JP6724335B2 - Molding method and molding apparatus for resin molded product using thermosetting resin - Google Patents

Description

The present invention relates to a molding method and a molding device for a resin molded product using a thermosetting resin.

2. Description of the Related Art In recent years, in the production of resin molded products, resin molding using a thermosetting resin having a higher strength after curing than a thermoplastic resin has been performed. In particular, RTM (Resin Transfer Molding) molding, which is capable of forming a very strong and lightweight product by impregnating a reinforced substrate with a thermosetting resin and curing it, has become popular. There is.

In the method described above, a pressing machine is used to apply a mold clamping pressure that is higher than the pressure generated in the mold from the time the mold is closed until the resin molded product is formed and the mold is opened. It is common to continue. When the peak value of the pressure generated in the molding die is high, a large press machine must be introduced, which increases the cost required for the press machine. As a method of reducing the cost required for the press machine, a method of clamping the mold at a pressure lower than the peak value of the pressure generated in the molding die is known (see Patent Document 1).

JP, 2007-83685, A

However, when the above-mentioned method is applied to the RTM molding, the pressure of the resin injected into the cavity cannot be sufficiently increased, and the impregnation property of the resin into the reinforced substrate is deteriorated. Therefore, in order to sufficiently impregnate the reinforcing base material with the resin, it is necessary to take a long impregnation time. As a result, there is a problem that the cycle time increases and the productivity decreases.

Therefore, the present invention has been made in order to solve the above problems, it is possible to reduce the cycle time and the cost of the press machine without lowering the impregnating property by ensuring the impregnation time to the reinforcing base material. An object of the present invention is to provide a molding method and a molding device for a resin molded product using a thermosetting resin.

A method for molding a resin molded product using a thermosetting resin according to the present invention that achieves the above object is such that a molding die that forms a cavity into which a thermosetting resin is injected is detachably attached to a press In a state where the molding die is clamped by the machine, inject a specified amount of resin into the cavity in which the reinforcing base material is placed, and from the start of injecting the resin into the cavity until the injection of the specified amount is completed, was heated to a first temperature that the resin results in a curing reaction, after completion resin injection prescribed amount, cooling the resin injected into the cavity, the expansion of the low rather resin than the first temperature to suppress the second temperature Then, the mold clamping is released when a preset time, which is judged as the completion of the resin impregnation in the reinforcing base material, has elapsed . Then, in a state where the mold whose clamp has been released is removed from the press machine, while the resin injected into the cavity of the mold is being cured, a new mold in which the reinforcing base material is arranged in the cavity is formed. the Ru attached to the press.

Further, the molding device for a resin molded product using a thermosetting resin according to the present invention, which achieves the above object, is a molding device for forming a cavity into which a thermosetting resin is injected in a state where a reinforced substrate is arranged. A mold and a press machine to which the mold is detachably attached, and which clamps the mold; and an injection machine that injects a prescribed amount of resin into the mold when the mold is clamped by the press machine, heating of the resin of the resin injected into the cavity to a first temperature which is a curing reaction, and, optionally cooling, of the resin to lower rather suppresses the expansion of the resin the second temperature than the first temperature It has a temperature control mechanism to perform, and a control unit that controls the operations of the press machine, the injection machine, and the temperature control mechanism. Control unit, the temperature control mechanism, to the specified amount of completion of injection from the injection start of the resin into the cavity, the injected resin is heated to a first temperature, after completion infusion of the resin specified amount is injected into the cavity The cooled resin to a second temperature. Control unit, when the preset time is judged to impregnation of resin into reinforcing substrate is completed has elapsed, it cancels the clamping of the mold by the press.

According to the molding method and the molding apparatus of the present invention, the step of curing the resin injected into the cavity of the molding die using one press machine and the injection of the resin into the cavity of the new molding die are performed. The steps to be performed can be performed in parallel. As a result, the curing time of the injected resin can be used as the injection time of the resin for the next molding, so the molding time (cycle time) required for each resin molded product can be reduced by using a smaller number of press machines. It can be reduced substantially. Further, since the mold clamping is released when the resin is impregnated into the reinforcing base material, the impregnating property into the reinforcing base material is not affected. Therefore, it is possible to provide a molding method of a resin molded product using a thermosetting resin, which can reduce the cycle time and the cost of the pressing machine without lowering the impregnating property by ensuring the impregnation time to the reinforced substrate. ..

