JP6763754B2 - Manufacturing method of substrate terminal board for mounting semiconductor elements - Google Patents

Description

The present invention has a mounting substrate terminal board having a portion for mounting a semiconductor element, for example, an element such as an LED chip, LSI, or CPU that consumes a large amount of power and generates a large amount of heat, and also has a terminal portion for connecting to an electrode wire. It is related to the manufacturing method which made it possible to manufacture with a simple structure.

Conventionally, some LED elements that consume a large amount of power have a configuration in which a chip is enclosed in a glass epoxy substrate to expose terminals. Since this type of LED element generates a large amount of heat, it is not provided side by side on the same circuit board as other elements and devices, but a dedicated electrode wire for the LED element is provided to supply power to the LED element. The contact between the contact point of the LED element and the electrode wire was made conductive by using a connecting component in which a conductive metal plate was bent into a predetermined shape.

For example, as shown in Patent Documents 1 and 2, a connection component having a box portion capable of holding an LED element and capable of connecting to a terminal of the LED element and a connection capable of connecting to the other contact of the LED element. It is prepared as a pair with the parts. Then, after attaching a connection component that can be connected to the other contact of the LED element to the cable that is the electrode wire, another connection component is attached to the cable, and the LED element is fitted into the box portion, so that each connection component is an LED. It was designed to come into contact with the contacts of the element.

In addition, by incorporating the pair of connecting parts and the LED element into the device holder, the contacts of the LED element and the connecting parts come into contact with each other inside the device holder, and by sandwiching the electrode wire cable between the device holders, the connecting parts become the cable. The points of contact are also shown.

Japanese Patent No. 4934545 Japanese Patent No. 5203035

However, in order to be able to supply power from the electrode wire such as a cable to the LED element side, if the two connecting parts are not attached to the electrode wire independently or attached to the device holder, the insulation between the connecting parts must be provided. It is not possible to connect to the LED element side while maintaining it. As described above, two connecting parts are required to supply power to the LED element, and each of them is handled independently. Furthermore, if such a configuration is adopted for supplying power to the LED chip, the structure of each connecting component becomes very complicated, and there is a drawback that the management of the connecting component becomes complicated.

The above-mentioned points are not limited to those for LED elements and LED chips, but also have the same drawbacks for semiconductor element products such as LSIs and CPUs that generate heat.

Therefore, in view of the above circumstances, it is an object of the present invention to make it possible to supply electricity to a semiconductor element without using a plurality of independent parts, and to provide an easy-to-handle substrate terminal board to which the semiconductor element is attached. The purpose is to do that.

(Invention of claim 1)
The present invention has been made in consideration of the above problems, and a semiconductor element is provided in the center of the upper surface of a terminal plate by providing a pair of a first element connection terminal portion and a second element connection terminal portion for connecting to a semiconductor element. For mounting a semiconductor device having an element mounting portion that can be arranged and having an electrode terminal portion composed of a first electrode terminal portion and a second electrode terminal portion for connecting an electrode wire on the side portion of the terminal plate. It is a method of manufacturing a board terminal board.
From the conductive metal plate, the first element connection terminal portion is provided in the center of the upper surface, the first electrode terminal portion is provided in one corner, and an electrode wire restraint portion is arranged in the vicinity of the first electrode terminal portion. While forming the lower substrate
A through hole is opened from the conductive metal plate at a portion corresponding to the first element connection terminal portion when superposed on the lower substrate, and the second element connection terminal portion is provided around the through hole. The upper substrate is provided with the second electrode terminal portion at a position facing the first electrode terminal portion when superposed on the lower substrate, and the electrode wire restraint portion is arranged in the vicinity of the second electrode terminal portion. Form and
The lower substrate and the upper substrate are coated with a resin coating film obtained by electrodeposition coating using an electrodeposition coating having heat resistance and insulating properties, and each electrode line restraint portion is covered with a resin coating film. Covered with
The first element connection terminal portion of the lower substrate is made to correspond to the through hole of the upper substrate, and the first electrode terminal portion and the electrode restraint portion of the lower substrate are the second electrode terminal portion and the electrode wire restraint portion of the upper substrate. Lay the upper substrate on the lower substrate so that it does not overlap with the lower substrate.
By applying pressure and heat treatment to the lower substrate and the upper substrate in this superposed state, the resin coating films between the lower substrate and the upper substrate are adhered to each other.
By connecting the lower substrate and the upper substrate by this adhesion, the element mounting portion provided with the first element connecting terminal portion and the second element connecting terminal portion is provided, and each of them has an electrode wire restraining portion arranged in the vicinity. (I) A method for manufacturing a substrate terminal plate for mounting a semiconductor element, which comprises forming one substrate terminal plate having the electrode terminal portion in which the electrode terminal portion and the second electrode terminal portion are arranged, is provided. It solves the problem.

