JP6775848B2 - Heat dissipation plate material - Google Patents
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- JP6775848B2 JP6775848B2 JP2019072555A JP2019072555A JP6775848B2 JP 6775848 B2 JP6775848 B2 JP 6775848B2 JP 2019072555 A JP2019072555 A JP 2019072555A JP 2019072555 A JP2019072555 A JP 2019072555A JP 6775848 B2 JP6775848 B2 JP 6775848B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
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Description
本発明は、放熱板材に関し、より詳細には、高出力素子のパッケージング用に適切に使用することができる放熱板材であって、アルミナ（Ａｌ２Ｏ３）のようなセラミック素材を含む素子と接合させても、良好な接合が可能となるように、セラミック素材と類似したレベルの熱膨張係数を有し、かつ、高出力素子で発生する多量の熱を迅速に外部に排出できる高い熱伝導度を示す放熱板材に関する。 The present invention relates to a heat radiating plate material, and more specifically, a heat radiating plate material that can be appropriately used for packaging a high output element and includes an element containing a ceramic material such as alumina (Al 2 O 3 ). High thermal conductivity that has a coefficient of thermal expansion similar to that of ceramic materials and can quickly discharge a large amount of heat generated by high-power elements to the outside so that good bonding is possible even when bonded. It relates to a heat radiation plate material showing a degree.
最近、情報通信および国防分野の核心技術としてＧａＮ系化合物半導体を利用した高出力増幅素子が注目を集めている。 Recently, high-power amplification devices using GaN-based compound semiconductors have been attracting attention as core technologies in the fields of information communication and national defense.
このような高出力電子素子や光素子では、一般素子に比べて多くの熱が発生し、このように発生した多量の熱を効率的に排出できるパッケージング技術が必要である。 Such high-power electronic devices and optical devices generate more heat than general devices, and packaging technology capable of efficiently discharging the large amount of heat generated in this way is required.
現在、ＧａＮ系化合物半導体を活用した高出力半導体素子には、タングステン（Ｗ）／銅（Ｃｕ）の２層複合素材、銅（Ｃｕ）とモリブデン（Ｍｏ）の２相（ｐｈａｓｅ）複合素材、銅（Ｃｕ）／銅−モリブデン（Ｃｕ−Ｍｏ）合金／銅（Ｃｕ）の３層複合素材、銅（Ｃｕ）／モリブデン（Ｍｏ）／銅（Ｃｕ）／モリブデン（Ｍｏ）／銅（Ｃｕ）の多層複合素材のように比較的良好な熱伝導度と低い熱膨張係数を有する金属基複合板材が使用されている。 Currently, high-power semiconductor elements that utilize GaN-based compound semiconductors include a two-layer composite material of tungsten (W) / copper (Cu), a two-phase composite material of copper (Cu) and molybdenum (Mo), and copper. (Cu) / copper-molybdenum (Cu-Mo) alloy / copper (Cu) three-layer composite material, copper (Cu) / copper (Mo) / copper (Cu) / copper (Mo) / copper (Cu) multilayer A metal-based composite plate material having relatively good thermal conductivity and a low thermal expansion coefficient, such as a composite material, is used.
ところが、これらの複合板材の厚さ方向の熱伝導度は、最大２００〜３００Ｗ／ｍＫ程度であり、実際にそれ以上の高い熱伝導度を具現しないので、数百ワット級のパワートランジスターのような素子に適用するための新しい放熱素材あるいは放熱基板が市場で至急に要求されている。また、銅（Ｃｕ）／モリブデン（Ｍｏ）／銅（Ｃｕ）／モリブデン（Ｍｏ）／銅（Ｃｕ）の多層複合素材の場合、各層間の結合力が低いという問題点もある。 However, the thermal conductivity of these composite plates in the thickness direction is about 200 to 300 W / mK at the maximum, and since it does not actually realize higher thermal conductivity, it is similar to a power transistor of several hundred watt class. There is an urgent need in the market for new heat-dissipating materials or heat-dissipating substrates for application to devices. Further, in the case of a multilayer composite material of copper (Cu) / molybdenum (Mo) / copper (Cu) / molybdenum (Mo) / copper (Cu), there is also a problem that the bonding force between each layer is low.
一方、半導体素子を製造する工程には、アルミナ（Ａｌ２Ｏ３）のようなセラミック素材とのブレージング接合工程が必須である。 On the other hand, in the process of manufacturing a semiconductor element, a brazing bonding process with a ceramic material such as alumina (Al 2 O 3 ) is indispensable.
