JP6783349B2 - Electronics - Google Patents

Description

The present invention relates to the structure of a vent of an electronic device.

The electronic device of Patent Document 1 below includes a frame to which various parts included in the electronic device are attached, an upper cover that covers the upper side of the frame, and a lower cover that covers the lower side of the frame. doing. The frame has an outer peripheral portion formed so as to surround various components (specifically, a cooling fan, a heat sink, a power supply unit, an optical disk drive, etc.) included in the electronic device. The circuit board is located above the cooling fan and heat sink. The circuit board is covered by a chassis made of metal.

International Publication No. 2014/185311

In the electronic device of Patent Document 1, the entire frame is made of resin. In order to improve the rigidity of the frame, it is necessary to increase the thickness and thickness of the frame. This is not preferable for miniaturization of electronic devices.

One of an object of the present invention is to provide an electronic device capable of improving the rigidity of a frame while reducing the size of the electronic device.

The electronic device according to the present invention has a plurality of parts, a frame formed of a resin having an outer peripheral portion surrounding the plurality of parts, and the plurality of parts in a first direction. A circuit board arranged on one side, a chassis formed of metal arranged on the one side in the first direction with respect to the plurality of components and attached to the frame, and the plurality of parts. It has a metal plate arranged on the other side in the first direction and attached to the frame with respect to at least one component of the above.

It is a perspective view of the electronic device which concerns on one Embodiment of this invention. It is an exploded perspective view of an electronic device. It is an exploded perspective view of the main body shown in FIG. It is a top view of the main body of an electronic device. It is a top view of the frame to which the lower cover is attached. It is sectional drawing of the electronic device obtained by the cut surface shown by the VV line of FIG. 4A. It is a perspective view of a metal plate, a frame, and a cooling fan shown in FIG. It is an enlarged view of the region shown by VII in FIG. It is a rear view of an electronic device. It is sectional drawing obtained from the cut surface shown by the IX-IX line of FIG. It is a perspective view which shows the rear side of a frame, a power supply unit, and a lower cover.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic device 1 according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the electronic device 1. FIG. 3 is an exploded perspective view of the main body 10 shown in FIG. FIG. 4A is a plan view of the main body 10. FIG. 4B is a plan view of the frame 20 to which the lower cover 60 is attached. FIG. 5 is a cross-sectional view of the electronic device 1 obtained on the cut surface shown by the VV line of FIG. 4A. FIG. 6 is a perspective view of the metal plate 39, the frame 20, and the cooling fan 5 shown in FIG.

In the following description, X1 and X2 shown in FIG. 1 are leftward and rightward, Y1 and Y2 are forward and rearward, respectively, and Z1 and Z2 are upward and downward, respectively.

The electronic device 1 is an entertainment device that functions as, for example, a game device or an audio / visual device. The electronic device 1 outputs video / audio data generated by executing a game program, video / audio data acquired from a recording medium such as an optical disk, and / or video / audio data acquired through a network to a display device such as a television. .. The electronic device 1 is not limited to an entertainment device such as a game device, and may be a personal computer.

As shown in FIG. 2, the electronic device 1 has a main body 10. The upper side of the main body 10 is covered with an upper cover 50 constituting the exterior member A of the electronic device 1. The lower side of the main body 10 is covered with a lower cover 60 constituting the exterior member A. As shown in FIG. 3, the main body 10 is composed of a frame 20 and various parts attached to the frame 20. As will be described later, in the example of the electronic device 1, the frame 20 also constitutes the exterior member A.

As shown in FIG. 3, for example, a cooling fan 5, an optical disk drive 7, a power supply unit 40, and the like are attached to the frame 20. In the example of the electronic device 1, the cooling fan 5 and the optical disk drive 7 are arranged in the front portion of the electronic device 1 and are arranged in the left-right direction. The power supply unit 40 is arranged behind the cooling fan 5 and the optical disk drive 7. The power supply unit 40 has a case 42. A circuit board 41 (see FIG. 5) on which a power supply circuit is mounted is housed in the case 42. The layout of the parts included in the electronic device 1, that is, the layout of the cooling fan 5, the optical disk drive 7, and the power supply unit 40 is not limited to the example of the electronic device 1. Further, the electronic device 1 does not necessarily have all of these parts. For example, the electronic device 1 does not have to have the optical disk drive 7.

As shown in FIG. 3, the frame 20 has a frame outer peripheral portion 21. The outer peripheral portion 21 of the frame surrounds a plurality of parts included in the electronic device 1. In the example of the electronic device 1, the outer peripheral portion 21 of the frame surrounds the above-mentioned optical disk drive 7, the cooling fan 5, and the power supply unit 40 (see FIG. 4A). The outer peripheral portion 21 of the frame is substantially quadrangular in a plan view, and has a front wall portion 21A, a right wall portion 21B, a rear wall portion 21C, and a left wall portion 21D. The front wall portion 21A is a wall portion located in front of the above-mentioned parts. An insertion port 21n for inserting an optical disk into the optical disk drive 7 may be formed in the front wall portion 21A. The rear wall portion 21C is a wall portion located on the opposite side of the front wall portion 21A. The right wall portion 21B is located to the right with respect to the above-mentioned parts, and the left wall portion 21D is a wall portion located on the opposite side of the right wall portion 21B. The inside of the outer peripheral portion 21 of the frame is open in the vertical direction. That is, the outer peripheral portion 21 of the frame has a tubular shape.

As shown in FIG. 3, the main body 10 includes a circuit board 31, an upper chassis 32, and a lower chassis 33. The chassis 32 and 33 are made of a metal plate such as aluminum or iron, and cover the upper surface and the lower surface of the circuit board 31, respectively. Electronic components such as integrated circuits that control the electronic device 1 and execute image processing are mounted on the circuit board 31. The chassis 32 and 33 prevent the radiation of electromagnetic waves emitted from components such as integrated circuits, and prevent the electromagnetic waves from external devices from affecting the electronic components on the circuit board 31. In one example, the chassis 32 and 33 cover the entire circuit board 31. The chassis 32 and 33 may cover only the region where components such as the integrated circuit 31a are mounted on the circuit board 31.

