JP6802994B2 - Three-dimensional modeling device and modeling object mounting plate - Google Patents

Description

The present invention relates to a three-dimensional modeling apparatus and a modeling object mounting plate.

Conventionally, a three-dimensional modeling device that forms a three-dimensional model by laminating a layered structure that cools and solidifies a heated modeling material on the surface of the mounting table or on a mounting plate held on the mounting table. It has been known.

For example, Patent Document 1 discloses a three-dimensional modeling apparatus that forms a three-dimensional model by a fused deposition modeling method (FDM method) in a heated production chamber. This three-dimensional modeling device extrudes the thermoplastic material while heating it at the outlet nozzle of the extrusion head located in the production chamber. Then, by moving the extrusion head in the two-dimensional direction along the horizontal plane while extruding the thermoplastic material, the layered structures are sequentially laminated on the plate (modeling object mounting plate) of the platform, and finally three-dimensional modeling is performed. Make things.

When modeling a three-dimensional model by the FDM method, each layered structure formed on the surface of the mounting table or on the mounting plate held by the mounting table by the heated modeling material is in the middle of the modeling process. Thermal expansion and contraction are caused by temperature changes. Since the conventional mounting table and mounting plate are composed of a high-rigidity member that does not easily deform, the lowermost layered structure (the first layered structure formed) fixed on the mounting table or the mounting plate is thermally expanded or heated. Due to the increase in internal stress of the layered structure due to shrinkage, there is a risk of peeling from the mounting table or mounting plate. If the lowermost layered structure is peeled off from the mounting table or mounting plate during the modeling process, the position of the formed layered structure moves, and it is relative to the layered structure formed on it. The position will shift and the modeling process cannot be continued properly.

This problem is not limited to the FDM type three-dimensional modeling device, but a layered structure that cools and solidifies the heated modeling material is laminated on the surface of the mounting table or on the mounting plate held by the mounting table. The same can occur if it is a three-dimensional modeling device that models a three-dimensional model.

In order to solve the above-mentioned problems, in the present invention, a layered structure for cooling and solidifying a heated molding material is laminated on the surface of the mounting table or on the mounting plate held on the mounting table. in the three-dimensional modeling apparatus for shaping a three-dimensional model, the surface portion or the mounting plate of the mounting table may have a deformed layer of deformable rubber to follow the deformation of the layered structure, said mounting base surface layer or the mounting plate of, to the side of the layered structure is laminated to hold the deformable layer on the opposite side, characterized in that have a hardly deformed rigid layer than the modified form layer.

According to the present invention, even if the formed layered structure causes thermal expansion or contraction during the modeling process, the position of the layered structure is suppressed from moving, and the modeling process can be appropriately executed. Has an effect.

It is explanatory drawing which shows typically the structure of the 3D modeling apparatus in embodiment. It is a perspective view which shows the appearance of the chamber provided in the three-dimensional modeling apparatus. It is a perspective view of the state in which the front part in FIG. 2 of the three-dimensional modeling apparatus is cut and excluded. It is a control block diagram of the three-dimensional modeling apparatus. It is a flowchart which shows the flow of the preheat treatment and the modeling process in an embodiment. It is a schematic diagram which shows the state which the layered structure formed on the conventional high-rigidity modeling plate is peeled off. It is sectional drawing which shows typically the modeling plate in embodiment. It is a schematic diagram which shows the state which the deforming layer of a modeling plate is deformed following the deformation of a layered structure during the modeling process in an embodiment. It is explanatory drawing which shows the structure of the stage in the modification.

Hereinafter, an embodiment in which the present invention is applied to a three-dimensional modeling apparatus for modeling a three-dimensional model by the Fused Deposition Modeling (FDM) method will be described.
The three-dimensional modeling apparatus to which the present invention is applied is not limited to the thermal melting lamination method (FDM), and the heated modeling material is placed on the surface of the mounting table or on the mounting plate held on the mounting table. If it is a three-dimensional modeling device that forms a three-dimensional model by stacking layered structures that are cooled and solidified, it can also be applied to a three-dimensional modeling device that models a three-dimensional model by another modeling method. ..

FIG. 1 is an explanatory diagram showing a configuration of a three-dimensional modeling apparatus 1 according to the present embodiment.
FIG. 2 is a perspective view showing the appearance of a chamber provided inside the three-dimensional modeling apparatus 1 according to the present embodiment.
FIG. 3 is a perspective view of a state in which the front portion of the three-dimensional modeling apparatus 1 in the present embodiment is cut and excluded.

The three-dimensional modeling device 1 includes a three-dimensional modeling chamber (hereinafter referred to as “chamber”) 3 inside the main body frame 2. The inside of the chamber 3 is a processing space for modeling a three-dimensional model, and a stage 4 as a mounting table is provided in the processing space, that is, inside the chamber 3. In the present embodiment, a modeling plate 40 as a mounting plate is held on the stage 4, and a three-dimensional modeled object is modeled on the modeling plate 40.

The wall portion surrounding the processing space in the chamber 3 is composed of a heat insulating wall having a heat insulating function in most or all of the wall portion. Specifically, the ceiling wall portion of the chamber 3 is a heat insulating wall composed of a plurality of slide heat insulating members 3A and 3B, as will be described later. Further, the side wall portion 3C of the chamber 3, that is, both wall portions in the left-right direction of the device (left-right direction = X-axis direction in FIGS. 2 and 3) has a heat insulating material containing glass wool or the like between the inner plate and the outer plate. It is a heat insulating wall with a sandwiched structure. Further, the bottom wall portion 3D of the chamber 3 is also a heat insulating wall having a structure in which a heat insulating material containing glass wool or the like is sandwiched between the inner plate and the outer plate. Further, the rear wall portion and the front wall portion 3E of the chamber 3 are also heat insulating walls having a structure in which a heat insulating material containing glass wool or the like is sandwiched between the inner plate and the outer plate.

