 31, the first structure 310 of the first support 30 may be arranged below the key region 111A. In this case, the detection unit 20s is arranged at a position overlapping the first structure 310 when viewed from the Z-axis direction, and the second structure 410 is below the groove 112A between the adjacent first structures 310. Is placed in.

In the arrangement example 1, the position on the first structure 310 is pressed during the key input operation. As a result, as described with reference to FIG. 15A, each of the metal film 12 and the conductor layer 50 and the detection unit 20s are in close proximity to each other, and the capacitance change of the detection unit 20s can be obtained.

Further, the shape of the first structure 310 is not limited to the cylindrical body as shown in FIG. 12, and may be arranged in a wall shape along the groove 112A, for example. In this case, each second structure 410 will be arranged along the boundary between the plurality of key regions 111A.

(Arrangement example 2)
Further, the first structure 310 may be arranged below the groove portion 112A. In this case, the second structure 410 is arranged below the key region 111A between the adjacent first structures 310. Further, the detection unit 20s is arranged at a position overlapping the first structure 310 when viewed from the Z-axis direction.

In the arrangement example 2, as described with reference to FIG. 15B, the metal film 12 and the detection unit 20s are brought close to each other by pressing the top of the first space portion 330 during the key input operation. Further, the first structure 310 adjacent to the first space 330 immediately below the operation position is displaced downward, and the electrode substrate 20 is bent, so that the second structure 410 is also slightly elastically deformed. Therefore, each of the metal film 12 and the conductor layer 50 and the detection unit 20s are close to each other, and the capacitance change of the detection unit 20s can be obtained.

The arrangement of the detection unit 20s is not limited to the above, and may be arranged so as to overlap with the second structure 410, for example.

As described above, the control unit 60 has a calculation unit 61 and a signal generation unit 62, and is electrically connected to the electrode substrate 20. Further, in the present embodiment, the control unit 60 is configured to be able to generate information regarding an input operation for each of the plurality of key areas 111A based on the outputs of the plurality of detection units 20s. That is, the calculation unit 61 operates in the XY coordinate system on the first surface 110 based on the electrical signals (input signals) output from the first and second electrode lines 210 and 220 of the electrode substrate 20. The position is calculated, and the key area 111A assigned to the operation position is determined. The signal generation unit 62 generates an operation signal corresponding to the key region 111A in which the pressing is detected.

The input device 100A can be applied as a keyboard device as described above by being incorporated in an electronic device such as a notebook personal computer or a mobile phone. Further, since the input device 100A has a communication unit (not shown), it is electrically connected to another electronic device such as a personal computer by wire or wirelessly, and an input operation for controlling the electronic device is possible. You may.

Further, the input device 100A can also be used as a pointing device as described in the first embodiment. That is, a threshold value of 2 or more is set for the output of each detection unit 20s, and the calculation unit 61 determines the touch operation and the push operation, so that the input device can be a pointing device and a keyboard. is there.

[Modification example]
FIG. 33 is an enlarged cross-sectional view showing an input device 100A of a modified example according to the present embodiment. The input device 100A shown in the figure does not have a configuration in which the plurality of second structures 410 are arranged between the plurality of adjacent first structures 310, and among the plurality of first structures 310. At least a part of the first structure 310 is arranged so as to face the second structure 410 of at least a part of the plurality of second structures 410 in the Z-axis direction. Further, the first structure 310 and the second structure 410 arranged so as to face each other in the Z-axis direction are arranged so as to face the groove 112A and the Z-axis direction, and are arranged at the boundary between the plurality of key regions 111A. Will be done.

FIG. 34A is a plan view showing an arrangement example of the first structure 310, and FIG. 34B is a plan view showing an arrangement example of the second structure 410. In this modification, the plurality of first structures 310 and the plurality of second structures 410 are respectively arranged according to the arrangement of the plurality of key areas 111A, as will be described later. Further, each of the plurality of first structures 310 has a plurality of types of shapes according to the arrangement thereof, and each of the plurality of second structures 410 also has a plurality of types of shapes according to the arrangement thereof. Further, when viewed from the Z-axis direction, the first structure 310e of the first structure 310 shown in FIG. 34A and the second structure 410e of the second structure 410 shown in FIG. 34B. Is configured to overlap.

FIG. 35A is a plan view showing a configuration example of the plurality of X electrodes 210, and FIG. 35B is a plan view showing a configuration example of the plurality of Y electrodes 220. As shown in FIG. 35A, each X electrode 210 has a plurality of unit electrode bodies 210 m, and each unit electrode body 210 m has a configuration in which each unit electrode body 210 m is connected in the Y-axis direction by an electrode wire. Each unit electrode body 210m includes a plurality of sub-electrodes and is arranged corresponding to each key region 111A. On the other hand, as shown in FIG. 35B, the Y electrode 220 is composed of an electrode group 22w including a plurality of electrode lines extending in the X-axis direction. The intersection region of each unit electrode body 210m of the X electrode 210 and each electrode group 22w of the Y electrode constitutes the detection unit 20s, and each detection unit 20s is configured to correspond to each key region 111A. The configuration is not limited to the above, and the X electrode 210 may include a plurality of electrode groups, and the Y electrode 220 may have a plurality of unit electrode bodies.

