JP2017081016A - Method and device for molding resin molded article using thermosetting resin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a device for molding a resin molded article using a thermosetting resin, which are capable of reducing cycle time and cost of a press machine without deteriorating impregnation property by securing impregnation time in a reinforcing base material.SOLUTION: Provided is a method for molding a resin molded article using a thermosetting resin, in which: in a state where a molding die attached detachably to a press machine is clamped by the press machine (step S31); a resin is injected inside a cavity where a reinforcing base material is disposed (step S33); and when impregnation of the resin in the reinforcing base material is completed (step S37), clamping is released (step S38). With this molding method, while the resin injected inside the cavity of the molding die is cured in a state where the released molding die is detached from the press machine, a new molding die having the reinforcing base material disposed inside its cavity is attached to the press machine.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a molding method and a molding apparatus for a resin molded product using a thermosetting resin.

  In recent years, in the production of resin molded products, resin molding using a thermosetting resin having higher strength after curing as compared with a thermoplastic resin has been performed. In particular, RTM (Resin Transfer Molding) molding, which can form a very strong and light product by impregnating a curable base material with a thermosetting resin and curing it, has been actively performed. Yes.

  In the above-described method, a mold clamping pressure larger than the pressure generated in the mold is applied to the mold by using a press machine from when the mold is closed until the resin mold is formed and the mold is opened. It is common to continue. When the peak value of pressure generated in the mold is high, a large press must be introduced, and the cost required for the press increases. As a method of reducing the cost required for a press, a method of clamping with a pressure lower than the peak value of pressure generated in the mold is known (see Patent Document 1).

Japanese Patent Laid-Open No. 2007-83685

  However, when the above-described method is applied to RTM molding, the pressure of the resin injected into the cavity cannot be sufficiently increased, and the impregnation property of the resin into the reinforced substrate is lowered. For this reason, in order to sufficiently impregnate the reinforced substrate with the resin, it is necessary to take a long time for the impregnation. As a result, there is a problem that the cycle time increases and the productivity decreases.

  Therefore, the present invention has been made to solve the above-mentioned problems, and it is possible to reduce the cycle time and the cost of the press machine without reducing the impregnation property by securing the impregnation time to the reinforced base material. It is an object of the present invention to provide a molding method and a molding apparatus for a resin molded product using a thermosetting resin.

  The method for molding a resin molded product using a thermosetting resin according to the present invention that achieves the above object comprises a mold for forming a cavity into which a thermosetting resin is injected, detachably attached to a press machine, In a state where the mold is clamped by a machine, resin is injected into the cavity in which the reinforced base material is disposed, and the mold clamping is released when the impregnation of the reinforced base material is completed. A new molding die in which a reinforced base material is disposed in the cavity while the resin injected into the cavity of the molding die is cured in a state where the molding die whose mold clamping is released is removed from the press machine. Attach to the press.

  In addition, a molding apparatus for a resin molded product using a thermosetting resin according to the present invention that achieves the above object is a molding that forms a cavity into which a thermosetting resin is injected in a state where a reinforced base material is disposed. A mold, a press machine in which the mold is detachably attached, a press machine for clamping the mold, an injection machine for injecting resin into the mold in a state where the mold is clamped by the press machine, a press machine, And a controller for controlling the operation of the injector. The control unit releases the clamping of the molding die by the press when the impregnation of the resin to the reinforced substrate is completed.

  According to the molding method and the molding apparatus of the present invention, the step of curing the resin injected into the cavity of the mold using one press machine and the injection of the resin into the cavity of the new mold are performed. And the process of performing can be performed in parallel. As a result, the curing time of the injected resin can be used as the injection time of the resin for the next molding, so the molding time (cycle time) required per resin molded product can be reduced using a smaller number of press machines. It can be reduced substantially. Further, since the mold clamping of the mold is released when the resin impregnation of the reinforcing base is completed, the impregnation property of the reinforcing base is not affected. Therefore, it is possible to provide a molding method of a resin molded product using a thermosetting resin that can reduce the cycle time and the cost of the press without reducing the impregnation property by ensuring the impregnation time to the reinforced base material. .