In the present embodiment, the front wall portion 3E of the chamber 3 is provided with an opening / closing door 3a as shown in FIG. The opening / closing door 3a constitutes a heat insulating wall like the front wall portion 3E, and is configured to exhibit a sufficient heat insulating function. Further, as shown in FIG. 2, a window 3b is provided on the front wall portion 3E of the chamber 3. The window 3b has a double glass structure sandwiching an air layer, and constitutes a heat insulating wall similarly to the front wall portion 3E.

The heat insulating structure of each wall portion of the chamber 3 is not limited to that of the present embodiment as long as it can exhibit the required heat insulating function, and any heat insulating structure can be used. In the present embodiment, where the processing space in the chamber 3 has a high temperature of 200 ° C. or higher during the modeling process, it is possible to exhibit a heat insulating function such that the external air temperature of the chamber 3 is kept at about 40 ° C. or lower even at such a high temperature. It is preferably a heat insulating wall.

Above the stage 4 inside the chamber 3, a modeling head 10 is provided as a modeling material discharge unit. The modeling head 10 has an injection nozzle 11 below which the filament, which is a modeling material, is ejected. In the present embodiment, four injection nozzles 11 are provided on the molding head 10, but the number of injection nozzles 11 is arbitrary. Further, the molding head 10 is provided with a head heating unit 12 as a molding material heating means for heating the filaments supplied to each injection nozzle 11.

The filament has an elongated wire shape, is set in the three-dimensional modeling apparatus 1 in a wound state, and is supplied to each injection nozzle 11 on the modeling head 10 by the filament supply unit 6. The filament may be different for each injection nozzle 11 or may be the same. In the present embodiment, the filament supplied by the filament supply unit 6 is heated by the head heating unit 12 to be melted (or softened), and the molten filament is ejected by pushing out from a predetermined injection nozzle 11. , Layered modeling structures are sequentially laminated on the modeling plate 40 held on the stage 4, and a three-dimensional modeled object is modeled.

The injection nozzle 11 on the modeling head 10 may be supplied with a support material that does not form a three-dimensional model, instead of a filament of the model material. This support material is usually formed of a material different from the filament of the modeling material and is finally removed from the three-dimensional model formed of the filament. This support material is also heated and melted by the head heating unit 12, and the support material in the molten state is ejected so as to be extruded from a predetermined injection nozzle 11, and is sequentially laminated in layers.

The modeling head 10 refers to the X-axis drive mechanism 21 extending in the left-right direction of the device (horizontal direction in FIGS. 2 and 3 = X-axis direction) via the connecting member 21a in the longitudinal direction of the X-axis drive mechanism 21. It is held so as to be movable along the X-axis direction). The modeling head 10 can be moved in the left-right direction (X-axis direction) of the device by the driving force of the X-axis drive mechanism 21. Since the modeling head 10 is heated by the head heating unit 12 to a high temperature, it is preferable that the connecting member 21a has a low heat transfer property so that the heat is not easily transferred to the X-axis drive mechanism 21.

Both ends of the X-axis drive mechanism 21 have a longitudinal direction (Y) of the Y-axis drive mechanism 22 with respect to the Y-axis drive mechanism 22 extending in the front-rear direction (front-rear direction = Y-axis direction in FIGS. 2 and 3). It is held so that it can be slidably moved along the axial direction). When the X-axis drive mechanism 21 moves along the Y-axis direction by the driving force of the Y-axis drive mechanism 22, the modeling head 10 can move along the Y-axis direction.

In the present embodiment, the bottom wall portion 3D of the chamber 3 is fixed to the main body frame 2 with respect to the Z-axis drive mechanism 23 extending in the vertical direction of the device (vertical direction in FIGS. 2 and 3 = Z-axis direction). , The Z-axis drive mechanism 23 is movably held along the longitudinal direction (Z-axis direction). The bottom wall portion 3D of the chamber 3 can be moved in the vertical direction (Z-axis direction) of the device by the driving force of the Z-axis drive mechanism 23. Since the stage 4 is fixed on the bottom wall portion 3D, the stage 4 and the modeling plate 40 held by the stage 4 can be moved in the Z-axis direction by the driving force of the Z-axis drive mechanism 23.

The peripheral edge of the bottom wall 3D of the chamber 3 is in close contact with the inner wall surfaces of the side wall 3C, the front wall 3E, and the rear wall of the chamber 3. When the bottom wall portion 3D of the chamber 3 is moved in the Z-axis direction by the Z-axis drive mechanism 23, the bottom wall portion 3D has the peripheral portions of the side wall portions 3C, the front wall portion 3E, and the rear wall portion of the chamber 3. It moves while sliding each inner wall surface. As a result, the shielding property in the chamber 3 is ensured, and sufficient heat insulating property in the chamber 3 can be obtained. If sufficient heat insulating properties in the chamber 3 can be obtained, the peripheral surface of the bottom wall portion 3D of the chamber 3, the side wall portions 3C of the chamber 3, and the inner wall surfaces of the front wall portion 3E and the rear wall portion. There may be some gaps between them. By forming such a gap, smooth and highly accurate movement of the bottom wall portion 3D can be realized, and smooth and highly accurate movement of the stage 4 is realized.

Further, in the present embodiment, a chamber heater 7 is provided inside the chamber 3 (processing space) as a processing space heating means for heating the inside of the chamber 3. In the present embodiment, since the three-dimensional modeled object is modeled by the Fused Deposition Modeling Method (FDM), it is desirable to perform the modeling process while maintaining the temperature inside the chamber 3 at the target temperature. Therefore, in the present embodiment, the preheat treatment for raising the temperature in the chamber 3 to the target temperature is performed in advance before starting the modeling process. During this preheat treatment, the chamber heater 7 heats the inside of the chamber 3 in order to raise the temperature inside the chamber 3 to a target temperature, and maintains the temperature inside the chamber 3 at the target temperature during the modeling process. Therefore, the inside of the chamber 3 is heated. The operation of the chamber heater 7 is controlled by the control unit 100.