In this modification, the intersections of the sub-electrodes in the unit electrode body 210 m and the electrode lines in the electrode group 22w are densely arranged in the central portion of each key region 111A. This makes it possible to improve the detection sensitivity when the key region 111A is pressed.

FIG. 36 is an enlarged plan view showing an arrangement example of the first structure 310 and the second structure 410, and is a diagram showing one key region 111A. In the figure, for convenience, the first structure 310 is indicated by reference numerals u1 to u10, and the second structure 410 is indicated by reference numerals s1 to s9.

As shown in the figure, the first structure u9 and the second structure s8, and the first structure u10 and the second structure s4 are in the Y-axis direction indicated by the alternate long and short dash line around the key region 111A. They are arranged on the sides along the above, facing each other in the Z-axis direction. In the region where the first structure 310 and the second structure 410 are arranged so as to overlap each other in the Z-axis direction, the distance between each of the metal film 12 and the conductor layer 50 and the electrode substrate 20 is unlikely to change. , The detection sensitivity as a sensor is low. Further, this region is a region in which deformation of the flexible sheet 11A (metal film 12) and the electrode substrate 20 is unlikely to propagate to another key region 111A when a certain key region 111A is pressed. Therefore, by arranging the first structures u9 and u10 and the second structures s8 and s4 facing each other in the Z-axis direction around the key region 111A, a malfunction between the key regions 111A adjacent in the X-axis direction is particularly bad. Can be prevented.

The first structure and the second structure facing the Z-axis direction may be arranged on the side of the key region 111A along the X-axis direction. Specifically, the first structure may be arranged on the second supports s1 to s3 and s5 to s7. In this case, it is possible to prevent a malfunction between the key regions 111A adjacent to each other in the Y-axis direction.

Further, as shown in the figure, a plurality of first structures u5 to u8 are arranged inside the key region 111A. Since the first structures u5 to u8 arranged so as not to overlap with the second structure efficiently deform the flexible sheet 11A (key region 111A) and the electrode substrate 20 as described above, the key region 111A It is possible to improve the detection sensitivity inside.

If only one first structure is arranged inside the key region 111A, the flexible sheet 11A and the electrode substrate 20A can be efficiently pressed when the region away from the first structure is pressed. It cannot be transformed. In particular, when a pressing operation is performed with an operator having a small contact area such as a claw or a stylus, the sensitivity may vary depending on the position in the key area 111A. On the other hand, in this modification, since the plurality of first structures u5 to u8 are symmetrically arranged in the key area 111A, the pressing position and the contact area of the operator in the key area 111A Regardless, it is possible to maintain high detection sensitivity.

Further, the intersection of the sub-electrode in the unit electrode body 210 m and the electrode line in the electrode group 22w is inside the region defined by the first structure u5 to u8 (the region shown by the one-point broken line in FIG. 36) and It may be densely arranged in the vicinity. This makes it possible to further improve the detection sensitivity when the key region 111A is pressed.

The second structure s9 is arranged substantially in the center of the key region 111A. If the structure is not arranged in the central portion of the key region 111A, the amount of deformation of the flexible sheet 11A and the electrode substrate 20 tends to be larger in the central portion than in the peripheral portion. As a result, there may be a difference in detection sensitivity between the central portion and the peripheral portion of the key region 111A. Therefore, by arranging the second structure s9 substantially in the center of the key region 111A, it is possible to maintain uniform detection sensitivity between the central portion and the peripheral portion of the key region 111A.

On the other hand, the first structures u1 to u4 and the second structures s1 to s3 and s5 to s7 are arranged around the key region 111A without overlapping each other. These first and second structures u1 to u4, s1 to s3, and s5 to s7 are larger than the first and second structures u5 to u8 and s9 arranged inside the key region 111A. To. As a result, the adhesiveness between the first and second structures and the electrode substrate 20, the flexible sheet 11A, and the like can be enhanced, and the strength of the input device 100A can be enhanced. In addition, deformation around the key area 111A can be suppressed to prevent malfunction.

Further, as shown in FIG. 36, it is preferable that the first and second structures arranged around each key region 111A are separated from each other. If the first and second structures surround the key area 111A without gaps, the internal pressure increases in the first space 330 and the second space 430 in the key area 111A, and the flexible sheet 11A and the flexible sheet 11A and the second structure There is a risk of delaying the return of deformation of the electrode substrate 20 and lowering the detection sensitivity. Therefore, by arranging the first and second structures so as to be separated from each other, the movement of air in the first space portion 330 and the second space portion 430 is not hindered, and a decrease in detection sensitivity is prevented. It becomes possible to do.

<Third embodiment>
FIG. 37 is a schematic cross-sectional view of an electronic device 70B incorporating an input device 100B according to a third embodiment of the present technology. The configuration of the input device 100B according to the present embodiment other than the operation member 10B is the same as that of the first embodiment, and the description thereof will be omitted as appropriate.

In the input device 100B according to the present embodiment, a part of the housing 720B of the electronic device 70B constitutes a part of the operation member 10B. That is, the input device 100B has an operation area 721B forming a part of the housing 720B, and a sensor device 1 similar to the first embodiment. As the electronic device 70B, for example, a personal computer equipped with a touch sensor or the like can be applied.

