JP6793064B2 - Surface mounter and setting program - Google Patents

Description

The techniques disclosed herein relate to surface mounters and setting programs.

Conventionally, in a surface mounter that mounts a component on a substrate having a reference mark and a component positioning mark, it is known that the angle error of the substrate is determined by using the reference mark (see, for example, Patent Document 1).
Specifically, in the electronic component mounting device described in Patent Document 1, first and second recognition marks (corresponding to reference marks) are arranged around a circuit board, and a third electronic component mounting position is located near the mounting position of the electronic component. The recognition mark (corresponding to the component positioning mark) is placed, the first recognition mark and the second recognition mark are recognized, the inclination error (corresponding to the angle error) of the circuit board is calculated, and the third recognition mark is displayed. The electronic components are mounted by correcting the tilt error during positioning based on the position.

Japanese Unexamined Patent Publication No. 5-633390

By the way, there are cases where the angle error of the substrate can be judged more accurately by using the component positioning mark than by using the reference mark. However, since the electronic component mounting device described in Patent Document 1 always determines the angle error of the substrate by using the reference mark, there is a possibility that the determination accuracy of the angle error may decrease in such a case.

On the other hand, conventionally, a surface mounter (hereinafter referred to as the surface mounter) is also known in which an operator can specify a mark used for determining a position error and an angle error of a substrate among a reference mark and a component positioning mark. In the surface mounter, if the component positioning mark can be used to determine the angle error of the substrate more accurately, the angle error can be determined more accurately by designating the component positioning mark.
However, according to the surface mounter, when the reference mark can be used to judge the angle error of the board more accurately, if the reference mark is specified to judge the angle error of the board more accurately, the position error of the board is also increased. Since the judgment is made using the reference mark, there is a concern that the judgment accuracy of the position error may be lowered.

That is, conventionally, there have been cases where it is not possible to accurately determine the position error of the substrate and accurately determine the angle error of the substrate.
In the present specification, both the position error and the angle error of the substrate are accurate even when it is not possible to accurately judge the position error of the substrate and the angle error of the substrate. We will disclose a technology that can make a good judgment and thus improve the mounting accuracy of parts.

The surface mounter disclosed in the present specification has two component positioning marks attached in the vicinity of the component mounting position and two reference marks attached at intervals wider than the interval between the two component positioning marks. A surface mounter that mounts the component on at least the substrate, and recognizes the positioning unit for positioning the substrate, the position of the reference mark on the substrate positioned by the positioning unit, and the position of the component positioning mark. A recognition unit and a control unit are provided, and the control unit includes a mark used for determining a position error of the substrate and a mark used for determining an angle error of the substrate among the reference mark and the component positioning mark. A setting process that is set separately, a position error determination process that determines the position error of the substrate based on the position recognized by the recognition unit of the mark set as a mark used for determining the position error of the substrate, and a position error determination process. The angle error determination process of determining the angle error of the substrate based on the position recognized by the recognition unit of the mark set as the mark used for determining the angle error of the substrate is executed.

According to the above-mentioned surface mounting machine, the mark used for judging the position error of the board and the mark used for judging the angle error of the board can be set separately. Therefore, conventionally, the position error of the board can be judged accurately and the board can be judged. Even when it is not possible to accurately determine the angle error, both the position error and the angle error of the substrate can be accurately determined, and thus the mounting accuracy of the component can be improved.

Further, the control unit includes a designated reception unit that receives the designation of the mark used for determining the angle error of the substrate among the reference mark and the component positioning mark, and the control unit is designated by the designated reception unit in the setting process. The mark may be set as a mark used for determining the angle error of the substrate.

According to the above surface mounter, the operator can specify a mark used for determining the angle error of the substrate.

Further, in the setting process, the control unit compares the mark-to-mark distance of the two component positioning marks with the reference distance, and when the mark-to-mark distance is wider than the reference distance, the component positioning mark is placed on the substrate. It may be set as a mark used for determining the angle error, and if it is narrower than the reference distance, the reference mark may be set as a mark used for determining the angle error of the substrate.

According to the above surface mounter, an appropriate mark can be automatically set by setting an appropriate reference distance in advance.

In addition, a setting reception unit that accepts the setting of the reference distance may be provided.

The appropriate reference distance may vary from part to part. According to the above surface mounter, an appropriate reference distance can be set according to the component.

Further, the control unit may automatically set the reference distance using the following formula 1.
Reference distance = required position accuracy / sin (required angle accuracy) ・ ・ ・ Equation 1
According to the above surface mounter, an appropriate reference distance can be set regardless of the experience of the operator.

