JP6707835B2 - Anisotropic conductive film - Google Patents

Description

The present invention relates to an anisotropic conductive film.

Anisotropic conductive films in which conductive particles are dispersed in an insulating resin binder are widely used when mounting electronic components such as IC chips on wiring boards and the like. In such anisotropic conductive films, It is known that conductive particles exist in a state of being connected or aggregated. Therefore, when the anisotropic conductive film is applied to the connection between the terminals of the IC chip and the terminals of the wiring board whose pitch is narrowed as the weight and size of electronic devices are reduced, the anisotropic conductive film is connected or aggregated in the anisotropic conductive film. Due to the conductive particles existing in this state, a short circuit may occur between adjacent terminals.

Heretofore, as an anisotropic conductive film corresponding to such a narrow pitch, a film in which conductive particles are regularly arranged is proposed. For example, an adhesive layer is formed on a stretchable film, the surface of the adhesive layer is densely packed with a single layer of conductive particles, and the film is biaxially stretched until the distance between the conductive particles reaches a desired distance. Anisotropic conductivity obtained by arranging conductive particles in a regular arrangement and then pressing the insulating adhesive base layer that is a component of the anisotropic conductive film against the conductive particles to transfer the conductive particles to the insulating adhesive base layer. A film has been proposed (Patent Document 1). In addition, conductive particles are dispersed on the transfer-type recess forming surface having a recess on the surface, the recess forming surface is squeegeeed to hold the conductive particles in the recess, and an adhesive film having a transfer adhesive layer formed thereon is formed. The conductive particles are first transferred to the adhesive layer by pressing, and then the insulating adhesive base layer, which is a component of the anisotropic conductive film, is pressed against the conductive particles attached to the adhesive layer to insulate the conductive particles. An anisotropic conductive film obtained by transferring to an adhesive base layer has also been proposed (Patent Document 2). In these anisotropic conductive films, an insulating adhesive cover layer is generally laminated on the surface of the conductive particles so as to cover the conductive particles.

WO2005/054388 JP, 2010-33793, A

However, it is difficult for the conductive particles to always exist alone as the primary particles because the conductive particles easily aggregate due to static electricity or the like to form secondary particles. Therefore, the following problems occur in the techniques of Patent Document 1 and Patent Document 2. That is, in the case of Patent Document 1, it is difficult to densely fill the entire surface of the stretchable film with conductive particles in a single layer without defects, and the conductive particles are packed in the stretchable film in an aggregated state, which may cause a short circuit. However, there is a problem in that an unfilled region (so-called “removal”) occurs, which may cause conduction failure. Further, in the case of Patent Document 2, when the transfer-type recess is covered with the conductive particles having a large particle diameter, the transfer-type recess is removed by a squeegee thereafter to form a recess that does not hold the conductive particles, and the anisotropic conductive film is electrically conductive. If particles “drop out” occur and cause conduction failure, or conversely, a large number of small conductive particles are pressed into the recesses, when transferred to the insulating adhesive base layer, the conductive particles aggregate, or Since the conductive particles located on the bottom side of the recess are not in contact with the insulating adhesive base layer, the conductive particles are scattered on the surface of the insulating adhesive base layer, which damages the regular arrangement and causes a short circuit or poor conduction. There was a problem that

As described above, in Patent Documents 1 and 2, it is sufficient to know how to control “dropout” and “aggregation” of conductive particles to be arranged in a regular pattern on the anisotropic conductive film. The fact is that it is not taken into consideration.

An object of the present invention is to solve the above-mentioned problems of the conventional techniques, and from the viewpoint of “missing” and “aggregation” of conductive particles to be arranged in a regular pattern, occurrence of a short circuit or poor conduction occurs. An object of the present invention is to provide a significantly suppressed anisotropic conductive film.

The present inventor, when arranging the conductive particles at the lattice points of the plane lattice, with respect to all the lattice points of the plane lattice pattern assumed in the reference region of the anisotropic conductive film, "the lattice points where the conductive particles are not arranged" The inventors have found that the above-mentioned object can be achieved by controlling the "ratio of" and the "ratio of lattice points where conductive particles are aggregated and arranged", and have completed the present invention. In addition, such an anisotropic conductive film does not arrange the conductive particles in the concave portions of the transfer body, but attaches the conductive particles to the tips of the convex portions of the transfer body having the columnar convex portions formed on the surface. It was found that it can be produced by transferring by transfer, and completed the production method of the present invention.

That is, the present invention is an anisotropic conductive film having a structure in which conductive particles in the insulating adhesive base layer are arranged at lattice points of a plane lattice pattern,
The ratio of the lattice points in which the conductive particles are not arranged to all the lattice points of the plane lattice pattern assumed in the reference region of the anisotropic conductive film is less than 20%,
An anisotropic conductive film having a ratio of lattice points in which a plurality of conductive particles are aggregated and arranged with respect to all lattice points of the plane lattice pattern is 15% or less, and a total of voids and aggregation is less than 25%. provide.

Further, the present invention is an anisotropic conductive film having a structure in which an insulating adhesive base layer and an insulating adhesive cover layer are laminated, and conductive particles are arranged in the vicinity of the interface between them at lattice points of a plane lattice pattern. ,
The ratio of the lattice points in which the conductive particles are not arranged to all the lattice points of the plane lattice pattern assumed in the reference region of the anisotropic conductive film is less than 20%,
Provided is an anisotropic conductive film in which the ratio of lattice points in which a plurality of conductive particles are aggregated and arranged with respect to all lattice points of the plane lattice pattern is 5% or less. Also in this case, the total of omission and aggregation is preferably less than 25%.

