JP2017222072A - Three-dimensional molding apparatus and modeled product mounting plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress movement of the position of an already formed layer structure even if the layer structure thermally expands or thermally contracts in the midst of a molding treatment, thereby enabling the molding treatment to be appropriately performed.SOLUTION: In a three-dimensional molding apparatus which laminates a layer structure obtained by cooling and solidifying a heated molding material 50 on a surface of a mounting stand or on a mounting plate 40 retained on the mounting stand and molds a three-dimensionally modeled product, a surface portion on the mounting stand or the mounting plate has a deformation layer 42 that is deformable following the deformation of the layer structure. As a result, even if the layer structure thermally expands or thermally contracts and is deformed, peel force generated between the layer structure and the surface of the mounting stand or the plate surface of the mounting plate can be reduced to a low level, and the layer structure can be inhibited from peeling from the mounting stand and the mounting plate.SELECTED DRAWING: Figure 8

Description

  The present invention relates to a three-dimensional modeling apparatus and a modeled article mounting plate.

  Conventionally, a three-dimensional modeling apparatus that forms a three-dimensional structure by laminating a layered structure that cools and solidifies a heated modeling material on the surface of the mounting table or on a mounting plate held by the mounting table It has been known.

  For example, Patent Document 1 discloses a three-dimensional modeling apparatus that models a three-dimensional modeled object by a hot melt lamination method (FDM method) in a heated production chamber. This three-dimensional modeling apparatus extrudes a thermoplastic material while heating it at an exit nozzle of an extrusion head located in a production chamber. Then, by extruding the thermoplastic material and moving the extrusion head in a two-dimensional direction along the horizontal plane, the layered structure is sequentially laminated on the platform plate (modeling object mounting plate), and finally three-dimensional modeling is performed. Shape objects.

  When modeling a three-dimensional structure by the FDM method, each layered structure formed on the surface of the mounting table or the mounting plate held on the mounting table by the heated modeling material is in the middle of the modeling process. Causes thermal expansion and contraction due to temperature changes. Since the conventional mounting table and mounting plate are composed of a high-rigidity member that does not easily deform, the lowest layered layered structure (the layered structure that is formed first) that adheres to it is thermally expanded and heated. There is a risk of peeling from the mounting table or the mounting plate due to an increase in internal stress of the layered structure due to the shrinkage. If the lowermost layered structure is peeled off from the mounting table or the mounting plate during the modeling process, the position of the formed layered structure will move, and the relative to the layered structure formed on it The position shifts and the modeling process cannot be continued properly.

  This problem is not limited to the FDM type three-dimensional modeling apparatus, and a layered structure that cools and solidifies the heated modeling material is laminated on the surface of the mounting table or on the mounting plate held on the mounting table. If it is a three-dimensional modeling apparatus that models a three-dimensional model, it can occur in the same way.

  In order to solve the above-described problems, the present invention stacks a layered structure that cools and solidifies the heated modeling material on the surface of the mounting table or on the mounting plate held by the mounting table, In the three-dimensional modeling apparatus that models a three-dimensional modeled object, the surface portion of the mounting table or the mounting plate has a deformable layer that can be deformed following the deformation of the layered structure.

  According to the present invention, even if the formed layered structure causes thermal expansion or heat shrinkage during the modeling process, the position of the layered structure is suppressed from moving, and the modeling process can be appropriately executed. There is an effect.

It is explanatory drawing which shows typically the structure of the three-dimensional modeling apparatus in embodiment. It is a perspective view which shows the external appearance of the chamber provided in the inside of the same three-dimensional modeling apparatus. It is a perspective view of the state which cut | disconnected and excluded the near part in FIG. 2 of the same three-dimensional modeling apparatus. It is a control block diagram of the same three-dimensional modeling apparatus. It is a flowchart which shows the flow of the preheat processing and modeling process in embodiment. It is a schematic diagram which shows the state which the layered structure formed on the conventional highly rigid modeling plate peeled. It is sectional drawing which shows typically the modeling plate in embodiment. It is a schematic diagram which shows the state which the deformation layer of a modeling plate deform | transforms following the deformation | transformation of a layered structure in the middle of the modeling process in embodiment. It is explanatory drawing which shows the structure of the stage in a modification.

Hereinafter, an embodiment in which the present invention is applied to a three-dimensional modeling apparatus that models a three-dimensional modeled object by a hot melt lamination method (FDM) will be described.
The three-dimensional modeling apparatus to which the present invention is applied is not limited to the hot melt lamination method (FDM), and a heated modeling material is placed on the surface of the mounting table or on the mounting plate held by the mounting table. If it is a 3D modeling apparatus that stacks a layered structure to be cooled and solidified and models a 3D model, it can also be applied to a 3D model apparatus that models a 3D model by other modeling methods. .

FIG. 1 is an explanatory diagram showing a configuration of a three-dimensional modeling apparatus 1 in the present embodiment.
FIG. 2 is a perspective view showing an appearance of a chamber provided inside the three-dimensional modeling apparatus 1 in the present embodiment.
FIG. 3 is a perspective view of a state in which the front portion of the three-dimensional modeling apparatus 1 in the present embodiment is cut and excluded.

  The three-dimensional modeling apparatus 1 includes a three-dimensional modeling chamber (hereinafter referred to as “chamber”) 3 inside a main body frame 2. The interior of the chamber 3 is a processing space for modeling a three-dimensional structure, and a stage 4 as a mounting table is provided in the processing space, that is, inside the chamber 3. In the present embodiment, a modeling plate 40 as a mounting plate is held on the stage 4, and a three-dimensional modeled object is modeled on the modeling plate 40.