The operating member 10B has a laminated structure of a deformable operating region 721B including a first surface 110B and a second surface 120B and a metal film 12. That is, the first surface 110B is one surface of the housing 720B, and the second surface 120B is the back surface (inner surface) of the one surface.

The operation area 721B may be made of, for example, the same material as the other area of the housing 720B, for example, a conductor material such as an aluminum alloy or a magnesium alloy, or a plastic material. In this case, during a touch operation or a push operation by the user. It is composed of a deformable thickness. Alternatively, the operation region 721B may be made of a material different from other regions of the housing 720B, and in this case, a material having a lower rigidity than the other regions can be adopted.

Further, on the second surface 120B, a metal film 12 such as a metal foil formed on the adhesive adhesive layer 13 is formed. When the operation region 721B is made of a conductor material, the metal film 12 becomes unnecessary, and the operation member 10B can be made thinner. In this case, the operation region 721B also has a function as a metal film 12, and is connected to, for example, a ground potential.

As described above, the input device 100B according to the present embodiment can be configured by using a part of the housing 720B such as a conductor material. This is because, as described above, the input device 100B does not detect the input operation by utilizing the capacitive coupling between the operator and the X and Y electrodes, but the metal film 12 pressed by the operator and the conductor facing it. This is because the capacitive coupling between each of the layers 50 and the detection unit 20s is used. Therefore, according to the input device 100B, it is possible to reduce the number of parts of the electronic device 70B and further increase the productivity.

Further, since the input device 100B according to the present embodiment has the same sensor device 1 as that of the first embodiment described above, the operating position and the pressing force can be accurately detected even with a minute pressing force. .. Therefore, according to the present embodiment, there are few restrictions on the material of the operation region 721B, and it is possible to provide the input device 100B having high detection sensitivity.

<Fourth Embodiment>
FIG. 38A is a schematic cross-sectional view of the input device 100C according to the fourth embodiment of the present technology, and FIG. 38B is an enlarged cross-sectional view showing a main part of the input device 100C. The present embodiment is different from the first embodiment in that the electrode substrate 20 electrostatically detects a change in the distance between the metal film 12 and the conductor layer 50 according to the amount of change in the capacitive coupling in the XY plane. Is different. That is, the Y electrode 220C has an opposing portion that faces the X electrode 210C and the electrode substrate 20C in the in-plane direction, and the opposing portion constitutes the detection unit 20Cs.

The electrode substrate 20 has a base material 211C in which a plurality of first electrode wires (X electrodes) 210C and a plurality of second electrode wires (Y electrodes) 220C are arranged, and these plurality of X electrodes 210C and The Y electrode 220C is arranged on the same plane.

An example of the configuration of the X electrode 210C and the Y electrode 220C will be described with reference to FIGS. 39A and 39B. Here, each X electrode 210C and each Y electrode 220C have a plurality of comb-shaped unit electrode bodies (first unit electrode body) 210 m and a plurality of unit electrode bodies (second unit electrode body) 220 m, respectively. An example is shown in which one unit electrode body 210 m and one unit electrode body 220 m form each detection unit 20 Cs.

As shown in FIG. 39A, the X electrode 210C has a plurality of unit electrode bodies 210m, an electrode wire portion 210p, and a plurality of connection portions 210z. The electrode wire portion 210p extends in the Y-axis direction. The plurality of unit electrode bodies 210 m are arranged at regular intervals in the Y-axis direction. The electrode wire portion 210p and the unit electrode body 210m are separated from each other for a predetermined period of time, and are connected to each other by a connecting portion 210z.

As described above, the unit electrode body 210 m has a comb-teeth shape as a whole. Specifically, the unit electrode body 210m includes a plurality of sub electrodes 210w and a connecting portion 210y. The plurality of sub electrodes 210w extend in the X-axis direction. The adjacent sub-electrodes 210w are isolated for a predetermined period of time. One end of the plurality of sub electrodes 210w is connected to a connecting portion 210y extending in the X-axis direction.

As shown in FIG. 39B, the Y electrode 220C includes a plurality of unit electrode bodies 220m, an electrode wire portion 220p, and a plurality of connection portions 220z. The electrode wire portion 220p extends in the X-axis direction. The plurality of unit electrode bodies 220 m are arranged at regular intervals in the X-axis direction. The electrode wire portion 220p and the unit electrode body 220m are separated from each other for a predetermined period of time, and are connected to each other by a connecting portion 220z. The connection portion 220z may be omitted, and a configuration in which the unit electrode body 220m is directly provided on the electrode wire portion 220p may be adopted.

As described above, the unit electrode body 220 m has a comb-teeth shape as a whole. Specifically, the unit electrode body 220m includes a plurality of sub electrodes 220w and a connecting portion 220y. The plurality of sub-electrodes 220w extend in the X-axis direction. The adjacent sub-electrodes 220w are isolated for a predetermined period of time. One end of the plurality of sub electrodes 220w is connected to a connecting portion 220y extending in the Y-axis direction.

As shown in FIG. 40A, each detection unit 20Cs is formed in a region where each of the unit electrode bodies 210m and each of the unit electrode bodies 220m are mutually combined. The plurality of sub-electrodes 210w of the unit electrode body 210m and the plurality of sub-electrodes 220w of the unit electrode body 220m are alternately arranged in the Y-axis direction. That is, the sub electrodes 210w and 220w are arranged so as to face each other in the in-plane direction (for example, the Y-axis direction) of the electrode substrate 20C.