The present invention also provides a method for producing an anisotropic conductive film having a structure in which an insulating adhesive base layer and an insulating adhesive cover layer are laminated, and conductive particles are arranged in the vicinity of the interface between them at lattice points of a plane lattice pattern. The following steps (a) to (e):
<Process (a)>
A step of preparing a transfer body having columnar convex portions corresponding to lattice points of a plane lattice pattern formed on the surface;
<Process (b)>
A step of forming at least the top surface of the convex portion of the transfer member as a slight adhesive layer;
<Process (C)>
A step of attaching conductive particles to the slightly adhesive layer on the convex portion of the transfer member;
<Process (d)>
A step of transferring the conductive particles to the insulating adhesive base layer by stacking and pressing the insulating adhesive base layer on the surface of the transfer body on which the conductive particles adhere; and <step (e)>
Provided is a manufacturing method including a step of laminating an insulating adhesive cover layer from the conductive particle transfer surface side to an insulating adhesive base layer onto which conductive particles are transferred.

Furthermore, the present invention provides a connection structure in which the terminals of the first electronic component and the terminals of the second electronic component are anisotropically conductively connected by the anisotropic conductive film of the present invention.

In the anisotropic conductive film of the present invention, the ratio of "lattice points where conductive particles are not arranged" to all the lattice points of the plane lattice pattern assumed in the reference region is set to less than 20%, and "plurality of conductive layers" is set. The ratio of "lattice points where particles are aggregated and arranged" is set to 15% or less, and the total of voids and aggregation is set to less than 25%. Therefore, when the anisotropic conductive film of the present invention is applied to anisotropic conductive connection, a good initial conduction resistance value and a good conduction reliability after aging can be realized, and a short circuit can be suppressed. Further, not only COG but also an electronic component having a sufficiently large bump area and distance, such as FOG, is excellent in economic efficiency.

In the preferred anisotropic conductive film of the present invention, the ratio of “lattice points where conductive particles are not arranged” to all the lattice points of the plane lattice pattern assumed in the reference region is set to less than 20%, The ratio of “lattice points where the conductive particles are aggregated and arranged” is 5% or less. Therefore, when the anisotropic conductive film of the present invention is applied to anisotropic conductive connection, a good initial conduction resistance value and a good conduction reliability after aging can be realized, and a short circuit can be suppressed.

Further, in the method for producing an anisotropic conductive film of the present invention, a transfer body having columnar convex portions corresponding to the lattice points of the plane lattice pattern formed on the surface is used, and formed on the top surface of the convex portions. After attaching the conductive particles to the slightly adhesive layer, the conductive particles are transferred to the insulating adhesive base layer. Therefore, the ratio of “lattice points where conductive particles are not arranged” to all the lattice points of the plane lattice pattern assumed in the reference area of the anisotropic conductive film is set to less than 20% and all the lattice points of the plane lattice pattern are set. The ratio of “lattice points where a plurality of conductive particles are aggregated and arranged” can be set to 5% or less. Therefore, the production method of the present invention can economically produce an anisotropic conductive film, and by using this anisotropic conductive film, the IC chip and the wiring board having a narrow pitch can be short-circuited or short-circuited. Anisotropic conductive connection is possible while greatly suppressing the occurrence of conduction failure.

FIG. 1 is a cross-sectional view of the anisotropic conductive film of the present invention. FIG. 2 is a perspective plan view of the anisotropic conductive film of the present invention. FIG. 3A is a process explanatory view of the manufacturing method of the present invention. FIG. 3B is a process explanatory diagram of the manufacturing method of the present invention. FIG. 3C is a process explanatory diagram of the manufacturing method of the present invention. FIG. 3D is a process explanatory view of the manufacturing method of the present invention. FIG. 3E is a process explanatory view of the manufacturing method of the present invention. FIG. 3F is a schematic cross-sectional view of the anisotropic conductive film of the present invention at the same time as being a step explanatory diagram of the production method of the present invention.

The anisotropic conductive film of the present invention has a structure in which an insulating adhesive base layer and an insulating adhesive cover layer are laminated, and conductive particles are arranged in the vicinity of their interface at lattice points of a plane lattice pattern. The ratio of the lattice points in which the conductive particles are not arranged to all the lattice points of the plane lattice pattern assumed in the reference region of this anisotropic conductive film is less than 20%, and the plurality of lattice points to all the lattice points of the plane lattice pattern are plural. The ratio of the lattice points in which the conductive particles are arranged in agglomeration is 15% or less, and the total of voids and agglomeration is less than 25%. Hereinafter, the anisotropic conductive film of the present invention will be described in detail with reference to the drawings.

<Anisotropic conductive film>
As shown in FIG. 1 (cross-sectional view) and FIG. 2 (planar perspective view), an anisotropic conductive film 10 of the present invention has an insulating adhesive base layer 11 and an insulating adhesive cover layer 12 laminated, It has a structure in which conductive particles 13 are arranged in the vicinity of the interface at lattice points of a plane lattice pattern (dotted lines in FIG. 2). In FIG. 1 and FIG. 2, the plane lattice pattern is assumed along the longitudinal direction of the anisotropic conductive film 10 and the direction (short direction) orthogonal to the longitudinal direction, but it is assumed that the plane lattice pattern as a whole is long and short. May be assumed to be inclined. Here, the arrow A indicates the position where the conductive particles are not arranged at the lattice points of the plane lattice, that is, the position where the conductive particles are “missing”. The arrow B indicates a position where the conductive particles are in contact with each other and aggregates, and the arrow C indicates a position where the conductive particles are in non-contact with each other. Here, "non-contact aggregation" means that the conductive particles are close to each other within a range not exceeding 25% of the average particle diameter of the conductive particles.

(“Ejection” of conductive particles)
In the anisotropic conductive film of the present invention, the ratio of “lattice points where conductive particles are not arranged” (A in FIG. 2) to all the lattice points of the plane lattice pattern assumed in the reference area of the anisotropic conductive film. The (rate of the lattice in which the conductive particles are missing) is set to less than 20%, preferably 18% or less, and more preferably 10 to 18%. Thereby, when the anisotropic conductive film of the present invention is applied to anisotropic conductive connection, good initial conductivity and good conductivity reliability after aging can be realized, and occurrence of short circuit can be suppressed.