It is a general | schematic process figure which shows the shaping | molding process of the resin molded product using the shaping | molding apparatus which concerns on embodiment. It is the schematic of the same shaping | molding apparatus. It is the schematic of the shaping | molding die of the shaping | molding apparatus. FIG. 4 is an enlarged view of a portion surrounded by a broken line portion M1 in FIG. 3 in a state where mold clamping is released. It is a flowchart which shows the molding method of the resin molded product using the shaping | molding apparatus which concerns on embodiment. It is a flowchart which shows the process of inject | pouring resin into the shaping | molding die of the shaping | molding apparatus which concerns on embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. The size and ratio of each member in the drawings are exaggerated for convenience of explanation and may be different from the actual size and ratio.

<Molding device>
A molding apparatus 100 for a resin molded product 200 using a thermosetting resin 220 according to the present embodiment will be described with reference to FIGS.

  FIG. 1 is a schematic process diagram illustrating a molding process of a resin molded product 200 using the molding apparatus 100 according to the present embodiment. FIG. 2 is a schematic view of the molding apparatus 100. FIG. 3 is a schematic view of the mold 10 of the molding apparatus 100. FIG. 4 is an enlarged view of a portion surrounded by a broken line portion M1 in FIG. 3 in a state where the mold clamping is released.

  As shown in FIGS. 1 to 3, the molding apparatus 100 includes a molding die 10 that forms a cavity 15 into which a thermosetting resin 220 is injected in a state in which a reinforcing base 210 is disposed, and the molding die 10 is attached and detached. A press machine 20 that is freely attached and that clamps the mold 10; and an injection machine 30 that injects a thermosetting resin 220 into the mold 10 when the mold 10 is clamped by the press machine 20; And a control unit 40 that controls the operations of the press machine 20 and the injection machine 30. The control unit 40 releases the mold clamping of the molding die 10 by the press machine 20 when the impregnation of the resin 220 into the reinforcing base 210 is completed. The molding apparatus 100 includes a suction unit 50 that vacuum-sucks the inside of the cavity 15, a sensor 60 that detects opening and closing of the molding die 10, and a conveyance device 110 that conveys the molding die 10 that is attached to and detached from the press machine 20. Also have. Hereinafter, each component will be described in detail.

  A resin molded product 200 obtained by the molding apparatus 100 and the molding method according to the present embodiment is a composite material composed of a reinforced substrate 210 and a thermosetting resin 220. By combining with the reinforced substrate 210, a resin molded product 200 having higher strength and rigidity than the resin 220 alone is obtained.

  The type of the thermosetting resin 220 is not particularly limited, but in this embodiment, an epoxy resin for composite material is used as the thermosetting resin 220. The epoxy resin for composite material is formed by mixing the main agent 221 and the curing agent 222.

  As the main agent 221, for example, bisphenol A type epoxy resin, phenol novolac type epoxy resin, glycidylamine type epoxy resin, or the like can be used. As the curing agent 222, for example, a combination of dicyandiamide and dichlorophenyldimethylurea can be used. However, it is not particularly limited, and diaminodiphenyl sulfone, aromatic diamine, acid anhydride polyamide and the like can be used as the curing agent 222.

  Referring to FIG. 1, in the present embodiment, a conveying device 110 includes a stage ST <b> 1 where a reinforced substrate 210 is disposed, a stage ST <b> 2 where a thermosetting resin 220 is injected into the mold 10, and a mold 10. The molding die 10 is sequentially conveyed from the molding die 10 to the stage ST3 where the thermosetting resin 220 is cured and from the molding die 10 to the stage ST4 from which the resin molded product 200 is removed. As the conveying device 110, for example, a belt conveyor type device can be used.

  Referring to FIG. 2, the mold 10 includes a pair of upper and lower molds (male molds) 11, a lower mold (female mold) 12, an upper mold bolster 13 that holds the upper mold 11 fixedly, And a lower die bolster 14 that holds the lower die 12 fixedly.

  Carbon fibers corresponding to the reinforcing base 210 are placed in the cavity 15. The thermosetting resin 220 is impregnated from the bottom surface of the carbon fiber.

  The press machine 20 applies a clamping pressure P to the upper mold 11 of the mold 10. The mold clamping pressure P is applied to the upper mold 11 via the upper mold bolster 13. When the mold clamping pressure P is applied to the mold 10, the mold 10 is clamped. The press machine 20 has a cylinder 21 using fluid pressure such as hydraulic pressure, and adjusts the mold clamping pressure P by controlling the hydraulic pressure or the like.

  In this embodiment, the injection machine 30 supplies the main agent 221 and the curing agent 222 to the mixing head 31, which forms the thermosetting resin 220 by mixing the main agent 221 and the curing agent 222. And a feeder 32.