FIG. 40B is a cross-sectional view taken from the direction AA of FIG. 40A. The Y electrode 220 is provided so as to intersect the X electrode 210 as in the first embodiment, but is formed on the same plane as the X electrode 210. Therefore, as shown in FIG. 40B, the region where the X electrode 210 and the Y electrode 220 intersect is configured so that the X electrode 210 and the Y electrode 220 do not come into direct contact with each other. That is, an insulating layer 220r is provided on the electrode wire portion 210p of the X electrode 210. A jumper wiring 220q is provided so as to straddle the insulating layer 220r. The electrode wire portion 220p is connected by the jumper wiring 220q.

FIG. 41 is a schematic cross-sectional view for explaining the configuration of the detection unit 20Cs according to the present embodiment. In the example shown in the figure, in the detection unit 20Cs, the sub electrode 210w1 and the sub electrode 220w1, the sub electrode 220w1 and the sub electrode 210w2, the sub electrode 210w2 and the sub electrode 220w2, the sub electrode 220w2 and the sub electrode 210w3, and the sub electrode 210w3 and the sub electrode 210w3 The electrodes 220w3 are capacitively coupled to each other. That is, with the base material 211C as the dielectric layer, the capacitances Cc11, Cc12, Cc13, Cc14, and Cc15 between the sub-electrodes include the metal film 12, the conductor layer 50, and the sub-electrodes, and the first and second electrode wires 210C. , 220C is variably configured according to the capacitive coupling.

With the above configuration, the second base material and the adhesive layer of the electrode substrate are not required, which can contribute to the thinning of the input device 100C. Further, a large number of sub-electrodes are capacitively coupled to each other, and the distance between the sub-electrodes to be capacitively coupled can be narrowed. As a result, the capacitance coupling amount of the input device 100C as a whole can be increased, and the detection sensitivity can be improved.

<Fifth Embodiment>
The input device 100D according to the fifth embodiment of the present technology is the first in that one of the X electrode 210 and the Y electrode 220 includes a plurality of electrode groups, while the other includes a flat electrode. It is different from the embodiment of 1.

[First structural example]
FIG. 42 is a schematic cross-sectional view of the input device 100D according to the present embodiment. As shown in the figure, the input device 100D includes an operating member 10D, a conductor layer 50, an electrode substrate 20D, a first support 30, and a second support 40. The conductor layer 50, the first support 30, and the second support 40 have substantially the same configurations as those of the first embodiment, but the configurations of the operating member 10D and the electrode substrate 20D are different from those of the first embodiment. .. Specifically, the operating member 10D does not have a metal film. Further, regarding the electrode substrate 20D, each of the plurality of X electrodes (first electrode wire) 210D is a flat plate-shaped electrode arranged on the operating member 10D side of the plurality of Y electrodes (second electrode wire) 220D. , Each of the plurality of Y electrodes 220D includes a plurality of electrode groups 22Dw. Further, the electrode substrate 20D is configured to be capable of electrostatically detecting a change in the distance between each of the conductive controls such as the user's finger and the conductor layer 50.

FIG. 43 is a schematic plan view showing an arrangement example of the first and second structures 310 and 410 and the X electrode 210D and the Y electrode 220D. As shown in the figure, each X electrode 210D is a strip-shaped electrode extending in the Y-axis direction. Each Y electrode 220D extends in the X-axis direction and includes a plurality of electrode groups 22Dw. Similar to the first embodiment, the detection units 20Ds are formed in the intersection region of each X electrode 210D and each Y electrode, and are formed so as to face each of the first structures 210.

As shown in FIG. 42, the X electrode 210D is connected to, for example, a drive side (pulse input side) terminal of the controller 710, and can be switched to a drive pulse potential during detection and, for example, a ground potential during standby. As a result, a shielding effect against external noise (external electric field) can be exhibited. As a result, the input device 100D can maintain the shielding effect against external noise from the operating member 10D side and omit the metal film even if the operating member 10D does not have the metal film. Therefore, the configuration can be simplified and the productivity can be improved. The X electrode 210E may be connected to the ground potential regardless of whether it is during detection or standby.

Further, by providing the metal film 12 on the operating member 10 and connecting the metal film 12 to the ground potential as in the first embodiment, it is possible to exert a stronger shielding effect. As a result, the detection unit 20Ds can be made stable against external noise, and the detection sensitivity can be stably maintained.

[Second structural example]
FIG. 44 is a schematic cross-sectional view of the input device 100E according to the present embodiment. As shown in the figure, the input device 100E includes an operating member 10, a back plate 50E, an electrode substrate 20E, a first support 30, and a second support 40. The operating member 10, the first support 30, and the second support 40 have substantially the same configuration as that of the first embodiment, but have a back plate 50E instead of the conductor layer, and the electrode substrate 20E. The configuration is different from the first embodiment.