このようなブレージング接合工程は、約８００℃以上の高温で行われるので、金属複合材基板とセラミック素材間の熱膨張係数の差異によって、ブレージング接合過程で反りや破損が発生し、このような反りや破損は、素子の信頼性に致命的な影響を与えるようになる。 Since such a brazing joining process is performed at a high temperature of about 800 ° C. or higher, warpage or breakage occurs in the brazing joining process due to the difference in the coefficient of thermal expansion between the metal composite substrate and the ceramic material, and such warping occurs. And damage will have a fatal effect on the reliability of the device.
このような要求に対応するために、本発明者らは、下記特許文献２に開示されたように、銅（Ｃｕ）からなるカバー層（第１層、第５層）と、銅（Ｃｕ）とモリブデン（Ｍｏ）の合金からなる中間層（第２層、第４層）と、放熱板材の上下面に平行な方向に沿って銅（Ｃｕ）層とモリブデン（Ｍｏ）層が交互に繰り返される構造を有するコア層からなる放熱板材を提示したが、この構造の放熱板材は、セラミック素材の熱膨張係数と同一または類似しながらも、４００Ｗ／ｍＫ以上の優れた熱伝導度を示すが、複雑な構造によって製造工程数と工程費用が増加する問題点がある。 In order to meet such demands, the present inventors, as disclosed in Patent Document 2 below, cover layers (first layer, fifth layer) made of copper (Cu) and copper (Cu). Intermediate layers (second and fourth layers) made of an alloy of molybdenum (Mo) and copper (Cu) layers and molybdenum (Mo) layers are alternately repeated along the direction parallel to the upper and lower surfaces of the heat radiation plate material. Although a heat radiating plate material composed of a core layer having a structure is presented, the heat radiating plate material having this structure exhibits excellent thermal conductivity of 400 W / mK or more, although it is the same as or similar to the coefficient of thermal expansion of the ceramic material, but is complicated. There is a problem that the number of manufacturing processes and the process cost increase due to the structure.
この故、より簡単な工程で製造できる構造を有し、かつ、厚さ方向に優れた熱伝導性を示すと同時に、厚さ方向に垂直な面方向にセラミック素材と類似したレベル熱膨張係数を具現することができる放熱板材の開発が要求されている。 Therefore, it has a structure that can be manufactured by a simpler process, exhibits excellent thermal conductivity in the thickness direction, and at the same time, has a level thermal expansion coefficient similar to that of ceramic materials in the plane direction perpendicular to the thickness direction. There is a demand for the development of heat dissipation plate materials that can be realized.
本発明の課題は、厚さ方向に３００Ｗ／ｍＫ以上の優れた熱伝導性と共に、厚さ方向に垂直な面方向に７×１０−６／Ｋ〜１２×１０−６／Ｋのレベルの熱膨張係数を具現することができる放熱板材を提供することにある。 An object of the present invention, together with excellent thermal conductivity above 300 W / mK in the thickness direction, of the level of 7 × 10 -6 / K~12 × 10 -6 / K in a plane direction perpendicular to the thickness direction thermal An object of the present invention is to provide a heat radiating plate material capable of realizing an expansion coefficient.
前記課題を解決するために、本発明は、銅（Ｃｕ）または銅（Ｃｕ）合金からなる第１層と、前記第１層上に形成され、銅（Ｃｕ）とモリブデン（Ｍｏ）を含む合金からなる第２層と、前記第２層上に形成され、銅（Ｃｕ）または銅（Ｃｕ）合金からなる第３層と、前記第３層上に形成され、銅（Ｃｕ）とモリブデン（Ｍｏ）を含む合金からなる第４層と、前記第４層上に形成され、銅（Ｃｕ）または銅（Ｃｕ）合金からなる第５層とを含む放熱板材であって、前記第１層、第３層および第５層の厚さは、１０〜１，０００μｍであり、前記第２層と第４層の厚さは、１０〜６０μｍであり、前記放熱板材全体に含まれるモリブデン（Ｍｏ）の含量は、３〜１５重量％である、放熱板材を提供する。 In order to solve the above problems, the present invention comprises a first layer made of copper (Cu) or a copper (Cu) alloy, and an alloy formed on the first layer and containing copper (Cu) and molybdenum (Mo). A second layer composed of, a third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy, and formed on the third layer, copper (Cu) and molybdenum (Mo). A heat-dissipating plate material containing a fourth layer made of an alloy containing) and a fifth layer formed on the fourth layer and made of copper (Cu) or a copper (Cu) alloy, wherein the first layer and the first layer. The thickness of the third layer and the fifth layer is 10 to 1,000 μm, the thickness of the second layer and the fourth layer is 10 to 60 μm, and the thickness of the molybdenum (Mo) contained in the entire heat radiating plate material is Provided is a radiating plate material having a content of 3 to 15% by weight.