Further, the setting program disclosed in the present specification includes two component positioning marks attached in the vicinity of the component mounting position and two reference marks attached at intervals wider than the interval between the two component positioning marks. This is a setting program for setting a mark used for determining the position error and the angle error of the substrate having at least the above on the surface mounter, and is a mark used for determining the position error of the substrate among the reference mark and the component positioning mark. The computer is made to execute the setting process of separately setting the mark information representing the mark and the mark information representing the mark used for determining the angle error of the substrate, and the output process of outputting the mark information.

According to the above setting program, the mark used to judge the position error of the board and the mark used to judge the angle error of the board can be set separately. Therefore, conventionally, the position error of the board can be judged accurately and the angle of the board can be determined. Even if it is not possible to determine the error accurately, both the position error and the angle error of the substrate can be accurately determined, and the mounting accuracy of the component can be improved.

Top view of the surface mounter according to the first embodiment Side view of the head unit and head transport unit as viewed from the front side Schematic diagram of the positioning unit viewed from the left side Block diagram showing the electrical configuration of the surface mounter Schematic diagram showing an example of a substrate Schematic diagram showing the parts information table Schematic diagram for explaining the correction of mounting coordinates and mounting angle Schematic diagram showing the parts information table according to the second embodiment Schematic diagram showing an example of a substrate Schematic diagram for explaining the required position accuracy and the required angle accuracy according to the third embodiment. Schematic diagram showing examples of required position accuracy, required angle accuracy, and reference distance

<Embodiment 1>
The first embodiment will be described with reference to FIGS. 1 to 7. In the following description, the left-right direction shown in FIG. 1 is referred to as an X-axis direction, the front-back direction is referred to as a Y-axis direction, and the up-down direction shown in FIG. 2 is referred to as a Z-axis direction. Further, in the following description, the right side shown in FIG. 1 is referred to as an upstream side, and the left side is referred to as a downstream side. Further, in the following description, the reference numerals of the drawings may be omitted for the same constituent members except for a part.

(1) Overall Configuration of Surface Mounter The overall configuration of the surface mounter 1 according to the first embodiment will be described with reference to FIGS. 1 to 4. The surface mounter 1 mounts a component E (see FIG. 1) on a printed circuit board P (see FIG. 5, an example of a substrate), and has a base 10, a conveyor 11, and four component supply devices 12 shown in FIG. , Head unit 13, head transport unit 14, board recognition camera 15 (an example of recognition unit), component recognition camera 26, positioning unit 16 shown in FIG. 3, control unit 51 shown in FIG. 4, operation unit 52, and the like. ..

As shown in FIG. 1, the base 10 has a rectangular shape in a plan view and a flat upper surface. The rectangular frame A shown by the alternate long and short dash line in FIG. 1 indicates the working position when the component E is mounted on the printed circuit board P.
The conveyor 11 carries the printed circuit board P from the upstream side in the X-axis direction to the working position A, and carries out the printed circuit board P on which the component E is mounted at the working position A to the downstream side. The conveyor 11 includes a pair of conveyor belts 11A and 11B that circulate and drive in the X-axis direction, a conveyor drive motor 63 that drives the conveyor belts 11A and 11B (see FIG. 4), and the like. The rear conveyor belt 11A can be moved in the front-rear direction, and the distance between the two conveyor belts 11A and 11B can be adjusted according to the width of the printed circuit board P.

The parts supply device 12 is arranged at two locations along the X-axis direction on both sides of the conveyor 11 in the Y-axis direction, for a total of four locations. A plurality of feeders 17 are attached to these component supply devices 12 so as to be arranged side by side in the X-axis direction.
Each feeder 17 is a so-called tape feeder, and is a reel (not shown) on which a component tape (not shown) containing a plurality of parts E is wound, and an electric sending device (not shown) that pulls out the component tape from the reel. (Fig.) Etc. are provided, and parts E are supplied one by one from a part supply position provided at an end on the transfer conveyor 11 side.
Although the component supply device 12 for supplying the component E using the tape feeder will be described here as an example, the component supply device 12 may supply a tray or a semiconductor wafer on which the component E is placed. Good.

The head unit 13 supports a plurality of (here, five) mounting heads 18 so as to be able to move up and down and rotatably around an axis. The head unit 13 according to this embodiment is a so-called in-line type, and a plurality of mounting heads 18 are arranged side by side in the X-axis direction. Further, the head unit 13 includes a Z-axis servomotor 61 (see FIG. 4) that raises and lowers these mounting heads 18 individually, and an R-axis servomotor 62 (see FIG. 4) that simultaneously rotates these mounting heads 18 around an axis. ) Etc. are provided.

