JP6753435B2 - Physical quantity sensors, electronics and mobiles - Google Patents

Description

The present invention relates to packages, electronic component mounting packages, physical quantity sensors, electronic devices and mobile objects.

Conventionally, an angular velocity sensor as in Patent Document 1 is known as a physical quantity sensor for detecting a physical quantity such as an angular velocity.
The angular velocity sensor described in Patent Document 1 includes a package, a vibration gyro element and an IC housed in the package. Further, a plurality of wirings are formed in the package (base), and a predetermined terminal of the IC is electrically connected to the gyro element or is pulled out to the outside through the wiring. More specifically, the plurality of wirings are at least electrically connected to the first detection wiring that is electrically connected to the first detection terminal of the gyro element and the second detection terminal. A second detection wiring and an input / output wiring for inputting a signal to the IC and outputting a signal from the IC are included.

Japanese Unexamined Patent Publication No. 2008-197033

In recent years, digital interfaces have been increasingly used as means for inputting and outputting signals between ICs and the outside. When a digital interface is used, the plurality of wirings described above include input / output wirings for inputting a digital signal to the IC and outputting a digital signal from the IC. Therefore, due to the electrical coupling between the first and second detection wirings (first and second detection signal input pads) and the input / output wirings (input / output pads), noise is transferred to the first and second detection wirings. It may be mixed and the detection signal may not be acquired accurately.
An object of the present invention is to provide a package capable of reducing noise interference, an electronic component mounting package, a physical quantity sensor, an electronic device, and a mobile body.

Such an object is achieved by the following invention.
[Application example 1]
The package of this application example has a base on which electronic components are placed and
With a plurality of wires arranged on the base,
Have,
The wiring is
A plurality of first wires having internal terminals connected to the electronic component,
A plurality of second wires having internal terminals connected to the electronic component,
Have,
The internal terminals of the plurality of first wirings are arranged side by side along the first axis.
The internal terminals of the plurality of second wires are arranged side by side along a second axis that intersects the first axis.
The second wiring includes a detection signal wiring electrically connected to a detection electrode of the physical quantity detecting element.
The plurality of first wirings include digital signal wirings for transmitting digital signals.
The internal terminals of the digital signal wiring shall be arranged on the side opposite to the second axis with respect to the center line in the first axial direction of the plurality of internal terminals of the plurality of first wirings. It is characterized by.
As a result, the first wiring and the second wiring can be separated from each other, so that noise interference from the first wiring to the second wiring can be reduced.

[Application example 2]
The package of this application example has a base on which electronic components are placed and
The wiring arranged on the base and
Have,
The base is in a plan view of the base.
With the first outer edge
A second outer edge located on one end side of the first outer edge and extending in a direction intersecting the first outer edge,
Have,
The wiring is
A first wire having an internal terminal connected to the electronic component and side electrodes arranged on the side surface corresponding to the first outer edge of the base.
A plurality of second wirings arranged side by side along an axis parallel to the second outer edge and having internal terminals connected to the electronic component.
Have,
The first wiring includes a digital signal wiring for transmitting a digital signal.
The second wiring includes a detection signal wiring that is electrically connected to a detection electrode of the physical quantity detecting element.
As a result, the first wiring and the second wiring can be separated from each other, so that noise interference from the first wiring to the second wiring can be reduced.

[Application example 3]
In the package of this application example, the first wiring is a plurality.
It is preferable that the internal terminals of the first wiring are arranged side by side along an axis parallel to the first outer edge.
As a result, the internal terminal of the first wiring and the internal terminal of the second wiring can be separated from each other, and noise interference from the first wiring to the second wiring is reduced.

[Application example 4]
In the package of this application example, at least one of the ground wiring and the fixed potential wiring having a fixed potential is arranged between the internal terminal of the digital signal wiring and the internal terminal of the detection signal wiring. Is preferable.
As a result, the ground wiring or the fixed potential wiring functions as a shield layer, so that noise interference from the first wiring to the second wiring is further reduced.

[Application example 5]
The package of this application example has a base on which electronic components are placed and
With a plurality of wires arranged on the base,
Have,
The plurality of wirings
A plurality of first wires having internal terminals connected to the electronic component,
A second wire having an internal terminal connected to the electronic component,
Have,
The plurality of first wirings include digital signal wirings for transmitting digital signals.
The second wiring includes a detection signal wiring electrically connected to a detection electrode of the physical quantity detecting element.
It is characterized in that a ground wiring or a fixed potential wiring having a fixed potential is arranged between the digital signal wiring and the detection signal wiring.
As a result, the ground wiring or the fixed potential wiring functions as a shield layer, so that noise interference from the first wiring to the second wiring is reduced.

[Application example 6]
In the package of this application example, the base is viewed in plan view of the base.
With the first outer edge
A second outer edge located on one end side of the first outer edge and extending in a direction intersecting the first outer edge,
Have,
The internal terminals of the plurality of first wires are arranged along a first axis parallel to the first outer edge.
The second wiring is plural,
The internal terminals of the plurality of second wirings are preferably arranged along a second axis parallel to the second outer edge.
As a result, the first wiring and the second wiring can be separated from each other, and noise interference from the first wiring to the second wiring is further reduced.

[Application 7]
In the package of this application example, it is preferable that the internal terminal of the digital signal wiring is arranged on the other end side of the first outer edge.
As a result, the first wiring and the second wiring can be further separated from each other, and noise interference from the first wiring to the second wiring is further reduced.

[Application Example 8]
The electric element mounting package of this application example is the package of this application example and
With the electronic components
An electronic component mounting package characterized by having.
As a result, a highly reliable electronic component mounting package can be obtained.

[Application 9]
The electronic component mounting package of this application example is the base and
Electronic components placed on the base
The first wiring connected to the electronic component and
The second wiring connected to the electronic component and
A first conductive wire that connects the electronic component and the first wiring,
A second conductive wire that connects the electronic component and the second wiring,
Have,
The first wiring includes a digital signal wiring for transmitting a digital signal.
The second wiring includes a detection signal wiring electrically connected to a detection electrode of the physical quantity detecting element.
In a plan view of the base, the extending direction of the first conductive wire connected to the digital signal wiring and the extending direction of the second conductive wire connected to the detection signal wiring are It is characterized by intersecting.
As a result, the first conductive wire and the second conductive wire can be separated from each other, and noise interference from the first wiring to the second wiring is reduced.
[Application Example 10]
In the electronic component mounting package of the present application example, in the plan view of the base, the extending direction of the first conductive wire connected to the digital signal wiring and the first one connected to the detection signal wiring. It is preferable that the extending direction of the conductive wire 2 is orthogonal to the extending direction.

[Application example 11]
The physical quantity sensor of this application example includes the electronic component mounting package of this application example and
With the physical quantity detecting element
It is characterized by having.
As a result, a highly reliable electronic component mounting package can be obtained.

[Application example 11]
The electronic device of this application example is characterized by including the physical quantity sensor of this application example.
As a result, a highly reliable electronic device can be obtained.
[Application Example 12]
The moving body of this application example is characterized by including the physical quantity sensor of this application example.
As a result, a highly reliable moving body can be obtained.

It is a top view (top view) of the physical quantity sensor which concerns on 1st Embodiment of this invention. FIG. 5 is a cross-sectional view taken along the line AA in FIG. It is a top view (top view) which shows the gyro element which the physical quantity sensor shown in FIG. 1 has. It is a top view (top view) which shows the electrode arrangement of the gyro element shown in FIG. It is a top view (transmission view seen from the upper side) which shows the electrode arrangement of the gyro element shown in FIG. It is a figure for demonstrating the operation of the gyro element shown in FIG. (A) is a plan view of the first substrate (transmission view seen from above), and (b) is a plan view (top view) of the second substrate. (A) is a plan view (top view) of the third substrate, and (b) is a plan view (top view) of the fourth substrate. (A) is a plan view (top view) of the fifth substrate, and (b) is a plan view (top view) of the sixth substrate. It is a top view (top view) of the base. It is a top view (top view) of the support substrate which has the vibration shown in FIG. It is a top view (top view) which shows the bonding state of a support substrate and a base. It is a top view (bottom view) which shows the bonding state of a support substrate and a gyro element. It is a top view (top view) of the physical quantity sensor which concerns on 2nd Embodiment of this invention. It is a perspective view which shows the structure of the mobile type (or notebook type) personal computer which applied the electronic device provided with the physical quantity sensor of this invention. It is a perspective view which shows the structure of the mobile phone (including PHS) to which the electronic device provided with the physical quantity sensor of this invention is applied. It is a perspective view which shows the structure of the digital still camera to which the electronic device provided with the physical quantity sensor of this invention is applied. It is a perspective view which shows the structure of the automobile to which the moving body provided with the physical quantity sensor of this invention is applied.

Hereinafter, the package of the present invention, the package for mounting electronic components, the physical quantity sensor, the electronic device, and the moving body will be described in detail based on the embodiments shown in the accompanying drawings.
1. Physical quantity sensor <First embodiment>
FIG. 1 is a plan view (top view) of the physical quantity sensor according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA in FIG. FIG. 3 is a plan view (top view) showing a gyro element included in the physical quantity sensor shown in FIG. FIG. 4 is a plan view (top view) showing the electrode arrangement of the gyro element shown in FIG. FIG. 5 is a plan view (transmission view seen from above) showing the electrode arrangement of the gyro element shown in FIG. FIG. 6 is a diagram for explaining the operation of the gyro element shown in FIG. 7A and 7B are a plan view (transmission view seen from above) of the first substrate, and FIG. 7B is a plan view (top view) of the second substrate. 8A is a plan view (top view) of the third substrate, and FIG. 8B is a plan view (top view) of the fourth substrate. 9A is a plan view (top view) of the fifth substrate, and FIG. 9B is a plan view (top view) of the sixth substrate. FIG. 10 is a plan view (top view) of the base. FIG. 11 is a plan view (top view) of the support substrate having the vibration shown in FIG. FIG. 12 is a plan view (top view) showing a joined state between the support substrate and the base. FIG. 13 is a plan view (bottom view) showing a bonded state of the support substrate and the gyro element. In the following, for convenience of explanation, the front side of the paper in FIG. 1 and the upper side in FIG. 2 are also referred to as “upper”, and the back side of the paper in FIG. 1 and the lower side in FIG. 2 are also referred to as “lower”. .. Further, in the following, the direction along the X-axis is also referred to as "X-axis direction", and the direction along the Y-axis is also referred to as "Y-axis direction".

