JP6732122B2 - Board-to-board working machine - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a working machine for a board that applies molten solder to the leads of lead components inserted in a board.

Conventionally, there is a technique of applying molten solder to the leads of lead components inserted into a board (for example, Patent Document 1). In the soldering apparatus described in Patent Document 1, the molten solder is jetted from the nozzle of the molten solder bath toward the leads inserted into the through holes of the substrate, so that the molten solder is applied to the leads and the lead parts are attached. Solder to the board.

Moreover, this soldering device adjusts the height of the liquid surface of the molten solder bath. The soldering device includes an arm that conveys the substrate to a molten solder bath. The arm is provided with a continuity sensor. When adjusting the height of the liquid surface, the arm moves above the nozzle and descends to a position corresponding to the height of the liquid surface set by the user. The continuity sensor contacts the liquid surface of the molten solder jetted from the nozzle of the molten solder bath and detects that the liquid surface has reached a predetermined height. The soldering device adjusts the height of the liquid surface of the solder bath based on the detection information of the continuity sensor.

International Publication No. 2010/131752

By the way, when the molten solder jetted as described above is soldered by contacting a part of the substrate, so-called point flow soldering, the operation at the time of separating the molten solder from the substrate and the leads is important for the quality of soldering. Become. The quality of soldering referred to here is, for example, the degree of solder rising, the presence or absence of air bubbles in the solder, and the like. In other words, if the operation for separating the molten solder from the substrate or the lead is not appropriate, the quality of soldering will be deteriorated. Therefore, how to separate the molten solder from the substrate and the leads to improve the soldering quality is an issue.

Therefore, an object of the present application is to provide a working machine for a substrate that can improve the quality of soldering by changing the operation when separating the molten solder from the substrate or the lead.

The present application is directed to a substrate holding device for holding a substrate having a penetrating portion and a lead component having a lead inserted in the penetrating portion, in which molten solder is jetted from a jet nozzle to insert the lead into the penetrating portion. And a controller for applying the molten solder to the lead, the controller for applying the molten solder to the lead inserted in the penetrating portion by the injector. And an operation changing unit that changes the operation of the jet nozzle in the coating operation, wherein the operation changing unit includes a moving distance of the jet nozzle, a moving direction of the jet nozzle, and a moving speed of the jet nozzle. , and of the operating conditions of the movement acceleration of the jet nozzle, change at least one operating condition, changes the state of the molten solder to be applied to the lead, a counter substrate working machine, wherein the control device Further, the operation changing unit has control data having a plurality of patterns of data for changing at least one of the operating conditions, and causes the operation changing unit to execute the data of the plurality of patterns according to a preset order. A substrate working machine is disclosed.

According to the working machine for a board of the present application, the operation changing unit changes at least one of the four operating conditions such as the moving distance of the jet nozzle. As a result, the operation of separating the molten solder from the substrate or the lead can be changed, and the soldering quality can be improved.

It is a perspective view showing a component mounting machine of an embodiment. It is a perspective view which shows a component mounting apparatus. It is a perspective view which shows a soldering apparatus. It is a block diagram which shows a control apparatus. It is a schematic diagram showing a state where molten solder is jetted toward a lead inserted in a through hole of a circuit substrate. It is a schematic diagram of a pattern which separates a jet nozzle and a lead in a central part of molten solder, and separates molten solder. It is a schematic diagram which shows the state of the application operation seen from the base material upper surface of a circuit base material. It is a schematic diagram which shows the state of the application operation seen from the base material upper surface of a circuit base material. It is a schematic diagram showing the state after soldering. It is a schematic diagram of a pattern which separates a jet nozzle and a lead in an end part of molten solder, and separates molten solder. It is a schematic diagram at the time of applying molten solder collectively to two leads. FIG. 9 is a schematic diagram showing a state of application work as seen from the top surface of the base material of the circuit base material when the molten solder is applied to the two leads collectively. FIG. 9 is a schematic diagram showing a state of application work as seen from the top surface of the base material of the circuit base material when the molten solder is applied to the two leads collectively. FIG. 7 is a schematic view of a pattern in which the jet nozzles are once separated, then again brought close to each other, and then the molten solder is separated. It is a schematic diagram of a pattern which accelerates when separating a jet nozzle from a circuit substrate, and separates molten solder. It is the schematic of the pattern which moves a jet nozzle stepwise.

Hereinafter, an embodiment in which the board working machine of the present application is embodied as a component mounter will be described in detail with reference to the drawings.

(Component mounter configuration)
FIG. 1 shows a component mounter 10 of this embodiment. The component mounter 10 is a device for executing a component mounting operation on the circuit substrate 12. The component mounter 10 includes an apparatus main body 20, a base material transfer/holding device 22, a component mounting device 24, a mark camera 26, a part camera 28, a component supply device 30, a bulk component supply device 32, and a soldering device 36 (see FIG. 3). , Control device 38 (see FIG. 4). Examples of the circuit substrate 12 include a circuit board and a substrate having a three-dimensional structure. Examples of the circuit board include printed wiring boards and printed circuit boards.

The apparatus main body 20 includes a frame portion 40 and a beam portion 42 mounted on the frame portion 40. The substrate transfer/holding device 22 is disposed in the center of the frame portion 40 in the front-rear direction, and has a transfer device 50 and a clamp device 52. The transfer device 50 is a device that transfers the circuit substrate 12. The clamp device 52 is a device that holds the circuit substrate 12. As a result, the base material carrying/holding device 22 carries the circuit base material 12 and holds the circuit base material 12 at a predetermined work position. In the following description, the transport direction of the circuit substrate 12 shown in FIG. 1 is referred to as the X direction, the horizontal direction perpendicular to the X direction is referred to as the Y direction, and the X direction and the direction perpendicular to the Y direction are Z directions. The description will be made by calling the direction. In this case, the width direction of the component mounter 10 is the X direction. The front-back direction of the component mounter 10 is the Y direction.