As shown in FIG. 2, each mounting head 18 has a nozzle shaft 19 and a suction nozzle 20 detachably attached to the lower end of the nozzle shaft 19. Negative pressure and positive pressure are supplied to the suction nozzle 20 from an external air supply device via the nozzle shaft 19. The suction nozzle 20 sucks the component E when a negative pressure is supplied, and releases the component E when a positive pressure is supplied.
Although the in-line type head unit 13 has been described here as an example, the head unit 13 may be, for example, a so-called rotary head in which a plurality of mounting heads 18 are arranged on the circumference.

The head transport unit 14 shown in FIG. 1 transports the head unit 13 in the X-axis direction and the Y-axis direction within a predetermined movable range. The head transport unit 14 includes a beam 21 that supports the head unit 13 so as to be reciprocally movable in the X-axis direction, a pair of Y-axis guide rails 22 that support the beam 21 so that it can be reciprocated in the Y-axis direction, and a head unit 13. The X-axis servomotor 59 reciprocates in the X-axis direction, the Y-axis servomotor 60 reciprocates the beam 21 in the Y-axis direction, and the like.

The board recognition camera 15 is for recognizing the positions of the reference mark K (see FIG. 5) and the component positioning mark B (see FIG. 5) provided on the printed circuit board P and recognizing their positions. The head unit 13 is provided in a downward posture.

The two component recognition cameras 26 capture the component E adsorbed on the suction nozzle 20 from below. The image captured by the component recognition camera 26 is used for recognizing the position of the component E and the rotation angle of the component E around the vertical line.

As shown in FIG. 3, the positioning unit 16 has a backup mechanism 23 and two regulating units 24 extending in the left-right direction (vertical direction on the paper surface in FIG. 3) above the conveyor belts 11A and 11B. .. The backup mechanism 23 is provided so as to be able to move up and down, and a plurality of backup pins 25 are provided in a posture of projecting upward. When the backup mechanism 23 is raised, the printed circuit board P is lifted by the backup pin 25, and is sandwiched between the backup pin 25 and the regulating portion 24 for positioning.

(2) Electrical Configuration of Surface Mount Machine As shown in FIG. 4, the surface mount machine 1 includes a control unit 51 and an operation unit 52. The control unit 51 includes an arithmetic processing unit 53, a motor control unit 54, a storage unit 55, an image processing unit 56, an external input / output unit 57, a feeder communication unit 58, and the like.

The arithmetic processing unit 53 includes a CPU, ROM, RAM, and the like, and controls each unit of the surface mounter 1 by executing a control program stored in the ROM.
The motor control unit 54 rotates each motor such as the X-axis servo motor 59, the Y-axis servo motor 60, the Z-axis servo motor 61, the R-axis servo motor 62, and the conveyor drive motor 63 under the control of the arithmetic processing unit 53.

Various types of data are stored in the storage unit 55. Various data includes information on the number and types of printed circuit boards P to be produced, information including the number and types of parts E mounted on the printed circuit board P, and parts E held in the parts supply device 12. Information on the number and types of the components, a component information table 80 (see FIG. 6) described later, and the like are included.

The image processing unit 56 is configured to capture image signals output from the board recognition camera 15 and the component recognition camera 26, and generates a digital image based on the output image signals.
The external input / output unit 57 is a so-called interface, and is configured to capture detection signals output from various sensors 64 provided in the main body of the surface mounter 1. Further, the external input / output unit 57 is configured to perform operation control on various actuators 65 based on a control signal output from the arithmetic processing unit 53.

The feeder communication unit 58 is connected to the feeder 17, and controls the feeder 17 in an integrated manner.
The operation unit 52 includes a display device such as a liquid crystal display and an input device such as a touch panel, a keyboard, and a mouse. The operator can operate the operation unit 52 to edit the parts information table 80 and make various settings.

(3) Example of Printed Circuit Board Next, an example of the printed circuit board P will be described with reference to FIG. The printed circuit board P shown in FIG. 5 has a plurality of + symbols 71 (71A, 71B, 71C), four reference marks K (K1 to K4), four component positioning marks B1 (B11 to B14), and four component positioning marks. B2 (B21 to B24) and the like are attached.
In the following description, the component positioning marks B1 and B2 are collectively referred to as the component positioning marks B. Further, in the following description, the reference mark K and the component positioning mark B are collectively referred to as a fiducial mark (abbreviated as F mark).

The + symbol 71A indicates the mounting position of the QFP (Quad Flat Package) 40, and the + symbol 71B indicates the mounting position of the QFP96. Further, a plurality of + symbols 71C indicate mounting positions of CHIP32 (see FIG. 6), which is a chip component such as a capacitor or an LED.