  Most or all of the wall portion surrounding the processing space in the chamber 3 is a heat insulating wall having a heat insulating function. Specifically, the ceiling wall portion of the chamber 3 is a heat insulating wall configured by a plurality of slide heat insulating members 3A and 3B, as will be described later. Further, the side wall portion 3C of the chamber 3, that is, both wall portions in the left-right direction of the apparatus (the left-right direction in FIGS. 2 and 3 = X-axis direction) is provided with a heat insulating material containing glass wool or the like between the inner plate and the outer plate. It is a heat insulating wall with a sandwiched structure. The bottom wall portion 3D of the chamber 3 is also a heat insulating wall having a structure in which a heat insulating material containing glass wool or the like is sandwiched between an inner plate and an outer plate. The rear wall portion and the front wall portion 3E of the chamber 3 are also heat insulating walls having a structure in which a heat insulating material containing glass wool or the like is sandwiched between an inner plate and an outer plate.

  In the present embodiment, the front wall 3E of the chamber 3 is provided with an opening / closing door 3a as shown in FIG. The open / close door 3a constitutes a heat insulating wall in the same manner as the front wall portion 3E, and is configured to exhibit a sufficient heat insulating function. Further, a window 3b is provided in the front wall 3E of the chamber 3 as shown in FIG. This window 3b has a double glass structure with an air layer interposed therebetween, and constitutes a heat insulating wall in the same manner as the front wall portion 3E.

  In addition, if the heat insulation structure of each wall part of the chamber 3 is a structure which can exhibit a required heat insulation function, it will not be restricted to the thing of this embodiment, The thing of all heat insulation structures can be utilized. In the present embodiment, the processing space in the chamber 3 becomes a high temperature of 200 ° C. or higher during the modeling process, and even at such a high temperature, a heat insulating function can be exhibited so that the outside temperature of the chamber 3 is kept at approximately 40 ° C. or lower. A heat insulating wall is preferred.

  A modeling head 10 as a modeling material discharge unit is provided above the stage 4 in the chamber 3. The modeling head 10 has an injection nozzle 11 that injects a filament, which is a modeling material, below the modeling head 10. In the present embodiment, four injection nozzles 11 are provided on the modeling head 10, but the number of injection nozzles 11 is arbitrary. Further, the modeling head 10 is provided with a head heating unit 12 as a modeling material heating unit that heats the filament supplied to each injection nozzle 11.

  The filament has an elongated wire shape, is set in the three-dimensional modeling apparatus 1 in a wound state, and is supplied to each injection nozzle 11 on the modeling head 10 by the filament supply unit 6. In addition, a filament may differ for every injection nozzle 11, and the same may be sufficient as it. In the present embodiment, the filament supplied from the filament supply unit 6 is heated by the head heating unit 12 to be melted (or softened), and the molten filament is ejected by being pushed out from a predetermined ejection nozzle 11. The layered modeling structure is sequentially laminated on the modeling plate 40 held on the stage 4 to model a three-dimensional modeled object.

  The injection nozzle 11 on the modeling head 10 may be supplied with a support material that does not constitute a three-dimensional structure, instead of a filament of a modeling material. This support material is usually formed of a material different from the filament of the modeling material, and finally removed from the three-dimensional structure formed of the filament. This support material is also heated and melted by the head heating unit 12, and the molten support material is injected so as to be pushed out from a predetermined injection nozzle 11, and sequentially laminated in layers.

  The modeling head 10 is connected to the X-axis drive mechanism 21 extending in the left-right direction of the apparatus (left-right direction in FIGS. 2 and 3 = X-axis direction) via the connecting member 21a in the longitudinal direction of the X-axis drive mechanism 21 ( (Movable along the X axis direction). The modeling head 10 can move in the left-right direction of the apparatus (X-axis direction) by the driving force of the X-axis driving mechanism 21. Since the modeling head 10 is heated by the head heating unit 12 and becomes a high temperature, it is preferable that the connecting member 21 a has a low heat conductivity so that the heat is not easily transmitted to the X-axis drive mechanism 21.

  Both ends of the X-axis drive mechanism 21 are respectively in the longitudinal direction (Y of the Y-axis drive mechanism 22 with respect to the Y-axis drive mechanism 22 extending in the apparatus front-rear direction (front-rear direction in FIGS. 2 and 3 = Y-axis direction). It is held so as to be slidable along the axial direction. As the X-axis drive mechanism 21 moves along the Y-axis direction by the driving force of the Y-axis drive mechanism 22, the modeling head 10 can move along the Y-axis direction.

  In the present embodiment, the bottom wall 3D of the chamber 3 is fixed to the main body frame 2 with respect to the Z-axis drive mechanism 23 extending in the vertical direction of the apparatus (vertical direction in FIGS. 2 and 3 = Z-axis direction). The Z-axis drive mechanism 23 is held so as to be movable along the longitudinal direction (Z-axis direction). The bottom wall 3 </ b> D of the chamber 3 can be moved in the vertical direction of the apparatus (Z-axis direction) by the driving force of the Z-axis driving mechanism 23. Since the stage 4 is fixed on the bottom wall portion 3D, the stage 4 and the modeling plate 40 held by the stage 4 can be moved in the Z-axis direction by the driving force of the Z-axis driving mechanism 23.

  The peripheral edge portion of the bottom wall portion 3D of the chamber 3 is in close contact with both side wall portions 3C of the chamber 3 and the inner wall surfaces of the front wall portion 3E and the rear wall portion. When the bottom wall portion 3D of the chamber 3 is moved in the Z-axis direction by the Z-axis drive mechanism 23, the bottom wall portion 3D has a peripheral edge portion of the side wall portion 3C, the front wall portion 3E, and the rear wall portion of the chamber 3. Move while sliding each inner wall. Thereby, the shielding property in the chamber 3 is ensured, and sufficient heat insulation in the chamber 3 is obtained. If sufficient heat insulation in the chamber 3 is obtained, the peripheral edge portion of the bottom wall portion 3D of the chamber 3 and the inner wall surfaces of the side wall portions 3C, the front wall portion 3E and the rear wall portion of the chamber 3 There may be a slight gap between them. By forming such a gap, the bottom wall 3D can be moved smoothly and accurately, and the stage 4 can be moved smoothly and accurately.