The component mounting device 24 is disposed on the beam unit 42 and has two work heads 60 and 62 and a work head moving device 64. As shown in FIG. 2, suction nozzles 66 are provided on the lower end surfaces of the work heads 60 and 62. Each work head 60, 62 sucks and holds a component by a suction nozzle 66. Further, the work head moving device 64 has an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. Then, the X-direction moving device 68 and the Y-direction moving device 70 move the two work heads 60 and 62 integrally to an arbitrary position on the frame portion 40. The work heads 60 and 62 are detachably attached to the sliders 74 and 76. The Z-direction moving device 72 individually moves the sliders 74 and 76 in the vertical direction. That is, the work heads 60 and 62 are individually moved in the vertical direction by the Z-direction moving device 72.

The mark camera 26 is attached to the slider 74 in a state of facing downward, and is moved together with the work head 60 in the X direction, the Y direction, and the Z direction. As a result, the mark camera 26 images an arbitrary position on the frame section 40. As shown in FIG. 1, the parts camera 28 is arranged in a state in which the parts camera 28 faces upward between the base material conveying and holding device 22 on the frame portion 40 and the component supply device 30. As a result, the parts camera 28 images the components sucked and held by the suction nozzles 66 of the work heads 60 and 62.

As shown in FIG. 1, the component supply device 30 is arranged at one end (front side) of the frame portion 40 in the front-rear direction. The component supply device 30 has, for example, a tray-type component supply device 78 and a feeder-type component supply device 80 (see FIG. 4). The tray-type component supply device 78 is a device that supplies components placed on the tray. The feeder-type component supply device 80 is a device that supplies components using a tape feeder or a stick feeder (not shown).

The bulk component supply device 32 is arranged at the other end (rear side) of the frame portion 40 in the front-rear direction. The discrete component supply device 32 is a device that aligns a plurality of components in a scattered state and supplies the components in the aligned state. In other words, it is a device that aligns a plurality of components in arbitrary postures in a predetermined posture and supplies the components in a predetermined posture. Examples of the components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components and power module components. In addition, as the electronic circuit component, there are a component having a lead (a radial component or an axial component), a component having no lead, and the like.

The soldering device 36 is disposed below the transfer device 50, and has a jet device 100 and a jet device moving device 102, as shown in FIG. The jet device 100 includes a solder bath 106, a jet nozzle 108, and a nozzle cover 110. The solder bath 106 has a generally rectangular parallelepiped shape, and the molten solder is stored therein. The jet nozzle 108 is erected on the upper surface of the solder bath 106. Then, the molten solder is pumped up from the solder bath 106 by the operation of a pump (not shown), and the molten solder jets upward from the upper end portion of the jet nozzle 108. The nozzle cover 110 is generally cylindrical and is arranged on the upper surface of the solder bath 106 so as to surround the jet nozzle 108. Then, the molten solder jetted from the upper end portion of the jet nozzle 108 flows between the outer peripheral surface of the jet nozzle 108 and the inner peripheral surface of the nozzle cover 110 and flows back into the solder bath 106.

The jet device moving device 102 includes a slider 112, an X-direction moving device 114, a Y-direction moving device 116, and a Z-direction moving device 118. The slider 112 is generally plate-shaped. The jet device 100 is disposed on the upper surface of the slider 112. Further, the X-direction moving device 114 moves the slider 112 in the carrying direction of the circuit substrate 12 by the carrying device 50, that is, in the X direction. The Y-direction moving device 116 moves the slider 112 in the Y direction. Further, the Z-direction moving device 118 moves the slider 112 in the Z direction, that is, the vertical direction. As a result, the jet device 100 moves to an arbitrary position below the transport device 50 by the operation of the jet device moving device 102.

Further, as shown in FIG. 4, the control device 38 includes a controller 152, a plurality of drive circuits 154, an image processing device 156, and a storage device 157. The plurality of drive circuits 154 include the above-described transfer device 50, clamp device 52, work heads 60 and 62, work head moving device 64, tray type component supply device 78, feeder type component supply device 80, bulk component supply device 32, jet flow. It is connected to the device 100, the jet device moving device 102, and a display operation unit 159 described later. The controller 152 includes a CPU, a ROM, a RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 154. As a result, the controller 152 controls the operations of the base material carrying and holding device 22, the component mounting device 24, and the like. The controller 152 is also connected to the image processing device 156. The image processing device 156 processes image data obtained by the mark camera 26 and the parts camera 28. The controller 152 acquires various information from the image data of the mark camera 26 and the parts camera 28.

The storage device 157 includes, for example, a hard disk and a memory. The controller 152 of the present embodiment reads the control data D1 stored in the storage device 157, and executes the component mounting work on the circuit substrate 12. The control data D1 is set with data such as the type of the circuit board 12 to be produced, the type of parts to be mounted, the mounting position of the parts on the circuit board 12, and the like. Further, the control data D1 of the present embodiment stores a plurality of types of pattern data as the operation pattern of the jet nozzle 108 in the molten solder coating operation described later. The controller 152 changes the operation of the jet nozzle 108 in the coating operation according to the type of pattern.

The component mounter 10 also includes a display operation unit 159, as shown in FIG. The display operation unit 159 is arranged on the rear end surface of the bulk component supply device 32. The display operation unit 159 is, for example, a touch panel, and includes a liquid crystal panel, a light source such as an LED that emits light from the back side of the liquid crystal panel, and a touch sensing film attached to the surface of the liquid crystal panel. The user can select the type of pattern for changing the operation of the jet nozzle 108 by operating the display operation unit 159. The user can, for example, confirm the degree of solder rise of the circuit substrate 12 that has been mounted by the component mounter 10, and change the pattern as necessary. Note that the controller 152 may be configured not to accept selection from the user as to which of the patterns is to be executed, but to accept only whether or not to change the operation (pattern) of the jet nozzle 108. In this case, the controller 152 may change the pattern according to a preset order, for example, when the display operation unit 159 receives an operation to change the pattern being executed. Accordingly, the user can change the operation of the jet nozzle 108 by only giving an instruction to change the pattern.