(Invention of claim 2)
In the present invention, the electrode wire restraint portion is preferably a through hole penetrating in the substrate thickness direction or a raised shape that is convex upward in the substrate thickness direction.

(Invention of claim 3)
Further, in the present invention, the portion of the lower substrate where the electrode wire restraint portion and the first electrode terminal portion are arranged and the portion of the upper substrate where the electrode wire restraint portion and the second electrode terminal portion are arranged are respectively. It is a terminal, and an electrode wire restraint portion and a first electrode terminal portion are formed on the Giboshi terminal on the lower substrate, and an electrode wire restraint portion and a second electrode terminal portion are formed on the Giboshi terminal on the upper substrate. It is good that it is formed.

(Invention of claim 4)
Further, in the present invention, before applying the electrodeposition paint, masking is applied to each of the first element connection terminal portion, the second element connection terminal portion, the first electrode terminal portion, and the second electrode terminal portion. Alms,
After the connection between the lower substrate and the upper substrate, the masking is removed so that the first element connection terminal portion, the second element connection terminal portion, the first electrode terminal portion, the second electrode terminal portion, and the outside are exposed. Is good.

(Invention of claim 5)
Further, in the present invention, after the connection between the lower substrate and the upper substrate, the resin coating that covers the first element connection terminal portion, the second element connection terminal portion, the first electrode terminal portion, and the second electrode terminal portion. It is possible to remove the covering film so that the first element connection terminal portion, the second element connection terminal portion, the first electrode terminal portion, and the second electrode terminal portion are exposed to the outside.

(Effect of the invention of claim 1)
According to the invention of claim 1, one semiconductor element mounting substrate terminal plate is formed by bonding the resin coating films of the lower substrate and the upper substrate to each other, and the one semiconductor element mounting substrate terminal plate is formed. Since the element mounting portion and the electrode terminal portion including the first electrode terminal portion and the second electrode terminal portion in which the electrode wire restraining portions are close to each other are provided, the semiconductor element mounting substrate terminal plate can be used. It is possible to eliminate the complexity of handling and management in which each pair of connecting parts is handled independently as in the conventional case. In addition, since the substrate terminal board for mounting the semiconductor element is obtained by utilizing the adhesion between the resin coating films as the insulating layer, it can be manufactured at low cost and does not raise the cost, which is an excellent effect. It plays.

Further, it has a simple structure in which two substrates, a lower substrate and an upper substrate, are superposed, and has an effect that heat loss due to thermal resistance between the upper and lower substrates is reduced and good heat dissipation can be performed.

(Effect of the invention of claim 2)
According to the invention of claim 2, the shape of the electrode wire restraint portion is simple, and a substrate terminal plate for mounting a semiconductor element can be obtained in which the electrode wire connection is more reliable without increasing the manufacturing cost. It has the effect of being able to be used.

(Effect of the invention of claim 3)
According to the invention of claim 3, the substrate terminal plate for mounting the semiconductor element has a pair of giboshi terminals, and the electrode wire can be reliably mounted using a conventionally known tool.

(Effect of the invention of claim 4)
According to the invention of claim 4, the first element connection terminal portion, the second element connection terminal portion, the first electrode terminal portion, and the second electrode terminal portion can be accurately provided at predetermined positions. Has an effect.

