JP6767930B2 - Semiconductor element test jig and reliability test equipment - Google Patents

Description

The present invention relates to a semiconductor device test jig and a reliability test apparatus.

Conventionally, various tests have been performed as tests for confirming the reliability of semiconductor elements. For example, Patent Document 1 discloses that, as a reliability test, a high-temperature reverse bias test is performed in which a semiconductor element is placed in a high-temperature environment and a voltage is applied in a non-conducting state. When performing such a reliability test, a test jig for fixing the semiconductor element in the chamber is used (see, for example, Patent Document 2). While the test jig has a structure for holding the semiconductor element, it is provided with a conduction structure for applying a voltage to the semiconductor element. In addition, some have a base made of a metal plate so as to be suitable for a reliability test performed in a high temperature environment.

Japanese Unexamined Patent Publication No. 2001-91571 JP-A-5-183027

When a high voltage is applied to a semiconductor element, an unexpected discharge may occur between the base and the semiconductor element. Further, in response to the increase in characteristics required for semiconductor elements, it is desired to reduce the leakage current from the high voltage side to the test jig in the test jig.

Therefore, the present invention has been made in view of the above-mentioned prior art, and an object of the present invention is to provide a test jig and a reliability test apparatus capable of suppressing discharge and reducing leakage current during a reliability test. To provide.

In order to achieve the above object, the present invention presents a connector portion including a metal terminal and an insulating portion made of an insulating material that supports the terminal, and a metal base that holds the insulating portion of the connector portion. When the spacer to be tested substrate made of an insulating material for supporting at a distance from the base on which a semiconductor element can be mounted electrodes are formed to be tested, electrically connected to said terminals It is composed of a probe for electrically connecting to the electrode of the substrate to be tested, a holding portion made of an insulating material that holds the probe, and an insulating material that is supported by the base and supports the holding portion. It is a test jig for a semiconductor element provided with a support column.

In the present invention, it is possible to prevent an electric discharge from occurring between the substrate under test and the metal base by separating the substrate under test and the metal base by a spacer made of an insulating material. Further, the holding portion for holding the probe is not directly attached to the base, but is supported by the base via a support column. That is, since a support column having a cross-sectional area smaller than that of the holding portion is interposed between the base and the holding portion, the volume resistivity between the holding portion and the base can be increased. As a result, the leakage current from the probe to the base side can be reduced.

The support column may be formed with a through hole penetrating in the length direction thereof. In this aspect, the cross-sectional area of the strut can be reduced as compared with the case where the strut is formed in a solid state. Therefore, the volume resistivity between the holding portion and the base can be further increased, and the leakage current from the probe to the base can be further reduced.

Bottomed holes may be formed at the tips and bases of the columns. In this aspect, the cross-sectional area of the strut can be partially reduced as compared with the case where the strut is formed in a solid state. Even in this case, since the volume resistivity between the holding portion and the base can be further increased, the leakage current from the probe to the base can be further reduced.

The probe may be provided with a covering portion that covers a portion connected from the tip surface in contact with the electrode. In this aspect, the exposed area of the probe can be reduced while ensuring the contact between the probe and the electrode of the substrate under test. Therefore, it is possible to further suppress the discharge from the probe while ensuring the function of the probe.

The tip surface of the probe may be formed on a round curved surface. In this aspect, the configuration is useful when a high voltage is applied to the electrodes of the substrate under test by the probe.

When the probe is in contact with the substrate to be tested, the probe may be in a state where the connecting portion between the tip surface and the outer peripheral surface of the portion is covered with the covering portion. In this aspect, even if the connecting portion between the tip surface formed on the round curved surface and the outer peripheral surface of the portion is connected in a slightly stepped shape, for example, this portion is covered by the covering portion. This makes it possible to prevent the discharge from this portion.

The insulating portion of the connector portion may have a surrounding portion surrounding the terminal. In this embodiment, since the terminals of the connector portion are surrounded by the surrounding portion of the insulating portion, it is possible to prevent the terminals of the connector portion from being exposed when the test jig is mounted on the rack portion of the reliability test apparatus. can do. This makes it possible to prevent discharge from the terminals of the connector portion.

The present invention has a test jig for the semiconductor element and a chamber for mounting the test jig for the semiconductor element, and the chamber has a terminal coupled to the terminal of the connector portion. Is a semiconductor device reliability test apparatus provided with.