本発明による放熱板材は、銅（Ｃｕ）層と銅（Ｃｕ）−モリブデン（Ｍｏ）合金層からなる５層積層構造と、銅（Ｃｕ）層および銅（Ｃｕ）−モリブデン（Ｍｏ）合金層のそれぞれの厚さに対する制御と、放熱板材全体で占めるモリブデン（Ｍｏ）の含量の制御を通じて、従来の５層積層構造で具現しにくい厚さ方向に３００Ｗ／ｍＫ以上（より好ましくは３５０Ｗ／ｍＫ以上）の優れた熱伝導度とともに、７〜１２×１０−６／Ｋの範囲の面方向の熱膨張係数を具現することができるので、一般素子に比べて多くの熱が発生する高出力電子素子や光素子のパッケージングに適切に使用することができる。 The heat radiating plate material according to the present invention has a five-layer laminated structure consisting of a copper (Cu) layer and a copper (Cu) -molybdenum (Mo) alloy layer, and a copper (Cu) layer and a copper (Cu) -molybdenum (Mo) alloy layer. 300 W / mK or more (more preferably 350 W / mK or more) in the thickness direction, which is difficult to realize with the conventional 5-layer laminated structure, through control for each thickness and control of the content of molybdenum (Mo) in the entire heat radiation plate material. Since it is possible to realize a thermal expansion coefficient in the plane direction in the range of 7 to 12 × 10-6 / K together with the excellent thermal conductivity of molybdenum, high-power electronic devices that generate more heat than general devices It can be appropriately used for packaging optical elements.
また、本発明による放熱板材は、５個の層を積層する単純な構造からなるので、製造が容易であり、製造費用を節減することができる。 Further, since the heat radiating plate material according to the present invention has a simple structure in which five layers are laminated, it is easy to manufacture and the manufacturing cost can be reduced.
以下、添付の図面を参照して本発明の好ましい実施例を詳細に説明する。しかしながら、下記に例示する本発明の実施例は、様々な他の形態に変形され得、本発明の範囲が下記に詳述する実施例に限定されるものではない。本発明の実施例は、当業界において平均的な知識を有する者に本発明をより完全に説明するために提供されるものである。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the examples of the present invention illustrated below can be transformed into various other forms, and the scope of the present invention is not limited to the examples detailed below. The embodiments of the present invention are provided to more fully explain the present invention to those with average knowledge in the art.
本発明者らは、格子構造のような複雑な構造でなく、単純な積層構造を有し、かつ、図１に示された面方向（厚さ方向に垂直な方向を意味する）に７〜１２×１０−６／Ｋの熱膨張係数を示し、厚さ方向に３００Ｗ／ｍＫ以上の優れた熱伝導度を具現し、層間の結合力を良好に維持できる放熱板材について研究した。 The present inventors have a simple laminated structure rather than a complicated structure such as a lattice structure, and have 7 to 7 to 7 in the plane direction (meaning the direction perpendicular to the thickness direction) shown in FIG. We studied a heat-dissipating plate material that exhibits a coefficient of thermal expansion of 12 × 10-6 / K, realizes excellent thermal conductivity of 300 W / mK or more in the thickness direction, and can maintain good bonding force between layers.