In the present embodiment, the X-axis drive mechanism 21, the Y-axis drive mechanism 22, and the Z-axis drive mechanism 23 are arranged outside the chamber 3. Therefore, the X-axis drive mechanism 21, the Y-axis drive mechanism 22, and the Z-axis drive mechanism 23 are not exposed to the high temperature in the chamber 3, and stable drive control is realized. The entire X-axis drive mechanism 21 and the Y-axis drive mechanism 22 are not limited to the configuration arranged outside the chamber 3, and a part or the whole thereof may be arranged inside the chamber 3. ..

Here, the drive target of the X-axis drive mechanism 21 and the Y-axis drive mechanism 22 in the present embodiment is the modeling head 10, and a part of the modeling head 10 (the tip portion of the modeling head 10 including the injection nozzle 11) is a chamber. It is arranged in 3. In the present embodiment, the inside of the chamber 3 is shielded from the outside even if the modeling head 10 is moved in the X-axis direction. Specifically, in the ceiling wall portion of the chamber 3, as shown in FIGS. 2 and 3, a plurality of X-axis slide heat insulating members 3A elongated in the Y-axis direction are arranged side by side in the X-axis direction. The adjacent X-axis slide heat insulating members 3A are configured to be relatively slidable in the X-axis direction. As a result, even if the modeling head 10 is moved in the X-axis direction by the X-axis drive mechanism 21, the plurality of X-axis slide heat insulating members 3A slide and move in the X-axis direction, respectively, and the processing space in the chamber 3 The upper part is always covered with the X-axis slide insulation member 3A.

Similarly, in the ceiling wall portion of the chamber, as shown in FIGS. 2 and 3, a plurality of Y-axis slide heat insulating members 3B are arranged side by side in the Y-axis direction. The adjacent Y-axis slide heat insulating members 3B are configured to be relatively slidable in the Y-axis direction. As a result, even if the modeling head 10 on the X-axis drive mechanism 21 is moved in the Y-axis direction by the Y-axis drive mechanism 22, the plurality of Y-axis slide heat insulating members 3B slide and move in the Y-axis direction, respectively. The upper part of the processing space in the chamber 3 is always covered with the Y-axis slide heat insulating member 3B.

Further, the drive target of the Z-axis drive mechanism 23 in the present embodiment is the bottom wall portion 3D of the chamber 3 or the stage 4 (or the modeling plate 40). In the present embodiment, the inside of the chamber 3 is shielded from the outside even if the bottom wall portion 3D or the stage 4 is moved in the Z-axis direction. Specifically, as shown in FIGS. 2 and 3, slide holes 3c for passing through the connecting portion between the Z-axis drive mechanism 23 and the bottom wall portion 3D are provided in the side wall portions 3C of the chamber 3 in the Z-axis direction. It is formed to extend. The slide hole 3c is sealed by a flexible sealing member 3d made of a heat insulating material. When the bottom wall portion 3D is moved in the Z-axis direction by the Z-axis drive mechanism 23, the connecting portion between the Z-axis drive mechanism 23 and the bottom wall portion 3D elastically deforms the flexible sealing member 3d and slide holes 3c. It moves in the Z-axis direction along. Therefore, the slide holes 3c formed in the side wall portions 3C of the chamber 3 are always covered with the sealing member 3d.

In addition, in the present embodiment, nozzle cleaning for cleaning the in-device cooling device 8 for cooling the space outside the chamber 3 and inside the three-dimensional molding device 1 and the injection nozzle 11 of the molding head 10. A part 9 and the like are provided.

FIG. 4 is a control block diagram of the three-dimensional modeling apparatus 1 of the present embodiment.
In the present embodiment, an X-axis position detecting mechanism 24 for detecting the position of the modeling head 10 in the X-axis direction is provided. The detection result of the X-axis position detection mechanism 24 is sent to the control unit 100. The control unit 100 controls the X-axis drive mechanism 21 based on the detection result to move the modeling head 10 to the target X-axis direction position.

Further, in the present embodiment, a Y-axis position detecting mechanism 25 for detecting the Y-axis direction position of the X-axis drive mechanism 21 (the Y-axis direction position of the modeling head 10) is provided. The detection result of the Y-axis position detection mechanism 25 is sent to the control unit 100. The control unit 100 moves the modeling head 10 on the X-axis drive mechanism 21 to the target Y-axis direction position by controlling the Y-axis drive mechanism 22 based on the detection result.

Further, in the present embodiment, a Z-axis position detecting mechanism 26 for detecting the Z-axis direction position of the modeling plate 40 held on the stage 4 is provided. The detection result of the Z-axis position detection mechanism 26 is sent to the control unit 100. The control unit 100 controls the Z-axis drive mechanism 23 based on the detection result to move the modeling plate 40 on the stage 4 to the target Z-axis direction position.

By controlling the movement of the modeling head 10 and the stage 4 in this way, the control unit 100 sets a target relative three-dimensional position between the modeling head 10 and the modeling plate 40 on the stage 4 in the chamber 3. It can be positioned in a three-dimensional position.

FIG. 5 is a flowchart showing the flow of the preheat treatment and the modeling process in the present embodiment.
In the present embodiment, when the control unit 100 starts modeling by a user-instructed operation or the like, first, the chamber heater 7, the head heating unit 12, and the stage heating unit 5 are turned on and operated (these are operated (). S1). Further, the control unit 100 controls the Z-axis drive mechanism 23 and raises the stage 4 from a predetermined standby position (for example, the lowest point) by the driving force of the Z-axis drive mechanism 23 (S2). Then, when the stage 4 reaches the above-mentioned preheating position (Yes in S3), the driving of the Z-axis drive mechanism 23 is stopped (S4).