  In the present embodiment, the mixing head 31 is provided on the lower mold 12. The mixing ratio of the main agent 221 and the curing agent 222 is determined by the manufacturer that provides the main agent 221 and the curing agent 222. In the present embodiment, the mixing head 31 mixes the main agent 221 and the curing agent 222 while maintaining the glass transition temperature of the resin 220 while increasing the compounding ratio of the curing agent 222 with respect to the main agent 221 beyond a predetermined compounding ratio. As a result, the curing reaction can be promoted by supplementing the curing agent 222 that volatilizes by the curing heat when the resin 220 is cured in the mold 10. Thereby, the time required for the resin 220 to cure in the mold 10 can be shortened. Further, since the volume of the resin 220 is reduced by being cured, a decrease in the pressure in the mold 10 can be promoted.

  The supply machine 32 supplies the main agent 221 and the curing agent 222 to the mixing head 31. In the present embodiment, the supply machine 32 is connected to the mixing head 31 via the first hose 70. The first hose 70 is fixed to the lower bolster 14 with a fastener 71.

  In the present embodiment, the control unit 40 controls the operation of the entire molding apparatus 100 including the press machine 20 and the injection machine 30. The control unit 40 is connected to the press machine 20, the mixing head 31 and the feeder 32 of the injection machine 30, the suction unit 50, the sensor 60, and the transfer device 110 by wiring.

  The control unit 40 clamps the mold 10 with the press 20 until the resin 220 injected into the mold 10 is completely impregnated into the reinforcing base 210 after the mold 10 is closed. And the control part 40 cancels | releases the clamping of the shaping | molding die 10 by the press machine 20 when the impregnation of the resin 220 to the reinforcement base material 210 is completed.

  In the present embodiment, whether or not the impregnation of the reinforced substrate 210 is completed is determined based on the void ratio included in the resin molded product 200 that has been molded. The void ratio included in the resin molded product 200 that has been molded varies depending on the timing at which the load of the mold clamping pressure P applied to the mold 10 by the press machine 20 is stopped. Specifically, the longer the time from the completion of the injection of the resin 220 into the mold 10 until the release of the mold clamping of the mold 10 is, the more the impregnation of the resin 220 into the reinforcing base 210 is promoted. The void ratio decreases. That is, as an index for determining whether or not the impregnation of the resin 220 into the reinforced substrate 210 has been completed, the void ratio included in the resin molded product 200 that has been molded can be used.

  The control unit 40 releases the mold clamping of the molding die 10 by the press machine 20 at a timing when the void ratio included in the resin molded product 200 that has been molded becomes a predetermined value or less. In the present embodiment, the control unit 40 releases the mold clamping of the mold 10 by the press machine 20 at a timing when the void ratio included in the resin molded product 200 that has been molded is 10% or less.

  When the control unit 40 completes the impregnation of the resin 220 into the reinforced substrate 210, the control unit 40 releases the mold clamping by the press machine 20, thereby enabling the following. That is, while the resin mold injected into the cavity 15 of the mold 10 is being cured in a state where the mold 10 whose mold clamping has been released is removed from the press machine 20, the new mold 10 is inserted into the press machine 20. Can be attached to. Thereby, using one press 20, a step of curing the resin 220 injected into the cavity 15 of the mold 10, and a step of injecting the resin 220 into the cavity 15 of the new mold 10 Can be performed in parallel. Since the mold clamping of the mold 10 is released when the impregnation of the resin 220 into the reinforcing base 210 is completed, the impregnation property into the reinforcing base 210 is not affected.

  The suction unit 50 has a vacuum pump (not shown). The suction unit 50 sucks (evacuates) the air in the cavity 15 after the mold 10 is closed, and places the cavity 15 in a vacuum state. The suction part 50 and the lower mold 12 are connected via a second hose 80. The second hose 80 is fixed to the lower bolster 14 by a fastener 81. The suction unit 50 and the upper mold 11 are connected via a third hose 90. The third hose 90 is fixed to the upper bolster 13 by a fastener 91.

  Referring to FIG. 3, in the mold 10, the thermosetting resin 220 injected into the cavity 15 is heated to the first temperature T <b> 1 at which the curing reaction occurs, and is lower than the first temperature T <b> 1. A temperature control mechanism 120 that selectively cools the resin 220 to the second temperature T2 is provided.

  When the temperature control mechanism 120 heats the resin 220 injected into the cavity 15 to the first temperature T1 at which a curing reaction occurs, a curing reaction occurs in the resin 220 injected into the cavity 15. Then, the thermosetting resin 220 is cured over time.