The circuit board 31 and the chassis 32, 33 are arranged below the above-mentioned components arranged inside the outer peripheral portion 21 of the frame. In the example of the electronic device 1, the circuit board 31, the chassis 32, and 33 are located below the cooling fan 5 and the power supply unit 40 (see FIG. 5). The circuit board 31 and the chassis 32 and 33 are attached to the frame 20. More specifically, the circuit board 31 and the chassis 32, 33 are attached to the outer peripheral portion 21 of the frame. In the example of the electronic device 1, the circuit board 31 and the chassis 32, 33 are attached to the front wall portion 21A, the right wall portion 21B, and the rear wall portion 21C of the frame outer peripheral portion 21. Fixtures such as screws are used to attach the circuit board 31 and the chassis 32 and 33. The electronic device 1 does not necessarily have two chassis 32 and 33. That is, the chassis may be provided only on one surface of the circuit board 31.

As shown in FIG. 3, the electronic device 1 has a heat sink 34. The heat sink 34 is in direct or indirect contact with a heat generating component such as an integrated circuit 31a (see FIG. 5) mounted on the circuit board 31. The heat sink 34 is arranged in an air flow path S2 (see FIG. 4A) which will be described later and continues from the cooling fan 5. In the example of the electronic device 1, the heat sink 34 is attached to the upper chassis 32. Specifically, as shown in FIG. 5, the heat sink 34 has a base portion 34a and a plurality of fins 34b fixed to the upper side of the base portion 34a. A hole having a size corresponding to the heat sink 34 is formed in the upper chassis 32, and the fins 34b of the heat sink 34 are fitted into the holes of the upper chassis 32 from below. Then, the base portion 34a is fixed to the edge of the hole of the chassis 32. The fins 34b are located above the upper chassis 32 and are located in the air flow path S2. The mounting structure of the heat sink 34 is not limited to the example of the electronic device 1, and may be appropriately changed.

As shown in FIG. 3, the electronic device 1 has a metal plate 39. The metal plate 39 is arranged on the side opposite to the chassis 32 and 33 and the circuit board 31 with the cooling fan 5 interposed therebetween. In the example of the electronic device 1, the metal plate 39 is arranged above the cooling fan 5. Further, the metal plate 39 is attached to the frame 20. Specifically, the metal plate 39 is attached to the outer peripheral portion 21 of the frame. The frame 20 is made of a resin such as ABS resin or polystyrene. On the other hand, the plate 39 is made of a metal such as aluminum or iron. According to such a structure using the metal plate 39, the rigidity of the frame 20 can be improved without increasing the thickness of the wall portions 21A, 21B, 21C, 21D of the frame 20.

The metal plate 39 is preferably attached to at least three of the four wall portions 21A, 21B, 21C, and 21D constituting the outer peripheral portion 21 of the frame. By doing so, the rigidity of the outer peripheral portion 21 of the frame can be improved more effectively. As shown in FIG. 6, in the example of the electronic device 1, the metal plate 39 is attached to the right wall portion 21B, the front wall portion 21A, and the left wall portion 21D of the frame outer peripheral portion 21. In one example, the metal plate 39 is attached to the upper edge of the outer peripheral portion 21 of the frame. As another example, a mounting portion may be formed inside the outer peripheral portion 21 of the frame, and the metal plate 39 may be mounted on the mounting portion. For mounting the metal plate 39, for example, a fixture such as a screw is used.

The mounting structure of the metal plate 39 is not limited to the examples described here. For example, the metal plate 39 may be attached to only two of the four wall portions 21A, 21B, 21C, and 21D of the frame outer peripheral portion 21. As will be described later, the metal plate 39 covers the cooling fan 5 and functions as a wall that defines the air flow path. Therefore, the metal plate 39 may be attached only to the two wall portions (the front wall portion 21A and the right wall portion 21B in the example of the electronic device 1) close to the cooling fan 5. As yet another example, the metal plate 39 may be attached to all four wall portions 21A, 21B, 21C, 21D. In this case, the metal plate 39 may cover all the parts arranged inside the outer peripheral portion 21 of the frame, or may cover only a part of the parts arranged inside the outer peripheral portion 21 of the frame.

As described above, the electronic device 1 has a cooling fan 5 and a heat sink 34 arranged inside the outer peripheral portion 21 of the frame. Further, the electronic device 1 has vents E1 and E2 (see FIG. 9). Here, the "vent" is a boundary between the outside and the inside of the exterior member A of the electronic device 1. That is, the outside air exists outside the vents E1 and E2, and the air inside the exterior member A becomes the outside air at the moment when it passes through the vents E1 and E2. The electronic device 1 has ventilation ports E1 and E2 for exhausting the air in the exterior member A to the outside. In the example of the electronic device 1, the exhaust ports E1 and E2 are provided on the rear wall portion 21C of the frame outer peripheral portion 21. Air passages S1, S2, and S3 from the cooling fan 5 to the exhaust ports E1 and E2 are formed inside the outer peripheral portion 21 of the frame (see FIG. 4A).

In the example of the electronic device 1, the cooling fan 5 is arranged so that its rotation center line C1 (see FIG. 6) is along the vertical direction. As shown in FIG. 4A, the air flow path is connected to the first flow path S1 formed on the outer periphery of the cooling fan 5 and curved in an arc shape, and the first flow path S1 formed on the rear side of the cooling fan 5. It has a second flow path S2. A heat sink 34 is arranged in the second flow path S2. The air flow path further has a third flow path S3 formed behind the heat sink 34 and connected to the second flow path S2. As described above, the electronic device 1 has a power supply unit 40 at the rear portion. The power supply unit 40 has a circuit board 41 and a case 42 accommodating the circuit board 41. The third flow path S3 is composed of a case 42, and the circuit board 41 is arranged in the third flow path S3 (see FIG. 5). Exhaust ports E1 and E2 are provided on the rear side of the case 42. A power supply circuit is mounted on the circuit board 41. The power supply circuit supplies the driving power to various components included in the electronic device 1.