(Operation of component mounter)
With the configuration described above, the component mounter 10 of the present exemplary embodiment mounts components on the circuit substrate 12 held by the substrate transfer/holding device 22. The component mounter 10 can mount various components on the circuit substrate 12, but in the following description, components having leads (hereinafter, may be abbreviated as “lead components”) A case where the circuit substrate 12 is mounted will be described.

Specifically, first, the transfer device 50 carries the circuit substrate 12 into the component mounter 10 from a device upstream of the production line, for example, under the control of the controller 152. The transfer device 50 transfers the circuit substrate 12 to the work position. The clamp device 52 holds the circuit substrate 12 in this working position.

Next, the mark camera 26 moves under the control of the controller 152 to above the circuit substrate 12 and captures an image of the circuit substrate 12. As a result, information about the holding position of the circuit substrate 12 and the like can be obtained. Further, the component supply device 30 or the bulk component supply device 32 supplies the lead component at a predetermined supply position. Then, one of the work heads 60 and 62 moves above the lead component supply position, and the suction nozzle 66 holds the lead component.

FIG. 5 shows a state in which the lead 144 of the lead component 140 sucked and held by the suction nozzle 66 is inserted into the through hole 148 of the circuit substrate 12. Further, FIG. 5 shows a state in which the molten solder 150 is jetted from the jet nozzle 108 toward the lead 144 inserted in the through hole 148. The lead component 140 has, for example, a component body 142 and two leads 144 extending from a bottom surface 142A of the component body 142. The lead component 140 is suction-held by the suction nozzle 66 on the upper surface 142B of the component body 142 opposite to the bottom surface 142A to which the lead 144 is attached. Note that FIG. 5 is a state in which the lead component 140 is viewed from the side, and illustrates only one of the two leads 144 and the two through holes 148. In the following description, as an example, a case where the molten solder 150 is applied to only one lead 144 will be described. The case of applying the molten solder 150 to the plurality of leads 144 will be described later.

The work heads 60 and 62 move above the parts camera 28 while holding the lead component 140 after the lead component 140 is sucked by the suction nozzle 66 at the supply position. The parts camera 28 images the lead component 140 held by the suction nozzle 66. As a result, information regarding the holding position of the lead component 140 and the like can be obtained.

Next, the work heads 60 and 62 holding the lead component 140 move above the circuit substrate 12. The controller 152 corrects an error in the holding position of the circuit substrate 12 and an error in the holding position of the lead component 140 while the work heads 60 and 62 are moving. Then, as shown in FIG. 5, the leads 144 of the lead component 140 suction-held by the suction nozzle 66 are inserted into the through holes 148 formed in the circuit substrate 12.

The insertion amount of the lead 144 is set in the control data D1 for each type of the lead component 140. Specifically, for example, in the lead component 140 in which the lead 144 is inserted into the through hole 148, the insertion amount becomes large until the bottom surface 142A of the component body 142 contacts the base material upper surface 12A of the circuit substrate 12. Further, in the lead component 140 in which the lead 144 is inserted into the through hole 148, the insertion amount becomes small so that the bottom surface 142A of the component main body 142 and the base material upper surface 12A of the circuit base material 12 are maintained in a separated state. .. In this way, the insertion amount of the lead 144 is set in the control data D1 for each type of the lead component 140.

In the following description, as an example, a case will be described in which the lead 144 is inserted into the through hole 148 so that the bottom surface 142A of the component body 142 and the base material upper surface 12A of the circuit base material 12 are maintained in a separated state. To do. In this case, the lead 144 is inserted into the through hole 148 with the component body 142 of the lead component 140 floating from the circuit substrate 12.

When the above-described working heads 60 and 62 move above the circuit substrate 12 and insert the leads 144 into the through holes 148 of the circuit substrate 12, the jet device 100 moves below the circuit substrate 12 (through hole 148). Have moved to. The jet device 100 is arranged below the circuit substrate 12, jets the molten solder 150 from the jet nozzle 108 toward the substrate lower surface 12B of the circuit substrate 12, and the leads 144 inserted into the through holes 148. The molten solder 150 is applied to. Here, as described above, the controller 152 of the present embodiment operates the jet nozzle 108 in the coating operation according to the data of the pattern selected by the user among the plurality of patterns set in the control data D1. Change the content. An example of each pattern will be described below.

(Pattern separated at the central portion of the molten solder 150)
First, the pattern of separating the molten solder 150 at the center thereof will be described. More specifically, FIG. 6 shows a pattern in which the jet nozzle 108 and the lead 144 are separated from each other in the central portion of the molten solder 150 and the molten solder 150 is separated. In order to make the description easier to understand, an example of a direction (X direction and the like) is shown in FIG. 6 and FIG. 10 to be described later, but this direction is an example and is appropriately changed according to the arrangement of the through holes 148 and the like. To be done.

As shown in FIG. 6, the lead 144 of the lead component 140 sucked and held by the suction nozzle 66 is inserted into the through hole 148 formed in the circuit substrate 12. Further, as shown in step 1 (hereinafter, simply referred to as “S”) 1 of FIG. 6, the jet device 100 located below the through hole 148 faces the circuit substrate 12 along the Z direction. The jet nozzle 108 of the jet device 100 is moved closer to the tip of the lead 144 inserted into the through hole 148. The approaching speed of the jet nozzle 108 along the Z direction at this time, that is, the moving speed for raising the jet device 100 (jet nozzle 108) is set in the pattern data of the control data D1. Instead of the moving speed, or in addition to the moving speed, the moving acceleration of the jet nozzle 108 may be set in the control data D1.