It is a schematic process drawing which shows the molding process of the resin molded product which used the molding apparatus which concerns on embodiment. It is a schematic diagram of the molding device. It is a schematic diagram of a forming die of the forming device. FIG. 4 is an enlarged view of a portion surrounded by a broken line portion M1 of FIG. 3 in a state where mold clamping is released. It is a flow chart which shows the molding method of the resin molding using the molding device concerning an embodiment. It is a flow chart which shows the process of injecting resin into the shaping die of the shaping device concerning an embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the description of the drawings, the same elements will be denoted by the same reference symbols, without redundant description. The sizes and ratios of the respective members in the drawings may be exaggerated for convenience of explanation and may differ from the actual sizes and ratios.

<Molding equipment>
A molding apparatus 100 for a resin molded product 200 using the thermosetting resin 220 according to the present embodiment will be described with reference to FIGS. 1 to 4.

FIG. 1 is a schematic process diagram showing a molding process of a resin molded product 200 using the molding apparatus 100 according to this embodiment. FIG. 2 is a schematic diagram of the molding apparatus 100. FIG. 3 is a schematic view of the molding die 10 of the molding apparatus 100. FIG. 4 is an enlarged view of a portion surrounded by a broken line portion M1 of FIG. 3 in a state where the mold clamping is released.

As shown in FIGS. 1 to 3, the molding apparatus 100 includes a molding die 10 that forms a cavity 15 into which a thermosetting resin 220 is injected in a state where a reinforced substrate 210 is arranged, and the molding die 10 is detachable. A press machine 20 that is freely attached and that clamps the molding die 10, and an injecting machine 30 that injects a thermosetting resin 220 into the molding die 10 when the molding die 10 is clamped by the pressing machine 20. And a control unit 40 that controls the operations of the press machine 20 and the injection machine 30. The control unit 40 releases the mold clamping of the molding die 10 by the pressing machine 20 when the impregnation of the resin 220 into the reinforcing base 210 is completed. In addition, the molding apparatus 100 includes a suction unit 50 that vacuum-vacuates the inside of the cavity 15, a sensor 60 that detects opening/closing of the molding die 10, and a conveying device 110 that conveys the molding die 10 that is attached to and detached from the press machine 20. Have more. Hereinafter, each component will be described in detail.

A resin molded product 200 obtained by the molding apparatus 100 and the molding method according to the present embodiment is a composite material including a reinforced substrate 210 and a thermosetting resin 220. By combining with the reinforced substrate 210, the resin molded product 200 having higher strength and rigidity than the resin 220 alone is obtained.

The type of the thermosetting resin 220 is not particularly limited, but in the present embodiment, an epoxy resin for composite material is used as the thermosetting resin 220. The epoxy resin for composite material is formed by mixing the base material 221 and the curing agent 222.

As the main agent 221, for example, bisphenol A type epoxy resin, phenol novolac type epoxy resin, glycidyl amine type epoxy resin, or the like can be used. As the curing agent 222, for example, a combination of dicyandiamide and dichlorophenyldimethylurea can be used. However, the curing agent 222 is not particularly limited, and diaminodiphenyl sulfone, aromatic diamine, acid anhydride polyamide, etc. can be used as the curing agent 222.

With reference to FIG. 1, in the present embodiment, the transport device 110 includes a stage ST1 on which a reinforcing base 210 is arranged, a stage ST2 on which a thermosetting resin 220 is injected into the molding die 10, and a molding die 10. The molding die 10 is sequentially conveyed to the stage ST3 where the thermosetting resin 220 is cured and the stage ST4 where the resin molded product 200 is released from the molding die 10. As the carrier device 110, for example, a belt conveyor type device can be used.

With reference to FIG. 2, a molding die 10 includes a pair of upper molds (male molds) 11 that can be opened and closed, a lower mold (female mold) 12, an upper mold bolster 13 that holds the upper molds 11 in a fixed manner, A lower mold bolster 14 for fixing and holding the lower mold 12.

A carbon fiber corresponding to the reinforcing base material 210 is placed in the cavity 15. The thermosetting resin 220 is impregnated into the inside of the carbon fiber from the lower surface.

The press 20 applies a mold clamping pressure P to the upper mold 11 of the molding mold 10. The mold clamping pressure P is applied to the upper mold 11 via the upper mold bolster 13. When the mold clamping pressure P is applied to the mold 10, the mold 10 is clamped. The press 20 has a cylinder 21 that uses fluid pressure such as hydraulic pressure, and adjusts the mold clamping pressure P by controlling hydraulic pressure and the like.