Similar to the conductor layer according to the first embodiment, the back plate 50E constitutes the lowermost portion of the input device 100E and faces the metal film (conductor layer) 12 (second surface 120) in the Z-axis direction. Be placed. The back plate 50E functions as a support plate for the input device 100E, and is configured to have higher bending rigidity than, for example, the operating member 10 and the electrode substrate 20E. The material of the back plate 50E is not particularly limited as long as the desired strength can be obtained, and may be, for example, a resin plate such as a reinforced plastic or a metal plate. Further, as described for the conductor layer in the first embodiment, it may have a stepped portion from the viewpoint of increasing rigidity, or it may be configured in a mesh shape or the like from the viewpoint of heat dissipation.

The electrode substrate 20E has a plurality of X electrodes (first electrode wire) 210E and a plurality of Y electrodes (second electrode wire) 220E as in the first embodiment. Each of the Y electrodes 220E is a flat plate-shaped electrode arranged on the back plate 50E side of the plurality of X electrodes 210E, and each of the plurality of X electrodes 210E includes a plurality of electrode groups 21Ew. The electrode substrate 20E is configured to be capable of electrostatically detecting a change in distance from the metal film 12.

FIG. 45 is a schematic plan view showing an arrangement example of the first and second structures 310 and 410 and the X electrode 210E and the Y electrode 220E. As shown in the figure, each X electrode 210E extends in the Y-axis direction and includes a plurality of electrode groups 21Ew. Each Y electrode 220E is a strip-shaped electrode having a wide configuration extending in the X-axis direction. The detection units 20Es are formed in the intersection region of each X electrode 210E and each Y electrode, and are formed so as to face each of the first structures 210, respectively, as in the first embodiment.

As shown in FIG. 44, the Y electrode 220E is connected to, for example, a drive side (pulse input side) terminal of the controller 710, and can be switched to a drive pulse potential during detection and, for example, a ground potential during standby. As a result, a shielding effect against external noise (external electric field) can be exhibited. As a result, the input device 100E maintains the shielding effect against external noise from the back plate 50E side even when the back plate 50E is an insulator or is not connected to the ground potential, and the conductor plate 50E Can be omitted. Therefore, the material selectivity of the back plate 50E can be improved, and the configuration can be made cost-effective. The Y electrode 220E may be connected to the ground potential regardless of whether it is during detection or standby.

Further, by forming the back plate 50E with a conductor plate and connecting both the Y electrode 220E and the back plate 50E to the ground potential, a stronger shielding effect can be exhibited. As a result, the detection unit 20Es can be made stable against external noise, and the detection sensitivity can be stably maintained.

In the case of the second structural example, the Y electrode 220E has a flat plate shape, and is configured to be capable of detecting a change in the distance between the detection unit 20Es and the metal film 12. As a result, as shown in FIG. 25, the distance between the detection unit 20Es and the metal film 12 can be changed more greatly, and the second structure 410 is arranged so as to face the detection unit 20Es. preferable. With such a configuration, a larger detection sensitivity can be obtained.

[Modification example]
(Modification example 1)
FIG. 46 is a schematic plan view showing an electrode configuration according to a modification of the input device 100D (first configuration example), FIG. 46A is a configuration example of the X electrode 210D, and FIG. 46B is a configuration example of the Y electrode 220D. Is shown. As shown in FIGS. 46A and 46B, the X electrode 210D and the Y electrode 220D may have a unit electrode body 210Dm and a unit electrode body 220Dm, respectively. As shown in FIG. 46A, the unit electrode body 210Dm of the X electrode 210D is a flat plate-shaped electrode, and as shown in FIG. 46B, the unit electrode body 220Dm of the Y electrode 220D is composed of a plurality of sub electrodes 220Dw. There is. In this modification, the plurality of sub-electrodes 220Dw of each unit electrode body 220D function as an electrode group.

(Modification 2)
FIG. 47 is a schematic plan view showing an electrode configuration according to a modification of the input device 100E (second configuration example), FIG. 47A is a configuration example of the X electrode 210E, and FIG. 47B is a configuration example of the Y electrode 220E. Is shown. As shown in FIGS. 47A and 47B, the X electrode 210E and the Y electrode 220E may have a unit electrode body 210Em and a unit electrode body 220Em, respectively, as in the first modification. As shown in FIG. 47A, the unit electrode body 210Em of the X electrode 210E is composed of a plurality of sub electrodes 210Ew, and as shown in FIG. 47B, the unit electrode body 220Em of the Y electrode 220E is a flat plate-shaped electrode. In this modification, the plurality of sub-electrodes 210Ew of each unit electrode body 210E function as an electrode group.

(Other variants)
In the present embodiment, the configurations of the X electrodes 210D and 210E and the Y electrodes 220D and 220E are not limited to the above configurations, and both the X electrodes 210D and 210E and the Y electrodes 220D and 220E are flat electrodes. It may be configured.

<Sixth Embodiment>
FIG. 48A is a perspective view showing an example of the appearance of the input device 100F according to the sixth embodiment of the present technology, and FIG. 48B is an enlarged cross-sectional view of FIG. 48A as viewed from the BB direction. The input device 100F according to the sixth embodiment has a cylindrical shape as a whole. Therefore, the first surface 110F, which is the input operation surface, has a cylindrical surface shape. Other configurations of the input device 100F are the same as those of the input device 100 according to the first embodiment.