  Further, after the injection of the resin 220 is completed, the temperature adjustment mechanism 120 cools the resin 220 injected into the mold 10, whereby the expansion of the resin 220 can be suppressed. When the injection of the resin 220 is completed, the molding die 10 is in a state of being clamped by the press machine 20. By suppressing the expansion of the resin 220 in a state where the mold 10 is clamped, the peak value of the pressure generated in the mold 10 can be lowered.

  The temperature adjustment mechanism 120 has a pipe 16 provided in the upper mold 11 and the lower mold 12. In the pipe 16, either the fluid adjusted to the first temperature T1 or the fluid adjusted to the second temperature T2 is selectively circulated. Although hot water, steam, or oil can be used as the fluid circulated in the pipe 16, it is not particularly limited.

  As the fluid adjusted to the first temperature T1 flows through the pipe 16, the resin 220 injected into the cavity 15 is heated to the first temperature T1. In addition, the resin 220 injected into the cavity 15 is cooled by flowing the fluid adjusted to the second temperature T2 through the pipe 16.

  With reference to FIGS. 3 and 4, in this embodiment, the dimension of the cavity 15 is such that the dimension of the cavity 15 increased by releasing the mold clamping is a dimension that matches the dimension of the resin molded product 200. Is set. Specifically, the upper die 11 is lifted by releasing the clamping by the press machine 20. Therefore, the dimension h of the cavity 15 in the load direction Y of the mold clamping pressure P increases to h + Δh.

  In this embodiment, the dimension of the cavity 15 is set so that the dimension h + Δh of the increased cavity 15 matches the dimension of the resin molded product 200. More specifically, taking the case shown in FIGS. 1 and 4 as an example, when the dimension of the resin molded product 200 in the load direction Y of the clamping pressure P is H, the amount of lifting of the upper mold 11 is expected. Therefore, the dimension of the cavity 15 is set so that the dimension h + Δh of the cavity 15 after the increase becomes H. In other words, the dimension of the cavity 15 is set so that the dimension h of the cavity 15 in the clamped state becomes H−Δh. Thereby, the dimensional accuracy of the resin molded product is improved. The increase amount Δh of the dimension of the cavity 15 is, for example, less than about 0.5 mm.

<Molding method>
Hereinafter, the procedure of the molding method using the molding apparatus 100 according to the present embodiment will be described with reference to FIG.

  FIG. 5 is a flowchart showing a molding method of the resin molded product 200 using the molding apparatus 100.

  As shown in FIG. 5, in the molding method of the resin molded product 200 using the molding apparatus 100, the step (step S <b> 1) of arranging the reinforcing base 210 in the molding die 10 and the molding die 10 are attached to the press machine 20. Step (step S2), step of injecting resin 220 into mold 10 (step S3), step of removing mold 10 from press machine 20 (step S4), and curing resin 220 in mold 10 A process (step S5) and a process of removing the molded resin molded product 200 from the mold 10 (step S6).

  In the molding method of the resin molded product 200 using the molding apparatus 100 according to the present embodiment, the resin molded product 200 is continuously formed. A part of the process of molding one resin molded product 200 is performed in parallel with a part of the process of forming the next resin molded product 200. At least in the molding method of the resin molded product 200 using the molding apparatus 100 according to the present embodiment, a new reinforcing base 210 is disposed in the cavity 15 while the resin 220 is cured in the molding die 10. The mold 10 is attached to the press machine 20. Hereinafter, each process is explained in full detail.

  First, in the stage ST1 of the molding apparatus 100, the reinforcing base 210 is placed in the cavity 15 of the molding die 10 and preformed (step S1). At this time, the inner surface of the mold facing the cavity 15 is degreased using a predetermined organic solvent, and is subjected to a mold release process using a mold release agent. At this time, the inner surface of the mold facing the cavity 15 is degreased using a predetermined organic solvent, and is subjected to a mold release process using a mold release agent.

  Next, the mold 10 is transported from the stage ST1 to the stage ST2 by the transport device 110. Then, the mold 10 is detachably attached to the press machine 20 (step S2).

  Next, the resin 220 is injected into the mold 10 (step S3). Details of the process of injecting the resin 220 into the mold 10 will be described later.