When the cooling fan 5 is driven, air flows out from the cooling fan 5 to the first flow path S1. After that, the air flows into the second flow path S2 and passes through the heat sink 34. Then, the air flows into the third flow path S3. That is, the air flows into the case 42 of the power supply unit 40. After that, the air is discharged to the outside from the exhaust ports E1 and E2.

The metal plate 39 and the frame 20 have a portion that functions as a wall that defines an air flow path. That is, the metal plate 39 and the frame 20 have a portion that functions as a wall that separates the inside and the outside of the air flow path. In the example of the electronic device 1, the metal plate 39 and the frame 20 have a portion that functions as a wall that defines the first flow path S1 and the second flow path S2. As described above, the metal plate 39 has a function of improving the rigidity of the frame 20 and a function of a wall defining the flow paths S1 and S2. This eliminates the need for a dedicated member that defines the upper walls of the flow paths S1 and S2. As a result, the number of parts can be reduced. In addition, the height of the electronic device can be reduced by the amount of the dedicated member.

As shown in FIGS. 4B and 6, the frame 20 has a flow path wall portion 22 that defines a first flow path S1 and a second flow path S2. The flow path wall portion 22 is a wall that defines the outer shape of the flow paths S1 and S2 in a plan view. The flow path wall portion 22 surrounds the cooling fan 5 and the heat sink 34 in a plan view.

In the example of the electronic device 1, the flow path wall portion 22 has a curved wall portion 22A that surrounds the outer circumference of the cooling fan 5 and is curved along the outer circumference of the cooling fan 5. A first flow path S1 is formed between the cooling fan 5 and the curved wall portion 22A. One end of the curved wall 22A (the right end in the example of the electronic device 1) is connected to the right wall 21B of the outer peripheral portion 21 of the frame. Therefore, the front portion of the right wall portion 21B functions as a part 22B of the flow path wall portion 22 (the portion 22B is hereinafter referred to as a first side wall portion). The flow path wall portion 22 has a second side wall portion 22C extending rearward from the other end portion (left end portion in the example of the electronic device 1) of the curved wall portion 22A. A second flow path S2 is formed between the first side wall portion 22B and the second side wall portion 22C. The inside of the flow path wall portion 22 is open in the vertical direction.

As shown in FIG. 6, the metal plate 39 has a portion 39A that functions as an upper wall of the first flow path S1 and the second flow path S2 (hereinafter, this portion 39A is referred to as a flow path upper wall portion). ). That is, the flow path upper wall portion 39A closes the upper side of the flow paths S1 and S2. The flow path upper wall portion 39A has a first wall portion 39Aa that functions as an upper wall of the first flow path S1 and a second wall portion 39Ab that functions as an upper wall of the second flow path S2. The second wall portion 39Ab covers the heat sink 34.

As shown in FIG. 6, the cooling fan 5 has a mounting plate 5c attached to the lower side of the outer peripheral portion 21 of the frame at the bottom thereof. The mounting plate 5c closes the lower side of the first flow path S1 and functions as a lower wall of the first flow path S1. Further, as described above, the upper chassis 32 is attached to the lower side of the outer peripheral portion 21 of the frame. The upper chassis 32 has a portion that functions as a lower wall of the second flow path S2. Therefore, the flow paths S1 and S2 are partitioned from the space around them by the frame 20, the metal plate 39, the upper chassis 32, and the mounting plate 5c.

The flow path upper wall portion 39A of the metal plate 39 is connected to the flow path wall portion 22 of the frame 20. That is, the flow path upper wall portion 39A is connected to the entire upper edge of the flow path wall portion 22 (that is, the curved wall portion 22A, the side wall portions 22B, and the upper edges of 22C). As a result, the air in the flow paths S1 and S2 is prevented from leaking to the outside of the flow paths S1 and S2. In the example of the electronic device 1, as shown in FIG. 6, the frame 20 has a plurality of mounting portions 22a arranged along the flow path wall portion 22 and the frame outer peripheral portion 21. The metal plate 39 is arranged on the flow path wall portion 22 of the frame 20, and is attached to the attachment portion 22a by a fixture such as a screw. As a result, the flow path upper wall portion 39A of the metal plate 39 is in close contact with the upper edge of the flow path wall portion 22 of the frame 20.

FIG. 7 is an enlarged view of a region represented by reference numeral VII in FIG. As shown in FIG. 7, the metal plate 39 has an edge located on the flow path wall portion 22 of the frame 20. A convex portion 22b formed along the edge of the metal plate 39 and located outside the edge of the metal plate 39 is formed on the upper edge of the flow path wall portion 22 of the frame 20. The protrusion 22b surrounds the edge of the metal plate 39. In the example of the electronic device 1, the leading edge 39d (see FIG. 6) of the first wall portion 39Aa and the right edge 39e (see FIG. 6) of the second wall portion 39Ab included in the metal plate 39 are the flow of the frame 20. It is located on the road wall portion 22 (more specifically, the curved wall portion 22A and the first side wall portion 22B). A convex portion 22b is formed on the upper edge of the curved wall portion 22A and the first side wall portion 22B. The protrusions 22b are formed along the edges 39d and 39e of the metal plate 39 and are located outside the edges 39d and 39e of the metal plate 39. The convex portion 22b can more effectively prevent air from leaking from the edges 39d and 39e of the metal plate 39 and the upper edge of the flow path wall portion 22.

As shown in FIG. 6, the cooling fan 5 has a rotor 5a and a plurality of fins 5b that rotate integrally with the rotor 5a. The fins 5b extend radially from the rotor 5a. The first wall portion 39Aa of the metal plate 39 is provided with a fin cover portion 39c that covers the upper side of the base portions of the plurality of fins 5b. In the example of the electronic device 1, the fin cover portion 39c is formed in an annular shape. The rotor 5a is located inside the fin cover portion 39c in a plan view. That is, the metal plate 39 does not exist above the rotor 5a. By doing so, it is possible to reduce the height of the electronic device 1 by the thickness of the metal plate 39. The shape of the metal plate 39 is not limited to this. For example, the fin cover portion 39c may not be provided on the metal plate 39. The metal plate 39 may have a portion that covers the upper side of the rotor 5a.