In the present embodiment, the injection machine 30 supplies the main agent 221 and the curing agent 222 to the mixing head 31, which forms the thermosetting resin 220 by mixing the main agent 221 and the curing agent 222. And a feeder 32.

In this embodiment, the mixing head 31 is provided on the lower mold 12. The mixing ratio of the main agent 221 and the curing agent 222 is determined by the manufacturer who provides the main agent 221 and the curing agent 222. In the present embodiment, the mixing head 31 mixes the main agent 221 and the curing agent 222 by maintaining the glass transition temperature of the resin 220 and increasing the compounding ratio of the curing agent 222 to the main agent 221 above a predetermined compounding ratio. As a result, the curing reaction can be accelerated by supplementing the curing agent 222 that is volatilized by the curing heat when the resin 220 is cured in the molding die 10. Thereby, the time required for the resin 220 to cure in the molding die 10 can be shortened. Further, since the volume of the resin 220 is reduced by being cured, it is possible to promote the decrease in the pressure inside the molding die 10.

The feeder 32 supplies the main agent 221 and the curing agent 222 to the mixing head 31. In the present embodiment, the feeder 32 is connected to the mixing head 31 via the first hose 70. The first hose 70 is fixed to the lower bolster 14 by a fastener 71.

In the present embodiment, the control unit 40 controls the operation of the entire molding apparatus 100 including the press machine 20 and the pouring machine 30. The control unit 40 is connected to the pressing machine 20, the mixing head 31 of the pouring machine 30 and the feeder 32, the suction unit 50, the sensor 60, and the transport device 110 by wiring.

The control unit 40 clamps the molding die 10 with the pressing machine 20 after the molding die 10 is closed until the impregnation of the resin 220 injected into the molding die 10 into the reinforcing base material 210 is completed. Then, when the impregnation of the resin 220 into the reinforcing base material 210 is completed, the control unit 40 releases the mold clamping of the molding die 10 by the pressing machine 20.

In the present embodiment, whether or not the impregnation into the reinforced base material 210 is completed is determined based on the void rate included in the resin molded product 200 that has been completed. The void ratio contained in the resin molded product 200 that has been molded changes depending on the timing at which the load of the mold clamping pressure P on the molding die 10 by the press 20 is stopped. Specifically, the longer the time from the completion of the injection of the resin 220 into the molding die 10 to the release of the mold clamping of the molding die 10, the more the impregnation of the resin 220 into the reinforcing base 210 is promoted. The void rate decreases. That is, the void ratio contained in the molded resin product 200 can be used as an index for determining whether or not the resin 220 has been impregnated into the reinforced substrate 210.

The control unit 40 releases the mold clamping of the molding die 10 by the pressing machine 20 at the timing when the void rate included in the resin molded product 200 that has been molded becomes a predetermined value or less. In the present embodiment, the control unit 40 releases the mold clamping of the molding die 10 by the pressing machine 20 at the timing when the void ratio included in the resin molded product 200 that has been molded becomes 10% or less.

When the control unit 40 releases the mold clamping by the press machine 20 when the impregnation of the resin 220 into the reinforcing base material 210 is completed, the following becomes possible. That is, while the resin 220 injected into the cavity 15 of the molding die 10 is being cured while the molding die 10 whose mold clamping has been released is removed from the pressing machine 20, a new molding die 10 is pressed by the pressing machine 20. Can be attached to. Thereby, the step of curing the resin 220 injected into the cavity 15 of the molding die 10 using the one press machine 20 and the step of injecting the resin 220 into the cavity 15 of the new molding die 10 are performed. , Can be performed in parallel. Since the mold clamping is released when the reinforcing substrate 210 is completely impregnated with the resin 220, the impregnating property of the reinforcing substrate 210 is not affected.

The suction unit 50 has a vacuum pump (not shown). The suction unit 50 suctions (vacuums) the air in the cavity 15 after closing the molding die 10 to bring the cavity 15 into a vacuum state. The suction part 50 and the lower mold 12 are connected via a second hose 80. The second hose 80 is fixed to the lower mold bolster 14 by a fastener 81. The suction unit 50 and the upper mold 11 are connected via a third hose 90. The third hose 90 is fixed to the upper mold bolster 13 by a fastener 91.

With reference to FIG. 3, in the molding die 10, the thermosetting resin 220 injected into the cavity 15 is heated to a first temperature T1 at which a curing reaction occurs, and the temperature is lower than the first temperature T1. The temperature control mechanism 120 that selectively cools the resin 220 to the second temperature T2 is included.