The physical quantity sensor 1 shown in FIGS. 1 and 2 is a gyro sensor that supports the gyro element (physical quantity detection element) 2, the package 5 accommodating the gyro element 2, and the gyro element 2 and is fixed to the package 5. It has a support substrate 9 and an IC (electronic component) 10 arranged in the package 5. The package 5 in which the IC 10 is mounted is referred to as an electronic component mounting package.

Hereinafter, each of these components will be described in sequence.
≪Gyro element≫
As shown in FIG. 3, the gyro element 2 has a vibrating piece 3 and an electrode formed on the vibrating piece 3.
-Vibration piece-
Examples of the constituent material of the vibrating piece 3 include piezoelectric materials such as quartz, lithium tantalate, and lithium niobate. Among these, it is preferable to use quartz as a constituent material of the vibrating piece 3. By using quartz, a gyro element 2 having excellent frequency-temperature characteristics as compared with other materials can be obtained. In the following, a case where the vibrating piece 3 is made of quartz will be described.

The vibrating piece 3 has a plate shape having a spread in the XY plane defined by the Y axis (mechanical axis) and the X axis (electric axis), which are the crystal axes of the crystal substrate, and having a thickness in the Z axis (optical axis) direction. Is doing. That is, the vibrating piece 3 is composed of a Z-cut crystal plate. It is preferable that the Z-axis coincides with the thickness direction of the vibrating piece 3, but from the viewpoint of reducing the frequency temperature change in the vicinity of room temperature, it is slightly (for example, −5 ° ≦ θ) with respect to the thickness direction. It may be tilted (about ≦ 15 °).

Such a vibrating piece 3 extends from the base portion 31 located at the center, the first and second detection arms 321 and 322 extending from the base portion 31 to both sides in the Y-axis direction, and from the base portion 31 to both sides in the X-axis direction. The existing first and second connecting arms 331 and 332, the first and second driving arms 341 and 342 extending from the tip of the first connecting arm 331 to both sides in the Y-axis direction, and the second connecting arm. It has third and fourth driving arms 343 and 344 extending from the tip end portion of 332 to both sides in the Y-axis direction.

The first detection arm 321 extends from the base 31 in the + Y-axis direction, and a wide hammer head 3211 is provided at the tip thereof. On the other hand, the second detection arm 322 extends from the base portion 31 in the −Y axis direction, and a wide hammer head 3221 is provided at the tip portion thereof. These first and second detection arms 321 and 322 are arranged symmetrically with respect to the XZ plane passing through the center of gravity G of the gyro element 2. The hammer heads 3211 and 3221 may be provided as needed, and may be omitted. Further, if necessary, bottomed grooves extending in the length direction may be formed on the upper surface and the lower surface of the first and second detection arms 321 and 322.

The first connecting arm 331 extends from the base 31 in the + X axis direction. On the other hand, the second connecting arm 332 extends from the base 31 in the −X axis direction. These first and second connecting arms 331 and 332 are arranged symmetrically with respect to the YZ plane passing through the center of gravity G.
The first driving arm 341 extends from the tip of the first connecting arm 331 in the + Y-axis direction, and a wide hammer head 3411 is provided at the tip. Further, the second driving arm 342 extends from the tip end portion of the first connecting arm 331 in the −Y axis direction, and a wide hammer head 3421 is provided at the tip end portion. Further, the third driving arm 343 extends from the tip end portion of the second connecting arm 332 in the + Y axis direction, and a wide hammer head 3431 is provided at the tip end portion. Further, the fourth driving arm 344 extends from the tip end portion of the second connecting arm 332 in the −Y axis direction, and a wide hammer head 3441 is provided at the tip end portion. These four driving arms 341, 342, 343, and 344 are arranged point-symmetrically with respect to the center of gravity G. The hammer heads 3411, 3421, 3431, and 3441 may be provided as necessary or may be omitted. Further, if necessary, bottomed grooves extending in the length direction may be formed on the upper surface and the lower surface of the drive arms 341, 342, 343, and 344.

-Electrode-
As shown in FIGS. 4 and 5, the electrodes are the first detection signal electrode 411, the first detection signal terminal 412, the first detection ground electrode 421, the first detection ground terminal 422, and the second detection signal electrode. 431, the second detection signal terminal 432, the second detection ground electrode 441, the second detection ground terminal 442, the drive signal electrode 451 and the drive signal terminal 452, the drive ground electrode 461, and the drive ground terminal 462. ,have. In FIGS. 3 and 4, for convenience of explanation, the first and second detection signal electrodes 411, 431 and the first and second detection signal terminals 412, 432, the first and second detection ground electrodes 421, 441 and the first The first and second detection ground terminals 422 and 442, the drive signal electrode 451 and the drive signal terminal 452, the drive ground electrode 461 and the drive ground terminal 462 are illustrated by different hatches. Further, the electrodes formed on the side surface of the vibrating piece 3 are shown by thick lines.

The first detection signal electrode 411 is formed on the upper surface and the lower surface (the portion excluding the hammer head 3211) of the first detection arm 321, and the second detection signal electrode 431 is the upper surface and the lower surface (hammer head 3221) of the second detection arm 322. It is formed in the part excluding). Such first and second detection signal electrodes 411 and 431 are electrodes for detecting the electric charge generated by the detection vibrations of the first and second detection arms 321 and 322 when the detection vibrations are excited. ..

The first detection signal terminal 412 is provided on the + Y-axis side of the + X-axis side row of the base 31, and is electrically connected to the first detection signal electrode 411 formed on the first detection arm 321 via a wiring (not shown). It is connected to the. Further, the second detection signal terminal 432 is provided on the −Y axis side of the row on the + X axis side of the base 31, and the second detection signal electrode 431 formed on the second detection arm 322 via a wiring (not shown). Is electrically connected to.

The first detection ground electrode 421 is formed on both side surfaces of the first detection arm 321 and is electrically connected to each other via the hammer head 3211. Similarly, the second detection ground electrode 441 is formed on both side surfaces of the second detection arm 322 and is electrically connected to each other via the hammer head 3221. Such first and second detection ground electrodes 421 and 441 have a potential to be ground with respect to the first and second detection signal electrodes 411 and 431.

The first detection ground terminal 422 is provided on the + Y-axis side of the row on the −X-axis side of the base 31, and is electrically connected to the first detection ground electrode 421 formed on the first detection arm 321 via a wiring (not shown). Is connected. Further, the second detection ground terminal 442 is provided on the −Y axis side of the −X axis side row of the base 31, and is a second detection signal electrode formed on the second detection arm 322 via a wiring (not shown). It is electrically connected to 431.

As described above, the first and second detection signal electrodes 411 and 431, the first and second detection signal terminals 412 and 432, the first and second detection ground electrodes 421 and 441, and the first and second detection ground terminals By arranging 422 and 442, the detection vibration generated in the first detection arm 321 appears as a charge between the first detection signal electrode 411 and the first detection ground electrode 421, and the first detection signal terminal 412 And the first detection ground terminal 422 can be taken out as a signal (detection signal). Further, the detection vibration generated in the second detection arm 322 appears as an electric charge between the second detection signal electrode 431 and the second detection ground electrode 441, and is transmitted from the second detection signal terminal 432 and the second detection ground terminal 442. It can be taken out as a signal (detection signal).

The drive signal electrodes 451 are formed on the upper surfaces and lower surfaces (parts excluding the hammer heads 3411 and 3421) of the first and second drive arms 341 and 342. Further, the drive signal electrodes 451 are formed on both side surfaces of the third and fourth drive arms 343 and 344, and are electrically connected to each other via the hammer heads 3431 and 3441. Such a drive signal electrode 451 is an electrode for exciting the drive vibration of the first, second, third, and fourth drive arms 341, 342, 343, and 344.
The drive signal terminal 452 is provided at the center of the row on the −X axis side of the base 31 (that is, between the first detection ground terminal 422 and the second detection ground terminal 442), and is provided via a wiring (not shown). It is electrically connected to the drive signal electrodes 451 formed on the first, second, third, and fourth drive arms 341, 342, 343, and 344.

The drive ground electrode 461 is formed on the upper surface and the lower surface (parts excluding the hammer heads 3431 and 3441) of the third and fourth drive arms 343 and 344. Further, the drive ground electrode 461 is formed on both side surfaces of the first and second drive arms 341 and 342, and is electrically connected to each other via the hammer heads 3411 and 3421. Such a drive ground electrode 461 has a potential that becomes ground with respect to the drive signal electrode 451.
The drive ground terminal 462 is provided at the center of the row on the + X axis side of the base 31 (that is, between the first detection signal terminal 412 and the second detection signal terminal 432), and is provided via a wiring (not shown). It is electrically connected to the drive ground electrode 461 formed on the first, second, third, and fourth drive arms 341, 342, 343, and 344.

By arranging the drive signal electrode 451 and the drive signal terminal 452, the drive ground electrode 461, and the drive ground terminal 462 in this way, the drive signal is applied between the drive signal terminal 452 and the drive ground terminal 462. An electric field is generated between the drive signal electrode 451 formed on the first, second, third, and fourth drive arms 341, 342, 343, and 344 and the drive ground electrode 461, and the drive arms 341, 342, and 343, respectively. The 344 can be driven and vibrated.

The configuration of the electrode as described above is not particularly limited as long as it has conductivity, but for example, Ni (nickel) or Au is applied to a metallized layer (underlayer) such as Cr (chromium) or W (tungsten). It can be composed of a metal coating in which each coating such as (gold), Ag (silver), and Cu (copper) is laminated.
The metal film formed on the hammer heads 3211 and 3221 functions as an adjusting film for adjusting the frequency of the detection vibration mode. For example, a part of the metal film is removed by laser irradiation or the like, and the first By adjusting the masses of the second detection arms 321 and 322, the frequency of the detection mode can be adjusted. On the other hand, the metal film formed on the hammer heads 3411, 3421, 3431, 3441 functions as an adjusting film for adjusting the frequency of the drive vibration mode, and for example, a part of the metal film is removed by laser irradiation or the like. By adjusting the mass of the drive arms 341, 342, 343, and 344, the frequency of the drive mode can be adjusted.
The configuration of the gyro element 2 has been briefly described above. Next, the driving of the gyro element 2 will be briefly described.