(Effect of the invention of claim 5)
According to the invention of claim 5, the width of the portion where the surface of the conductor is exposed in the first element connection terminal portion, the second element connection terminal portion, the first electrode terminal portion, and the second electrode terminal portion is appropriately changed. It has an excellent effect of being able to do it.

It is explanatory drawing which shows the substrate terminal board for semiconductor element mounting which comprises an example of the manufacturing method of the board terminal board for mounting a semiconductor element which concerns on this invention. It is explanatory drawing which shows the substrate terminal board for mounting a semiconductor element in a state where the lower substrate and the upper substrate are separated. It is explanatory drawing which shows the lower substrate used in the manufacturing method of the substrate terminal board for mounting a semiconductor element of this invention in the cross section along the line AA. It is explanatory drawing which also shows the upper substrate used in 1st Embodiment in the cross section along the line AA. It is explanatory drawing which shows the state in which the resin coating film of the upper substrate is completely hardened in the state of superimposing the upper and lower substrates in the cross section. It is explanatory drawing which shows the example which the electrode wire restraint part has a bridge shape. It is explanatory drawing which shows the example which the electrode line restraint part is a through hole. It is explanatory drawing which shows the example which the electrode wire restraint part is a Giboshi terminal.

Next, the present invention will be described in detail based on the embodiments shown in FIGS. 1 to 8. The present invention will be described by giving an example for arranging LED chips as an embodiment. However, the present invention is not limited to arranging LED chips, and semiconductor elements such as LSIs and CPUs are arranged. You can also do it.

In the figure, reference numeral 1 denotes a substrate terminal board for mounting a semiconductor element, which is formed by superimposing and integrating the lower substrate 2 and the upper substrate 3 as shown in FIGS. 1 and 2. The semiconductor element mounting substrate terminal plate 1 has an element mounting portion 4 in which the LED chip can be arranged in the center of the upper surface of the terminal plate, and is arranged so as to be separated from the terminal plate side portion in the element mounting portion. It has an electrode terminal portion 5 capable of connecting an electrode wire such as an electric cable to supply electricity to the arranged LED chips.

(Lower board, first element connection terminal)
The lower substrate 2 of the upper and lower substrates forming the semiconductor element mounting substrate terminal plate 1 covers the surface of the conductor plate 6 of the lower substrate conductor plate 6 made of a conductive metal plate such as a copper material with an insulating resin. It is coated with a cover film 7. Then, there is a convex surface in the center, and the convex surface is used as a portion where the conductor plate surface of the lower substrate conductor plate 6 is exposed without the presence of the resin coating film, and the first element connection terminal for connecting the LED chip. It is provided as a part 8.

(Lower board, first electrode terminal)
Further, one of the electrode terminal portions 5 which is exposed in a rectangular shape on the surface of the conductor plate 6 for the lower substrate without the presence of the resin coating film on the surface of the lower substrate 2 on the one corner side of the terminal plate side portion. The first electrode terminal portion 9 is provided.

(Lower substrate, electrode wire restraint)
Further, as shown in FIGS. 1 and 2, the conductor plate surface (the surface where the first element connection terminal portion exists) of the lower substrate conductor plate 6 is formed in the vicinity of the first electrode terminal portion 9 to have a conductor plate thickness. An electrode wire restraining portion 10 made of a flat, square raised object that is raised so as to be convex upward in the direction is provided, and the electrode wire restraining portion 10 is also covered with the resin coating film 7. There is.

(Upper board, second element connection terminal)
The upper substrate 3 is formed by coating the surface of a conductor plate 11 for an upper substrate, which is made of a conductive metal plate such as a copper material like the lower substrate 2, with an insulating resin coating film 7. Then, the resin coating film does not exist on the surface of the thin plate-shaped plate portion around the through hole 12 that is opened corresponding to the first element connection terminal portion 8 of the lower substrate conductor plate 6. A second element connection terminal portion 13 for connecting the LED chip is provided in a portion where the surface of the conductor plate 11 for the upper substrate is exposed.