When the temperature of the processing space reaches the target temperature (Yes in S5), the control unit 100 subsequently shifts to the modeling process. The three-dimensional shape data of the three-dimensional model formed by the three-dimensional modeling device 1 of the present embodiment is obtained from an external device such as a personal computer connected to the three-dimensional modeling device 1 so as to be capable of data communication by wire or wirelessly. Entered. The control unit 100 generates data (slice data for modeling) of a large number of layered structures decomposed in the vertical direction based on the input three-dimensional shape data. The slice data corresponding to each layered structure corresponds to each layered structure formed by the filament ejected from the modeling head 10 of the three-dimensional modeling apparatus 1, and the thickness of the layered structure is three-dimensional. It is appropriately set according to the capacity of the modeling apparatus 1.

In the modeling process, first, the control unit 100 creates a layered structure of the lowest layer on the surface of the modeling plate 40 held on the stage 4 according to the slice data of the lowermost layer (first layer) (S6). Specifically, the control unit 100 controls the X-axis drive mechanism 21 and the Y-axis drive mechanism 22 based on the slice data of the lowermost layer (first layer), and targets the tip of the injection nozzle 11 of the molding head 10. The filament is ejected from the ejection nozzle 11 while being sequentially moved to the position (target position on the XY plane). As a result, a layered structure according to the slice data of the lowest layer (first layer) is formed on the surface of the modeling plate 40 on the stage 4. A support material that does not constitute a three-dimensional model may also be created, but the description here will be omitted.

Next, the control unit 100 controls the Z-axis drive mechanism 23 to lower the stage 4 by a distance corresponding to one layer of the layered structure, and the modeling plate 40 on the stage 4 is placed on the next layer (third layer). It is lowered to a position for creating a layered structure of (two layers) and positioned (S8). After that, the control unit 100 controls the X-axis drive mechanism 21 and the Y-axis drive mechanism 22 based on the slice data of the second layer, and sequentially moves the tip of the injection nozzle 11 of the molding head 10 to the target position. The filament is ejected from the ejection nozzle 11. As a result, a layered structure according to the slice data of the second layer is formed on the layered structure of the lowermost layer formed on the modeling plate 40 of the stage 4 (S6).

In this way, the control unit 100 controls the Z-axis drive mechanism 23, and repeats the process of laminating and modeling each layered structure in order from the lower layer while sequentially lowering the stage 4. Then, when the creation of the uppermost layered structure is completed (Yes in S7), the three-dimensional modeled object according to the input three-dimensional shape data is modeled on the modeling plate 40.

When the modeling process is completed in this way, the control unit 100 controls the Z-axis drive mechanism 23 to lower the stage 4 to a predetermined take-out position (the lowest point in the present embodiment) (S9). This take-out position is set at a position where the opening / closing door 3a provided on the front wall portion 3E of the chamber 3 can be opened so that the three-dimensional modeled object on the stage 4 can be easily taken out of the chamber 3.

Immediately after the completion of the modeling process, the processing space in the chamber 3 is still hot, so that the user cannot immediately take out the three-dimensional modeled object in the processing space by opening the opening / closing door 3a. Therefore, after the temperature in the processing space is lowered to a temperature at which the processing space can be taken out, the user opens the opening / closing door 3a and takes out the three-dimensional modeled object in the processing space in a state of being fixed to the modeling plate 40. The control unit 100 provides a cooling period for locking the opening / closing door 3a until the temperature in the processing space drops to a temperature that can be taken out, and after the temperature in the processing space drops to a temperature that can be taken out, the opening / closing door 3a It is preferable to release the locked state of.

Here, when modeling a three-dimensional modeled object with the three-dimensional modeling device 1 of the present embodiment, the softened filament 50 heated by the head heating unit 12 and ejected from the injection nozzle 11 is a modeling plate in the chamber 3. 40 is ejected upward. The inside of the chamber 3 is heated by the heater 7 for the chamber and the like, but since the temperature inside the chamber 3 is lower than the softening temperature of the filament 50 in the head heating unit 12, the softened filament ejected onto the molding plate 40. The temperature of the will gradually decrease. As a result, the filament 50 is fixed to the surface of the modeling plate 40, and its hardness is increased so that the shape as a layered structure can be maintained.

The filament 50 ejected onto the modeling plate 40 causes heat shrinkage in the process of gradually lowering the temperature. Conventionally, as shown in FIG. 6, since the modeling plate 40'is composed of a high-rigidity member that is not easily deformed, the internal stress of the lowermost layered structure fixed to the modeling plate 40'is increased by the heat shrinkage. .. Further, since the layered structures of the second and subsequent layers laminated on the lowermost layer also cause heat shrinkage, the internal stress of the layered structures of the second and subsequent layers also increases, which causes the layered structures of the lowermost layer. The internal stress of is further increased. The internal stress of the lowermost layered structure that increases in this way causes the lowermost layered structure to warp, and the end of the lowermost layered structure is separated from the high-rigidity modeling plate 40'. Generate force.

As shown in FIG. 6, when the internal stress of the lowermost layered structure increases to the extent that a peeling force exceeding the fixing force between the lowermost layered structure and the high-rigidity modeling plate 40'is generated, the lowermost layered structure The object peels off from the modeling plate 40'. If the lowermost layered structure is peeled off from the modeling plate 40'in the middle of the modeling process, the position of the formed layered structure moves on the modeling plate 40', and a new layered structure formed on the layered structure moves. The relative position with the layered structure shifts, and the modeling process cannot be continued properly.

As a method of suppressing peeling during the modeling process, it is conceivable to increase the adhesive force between the layered structure of the lowermost layer and the highly rigid modeling plate 40'. For example, a method of coating a high-rigidity modeling plate 40'with a surface film that improves chemical bonding and mechanical bonding with a layered structure to increase the adhesion between the modeling plate 40'and the layered structure of the lowermost layer. Can be mentioned. However, since there is a limit to increasing the fixing force, when the peeling force of the lowermost layered structure is large, the problem that the lowermost layered structure is peeled off from the modeling plate 40'in the middle of the modeling process is solved. Difficult to do.