The jet device 100 starts jetting the molten solder 150 from the tip of the jet nozzle 108 when the jet device 100 moves below the circuit substrate 12, for example. Therefore, when the jetting device 100 moves up by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144. The rising movement direction (for example, the Z direction) and the movement distance of the movement in the Z direction are set in the pattern data of the control data D1.

The jet device 100 stops, for example, when it rises to a predetermined height, maintains the height (position in the Z direction), and then stops. At the raised position, the molten solder 150 is jetted from the suction nozzle 66 toward the lead 144, and the molten solder 150 is applied to the tip end portion of the lead 144 and the through hole 148 of the circuit substrate 12.

FIG. 7 schematically shows the state of the coating operation as seen from the base material upper surface 12A of the circuit base material 12. As shown in FIG. 7, in this pattern, when the circuit substrate 12 is viewed in a plan view, the central portion of the molten solder 150 jetted from the jet nozzle 108 (see FIG. 6) is aligned with the position of the lead 144. Has become. Incidentally, the diameter L1 of the jetted molten solder 150 shown in FIG. 7 is, for example, 6 mm to 10 mm. Then, the controller 152 moves the jet nozzle 108 in a direction away from the circuit substrate 12 with the position of the lead 144 aligned with this central portion (see S2 in FIG. 6). For example, the controller 152 lowers the jet nozzle 108 along the Z direction without changing the position in the X direction and the Y direction (S2).

According to this, when the molten solder 150 is separated from the circuit substrate 12 or the lead 144, the central portion of the molten solder 150 jetted from the jet nozzle 108, that is, the apex portion of the molten solder 150 jetted from the jet nozzle 108. Thus, the molten solder 150 can be separated from the leads 144 and the circuit substrate 12.

Here, as shown in FIG. 6, after the molten solder 150 jetted from the tip of the jet nozzle 108 moves upward, the molten solder 150 scatters around (in the X direction and the Y direction) and descends, so that the jet nozzle 108 It flows back between the outer peripheral surface and the inner peripheral surface of the nozzle cover 110 into the solder bath 106 (see FIG. 3 ). Therefore, in the central portion (vertex portion) of the molten solder 150 in the plan view shown in FIG. 7, the molten solder 150 jetted upward from the jet nozzle 108 rises to the highest position in the Z direction. Further, in the central portion, the moving direction of the molten solder 150 shifts from the upper side to the lower side, so that the convection velocity of the molten solder 150 is likely to be slow.

In other words, the molten solder 150 that is scattered around and descends moves in the X direction and the Y direction, and moves in the direction away from the circuit substrate 12 (downward in the Z direction) in accordance with gravitational acceleration or the like. .. Therefore, when the circuit substrate 12 is viewed in a plan view, the molten solder 150 jetted from the jet nozzle 108 is likely to have a faster convection speed as it moves away from the center in the X and Y directions. Then, the velocity of convection is likely to be higher in the end portions in the X direction and the Y direction than in the central portion (the upper end portion in the Z direction).

Further, the central portion is closer to the tip end portion of the jet nozzle 108, that is, the opening of the jet nozzle 108, as compared with the molten solder 150 that is scattered around and descends. For this reason, the temperature of the molten solder 150 is high in the central portion, and there is a high possibility that the temperature will be scattered around the periphery and will decrease as the distance from the center increases. In other words, the temperature of the molten solder 150 scattered around and falling, that is, the temperature of the molten solder 150 at the end portion in the X direction and the Y direction is likely to be low. The controller 152 of the present embodiment can improve the soldering quality by changing the positional relationship between the jet nozzle 108, the molten solder 150, and the leads 144.

The quality of soldering referred to here is, for example, the degree of rise of solder, the presence or absence of bubbles in the molten solder 150 after soldering, and the like. For example, it is whether or not the shape of the molten solder 150 after soldering is a shape that tapers downward from the base material lower surface 12B of the circuit base material 12 (see FIG. 9). Alternatively, it is whether or not the through-hole 148 is sufficiently filled with the molten solder 150. Further, it is whether or not bubbles are generated in the molten solder 150 filled in the through hole 148. The quality of such soldering varies depending on the type of the molten solder 150, the room temperature, the humidity, etc., but also greatly varies depending on the operation when the molten solder 150 is separated from the leads 144 or the circuit substrate 12 in the coating operation. To do. Therefore, the controller 152 of the present embodiment can switch a plurality of patterns and change the operation at the time of separation, thereby improving the quality of soldering.

Further, the time for stopping the jet device 100 at the position where the jet device 100 is raised is set in the data of the pattern of the control data D1. The controller 152 measures, for example, the time from the arrival at the raised position until the jet nozzle 108 is separated from the circuit substrate 12, that is, the time to apply the molten solder 150 to the leads 144, and is set in the pattern data. After a lapse of time, the jet nozzle 108 (jet device 100) starts descending. Therefore, the controller 152 can also improve the quality of soldering by changing the stop time at such a raised position. The controller 152 may immediately lower the jet nozzle 108 without stopping the jet nozzle 108 at the raised position.

In S2 of FIG. 6, the controller 152 continues the jet of the molten solder 150 from the jet nozzle 108 even when the jet device 100 is lowered. As a result, the jetted molten solder 150 and the lead 144 are separated from each other at the above-mentioned central portion, and the application of the molten solder 150 to the lead 144 is completed. The moving speed for lowering the jet device 100 (jet nozzle 108) is set in the pattern data of the control data D1. Further, instead of the moving speed for descending or in addition to the moving speed, the moving acceleration of the jet nozzle 108 may be set in the control data D1.

Further, the controller 152 of the present embodiment maintains the suction holding of the lead component 140 by the suction nozzle 66 even after finishing the application work of the molten solder 150 to the leads 144. The controller 152 releases the holding of the lead component 140 by the suction nozzle 66 after a lapse of a predetermined time. The controller 152 may release the suction holding of the lead component 140 by the suction nozzle 66 after inserting the lead 144 into the through hole 148, that is, before applying the molten solder 150. Alternatively, the controller 152 may change the timing for releasing the suction of the lead component 140, for example, according to the required mounting accuracy of the lead component 140 and the like. Therefore, the controller 152 can also improve the quality of soldering by changing the suction holding state.