  In the present embodiment, a chamber heater 7 is provided inside the chamber 3 (processing space) as processing space heating means for heating the inside of the chamber 3. In this embodiment, in order to model a three-dimensional modeled object by the hot melt lamination method (FDM), it is desirable to perform the modeling process while maintaining the temperature in the chamber 3 at the target temperature. Therefore, in the present embodiment, pre-heat treatment is performed in which the temperature in the chamber 3 is raised to the target temperature in advance before the modeling process is started. The chamber heater 7 heats the chamber 3 to raise the temperature of the chamber 3 to the target temperature during the pre-heat treatment, and maintains the temperature in the chamber 3 at the target temperature during the modeling process. Therefore, the inside of the chamber 3 is heated. The operation of the chamber heater 7 is controlled by the control unit 100.

  In the present embodiment, the X-axis drive mechanism 21, the Y-axis drive mechanism 22, and the Z-axis drive mechanism 23 are arranged outside the chamber 3. Therefore, the X-axis drive mechanism 21, the Y-axis drive mechanism 22, and the Z-axis drive mechanism 23 are not exposed to the high temperature in the chamber 3, and stable drive control is realized. The X-axis drive mechanism 21 and the Y-axis drive mechanism 22 are not limited to be configured to be disposed outside the chamber 3, but may be configured to be partially or entirely disposed inside the chamber 3. .

  Here, the driving target of the X-axis drive mechanism 21 and the Y-axis drive mechanism 22 in this embodiment is the modeling head 10, and a part of the modeling head 10 (the tip portion of the modeling head 10 including the injection nozzle 11) is a chamber. 3 is arranged. In the present embodiment, the inside of the chamber 3 is shielded from the outside even when the modeling head 10 is moved in the X-axis direction. Specifically, in the ceiling wall portion of the chamber 3, as shown in FIGS. 2 and 3, a plurality of X-axis slide heat insulating members 3A that are long in the Y-axis direction are arranged side by side in the X-axis direction. The adjacent X-axis slide heat insulating members 3A are configured to be slidable relative to each other in the X-axis direction. Thereby, even if the modeling head 10 is moved in the X-axis direction by the X-axis drive mechanism 21, the plurality of X-axis slide heat insulating members 3 </ b> A slide in the X-axis direction accordingly, and the processing space in the chamber 3 The upper part is always covered with the X-axis slide heat insulating member 3A.

  Similarly, in the ceiling wall portion of the chamber, as shown in FIGS. 2 and 3, a plurality of Y-axis slide heat insulating members 3B are arranged side by side in the Y-axis direction. The adjacent Y-axis slide heat insulating members 3B are configured to be slidable relative to each other in the Y-axis direction. Thereby, even if the modeling head 10 on the X-axis drive mechanism 21 is moved in the Y-axis direction by the Y-axis drive mechanism 22, the plurality of Y-axis slide heat insulating members 3B slide and move in the Y-axis direction accordingly. The upper part of the processing space in the chamber 3 is always covered with the Y-axis slide heat insulating member 3B.

  In addition, the drive target of the Z-axis drive mechanism 23 in the present embodiment is the bottom wall 3D of the chamber 3 or the stage 4 (or the modeling plate 40). In the present embodiment, the inside of the chamber 3 is shielded from the outside even if the bottom wall 3D or the stage 4 is moved in the Z-axis direction. Specifically, as shown in FIGS. 2 and 3, slide holes 3c that penetrate through the connecting portion between the Z-axis drive mechanism 23 and the bottom wall 3D are formed in the Z-axis direction on both side walls 3C of the chamber 3. It is formed to extend. The slide hole 3c is sealed by a flexible seal member 3d made of a heat insulating material. When the bottom wall portion 3D is moved in the Z-axis direction by the Z-axis drive mechanism 23, the connecting portion between the Z-axis drive mechanism 23 and the bottom wall portion 3D is configured to slide the slide hole 3c while elastically deforming the flexible seal member 3d. Along the Z axis. Therefore, the slide holes 3c formed in the both side walls 3C of the chamber 3 are always covered with the seal member 3d.

  In addition, in this embodiment, nozzle cleaning for cleaning the in-device cooling device 8 for cooling the space inside the 3D modeling apparatus 1 outside the chamber 3 and the injection nozzle 11 of the modeling head 10. A part 9 and the like are provided.

FIG. 4 is a control block diagram of the three-dimensional modeling apparatus 1 of the present embodiment.
In the present embodiment, an X-axis position detection mechanism 24 that detects the position of the modeling head 10 in the X-axis direction is provided. The detection result of the X-axis position detection mechanism 24 is sent to the control unit 100. The control unit 100 controls the X-axis drive mechanism 21 based on the detection result to move the modeling head 10 to the target X-axis direction position.

  In the present embodiment, a Y-axis position detection mechanism 25 that detects the Y-axis direction position of the X-axis drive mechanism 21 (the Y-axis direction position of the modeling head 10) is provided. The detection result of the Y-axis position detection mechanism 25 is sent to the control unit 100. The control unit 100 moves the modeling head 10 on the X-axis drive mechanism 21 to a target position in the Y-axis direction by controlling the Y-axis drive mechanism 22 based on the detection result.

  In the present embodiment, a Z-axis position detection mechanism 26 that detects the position in the Z-axis direction of the modeling plate 40 held on the stage 4 is provided. The detection result of the Z-axis position detection mechanism 26 is sent to the control unit 100. The control unit 100 controls the Z-axis drive mechanism 23 based on the detection result to move the modeling plate 40 on the stage 4 to a target position in the Z-axis direction.

  The control unit 100 controls the movement of the modeling head 10 and the stage 4 in this way, thereby determining the relative three-dimensional position between the modeling head 10 in the chamber 3 and the modeling plate 40 on the stage 4 as a target. It can be located in a three-dimensional position.