When a voltage (alternating voltage) is applied between the drive signal terminal 452 and the drive ground terminal 462 in a state where the angular velocity is not applied to the gyro element 2, an electric field is generated between the drive signal electrode 451 and the drive ground electrode 461. As shown in FIG. 6A, each drive arm 341, 342, 343, 344 bends and vibrates in the direction indicated by the arrow A. At this time, since the first and second driving arms 341 and 342 and the third and fourth driving arms 343 and 344 vibrate plane-symmetrically with respect to the YZ plane passing through the center of gravity G of the gyro element 2, the base portion 31, The first and second detection arms 321 and 322 and the first and second connecting arms 331 and 332 hardly vibrate.

When the angular velocity ω around the Z axis is applied to the gyro element 2 in the state of performing such drive vibration, the detected vibration as shown in FIG. 6B is excited. Specifically, the Coriolis force in the direction of arrow B acts on the driving arms 341, 342, 343, 344 and the first and second connecting arms 331 and 332, and new vibrations are excited. The vibration in the arrow B direction is a vibration in the circumferential direction with respect to the center of gravity G. At the same time, the first and second detection arms 321 and 322 are excited with the detection vibration in the direction of arrow C in response to the vibration of arrow B. Then, the electric charges generated in the first and second detection arms 321 and 322 due to this vibration are taken out as signals from the first and second detection signal electrodes 411 and 431 and the first and second detection ground electrodes 421 and 441. The angular velocity ω is obtained based on this signal.

≪Package≫
As shown in FIGS. 1 and 2, the package 5 has a box-shaped base (base) 6 having a recess 61 that opens on the upper surface, and a plate-shaped lid (base) 6 that closes the opening of the recess 61 and is joined to the base 6. It has a lid) 7. The gyro element 2 described above is housed in the internal space S formed by closing the opening of the recess 61 with the lid 7. The atmosphere of the internal space S is not particularly limited, but in the present embodiment, it is in a vacuum state (for example, a reduced pressure state of 10 Pa or less).

-Base-
The base 6 has a substantially rectangular outer shape in a plan view thereof, and intersects a pair of outer edges 631 and 632 extending in the major axis direction in the minor axis direction (long axis direction). It has a pair of outer edges 633, 634, which extend in the direction). However, the plan view shape of the base 6 is not limited to a rectangle, and may be, for example, a square, a polygon of a pentagon or more, or a variant.

Here, the term "substantially rectangular" as used herein means not only a perfect rectangle but also a shape that can be regarded as a substantially rectangle, specifically, at least one of the four corners of the rectangle. This means that a shape in which the portion is rounded or a shape in which a curved or bent portion is present on at least one of the four sides of the rectangle is also included.

Further, the base 6 is formed by laminating a plurality of rectangular substrates (sheets) formed by molding ceramic green sheets such as aluminum oxide, aluminum nitride, silicon carbide, mullite, and glass / ceramic, and then laminating the base 6. It is formed by sintering. The number of sheets to be laminated is not particularly limited, but in the present embodiment, six sheets, specifically, the first substrate 6A and the second substrate 6B from the lower side (opposite side to the lid 7) in FIG. , The third substrate 6C, the fourth substrate 6D, the fifth substrate 6E, and the sixth substrate 6F are laminated in this order.

Further, the recess 61 has a bottomed first recess 611 that opens on the upper surface of the base 6, a bottomed second recess 612 that opens on the bottom of the first recess 611 and is smaller than the first recess 611, and a second recess. It has a bottomed third recess 613 that opens at the bottom of the recess 612 and is smaller than the second recess 612. Of these, the first recess 611 is composed of through holes formed in the sixth substrate 6F, the second recess 612 is composed of through holes formed in the fifth substrate 6E, and the third recess 613 is composed of through holes. , The fourth substrate 6D and the third substrate 6C are composed of through holes continuously formed. Further, the fifth substrate 6E is formed with cutouts 651 and 652 connected to the second recess 612.
The first recess 611, the second recess 612, and the third recess 613 each have a substantially rectangular outer shape in a plan view, and the major axis direction thereof substantially coincides with the major axis direction of the base 6. There is.

As shown in FIG. 9B, the first recess 611 has a pair of long sides 611a and 611b extending in the long axis direction and a pair of short sides 611c and 611d extending in the end axis direction. In addition, each corner is rounded.
Further, as shown in FIG. 9A, the second recess 612 has a pair of long sides 612a and 612b extending in the long axis direction and a pair of short sides 612c and 612d extending in the end axis direction. In addition, each corner is rounded. Further, in the plan view of the base 6, each of the four sides 612a to 612d is located inside the first recess 611. Further, notches 651 and 652 extending toward the outer edge 633 of the base 6 are formed on the side 612c.

Further, as shown in FIGS. 8A and 8B, the third recess 613 has a pair of long sides 613a and 613b extending in the long axis direction and a pair of short sides 613c extending in the short axis direction. , 613d, and each corner is rounded. Further, in the plan view of the base 6, the three sides 612a, 612b, and 612c are located inside the second recess 612, respectively, and the remaining side 613d overlaps with the short side 612d of the second recess 612. There is.
An IC 10 is fixed to the bottom surface of such a recess 61 (the bottom surface of the third recess 613; the top surface of the second substrate 6B) with a conductive adhesive K such as silver (Ag) paste. The IC 10 is electrically connected to a wiring group 8 to be described later formed on the base 6 by a conductive wire (bonding wire) 821 to 835.

Further, the IC 10 has, for example, a drive circuit for driving and vibrating the gyro element 2 (that is, a drive circuit for applying a voltage between the drive signal electrode 451 and the drive ground electrode 461) and the gyro element when the angular velocity ω is applied. A detection circuit that detects the detection vibration generated in 2 (that is, a detection circuit that detects the charge between the first detection signal electrode 411 and the first detection ground electrode 421 and the charge between the second detection signal electrode 431 and the second detection ground electrode 441. ) And are incorporated.

Further, the IC 10 has a substantially rectangular outer shape in a plan view, and the major axis direction substantially coincides with the major axis direction of the base 6. As shown in FIG. 10, the IC 10 extends in the minor axis direction (direction intersecting the major axis direction) with a pair of outer edges (first element outer edges) 101 and 102 extending in the major axis direction. It has a pair of outer edges (second element outer edges) 103 and 104. However, the plan view shape of the IC 10 is not limited to a rectangle, and may be, for example, a square, a polygon of a pentagon or more, or a variant.

Further, as shown in FIG. 2, a through hole 62 that communicates with the inside and outside of the recess 61 is formed at the bottom of the base 6. The through hole 62 is a hole for evacuating the internal space S, and after removing the air in the internal space S through the through hole 62, it is sealed with a sealing material M made of an Au-Ge alloy or the like. It will be stopped. As a result, the internal space S can be maintained in a vacuum state. In FIG. 2, the inner opening of the through hole 62 is shown to be closed by the IC10 (conductive adhesive K), but in reality, the inner opening of the through hole 62 is not closed. IC10 is fixed to.

The through hole 62 is composed of a lower through hole 62A formed in the first substrate 6A and an upper through hole 62B formed in the second substrate 6B, and the diameter of the upper through hole 62B is lower. It is smaller than the diameter of the through hole 62A. Therefore, a step portion 62C formed on the lower surface of the second substrate 6B is formed in the middle of the through hole 62. By having such a step portion 62C, the through hole 62 can be easily sealed by the sealing material M. Specifically, first, a spherical metal ball (material to be the sealing material M) made of an Au-Ge alloy or the like, which is smaller than the lower through hole 62A and larger than the upper through hole 62B is prepared, and the metal is prepared. The ball is introduced into the through hole 62 from the lower through hole 62A side. Since the metal ball introduced into the through hole 62 is caught by the step portion 62C and stays there, the through hole 62 can be sealed with the sealing material M by irradiating the metal ball with a laser or the like to melt it. ..

Further, a plurality of notches extending from the upper surface to the lower surface of the base 6 are formed on the side surfaces (side surfaces extending in the major axis direction) 631'and 632' corresponding to the outer edges 631 and 632 of the base 6, respectively. .. Specifically, five notches 640, 641, 642, 643, and 644 are formed on the side surface 631'corresponding to the outer edge 631 at substantially equal intervals, and the side surface 632' corresponding to the outer edge 632 is formed. Is formed with five notches 645, 646, 647, 648, and 649 arranged at substantially equal intervals. A part of the wiring group 8 is formed in each of these notches 640 to 649.

Next, the wiring group 8 arranged on the base 6 will be described in detail with reference to FIGS. 7 to 10. 7A is a transmission view of the first substrate 6A viewed from the upper surface side, FIG. 7B is a top view of the second substrate 6B, and FIG. 8A is a top view of the third substrate 6C. b) is a top view of the fourth substrate 6D, FIG. 8 is a top view of the fifth substrate 6E, (b) is a top view of the sixth substrate 6F, and FIG. 10 is a top view of the base 6. ..

The wiring group 8 includes S1 wiring 801 and S2 wiring 802, GND wiring 803 as ground wiring, DS wiring 804, DG wiring 805, CLK wiring 806, DI wiring 807, DO wiring 808, and CS. It has wiring 809, VDD1 wiring 810, TEST1 wiring 811, DRY wiring 812, TEST2 wiring 813, and VDD2 wiring 814. Of these, the "second wiring" of the present invention includes S1 wiring 801 and S2 wiring 802, and DG wiring 805, and the "first wiring" of the present invention includes GND wiring 803 and DS. Includes wiring 804, CLK wiring 806, DI wiring 807, DO wiring 808, CS wiring 809, VDD1 wiring 810, TEST1 wiring 811, DRY wiring 812, TEST2 wiring 813, and VDD2 wiring 814. Further, the wiring group 8 may have wiring other than the wiring, or at least one of the wirings may be omitted.
The configuration of each of these wirings 801 to 814 is not particularly limited, but for example, a plated metal layer such as gold (Au) is laminated on a base layer such as tungsten (W), molybdenum (Mo), or manganese (Mg). It can be composed of a metal coating. The plated metal layer is formed by, for example, an electrolytic plating method.

Hereinafter, each wiring 801 to 814 will be described in sequence.
[S1 wiring]
As shown in FIGS. 8B and 9A, the S1 wiring 801 has an S1 internal terminal 801a at one end thereof and an S1 connection terminal 801b at the other end. The S1 wiring 801 is electrically connected to the IC 10 at the S1 internal terminal 801a, and is electrically connected to the first detection signal terminal 412 at the S1 connection terminal 801b. As shown in FIG. 10, the electrical connection between the S1 internal terminal 801a and the IC 10 is made by the conductive wire 821. On the other hand, the electrical connection between the S1 connection terminal 801b and the first detection signal terminal 412 is made via the support substrate 9.