Through the above work, as shown in FIG. 9, the lead component 140 is mounted on the circuit substrate 12 in a state where the component body 142 is floated from the circuit substrate 12. The mounted lead component 140 is soldered to the circuit substrate 12. By applying the molten solder 150 to the lead 144 inserted into the through hole 148 and the lead 144 of the circuit substrate 12, the lead 144 and the circuit substrate 12 are electrically connected to each other. A circuit is formed.

(Pattern separated at the end of the molten solder 150)
Next, a pattern for separating the molten solder 150 at the end portion will be described. Note that, in the following description, the description of the same content as the above-described pattern of separating at the central portion will be appropriately omitted. FIG. 10 shows a pattern in which the jet nozzle 108 and the lead 144 are separated at the end portion of the molten solder 150, and the molten solder 150 is separated.

First, as shown in S4 of FIG. 10, the jet device 100 located below the through hole 148 moves upward toward the circuit substrate 12 along the Z direction and is inserted into the through hole 148. The jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144. When the jet device 100 rises by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.

The jet apparatus 100 moves along the X direction while maintaining the height (position in the Z direction) after rising to a predetermined height, for example (S5). FIG. 8 schematically shows the state of the coating operation as viewed from the base material upper surface 12A of the circuit base material 12. As shown in FIG. 8, in this pattern, when the circuit substrate 12 is viewed in plan, first, the central portion of the molten solder 150 jetted from the jet nozzle 108 is aligned with the position of the lead 144. ..

Next, as shown in S5 of FIG. 8, as the jet nozzle 108 moves in the X direction, the position of the molten solder 150 with respect to the lead 144 in the X direction is changed. When the circuit substrate 12 is viewed in a plan view, the end portion of the molten solder 150 jetted from the jet nozzle 108 is the position of the lead 144. Then, the controller 152 moves the jet nozzle 108 in the direction away from the circuit substrate 12 with the position of the lead 144 aligned with this end portion (S6 in FIG. 10). For example, the controller 152 lowers the jet nozzle 108 along the Z direction without changing the position in the X direction and the Y direction (S6).

According to this, when the molten solder 150 is separated from the circuit substrate 12 and the leads 144, the molten solder 150 can be separated from the leads 144 and the like at the end portion of the molten solder 150 jetted from the jet nozzle 108. That is, the molten solder 150 can be separated from the leads 144 and the like at a portion which is jetted from the jet nozzle 108 toward the circuit substrate 12 and then moves (falls) in a direction away from the circuit substrate 12. As described above, the convection speed of the molten solder 150 is high at this end portion, and the temperature of the molten solder 150 is likely to be low. In this way, by changing the separating position and changing the state of the molten solder 150, it is possible to expect an improvement in soldering quality.

In S6, the controller 152 continues the jet of the molten solder 150 from the jet nozzle 108 even when the jet apparatus 100 is lowered. As a result, the molten solder 150 and the lead 144 are separated from each other at the end portion described above, and the application of the molten solder 150 to the lead 144 is completed.

Through the above work, as shown in FIG. 9, the lead component 140 is mounted on the circuit substrate 12 in a state where the component body 142 is floated from the circuit substrate 12. On the other hand, since the operation of the jet nozzle 108 is changed according to the pattern, the quality of soldering is changed. For example, when the user cannot obtain the desired quality with the pattern of pulling apart at the central portion, the user can obtain the desired quality by changing to the pattern of pulling away at the end portion. On the contrary, for example, when the desired quality cannot be obtained with the pattern of pulling away at the end portion, the user can obtain the desired quality by changing to the pattern of pulling away at the central portion.

In addition, as described above, the user can select the type of pattern for changing the operation of the jet nozzle 108 by operating the display operation unit 159. It was verified that this pattern has a high possibility of improving the soldering quality among various patterns that change the operating conditions such as the moving distance, moving direction, moving speed, and moving acceleration of the jet nozzle 108. It is a pattern. In this case, the user can change the operating condition and improve the soldering quality simply by selecting one of a plurality of verified and highly reliable patterns. Moreover, the user does not need to verify the contents of the operating conditions. The above-mentioned pattern is not limited to the pattern verified by the manufacturer or the like, and may be, for example, a pattern with a proven track record of improving the soldering quality in use by the user.

As described above, the soldering device 36 is arranged in the X and Y directions (plane directions) parallel to the plane of the circuit substrate 12 and in the Z direction (orthogonal direction) orthogonal to the plane of the circuit substrate 12. The jet nozzle 108 (jet device 100) is movable. According to this, for example, by limiting the moving direction of the jet nozzle 108 that is the target of changing the operating condition to two directions of the X and Y directions (planar direction) and the Z direction (orthogonal direction), It is possible to simplify the control content for changing the number of items and reduce the processing load of the controller 152 in the coating work.

(When the molten solder 150 is applied to the plurality of leads 144)
Here, in the example of the two patterns described above, the case where the molten solder 150 is applied to only one lead 144 has been described, but the case where the molten solder 150 is applied to a plurality of leads 144 may be similarly performed. it can. FIG. 11 shows a case where the molten solder 150 is applied to the two leads 144 collectively. FIG. 12 schematically shows a state of the coating operation when the molten solder 150 is collectively coated on the two leads 144 and viewed from the substrate upper surface 12A of the circuit substrate 12.

In the examples shown in FIGS. 11 and 12, the width of the jet nozzle 108 in the X direction, that is, the diameter L1 (see FIG. 12) of the molten solder 150 jetted is smaller than the pitch L2 (see FIG. 12) between the two leads 144. Is big enough. In this case, as shown in FIG. 12, the central portion of the molten solder 150 jetted from the jet nozzle 108 is aligned with the positions of the two leads 144 when the circuit substrate 12 is viewed in plan. You can When the molten solder 150 is separated from the two leads 144, the molten solder 150 can be separated from the two leads 144 at the central portion of the molten solder 150 jetted from the jet nozzle 108.