その結果、図２に示されたように、銅（Ｃｕ）層と銅（Ｃｕ）−モリブデン（Ｍｏ）の合金層間の境界面の面積が増加するほど（Ｃｕ−Ｍｏ合金層よりもＣｕ／Ｃｕ−Ｍｏ／Ｃｕ層の３層構造の境界面の面積が増加し、Ｃｕ／Ｃｕ−Ｍｏ／Ｃｕ層の３層構造よりもＣｕ／Ｃｕ−Ｍｏ／Ｃｕ層／Ｃｕ−Ｍｏ層／Ｃｕ層の５層構造の境界面の面積が増加する）、少ないモリブデン（Ｍｏ）の含量でも低い熱膨張係数を具現することができる点、銅（Ｃｕ）層と銅（Ｃｕ）−モリブデン（Ｍｏ）の合金層間には、十分な結合力を得ることができる点、銅（Ｃｕ）−モリブデン（Ｍｏ）合金層の厚さを所定の範囲に低く制御する場合、放熱板材の厚さ方向の熱伝導度を高めることができる点などを考慮して、本発明に至るようになった。 As a result, as shown in FIG. 2, as the area of the interface between the copper (Cu) layer and the copper (Cu) -molybdenum (Mo) alloy layer increases (Cu / Cu more than the Cu-Mo alloy layer). The area of the interface of the three-layer structure of the −Mo / Cu layer is increased, and the Cu / Cu—Mo / Cu layer / Cu—Mo layer / Cu layer is 5 more than the three-layer structure of the Cu / Cu—Mo / Cu layer. (The area of the interface of the layer structure increases), a low thermal expansion coefficient can be realized even with a small content of molybdenum (Mo), and an alloy layer between a copper (Cu) layer and copper (Cu) -molybdenum (Mo) In addition, a sufficient bonding force can be obtained, and when the thickness of the copper (Cu) -molybdenum (Mo) alloy layer is controlled to be low within a predetermined range, the thermal conductivity in the thickness direction of the heat dissipation plate material is increased. The present invention has come to be made in consideration of the points that can be achieved.
本発明による放熱板材は、銅（Ｃｕ）または銅（Ｃｕ）合金からなる第１層と、前記第１層上に形成され、銅（Ｃｕ）とモリブデン（Ｍｏ）を含む合金からなる第２層と、前記第２層上に形成され、銅（Ｃｕ）または銅（Ｃｕ）合金からなる第３層と、前記第３層上に形成され、銅（Ｃｕ）とモリブデン（Ｍｏ）を含む合金からなる第４層と、前記第４層上に形成され、銅（Ｃｕ）または銅（Ｃｕ）合金からなる第５層とを含み、前記第１層、第３層および第５層の厚さは、１０〜１，０００μｍであり、前記第２層と第４層の厚さは、１０〜６０μｍであり、前記放熱板材全体に含まれるモリブデン（Ｍｏ）の含量は、３〜１５重量％であることを特徴とする。 The heat radiating plate material according to the present invention has a first layer made of copper (Cu) or a copper (Cu) alloy, and a second layer formed on the first layer and made of an alloy containing copper (Cu) and molybdenum (Mo). And a third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy, and an alloy formed on the third layer and containing copper (Cu) and molybdenum (Mo). 4th layer and a 5th layer formed on the 4th layer and made of copper (Cu) or a copper (Cu) alloy, the thickness of the 1st layer, the 3rd layer and the 5th layer is , 10 to 1,000 μm, the thickness of the second layer and the fourth layer is 10 to 60 μm, and the content of molybdenum (Mo) contained in the entire heat radiation plate material is 3 to 15% by weight. It is characterized by that.
本発明による放熱板材は、銅（Ｃｕ）層／銅（Ｃｕ）−モリブデン（Ｍｏ）合金層／銅（Ｃｕ）層／銅（Ｃｕ）−モリブデン（Ｍｏ）合金層／銅（Ｃｕ）層の５層構造からなるが、このように少なくとも５層構造を形成することによって、銅（Ｃｕ）層／銅（Ｃｕ）−モリブデン（Ｍｏ）合金層間の境界面の面積を広げることができるので、放熱板材に含まれる銅（Ｃｕ）−モリブデン（Ｍｏ）合金層の厚さを薄く維持しながらも、面方向に７〜１２×１０−６／Ｋの熱膨張係数を具現することができる。 The heat radiating plate material according to the present invention is 5 of copper (Cu) layer / copper (Cu) -molybdenum (Mo) alloy layer / copper (Cu) layer / copper (Cu) -molybdenum (Mo) alloy layer / copper (Cu) layer. Although it has a layered structure, by forming at least a five-layer structure in this way, the area of the interface between the copper (Cu) layer / copper (Cu) -molybdenum (Mo) alloy layers can be expanded, so that the heat dissipation plate material While maintaining the thickness of the copper (Cu) -molybdenum (Mo) alloy layer contained in the above as thin, it is possible to realize a thermal expansion coefficient of 7 to 12 × 10-6 / K in the plane direction.
前記第１層、第３層および第５層は、銅（Ｃｕ）９９重量％以上の銅（Ｃｕ）はもちろん、多様な合金元素を含む銅（Ｃｕ）合金からなり得、銅（Ｃｕ）合金の場合、放熱特性を考慮するとき、銅（Ｃｕ）を８０重量％以上、好ましくは９０重量％以上、より好ましくは９５重量％以上含むことができる。 The first layer, the third layer, and the fifth layer may be made of a copper (Cu) alloy containing 99% by weight or more of copper (Cu) as well as various alloying elements, and may be a copper (Cu) alloy. In the case of, copper (Cu) can be contained in an amount of 80% by weight or more, preferably 90% by weight or more, and more preferably 95% by weight or more when considering the heat dissipation characteristics.