In addition, although the case where thermal shrinkage occurs has been described here, the same applies when thermal expansion occurs. For example, due to temperature variation in the chamber 3, the layered structure may thermally expand during the modeling process, and such thermal expansion may also generate a peeling force.

FIG. 7 is a cross-sectional view schematically showing the modeling plate 40 in the present embodiment.
As shown in FIG. 7, the modeling plate 40 of the present embodiment is composed of a rigid substrate 41 which is a rigid layer and a deformable layer 42 formed on the rigid substrate 41. The deformable layer 42 is firmly fixed on the rigid substrate 41 and has a property of being deformable following the deformation of the lowermost layered structure fixed to the deformable layer 42. The deformed layer 42 of the present embodiment has such characteristics, so that the layered structure formed on the deformed layer 42 of the modeling plate 40 causes heat shrinkage and is fixed to the deformed layer 42. Even if the object is deformed so as to warp, as shown in FIG. 8, the deformation layer 42 is also deformed following the deformation. As a result, the peeling force generated between the deformed layer 42 and the layered structure of the lowermost layer can be suppressed to be small, and the layered structure of the lowermost layer can be suppressed from peeling from the modeling plate 40 during the modeling process. Therefore, the position of the layered structure formed in the middle of the modeling process does not move on the modeling plate 40 beyond the permissible range, and the modeling process can be appropriately performed.

When the deformed layer 42 of the modeling plate 40 is deformed following the deformation of the layered structure of the lowermost layer in this way, the layered structure of the lowest layer is deformed during the modeling process, and the tertiary layered structure to be modeled The modeling accuracy of the original model can be low. However, if peeling occurs during the modeling process, the merit of being able to model a three-dimensional modeled object is greater than the fact that it is not possible to model a three-dimensional modeled object in the first place, even if the modeling accuracy is low.

Further, even when the deformed layer 42 of the modeling plate 40 is deformed following the deformation of the layered structure of the lowermost layer, when the deformed layer 42 is deformed, a deformation resistance force is generated to resist the deformation, and the deformation resistance force is generated. It is a force that suppresses deformation of the layered structure of the lowest layer. Therefore, by adjusting the characteristics (hardness, flexibility, etc.) of the deformable layer 42 so that the deformation resistance force that can sufficiently suppress the deformation of the layered structure of the lowermost layer is generated, three-dimensional modeling is performed with an allowable modeling accuracy. It is possible to model things.

Further, in the present embodiment, the three-dimensional modeled object in a state of being fixed to the modeling plate 40 is cooled to a temperature that can be taken out in the chamber 3 (for example, near room temperature) after the modeling process is completed, and then from the chamber 3. Taken out. In this cooling process, the layered structure at the bottom of the three-dimensional model that adheres to the model plate 40 causes greater heat shrinkage than during the model process. Therefore, since a larger peeling force is generated, in the conventional high-rigidity modeling plate 40, the layered structure of the lowermost layer is warped at the maximum in the process of cooling the three-dimensional modeled object fixed to the modeling plate 40'. The lower layered structure peels off from the modeling plate 40'. If peeling occurs in such a cooling process, the external force that resists the deformation of the three-dimensional model due to heat shrinkage does not act at all after that, so that the three-dimensional model is deformed and the modeling accuracy deteriorates.

According to the present embodiment, even if the layered structure of the lowermost layer is deformed in such a cooling process, the deformed layer 42 of the modeling plate 40 is deformed following the deformation. At this time as well, when the deformation layer 42 is deformed, a deformation resistance force is generated to resist the deformation, and the deformation resistance force becomes a force for suppressing the deformation of the layered structure of the lowermost layer. Therefore, the deformation of the three-dimensional modeled object due to heat shrinkage during the cooling process after the modeling process can be suppressed by the deformed layer 42, and the deterioration of modeling accuracy due to peeling can be suppressed.

The deformable layer 42 may be a plastically deformable layer having little or no deformation restoring force as long as it can be deformed following the deformation of the lowermost layered structure. However, in the present embodiment, an elastic layer having a large deformation restoring force is used as the deformation layer 42. In such an elastic layer, the restoring force of deformation continuously acts as a deformation resistance force against the deformation of the layered structure of the lowermost layer, so that the effect of suppressing the deformation of the layered structure of the lowermost layer is high. .. Therefore, it is possible to model a three-dimensional model with higher modeling accuracy.

The rigid substrate 41 of the modeling plate 40 may have a hardness that can support the deformed layer 42 without substantially deforming even if the deformed layer 42 is deformed following the deformation of the layered structure of the lowermost layer. Just do it. However, in the present embodiment, since the modeling plate 40 is exposed to a high temperature in the chamber 3, the rigid substrate 41 preferably has flame retardancy and heat resistance.

Materials of the rigid substrate 41 include styrene resin, phenol resin, acrylic resin, methacrylic resin, urethane resin, melamine resin, polyamide resin, polyester resin, polyether resin, polyvinyl ether resin, polyolefin resin, epoxy resin, ketone resin, and silicone. A resin such as a resin or a fluororesin can be used. From the viewpoint of flame retardancy, for example, fluororesins such as PVDF and ETFE, polyimide resins or polyamide-imide resins are preferable, and from the viewpoint of mechanical strength (high elasticity) and heat resistance, polyimide resins or polyamide-imide resins are particularly preferable. Is preferable.

Further, as the material of the rigid substrate 41, a metal material is more preferable than a resin material from the viewpoint of thermal conductivity and mechanical strength. Even when a metal material is used, iron, aluminum, stainless steel, and true casting are highly versatile, regardless of the type, as long as they have hardness and heat resistance that can support the deformed layer 42 without being substantially deformed. , Titanium, steel, copper and the like can be used, but stainless steel and aluminum are preferable from the viewpoint of cost, mechanical strength, thermal conductivity, and surface processability.