As shown in FIG. 6, a step is formed between the fin cover portion 39c and the first wall portion 39Aa. More specifically, the position of the first wall portion 39Aa is lower than the position of the fin cover portion 39c. An opening 39h is formed between the inner peripheral edge of the first wall portion 39Aa and the outer peripheral edge of the fin cover portion 39c. When the cooling fan 5 is driven, external air flows to the cooling fan 5 through the opening 39h. According to the above-mentioned structure in which the position of the first wall portion 39Aa and the position of the fin cover portion 39c are deviated in the vertical direction, the size of the opening 39h can be easily secured. As a result, the intake efficiency can be improved. The outer peripheral edge of the fin cover portion 39c is connected to the inner peripheral edge of the first wall portion 39Aa via a plurality of connecting portions 39f arranged in the circumferential direction.

As shown in FIG. 1, the electronic device 1 has an intake port P1 for introducing external air into the exterior member A thereof. In the example of the electronic device 1, the intake ports P1 are provided on the right side surface and the left side surface of the electronic device 1. Specifically, the right wall portion 51B of the upper cover 50 and the right wall portion 61B of the lower cover 60 are located apart from each other in the vertical direction, and an intake port P1 is formed between them. An air flow path is formed between the right wall portion 21B of the frame outer peripheral portion 21 and the right wall portion 51B of the upper cover 50, and the air introduced from the intake port P1 is the right wall portion 21B of the frame outer peripheral portion 21. It passes between the air and the right wall portion 51B of the upper cover 50 and flows toward the upper side of the cooling fan 5. Similarly, an air flow path is formed in the right wall portion 21B of the frame outer peripheral portion 21 and the right wall portion 61B of the lower cover 60, and the air introduced from the intake port P1 is the right wall portion 21B of the frame outer peripheral portion 21. It passes between the air and the right wall portion 61B of the lower cover 60 and flows toward the lower side of the cooling fan 5. The air that has reached the lower side of the cooling fan 5 is introduced into the cooling fan 5 through the opening 5d formed in the mounting plate 5c. Similar to the right side, the left side of the electronic device 1 is also provided with an intake port. The left wall portion of the upper cover 50 and the left wall portion of the lower cover 60 are located apart from each other in the vertical direction, and an intake port is formed between them. The position of the intake port is not limited to the example of the electronic device 1, and may be changed as appropriate.

The metal plate 39 may have a portion that covers parts that are different from the parts arranged in the air flow path, such as the cooling fan 5 and the heat sink 34. In the example of the electronic device 1, the optical disk drive 7 is arranged in front of the electronic device 1. As shown in FIG. 6, the metal plate 39 has a portion 39B that covers the optical disk drive 7 (hereinafter, this portion 39B is referred to as a component cover portion). In the example of the electronic device 1, the optical disk drive 7 has a part of a mechanism for transporting the optical disk on the upper side of the upper surface thereof. The component cover portion 39B covers this mechanism. By covering the optical disk drive 7 with the metal plate 39 in this way, a dedicated cover for covering the optical disk drive 7 becomes unnecessary. As a result, the number of parts can be reduced. In addition, the height of the electronic device can be reduced by the amount of the dedicated cover.

The component covered by the component cover portion 39B is not limited to the optical disk drive 7. Alternatively, the metal plate 39 does not have to have the component cover portion 39B. That is, the entire metal plate 39 may function as the flow path upper wall portion 39A.

As described above, the air flow path includes the third flow path S3 following the second flow path S2. The wall defining the third flow path S3 is composed of the case 42 of the power supply unit 40. The flow path upper wall portion 39A of the metal plate 39 and the flow path wall portion 22 of the frame 20 are connected to a vent 42d formed in the case 42. In the example of the electronic device 1, the vent 42d is formed on the front surface of the case 42 (see FIG. 3). As shown in FIG. 5, the trailing edge 39g of the flow path upper wall portion 39A of the metal plate 39 is connected to the upper edge of the vent 42d. The side wall portions 22B and 22C of the frame 20 are connected to the left and right edges of the vent 42d. As a result, it is possible to prevent air from leaking to the outside between the second flow path S2 and the third flow path S3.

As described above, the electronic device 1 has an upper cover 50 that covers the upper side of the main body 10 and a lower cover 60 that covers the lower side of the main body 10 as its exterior member A. Further, in the example of the electronic device 1, a part of the frame 20 is exposed to the outside from between the upper cover 50 and the lower cover 60. Specifically, the upper cover 50 has a peripheral wall portion 51 that surrounds the outer periphery of the frame outer peripheral portion 21 in a plan view of the electronic device 1. The lower cover 60 has a peripheral wall portion 61 that surrounds the outer periphery of the outer peripheral portion 21 of the frame in a plan view of the electronic device 1. The lower edge of the peripheral wall portion 51 of the upper cover 50 and the upper edge of the peripheral wall portion 61 of the lower cover 60 are separated in the vertical direction, and the outer peripheral portion 21 of the frame is the lower edge of the peripheral wall portion 51 of the upper cover 50 and the peripheral wall of the lower cover 60. It is exposed to the outside from between the upper edge of the portion 61. Therefore, in the electronic device 1, the exterior member A is composed of the covers 50 and 60 and the frame 20.

The exterior member A has exhaust ports E1 and E2 for discharging the air that has passed through the above-mentioned air flow paths S1, S2, and S3 to the outside. 8 to 10 are views for explaining the structures of the exhaust ports E1 and E2. FIG. 8 is a rear view of the electronic device 1. FIG. 9 is a cross-sectional view obtained from the cut surface shown by the IX-IX line of FIG. FIG. 10 is a perspective view showing the rear side of the frame 20, the power supply unit 40, and the lower cover 60.