The four component positioning marks B1 (B11 to B14) are for determining the position error and the angle error of the printed circuit board P when mounting the QFP40 and correcting the mounting coordinates and the mounting angle of the QFP40, and mounting the QFP40. It is arranged at the four corners of a rectangular area centered on the position. Although four component positioning marks B are attached around one mounting position here, at least two component positioning marks B may be used for one mounting position.

Similarly, the four component positioning marks B2 (B21 to B24) are for determining the position error and the angle error of the printed circuit board P when mounting the QFP96 and correcting the mounting coordinates and the mounting angle of the QFP96. It is arranged at four corners of a rectangular area centered on the mounting position of the QFP96.

In this embodiment, the component positioning mark B is not attached to the mounting position where CHIP 32 is mounted. This is because, in the present embodiment, the capacitors and LEDs are not required to have higher mounting accuracy than the QFP96 and QFP40.

The four reference marks K (K1 to K4) are attached at intervals wider than the interval between any two marks of the four component positioning marks B attached in the vicinity of one mounting position. The reference mark K determines the position error and the angle error of the printed circuit board P when the component E is mounted at the mounting position where the component positioning mark B is not attached like CHIP32, and the mounting coordinates and the mounting angle of the component E are determined. It is for correcting. It is sufficient that at least two reference marks K are used in the entire printed circuit board P.

Here, as will be described in detail later, in the present embodiment, even if the component E is mounted at the mounting position where the component positioning mark B is attached, such as QFP40 and QFP96, the printed circuit board P is used by using the reference mark K. In some cases, the position error and angle error of are determined.

(4) Parts Information Table Next, the parts information table 80 will be described with reference to FIG. The component information table 80 is a table that can be edited by an operator, and includes an F mark or component identification code, F mark coordinates or component mounting coordinates (X coordinate, Y coordinate), component mounting angle, and F mark group number (F mark group number). It consists of XY correction), F mark group number (θ correction), and the like.

The F mark group number (XY correction) indicates the F mark group number of the F mark in the case of lines related to the F mark (1 to 4, 21 to 24, 26 to 29), and relates to the part E. In the case of lines (5th to 20th, 25th, 30th), the F mark group number of the F mark used for determining the position error of the printed circuit board P when mounting the component E is shown. Further, the F mark group number (θ correction) indicates the F mark group number of the F mark used for determining the angle error of the printed circuit board P when the component E is mounted.
The F mark group number (XY correction) is an example of mark information representing a mark used for determining the position error of the printed circuit board P, and the F mark group number (θ correction) is a mark used for determining the angle error of the printed circuit board P. This is an example of the mark information to be represented.

As described above, since the part information table 80 is divided into an F mark group number (XY correction) and an F mark group number (θ correction), the operator can use the F mark group number (XY correction) and the F mark group number. (Θ correction) and can be specified separately.
In other words, the control unit 51 receives the designation of the F mark used for determining the position error of the printed circuit board P and the F mark used for determining the angle error among the reference mark K and the component positioning mark B, respectively, and the designated F mark. Are separately set as the F mark used for determining the position error of the printed circuit board P and the F mark used for determining the angle error (an example of the setting process). The reason why the F mark group number (XY correction) and the F mark group number (θ correction) can be set separately will be described later.

When accepting the designation of the F mark, the control unit 51 may present the reference mark K and the component positioning mark B as options and let the user select them.

(5) Correction of mounting coordinates and mounting angle of parts using F mark As shown in Fig. 6, "0" is set for F mark group number (XY correction) and F mark group number (θ correction) for CHIP32. Has been done. Therefore, in these parts E, the position error and the angle error of the printed circuit board P are determined by using the reference mark K, and the mounting coordinates and the mounting angle are corrected based on the determined position error and the angle error.

An example of correction of the mounting coordinates and the mounting angle of CHIP 32 will be described with reference to FIG. 7. Here, in FIG. 7, the reference marks K1a to K4a indicate the XY coordinates set in the parts information table, and the reference marks K1b to K4b indicate the recognized XY coordinates.

The control unit 51 recognizes the XY coordinates (K1b to K4b) of the center point of each reference mark K by transporting the head unit 13 and taking an image of each reference mark K by the substrate recognition camera 15. Then, for example, when the reference mark K2 on the upper right is used as a reference, the control unit 51 differs between the XY coordinates (K2a) set in the component information table 80 of the reference mark K2 on the upper right and the recognized XY coordinates (K2b). Is determined to be the position error (ΔX, ΔY) of the printed circuit board P (an example of the position error determination process), and the mounting coordinates of each CHIP 32 are provisionally corrected according to the determined position error (ΔX, ΔY).