The temperature adjustment mechanism 120 heats the resin 220 injected into the cavity 15 to the first temperature T1 at which the curing reaction occurs, so that the resin 220 injected into the cavity 15 undergoes a curing reaction. Then, the thermosetting resin 220 is cured eventually.

Further, after the injection of the resin 220 is completed, the temperature adjustment mechanism 120 cools the resin 220 injected into the molding die 10 so that the expansion of the resin 220 can be suppressed. When the injection of the resin 220 is completed, the molding die 10 is in a state of being clamped by the pressing machine 20. By suppressing the expansion of the resin 220 when the molding die 10 is clamped, the peak value of the pressure generated in the molding die 10 can be lowered.

The temperature control mechanism 120 has the pipe 16 provided in the upper mold 11 and the lower mold 12. In the pipe 16, either the fluid adjusted to the first temperature T1 or the fluid adjusted to the second temperature T2 is selectively circulated. Hot water, steam, or oil can be used as the fluid circulating in the pipe 16, but is not particularly limited.

The resin 220 injected into the cavity 15 is heated to the first temperature T1 by flowing the fluid adjusted to the first temperature T1 through the pipe 16. Further, the resin 220 injected into the cavity 15 is cooled by flowing the fluid adjusted to the second temperature T2 through the pipe 16.

With reference to FIG. 3 and FIG. 4, in the present embodiment, the size of the cavity 15 is adjusted so that the size of the cavity 15 increased by releasing the mold clamping becomes a size suitable for the size of the resin molded product 200. It is set. Specifically, by releasing the mold clamping by the press machine 20, the upper mold 11 is lifted. Therefore, the dimension h of the cavity 15 in the load direction Y of the mold clamping pressure P increases to h+Δh.

In the present embodiment, the dimension of the cavity 15 is set so that the dimension h+Δh of the cavity 15 after the increase matches the dimension of the resin molded product 200. More specifically, the case shown in FIG. 1 and FIG. 4 will be described in more detail. When the dimension of the resin molded product 200 in the load direction Y of the mold clamping pressure P is H, the lift amount of the upper mold 11 is expected. The dimension of the cavity 15 is set so that the dimension h+Δh of the cavity 15 after the increase becomes H. In other words, the dimension of the cavity 15 is set so that the dimension h of the cavity 15 in the mold clamped state is H-Δh. This improves the dimensional accuracy of the resin molded product. The increase amount Δh of the size of the cavity 15 is, for example, less than about 0.5 mm.

<Molding method>
Hereinafter, the procedure of the molding method using the molding apparatus 100 according to the present embodiment will be described with reference to FIG.

FIG. 5 is a flowchart showing a molding method of the resin molded product 200 using the molding apparatus 100.

As shown in FIG. 5, in the method of molding the resin molded product 200 using the molding apparatus 100, the step of disposing the reinforcing base material 210 in the molding die 10 (step S1) and the molding die 10 are attached to the press 20. Step (step S2), step of injecting resin 220 into the molding die 10 (step S3), step of removing the molding die 10 from the press 20 (step S4), and curing the resin 220 in the molding die 10. The method includes a step (step S5) and a step (step S6) of releasing the molded resin molded product 200 from the molding die 10.

In the molding method of the resin molded product 200 using the molding apparatus 100 according to the present embodiment, the resin molded product 200 is continuously formed. Then, a part of the step of molding one resin molded product 200 is performed in parallel with a part of the process of forming the next resin molded product 200. At least in the method of molding the resin molded product 200 using the molding apparatus 100 according to the present embodiment, a new reinforced substrate 210 is placed in the cavity 15 while the resin 220 is being cured in the molding die 10. The mold 10 is attached to the press 20. Hereinafter, each step will be described in detail.

First, in the stage ST1 of the molding apparatus 100, the reinforcing base material 210 is placed in the cavity 15 of the molding die 10 and preformed (step S1). At this time, the inner surface of the mold facing the cavity 15 is degreased using a predetermined organic solvent, and the mold release treatment is performed using a mold release agent. At this time, the inner surface of the mold facing the cavity 15 is degreased by using a predetermined organic solvent, and is released by using a release agent.

Next, the molding apparatus 10 is carried by the carrying device 110 from the stage ST1 to the stage ST2. Then, the mold 10 is detachably attached to the press 20 (step S2).