In the present invention, at the time of the reliability test, the discharge in the test jig can be suppressed and the leakage current from the test jig can be reduced, so that more accurate test results can be obtained.

As described above, according to the test jig and the reliability test apparatus of the present invention, it is possible to suppress the discharge and reduce the leakage current during the reliability test.

It is a figure which looked at the reliability test apparatus which concerns on embodiment of this invention from the front side. It is a top view of the test jig used for the reliability test. It is a side view of the test jig. (A) is a diagram showing the configuration of the connection portion provided in the chamber, and (b) is a diagram showing the configuration of the connector portion of the test jig. It is sectional drawing in the VV line in FIG. FIG. 5 is a partially enlarged view of FIG. It is sectional drawing in the VII-VII line in FIG. FIG. 5 is a cross-sectional view taken along the line VIII-VIII in FIG.

Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.

As shown in FIG. 1, the semiconductor device reliability test apparatus (hereinafter, simply test apparatus) 10 according to the present embodiment includes a chamber 12 having a test chamber, a rack portion 13 fixed in the chamber 12, and a rack. A semiconductor device test jig 14 positioned in the chamber 12 by the portion 13 and mounted on the chamber 12 is provided. Further, the test apparatus 10 is arranged next to the chamber 12 and includes an operation unit 15 that performs an operation for inputting test conditions and the like. The chamber 12 includes an air-conditioning chamber in which equipment for adjusting the temperature in the test chamber is arranged, but the air-conditioning chamber is not shown in FIG. 1 because it is arranged on the back side of the test chamber. Note that FIG. 1 shows a state in which the front door body is removed to expose the test chamber, but the test chamber is sealed by the door body during the test.

The test apparatus 10 can perform control for performing reliability tests such as a high temperature reverse bias test, a high temperature gate bias test, a high temperature and high humidity bias test, and an electrostatic breakdown test of a semiconductor element. Therefore, the test apparatus 10 can control the test chamber to be maintained at a high temperature of, for example, 150 ° C. or higher, based on the test conditions input through the operation unit 15. Further, the test apparatus 10 can control to apply a high voltage of, for example, 10 kV or more (for example, about 15 kV) to the test jig 14 through the rack portion 13. Although the chamber 12 is composed of a constant temperature and humidity chamber, it may be composed of a constant temperature and humidity chamber in order to enable a high temperature and high humidity bias test and the like.

The chamber 12 has a connecting portion 16 for connecting the connector portion 24 described later of the test jig 14. The connecting portion 16 is arranged corresponding to the position of the rack portion 13. The connection portion 16 includes a first connection portion 16 for connecting the high-voltage side connector portion 24 and a second connection portion 16 for connecting the low-voltage side (or minus side) connector portion 24. The first connecting portion 16 and the second connecting portion 16 face the front side (that is, the door body side). Therefore, the test jig 14 can be mounted on the rack portion 13 from the front side. The first connection portion 16 and the second connection portion 16 are provided with a female terminal 16a (see FIG. 4A), and the female terminal 16a is electrically connected to a voltage supply device (not shown). Receives voltage supply from the voltage supply device.

As shown in FIG. 1, the test apparatus 10 is provided with three rack portions 13 at the top and bottom, and the test apparatus 10 has a configuration in which a maximum of three test jigs 14 can be connected. Note that FIG. 1 shows a state in which the test jig 14 is connected to the lower two-stage rack portion 13 and the test jig 14 is not connected to the uppermost rack portion 13.

The test jig 14 is configured so that the substrate 20 to be tested on which the semiconductor element can be mounted is fixed and the voltage applied through the chamber 12 can be applied to the substrate 20 to be tested. Hereinafter, the configuration of the test jig 14 will be specifically described.

As shown in FIGS. 2 and 3, the test jig 14 includes a base 22, a handle 23, and a connector portion 24. The base 22 is formed by combining metal plates into a flat rectangular parallelepiped shape. FIG. 2 shows a state viewed from the front plate 22a side, which is the front surface of the base 22, and a plurality of (four in the example) test boards 20 are attached to the front plate 22a of the base 22. Can be done. In the present embodiment, the front plate 22a is mounted on the chamber 12 in a posture of facing upward and the back plate 22b facing downward. Therefore, the front plate 22a becomes the upper surface plate, and the back plate 22b becomes the lower surface plate.