Then, the control unit 51 has, for example, a straight line passing through the XY coordinates (K1b) recognized by the upper left reference mark K1 and the XY coordinates (K2b) recognized by the upper right reference mark K2, and a component information table of the upper left reference mark K1. The angle formed by the straight line passing through the XY coordinates (K1a) set in 80 and the XY coordinates (K2a) set in the part information table 80 of the reference mark K2 on the upper right is obtained. Similarly, the control unit 51 has a straight line passing through the XY coordinates (K3b) recognized by the reference mark K3 at the lower left and the XY coordinates (K4b) recognized by the reference mark K4 at the lower right, and component information of the reference mark K3 at the lower left. The angle formed by the straight line passing through the XY coordinates (K3a) set in the table 80 and the XY coordinates (K4a) set in the component information table 80 of the reference mark K4 at the lower right is obtained. Then, the control unit 51 determines the angle error (Δθ) of the printed circuit board P by averaging the obtained angles (an example of the angle error determination process).

Then, the control unit 51 corrects the provisionally corrected mounting coordinates of each CHIP 32 by rotating the XY coordinates (K2b) recognized by the reference mark K2 on the upper right as the rotation center by the angle error (Δθ), and further corrects the mounting coordinates. The mounting angle of each CHIP 32 is corrected by the angle error (Δθ).

As shown in FIG. 6, “2” is set for the F mark group number (XY correction) and the F mark group number (θ correction) in the QFP96. Therefore, in the QFP96, the position error and the angle error of the printed circuit board P are determined by using the component positioning mark B2, and the mounting coordinates and the mounting angle are corrected based on the determined position error and the angle error. The determination of the position error and the angle error of the printed circuit board P using the component positioning mark B2 is substantially the same as the case where the reference mark K is used.

As shown in FIG. 6, the F mark group number (XY correction) is set to "1" in the QFP 40, while the F mark group number (θ correction) is set to "0". Therefore, in the case of the QFP 40, the control unit 51 uses the component positioning mark B1 to determine the position error of the printed circuit board P, while the reference mark K is used to determine the angle error of the printed circuit board P.

Then, the control unit 51 temporarily corrects the mounting coordinates of the QFP 40 according to the position error of the printed circuit board P determined by using the component positioning mark B1, and the temporarily corrected mounting coordinates are XY recognized by the component positioning mark B12 on the upper right. It is corrected by rotating the printed circuit board P determined by using the reference mark K with the coordinates as the center of rotation by the amount of the angle error, and further, the mounting angle of the QFP40 is corrected by the amount of the angle error.

Next, the reason why the F mark group number (XY correction) and the F mark group number (θ correction) can be set separately will be described.
Since the reference mark K is farther from the mounting position than the component positioning mark B, it is usually desirable to use the component positioning mark B to determine the position error of the printed circuit board P. On the other hand, the angle error of the printed circuit board P may be judged by using the reference mark K or by using the component positioning mark B.

For example, the QFP40 uses the component positioning mark B1 because the distance between the marks of the two component positioning marks B1 (two component positioning marks B11 and B12 through which the same straight line passes when determining the angle error of the printed circuit board P) is narrow. When the angle error of the printed circuit board P is determined, the angle of the printed circuit board P recognized by the control unit 51 changes significantly when there is a deviation between the recognized center point and the actual center point, and the printed circuit board P There is a risk that the judgment accuracy of the angle error will decrease.

On the other hand, the reference mark K has a distance between two reference marks K (two reference marks K1 and K2 through which the same straight line passes when determining the angle error of the printed circuit board P) as compared with the component positioning mark B1. Since it is wide, the angle of the printed circuit board P recognized by the control unit 51 is unlikely to change significantly even if there is a deviation between the recognized center point and the actual center point. Therefore, when the distance between the marks of the two component positioning marks B is narrow as in the QFP40, it is desirable to use the reference mark K to determine the angle error.

However, for example, when the component E is mounted on the front surface of the printed circuit board P, the printed circuit board P is passed through the reflow process, and then the component E is mounted on the back surface of the printed circuit board P, the printed circuit board P is stretched by the heat of the reflow process. It may occur. In that case, as described above, the reference mark K is more susceptible to elongation because the distance between the marks of the two reference marks K is wider than that of the component positioning mark B. Therefore, there is a risk that the accuracy of determining the angle error will decrease. Therefore, when the distance between the marks of the two component positioning marks B is wide to some extent as in the QFP96, it is desirable to use the component positioning mark B to determine the angle error.