Next, the resin 220 is injected into the molding die 10 (step S3). Details of the step of injecting the resin 220 into the molding die 10 will be described later.

Next, the mold 10 is removed from the press 20 (step S4). Then, the molding apparatus 10 is transported from the stage ST2 to the stage ST3 by the transport device 110 and left until the resin 220 in the cavity 15 is sufficiently cured (step S5). At this time, a new mold 10 having the reinforcing base material 210 arranged in the cavity 15 is attached to the press 20. Thereby, the step of curing the resin 220 injected into the cavity 15 of the molding die 10 using the one press machine 20 and the step of injecting the resin 220 into the cavity 15 of the new molding die 10 are performed. , Can be performed in parallel. As a result, the molding time (cycle time) required for each resin molded product 200 can be substantially reduced by using a smaller press machine 20. The processes performed in steps S3 to S6 are similarly performed on the new mold 10 attached to the press 20.

Finally, the transfer device 110 transfers the molding die 10 from the stage ST3 to the stage ST4. Then, the molding die 10 is opened, and the molded resin molded product 200 is released from the molding die 10 (step S6).

<Injection process>
The step (step S3) of injecting the resin 220 into the molding die 10 will be described in detail with reference to FIG.

FIG. 6 is a flowchart showing a step of injecting the resin 220 into the molding die 10.

The step of injecting the resin 220 into the molding die 10 includes a step of clamping the molding die 10 (step S31), a step of vacuum suction inside the molding die 10 (step S32), and a resin in the cavity 15 of the molding die 10. A step of injecting 220 (step S33), a step of heating resin 220 in cavity 15 of molding die 10 (step S34), and a step of determining whether or not a prescribed amount of resin 220 has been injected (step S35). The step of cooling the resin 220 in the cavity 15 of the molding die 10 (step S36), the step of determining whether or not the impregnation of the resin 220 is completed (step S37), and the clamping of the molding die 10 are released. The process (step S38). Hereinafter, each step will be described in detail. The control unit 40 performs the process of each step.

First, the molding machine 10 is clamped by the press machine 20 (step S31). Specifically, by applying a mold clamping pressure P to the mold 10 by the press machine 20, the upper mold 11 and the lower mold 12 of the mold 10 are brought close to each other. Then, when the upper die 11 of the molding die 10 contacts the lower die 12, the mold closing of the molding die 10 is completed and the molding die 10 is clamped. At this time, a closed cavity 15 is formed between the upper mold 11 and the lower mold 12.

Next, the inside of the cavity 15 of the molding die 10 is sucked by the suction unit 50 to perform vacuuming, and the inside of the cavity 15 is brought into a vacuum state (step S32). By performing vacuuming, bubbles generated on the surface can be prevented, voids and pits of the composite material that is the resin molded product 200 can be reduced, and mechanical properties and designability of the composite material can be improved.

Next, the main agent 221 and the curing agent 222 are mixed to form the resin 220. Then, the formed resin 220 is injected into the cavity 15 (step S33).

The mixing of the main agent 221 and the curing agent 222 is performed using the mixing head 31. In the present embodiment, when the main agent 221 and the curing agent 222 are mixed, while maintaining the glass transition temperature of the resin 220, the mixing ratio of the curing agent 222 to the main agent 221 is increased above a predetermined mixing ratio to increase the main agent 221. And the curing agent 222 are mixed. As a result, the curing reaction can be accelerated by supplementing the curing agent 222 that is volatilized by the curing heat when the resin 220 is cured in the molding die 10. Therefore, the time required for the resin 220 to cure in the molding die 10 can be shortened. Further, since the volume of the resin 220 is reduced by being cured, it is possible to promote the decrease in the pressure inside the molding die 10.

When injecting the resin 220, the resin 220 is heated to the first temperature T1 at which the resin 220 causes a curing reaction (step S34). As a result, the resin 220 injected into the cavity 15 of the mold 10 undergoes a curing reaction. In the present embodiment, when the resin 220 injected into the cavity 15 is heated to the first temperature T1, the fluid adjusted to the first temperature T1 is circulated through the pipe 16 arranged in the molding die 10.

After the injection of the resin 220 is completed (step S35: “Yes”), the resin 220 in the cavity 15 of the mold 10 is cooled to the second temperature T2 lower than the first temperature T1 (step S36). As a result, the expansion of the resin 220 injected into the cavity 15 of the molding die 10 can be suppressed, so that the peak value of the pressure generated in the molding die 10 can be reduced.