FIG. 5 is a flowchart showing the flow of pre-heat treatment and modeling processing in the present embodiment.
In the present embodiment, when the modeling is started by the user's instruction operation or the like, the controller 100 first turns on the energization to the chamber heater 7, the head heating unit 12, and the stage heating unit 5 to operate them ( S1). Further, the control unit 100 controls the Z-axis drive mechanism 23 to raise the stage 4 from a predetermined standby position (for example, the lowest point) by the driving force of the Z-axis drive mechanism 23 (S2). When the stage 4 reaches the preheating position described above (Yes in S3), the driving of the Z-axis drive mechanism 23 is stopped (S4).

  When the temperature of the processing space reaches the target temperature (Yes in S5), the control unit 100 subsequently proceeds to modeling processing. The three-dimensional shape data of the three-dimensional structure to be modeled by the three-dimensional modeling apparatus 1 of the present embodiment is obtained from an external device such as a personal computer connected to the three-dimensional modeling apparatus 1 so that data communication can be performed by wire or wirelessly. Entered. The control unit 100 generates data (slice data for modeling) of a large number of layered structures decomposed in the vertical direction based on the input three-dimensional shape data. The slice data corresponding to each layered structure corresponds to each layered structure formed by the filament ejected from the modeling head 10 of the three-dimensional modeling apparatus 1, and the thickness of the layered structure is three-dimensional. It is appropriately set according to the capability of the modeling apparatus 1.

  In the modeling process, first, the control unit 100 creates a lowermost layered structure on the surface of the modeling plate 40 held on the stage 4 according to the slice data of the lowermost layer (first layer) (S6). Specifically, the control unit 100 controls the X-axis drive mechanism 21 and the Y-axis drive mechanism 22 based on the slice data of the lowermost layer (first layer) to target the tip of the injection nozzle 11 of the modeling head 10. The filament is ejected from the ejection nozzle 11 while sequentially moving to a position (target position on the XY plane). Thereby, the layered structure according to the slice data of the lowest layer (first layer) is formed on the surface of the modeling plate 40 on the stage 4. In addition, although the support material which does not comprise a three-dimensional structure may be created together, description here is abbreviate | omitted.

  Next, the control unit 100 controls the Z-axis drive mechanism 23 to lower the stage 4 by a distance corresponding to one layer of the layered structure, and the modeling plate 40 on the stage 4 is moved to the next layer (first layer). The position is lowered to a position for creating a (two-layer) layered structure and positioned (S8). Thereafter, the control unit 100 controls the X-axis drive mechanism 21 and the Y-axis drive mechanism 22 based on the slice data of the second layer, and sequentially moves the tip of the injection nozzle 11 of the modeling head 10 to the target position. A filament is injected from the injection nozzle 11. Thereby, the layered structure according to the slice data of the second layer is formed on the lowermost layered structure formed on the modeling plate 40 of the stage 4 (S6).

  In this way, the control unit 100 controls the Z-axis drive mechanism 23 and repeats the process of laminating and modeling each layered structure in order from the lower layer while sequentially lowering the stage 4. When the creation of the uppermost layered structure is completed (Yes in S7), a three-dimensional structure according to the input three-dimensional shape data is formed on the modeling plate 40.

  When the modeling process is thus completed, the control unit 100 controls the Z-axis drive mechanism 23 to lower the stage 4 to a predetermined extraction position (the lowest point in the present embodiment) (S9). This take-out position is set at a position where the open / close door 3a provided on the front wall 3E of the chamber 3 is opened and the three-dimensional structure on the stage 4 is easily taken out of the chamber 3.

  Since the processing space in the chamber 3 is still hot immediately after the modeling process is completed, the user cannot immediately open the open / close door 3a and take out the three-dimensional modeled object in the processing space. Therefore, after the temperature in the processing space is lowered to a temperature at which the user can take out, the user opens the door 3a and takes out the three-dimensional structure in the processing space while being fixed to the modeling plate 40. The control unit 100 provides a cooling period in which the open / close door 3a is locked until the temperature in the processing space decreases to a temperature at which it can be taken out. It is preferable to release the locked state.

  Here, when modeling the three-dimensional modeled object with the three-dimensional modeling apparatus 1 of the present embodiment, the softened filament 50 heated by the head heating unit 12 and injected from the injection nozzle 11 is the modeling plate in the chamber 3. 40 is injected onto. The inside of the chamber 3 is heated by the chamber heater 7 or the like, but since the temperature in the chamber 3 is lower than the softening temperature of the filament 50 in the head heating section 12, the softened filament injected onto the modeling plate 40 The temperature of will gradually decrease. Thereby, the filament 50 is fixed to the surface of the modeling plate 40, and the hardness is increased so that the shape as a layered structure can be maintained.

  The filament 50 injected onto the modeling plate 40 causes thermal contraction in the process of gradually decreasing the temperature. Conventionally, as shown in FIG. 6, the modeling plate 40 ′ is composed of a highly rigid member that is not easily deformed. Therefore, the internal stress of the lowermost layered structure fixed to the plate increases due to thermal contraction. . In addition, since the layered structure after the second layer laminated on the lowermost layer also causes thermal shrinkage, the internal stress of the layered structure after the second layer also increases, thereby causing the layered structure of the lowermost layer. The internal stress increases further. The internal stress of the lowermost layered structure that increases in this way causes the lowermost layered structure to warp and peels off the end of the lowermost layered structure from the highly rigid modeling plate 40 '. Generate power.

  When the internal stress of the lowermost layered structure increases so that a peeling force exceeding the fixing force between the lowermost layered structure and the highly rigid modeling plate 40 ′ is generated, as shown in FIG. 6, the lowermost layered structure The object is peeled off from the modeling plate 40 ′. If the lowermost layered structure is peeled off from the modeling plate 40 ′ during the modeling process, the position of the layered structure already formed moves on the modeling plate 40 ′, and a new layer is formed on the layered structure. The relative position with the layered structure shifts and the modeling process cannot be continued properly.