The S1 internal terminal 801a is formed on the upper surface of the fourth substrate 6D, and is arranged along the outer edge 633 of the base 6 (the outer edge 103 of the IC 10 and the short side 613c of the third recess 613). Further, the S1 internal terminal 801a is arranged offset to the outer edge 631 side. On the other hand, the S1 connection terminal 801b is formed on the upper surface of the fifth substrate 6E and is provided along the outer edge 633 of the base 6 (short side 612c of the second recess 612). Further, the S1 connection terminal 801b is arranged on the outer edge 631 side of the notch 651.
Such S1 wiring 801 is formed so as to straddle the fourth substrate 6D and the fifth substrate 6E. The wiring from the 4th substrate 6D to the 5th substrate 6E is routed by the via (through silicon via) 801c formed on the 5th substrate 6E. The via 801c is hidden behind the wiring and cannot be seen, but its position is indicated by a white circle for convenience of explanation.

[S2 wiring]
As shown in FIGS. 8B and 9A, the S2 wiring 802 has an S2 internal terminal 802a at one end thereof and an S2 connection terminal 802b at the other end. The S2 wiring 802 is electrically connected to the IC 10 at the S2 internal terminal 802a, and is electrically connected to the second detection signal terminal 432 at the S2 connection terminal 802b. As shown in FIG. 10, the electrical connection between the S2 internal terminal 802a and the IC 10 is made by a conductive wire 822. On the other hand, the electrical connection between the S2 connection terminal 802b and the first detection signal terminal 432 is made via the support substrate 9.

The S2 internal terminal 802a is formed on the upper surface of the fourth substrate 6D, and is arranged along the outer edge 633 of the base 6 (the outer edge 103 of the IC 10 and the short side 613c of the third recess 613). Further, the S2 internal terminal 802a is arranged offset to the outer edge 632 side. On the other hand, the S2 connection terminal 802b is formed on the upper surface of the fifth substrate 6E and is provided along the outer edge 633 of the base 6 (short side 612c of the second recess 612). Further, the S2 connection terminal 802b is arranged on the outer edge 632 side of the notch 652.

Such S2 wiring 802 is formed so as to straddle the fourth substrate 6D and the fifth substrate 6E. The wiring from the 4th substrate 6D to the 5th substrate 6E is routed by the via 802c formed on the 5th substrate 6E. The via 802c is hidden behind the wiring and cannot be seen, but its position is indicated by a white circle for convenience of explanation.
The S1 wiring 801 and the S2 wiring 802 described above intersect the center of the base 6 and are line-symmetrical with respect to the straight line L (see FIG. 8B) along the long axis of the base 6 in the plan view of the base 6. Have been placed.

[DG wiring]
As shown in FIGS. 8B and 9A, the DG wiring 805 has a DG internal terminal 805a at one end thereof and a DG connection terminal 805b at the other end. The DG wiring 805 is electrically connected to the IC 10 at the DG internal terminal 805a, and is electrically connected to the drive ground terminal 462 at the DG connection terminal 805b. As shown in FIG. 10, the electrical connection between the DG internal terminal 805a and the IC 10 is made by the conductive wire 823. On the other hand, the electrical connection between the DG connection terminal 805b and the drive ground terminal 462 is made via the support substrate 9.

The DG internal terminal 805a is formed on the upper surface of the fourth substrate 6D, and is provided along the outer edge 633 of the base 6 (the outer edge 103 of the IC 10 and the short side 613c of the third recess 613). Further, the DG internal terminal 805a is arranged between the S1 internal terminal 801a and the S2 internal terminal 802a. On the other hand, the DG connection terminal 805b is formed on the upper surface of the fifth substrate 6E and is provided along the outer edge 633 of the base 6 (short side 612c of the second recess 612). Further, the DG connection terminal 805b is arranged between the notches 651 and 652 (between the S1 and S2 connection terminals 801b and 802b).
Such a DG wiring 805 is formed so as to straddle the fourth substrate 6D and the fifth substrate 6E. The wiring from the 4th substrate 6D to the 5th substrate 6E is routed by the via 805c formed on the 5th substrate 6E. The via 805c is hidden behind the wiring and cannot be seen, but its position is indicated by a white circle for convenience of explanation.

[CLK wiring]
As shown in FIGS. 7 and 8, the CLK wiring 806 has a CLK internal terminal 806a at one end thereof and a CLK external terminal 806b at the other end. The CLK wiring 806 is electrically connected to the IC 10 at the CLK internal terminal 806a. As shown in FIG. 10, the electrical connection between the CLK internal terminal 806a and the IC 10 is made by the conductive wire 824.

The CLK internal terminal 806a is formed on the upper surface of the fourth substrate 6D, and is provided along the outer edge 631 of the base 6 (the outer edge 101 of the IC 10 and the long side 613a of the third recess 613). Further, the CLK internal terminal 806a is arranged on the short side 613d side of the long side 613a. On the other hand, the CLK external terminal 806b is the lower surface of the first substrate 6A (the lower surface of the base 6), and is arranged in the vicinity of the notch 640 along the outer edge 631.
Such a CLK wiring 806 is formed so as to straddle the fourth substrate 6D to the first substrate 6A. The wiring from the 4th substrate 6D to the 1st substrate 6A is routed by the CLK side electrode 806c formed in the notch 640, and the CLK is routed through the wiring formed on the upper surface of the 4th substrate 6D. The internal terminal 806a and the CLK side electrode 806c are connected.

[DO wiring]
As shown in FIGS. 7 and 8, the DO wiring 808 has a DO internal terminal 808a at one end thereof and a DO external terminal 808b at the other end. The DO wiring 808 is electrically connected to the IC 10 at the DO internal terminal 808a. As shown in FIG. 10, the electrical connection between the DO internal terminal 808a and the IC 10 is made by the conductive wire 825.

The DO internal terminal 808a is formed on the upper surface of the fourth substrate 6D and is arranged along the outer edge 631 of the base 6 (the outer edge 101 of the IC 10 and the long side 613a of the third recess 613). Further, the DO internal terminal 808a is located on the short side 613d side of the long side 613a and is arranged to the right of the CLK internal terminal 806a. On the other hand, the DO external terminal 808b is the lower surface of the first substrate 6A (the lower surface of the base 6), and is arranged in the vicinity of the notch 641 along the outer edge 631.
Such a DO wiring 808 is formed so as to straddle the fourth substrate 6D to the first substrate 6A. The wiring from the 4th substrate 6D to the 1st substrate 6A is routed by the DO side electrode 808c formed in the notch 641, and the DO is routed through the wiring formed on the upper surface of the 4th substrate 6D. The internal terminal 808a and the DO side electrode 808c are connected.

[VDD1 wiring]
As shown in FIGS. 7 and 8, the VDD1 wiring 810 has a VDD1 internal terminal 810a at one end thereof and a VDD1 external terminal 810b at the other end. The VDD1 wiring 810 is electrically connected to the IC 10 at the VDD1 internal terminal 810a. As shown in FIG. 10, the electrical connection between the VDD1 internal terminal 810a and the IC10 is made by the conductive wire 826.

The VDD1 internal terminal 810a is formed on the upper surface of the fourth substrate 6D and is arranged along the outer edge 631 of the base 6 (the outer edge 101 of the IC 10 and the long side 613a of the third recess 613). Further, the VDD1 internal terminal 810a is located on the short side 613d side of the long side 613a and is arranged to the right of the DO internal terminal 808a. On the other hand, the VDD1 external terminal 810b is the lower surface of the first substrate 6A (the lower surface of the base 6), and is arranged in the vicinity of the notch 642 along the outer edge 631.

Such VDD1 wiring 810 is formed so as to extend from the fourth substrate 6D to the first substrate 6A. The wiring from the 4th substrate 6D to the 1st substrate 6A is routed by the VDD1 side electrode 810c formed in the notch 642, and VDD1 is routed through the wiring formed on the upper surface of the 4th substrate 6D. The internal terminal 810a and the VDD1 side electrode 810c are connected.

[VDD2 wiring]
As shown in FIGS. 7 and 8, the VDD2 wiring 814 has a VDD2 internal terminal 814a at one end thereof and a VDD2 external terminal 814b at the other end. The VDD2 wiring 814 is electrically connected to the IC 10 at the VDD2 internal terminal 814a. As shown in FIG. 10, the electrical connection between the VDD2 internal terminal 814a and the IC10 is made by a conductive wire 827.

The VDD2 internal terminal 814a is formed on the upper surface of the fourth substrate 6D and is arranged along the outer edge 631 of the base 6 (the outer edge 101 of the IC 10 and the long side 613a of the third recess 613). Further, the VDD2 internal terminal 814a is located substantially at the center of the long side 613a and is arranged to the right of the VDD1 internal terminal 810a. On the other hand, the VDD2 external terminal 814b is the lower surface of the first substrate 6A (the lower surface of the base 6), and is arranged in the vicinity of the notch 644 along the outer edge 631.

Such VDD2 wiring 814 is formed so as to extend from the fourth substrate 6D to the first substrate 6A. The wiring from the 4th substrate 6D to the 2nd substrate 6B is routed by the via 814e formed on the 4th substrate 6D and the 3rd substrate 6C, and the routing from the 2nd substrate 6B to the 1st substrate 6A is performed. This is done by the VDD2 side electrode 814c formed in the notch 644. The via 814e is hidden behind the wiring and cannot be seen, but its position is indicated by a white circle for convenience of explanation.

[DRY wiring]
As shown in FIGS. 7 and 8, the DRY wiring 812 has a DRY internal terminal 812a at one end thereof and a DRY external terminal 812b at the other end. The DRY wiring 812 is electrically connected to the IC 10 at the DRY internal terminal 812a. As shown in FIG. 10, the electrical connection between the DRY internal terminal 812a and the IC 10 is made by a conductive wire 828.

The DRY internal terminal 812a is formed on the upper surface of the fourth substrate 6D and is arranged along the outer edge 631 of the base 6 (the outer edge 101 of the IC 10 and the long side 613a of the third recess 613). Further, the DRY internal terminal 812a is arranged on the short side 613c side of the long side 613a and to the right of the VDD2 internal terminal 814a. On the other hand, the DRY external terminal 812b is the lower surface of the first substrate 6A (the lower surface of the base 6), and is arranged in the vicinity of the notch 643 along the outer edge 631.
Such a DRY wiring 812 is formed so as to straddle the fourth substrate 6D to the first substrate 6A. The wiring from the 4th substrate 6D to the 1st substrate 6A is routed by the DRY side electrode 812c formed in the notch 644, and the DRY is routed through the wiring formed on the upper surface of the 4th substrate 6D. The internal terminal 812a and the DRY side electrode 812c are connected.