As described above, it is usually desirable to judge the position error of the printed circuit board P by using the component positioning mark B, while it is desirable to judge the angle error of the printed circuit board P by using the reference mark K. Since it may be desirable to use the component positioning mark B for judgment, in this embodiment, the F mark used for determining the position error of the printed circuit board P and the F mark used for determining the angle error can be set separately. I have to.

(6) Effect of Embodiment According to the surface mounting machine 1 according to the first embodiment described above, the F mark used for determining the position error of the printed circuit board P and the F mark used for determining the angle error of the printed circuit board P are separately separated. Therefore, even if it is not possible to accurately judge the position error of the printed circuit board P and the angle error of the printed circuit board P in the past, the position error of the printed circuit board P and the position error of the printed circuit board P can be set to. Both of the angle errors can be accurately determined, and thus the mounting accuracy of the component E can be improved.

Further, according to the surface mounter 1, the operator can specify the F mark used for determining the position error and the angle error of the printed circuit board P.

<Embodiment 2>
Next, the second embodiment will be described with reference to FIGS. 8 to 9.
The second embodiment is a modification of the first embodiment. In the first embodiment described above, a case where the operator specifies the F mark used for determining the position error and the angle error of the printed circuit board P has been described as an example. On the other hand, in the second embodiment, the control unit 51 automatically sets the F mark used for determining the angle error of the printed circuit board P.

First, the parts information table 81 according to the second embodiment will be described with reference to FIG. As shown in FIG. 8, in the second embodiment, "automatic" is automatically set for the F mark group number (θ correction). When the F mark group number (θ correction) is set to "automatic", the control unit 51 refers to the component E mounted at the mounting position where the component positioning mark B is not attached, such as CHIP 32. The mark K is internally set (for example, stored in RAM) as the F mark used for correcting the mounting angle.

On the other hand, for the component E mounted at the mounting position where the component positioning mark B is attached, such as QFP96 and QFP40, as shown in FIG. 9, the control unit 51 determines the angle error of the printed circuit board P. The distance between the marks of the two component positioning marks B through which the same straight line passes (for example, the distance between the component positioning marks B11 and B12 and the distance between B21 and B22) is compared with the preset reference distance H.
Then, when the distance between the marks of the two component positioning marks B is equal to or greater than the reference distance H, the control unit 51 internally sets the component positioning mark B as an F mark used for determining the angle error of the printed circuit board P. If the distance is less than the reference distance H, the reference mark K is internally set as the F mark used for determining the angle error of the printed circuit board P.

The reference distance H described above may be fixedly set in advance, or may be set by an operator operating the operation unit 52. Further, the reference distance H may be set uniformly for all the parts E, or may be set for each part E.
Further, the parts information table 81 according to the second embodiment may not have a column for the F mark group number (θ correction). In that case, the control unit 51 considers that the F mark group number (θ correction) is set to "automatic", and even if the F mark used for determining the angle error of the printed circuit board P is automatically set. Good.

Further, the F mark group number (θ correction) may be set to the F mark group number or "automatic" may be set. Then, when the F mark group number is set, the control unit 51 may determine the angle error of the printed circuit board P by using the F mark of the F mark group number.

Further, here, a case where the distance between the marks of the two component positioning marks B separated in the X-axis direction and the reference distance H are compared has been described as an example. On the other hand, it may be compared with the longer of the distance between the marks of the two component positioning marks B separated in the X-axis direction and the distance between the marks of the two component positioning marks B separated in the Y-axis direction. However, it may be compared with the shorter one or the average value thereof. Alternatively, it may be compared with the distance between the marks of the two component positioning marks B on the diagonal line.

Further, although the case where “automatic” is automatically set for the F mark group number (θ correction) has been described here as an example, the F mark group number (θ correction) may be blank. Then, the control unit 51 may automatically determine the F mark used for determining the angle error of the printed circuit board P and set the F mark group number to the F mark group number (θ correction).

According to the surface mounter 1 according to the second embodiment described above, an appropriate F mark can be automatically set by setting an appropriate reference distance H in advance.

Further, as described above, the surface mounter 1 may accept the setting of the reference distance H from the operator. Since the appropriate reference distance H may differ depending on the component E, if the operator can set the reference distance H, the appropriate reference distance H can be set according to the component E.

<Embodiment 3>
Next, the third embodiment will be described with reference to FIGS. 9 to 11.
The third embodiment is a modification of the second embodiment. In the above-described second embodiment, the case where the reference distance H is fixedly set in advance (or the case where the reference distance H is set by the operator) has been described as an example. On the other hand, in the third embodiment, the control unit 51 automatically sets the reference distance H based on the required position accuracy and the required angle accuracy of the component E.