  As a method for suppressing peeling during the modeling process, it is conceivable to increase the adhesion between the lowermost layered structure and the highly rigid modeling plate 40 '. For example, there is a method in which a highly rigid modeling plate 40 ′ is coated with a surface film that improves chemical bonding and mechanical bonding with the layered structure, and the adhesion between the modeling plate 40 ′ and the lowermost layered structure is increased. Can be mentioned. However, since there is a limit to increasing the fixing force, when the peeling power of the lowermost layered structure is large, the problem that the lowermost layered structure peels off from the modeling plate 40 ′ during the modeling process is solved. Difficult to do.

  Here, the case where thermal contraction occurs is described, but the same applies to the case where thermal expansion occurs. For example, due to temperature variation in the chamber 3, the layered structure may thermally expand during the modeling process, and peeling force may occur due to such thermal expansion.

FIG. 7 is a cross-sectional view schematically showing the modeling plate 40 in the present embodiment.
As shown in FIG. 7, the modeling plate 40 of the present embodiment includes a rigid substrate 41 that is a rigid layer and a deformation layer 42 formed on the rigid substrate 41. The deformable layer 42 is a layer that is firmly fixed on the rigid substrate 41 and has a property that can be deformed following the deformation of the lowermost layered structure fixed to the deformable layer 42. The deformable layer 42 of the present embodiment has such characteristics, so that the layered structure formed on the deformable layer 42 of the modeling plate 40 causes thermal contraction and is fixed to the deformable layer 42 to be the lowermost layered structure. Even if the object is deformed so as to warp, the deformation layer 42 is also deformed following the deformation as shown in FIG. As a result, the peeling force generated between the deformable layer 42 and the lowermost layered structure can be kept small, and the lowermost layered structure can be prevented from peeling from the modeling plate 40 during the modeling process. Therefore, the position of the layered structure already formed in the middle of the modeling process does not move on the modeling plate 40 beyond the allowable range, and the modeling process can be performed appropriately.

  Thus, if the deformation layer 42 of the modeling plate 40 is deformed following the deformation of the lowermost layered structure, the lowermost layered structure is deformed during the modeling process, and the tertiary to be modeled. The modeling accuracy of the original model can be lowered. However, if peeling occurs during the modeling process, the advantage of being able to model the three-dimensional model is greater even if the modeling accuracy is low, compared to the fact that it is impossible to model the three-dimensional model.

  Further, even when the deformation layer 42 of the modeling plate 40 is deformed following the deformation of the lowermost layered structure, a deformation resistance force is generated against the deformation when the deformation layer 42 is deformed, and the deformation resistance force is This is a force that suppresses deformation of the lowermost layered structure. Therefore, by adjusting the characteristics (hardness, flexibility, etc.) of the deformable layer 42 so as to generate a deformation resistance that can sufficiently suppress the deformation of the lowermost layered structure, three-dimensional modeling with an acceptable modeling accuracy. An object can be shaped.

  Further, in the present embodiment, the three-dimensional structure that is fixed to the modeling plate 40 is cooled to a temperature that can be taken out in the chamber 3 (for example, near room temperature) after the modeling process is finished, and then from the chamber 3. It is taken out. In this cooling process, the lowermost layered structure of the three-dimensional structure that adheres to the modeling plate 40 causes a larger thermal shrinkage than during the modeling process. Therefore, since a larger peeling force is generated, in the conventional high-rigidity modeling plate 40, the lowermost layered structure is warped in the process of cooling the three-dimensional structure fixed to the modeling plate 40 ′. The lower layered structure is peeled off from the modeling plate 40 ′. When peeling occurs in such a cooling process, an external force that resists deformation due to thermal contraction of the three-dimensional structure does not act at all thereafter, so that the deformation of the three-dimensional structure proceeds and the modeling accuracy deteriorates.

  According to this embodiment, even if the lowermost layered structure is deformed in such a cooling process, the deformable layer 42 of the modeling plate 40 is deformed following the deformation. Also at this time, when the deformation layer 42 is deformed, a deformation resistance force resisting the deformation is generated, and the deformation resistance force is a force for suppressing the deformation of the lowermost layered structure. Therefore, the deformation layer 42 can also prevent the three-dimensional structure from being deformed by thermal contraction during the cooling process after the forming process, and the deterioration of the forming accuracy due to peeling can also be suppressed.

  The deformable layer 42 may be a plastically deformable layer having a small or no restoring force as long as it can be deformed following the deformation of the lowermost layered structure. However, in this embodiment, an elastic layer having a large deformation restoring force is used as the deformation layer 42. With such an elastic layer, the restoring force of deformation acts continuously as a deformation resistance force against the deformation of the lowermost layered structure, so the effect of suppressing the deformation of the lowermost layered structure is high. . Therefore, it becomes possible to model a three-dimensional structure with higher modeling accuracy.

  As the rigid substrate 41 of the modeling plate 40, even if the deformable layer 42 is deformed following the deformation of the lowermost layered structure, it has a hardness that can support the deformable layer 42 without substantially deforming. That's fine. However, in this embodiment, since the modeling plate 40 is exposed to a high temperature in the chamber 3, the rigid substrate 41 preferably has flame resistance and heat resistance.

  Materials for the rigid substrate 41 include styrene resin, phenol resin, acrylic resin, methacrylic resin, urethane resin, melamine resin, polyamide resin, polyester resin, polyether resin, polyvinyl ether resin, polyolefin resin, epoxy resin, ketone resin, silicone Resins such as resin and fluororesin can be used. From the viewpoint of flame retardancy, for example, fluorine resins such as PVDF and ETFE, polyimide resin or polyamideimide resin are preferable, and polyimide resin or polyamideimide resin is particularly preferable from the viewpoint of mechanical strength (high elasticity) and heat resistance. Is preferred.