The electrode substrate 20F includes a plurality of detection units 20Fs arranged two-dimensionally in a cylindrical in-plane direction. FIG. 48A shows an example in which a plurality of detection units 20Fs are two-dimensionally arranged in the circumferential direction and the axial direction (height direction) of the cylindrical electrode substrate 20F. Further, in the example shown in FIG. 48A, the first and second frame bodies 320F and 420F are arranged in the circumferential direction of the upper and lower ends of the cylinder. Thereby, the strength of the entire input device 100F can be increased.

As shown in FIG. 48B, the input device 100F according to the present embodiment has a shape in which the input device 100 according to FIG. 1 is curved with the first surface 110 (110F) facing outward. That is, the input device 100F has an operation member 10F, a conductor plate 50F, an electrode substrate 20F, a first support 30F, and a second support 40F, and each of these components has a cylindrical shape. It is configured to be curved.

Even with such an input device 100F, the detection sensitivity at the time of input operation on the first surface 110F can be increased, and it can be used as a touch sensor or a keyboard device. The shape of the entire input device 100F is not limited to a cylindrical shape, and may be, for example, a flat tubular shape or a cylindrical shape having a rectangular cross section. Further, FIG. 48A shows an example in which the first and second frame bodies 320F and 420F are arranged only in the circumferential direction of the upper and lower ends of the cylinder, but the present invention is not limited to this, and the first and second frames are not limited to this. The bodies 320F and 420F may be arranged along the vertical direction (the height direction of the cylinder). This allows for stronger support.

(Modification example 1)
FIG. 49A is a perspective view showing an example of the configuration of the input device 100F according to the modified example of the sixth embodiment of the present technology. The input device 100F according to this modification has a curved surface as a whole. That is, the input device 100F has a configuration in which a rectangular input device is curved. Therefore, the first surface 110F, which is the input operation surface, has a curved surface shape. Further, the electrode substrate (not shown) includes a plurality of detection units 20Fs arranged two-dimensionally in a cylindrical in-plane direction. The overall shape of the input device 100F is not limited to the example shown in FIG. 49A, and can be a desired curved surface shape.

(Modification 2)
FIG. 49B is a perspective view showing an example of the configuration of the input device 100F according to the modified example of the sixth embodiment of the present technology. In the input device 100F according to this modification, two sensor devices formed in a semicircle are combined to form one input device 100F. That is, the input device 100F has two detection regions 200 corresponding to each sensor device, and is configured in a cylindrical shape as a whole. The number of detection regions 200 is not limited, and may have three or more detection regions 200. Further, the shape of the entire input device 100F is not limited to the cylindrical shape. For example, the input device 100F may have four detection areas 200, and each of the four detection areas 200 may form a cylindrical shape having a rectangular cross section.

Although the embodiments of the present technology have been described above, the present technology is not limited to the above-described embodiments, and it goes without saying that various changes can be made without departing from the gist of the present technology.

For example, the input device may not have a metal film and may detect a change in capacitance of the detection unit due to capacitive coupling between the operator, each of the conductor layers, and the X and Y electrodes. In this case, a flexible sheet (see the second embodiment) made of an insulating material can be used as the operating member. Even with such a configuration, the first and second supports can change the distance between the operator, each of the conductor layers, and the detection unit, and can be an input device with high detection accuracy of the operation position and the pressing force.

Further, in the above embodiment, the configuration has been described in which the detection unit is arranged directly below the first structure, but the present invention is not limited to this. For example, the detection unit may be formed so as to face each of the second structures, or may be arranged at a position where neither the first structure nor the second structure faces each other. Even with such a configuration, it is possible to detect the operating position and the pressing force with high accuracy as in the above-described embodiment.

In the above embodiment, it has been described that the detection unit constitutes a mutual capacitance type capacitance element, but a self-capacitance type capacitance element may be configured. In this case, the input operation can be detected based on the amount of change in capacitance between each of the metal film and the conductor layer and the electrode layer included in the detection unit.

In the above embodiment, it has been described that the first space portion is arranged between the plurality of first structures and the second space portion is arranged between the plurality of second structures. , Not limited to this configuration. For example, an elastic material or the like may be filled in a region corresponding to all or a part of a plurality of first and second space portions. The elastic material to be filled is not particularly limited as long as it does not hinder the deformation of the electrode substrate, the operating member, or the like.

Further, the first and second supports 30, 40 may not have the first and second frames 320 and 330, respectively.

Further, the input device is not limited to the flat plate shape and the configuration described in the sixth embodiment, and may be configured as a plate shape having an irregular first surface, for example. That is, since the sensor device of the present technology has a flexible configuration as a whole, a mounting method with a high degree of freedom is possible.