前記第２層と第４層は、銅（Ｃｕ）とモリブデン（Ｍｏ）を含む合金からなるが、この合金は、銅（Ｃｕ）：５〜４０重量％、モリブデン（Ｍｏ）：６０〜９５重量％を含むことが好ましいが、これは、銅（Ｃｕ）含量が５重量％未満なら、銅（Ｃｕ）層との結合力を良好に維持しにくく、厚さ方向の熱伝導度が減少し、４０重量％超過なら、面方向の熱膨張係数を低く維持しにくいためである。 The second layer and the fourth layer are made of an alloy containing copper (Cu) and molybdenum (Mo), and this alloy has copper (Cu): 5 to 40% by weight and molybdenum (Mo): 60 to 95% by weight. It is preferable to contain%, but this is because if the copper (Cu) content is less than 5% by weight, it is difficult to maintain good bonding force with the copper (Cu) layer, and the thermal conductivity in the thickness direction decreases. This is because if it exceeds 40% by weight, it is difficult to keep the coefficient of thermal expansion in the plane direction low.
前記第１層、第３層および第５層の厚さは、１０〜１，０００μｍの範囲を維持する場合、放熱板材の面方向の熱膨張係数を１２×１０−６／Ｋの範囲に維持し、厚さ方向の熱伝導度を３００Ｗ／ｍＫ以上に具現することができるので、前記範囲に維持することが好ましい。 When the thickness of the first layer, the third layer and the fifth layer is maintained in the range of 10 to 1,000 μm, the coefficient of thermal expansion in the surface direction of the heat radiating plate material is maintained in the range of 12 × 10-6 / K. However, since the thermal conductivity in the thickness direction can be realized at 300 W / mK or more, it is preferable to maintain the thermal conductivity in the above range.
前記第２層と第４層の厚さは、１０μｍ未満の場合、面方向の熱膨張係数を７〜１２×１０−６／Ｋの範囲に維持することが難しく、６０μｍ超過の場合、厚さ方向の熱伝導度を３００Ｗ／ｍＫ以上に維持しにくいので、１０〜６０μｍの範囲に維持することが好ましい。 When the thickness of the second layer and the fourth layer is less than 10 μm, it is difficult to maintain the coefficient of thermal expansion in the plane direction in the range of 7 to 12 × 10-6 / K, and when it exceeds 60 μm, the thickness is increased. Since it is difficult to maintain the thermal conductivity in the direction at 300 W / mK or more, it is preferable to maintain it in the range of 10 to 60 μm.
前記放熱板材全体において、モリブデン（Ｍｏ）の含量は、３重量％未満の場合、面方向の熱膨張係数を１２×１０−６／Ｋの範囲以下に具現しにくく、モリブデン（Ｍｏ）の含量は、１５重量％超過の場合、厚さ方向の熱伝導度を３００Ｗ／ｍＫ以上に具現しにくいので、３〜１５重量％の範囲に維持することが好ましく、５〜１０重量％の範囲に維持することが、面方向の熱膨張係数および熱伝導度の側面からより好ましい。 When the content of molybdenum (Mo) in the entire heat radiation plate material is less than 3% by weight, it is difficult to realize the coefficient of thermal expansion in the plane direction within the range of 12 × 10-6 / K, and the content of molybdenum (Mo) is If it exceeds 15% by weight, it is difficult to realize the thermal conductivity in the thickness direction to 300 W / mK or more. Therefore, it is preferably maintained in the range of 3 to 15% by weight, and maintained in the range of 5 to 10% by weight. This is more preferable in terms of the coefficient of thermal expansion in the plane direction and the thermal conductivity.
前記放熱板材において、放熱板材の面方向の熱膨張係数は、７×１０−６／Ｋ〜１２×１０−６／Ｋであることが好ましいが、この範囲を外れる場合、セラミック素子との接合または使用時に熱膨張係数の差異による不良が発生しやすいためである。 In the cooling plate, the thermal expansion coefficient in the planar direction of the cooling plate is preferably a 7 × 10 -6 / K~12 × 10 -6 / K, when outside this range, the bonding between the ceramic element or This is because defects are likely to occur due to the difference in the coefficient of thermal expansion during use.