  The material of the rigid substrate 41 is more preferably a metal material than a resin material from the viewpoint of thermal conductivity and mechanical strength. Even in the case of using a metal material, any material can be used as long as it has hardness and heat resistance that can support the deformable layer 42 without substantially deforming, and is highly versatile, such as iron, aluminum, stainless steel, true casting. Titanium, steel, copper and the like can be used, but stainless steel and aluminum are preferable from the viewpoints of cost, mechanical strength, thermal conductivity, and surface workability.

  Further, the surface of the rigid substrate 41 of the modeling plate 40 may be roughened by roughening or the like to increase the contact area or improve the adhesion between the rigid substrate 41 and the deformation layer 42 due to the anchor effect. Good. Examples of the method for forming such irregularities include known roughening treatments such as plating, surface coating, plasma treatment, surface modification, and formation of a primer layer. Sand blasting, shot blasting, plating, polishing, etc. may be used.

Moreover, as a material of the deformation layer 42, materials such as general-purpose resins, elastomers, and rubbers can be used, but elastomer materials and rubber materials are preferably used.
Examples of the elastomer material include thermoplastic elastomers such as polyester, polyamide, polyether, polyurethane, polyolefin, polystyrene, polyacryl, polydiene, silicone-modified polycarbonate, and fluorine copolymer. . Examples of thermosetting include polyurethane, silicone-modified epoxy, and silicone-modified acrylic.
Examples of the rubber material include isoprene rubber, styrene rubber, butadiene rubber, nitrile rubber, ethylene propylene rubber, butyl rubber, silicone rubber, chloroprene rubber, acrylic rubber, chlorosulfonated polyethylene, fluorine rubber, urethane rubber, and hydrin rubber. .
Of these various elastomers and rubbers, a material that can obtain the desired characteristics as the above-described deformation layer 42 is appropriately selected. In the present embodiment, the flexibility of the deformation layer 42 (deformation followability of the layered structure) is selected. And acrylic rubber is preferable as the material of the deformable layer 42 from the viewpoint of adhesion to the rigid substrate 41 formed of a metal material.

  In the present embodiment, since the modeling plate 40 is exposed to a high temperature in the chamber 3, the deformable layer 42 is a material that can obtain desired characteristics as the deformable layer 42 described above under such a high temperature environment. It is desirable to select. From this viewpoint, the material of the deformable layer 42 is preferably silicone rubber, fluorine rubber, or the like, and more preferably silicone rubber from the viewpoint of flame retardancy.

  The hardness of the deformed layer 42 to be laminated affects the modeling quality. Specifically, if the hardness is too high, it will be difficult to deform and inferior in followability, whereas if the hardness is too low, the deformation of the three-dimensional structure will be allowed and the modeling quality will deteriorate. . Examples of a method for measuring the hardness of the deformable layer 42 include a method of measuring a microhardness such as Martens hardness and Vickers hardness. In this method, only the shallow region in the bulk direction of the measurement site, that is, the hardness in the vicinity of the surface is measured, so it is difficult to evaluate the deformation performance of the entire deformation layer 42. Therefore, it is preferable to use a method of measuring the micro rubber hardness that can evaluate the deformation performance of the entire deformation layer 42. The micro rubber hardness can be measured using a commercially available micro rubber hardness meter. Specifically, it can be measured using, for example, “Micro Rubber Hardness Meter MD-1” manufactured by Kobunshi Keiki Co., Ltd. The micro rubber hardness of the deformation layer 42 is preferably 10 or more and 50 or less, and more preferably 15 or more and 40 or less in an environment of 23 ° C. and 50% RH.

  The modeling plate 40 of the present embodiment has a two-layer structure of the rigid substrate 41 and the deformable layer 42, but a layer that makes it impossible to deform the deformable layer 42 following the deformation of the lowermost layered structure. Otherwise, other necessary layers may be added.

  Moreover, in this embodiment, the structure which hold | maintains the modeling plate 40 taken out from the chamber 3 with a three-dimensional structure after a modeling process on the stage 4, and shape | molds a three-dimensional structure on the modeling plate 40 was demonstrated. However, the three-dimensional structure may be formed directly on the stage 4 without using the modeling plate 40. In this case, by providing a deformation layer similar to the deformation layer 42 of the modeling plate 40 on the surface portion of the stage 4, similarly, the layered structure formed on the deformation layer of the stage 4 is deformed by causing thermal contraction. However, the deformation layer of the stage 4 is also deformed following the deformation. Thereby, the position of the layered structure already formed during the modeling process does not move on the modeling plate 40 beyond the allowable range, and the modeling process can be appropriately performed. Also in this case, the deformation resistance that resists the deformation that occurs when the deformation layer on the stage 4 is deformed becomes the force that suppresses the deformation of the lowermost layered structure, and the deterioration of the modeling accuracy can be suppressed.

[Modification]
Next, a modification of the above-described embodiment will be described.
In the embodiment described above, if the fixing force between the deformation layer 42 of the modeling plate 40 and the three-dimensional structure is further increased, the flexibility of the deformation layer 42 is reduced (hardness is increased), and the deformation layer 42 is deformed. Higher modeling accuracy can be realized by increasing the deformation resistance force to be generated. However, after the three-dimensional structure that is fixed to the modeling plate 40 is cooled, it may be necessary to separate the modeling plate 40 from the three-dimensional structure. If the fixing force between the deformation layer 42 of the modeling plate 40 and the three-dimensional structure is simply increased, the separability when the modeling plate 40 is separated from the three-dimensional structure is deteriorated. Therefore, in the cooling process during or after the modeling process that requires high adhesion between the deformable layer 42 of the modeling plate 40 and the three-dimensional modeled object, the modeling plate 40 (deformed layer 42) and the three-dimensional modeled object A structure that can secure the separability between the modeling plate 40 (deformable layer 42) and the three-dimensional modeled object after the cooling process is desired while securing the fixing property.