Further, FIG. 13 schematically shows a state of application work when the molten solder 150 is applied to the two leads 144 collectively and viewed from the base material upper surface 12A of the circuit base material 12. In the case shown in FIG. 13, for example, first, in the raised position, the end portion of the molten solder 150 jetted from the jet nozzle 108 is aligned with the positions of the two leads 144. Then, as shown in S8 of FIG. 13, the jet nozzle 108 is configured such that, of the two end portions facing each other in the X direction, one end portion is aligned with the two leads 144, and the other end portion is moved. Is moved along the X direction to a position aligned with the two leads 144.

That is, in the example shown in FIG. 13, unlike the case of FIG. 8, application to the lead 144 is started at the end portion of the molten solder 150, and the molten solder 150 and the lead 144 are separated at the end portion. ing. Even in such an operation pattern, improvement in soldering quality can be expected by changing the state in which the molten solder 150 is separated.

(Pattern that returns after moving in the separating direction)
Next, a pattern in which the jet nozzle 108 is moved in the direction away from the circuit substrate 12 and then again in the direction toward the circuit substrate 12 (lead 144) will be described. Note that, in the following description, description of the same contents as the above-described patterns will be appropriately omitted. FIG. 14 shows a pattern in which the jet nozzles 108 are once separated and then again brought close to each other, and then the molten solder 150 is separated.

First, as shown in S10 of FIG. 14, the jet device 100 located below the through hole 148 moves upward toward the circuit substrate 12 along the Z direction and is inserted into the through hole 148. The jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144. When the jet device 100 rises by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.

Next, the jet device 100 rises to a height close to the tip of the lead 144 and then descends by a predetermined distance (S11). For example, the jet device 100 moves downward along the Z direction by a predetermined distance while fixing the positions in the X direction and the Y direction. For example, when the jet device 100 is lowered by a predetermined distance, the molten solder 150 jetted from the jet nozzle 108 reaches the tip of the lead 144. That is, the molten solder 150 is applied to the leads 144 even at the position where the predetermined distance is set to be short and the distance is lowered in S11.

When the jet device 100 is lowered by a predetermined distance in S11, the molten solder 150 jetted from the jet nozzle 108 does not have to reach the tip of the lead 144. That is, the molten solder 150 and the lead 144 may be separated from each other as S12 descends. In this case, the molten solder 150 once separated is applied again to the same lead 144.

Next, the lowered jet device 100 is raised again toward the circuit substrate 12 (S12). The molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144. The jet device 100 moves upward along the Z direction by a predetermined distance while keeping the positions in the X and Y directions fixed, for example. The predetermined distance in S12 is, for example, the same distance as S11. That is, the jet device 100 rises in S12 by the distance lowered in S11. The jet device 100 may move up in S12 by a moving distance shorter than the moving distance down in S11. In this case, the jet device 100 moved up in S12 is at a lower position than the position raised in S11.

Then, the controller 152 raises the jet device 100 again in S12, and then moves the jet device 100 (jet nozzle 108) in a direction away from the circuit substrate 12 (S13). For example, the controller 152 lowers the jet nozzle 108 along the Z direction without changing the positions in the X direction and the Y direction (S13).

In this pattern, after the jet nozzle 108 is once separated from the circuit substrate 12, the jet nozzle 108 is moved again to the circuit substrate 12 side, so that the molten solder 150 applied before the descent is raised and the through hole is formed. It can be pushed into 148. As a result, it is expected that the degree of rise of the solder will be improved and that the generation of bubbles in the molten solder 150 filled in the through holes 148 will be reduced.

In S13, the controller 152 continues the jet of the molten solder 150 from the jet nozzle 108 even when the jet device 100 is lowered. As a result, the molten solder 150 and the lead 144 are separated from each other at the central portion described above, and the application of the molten solder 150 to the lead 144 is completed.

In the pattern described above, the controller 152 executes the descending operation in S11 and the ascending operation in S12 once, but it may also be executed multiple times. That is, the jet nozzle 108 may be moved up and down a plurality of times. This can be expected to further improve the degree of solder rise. In addition, the controller 152 may control the jet device 100 (soldering device 36) so as to separate the molten solder 150 and the lead 144 at the end portion in the above-described rising pattern. Further, the controller 152 may change the moving speed or the moving acceleration of the jet device 100 (jet nozzle 108) in each of the above S10 to S13 to a different speed or the like.

(Pattern that accelerates when separated)
Next, a pattern for increasing the moving speed and the moving acceleration of the jet nozzle 108 when the molten solder 150 is separated from the leads 144 and the circuit substrate 12 will be described. Note that, in the following description, description of the same contents as the above-described patterns will be appropriately omitted. FIG. 15 shows a pattern in which the jet nozzle 108 is accelerated when it is separated from the circuit substrate 12, and the molten solder 150 is separated from the leads 144 and the like.

First, as shown in S15 of FIG. 15, the jet device 100 located below the through hole 148 moves upward toward the circuit substrate 12 along the Z direction and is inserted into the through hole 148. The jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144. When the jet device 100 rises by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.

The jet device 100 maintains its height (position in the Z direction) after rising to a predetermined height, for example. Next, the jet device 100 starts moving in the direction away from the circuit substrate 12. The jet device 100 descends along the Z direction while keeping its position in the X direction and the Y direction fixed, for example. At this time, the controller 152 slowly lowers the jet nozzle 108 (jet device 100) in the initial stage of the descent (S16). Then, the controller 152 lowers the jet nozzle 108 at a slow speed (S16), and then increases the descending speed of the jet nozzle 108. That is, the controller 152 makes the moving speed in the latter period (S17) faster than the moving speed in the initial stage (S16) during the descent.