前記放熱板材において、厚さ方向の熱伝導度は、３００Ｗ／ｍＫ以上であり、より好ましくは３５０Ｗ／ｍＫ以上であってもよい。。 In the heat radiating plate material, the thermal conductivity in the thickness direction may be 300 W / mK or more, more preferably 350 W / mK or more. ..
前記放熱板材において、全体厚さが０．０５ｍｍ未満であるか、１０ｍｍを超過する場合、本発明の構造を有する放熱板材を用いて面方向の熱膨張係数は、７×１０−６／Ｋ〜１２×１０−６／Ｋと、厚さ方向の熱伝導度３００Ｗ／ｍＫ以上を具現しにくいので、全体厚さは、前記範囲に維持することが好ましい。 When the total thickness of the heat radiating plate material is less than 0.05 mm or exceeds 10 mm, the thermal expansion coefficient in the plane direction using the heat radiating plate material having the structure of the present invention is 7 × 10 -6 / K ~. Since it is difficult to realize a thermal conductivity of 12 × 10-6 / K and a thermal conductivity of 300 W / mK or more in the thickness direction, it is preferable to maintain the overall thickness within the above range.
前記放熱板材において、前記第２層および第４層の厚さの合計が全体放熱板材の厚さの５％未満である場合、面方向の熱膨張係数は、７×１０−６／Ｋ〜１２×１０−６／Ｋを具現することが容易でなく、１５％超過の場合、厚さ方向の熱伝導度を具現することが容易でないので、５〜１５％の範囲を維持することが好ましい。 In the heat radiating plate material, when the total thickness of the second layer and the fourth layer is less than 5% of the total thickness of the heat radiating plate material, the coefficient of thermal expansion in the plane direction is 7 × 10 -6 / K to 12 It is not easy to realize × 10-6 / K, and when it exceeds 15%, it is not easy to realize thermal conductivity in the thickness direction, so it is preferable to maintain the range of 5 to 15%.
［実施例］
図３は、本発明の一実施形態による放熱板材の積層構造を示す図である。
[Example]
FIG. 3 is a diagram showing a laminated structure of heat radiating plate materials according to an embodiment of the present invention.
図３に示されたように、本発明の実施例による放熱板材１は、銅（Ｃｕ）からなる第１層１０と、前記第１層１０の上面に形成され、銅（Ｃｕ）−モリブデン（Ｍｏ）合金からなる第２層２０と、前記第２層２０の上面に形成され、銅（Ｃｕ）からなる第３層３０と、前記第３層３０の上面に形成され、銅（Ｃｕ）−モリブデン（Ｍｏ）合金からなる第４層４０と、前記第４層４０の上面に形成され、銅（Ｃｕ）からなる第５層５０とを含んでなる。 As shown in FIG. 3, the heat radiating plate material 1 according to the embodiment of the present invention is formed on the first layer 10 made of copper (Cu) and the upper surface of the first layer 10 and is formed of copper (Cu) -molybdenum (Cu). Mo) Formed on the upper surface of the second layer 20 made of an alloy and the upper surface of the second layer 20, and formed on the upper surface of the third layer 30 made of copper (Cu) and the third layer 30, copper (Cu)-. It includes a fourth layer 40 made of a molybdenum (Mo) alloy and a fifth layer 50 formed on the upper surface of the fourth layer 40 and made of copper (Cu).
このうち、前記第１層１０と第５層５０は、銅（Ｃｕ）を９９重量％以上含有する銅（Ｃｕ）からなり、その厚さは、それぞれ約２００μｍであり、前記第３層３０は、銅（Ｃｕ）を９９重量％以上含有する銅（Ｃｕ）からなり、その厚さは、約６００μｍであり、前記第２層２０および第４層４０は、それぞれ銅（Ｃｕ）−モリブデン（Ｍｏ）合金（Ｃｕ：３０重量％、Ｍｏ：７０重量％）からなり、その厚さは、約５０μｍである。 Of these, the first layer 10 and the fifth layer 50 are made of copper (Cu) containing 99% by weight or more of copper (Cu), and the thickness thereof is about 200 μm, respectively, and the third layer 30 is , Copper (Cu) containing 99% by weight or more of copper (Cu), the thickness thereof is about 600 μm, and the second layer 20 and the fourth layer 40 are copper (Cu) -molybdenum (Mo), respectively. ) Alloy (Cu: 30% by weight, Mo: 70% by weight), the thickness of which is about 50 μm.