[DS wiring]
As shown in FIGS. 7 and 8, the DS wiring 804 has a DS internal terminal 804a at one end thereof and a DS connection terminal 804b at the other end. The DS wiring 804 is electrically connected to the IC 10 at the DS internal terminal 804a, and is electrically connected to the drive signal terminal 452 at the DS connection terminal 804b. As shown in FIG. 10, the electrical connection between the DS internal terminal 804a and the IC 10 is made by a conductive wire 829. On the other hand, the electrical connection between the DS connection terminal 804b and the drive signal terminal 452 is made via the support substrate 9.

The DS internal terminal 804a is formed on the upper surface of the fourth substrate 6D and is arranged along the outer edge 632 of the base 6 (the outer edge 102 of the IC 10 and the long side 613b of the third recess 613). Further, the DS internal terminal 804a is arranged on the short side 613d side of the long side 613b. On the other hand, the DS connection terminal 804b is formed on the upper surface of the fifth substrate 6E and is provided along the outer edge 634 of the base 6 (short side 612d of the second recess 612). Further, the DS connection terminal 804b is arranged at the center of the short side 612d.
Such a DS wiring 804 is formed so as to straddle the fourth substrate 6D and the fifth substrate 6E. The wiring from the 4th substrate 6D to the 5th substrate 6E is routed by the via 804c formed on the 5th substrate 6E. The via 804c is hidden behind the wiring and cannot be seen, but its position is indicated by a white circle for convenience of explanation.

[DI wiring]
As shown in FIGS. 7 and 8, the DI wiring 807 has a DI internal terminal 807a at one end thereof and a DI external terminal 807b at the other end. The DI wiring 807 is electrically connected to the IC 10 at the DI internal terminal 807a. As shown in FIG. 10, the electrical connection between the DI internal terminal 807a and the IC 10 is made by the conductive wire 830.

The DI internal terminal 807a is formed on the upper surface of the fourth substrate 6D and is arranged along the outer edge 632 of the base 6 (the outer edge 102 of the IC 10 and the long side 613b of the third recess 613). Further, the DI internal terminal 807a is located on the short side 613d side of the long side 613b and is arranged to the right of the DS internal terminal 804a. On the other hand, the DI external terminal 807b is the lower surface (bottom surface of the base 6) of the first substrate 6A, and is arranged in the vicinity of the notch 645 along the outer edge 632.

Such a DI wiring 807 is formed so as to straddle the fourth substrate 6D to the first substrate 6A. The wiring from the 4th substrate 6D to the 3rd substrate 6C is routed by the via 807e formed on the 4th substrate 6D, and the routing from the 3rd substrate 6C to the 1st substrate 6A is performed in the notch 645. This is done by the formed DI side electrode 807c. The via 807e is hidden behind the wiring and cannot be seen, but its position is indicated by a white circle for convenience of explanation.

[CS wiring]
As shown in FIGS. 7 and 8, the CS wiring 809 has a CS internal terminal 809a at one end thereof and a CS external terminal 809b at the other end. The CS wiring 809 is electrically connected to the IC 10 at the CS internal terminal 809a. As shown in FIG. 10, the electrical connection between the CS internal terminal 809a and the IC 10 is made by the conductive wire 831.

The CS internal terminal 809a is formed on the upper surface of the fourth substrate 6D and is arranged along the outer edge 632 of the base 6 (the outer edge 102 of the IC chip 10 and the long side 613b of the third recess 613). Further, the CS internal terminal 809a is located on the short side 613d side of the long side 613b and is arranged to the right of the DI internal terminal 807a. On the other hand, the CS external terminal 809b is the lower surface (bottom surface of the base 6) of the first substrate 6A, and is arranged in the vicinity of the notch 646 along the outer edge 632.

As described above, since the CS internal terminal 809a is formed on the fourth substrate 6D and the CS external terminal 809b is formed on the first substrate 6A, the CS wiring 809 straddles the fourth substrate 6D to the first substrate 6A. It is formed. The wiring from the 4th substrate 6D to the 1st substrate 6A is routed by the CS side electrode 809c formed in the notch 646, and the CS is routed through the wiring formed on the upper surface of the 4th substrate 6D. The internal terminal 809a and the CS side electrode 809c are connected.

[TEST1 wiring]
As shown in FIGS. 7 and 8, the TEST1 wiring 811 has a TEST1 internal terminal 811a at one end thereof and a TEST1 external terminal 811b at the other end. The TEST1 wiring 811 is electrically connected to the IC 10 at the TEST1 internal terminal 811a. As shown in FIG. 10, the electrical connection between the TEST1 internal terminal 811a and the IC10 is made by the conductive wire 832.

The TEST1 internal terminal 811a is formed on the upper surface of the fourth substrate 6D, and is provided along the outer edge 632 of the base 6 (the outer edge 102 of the IC 10 and the long side 613b of the third recess 613). Further, the TEST1 internal terminal 811a is located substantially at the center of the long side 613b and is arranged to the right of the CS internal terminal 809a. On the other hand, the TEST1 external terminal 811b is the lower surface of the first substrate 6A (the bottom surface of the base 6), and is arranged in the vicinity of the notch 647 along the outer edge 632.

Such TEST1 wiring 811 is formed so as to extend from the fourth substrate 6D to the first substrate 6A. The wiring from the 4th substrate 6D to the 1st substrate 6A is routed by the TEST1 side electrode 811c formed in the notch 647, and TEST1 is routed through the wiring formed on the upper surface of the 4th substrate 6D. The internal terminal 811a and the TEST1 side electrode 811c are connected.

[TEST2 wiring]
As shown in FIGS. 7 and 8, the TEST2 wiring 813 has a TEST2 internal terminal 813a at one end thereof and a TEST2 external terminal 813b at the other end. The TEST2 wiring 813 is electrically connected to the IC 10 at the TEST2 internal terminal 813a. As shown in FIG. 10, the electrical connection between the TEST2 internal terminal 813a and the IC10 is made by a conductive wire 833.

The TEST2 internal terminal 813a is formed on the upper surface of the fourth substrate 6D and is arranged along the outer edge 632 of the base 6 (the outer edge 102 of the IC 10 and the long side 613b of the third recess 613). Further, the TEST2 internal terminal 813a is located on the short side 613c side of the long side 613b and is arranged to the right of the TEST1 internal terminal 811a. On the other hand, the TEST2 external terminal 813b is the lower surface of the first substrate 6A (the bottom surface of the base 6), and is arranged in the vicinity of the notch 648 along the outer edge 632.

Such a TEST2 wiring 813 is formed so as to extend from the fourth substrate 6D to the first substrate 6A. The wiring from the 4th substrate 6D to the 1st substrate 6A is routed by the TEST2 side electrode 813c formed in the notch 648, and TEST2 is routed through the wiring formed on the upper surface of the 4th substrate 6D. The internal terminal 813a and the TEST2 side electrode 813c are connected.

[GND wiring]
As shown in FIGS. 7, 8 and 9, the GND wiring 803 is formed across all the substrates 6A to 6F. The GND wiring 803 is widely arranged on the substrates 6A to 6F within a range that does not hinder the routing of the other wirings 801, 802, and 804 to 814. Specifically, the GND wiring 803 surrounds most of the area on the second substrate 6B, and surrounds the circumference of the third recess 613 on the third and fourth substrates 6C and 6D, and the second recess on the fifth substrate 6E. It is provided in a "U" shape so as to surround the periphery of the 612, and in an annular shape surrounding the periphery of the first recess 611 in the sixth substrate 6F.
The GND wiring 803 arranged on the 6th substrate 6F also functions as a metallize layer 803'used for joining with the lid 7.

The GND wiring 803 has GND internal terminals 803a'and 803a ", GND connection terminals 803b' and 803b", and GND external terminal 803c. Then, the GND wiring 803 is electrically connected to the IC 10 at at least one of the GND internal terminals 803a'and 803a "(in this embodiment, the GND internal terminal 803a"), and is first at the GND connection terminals 803b'and 803b ". , The second detection ground terminals 422 and 442 are electrically connected. As shown in FIG. 10, the electrical connection between the GND internal terminal 803a "and the IC 10 is made by a conductive wire 835. On the other hand, the electrical connection between the GND connection terminals 803b'and 803b "and the first and second detection ground terminals 422 and 442 is made via the support substrate 9.

The GND internal terminal 803a'is formed on the upper surface of the fourth substrate 6D, and is arranged between the DRY internal terminal 812a and the S1 internal terminal 801a. On the other hand, the GND internal terminal 803a "is formed on the upper surface of the fourth substrate 6D and is arranged between the TEST2 internal terminal 813a and the S2 internal terminal 802a. The GND internal terminals 803a', 803a" are arranged in this way. By doing so, the GND internal terminals 803a'and 803a "set the S1 and S2 internal terminals 801a and 802a and the internal terminals 803a, 804a and 806a to 814a separated from each other.

Further, the GND connection terminals 803b'and 803b "are formed on the upper surface of the fifth substrate 6E, respectively, and are provided along the outer edge 634 of the base 6 (short side 612d of the second recess 612). The connection terminal 803b'is arranged on the outer edge 631 side, and the GND connection terminal 803b'is arranged on the outer edge 632 side. That is, the GND connection terminals 803b'and 803b "are arranged so as to sandwich the DS connection terminal 804b in between. These GND connection terminals 803b' and 803b" are formed on the upper surface of the fifth substrate 6E and are second. It is electrically connected by a GND wiring 803 arranged so as to wrap around the outside of the three sides 612a, 612c, and 612b of the recess 612.

Further, the GND external terminal 803c is the lower surface of the first substrate 6A (the lower surface of the base 6), and is arranged in the vicinity of the notch 649 along the outer edge 632.
Further, the GND wiring 803 on the substrates 6A to 6F is electrically connected via the GND side electrode 803d formed in the notch 649 and the via 803e formed in the third substrate 6C to the sixth substrate 6F. It is connected. Specifically, the wiring from the 6th substrate 6F to the 5th substrate 6E is routed by a plurality of vias 803e formed on the 6th substrate 6F, and the wiring from the 5th substrate 6E to the 4th substrate 6D is performed. The routing is performed by the via 803e formed on the fifth substrate 6E, and the routing of the wiring from the fourth substrate 6D to the third substrate 6C is performed by the via 803e formed on the fourth substrate 6D, and the routing is performed by the via 803e formed on the fourth substrate 6D. The routing of the wiring from the 6C to the second substrate 6B and the routing of the wiring from the second substrate 6B to the first substrate 6A are performed by the GND side electrode 803d formed in the notch 659, respectively. The via 803e is hidden behind the wiring and cannot be seen, but its position is indicated by a white circle for convenience of explanation.