  Next, the mold 10 is removed from the press machine 20 (step S4). Then, the mold 10 is transported from the stage ST2 to the stage ST3 by the transport device 110, and left until the resin 220 in the cavity 15 is sufficiently cured (step S5). At this time, the new mold 10 in which the reinforcing base 210 is disposed in the cavity 15 is attached to the press machine 20. Thereby, using one press 20, a step of curing the resin 220 injected into the cavity 15 of the mold 10, and a step of injecting the resin 220 into the cavity 15 of the new mold 10 Can be performed in parallel. Thereby, the molding time (cycle time) required for one resin molded product 200 can be substantially reduced by using fewer press machines 20. For the new mold 10 attached to the press machine 20, the processing performed in steps S3 to S6 is similarly performed.

  Finally, the mold 10 is transported from the stage ST3 to the stage ST4 by the transport device 110. Then, the mold 10 is opened, and the molded resin molded product 200 is removed from the mold 10 (step S6).

<Injection process>
With reference to FIG. 6, the process (step S3) of injecting the resin 220 into the mold 10 will be described in detail.

  FIG. 6 is a flowchart showing a process of injecting the resin 220 into the mold 10.

  The process of injecting the resin 220 into the mold 10 includes a process of clamping the mold 10 (step S31), a process of vacuuming the mold 10 (step S32), and a resin in the cavity 15 of the mold 10. A step of injecting 220 (step S33), a step of heating the resin 220 in the cavity 15 of the mold 10 (step S34), a step of determining whether or not a predetermined amount of the resin 220 has been injected (step S35), and The step of cooling the resin 220 in the cavity 15 of the mold 10 (step S36), the step of determining whether the impregnation of the resin 220 is completed (step S37), and the mold clamping of the mold 10 are released. And a process (step S38). Hereinafter, each process is explained in full detail. In addition, the control part 40 performs the process of each process.

  First, the mold 10 is clamped by the press machine 20 (step S31). Specifically, by applying a clamping pressure P to the mold 10 by the press machine 20, the upper mold 11 and the lower mold 12 are brought close to each other. When the upper mold 11 of the mold 10 comes into contact with the lower mold 12, the mold mold 10 is closed and the mold 10 is clamped. At this time, a sealed cavity 15 is formed between the upper mold 11 and the lower mold 12.

  Next, vacuuming is performed by sucking the inside of the cavity 15 of the mold 10 by the suction part 50, and the inside of the cavity 15 is brought into a vacuum state (step S32). By performing evacuation, bubbles generated on the surface can be prevented, voids and pits of the composite material which is the resin molded product 200 can be reduced, and mechanical properties and design properties of the composite material can be improved.

  Next, the resin 220 is formed by mixing the main agent 221 and the curing agent 222. Then, the formed resin 220 is injected into the cavity 15 (step S33).

  The mixing of the main agent 221 and the curing agent 222 is performed using the mixing head 31. In the present embodiment, when the main agent 221 and the curing agent 222 are mixed, while maintaining the glass transition temperature of the resin 220, the mixing ratio of the curing agent 222 to the main agent 221 is increased from a predetermined mixing ratio to increase the main agent 221. And the curing agent 222 are mixed. As a result, the curing reaction can be promoted by supplementing the curing agent 222 that volatilizes by the curing heat when the resin 220 is cured in the mold 10. Therefore, the time required for the resin 220 to cure in the mold 10 can be shortened. Further, since the volume of the resin 220 is reduced by being cured, a decrease in the pressure in the mold 10 can be promoted.

  When injecting the resin 220, the resin 220 is heated to the first temperature T1 at which the resin 220 undergoes a curing reaction (step S34). As a result, a curing reaction occurs in the resin 220 injected into the cavity 15 of the mold 10. In the present embodiment, when the resin 220 injected into the cavity 15 is heated to the first temperature T <b> 1, the fluid adjusted to the first temperature T <b> 1 is circulated through the pipe 16 disposed in the mold 10.

  After the injection of the resin 220 is completed (step S35: “Yes”), the resin 220 in the cavity 15 of the mold 10 is cooled to the second temperature T2 lower than the first temperature T1 (step S36). Thereby, since the expansion of the resin 220 injected into the cavity 15 of the mold 10 can be suppressed, the peak value of the pressure generated in the mold 10 can be lowered.

  In the present embodiment, as described above, when the resin 220 injected into the cavity 15 is heated to the first temperature T1, the fluid adjusted to the first temperature T1 is supplied to the pipe 16 provided in the mold 10. Circulate. Then, when the resin 220 injected into the cavity 15 is cooled to the second temperature T2, the fluid adjusted to the second temperature T2 is circulated through the pipe 16. Thereby, the temperature of the resin 220 injected into the cavity 15 can be selectively adjusted to the first temperature T1 and the second temperature T2 by the one pipe 16.