Further, even if unevenness is formed on the surface of the rigid substrate 41 of the modeling plate 40 by roughening treatment or the like to increase the contact area and improve the adhesiveness between the rigid substrate 41 and the deformed layer 42 due to the anchor effect. Good. Examples of the method for forming such unevenness include known roughening treatments such as plating, surface coating, plasma treatment, surface modification, and formation of a primer layer. It may be sandblasted, shotblasted, plated, polished or the like.

Further, as the material of the deformable layer 42, a general-purpose resin, elastomer, rubber or the like can be used, but it is preferable to use an elastomer material or a rubber material.
Examples of the elastomer material include polyester-based, polyamide-based, polyether-based, polyurethane-based, polyolefin-based, polystyrene-based, polyacrylic-based, polydiene-based, silicone-modified polycarbonate-based, and fluorine-based copolymer systems as thermoplastic elastomers. .. Further, examples of the thermosetting property include polyurethane-based, silicone-modified epoxy-based, and silicone-modified acrylic-based.
Examples of the rubber material include isoprene rubber, styrene rubber, butadiene rubber, nitrile rubber, ethylene propylene rubber, butyl rubber, silicone rubber, chloroprene rubber, acrylic rubber, chlorosulfonated polyethylene, fluorine rubber, urethane rubber, and hydrin rubber. ..
From these various elastomers and rubbers, a material that can obtain the desired properties as the deformable layer 42 described above is appropriately selected, but in the present embodiment, the flexibility of the deformable layer 42 (deformation followability of the layered structure). ) Or metal material, acrylic rubber is preferable as the material of the deformable layer 42 from the viewpoint of adhesion to the rigid substrate 41.

In the present embodiment, since the modeling plate 40 is exposed to a high temperature in the chamber 3, the deformable layer 42 is a material that can obtain the desired characteristics as the deformed layer 42 described above in such a high temperature environment. It is desirable to select. From this point of view, as the material of the deformable layer 42, silicone rubber, fluororubber, or the like is preferable, and silicone rubber is more preferable from the viewpoint of flame retardancy.

The hardness of the deformed layer 42 to be laminated affects the molding quality. Specifically, if the hardness is too high, it will be difficult to deform and the followability will be poor, while if the hardness is too low, the deformation of the three-dimensional model will be allowed too much and the modeling quality will deteriorate. .. Examples of the method for measuring the hardness of the deformed layer 42 include a method for measuring minute hardness such as Martens hardness and Vickers hardness. In this method, since the hardness of the measurement site is measured only in a shallow region in the bulk direction, that is, in the vicinity of the surface, it is difficult to evaluate the deformation performance of the deformed layer 42 as a whole. Therefore, it is preferable to use a method of measuring the microrubber hardness, which can evaluate the deformation performance of the entire deformable layer 42. The microrubber hardness can be measured using a commercially available microrubber hardness tester. Specifically, for example, the measurement can be performed using a "micro rubber hardness tester MD-1" manufactured by Polymer Instruments Co., Ltd. The microrubber hardness of the deformable layer 42 is preferably 10 or more and 50 or less, and more preferably 15 or more and 40 or less in an environment of 23 ° C. and 50% RH.

The modeling plate 40 of the present embodiment has a two-layer structure of a rigid substrate 41 and a deformable layer 42, but is a layer that makes it impossible to deform the deformable layer 42 following the deformation of the layered structure of the lowermost layer. If not, other necessary layers may be added.

Further, in the present embodiment, the configuration in which the modeling plate 40 taken out from the chamber 3 together with the three-dimensional modeled object after the modeling process is held on the stage 4 and the three-dimensional modeled object is modeled on the modeling plate 40 has been described. However, the three-dimensional modeled object may be directly modeled on the stage 4 without using the modeling plate 40. In this case, by providing a deformable layer similar to the deformable layer 42 of the modeling plate 40 on the surface portion of the stage 4, the layered structure formed on the deformed layer of the stage 4 is similarly deformed by causing heat shrinkage. However, the deformation layer of the stage 4 is also deformed following the deformation. As a result, the position of the layered structure formed in the middle of the modeling process does not move on the modeling plate 40 beyond the permissible range, and the modeling process can be appropriately performed. Further, also in this case, the deformation resistance force against the deformation generated when the deformation layer on the stage 4 is deformed becomes the force for suppressing the deformation of the layered structure of the lowermost layer, and the deterioration of the molding accuracy can be suppressed.

[Modification example]
Next, a modification of the above-described embodiment will be described.
In the above-described embodiment, if the adhesive force between the deformed layer 42 of the modeling plate 40 and the three-dimensional modeled object is further increased, the flexibility of the deformed layer 42 is reduced (increased in hardness), and the deformed layer 42 is deformed at the time of deformation. Higher modeling accuracy can be achieved by increasing the generated deformation resistance. However, after the three-dimensional modeled object fixed to the modeling plate 40 is cooled, it may be necessary to separate the modeling plate 40 from the three-dimensional modeled object. If the adhesive force between the deformed layer 42 of the modeling plate 40 and the three-dimensional modeled object is simply increased, the separability when separating the modeled plate 40 from the three-dimensional modeled object deteriorates. Therefore, during the modeling process or the cooling process after the modeling process, which requires a high adhesive force between the deformed layer 42 of the modeling plate 40 and the three-dimensional modeled object, the modeling plate 40 (deformed layer 42) and the three-dimensional modeled object While the adhesiveness can be ensured, a configuration that can secure the separability between the modeling plate 40 (deformed layer 42) and the three-dimensional modeled object after the cooling process is desired.