The front plate 22a and the back plate 22b of the base 22 are arranged at intervals from each other and are connected to each other by the side plates 22c. The side plate 22c is arranged along three sides excluding one side of the rectangular front plate 22a. An opening is formed between the front plate 22a and the back plate 22b on one side of the side plate 22c where the side plate 22c is not arranged, and the connector portion 24 is inserted into this opening. A handle 23 is fixed to a side plate 22c (not shown) arranged on the side facing the connector portion 24. The test jig 14 can be mounted on the rack portion 13 with the handle 23 on the front side and the connector portion 24 on the back side.

The connector portion 24 includes a low-voltage side connector portion 24 and a high-voltage side connector portion 24, which have the same configuration. As shown in FIG. 4B, the connector portion 24 has an insulating portion 24a made of an insulating material having electrical insulating properties, and a metal male terminal 24b. The insulating portion 24a is formed in a rectangular parallelepiped block shape. Examples of the material of the insulating material include PTFE (polytetrafluoroethylene) resin, PPS (polyphenylene sulfide) resin, and ceramic materials.

A part of the insulating portion 24a protrudes from the gap between the front plate 22a and the back plate 22b of the base 22. Two recesses 24d are formed on the flat end surface (one surface of a rectangular parallelepiped) 24c of the protruding portion so as to be recessed from the end surface 24c. The recess 24d has a circular bottom surface 24e parallel to the end surface 24c, and an inner peripheral surface 24f that connects the end surface 24c and the outer peripheral portion of the bottom surface 24e and surrounds the periphery of the male terminal 24b. The male terminal 24b is arranged in a posture extending from the bottom surface 24e toward the end surface 24c, and is supported by the insulating portion 24a. However, the male terminal 24b is completely contained in the recess 24d and does not project outward from the end face 24c. The inner peripheral surface 24f of the recess 24d functions as a surrounding portion surrounding the male terminal 24b. The gap width between the inner peripheral surface 24f and the male terminal 24b is a gap width into which the female terminal 16a provided in the connecting portion 16 can be inserted.

On the other hand, as shown in FIG. 4A, the first connection portion 16 comprises a terminal block 16b made of an insulating material having electrical insulating properties and a female terminal 16a attached to the front surface 16d of the terminal block 16b. Have. At the base of the female terminal 16a, a fitting member 16c having an outer peripheral surface suitable for the inner peripheral surface 24f of the recess 24d of the connector portion 24 is fixed.

The terminal block 16b is fixed so that the female terminal 16a faces the front side (door body side) of the chamber 12. The front surface 16d of the terminal block 16b to which the female terminal 16a is attached is formed in a flat shape. Therefore, when the test jig 14 is mounted on the rack portion 13, the male terminal 24b is inserted into the female terminal 16a, and the fitting member 16c is fitted to the inner peripheral surface 24f of the recess 24d. In this state, the front surface 16d of the terminal block 16b and the end surface 24c of the insulating portion 24a come into contact with each other so that a gap is not formed between the terminal block 16b and the insulating portion 24a. Therefore, the male terminal 24b and the female terminal 16a are completely surrounded by the insulating material. This makes it possible to prevent discharge from the terminals 24b and 16a. Although the configuration of the second connection portion 16 is not shown, the second connection portion 16 is also configured in the same manner as the first connection portion 16. In the present embodiment, the terminal provided on the test jig 14 is configured as a male terminal 24b, and the terminal provided on the chamber 12 is configured as a female terminal 16a, but the present invention is not limited to this. A female terminal may be provided on the test jig 14, and a male terminal may be provided on the chamber 12. In this case, the female terminal is provided in the recess 24d of the connector portion 24 of the test jig 14.

As shown in FIG. 2, on the front plate 22a of the base 22, an electrical connection portion 27 on the low voltage side having a structure for connecting to the electrode 20a on the low voltage side of the substrate 20 to be tested and a substrate to be tested A high-voltage side electrical connection portion 28 having a structure for connecting to the high-voltage side electrode 20b of 20 and a measurement electrical connection portion 29 having a structure for connecting to the measurement electrode 20c of the test substrate 20. , Are provided. In the present embodiment, since a plurality of (four in the example) test substrates 20 can be attached to the test jig 14, a plurality of these electrical connection portions 27, 28, 29 are all present. (4 in the example) are provided. The low-voltage side electrode 20a, the high-voltage side electrode 20b, and the measurement electrode 20c are all provided on the same surface (surface) of the substrate 20 to be tested.