In the semiconductor element mounting substrate terminal plate 1, the upper substrate 3 is superposed on the lower substrate 2 and integrated so that the semiconductor element mounting substrate terminal plate 1 is centered on the first element connecting terminal portion 8. The element mounting portion 4 in which the surface and the second element terminal portion 12 are exposed is formed.

(Upper board, second electrode terminal)
Further, as with the first electrode terminal portion 9, the resin coating film does not exist on the surface of the corner portion of the upper substrate 3 on the one corner side of the terminal plate side portion and opposite to the first electrode terminal portion 9. The surface of the conductor plate 11 for the upper substrate is exposed in a rectangular shape, and a second electrode terminal portion 14 which is the other of the pair of electrode terminal portions 5 is provided.

In the semiconductor element mounting substrate terminal plate 1, the upper substrate 3 is superposed on the lower substrate 2 and integrated, so that the first electrode terminal is formed on the terminal plate side portion of the semiconductor element mounting substrate terminal plate 1. A pair of electrode terminal portions 5 composed of a portion 9 and a second electrode terminal portion 14 are arranged so as to face each other.

Further, an electrode wire restraint portion 10 is provided in the vicinity of the second electrode terminal portion 14 of the upper substrate 3. Similar to the electrode wire restraint portion 10 of the lower substrate 2, the electrode wire restraint portion 10 also has the conductor plate thickness of the conductor plate surface (the surface where the second element connection terminal portion exists) of the conductor plate 11 for the upper substrate. It is made of a raised shape that is raised so as to be convex upward in the direction, and is covered with a resin coating film 7.

(Upper and lower substrates, resin coating film)
As will be described later, each of the resin coating films 7 of the lower substrate 2 and the upper substrate 3 is electrodeposited on the surface of the conductor plate by electrodeposition coating using an electrodeposition coating material having heat resistance and insulating properties. It is formed by precipitating paint. As the electrodeposition coating material, a polyimide resin, a polyamide resin, an epoxy resin, preferably a polyamideimide resin or the like having excellent heat resistance and insulating properties is used, and a resin coating film 7 having heat resistance and insulating properties is used. Is formed as a resin layer.

Even when the upper substrate 3 is superposed on the lower substrate 2 and integrated, the resin coating film 7 on the upper surface side of the lower substrate 2 and the resin coating film 7 on the lower surface side of the upper substrate 3 are used for the lower substrate. It exists between the conductor plate 6 and the conductor plate 11 for the upper substrate, and insulates between the conductor plate 6 for the lower substrate and the conductor plate 11 for the upper substrate.

(Production method)
Next, a first embodiment of the method for manufacturing the semiconductor element mounting substrate terminal plate 1 will be described. It should be noted that each cross section shown in the drawing is a cross section at the same portion as the position along the line AA in FIG.

(Manufacturing of lower board and upper board)
First, a conductor plate 6 for a lower substrate and a conductor plate 11 for an upper substrate having a predetermined shape by punching using a press die for punching are prepared. At this point, the electrode wire restraint portion 10 is formed as a raised shape on the lower substrate conductor plate 6 and the upper substrate conductor plate 11.

Next, electrodeposition coating of the electrodeposition paint is performed on the lower substrate conductor plate 6 and the upper substrate conductor plate 11. Further, before applying the electrodeposition paint, the lower substrate conductor plate 6 is masked at the portions to be the first element connection terminal portion 8 and the first electrode terminal portion 9, and the upper substrate conductor plate 11 is provided. The second element connection terminal portion 13 and the second electrode terminal portion 14 are masked. Then, an electrodeposition paint is applied to the lower substrate conductor plate 6 and the upper substrate conductor plate 11 whose necessary parts are masked by electrodeposition coating, and the lower substrate conductor plate 6 and the upper substrate conductor plate 11 are combined. A resin coating film 7 is precipitated and formed on the entire surface.

Although only the point that the masking 15 is applied to the first element connection terminal portion 8 is shown in the cross section shown in the figure, the second element connection terminal portion 12, the first electrode terminal portion 9, and the second electrode terminal portion are shown. The same applies to masking for 13.