(Planar grid pattern)
Examples of the plane lattice pattern include an orthorhombic lattice, a hexagonal lattice, a square lattice, a rectangular lattice, and a parallel body lattice. Of these, a hexagonal lattice that allows close packing is preferable.

Here, although it is possible to select the entire surface of the anisotropic conductive film as the reference region of the anisotropic conductive film, usually, the following relational expression (A) at the center of the plane of the anisotropic conductive film, preferably It is preferable to select, as the reference region, a substantially rectangular region having sides X and Y satisfying relational expression (1) and relational expressions (2) and (3).

When applied to a FOG connection that can take a relatively large connection area, it is possible to reduce the amount of conductive particles present in the film. In such a case, as shown below, X and It is preferable to increase the values of Y and 20 D or more, respectively, and it is also preferable that the numerical value of “X+Y” is in the range of 100 D to 400 D, and finally 400 D.

In the formulas (A) and (1) to (3), the above formula, D is the average particle diameter of the conductive particles. The average particle diameter of the conductive particles can be measured by an image type particle size distribution meter. You may measure from surface observation. The side Y is a straight line in the range of less than ±45° with respect to the longitudinal direction of the anisotropic conductive film (see FIG. 2), and the side X is a straight line perpendicular to the side Y.

By defining the reference region in this way, the reference region can be made similar or approximate to the shape of the bump on which the conductive particles are pressed, and as a result, the allowable range of deviation of the conductive particles from the plane lattice pattern is increased. Therefore, anisotropic conductive connection can be made economically and stably. In other words, by setting the minimum side of the reference area to be 5 times or more the diameter of the conductive particles, even if the conductive particles are displaced, come off, or come close to each other within the range assumed within this range, Therefore, the anisotropic conductive connection can be surely performed because the bumps are not captured and are not excessively aggregated in the space between the bumps.

The reason for setting the minimum side to be 5 times or more the conductive particle size is generally larger than the average particle size of the conductive particles in order to ensure capture on at least one side of the bumps that are anisotropically conductively connected. It is necessary to provide the space between the bumps preferably twice or more the average particle diameter of the conductive particles for the purpose of preventing short circuit. In other words, when focusing on one reference circular conductive particle, the diameter (that is, 5D) obtained by adding the average particle diameter D of this conductive particle to the length 4 times the diameter (4D) This is because it is considered that the above requirements can be satisfied if an unexpected defect does not occur within the concentric circle. This is also because the minimum distance between the bumps when the fine pitch is set is less than 4 times the diameter of the conductive particles, for example.

(Aggregation of conductive particles)
Further, in the anisotropic conductive film of the present invention, the ratio of the lattice points (B and C in FIG. 2) in which the plurality of conductive particles are aggregated and arranged to all the lattice points of the plane lattice pattern is preferably 15. % Or less, more preferably 5% or less. Since it is theoretically most preferable to be 0%, it may be less than 0.1%. When the proportion of aggregated arrangement lattice points is 5% or less, even when the anisotropic conductive film of the present invention is applied to anisotropic conductive connection, better initial conductivity and conductivity reliability after aging are obtained. It can be realized and the occurrence of short circuit can be further suppressed. Here, the degree of aggregation of the conductive particles with respect to one lattice point is preferably small from the viewpoint of suppressing short circuits, and preferably does not exceed two. In addition, as shown in C of FIG. 2, when the agglomerated conductive particles are not in contact with each other, the interval is preferably within 25% of the average particle diameter of the conductive particles, more preferably within 15%. is there.

(Arrangement of conductive particles)
It is preferable that 11 or more conductive particles are continuously arranged in the direction perpendicular to the longitudinal direction of the film, and it is more preferable that 13 or more conductive particles are continuously arranged. This is because if conductive particles are missing in the longitudinal direction of the bump, the anisotropic conductive connection may be hindered. In this case, it is preferable that all three rows which are continuous along the longitudinal direction of the film satisfy the above condition, and it is more preferable that all five rows satisfy the above condition. As a result, the number of conductive particles captured by the bumps can be set to a certain value or more, and stable anisotropic conductive connection can be performed.

When the conductive particles are agglomerated, it is preferable that there are three or less sets of conductive particles connected to each other around the two agglomerated conductive particles, more preferably two or less, and even more preferably 1 or less. Less than three. The reason for this is that if the conductive particles agglomerated by two particles are present in a dense manner, it will cause a short circuit.

In addition, it is preferable that four or more continuous conductive particles in the longitudinal direction of the film do not intersect with four or more continuous conductive particles in the direction perpendicular to the longitudinal direction of the film. It is more preferable that the gaps are not adjacent to each other through the conductive particles that form one or more lattice points, and any gap that is continuous by 4 or more forms a gap between the conductive particles that form two or more lattice points. It is even more preferred that they are not adjacent. With regard to the intersections of such gaps, there is no problem even if up to three rows are intersected at the same time for the gaps in one direction. This is because, if the defects are not continuous more than this, the bumps are captured by the conductive particles in the vicinity thereof.

In addition, it is generally not preferable that there are a plurality of regions in which continuous gaps are crossed in the vicinity as described above, but the stability of anisotropic conductive connection may be improved if an array of conductive particles equal to or more than the number of the gap regions is interposed. Is no problem.