-Lid 7-
As shown in FIGS. 1 and 2, the lid 7 has a plate shape and a substantially rectangular shape with rounded corners. Such a lid 7 is joined to, for example, a metallized layer 803'(GND wiring 803) provided on the upper surface of the base 6 via a metal brazing material (not shown) arranged on the lower surface thereof.

The constituent material of the lid 7 is not particularly limited, but a member having a linear expansion coefficient similar to that of the constituent material of the base 6 is preferable. For example, when the constituent material of the base 6 is the above-mentioned ceramics, it is preferable to use an alloy such as Kovar. Further, by using an alloy such as Kovar as the constituent material of the lid 7, the lid 7 can be electrically connected to the GND wiring 803. Therefore, the lid 7 can function as a shield portion that blocks noise from the outside of the package 5.

≪Support board≫
The support substrate 9 is a conventionally known substrate for mounting a TAB (Tape Automated Bonding).
As shown in FIGS. 1 and 11, the support substrate 9 includes a frame-shaped base 91 and six bonding leads (wiring) 92, 93, 94, 95, 96, 97 provided on the base 91. Have.
The base 91 is made of a flexible resin such as polyimide. Further, the base portion 91 has a substantially rectangular outer shape, and is arranged in the first recess 611 so that its long axis coincides with the long axis of the package 5.

Each of the six bonding leads 92 to 97 is fixed to the lower surface of the base 91 by an adhesive (not shown). Further, the bonding leads 92, 93, 94 are arranged on the left side (one side in the major axis direction) of the base 91 in the drawing, and the tip thereof extends into the opening 911 of the base 91. On the other hand, the bonding leads 95, 96, 97 are arranged on the right side (the other side in the major axis direction) of the base 91 in the drawing, and the tip thereof extends into the opening 911 of the base 91.
The tips of the bonding leads 92, 93, 94 and the tips of the bonding leads 95, 96, 97 face each other at the center of the opening 911.

Further, each of the bonding leads 92 to 97 is inclined in the middle, and the tip portion thereof is located above the base portion 91. Further, the width of the bonding leads 92 to 97 is narrowed in the middle, and the tip end portion is narrower than the base end portion. Further, the tips of the bonding leads 92 to 96 include a first detection signal terminal 412, a first detection ground terminal 422, a second detection signal terminal 432, a second detection ground terminal 442, and a drive signal terminal 452, which are included in the gyro element 2. It is arranged (overlapping) corresponding to the drive ground terminal 462.

Further, the base ends of the bonding leads 92 and 95 are connection terminals 921 and 951, and the bonding leads 92 and 95 extend straight from the connection terminals 921 and 951. On the other hand, the base ends of the bonding leads 93, 94, 96, 97 are connection terminals 931, 941, 961, 971, and the bonding leads 93, 94, 96, 97 are connection terminals 931, 941, 961, It extends from 971 while bending at a right angle to the bonding leads 92 and 95 sides. The connection terminals 921 to 971 are arranged so as to overlap the S1 connection terminal 801b, the S2 connection terminal 802b, the GND connection terminal 803b', 803b ", the DS connection terminal 804b, and the DG connection terminal 805b provided on the base 6. Has been done.

The support substrate 9 having the above configuration is joined to the base 6 and the gyro element 2 via a conductive adhesive. Specifically, as shown in FIG. 12, the support substrate 9 and the base 6 are joined via six conductive adhesives 511 to 516. The conductive adhesive 511 is provided in contact with the connection terminal 931 and the S1 connection terminal 801b, and electrically connects them. Further, the conductive adhesive material 512 is provided in contact with the connection terminal 921 and the DG connection terminal 805b, and electrically connects them. Further, the conductive adhesive material 513 is provided in contact with the connection terminal 941 and the S2 connection terminal 802b, and electrically connects them. Further, the conductive adhesive material 514 is provided in contact with the connection terminal 961 and the GND connection terminal 803b', and electrically connects them. Further, the conductive adhesive material 515 is provided in contact with the connection terminal 951 and the DS connection terminal 804b, and electrically connects them. Further, the conductive adhesive 516 is provided in contact with the connection terminal 971 and the GND connection terminal 803b ”and electrically connects them. Thereby, the support substrate 9 is fixed to the base 6 as well. , Electrically connected.

Further, as shown in FIG. 13, the support substrate 9 and the gyro element 2 are joined via six conductive adhesives 521 to 526. The conductive adhesive material 521 is provided in contact with the tip end portion of the bonding lead 93 and the first detection signal terminal 412, and electrically connects them. Further, the conductive adhesive material 522 is provided in contact with the tip end portion of the bonding lead 92 and the drive ground terminal 462, and electrically connects them. Further, the conductive adhesive material 523 is provided in contact with the tip end portion of the bonding lead 94 and the second detection signal terminal 432, and these are electrically connected. Further, the conductive adhesive 524 is provided in contact with the tip of the bonding lead 96 and the first detection ground terminal 422, and electrically connects them. Further, the conductive adhesive material 525 is provided in contact with the tip end portion of the bonding lead 95 and the drive signal terminal 452, and these are electrically connected. Further, the conductive adhesive material 526 is provided in contact with the tip end portion of the bonding lead 97 and the second detection ground terminal 442, and electrically connects them. As a result, the gyro element 2 is fixed to the support substrate 9 and electrically connected.

The conductive adhesives 511-516 and 521-526 are not particularly limited as long as they have conductivity and adhesiveness, and are, for example, silicone-based, epoxy-based, acrylic-based, polyimide-based, bismaleimide-based, and the like. An adhesive material in which a conductive filler such as silver particles is dispersed can be used. Instead of the conductive adhesive, the support substrate 9 and the base 6 and the support substrate 9 and the gyro element 2 may be joined by using gold bumps, solder, or the like.
The configuration of the physical quantity sensor 1 has been described in detail above. The physical quantity sensor 1 having such a configuration can mainly exert the following effects.

(First effect)
First, in the physical quantity sensor 1, the internal terminals (internal terminals 803a, 804a, 806a) of the plurality of first wirings (wiring 803, 804, 806, 807, 808, 809, 810, 811, 812, 813, 814) are used. , 807a, 808a, 809a, 810a, 811a, 812a, 813a, 814a) are arranged side by side along the first axis J1 along the major axis direction of the base 6, and a plurality of second wirings (wiring) are arranged side by side. The internal terminals (internal terminals 801a, 802a, 805a) of 801, 802, 805) intersect the first axis J1 and are arranged side by side along the second axis J2 along the minor axis direction of the base 6. There is. Further, the plurality of first wirings include digital signal wirings (CLK wiring 806, DI wiring 807, DO wiring 808 and CS wiring 809), and these internal terminals 806a, 807a, 808a, 809a are used. It is arranged on the side opposite to the second axis J2 with respect to the center line Jc in the direction of the first axis J1 at the internal terminals of the plurality of first wirings. Here, the digital signal transmitted by the digital signal wiring is particularly liable to become the above-mentioned noise source. Therefore, in the physical quantity sensor 1, the above arrangement causes the S1 and S2 wirings 801 and 802 to be largely separated from the digital signal wiring, thereby causing noise interference from the digital signal wiring to the S1 and S2 wirings 801 and 802. It is effectively reduced. Therefore, according to the physical quantity sensor 1, noise interference to the S1 and S2 wirings 801 and 802 is reduced, and the angular velocity ω can be detected with high accuracy.

(Second effect)
Secondly, as described above, in the physical quantity sensor 1, the side electrodes (803d, 806c) of the first wiring are attached to the side surfaces 631'and 632' corresponding to the outer edges (first outer edges) 631 and 632 of the base 6. , 807c, 807c, 808c, 809c, 810c, 811c, 812c, 813c, 814c) are arranged. As a result, the S1 and S2 wirings 801 and 802 can be separated from each side electrode. Therefore, noise interference from the first wiring to the S1, S2 wirings 801 and 802 is reduced, and the angular velocity ω can be detected with high accuracy. In particular, in the present embodiment, the side electrodes 806c, 807c, 808c, and 809c of the digital signal wiring are arranged on the opposite sides of the S1 and S2 internal terminals 801a and 802a, so that the side electrodes 806c, 807c, 808c, and 809c , S1 and S2 wirings 801 and 802 are further separated from each other. Therefore, the above effect becomes more remarkable, and the physical quantity sensor 1 can detect the angular velocity ω with higher accuracy.

(Third effect)
Third, as described above, in the physical quantity sensor 1, the bottom surface of the base has a CLK external terminal 806b, a DO external terminal 808b, and a VDD1 external terminal 810b along the outer edges (first outer edge) 631 and 632. , VDD2 external terminal 814b, DRY external terminal 812b, DI external terminal 807b, CS external terminal 809b, TEST1 external terminal 811b, and TEST2 external terminal 813b are arranged. By arranging the external terminals in this way, the S1, S2 wirings 801 and 802 and the external terminals 806b to 814b can be separated as much as possible while maintaining the package size. Therefore, noise interference from other wirings (particularly side electrodes) to the S1 and S2 wirings 801 and 802 is reduced, and the angular velocity ω can be detected with high accuracy.

In particular, in the present embodiment, the external terminals 806b, 807b, 808b, 809b of the CLK wiring 806, DI wiring 807, DO wiring 808, and CS wiring 809 for transmitting digital signals are the outer edges 631 and 632, and the S1, S2 internal terminals 801a. , 802a is arranged on the opposite side, so that these external terminals 806b, 807b, 808b, 809b and the S1, S2 wirings 801 and 802 are further separated from each other. Therefore, the above effect becomes more remarkable, and the physical quantity sensor 1 can detect the angular velocity ω with higher accuracy.