FIG. 9 is an explanatory diagram showing the configuration of the stage 4 in this modified example.
As shown in FIG. 9, the stage 4 includes an upper plate 46 and a lower plate 47. FIG. 9A is an explanatory view of a state in which the upper plate 46 and the lower plate 47 are overlapped, and FIG. 9B is an explanatory view of a state in which the upper plate 46 and the lower plate 47 are separated. ..
In this modification, the modeling plate 40 of the above-described embodiment is not used, but a deformation layer similar to the deformation layer 42 provided on the modeling plate 40 is provided on the surface of the stage 4, and the stage 4 is provided. A three-dimensional model is formed on the surface. In this modified example as well, a three-dimensional modeled object may be modeled on the modeling plate 40.

The upper plate 46 is a plate-shaped member provided with a plurality of through holes 46a, and the upper surface portion thereof is deformable so as to follow the deformation of the lowermost layered structure formed on the upper plate 46. It is composed of layer 46b. The lower plate 47 protrudes so as to penetrate the through hole 46a, and the convex portion forming member 47b having a plurality of convex portions 47a whose protrusion amount with respect to the upper plate 46 can be changed is fixed to the upper surface of the protrusion support 47c. It is a member of.

The Z-axis drive mechanism 23 of this modification includes an upper plate drive mechanism 23a that moves the upper plate 46 in the vertical direction and a lower plate drive mechanism 23b that moves the lower plate 47 in the vertical direction. As shown in FIG. 9A, the upper plate 46 and the lower plate 47 are overlapped with each other by inputting the same drive to the upper plate drive mechanism 23a and the lower plate drive mechanism 23b in a state where the upper plate 46 and the lower plate 47 are overlapped. The 47 can be integrally moved in the vertical direction. In the state shown in FIG. 9A, the convex portion 47a of the convex portion forming member 47b penetrates the through hole 46a, and the tip of the convex portion 47a protrudes above the upper surface of the upper plate 46.

When only the lower plate driving mechanism 23b is driven from the state shown in FIG. 9A and the lower plate 47 is moved downward, the lower plate 47 is separated from the upper plate 46 as shown in FIG. 9B. By inputting different drives to the lower plate drive mechanism 23b and the upper plate drive mechanism 23a in this way, the relative positions of the upper plate 46 and the lower plate 47 change. Thereby, the amount of protrusion of the convex portion 47a of the convex portion forming member 47b included in the lower plate 47 with respect to the upper plate 46 can be changed.

In the three-dimensional modeling apparatus of this modification, the upper plate 46 and the lower plate 47 are overlapped during the modeling process, and the tip of the convex portion 47a protrudes above the upper surface of the upper plate 46. The lower plate 47 is integrally moved in the vertical direction. Further, after the modeling process, the upper plate 46 and the lower plate 47 are separated as shown in FIG. 9B before the three-dimensional modeled object is taken out from the chamber 3. As a result, both the stickiness of the stage 4 and the three-dimensional modeled object during the modeling process and the cooling process and the separability after the cooling process are compatible.

At the time of the modeling process, the portion of the convex portion 47a protruding above the upper surface of the upper plate 46 and the bottom surface portion of the three-dimensional model can be locally fitted, and the model from the stage 4 can be fitted. An anchor effect that prevents peeling can be obtained. This makes it possible to improve the stickiness during the modeling process. Further, the three-dimensional model is formed so that the convex portion 47a sticks into the bottom surface portion of the three-dimensional model, so that the surface of the convex portion 47a and the three-dimensional model are fixed to each other, and the three-dimensional model and the stage 4 The area of adhesion to the side increases. Further, the modeling material enters the through hole 46a of the upper plate 46 and the gap between the through hole 46a and the convex portion 47a and is hardened, so that the fixed area between the three-dimensional modeled object and the stage 4 is increased. Due to the increase in the fixing area and the anchor effect in this way, the fixing property during the modeling process is improved.

After the modeling process is completed and the temperature is cooled to a temperature that can be taken out from the chamber 3, the upper plate 46 and the lower plate 47 are relatively moved in the vertical direction in the vertical direction (Z-axis) with respect to the three-dimensional modeled object. By applying a force (direction), the three-dimensional model is separated from the upper plate 46 and the lower plate 47 constituting the stage 4. Specifically, by moving the lower plate 47 downward with respect to the upper plate 46, the three-dimensional model is pulled downward by the surface fixed to the convex portion 47a, but the bottom surface of the three-dimensional model is the upper part. It is in contact with the upper surface of the plate 46. Therefore, the three-dimensional model cannot follow the convex portion 47a, and the fixed surface between the three-dimensional model and the convex portion 47a is peeled off. As a result, the three-dimensional model and the lower plate 47 can be easily separated.

In this state, the upper plate 46 and the three-dimensional modeled object are in a fixed state, but since there is no contact at the corresponding portion of the convex portion 47a, the fixing force is stronger than in the state before the cooling process. It is greatly reduced and separability is ensured. Moreover, in this state, the adhesive force is lower than that in the state where the entire bottom surface of the three-dimensional model and the surface of the stage 4 are in full contact with each other, so that the separability is higher. To be secured.

Further, the lower plate 47 may be moved upward with respect to the upper plate 46 at any timing before or after the lower plate 47 is moved downward with respect to the upper plate 46. By this movement, the three-dimensional model is pushed upward by the convex portion 47a, and the fixed surface between the three-dimensional model and the upper plate 46 is peeled off. After the cooling process, the fixing surface between the three-dimensional model and the upper plate 46 is peeled off in this way, and then the three-dimensional model and the lower plate 47 are separated, so that the three-dimensional model and the stage 4 are fixed. There is no surface, and high separability can be obtained.