(Particle area occupation rate)
Further, the particle area occupancy ratio of all the conductive particles present in the area of the reference area of the anisotropic conductive film to the area where the bump size and the distance between the bumps are relatively large as in the FOG connection. Is usually 0.15% or more, preferably 0.35% or more, more preferably 1.4% or more. In this case, the upper limit is preferably 35% or less, more preferably 32% or less. Further, when the bump size or the distance between bumps is relatively small (for example, COG connection), it is more preferably 15 to 35%, particularly preferably 16 to 20%. Within this range, even when the anisotropic conductive film of the present invention is applied to anisotropic conductive connection, better initial conductivity and conductivity reliability after aging can be realized, and the occurrence of short circuits is further enhanced. Can be suppressed. Here, the particle area occupancy is the ratio of the area occupied by all the conductive particles existing in the reference area to the area S of the reference area. The area occupied by all conductive particles is represented by (R/2) ² ×π×n, where R is the average particle diameter of the conductive particles and n is the number of conductive particles. Therefore, the particle area occupancy rate (%)=[{(R/2) ² ×π×n}/S]×100.

Incidentally, when the average particle diameter of the conductive particles is 2 μm, the number density is 500 particles/mm ² (0.0005 particles/μm ² ), X=Y=200D, and X+Y=400D, the calculated particle area occupancy rate is It becomes 0.157%. When the average particle diameter of the conductive particles is 3 μm, the number density is 500 particles/mm ² (0.0005 particles/μm ² ), X=Y=200D, and X+Y=400D, the calculated particle area occupancy rate is 0. It becomes 35325%. When the average particle diameter of the conductive particles is 3 μm, the number density is 2000 particles/mm ² (0.002 particles/μm ² ), X=Y=200D, and X+Y=400D, the calculated particle area occupation ratio is 1. It becomes 413%. In addition, when the average particle diameter of the conductive particles is 30 μm, the number density is 500 particles/mm ² (0.0005 particles/μm ² ), X=Y=200D, and X+Y=400D, the calculated particle area occupancy rate is It becomes 35.325%.

(Conductive particles)
As the conductive particles, those used in known anisotropic conductive films can be appropriately selected and used. Examples thereof include metal particles such as nickel, copper, silver, gold and palladium, metal coated resin particles obtained by coating the surface of resin particles such as polyamide and polybenzoguanamine with a metal such as nickel. The average particle diameter of the conductive particles is preferably 1 to 30 μm, more preferably 1 to 10 μm, and particularly preferably 2 to 6 μm, from the viewpoint of handleability during production. The average particle diameter can be measured by an image type particle size distribution meter, as described above. You may measure from surface observation.

The amount of conductive particles present in the anisotropic conductive film depends on the lattice pitch of the plane lattice pattern and the average particle diameter of the conductive particles, and is usually 300 to 40,000 particles/mm ² .

(Distance between adjacent grid points)
The distance between adjacent lattice points in the plane lattice pattern assumed for the anisotropic conductive film is preferably larger than 0.5 times the average particle diameter of the conductive particles, more preferably 1 time or more, further preferably 1 to 20 times. Within this range, even when the anisotropic conductive film of the present invention is applied to anisotropic conductive connection, better initial conductivity and conductivity reliability after aging can be realized, and the occurrence of short circuits is further enhanced. Can be suppressed.

(Insulating adhesive base layer)
As the insulating adhesive base layer 11, those used as an insulating adhesive base layer in a known anisotropic conductive film can be appropriately selected and used. For example, a photoradical polymerizable resin layer containing an acrylate compound and a photoradical polymerization initiator, a thermal radical polymerizable resin layer containing an acrylate compound and a thermal radical polymerization initiator, a heat containing an epoxy compound and a thermal cationic polymerization initiator. A cationically polymerizable resin layer, a thermally anionic polymerizable resin layer containing an epoxy compound and a thermally anionic polymerization initiator, or a cured resin layer thereof can be used. In addition, a silane coupling agent, a pigment, an antioxidant, an ultraviolet absorber, and the like can be appropriately selected and contained in these resin layers, if necessary.

The insulating adhesive base layer 11 is formed by forming a coating composition containing a resin as described above by a coating method and drying it, further curing it, or forming a film by a known method in advance. can do.

The thickness of such an insulating adhesive base layer 11 is preferably 1 to 30 μm, more preferably 2 to 15 μm.

(Insulating adhesive cover layer)
As the insulating adhesive cover layer 12, the one used as an insulating adhesive cover layer in a known anisotropic conductive film can be appropriately selected and used. Further, a material formed of the same material as the insulating adhesive base layer 11 described above can also be used.

The insulating adhesive cover layer 12 is formed by forming a coating composition containing a resin as described above by a coating method and drying it, or by further curing it, or by forming a film by a known method in advance. can do.

The thickness of such an insulating adhesive cover layer 12 is preferably 1 to 30 μm, more preferably 2 to 15 μm.

Furthermore, the insulating adhesive base layer 11 and the insulating adhesive cover layer 12 may be added with an insulating filler such as silica fine particles, alumina, and aluminum hydroxide, if necessary. The compounding amount of the insulating filler is preferably 3 to 40 parts by mass with respect to 100 parts by mass of the resin forming the layers. Thereby, even if the insulating adhesive layer 10 is melted at the time of anisotropic conductive connection, it is possible to suppress the conductive particles 2 from unnecessarily moving by the melted resin.

(Lamination of insulating adhesive base layer and insulating adhesive cover layer, embedding of conductive particles)
In addition, when laminating the insulating adhesive base layer 11 and the insulating cover layer 12 with the conductive particles 13 sandwiched therebetween, a known method can be used. In this case, the conductive particles 13 exist near the interface between these layers. Here, "existing in the vicinity of the interface" means that a part of the conductive particles bites into one layer and the rest bites into the other layer. In addition, conductive particles may be embedded in the insulating adhesive base layer. In this case, it can be formed without laminating the insulating adhesive cover layer.