In addition, this technology can also adopt the following configurations.
(1) A deformable sheet-like first conductor layer and
A second conductor layer arranged to face the first conductor layer and
It has a plurality of first electrode lines and a plurality of second electrode lines arranged to face the plurality of first electrode lines and intersect with the plurality of first electrode lines. An electrode substrate deformably arranged between the second conductor layers and
A first support having a plurality of first structures connecting the first conductor layer and the electrode substrate, and
A sensor device including a second support having a plurality of second structures connecting the second conductor layer and the electrode substrate.
(2) A deformable sheet-like first conductor layer and
A second conductor layer arranged to face the first conductor layer and
It has a plurality of first electrode lines and a plurality of second electrode lines arranged to face the plurality of first electrode lines and intersect with the plurality of first electrode lines. An electrode substrate that is deformably arranged between the second conductor layers and capable of electrostatically detecting a change in distance from each of the first and second conductor layers.
A first structure having a plurality of first structures connecting the first conductor layer and the electrode substrate, and a first space portion formed between the plurality of first structures. With the support
Between a plurality of second structures arranged between the plurality of adjacent first structures and connecting the second conductor layer and the electrode substrate, and between the plurality of second structures. A sensor device including a second support having a second space formed in.
(3) The sensor device according to (1) or (2) above.
The electrode substrate is formed at the intersection region of the plurality of first electrode wires and the plurality of second electrode wires, and the capacitance is increased according to the relative distance between the first and second conductor layers. A sensor device further having a plurality of variable detectors.
(4) The sensor device according to (3) above.
The plurality of detection units are sensor devices formed so as to face each of the plurality of first structures.
(5) The sensor device according to (3) above.
The plurality of detection units are sensor devices formed so as to face each of the plurality of second structures.
(6) The sensor device according to any one of (1) to (5) above.
The first support has a first frame body that connects between the first conductor layer and the electrode substrate and is arranged along the peripheral edge of the electrode substrate.
The second support is a sensor device having a second frame that connects between the second conductor layer and the electrode substrate and is arranged so as to face the first frame.
(7) The sensor device according to any one of (1) to (6) above.
The second conductor layer is a sensor device having a stepped portion.
(8) The sensor device according to (1) above.
The electrode substrate is a sensor device configured to be capable of electrostatically detecting a change in distance from each of the first and second conductor layers.
(9) The sensor device according to (1) or (8) above.
The first support is
A sensor device further comprising a first space formed between the plurality of first structures.
(10) The sensor device according to any one of (1), (8) or (9) above.
The second support is
A sensor device further comprising a second space formed between the plurality of second structures.
(11) The sensor device according to any one of (1), (2), (8) to (10) above.
Each of the plurality of first electrode wires has a plurality of first unit electrode bodies including a plurality of first sub-electrodes, respectively.
Each of the plurality of second electrode wires includes a plurality of second sub-electrodes, and has a plurality of second unit electrode bodies facing each of the plurality of first unit electrode bodies.
The electrode substrate is
A base material on which the plurality of first electrode wires and the plurality of second electrode wires are arranged, and
A plurality of detections in which the plurality of first sub-electrodes of each first unit electrode body and the plurality of second sub-electrodes of each second unit electrode body face each other in the in-plane direction of the electrode substrate. A sensor device having a unit.
(12) A deformable sheet-shaped operating member having a first surface that accepts operations by the user and a second surface opposite to the first surface.
A conductor layer arranged to face the second surface and
It has a plurality of first electrode wires and a plurality of second electrode wires arranged to face the plurality of first electrode wires and intersect with the first electrode, and the operating member and the conductor layer. An electrode substrate that is deformably arranged between
A first support having a plurality of first structures connecting the operating member and the electrode substrate, and
An input device including a second support having a plurality of second structures connecting the conductor layer and the electrode substrate.
(13) A deformable sheet-shaped operating member having a first surface that accepts operations by the user and a second surface opposite to the first surface.
A first conductor layer arranged to face the second surface and
It has a plurality of first electrode wires and a plurality of second electrode wires arranged to face the plurality of first electrode wires and intersect with the first electrode wire, and the operating member and the first electrode wire. An electrode substrate that is deformably arranged between the first conductor layers and capable of electrostatically detecting a change in the distance from the first conductor layer,
A first support having a plurality of first structures connecting the operating member and the electrode substrate, and a first space portion formed between the plurality of first structures. ,
Between the plurality of second structures arranged between the plurality of adjacent first structures and connecting the first conductor layer and the electrode substrate, and the plurality of second structures. An input device including a second support having a second space formed in.
(14) The input device according to (12) above.
The operating member further has a second conductor layer formed on the second surface.
The detection board is an input device capable of electrostatically detecting a change in the distance between the first conductor layer and the second conductor layer.
(15) The input device according to (12) or (13) above.
The operation member is an input device including a display unit.
(16) The input device according to (12) or (13) above.
The operating member is an input device including a plurality of key areas.
(17) The input device according to (16) above.
The electrode substrate is formed in each of the intersecting regions of the plurality of first electrode wires and the plurality of second electrode wires, and the capacitance is variable according to the relative distance to the first conductor layer. An input device further having a detector.
(18) The input device according to (17) above.
An input device further comprising a control unit that is electrically connected to the electrode substrate and can generate information regarding an input operation for each of the plurality of key regions based on the outputs of the plurality of detection units.
(19) The input device according to any one of (16) to (18) above.
Each of the plurality of first structures is an input device arranged along a boundary between the plurality of key regions.
(20) The input device according to any one of (12) to (19) above.
Each of the plurality of first electrode wires is a flat plate-shaped electrode arranged closer to the operating member than the plurality of second electrode wires.
Each of the plurality of second electrode wires is an input device including a plurality of electrode groups.
(21) A deformable sheet-like operation having a first surface that accepts an operation by a user, a second surface opposite to the first surface, and a metal film formed on the second surface. Members and
A back plate arranged to face the second surface and
It has a plurality of first electrode wires and a plurality of second electrode wires arranged to face the plurality of first electrode wires and intersect with the first electrode wire, and the operating member and the back surface thereof. An electrode substrate that is deformably arranged between the plates and capable of electrostatically detecting a change in the distance from the metal film,
A first support having a plurality of first structures connecting the operating member and the electrode substrate, and a first space portion formed between the plurality of first structures. ,
It is formed between a plurality of second structures arranged between the plurality of adjacent first structures and connecting the back plate and the electrode substrate, and the plurality of second structures. An input device including a second support having a second space.
(22) The input device according to (21) above.
Each of the plurality of second electrode wires is a flat plate-shaped electrode arranged on the back plate side of the plurality of first electrode wires.
Each of the plurality of first electrode wires is an input device including a plurality of electrode groups.
(23) A deformable sheet-shaped operating member having a first surface that accepts operations by the user and a second surface opposite to the first surface.
A conductor layer arranged to face the second surface and
It has a plurality of first electrode wires and a plurality of second electrode wires arranged to face the plurality of first electrode wires and intersect with the plurality of first electrode wires. An electrode substrate that is deformably arranged between the conductor layers and capable of electrostatically detecting a change in the distance from the conductor layer,
A first support having a plurality of first structures connecting the first operating member and the electrode substrate, and a first space portion formed between the plurality of first structures. When,
It is formed between a plurality of second structures arranged between the plurality of adjacent first structures and connecting the conductor layer and the electrode substrate, and the plurality of second structures. A second support having a second space,
An electronic device including a controller that is electrically connected to the electrode substrate and has a control unit capable of generating information regarding an input operation for each of the plurality of operating members based on the output of the electrode substrate.