(Lower board, Fig. 3)
The conductor plate 6 for the lower substrate having the resin coating film 7 deposited on the entire surface is heat-treated (baked) at an appropriate temperature, and the resin coating film 7 is baked and dried as shown in FIG. The resin coating film 7 is completely cured. As a result, it is possible to obtain a lower substrate 2 having a completely cured resin coating film 7 having a predetermined thickness and a uniform thickness. If there are pinholes in the resin coating film 7 at the time of precipitation formation, the pinholes are filled with the surrounding electrodeposition paint during the heat treatment, so that the thickness uniformity is ensured.

(Upper board, Fig. 4)
On the other hand, the conductor plate 11 for the upper substrate on which the resin coating film 7 is formed on the entire surface is heat-treated (baked) at an appropriate temperature to semi-cure the resin coating film 7 to form a soft state. An upper substrate 3 having a semi-cured resin coating film 7 is obtained.

(Superposition, Fig. 5)
Next, the upper substrate 3 having the semi-cured resin coating film 7 is superposed on the upper surface of the lower substrate 2 having the completely cured resin coating film 7 as described above. At this time, the masked first element connection terminal portion 8 of the lower substrate 2 is located outside through the through hole 12 of the upper substrate 3, and the first element connection terminal portion 8 (lower) is masked together. The substrate 2) and the second element connection terminal portion 13 (upper substrate 3) are made to appear to the outside. Further, the masked first electrode terminal portion 9 and the electrode wire restraint portion 10, and the masked second electrode terminal portion 14 and the electrode wire restraint portion 10 are also exposed to the outside of the lower substrate 2. And the upper substrate 3 are superposed.

(Pressurized heating)
The superposed lower substrate 2 and upper substrate 3 are subjected to a pressure heating treatment in which the upper substrate 3 is heated at an appropriate temperature while being pressurized at an appropriate pressure from above and below, and the semi-cured resin coating film 7 of the upper substrate 3 is formed. Fully cure. The completely cured resin coating film 7 of the lower substrate 2 and the semi-cured resin coating film 7 of the upper substrate 3 are in close contact with each other due to superposition, and are semi-cured by applying pressure heat treatment. The resin coating film 7 of the above is completely cured.

Then, in the process of completely curing the semi-cured resin coating film 7, the resin coating film 7 of the lower substrate 2 and the resin coating film 7 of the upper substrate 3 adhere to each other, and the lower substrate 2 and the upper substrate 3 come together. It is firmly bonded and becomes one. FIG. 5 shows a state in which the resin coating film 7 is completely cured and adhered to each other.

As shown in FIG. 5, a resin coating film 7 having an insulating property exists between the lower substrate 2 and the upper substrate 3 which are bonded and integrated by the pressure heat treatment. The substrate 2 and the upper substrate 3 are connected in an electrically insulated laminated state.

(Masking removal)
After applying pressure heat treatment to connect the lower substrate 2 and the upper substrate 3 in a laminated state by adhering the resin coating films 7 to each other, and then removing the masking, the substrate terminal board 1 for mounting the semiconductor element is completed.

As a result, one semiconductor element mounting substrate terminal plate 1 has an element mounting portion 4 in which the first element connecting terminal portion 8 and the second element connecting terminal portion 12 are exposed to the outside, and is convex upward. A pair of electrode terminal portions 5 in which the first electrode terminal portion 9 having the electrode wire restraint portion 10 in close proximity and the second electrode terminal portion 14 in which the electrode wire restraint portion 10 convex upward is brought close to each other are exposed to the outside. It is supposed to have.