FIG. 9 is an explanatory diagram showing the configuration of the stage 4 in this modification.
As shown in FIG. 9, the stage 4 includes an upper plate 46 and a lower plate 47. FIG. 9A is an explanatory view showing a state in which the upper plate 46 and the lower plate 47 are overlapped, and FIG. 9B is an explanatory view showing a state in which the upper plate 46 and the lower plate 47 are separated. .
In this modified example, without using the modeling plate 40 of the above-described embodiment, a deformation layer similar to the deformation layer 42 provided on the modeling plate 40 is provided on the surface portion of the stage 4, and the stage 4 A three-dimensional structure is formed on the surface. In this modification, a three-dimensional structure may be formed on the modeling plate 40.

  The upper plate 46 is a plate-like member provided with a plurality of through holes 46a, and the upper surface portion of the upper plate 46 can be deformed following the deformation of the lowermost layered structure formed on the upper plate 46. It is composed of the layer 46b. The lower plate 47 protrudes so as to pass through the through hole 46a, and a plate-shaped member in which a protrusion-forming member 47b having a plurality of protrusions 47a whose protrusion amount with respect to the upper plate 46 can be changed is fixed to the upper surface of the protrusion support 47c. It is a member.

  The Z-axis drive mechanism 23 of this modification includes an upper plate drive mechanism 23a that moves the upper plate 46 in the vertical direction and a lower plate drive mechanism 23b that moves the lower plate 47 in the vertical direction. As shown in FIG. 9A, when the upper plate 46 and the lower plate 47 are overlapped, the same drive is input to the upper plate drive mechanism 23a and the lower plate drive mechanism 23b, so that the upper plate 46 and the lower plate 47 can be moved up and down integrally. In the state shown in FIG. 9A, the convex portion 47 a of the convex portion forming member 47 b passes through the through hole 46 a, and the tip of the convex portion 47 a protrudes above the upper surface of the upper plate 46.

  When only the lower plate driving mechanism 23b is driven from the state shown in FIG. 9A and the lower plate 47 is moved downward, the lower plate 47 is separated from the upper plate 46 as shown in FIG. 9B. Thus, by inputting different driving to the lower plate driving mechanism 23b and the upper plate driving mechanism 23a, the relative positions of the upper plate 46 and the lower plate 47 change. Thereby, the protrusion amount with respect to the upper plate 46 of the convex part 47a of the convex part formation member 47b with which the lower plate 47 is provided can be changed.

  In the three-dimensional modeling apparatus of this modification, the upper plate 46 and the lower plate 47 are overlapped at the time of the modeling process, and the upper plate 46 and the upper plate 46 are protruded upward from the upper surface of the upper plate 46. The lower plate 47 is integrally moved in the vertical direction. Further, after the modeling process, the upper plate 46 and the lower plate 47 are separated as shown in FIG. 9B before the three-dimensional modeled object is taken out from the chamber 3. Thereby, both the fixing property at the time of the modeling process of the stage 4 and the three-dimensional structure or the cooling process and the separability after the cooling process are compatible.

  At the time of the modeling process, the portion protruding above the upper surface of the upper plate 46 in the convex portion 47a and the bottom surface portion of the three-dimensional modeled object can be locally fitted, and the modeled object from the stage 4 can be fitted. An anchor effect for preventing peeling can be obtained. Thereby, the adhesiveness at the time of a modeling process can be improved. Further, the three-dimensional structure is formed so that the convex portion 47a is stuck in the bottom surface portion of the three-dimensional structure, whereby the surface of the convex portion 47a and the three-dimensional structure are fixed, and the three-dimensional structure and the stage 4 are fixed. The fixing area with the side increases. Furthermore, when the modeling material enters and cures in the through holes 46a of the upper plate 46 or the gaps between the through holes 46a and the convex portions 47a, the fixing area between the three-dimensional structure and the stage 4 increases. Thus, the fixation at the time of modeling processing is improved by the increase in the fixation area and the anchor effect.

  After the modeling process is completed and cooled to a temperature that can be taken out from the chamber 3, the upper plate 46 and the lower plate 47 are relatively moved in the vertical direction, and the vertical direction (Z axis) Direction), the three-dimensional structure is separated from the upper plate 46 and the lower plate 47 constituting the stage 4. Specifically, by moving the lower plate 47 downward relative to the upper plate 46, the three-dimensional structure is pulled downward by the fixing surface with the convex portion 47a, but the bottom surface of the three-dimensional structure is the upper part. It is in contact with the upper surface of the plate 46. For this reason, the three-dimensional structure cannot follow the convex portion 47a, and the fixing surface between the three-dimensional structure and the convex portion 47a is peeled off. Thereby, a three-dimensional structure and the lower plate 47 can be easily separated.

  In this state, the upper plate 46 and the three-dimensional structure are in a fixed state, but since the contact at the corresponding portion of the convex portion 47a is lost, the fixing force is higher than that in the state before the cooling process. It is greatly reduced and separability is ensured. Moreover, in this state, the fixing force is low compared to the state where the entire bottom surface of the three-dimensional structure and the surface of the stage 4 are in contact with each other. Secured.

  Alternatively, the lower plate 47 may be moved upward relative to the upper plate 46 at the timing before or after the lower plate 47 is moved downward relative to the upper plate 46 than during the modeling process. By this movement, the three-dimensional structure is pushed upward by the convex portion 47a, and the fixing surface between the three-dimensional structure and the upper plate 46 is peeled off. After the cooling process, after the fixing surface between the three-dimensional structure and the upper plate 46 is peeled off in this way, the three-dimensional structure and the lower plate 47 are separated, and the three-dimensional structure and the stage 4 are fixed. There is no surface and high separation is obtained.