<Production of anisotropic conductive film>
Next, a method for producing an anisotropic conductive film of the present invention having a structure in which an insulating adhesive base layer and an insulating adhesive cover layer are laminated, and conductive particles are arranged in the vicinity of their interfaces at lattice points of a plane lattice pattern. Will be explained. This manufacturing method has the following steps (a) to (e). Each step will be described in detail with reference to the drawings. The present invention is not particularly limited to this manufacturing method.

(Process (a))
First, as shown in FIG. 3A, a transfer body 100 having columnar convex portions 101 corresponding to lattice points of a plane lattice pattern formed on the surface thereof is prepared. Here, the columnar shape means a columnar shape or a prismatic shape (triangular prism, quadrangular prism, hexagonal prism, etc.). This column includes a cone. It is preferably cylindrical. The height of the convex portion 101 can be determined according to the terminal pitch to be anisotropically conductively connected, the terminal width, the space width, the average particle diameter of the conductive particles, and the like. It is preferably 1.2 times or more and less than 2 times. The width of the convex portion 101 (width at half height) is preferably 0.7 times or more and 1.3 times or less of the average particle diameter of the conductive particles. If the height and the width are within these ranges, it is possible to obtain the effect that continuous dropout and dropout can be avoided.

Furthermore, the convex portion 101 has a flat top surface that allows the conductive particles to be stably attached.

*Specific example of transfer body The transfer body to be prepared in this step (a) can be prepared by using a known method. For example, a metal plate is processed to prepare a master, and a curable resin is added thereto. It can be prepared by coating and curing. Specifically, a flat metal plate is cut to create a transfer body master having recesses corresponding to the protrusions, and the resin composition constituting the transfer body is applied to the recess forming surface of the master, After curing, the transfer body is obtained by separating it from the master.

(Process (b))
Next, as shown in FIG. 3B, at least the top surface of the convex portions 101 of the transfer body 100 having a plurality of convex portions 101 formed on the surface in a plane lattice pattern is used as the slightly adhesive layer 102.

*Slightly Adhesive Layer of Transfer Body The slightly adhesive layer 102 is a layer having an adhesive force capable of temporarily holding the conductive particles until the conductive particles are transferred to the insulating adhesive base layer forming the anisotropic conductive film. Yes, it is formed on at least the top surface of the convex portion 101. Therefore, the entire convex portion 101 may be slightly adhesive. The thickness of the slightly adhesive layer 102 can be appropriately determined according to the material of the slightly adhesive layer 102, the particle diameter of the conductive particles, and the like. Further, "slightly adhesive" means that the adhesive force when transferring the conductive particles to the insulating adhesive base layer is weaker than that of the insulating adhesive base layer.

As such a slight adhesive layer 102, a slight adhesive layer used in a known anisotropic conductive film can be applied. For example, it can be formed by applying a silicone-based adhesive composition, an insulating adhesive base layer, or an adhesive layer made of the same material as the insulating adhesive cover layer to the top surface of the convex portion 101.

(Process (C))
Next, as shown in FIG. 3C, conductive particles 103 are attached to the slightly adhesive layer 102 of the convex portion 101 of the transfer body 100. Specifically, the conductive particles 103 may be scattered from above the convex portion 101 of the transfer body 100, and the conductive particles 103 that have not adhered to the slightly adhesive layer 102 may be blown off using a blower. Alternatively, the direction of the surface may be reversed from that of FIG. 3C, and the top surface of the protrusion may be attached to the surface covered with the conductive particles. This is because unnecessary stress is not applied to the conductive particles. In this way, by attaching only the conductive particles necessary for the arrangement to the top surface of the protrusion, it becomes easier to collect and reuse the conductive particles, and it is more economical than the method in which the conductive particles are filled into the opening and taken out. Become. In the case of the method in which the conductive particles are filled in the opening and taken out, there is a concern that unfilled conductive particles are likely to be subjected to unnecessary stress.

In FIG. 3C, the width of the left half convex portion 101 is adjusted to be narrower than that of the right half convex portion 101. As a result, as shown in FIG. 3C, the left half and the right half may differ in the mode of aggregation of the conductive particles 103.

(Process (d))
Next, as shown in FIG. 3D, the surface of the transfer body 100 on which the conductive particles 103 are attached is pressed against the surface of the transfer body 100 on which the insulating adhesive base layer 104 that constitutes the anisotropic conductive film is pressed. The conductive particles 103 are transferred onto one surface of the adhesive base layer 104 (FIG. 3E). In this case, it is preferable that the transfer member 100 is pressed against the insulating adhesive base layer 104 so that the convex portion 101 faces downward. This is because it is easy to remove the conductive particles that are not attached to the top surface of the convex portion by performing the blower downward.

(Process (e))
As shown in FIG. 3F, the insulating adhesive base layer 104 on which the conductive particles 103 have been transferred is laminated with the insulating adhesive cover layer 105 from the conductive particle transfer surface side. Thereby, the anisotropic conductive film 200 of the present invention is obtained.

In addition, in this anisotropic conductive film 200, a plurality of conductive particles may be arranged in contact with each other in the horizontal direction at one grid point of the plane grid pattern or in close proximity to each other. This is because when the conductive particles are attached to the slightly adhesive layer on the convex portion of the transfer member, the width of the convex portion (width of the slightly adhesive layer) and the average particle diameter of the conductive particles are substantially equal to each other, It is difficult to think that there are multiple conductive particles on one protrusion, but excess conductive particles adhered to the edge of the slightly adhesive layer, or those that fell off from the protrusion and could not be blower completely were the gaps between the protrusions of the transfer body. This is because it may remain in

<Connection structure>
The anisotropic conductive film of the present invention is provided between a terminal (for example, a bump) of a first electronic component (for example, an IC chip) and a terminal (for example, a bump or pad) of a second electronic component (for example, a wiring board). , And the anisotropic conductive connection is performed by main curing by thermocompression bonding from the side of the first or second electronic component, so that short circuit and conduction failure are suppressed, so-called COG (chip on glass) and FOG (film). connection structure such as on glass) can be provided.