According to this, when the jet device 100 descends and the upper end of the molten solder 150 to be jetted and the tip (lower end) of the lead 144 come close to each other, the jet device 100 increases the descending speed. Therefore, when the upper end (apex) of the molten solder 150 and the tip of the lead 144 are separated, they can be separated quickly. As a result, as shown in FIG. 9, the shape of the molten solder 150 applied to the leads 144 is tapered toward the bottom of the base material lower surface 12B, that is, the shape is formed so as to stand in a mountain shape from the base material lower surface 12B. it can. Therefore, improvement in the quality of soldering can be expected.

Then, in S17, the controller 152 continues the jet of the molten solder 150 from the jet nozzle 108 even when the jet device 100 is lowered. As a result, the molten solder 150 and the lead 144 are separated from each other, and the application of the molten solder 150 to the lead 144 is completed.

The controller 152 may change the moving acceleration instead of the moving speed of the jet nozzle 108 or in addition to the moving speed. For example, the controller 152 may make the moving acceleration of S17 faster than the moving acceleration of S16. Further, the controller 152 may slow down the moving speed in S17 as compared with the moving speed in S16. That is, the moving speed in the latter period may be slower than the moving speed in the initial stage of the descent. Thereby, the upper end of the molten solder 150 and the tip of the lead 144 can be slowly separated. As a result, improvement in soldering quality can be expected by changing the operation of the jet nozzle 108. Further, the controller 152 shifts from S16 to S17 and accelerates by one step, but may accelerate by a plurality of steps. Further, the controller 152 may control the jet device 100 so as to separate the molten solder 150 and the lead 144 at the end portion shown in FIG. 10 in the above-described accelerating pattern.

(Pattern that moves in steps)
Next, a pattern in which the jet nozzle 108 is moved stepwise when it is lowered to separate the molten solder 150 from the leads 144 and the circuit substrate 12 will be described. Note that, in the following description, description of the same contents as the above-described patterns will be appropriately omitted. FIG. 16 shows a pattern in which the jet nozzle 108 is moved stepwise.

First, as shown in S19 of FIG. 16, the jet device 100 located below the through hole 148 moves upward toward the circuit substrate 12 along the Z direction and is inserted into the through hole 148. The jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144. When the jet device 100 rises by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.

For example, the jet device 100 moves to a predetermined height and then moves a predetermined distance along the X direction while maintaining the height (position in the Z direction) (S20). Further, the jet device 100 moves in the X direction and then descends along the Z direction by a predetermined distance (S20). The controller 152 causes the jet device 100 to repeatedly perform the movement in the X direction and the movement in the Z direction. As shown in FIG. 16, the jet device 100 separates from the circuit substrate 12 while descending stepwise.

Each one movement in the X direction and the Z direction is executed within a range in which the molten solder 150 and the lead 144 are not separated from each other. As the movement distance once in the X direction, for example, a distance between the center and the end of the molten solder 150 jetted in the plan view shown in FIG. 7, that is, a distance obtained by dividing half (radius) of the diameter L1 is set. it can. As a result, the jet nozzle 108 moves while changing the position where the lead 144 and the molten solder 150 come into contact with each other in a plurality of steps from the center of the molten solder 150 toward the end.

Further, the Z-direction movement distance is, for example, between the position of the upper end where the jet device 100 is raised in S19 and the position where the jet device 100 is lowered until the lead 144 and the molten solder 150 are separated. You can set the distance by dividing the distance. As a result, the jet nozzle 108 moves in a plurality of stages from the position where the lead 144 is coated with the molten solder 150 to the position where the lead 144 and the molten solder 150 are separated from each other.

As shown in S20 of FIG. 16, as the jet nozzle 108 moves in the X direction, the position of the molten solder 150 relative to the lead 144 in the X direction changes. Further, with the movement of the jet nozzle 108 in the Z direction, the position of the upper end of the molten solder 150 moves from the base end side (base material lower surface 12B side) of the lead 144 toward the tip side. Then, the controller 152 separates the molten solder 150 and the lead 144 while moving the jet nozzle 108 (jet device 100) in a stepwise manner.

As described above, the controller 152 moves the jet nozzle 108 in the X direction (plane direction) parallel to the plane of the circuit substrate 12 and the Z direction (orthogonal direction) orthogonal to the plane of the circuit substrate 12. In addition, the jet device 100 is controlled so as to alternately repeat the movement of the jet nozzle 108 in the direction away from the circuit substrate 12 (downward). According to this, when the molten solder 150 is separated from the circuit substrate 12 or the lead 144, the jet nozzle 108 can be moved stepwise in the direction away from the circuit substrate 12. As a result, the quality of soldering can be expected to be improved by changing the operation for separating the lead 144 and the molten solder 150.

As shown in FIG. 4, the controller 152 of the control device 38 has a coating section 160, an operation changing section 162, and a receiving section 164. The coating section 160 is a functional section for performing a coating operation of coating the lead 144 inserted into the through hole 148 with the molten solder 150 by the jet device 100. The operation changing unit 162 is a functional unit for changing the operation of the jet nozzle 108 in the coating operation of the coating unit 160. The accepting unit 164 is a functional unit that accepts which of the patterns of data (control data D1) for changing the operation of the jet nozzle 108 is to be executed by the operation changing unit 162.

Incidentally, in the above-described embodiment, the component mounter 10 is an example of a work machine for a board. The through hole 148 is an example of a through portion. The circuit substrate 12 is an example of a substrate. The base material transport holding device 22 is an example of a substrate holding device. The soldering device 36 is an example of a jet device.