Since the configurations of the electrical connection portion 27 on the low voltage side and the electrical connection portion 29 for measurement are the same, the structure of the electrical connection portion 27 on the low voltage side will be described here, and the structure of the electrical connection portion 29 for measurement will be described. The description is omitted.

As shown in FIGS. 5 and 6, the low-voltage side electrical connection portion 27 includes a probe 31 (low-voltage side probe 31) provided so as to be in contact with the low-voltage side electrode 20a of the substrate 20 to be tested, and a second. 1 Connection member 32, 2nd connection member 33, a covering portion 34 made of an insulating material that covers a portion connected from the tip surface of the probe 31, and a position away from the base 22 (and away from the 2nd connection member 33). A support column 35 for holding the covering portion 34 at the position) and a spacer 36 for supporting the substrate 20 to be tested at a position away from the base 22 are provided.

In the present embodiment, since a plurality of (two in the example) probes 31 are provided in the electrical connection portions 27 on each low voltage side, the first connection member 32 and the second connection member 33 have a plurality of these probes 31. It is provided so as to be electrically connected to the probe 31. The first connecting member 32 and the second connecting member 33 are made of a metal plate such as stainless steel so as to be conductive.

The probe 31 is held by the first connecting member 32 in a state of being electrically connected to the first connecting member 32. The first connecting member 32 is formed in the shape of an elongated plate in one direction. The first connecting member 32 and the second connecting member 33 are electrically connected by a screw 40 described later. The second connecting member 33 is electrically connected to the male terminal 24b provided on the connector portion 24 on the low voltage side by a conductive wire (not shown).

The covering portion 34 is formed in a long shape in one direction like the first connecting member 32. The covering portion 34 is sandwiched between the first connecting member 32 and the strut portion 35. A through hole through which the probe 31 penetrates is formed in the covering portion 34. The covering portion 34 is made of an insulating material having an electrically insulating property. Examples of the material of the insulating material include PTFE resin, PPS resin, ceramic and the like.

The spacer 36 has a base side portion 36a arranged between the base 22 and the second connecting member 33, and a front side portion 36b held by the second connecting member 33 at a position facing the probe 31. .. The base side portion 36a is composed of a nut member having a female screw formed at one end and a male screw 38 formed at the other end. The base side portion 36a is fixed to the front plate 22a by the male screw 38 penetrating the front plate 22a and the nut shown in the drawing being screwed into the male screw 38. Further, the base side portion 36a is fixed to the second connecting member 33 by the screw 39 penetrating the second connecting member 33 and screwing into the female screw of the base side portion 36a. By sandwiching the base side portion 36a between the second connecting member 33 and the base 22, the second connecting member 33 can be positioned at a position away from the base 22 that functions as a ground. .. The front side portion 36b has a male screw portion, and the male screw portion is fixed to the second connecting member 33 by screwing into the screw hole of the second connecting member 33.

The spacer 36 is not limited to the one in which the base side portion 36a and the front side portion 36b are separately configured. The spacer 36 may be composed of an integral member that penetrates the second connecting member 33. In this case, the support member (not shown) is provided so that the second connection member 33 is fixed at a position away from the base 22.

The base side portion 36a and the front side portion 36b of the spacer 36 are made of an insulating material having electrical insulating properties such as PTFE resin, PPS resin, and ceramic. The spacer 36 (front side portion 36b) contacts the surface (back surface) of the substrate 20 to be tested that is opposite to the surface (front surface) that the probe 31 contacts.

The strut portion 35 is composed of a member having a volume smaller than that of the covering portion 34, and is arranged between the second connecting member 33 and the covering portion 34. The strut portion 35 is made of an insulating material having an electrically insulating property. Examples of the material of the insulating material include PTFE resin, PPS resin, ceramic and the like.

The strut portion 35 is formed in a tubular shape having through holes formed in the length direction thereof. As a result, the cross-sectional area of the strut portion 35 can be reduced, and the volume resistivity can be increased.

The second connecting member 33 and the first connecting member 32 are connected by a screw made of a conductive metal such as stainless steel. That is, the second connecting member 33 is provided with a screw hole, and the covering portion 34 and the strut portion 35 are formed with a through hole. Then, with the support column 35, the covering portion 34, and the first connecting member 32 sandwiched between the head of the screw 40 and the second connecting member 33, the screw 40 is screwed into the screw hole of the second connecting member 33. It fits. As a result, electrical continuity between the second connecting member 33 and the first connecting member 32 is ensured. A metal nut 42 such as stainless steel is arranged in the support column 35, and the screw 40 is also screwed into the nut 42. The nut 42 strengthens the electrical connection between the screw 40 and the second connecting member 33.