What has been described above is an example, and each of the following aspects produces a unique effect.
(Aspect A)
A layered structure for cooling and solidifying a molding material such as a heated filament 50 is laminated on the surface of a mounting table such as a stage 4 or on a mounting plate such as a modeling plate 40 held on the mounting table. In the three-dimensional modeling apparatus 1 for modeling a three-dimensional model, the surface portion of the pre-described stand or the pre-described plate has a deformable layer 42, 46b that can be deformed according to the deformation of the layered structure. And.
According to this aspect, even if the formed layered structure causes thermal expansion or contraction during the modeling process, the deformation provided on the surface portion or the mounting plate of the mounting table to which the layered structure is fixed. The layer deforms following the deformation of the layered structure due to thermal expansion and contraction. Therefore, even if the layered structure is deformed by causing thermal expansion or contraction, the peeling force generated between the layered structure and the surface of the mounting table or the plate surface of the mounting plate can be suppressed to a small level, and the layered structure can be layered. It is possible to prevent the structure from peeling off from the mounting table or mounting plate.

(Aspect B)
In the aspect A, the deformable layer is an elastic layer that exerts a restoring force against the deformation.
According to this, since the restoring force of deformation continuously acts as a deformation resistance force against the deformation of the layered structure, a high effect of suppressing the deformation of the layered structure can be obtained. This makes it possible to create a three-dimensional model with higher modeling accuracy.

(Aspect C)
In the aspect B, the elastic layer is made of acrylic rubber.
According to this, a high effect of suppressing the deformation of the layered structure can be obtained. Further, when the deformed layer is formed by adhering it on the metal material, it is easy to obtain a high adhesive force with the metal material.

(Aspect D)
In the first aspect B, the elastic layer is made of silicone rubber.
According to this, a high effect of suppressing the deformation of the layered structure can be obtained. Further, an elastic layer having high heat resistance can be obtained.

(Aspect E)
In any of the above aspects A to D, the surface layer or the above-mentioned mounting plate of the above-mentioned stand holds the deformed layer on the side opposite to the side on which the layered structure is laminated, and is more than the deformed layer. It is also characterized by having a rigid layer that is not easily deformed.
According to this, a high effect of suppressing deformation of the layered structure can be obtained, and a three-dimensional modeled object with higher modeling accuracy can be modeled.

(Aspect F)
In the aspect E, the rigid layer is made of metal.
According to this, the high rigidity required for the rigid layer can be easily obtained, and a highly durable rigid layer can be obtained.

(Aspect G)
In any of the above-described aspects A to F, the modeling material discharging unit such as the modeling head 10 for discharging the modeling material such as the heated filament, and the processing space in which the above-mentioned stand and the modeling material discharging unit are arranged are provided. The layered structure is formed by relatively moving the chamber 3 provided inside, the processing space heating means such as the chamber heater 7 for heating the processing space in the chamber, and the above-mentioned stand and the modeling material discharging portion. It is characterized by having a modeling control means such as a control unit 100 that controls the operation of stacking.
According to this, even in the Fused Deposition Modeling Method (FDM) in which the formed layered structure tends to cause thermal expansion and contraction, it is possible to prevent the layered structure from peeling off from the mounting table or mounting plate.

(Aspect H)
A three-dimensional model is formed by laminating a layered structure that cools and solidifies a model material such as a heated filament on a model plate such as a model plate 40 that is held on a platform such as a stage 4. It is a modeled object mounting plate of the three-dimensional modeling apparatus 1 to be modeled, and is characterized by having a deformable layer 42 that can be deformed following the deformation of the layered structure.
According to this aspect, even if the formed layered structure causes thermal expansion or contraction during the modeling process, the deformed layer provided on the modeled object mounting plate to which the layered structure is fixed heats up. It deforms following the deformation of the layered structure due to expansion and heat contraction. Therefore, even if the layered structure is deformed by causing thermal expansion or contraction, the peeling force generated between the layered structure and the plate surface of the modeled object mounting plate can be suppressed to a small value, and the layered structure can be formed. It is possible to suppress peeling from the modeled object mounting plate.

1 Three-dimensional modeling device 3 Chamber 4 Stage 10 Modeling head 11 Injection nozzle 12 Head heating part 40 Modeling plate 41 Rigid substrate 42, 46b Deformed layer 46 Upper plate 46a Through hole 47 Lower plate 47a Convex part 50 Filament 100 Control unit

Japanese Patent No. 3995933

Claims (6)

In a three-dimensional modeling device that forms a three-dimensional model by laminating a layered structure that cools and solidifies the heated modeling material on the surface of the mounting table or on the mounting plate held by the mounting table.
Surface portion or the mounting plate of the mounting table may have a deformed layer of the rubber capable of following to deform the deformation of the layered structure,
Surface layer or the mounting plate of the mounting table is characterized in that the side where the layered structure is laminated to hold the deformable layer on the opposite side to have a deformation hardly rigid layer than the modified form layer Three-dimensional modeling device. In the three-dimensional modeling apparatus according to claim 1,
A three-dimensional modeling apparatus characterized in that the deformed layer is made of acrylic rubber. In the three-dimensional modeling apparatus according to claim 1,
A three-dimensional modeling apparatus characterized in that the deformed layer is made of silicone rubber . In the three-dimensional modeling apparatus according to any one of billed items 1 to 3,
A three-dimensional modeling device characterized in that the rigid layer is made of metal. In the three-dimensional modeling apparatus according to any one of claims 1乃Itaru 4,
A modeling material discharge unit that discharges the heated modeling material,
A chamber provided with a processing space inside in which the above-mentioned stand and the molding material discharge part are arranged, and
A processing space heating means for heating the processing space in the chamber,
A three-dimensional modeling apparatus comprising: a modeling control means for controlling an operation of forming and laminating the layered structure while relatively moving the above-described stand and the modeling material discharging portion. A modeled object mounting plate of a three-dimensional modeling device that forms a three-dimensional modeled object by laminating a layered structure that cools and solidifies the heated modeling material on the modeled object mounting plate held on the mounting table. And
A deformable layer of rubber that can be deformed following the deformation of the layered structure ,
A modeled object mounting plate characterized by holding the deformable layer on a side opposite to the side on which the layered structure is laminated and having a rigid layer that is less likely to be deformed than the deformed layer .

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