In the present embodiment, as described above, when the resin 220 injected into the cavity 15 is heated to the first temperature T1, the fluid adjusted to the first temperature T1 is supplied to the pipe 16 arranged in the molding die 10. Distribute. When the resin 220 injected into the cavity 15 is cooled to the second temperature T2, the fluid adjusted to the second temperature T2 is passed through the pipe 16. Thereby, the temperature of the resin 220 injected into the cavity 15 can be selectively adjusted to the first temperature T1 and the second temperature T2 by the one pipe 16.

When the impregnation of the resin 220 into the reinforcing base 210 is completed (step S37: “Yes”), the mold clamping of the molding die 10 is released (step S38). As a result, as described above, the step of curing the resin 220 injected into the cavity 15 of the molding die 10 using the one press 20 and the resin 220 to the cavity 15 of the new molding die 10 are cured. The step of performing the injection can be performed in parallel. Further, the mold clamping of the molding die 10 is released when the impregnation of the resin 220 into the reinforced base material 210 is completed, and therefore the impregnability into the reinforced base material 210 is not affected.

As described above, in the present embodiment, whether or not the impregnation into the reinforcing base material 210 is completed is determined based on the void rate contained in the resin molded product 200 that has been completed in molding. Specifically, the mold clamping of the molding die 10 is released at the timing when the void rate contained in the resin molded product 200 that has been molded becomes a predetermined value or less. In the present embodiment, the mold clamping of the molding die 10 is released at the timing when the void ratio contained in the resin molded product 200 that has been molded becomes 10% or less.

In addition, in the present embodiment, the size of the cavity 15 is set such that the size that increases by releasing the mold clamping matches the size of the resin molded product 200. Thereby, the dimensional accuracy of the resin molded product can be improved.

(Action/effect)
In the molding apparatus 100 and the molding method according to the present embodiment, the molding die 10 forming the cavity 15 into which the thermosetting resin 220 is injected is detachably attached to the press machine 20, and the molding machine 10 is molded by the press machine 20. In the tightened state, the resin 220 is injected into the cavity 15 in which the reinforcing base 210 is arranged, and the mold clamping is released when the impregnation of the resin 220 into the reinforcing base 210 is completed. Then, while the resin 220 injected into the cavity 15 of the molding die 10 is being cured in a state where the molding die 10 from which the mold clamping has been released is removed from the pressing machine 20, the reinforced base material 210 is kept inside the cavity 15. The new molding die 10 arranged is attached to the press 20.

According to the molding apparatus 100 thus configured and the molding method using the molding apparatus 100, a step of curing the resin 220 injected into the cavity 15 of the molding die 10 using one press machine 20, The step of injecting the resin 220 into the cavity 15 of the new molding die 10 can be performed in parallel. As a result, since the curing time of the injected resin can be used as the injection time of the resin for the next molding, the molding time (cycle time) required for one resin molded product 200 is reduced by using a smaller number of press machines 20. ) Can be substantially reduced. Further, the mold clamping of the molding die 10 is released when the impregnation of the resin 220 into the reinforced base material 210 is completed, and therefore the impregnability into the reinforced base material 210 is not affected. Therefore, a molding apparatus and a molding method for a resin molded product using a thermosetting resin capable of reducing the cycle time and the cost of the press machine without lowering the impregnating property by ensuring the impregnation time for the reinforced substrate. Can be provided.

Further, in the molding apparatus 100 and the molding method according to the present embodiment, when the resin 220 is injected into the cavity 15, the resin 220 is heated to the first temperature T1 at which the resin 220 causes a curing reaction, and the resin 220 is injected. After the completion, the resin 220 is cooled to the second temperature T2 lower than the first temperature T1.

According to the molding apparatus 100 configured as described above and the molding method using the molding apparatus 100, the expansion of the resin 220 injected into the molding die 10 can be suppressed. Thereby, the peak value of the pressure generated in the molding die 10 can be lowered. Therefore, the press machine can be downsized, and the cost of the press machine can be further reduced.

In addition, in the molding apparatus 100 and the molding method according to the present embodiment, when the resin 220 injected into the cavity 15 is heated to the first temperature T1, the fluid adjusted to the first temperature T1 is applied to the molding die 10. When the resin 220 injected into the cavity 15 is cooled and the resin 220 injected into the cavity 15 is cooled to the second temperature T2, the fluid adjusted to the second temperature T2 is passed through the pipe 16.