(Fourth effect)
Fourth, as described above, in the physical quantity sensor 1, the GND wiring 803 (GND internal terminal) is provided between the S1 wiring 801 and the CLK wiring 806, the DO wiring 808, the VDD1 wiring 810, the VDD2 wiring 814, and the DRY wiring 812. 803a') is arranged, and similarly, GND wiring 803 (GND internal terminal 803a ") is arranged between S2 wiring 802 and DS wiring 804, DI wiring 807, CS wiring 809, TEST1 wiring 811 and TEST2 wiring 813. Therefore, the GND wiring 803 functions as a shield layer for blocking noise, and the noise S1 and S2 wiring 801 from the CLK wiring 806, the DO wiring 808, the VDD1 wiring 810, the VDD2 wiring 814, and the DRY wiring 812 function as a shield layer. , 802, and noise from DS wiring 804, DI wiring 807, CS wiring 809, TEST1 wiring 811 and TEST2 wiring 813 are reduced in S1, S2 wirings 801 and 802, respectively. Therefore, noise interference from other wiring to the S1 and S2 wirings 801 and 802 is reduced, and the angular velocity ω can be detected with high accuracy.
In particular, by arranging the GND wiring 803 between the CLK wiring 806, the DI wiring 807, the DO wiring 808, the CS wiring 809 and the S1, S2 wirings 801 and 802 as in the present embodiment, the reason described above For the same reason as above, the above effect becomes more remarkable, and the angular velocity ω can be detected with higher accuracy.

In this embodiment, GND wiring is provided between the S1 wiring 801 and the wiring 806, 808, 810, 814, 812, and between the S2 wiring 802 and the wiring 804, 807, 809, 811, 813, respectively. Although 803 is arranged, the same effect can be obtained by arranging a fixed potential wiring having a fixed potential instead of the 803. As the fixed potential wiring, for example, power supply wiring can be used.

(Fifth effect)
Fifth, the extending directions of the conductive wires 824, 825, 830, 831 connected to the CLK internal terminal 806a, the DO internal terminal 808a, the DI internal terminal 807a, and the CS internal terminal 809a as digital signal wiring, and the detection signal. The extending directions of the conductive wires 821 and 822 connected to the internal terminals 801a and 802a of S1 and S2 as the internal terminals of the wiring are orthogonal to each other. More specifically, when a digital signal flows through the conductive wires 824, 825, 830, and 831, a magnetic field is generated concentrically around the axis of the conductive wire.

Here, other conductive wires (hereinafter, referred to as parallel conductive wires) parallel to the conductive wires 824, 825, 830, and 831 in a plan view will be described. The parallel conductive wire is a substantially straight line in a plan view, but is not a perfect straight line in a cross-sectional view and forms a part of a closed loop. Since the vector of the above-mentioned magnetic field generated around the parallel conductive wire has a component orthogonal to the plane of the closed loop, an induced current flows through the parallel conductive wire. As a result, an electrical noise signal is superimposed on the parallel conductive wire.

Next, the conductive wires 821 and 822 that are orthogonal to the conductive wires 824, 825, 830, and 831 in a plan view will be described. The conductive wires 821 and 822 are substantially straight lines in a plan view, but are not a perfect straight line in a cross-sectional view and form a part of a closed loop. However, since the vector of the above-mentioned magnetic field generated around the conductive wires 821 and 822 is substantially parallel to the surface of the closed loop, the induced current flowing through the conductive wires 821 and 822 can be suppressed. As a result, the noise signal generated in the conductive wires 821 and 822 can be suppressed by the digital signal flowing through the conductive wires 824, 825, 830 and 831.
Although the extension directions of the conductive wires 824, 825, 830, and 831 and the extension directions of the conductive wires 821 and 822 are orthogonal to each other, the conductive wires are conductive even when they intersect. It is possible to suppress the superimposition of an electrical noise signal on the wires 821 and 822.

Further, as described above, in the physical quantity sensor 1, the CLK internal terminal 806a, the DO internal terminal 808a, the VDD1 internal terminal 810, the VDD2 internal terminal 814a, the DRY internal terminal 812a, the DS internal terminal 804a, the DI internal terminal 807a, and the CS internal terminal. 809a, TEST1 internal terminals 811a and TEST2 internal terminals 813a, and IC10 are connected by conductive wires 824 to 835, and S1, S2 internal terminals 801a, 802a and IC10 are connected by conductive wires 821, 822. ing. In the physical quantity sensor 1, the extending directions of the conductive wires 824 to 835 and the extending directions of the conductive wires 821 and 822 intersect in a plan view of the base 6. Specifically, the conductive wires 824 to 835 extend in the minor axis direction of the base 6, whereas the conductive wires 821 and 822 extend in the major axis direction of the base 6. .. That is, the extending directions of the conductive wires 824 to 835 and the extending directions of the conductive wires 821 and 822 are orthogonal to each other. With such an arrangement, the conductive wires 821 and 822 and the conductive wires 824 to 835 can be separated as much as possible while maintaining the package size. Therefore, noise interference from other wirings to the S1 and S2 wirings 801 and 802 is reduced, and the angular velocity ω can be detected with high accuracy.

(Sixth effect)
Sixth, as described above, in the physical quantity sensor 1, the third substrate 6C and the fifth substrate 6E are arranged so as to sandwich the fourth substrate 6D on which the internal terminals 801a to 814a are formed. GND wiring 803 is provided on each of the third and fifth substrates 6C and 6E. As a result, the wirings 801 and 802, 804 to 814 arranged on the fourth substrate 6D are sandwiched by the GND wiring 803. As described above, the GND wiring 803 functions as a shield layer for reducing the mixing of noise into the S1, S2 wirings 801 and 802. Therefore, with such a configuration, noise interference from other wiring to the S1 and S2 wirings 801 and 802 is reduced, and the angular velocity ω can be detected with high accuracy.

(7th effect)
Seventh, in the physical quantity sensor 1, the bonding lead 93 is arranged so as to overlap the S1 wiring 801 (S1 internal terminal 801a). By arranging the bonding leads 93 that are electrically connected to the S1 wiring 801 in close proximity to the S1 wiring 801 in this way, other bonding leads that are not electrically connected to the S1 wiring 801 are relatively arranged. 92 and 94 can be separated from the S1 wiring 801. Therefore, noise interference from the bonding leads 92 and 94 to the S1 wiring 801 can be reduced.

Similarly, the bonding lead 94 is arranged so as to overlap the S2 wiring 802 (S2 internal terminal 802a). By arranging the bonding lead 94 electrically connected to the S2 wiring 802 in close proximity to the S2 wiring 802 in this way, other bonding leads that are not electrically connected to the S2 wiring 802 are relatively arranged. 92 and 93 can be separated from the S2 wiring 802. Therefore, noise interference from the bonding leads 92 and 92 to the S2 wiring 802 can be reduced.
The effects that the physical quantity sensor 1 can exert have been described above.

The simulation results for supporting the above effects are shown in Table 1 of the writing. “The present embodiment” in Table 1 corresponds to the physical quantity sensor of the present embodiment, and is between the wirings when the S1 internal terminal 801a and the S2 internal terminal 802a are arranged along the short side 613c of the fourth substrate 6D. It shows the size of the capacitive coupling. On the other hand, "conventional" in Table 1 corresponds to the conventional physical quantity sensor. For example, the S1 internal terminal 801a is arranged along the outer edge 631 (long side 613a) of the fourth substrate 6D, and the S2 internal terminal 802a is arranged along the outer edge. It shows the size of the capacitive coupling between each wiring when arranged along 632 (long side 613b).

As can be seen from Table 1, the physical quantity sensor of the present embodiment has a smaller capacitive coupling between the S1, S2 wirings 801 and 802 and the other wirings. In particular, the capacitive coupling between the CS wiring, the VDD1 wiring, and the VDD2 wiring is remarkably small. Therefore, according to the physical quantity sensor 1, noise interference from other wiring to the S1, S2 wirings 801 and 802 is reduced, and the angular velocity ω can be detected more accurately.

<Second Embodiment>
FIG. 14 is a plan view (top view) of the physical quantity sensor according to the second embodiment of the present invention.
Hereinafter, the physical quantity sensor of the second embodiment will be described mainly on the differences from the above-described embodiment, and the description of the same items will be omitted.
The physical quantity sensor of the second embodiment is the same as the physical quantity sensor of the first embodiment described above, except that the configuration of the gyro element is different and the support substrate is omitted accordingly. In FIG. 14, the same reference numerals are given to the same configurations as those in the above-described embodiment.
As shown in FIG. 14, the physical quantity sensor 1 of the present embodiment has a configuration in which the support substrate 9 is omitted as compared with the first embodiment described above.

≪Gyro element≫
The gyro element 2 of the present embodiment has the first and second support portions 351 and 352 and the first, second, third and fourth beams 361 and 362 as compared with the gyro element 2 of the first embodiment described above. , 363, 364, and so on.
The first and second support portions 351 and 352 are arranged to face each other in the Y-axis direction via the base portion 31. Further, the first and second support portions 351 and 352 are arranged so as to extend in the X-axis direction, respectively. The base portion 31 is supported by the first support portion 351 by the first and third beams 361 and 363, and is supported by the second support portion 352 by the second and fourth beams 362 and 364.

The first beam 361 passes between the first detection arm 321 and the first driving arm 341 to connect the base portion 31 and the first support portion 351. Further, the second beam 362 connects the base portion 31 and the second support portion 352 through between the second detection arm 322 and the second driving arm 342. Further, the third beam 363 connects the base portion 31 and the first support portion 351 through between the first detection arm 321 and the third driving arm 343. Further, the fourth beam 364 connects the base portion 31 and the second support portion 352 through between the second detection arm 322 and the fourth driving arm 344. These beams 361, 362, 363, and 364 are arranged point-symmetrically with respect to the center of gravity G. Further, each of the beams 361, 362, 363, and 364 has a meandering portion (S-shaped portion) extending along the Y-axis direction while reciprocating along the X-axis direction, and has an X-axis direction and a Y-axis direction. Has elasticity. As a result, the impact can be absorbed by each of the beams 361, 362, 363, and 364, and the detection noise caused by the impact can be reduced or suppressed.

In such a gyro element 2, the drive ground terminal 462 is arranged at the center of the first support portion 351 and the first detection signal terminal 412 is arranged at the end in the −X axis direction, and the + X axis direction. The second detection signal terminal 432 is arranged at the end of the. Further, the drive signal terminal 452 is arranged at the center of the second support portion 352, the first detection ground terminal 422 is arranged at the end in the −X axis direction, and the second detection ground terminal 422 is arranged at the end in the + X axis direction. The detection ground terminal 442 is arranged.