In the present embodiment, the covering portion 34 is fixed by a screw 40 that connects the first connecting member 32 and the second connecting member 33, but the covering portion 34 is not shown separately. It may be fastened to the first connecting member 32 by the bolt of. This bolt will be made of insulating material.

Further, in the present embodiment, the electrical connection portion 27 on each low voltage side is provided with a plurality of (two in the example) probes 31, but the present invention is not limited to this. A configuration in which one probe 31 is provided or a configuration in which three or more probes 31 are provided may be provided. In the case where one probe 31 is provided, instead of the second connecting member 33 for ensuring the conductivity between the probes 31, the probe 31 and the connector portion 24 on the low voltage side are provided with a conductive wire (not shown). It may be configured to connect with the male terminal 24b. In this case, the first connecting member 32 is not made of a conductive material, but is made of an insulating material. Even in this case, the first connecting member 32 is still configured to hold the probe 31 in a state of being supported by the base 22 via the support column 35 and the base side portion 36a of the spacer 36. In the case where the second connecting member 33 is omitted, the spacer 36 is not divided into the base side portion 36a and the front side portion 36b, but is integrally formed and attached to the front plate 22a of the base 22. Will be configured.

Even when only one probe 31 is provided, the second connecting member 33 may be used as in the present embodiment. In this case, the second connecting member 33 and the first connecting member 32 are electrically connected so as to be conductive, and the probe 31 is passed through the first connecting member 32 and the second connecting member 33 to the male terminal of the connector portion 24. It is electrically connected to 24b.

The probe 31 has a head portion 31a and a shaft portion 31b narrower than the head portion 31a. The head portion 31a includes a tip surface 31c formed on a round curved surface and a body portion 31d having a peripheral surface connected to the tip surface 31c.

The shaft portion 31b of the probe 31 is inserted into a sleeve 31e having a tubular portion having a male screw formed on the outer peripheral surface. A flange portion 31f is formed at one end of the tubular portion of the sleeve 31e, and the sleeve 31e is fitted to the probe 31 in a posture in which the flange portion 31f is on the tip surface 31c side of the probe 31. The tubular portion penetrates the insertion hole formed in the first connecting member 32, and the flange portion 31f is a surface of the first connecting member 32 facing the head 31a of the probe 31 (first surface; in FIG. 6). It is in contact with the lower surface). On the surface (second surface) side of the first connecting member 32 opposite to the first surface, the nut 44 is screwed into the male screw of the tubular portion. The first connecting member 32 is sandwiched between the nut 44 and the flange portion 31f, and in this state, the sleeve 31e is fixed to the first connecting member 32.

Since the probe 31 movably penetrates the sleeve 31e, a collar 45 for preventing the probe 31 from coming off is fixed to the probe 31. Further, a coil spring 46 is arranged between the flange portion 31f of the sleeve 31e and the body portion 31d of the head portion 31a of the probe 31. The coil spring 46 urges the probe 31 to the spacer 36 side (front side portion 36b side) while pressing the flange portion 31f toward the first connecting member 32 side. As a result, in the natural state where the probe 31 is not pressed from the outside, the collar 45 abuts on the sleeve 31e and the probe 31 is positioned so as to protrude from the covering portion 34. On the other hand, when the head 31a of the probe 31 is pressed from the outside in the direction away from the spacer 36, the probe 31 can be moved in the direction in which the tip surface 31c of the probe 31 retracts into the covering portion 34. In such a state, the probe 31 is held by the first connecting member 32. When the substrate 20 to be tested is mounted on the test jig 14, the tip surface 31c of the low voltage side probe 31 comes into contact with the electrode 20a on the low voltage side of the substrate 20 to be tested.

As shown in FIGS. 7 and 8, the high-voltage side electrical connection portion 28 includes a probe 50 (high-voltage side probe 50) provided so as to be in contact with the high-voltage side electrode 20b of the substrate 20 to be tested, and a probe. A holding portion 52 that holds the 50, a covering portion 54 made of an insulating material that covers a portion connected to the tip surface 50c of the probe 50, and a support column 55 that supports the holding portion 52 and the covering portion 54 at a position away from the base 22. And have.