According to the molding apparatus 100 configured as above and the molding method using the molding apparatus 100, the resin 220 injected into the cavity 15 is selectively heated to the first temperature T1 by using the one pipe 16 or the first temperature T1. It can be cooled to two temperatures T2. This simplifies the device configuration, facilitates design, and reduces manufacturing costs.

Further, in the molding apparatus 100 and the molding method according to the present embodiment, the resin 220 is formed by mixing the main agent 221 and the curing agent 222, and when the main agent 221 and the curing agent 222 are mixed, the resin 220 is used. The main agent 221 and the curing agent 222 are mixed by increasing the compounding ratio of the curing agent 222 to the main agent 221 above a predetermined mixing ratio while maintaining the glass transition temperature of 1.

According to the molding apparatus 100 thus configured and the molding method using the molding apparatus 100, the curing reaction can be accelerated by supplementing the curing agent 222 that is volatilized by the curing heat when the resin 220 is cured in the molding die 10. .. As a result, the time required to cure the resin 220 can be shortened, and the cycle time can be further shortened.

Further, in the molding apparatus 100 and the molding method according to the present embodiment, the size of the cavity 15 is increased by releasing the mold clamping, and the size of the cavity 15 becomes a size suitable for the size of the resin molded product 200. To set.

According to the molding apparatus 100 thus configured and the molding method using the molding apparatus 100, the dimensional accuracy of the resin molded product 200 can be improved.

It should be noted that the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims.

For example, the molding die 10 and the pouring machine 30 of the molding apparatus 100 according to the above-described embodiment are configured as follows. That is, in the mold 10, the resin 220 injected into the cavity 15 is heated to the first temperature T1 at which the resin 220 undergoes a curing reaction, and the resin 220 is heated to the second temperature T2 lower than the first temperature T1. The temperature control mechanism 120 selectively performs the cooling. Further, the dimension h of the cavity 15 of the molding die 10 is set so that the dimension h+Δh of the cavity after being increased by releasing the mold clamping becomes a dimension that matches the dimension of the resin molded product 200. In addition, the injection machine 30 has a mixing head 31 that forms the resin 220 by mixing the main agent 221 and the curing agent 222, and the mixing head 31 maintains the glass transition temperature of the resin 220 while maintaining the glass transition temperature of the resin 220. The main agent 221 and the curing agent 222 were mixed with each other by increasing the compounding ratio of the curing agent 222 above a predetermined compounding ratio. However, the molding die 10 does not have the temperature control mechanism 120, and the injection machine 30 maintains the glass transition temperature of the resin 220 and increases the compounding ratio of the curing agent 222 to the main agent 221 above a predetermined compounding ratio. A mode that does not have the mixing head 31 for mixing 221 and the curing agent 222 is also included in the technical scope of the present invention. In addition, a mode in which the dimension h of the cavity 15 of the molding die 10 is not set such that the dimension h+Δh of the cavity 15 increased by releasing the mold clamping matches the dimension of the resin molded product 200 It is included in the technical scope of the invention.

Further, in the molding method according to the above-described embodiment, when the resin 220 is injected into the cavity 15, the resin 220 is heated to the first temperature T1 at which the resin 220 causes a curing reaction, and after the injection of the resin 220 is completed, The resin 220 was cooled to the second temperature T2 lower than the first temperature T1. The resin 220 is formed by mixing the main agent 221 and the curing agent 222. When the main agent 221 and the curing agent 222 are mixed, the resin 220 is cured with respect to the main agent 221 while maintaining the glass transition temperature of the resin 220. The main agent 221 and the curing agent 222 were mixed by increasing the compounding ratio of the agent 222 above a predetermined compounding ratio. Further, the dimension h of the cavity 15 is set so that the dimension h+Δh of the cavity 15 after being increased by releasing the mold clamping matches the dimension of the resin molded product 200. However, when the resin 220 is injected into the cavity 15, the resin 220 is heated to the first temperature T1 at which the resin 220 undergoes a curing reaction, and after the injection of the resin 220 is completed, the resin 220 is heated to the second temperature T2 lower than the first temperature T1. Forming the resin 220 by cooling 220 and forming the resin 220 by mixing the main agent 221 and the curing agent 222 by increasing the mixing ratio of the curing agent 222 to the main agent 221 above a predetermined mixing ratio is also included. It is included in the technical scope of the present invention. Further, a mode not including setting the dimension h of the cavity 15 so that the dimension h+Δh of the cavity 15 after being increased by releasing the mold clamping becomes a dimension that matches the dimension of the resin molded product 200. Within the technical scope of.