As described above, the present embodiment described above has the following effects.
The controller 152 (application section 160) of the control device 38 causes the lead 144 inserted into the through hole 148 (penetration portion) of the circuit substrate 12 (substrate) to jet the molten solder 150 from the jet nozzle 108 of the jet device 100. Apply. The controller 152 (operation changing unit 162) changes the operation of the jet nozzle 108 in the coating operation by the coating unit 160. The operation changing unit 162 changes at least one of the four operating conditions of the moving distance, moving direction, moving speed, and moving acceleration of the jet nozzle 108. As a result, the operation of separating the molten solder 150 from the circuit substrate 12 and the leads 144 can be changed, and the quality of soldering can be improved.

Note that the present application is not limited to the above-described embodiment, and can be implemented in various modes in which various changes and improvements are made based on the knowledge of those skilled in the art.
For example, in the above-described embodiment, the component mounting apparatus 10 that includes the component mounting device 24 and mounts the lead component 140 on the circuit substrate 12 by the working heads 60 and 62 is used as the board-to-board working machine of the present application. Not exclusively. The work machine for a board of the present application may be configured to apply the molten solder 150 without performing the work of mounting the lead component 140, for example. For example, the work machine for a board may have a configuration in which the circuit substrate 12 to which the lead component 140 has already been mounted is carried in and only soldering is performed. In this case, the board-to-board working machine may not include the component mounting device 24 or the component supply device 30.
Further, in the control data D1, a plurality of patterns of data for changing at least one operating condition among the operating conditions of the moving distance, moving direction, moving speed, and moving acceleration of the jet nozzle 108 are set. However, the control data D1 may be configured to have only one pattern to be changed.

Further, the control data D1 may not have data of a preset pattern. For example, the control device 38 may be configured so that the user can change the control data D1. In this case, the user does not select the pattern but directly changes the control data D1, that is, by changing the length of the moving distance of the jet nozzle 108, the size of the moving speed, or the like, so that the jet nozzle 108 It is possible to change the operation.

Further, the controller 152 moves the jet nozzle 108 in a plane direction (X direction, Y direction) parallel to the plane of the circuit substrate 12 and an orthogonal direction (Z direction) orthogonal to the plane, but the present invention is not limited to this. Absent. For example, the controller 152 may move the jet nozzle 108 in an oblique direction that forms a predetermined angle with respect to the plane of the circuit substrate 12. Also in this case, the operation of pulling the molten solder 150 away from the lead 144 can be changed to improve the quality of soldering.
Further, in the above-described embodiment, the lead component 140 is mounted on the circuit substrate 12 with the component body 142 floating from the circuit substrate 12, but with the component body 142 in contact with the circuit substrate 12. The lead component 140 may be attached to the circuit substrate 12.
Further, in the above embodiment, the through hole 148 is adopted as the through portion of the present application, but the present invention is not limited to this. The penetrating portion may penetrate the circuit substrate 12 in the vertical direction, and may be a notch or the like.

10 component mounting machine (working machine for board), 12 circuit substrate (board), 22 substrate carrying and holding device (board holding device), 36 soldering device (jet device), 38 control device, 108 jet nozzle, 140 lead Parts, 144 leads, 148 through holes (penetrating parts), 150 molten solder, 160 coating parts, 162 operation changing parts, 164 receiving parts.

Claims (8)

A substrate holding device for holding a substrate having a penetrating portion,
A jet device that jets molten solder from a jet nozzle to a lead component having a lead inserted in the penetrating portion, and applies the molten solder to the lead inserted in the penetrating portion,
And a control device,
The control device is
An application unit that performs an application operation of applying the molten solder by the jet device to the lead inserted in the penetrating portion,
An operation changing unit for changing the operation of the jet nozzle in the coating operation,
Have
The operation changing unit changes at least one of operating conditions of a moving distance of the jet nozzle, a moving direction of the jet nozzle, a moving speed of the jet nozzle, and a moving acceleration of the jet nozzle, A working machine for a substrate, which changes the state of the molten solder applied to the leads ,
The control device further comprises
Among the operating conditions, there is control data having a plurality of patterns of data for changing at least one operating condition, and the operation changing unit is made to execute the data of the plurality of patterns according to a preset order. Machine . The control device is
Having a reception unit that receives an instruction as to whether or not to change the pattern to be executed, when receiving the change instruction at the reception unit, a plurality of data of the patterns is sent to the operation change unit according to a preset order. The anti-board working machine according to claim 1 , which is executed . 3. The pair according to claim 1, wherein the jet device is configured to move the jet nozzle in a plane direction parallel to the plane of the substrate and an orthogonal direction orthogonal to the plane of the substrate. Substrate working machine. In at least one of the plurality of the patterns, the operation changing portion may be configured such that, when the substrate is viewed in a plan view, the central portion of the molten solder jetted from the jet nozzle is aligned with the position of the lead. The working machine for a board according to any one of claims 1 to 3, wherein the operating condition is changed so as to move the nozzle in a direction away from the substrate. In at least one of the plurality of the patterns, the operation changing unit is configured such that the end portion of the molten solder jetted from the jet nozzle is aligned with the position of the lead when the substrate is viewed in plan. The work machine for a substrate according to any one of claims 1 to 3, wherein the operating condition is changed so as to move the jet nozzle in a direction of separating from the substrate. In at least one of the plurality of patterns, the operation changing unit moves the jet nozzle in a direction of separating from the substrate and then moves the jet nozzle in a direction of approaching the substrate again. The working machine for a board according to any one of claims 1 to 5 which changes conditions. In at least one of the plurality of patterns, the operation changing unit separates the jet nozzle from the substrate and separates the lead and the molten solder from which the jet is jetted, and the movement speed and the movement acceleration of the jet nozzle. The work machine for a substrate according to claim 1, wherein at least one of them is made faster. In at least one of the plurality of patterns, the operation changing unit is configured to move the jet nozzle in a plane direction parallel to the plane of the substrate, and to move the jet nozzle in an orthogonal direction orthogonal to the plane of the substrate and from the substrate. The working machine for a substrate according to any one of claims 1 to 5, wherein the operating condition is changed so as to alternately repeat the movement of the jet nozzle in the direction of separation.

Images