Hereinafter, the present invention will be specifically described.

Example 1
A nickel plate having a thickness of 2 mm was prepared, and cylindrical recesses (inner diameter 5 μm, depth 6 μm) were formed in a square lattice pattern to prepare a transfer body master. The distance between the centers of the adjacent recesses was 8 μm. Therefore, the density of the recesses was 16000/mm 2.

On the obtained transfer master, 60 parts by mass of a phenoxy resin (YP-50, Nippon Steel & Sumikin Chemical Co., Ltd.), 29 parts by mass of an acrylate resin (M208, Toagosei Co., Ltd.), a photopolymerization initiator (IRGCUR184, BASF Japan Ltd.) were used. Co., Ltd.) A photopolymerizable resin composition containing 2 parts by mass was coated on a PET (polyethylene terephthalate) film so that the dry thickness was 30 μm, dried at 80° C. for 5 minutes, and then with a high pressure mercury lamp. A transfer member was prepared by irradiating with 1000 mJ light.

Peel the transfer material from the master and wind it around a stainless steel roll with a diameter of 20 cm so that the protrusions are on the outside. While rotating this roll, 70 parts by mass of epoxy resin (jER828, Mitsubishi Chemical Corporation) and phenoxy resin are used. (YP-50, Nippon Steel & Sumikin Chemical Co., Ltd., 30 parts by mass) is brought into contact with a pressure-sensitive adhesive sheet impregnated with a non-woven fabric, and the slight pressure-sensitive adhesive composition is adhered to the top surface of the convex portion. Then, a slightly adhesive layer having a thickness of 1 μm was formed to obtain a transfer body.

Conductive particles having an average particle diameter of 4 μm (nickel-plated resin particles (AUL704, Sekisui Chemical Co., Ltd.)) were sprayed on the surface of this transfer member, and then blown to prevent the conductive particles from adhering to the slightly adhesive layer. Was removed.

From the surface where the conductive particles are adhered, the transfer body on which the conductive particles are adhered is a sheet-like thermosetting insulating adhesive film (phenoxy resin (YP-50, Nippon Steel & Sumikin Chemical ( Co., Ltd.) 60 parts by mass, epoxy resin (jER828, Mitsubishi Chemical Corporation) 40 parts by mass, cationic curing agent (SI-60L, Sanshin Chemical Industry Co., Ltd.) 2 parts by mass, and silica fine particles (Aerosil RY200, A film formed from an insulating adhesive composition containing 20 parts by mass of Nippon Aerosil Co., Ltd.) is pressed at a temperature of 50° C. and a pressure of 0.5 MPa to transfer the conductive particles to the insulating adhesive base layer. It was

On the conductive particle transfer surface of the obtained insulating adhesive base layer, another sheet-like insulating adhesive film having a thickness of 15 μm as a transparent insulating adhesive cover layer (phenoxy resin (YP-50, Nippon Steel & Sumikin Chemical Co., Ltd. )) 60 parts by mass, an epoxy resin (jER828, Mitsubishi Chemical Co., Ltd.) 40 parts by mass, and a cationic curing agent (SI-60L, Sanshin Chemical Industry Co., Ltd.) 2 parts by mass of an insulating adhesive composition. Films formed from the above) were stacked and laminated at a temperature of 60° C. and a pressure of 2 MPa. As a result, an anisotropic conductive film was obtained.

Example 2
An anisotropic conductive film was obtained by repeating Example 1 except that the amount of conductive particles sprayed and the number of blowers were each doubled as compared with the case of Example 1.

Example 3
The inner diameter of the recesses of the master of the transfer body is 3.6 μm, the distance between the centers of adjacent recesses is 6 μm, the density of the recesses is 28,000 particles/mm 2, and conductive particles having an average particle diameter of 3 μm are used instead of the conductive particles having an average particle diameter of 4 μm (AUL703). , Sekisui Chemical Co., Ltd.) was repeated to obtain an anisotropic conductive film.

Example 4
An anisotropic conductive film was obtained by repeating Example 3 except that the amount of conductive particles sprayed and the number of blowers were each doubled as compared with Example 3.

Comparative Example 1
Example 1 is repeated except that the depth of the recesses of the transfer body master is 4.4 μm, the inner diameter of the recesses is 4.8 μm, the distance between the centers of adjacent recesses is 5.6 μm, and the density of the recesses is 32000/mm ^2. Thus, an anisotropic conductive film was obtained.

Comparative example 2
Conductive particles having a recess depth of 3.3 μm, a recess inner diameter of 3.6 μm, a center-to-center distance between adjacent recesses of 4.2 μm, a recess density of 57,000 particles/mm ² , and an average particle diameter of 4 μm. An anisotropic conductive film was obtained by repeating Example 1 except that conductive particles having an average particle diameter of 3 μm (AUL703, Sekisui Chemical Co., Ltd.) were used instead of.

<Evaluation>
(“Elimination” and “Agglomeration” of conductive particles)
Regarding the anisotropic conductive films of Examples 1 to 4 and Comparative Examples 1 to 2, a 1 cm square area was observed with an optical microscope (MX50, Olympus Corporation) from the transparent insulating adhesive cover layer side, and it is assumed. The ratio of the lattice points where no conductive particles are attached to all the lattice points (missing [%]) and the ratio of the lattice points where two or more conductive particles are aggregated to all the lattice points It was The results obtained are shown in Table 1.

Further, the maximum distance (aggregation distance) between the aggregated conductive particles was measured, and is also shown in Table 1. The "aggregation" direction was the horizontal direction of the anisotropic conductive film.