In the example of the electronic device 1, the case 42 of the power supply unit 40 has an opening 42f on the rear side (see FIG. 10). As shown in FIG. 9, the exterior member A has exhaust ports E1 and E2 behind the case 42. The air in the case 42 (air in the third flow path S3) is discharged to the outside through the exhaust ports E1 and E2.

As shown in FIG. 9, the exterior member A is provided with a plurality of shielding portions located behind the power supply unit 40. In the example of the electronic device 1, the exterior member A is provided with three shielding portions H1, H2, and H3 (hereinafter, when identifying the three shielding portions, the first shielding portion H1 and the second shielding portion H1, respectively). H2, referred to as the third shielding portion H3). Each of the shielding portions H1, H2, and H3 is an elongated plate-shaped portion extending in the left-right direction. In the example of the electronic device 1, the shielding portions H1, H2, and H3 have a length substantially corresponding to the width in the left-right direction of the electronic device 1.

In the example of the electronic device 1, as shown in FIG. 9, the first shielding portion H1 is provided on the rear wall portion 21C of the frame 20. The second shielding portion H2 is composed of a rear wall portion 51C forming the peripheral wall portion 51 of the upper cover 50 and a panel portion 21m provided on the rear wall portion 21C of the frame 20. The rear wall portion 51C of the upper cover 50 is located behind the panel portion 21m of the frame 20 and constitutes one second shielding portion H2. The second shielding portion H2 does not necessarily have to be composed of two members. For example, the second shielding portion H2 may be composed of only the rear wall portion 51C of the upper cover 50.

The third shielding portion H3 constitutes a wall behind the air flow path S5, which will be described later. In the example of the electronic device 1, as shown in FIGS. 9 and 10, the peripheral wall portion 61 of the lower cover 60 has a rear wall portion 61C. The upper portion of the rear wall portion 61C constitutes the rear wall of the air flow path S5, and this upper portion is the third shielding portion H3.

The shielding portions H1, H2, and H3 are not limited to the examples described here. Each of the shielding portions H1, H2, and H3 may be provided on any of the members of the frame 20 and the covers 50, 60. The number of shielding portions provided in the electronic device 1 is not limited to three. The number of shielding portions may be two or four or more.

The shielding portions H1, H2, and H3 are arranged in the vertical direction when viewed in the front-rear direction. In other words, as shown in FIG. 8, the shielding portions H1, H2, and H3 are arranged in the vertical direction in the rear view of the electronic device 1. In the example of the electronic device 1, the second shielding portion H2 is located above the first shielding portion H1. The third shielding portion H3 is located on the side opposite to the position of the second shielding portion H2 with the position of the first shielding portion H1 in the vertical direction. In the example of the electronic device 1, the third shielding portion H3 is located below the first shielding portion H1. The first shielding portion H1 and the second shielding portion H2 are adjacent to each other in the vertical direction when viewed in the front-rear direction. That is, when these are viewed in the front-rear direction, there is no other shielding portion between the first shielding portion H1 and the second shielding portion H2. Similarly, the first shielding portion H1 and the third shielding portion H3 are adjacent to each other in the vertical direction when viewed in the front-rear direction. That is, when these are viewed in the front-rear direction, there is no other shielding portion between the first shielding portion H1 and the third shielding portion H3.

It is preferable that the first shielding portion H1 and the second shielding portion H2 are arranged so that a part of the second shielding portion H2 overlaps with a part of the first shielding portion H1 when they are viewed in the front-rear direction. .. As a result, the parts arranged inside the exterior member A (in the example of the electronic device 1, the circuit board 41 of the power supply unit 40 and the parts 41b mounted on the circuit board 41) are moved from between the two shielding portions H1 and H2 to the outside. It can be prevented from being exposed. In the example of the electronic device 1, the lower edge of the second shielding portion H2 overlaps with the upper edge of the first shielding portion H1 in the rear view of the electronic device 1. That is, the lower edge of the second shielding portion H2 and the upper edge of the first shielding portion H1 are located at the same height. The two shielding portions H1 and H2 may overlap in a larger range. The first shielding portion H1 is located so as to overlap the component 41b mounted on the circuit board 41 in the rear view of the electronic device 1.

In the example of the electronic device 1, the third shielding portion H3 is located below the lower edge of the first shielding portion H1. That is, in the rear view of the electronic device 1, a very small gap is formed between the upper edge of the third shielding portion H3 and the lower edge of the first shielding portion H1. As a result, the exhaust efficiency can be improved. As will be described in detail later, the circuit board 41 is arranged so as to be offset from the center C2 of the first shielding portion H1 to the second shielding portion H2 side in the vertical direction. Therefore, it is suppressed that the circuit board 41 and the components on the circuit board 41 are exposed from the gap between the upper edge of the third shielding portion H3 and the lower edge of the first shielding portion H1. Instead of the example of the electronic device 1, when the first shielding portion H1 and the third shielding portion H3 are viewed in the front-rear direction, a part of the third shielding portion H3 overlaps with a part of the first shielding portion H1. It may be arranged as follows. For example, the upper edge of the third shielding portion H3 may be arranged so as to overlap the lower edge of the first shielding portion H1 in the rear view of the electronic device 1. The two shielding portions H1 and H3 may overlap in a larger range. In this case, the first shielding portion H1 and the second shielding portion H2 may also be arranged so that a part of the second shielding portion H2 overlaps with a part of the first shielding portion H1 in the rear view of the electronic device 1. ..

As yet another example, the upper edge of the third shielding portion H3 is located below the lower edge of the first shielding portion H1, and the lower edge of the second shielding portion H2 described above is above the first shielding portion H1. It may be located very slightly above the edge (ie, there may be a gap between the two shields H1 and H2, and there may also be a gap between the two shields H1 and H3). .. In this case, from the gap between the upper edge of the third shielding portion H3 and the lower edge of the first shielding portion H1 and the gap between the lower edge of the second shielding portion H2 and the upper edge of the first shielding portion H1. It is preferable that the size of the gap between them is specified so that the user cannot see the circuit board 41 and the like. As yet another example, contrary to the example of the electronic device 1, the lower edge of the second shielding portion H2 is located slightly above the upper edge of the first shielding portion H1, while the third shielding portion H1 is located. The upper edge of the portion H3 may be located at the same height as the lower edge of the first shielding portion H1 or below the lower edge of the first shielding portion H1 (that is, a gap between the two shielding portions H2 and H1). On the other hand, there may be no gap between the two shielding portions H3 and H1). In this case, the circuit board 41 may be arranged so as to be offset from the center C2 of the first shielding portion H1 to the third shielding portion H3 side in the vertical direction.