Further, in the above-described embodiment, whether or not the impregnation of the reinforced base material 210 with the thermosetting resin 220 is completed is determined based on the void rate included in the resin molded product 200 that has been molded. However, another method may be used to determine whether or not the impregnation of the thermosetting resin 220 into the reinforced substrate 210 has been completed. For example, whether or not the impregnation of the thermosetting resin 220 into the reinforced base material 210 may be determined based on the viscosity and pressure of the thermosetting resin 220 injected into the cavity 15.

Further, in the above-described embodiment, in the molding apparatus 100, the reinforced base material 210 is arranged in the molding die 10, the thermosetting resin 220 is injected into the molding die 10, and the thermosetting resin in the molding die 10 is injected. Curing of the resin 220 and demolding of the resin molded product 200 from the molding die 10 were performed in different stages ST1 to ST4. However, the division of the stages is not limited as long as the resin molding 200 can be formed in parallel by using one press 20. For example, the placement of the reinforcing base material 210 in the molding die 10 and the injection of the thermosetting resin 220 into the molding die 10 may be performed in one stage. Further, the curing of the thermosetting resin 220 in the molding die 10 and the demolding of the resin molded product 200 from the molding die 10 may be performed in one stage.

10 Mold,
15 cavities,
16 pipes,
20 press machines,
30 injection machines,
31 mixing heads,
32 feeders,
40 control unit,
50 suction unit,
100 molding equipment,
110 transport device,
120 temperature control mechanism,
200 resin molded products,
210 reinforced base material,
220 reinforced substrate,
P mold clamping pressure,
Y clamping pressure load direction,
h, H dimensions.

Claims (6)

A mold that forms a cavity into which a thermosetting resin is injected is detachably attached to a press machine.
In a state where the molding die is clamped by the press machine, a prescribed amount of the resin is injected into the cavity in which a reinforced substrate is arranged,
The start of infusion of the resin into the cavity until the specified amount of completion of injection, the injected the resin is heated to a first temperature that the resin results in a curing reaction, after completion injection of specified amount of the resin, the the resin injected into the cavity to cool the inflation of the first temperature lower rather resin than to suppress the second temperature,
The mold clamping is released when a preset time period in which it is determined that the impregnation of the resin into the reinforcing base material is completed,
The reinforced base material is arranged in the cavity while the resin injected into the cavity of the mold is cured while the mold having the mold clamp released is removed from the press machine. A method for molding a resin molded product using a thermosetting resin, in which the new molding die is attached to the press machine. When heating the resin injected into the cavity to the first temperature, a fluid adjusted to the first temperature is circulated through a pipe arranged in the molding die, and the resin injected into the cavity The molding method according to claim 1, wherein, when the resin is cooled to the second temperature, a fluid adjusted to the second temperature is circulated through the pipe. The molding according to claim 1 or 2, wherein the size of the cavity is increased by releasing the mold clamping so that the size of the cavity matches the size of the resin molded product. Method. A mold for forming a cavity into which a thermosetting resin is injected in a state where the reinforcing base material is arranged,
A press machine for detachably attaching the molding die and clamping the molding die,
An injection machine that injects a specified amount of the resin into the mold in a state where the mold is clamped by the press machine,
Heating of the resin of the resin injected into the cavity to a first temperature which is a curing reaction, and the cooling of the resin to a low rather suppresses the expansion of the resin the second temperature than the first temperature A temperature control mechanism to selectively perform,
A control unit that controls the operations of the press machine, the injection machine, and the temperature control mechanism,
The control unit heats the injected resin to the first temperature from the start of the injection of the resin into the cavity to the completion of the injection of the specified amount by the temperature adjustment mechanism, and the injection of the specified amount of the resin is completed. After that, the resin injected into the cavity is cooled to the second temperature,
The control unit releases the mold clamping of the mold by the press machine when a preset time period in which it is determined that impregnation of the resin into the reinforcing base material is completed, thermosetting, Molding equipment for resin molded products using the above resin. The molding apparatus according to claim 4 , wherein the temperature adjustment mechanism includes a pipe through which either one of the fluid adjusted to the first temperature and the fluid adjusted to the second temperature is selectively circulated. The dimensions of the cavity, the dimensions of the cavity after increasing by releasing the mold clamping is set to be the dimensions adapted to the dimensions of the resin molded product, to claim 4 or claim 5 The molding apparatus described.