First, the required position accuracy and the required angle accuracy will be described with reference to FIG. The required angle accuracy refers to the maximum allowable angular deviation amount P [deg] of the component E, and the required position accuracy refers to the maximum allowable displacement amount Q [mm] of the component E. In this case, the control unit 51 calculates the "distance required for accurate angle calculation" by the following equation 1.

Distance required for accurate angle calculation = Required position accuracy Q / sin (Required angle accuracy P) ・ ・ ・ Equation 1

For example, assuming that the required angle accuracy is 0.050 deg and the required position accuracy is 0.025 mm, the "distance required for accurate angle calculation" is 28.648 mm. In this case, the width R (or the distance R between the marks of the component positioning marks) of the component E needs to be 28.648 mm or more in order for the required angle accuracy and the required position accuracy to fall within the above-mentioned values.

For example, in the example shown in FIG. 9, the width of the QFP96 (or the distance between the marks of the component positioning mark B2) is 40 mm (≧ 28.648 mm), so that the component angle is 0.0358 deg when the position accuracy deviates by 0.025 mm. Therefore, it can be said that the condition of the required angle accuracy (= 0.050 deg) is satisfied.
On the other hand, in the example shown in FIG. 9, the width of the QFP40 (or the distance between the marks of the component positioning mark B1) is 20 mm (<28.648 mm), so that the component angle when the required position accuracy deviates by 0.025 mm is It is 0.0716 deg, and it can be said that the condition of the required angle accuracy (= 0.050 deg) is not satisfied.

Therefore, the control unit 51 automatically sets the "distance required for accurate angle calculation" as the reference distance H. When "the distance required for accurate angle calculation" is set as the reference distance H, as described above, in the QFP96, the distance between the marks of the two component positioning marks B21 and B22 is equal to or greater than the reference distance H, so that the angle error of the printed circuit board P The component positioning mark B is set as the F mark used for the determination of. On the other hand, in the QFP40, since the distance between the marks of the two component positioning marks B11 and B12 is less than the reference distance H, the reference mark K is set as the F mark used for determining the angle error.

Although the case where the required angle accuracy is 0.050 deg and the required position accuracy is 0.025 mm has been described here as an example, the required angle accuracy and the required position accuracy are not limited to these. FIG. 11 is an example of calculating the “distance required for accurate angle calculation” from the combination of the required position accuracy and the required angle accuracy. For example, assuming that the required position accuracy is 0.050 mm and the required angle accuracy is 0.050 deg, the "distance required for accurate angle calculation" is 57.325 mm.

Further, although the case where the required position accuracy and the required angle accuracy of the QFP96 and the QFP40 are the same has been described here as an example, the required position accuracy and the required angle accuracy may be set individually for each component E. In that case, the "distance required for accurate angle calculation" will differ depending on the component E.

According to the surface mounter 1 according to the third embodiment described above, since the reference distance H is automatically set using the equation 1, an appropriate reference distance H can be set regardless of the experience of the operator. ..

<Embodiment 4>
In the above-described first to third embodiments, a case where the surface mounter 1 itself has a function of setting the component information table 80 (or the component information table 81) has been described as an example. On the other hand, an external device such as a personal computer (an example of a computer) may execute a setting program to set the parts information table 80 (an example of a setting process). The process of setting the component information table 80 by the external device is substantially the same as that of the first to third embodiments.

In the fourth embodiment, the component information table 80 set by the external device is output to the surface mounter 1 online or offline (an example of output processing), and the surface mounter 1 is set in the component information table 80. The mark is used to determine the position error and the angle error of the printed circuit board P.

According to the setting program according to the fourth embodiment described above, the F mark used for determining the position error of the printed circuit board P and the F mark used for determining the angle error of the printed circuit board P can be set separately. Even when it is not possible to accurately judge the position error and the angle error of the substrate, both the position error and the angle error of the printed circuit board P can be accurately judged. Therefore, the mounting accuracy of the component E can be improved.

In the setting program according to the fourth embodiment, the F mark used for determining the angle error of the printed circuit board P may be set based on the distance between the two component positioning marks B and the reference distance H. In that case, by setting an appropriate reference distance H in advance, an appropriate F mark can be automatically set.

<Other embodiments>
The technology disclosed herein is not limited to the embodiments described above and in the drawings, and for example, the following embodiments are also included in the technical scope disclosed herein.

(1) In the above embodiment, the case where the operator can also specify the F mark group number (XY correction) has been described as an example, but the F mark group number (XY correction) is a component attached near the mounting position. The control unit 51 may automatically set the positioning mark B. That is, in the case of the component E mounted at the mounting position where the component positioning mark B is attached, such as QFP40 and QFP96, the positional error of the printed circuit board P is always determined by using the component positioning mark B. You may.