As shown in FIG. 9, the first shielding portion H1 and the second shielding portion H2 are arranged so as to be offset from each other in the front-rear direction. The above-mentioned first exhaust port E1 is formed between the first shielding portion H1 and the second shielding portion H2. According to this structure, by increasing the distance between the two shielding portions H1 and H2 in the front-rear direction, the exhaust efficiency can be improved without causing the circuit board 41 of the power supply unit 40 to be exposed. In the example of the electronic device 1, the second shielding portion H2 is located behind the first shielding portion H1.

It is desirable that the second shielding portion H2 and the first shielding portion H1 do not overlap in a plan view. That is, it is preferable that the entire second shielding portion H2 is located behind the rear end (upper end) of the first shielding portion H1. By doing so, it becomes easy to secure the exhaust efficiency.

As shown in FIG. 9, the first shielding portion H1 and the third shielding portion H3 are also arranged so as to be offset from each other in the front-rear direction. A second exhaust port E2 is formed between the first shielding portion H1 and the third shielding portion H3. According to this structure, by increasing the distance between the two shielding portions H1 and H3, the exhaust efficiency can be improved without causing the circuit board 41 of the power supply unit 40 to be exposed. In the example of the electronic device 1, the third shielding portion H3 is located behind the first shielding portion H1.

It is desirable that the third shielding portion H3 and the first shielding portion H1 also do not overlap in a plan view. That is, it is desirable that the entire third shielding portion H3 is located behind the rear end (upper end) of the first shielding portion H1.

As shown in FIG. 9, the second shielding portion H2 and the third shielding portion H3 are displaced in the same direction with respect to the first shielding portion H1. By doing so, for example, as compared with the structure in which the second shielding portion H2 and the third shielding portion H3 are displaced in opposite directions with respect to the first shielding portion H1, the entire shielding portions H1, H2, and H3 are in the front-rear direction. The width can be reduced. As a result, the electronic device 1 can be miniaturized.

In the example of the electronic device 1, both the second shielding portion H2 and the third shielding portion H3 are located behind the first shielding portion H1. As a result, the second exhaust port E2 and the first exhaust port E1 are provided so as to face each other in the vertical direction. The second exhaust port E2 located on the upper side is open downward, and the first exhaust port E1 located on the lower side is open upward. By doing so, it is possible to prevent the exhaust ports E1 and E2 from being exposed to the outside. The layout of the shielding portions H1, H2, and H3 is not limited to the example described here. For example, the third shielding portion H3 may be located in front of the first shielding portion H1, and the second shielding portion H2 may be located behind the first shielding portion H1.

As shown in FIG. 9, an air flow path S4 is formed above the first shielding portion H1. The air that has passed through the air flow path S4 is discharged from the first exhaust port E1. As shown in FIG. 10, the air flow path S4 is provided with a plurality of guide portions H4 extending from the position of the first shielding portion H1 toward the second shielding portion H2. The plurality of guide portions H4 are arranged in the left-right direction. The guide unit H4 guides the air flow in the front-rear direction. In the example of the electronic device 1, the guide portion H4 is integrally formed with the frame 20. Then, the guide portion H4 connects the upper edge of the first shielding portion H1 and the second shielding portion H2.

As described above, an air flow path S5 (see FIG. 9) is formed below the first shielding portion H1. The air that has passed through the air flow path S5 is discharged from the second exhaust port E2. As shown in FIG. 10, the air flow path S5 is provided with a plurality of guide portions H5 extending from the position of the first shielding portion H1 toward the third shielding portion H3. The plurality of guide portions H5 are arranged in the left-right direction. The air flow is guided in the front-rear direction by the guide portion H5. In the example of the electronic device 1, the guide portion H5 is integrally formed with the frame 20. More specifically, the guide portion H5 is formed on the bottom panel portion 21g that defines the bottom of the air flow path S5.

As described above, the power supply unit 40 is arranged in front of the shielding portions H1, H2, and H3. The circuit board 41 is arranged inside the case 42 of the power supply unit 40. As shown in FIG. 9, the circuit board 41 is arranged so as to be offset from the center C2 of the first shielding portion H1 to the second shielding portion H2 side in the vertical direction. In the example of the electronic device 1, the circuit board 41 is displaced upward from the center C2 of the first shielding portion H1. The distance between the second shield H2 and the circuit board 41 in the front-rear direction is larger than the distance between the first shield H1 and the circuit board 41 in the front-rear direction. According to such a layout of the circuit board 41 and the second shielding portion H2, it is possible to prevent the circuit board 41 from becoming an obstacle to the air flow.

As shown in FIG. 9, the trailing edge 41a of the circuit board 41 is located in front of the first shielding portion H1. An air flow path is formed between the trailing edge 41a of the circuit board 41 and the first shielding portion H1. According to this layout, the air flowing under the circuit board 41 can be discharged from the first exhaust port E1 through the flow path between the trailing edge 41a of the circuit board 41 and the first shielding portion H1. As a result, the cooling performance for the components mounted on the circuit board 41 can be improved.

In the example of the electronic device 1, the circuit board 41 is located above the upper edge of the first shielding portion H1. As a result, the distance between the trailing edge 41a of the circuit board 41 and the first shielding portion H1 can be easily secured, and the air flow through the air flow path formed between them can be further smoothed.