The holding portion 52 is formed in a long shape in one direction, and includes a thick thick portion 52a and a thin portion 52b formed to be thinner than the thick portion 52a. The thin portion 52b is arranged on both sides of the thick portion 52a. The holding portion 52 has a first facing surface 52d (lower surface in FIG. 8) and a first outer surface 52e facing the side opposite to the first facing surface 52d. The first facing surface 52d is formed in a flat flat shape over the thick portion 52a and the thin portion 52b. The first outer surface 52e is formed at the thick portion 52a in a shape that is more raised than at the thin portion 52b.

The thick portion 52a is formed with a bottomed recess 52c formed so as to be recessed from the first facing surface 52d. A probe (high voltage side probe) 50 is inserted in the recess 52c.

The holding portion 52 is made of an insulating material having an electrically insulating property. Examples of the material of the insulating material include PTFE resin, PPS resin, ceramic and the like.

The thin portion 52b of the holding portion 52 is formed with an insertion hole (not shown) through which the first screw 57 is inserted and an insertion hole through which the second screw 58 is inserted. These insertion holes penetrate the thin portion 52b of the holding portion 52 from the first facing surface 52d to the first outer surface 52e. A covering portion 54 is fixed to the holding portion 52 by a second screw 58. The second screw 58 is inserted from the insertion hole of the holding portion 52 to the insertion hole formed in the covering portion 54. A nut 59 is screwed into the second screw 58.

The first screw 57, the second screw 58, and the nut 59 are not made of metal because they are electrically isolated from the male terminal 24b of the connector portion 24, but are made of an insulating material having electrical insulating properties. Examples of the material of the insulating material include PTFE resin, PPS resin, ceramic and the like.

The covering portion 54 is sandwiched between the holding portion 52 and the support column 55. The covering portion 54 is formed in a long shape in the same direction as the holding portion 52, and includes a thick thick portion 54a and a thin portion 54b formed to be thinner than the thick portion 54a. The thin portion 54b is arranged on both sides of the thick portion 54a. The covering portion 54 has a second facing surface 54c facing the first facing surface 52d of the holding portion 52, and a second outer surface 54d facing the side opposite to the second facing surface 54c and facing the base 22. ..

The second facing surface 54c is formed flat from the thick portion 54a to the thin portion 54b, and the recess 54e is formed in a portion corresponding to the thick portion 54a. The second outer surface 54d is formed from the thick portion 54a to the thin wall portion 54b, and the portion corresponding to the thick portion 54a in the central portion in the longitudinal direction is formed in a shape that is raised more than the portion corresponding to the thin wall portion 54b. Has been done.

The covering portion 54 is made of an insulating material having an electrically insulating property. Examples of the material of the insulating material include PTFE resin, PPS resin, ceramic and the like.

A through hole 54f through which the high voltage side probe 50 penetrates is formed in the thick portion 54a of the covering portion 54. The through hole 54f is formed between the bottom surface of the recess 54e formed on the second facing surface 54c and the second outer surface 54d.

The thin portion 54b of the covering portion 54 has an insertion hole (not shown) for inserting a first screw 57 for fixing the holding portion 52 to the support column 55, and a second screw for fixing the covering portion 54 to the holding portion 52. An insertion hole through which the 58 is inserted is formed.

The second screw 58 may be omitted, and the covering portion 54 may be fixed to the holding portion 52 only by the first screw 57. Further, the covering portion 54 is not limited to a configuration in which the covering portion 54 is fixed while being sandwiched between the holding portion 52 and the support column 55. When the covering portion 54 is not sandwiched between the holding portion 52 and the support column 55, the covering portion 54 is fixed to the holding portion 52 only by the second screw 58.

The high-voltage side probe 50 has a head portion 50a and a shaft portion 50b narrower than the head portion 50a, and is arranged in a recess 52c of the holding portion 52, a recess 54e of the covering portion 54, and a through hole 54f. The head portion 50a includes a tip surface 50c formed on a round curved surface and a body portion 50d having a circumferential surface connected to the tip surface 50c.