(Other examples of superposition)
In the above-mentioned superposition, the upper substrate 3 is superposed on the lower substrate 2 so that the semi-cured resin coating film 7 of the upper substrate 3 is in contact with the completely cured resin coating film 7 of the lower substrate 2. The lower substrate 2 and the upper substrate 3 are subjected to pressure heating treatment in this state, but the resin coating film 7 of the lower substrate 2 before being overlapped is left in a semi-cured state, and the lower substrate 2 is subjected to a semi-cured state. A space-retaining member (a space-retaining member made of glass beads, silica beads, or a resin sheet made of the same material as the electrodeposition coating material) between the semi-cured resin coating film 7 and the semi-cured resin coating film 7 of the upper substrate 3. The upper substrate 3 is overlaid on the lower substrate 2 so that the semi-cured resin coating film 7 of the lower substrate 2 is in contact with the semi-cured resin coating film 7 of the upper substrate 3 with an interposition (not shown). After that, the lower substrate 2 and the upper substrate 3 may be subjected to a pressure heating treatment so that the lower substrate 2 and the lower substrate 3 are integrated with the space holding member interposed therebetween.

(Laser processing without masking)
Further, although masking is performed in the above-described embodiment, as a method of exposing the first element connection terminal portion 8, the second element connection terminal portion 13, the first electrode terminal portion 9, and the second electrode terminal portion 14. Connects the lower substrate 2 and the upper substrate 3 without masking, and then connects the first element connection terminal portion 8, the second element connection terminal portion 13, the first electrode terminal portion 9, and the second electrode terminal. The resin coating film 7 covering the portion 14 may be removed by laser processing.

(Other examples of electrode wire restraint)
The electrode wire restraint portion 10 in the above embodiment is shown to be a raised object having a quadrangular planar shape, but the present invention is not limited to this example, and as shown in FIG. It may consist of a raised object having a bridge shape that is convex upward in the substrate thickness direction, or a through hole that penetrates in the substrate thickness direction as shown in FIG. 7.

Further, the entire corner of the lower substrate 2 on which the first electrode terminal portion 9 and the electrode wire restraint portion 10 are arranged, and the entire corner of the upper substrate 3 on which the second electrode terminal portion 14 and the electrode wire restraint portion 10 are arranged are covered. As shown in FIG. 8, each of the Giboshi terminals 16 is formed, and the first electrode terminal portion 9 and the electrode wire restraint portion 10 are formed in a continuous state by the Giboshi terminal 16 of the lower substrate 2, and the Giboshi terminal 16 of the upper substrate 3 is formed. It is also possible to form the second electrode terminal portion 14 and the electrode wire restraint portion 10 in a continuous state.

When the Giboshi terminal 16 is provided, the entire Giboshi is masked and then the masking is removed after the lower substrate 2 and the upper substrate 3 are integrated, or the masking is covered with a resin coating film without masking, as described above. The resin coating film may be removed by laser processing.

As described above, the electrode wire restraint portion 10 is provided on the lower substrate 2 and the upper substrate 3 before forming the resin coating film, and the conductor plate 6 for the lower substrate and the conductor plate 11 for the upper substrate are provided. It is formed by processing each of them. The processing method itself for obtaining the electrode wire restraint portion 10 is not particularly limited, but for example, an electrode wire restraint portion made of a flat quadrangular raised shape object or an electrode wire restraining portion made of a bridge-shaped raised shape object. It is possible to deal with this by stamping the press. Further, when obtaining an electrode wire restraint portion formed of a through hole, it is possible to deal with it by punching. When obtaining an electrode wire restraint portion continuous with the electrode terminal portion at the above-mentioned Giboshi terminal, it is possible to cope with the process by bending and raising the portion formed for Giboshi.

The electrode wire restraint portion formed of the raised shape and the through hole between the conductor plate for the lower substrate and the conductor plate for the upper substrate has the electrode wire fastening portion to be connected by ultrasonic welding on the same surface as the electrode connection terminal portion. It is formed so as to appear as a hole or a convex portion on the side (that is, the side on which the electrode wires are superposed during ultrasonic welding).