As shown in FIG. 9, the first shielding portion H1 is inclined so that the distance between the circuit board 41 and the first shielding portion H1 increases as it approaches the second shielding portion H2. That is, the first shielding portion H1 is inclined so that the upper portion thereof is located behind the lower portion. According to this structure of the first shielding portion H1, the distance between the trailing edge 41a of the circuit board 41 and the first shielding portion H1 can be further secured, and the air flow can be further smoothed. In the example of the electronic device 1, the second shielding portion H2 and the third shielding portion H3 are inclined to the rear side in the same manner as the first shielding portion H1. The shielding portions H1, H2, and H3 do not necessarily have to be inclined. That is, the shielding portions H1, H2, and H3 may be arranged vertically.

As shown in FIG. 9, a convex portion 42b projecting downward is formed on the upper wall portion 42a of the case 42. The circuit board 41 is located at the lower end of the convex portion 42b and is separated downward from the upper wall portion 42a. As a result, it is possible to prevent the circuit board 41 and the component 41b mounted on the circuit board 41 from being seen from the outside through the first exhaust port E1. In the example of the electronic device 1, the convex portion 42b has a wall shape extending in the front-rear direction.

As described above, the circuit board 41 is arranged so as to be displaced upward with respect to the center C2 of the first shielding portion H1 in the vertical direction. Various components (for example, components such as a transformer constituting a power supply circuit) 41b are mounted on the lower surface of the circuit board 41. An air flow path S5 is formed below the first shielding portion H1, and a second exhaust port E2 for discharging air from the air flow path S5 is formed between the first shielding portion H1 and the third shielding portion H3. Has been done. According to this layout of the circuit board 41 and the second exhaust port E2, the air that has passed through the component 41b of the circuit board 41 (the air that has passed through the lower part of the case 42) can be smoothly discharged from the second exhaust port E2. As a result, the cooling performance for the components mounted on the circuit board 41 can be improved.

As shown in FIG. 9, the second shielding portion H2 is farther from the case 42 than the first shielding portion H1. The case 42 has a wall portion that defines an air flow path S4 that continues to the first exhaust port E1. In the example of the electronic device 1, the case 42 has an upper wall portion 42a and a lower wall portion 42c. The upper wall portion 42a extends rearward more than the lower wall portion 42c. The trailing edge 42g of the upper wall portion 42a is connected to the second shielding portion H2. More specifically, the trailing edge 42g of the upper wall portion 42a is connected to the upper end of the second shielding portion H2. The air flow path S4 is defined by the upper wall portion 42a. The structure of the case 42 is not limited to the example described here. For example, instead of the upper wall portion 42a of the case 42, a panel portion forming the upper wall of the air flow path S4 formed above the first shielding portion H1 is provided on the rear wall portion 21C of the frame 20. May be good.

The bottom of the air flow path S5 formed under the first shielding portion H1 is defined by the bottom panel portion 21g. The bottom panel portion 21g is provided on the rear wall portion 21C of the frame 20. The trailing edge 42h of the lower wall portion 42c of the case 42 is connected to the leading edge of the bottom panel portion 21g.

Various components may also be arranged below the power supply unit 40. For example, in the example of the electronic device 1, as shown in FIG. 9, the hard disk device 8 is arranged below the power supply unit 40. The lower side of the hard disk device 8 is covered with a lower cover 60.

Further, a component such as a connector mounted on the circuit board 31 may be arranged below the power supply unit 40. In this case, as shown in FIG. 10, openings 21h and 61h for exposing the connector to the rear may be formed in the rear wall portion 21C of the frame 20 and the rear wall portion 61C of the lower cover 60.

As described above, the electronic device 1 has a metal plate 39. The metal plate 39 is arranged on the side opposite to the chassis 32 and 33 and the circuit board 31 with the cooling fan 5 interposed therebetween, and the metal plate 39 is attached to the frame 20. According to such a structure using the metal plate 39, the rigidity of the frame 20 can be improved without increasing the thickness of the wall portions 21A, 21B, 21C, 21D of the frame 20.

Further, the exterior member A of the electronic device 1 has a first shielding portion H1 and a second shielding portion H2 that are arranged so as to be displaced from each other in the front-rear direction. The above-mentioned first exhaust port E1 is formed between the first shielding portion H1 and the second shielding portion H2. According to this structure, by increasing the distance between the two shielding portions H1 and H2 in the front-rear direction, the exhaust efficiency can be improved without causing the circuit board 41 of the power supply unit 40 to be exposed.

In the present specification, the exterior member A means a member that constitutes at least a part of the outer surface of the electronic device. Therefore, the exterior member A is not limited to the covers 50 and 60 and the frame 20. For example, another member may be attached to the covers 50 and 60 (here, the member attached to the covers 50 and 60 is referred to as an attached member). When a part or all of the attached member is exposed on the outer surface of the electronic device, the attached member also constitutes the exterior member A. In this case, all or part of the shielding portions H1, H2, and H3 may be provided on the attached member.

Further, in the example of the electronic device 1, the shielding portions H1, H2, and H3 are integrally formed with the exterior member A. Specifically, the first shielding portion H1 is integrally formed with the frame 20. Further, the rear wall portion 51C constituting the second shielding portion H2 is integrally formed with the upper cover 50, and the panel portion 21m constituting the second shielding portion H2 is integrally formed with the frame 20. There is. Further, the third shielding portion H3 is integrally formed with the lower cover 60. However, each of the shielding portions H1, H2, and H3 may be a member formed separately from the exterior member A. Then, the shielding portions H1, H2, and H3 may be attached to the exterior member A by a fixing tool such as a screw, an engaging claw formed on the shielding portions H1, H2, and H3, and the like.

The present invention is not limited to the embodiments described above, and various modifications can be made.

For example, in the electronic device 1, the exhaust ports E1 and E2 may not be formed by the shielding portions H1, H2, and H3 that are displaced in the front-rear direction.

Further, the electronic device 1 does not necessarily have to have parts such as an optical disk drive 7 and a power supply unit 40.