(2) In the above embodiment, one printed circuit board P has been described as an example of the substrate. On the other hand, one substrate may be divided into a plurality of regions, the component E may be mounted in each region, and then divided into regions and each of them may be used as one printed circuit board P. In that case, the reference mark K may be provided in common to all areas or may be provided for each area.

(3) The reference mark K and the component positioning mark B described in the above embodiment may be provided on the printed circuit board P by printing, or may be provided as holes formed in the substrate. Further, the substrate may be an assembled substrate in which a child substrate is superposed on a parent substrate. In that case, the reference mark K may be provided on the parent board, and the component positioning mark B may be provided on the child board. Further, in that case, the component positioning mark B may be provided as a notch at the edge of the child substrate.

1 ... Surface mounter, 15 ... Board recognition camera (an example of recognition unit), 16 ... Positioning unit, 51 ... Control unit, 52 ... Operation unit (an example of designated reception unit, setting reception unit), 71 (71A, 71B, 71C) ... Mounting position, B1 (B11, B12, B13, B14) ... Parts positioning mark, B2 (B21, B22, B23, B24) ... Parts positioning mark, E ... Parts, H ... Reference distance, K (K1, K2) , K3, K4) ... Reference mark, P ... Printed circuit board (example of substrate)

Claims (6)

Surface mounting for mounting the component on a board having at least two component positioning marks attached in the vicinity of the component mounting position and two reference marks attached at a distance wider than the distance between the two component positioning marks. It ’s a machine,
A positioning unit for positioning the substrate and
A recognition unit that recognizes the position of the reference mark and the position of the component positioning mark on the substrate positioned by the positioning unit.
Control unit and
With
The control unit
For each of the above parts, the setting of the mark used for determining the position error of the board among the reference mark and the part positioning mark is accepted, and separately from the setting of the mark used for determining the position error of the board, each of the above parts The setting process for accepting the setting of the mark used for determining the angle error of the substrate among the reference mark and the component positioning mark, respectively , and
A position error determination process for determining the position error of the substrate based on the position recognized by the recognition unit of the mark set as a mark used for determining the position error of the substrate for each component.
An angle error determination process for determining the angle error of the substrate based on the position recognized by the recognition unit of the mark set as a mark used for determining the angle error of the substrate for each component.
A surface mounter that runs. It is provided with a designated reception unit that accepts the designation of the mark used for determining the angle error of the substrate among the reference mark and the component positioning mark.
The surface mounter according to claim 1, wherein the control unit sets a mark designated by the designated reception unit as a mark used for determining an angle error of the substrate in the setting process. Surface mounting for mounting the component on a board having at least two component positioning marks attached in the vicinity of the component mounting position and two reference marks attached at a distance wider than the distance between the two component positioning marks. It ’s a machine,
A positioning unit for positioning the substrate and
A recognition unit that recognizes the position of the reference mark and the position of the component positioning mark on the substrate positioned by the positioning unit.
Control unit and
With
The control unit
A setting process for separately setting a mark used for determining the position error of the substrate and a mark used for determining the angle error of the substrate among the reference mark and the component positioning mark.
Positional error determination processing for determining the position error of the substrate based on the position recognized by the recognition unit of the mark set as the mark used for determining the position error of the substrate, and
An angle error determination process for determining the angle error of the substrate based on the position recognized by the recognition unit of the mark set as a mark used for determining the angle error of the substrate.
And run
In the setting process, the distance between the marks of the two component positioning marks is compared with the reference distance, and when the distance between the marks is wider than the reference distance, the component positioning mark is used to determine the angle error of the substrate. A surface mounter that sets the reference mark as a mark used for determining the angle error of the substrate when the distance is narrower than the reference distance. The surface mounter according to claim 3, further comprising a setting reception unit that accepts the setting of the reference distance. The surface mounter according to claim 3, wherein the control unit automatically sets the reference distance using the following formula 1.
Reference distance = required position accuracy / sin (required angle accuracy) ・ ・ ・ Equation 1 Judgment of position error and angle error of a board having at least two component positioning marks attached in the vicinity of the component mounting position and two reference marks attached at a distance wider than the interval between the two component positioning marks. It is a setting program for setting the mark used for the surface mounter on the surface mounter.
For each of the above parts, the setting of the mark used for determining the position error of the board among the reference mark and the part positioning mark is accepted, and separately from the setting of the mark used for determining the position error of the board, each of the above parts The setting process for accepting the setting of the mark used for determining the angle error of the substrate among the reference mark and the component positioning mark, respectively , and
Output processing that outputs mark information representing the mark set in the setting processing, and
A configuration program that lets your computer run.

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