(Particle area occupation rate)
The particle area occupancy rate was calculated from the average particle diameter of the conductive particles and the concave density of the master of the transfer body (=the convex density of the transfer body) in consideration of the “dropout” and “aggregation” of the conductive particles. .. The results obtained are shown in Table 1.

(Initial conduction resistance)
Using the anisotropic conductive films of Examples and Comparative Examples, an IC chip having a bump-to-bump space of 12 μm, a height of 15 μm, and 30×50 μm gold bumps, and a glass substrate provided with a wiring of 12 μm space were provided. Anisotropic conductive connection was performed under the conditions of 180° C., 60 MPa, and 5 seconds to obtain a connection structure. With respect to the obtained connection structure, the initial conduction resistance value was measured using a resistance meter (Digital Multimeter 7565, Yokogawa Electric Co., Ltd.). The results obtained are shown in Table 1. It is desired to be 0.5Ω or less.

(Continuity reliability)
The connection structure used for measuring the initial conduction resistance value was placed in an aging tester set to a temperature of 85° C. and a humidity of 85%, and the conduction resistance value after leaving for 500 hours was the same as the initial conduction resistance. It was measured. The results obtained are shown in Table 1. It is desired to be 5Ω or less.

(Short rate)
The same connection structure as that used for the initial conduction resistance was created, and it was examined whether or not a short circuit occurred between adjacent wirings. The results obtained are shown in Table 1. It is desired that the short-circuit occurrence rate is 50 ppm or less.

From the results of Table 1, it was found that the connection structures using the anisotropic conductive films of Examples 1 to 4 showed good results for each evaluation item of initial conduction resistance, conduction reliability, and short-circuit occurrence rate. Recognize.

On the other hand, in the case of the anisotropic conductive films of Comparative Examples 1 and 2, the percentage of “missing” of the conductive particles was small, but the percentage of “aggregation” was too high, and therefore the evaluation of the occurrence rate of short circuit was low.

Example 5
A transfer member was prepared in the same manner as in Example 2 except that the distance between the centers of adjacent recesses was adjusted in order to use a transfer master having a recess density of 500/mm ² , and further an anisotropic conductive film was prepared. .. With respect to the obtained anisotropic conductive film, “missing” and “aggregation” of conductive particles were measured in the same manner as in Example 2, and the particle area occupancy rate was calculated. As a result, the "dropout" and "aggregation" of the conductive particles were the same as in Example 2. The particle area occupation rate was 0.6%.

In addition, the obtained anisotropic conductive film was placed between a glass substrate (ITO solid electrode) and a flexible wiring substrate (bump width: 200 μm, L (line)/S (space)=1, wiring height 10 μm). The sandwiched structure was anisotropically conductive under the conditions of 180° C., 80 MPa, and 5 seconds so that the connection bump length was 1 mm to obtain a connection structure for evaluation. Regarding the obtained connection structure, the "initial conduction resistance value" and the "conduction reliability" after being placed in a constant temperature bath at a temperature of 85°C and a humidity of 85% RH for 500 hours were measured by a digital multimeter (34401A, Agilent・Technology Co., Ltd.) was used to measure the conduction resistance at a current of 1 A by the 4-terminal method. In the case of the "initial conduction resistance value", it is preferable that the measured value is 2Ω or less When the measured value was 5 Ω or less, it was evaluated as good, and when the measured value was 5 Ω or more, it was evaluated as poor. As a result, all the connection structures of Example 5 were evaluated as “good”. When the “short circuit occurrence rate” was measured in the same manner as in Example 2, good results were obtained as in Example 2.

Example 6
A transfer member was prepared in the same manner as in Example 2 except that the distance between the centers of the adjacent recesses was adjusted in order to use a transfer master having a recess density of 2000/mm ² , and further an anisotropic conductive film was prepared. .. With respect to the obtained anisotropic conductive film, “missing” and “aggregation” of conductive particles were measured in the same manner as in Example 2, and the particle area occupancy rate was calculated. As a result, the "dropout" and "aggregation" of the conductive particles were the same as in Example 2. The particle area occupancy rate was 2.4%.

In addition, the obtained anisotropic conductive film was sandwiched between a glass substrate and a flexible wiring substrate and anisotropically conductively connected in the same manner as in Example 5 to obtain a connection structure for evaluation. The obtained connection structure was evaluated for "initial conduction resistance value", "conduction reliability", and "short circuit occurrence rate" in the same manner as in Example 5, and good results were obtained.

In the preferred anisotropic conductive film of the present invention, the ratio of "lattice points where conductive particles are not arranged" to all the lattice points of the plane lattice pattern assumed in the reference region is set to less than 20%, and the plane lattice is also used. The ratio of “lattice points where a plurality of conductive particles are aggregated and arranged” to all the lattice points of the pattern is 5% or less. Therefore, when the anisotropic conductive film of the present invention is applied to anisotropic conductive connection, good initial conductivity and good conductivity reliability after aging can be realized, and the occurrence of short circuits can be suppressed. This is useful when anisotropically conductively connecting a pitched IC chip and a wiring board.

10, 200 Anisotropic conductive film 11, 104 Insulating adhesive base layer 12, 105 Insulating adhesive cover layer 13, 103 Conductive particles 100 Transfer body 101 Convex part 102 Slightly adhesive layer A Lattice point where conductive particles are missing B Conductive Lattice points where particles are in contact with each other and agglomerate C Lattice points where conductive particles are separated from each other and agglomerate

Claims (13)