What was demonstrated above is an example, and there exists an effect peculiar for every following aspect.
(Aspect A)
Laminating a layered structure that cools and solidifies the modeling material such as the heated filament 50 on the surface of the mounting table such as the stage 4 or on the mounting plate such as the modeling plate 40 held on the mounting table, In the three-dimensional modeling apparatus 1 for modeling a three-dimensional modeled object, the surface portion of the mounting table or the mounting plate has deformable layers 42 and 46b that can be deformed following the deformation of the layered structure. And
According to this aspect, even if the formed layered structure causes thermal expansion or contraction during the modeling process, the deformation provided on the surface portion of the mounting table or the mounting plate to which the layered structure is fixed. The layer deforms following the deformation of the layered structure due to thermal expansion or contraction. Therefore, even if the layered structure is deformed due to thermal expansion or contraction, the peeling force generated between the layered structure and the surface of the mounting table or the plate surface of the mounting plate can be suppressed to a small level. It can suppress that a structure peels from a mounting base or a mounting board.

(Aspect B)
In the aspect A, the deformation layer is an elastic layer that exhibits a restoring force against the deformation.
According to this, since the restoring force of deformation acts continuously as a deformation resistance force against the deformation of the layered structure, a high effect of suppressing the deformation of the layered structure can be obtained. Thereby, it becomes possible to model a three-dimensional modeled object with higher modeling accuracy.

(Aspect C)
In the aspect B, the elastic layer is formed of acrylic rubber.
According to this, the high effect which suppresses a deformation | transformation of a layered structure is acquired. In addition, when the deformation layer is formed on a metal material by bonding, it is easy to obtain a high adhesive force with the metal material.

(Aspect D)
In the aspect B, the elastic layer is formed of silicone rubber.
According to this, the high effect which suppresses a deformation | transformation of a layered structure is acquired. Moreover, an elastic layer having high heat resistance can be obtained.

(Aspect E)
In any one of the aspects A to D, the surface layer of the mounting table or the mounting plate holds the deformation layer on the side opposite to the side on which the layered structure is laminated, Is characterized by having a rigid layer which is not easily deformed.
According to this, the high effect which suppresses a deformation | transformation of a layered structure is acquired, and the three-dimensional structure with higher modeling precision can be modeled.

(Aspect F)
In the aspect E, the rigid layer is made of metal.
According to this, high rigidity required for the rigid layer can be easily obtained, and a rigid layer having high durability can be obtained.

(Aspect G)
In any one of the aspects A to F, a processing space in which the modeling material discharging unit such as the modeling head 10 that discharges the modeling material such as a heated filament, the mounting table, and the modeling material discharging unit are arranged. The layered structure is formed while relatively moving the chamber 3 provided therein, the processing space heating means such as the chamber heater 7 for heating the processing space in the chamber, and the mounting table and the modeling material discharging unit. And a modeling control means such as a control unit 100 for controlling the operation of stacking.
According to this, it is possible to suppress the layered structure from being peeled off from the mounting table or the mounting plate even by the hot melt lamination method (FDM) in which the formed layered structure is likely to cause thermal expansion or thermal contraction.

(Aspect H)
A layered structure that cools and solidifies a modeling material such as a heated filament is stacked on a modeling object mounting plate such as a modeling plate 40 held on a mounting table such as the stage 4, and a three-dimensional modeling object is obtained. It is a modeling object mounting plate of the three-dimensional modeling apparatus 1 to model, and has a deformation layer 42 that can be deformed following the deformation of the layered structure.
According to this aspect, even if the layered structure already formed causes thermal expansion or contraction during the modeling process, the deformation layer provided on the model mounting plate to which the layered structure is fixed is heated. Deforms following the deformation of the layered structure due to expansion or thermal contraction. Therefore, even if the layered structure is deformed due to thermal expansion or contraction, the peeling force generated between the layered structure and the plate surface of the model mounting plate can be suppressed to a small level. It can suppress that it peels from a molded article mounting board.

DESCRIPTION OF SYMBOLS 1 3D modeling apparatus 3 Chamber 4 Stage 10 Modeling head 11 Injection nozzle 12 Head heating part 40 Modeling plate 41 Rigid board 42, 46b Deformable layer 46 Upper plate 46a Through hole 47 Lower plate 47a Convex part 50 Filament 100 Control part

Japanese Patent No. 399933

Claims (8)

In the three-dimensional modeling apparatus that forms a three-dimensional structure by laminating a layered structure that cools and solidifies the heated modeling material on the surface of the mounting table or on the mounting plate held by the mounting table,
The surface portion of the mounting table or the mounting plate has a deformable layer that can be deformed following the deformation of the layered structure. The three-dimensional modeling apparatus according to claim 1,
The three-dimensional modeling apparatus, wherein the deformation layer is an elastic layer that exhibits a restoring force against the deformation. The three-dimensional modeling apparatus according to claim 2,
The three-dimensional modeling apparatus, wherein the elastic layer is made of acrylic rubber. The three-dimensional modeling apparatus according to claim 2,
The three-dimensional modeling apparatus, wherein the elastic layer is made of silicone rubber. In the three-dimensional modeling apparatus according to any one of claims 1 to 4,
The surface layer of the mounting table or the mounting plate described above is characterized in that the deformation layer is held on the side opposite to the side on which the layered structure is laminated and has a rigid layer that is more difficult to deform than the deformation layer. 3D modeling device. The three-dimensional modeling apparatus according to claim 5,
The three-dimensional modeling apparatus, wherein the rigid layer is made of metal. The three-dimensional modeling apparatus according to any one of claims 1 to 6,
A modeling material discharge unit for discharging the heated modeling material;
A chamber provided therein with a processing space in which the mounting table and the modeling material discharge unit are disposed;
Processing space heating means for heating the processing space in the chamber;
A three-dimensional modeling apparatus comprising: a modeling control unit that controls an operation of forming and laminating the layered structure while relatively moving the mounting table and the modeling material discharging unit. A modeling object mounting plate of a three-dimensional modeling apparatus that forms a three-dimensional modeling object by stacking a layered structure that cools and solidifies the heated modeling material on the modeling object mounting plate held by the mounting table. Because
A shaped article placing plate having a deformable layer that can be deformed following the deformation of the layered structure.

Images