  When the impregnation of the reinforcing base 210 with the resin 220 is completed (step S37: “Yes”), the mold clamping of the mold 10 is released (step S38). As a result, as described above, the step of curing the resin 220 injected into the cavity 15 of the mold 10 using the one press 20 and the resin 220 into the cavity 15 of the new mold 10 are performed. The step of performing the implantation can be performed in parallel. Further, since the mold clamping of the mold 10 is released when the impregnation of the resin 220 into the reinforced base 210 is completed, the impregnation property into the reinforced base 210 is not affected.

  As described above, in the present embodiment, whether or not the impregnation into the reinforced substrate 210 is completed is determined based on the void ratio included in the resin molded product 200 that has been molded. Specifically, the mold clamping of the molding die 10 is released at a timing when the void ratio included in the resin molded product 200 that has been molded becomes a predetermined value or less. In the present embodiment, the mold clamping of the mold 10 is released at a timing when the void ratio included in the resin molded product 200 that has been molded is 10% or less.

  Further, in the present embodiment, the dimension of the cavity 15 is set so that the dimension that increases by releasing the mold clamping is a dimension that matches the dimension of the resin molded product 200. Thereby, the dimensional accuracy of the resin molded product can be improved.

(Action / Effect)
In the molding apparatus 100 and the molding method according to the present embodiment, the molding die 10 that forms the cavity 15 into which the thermosetting resin 220 is injected is detachably attached to the press machine 20, and the molding die 10 is molded by the press machine 20. In the clamped state, the resin 220 is injected into the cavity 15 in which the reinforcing base 210 is disposed, and the mold clamping is released when the impregnation of the reinforcing base 210 with the resin 220 is completed. Then, while the resin 220 injected into the cavity 15 of the mold 10 is cured in a state in which the mold 10 whose mold clamping has been released is removed from the press machine 20, the reinforced substrate 210 is placed in the cavity 15. The arranged new mold 10 is attached to the press machine 20.

  According to the molding apparatus 100 configured as described above and the molding method using the molding apparatus 100, the step of curing the resin 220 injected into the cavity 15 of the molding die 10 using one press machine 20, The step of injecting the resin 220 into the cavity 15 of the new mold 10 can be performed in parallel. As a result, the curing time of the injected resin can be used as the injection time of the resin for the next molding. Therefore, the molding time (cycle time) required for one resin molded product 200 using a smaller number of press machines 20 is used. ) Can be substantially reduced. Further, since the mold clamping of the mold 10 is released when the impregnation of the resin 220 into the reinforced base 210 is completed, the impregnation property into the reinforced base 210 is not affected. Therefore, a molding apparatus and a molding method for a resin molded product using a thermosetting resin that can reduce the cycle time and the cost of a press without reducing the impregnation property by ensuring the impregnation time to the reinforced substrate. Can provide.

  In the molding apparatus 100 and the molding method according to the present embodiment, when the resin 220 is injected into the cavity 15, the resin 220 is heated to the first temperature T <b> 1 at which the resin 220 undergoes a curing reaction, and the resin 220 is injected. After completion, the resin 220 is cooled to a second temperature T2 lower than the first temperature T1.

  According to the molding apparatus 100 configured as described above and the molding method using the molding apparatus 100, the expansion of the resin 220 injected into the molding die 10 can be suppressed. Thereby, the peak value of the pressure generated in the mold 10 can be lowered. Therefore, it is possible to reduce the size of the press machine and further reduce the cost of the press machine.

  In the molding apparatus 100 and the molding method according to the present embodiment, when the resin 220 injected into the cavity 15 is heated to the first temperature T1, the fluid adjusted to the first temperature T1 is supplied to the molding die 10. When the resin 220 injected into the cavity 15 is cooled to the second temperature T2 through the arranged pipe 16, the fluid adjusted to the second temperature T2 is circulated through the pipe 16.

  According to the molding apparatus 100 configured as described above and the molding method using the molding apparatus 100, the resin 220 injected into the cavity 15 is selectively heated to the first temperature T1 using the one pipe 16 or first. It can cool to 2 temperature T2. As a result, the device configuration is simplified, thereby facilitating the design and reducing the manufacturing cost.