The insulating adhesive base layer has a structure in which conductive particles are arranged at lattice points of a plane lattice pattern, and conductive particles are arranged at all lattice points of the plane lattice pattern assumed in the reference area of the anisotropic conductive film. The ratio of the non-existing grid points is less than 20%, and the ratio of the grid points in which the plurality of conductive particles are aggregated and arranged with respect to all the grid points of the planar lattice pattern is 15% or less. A method for producing an anisotropic conductive film , the total of which is less than 25% , comprising the following steps (a) to (e):
<Process (a)>
A step of preparing a transfer body having columnar convex portions corresponding to lattice points of a plane lattice pattern formed on the surface;
<Process (b)>
A step of forming a slight adhesive layer on at least the top surface of the convex portion of the transfer member;
<Process (C)>
A step of attaching conductive particles to the slightly adhesive layer on the convex portion of the transfer member;
<Process (d)>
A step of transferring the conductive particles to the insulating adhesive base layer by stacking and pressing the insulating adhesive base layer on the surface of the transfer body on which the conductive particles adhere; and <step (e)>
A method of manufacturing, comprising a step of laminating an insulating adhesive cover layer from the conductive particle transfer surface side to an insulating adhesive base layer on which conductive particles are transferred. The manufacturing method according to claim 1 , wherein the transfer body used in the step (a) is prepared by processing a metal plate to prepare a master, applying a curable resin thereto, and curing it. The height of the convex portion of the transfer member in the step (a) is 1.2 times or more and less than 2 times the average particle diameter of the conductive particles, and the full width at half maximum of the convex portion is 0.7 times the average particle diameter of the conductive particles. The production method according to claim 1 or 2, which is not less than 1.3 times and not more than 1.3 times. The anisotropic conductive film has a structure in which an insulating adhesive base layer and an insulating adhesive cover layer are laminated, and conductive particles are arranged in the vicinity of the interface between them at lattice points of a plane lattice pattern. The manufacturing method according to any one of claims 1 to 3, wherein the ratio of the lattice points where the plurality of conductive particles are aggregated and arranged with respect to all the lattice points is 5% or less. The reference region is the following relational expressions (A), (2) and (3) in the plane central portion of the anisotropic conductive film:

Is a substantially rectangular region consisting of side X and side Y satisfying the above, where D is the average particle diameter of the conductive particles, and side Y is in the range of less than ±45° with respect to the longitudinal direction of the anisotropic conductive film. The manufacturing method according to claim 1, wherein the manufacturing method is a straight line, and the side X is a straight line perpendicular to the side Y. The reference region is the following relational expressions (1) to (3) in the plane central portion of the anisotropic conductive film:

Is a substantially rectangular region consisting of side X and side Y satisfying the above, where D is the average particle diameter of the conductive particles, and side Y is in the range of less than ±45° with respect to the longitudinal direction of the anisotropic conductive film. The manufacturing method according to claim 1, wherein the manufacturing method is a straight line, and the side X is a straight line perpendicular to the side Y. To the area of the reference area of the anisotropic conductive film, the manufacturing method according to any one of claims 1 to 6 particle area occupancy of Zenshirubeden particles is 15% to 35% present in the area in. The average particle diameter of the conductive particles is 1 to 10 [mu] m, method according to any one of the average 0.5 times larger than the aspect of particle size 1-7 distances between neighboring grid points of the plane grating pattern is conductive particles. The reference region is the following relational expression of the plane center portion of the anisotropic conductive film:

Is a substantially rectangular region consisting of side X and side Y satisfying the above, where D is the average particle diameter of the conductive particles, and side Y is in the range of less than ±45° with respect to the longitudinal direction of the anisotropic conductive film. The manufacturing method according to claim 1, wherein the manufacturing method is a straight line, and the side X is a straight line perpendicular to the side Y. The production method according to claim 9 , wherein the particle area occupancy rate of all the conductive particles present in the area of an arbitrary reference region of the anisotropic conductive film is 0.15% or more. The manufacturing method according to claim 9 or 10, wherein the conductive particles have an average particle diameter of 1 to 30 µm, and the distance between adjacent grid points of the plane grid pattern is larger than 0.5 times the average particle diameter of the conductive particles. The insulating adhesive base layer has a structure in which conductive particles are arranged at lattice points of a plane lattice pattern, and conductive particles are arranged at all lattice points of the plane lattice pattern assumed in the reference area of the anisotropic conductive film. The ratio of the non-existing grid points is less than 20%, and the ratio of the grid points in which the plurality of conductive particles are aggregated and arranged with respect to all the grid points of the planar lattice pattern is 15% or less. A method for producing an anisotropic conductive film having a total content of less than 25% , comprising the following steps (a) to (d):
<Process (a)>
A step of preparing a transfer body having columnar convex portions corresponding to lattice points of a plane lattice pattern formed on the surface;
<Process (b)>
A step of forming a slight adhesive layer on at least the top surface of the convex portion of the transfer member;
<Process (C)>
A step of attaching conductive particles to the slightly adhesive layer on the convex portion of the transfer member; and <step (d)>
A manufacturing method comprising a step of transferring conductive particles to the insulating adhesive base layer by stacking and pressing the insulating adhesive base layer on the surface of the transfer body on which the conductive particles are attached. An anisotropic conductive film having a structure in which conductive particles are arranged in a plane lattice pattern in the insulating adhesive base layer, and the conductive particles are not arranged for the plane lattice pattern assumed in the reference region of the anisotropic conductive film. Anisotropic conductivity having a ratio of less than 20%, a ratio of a plurality of conductive particles aggregated and arranged with respect to the planar lattice pattern is 15% or less, and a total of voids and agglomeration is less than 25%. A method for producing a film, comprising the following steps (a) to (d):
<Process (a)>
A step of preparing a transfer body on the surface of which projections corresponding to a plane lattice pattern are formed;
<Process (b)>
A step of forming a slight adhesive layer on at least the top surface of the convex portion of the transfer member;
<Process (C)>
A step of attaching conductive particles to the slightly adhesive layer on the convex portion of the transfer member; and <step (d)>
A manufacturing method comprising a step of transferring conductive particles to the insulating adhesive base layer by stacking and pressing the insulating adhesive base layer on the surface of the transfer body on which the conductive particles are attached.

Images