1 ... Sensor device 100, 100A, 100B, 100C, 100D, 100E, 100F ... Input device 10, 10A, 10B, 10D, 10F ... Operating member 11 ... Flexible display (display unit)
12 ... Metal film (first conductor layer)
20, 20A, 20D, 20E, 20F ... Electrode substrate 20s, 20Cs, 20Ds ... Detection unit 210 ... First electrode wire 220 ... Second electrode wire 30, 30F ... First support 310 ... First structure 320 ... 1st frame 330 ... 1st space 40, 40F ... 2nd support 410 ... 2nd structure 420 ... 2nd frame 430 ... 2nd space 50, 50B, 50C ... Conductor layer (second conductor layer)
50E, 50F ... Back plate 51, 51B, 51C ... Step portion 60 ... Control unit 70, 70B ... Electronic device 710 ... Controller

Claims (9)

A deformable sheet-like first conductor layer and
A second conductor layer arranged to face the first conductor layer and
A plurality of first electrode lines, a plurality of second electrode lines arranged to face the plurality of first electrode lines and intersecting the plurality of first electrode lines, and the plurality of first electrodes. It has a plurality of detection units formed in each intersection region of the wire and the plurality of second electrode wires and whose capacitance is variable according to the relative distance between the first and second conductor layers. An electrode substrate deformably arranged between the first and second conductor layers,
A first support having a plurality of first structures connecting the first conductor layer and the electrode substrate, and
A sensor device including a second support having a plurality of second structures connecting the second conductor layer and the electrode substrate. The sensor device according to claim 1.
The plurality of detection units are sensor devices formed so as to face each of the plurality of first structures. The sensor device according to claim 1.
The plurality of detection units are sensor devices formed so as to face each of the plurality of second structures. The sensor device according to any one of claims 1 to 3.
The first support has a first frame that connects between the first conductor layer and the electrode substrate and is arranged along the peripheral edge of the electrode substrate.
The second support is a sensor device having a second frame that connects between the second conductor layer and the electrode substrate and is arranged so as to face the first frame. The sensor device according to any one of claims 1 to 4.
The second conductor layer is a sensor device having a stepped portion. A deformable sheet-shaped operating member having a first surface for receiving an operation by a user, a second surface on the opposite side of the first surface, and a plurality of key areas.
A conductor layer arranged to face the second surface and
A plurality of first electrode lines, a plurality of second electrode lines arranged to face the plurality of first electrode lines and intersecting with the first electrode line, and the plurality of first electrode lines. It has a plurality of detection units each formed in an intersection region with the plurality of second electrode lines and whose capacitance is variable according to a relative distance to the conductor layer, and is between the operating member and the conductor layer. Deformablely arranged electrode substrate and
A first support having a plurality of first structures connecting the operating member and the electrode substrate, and
An input device including a second support having a plurality of second structures connecting the conductor layer and the electrode substrate. The input device according to claim 6.
An input device further comprising a control unit that is electrically connected to the electrode substrate and is capable of generating information regarding an input operation for each of the plurality of key regions based on the outputs of the plurality of detection units. The input device according to claim 6 or 7.
Each of the plurality of first structures is an input device arranged along a boundary between the plurality of key regions. The input device according to any one of claims 6 to 8.
Each of the plurality of first electrode wires is a flat plate-shaped electrode arranged on the operating member side of the plurality of second electrode wires.
Each of the plurality of second electrode wires is an input device including a plurality of electrode groups.

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