  In the molding apparatus 100 and the molding method according to the present embodiment, the resin 220 is formed by mixing the main agent 221 and the curing agent 222, and when the main agent 221 and the curing agent 222 are mixed, the resin 220 is formed. While maintaining the glass transition temperature, the mixing ratio of the curing agent 222 to the main agent 221 is increased from a predetermined mixing ratio, and the main agent 221 and the curing agent 222 are mixed.

  According to the molding apparatus 100 configured as described above and the molding method using the molding apparatus 100, the curing reaction can be accelerated by supplementing the curing agent 222 that volatilizes by the curing heat when the resin 220 is cured in the mold 10. . Thereby, since the time required to cure the resin 220 can be shortened, the cycle time can be further shortened.

  Further, in the molding apparatus 100 and the molding method according to the present embodiment, the dimension of the cavity 15 after being increased by releasing the mold clamping is a dimension that matches the dimension of the resin molded product 200. Set as follows.

  According to the molding apparatus 100 configured as described above and the molding method using the molding apparatus 100, the dimensional accuracy of the resin molded product 200 can be improved.

  In addition, this invention is not limited only to embodiment mentioned above, A various change is possible in a claim.

  For example, the mold 10 and the injector 30 of the molding apparatus 100 according to the above-described embodiment are configured as follows. That is, in the mold 10, the resin 220 injected into the cavity 15 is heated to the first temperature T1 at which the curing reaction occurs, and the resin 220 to the second temperature T2 lower than the first temperature T1. The temperature control mechanism 120 that selectively cools the air was provided. Further, the dimension h of the cavity 15 of the molding die 10 is set so that the dimension h + Δh of the cavity after increasing by releasing the mold clamping becomes a dimension suitable for the dimension of the resin molded product 200. The injection machine 30 has a mixing head 31 that forms the resin 220 by mixing the main agent 221 and the curing agent 222. The mixing head 31 maintains the glass transition temperature of the resin 220 while maintaining the glass transition temperature of the resin 220. The main agent 221 and the curing agent 222 were mixed by increasing the blending ratio of the curing agent 222 beyond a predetermined blending ratio. However, the mold 10 does not have the temperature control mechanism 120, and the injection machine 30 maintains the glass transition temperature of the resin 220 while increasing the compounding ratio of the curing agent 222 with respect to the main agent 221 beyond a predetermined compounding ratio. A form that does not have the mixing head 31 for mixing 221 and the curing agent 222 is also included in the technical scope of the present invention. In addition, there is an embodiment in which the dimension h of the cavity 15 of the molding die 10 is not set so that the dimension h + Δh of the cavity 15 after being increased by releasing the mold clamping becomes a dimension suitable for the dimension of the resin molded product 200. It is included in the technical scope of the invention.

  In the molding method according to the above-described embodiment, when the resin 220 is injected into the cavity 15, the resin 220 is heated to the first temperature T <b> 1 at which the resin 220 undergoes a curing reaction, and after the injection of the resin 220 is completed. The resin 220 was cooled to a second temperature T2 lower than the first temperature T1. The resin 220 is formed by mixing the main agent 221 and the curing agent 222. When the main agent 221 and the curing agent 222 are mixed, the resin 220 is cured with respect to the main agent 221 while maintaining the glass transition temperature. The main agent 221 and the curing agent 222 were mixed by increasing the compounding ratio of the agent 222 beyond a predetermined compounding ratio. Further, the dimension h of the cavity 15 is increased by releasing the mold clamping so that the dimension h + Δh of the cavity 15 is adapted to the dimension of the resin molded product 200. However, when the resin 220 is injected into the cavity 15, the resin 220 is heated to the first temperature T <b> 1 at which the resin 220 undergoes a curing reaction, and after the injection of the resin 220 is completed, the resin 220 is heated to a second temperature T <b> 2 that is lower than the first temperature T <b> 1. A form not including cooling the 220 and forming the resin 220 by mixing the main agent 221 and the curing agent 222 by increasing the compounding ratio of the curing agent 222 with respect to the main agent 221 beyond a predetermined compounding ratio. It is included in the technical scope of the present invention. The present invention also includes an embodiment that does not include setting the dimension h of the cavity 15 so that the dimension h + Δh of the cavity 15 after being increased by releasing the mold clamping is a dimension that matches the dimension of the resin molded product 200. Is included in the technical scope.

