JP6794456B2 - 電気流体力学的制御装置 - Google Patents
電気流体力学的制御装置 Download PDFInfo
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
- F04B19/006—Micropumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/16—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying an electrostatic field to the body of the heat-exchange medium
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B17/00—Pumps characterised by combination with, or adaptation to, specific driving engines or motors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B33/00—Pumps actuated by muscle power, e.g. for inflating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
- F04B37/10—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B39/00—Component parts, details, or accessories, of pumps or pumping systems specially adapted for elastic fluids, not otherwise provided for in, or of interest apart from, groups F04B25/00 - F04B37/00
- F04B39/06—Cooling; Heating; Prevention of freezing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/04—Pumps having electric drive
- F04B43/043—Micropumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J41/00—Discharge tubes for measuring pressure of introduced gas or for detecting presence of gas; Discharge tubes for evacuation by diffusion of ions
- H01J41/12—Discharge tubes for evacuating by diffusion of ions, e.g. ion pumps, getter ion pumps
- H01J41/18—Discharge tubes for evacuating by diffusion of ions, e.g. ion pumps, getter ion pumps with ionisation by means of cold cathodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B17/00—Pumps characterised by combination with, or adaptation to, specific driving engines or motors
- F04B17/03—Pumps characterised by combination with, or adaptation to, specific driving engines or motors driven by electric motors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
- F04B49/06—Control using electricity
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K44/00—Machines in which the dynamo-electric interaction between a plasma or flow of conductive liquid or of fluid-borne conductive or magnetic particles and a coil system or magnetic field converts energy of mass flow into electrical energy or vice versa
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K44/00—Machines in which the dynamo-electric interaction between a plasma or flow of conductive liquid or of fluid-borne conductive or magnetic particles and a coil system or magnetic field converts energy of mass flow into electrical energy or vice versa
- H02K44/02—Electrodynamic pumps
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
Claims (13)
- 循環液体を搬送するように適合された密閉通路(200)と、
前記密閉通路内に配置された流れユニット(100)と、
を備える流体装置(1)であって、
前記流れユニットは、
第1電極(110)と、
前記循環液体の流れの下流方向に前記第1電極から偏位された第2電極(120)であって、前記第1電極と前記第2電極は電圧源に接続可能である、第2電極とを備え、
前記第1電極は、グリッド構造として形成され、かつ前記循環液体が前記第1電極を通って流れることができるように配置され、
前記密閉通路の少なくとも一部は、前記循環液体と前記流体装置の周囲との間で熱を伝達できるように、熱接続を提供するように構成され、
前記密閉通路(200)は、前記循環液体が循環する閉ループを画定する、
流体装置(1)。 - 前記第1電極は、前記グリッド構造を形成する複数のブリッジ(111)および複数のジョイント(112)を備え、
前記複数のブリッジのうちの少なくとも1つの少なくとも一部は、前記流れの方向に平行な方向の最大高さ(h1)と、前記流れの方向に垂直な方向の最大ゲージ(w1)とを有し、
前記最大高さは、前記最大ゲージよりも大きい、
請求項1に記載の流体装置。 - 前記流れユニットは、前記密閉通路の断面の少なくとも一部を覆うように配置されている、請求項1または2に記載の流体装置。
- 前記流れユニットは、前記密閉通路の断面全体を覆うように配置されている、請求項1または2に記載の流体装置。
- 共通の横方向平面内に横方向に拡がるように配置された複数の流れユニットの配列(10)を含み、前記循環液体が前記複数の流れユニットのうちの第1および第2の流れユニットを通過することができるように、前記流れユニットのうちの前記第1の流れユニットの下流側が、前記流れユニットのうちの前記第2の流れユニットの上流側と流体連通している、請求項1から4のいずれか一項に記載の流体装置。
- 前記密閉通路は、熱交換器(H、C)に熱的に接続されるように適合されている、請求項1から5のいずれか一項に記載の流体装置。
- 前記熱交換器は、ヒートシンクまたは熱源である、請求項6に記載の流体装置。
- 前記密閉通路は、第2の室(220)と流体連通する第1の室(210)で形成されており、前記流れユニットは、前記第1の室および前記第2の室のうちの1つに配置されている、請求項1から7のいずれか一項に記載の流体装置。
- 前記密閉通路の少なくとも一部は、管(200)として形成されている、請求項1から8のいずれか一項に記載の流体装置。
- 前記第2電極は、グリッド構造として形成されている、請求項1から9のいずれか一項に記載の流体装置。
- 前記第1電極および前記第2電極のうちの少なくとも1つは、それぞれ、前記第1電極または前記第2電極における熱による変形を吸収するために配置された懸架(125)構造を有する、請求項1から10のいずれか一項に記載の流体装置。
- 前記流体装置内の前記液体の流れを誘起するように前記流れユニットを活動化し、
前記流体装置内の前記液体の流れを妨げるように前記流体装置を非活動化する、
ステップを含む請求項1から11のいずれか一項に記載の流体装置における方法。 - 前記流れユニットを活動化するステップは、前記第1電極と前記第2電極との間に電圧差を印加することを含む、請求項12に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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SE1650061-3 | 2016-01-20 | ||
SE1650061A SE540921C2 (en) | 2016-01-20 | 2016-01-20 | Electrohydrodynamic control device |
PCT/SE2017/050059 WO2017127017A1 (en) | 2016-01-20 | 2017-01-20 | Electrohydrodynamic control device |
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JP2019506123A JP2019506123A (ja) | 2019-02-28 |
JP6794456B2 true JP6794456B2 (ja) | 2020-12-02 |
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US (1) | US11708824B2 (ja) |
EP (1) | EP3405976B1 (ja) |
JP (1) | JP6794456B2 (ja) |
CN (1) | CN108475667B (ja) |
ES (1) | ES2881339T3 (ja) |
SE (1) | SE540921C2 (ja) |
WO (1) | WO2017127017A1 (ja) |
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SE543734C2 (en) * | 2019-03-11 | 2021-07-06 | Apr Tech Ab | Cooling of electronic components with an electrohydrodynamic flow unit |
SE544435C2 (en) * | 2019-11-08 | 2022-05-24 | Apr Tech Ab | Electrohydrodynamics system and method |
JP7447722B2 (ja) * | 2020-07-22 | 2024-03-12 | 三浦工業株式会社 | 電気流体力学ポンプ |
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JP2014212625A (ja) * | 2013-04-18 | 2014-11-13 | 株式会社デンソー | Ehdポンプ |
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SE537790C2 (sv) * | 2013-12-04 | 2015-10-20 | Apr Technologies Ab | Elektrohydrodynamisk mikropumpsanordning samt förfarande förtillverkning av anordningen |
SE541352C2 (en) | 2015-06-03 | 2019-08-13 | Apr Tech Ab | Microfluidic array |
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EP3405976A1 (en) | 2018-11-28 |
SE1650061A1 (en) | 2017-07-21 |
JP2019506123A (ja) | 2019-02-28 |
CN108475667A (zh) | 2018-08-31 |
WO2017127017A1 (en) | 2017-07-27 |
SE540921C2 (en) | 2018-12-27 |
EP3405976A4 (en) | 2019-08-28 |
ES2881339T3 (es) | 2021-11-29 |
CN108475667B (zh) | 2021-12-21 |
US11708824B2 (en) | 2023-07-25 |
EP3405976B1 (en) | 2021-05-05 |
US20210082786A1 (en) | 2021-03-18 |
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