1 Electronic equipment, 5 Cooling fan, 7 Optical disk drive, 10 Main body, 20 frame, 21 frame outer circumference, 21C rear wall, 22 flow path wall, 22A curved wall, 22B first side wall, 22C second side wall , 31 circuit board, 32, 33 chassis, 34 heat sink, 39 metal plate, 39A flow path upper wall part, 39B parts cover part, 39c fin cover part, 40 power supply unit, 41 circuit board, 42 case, 50 upper cover, 60 lower Cover, H1, H2, H3 shield, H4, H5 guide, P1 intake port, S1, S2, S3 air flow path.

Claims (16)

A heat sink, a cooling fan for sending air to the heat sink, and
A frame made of resin and having an outer peripheral portion surrounding the heat sink and the cooling fan.
A circuit board arranged on one side in the first direction with respect to the heat sink,
A chassis located on one side of the heat sink and the cooling fan in the first direction and made of metal.
It has a power supply unit surrounded by the outer peripheral portion of the frame, and has.
The frame has two side walls located on opposite sides of the cooling fan or heat sink in a second direction orthogonal to the first direction.
A first wall portion located on the other side of the cooling fan in the first direction and a second wall portion located on the other side of the heat sink in the first direction and covering the heat sink. A wall portion and an exterior cover located on the other side of the first wall portion and the second wall portion in the first direction and covering the first wall portion and the second wall portion. Is provided,
A fin cover located on the other side of the cooling fan fin in the first direction is provided on the first wall portion, and the fin cover is arranged in the circumferential direction of the cooling fan and is partitioned from each other. Multiple openings are formed,
The first wall portion is lowered toward the cooling fan with respect to the second wall portion, and an intake flow path is formed between the first wall portion and the exterior cover.
An electronic device characterized in that the fin cover has a height in the first direction with respect to the first wall portion. The electronic device according to claim 1, wherein the chassis is attached to the outer peripheral portion of the frame. An air flow path is formed inside the outer peripheral portion of the frame.
The electronic device according to claim 1 or 2, wherein the two side wall portions of the frame function as a wall defining the air flow path. The two side wall portions of the frame form a flow path wall portion that defines the outer shape of the air flow path when the air flow path is viewed in the first direction.
The electronic device according to claim 3, wherein the power supply unit is connected to an end portion of the flow path wall portion. The cooling fan is arranged so that its rotation center line faces the first direction.
The electronic device according to claim 1, wherein the frame has a flow path wall portion that surrounds the outer periphery of the cooling fan. The electronic device according to claim 5, wherein the heat sink is arranged in an air flow path formed inside the frame. A heat sink, a cooling fan for sending air to the heat sink, and
A flow path wall portion that surrounds the heat sink and the cooling fan and is formed of resin to define an air flow path.
A circuit board arranged on one side in the first direction with respect to the heat sink,
A first metal plate arranged on one side of the heat sink and the cooling fan in the first direction and formed of metal.
With a power supply unit,
The flow path wall portion has two side wall portions located on opposite sides of the cooling fan or the heat sink in a second direction orthogonal to the first direction.
A first wall portion located on the other side of the cooling fan in the first direction and a second wall portion located on the other side of the heat sink in the first direction and covering the heat sink. A wall portion and an exterior cover located on the other side of the first wall portion and the second wall portion in the first direction and covering the first wall portion and the second wall portion. Is provided,
A fin cover located on the other side of the cooling fan fin in the first direction is provided on the first wall portion, and the fin cover is lined up in the circumferential direction of the cooling fan and is partitioned from each other. Multiple openings are formed,
The first wall portion is lowered toward the cooling fan with respect to the second wall portion, and an intake flow path is formed between the first wall portion and the exterior cover.
An electronic device characterized in that the fin cover has a height in the first direction with respect to the first wall portion. The electronic device according to claim 1, wherein the frame has a curved wall portion that surrounds the outer periphery of the cooling fan and is curved along the outer periphery of the cooling fan. The electronic device according to claim 7, wherein the flow path wall portion has a curved wall portion that surrounds the outer periphery of the cooling fan and is curved along the outer circumference of the cooling fan. Further having an exterior member including the frame and constituting the exterior of the electronic device.
The exterior member has a first shielding portion and a second shielding portion located in a third direction with respect to the power supply unit.
The first shielding portion and the second shielding portion are arranged in a fourth direction orthogonal to the third direction when the first shielding portion and the second shielding portion are viewed in the third direction. Orthogonal
The first shielding portion and the second shielding portion are arranged so as to be offset from each other in the third direction, and have a first vent between the first shielding portion and the second shielding portion. The electronic device according to claim 1. The exterior member has a third shielding portion and has a third shielding portion.
The third shielding portion is located on the side opposite to the second shielding portion with the first shielding portion interposed therebetween in the fourth direction.
The third shielding portion and the first shielding portion are arranged so as to be offset from each other in the third direction, and a second vent is provided between the first shielding portion and the third shielding portion. The electronic device according to claim 10. It is arranged in a fifth direction orthogonal to both the third direction and the fourth direction, and has a plurality of guide portions extending from the position of the first shielding portion to the second shielding portion. The electronic device according to claim 10, wherein the electronic device is provided. The power supply unit has a circuit board and
The circuit board is arranged so as to be offset from the center of the first shielding portion in the fourth direction toward the second shielding portion side.
The distance between the second shield and the circuit board in the third direction is larger than the distance between the first shield and the circuit board in the third direction. The electronic device according to claim 10. The power supply unit has a circuit board and a case accommodating the circuit board.
The case has an opening that is open in the third direction.
10. A aspect of claim 10, wherein the edge of the opening of the case is connected to the second shield or the first shield, and the case defines an air flow path leading to the first vent. Described electronic devices. The fin covers are arranged in the circumferential direction of the cooling fan and each has a plurality of connecting portions that partition the two adjacent openings, and each of the plurality of connecting portions has a connection with respect to the first direction. The electronic device according to claim 1 or 7, wherein the electronic device is formed diagonally. When viewed in front Symbol first direction, one end of the stepped curved to have a step is formed so as to surround the street and before Symbol fins cover between said first wall portion and the second wall portion The electronic device according to claim 1 or 7, wherein the other end of the step is connected to the first edge of the first wall portion and is connected to the second edge of the first wall portion. ..

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