以上のような構造を有する放熱板材１は、次のような工程によって製造した。 The heat radiating plate material 1 having the above structure was manufactured by the following steps.
まず、厚さ約２００μｍ、長さ１００ｍｍ、幅１００ｍｍの銅（Ｃｕ）板材を第１層１０および第５層５０の素材として準備し、厚さ約６００μｍ、長さ１００ｍｍ、幅１００ｍｍの銅（Ｃｕ）板材を第３層３０の素材として準備し、厚さ約５０μｍ、長さ１００ｍｍ、幅１００ｍｍの銅（Ｃｕ）−モリブデン（Ｍｏ）合金板材（Ｃｕ３０重量％−Ｍｏ６０重量％）を第２層２０および第４層４０の素材として用意した。 First, a copper (Cu) plate having a thickness of about 200 μm, a length of 100 mm, and a width of 100 mm is prepared as a material for the first layer 10 and the fifth layer 50, and a copper (Cu) having a thickness of about 600 μm, a length of 100 mm, and a width of 100 mm is prepared. ) A plate material is prepared as a material for the third layer 30, and a copper (Cu) -molybdenum (Mo) alloy plate material (Cu30% by weight-Mo60% by weight) having a thickness of about 50 μm, a length of 100 mm, and a width of 100 mm is used as the material of the second layer 20. And prepared as a material for the fourth layer 40.
次に、前記準備した板材を図３の積層構造で積層した後、加圧焼結方式で接合した。この際、焼結温度は、９００℃とし、焼結後には、焼結炉内で冷却させる方式で冷却した。 Next, the prepared plate materials were laminated by the laminated structure shown in FIG. 3 and then joined by a pressure sintering method. At this time, the sintering temperature was set to 900 ° C., and after sintering, the sintering was performed by cooling in a sintering furnace.
このように製造された放熱板材には、銅（Ｃｕ）層と銅（Ｃｕ）−モリブデン（Ｍｏ）層間の熱膨張係数の差異によって、銅（Ｃｕ）層に強い引張応力が作用する膨張状態になり、このように引張応力が作用した状態で放熱板材を接合する、例えばブレージング工程で放熱板材の温度が上昇すると、応力が解消されることによって、既にある程度膨張した状態の銅（Ｃｕ）が追加に膨張する比率を減らして、全体的に放熱板材の熱膨張係数を低減するようになる。また、本発明によって製造された放熱板材において熱伝導度に不利な銅（Ｃｕ）−モリブデン（Ｍｏ）層の厚さは、それぞれ約５０μｍに低く維持されているので、厚さ方向の熱伝導度を高めることができるようになる。 The heat radiation plate material produced in this way is in an expanded state in which a strong tensile stress acts on the copper (Cu) layer due to the difference in the coefficient of thermal expansion between the copper (Cu) layer and the copper (Cu) -molybdenum (Mo) layer. Therefore, when the heat radiating plate material is joined in the state where the tensile stress is applied, for example, when the temperature of the heat radiating plate material rises in the brazing step, the stress is relieved and copper (Cu) already expanded to some extent is added. By reducing the rate of expansion to, the coefficient of thermal expansion of the heat dissipation plate material is reduced as a whole. Further, in the heat radiating plate material produced by the present invention, the thickness of each of the copper (Cu) -molybdenum (Mo) layers, which is disadvantageous for thermal conductivity, is maintained as low as about 50 μm, so that the thermal conductivity in the thickness direction is maintained. Will be able to increase.
一方、本発明の実施例では、それぞれの板材を準備した後、加圧焼結方式を使用して接合したが、メッキ、蒸着法のような多様な方法で本発明による積層構造を具現することができることはもちろんである。 On the other hand, in the embodiment of the present invention, after preparing each plate material, they are joined by using a pressure sintering method, but the laminated structure according to the present invention is realized by various methods such as plating and thin film deposition. Of course, you can do it.
このように製造された放熱板材の層間接合力を評価するために、万能材料試験機（ＡＧ−３００ｋＮＸ）を使用して、界面が破断されるまで一定の変形速度（１ｍｍ／ｍｉｎ）でテストした結果、相当な荷重（約２８ｋＮ）に耐えることができることが確認された。すなわち、一定のレベルの結合力を確保することができることが確認された。 In order to evaluate the interlayer bonding force of the heat radiating plate material thus produced, a universal material tester (AG-300 kNX) was used and tested at a constant deformation rate (1 mm / min) until the interface was broken. As a result, it was confirmed that it can withstand a considerable load (about 28 kN). That is, it was confirmed that a certain level of binding force can be secured.