In the present embodiment, such a gyro element 2 is bonded to the base 6 by six conductive adhesives 513 to 536. The conductive adhesive 531 is provided in contact with the first detection signal terminal 412 and the S1 connection terminal 801b, and electrically connects them. Further, the conductive adhesive material 532 is provided in contact with the drive ground terminal 462 and the DG connection terminal 805b, and electrically connects them. Further, the conductive adhesive material 533 is provided in contact with the second detection signal terminal 432 and the S2 connection terminal 802b, and electrically connects them. Further, the conductive adhesive material 534 is provided in contact with the first detection ground terminal 422 and the GND connection terminal 803b', and electrically connects them. Further, the conductive adhesive material 535 is provided in contact with the drive signal terminal 452 and the DS connection terminal 804b, and electrically connects them. Further, the conductive adhesive material 556 is provided in contact with the second detection ground terminal 442 and the GND connection terminal 803b "and electrically connects them. Thereby, the gyro element 2 is fixed to the base 6. At the same time, they are electrically connected.

2. Electronic device Next, the electronic device to which the physical quantity sensor 1 is applied will be described in detail with reference to FIGS. 15 to 17.
FIG. 15 is a perspective view showing the configuration of a mobile (or notebook) personal computer to which an electronic device including the physical quantity sensor of the present invention is applied. In this figure, the personal computer 1100 is composed of a main body 1104 having a keyboard 1102 and a display unit 1106 having a display 1108, and the display unit 1106 rotates with respect to the main body 1104 via a hinge structure. It is movably supported. Such a personal computer 1100 has a built-in physical quantity sensor 1 that functions as an angular velocity detecting means.

FIG. 16 is a perspective view showing the configuration of a mobile phone (including PHS) to which an electronic device including the physical quantity sensor of the present invention is applied. In this figure, the mobile phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is arranged between the operation button 1202 and the earpiece 1204. Such a mobile phone 1200 has a built-in physical quantity sensor 1 that functions as an angular velocity detecting means.

FIG. 17 is a perspective view showing a configuration of a digital still camera to which an electronic device including the physical quantity sensor of the present invention is applied. Note that this figure also briefly shows the connection with an external device. Here, while a normal camera sensitizes a silver halide photographic film by the light image of the subject, the digital still camera 1300 photoelectrically converts the light image of the subject by an imaging element such as a CCD (Charge Coupled Device). Generates an imaging signal (image signal).

A display unit is provided on the back surface of the case (body) 1302 of the digital still camera 1300, and the display unit is configured to display based on the image pickup signal by the CCD. The display unit 1310 is a finder that displays the subject as an electronic image. Functions as.
Further, on the front side (back side in the drawing) of the case 1302, a light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided.
When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD imaging signal at that time is transferred and stored in the memory 1308.

Further, in the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. Then, as shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312, and a personal computer 1440 is connected to the input / output terminal 1314 for data communication, respectively, as needed. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 and the personal computer 1440 by a predetermined operation.
Such a digital still camera 1300 has a built-in physical quantity sensor 1 that functions as an angular velocity detecting means.

In addition to the personal computer (mobile personal computer) of FIG. 15, the mobile phone of FIG. 16, and the digital still camera of FIG. 17, the electronic device provided with the physical quantity sensor of the present invention includes, for example, an inkjet ejection device (for example,). Inkjet printer), laptop personal computer, TV, camcorder, video tape recorder, car navigation device, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game equipment, word processor, workstation, TV Telephone, security TV monitor, electronic binoculars, POS terminal, medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish finder, various measuring devices, instruments It can be applied to types (for example, vehicles, aircraft, marine instruments), flight simulators, and the like.

3. Moving body Next, a moving body to which the physical quantity sensor shown in FIG. 1 is applied will be described in detail with reference to FIG.
FIG. 18 is a perspective view showing a configuration of an automobile to which a moving body including the physical quantity sensor of the present invention is applied. The automobile 1500 has a built-in physical quantity sensor 1 that functions as an angular velocity detecting means, and the physical quantity sensor 1 can detect the posture of the vehicle body 1501. The signal from the physical quantity sensor 1 is supplied to the vehicle body attitude control device 1502, and the vehicle body attitude control device 1502 detects the attitude of the vehicle body 1501 based on the signal and controls the hardness of the suspension according to the detection result. It is possible to control the brakes of individual wheels 1503. In addition, such attitude control can be used in biped robots and radio-controlled helicopters. As described above, the physical quantity sensor 1 is incorporated in realizing the attitude control of various moving objects.

Although the package, the electronic component mounting package, the physical quantity sensor, the electronic device, and the mobile body of the present invention have been described above based on the illustrated embodiments, the present invention is not limited to this, and the configurations of each part are the same. It can be replaced with an arbitrary configuration having the function of. Further, any other constituents may be added to the present invention. In addition, the present invention may be a combination of any two or more configurations (features) of each of the above embodiments.

1 …… Physical quantity sensor 2 …… Gyro element 3 …… Vibration piece 31 …… Base 321 …… First detection arm 3211 …… Hammer head 322 …… Second detection arm 3221 …… Hammer head 331 …… First connecting arm 332 ... 2nd connecting arm 341 ... 1st driving arm 3411 ... Hammer head 342 ... 2nd driving arm 3421 ... Hammer head 343 ... 3rd driving arm 3431 ... Hammer head 344 ... 4th driving arm 3441 …… Hammer head 351 …… 1st support 352 …… 2nd support 361 …… 1st beam 362 …… 2nd beam 363 …… 3rd beam 364 …… 4th beam 411 …… 1st detection signal Electrode 412 ... 1st detection signal terminal 421 ... 1st detection ground electrode 422 ... 1st detection ground terminal 431 ... 2nd detection signal electrode 432 ... 2nd detection signal terminal 441 ... 2nd detection ground electrode 442 ...... Second detection ground terminal 451 ...... Drive signal electrode 452 ...... Drive signal terminal 461 ...... Drive ground electrode 462 ...... Drive ground terminal 5 ...... Package 511-516, 521-526, 513-536 ... Conductive Adhesive 6 ... Base 6A ... 1st board 6B ... 2nd board 6C ... 3rd board 6D ... 4th board 6E ... 5th board 6F ... 6th board 61 ... Recessed 611 ... 1 recess 611a, 611b ... long side 611c, 611d ... short side 612 ... second recess 612a, 612b ... long side 612c, 612d ... short side 613 ... third recess 613a, 613b ... long side 613c , 613d …… Short side 62 …… Through hole 62A …… Lower through hole 62B …… Upper through hole 62C …… Step 631, 632 …… Side 640-649 …… Notch 7 …… Lid 8 …… Wiring Group 801 ... S1 wiring 801a ... S1 internal terminal 801b ... S1 connection terminal 801c ... via 802 ... S2 wiring 802a ... S2 internal terminal 802b ... S2 connection terminal 802c ... via 803 ... GND wiring 803' ...... Metallized layer 803a', 803a "... GND internal terminal 803b', 803b" ... GND connection terminal 803c ... GND external terminal 803d ... GND side electrode 803e ... Via 80 4 …… DS wiring 804a …… DS internal terminal 804b …… DS connection terminal 804c …… Via 805 …… DG wiring 805a …… DG internal terminal 805b …… DG connection terminal 805c …… Via 806 …… CLK wiring 806a …… CLK internal terminal 806b ... CLK external terminal 806c ... CLK side electrode 807 ... DI wiring 807a ... DI internal terminal 807b ... DI external terminal 807c ... DI side electrode 808 ... DO wiring 808a ... DO internal terminal 808b ...... DO external terminal 808c ... DO side electrode 809 ... CS wiring 809a ... CS internal terminal 809b ... CS external terminal 809c ... CS side electrode 810 ... VDD1 wiring 810a ... VDD1 internal terminal 810b ... VDD1 external Terminal 810c …… VDD1 side electrode 811 …… TEST1 wiring 811a …… TEST1 internal terminal 811b …… TEST1 external terminal 811c …… TEST1 side electrode 812 …… DRY wiring 812a …… DRY internal terminal 812b …… DRY external terminal 812c …… DRY side electrode 813 …… TEST2 wiring 813a …… TEST2 internal terminal 813b …… TEST2 external terminal 813c …… TEST2 side electrode 814 …… VDD2 wiring 814a …… VDD2 internal terminal 814b …… VDD2 external terminal 814c …… VDD2 side electrode 821 ~ 835 ... Conductive wire 9 ... Support substrate 91 ... Base 911 ... Opening 92 to 97 ... Bonding lead 921 to 971 ... Connection terminal 10 ... IC 101, 102, 103, 104 ... Outer edge 1100 …… Personal computer 1102 …… Keyboard 1104 …… Main unit 1106 …… Display unit 1108 …… Display unit 1200 …… Mobile phone 1202 …… Operation button 1204 …… Earpiece 1206 …… Mouthpiece 1208 …… Display unit 1300 …… Digital still camera 1302 …… Case 1304 …… Light receiving unit 1306 …… Shutter button 1308 …… Memory 1310 …… Display 1312 …… Video signal output terminal 1314 …… Input / output terminal 1430 …… TV monitor 1440 …… Personal Compute Tar 1500 …… Automobile 1501 …… Body 1502 …… Body attitude control device 1503 …… Wheel G …… Center of gravity K …… Conductive adhesive M …… Sealing material S …… Internal space ω …… Angular velocity

Claims (5)

A physical quantity detection element having a detection electrode and
And electronic components,
A package having a base on which the electronic component is arranged and accommodating the electronic component and the physical quantity detecting element, and
With
The package is
The first wiring connected to the electronic component and
The second wiring connected to the electronic component and
A first conductive wire that connects the electronic component and the first wiring,
A second conductive wire that connects the electronic component and the second wiring,
Have,
The first wiring includes a digital signal wiring for transmitting a digital signal.
The second wiring comprises a detection signal wiring electrically connected to the detection electrode,
In a plan view of the base, the extending direction of the first conductive wire connected to the digital signal wiring and the extending direction of the second conductive wire connected to the detection signal wiring are Crossed and
A physical quantity sensor characterized in that the physical quantity detecting element overlaps with the electronic component and the detection electrode does not overlap with the digital signal wiring in a plan view of the base . In a plan view of the base, the extending direction of the first conductive wire connected to the digital signal wiring and the extending direction of the second conductive wire connected to the detection signal wiring. The physical quantity sensor according to claim 1, wherein the and is orthogonal to each other. The physical quantity sensor according to claim 1 or 2, wherein at least one of a ground wiring and a fixed potential wiring having a fixed potential is arranged between the internal terminal of the digital signal wiring and the internal terminal of the detection signal wiring. .. An electronic device comprising the physical quantity sensor according to any one of claims 1 to 3 . A mobile body including the physical quantity sensor according to any one of claims 1 to 3 .

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