The shaft portion 50b of the probe 50 is inserted into a sleeve 50e having a tubular portion having a male screw formed on the outer peripheral surface. A flange portion 50f is formed at one end of the tubular portion of the sleeve 50e, and the sleeve 50e is fitted to the probe 50 in a posture in which the flange portion 50f is on the tip surface 50c side of the probe 50. The tubular portion is inserted into the recess 52c formed in the holding portion 52, and the flange portion 50f is in contact with the first facing surface 52d of the holding portion 52. The tubular portion is fixed to a tubular female screw member 61 fixed to the recess 52c. That is, a female screw is formed on the inner peripheral surface of the female screw member 61, and the sleeve 50e is fixed to the holding portion 52 by screwing the male screw of the sleeve 50e into the female screw.

Since the probe 50 movably penetrates the sleeve 50e, a collar 63 for preventing the probe 50 from coming off is fixed to the probe 50. Further, a coil spring 65 is arranged between the flange portion 50f of the sleeve 50e and the body portion 50d of the head portion 50a of the probe 50. The coil spring 65 urges the probe 50 toward the base 22 while pressing the flange portion 50f toward the holding portion 52. As a result, in the natural state where the probe 50 is not pressed from the outside, the collar 63 abuts on the sleeve 50e and the probe 50 is positioned in the direction of protruding from the covering portion 54, while the head 50a of the probe 50 is placed on the substrate 20 to be tested. The tip surface 50c of the probe 50 can be moved in the direction of retracting into the covering portion 54 by pressing from the outside in the direction of pulling away from the probe 50. In such a state, the probe 50 is held by the holding portion 52. When the substrate 20 to be tested is mounted on the test jig 14, the tip surface 50c of the probe 50 on the high voltage side comes into contact with the electrode 20b on the high voltage side of the substrate 20 to be tested.

When the probe 50 is in contact with the substrate 20 to be tested, the probe 50 is in a state in which the body portion 50d and the shaft portion 50b of the head portion 50a of the probe 50 are covered by the coating portion 54. Further, when the probe 50 is in contact with the substrate 20 to be tested, the connecting portion 50g between the tip surface 50c of the head portion 50a of the probe 50 and the outer peripheral surface of the body portion 50d is also covered by the covering portion 54. It has become. That is, when the probe 50 is in contact with the substrate 20 to be tested, the probe 50 is set so that the connecting portion 50g is located inside the second outer surface 54d of the covering portion 54 (on the second facing surface 54c side). It has become. The probe 50 may be set so that the connecting portion 50g is covered by the covering portion 54 even when the collar 63 is in contact with the sleeve 50e, or in the natural state, the connecting portion 50g is covered with the covering portion 54. It may be a setting located outside the.

The support column 55 is formed in a long shape in one direction, and one end surface thereof faces the front plate 22a of the base 22, and the other end surface faces the covering portion 54 and the holding portion 52. In the present embodiment, the support column 55 is formed in a shape in which the cross-sectional area is constant over the entire length direction, but the support is not limited to this. For example, the support column 55 may be formed in a shape in which the cross-sectional area decreases from the base 22 side toward the holding portion 52 side. Further, the support column 55 is not limited to a circular cross section, and may be formed in a polygonal shape.

The support column 55 is made of an insulating material having an electrically insulating property. Examples of the material of the insulating material include PTFE resin, PPS resin, ceramic and the like.

The support column 55 is formed with a through hole 55a extending in the length direction thereof and penetrating the support column 55. The first screw 57 is inserted into the through hole 55a from the holding portion 52 side through the covering portion 54. The first screw 57 penetrates the front plate 22a of the base 22. By screwing the nut (not shown) into the first screw 57, the holding portion 52 is fixed to the base 22 with the covering portion 54 and the support column 55 sandwiched between the holding portion 52 and the base 22. To.

Since the support hole 55 is formed with the through hole 55a, the volume resistivity of the support column 35 can be increased as compared with the configuration formed in a solid state. In addition, instead of the through hole 55a provided over the entire length direction, bottomed holes (not shown) may be formed at both ends in the length direction. In this case, a screw (not shown) for fastening the holding portion 52 and the support column 55 is screwed into the hole on the holding portion 52 side, and the support column 55 and the base base 22 are fastened to the hole on the base 22 side. Screws (not shown) are screwed. In this case, since the cross-sectional area is formed small in the vicinity of both ends of the support column 55, the volume resistivity of the support column 35 in the vicinity of both ends can be increased. The support column 55 may be formed in a solid state in which the through hole 55a is not formed.