下記の表１は、本発明の一実施形態によって製造した放熱板材の面方向の熱膨張係数と、厚さ方向の熱伝導度（放熱板材において任意の１０ヶ所を選定して測定した結果を平均した値）を測定した結果と、純銅板材の熱伝導度と熱膨張係数を測定した結果とを比較したものである。 Table 1 below shows the average coefficient of thermal expansion in the surface direction and the thermal conductivity in the thickness direction (results measured by selecting any 10 locations in the heat radiating plate material) manufactured by one embodiment of the present invention. This is a comparison between the result of measuring the value obtained) and the result of measuring the thermal conductivity and the coefficient of thermal expansion of the pure copper plate.
前記表１から確認されるように、本発明の実施例による放熱板材の熱膨張係数は、面方向において、１０．８×１０−６／Ｋの熱膨張係数を示すが、このような値は、半導体素子や光素子のような電子素子を構成するセラミック物質の熱膨張係数と類似しているので、これら素子の実装時に発生する反りや剥離の問題を減らすことができる。 As confirmed from Table 1, the coefficient of thermal expansion of the heat dissipation plate material according to the embodiment of the present invention shows a coefficient of thermal expansion of 10.8 × 10-6 / K in the plane direction, and such a value is Since it is similar to the coefficient of thermal expansion of ceramic materials constituting electronic elements such as semiconductor elements and optical elements, it is possible to reduce the problems of warpage and peeling that occur when these elements are mounted.
また、本発明の実施例による放熱板材の厚さ方向の熱伝導度は、３５０Ｗ／ｍＫを超過するレベルであるが、これは、銅だけからなる板材（比較例）に近接するほど優れているので、発熱量が多い高出力素子の放熱板材用にも適用され得るレベルである。 Further, the thermal conductivity in the thickness direction of the heat radiating plate material according to the embodiment of the present invention is at a level exceeding 350 W / mK, which is superior as it approaches the plate material made of only copper (comparative example). Therefore, it is a level that can be applied to a heat radiating plate material of a high output element that generates a large amount of heat.
１ 放熱板材
１０ 第１層（Ｃｕ層）
２０ 第２層（Ｃｕ−Ｍｏ層）
３０ 第３層（Ｃｕ層）
４０ 第４層（Ｃｕ−Ｍｏ層）
５０ 第５層（Ｃｕ層）
1 Heat dissipation plate material 10 1st layer (Cu layer)
20 Second layer (Cu-Mo layer)
30 Third layer (Cu layer)
40 Fourth layer (Cu-Mo layer)
50 5th layer (Cu layer)
Claims (8)
前記第１層上に形成され、銅（Ｃｕ）とモリブデン（Ｍｏ）を含む合金からなる第２層と、
前記第２層上に形成され、銅（Ｃｕ）または銅（Ｃｕ）合金からなる第３層と、
前記第３層上に形成され、銅（Ｃｕ）とモリブデン（Ｍｏ）を含む合金からなる第４層と、
前記第４層上に形成され、銅（Ｃｕ）または銅（Ｃｕ）合金からなる第５層と、を含む放熱板材であって、
前記第１層、第３層および第５層の厚さは、１０〜１，０００μｍであり、
前記第２層と第４層の厚さは、１０〜６０μｍであり、
前記放熱板材全体に含まれるモリブデン（Ｍｏ）の含量は、３〜１５重量％であり、
前記第１層、第３層および第５層の銅（Ｃｕ）含量は、９９重量％以上である、
放熱板材。 A first layer made of copper (Cu) or a copper (Cu) alloy,
A second layer formed on the first layer and made of an alloy containing copper (Cu) and molybdenum (Mo),
A third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy,
A fourth layer formed on the third layer and made of an alloy containing copper (Cu) and molybdenum (Mo),
A heat radiating plate material formed on the fourth layer and containing a fifth layer made of copper (Cu) or a copper (Cu) alloy.
The thickness of the first layer, the third layer and the fifth layer is 10 to 1,000 μm.
The thickness of the second layer and the fourth layer is 10 to 60 μm.
The content of molybdenum (Mo) contained in the entire said cooling plate is Ri 3-15 wt% der,
The copper (Cu) content of the first layer, the third layer and the fifth layer is 99% by weight or more.
Heat dissipation plate material.
The heat radiating plate material according to claim 7 , wherein the total thickness of the second layer and the fourth layer occupies 5 to 15% of the total thickness of the heat radiating plate material.
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