  In the embodiment described above, whether or not the impregnation of the reinforced base material 210 with the thermosetting resin 220 is completed is determined based on the void ratio included in the resin molded product 200 that has been molded. However, it may be determined whether or not the impregnation of the reinforced base material 210 with the thermosetting resin 220 is completed by another method. For example, it may be determined whether or not the impregnation of the reinforced base material 210 with the thermosetting resin 220 is completed based on the viscosity or pressure of the thermosetting resin 220 injected into the cavity 15.

  In the embodiment described above, in the molding apparatus 100, the placement of the reinforced substrate 210 in the molding die 10, the injection of the thermosetting resin 220 into the molding die 10, and the thermosetting in the molding die 10. The curing of the resin 220 and the demolding of the resin molded product 200 from the mold 10 were performed in different stages ST1 to ST4. However, the division of the stage is not limited as long as the resin molded product 200 can be formed in parallel using one press machine 20. For example, the placement of the reinforcing base 210 on the mold 10 and the injection of the thermosetting resin 220 into the mold 10 may be performed in one stage. Further, the curing of the thermosetting resin 220 in the mold 10 and the demolding of the resin molded product 200 from the mold 10 may be performed in one stage.

10 Mold,
15 cavities,
16 piping,
20 press machine,
30 injectors,
31 mixing head,
32 feeders,
40 control unit,
50 suction part,
100 molding equipment,
110 transfer device,
120 temperature control mechanism,
200 resin molded products,
210 reinforced substrate,
220 reinforced substrate,
P clamping pressure,
Y Load direction of clamping pressure,
h, H dimensions.

Claims (10)

A mold for forming a cavity into which a thermosetting resin is injected is detachably attached to a press machine,
In a state where the mold is clamped by the press machine, the resin is injected into the cavity where the reinforcing base material is disposed,
When the impregnation of the resin to the reinforced substrate is completed, the mold clamping is released,
The reinforced substrate is disposed in the cavity while the resin injected into the cavity of the molding die is cured in a state where the molding die released from the mold clamping is removed from the press machine. A method for molding a resin molded product using a thermosetting resin, wherein the new mold is attached to the press. When injecting the resin into the cavity, the resin is heated to a first temperature at which the resin undergoes a curing reaction,
The molding method according to claim 1, wherein the resin is cooled to a second temperature lower than the first temperature after the resin injection is completed.   When the resin injected into the cavity is heated to the first temperature, a fluid adjusted to the first temperature is circulated through a pipe disposed in the mold, and the resin injected into the cavity 3. The molding method according to claim 2, wherein when cooling the liquid to the second temperature, the fluid adjusted to the second temperature is circulated through the pipe. The resin is formed by mixing a main agent and a curing agent,
When mixing the main agent and the curing agent, while maintaining the glass transition temperature of the resin, increasing the compounding ratio of the curing agent with respect to the main agent more than a predetermined compounding ratio, the main agent and the curing agent The shaping | molding method of any one of Claims 1-3 which mixes.   The dimension of the cavity is adjusted so that the dimension of the cavity after being increased by releasing the mold clamping becomes a dimension adapted to the dimension of the resin molded product. The forming method as described. A mold that forms a cavity into which a thermosetting resin is injected in a state in which the reinforced substrate is disposed;
A press machine for detachably attaching the mold, and clamping the mold;
An injection machine for injecting the resin into the mold in a state where the mold is clamped by the press;
A control unit for controlling the operation of the press machine and the injection machine,
The control unit releases a mold clamping of the molding die by the press machine when the resin impregnation into the reinforced substrate is completed, and a molding apparatus for a resin molded product using a thermosetting resin .   The mold selectively heats the resin to a first temperature at which the resin injected into the cavity undergoes a curing reaction and cools the resin to a second temperature lower than the first temperature. The molding apparatus according to claim 6, further comprising a temperature control mechanism.   The molding apparatus according to claim 7, wherein the temperature adjustment mechanism has a pipe through which either the fluid adjusted to the first temperature or the fluid adjusted to the second temperature is selectively circulated. The injection machine has a mixing head for forming the resin by mixing a main agent and a curing agent,
The mixing head mixes the main agent and the curing agent by maintaining a glass transition temperature of the resin while increasing a compounding ratio of the curing agent with respect to the main agent more than a predetermined compounding ratio. The shaping | molding apparatus of any one.   The dimension of the cavity is set so that the dimension of the cavity after being increased by releasing the mold clamping is a dimension adapted to the dimension of the resin molded product. 2. The molding apparatus according to item 1.