1 ... Substrate terminal plate for mounting semiconductor elements 2 ... Lower board 3 ... Upper board 4 ... Element mounting part 5 ... Electrode terminal part 6 ... Conductor plate for lower board 7 ... Resin coating film 8 ... First element connection terminal part 9 ... 1st electrode terminal part 10 ... Electrode line restraint part 11 ... Conductor plate for upper substrate 12 ... Through hole 13 ... 2nd element connection terminal part 14 ... 2nd electrode terminal part 16 ... Giboshi terminal

Claims (5)

In the center of the upper surface of the terminal plate, there is an element mounting portion in which a semiconductor element can be arranged by providing a pair of a first element connection terminal portion and a second element connection terminal portion for connecting to a semiconductor element, and the terminal plate side. This is a method for manufacturing a substrate terminal plate for mounting a semiconductor element, which has an electrode terminal portion including a first electrode terminal portion and a second electrode terminal portion for connecting an electrode wire.
From the conductive metal plate, the first element connection terminal portion is provided in the center of the upper surface, the first electrode terminal portion is provided in one corner, and an electrode wire restraint portion is arranged in the vicinity of the first electrode terminal portion. While forming the lower substrate
A through hole is opened from the conductive metal plate at a portion corresponding to the first element connection terminal portion when superposed on the lower substrate, and the second element connection terminal portion is provided around the through hole. The upper substrate is provided with the second electrode terminal portion at a position facing the first electrode terminal portion when superposed on the lower substrate, and the electrode wire restraint portion is arranged in the vicinity of the second electrode terminal portion. Form and
The lower substrate and the upper substrate are coated with a resin coating film obtained by electrodeposition coating using an electrodeposition coating having heat resistance and insulating properties, and each electrode line restraint portion is covered with a resin coating film. Covered with
The first element connection terminal portion of the lower substrate is made to correspond to the through hole of the upper substrate, and the first electrode terminal portion and the electrode restraint portion of the lower substrate are the second electrode terminal portion and the electrode wire restraint portion of the upper substrate. Lay the upper substrate on the lower substrate so that it does not overlap with the lower substrate.
By applying pressure and heat treatment to the lower substrate and the upper substrate in this superposed state, the resin coating films between the lower substrate and the upper substrate are adhered to each other.
By connecting the lower substrate and the upper substrate by this adhesion, the element mounting portion provided with the first element connecting terminal portion and the second element connecting terminal portion is provided, and each of them has an electrode wire restraining portion arranged in the vicinity. (I) A method for manufacturing a substrate terminal plate for mounting a semiconductor element, which comprises forming one substrate terminal plate having the electrode terminal portion in which the electrode terminal portion and the second electrode terminal portion are arranged. The substrate terminal plate for mounting a semiconductor element according to claim 1, wherein the electrode wire restraint portion is a through hole penetrating in the substrate thickness direction or a raised shape that is convex upward in the substrate thickness direction. Production method. The portion of the lower substrate where the electrode wire restraint portion and the first electrode terminal portion are arranged and the portion where the electrode wire restraint portion and the second electrode terminal portion of the upper substrate are arranged are designated as Giboshi terminals, respectively. A claim that an electrode wire restraint portion and a first electrode terminal portion are formed on the Giboshi terminal of the lower substrate, and an electrode wire restraint portion and a second electrode terminal portion are formed on the Giboshi terminal of the upper substrate. The method for manufacturing a substrate terminal plate for mounting a semiconductor element according to 1. Before applying the electrodeposition paint, masking is applied to each of the first element connection terminal portion, the second element connection terminal portion, the first electrode terminal portion, and the second electrode terminal portion.
A claim that removes the masking after the connection between the lower substrate and the upper substrate so that the first element connection terminal portion, the second element connection terminal portion, the first electrode terminal portion, the second electrode terminal portion, and the outside are exposed. Item 8. The method for manufacturing a substrate terminal board for mounting a semiconductor element according to any one of Items 1 to 3. After the above connection between the lower substrate and the upper substrate, the resin coating film covering the first element connection terminal portion, the second element connection terminal portion, the first electrode terminal portion, and the second electrode terminal portion is removed. The semiconductor element mounting according to any one of claims 1 to 3, wherein the first element connection terminal portion, the second element connection terminal portion, the first electrode terminal portion, and the second electrode terminal portion are exposed to the outside. Substrate Terminal plate manufacturing method.