As described above, in the present embodiment, the substrate 20 to be tested and the metal base 22 are separated from each other by the spacer 36 made of an insulating material, and the substrate 20 to be tested and the second connecting member 33 are separated from each other. It is possible to prevent an electric discharge from occurring between the substrate 20 under test and the metal base 22, and it is possible to prevent an electric discharge from occurring between the substrate 20 under test and the second connecting member 33. .. Further, the holding portion 52 made of an insulating material for holding the probe 50 is not directly attached to the base 22, but is supported by the base 22 via the support column 55. That is, since the support column 55 having a cross-sectional area smaller than that of the holding portion 52 is interposed between the base 22 and the holding portion 52, the volume resistivity between the holding portion 52 and the base 22 is increased. Can be done. As a result, the leakage current from the probe 50 to the base 22 side can be reduced.

Further, in the present embodiment, since the support column 55 is formed with a through hole 55a penetrating in the length direction thereof, the cross-sectional area of the support column 55 is made smaller than that in the case where the support column 55 is formed in a solid state. be able to. Therefore, the volume resistivity between the holding portion 52 and the base 22 can be further increased, and the leakage current from the probe 50 to the base 22 side can be further reduced.

Further, in the present embodiment, since the covering portion 54 that covers the portion connected from the tip surface 50c of the probe 50 is provided, the exposed area of the probe 50 is secured while ensuring the contact between the probe 50 and the electrode 20b of the substrate 20 to be tested. Can be reduced. Therefore, it is possible to further suppress the discharge from the probe 50 while ensuring the function of the probe 50.

Further, when the probe 50 is in contact with the substrate 20 to be tested, the probe 50 is in a state where the connecting portion 50g between the tip surface 50c and the outer peripheral surface of the body portion 50d is covered by the covering portion 54. Even if the connecting portion 50g between the tip surface 50c formed on the round curved surface and the outer peripheral surface of the body portion 50d is connected in a slightly stepped shape, for example, this portion 50g is covered by the covering portion 54. .. This makes it possible to prevent the discharge from this portion of 50 g.

Further, in the present embodiment, since the male terminal 24b of the connector portion 24 is surrounded by the inner peripheral surface 24f of the recess 24d formed in the insulating portion 24a, the test jig 14 is the rack portion 13 of the reliability test apparatus 10. It is possible to prevent the male terminal 24b of the connector portion 24 and the female terminal 16a of the chamber 12 from being exposed in the state of being mounted on the connector portion 24. As a result, it is possible to prevent discharge from the terminals 24b and 16a.

10 Reliability test equipment 12 Chamber 14 Test jig 16a Female terminal 20 Test board 20a Electrode 20b Electrode 20c Measurement electrode 22 Base 24 Connector part 24a Insulation part 24b Male terminal 31 Probe 34 Coating part 36 Spacer 50 Probe 50a Head Part 50c Tip surface 50d Body part 50g Connection part 52 Holding part 54 Covering part 55 Strut 55a Through hole

Claims (8)

A connector portion including a metal terminal and an insulating portion made of an insulating material that supports the terminal,
A metal base that holds the insulating portion of the connector portion and
A spacer under test substrate which electrodes a mountable is formed a semiconductor element, made of an insulating material for supporting at a distance from the base to be tested,
A probe for being electrically connected to the terminal and electrically connected to the electrode of the substrate to be tested .
A holding portion made of an insulating material that holds the probe ,
A strut made of an insulating material supported by the base and supporting the holding portion,
A jig for testing semiconductor devices. The jig for testing a semiconductor element according to claim 1, wherein a through hole penetrating in the length direction is formed in the support column. The jig for testing a semiconductor element according to claim 1, wherein a bottomed hole is formed at the tip end and the base end of the support column. The jig for testing a semiconductor device according to any one of claims 1 to 3, further comprising a covering portion that covers a portion of the probe that is connected to a tip surface that contacts the electrode. The jig for testing a semiconductor device according to claim 4, wherein the tip surface of the probe is formed into a round curved surface. The fifth aspect of the present invention, wherein when the probe is in contact with the substrate to be tested, the connecting portion between the tip surface and the outer peripheral surface of the portion is covered with the covering portion. Jig for testing semiconductor devices. The jig for testing a semiconductor element according to any one of claims 1 to 6, wherein the insulating portion of the connector portion has an surrounding portion surrounding the terminal. The semiconductor device test jig according to any one of claims 1 to 7.
It has a chamber for mounting a jig for testing the semiconductor element , and has a chamber.
A reliability test device for a semiconductor element, wherein the chamber is provided with a terminal coupled to the terminal of the connector portion.

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